JP6168558B2 - High frequency module, electronic device, and method for manufacturing high frequency module - Google Patents

Description

  The present invention relates to a high-frequency module and an electronic device using the high-frequency module, and more particularly to a high-frequency module including an antenna, an electronic device, and a method for manufacturing the high-frequency module.

  Conventionally, electronic devices such as mobile phones, smartphones, personal computers, game machines, digital cameras, etc. that have a function of receiving digital broadcasts and a function of communicating wirelessly with other electronic devices have been widely used. .

  High-frequency modules such as broadcast receiving modules and communication modules used in these electronic devices are required to be downsized and thinned, and are required to be densely mounted in the casing of the electronic device.

  In the module device 800 described in Patent Document 1 (conventional example 1), as shown in FIG. 7, a module case electronic component, an element, a chip component, or the like is covered on a main surface of a wiring board 802 by a shield case 803. A wireless communication module unit is mounted. In addition, a technique is disclosed in which a chip antenna 805 is mounted on a main surface of a wiring board 802 to configure an antenna integrated module device 800.

  Further, the communication device 900 described in Patent Document 2 (conventional example 2) includes a printed circuit board 901, a printed circuit board 902, and a connection portion 903 using a flexible substrate, as shown in FIG. . As shown in FIG. 8B, a technique is disclosed in which a wiring group 905 and an antenna wiring 904 are arranged in a connection portion 903 using a flexible substrate.

JP 2002-353841 A JP 2012-239030 A

  However, the above-described conventional example 1 has a problem that it is necessary to secure the board space of the module for the area where the antenna element is mounted.

  In Conventional Example 2, it is not necessary to secure a board space for mounting the antenna element. However, since the antenna wiring is arranged side by side with the signal wiring, coupling with the signal wiring occurs and noise from the signal wiring is reduced. There was a problem that there was a risk of receiving.

  The present invention solves the above-described problems, and an object thereof is to provide a high-frequency module including an antenna that can reduce the influence of noise and can be easily mounted on an electronic device. Moreover, it aims at providing the manufacturing method of the electronic device provided with such a module, and a module.

  In order to solve this problem, a high-frequency module of the present invention is provided in a high-frequency circuit unit mounted on a first substrate, a flexible substrate having one end connected to the first substrate, and the flexible substrate, A signal wiring portion having signal wirings having connection terminals at both ends of the flexible substrate, and provided along the side of the flexible substrate, having a connection terminal at one end of the flexible substrate, and the other having a tip portion. A notch for separating a space between the signal wiring portion and the antenna element portion to a tip side of the antenna element and a side of the flexible substrate. A portion is provided.

  According to this, since the antenna element part of the flexible substrate is separated from the signal wiring part by the notch part, it is possible to install the antenna part away from the signal wiring. Can be reduced. In addition, since the signal wiring side and the antenna element side can be bent independently of each other, mounting inside the electronic device is facilitated. Therefore, it is possible to provide a high-frequency module including an antenna that can reduce the influence of noise and can be easily mounted on an electronic device.

  The electronic device of the present invention includes a main board, and the high-frequency module is connected to the main board by the flexible board.

  According to this, it is possible to provide an electronic device including a high-frequency module having an antenna that can reduce the influence of noise and can be easily mounted on the electronic device.

  In addition, the electronic apparatus of the present invention includes a shield member that covers the high-frequency circuit unit, the shield member is provided with a through hole, and the antenna element unit of the flexible substrate is connected to the outside of the shield member from the through hole. It is characterized by being arranged in.

  According to this, since the high-frequency circuit unit is shielded by the shield member, the influence of signals other than the signal received by the antenna element can be reduced.

  In addition, the electronic device of the present invention has an insulating housing that houses the main substrate and the high-frequency module, and the antenna element portion of the flexible substrate is disposed along the inner wall of the housing. It is characterized by.

  According to this, since the antenna element portion is disposed along the insulating casing, it can operate without deteriorating the performance of the antenna.

  The method for manufacturing a high-frequency module of the present invention includes a high-frequency circuit unit mounted on a first substrate, a flexible substrate having one end connected to the first substrate, the flexible substrate, and the flexible substrate. A signal wiring part having signal wirings having connection terminals at both ends thereof, and an antenna element provided along the side of the flexible board, having a connection terminal at one end of the flexible board, and the other having a tip part And a notch for separating a space between the signal wiring portion and the antenna element portion and a side of the flexible substrate on the tip end side of the antenna element. In the method of manufacturing a high-frequency module, the antenna element section cuts the tip of the antenna element to a predetermined length.

  According to this, the length of the antenna element is cut to a predetermined length determined in advance according to the mounting state of the electronic device to which the high-frequency module is applied, so that it is optimal for the electronic device to be easily mounted. It is possible to supply a high-frequency module including an antenna having a long length. For this reason, since a flexible substrate can be shared by a plurality of products, it becomes possible to reduce costs and inventory.

  As described above, according to the present invention, it is possible to provide a high-frequency module including an antenna that can reduce the influence of noise and can be easily mounted on an electronic device. Moreover, the electronic device provided with such a high frequency module and the manufacturing method of a high frequency module can be provided.

1 is a schematic external view of a high-frequency module according to a first embodiment of the present invention. It is a figure explaining the flexible substrate of a high frequency module. It is a disassembled perspective view explaining the structure of the electronic device which concerns on 2nd Embodiment of this invention. It is a figure explaining the connection state of the main board | substrate of the electronic device which concerns on 2nd Embodiment, and a high frequency module. It is a figure explaining the structure of the electronic device which concerns on 2nd Embodiment of this invention. It is explanatory drawing of the manufacturing method of the high frequency module which concerns on 3rd Embodiment of this invention. It is explanatory drawing of the module apparatus of the prior art example 1. FIG. It is explanatory drawing of the communication apparatus of the prior art example 2.

[First Embodiment]
Hereinafter, the high-frequency module 100 according to the first embodiment of the present invention will be described.

  First, the configuration of the high-frequency module 100 according to the first embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 is a schematic external view showing the configuration of the high-frequency module 100. 1 (a) is a perspective view, FIG. 1 (b) is a plan view seen from the Z1 side shown in FIG. 1 (a), and FIG. 1 (c) is from the Y1 side shown in FIG. 1 (a). FIG. FIG. 2 is a diagram for explaining the flexible substrate 3 of the high-frequency module 100. 2A is a diagram of the flexible substrate 3 viewed from the top surface (Z1 side shown in FIG. 1), and FIG. 2B is a diagram viewed from the bottom surface (Z2 side shown in FIG. 1). FIG. 2C is an enlarged view of the connecting portion 3a shown in FIG. 2B, and FIG. 2D is an enlarged view of the connecting portion 3b shown in FIG.

  As shown in FIG. 1A, the high-frequency module 100 includes a first substrate 1, a high-frequency circuit unit 2, and a flexible substrate 3.

  The first substrate 1 is formed in a rectangular shape with a wiring pattern (not shown) formed of a metal foil such as copper on a base material made of a resin material such as glass epoxy.

  The high-frequency circuit unit 2 is configured by mounting a semiconductor component such as an IC or a transistor (not shown), a chip component, or the like on a wiring pattern formed on the first substrate 1, and as shown in FIG. It is mounted on the upper surface (Z1 shown in FIG. 1) side of the first substrate 1.

  The flexible substrate 3 is formed of a signal wiring 4 and an antenna element 5 as shown in FIGS. 2A and 2B by a metal foil such as copper on a base material made of a flexible insulating material such as polyimide. Has been. The flexible substrate 3 is provided with a connecting portion 3a at one end and a connecting portion 3b at the other end.

  As shown in FIGS. 2A and 2B, a plurality of signal wires 4 are arranged so as to connect both ends of the flexible substrate 3 to form a signal wire portion 3c. As shown in FIGS. 2C and 2D, connection terminals 4 a are provided at both ends of the signal wiring 4, and are arranged at connection portions (3 a, 3 b) at both ends of the flexible substrate 3, respectively.

  As shown in FIGS. 2A and 2B, the antenna element 5 is provided along the side of the flexible substrate 3 (Y1 side shown in FIG. 2) to form an antenna element portion 3d. One of the antenna elements 5 has a connection terminal 5a at the connection portion 3a at one end of the flexible substrate 3 as shown in FIG. 2 (c), and the other as shown in FIGS. 2 (a) and 2 (b). It has the front-end | tip part 5b.

  As shown in FIGS. 1 and 2, the flexible substrate 3 is cut so as to separate the space between the signal wiring portion 3 c and the antenna element portion 3 d to the tip portion 5 b side of the antenna element 5 to the side of the flexible substrate 3. A notch 3e is provided. Therefore, the signal wiring portion 3c and the antenna element portion 3d are integrated on the connection portion 3a side provided at one end of the flexible substrate 3, and are separated by the notch portion 3e on the tip portion 5b side of the antenna element 5. ing.

  As shown in FIG. 1, a connection portion 3 a provided at one end of the flexible substrate 3 is connected to the first substrate 1, and the high-frequency circuit portion 2, a plurality of signal wires 4 provided on the flexible substrate 3, and an antenna. The elements 5 are connected by a wiring pattern provided on the first substrate 1.

  Hereinafter, the effect by having set it as this embodiment is demonstrated.

  The high-frequency module 100 according to the present embodiment is provided on the flexible substrate 3, the high-frequency circuit unit 2 mounted on the first substrate 1, the flexible substrate 3 having one end connected to the first substrate 1, and the flexible substrate 3. Are provided along the side of the flexible substrate 3, the signal wiring 4 having the connection terminals 4 a at both ends thereof, the connection substrate 5 a at one end of the flexible substrate 3, and the other at the tip portion An antenna element portion 3d having an antenna element 5 having 5b, and between the signal wiring portion 3c and the antenna element portion 3d to the tip portion 5b side of the antenna element 5 to the side of the flexible substrate 3. The structure is provided with a notch 3e for separating the.

  Thereby, since the antenna element part 3d of the flexible substrate 3 is separated from the signal wiring part 3c by the notch part 3e, the antenna element 5 can be installed separately from the signal wiring 4, and the signal wiring 4 Can reduce the influence of noise. Further, since the signal wiring 4 side and the antenna element 5 side can be bent independently, the mounting inside the electronic apparatus becomes easy. Therefore, it is possible to provide a high-frequency module including an antenna that can reduce the influence of noise and can be easily mounted on an electronic device.

[Second Embodiment]
Hereinafter, an electronic apparatus 200 according to the second embodiment will be described with reference to FIGS. FIG. 3 is an exploded perspective view illustrating the configuration of the electronic device 200 according to the second embodiment of the present invention. FIG. 4 is a diagram illustrating a connection state between the main board 10 and the high-frequency module 100 of the electronic device 200 according to the second embodiment. FIG. 4A illustrates the main board 10 on the top surface (Z1 shown in FIG. 5) side. FIG. 4B is a perspective view of the main substrate 10 viewed from the lower surface (Z2 shown in FIG. 5). FIG. 5 is a diagram illustrating the structure of the electronic device 200 according to the second embodiment. FIG. 5A is a schematic external view of the electronic device 200 according to the second embodiment, and FIG. It is a cross-sectional schematic diagram which shows the AA cross section shown to 5 (a). In addition, about the same structure as 1st Embodiment, the same code | symbol is attached | subjected and detailed description is abbreviate | omitted.

  As shown in FIG. 3, the electronic device 200 includes the high-frequency module 100 according to the first embodiment, the main board 10, the shield member 11, and the housing 12.

  The main substrate 10 has a wiring pattern (not shown) formed of a metal foil such as copper on a base material of a resin material such as glass epoxy, and is formed in a rectangular shape as shown in FIG. Note that the shape of the main substrate 10 is simply shown for explanation, and the shape changes depending on various electronic devices.

  The high frequency module 100 is mounted on the upper surface (Z1 shown in FIG. 3) side of the main substrate 10, and the lower surface (Z1 shown in FIG. 3) side of the main substrate 10 is as shown in FIG. 4 (b). A connection connector 13 is arranged.

  The signal wiring portion 3c provided on the flexible substrate 3 of the high-frequency module 100 is installed in an appropriately bent state as shown in FIGS. 4 and 5A, 5B, and the connection portion 3b is connected to the connection connector 13. Has been.

  The main board 10 is mounted or connected with a control unit including an MPU (Micro Processing Unit) (not shown), an operation unit for operation by a user, and devices and elements for inputting and outputting images, sounds, and the like. Thus, the function of the electronic device 200 is realized.

  As shown in FIG. 3, the shield member 11 is a side wall provided along the outer periphery of the rectangular top plate portion 11a and the top plate portion 11a by bending or drawing a thin metal plate such as copper or brass. It is formed in a shape having a portion 11b. A slit-shaped through hole 11 c is provided on one surface of the side wall 11 b of the shield member 11.

  As shown in FIG. 5B, the shield member 11 is installed on the upper surface (Z1 shown in FIG. 5) side of the main board 10 so as to cover the high-frequency circuit section 2 mounted on the first board 1 of the high-frequency module 100. Has been. The shield member 11 is fixed to the main board 10 and connected to the ground of the main board 10 by a wiring pattern (not shown) provided on the main board 10.

  The antenna element portion 3d and the signal wiring portion 3c of the flexible substrate 3 are inserted into the through hole 11c provided in the shield member 11 from the inside of the shield member 11, and the antenna element portion 3d is located outside the shield member 11. Has been placed.

  The storage portion 12a and the lid portion 12b are made of an insulating material such as a synthetic resin. By combining the storage portion 12a and the lid portion 12b as shown in FIG. 3, a rectangular parallelepiped shape is obtained as shown in FIG. A housing 12 having an outer shape is configured. As shown in FIG. 5B, a space in which the main board 10 and the high frequency module 100 can be stored is formed inside the storage portion 12a.

  In a state where the main board 10 and the high-frequency module 100 are housed in the housing 12, the antenna element portion 3 d provided on the flexible board 3 of the housing portion 12 a constituting the housing 12 is provided as shown in FIG. It is arranged along the inner wall.

  Hereinafter, the effect by having set it as this embodiment is demonstrated.

  The electronic device 200 according to the present embodiment includes the main substrate 10, and the high-frequency module 100 illustrated in the first embodiment is configured to be connected to the main substrate 10 by the flexible substrate 3.

  Thereby, the influence of noise can be reduced, and an electronic device including a high-frequency module having an antenna that can be easily mounted on the electronic device can be provided.

  In addition, the electronic device 200 of the present embodiment includes a shield member 11 that covers the high-frequency circuit unit 2. The shield member 11 is provided with a through hole 11 c, and the antenna element unit 3 d of the flexible substrate 3 is shielded from the through hole 11 c. It was set as the structure arrange | positioned on the outer side of the member 11. FIG.

  Thereby, since the high frequency circuit part 2 is shielded by the shield member 11, the influence of signals other than the signal received by the antenna element 5 such as noise generated by the high frequency circuit part 2 can be reduced.

  In addition, the electronic device 200 of the present embodiment includes an insulating housing 12 that houses the main substrate 10 and the high-frequency module 100, and the antenna element portion 3 d of the flexible substrate 3 extends along the inner wall of the housing 12. To be arranged.

  Thereby, since the antenna element part 3d is arrange | positioned along the insulating housing | casing 12, it can operate | move, without the performance of an antenna falling.

[Third Embodiment]
A method for manufacturing the high-frequency module according to the third embodiment will be described below. 6A and 6B are views for explaining a method of manufacturing a high-frequency module according to the third embodiment of the present invention. FIG. 6A is a manufacturing process diagram of the high-frequency module, and FIG. 6B is a trimming step S3. It is a figure explaining. In addition, about the same structure as 1st Embodiment, the same code | symbol is attached | subjected and detailed description is abbreviate | omitted.

  As shown in FIG. 6A, the method for manufacturing a high-frequency module according to the present embodiment includes a component mounting step S1, a flexible substrate connecting step S2, a trimming step S3, and an operation confirmation step S4.

  In a component mounting step S1 as the first step, components constituting the high-frequency circuit unit 2 such as a semiconductor component such as an IC and a transistor (not shown) and a chip component are mounted on the first substrate 1. By this process, the high-frequency circuit unit 2 is mounted on the first substrate 1.

  In the flexible substrate connecting step S2 as the next step, the connecting portion 3a provided at one end of the flexible substrate 3 is connected to the first substrate 1. The flexible substrate 3 to be connected is provided with an antenna element 5 slightly longer than the length corresponding to ¼ of the wavelength (λ) of the frequency transmitted or received by the high-frequency circuit unit 2 along the side of the flexible substrate 3. It has been.

  In the next trimming step S3, the tip 5b of the antenna element 5 of the antenna element 3d arranged on the flexible substrate 3 has a predetermined length L as shown in FIG. 6B. Cut so that. It should be noted that the predetermined length L can be determined by determining an optimum length through experiments so that the operation of the antenna is optimized in a state where the high-frequency module 100 is mounted on the electronic device in advance. Further, the predetermined length L may be obtained by simulation or the like from the structure of the electronic device on which the high frequency module 100 is mounted. Since the optimal length of the antenna element 5 may change depending on the type and structure of the electronic device on which the module is mounted, a predetermined length L that is optimal for each model of the applied electronic device is obtained. It is desirable to apply to the trimming step S3.

  In the operation confirmation step S4 which is the last step, the performance and operation of the high frequency module 100 are confirmed, and the high frequency module 100 is completed.

  Hereinafter, the effect by having set it as this embodiment is demonstrated.

  In the method for manufacturing a high-frequency module according to the present embodiment, a high-frequency circuit unit 2 mounted on the first substrate 1, a flexible substrate 3 having one end connected to the first substrate 1, and a flexible substrate 3 are provided. A signal wiring portion 3c in which signal wirings 4 having connection terminals 4a are arranged at both ends of the substrate 3 and a side of the flexible substrate 3 are provided, and a connection terminal 5a is provided at one end of the flexible substrate 3, and the other is An antenna element portion 3d having an antenna element 5 having a tip portion 5b, and between the signal wiring portion 3c and the antenna element portion 3d to the tip portion 5b side of the antenna element 5 to the side of the flexible substrate 3. A method of manufacturing a high-frequency module provided with a notch 3e for separating the antenna element 3d, wherein the antenna element 3d cuts the tip 5b of the antenna element 5 into a predetermined length. Was to so that.

  Accordingly, the length of the antenna element 5 is cut to a predetermined length L determined in advance according to the mounting state of the electronic device to which the high-frequency module 100 is applied, thereby supporting an electronic device that is easily mounted. It is possible to supply a high-frequency module equipped with an antenna having an optimal length. For this reason, since the flexible substrate 3 can be shared by a plurality of products, it is possible to reduce costs and inventory.

  As described above, the high-frequency module according to the first embodiment of the present invention, the electronic device according to the second embodiment, and the method for manufacturing the high-frequency module according to the third embodiment have been specifically described. The present invention is not limited to the embodiments, and various modifications can be made without departing from the scope of the invention. For example, the present invention can be modified as follows, and these embodiments also belong to the technical scope of the present invention.

  (1) In the first embodiment, the first substrate 1 and the flexible substrate 3 are described as examples that are individually independent members. However, the first substrate 1 and the flexible substrate 3 can be used. You may comprise integrally with the board | substrate which has flexibility. When comprised in this way, the flexible substrate connection process S2 in 3rd Embodiment can be skipped.

  (2) In the first embodiment, the connection between the first substrate 1 and the flexible substrate 3 is not specifically described. However, the connection may be performed by soldering, or the connection may be performed using a connector or the like. Anyway.

  (3) In the third embodiment, the example in which the component is directly mounted on the first substrate 1 in the component mounting step S1 has been described. However, the component is attached to the collective substrate in which a plurality of the first substrates 1 are connected. You may comprise so that it may divide | segment into the separate 1st board | substrate 1 after mounting.

  (4) In the third embodiment, the example in which the trimming step S3 is after the flexible substrate connecting step S2 has been described. However, the trimming step S3 is performed first, and the antenna element 5 is cut to a predetermined length in advance. Then, it may be connected to the first substrate 1.

DESCRIPTION OF SYMBOLS 1 1st board | substrate 2 High frequency circuit part 3 Flexible board 3a Connection part 3b Connection part 3c Signal wiring part 3d Antenna element part 3e Notch part 4 Signal wiring 4a Connection terminal 5 Antenna element 5a Connection terminal 5b Tip part 10 Main board 11 Shield Member 11a Top plate part 11b Side wall part 11c Through-hole 12 Housing 12a Storage part 12b Cover part 13 Connection connector 100 High-frequency module 200 Electronic device

Claims (5)

A high-frequency circuit unit mounted on the first substrate;
A flexible substrate having one end connected to the first substrate;
A signal wiring portion provided on the flexible substrate, in which signal wirings having connection electrodes on both ends of the flexible substrate are disposed;
An antenna element portion provided along the side of the flexible substrate, having a connection electrode at one end of the flexible substrate, and an antenna element having a tip portion on the other end;
A high-frequency module, wherein a notch for separating a space between the signal wiring portion and the antenna element portion to a side of the flexible substrate is provided on a tip portion side of the antenna element.   An electronic apparatus comprising a main substrate, wherein the high-frequency module according to claim 1 is connected to the main substrate by the flexible substrate. A shield member covering the high-frequency circuit unit;
The shield member is provided with a through hole,
The electronic apparatus according to claim 2, wherein the antenna element portion of the flexible substrate is disposed outside the shield member from the through hole. An insulating housing that houses the main substrate and the high-frequency module;
The electronic device according to claim 2, wherein the antenna element portion of the flexible substrate is disposed along an inner wall of the casing. A high-frequency circuit unit mounted on the first substrate;
A flexible substrate having one end connected to the first substrate;
A signal wiring portion provided on the flexible substrate, in which signal wirings having connection terminals at both ends of the flexible substrate are disposed;
An antenna element portion provided along a side of the flexible substrate, having a connection terminal at one end of the flexible substrate, and an antenna element having a tip portion at the other end;
A method of manufacturing a high-frequency module in which a notch for separating a space between the signal wiring portion and the antenna element portion to a side edge of the flexible substrate is provided on a tip portion side of the antenna element,
The method of manufacturing a high-frequency module, wherein the antenna element section cuts the tip of the antenna element into a predetermined length.