JP6261181B2 - Carrier film and laminate for transparent conductive film - Google Patents

Description

  The present invention relates to a carrier film for a transparent conductive film having a support and a pressure-sensitive adhesive layer having a specific arithmetic mean surface waviness. Moreover, this invention relates to the laminated body which has the said carrier film for transparent conductive films, and a transparent conductive film.

  In recent years, in a touch panel, a liquid crystal display panel, an organic EL panel, an electrochromic panel, an electronic paper element, and the like, demand for an element using a film substrate in which a transparent electrode is provided on a plastic film is increasing.

  As a material for the transparent electrode, an ITO thin film (In / Sn composite oxide) is currently the mainstream, and the thickness of the thin film substrate including the ITO thin film tends to be reduced year by year.

  Under such circumstances, a surface protective film or the like is bonded to an optical member such as an ITO thin film in order to prevent scratches, dirt, and the like in a processing step, a conveyance step, and the like. For example, Patent Document 1 discloses that a thin surface protective film is attached to an optical member for use.

  In addition, an anti-reflection (AR) film is provided as a functional layer on the thin film substrate including the ITO thin film to improve visibility, or a hard coat (HC) film is provided to prevent scratches. I often do it.

JP2007-304317A

  However, in order to improve productivity, for example, a manufacturing process such as formation and patterning of the ITO thin film is performed with the functional layer provided, and the transparent conductive film having the functional layer is placed in a heating environment. It may be exposed to very large temperature changes such as being washed with water. Along with such temperature change, there is a problem that the transparent conductive film (the functional layer itself when it has a functional layer) is greatly deformed (swelling occurs).

  Therefore, the object of the present invention is to provide a transparent conductive film even when it is used in a processing process or a conveying process accompanied by a temperature change with a transparent conductive film having a transparent conductive layer such as an ITO thin film attached to the carrier film. It is to provide a carrier film for a transparent conductive film that can prevent deformation of the film (when the transparent conductive film has a functional layer, the deformation of the functional layer can be prevented). Moreover, the objective of this invention is providing the carrier film for transparent conductive films which can maintain the shape of a transparent conductive film, without generating a wrinkle, a crack, etc. in the transparent conductive film which is a to-be-adhered body. It is. Furthermore, the objective of this invention is providing the laminated body containing the said carrier film for transparent conductive films, and a transparent conductive film.

  The present inventors have intensively studied to achieve the above object, and as a result, have found that the above object can be achieved by using the carrier film for transparent conductive film of the present invention, and have completed the present invention.

  That is, the carrier film for transparent conductive film of the present invention has an adhesive layer on at least one surface of the support, and the arithmetic average surface waviness Wa of the adhesive surface opposite to the surface of the adhesive layer that contacts the support. Is 70 nm or less. The carrier film for transparent conductive film of the present invention is used for a transparent conductive film having a support and a transparent conductive layer. And the adhesive layer of the carrier film for transparent conductive films is bonded to the support surface opposite to the transparent conductive layer of the transparent conductive film (if the support surface further has a functional layer, the functional layer). use.

  The pressure-sensitive adhesive layer is preferably formed from a pressure-sensitive adhesive composition containing a base polymer and a crosslinking agent.

  It is preferable that the base polymer is a (meth) acrylic polymer, and the amount of the crosslinking agent exceeds 10 parts by weight with respect to 100 parts by weight of the (meth) acrylic polymer.

  The base polymer is preferably a (meth) acrylic polymer obtained by polymerizing a monomer component containing a (meth) acrylic acid ester having an alkyl group having 2 to 14 carbon atoms and a monomer having a functional group.

  The molar ratio of the functional group of the crosslinking agent to the functional group of the monomer having the functional group is preferably 0.70 or more.

  The (meth) acrylic acid ester preferably contains butyl (meth) acrylate.

In addition, the present invention is a laminate having a transparent conductive film and a transparent conductive film laminated on the transparent conductive film carrier film,
The carrier film for transparent conductive film is the carrier film for transparent conductive film of the present invention,
The transparent conductive film has a transparent conductive layer and a support,
The present invention relates to a laminate in which the adhesive surface of the adhesive layer of the carrier film for transparent conductive film is bonded to the surface opposite to the surface in contact with the transparent conductive layer of the support.

Furthermore, the present invention is a laminate comprising a carrier film for transparent conductive film and a transparent conductive film laminated on the carrier film for transparent conductive film,
The carrier film for transparent conductive film is the carrier film for transparent conductive film of the present invention,
The transparent conductive film has a transparent conductive layer and a support, and further has a functional layer on the surface of the support opposite to the surface in contact with the transparent conductive layer,
The present invention relates to a laminate, wherein the adhesive surface of the pressure-sensitive adhesive layer of the carrier film for transparent conductive film is bonded to the surface of the functional layer opposite to the surface in contact with the support.

  Ratio of arithmetic mean surface waviness Wa of the contact surface of the functional layer before and after the adhesive surface of the adhesive layer of the carrier film for transparent conductive film is applied to the functional layer of the transparent conductive film (Wa after application / before application) Wa) is preferably 0.5 to 3.0.

  The carrier film for a transparent conductive film of the present invention is a temperature such as heating and washing with a support and a pressure-sensitive adhesive layer having a specific arithmetic mean surface waviness, with the transparent conductive film attached to the carrier film. Even if it is a case where it uses for the process process with a change, a conveyance process, etc., a deformation | transformation of a transparent conductive film can be prevented (when a transparent conductive film has a functional layer, a deformation | transformation of a functional layer can be prevented). Moreover, by using the carrier film for transparent conductive films of the present invention, the transparent conductive film as an adherend is not wrinkled or scratched, and the shape of the transparent conductive film can be maintained.

(A) It is a schematic diagram of the laminated body which affixed the transparent conductive film with a functional layer on the adhesive layer surface of the carrier film for transparent conductive films. (B) It is a schematic diagram of the laminated body which affixed the transparent conductive film on the adhesive layer surface of the carrier film for transparent conductive films.

1. Hereinafter, an embodiment of the present invention will be described in detail with reference to FIG. However, the present invention is not limited to the embodiment of FIG.

  The carrier film 20 for transparent conductive film of the present invention has the pressure-sensitive adhesive layer 3 on at least one surface of the support 4, and the arithmetic average of the pressure-sensitive adhesive surface A on the opposite side to the surface of the pressure-sensitive adhesive layer 3 that contacts the support. The surface waviness Wa is 70 nm or less. The arithmetic average surface waviness Wa of the pressure-sensitive adhesive surface A opposite to the surface in contact with the support of the pressure-sensitive adhesive layer 3 means a large waviness formed on the surface of the pressure-sensitive adhesive layer 3, and is generally called an arithmetic average surface. The roughness Ra refers to a different one. In addition, as shown to Fig.1 (a), when the transparent conductive film is the transparent conductive film 10 with a functional layer, the said adhesion surface A is a surface which contacts the said functional layer 2, FIG. As shown in b), when the transparent conductive film 1 does not have a functional layer, the surface of the support (base material) 1b constituting the transparent conductive film (the side where the transparent conductive layer 1a of the support 1b does not exist) It is the surface that comes into contact with.

(1) Adhesive layer It is preferable that the adhesive layer 3 in this invention is formed from the adhesive composition containing a base polymer and a crosslinking agent. The pressure-sensitive adhesive composition can be an acrylic, synthetic rubber-based, rubber-based, or silicone-based pressure-sensitive adhesive, but from the viewpoint of transparency, heat resistance, etc., a (meth) acrylic polymer is a base polymer. An acrylic pressure-sensitive adhesive is preferred.

  The (meth) acrylic polymer serving as the base polymer for the acrylic pressure-sensitive adhesive is obtained by polymerizing a monomer component containing a (meth) acrylic acid ester ((meth) acrylic monomer) having an alkyl group having 2 to 14 carbon atoms. It is preferable to be obtained. Use of the (meth) acrylic acid ester is useful from the viewpoint of ease of handling.

  In the present invention, the (meth) acrylic acid ester having an alkyl group having 2 to 14 carbon atoms can be used, but the (meth) acrylic acid ester having an alkyl group having 4 to 14 carbon atoms is more preferable. . Examples of the (meth) acrylic acid ester having an alkyl group having 2 to 14 carbon atoms include ethyl (meth) acrylate, n-butyl (meth) acrylate (BA), t-butyl (meth) acrylate, isobutyl ( (Meth) acrylate, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate (2EHA), n-octyl (meth) acrylate, isooctyl (meth) acrylate, n-nonyl (meth) acrylate, isononyl (meth) acrylate, n-decyl (meth) acrylate, isodecyl (meth) acrylate, n-dodecyl (meth) acrylate, n-tridecyl (meth) acrylate, n-tetradecyl (meth) acrylate, and the like can be mentioned. Or mix two or more To be able to use. Among these, n-butyl (meth) acrylate (BA) and 2-ethylhexyl (meth) acrylate (2EHA) are particularly preferable, and n-butyl (meth) acrylate (BA) is more preferably used as a main monomer. preferable. In the present invention, by using n-butyl (meth) acrylate as the main monomer, it is possible to suppress deformation of the pressure-sensitive adhesive layer before and after being heated and stored for the purpose of crosslinking the pressure-sensitive adhesive layer of the carrier film. The arithmetic average surface waviness Wa of the adhesive surface before being attached to the conductive film can be suppressed to a desired range. Here, the main monomer is 50% by weight or more, more preferably 60% by weight, based on the total amount of “(meth) acrylic acid ester having an alkyl group having 2 to 14 carbon atoms” contained in the monomer component. Or more, more preferably 80% by weight or more, and particularly preferably 100% by weight.

  The amount of the (meth) acrylic monomer having an alkyl group having 2 to 14 carbon atoms is preferably 55% by weight or more, more preferably 60 to 100% by weight, and particularly preferably 60 to 98% by weight in the monomer component. preferable. Within the above range, it is easy to adjust the arithmetic average surface waviness Wa of the pressure-sensitive adhesive surface opposite to the surface in contact with the support of the pressure-sensitive adhesive layer constituting the carrier film in the present invention to a desired range. Become.

  The monomer component may contain other polymerizable monomer other than the (meth) acrylic acid ester having an alkyl group having 2 to 14 carbon atoms. As said other polymerizable monomer, the glass transition point of a (meth) acrylic-type polymer, the polymerizable monomer for adjusting peelability, etc. can be used in the range which does not impair the effect of this invention. These monomers may be used alone or in combination. However, the blending amount of the other polymerizable monomer is preferably 45% by weight or less, more preferably 0 to 40% by weight in the monomer component. preferable.

  Examples of the other polymerizable monomers include, for example, components for improving cohesion and heat resistance such as sulfonic acid group-containing monomers, phosphoric acid group-containing monomers, cyano group-containing monomers, vinyl ester monomers, aromatic vinyl monomers, and hydroxyl group-containing monomers. Monomers, carboxyl group-containing monomers, acid anhydride group-containing monomers, amide group-containing monomers, amino group-containing monomers, epoxy group-containing monomers, N-acryloylmorpholine, vinyl ether monomers, etc. It can be used as appropriate. These monomer components may be used alone or in admixture of two or more.

  Examples of the carboxyl group-containing monomer include (meth) acrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid.

  Examples of the acid anhydride group-containing monomer include maleic anhydride and itaconic anhydride.

  Examples of the hydroxyl group-containing monomer include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, and 8-hydroxyoctyl. (Meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, (4-hydroxymethylcyclohexyl) methyl acrylate, N-methylol (meth) acrylamide, vinyl alcohol, allyl alcohol 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, diethylene glycol monovinyl ether, and the like.

  Examples of the sulfonic acid group-containing monomer include styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamide-2-methylpropane sulfonic acid, (meth) acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate, (meth And acryloyloxynaphthalene sulfonic acid.

  Examples of the phosphoric acid group-containing monomer include 2-hydroxyethylacryloyl phosphate.

  Examples of the cyano group-containing monomer include acrylonitrile.

  Examples of the vinyl ester monomer include vinyl acetate, vinyl propionate, vinyl laurate, and the like.

  Examples of the aromatic vinyl monomer include styrene, chlorostyrene, chloromethyl styrene, α-methyl styrene, and the like.

  Examples of the amide group-containing monomer include acrylamide and diethyl acrylamide.

  Examples of the amino group-containing monomer include N, N-dimethylaminoethyl (meth) acrylate, N, N-dimethylaminopropyl (meth) acrylate, and the like.

  Examples of the epoxy group-containing monomer include glycidyl (meth) acrylate and allyl glycidyl ether.

  Examples of the vinyl ether monomer include methyl vinyl ether, ethyl vinyl ether, isobutyl vinyl ether, and the like.

  The (meth) acrylic polymer used in the present invention is obtained by polymerizing the monomer components, and the polymerization method is not particularly limited, and is solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization. Polymerization can be performed by a known method such as turbid polymerization, and solution polymerization is more preferable from the viewpoint of workability and the like. The obtained polymer may be any of homopolymer, random copolymer, block copolymer and the like.

  The (meth) acrylic polymer used in the present invention preferably has a weight average molecular weight of 300,000 to 5,000,000, more preferably 400,000 to 4,000,000, particularly preferably 500,000 to 3,000,000. When the weight average molecular weight is less than 300,000, the adhesive strength at the time of peeling increases due to the improvement of wettability to the transparent conductive film (with functional layer), which is the adherend. The adherend may be damaged, and the adhesive force tends to be generated due to the reduced cohesive force of the pressure-sensitive adhesive layer. On the other hand, when the weight average molecular weight exceeds 5,000,000, the fluidity of the polymer is lowered and the wettability to the transparent conductive film (with functional layer) becomes insufficient, and the adherend and transparent conductive film are used. There is a tendency to cause blisters generated between the carrier film and the pressure-sensitive adhesive layer. In addition, a weight average molecular weight means what was obtained by measuring by GPC (gel permeation chromatography).

  Moreover, from the reason that it is easy to balance the adhesive performance, the glass transition temperature (Tg) of the (meth) acrylic polymer is preferably 0 ° C. or lower (usually −100 ° C. or higher, preferably −60 ° C. or higher). -10 ° C or lower is more preferable, -20 ° C or lower is further preferable, and -30 ° C or lower is particularly preferable. When the glass transition temperature is higher than 0 ° C., the polymer does not flow easily, and the wettability to the transparent conductive film (with a functional layer) becomes insufficient, and the pressure-sensitive adhesive between the adherend and the carrier film for the transparent conductive film It tends to cause blisters that occur between the layers. In addition, the glass transition temperature (Tg) of a (meth) acrylic-type polymer can be adjusted in the said range by changing the monomer component and composition ratio to be used suitably.

  The pressure-sensitive adhesive layer used in the present invention appropriately adjusts the (meth) acrylic polymer by appropriately adjusting the structural unit and structural ratio of the (meth) acrylic polymer, and the selection and blending ratio of the crosslinking agent described later. By cross-linking, it has excellent heat resistance.

  As the crosslinking agent used in the present invention, an isocyanate compound, an epoxy compound, a melamine resin, an aziridine derivative, a metal chelate compound, or the like is used. Among these, an isocyanate compound and an epoxy compound are particularly preferably used mainly from the viewpoint of obtaining an appropriate cohesive force. These compounds may be used alone or in combination of two or more.

  Examples of the isocyanate compound include lower aliphatic polyisocyanates such as butylene diisocyanate and hexamethylene diisocyanate, alicyclic isocyanates such as cyclopentylene diisocyanate, cyclohexylene diisocyanate and isophorone diisocyanate, and 2,4-tolylene diisocyanate. , 4,4'-diphenylmethane diisocyanate, aromatic isocyanates such as xylylene diisocyanate, trimethylolpropane / tolylene diisocyanate trimer adduct (trade name: Coronate L, manufactured by Nippon Polyurethane Industry Co., Ltd.), trimethylolpropane / Hexamethylene diisocyanate trimer adduct (trade name: Coronate HL, manufactured by Nippon Polyurethane Industry Co., Ltd.), hexamethylene diisocyanate Isocyanurate (trade name: Coronate HX, manufactured by Nippon Polyurethane Industry Co., Ltd.) and isocyanate adducts, and the like. These compounds may be used alone or in combination of two or more.

  Examples of the epoxy compound include N, N, N ′, N′-tetraglycidyl-m-xylenediamine (trade name: TETRAD-X, manufactured by Mitsubishi Gas Chemical Co., Ltd.) and 1,3-bis (N, N-diglycidylaminomethyl) cyclohexane (trade name: TETRAD-C, manufactured by Mitsubishi Gas Chemical Co., Ltd.) and the like. These compounds may be used alone or in combination of two or more.

  Examples of the melamine resin include hexamethylol melamine. As aziridine derivatives, for example, the trade name HDU (manufactured by Mutual Yakuko Co., Ltd.), the brand name TAZM (manufactured by Mutual Yakuko Co., Ltd.), the brand name TAZO (manufactured by Mutual Yakuko Co., Ltd.), etc. Is given. These compounds may be used alone or in combination of two or more.

  Examples of the metal chelate compound include aluminum, iron, tin, titanium, and nickel as metal components, and acetylene, methyl acetoacetate, and ethyl lactate as chelate components. These compounds may be used alone or in combination of two or more.

  The amount of the crosslinking agent used in the present invention is preferably 1 part by weight or more, more preferably 2 parts by weight or more, based on 100 parts by weight (solid content) of the (meth) acrylic polymer. It is more preferable to exceed the weight part. Moreover, as an upper limit, it is preferable that it is 30 weight part or less, and it is more preferable that it is 25 weight part or less. When the blending amount is less than 1 part by weight, the crosslinking formation by the crosslinking agent becomes insufficient, the cohesive force of the pressure-sensitive adhesive layer becomes small, and sufficient heat resistance may not be obtained. Tend to be. On the other hand, when the blending amount exceeds 30 parts by weight, the cohesive force of the pressure-sensitive adhesive layer is large, the fluidity is lowered, and the wettability is insufficient with respect to the transparent conductive film (with a functional layer) that is an adherend. This tends to cause blisters generated between the adherend and the pressure-sensitive adhesive layer, which is not preferable. Moreover, in this invention, when the addition amount of a crosslinking agent exceeds 10 weight part, when peeling the carrier film of this invention from the transparent conductive film which is a to-be-adhered body (with functional layer), peeling speed is slow. Even if it is a case, even if it is quick, it can express an appropriate adhesive force, and since it is excellent in peelability, it is preferable. These crosslinking agents may be used alone or in combination of two or more.

  Moreover, the adhesive layer of the carrier film for transparent conductive films of the present invention is obtained by polymerizing a monomer component containing a (meth) acrylic acid ester having an alkyl group having 2 to 14 carbon atoms and a monomer having the functional group. It is preferably formed from a pressure-sensitive adhesive composition containing a (meth) acrylic polymer and a crosslinking agent, and in this case, the functional group A of the monomer having the functional group and the crosslinking agent that reacts with the functional group A The functional group B has a molar ratio (B / A) of preferably 0.70 or more, more preferably 0.75 or more, and further preferably 0.8 to 0.95. For example, when a carboxyl group-containing monomer is used as a raw material, it can react with the carboxyl groups of all cross-linking agents with respect to “the total mole number A of carboxyl groups of all carboxyl group-containing monomers used as raw material monomers”. The ratio of [the total number of moles B of functional groups] [functional group B / carboxyl group A capable of reacting with carboxyl groups] (molar ratio) is preferably 0.70 or more, more preferably 0.75 or more, and Preferably it is 0.8-0.9. By setting [functional group / carboxyl group capable of reacting with carboxyl group] to 0.70 or more, when the laminate having the carrier film for transparent conductive film and the transparent conductive film is heat-treated, the pressure-sensitive adhesive for the carrier film It can suppress that a layer softens. Thereby, a deformation | transformation of the support body and functional layer of a transparent conductive film can be suppressed, and the arithmetic mean surface waviness Wa change rate of this support body and this functional layer can be suppressed to a desired range. Further, it is preferable because unreacted carboxyl groups in the pressure-sensitive adhesive layer can be reduced, and an increase in peeling force (adhesive force) over time due to the interaction between the carboxyl groups and the adherend can be effectively prevented.

For example, when 7 g of a crosslinking agent having a functional group equivalent to 110 (g / eq) of a functional group that can react with a carboxyl group is added (added), the number of moles of the functional group that can react with the carboxyl group of the crosslinking agent Can be calculated as follows, for example.
Number of moles of functional group capable of reacting with carboxyl group of crosslinking agent = [blending amount of crosslinking agent] / [functional group equivalent] = 7/110
For example, when 7 g of an epoxy crosslinking agent having an epoxy equivalent of 110 (g / eq) is added (blended) as the crosslinking agent, the number of moles of epoxy groups possessed by the epoxy crosslinking agent can be calculated as follows, for example. .
Number of moles of epoxy group possessed by epoxy-based crosslinking agent = [blending amount of epoxy-based crosslinking agent] / [epoxy equivalent] = 7/110

  Moreover, in this invention, the polyfunctional monomer which has 2 or more of radiation reactive unsaturated bonds can be mix | blended with the said crosslinking agent or independently as a crosslinking component. In such a case, the (meth) acrylic polymer is crosslinked by irradiating with radiation or the like. As a polyfunctional monomer having two or more radiation-reactive unsaturated bonds in one molecule, for example, it can be crosslinked (cured) by irradiation with radiation such as vinyl group, acryloyl group, methacryloyl group, vinylbenzyl group. Examples thereof include polyfunctional monomers having two or more radiation reactivity of one kind or two or more kinds. As the polyfunctional monomer, generally, those having 10 or less radiation-reactive unsaturated bonds are preferably used. These compounds may be used alone or in combination of two or more.

Specific examples of the polyfunctional monomer include, for example, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, and 1,6 hexane. Examples include diol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, divinylbenzene, and N, N′-methylenebisacrylamide.

  The blending amount of the crosslinking component is preferably 1 to 30 parts by weight, and more preferably 2 to 25 parts by weight with respect to 100 parts by weight (solid content) of the (meth) acrylic polymer.

  Examples of radiation include ultraviolet rays, laser rays, α rays, β rays, γ rays, X rays, electron rays, and the like, and ultraviolet rays are preferably used from the viewpoints of controllability, good handleability, and cost. More preferably, ultraviolet rays having a wavelength of 200 to 400 nm are used. Ultraviolet rays can be irradiated using an appropriate light source such as a high-pressure mercury lamp, a microwave excitation lamp, or a chemical lamp. In addition, when using an ultraviolet-ray as a radiation, a photoinitiator is mix | blended with an adhesive composition.

  The photopolymerization initiator may be any substance that generates radicals or cations by irradiating ultraviolet rays having an appropriate wavelength that can trigger the polymerization reaction according to the type of the radiation-reactive component.

  Examples of radical photopolymerization initiators include benzoins such as benzoin, benzoin methyl ether, benzoin ethyl ether, o-benzoylbenzoic acid methyl-p-benzoin ethyl ether, benzoin isopropyl ether, α-methylbenzoin, benzyldimethyl ketal, and trichloro Acetophenones such as acetophenone, 2,2-diethoxyacetophenone, 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methylpropiophenone, 2-hydroxy-4′-isopropyl-2-methylpropiophenone, etc. Propiophenones, benzophenone, methylbenzophenone, p-chlorobenzophenone, benzophenones such as p-dimethylaminobenzophenone, 2-chlorothioxanthone, 2-ethyl Thioxanthones such as oxanthone and 2-isopropylthioxanthone, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, (2,4,6-trimethylbenzoyl)- Examples include acylphosphine oxides such as (ethoxy) -phenylphosphine oxide, benzyl, dibenzosuberone, α-acyloxime ester, and the like. These compounds may be used alone or in combination of two or more.

  Examples of the cationic photopolymerization initiator include onium salts such as aromatic diazonium salts, aromatic iodonium salts, and aromatic sulfonium salts, organometallic complexes such as iron-allene complexes, titanocene complexes, and arylsilanol-aluminum complexes, nitro Examples thereof include benzyl ester, sulfonic acid derivative, phosphoric acid ester, phosphoric acid ester, phenol sulfonic acid ester, diazonaphthoquinone, and N-hydroxyimide sulfonate. These compounds may be used alone or in combination of two or more. The photopolymerization initiator is usually added in an amount of 0.1 to 10 parts by weight and preferably 0.2 to 7 parts by weight with respect to 100 parts by weight of the (meth) acrylic polymer.

  Further, a photoinitiated polymerization aid such as amines can be used in combination. Examples of the photoinitiator include 2-dimethylaminoethylbenzoate, dimethylaminoacetophenone, p-dimethylaminobenzoic acid ethyl ester, p-dimethylaminobenzoic acid isoamyl ester, and the like. These compounds may be used alone or in combination of two or more. It is preferable to mix | blend 0.05-10 weight part with respect to 100 weight part of (meth) acrylic-type polymers, and, as for a polymerization start adjuvant, it is more preferable to mix | blend in the range of 0.1-7 weight part.

  Furthermore, the pressure-sensitive adhesive composition used in the present invention may contain other known additives, such as powders such as colorants and pigments, surfactants, plasticizers, and tackifiers. , Low molecular weight polymer, surface lubricant, leveling agent, antioxidant, corrosion inhibitor, light stabilizer, UV absorber, polymerization inhibitor, silane coupling agent, inorganic or organic filler, metal powder, particulate, It can mix | blend suitably according to the use which uses a foil-like thing.

  The pressure-sensitive adhesive layer used in the present invention is formed from the pressure-sensitive adhesive composition as described above, and is preferably obtained by cross-linking the (meth) acrylic polymer with the cross-linking agent. . The carrier film for a transparent conductive film (with a functional layer) of the present invention is formed by forming such an adhesive layer on a support (base material, base material layer). At that time, the crosslinking of the (meth) acrylic polymer is generally performed after the application of the pressure-sensitive adhesive composition, but the pressure-sensitive adhesive layer comprising the pressure-sensitive adhesive composition after crosslinking may be transferred to a support or the like. Is possible.

  A method for forming the pressure-sensitive adhesive layer on the support (also referred to as a base material or a base material layer) is not particularly limited. For example, the pressure-sensitive adhesive composition is applied to the support (for example, as a solid content). 20% by weight or more is preferable, and 30% by weight or more is more preferable.By setting it to 20% by weight or more, the arithmetic average surface waviness Wa of the present invention can be easily adjusted to a desired range. It is produced by drying and removing to form an adhesive layer on the support. Thereafter, curing may be performed for the purpose of adjusting the component transfer of the pressure-sensitive adhesive layer or adjusting the crosslinking reaction. In addition, when a pressure-sensitive adhesive composition is applied on a support to produce a carrier film for a transparent conductive film, one or more types other than the polymerization solvent are included in the pressure-sensitive adhesive composition so that it can be uniformly applied onto the support. A new solvent may be added.

  Moreover, as a coating method of the said adhesive composition, the well-known method used for manufacture of an adhesive tape etc. is used. Specific examples include roll coating, gravure coating, reverse coating, roll brushing, spray coating, air knife coating, and the like.

  The drying conditions for drying the pressure-sensitive adhesive composition applied to the support can be appropriately determined depending on the composition, concentration, type of solvent in the composition, etc., and are not particularly limited. However, it can be dried at 80 to 200 ° C. for about 10 seconds to 30 minutes.

In addition, when a photopolymerization initiator as an optional component is blended as described above, the pressure-sensitive adhesive layer is applied by light irradiation after coating on one or both sides of the support (base material, base material layer). Can be obtained. Usually, the pressure-sensitive adhesive layer is obtained by irradiating ultraviolet rays having an illuminance of 1 to 200 mW / cm ² at a wavelength of 300 to 400 nm and photopolymerizing them with a light amount of about 400 to 4000 mJ / cm ² .

  As for the thickness of the adhesive layer of the carrier film for transparent conductive films of this invention, 5-50 micrometers is preferable, More preferably, it is 10-30 micrometers. Within the above range, the balance between adhesion and removability is excellent and a preferred embodiment is obtained. The pressure-sensitive adhesive layer is formed on at least one surface of a support (base material layer) used in the present invention by coating or the like, and is formed into a film shape, a sheet shape, a tape shape, or the like.

  The arithmetic average surface waviness Wa of the pressure-sensitive adhesive surface opposite to the surface in contact with the support of the pressure-sensitive adhesive layer is 70 nm or less, preferably 65 nm or less, more preferably 60 nm or less, and still more preferably 1 to 55 nm. If it is within the above range, the pressure-sensitive adhesive surface (glue surface) becomes smooth, so that the shape is not easily transferred to the adherend, which is a preferred embodiment.

  When the transparent conductive film has a functional layer, the arithmetic average surface of the adhesive surface before applying the adhesive surface of the adhesive layer of the carrier film for transparent conductive film of the present invention to the functional layer of the transparent conductive film with a functional layer The ratio (Wa1 / Wa) of the waviness (Wa) to the arithmetic mean surface waviness (Wa1) of the adhesive surface after pasting is preferably 0.7 to 2.0, and 0.8 to 1.8. More preferred. Within the above range, the pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer is not deformed in the heating step, so that the smoothness of the pressure-sensitive adhesive surface is maintained in the production process, which is a preferred embodiment.

Moreover, the arithmetic average surface waviness Wa _F of the contact surface of the functional layer before applying the adhesive surface of the adhesive layer of the carrier film for transparent conductive film of the present invention to the functional layer of the transparent conductive film with the functional layer, preferably the ratio of the arithmetic mean surface waviness Wa _F 1 of the contact surface of the functional layer after sticking _{(Wa F} 1 / Wa F) is 0.5 to 3.0, 0.6 to 2. 8 is more preferable. Within the above range, the adherend surface (functional layer surface) is not deformed even after heating, which is a preferred embodiment.

(2) Support The support (base material) (4 in FIG. 1) constituting the carrier film for transparent conductive film of the present invention is not particularly limited, but for example, a paper-based support such as paper; cloth, nonwoven fabric And fiber-based supports such as nets (the raw materials are not particularly limited, and for example, Manila hemp, rayon, polyester, pulp fibers, etc. can be selected as appropriate); metal-based supports such as metal foils and metal plates A plastic support such as a plastic film or sheet; a rubber support such as a rubber sheet; a foam such as a foam sheet or a laminate thereof (for example, a laminate of a plastic support and another support); In addition, an appropriate thin leaf body such as a laminate of plastic films (or sheets) can be used.

  As a raw material in the plastic film or sheet, for example, α-olefin such as polyethylene (PE), polypropylene (PP), ethylene-propylene copolymer, ethylene-vinyl acetate copolymer (EVA) is used as a monomer component. Olefin resins; Polyester resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT); Polyvinyl chloride (PVC); Vinyl acetate resins; Polyphenylene sulfide (PPS); Polyamide (nylon) ), Amide resins such as wholly aromatic polyamide (aramid); polyimide resins; polyether ether ketone (PEEK) and the like. These materials can be used alone or in combination of two or more. Among them, the polyester-based resin has toughness, workability, transparency, and the like. Therefore, by using this for a carrier film for a transparent conductive film, workability / inspectability is improved, which is more preferable. It becomes an aspect.

  The polyester resin is not particularly limited as long as it can be formed into a sheet shape or a film shape, and examples thereof include polyester films such as polyethylene terephthalate (PET), polyethylene naphthalate, and polybutylene terephthalate. . These polyester resins may be used alone (homopolymer), or two or more kinds may be mixed and polymerized (copolymers, etc.). In particular, in the present invention, polyethylene terephthalate is preferably used as a support because it is used as a carrier film for a transparent conductive film. By using polyethylene terephthalate, it becomes the carrier film for transparent conductive films excellent in toughness, workability, and transparency, and the workability is improved, which is a preferred embodiment.

  The thickness of the support is preferably 75 to 200 μm, more preferably 80 to 140 μm, and particularly preferably 90 to 130 μm. Within the above range, the transparent conductive film carrier film for transparent conductive film can be attached to a transparent conductive film (with a functional layer) and used to maintain the shape of the transparent conductive film that is flexible and flexible. It is useful because it can prevent the occurrence of defects such as wrinkles and scratches in the processing process and the conveying process.

  In addition, the support may include a silicone-based, fluorine-based, long-chain alkyl-based or fatty acid amide-based release agent, release with a silica powder, antifouling treatment, acid treatment, alkali treatment, primer, if necessary. Anti-adhesive treatment such as treatment, corona treatment, plasma treatment, and ultraviolet treatment, coating type, kneading type, and vapor deposition type can also be performed.

  In addition, in order to improve the adhesiveness between an adhesive layer and a support body, you may perform a corona treatment etc. on the surface of a support body. Moreover, you may perform a back surface process to a support body.

  In the carrier film for transparent conductive film (with a functional layer) of the present invention, a separator can be bonded to the pressure-sensitive adhesive surface for the purpose of protecting the pressure-sensitive adhesive surface as necessary. As the base material constituting the separator, there are paper and plastic film, but a plastic film is preferably used from the viewpoint of excellent surface smoothness. The film is not particularly limited as long as it can protect the pressure-sensitive adhesive layer. For example, polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer Examples thereof include a coalesced film, a polyethylene terephthalate film, a polybutylene terephthalate film, a polyurethane film, and an ethylene-vinyl acetate copolymer film.

2. Transparent conductive film (with a functional layer) As shown in FIG. 1, the transparent conductive film (thin layer base material) 1 can mention the film which has the transparent conductive layer 1a and the support body 1b.

  Examples of the support 1b include a resin film and a substrate made of glass or the like (for example, a sheet-like, film-like, or plate-like substrate (member)), and particularly, a resin film can be mentioned. Although the thickness of the support body 1b is not specifically limited, About 10-200 micrometers is preferable and about 15-150 micrometers is more preferable.

  The material of the resin film is not particularly limited, and various plastic materials having transparency can be mentioned. For example, the materials include polyester resins such as polyethylene terephthalate and polyethylene naphthalate, acetate resins, polyethersulfone resins, polycarbonate resins, polyamide resins, polyimide resins, polyolefin resins, (meth) acrylic resins. , Polyvinyl chloride resin, polyvinylidene chloride resin, polystyrene resin, polyvinyl alcohol resin, polyarylate resin, polyphenylene sulfide resin, and the like. Of these, polyester resins, polyimide resins and polyethersulfone resins are particularly preferable.

  Further, the support 1b is subjected to etching treatment such as sputtering, corona discharge, flame, ultraviolet ray irradiation, electron beam irradiation, chemical conversion, oxidation, or undercoating treatment on the surface in advance, and the transparent conductive layer 1a provided thereon, etc. You may make it improve the adhesiveness with respect to the said support body 1b. In addition, before providing the transparent conductive layer 1a, dust may be removed and cleaned by solvent cleaning or ultrasonic cleaning as necessary.

  The constituent material of the transparent conductive layer 1a is not particularly limited, and is selected from the group consisting of indium, tin, zinc, gallium, antimony, titanium, silicon, zirconium, magnesium, aluminum, gold, silver, copper, palladium, and tungsten. A metal oxide of at least one metal is used. The metal oxide may further contain a metal atom shown in the above group, if necessary. For example, indium oxide (ITO) containing tin oxide and tin oxide containing antimony are preferably used, and ITO is particularly preferably used. As ITO, it is preferable to contain 80 to 99 weight% of indium oxide and 1 to 20 weight% of tin oxide.

  The thickness of the transparent conductive layer 1a is not particularly limited, but is preferably 10 to 300 nm, and more preferably 15 to 100 nm.

  The method for forming the transparent conductive layer 1a is not particularly limited, and a conventionally known method can be employed. Specifically, for example, a vacuum deposition method, a sputtering method, and an ion plating method can be exemplified. In addition, an appropriate method can be adopted depending on the required film thickness.

  Moreover, an undercoat layer, an oligomer prevention layer, etc. can be provided between the transparent conductive layer 1a and the support 1b as required.

  The transparent conductive film 1 having the transparent conductive layer 1a can be used as a substrate for optical devices (optical member). The substrate for an optical device is not particularly limited as long as it is a substrate having optical characteristics. For example, a display device (liquid crystal display device, organic EL (electroluminescence) display device, PDP (plasma display panel), electronic Paper, etc.), base materials (members) constituting devices such as input devices (touch panels, etc.) or base materials (members) used in these devices. These substrate materials for optical devices have become stiff due to the recent trend of thinning, and have been prone to bend and deform in shape during processing and transporting processes. By sticking and using the carrier film for transparent conductive films of this invention, a shape can be hold | maintained and generation | occurrence | production of a malfunction can be suppressed and it becomes a preferable aspect.

  The functional layer 2 can be provided on the surface of the transparent conductive film where the transparent conductive layer 1a is not provided.

  As the functional layer, for example, an antiglare treatment (AG) layer or an antireflection (AR) layer for the purpose of improving visibility can be provided. The constituent material of the antiglare layer is not particularly limited, and for example, an ionizing radiation curable resin, a thermosetting resin, a thermoplastic resin, or the like can be used. The thickness of the antiglare treatment layer is preferably 0.1 to 30 μm. As the antireflection layer, titanium oxide, zirconium oxide, silicon oxide, magnesium fluoride, or the like is used. The antireflection layer can be provided with a plurality of layers.

  As the functional layer, a hard coat (HC) layer can be provided. As a material for forming the hard coat layer, for example, a cured film made of a curable resin such as a melamine resin, a urethane resin, an alkyd resin, an acrylic resin, or a silicone resin is preferably used. The thickness of the hard coat layer is preferably 0.1 to 30 μm. The thickness is preferably 0.1 μm or more for imparting hardness. Further, the antiglare treatment layer and the antireflection layer can be provided on the hard coat layer.

  The thickness of the transparent conductive film with a functional layer (including the functional layer) is preferably 210 μm or less, and more preferably 150 μm or less. By using the carrier film for transparent conductive film of the present invention (with a functional layer) for the transparent conductive film (adhered body) within the above range, the shape is maintained even when the transparent conductive film is very thin. Therefore, the occurrence of defects such as wrinkles and scratches can be suppressed, which is a preferable mode.

  As the adhesive strength of the pressure-sensitive adhesive layer used in the present invention to the functional layer (normal temperature: 25 ° C., adhesive strength to the A surface in FIG. 1), low speed peeling (0.3 m / min) and high speed peeling (10 m / min) In any of (min), it is preferably 0.1 to 3.5 N / 20 mm, more preferably 0.2 to 2.5 N / 20 mm, and 0.2 to 1.0 N / 20 mm. Is more preferable. Within the above range, when the carrier film for transparent conductive film is peeled from the transparent conductive film, the shape of the transparent conductive film is not deformed, and is a preferred embodiment. In particular, when the adhesive strength exceeds 3.0 N / 20 mm, when the carrier film for transparent conductive film is peeled from the transparent conductive film, the shape of the transparent conductive film tends to be deformed. Absent.

3. Laminated body Moreover, this invention is a laminated body which has the transparent conductive film laminated | stacked on the carrier film for transparent conductive films, and the said carrier film for transparent conductive films,
The carrier film for transparent conductive film is a carrier film for transparent conductive film described in the present specification,
The transparent conductive film has a transparent conductive layer and a support,
The present invention relates to a laminate in which the adhesive surface of the adhesive layer of the carrier film for transparent conductive film is bonded to the surface opposite to the surface in contact with the transparent conductive layer of the support.

Furthermore, the present invention is a laminate comprising a carrier film for transparent conductive film and a transparent conductive film laminated on the carrier film for transparent conductive film,
The carrier film for transparent conductive film is a carrier film for transparent conductive film described in the present specification,
The transparent conductive film has a transparent conductive layer and a support, and further has a functional layer on the surface of the support opposite to the surface in contact with the transparent conductive layer,
The present invention relates to a laminate, wherein the adhesive surface of the pressure-sensitive adhesive layer of the carrier film for transparent conductive film is bonded to the surface of the functional layer opposite to the surface in contact with the support.

  The above-mentioned thing can be mentioned about the carrier film for transparent conductive films used for the laminated body of this invention, and a transparent conductive film.

Moreover, it affixed on the functional layer of the transparent conductive film with a functional layer, the arithmetic mean surface waviness Wa _F of the contact surface of the functional layer before affixing the adhesive surface of the adhesive layer of the carrier film for transparent conductive films. the ratio of the arithmetic mean surface waviness Wa _F 1 of the contact surface of the functional layer after _{(Wa F} 1 / Wa F) is preferably from 0.5 to 3.0, it is from 0.6 to 2.8 More preferred. Within the above range, the functional layer surface does not deform even after heating, which is a preferred embodiment.

  Hereinafter, examples and the like specifically showing the configuration and effects of the present invention will be described, but the present invention is not limited to these. In addition, the evaluation items in Examples and the like were measured as follows, and the contents of blending are shown in Tables 1 and 2, and the evaluation results are shown in Table 3.

[Example 1]
<Adjustment of acrylic polymer (A)>
In a four-flask equipped with a stirring blade, thermometer, nitrogen gas inlet tube, and condenser, 95 parts by weight of butyl acrylate (BA), 5 parts by weight of acrylic acid (AA), and 2,2′-azobis as a polymerization initiator Charge 0.2 parts by weight of isobutyronitrile and 234 parts by weight of ethyl acetate, introduce nitrogen gas with gentle stirring, perform a polymerization reaction for about 7 hours while maintaining the liquid temperature in the flask at about 63 ° C. A polymer (A) solution (30% by weight) was prepared. The acrylic polymer (A) had a weight average molecular weight of 600,000 and Tg of −50 ° C.

<Adjustment of adhesive solution>
The acrylic polymer (A) solution (30% by weight) is diluted to 20% by weight with ethyl acetate, and 100 parts by weight (solid content) of the acrylic polymer in this solution is used as an epoxy crosslinking agent (Mitsubishi). Gas Chemical Co., Ltd., TETRAD-C: T / C in Table 2) 7 parts by weight was added, and the mixture was stirred at about 25 ° C. for about 1 minute to obtain an acrylic pressure-sensitive adhesive composition (1). Prepared.

<Preparation of carrier film for transparent conductive film>
The acrylic pressure-sensitive adhesive composition (1) is applied to one side of a polyethylene terephthalate (PET) substrate (thickness 125 μm, support) and heated at 150 ° C. for 90 seconds to form a pressure-sensitive adhesive layer having a thickness of 20 μm. Formed. Next, the surface of the pressure-sensitive adhesive layer was bonded with a silicone-treated surface of a PET release liner (thickness 25 μm) that had been treated with silicone on one side, and stored at 50 ° C. for 2 days to produce a carrier film for a transparent conductive film. did. In use, the release liner was removed before use.

[Examples 2 to 4, Comparative Example 1]
As shown in Tables 1 and 2, in the same manner as in Example 1 except that the blending amount of the acrylic monomer constituting the acrylic polymer and the crosslinking agent constituting the pressure-sensitive adhesive composition was changed, transparent conductive A carrier film for film was prepared.

<Measurement of weight average molecular weight (Mw) of acrylic polymer>
The weight average molecular weight of the produced polymer was measured by GPC (gel permeation chromatography).

Device: HLC-8220GPC, manufactured by Tosoh Corporation
column:
Sample column: TSK guard column Super HZ-H manufactured by Tosoh Corporation
(1) + TSKgel Super HZM-H (2)
Reference column; manufactured by Tosoh Corporation, TSKgel Super H-RC (1)
Flow rate: 0.6ml / min
Injection volume: 10 μl
Column temperature: 40 ° C
Eluent: THF
Injection sample concentration: 0.2% by weight
Detector: differential refractometer The weight average molecular weight was calculated in terms of polystyrene.

<Measurement of glass transition temperature (Tg)>
The glass transition temperature (Tg) (° C.) was determined by the following formula using the following literature values as the glass transition temperature Tgn (° C.) of the homopolymer of each monomer.

Formula: 1 / (Tg + 273) = Σ [Wn / (Tgn + 273)]
(Wherein, Tg (° C.) is the glass transition temperature of the copolymer, Wn (−) is the weight fraction of each monomer, Tgn (° C.) is the glass transition temperature of the homopolymer of each monomer, and n is the type of each monomer. Represents.)
2-ethylhexyl acrylate (2EHA): -70 ° C
Butyl acrylate (BA): -55 ° C
Acrylic acid: 106 ° C
In addition, as a reference value, “Synthesis / design of acrylic resin and development of new application” (published by Central Management Development Center Publishing Department) was referred.

<Arithmetic mean surface waviness (Wa)>
Carrier film for transparent conductive film (1) “Adhesive surface” on the opposite side to the surface of the carrier layer for transparent conductive film that contacts the support, and AR before applying the carrier film for transparent conductive film Regarding "AR surface" of a film (antireflection film, manufactured by Nippon Reflight Industry Co., Ltd., product number: A-3504, a film having an antireflection layer on a PET film), "Wa (arithmetic mean surface undulation before AR film application) ) "Was measured.
(2) Subsequently, after bonding the “adhesive surface” of the carrier film for transparent conductive film and the “AR surface” of the AR film, the carrier film for transparent conductive film is peeled off from the AR film. Regarding “adhesive surface” of the carrier film for transparent conductive film and “AR surface” of the AR film, “Wa (arithmetic average surface waviness) after pasting AR film” was measured.

As a specific sample adjustment method, first, the Wa of each of the AR surface of the AR film and the adhesive surface of the carrier film for transparent conductive film was measured. Wa of the AR surface and the adhesive surface are referred to as Wa _AR and Wa, respectively.
Then, after sticking the said adhesive surface of the adhesive layer of the carrier film for transparent conductive films to the said AR film (crimping with a bonding machine: 0.4 Mpa, crimping | compression-bonding speed 2.0m / min), it is 140 degreeC. For 90 minutes, and then left at room temperature (25 ° C.) for 30 minutes or longer, and then the carrier film for transparent conductive film is peeled off from the AR film and contacted with the adhesive surface of the AR film, And Wa of each pressure-sensitive adhesive surface of the carrier film for transparent conductive film was measured. Wa of the AR surface and the adhesive surface are referred to as Wa _AR 1 and Wa 1, respectively.

As a method for measuring Wa (arithmetic mean surface waviness) in the present invention, the “adhesive surface” of the carrier film for transparent conductive film and the “AR surface” of the AR film (surface to be measured), which are measurement (evaluation) surfaces. Using a double-sided pressure-sensitive adhesive tape (manufactured by Nitto Denko Corporation, CS9621T), it is pasted on a slide glass (manufactured by Matsunami Glass Industry Co., Ltd., S1214, thickness 1.2-1.5 mm). The following conditions were used.
An optical profiler NT9100 (manufactured by Veeco) is used as a measuring instrument, and measurement conditions are Measurement Type: VSI (Infinite Scan), Objective: 2.5X, FOV: 1.0X, Modulation Threshold: 1% condition Thus, measurement was performed at n = 3.
After the measurement, data analysis was performed using Term Removal: Tilt Only (Plane Fit), Window Filtering: Fourier Filtering, and Fourier Filtering: Low Pass, Fourier.
The arithmetic average surface roughness Ra obtained by Filter Window: Gaussian, Low Cut off: 5 / mm was defined as the arithmetic average surface waviness Wa.

<Wa change rate>
Using the measured values Wa, Wa1, Wa _AR , Wa _AR 1, the rate of change in Wa of the adhesive surface before and after bonding the “adhesive surface” of the carrier film for transparent conductive film and the “AR surface” of the AR film ( Wa1 / Wa) and was determined Wa rate of change of the AR surface _(Wa AR 1 / _{Wa AR).}

<Observation of surface state of functional layer>
For the transparent conductive film, the AR film (antireflection film, manufactured by Nippon Reflight Industry Co., Ltd., product number: A-3504), which is an adherend, is peeled off from the adhesive surface of the adhesive layer of the carrier film for transparent conductive film. The AR surface that was in contact with the adhesive surface of the carrier film was visually observed under a fluorescent lamp, and it was confirmed whether or not the AR surface was uneven.
If there are no irregularities on the AR surface: ◎
When there are almost no irregularities on the AR surface: ○
When irregularities are clearly confirmed on the AR surface: ×

<Adhesion measurement>
As an adherend, a 20 mm wide and 100 mm long AR film (antireflection film, manufactured by Nippon Reflight Industry Co., Ltd., product number: A-3504) fixed to a SUS plate (SUS430BA) is used as a carrier film for a transparent conductive film. The pressure-sensitive adhesive surface was pressure-bonded at a linear pressure of 78.5 N / cm and a speed of 0.3 m / min. This was heated for 90 minutes in an environment of 140 ° C., then left at room temperature (25 ° C.) for 30 minutes or longer, and in this environment, a peeling speed of 0.3 m / min (low speed peeling) using a universal tensile tester. The carrier film for transparent conductive film was peeled from the AR film under the conditions of 10 m / min (high-speed peeling) and a peeling angle of 180 °, and the peeling force at this time was determined as adhesive force (vs. AR film) (N / 20 mm ) And evaluated.

注）ＢＡ：ブチルアクリレート、２ＥＨＡ：２−エチルヘキシルアクリレート、ＡＡ：アクリル酸

Note) BA: butyl acrylate, 2EHA: 2-ethylhexyl acrylate, AA: acrylic acid

注）原料モノマー：アクリル酸（ＡＡ）、官能基Ａ：カルボキシル基、Ｔ／Ｃ：エポキシ系架橋剤（三菱ガス化学社製、ＴＥＴＲＡＤ−Ｃ）、官能基Ｂ：エポキシ基、モル比については、小数点以下２桁まで表示した。

Note) Raw material monomer: acrylic acid (AA), functional group A: carboxyl group, T / C: epoxy-based crosslinking agent (manufactured by Mitsubishi Gas Chemical Co., Ltd., TETRAD-C), functional group B: epoxy group, for molar ratio, Displayed up to two decimal places.

  From the results of Table 3 above, in all the examples, by adjusting the arithmetic average surface waviness Wa of the adhesive surface of the adhesive layer constituting the carrier film for transparent conductive film to a desired range, the unevenness on the adhesive surface Generation | occurrence | production could be suppressed and generation | occurrence | production of the unevenness | corrugation in AR surface could be further suppressed in connection with this, and the external appearance of the transparent conductive film was able to be aimed at. Moreover, the adhesive force in low speed peeling and high speed peeling can also be adjusted to the desired range, and it has confirmed that it was excellent also in the adhesive characteristic.

  On the other hand, in Comparative Example 1, since the arithmetic average surface waviness Wa of the adhesive surface of the transparent conductive film carrier film was out of the desired range, the occurrence of irregularities on the AR surface was confirmed.

  In addition, when the ITO thin film layer is formed on the PET film on the side where the AR coating layer of the AR film (antireflection film, manufactured by Nippon Reflight Industry Co., Ltd., product number: A-3504) is not formed, It was confirmed that the same effect was obtained.

1a Transparent conductive layer 1b Support (base material)
DESCRIPTION OF SYMBOLS 1 Transparent conductive film 2 Functional layer 3 Adhesive layer 4 Support body (base material)
DESCRIPTION OF SYMBOLS 10 Transparent conductive film with a functional layer 20 Carrier film for transparent conductive films with a functional layer A Adhesive surface on the opposite side to the surface which contacts a support body

Claims (6)

Having an adhesive layer on at least one side of the support,
The arithmetic average surface waviness Wa of the pressure-sensitive adhesive surface opposite to the surface in contact with the support of the pressure-sensitive adhesive layer is 60 nm or less ,
The pressure-sensitive adhesive layer contains a (meth) acrylic polymer obtained by polymerizing a monomer component containing a (meth) acrylic acid ester having a C 2-14 alkyl group and a monomer having a carboxyl group, and a crosslinking agent. Adhesive composition (provided that (meth) acrylic acid alkyl ester (A), carboxyl group-containing unsaturated monomer (B), and at least one selected from the group consisting of methyl methacrylate, vinyl acetate and diethylacrylamide) An acrylic emulsion polymer having a solvent insoluble content of 70% by weight or more, which is composed of the seed monomer (C) as an essential raw material monomer, and two functional groups capable of reacting with a carboxyl group in the molecule The acrylic pressure-sensitive adhesive composition containing the water-insoluble crosslinking agent having the above is excluded) ,
The (meth) acrylic polymer has a glass transition temperature of −60 ° C. or higher and −30 ° C. or lower and a weight average molecular weight of 600,000 to 1010,000.
The molar ratio of the carboxyl group, which is the functional group A of the monomer having a carboxyl group, and the functional group B of the crosslinking agent that reacts with the functional group A is 0.70 or more and 0.95 or less. Carrier film for transparent conductive film. The carrier film for a transparent conductive film according to claim 1, wherein the amount of the crosslinking agent exceeds 10 parts by weight with respect to 100 parts by weight of the (meth) acrylic polymer. The (meth) acrylic acid ester, a transparent conductive film for the carrier film of claim 1 or 2, wherein the containing butyl (meth) acrylate. A laminate comprising a transparent conductive film and a transparent conductive film laminated on the transparent conductive film carrier film,
The carrier film for transparent conductive film is the carrier film for transparent conductive film according to any one of claims 1 to 3 ,
The transparent conductive film has a transparent conductive layer and a support,
The laminated body, wherein the adhesive surface of the adhesive layer of the carrier film for transparent conductive film is bonded to the surface of the support opposite to the surface in contact with the transparent conductive layer. A laminate comprising a transparent conductive film and a transparent conductive film laminated on the transparent conductive film carrier film,
The carrier film for transparent conductive film is the carrier film for transparent conductive film according to any one of claims 1 to 3 ,
The transparent conductive film has a transparent conductive layer and a support, and further has a functional layer on the surface of the support opposite to the surface in contact with the transparent conductive layer,
The laminated body characterized by the adhesive surface of the adhesive layer of the said carrier film for transparent conductive films being affixed on the surface on the opposite side to the surface which contacts the said support body of the said functional layer. Ratio of arithmetic mean surface waviness Wa of the contact surface of the functional layer before and after the adhesive surface of the adhesive layer of the carrier film for transparent conductive film is applied to the functional layer of the transparent conductive film (Wa after application / before application) The laminate according to claim 5 , wherein Wa) is 0.5 to 3.0.

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