JP6083128B2 - Method for manufacturing a three-dimensional electronic circuit on an image substrate - Google Patents

Description

  The present invention relates to a method for manufacturing a three-dimensional electronic circuit and a three-dimensional electronic circuit. More specifically, the present invention relates to a structure in which a sheet-like thin structure including an electronic circuit expands and functions three-dimensionally and a manufacturing method thereof.

  As a display medium that can replace paper, which is a paper medium, electronic paper, electronic books, multimedia sheets, catalogs that emit light and sound, and sheet-like thin structures with electronic circuits such as books are widely known. ing.

  On the other hand, sensor sheets having a pop-up mechanism that forms a three-dimensional structure by opening from a flat folded state, greeting cards, pop-up picture books, sign graphics, etc. (hereinafter collectively referred to as pop-up cards) are widely known. The pop-up card is printed and designed according to the application.

  For example, Patent Literature 1 discloses a card-like light emitting display device that is such a pop-up card and is a greeting card incorporating a light emitting system.

  When manufacturing a three-dimensional structure three-dimensional electronic circuit (sheet-like thin structure) having a pop-up mechanism as in Patent Document 1, the wiring of the wiring on the substrate, the mounting of components such as a light emitting element, and the cutting of the substrate, Bending is a problem.

  As the above related technology, for example, in Patent Document 2, a flexible circuit board portion having an insulating resin layer and a wiring layer is laminated so as to cover one surface of a plastically deformable plate-like substrate, A bendable deformable wiring board is disclosed in which electrode parts for mounting electronic components are provided at a plurality of locations separated from each other, and it is disclosed that a three-dimensional shape can be formed by bending.

  In Patent Document 3, a metal plate is cut into a developed shape of a box by etching, a shallow groove for bending is formed, an insulating layer and a conductive foil are formed thereon, and the conductive foil is etched to obtain a predetermined shape. A box-shaped structure (folded three-dimensional circuit device) is disclosed in which a circuit pattern is formed and an electronic component is reflow-soldered thereon to form an electronic component mounting flat plate, which is bent along a groove.

  However, in manufacturing a three-dimensional electronic circuit having a three-dimensional structure having a pop-up mechanism, a manual manufacturing process such as winding of lead wires on a substrate and mounting of components such as light emitting elements is indispensable to obtain a desired pop-up structure. There was a high cost factor. The techniques of Patent Documents 2 and 3 have not been able to solve this problem.

  In particular, it is difficult to adopt a manufacturing process that uses plates and molds for products that are produced in a variety of small quantities and various quantities (on-demand products), because it takes time and costs. There is a problem.

  Therefore, the present invention provides a three-dimensional electronic circuit that can manufacture a three-dimensional electronic circuit having a pop-up structure capable of displacing an electronic component mounted at a desired position on a substrate from the plane of the substrate on-demand at a low cost. It is an object to provide a circuit manufacturing method and a three-dimensional electronic circuit.

In order to achieve this object, a method for manufacturing a three-dimensional electronic circuit on an image substrate according to the present invention is a method for manufacturing a three-dimensional electronic circuit on an image substrate, which includes an image forming step of forming an image on a substrate, After the step, a conductive pattern forming step for patterning a conductive material on the image forming surface on the substrate or the back surface of the image forming surface, a component mounting step for mounting an electronic component on the substrate, and a substrate for cutting the substrate A processing step and a substrate deformation step of bending the substrate including a notch position by the substrate processing step so as to displace at least one of the electronic components from a plane of the substrate to an arbitrary position in the vertical direction of the substrate. And so on.

  According to the present invention, a three-dimensional electronic circuit having a pop-up structure can be manufactured on demand at a low cost.

It is a flowchart which shows an example of the manufacturing method of a three-dimensional electronic circuit. It is a schematic diagram explaining a conductor pattern formation process. It is a schematic diagram explaining a board | substrate processing process. It is a flowchart which shows the other example of the manufacturing method of a three-dimensional electronic circuit. It is sectional drawing of a three-dimensional electronic circuit. It is a schematic diagram explaining the manufacturing method of the pop-up card | curd which is one Embodiment of a three-dimensional electronic circuit. It is a schematic diagram explaining the other example of a pop-up card. It is a schematic diagram explaining the manufacturing method of a pop-up card. It is a schematic diagram explaining the other example of a pop-up card. It is a schematic diagram explaining the manufacturing method of the pop-up card | curd which has a some light emitting element. It is a flowchart which shows an example of the determination procedure of a board | substrate cut line and a board bending line. It is sectional drawing of the three-dimensional electronic circuit which provided the through hole. It is a schematic diagram explaining folding of a pop-up card. It is a schematic diagram explaining the pop-up card which mounted the speaker. It is a schematic diagram of the three-dimensional electronic circuit provided with the RFID tag function.

  Hereinafter, a configuration according to the present invention will be described in detail based on the embodiment shown in FIGS.

(Method for manufacturing a three-dimensional electronic circuit)
With reference to the flowchart shown in FIG. 1, the manufacturing method of the three-dimensional electronic circuit which concerns on this embodiment is demonstrated.

[Conductor pattern forming process]
First, a conductive material pattern (conductor pattern 4) is formed on the substrate 1 (S101). As this conductor pattern forming step, various known or novel forming methods can be used. For example, a printing method using a plate such as screen printing or flexographic printing, or on-demand printing that does not use a plate such as an inkjet or a dispenser can be used. Note that electrophotography may be used as a printing method.

  As the ink, for example, a conductive paste or conductive ink using metal nanoparticles can be used. As the material, gold, silver, copper, nickel, carbon, or the like can be used.

  Further, as the substrate 1, for example, a material that can be deformed and processed flexibly (plastically bendable) can be used, such as PET (polyethylene terephthalate), polyimide, and paper. In order to absorb and fix the ink on the substrate surface, it is also preferable to provide a receiving layer in advance. Moreover, it is good also as passing through a drying process and a baking process after conductor pattern formation.

  An example of conductor pattern formation in the conductor pattern formation step (S101) will be described with reference to FIG. In the example shown in FIG. 2, nozzle discharge of a conductive material is used as the conductor pattern forming means.

  That is, conductive ink is ejected from the nozzle 2 to the substrate 1, and the droplet 3 is landed on the substrate 1. At this time, the conductor pattern 4 can be formed at an arbitrary position on the substrate 1 by synchronously controlling the discharge timing from the nozzle 2 and the nozzle position or the substrate position. 2 shows an example in which the number of nozzles is one, it is needless to say that the number may be two or more.

[Component mounting process]
Next, components are arranged and mounted on the conductor pattern 4 formed on the substrate 1 (S102). The form of the mounting component (electronic component) is a lead component, a surface mounting component (such as a light emitting element (LED)), a bare chip, or the like, and the component terminal and the wiring portion are bonded and connected by a conductive material. The component may be formed by applying a functional material.

[Substrate processing process]
Next, the substrate is cut according to a preset score line (S103). The cut line is a desired straight line or curve, and cuts and cuts the outer shape. The external shape of the board | substrate 1 should just be a rectangle or arbitrary shapes. Moreover, the process of making the notch | incision from an outer periphery toward the inside of the board | substrate 1, and the process of giving a bending line to the board | substrate 1 are included. Moreover, the thing including the drilling process which cuts out the inside of the board | substrate 1 may be included. As a processing method of the substrate 1, a method using a die such as die cutting or an on-demand processing method such as laser processing is used.

  An example of the substrate processing step (S103) will be described with reference to FIG. In the substrate processing step, for example, the substrate 1 is cut by irradiating the substrate 1 with laser light 6 from the laser irradiation unit 5. A laser beam 6 is irradiated onto the substrate 1 from the laser irradiation unit 5, and a substrate cut line (cut portion) 7 is formed in the substrate 1 by the energy.

  At this time, the substrate cutting line 7 can be formed at an arbitrary position on the substrate 1 by synchronously controlling the laser irradiation timing and the position of the laser irradiation unit or the substrate position. The substrate processing means is not limited to a laser, and for example, the substrate 1 may be placed on a stage and the cutter may be moved in the XY directions.

  Further, the fold line is not necessarily formed, but when formed, for example, a shallow groove can be formed in the substrate 1 in accordance with the folding direction (mountain fold, valley fold). Further, both mountain folding and valley folding may be possible. The terms mountain fold and valley fold are used on the basis of the surface on which the conductor pattern 4 of the substrate 1 is formed. This fold line is constituted by a straight line or a curved line.

[Substrate deformation process]
Next, a force is applied to the substrate 1 according to a preset bending line on the processed substrate 1 (S104). A three-dimensional electronic circuit is manufactured by the above process. In addition, the board | substrate 1 maintains the state in the bent state, The plastic state which can cancel | fold a folded state again or be folded up in the folded state, and can be made into the original plane state. It can be deformed.

  The above steps can be automatically performed by a machine without manual intervention. About a board | substrate deformation | transformation process, you may make it bend without contact by Lorentz force etc. using the force which arises with an electric current, for example.

[Image forming process]
It is also preferable to include an image forming step (S201) for printing a pattern, a picture or the like on the surface of the substrate 1. A method of manufacturing the three-dimensional electronic circuit in this case will be described with reference to the flowchart shown in FIG. As the image forming means, various conventional image forming methods such as an electrophotographic method, an ink jet method, a flexographic printing method, and a screen printing method can be used.

  The image forming surface may be the same surface as the conductor pattern forming surface and the component mounting surface on the substrate 1, may be the opposite surface, or may be both surfaces. It is also preferable to manufacture the three-dimensional electronic circuit by performing the above-described processing (S202 to S205) using the substrate 1 on which the image is formed in advance. S202 to S205 are the same steps as S101 to S104.

(Configuration of 3D electronic circuit)
Next, a three-dimensional electronic circuit (sheet-like thin structure) manufactured by the method for manufacturing a three-dimensional electronic circuit including the above steps will be described.

  FIG. 5 shows a cross-sectional view of the three-dimensional electronic circuit. In the example of FIG. 5, the image 8 is printed by the image forming step (S <b> 201) on one surface of the substrate 1 (the surface on which the conductor pattern is not formed), and the conductor pattern forming step is formed on the opposite surface of the substrate 1. The wiring 9 is formed by (S101, S202) and the component mounting process (S102, S203), and the mounting component 10 is mounted.

  With reference to FIGS. 6A to 6E, a card (hereinafter referred to as a pop-up card) having a pop-up mechanism in which a light-emitting element and its drive module as one embodiment of a three-dimensional electronic circuit are arranged will be described. This pop-up card is a pop-up card including a substrate 1 on which a conductive material (wiring 9) is patterned, and an electronic component (light emitting element 11) mounted on the substrate 1. A predetermined cut portion (substrate cut line 7) is provided, and at least one of the electronic components including the cut portion is bent in a state of being displaced in the vertical direction of the substrate 1 from the plane of the substrate 1.

  First, an image 8 is formed on one side (back side in the drawing) of the flat substrate 1 as shown in FIG. 6A by an image forming step (S201). Next, as shown in FIG. 6B, the wiring 9 which is a conductor pattern is formed on the surface (the surface in the drawing) opposite to the image forming surface of the substrate 1 by the conductor pattern forming step (S101, S202). To do.

  Next, as shown in FIG. 6C, the light emitting element 11 and the drive module 12 of the light emitting element 11 are mounted on the substrate 1 by a component mounting process (S102, S203).

  Further, as shown in FIG. 6D, a substrate cut line 7 (shown by a solid line) and a substrate folding line 13 (shown by a broken line) are formed by a substrate processing step (S103, S204), and a substrate deformation step (S104, S204). The substrate 1 is bent (valley folded) as shown in FIG. 6E according to the substrate folding line 13 in S205, whereby the light-emitting element 11 can be popped up from the substrate plane.

  As shown in FIGS. 7A and 7B, a plurality of substrate folding lines 13a to 13c may be provided, and a plurality of substrate folding lines 13a to 13c may be bent and folded to form a plurality of folds.

  Next, another embodiment of the pop-up card will be described with reference to FIGS. First, as shown in FIG. 8B, the wiring 9 is formed on the flat substrate 1 as shown in FIG. 8A by the conductor pattern forming step (S101, S202). Of course, the image may be printed by the image forming step (S201).

  Next, as shown in FIG. 8C, the light emitting element 11 and the drive module 12 of the light emitting element 11 are mounted on the substrate 1 by a component mounting process (S102, S203).

Further, as shown in FIG. 8D, a substrate cut line 7 (shown by a solid line) and a substrate folding line 13 (shown by a broken line) are formed by a substrate processing step (S103, S204), and a substrate deformation step (S104, S204). accordance substrate fold line 13 by S205), bending processed (valley fold) in the substrate bending lines 13b ₁ a substrate 1 as shown in FIG. 8 (E), further, to draw part of the light emitting element 11, a substrate folding line The light emitting element 11 can be in a pop-up state by drawing 13b ₂ (folding the substrate folding line 13b ₂ and folding the substrate folding lines 13a and 13c).

Further, as a modified example of FIG. 8, as shown in FIG. 9 (A), without forming the board bending lines 13b _2, the substrate 1 of the portion mounting the light emitting element 11 may be deformed so as to curve. Further, as shown in FIG. 9B, the substrate folding lines 13b ₁ and ₂ are not formed, and the substrate 1 where the light emitting element 11 is mounted and the other portion of the substrate 1 are curved. You may make it deform | transform. In this case, the substrate 1 can be maintained in a bent state.

  Next, a three-dimensional electronic circuit provided with a plurality of mounting components will be described. FIG. 10A shows a pop-up card in which two light emitting elements 11a and 11b are driven and controlled independently by respective wirings 9a and 9b.

  By determining the substrate cut line 7 and the substrate folding line 13 so that the position (end) of each light emitting element 11 becomes a desired position, the light emitting element 11 is positioned at the corner of the three-dimensional structure. it can. An example of this procedure will be described.

  FIG. 10B shows a coordinate system when the substrate 1 is bent at an angle of 90 degrees (valley fold) by the substrate fold line 13d, and the X and Y coordinates of the light emitting element 11a are (x1, y1). (X1> 0, y1> 0).

  Here, as shown in FIG. 10C, substrate fold lines 13e and 13f (valley folds) are provided at positions x1 and y1 away from the substrate fold line 13d, respectively, and further, the substrate fold line is 1 minute from the substrate fold line 13e. A position close to 13d may be a substrate folding line 13g (mountain fold). The board cut line 7 may be provided with a suitable width for wiring and mounting parts between the board folding lines 13e and 13f. Similarly, the substrate bending lines 13h to 13j and the substrate cut line 7 are provided for the light emitting element 11b.

  By providing the substrate cut line 7 and the substrate bending lines 13e to j at such positions, when the substrate 1 is bent 90 degrees by the substrate cutting line 13d, the light emitting elements 11a and 11b are respectively placed at desired positions (x1, y1) and (x2, y2). Note that the angle at which the substrate 1 is bent may be an angle other than 90 degrees. In this case, the formation position of the folding line may be changed in consideration of the bending angle. As described above, a plurality of light emitting elements and wirings can be similarly arranged.

  The procedure for determining the substrate cut line 7 and the substrate folding line 13 will be described with reference to the flowchart shown in FIG.

  First, the substrate folding line 13d is set (S301), and the folding angle (90 degrees) at the substrate folding line 13d is set (S302). Next, desired arrangement positions X and Y of the respective light emitting elements 11 are set (S303), and the substrate cut lines 7 and the substrate folding lines 13e to 13j for three-dimensionally arranging the respective light emitting elements 11 are calculated. (S304 to S305).

  It is also preferable to form a through hole in a substrate portion corresponding to the light emitting element 11. For example, as shown in the cross-sectional view of the three-dimensional electronic circuit in FIG. 12, the image 8 is printed on one side of the substrate 1 by the image forming step (S201), and the back side of the image surface is formed by the conductor pattern forming step (S101, S202). After forming the through hole 14 in the substrate processing process (S103, S204) for the three-dimensional electronic circuit having the wiring 9 formed on the side, the light emitting element 11 may be mounted in the component mounting process (S102, S203). By setting the light emitting direction of the light emitting element 11 as the direction in which the through hole 14 is formed, a three-dimensional electronic circuit (pop-up card) in which a part of the image 8 emits light can be obtained.

  As shown in FIG. 13A, the pop-up card described above is folded from a three-dimensional structure in which the light emitting element 11 is displaced from the plane of the substrate 1, as shown in FIG. 13B. A flat structure can be used, and conversely, a three-dimensional structure can be obtained by opening a state folded in a substantially plane. In this way, it is easy to carry, transport and carry by allowing it to be freely folded. Since it can be sealed in an envelope, it can be easily mailed.

  In the above embodiment, the light emitting element 11 has been described as an example of the mounting component 10. However, for example, a speaker 15 may be used as the mounting component 10. For example, as shown in FIG. 14, a speaker 15 is connected to the drive module 16 via a wiring 9 on the substrate 1. The speaker 15 and its drive module 16 may be any known or new technology, and are not particularly limited. For example, when a pop-up card is spread, a melody data storage means, data reproduction so that a melody starts to sound. Any means having various means such as means, D / A conversion means, audio signal amplifying means, and power supply means may be used.

  By providing the speaker 15, it can be set as the pop-up card which has an audio | voice output function. Further, it is preferable to use the light emitting element 11 together on the same substrate 1.

  A three-dimensional electronic circuit having an RFID (Radio Frequency IDentification) tag function is also preferable. For example, as shown in FIG. 15, an RFID IC chip 18 and an RFID antenna 17 made of a conductor pattern may be connected to the substrate 1. According to this configuration, for example, antenna characteristics such as directivity and gain change by expanding a three-dimensional electronic circuit, and therefore, it is possible to perform inventory management of card products using this. Moreover, it is also preferable to use together with the light emitting element 11 and the speaker 15 described above.

  According to the three-dimensional electronic circuit manufacturing method and the three-dimensional electronic circuit described above, it is difficult to automate lead wires, light-emitting element mounting, etc. due to conductor pattern formation on the board, component mounting, and board processing / deformation processes. The difficulty peculiar to manufacture of a three-dimensional electronic circuit can be eliminated, and the three-dimensional electronic circuit which arrange | positions a desired electronic component in a desired space position can be manufactured at low cost.

  In addition, since a three-dimensional electronic circuit can be formed on demand by forming an electronic circuit using printing that does not use a plate, variable-variety multi-product production at a low cost is possible. Furthermore, since a three-dimensional electronic circuit can be formed on demand by a substrate processing method that does not use a mold, variable-variety multi-product production at a low cost is possible.

  Further, by forming an image on the substrate, the design portion is a printed image and the light emitting portion is configured by LED mounting or the like, so that a pop-up card capable of a wide range of expression by a printed image and an electronic circuit can be obtained.

  The above-described embodiment is a preferred embodiment of the present invention, but is not limited thereto, and various modifications can be made without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 1 Substrate 2 Nozzle 3 Droplet 4 Conductor pattern 5 Laser irradiation part 6 Laser light 7 Substrate cut line 8 Image 9 Wiring 10 Mounting component 11 Light emitting element 12 Drive module 13 Board bending line 14 Through hole 15 Speaker 16 Drive module 17 RFID antenna 18 IC chip for RFID

Japanese Patent Laid-Open No. 2001-188489 JP 2011-249535 A JP 2001-156407 A

Claims (3)

A method of manufacturing a three-dimensional electronic circuit on an image substrate having an image forming step of forming an image on a substrate,
After the image forming step,
A conductor pattern forming step of patterning a conductive material on the image forming surface on the substrate or the back surface of the image forming surface;
A component mounting process for mounting electronic components on the substrate;
A substrate processing step of cutting the substrate;
A substrate deformation step of bending the substrate including a cut position by the substrate processing step so as to displace at least one of the electronic components from a plane of the substrate to an arbitrary position in the vertical direction of the substrate;
A method of manufacturing a three-dimensional electronic circuit on an image substrate, comprising:   2. The method for manufacturing a three-dimensional electronic circuit on an image substrate according to claim 1, wherein the conductor pattern forming step includes a step of discharging a conductive ink from a nozzle to form a conductor pattern.   The method for manufacturing a three-dimensional electronic circuit on an image substrate according to claim 1, wherein the substrate processing step includes a step of cutting the substrate by irradiating the substrate with a laser.