JP6085179B2 - Separation apparatus and separation method - Google Patents

Description

  The present invention relates to a separation apparatus or a separation method for separating an adherend or adherend from an integrated body in which the adherend and the adherend are bonded via an adhesive whose adhesive strength is reduced by cooling or heating.

  In a semiconductor wafer processing process or a flexible printed circuit board manufacturing process, a temperature sensitive adhesive such as a cooling release type or a heat release type is used as an adhesive for bonding a reinforcing material or a support material to an adherend. It has been proposed (see Patent Document 1). In addition, as a device for separating an integrated object bonded by such an adhesive, the adhesive strength of the adhesive is reduced by heating in a state where the integrated object is lifted, so that a reinforcing material or a support is supported from the adherend. A method and an apparatus for separating materials have been proposed (see Patent Document 2).

JP 2007-2199 A JP 2005-116679 A

  However, when the adhesive strength of the adhesive is reduced by cooling or heating as in the prior art, the adhesive and the adherend are surface bonded due to the wettability of the adhesive, and the adhesive does not become sticky. For this reason, the conventional separation method and separation apparatus have a disadvantage in that a vibration separation phenomenon (so-called zipping) is generated in which separation is performed with a burr and noise when separating the adherend and the adherend.

  In such vibration isolation phenomenon, separation in a minute range of several micrometers to several millimeters progresses at a moment when the separation force applied to the region separating the adherend and adherend exceeds a predetermined value. After that, the separation is temporarily stopped, and at the moment when the separation force exceeds the predetermined value again, the phenomenon that the separation of the next minute range proceeds at a stretch is repeated to cause the separation to proceed intermittently. It is believed that there is. When such a vibration separation phenomenon occurs, the bonded body or adherend may be damaged by the propagated vibration, which is a problem.

  An object of the present invention is to separate an adhesive body or an adherend from an integrated body in which the adherend and the adhesive body are bonded via an adhesive whose adhesive strength is reduced by cooling or heating while suppressing vibration isolation. It is to provide a possible separation device and separation method.

In order to achieve such an object, the separation device according to the present invention is:
In a separation apparatus for separating the adherend or adherend from an integrated body in which the adherend and the adherend are bonded via an adhesive whose adhesive strength is reduced by cooling or heating,
Holding means for holding each of the adhesive body and the adherend in the integrated body in a state where the adhesive force of the adhesive is reduced by cooling or heating;
Moving means for relatively moving and separating the adherend and the adherend;
For the adhesive immediately before separation, which is the region immediately before the separation edge where the bonded body or adherend separates from the integrated body, heating is applied to the adhesive whose adhesive strength is reduced by cooling, and the adhesive strength is decreased by heating. And a peeling pretreatment means for cooling the adhesive.

  In addition, for example, the separation device according to the present invention may include an adhesive strength reducing unit that reduces the adhesive strength of the adhesive by cooling or heating.

  In addition, for example, the separation device according to the present invention may include a pressing force applying unit capable of applying a pressing force in a direction in which the adhesive body and the adherend approach each other in the region immediately before the separation.

  In addition, for example, the pre-peeling processing unit may include a gas blowing unit that blows hot air or cold air on the region immediately before separation.

  For example, the peeling pretreatment unit may be provided inside the pressing force applying unit.

Moreover, the separation method according to the present invention includes:
A separation method for separating the adherend or adherend from an integrated body in which the adherend and the adherend are bonded via an adhesive whose adhesive strength is reduced by cooling or heating,
Holding each of the adhesive body and the adherend in the integrated body in a state where the adhesive force of the adhesive is reduced by cooling or heating; and
Separating the bonded body and the adherend by relatively moving; and
For the adhesive immediately before separation, which is the region immediately before the separation edge where the bonded body or adherend separates from the integrated body, heating is applied to the adhesive whose adhesive strength is reduced by cooling, and the adhesive strength is decreased by heating. And a step of cooling the adhesive to be performed.

  According to the present invention, since the adhesive in the region immediately before separation becomes sticky by applying reverse energy in the direction in which the adhesive force is reduced by the pre-peeling treatment means, separation in a minute range proceeds at once. The adhesive or adherend can be separated from the integrated body in which the adherend and the adherend are bonded via an adhesive whose adhesion is reduced by cooling or heating, while suppressing the vibration separation phenomenon. it can.

In addition, when the pressing force applying means is provided, the occurrence of the vibration separation phenomenon can be more effectively prevented by applying a force in the direction opposite to the separation direction. In this case, the peeling pretreatment means may be provided inside the pressing force applying means, and thereby it is possible to more effectively apply a force for suppressing the vibration separation phenomenon to the region immediately before separation.
In addition, when the peeling pretreatment means has a gas blowing means, it is possible to prevent the occurrence of vibration separation phenomenon while avoiding applying excessive pressing force etc. to the adherend or adhesive body, and in combination with the pressing means. Even when used, the region immediately before separation can be appropriately cooled or heated.

The side view of the separation apparatus which concerns on embodiment. The side view of the separation apparatus which concerns on a 1st modification. The partial side view of the separation apparatus which concerns on a 2nd modification. The partial side view of the separation apparatus which concerns on a 3rd modification.

Hereinafter, a separation apparatus 10 according to an embodiment of the present invention will be described with reference to FIG.
Note that the X axis, Y axis, and Z axis in this specification are orthogonal to each other, the X axis and Y axis are axes in a horizontal plane, and the Z axis is an axis that is orthogonal to the horizontal plane. Furthermore, in the present embodiment, when viewed from the near side of FIG. 1 parallel to the Y axis, when indicating the direction, “up” is the arrow direction of the Z axis, “down” is the opposite direction, “ “Left” is the X-axis arrow direction, “Right” is the opposite direction, “Front” is the front direction orthogonal to the Y-axis paper surface, and “Back” is the opposite direction.

  The separating apparatus 10 separates the base material sheet BS from the integrated body WK in which the wafer WF as the adherend and the base material sheet BS as the adhesive body are bonded via the adhesive AD whose adhesive strength is reduced by cooling. And a holding means 20 for holding the base sheet BS and the wafer WF in the integrated object WK in a state where the adhesive force of the adhesive AD is reduced by cooling, and the base sheet BS and the wafer WF are relatively The moving means 30 that moves and separates, and the pre-separation processing means 40 that heats the area PE immediately before separation, which is the area immediately before the separation edge DP where the base sheet BS separates from the integrated object WK.

The holding unit 20 includes an adhesive body holding unit 21 that holds the base sheet BS and an adherend holding unit 22 that holds the wafer WF.
The adhesive body holding means 21 includes a pinch roller 26 that sandwiches the peeling sheet PT between a support shaft 23 that supports the peeling sheet PT and a driving roller 25 that is driven by a rotation motor 24 as a driving device. A cutter blade, a laser cutter, or the like that is supported by each of the pressing member 28 supported by the output shaft 27A of the linear motion motor 27 as the device and each slider 29B of the linear motor 29A as the drive device and can cut the peeling sheet PT. And cutting means 29C.
The upper surface of the adherend holding unit 22 is a mounting surface 22A, and a decompression unit (not shown) such as a decompression pump or a vacuum ejector is connected to a suction hole (not shown) formed on the placement surface 22A.

  The moving means 30 is constituted by a linear motor 31, and the slider 31A of the linear motor 31 supports the adherend holding means 22 from below.

  The pre-peeling treatment means 40 includes a heating means 41 such as a coil heater or a heat exchanger, and a gas blowing means 42 such as a fan or a pressure pump that blows heated gas.

Next, the operation of the separation device 10 will be described.
First, the peeling sheet PT is supported by the support shaft 23, and the leading end portion of the peeling sheet PT is sandwiched between the driving roller 25 and the pinch roller 26. Next, when an operation start signal is input via an operation panel (not shown) or the like, the adhesive body holding means 21 drives the rotation motor 24, and the peeling sheet PT has a predetermined length as shown by the solid line in FIG. The peeling sheet PT is fed out so as to hang down. Then, the transfer means (not shown) is driven, and the unitary object WK in a state where the adhesive force of the adhesive AD is reduced by cooling so that the wafer WF side contacts the mounting surface 22A is waited at a position indicated by a solid line in FIG. When placed on the adherend holding means 22, the adherend holding means 22 drives a decompression means (not shown) to suck and hold the integrated object WK.

  Thereafter, the moving means 30 drives the linear motor 31 and moves the adherend holding means 22 until the left end portion of the base sheet BS is located directly below the left end portion of the pressing member 28 as indicated by the two-dot chain line on the right side. Let As a result, the leading end portion of the peeling sheet PT that hangs down from between the drive roller 25 and the pinch roller 26 is disposed on the upper surface (on the base material sheet BS) of the integrated object WK. Next, the adhesive body holding means 21 drives the linear motion motor 27, lowers the pressing member 28, and presses the peeling sheet PT against the base sheet BS with the pressing member 28. Adhere to BS.

  Next, the moving means 30 drives the linear motor 31 to move the adherend holding means 22 in the left direction, thereby moving the wafer WF and the base sheet BS relative to each other so that the base sheet BS is removed from the monolith WK. To separate. At this time, the adhesive body holding means 21 drives the rotation motor 24, and as shown by the two-dot chain line in FIG. 1, the peeling sheet PT is placed so that the area PE immediately before separation is located immediately below the pre-peeling processing means 40. In addition to winding, the pre-peeling processing means 40 drives the heating means 41 and the gas blowing means 42 to heat the region PE immediately before separation. In this way, since the adhesive AD in the region PE immediately before separation becomes sticky by intentionally applying reverse energy in the direction in which the adhesive force decreases, the separation in a minute range does not proceed at once, and the vibration separation phenomenon And the base material sheet BS can be smoothly separated from the monolith WK. At this time, the heating temperature of the adhesive AD can be set by an operator as an empirical value within a range in which the vibration isolation phenomenon can be suppressed.

  When the base material sheet BS is completely separated from the integrated object WK, the adhesive body holding means 21 drives the linear motor 29A, and the cutting means 29C cuts the peeling sheet PT, while the moving means 30 is shown in FIG. The adherend holding means 22 is moved to the position indicated by the solid line, and the driving of the linear motor 31 is stopped. Thereafter, a conveying means (not shown) is driven to convey the integrated object WK from which the base sheet BS has been separated to the next step or the like, and thereafter the same operation as described above is repeated.

  According to the embodiment as described above, the separation device 10 can smoothly separate the base sheet BS from the integrated object WK while suppressing the vibration separation phenomenon. Moreover, since the vibration propagated at the time of separation is suppressed, it is possible to prevent the wafer WF and the base sheet BS from being damaged.

The embodiment of the present invention has been described above, but the present invention is not limited to the above-described embodiment, and can of course be implemented in various modes without departing from the gist of the present invention. is there.
For example, it may be a separation device that separates the base material sheet BS from the integrated product WK in which the wafer WF and the base material sheet BS are bonded via an adhesive AD whose adhesive strength is reduced by heating. Holds the base sheet BS and the wafer WF in the integrated body WK in a state where the adhesive force of the adhesive AD is reduced by heating, and the moving means 30 moves the base sheet BS and the wafer WF relative to each other to separate them. In some cases, the pre-peeling treatment means 40 may cool the region PE immediately before separation. In this case, a cooling means such as a Peltier element or a heat exchanger may be provided instead of the heating means 41 of the pre-peeling processing means 40 of the above embodiment.

  Further, the pre-peeling treatment means 40 may include both the heating means 41 and the cooling means, or the adhesive AD is an adhesive whose adhesive force is reduced by cooling, or an adhesive whose adhesive force is reduced by heating. It is also possible to employ a determination means for determining whether or not the pre-peeling processing means 40 automatically uses the heating means 41 and the cooling means based on the determination result of the determination means.

  Furthermore, for example, as shown in FIG. 1, the adherend holding means 22 may be provided with an adhesive force reducing means 50 for reducing the adhesive force of the adhesive AD by heating or cooling. Examples of such adhesive strength reducing means 50 include heating means such as a coil heater or a heat exchanger, and cooling means such as a Peltier element or a heat exchanger. The position where the adhesive strength reducing means is provided is not limited to the inside of the adherend holding means 22, but the outside of the adherend holding means 22, for example, the entire space in which the separation device 10 shown in FIG. It may be comprised by the air conditioner etc. which adjust temperature, and if it can heat or cool the adhesive agent AD in the integrated object WK, it will not specifically limit. Also, the timing at which the adhesive strength reducing means starts heating or cooling the adhesive AD is not limited before and after the integrated object WK is held by the adherend holding means 22.

  Further, the moving means 30 may stop the rotation motor 24 and move only the adherend holding means 22, or stop the adherend holding means 22 and stop the rotation motor 24. It is good also as a structure which drives only this and isolate | separates the base sheet BS from the integral thing WK. In these cases, since the position of the region PE immediately before separation moves, the pre-peeling processing means 40 may be configured to move in accordance with the movement of the region PE immediately before separation by the driving device.

  Furthermore, as shown in FIG. 2, a pressing force applying means such as a pressing roller 80 or a pressing plate (not shown) that can apply a pressing force in the direction in which the base sheet BS and the wafer WF approach each other in the region PE immediately before separation is employed. The pressing force applying means may be configured to be movable in the X-axis direction and the Y-axis direction by a driving device (not shown). By providing such pressing force application means, it is possible to effectively prevent the occurrence of the vibration separation phenomenon. In addition, you may provide the peeling pre-processing means in the inside of the press roller 80 or the holding plate which is not shown in figure.

  Further, as shown in FIG. 2, the holding means is a chuck cylinder 72, and a linear motion motor (not shown) as a driving device capable of moving the chuck cylinder 72 in the X and Z directions and rotating in the XZ plane. The chuck 73 of the chuck cylinder 72 may hold the base sheet BS by sandwiching the end of the base sheet BS.

  Further, as shown in FIG. 3, a plurality of pre-peeling processing means 44 including heating means such as a coil heater or a heat exchanger, and cooling means such as a Peltier element or a heat exchanger are provided inside the adherend holding means 22. It is possible to control only the pre-peeling processing means 44 adjacent to the immediately preceding separation region PE according to the progress of the peeling by the control means capable of individually controlling each of the pre-peeling processing means 44. .

  In addition, as shown in FIG. 4, a Peltier element, a heat exchanger, or the like that lowers the adhesive force of the adhesive AD with respect to the immediately-separated area AE that is an area immediately after the base sheet BS is separated from the integrated object WK. You may provide the 2nd adhesive force reduction means 90 which consists of 2 cooling means, 2nd heating means, such as a coil heater or a heat exchanger. The second adhesive force lowering means 90 is provided along with the pre-peeling processing means, and the adhesive AD whose adhesive strength has been increased by the pre-peeling processing means is reduced by reducing the adhesive force of the adhesive AD located in the region AE immediately after separation. It is possible to prevent the separation from being hindered excessively.

  Alternatively, the wafer WF may be separated from the integrated object WK. In this case, the integrated object WK of the above embodiment is mounted on the adherend holding means 22 so that the base sheet BS side contacts the mounting surface 22A. The peeling sheet PT may be bonded to the wafer WF. Note that when the adherend or adhesive is separated from the integral body, the adhesive AD may be attached to either the adhesive or the adherend, or may be attached separately to both.

  In addition, the material, type, shape, and the like of the adhesive AD, the adhesive body, the adherend, and the release sheet PT in the present invention are not particularly limited. For example, the adhesive AD and the release sheet PT are not limited to adhesive forms such as pressure-sensitive adhesiveness and heat-sensitive adhesiveness, and when the heat-sensitive adhesive AD and the release sheet PT are employed. An appropriate heating means for heating the adhesive AD and the peeling sheet may be provided. Further, the release sheet PT may be, for example, a single layer having only an adhesive layer, an intermediate layer between the base sheet and the adhesive layer, or a cover layer on the upper surface of the base sheet. 3 or more layers may be used. The adhesive AD may be a so-called double-sided adhesive sheet, and the double-sided adhesive sheet has a single-layer or multi-layer intermediate layer, or has a single-layer or multi-layer without an intermediate layer. It may be. Examples of the adhesive and adherend include, for example, foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, information recording substrates such as circuit boards and optical disks, glass plates, steel plates, ceramics, wood plates, or resins. Arbitrary forms of members, articles, etc., such as plates, can also be targeted.

  Furthermore, the drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 10 ... Separation apparatus 20 ... Holding means 30 ... Moving means 40 ... Pre-peeling treatment means 50 ... Adhesive force reduction means AD ... Adhesive WF ... Wafer (adhered body)
BS ... Base sheet BS (adhesive)
WK ... Integral DP ... Separation edge PE ... Area just before separation

Claims (2)

In a separation apparatus for separating the adherend or adherend from an integrated body in which the adherend and the adherend are bonded via an adhesive whose adhesive strength is reduced by cooling or heating,
Holding means for holding each of the adhesive body and the adherend in the integrated body in a state where the adhesive force of the adhesive is reduced by cooling or heating;
Moving means for relatively moving and separating the adherend and the adherend;
For the adhesive immediately before separation, which is the region immediately before the separation edge where the bonded body or adherend separates from the integrated body, heating is applied to the adhesive whose adhesive strength is reduced by cooling, and the adhesive strength is decreased by heating. For the adhesive to be removed, a pre-peeling treatment means for cooling,
And an adhesive strength reducing means for reducing the adhesive strength of the adhesive by cooling or heating . A separation method for separating the adherend or adherend from an integrated body in which the adherend and the adherend are bonded via an adhesive whose adhesive strength is reduced by cooling or heating,
Holding each of the adhesive body and the adherend in the integrated body in a state where the adhesive force of the adhesive is reduced by cooling or heating; and
Separating the bonded body and the adherend by relatively moving; and
For the adhesive immediately before separation, which is the region immediately before the separation edge where the bonded body or adherend separates from the integrated body, heating is applied to the adhesive whose adhesive strength is reduced by cooling, and the adhesive strength is decreased by heating. And a step of cooling the adhesive to be performed.

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