JP6178216B2 - Grinding / lapping / polishing method and apparatus thereof - Google Patents

Description

  The present invention relates to a method for grinding, lapping and polishing a workpiece. Specifically, the present invention relates to a method for grinding, lapping, and polishing a workpiece such as ceramics, silicon wafer, SiC, alumina, sapphire, metal or alloy, and an apparatus used for the method.

  Many materials such as electronic materials are hard and brittle, and the difficult processability leads to high product costs. As the processing method, rough processing with a grindstone using diamond or the like is first performed, followed by lapping and finally polishing.

  A grindstone is a tool formed by solidifying hard particles, that is, abrasive grains with a binder. Processing using a grindstone includes grinding and lapping / polishing. Roughing is customarily called grinding and finishing is called lapping / polishing. In these processes, the surface of the workpiece, i.e., the surface to be processed, is moved by the abrasive grains by relatively moving the grindstone and the workpiece while the grindstone is pressed against the workpiece, i.e., the workpiece. It is a process to scrape off as.

  For grinding using a grindstone, cylindrical grinding that processes the cylindrical outer peripheral surface of the workpiece, internal grinding that processes the cylindrical inner peripheral surface of the workpiece, and processing the flat surface of the workpiece There is surface grinding. As a grindstone for processing the outer peripheral surface or the inner peripheral surface, a grindstone provided with a cylindrical processed surface is used. In addition, as a grindstone for machining a flat surface, a cylindrical grindstone having a machining surface provided on the outer peripheral surface or a cup-shaped, ring-shaped and disc-shaped grindstone having a machining surface provided on a flat end surface is used. .

  Various proposals have conventionally been made regarding grinding, lapping, and polishing methods. For example, JP-A-2005-088153 (Patent Document 1) discloses a volume ratio of abrasive grains to liquid, and 5 abrasive grains. Surface grinding is performed while supplying a slurry of up to 50%, and a plurality of slurry supply holes are provided as uniformly as possible on the entire processing surface of the surface plate. The slurry is supplied from the slurry supply holes at the same capacity per unit time. By being supplied, in surface grinding of various hard and brittle materials using a fixed-abrasive diamond wrap surface plate, there is no reduction in sharpness without interrupting the dressing and dressing, and stable surface grinding is possible. It describes how to make it possible.

  JP 2009-512566 (Patent Document 2) discloses a lapping process for a three-dimensional, non-flat, flexible, fixed abrasive structure having a first surface and a work surface. Or an abrasive article for polishing, wherein the work surface comprises a plurality of precisely shaped abrasive composites, the precise shaped abrasive composites comprising a resin phase and a metal phase, A method is described for polishing or lapping a workpiece with an abrasive, the phase further comprising a superabrasive material.

Japanese Unexamined Patent Publication No. 2005-088153 Special table 2009-512566 gazette

  Grinding with a conventional grindstone is capable of high-speed machining, but the finished surface is rough and defects are created on the material surface and below the surface. Roughing is usually not suitable for obtaining dimensional accuracy because of high processing speed. The polishing process is a process using floating abrasive grains and has a drawback that the processing speed is slow. However, the finished surface is smooth and does not leave a defect in the material. Rather, it is used for removing a defect generated during roughing. Lapping is an intermediate processing method. Usually, these three steps are performed by different machines, and the steps themselves are slow, and it takes time and effort to change the steps.

  Therefore, the present invention can perform the three steps of grinding, lapping, and polishing with the same grindstone, and also enables double-sided processing. Even if it is continuously used, the processing speed does not decrease, and the dressing sink is omitted. It is another object of the present invention to provide a grinding / lapping / polishing method capable of reducing the number of dressings and an apparatus used for the method.

  The present invention has been made as a result of intensive studies on the structure of a grindstone in order to solve the above-mentioned problems, and the gist of the present invention is as follows.

(1) A method of grinding, lapping, and polishing a workpiece using the same grindstone, wherein the grindstone includes a superabrasive lump having a Vickers hardness of 2000 or more, a metal lump having a Vickers hardness of 20 to 300, A matrix having a Vickers hardness of 300 to 2000, and after grinding using the grindstone, when performing lapping / polishing, the abrasive has a Vickers hardness of 300 to 2000 and a particle size of the abrasive Supplying a slurry containing an abrasive 5 to 100 times the protruding amount T from the metal lump or matrix of the superabrasive lump between the workpiece and the grindstone for lapping and polishing. A grinding, lapping, and polishing method that is characterized.
(2) The grinding / lapping / polishing method according to (1), wherein the superabrasive lump and metal lump are columnar having an axis L in the depth direction of the surface to be ground, lapped and polished. .
(3) The grinding / lapping / polishing method according to (1) or (2), wherein a part or the whole of the superabrasive grain lump is contained in the metal lump.
(4) The grinding / lapping / polishing method according to any one of (1) to (3), wherein a cross-sectional shape of the superabrasive grain lump or metal lump is rectangular or wedge-shaped.
(5) When the cross-sectional area of the metal lump includes a matrix, 2 mm 2 to ²⁰ cm ² or when there is no matrix, the cross-sectional area of the super-abrasive lump is 0.01 mm ^{2 to 20} cm. ^{2. The} grinding / lapping / polishing method according to any one of (1) to (4), wherein
(6) Grinding / lapping / polishing according to any one of (1) to (5), characterized in that double-sided processing is performed by attaching the grindstone to both surfaces of the workpiece. Method.

(7) An apparatus for grinding, lapping, and polishing a workpiece using the same grindstone, wherein the grindstone includes a superabrasive lump having a Vickers hardness of 2000 or more, a metal lump having a Vickers hardness of 20 to 300, A matrix having a Vickers hardness of 300 to 2000, and after grinding using the grindstone, when performing lapping / polishing, the abrasive has a Vickers hardness of 300 to 2000 and a particle size of the abrasive Supplying a slurry containing an abrasive 5 to 100 times the protruding amount T from the metal lump or matrix of the superabrasive lump between the workpiece and the grindstone for lapping and polishing. A grinding / lapping / polishing device.
(8) The grinding / lapping / polishing apparatus according to (7), wherein the superabrasive lump and the metal lump are columnar having an axis L in the depth direction of the surface to be ground, lapped and polished. .
(9) The grinding / lapping / polishing apparatus according to (7) or (8), wherein a part or the whole of the superabrasive grain lump is contained in the metal lump.
(10) The grinding / lapping / polishing apparatus according to any one of (7) to (9), wherein a cross-sectional shape of the superabrasive grain lump or metal lump is rectangular or wedge-shaped.
(11) When the cross-sectional area of the metal lump includes a matrix, 2 mm 2 to ²⁰ cm ² or when there is no matrix, the cross-sectional area of the super-abrasive lump is 0.01 mm ^{2 to 20} cm. ^The grinding / lapping / polishing apparatus according to any one of (7) to (10), wherein
(12) Grinding / lapping / polishing according to any one of (7) to (11), wherein the grindstone is mounted on both surfaces of the workpiece to perform double-sided processing. apparatus.
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According to the present invention (1), the grindstone has a superabrasive lump having a Vickers hardness of 2000 or more, a metal lump having a Vickers hardness of 20 to 300, and a matrix having a Vickers hardness of 300 to 2000. When grinding and lapping, the Vickers hardness of the abrasive is 300 to 2000, and the particle size of the abrasive is the amount of protrusion of the superabrasive lump from the metal lump or matrix By supplying a slurry containing an abrasive 5 to 100 times T between the workpiece and the grindstone and performing lapping and polishing, the superabrasive lump contacts the workpiece during grinding. On the other hand, at the time of lapping / polishing, since the abrasive comes into contact with the workpiece, grinding / lapping / polishing can be performed using the same grindstone.
Here, the superabrasive grain lump refers to a porous body in which a superabrasive powder such as diamond is sintered or hardened by a binder and has a porosity of zero to a porosity of 60%.
In addition, the metal lump refers to a porous body having a porosity of 60% from a dense body having a porosity of zero, such as a lump of metal such as copper or a metal powder solidified by a binder.
The matrix may be structurally necessary (for example, when it is desired to extend the dressing interval), but is not absolutely necessary, but when the matrix is used, the hardness is 300 to 2000 Vickers hardness.

  According to the present invention (2), the superabrasive grain lump and the metal lump are columnar having an axis L in the depth direction of the surface to be ground, lapped and polished, so that the abrasive grains exposed on the ground and polished surface fall off. Even if the abrasive grains buried in the lower layer are exposed, grinding and polishing can be performed continuously while maintaining the processing speed.

  According to the present invention (3), a part or the whole of the superabrasive lump is included in the metal lump so that the protruding amount of the superabrasive lump from the metal lump and the matrix is just after dressing. T can be easily secured.

  According to the present invention (4), the superabrasive grain lump or the metal lump has a rectangular or wedge-shaped cross section, which facilitates grinding, lapping and polishing.

According to the present invention (5), when the cross-sectional area of the metal lump includes a matrix, it is ² mm 2 to ²⁰ cm ² or the whole surface of the grindstone other than the super-abrasive lump when there is no matrix, When the thickness is 0.01 mm ^{2 to 20} cm ² , the working efficiency of grinding, lapping, and polishing can be increased.

  According to this invention (6), since the said grindstone is attached to both surfaces of a to-be-processed object, double-sided processing is possible.

  According to the present invention (7) to (12), an apparatus that can be used in the grinding, lapping, and polishing methods of (1) to (6) can be realized.

  According to the present invention, the three steps of grinding, lapping, and polishing can be performed with the same grindstone, and both sides can be processed. The processing speed does not decrease even when continuously used, and the dressing sink is omitted. In addition, it is possible to provide a grinding / lapping / polishing method capable of reducing the number of times of dressing and an apparatus used for the method.

FIG. 2 is a cross-sectional view of a grindstone when producing a grindstone in an embodiment of the grinding / lap / polishing method and apparatus of the present invention. It is a grindstone sectional view just after the dressing process in the embodiment of the grinding / lap / polishing method and apparatus of the present invention. 1 is a cross-sectional view of a grindstone during lapping / polishing in an embodiment of a grinding / lapping / polishing method and apparatus according to the present invention. It is a grindstone sectional view showing the embodiment which has arranged the superabrasive grain lump in the grinding / lap lapping method and apparatus of the present invention on the outside of the metal lump. It is a grindstone sectional view showing an embodiment in which a superabrasive grain lump in a grinding / lapping / polishing method and apparatus of the present invention is arranged inside a metal lump. It is sectional drawing which has arrange | positioned the grindstone in the grinding / lap | wrapping / polishing method and its apparatus of this invention on both surfaces of the workpiece. It is a grindstone plan view after grinding in an embodiment of a grinding, lap, and polishing method and apparatus of the present invention. It is a grindstone plan view showing an embodiment in which a matrix and a metal lump are integrated in a grinding / lapping / polishing method and apparatus of the present invention. FIG. 2 is a plan view of a grindstone showing an embodiment in which the cross-sectional shape of a superabrasive grain lump in the grinding / lap / polishing method and apparatus of the present invention is a wedge shape. It is a grindstone plan view showing an embodiment in which the cross-sectional shape of a superabrasive grain lump in the grinding / lapping / polishing method and apparatus of the present invention is rectangular.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. 1 to 10, 1 is a superabrasive grain lump, 2 is a metal lump, 3 is a matrix, 4 is an abrasive, 5 is a workpiece, T is a protruding amount of the superabrasive grain lump, and L is an axis. The workpieces targeted by the present invention include ceramics, silicon wafers, SiC, alumina, sapphire, metals and alloys.

  FIG. 1 is a cross-sectional view of a grindstone when producing a grindstone in an embodiment of the grinding / lapping / polishing method and apparatus of the present invention. The upper surface of FIG. 1 is a processing surface that contacts a workpiece 5 (not shown), and the superabrasive lump 1 and the metal lump 2 are fixed in the matrix 3 and are fixed. The surfaces of the grain lump 1 and the metal lump 2 are at the same level, and the superabrasive grain lump 1 does not protrude from the surface of the metal lump 2. Here, the superabrasive lump 1 refers to a material obtained by sintering or hardening a superabrasive powder such as diamond from a binder. As superabrasive powder, in addition to diamond, cubic boron nitride (CBN) abrasive grains or CBN may be used, a mixture of diamond and CBN may be used, and silicon carbide SiC. That is, GC alone or a mixture thereof may be used. Vitrified bonds are used as the binding material constituting the grindstone 10, but various bonding materials such as resinoid bonds, metal bonds, and electrodeposition bonds can be used as the respective binding materials in addition to vitrified bonds. . The metal lump 2 refers to a metal lump such as copper or a metal powder solidified with a binder.

  FIG. 2 is a cross-sectional view of a grindstone immediately after a dressing process in an embodiment of the grinding / lapping / polishing method and apparatus according to the present invention. Due to the dressing process, the superabrasive lump 1 protrudes from the surface of the metal lump 2 or the matrix 3 by a height T, so that the workpiece 5 (not shown) is in contact with the superabrasive lump 1 having a Vickers hardness of 2000 or more. To be ground. Here, through the grinding, lapping, and polishing processes, the surface of the metal block and the matrix is negligible compared to the height T because of their hardness.

  FIG. 3 is a cross-sectional view of a grindstone during lapping / polishing in an embodiment of the grinding / lapping / polishing method and apparatus of the present invention. In lapping / polishing, a slurry containing an abrasive 4 having a particle size 5 to 100 times the protruding amount T of the superabrasive lump 1 from the metal lump 2 is supplied between the workpiece 5 and the grindstone. And do it. Since the abrasive 4 has a Vickers hardness of 300 to 2000 and is harder than the Vickers hardness 20 to 300 of the metal lump 2, the abrasive 4 is pierced and held in the metal lump 2 as shown in FIG. Since the particle size of the abrasive 4 in this slurry is much larger as 5 to 100 times the protruding amount T of the superabrasive lump 1 from the metal lump 2, the workpiece 5 moving on the grindstone surface is Since only the abrasive 4 in the slurry contacts, the workpiece 5 is lapped and polished without being ground.

  Thus, the present invention adjusts the hardness of the superabrasive lump 1, the abrasive 4 and the metal lump 2 in this order, and the particle size of the abrasive 4 is changed to the metal lump of the superabrasive lump 1. By making it much larger than the protrusion amount T from 2, it is possible to perform grinding, lapping, and polishing using the same grindstone. The matrix 3 has almost the same hardness as the abrasive.

  FIG. 4 is a cross-sectional view of a grindstone showing an embodiment in which superabrasive grains in the grinding / lapping / polishing method and apparatus of the present invention are arranged outside a metal lump. As shown in FIG. 4, the superabrasive lump 1 and the metal lump 2 are columnar having an axis L in the depth direction of the surface to be ground, lapped and polished, so that the abrasive grains exposed on the ground and polished surface fall off. Even if the abrasive grains buried in the lower layer are exposed, grinding can be performed continuously while maintaining the processing speed. Further, the superabrasive lump and the matrix for fixing the same are both composed of abrasive grains and a binder, and the abrasive grains in the superabrasive lump are higher in hardness than the abrasive grains of the matrix. Abrasion is larger than that of the superabrasive stone lump, and the abrasive grains of the superabrasive agglomerate can always be exposed, and a hard and brittle workpiece such as an electronic material can be ground.

  The matrix is preferably a porous body having an open porosity of 20 to 60% by volume, but may be a dense body. Here, the open pores refer to pores through which water passes, as described in, for example, Porous Materials: Process technology and applications (Materials Technology Series). The reason for limiting the lower limit (20%) of the porosity is that in the porous body below this, the pores are mainly closed pores and not the open pores, and it becomes impossible for air or coolant to enter and exit from the vacuum. The reason for limiting the upper limit (60%) is that the mixed powder of abrasive grains and binder is at most about 60%, and since it is then fired, it is always 60% or less, which is the upper limit.

  FIG. 5 is a cross-sectional view of a grindstone showing an embodiment in which the superabrasive lump 1 is arranged inside the metal lump 2 in the grinding / lapping / polishing method and apparatus of the present invention. By including a part or the whole of the superabrasive lump 1 inside the metal lump 2, it is possible to easily secure the protruding amount T of the superabrasive lump from the metal lump.

  FIG. 6 is a cross-sectional view in which grinding wheels in the grinding / lapping / polishing method and apparatus of the present invention are arranged on both surfaces of the workpiece 5. As shown in FIG. 6, since the grindstone is attached to both surfaces of the workpiece 5, double-sided processing is possible. In this case, dressing may be performed by removing the workpiece 5 and processing the grindstones.

FIG. 7 is a plan view of a grindstone after grinding in an embodiment of the grinding / lapping / polishing method and apparatus of the present invention. The cross-sectional area of the metal lump 1 is 2 mm 2 to ²⁰ cm ² or, if there is no matrix, the whole surface of the grindstone other than the super-abrasive lump is made, and the cross-sectional area of the super-abrasive lump 2 is 0.01 mm ^{2 to 20} cm ² The working efficiency of lapping and polishing can be increased.

  FIG. 8 is a plan view of a grindstone showing an embodiment in which the matrix 3 and the metal lump 2 are integrated in the grinding / lapping / polishing method and apparatus of the present invention. The matrix 3 can be integrated by containing metal powder, and it may be a single metal.

  FIG. 9 is a plan view of a grindstone showing an embodiment in which the cross-sectional shape of the superabrasive lump 1 in the grinding / lapping / polishing method and apparatus of the present invention is a wedge shape, and FIG. 10 is the cross-sectional shape of the superabrasive lump 1. It is a grindstone top view which shows embodiment with a rectangle. The cross-sectional shape of the superabrasive lump 1 or metal lump 2 is rectangular or wedge-shaped so that grinding, lapping, and polishing can be facilitated. Also, the metal lump may spread over the entire whetstone and have no matrix. Is possible.

  As shown in Fig. 5, several 3 to 5 mm diameter cylindrical holes are opened in a grindstone, and a mixture of copper powder (60% by volume) hardened with resin (about 40% by volume) is put there. It was. A diamond column having a diameter of about 1 mm was placed in the center of the cylinder, and the protruding amount T of the diamond surface was 2 μm. Initially, this diamond column was ground. Thereafter, the slurry was flowed and lapped and polished with an abrasive having a particle diameter of 20 μm in the slurry. As a result, a surface roughness of 10 nm was achieved with Ra on the sapphire substrate. The effect of the present invention was confirmed by this example.

1 Superabrasive lump 2 Metal lump 3 Matrix 4 Abrasive 5 Workpiece T Metal lump protrusion L axis

Claims (12)

  A method of grinding, lapping, and polishing a workpiece using the same grindstone, wherein the grindstone has a superabrasive lump having a Vickers hardness of 2000 or more, a metal lump having a Vickers hardness of 20 to 300, and a Vickers hardness of A 300-2000 matrix, and after grinding using the grindstone, when performing lapping / polishing, the abrasive has a Vickers hardness of 300-2000, and the abrasive has a particle size exceeding the above Lapping and polishing are performed by supplying a slurry containing an abrasive 5 to 100 times the protruding amount T from the metal lump or matrix of the abrasive lump between the workpiece and the grindstone. , Grinding / lapping / polishing method.   The grinding / lapping / polishing method according to claim 1, wherein the superabrasive lump and the metal lump are columnar having an axis L in a depth direction of a surface to be ground, lapped, and polished.   The grinding / lapping / polishing method according to claim 1, wherein a part or the whole of the superabrasive grain lump is contained in the metal lump.   The grinding / lapping / polishing method according to claim 1, wherein a cross-sectional shape of the superabrasive lump or metal lump is rectangular or wedge-shaped. The cross-sectional area of the metal lump includes 2 mm 2 to ²⁰ cm ² when the matrix is included or the entire surface of the grindstone other than the super-abrasive lump when there is no matrix, and the cross-sectional area of the super-abrasive lump is 0.01 mm ^{2 to 20} cm ² . The grinding / lapping / polishing method according to any one of claims 1 to 4, wherein the grinding / lapping / polishing method is characterized.   The grinding / lapping / polishing method according to any one of claims 1 to 5, wherein the grindstone is attached to both surfaces of the workpiece to perform double-side processing.   An apparatus for grinding, lapping, and polishing a workpiece using the same grindstone, the grindstone having a superabrasive lump having a Vickers hardness of 2000 or more, a metal lump having a Vickers hardness of 20 to 300, and a Vickers hardness of A 300-2000 matrix, and after grinding using the grindstone, when performing lapping / polishing, the abrasive has a Vickers hardness of 300-2000, and the abrasive has a particle size exceeding the above Lapping and polishing are performed by supplying a slurry containing an abrasive 5 to 100 times the protruding amount T from the metal lump or matrix of the abrasive lump between the workpiece and the grindstone. , Grinding / lapping / polishing equipment.   The grinding / lapping / polishing apparatus according to claim 7, wherein the superabrasive lump and the metal lump are columnar having an axis L in a depth direction of a surface to be ground, lapped, and polished.   The grinding / lapping / polishing apparatus according to claim 7, wherein a part or the whole of the superabrasive grain lump is included in the metal lump.   The grinding / lapping / polishing apparatus according to any one of claims 7 to 9, wherein a cross-sectional shape of the superabrasive grain lump or metal lump is rectangular or wedge-shaped. The cross-sectional area of the metal lump includes 2 mm 2 to ²⁰ cm ² when the matrix is included or the entire surface of the grindstone other than the super-abrasive lump when there is no matrix, and the cross-sectional area of the super-abrasive lump is 0.01 mm ^{2 to 20} cm ² . The grinding / lapping / polishing apparatus according to claim 7, wherein the grinding / lapping / polishing apparatus is characterized. The grinding / lapping / polishing apparatus according to any one of claims 7 to 11, wherein the grindstone is mounted on both surfaces of the workpiece to perform double-side processing.

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