JP6261119B2 - Light source support for LED lamp and assembly thereof - Google Patents

Light source support for LED lamp and assembly thereof Download PDF

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Publication number
JP6261119B2
JP6261119B2 JP2013268514A JP2013268514A JP6261119B2 JP 6261119 B2 JP6261119 B2 JP 6261119B2 JP 2013268514 A JP2013268514 A JP 2013268514A JP 2013268514 A JP2013268514 A JP 2013268514A JP 6261119 B2 JP6261119 B2 JP 6261119B2
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light source
source support
support assembly
led lamp
led
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JP2015125849A5 (en
JP2015125849A (en
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泰久 松本
泰久 松本
加奈江 松本
加奈江 松本
将幸 松崎
将幸 松崎
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Iwasaki Denki KK
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Iwasaki Denki KK
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Priority to PCT/JP2014/080828 priority patent/WO2015098383A1/en
Priority to EP14874999.7A priority patent/EP3088794A4/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/10—Arrangement of heat-generating components to reduce thermal damage, e.g. by distancing heat-generating components from other components to be protected
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/061—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/40—Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F21Y2115/15—Organic light-emitting diodes [OLED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Description

本発明は、ＬＥＤランプに関する。   The present invention relates to an LED lamp.

照明用ランプは、概して、白熱電球、蛍光灯、ＨＩＤ(High Intensity Discharge)ランプ、ＬＥＤ(Liht Emitting Diode)ランプと順次開発され、実用化されてきた。ＬＥＤランプは、発光ダイオード素子を光源として利用したランプである。ＬＥＤランプは、青色ＬＥＤ素子の開発により白色の発光が可能となり、最近、照明用ランプとして利用が拡がりつつある。   In general, lighting lamps have been developed and put into practical use in the order of incandescent bulbs, fluorescent lamps, HID (High Intensity Discharge) lamps, and LED (Liht Emitting Diode) lamps. The LED lamp is a lamp using a light emitting diode element as a light source. LED lamps are capable of emitting white light due to the development of blue LED elements, and their use as illumination lamps has recently been expanding.

図１は、現在広く販売されているＬＥＤランプの一例を示す図である。これらのＬＥＤランプ１００は、一般に、出力が１０Ｗ以下（典型的には７Ｗ程度）のランプである。図１（Ａ）〜（Ｃ）に示すように、ランプ形状は種々あるが、基本的に、口金１０２、放熱部１０４及びグローブ１０６から成っている。放熱部１０４は、アルミニウムのダイキャストから形成され、多くの場合、外周面に放熱フィンが形成されている。グローブ１０６は、透光性の樹脂から成る。   FIG. 1 is a diagram showing an example of an LED lamp that is currently widely sold. These LED lamps 100 are generally lamps having an output of 10 W or less (typically about 7 W). As shown in FIGS. 1A to 1C, although there are various lamp shapes, the lamp basically includes a base 102, a heat radiating portion 104, and a globe 106. The heat dissipating part 104 is formed from aluminum die-casting, and in many cases, heat dissipating fins are formed on the outer peripheral surface. The globe 106 is made of a translucent resin.

白熱電球、蛍光灯、ＨＩＤランプ等と異なり、ＬＥＤ素子は、半導体素子であるため、基本的に真空雰囲気又は所定のガス雰囲気中に配置する必要性がない。従って、アルミダイキャスト部分１０４とグローブ１０６との間は、適当な接着剤で固定されている。即ち、アルミダイキャスト部分１０４とグローブ１０６とで形成される内部空間は、ランプ外部空間との間で気密封止にはなってない。   Unlike incandescent bulbs, fluorescent lamps, HID lamps, and the like, LED elements are semiconductor elements, so there is basically no need to arrange them in a vacuum atmosphere or a predetermined gas atmosphere. Accordingly, the aluminum die cast part 104 and the globe 106 are fixed with an appropriate adhesive. That is, the internal space formed by the aluminum die cast part 104 and the globe 106 is not hermetically sealed between the lamp external space.

本発明者等は、本発明に関連する次の先行特許文献が存在することを承知している。   The present inventors are aware that the following prior patent documents related to the present invention exist.

特開2012-156036「ＬＥＤランプ」（公開日：2012/08/16）、出願人：岩崎電気株式会社JP 2012-156036 "LED lamp" (release date: 2012/08/16), applicant: Iwasaki Electric Co., Ltd. WO2011/004798「素子搭載用セラミックス基板、ＬＥＤ搭載用セラミックス基板、ＬＥＤランプ及びヘッドライト並びに電子部品」（国際公開日：2011/01/13）、出願人：株式会社東芝WO2011 / 004798 “Ceramic substrate for mounting elements, ceramic substrate for mounting LEDs, LED lamp and headlight, and electronic component” (International publication date: 2011/01/13), Applicant: Toshiba Corporation 特開2013-8721「実装基板および発光モジュール」（公開日：2013/01/10）、出願人：パナソニック株式会社JP 2013-8721 "Mounting board and light emitting module" (publication date: 2013/01/10), applicant: Panasonic Corporation 特開2006-147333「ＬＥＤ実装用プリント基板」（公開日：2006/06/08）、出願人：豊田合成株式会社JP 2006-147333 “Printed Circuit Board for LED Mounting” (Release Date: 2006/06/08), Applicant: Toyoda Gosei Co., Ltd.

ＬＥＤ素子は、半導体素子であり、半導体の接合部の温度と素子寿命とが密接な関係にある。即ち、使用時の接合部の温度が比較的低い場合には素子寿命は長期間となるが、温度が高くなるにつれ素子寿命は急激に短くなる。従って、ＬＥＤランプは、ＬＥＤ素子の温度が高いとランプ寿命が短縮化し、ランプ照度も劣化する。そのため、ＬＥＤランプにおいては、冷却・放熱手段が重要事項となる。   The LED element is a semiconductor element, and the temperature of the junction of the semiconductor and the element lifetime are closely related. That is, when the temperature of the joint at the time of use is relatively low, the device lifetime becomes long, but as the temperature increases, the device lifetime decreases rapidly. Accordingly, in the LED lamp, when the temperature of the LED element is high, the lamp life is shortened and the lamp illuminance is also deteriorated. For this reason, in the LED lamp, the cooling / heat dissipating means is an important matter.

本出願人は、前掲特許文献１により、次のようなＬＥＤランプを提案した。即ち、気密封止されたランプ構成において、ランプ内に冷却ガス（低分子量ガス）を封入する。ランプ内には、ランプ軸線方向に長い形状の光源支持体を配置し、その周囲に複数個のＬＥＤを搭載する。光源支持体にはランプ軸線に沿って貫通孔を形成して冷却ガス流路とし、ＬＥＤを裏面側からも効率良く冷却する。このアイデアに関しては、一定の冷却効果が有ることが確認され、その効果が特許文献１の図６にグラフで示されている。   The present applicant has proposed the following LED lamp according to Patent Document 1 described above. That is, in a hermetically sealed lamp configuration, a cooling gas (low molecular weight gas) is enclosed in the lamp. In the lamp, a light source support having a long shape in the lamp axis direction is disposed, and a plurality of LEDs are mounted around the light source support. A through-hole is formed in the light source support along the lamp axis to form a cooling gas flow path, and the LED is efficiently cooled from the back side. Regarding this idea, it is confirmed that there is a certain cooling effect, and the effect is shown in a graph in FIG.

前掲特許文献１の出願後、本発明者等は、このアイデアを基に、更に高い冷却・放熱手段を備えたＬＥＤランプの構成の研究開発を継続してきた。
この研究開発の結果に基づき、本発明は、新規な冷却・放熱手段を備えたＬＥＤランプを提供することを目的とする。 After the filing of the above-mentioned Patent Document 1, the present inventors have continued research and development on the configuration of LED lamps equipped with higher cooling and heat dissipation means based on this idea.
Based on the result of this research and development, an object of the present invention is to provide an LED lamp provided with a novel cooling / dissipating means.

本発明に係るＬＥＤランプは、複数個のＬＥＤ素子と、各々複数個のＬＥＤ素子を実装し、ランプ軸線に沿って延在する複数の光源支持体と、前記光源支持体を包囲して気密封止するガラス製密封容器とを備え、前記複数の光源支持体は、ランプ軸線に沿って両端部間を流れるガス流路を形成するように、ランプ軸線に垂直な断面で見て、ｎ角形（ｎ＝３，４，…の自然数）を形成するように配置され、前記光源支持体は、前記ガス流路のガスに対する流入・流出の流れを形成するようにＬＥＤ素子実装面と裏面との間を貫通する通気構造が形成されている。   The LED lamp according to the present invention includes a plurality of LED elements, a plurality of LED elements each mounted thereon, a plurality of light source supports extending along the lamp axis, and surrounding the light source support so as to be hermetically sealed. A plurality of light source supports, each of which has a rectangular shape when viewed in a cross section perpendicular to the lamp axis so as to form a gas flow path that flows between both ends along the lamp axis. n = a natural number of 3, 4,..., and the light source support is provided between the LED element mounting surface and the back surface so as to form an inflow / outflow flow for the gas in the gas flow path. A ventilation structure penetrating through is formed.

更に、上記ＬＥＤランプでは、前記光源支持体は、メタルコア基板であってよい。
更に、上記ＬＥＤランプでは、前記光源支持体に形成された通気構造は、溝、円形開口又は複数個の貫通孔として形成されていてもよい。
更に、上記ＬＥＤランプでは、前記光源支持体に形成された通気構造は、隣接するＬＥＤ素子間の領域に形成されていてもよい。
更に、上記ＬＥＤランプでは、隣接する前記光源支持体は、前記ガス流路のガスに対する流入・流出の流れを形成するように間隙を空けて保持されていてもよい。
更に、上記ＬＥＤランプでは、前記ガスは、低分子量ガスであってよい。
更に、上記ＬＥＤランプでは、前記低分子量ガスは、少なくとも、ヘリウムと酸素とを含む混合ガスであってよい。 Furthermore, in the LED lamp, the light source support may be a metal core substrate.
Furthermore, in the LED lamp, the ventilation structure formed in the light source support may be formed as a groove, a circular opening, or a plurality of through holes.
Furthermore, in the LED lamp, the ventilation structure formed in the light source support may be formed in a region between adjacent LED elements.
Furthermore, in the LED lamp, the adjacent light source supports may be held with a gap so as to form an inflow / outflow flow for the gas in the gas flow path.
Furthermore, in the LED lamp, the gas may be a low molecular weight gas.
Furthermore, in the LED lamp, the low molecular weight gas may be a mixed gas containing at least helium and oxygen.

本発明によれば、新規な冷却・放熱手段を備えたＬＥＤランプを提供することが出来る。   ADVANTAGE OF THE INVENTION According to this invention, the LED lamp provided with the novel cooling and heat dissipation means can be provided.

図１は、現在広く販売されているＬＥＤランプの一例を示す図である。FIG. 1 is a diagram showing an example of an LED lamp that is currently widely sold. 図２Ａは、本実施形態に係るＬＥＤランプの正面図である。FIG. 2A is a front view of the LED lamp according to the present embodiment. 図２Ｂは、図２Ａに示すＬＥＤランプの右側面図である。FIG. 2B is a right side view of the LED lamp shown in FIG. 2A. 図３は、本実施形態に係るＬＥＤランプの拡大斜視図である。FIG. 3 is an enlarged perspective view of the LED lamp according to the present embodiment. 図４Ａは、本実施形態に係るＬＥＤランプに使用されている光源支持体の外形図である。FIG. 4A is an external view of a light source support used in the LED lamp according to the present embodiment. 図４Ｂは、図４Ｃに示すＸ−Ｘ箇所の断面図である。4B is a cross-sectional view taken along the line XX shown in FIG. 4C. 図４Ｃは、ＬＥＤ素子を搭載した光源支持体を説明する図である。FIG. 4C is a diagram illustrating a light source support on which LED elements are mounted. 図４Ｄは、光源支持体に形成される溝の代替例である。FIG. 4D is an alternative example of a groove formed in the light source support. 図５Ａは、本実施形態に係るＬＥＤランプを垂直点灯した場合の冷却流の流れを説明する図である。FIG. 5A is a diagram illustrating the flow of the cooling flow when the LED lamp according to this embodiment is vertically lit. 図５Ｂは、ＬＥＤランプを水平点灯した場合の冷却流の流れを説明する図である。FIG. 5B is a diagram illustrating the flow of the cooling flow when the LED lamp is horizontally lit. 図５Ｃは、図５Ｂに示すＹ−Ｙ箇所の切断面から見た冷却流の流れを説明する図であり、（Ａ）と（Ｂ）は口金にねじ込んだランプの係止状態の相違による。FIG. 5C is a diagram for explaining the flow of the cooling flow as seen from the cut surface at the Y-Y position shown in FIG. 5B. FIGS. 図６は、本実施形態に係るＬＥＤランプの製造方法を説明するフローである。FIG. 6 is a flow for explaining a manufacturing method of the LED lamp according to the present embodiment.

以下、本発明に係るＬＥＤランプの実施形態に付いて、添付の図面を参照しながら詳細に説明する。なお、図中、同じ要素に対しては同じ参照符号を付して、重複した説明を省略する。また、以下に説明する実施形態は、例示であって、本発明の範囲を限定するものではないことを承知されたい。   Hereinafter, embodiments of an LED lamp according to the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted. In addition, it should be understood that the embodiments described below are examples and do not limit the scope of the present invention.

（ＬＥＤランプの全体構成）
図２Ａは、本実施形態に係るＬＥＤランプの正面図であり、図２Ｂは、右側面図である。このＬＥＤランプ１０は、図１で説明した現在広く宣伝・販売されている７Ｗ程度の低出力ＬＥＤランプではなく、主として高出力の２０〜５０Ｗクラス、典型的には２５ＷのＬＥＤランプを対象としている。このため、冷却・放熱手段が更に重要な検討事項となる。 (Overall configuration of LED lamp)
FIG. 2A is a front view of the LED lamp according to the present embodiment, and FIG. 2B is a right side view thereof. The LED lamp 10 is not a low-power LED lamp of about 7 W currently widely advertised and sold as described in FIG. 1, but is mainly intended for a high-power 20 to 50 W class, typically 25 W LED lamp. . For this reason, cooling and heat dissipation means become a further important consideration.

ＬＥＤランプ１０は、一端が口金２で気密封止された外球６の内部に、複数個のＬＥＤ素子１８が配置されている。複数個のＬＥＤ素子１８は、光源支持体１４に適当な間隔で搭載され固定される。   In the LED lamp 10, a plurality of LED elements 18 are arranged inside an outer sphere 6 whose one end is hermetically sealed with a base 2. The plurality of LED elements 18 are mounted and fixed on the light source support 14 at appropriate intervals.

この光源支持体１４は、典型的には、メタルコア基板から成る。光源支持体１４は、外球６の一端に固着されたステム８から延在する支柱２０に対して上下２箇所の金属バンド２８を使って、外球６の内部の適当な箇所に位置決め支持されている。そのため、光源支持体１４には、金属バンド保持用の凹部１４ｎ（図４Ａ参照）が形成されている。所望により、光源支持体１４に隣接する支柱２０の部分には、絶縁性チューブ（図示せず。）が被せられ、光源支持体１４と支柱２０との間の電気絶縁性が確保される。   The light source support 14 is typically made of a metal core substrate. The light source support 14 is positioned and supported at an appropriate position inside the outer sphere 6 by using two metal bands 28 on the upper and lower sides of the support column 20 extending from the stem 8 fixed to one end of the outer sphere 6. ing. Therefore, the light source support 14 is formed with a recess 14n (see FIG. 4A) for holding a metal band. If desired, an insulating tube (not shown) is placed on the portion of the column 20 adjacent to the light source support 14 to ensure electrical insulation between the light source support 14 and the column 20.

更に、口金２に近い外球６の内部には、熱遮蔽部材３０（図３参照）が設けられていてもよい。熱遮蔽部材３０は、例えば、セラミック、金属板、マイカ板等で形成されている。熱遮蔽部材３０の機能に関しては、後で、図６に示す製造方法に関連して説明する。   Further, a heat shielding member 30 (see FIG. 3) may be provided inside the outer sphere 6 near the base 2. The heat shielding member 30 is formed of, for example, a ceramic, a metal plate, a mica plate, or the like. The function of the heat shielding member 30 will be described later in relation to the manufacturing method shown in FIG.

好ましくは、外球６の内部空間２２には、低分子量ガスが封入されている。本出願書類で「低分子量ガス」とは、比熱が大きく、熱伝導性が良好なガスであり、典型的にはヘリウムガスである。本発明者等は、経験的に、ヘリウムガスを使用する場合は、少量の酸素を混入することによりＬＥＤ素子搭載に使用する封止体（典型的にはシリコーン層）に発生する変色を抑制出来ることを知っている。従って、ヘリウムガスを使用する場合は、体積比で、ヘリウム：酸素＝９３：７（単位：％）の混合ガスとすることが好ましい。   Preferably, a low molecular weight gas is sealed in the internal space 22 of the outer sphere 6. In the present application document, the “low molecular weight gas” is a gas having a large specific heat and good thermal conductivity, typically helium gas. The present inventors can empirically suppress discoloration that occurs in a sealing body (typically a silicone layer) used for mounting an LED element by mixing a small amount of oxygen when helium gas is used. I know that. Therefore, when helium gas is used, it is preferable to use a mixed gas of helium: oxygen = 93: 7 (unit:%) in volume ratio.

（ＬＥＤランプの各構成要素の説明）
図３は、本実施形態に係るＬＥＤランプの拡大斜視図である。口金２は、白熱電球やＨＩＤランプで使用されているねじ込みタイプ（Ｅ型）や差し込みタイプであってよい。 (Description of each component of LED lamp)
FIG. 3 is an enlarged perspective view of the LED lamp according to the present embodiment. The base 2 may be a screw-in type (E type) or an insertion type used in incandescent bulbs or HID lamps.

外球６は、例えば、ホウケイ酸ガラス等の透光性の硬質ガラスから成るＢＴ管である。しかし、任意の形状であってよい。外球６は、透明タイプ又は拡散タイプ（曇りガラスタイプ）のいずれであってもよい。
公知の白熱電球やＨＩＤランプと同様に、口金２と外球６との間は気密封止され、外球内部空間と外部空間との間は気密封止状態となっている。 The outer sphere 6 is a BT tube made of translucent hard glass such as borosilicate glass, for example. However, it may be any shape. The outer sphere 6 may be either a transparent type or a diffusion type (frosted glass type).
Similar to known incandescent bulbs and HID lamps, the space between the base 2 and the outer sphere 6 is hermetically sealed, and the space between the outer space and the outer space is hermetically sealed.

このＬＥＤランプ１０では、４枚の光源支持体１４を備え、各光源支持体に９個のＬＥＤ素子１８が搭載され、合計３６個のＬＥＤ素子により２５ＷのＬＥＤランプを実現している。   This LED lamp 10 includes four light source supports 14, and nine LED elements 18 are mounted on each light source support, and a total of 36 LED elements realize a 25 W LED lamp.

４枚の光源支持体１４は、ランプ軸線に対して垂直方向断面で見ると、概して矩形を形成するように配置されている。更に、好ましくは、隣接する光源支持体片の間は接続されてなく、間隙（ギャップ）２６を空けて配置されている。なお、４枚の光源支持体１４は、矩形を形成するように配置されているが、これに限定されない。即ち、３枚の光源支持体を、間隙を空けて三角形を形成するように配置してもよく、任意の枚数ｎ（ｎ＝３，４，…の自然数）の光源支持体を、間隙を空けてｎ角形を形成するように配置してもよい。   The four light source supports 14 are arranged so as to form a generally rectangular shape when viewed in a cross section perpendicular to the lamp axis. Furthermore, it is preferable that the adjacent light source support pieces are not connected to each other and are arranged with a gap (gap) 26 therebetween. In addition, although the four light source support bodies 14 are arrange | positioned so that a rectangle may be formed, it is not limited to this. That is, three light source supports may be arranged so as to form a triangle with a gap, and any number n (n = n, a natural number of n = 3, 4,...) Of light source supports with a gap. May be arranged so as to form an n-gon.

（光源支持体）
図４Ａは、本実施形態に係るＬＥＤランプに使用されている光源支持体１４の外形図であり、図４Ｂは、図４Ｃに示すＸ−Ｘ箇所の断面図であり、図４Ｃは、ＬＥＤ素子を搭載した光源支持体を説明する図であり、図４Ｄは、光源支持体に形成される溝（スリット）の代替例である。 (Light source support)
4A is an outline view of the light source support 14 used in the LED lamp according to the present embodiment, FIG. 4B is a cross-sectional view taken along the line XX shown in FIG. 4C, and FIG. 4C is an LED element. FIG. 4D is an alternative example of a groove (slit) formed in the light source support.

図４Ａに示す光源支持体１４は、好ましくは、メタルコア基板であり、例えば、長さ１００ｍｍ×幅２０ｍｍ×厚さ２ｍｍ程度の板状体である。ＬＥＤ素子の搭載箇所を符号１８ａで示している。光源支持体１４には、隣接するＬＥＤ素子搭載箇所１８ａの間を切断するように、端部から切り込まれた溝（スリット）１４ｂが形成されている。   The light source support 14 shown in FIG. 4A is preferably a metal core substrate, for example, a plate-like body having a length of about 100 mm × width of 20 mm × thickness of 2 mm. The LED element mounting location is indicated by reference numeral 18a. The light source support 14 is formed with a groove (slit) 14b cut from an end so as to cut between adjacent LED element mounting locations 18a.

図４Ｂに示すように、光源支持体１４には、比較的厚い本体部１４ａの上に薄い絶縁層１４ｉが形成され、更に絶縁層の上に、典型的には銅から成る導体パターン１４ｇ，１４ｅが形成され、更にその上に、樹脂等から成る薄いレジスト層１４ｊが形成されている。本体部１４ａは、熱伝導性の良好な材質から成り、例えば、銅、アルミニウム、熱伝導樹脂等から成る。熱伝導樹脂は、樹脂に金属粉・金属片を混入して熱伝導係数を高くしたものである。ここで、光源支持体１４として最も熱伝導性、加工性、経済性等に優れた部材は、アルミニウムである。   As shown in FIG. 4B, in the light source support 14, a thin insulating layer 14i is formed on a relatively thick main body 14a, and conductor patterns 14g and 14e typically made of copper are further formed on the insulating layer. And a thin resist layer 14j made of resin or the like is further formed thereon. The main body portion 14a is made of a material having good heat conductivity, and is made of, for example, copper, aluminum, heat conductive resin, or the like. The heat conductive resin is obtained by mixing a metal powder / metal piece into the resin to increase the heat conduction coefficient. Here, the member excellent in thermal conductivity, workability, economy, etc. as the light source support 14 is aluminum.

図４Ｃに示すように、導体パターン１４ｇは、図で見て第１の電極１４ｄから左方向に上側パターンに１４ｅによりＬＥＤ素子１８を順次直列に接続し、上下接続パターン１４ｆを介して、右方向に下側パターンに１４ｇによりＬＥＤ素子１８を順次直列に接続して電極１４ｈに至る。４枚の光源支持体１４は、リード線により、順次直列に接続されている（図示せず。）。従って、３６個のＬＥＤ素子は、全て直列接続されている。   As shown in FIG. 4C, the conductive pattern 14g is formed by connecting the LED elements 18 in series by 14e to the upper pattern in the left direction from the first electrode 14d in the figure, and in the right direction through the upper and lower connection patterns 14f. Further, the LED elements 18 are sequentially connected in series by 14 g to the lower pattern to reach the electrode 14 h. The four light source supports 14 are sequentially connected in series by lead wires (not shown). Therefore, all 36 LED elements are connected in series.

図４Ｄを参照されたい。図４Ａでは、光源支持体１４の溝（スリット）１４ｂは、端部から切り込まれた形状と説明したが、これに限定されない。光源支持体１４を貫通する通気構造（通気孔）であればよい。
従って、溝（スリット）１４ｂの代わりに、矩形開口１４ｋであってもよい。矩形開口１４ｋの場合、隣接するＬＥＤ素子１８の間の領域に形成すると更に好ましい。
或いは、円形の開口１４ｌであってもよい。円形の開口１４ｌの場合、隣接するＬＥＤ素子１８の間の領域に形成すると更に好ましい。この場合、複数個の貫通孔１４ｍを隣接するＬＥＤ素子１８の間の領域に形成してもよい。 See FIG. 4D. In FIG. 4A, the groove (slit) 14 b of the light source support 14 has been described as being cut from the end, but is not limited thereto. What is necessary is just the ventilation structure (ventilation hole) which penetrates the light source support body 14.
Accordingly, a rectangular opening 14k may be used instead of the groove (slit) 14b. In the case of the rectangular opening 14k, it is more preferable that the rectangular opening 14k is formed in a region between adjacent LED elements 18.
Alternatively, it may be a circular opening 14l. In the case of the circular opening 141, it is more preferable to form it in a region between adjacent LED elements 18. In this case, a plurality of through holes 14m may be formed in a region between adjacent LED elements 18.

（ＬＥＤランプの製造方法）
図６は、本実施形態に係るＬＥＤランプの製造方法を説明するフローである。 (LED lamp manufacturing method)
FIG. 6 is a flow for explaining a manufacturing method of the LED lamp according to the present embodiment.

ステップＳ１のマウント組立工程で、ＬＥＤ素子１８を光源支持体１４に固定し、光源支持体を支柱２０に取り付けてマウントを形成して、ステム８に取り付ける。
ステップＳ２の封止工程で、マウントを外球６の外球内部に挿入し、マウントが取り付けられたステム８と外球６とをバーナーで熱して封着し、気密封止する。
ステップＳ３の排気工程で、封止済みの外球内部から排気管を通じて一度真空状態に排気する。その後、ヘリウムと酸素の混合ガスを封入し、チップオフ（排気管をバーナーで溶かして封着すること）する。
ステップＳ４の口金付け工程で、口金２のトップ部及びサイド部を半田付けする。
ステップＳ５の点灯試験、検査を経て、ＬＥＤランプ１０が完成する。 In the mount assembling process of step S 1, the LED element 18 is fixed to the light source support 14, the light source support is attached to the column 20, a mount is formed, and the stem 8 is attached.
In the sealing step of step S2, the mount is inserted into the outer sphere 6 and the stem 8 to which the mount is attached and the outer sphere 6 are heated and sealed with a burner to be hermetically sealed.
In the exhaust process of step S3, the vacuum is once exhausted from the sealed outer sphere through the exhaust pipe. Thereafter, a mixed gas of helium and oxygen is sealed, and the chip is turned off (the exhaust pipe is melted and sealed with a burner).
The top part and the side part of the base 2 are soldered in the base attaching step of step S4.
The LED lamp 10 is completed through the lighting test and inspection in step S5.

ここで、ステップＳ２〜Ｓ４では、 外球の取り付け部、ステム等がバーナーによって１０００℃近くの高温に熱せられる。この熱が、外球内部のＬＥＤ素子１８に伝わって損傷しないようにするため、熱遮蔽部材３０（図３参照）が、外球の口金取り付け部分とＬＥＤ素子１８との間に設けられている。   Here, in steps S2 to S4, the outer sphere mounting portion, stem, and the like are heated to a high temperature close to 1000 ° C. by the burner. In order to prevent this heat from being transmitted to the LED element 18 inside the outer sphere and damaging it, a heat shielding member 30 (see FIG. 3) is provided between the base mounting portion of the outer sphere and the LED element 18. .

（本実施形態の利点・効果）
本実施例に係るＬＥＤランプ１０は、次のような利点・効果を有している。 (Advantages and effects of this embodiment)
The LED lamp 10 according to the present embodiment has the following advantages and effects.

(1) 図４Ｄに関連して説明したように、光源支持体１４を貫通する通気構造（通気孔）を形成することにより、光源支持体１４の軽量化が図れる。その結果、ＬＥＤランプ１０の軽量化が図れる。
(2) 光源支持体１４を貫通する通気孔を形成することにより、光源支持体１４の表面積が増加して放熱効果が向上する。即ち、ＬＥＤ素子１８の冷却効果が向上する。
(3) 冷却効果の詳細
図５Ａ〜図５Ｃを参照しながら、ランプの点灯方向（垂直点灯，水平点灯）を考慮した冷却効果に関して説明する。尚、図５Ａに示す垂直点灯では口金が上側に位置する場合となっているが、口金が下側に位置する場合も同様の効果が期待できる。 (1) As described with reference to FIG. 4D, the light source support 14 can be reduced in weight by forming a ventilation structure (vent hole) that penetrates the light source support 14. As a result, the LED lamp 10 can be reduced in weight.
(2) By forming a vent hole penetrating the light source support 14, the surface area of the light source support 14 is increased and the heat dissipation effect is improved. That is, the cooling effect of the LED element 18 is improved.
(3) Details of Cooling Effect With reference to FIGS. 5A to 5C, the cooling effect in consideration of the lamp lighting direction (vertical lighting, horizontal lighting) will be described. In the vertical lighting shown in FIG. 5A, the base is located on the upper side, but the same effect can be expected when the base is located on the lower side.

図５Ａに示すように、４枚の光源支持体１４が形成するランプ軸線に沿って延在する矩形空間は、煙突効果により下部から上部への冷却流Ｃａを形成する。更に、光源支持体間の間隙（ギャップ）２６は、冷却流Ｃａに対する流入・流出の流れＣｂを形成し、冷却効果を高めている。   As shown in FIG. 5A, the rectangular space extending along the lamp axis formed by the four light source supports 14 forms a cooling flow Ca from the lower part to the upper part due to the chimney effect. Further, the gap (gap) 26 between the light source supports forms an inflow / outflow flow Cb with respect to the cooling flow Ca to enhance the cooling effect.

更に、図４Ａに示す光源支持体１４に形成された溝（スリット）１４ｂ，図４Ｄに示す隣接ＬＥＤ素子間の領域に形成された矩形開口１４ｋ、円形開口１４ｌ、複数の貫通孔１４ｍ（以下、「溝１４ｂ等」という。）について説明する。図４Ａに示すように、溝１４ｂ等により、光源支持体の長さ方向の熱伝導路（矢印ａ）を確保しつつ、隣接するＬＥＤ素子からの直線的な熱伝導路（矢印ｂ）を遮断又は縮小して、熱的影響を少なくしている。   Furthermore, a groove (slit) 14b formed in the light source support 14 shown in FIG. 4A, a rectangular opening 14k, a circular opening 141, and a plurality of through-holes 14m (hereinafter referred to as the following) formed in the region between adjacent LED elements shown in FIG. 4D. (Referred to as “groove 14b etc.”). As shown in FIG. 4A, the linear heat conduction path (arrow b) from the adjacent LED element is cut off while securing the heat conduction path (arrow a) in the length direction of the light source support by the groove 14b and the like. Or, the thermal effect is reduced by reducing the size.

図５Ａに示す垂直点灯のＬＥＤランプに於いて、光源支持体１４の溝１４ｂ等は、光源支持体１４の間隙２６と同様に冷却流Ｃａに対する流入・流出の流れＣｃを形成すると共に、光源支持体の長さ方向の熱伝導路を確保しつつ、隣接するＬＥＤ素子からの直線的な熱伝導路を遮断又は減少して、熱的影響を少なくしている。 In the vertically lit LED lamp shown in FIG. 5A, the grooves 14b and the like of the light source support 14 form an inflow / outflow flow Cc with respect to the cooling flow Ca similarly to the gap 26 of the light source support 14 and also support the light source. While securing a heat conduction path in the length direction of the body, the thermal effect is reduced by blocking or reducing the linear heat conduction path from the adjacent LED elements.

図５Ｂは、水平点灯の場合であり、図５Ｃは、Ｙ−Ｙ線切断面であり、（Ａ）と（Ｂ）は口金にねじ込んだランプの係止状態の相違による。即ち、（Ａ）は４枚の光源支持体が正方形を形成するように位置した場合、（Ｂ）は４枚の光源支持体が菱形を形成するように位置した場合を示す図である。
水平点灯の場合、図５Ａで説明した煙突効果による冷却流Ｃａは相対的に少ない。しかし、光源支持体間の間隙２６を通過する冷却流Ｃｂは相対的に多くなる。更に、光源支持体１４の溝１４ｂ等は、冷却流Ｃｃの流路を形成すると共に、光源支持体の長さ方向の熱伝導路を確保しつつ、隣接するＬＥＤ素子からの直線的な熱伝導路を遮断又は減少して、熱的影響を少なくしている。 FIG. 5B shows the case of horizontal lighting, FIG. 5C shows the YY line cut surface, and (A) and (B) are due to the difference in the locking state of the lamp screwed into the base. That is, (A) shows a case where four light source supports are positioned so as to form a square, and (B) shows a case where four light source supports are positioned so as to form a rhombus.
In the case of horizontal lighting, the cooling flow Ca due to the chimney effect described in FIG. 5A is relatively small. However, the cooling flow Cb passing through the gap 26 between the light source supports is relatively large. Further, the grooves 14b and the like of the light source support 14 form a flow path of the cooling flow Cc, and secure a heat conduction path in the length direction of the light source support, while linearly conducting heat from adjacent LED elements. The path is blocked or reduced to reduce thermal effects.

これらにより、高出力のＬＥＤランプに関して、水平点灯でも十分な冷却効果を確認している。   As a result, a sufficient cooling effect has been confirmed for a high output LED lamp even when it is lit horizontally.

（まとめ）
以上により、本発明に係るＬＥＤランプの実施形態に付いて説明したが、これらは例示であって、本発明を限定するものではない。本発明の技術的範囲は、添付の特許請求の範囲の記載によって定められる。 (Summary)
As mentioned above, although it demonstrated about embodiment of the LED lamp which concerns on this invention, these are illustrations and do not limit this invention. The technical scope of the present invention is defined by the description of the appended claims.

２：口金、 ６：外球、 ８：ステム、 １０：ＬＥＤランプ，ランプ、 １４：光源支持体、 １４ａ：本体部、 １４ｂ：溝，スリット、 １４ｄ：電極、 １４ｆ：上下接続パターン、 １４ｈ：電極、 １４ｉ：絶縁層、 １４ｊ：レジスト層、 １４ｋ：開口、 １４ｋ：矩形開口、 １４ｌ：円形開口，開口、 １４ｍ：貫通孔、 １４ｎ：凹部、 １８：ＬＥＤ素子、 １８ａ：素子搭載箇所、 ２０：支柱、 ２２：内部空間、 ２６：間隙、 ２８：金属バンド、 ３０：熱遮蔽部材、 １００：ＬＥＤランプ，ランプ、 １０２：口金、 １０４：アルミダイキャスト部分，放熱部、 １０６：グローブ
ａ：矢印、 ｂ：矢印、 Ｃａ，Ｃｂ，Ｃｃ：冷却流、 2: base, 6: outer sphere, 8: stem, 10: LED lamp, lamp, 14: light source support, 14a: main body, 14b: groove, slit, 14d: electrode, 14f: vertical connection pattern, 14h: electrode 14i: insulating layer, 14j: resist layer, 14k: opening, 14k: rectangular opening, 14l: circular opening, opening, 14m: through hole, 14n: recess, 18: LED element, 18a: element mounting location, 20: support , 22: internal space, 26: gap, 28: metal band, 30: heat shielding member, 100: LED lamp, lamp, 102: base, 104: aluminum die cast part, heat radiation part, 106: globe a: arrow, b : Arrow, Ca, Cb, Cc: Cooling flow,

Claims (4)

垂直点灯用ＬＥＤランプのＢＴ管型外球内にランプ軸線に沿って配置されて使用される、複数枚ｎ（ｎ＝３，４，…の自然数）の光源支持体で構成された光源支持体組立体であって、
前記光源支持体は、片面に複数個のＬＥＤ素子が実装された所定の長手方向及び幅方向の寸法をもった矩形の外形形状の板状体であり、
複数枚ｎ（ｎ＝３，４，…の自然数）の前記光源支持体が前記長手方向の長さを揃えて、該長手方向に垂直な断面で見てｎ角形を形成するように該長手方向に沿って並置されて、前記光源支持体組立体は、全面的に開放された両端部の間を煙突効果により下部から上部へ流れる冷却流Ｃａを形成し、
前記光源支持体組立体の隣接する該光源支持体は、間隙を空けて配置されて、冷却流Ｃａに対する流入・流出の流れＣｂを形成し、
前記光源支持体は、隣接する前記ＬＥＤ素子の間に、ＬＥＤ素子実装面と裏面との間を貫通する通気構造が形成されて、冷却流Ｃａに対する流入・流出の流れＣｃを形成すると共に、該光源支持体の長さ方向の熱伝導路ａを確保しつつ、隣接する前記ＬＥＤ素子からの直線的な熱伝導路ｂを遮断又は縮小して熱的影響を少なくしている、光源支持体組立体。 A light source support composed of a plurality of n (n = 3, 4,... Natural number) light source supports arranged and used along the lamp axis in the BT tube type outer sphere of the LED lamp for vertical lighting. An assembly comprising:
The light source support is a rectangular plate-like body having a predetermined longitudinal and width dimension in which a plurality of LED elements are mounted on one side,
A plurality n (n = 3, 4, ... natural number) the light source support is aligned length of the longitudinal direction, longitudinal direction so as to form an n-gon viewed in cross section perpendicular to the longitudinal The light source support assembly forms a cooling flow Ca that flows from the lower part to the upper part due to the chimney effect between the both ends that are fully open,
The light source supports adjacent to the light source support assembly are arranged with a gap therebetween to form an inflow / outflow flow Cb with respect to the cooling flow Ca,
In the light source support, a ventilation structure penetrating between the LED element mounting surface and the back surface is formed between the adjacent LED elements to form an inflow / outflow flow Cc with respect to the cooling flow Ca, and A light source support assembly that secures a heat conduction path a in the lengthwise direction of the light source support and blocks or reduces the linear heat conduction path b from the adjacent LED elements to reduce the thermal influence. Solid. 請求項１に記載の光源支持体組立体において、
前記光源支持体組立体は、４枚（ｎ＝４）の前記光源支持体で構成されている、光源支持体組立体。 The light source support assembly according to claim 1,
The light source support assembly is composed of four (n = 4) light source supports. 請求項１又は２に記載の光源支持体組立体において、
前記通気構造は、スリット、矩形開口、円形開口又は複数の貫通孔のいずれかであり、隣接する前記ＬＥＤ素子からの直線的な熱伝導路を遮断又は縮小して熱的影響を少なくすると共に、前記冷却ガス流路に対する流入・流出口を形成している、光源支持体組立体。 The light source support assembly according to claim 1 or 2,
The ventilation structure is any one of a slit, a rectangular opening, a circular opening, or a plurality of through holes, and blocks or reduces a linear heat conduction path from the adjacent LED element to reduce a thermal influence. A light source support assembly that forms an inlet / outlet for the cooling gas flow path. 請求項１〜３のいずれか一項に記載の光源支持体組立体において、
前記光源支持体は、メタルコア基板から形成される、光源支持体組立体。 In the light source support assembly according to any one of claims 1 to 3,
The light source support is a light source support assembly formed of a metal core substrate.
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