JP6038702B2 - Air conditioning system - Google Patents

Description

  The present invention relates to an air conditioning system in a space where information processing equipment such as a data center generates a large amount of heat.

In recent years, information processing equipment such as servers, routers, gateways, and network devices that are peripheral equipment of servers, for example, server rooms in data centers installed in rack-like containers, or advanced communication equipment are also rack-like. In a communication electronic equipment installation room installed in a container, or a computer room equipped with a high-performance supercomputer capable of high-speed and high-speed computation, information processing is progressing due to remarkable progress in the integration of arithmetic circuits in electronic information processing equipment. The heat generation of the devices also increases, and further, the integration of information processing devices has progressed due to the downsizing of information processing devices, and the heat generation load per indoor flat area is increasing.
In order to maintain the normal operating environment of these information processing devices, the room is always cooled.

  As described above, arithmetic circuits of electronic information processing devices that have been increasingly integrated, such as a central processing unit: an MPU chip having a CPU function, require a large amount of power for calculation and therefore generate a great deal of heat. Since it is necessary to maintain a constant temperature environment in order to realize the calculation, heat generation must be quickly removed from the periphery of the calculation circuit. Even if the MPU chip has an air cooling mechanism, heat tends to be accumulated in the housing of the electronic information processing apparatus that holds the substrate on which the MPU chip is mounted. For this reason, electronic information processing devices usually include an air cooling fan.

  When these information processing devices inhale high-temperature air, for example, when the temperature is likely to deviate from the temperature environment of the MPU chip, the emergency avoidance of the device to prevent hardware breakdown such as a short circuit accident due to heat of the fine CPU circuit There is a case where a heat rise is avoided by stopping the system. Even if hardware destruction is avoided, the system operation stop causes an error in the arithmetic processing, and the information processing business that makes money through the arithmetic processing and communication causes a great loss. Troubles such as system shutdown must be avoided.

  Even if air is cooled by an air conditioner and air is blown indoors due to an increase in heat generation and integration density, the cooling air in the information processing device is bad and the cold air cannot be supplied to the device, and the CPU Due to the emergency avoidance system stop for temperature protection, there is a frequent problem that information processing devices mounted on the rack are brought down one after another, and the supply of cool air to the place to be cooled indoors is an issue. In addition, for example, in the business of a data center that rents rooms with server racks installed, the rentable ratio of buildings excluding machine rooms, which increases the proportion of buildings where information processing equipment can be installed, is improved. In order to increase the size, there is also a demand for reducing the machine room with a minimum capacity of the air conditioner, without installing an air conditioner with a large air volume unnecessarily.

  In general, as in conventional computer room air conditioning, cool air is introduced into the room through the floor outlet through the double floor as the supply air cooled by the air conditioner, and the exhaust heat from the indoor information processing equipment is cooled. An air conditioning system is employed in which the air is cooled by air circulation and is cooled by air circulation that returns the warmed return air to the air conditioner again through the ceiling through the ceiling. This air conditioning system uses the underfloor space, which is essential for installing cables required for transmitting and receiving signals and power between information processing devices, supplies cold and heavy air from below, and heats the lightened air to the upper ceiling. The air conditioning system makes sense in an era when the degree of integration of information processing equipment is low.

In particular, recent information processing equipment has a small cooling fan itself, and there is equipment in which the direction of air cooling is determined. In the case of a room that has such an information processing device, includes an information processing device arranged in a plurality of stages in a rack shape with the orientation of the information processing devices aligned, and blows out from under the double floor, The “cold aisle / hot aisle system”, in which the rear surfaces face each other, for example, cold air blown out from under the double floor, is sucked in from the front of the information processing device and discharged as hot air on the rear surface becomes the mainstream of the air conditioning system It has been adopted.
In the case of a double-floor blowout computer room, racks equipped with information processing equipment can be broadly divided into those that supply air from the front and exhaust the back and top, and those that supply air from the bottom and back and There are two types of exhaust on the top surface. The former is the mainstream in racks equipped with information processing equipment whose degree of integration has increased.

An example thereof will be described based on the description in Patent Document 1. FIG. 11 shows an air conditioning system for a data center based on the description in Patent Document 1.
In the data center 1, a plurality of racks 11 each accommodating information processing equipment 12 such as a server, a router, and a network device are arranged in the server management room 2 so that the respective intake surfaces face each other. The server management room 2 is composed of a double floor 3 where the floor side supplies cold air from the underfloor space 5 through a perforated panel 4 provided in the vicinity of the rack 11, and the ceiling side ceilings the exhaust heat in the server management room 2. A double ceiling 6 is formed in the space 8 to be discharged through a vent 7 with illumination.

The underfloor space 5 and the ceiling space 8 are connected to an air conditioner 10 disposed in a machine room 9 adjacent to the server management room 2.
The rack 11 is configured so that the internal information processing device 12 has cooling fans individually, sucks in cool air supplied from the front panel 11a through the perforated panel 4 into the server management room 2, and discharges high-temperature exhaust gas from the back surface 11b. It is configured. An aisle cap (shielding plate) 13 is provided on the ceiling surface of the facing rack 11. As a result, the cold aisle (the space in the server management room 2 where the air conditioner 10 sends out the cool air sucked by the information processing device 12) A is placed on the exhaust surface side of the rack 11 on the intake surface side. The hot aisles (spaces in the server management room 2 where only the heat exhausted from the information processing device 12 is collected) B are formed.

  In the air conditioning system configured as described above, for example, 19 ° C. cold air generated by the air conditioner 10 is placed in the entire server management room 2 in which the rows of racks 11 containing the information processing devices 12 are arranged side by side. The cold aisle A is formed in the space where the front surface 11a of the rack 11 is in contact, and the cool air is sucked into the interior from the front surface 11a of the rack 11 by the cooling fan. The exhaust heat is discharged into the server management room 2 from the back surface 11b of the rack 11, and the exhaust heat is discharged from the hot aisle B on the back surface 11b side of the rack 11 into the ceiling space 8 through the vent hole 7, By returning the return air of 27 ° C. to the air conditioner 10, the air is circulated to keep the cold aisle A in the server management room 2 at a temperature at which the information processing device 12 is sufficiently cooled. There.

In the air conditioning system for a data center shown in FIG. 11, the cold air isle A is formed by providing an aisle cap (shielding plate) 13 on the ceiling surface of the plurality of racks 11 facing each other and providing an aisle cap (shielding plate) 13 on the ceiling surface. Since Aisle A is an independent area isolated in the server management room 2, it is possible to prevent the exhaust that has passed through the rack 11 from flowing around the intake port of the rack 11 again, and only the cold air from the air conditioner 10 is contained in the rack 11. Through.
Therefore, a part of the exhaust from the information processing device 12 such as a high-density (high load) server distributed in the server management room 2 may enter the suction surface of the other information processing device 12 to increase the suction temperature. There is no need to supply a larger amount of cold air from the air conditioner 10 to alleviate the rise.

  However, since the air conditioning system for the data center shown in FIG. 11 employs an underfloor air supply method, the perforated panels 4 are provided in a distributed manner in the server management room 2 in a plan view. Even at the perforated panel installation site or through the underfloor chamber where there is a lot of air leakage, the blown wind speed at the perforated panel 4 in the central part at a distance from the machine room 9 of the server management room 2 is always secured at a surface speed of about 1 m / sec. It is necessary to reduce the total supply amount from the air conditioner 10 to the server management room 2 according to load fluctuations, etc., to reduce the information processing equipment 12 due to insufficient air supply in the central part of the server management room 2 It was not possible from the aspect of securing the indoor air supply air flow distribution for the purpose of avoiding the possibility of causing it.

  In addition, the floor of the cold aisle A is increased against the increase in heat generation of 4 kw to 10 kw per rack, which is caused by the improvement of the integration degree of the information processing equipment 12 and the mounting integration degree of the information processing equipment 12 to the rack 11. Even if the number of the perforated panels 4 is increased, the temperature difference between the supply air and the return air must be increased with the air flow rate of 1 m / sec. In particular, this is disadvantageous for removing heat generated by the information processing apparatus 12 located above the rack.

  Moreover, in the underfloor air supply method, it is ideal if cold air can be distributed according to the heat generation amount and required air volume of each device, but the actual situation is that the hole according to the floor blowing resistance due to the distance from the machine room etc. By installing the perforated panel 4, the distribution of the air supply air volume in the room plane must be the desired distribution, and the installation layout of the perforated panel 4, that is, the double floor grating layout, the indoor rack 11 side There is no way to avoid an imbalance with the heat generation distribution, which causes heat accumulation in the indoor space and wraparound of high-temperature exhaust. In addition, the amount of air blown from the grating (perforated panel 4) is not determined only by the opening ratio of the grating, but the pressure inside the double floor is related. The number of the power / communication cables laid here, the opening area of the entire room, the opening distribution, and the like. Since such complex elements are intertwined to determine the amount of blown air, a high level of technology is required for the design.

Therefore, an air conditioning system that supplies cold air from an air conditioner on the floor of a data center without providing an underfloor space for supplying conditioned air in a double floor has been proposed (for example, Patent Documents 2, 3, and 4). 4, 5).
For example, in Patent Document 2, in Example 8, the data center includes a server management room in which a large number of server racks are accommodated and a plurality of air conditioners are disposed, and the exhaust side of the server racks face each other. An area filled with exhaust air (hot aisle) is formed, and the hot aisle is surrounded by a wall formed continuously from the ceiling, part of the wall is formed by the rack body and door, and directly into the exhaust plenum behind the ceiling A technique is disclosed in which the exhaust plenum is in direct communication with the air intake of the air conditioner, and all the passages in the server management room are filled with cold air from the air conditioner.

In the air conditioning system of Patent Document 2, each region is partitioned so as to clearly zone the high temperature air region (hot aisle) due to exhaust heat and the low temperature air region (cold aisle) blown from the air conditioner. Therefore, the temperature of the cold aisle is uniform because it does not release any hot air to the cold aisle. It's easy and doesn't get too cold or hot.
The exhaust from the rack body surely passes through the hot aisle and is returned to the air conditioner, so that the exhaust does not enter the rack body and be sucked again from the intake port.
In addition, since the cold aisle serves as a traffic area for managers and others, the temperature setting of the area filled with the cold air from the air conditioner can be set to room temperature (about 25 ° C), and the temperature setting of the hot aisle can be set in the rack. It is possible to set the temperature (for example, 35 ° C.) slightly lower (in consideration of safety) than the upper limit temperature (for example, 40 ° C.) of the environmental conditions of the ICT apparatus. Therefore, since it can drive | operate in the state where the return air temperature to an air conditioner is high, the operating efficiency of an air conditioner can be improved.

In the embodiment, in each embodiment, in each set of rack groups, air-conditioned air (cold air) supplied from the cooling unit mainly exists in the space in contact with the air supply surface of the rack (cold aisle). In the space in contact with the exhaust surface, the server room is partitioned so that the exhaust heat air exhausted from each rack is mainly present (hot aisle). In the server room, the machine room with the cooling unit is placed through the side wall surface. The server room is provided with a plurality of air outlets for blowing air-conditioned air into the server room.
According to Patent Document 3, since the air conditioning mechanism employs a structure that directly supplies the conditioned air to the space in contact with the air supply surface of the rack, the opening from the air conditioner to the underfloor space and the underfloor as in the conventional structure There is no pressure loss at the floor opening from the space to the air-conditioned room. Thereby, there is little fan power for supplying conditioned air, and the power of the air conditioning mechanism required for supplying conditioned air to the air conditioned room can be reduced.

  In Patent Literature 4, as in Patent Literature 3, in each set of rack groups, conditioned air (cold air) supplied from the cooling unit mainly exists in the space in contact with the air supply surface of the rack (cold aisle), In the space in contact with the exhaust surface of the rack, the server room is partitioned so that the waste heat air exhausted from each rack is mainly present (hot aisle). A plurality of air outlets for blowing conditioned air into the server room are provided on the side wall surface of the server room. Furthermore, the upper part of the rack is partitioned by a shielding plate provided with a fan unit, and waste heat air discharged from the rack is quickly conveyed to the return air chamber through the suction port by the fan unit.

According to patent document 4, while having the same effect as patent document 3, waste heat air can be efficiently discharged | emitted from an air-conditioning object room by a ventilation part.
As described above, in the air conditioning systems of Patent Literatures 2 to 4, for example, as in the underfloor air supply method described in Patent Literature 1, data is provided without providing an underfloor space for supplying conditioned air in a double floor. Since an air conditioning system that supplies cold air from an air conditioner on the floor of the center can be proposed, there is an advantage that the number of construction steps required for installing the air conditioning system can be reduced.

Japanese Patent No. 3833515 JP 2009-140421 A JP 2011-196656 A JP 2011-220665 A

  However, in the air conditioning systems of Patent Documents 2 to 4, a hot aisle is set locally in the data center, and the remaining cold area is set as a work area and a passing area for a person such as an administrator. In the server management room, old and new information processing devices are usually stacked in racks with different degrees of integration, and the amount of heat generated differs from rack to rack. The emergency avoidance set temperature for temperature protection is almost the same, and the air conditioning return air temperature with a safety margin up to the set temperature is set by the air conditioning system, so the air supply temperature of the air conditioner is the rack that generates the maximum heat. Is the supply air temperature obtained by subtracting the temperature difference derived from the cooling fan airflow of the information processing equipment in the return air temperature. That is, in Patent Document 2, the temperature setting of the cold aisle region is set to about 25 ° C., but in recent racks equipped with highly integrated information processing equipment, air is supplied at a lower temperature (for example, 19 ° C.). If such a low temperature supply air is supplied to a large area of the server management room other than the limited hot aisle, the temperature difference from the outside air temperature affects the heat flow, building load, and cold air leakage from the room partition gap As a result, a large amount of air conditioning energy is wasted. In addition, the evaporation temperature of the refrigeration cycle in the heat source of the air conditioning system must be reduced according to the supply air temperature. However, in order to supply a large amount of air supply at a low temperature, the heat source refrigeration cycle also has a constant evaporation temperature. The coefficient of performance of the refrigeration cycle: COP also decreases and the air conditioning energy is wasted.

  As described above, when supplying cold air over a wide range as described in the air conditioning systems of Patent Documents 2 to 4, as described above, even if there are various racks with different heat generation amounts, the information processing device in the rack with the maximum heat generation The supply air temperature obtained by subtracting the temperature difference derived from the cooling fan airflow from the exhaust air temperature, for example, 19 ° C, is supplied, and there is a heat generation fluctuation due to the time fluctuation due to the amount of calculation even with the type of server and even the maximum heat generation rack However, the supply air temperature is required to be constant so as to prevent the deviation of all rack exhaust heat temperatures from the specified temperature.

In addition, the amount of air supply corresponding to the load density is determined by the maximum value required by each server, and is often reviewed each time the server is replaced, or the air supply amount is operated with the designed maximum amount in many cases.
As a result, as shown in FIG. 11 and Patent Document 1, by arranging the racks with the air supply surfaces facing each other and making the narrow space cold aisle, only the rack row with a large amount of heat is returned to the return air temperature and the temperature difference. Supply air with a large temperature and energy-saving operation by precisely controlling the air supply volume and supply air temperature corresponding to the amount of heat generated every hour based on the amount of calculation in the rack or rack row, etc. However, there is a problem that the air conditioning systems of Patent Documents 2 to 4 cannot. In addition, although it seems that control addition is possible in the form of a cold aisle in FIG. 11 and patent document 1, since it is the air supply from a floor, an air supply amount control cannot be performed as mentioned above.

Further, as described in the air conditioning systems of Patent Documents 2 to 4, in the system in which only the hot aisle is enclosed and the high-temperature return air is released to the back of the ceiling, the space under the ceiling other than the return air chamber is the same as the supply air temperature, for example, 19 Filled at ℃. At this time, in the ceiling part, there is a problem that the supply air cools the heat by exchanging heat with the return air from the ceiling and the temperature rises, and the air is supplied to the server and returned via the server.
As a result, there is a problem that energy-saving operation cannot be performed.
Moreover, in the air conditioning systems of Patent Documents 2 to 4, although the traffic area of a person such as an administrator is filled with cold air (for example, 19 ° C.), the temperature is too low to stay in it for a long time, which is not desirable.

  The present invention has been made to solve such conventional problems, and an object thereof is an air conditioning system capable of increasing or decreasing the amount of air supply from an air conditioner in a timely manner in accordance with the operation status of a high-density server. Is to provide.

  The invention according to claim 1 includes a machine room and a data center room with a side wall on the floor of the data center, and a ceiling space that communicates with a return port provided in the upper part of the side wall on the upper surface side of the data center room. In the air conditioning system for returning the exhaust air from the data center room by means of a blower conveying force of a server rack row air conditioner disposed in the machine room from the return air port to the machine room through the ceiling space, The machine room is provided with an air supply section on the side of the side wall surface for horizontally blowing the conditioned air temperature-controlled by the server rack row air conditioner toward the data center room, and the data center room extends along the side wall. Two rows of air supply chambers that communicate with the air supply unit, and that communicate with the air supply chamber through an air supply tunnel formed in its own arrangement and accommodate information processing devices. Each rack, which is an information processing device comprising two rows of racks, is mounted with the air intake side of each information processing device aligned, and a plurality of racks are aligned with the air intake surface. An information processing equipment storage room including a density-coupled server rack row and a return air chamber formed in a space on the exhaust surface side of the high-density coupled server rack row, The high-density connection type in which the ceiling surface is sealed with a shield covering and covering the edge of the upper top plate surface of the front surface of the intake surface arranged opposite to each other in the density connection type server rack row, and located farthest in parallel with the side wall Server rack row end side wall surfaces are sealed with a termination panel, and the return air chamber is configured such that a space on the exhaust surface side of the high-density connection type server rack row is orthogonal to the side wall at a predetermined interval. Outside the return air chamber in the direction A face wall is erected from the floor to the ceiling of the data center room, and the inner wall of the return air chamber is erected to the data center room ceiling on the edge of the upper top panel of the back of the high-density connection type server rack row. The end panel that is continuous with the air supply tunnel portion is erected in parallel along the end side wall surface of each of the two rack rows in the rack row, and the data center room ceiling provided with a return air slit is installed at the top. The exhaust gas discharged from the return air slit is formed by sealing each including the floor and the side wall, and is returned to the machine room from the return air port through the ceiling space. To do.

  The invention according to claim 2 is provided with a machine room and a data center room with a side wall on the floor of the data center, and a ceiling space communicating with a return air port provided in the upper part of the side wall on the upper surface side of the data center room. In the air conditioning system for returning the exhaust air from the data center room by means of a blower conveying force of a server rack row air conditioner disposed in the machine room from the return air port to the machine room through the ceiling space, The machine room is provided with an air supply section on the side of the side wall surface for horizontally blowing the conditioned air temperature-controlled by the server rack row air conditioner toward the data center room, and the data center room extends along the side wall. Two rows of air supply chambers that communicate with the air supply unit, and that communicate with the air supply chamber through an air supply tunnel formed in its own arrangement and accommodate information processing devices. Each rack, which is an information processing device comprising two rows of racks, is mounted with the air intake side of each information processing device aligned, and a plurality of racks are aligned with the air intake surface. An information processing equipment storage room including a density-coupled server rack row and a return air chamber formed in a space on the exhaust surface side of the high-density coupled server rack row, The high-density connection type in which the ceiling surface is sealed with a shield covering and covering the edge of the upper top plate surface of the front surface of the intake surface arranged opposite to each other in the density connection type server rack row, and located farthest in parallel with the side wall A server rack row end side wall surface is formed by sealing with a termination panel having an opening having a pressure adjusting body, and the return air chamber has a space on the exhaust surface side of the high-density connected server rack row at a predetermined interval. On each side wall across In the crossing direction, the outer wall of the return air chamber is erected from the floor to the ceiling of the data center room, and the inner wall of the return air chamber stands up to the data center room ceiling on the edge of the upper top panel of the back of the high-density connected server rack row. The end panel that is continuous with the air supply tunnel portion is erected in parallel along the end side wall surfaces of the two rack rows of the high-density connection type server rack row, and the upper portion is provided with a return air slit. The data center room ceiling is installed and sealed by including the floor and side walls, and the exhaust exhausted from the return air slit passes through the ceiling space from the return air port to the machine room. It is characterized by being returned.

  According to a third aspect of the present invention, the machine room and the data center room are provided on the double floor of the data center with the side wall being separated, and the ceiling communicated with the return air port provided in the upper part of the side wall on the upper surface side of the data center room. A space is provided, and the exhaust air from the data center room is disposed in the machine room from the return air port to the machine room via the ceiling space, and the fan transport force of the room rack air conditioner and the whole room air conditioner In the air-conditioning system for returning air, the machine room includes a first air supply unit located in the upper part of the side wall floor that blows air-conditioned air that has been temperature-controlled by the server rack row air conditioner toward the data center room side; A second air supply unit for blowing out the conditioned air temperature-controlled by the air conditioner for the entire room from the perforated panel provided on the double floor to the data center room side via the underfloor space of the double floor; With the front A data center room is provided along the side wall and communicates with an air supply chamber that communicates with the air supply unit, and communicates with the air supply chamber through an air supply tunnel formed by its own arrangement, and information processing equipment Each information processing device is mounted with the intake surface side aligned for each rack, and the plurality of racks are aligned with the intake surface. An information processing device storage chamber comprising a high-density linked server rack row formed as a rack row and a return air chamber formed in a space on the exhaust surface side of the high-density linked server rack row; The tunnel seals the ceiling surface with a shield that covers the edge of the upper top plate surface of the front surface of the intake surface arranged opposite to each other in the high-density connection type server rack row, and is located farthest in parallel with the side wall. The high-density linked server The return air chamber is formed by sealing the space on the exhaust surface side of the high-density connection type server rack row at a predetermined interval. A return air chamber outer side wall is erected from the floor to the data center room ceiling in a direction perpendicular to the side wall with a space therebetween, and the inner side wall of the return air chamber on the edge of the upper top plate surface of the back of the high-density connection type server rack row Standing up to the ceiling of the data center room, the end panel that is continuous with the air supply tunnel portion is erected in parallel along the end side wall surfaces of the two rack rows of the high-density connection type server rack row, Is formed by installing the ceiling of the data center room provided with a return air slit, and sealing each including the floor and the side wall, and the second air supply part is the side wall of the information processing equipment storage room The conditioned air from the second air supply unit is provided on the double floor on the side away from the air, and flows into the air supply tunnel from the pressure regulator when the pressure in the air supply tunnel is reduced. The exhaust gas discharged from the air slit is returned to the machine room from the return air port through the ceiling space.

  According to a fourth aspect of the present invention, in the air conditioning system according to any one of the first to third aspects, the supply air thermometer for measuring the supply air temperature from the server rack row air conditioner, and the return air chamber A return air thermometer that measures a predetermined return air temperature in the inside, and a control device that controls based on the measurement value of each thermometer, the control device based on the measurement value of the return air thermometer The number of rotations of the fan of the server rack air conditioner is controlled by an inverter, and the supply air temperature of the server rack array air conditioner is adjusted based on the measured value of the supply air thermometer, and the amount of cold water supplied to the heat exchanger is adjusted. It is characterized by controlling by.

  The invention according to claim 5 is the air conditioning system according to claim 1 or 4, wherein the air supply chamber is a substantially rectangular parallelepiped space having substantially the same height as the top plate of the high-density connection type server rack row. A cold air inlet that communicates with the air supply unit, and a tunnel cold air supply port that communicates with the air supply tunnel, and the high-density connected server rack row accommodates the information processing devices, respectively. Two rows of rack rows that are arranged through the air supply tunnel, which is a passage, with each intake surface facing each other, and one end side of which is in contact with the wall surface of the air supply chamber, and the top plate surface of the two rows of rack rows The return air chamber is formed by a shield for sealing each other and the end panel for sealing the other end of the two rack rows, and the return air chamber is exhausted to the back side of the high-density connected server rack row. In order to collect and guide the return air chamber outer side wall from the floor in a direction perpendicular to the side wall at a predetermined interval on the back side of the high-density connected server rack row. Standing up to the ceiling of the center room, the inner wall of the return air chamber standing up to the ceiling of the data center room above the edge of the upper top plate at the back of the high-density connected server rack row, and connecting the high-density Each of the return air chamber outer side walls has a length that extends from the side wall to the vertical end face located farthest from the side wall in parallel with each of the end side wall surfaces of the two rack rows of the type server rack row. A return air chamber end wall surface having a height from the floor to the ceiling of the data center room, and a vertical wall surface on the long side of the air supply chamber parallel to the side wall and the return wall The upper edge of the vertical wall on the long side of the air supply chamber between the connection with the outer wall of the chamber and the vertical wall on the long side of the air supply chamber and the connection with the inner wall of the return air chamber The first start wall is erected from the data center room ceiling to the ceiling of the data center room, the connecting portion between the vertical wall on the long side of the air supply chamber and the outer side wall of the return air chamber, and the vertical on the long side of the air supply chamber A second start wall is erected from the upper edge of the vertical wall on the long side of the air supply chamber to the ceiling of the data center room between the wall and the connecting portion of the inner wall of the return air chamber, An exhaust heat capturing space, which is inside the return air chamber, is formed up to the ceiling of the data center room on the back side of the density coupled server rack row.

  The invention according to claim 6 is the air conditioning system according to any one of claims 2 to 4, wherein the air supply chamber has a substantially rectangular parallelepiped having substantially the same height as the top plate of the high-density connection type server rack row. The high-density connection type server rack row, which includes a cold air inlet that communicates with the air supply unit or the first air supply unit, and a tunnel cold air supply port that communicates with the air supply tunnel. Are arranged via the air supply tunnel, which is a passage, with each of the information processing devices being accommodated and facing each intake surface side, and one row of rack rows abutting against the wall surface of the air supply chamber, , Formed by a shield that seals the top plate surfaces of the two rows of racks and the end panel that seals the other end of the two rows of racks, and the air supply tunnel is connected to the high density connection Type serverer The high-density connection type server rack row which is sealed at the ceiling with the shield covering the edge of the upper top plate surface of the front surface of the intake surface oppositely arranged in a row and is located farthest in parallel with the side wall The end side wall surface is formed by sealing with an end panel having an opening having a pressure adjusting body, and the return air chamber collects exhaust heat exhausted to the back side of the high-density connection type server rack row to collect the ceiling. In order to guide to the space, the outer side wall of the return air chamber stands from the floor to the ceiling of the data center room in a direction perpendicular to the side wall at a predetermined interval on the back side of the high-density connected server rack row. The return air chamber inner side wall is erected up from the edge of the upper top plate surface on the back of the high-density connected server rack row to the data center room ceiling, and the high-density connected server rack row 2 rows of la Parallel to each of the end side wall surfaces of the row, each of the return air chamber outer side walls has a length that extends from the side wall to a vertical end surface that is farthest from the side wall, and a height from the floor to the data center. A return air chamber end wall surface having a height to the ceiling of the room is erected, and is connected to a vertical wall surface on the long side of the supply chamber parallel to the side wall and an outer surface wall of the return air chamber; A first start wall from the upper edge of the vertical wall on the long side of the air supply chamber to the ceiling of the data center room between the vertical wall on the long side of the air chamber and the connecting portion of the inner wall of the return air chamber 47a, and a connection portion between the vertical wall on the long side of the supply chamber and the outer wall of the return air chamber, and the vertical wall on the long side of the supply chamber and the inner wall of the return chamber Communicating A second starting wall is erected from the upper edge of the vertical wall surface on the long side of the air supply chamber to the ceiling of the data center room between the connection portion and the rear side of the high-density connected server rack row. The exhaust heat capturing space inside the return air chamber is formed up to the ceiling of the data center room, and the terminal panel of the air supply tunnel is provided with an opening at a portion facing the air supply chamber, The opening is provided with the pressure adjusting body.

The invention according to claim 7 is the air conditioning system according to any one of claims 2 to 4, wherein the pressure adjusting body is a balancing damper.
The invention according to claim 8 is the air conditioning system according to any one of claims 1 to 7, wherein the air supply chamber includes a maintenance door on the left and right side walls, and each of the information processing devices has the information. It is characterized in that it is inserted into and removed from the left and right side walls in the processing equipment storage chamber.
The invention according to claim 9 is the air conditioning system according to any one of claims 1 to 8, wherein the supply tunnel and the return air chamber are maintenance passages for the information processing device, and It is characterized by being able to go in and out with information processing equipment.

According to the present invention, instead of a method in which high-density servers are distributed in the data center room, two rows of rack rows each accommodating high-density servers are arranged with the respective intake surfaces facing each other via a passage. Since the high-density servers are centrally managed by arranging the high-density linked server racks to be arranged, the total air supply amount can be reduced.
In addition, since the passages of the high-density connection type server rack row form a supply tunnel by sealing the upper surface and the rear end, it is possible to reduce the heat exchange area that releases heat unnecessarily as a building load of cold air. Become.

In addition, the passage of the high-density connected server rack row seals the top and rear ends to form an air supply tunnel, reducing the influence of high-temperature exhaust from the high-density server to other high-density servers It becomes possible to do.
According to the present invention, the server rack row air conditioner is provided with a fan inverter, calculates the measured values from the supply air thermometer and the return air thermometer with the control device, and operates the information processing equipment in the information processing equipment storage room. Depending on the situation, control the inverter frequency, adjust the air volume by raising or lowering the fan speed, and equipped with a two-way valve to adjust the amount of cold water supply, supply air thermometer and return air temperature The measured value from the meter is set as the PV value, and based on the PV value, several temperature threshold values set in advance in the control device are compared and set as a set value. Perform air volume control.

Then, after narrowing the fan's air flow to the predetermined inverter frequency, control the two-way valve to raise the air temperature without reducing the air flow, as in the control of air supply temperature reset in the variable air flow single duct system To be able to.
An information processing equipment storage room specializing in rack rows equipped with highly integrated information processing equipment is connected to the front and rear surfaces of the rack rows, equipped with air conditioners for server rack rows, and supplied with a low temperature (for example, 19 ° C.). It was introduced as a side flow into a small and limited supply tunnel. The supply of air from such a low-temperature dedicated air conditioner was supplied only to a limited cold aisle, preventing cold leaks to the high temperature return air. This also clears the problem and does not waste air conditioning energy. In addition, it is possible to increase the air supply temperature of the air conditioning in the data center other than the high-density linked server rack row, to increase the evaporation temperature of the refrigeration cycle in the heat source, and to improve the coefficient of performance (COP) of the refrigeration cycle. . Also, if the load on the information processing equipment storage room with the high-density connected server rack row is reduced, the air supply tank air volume can be reduced according to the load, and when the load is further reduced, the supply air temperature can be raised, The evaporating temperature of the refrigeration cycle in the heat source can be raised and the coefficient of performance (COP) of the refrigeration cycle can be improved, so there is no waste of air conditioning energy and timely air conditioning according to the operating status of the high-density server Energy can be increased or decreased.

1 is a schematic plan view of an air conditioning system according to a first embodiment of the present invention. It is a schematic plan view of the air conditioning system according to the first embodiment of the present invention from the ceiling space side. It is the outline perspective view which notched the ceiling and floor slab of the air-conditioning system concerning a first embodiment of the present invention, and looked down from the ceiling space side. It is the schematic perspective view which looked down at the data center room of FIG. 3 from the ceiling space side. 1 is a schematic side view of an air conditioning system according to a first embodiment of the present invention. It is a schematic longitudinal cross-sectional view of the air conditioning system which concerns on 1st embodiment of this invention. It is a figure which shows the control flow of the air supply temperature and the air supply amount of an air conditioner in the air conditioning system which concerns on 1st embodiment of this invention. It is the schematic perspective view which looked down at the data center room of the air-conditioning system concerning a second embodiment of the present invention from the ceiling space side. It is a schematic side view of the air conditioning system which concerns on 3rd embodiment of this invention. It is a schematic plan view of the air conditioning system which concerns on 3rd embodiment of this invention. It is a schematic side view of the conventional air conditioning system.

Hereinafter, the present invention will be described based on embodiments shown in the drawings.
1 to 7 show an air conditioning system according to a first embodiment of the present invention.
In the air conditioning system according to the present embodiment, the data center 20 is separated into a data center room 29 and a machine room 50 via a side wall 22, and an information processing equipment storage room 30 is arranged in the data center room 29. In the present embodiment, the data center room 29 is supplied with air-conditioned air whose temperature is controlled from another air conditioner (not shown) installed in the machine room 50 in an area other than the information processing equipment storage room 30. An air supply system (not shown) is provided.

In the side wall 22 of the data center 20, two cold air supply ports 23 respectively connected to the cold air discharge ports 54 of the two server rack row air conditioners (AHU / air handling units) 51 arranged in the machine room 50 are formed. doing.
The information processing equipment storage room 30 is connected to an air supply chamber 31 provided along the side wall 22 of the data center 20 and a high-density connection communicating with the air supply chamber 31 through an air supply tunnel 42 formed in its own arrangement. Type server rack row 36 and a return air chamber 43 formed around the high density coupled server rack row 36, and is installed on the floor 21 of the data center room 29.

The air supply chamber 31 has a substantially rectangular parallelepiped shape along the side wall 22 of the data center 20, each surface is formed of a steel plate sandwich panel or the like, and two cold air supply ports provided on the side wall 22 of the data center 20. It is installed on the floor 21 of the data center room 29 so as to form a space for storing the cold air supplied from 23.
In the air supply chamber 31, a tunnel cold air supply port 35 that supplies cold air to the air supply tunnel 42 is provided in a panel 34 that forms a vertical wall surface on the long side opposite to the side wall 22 of the data center 20. The tunnel cold air supply port 35 is substantially the same as the cross section of the air supply tunnel 42 (the height direction is substantially the same as the height of the high-density server rack row 36) formed by two opposing high-density coupled server rack rows 36 as gaps. It has an opening having a substantially rectangular cross section.

The panel 31 a constituting the ceiling surface of the air supply chamber 31 is installed at substantially the same height as the shield 41 constituting the ceiling surface of the air supply tunnel 42. The panels 31b and 31c constituting the short-side closing wall of the air supply chamber 31 are returned to the return air chamber 43 (described later) extending in parallel to the high-density connected server rack row 36 in the information processing device storage room 30. The chamber outer surface walls 44a and 45a are separated from each other by a longer distance than the distance perpendicular to the air supply tunnel 42, and the side walls 22 of the data center 20 and the vertical ends of the panels 34 are closed, and the floor surface of the air supply chamber 31 is It consists of the floor 21 of the data center room 29.
The air supply chamber 31 constitutes a closed space except for two cold air supply ports 23 provided on the side wall 22 of the data center 20 and a tunnel cold air supply port 35 for supplying cold air to the air supply tunnel 42. Yes. As shown in FIGS. 1 and 5, the two cold air supply ports 23 sequentially measure the outlet temperature of the cold air from the server rack row air conditioner 51 and send the measured value to the control device 55. Is provided.

As shown in FIGS. 3 and 4, the panels 31 b and 31 c constituting the short-side closing wall of the air supply chamber 31 are maintenance doors 31 f for an operator to enter and exit the air supply chamber 31 during maintenance. 31g is provided.
The dimensions of the air supply chamber 31 are assured of a cross-section in consideration of the resistance of the local curved portion as an air path, and information on the dimensions of the tunnel cold air supply port 35 for introducing the cold air conditioned into the air supply tunnel 42 at a predetermined speed. It is determined in consideration of securing a maintenance passage width for replacement of the processing equipment 38 or the like.

  The high-density connection type server rack row 36 is composed of two rows of rack rows 37 that respectively accommodate information processing devices 38 such as servers, routers, and network devices. The two rows of rack rows 37 are information processing constituting them. For each rack, which is a device, the air intake surface side of each information processing device 38 is aligned and inserted horizontally, and a plurality of racks are aligned in the air intake surface to form a rack row 37. The high-density connection type server rack row 36 is configured by arranging the two rack rows 37 in parallel with each intake surface facing each other with the passage 36a interposed therebetween. The information processing device 38 includes devices that have increased power consumption due to high-speed arithmetic processing. In a rack that is an information processing device in which such information processing devices 38 are mounted in multiple stages, the information processing devices The total power consumption of 38 is increased to 4 to 10 kW / rack. The passage 36a is wide enough to allow an operator to enter and exit the information processing device 38. The height of the rack row 37 and the number of racks constituting the rack row 37 may be different.

  The high-density connection type server rack row 36 is a shield made of a panel or the like from the edge of the upper front plate surface 39 on the front face that forms the intake surface of each rack row 37 on the passage 36a between the two rows of rack rows 37. 41, and the two rack rows 37 are sealed by the return air chamber end wall surface 46 so as to be closed by one sheet along the end wall surface 36b2 located farthest in parallel with the side wall 22, An air supply tunnel 42 is formed. In the high-density connection type server rack row 36, the air intake side of each information processing device 38 forms a cold aisle by the air supply tunnel 42, and the exhaust surface side of each information processing device 38 faces the hot aisle, that is, the return air chamber 43. ing.

  The return air chamber 43 collects exhaust heat discharged to the back side of the high-density connected server rack row 36 and guides it to the ceiling space 24, so that a predetermined interval is provided on the back side of the high-density connected server rack row 36. The return air chamber outer side walls 44a and 45a made of panels or the like are provided upright from the floor 21 to the data center room ceiling 26 in a direction perpendicular to the side wall 22 and are separated from the upper ceiling on the rear side of the high-density connected server rack row 36. On the edge of the plate surface 39, return air chamber inner side walls 44 b and 45 b made of panels and the like are erected up to the data center room ceiling 26, and are respectively terminated at the two rack rows 37 of the high-density connection type server rack row 36. In parallel with the side wall surface 36b, each of the return air chamber outer side walls 44a, 45a has a length that extends from the side wall 22 to the vertical end surface that is farthest from the side wall 36b. Is provided with a return air chamber end wall surface 46 made of a panel having a height from the floor 21 to the data center room ceiling 26 and parallel to the side wall 22 and the vertical wall surface 34 on the long side of the air supply chamber 31. The first start end wall 47a is connected between the connecting portion 34a with the air chamber outer side wall 44a and the connecting portion 34b with the vertical wall surface 34 on the long side of the air supply chamber 31 and the return air chamber inner side wall 44b. 31 from the upper edge of the vertical wall 34 on the long side to the data center room ceiling 26, a connecting portion 34 c between the vertical wall 34 on the long side of the air supply chamber 31 and the return air chamber outer side wall 45 a, Between the vertical wall 34 on the long side of the air chamber 31 and the connecting portion 34d between the inner wall 45b of the return air chamber, the second start wall 47b is connected to the vertical wall 34 on the long side of the air supply chamber 31. An exhaust heat capturing space 43a, which is inside the return air chamber 43 on the back side of the high-density connected server rack row 36, is erected from the edge to the data center room ceiling 26 and formed up to the data center room ceiling 26. .

The return air chamber end wall surface 46 is formed on the end side wall surface 36b2 of each of the two rack rows 37, which is located farthest in parallel with the side wall 22, so as to form an end panel of the supply tunnel 42 portion. It is continuously blocked along, and the height of the supply tunnel 42 is reduced.
Return air chamber outer side wall 44a, return air chamber inner side wall 44b, return air chamber end wall surface 46 and first start end wall 47a, exhaust heat capture space 43a surrounded by data center room ceiling 26, and return air chamber outer side wall 45a The exhaust heat capture space 43a surrounded by the return air chamber inner side wall 45b, the return air chamber end wall 46 and the second start end wall 47b, and the data center room ceiling 26 is a passage for high temperature exhaust exhausted from each information processing device 38. Functions as a (duct). The space between the shield 41 constituting the air supply tunnel 42 and the data center room ceiling 26 is, for example, about 500 mm. The height of the data center room ceiling 26 is, for example, about 2600 mm from the floor 21.

The exhaust heat in the return air chamber 43 is returned to the ceiling space 24 by the blower conveying force of the server rack row air conditioner 51 disposed in the machine room 50 through the return air slit 48 provided in the data center room ceiling 26. I care.
The ceiling space 24 is a so-called ceiling return air plenum chamber that is in communication with the machine room 50 and has a negative pressure due to suction on the blower suction side of the server rack row air conditioner 51 and other air conditioners. Return air (for example, 29 ° C.) is sucked and flowed from the return air slit 48 and the ceiling suction port in other areas.

The return air chamber 43 is provided with a return air thermometer 49 b for monitoring the representative temperature in the return air chamber 43. Each return air thermometer 49b sends a measured value to the control device 55 as shown in FIGS. In FIG. 1, a plurality of return air thermometers 49 b are provided. However, one point may be used, and even if the measured values from the plurality of return air thermometers 49 b are averaged in the control device 55, a comparison is made. It may be calculated and replaced with a representative temperature on some basis.
The ceiling space 24 is connected via a return air opening 25 constituted by a space (for example, a height dimension of about 500 mm) between the upper end of the side wall 22 of the data center 20 and the beam 27 supporting the upper floor or the roof slab 28. And communicate with the machine room 50.

The high-temperature exhaust, that is, return air discharged from each information processing device 38 is guided to the machine room 50 in which the server rack row air conditioner 51 is installed through the return air port 25.
The machine room 50 includes a heat exchanger (coil) 52, a fan 53 such as a plug fan that generates an air flow for heat exchange with the heat exchanger 52, a humidifier (not shown), an air filter, and a casing. Two server rack row air conditioners 51 are arranged and provided with an air supply section that blows air from the side wall 22 of the data center 20 onto the floor 21. The server rack row air conditioner 51 adjusts the temperature and humidity of the air by exchanging heat with a heat medium such as cold water supplied from the external heat source equipment to the heat exchanger 52, for example, 19 ° C., 65%. Cold air in a state such as RH is supplied to the air supply chamber 31 via the cold air discharge port 54.

The high-temperature return air flowing in the ceiling space 4 and the air that is indirectly contacted via the plate material of the data center room ceiling 26 depend on the air conditioning temperature of the data center room 29 (for example, 24 ° C. to 25 ° C.). 26, an intermediate temperature (for example, 25 ° C. to 27 ° C.) between the supply air (for example, 19 ° C.) and the return air (for example, 29 ° C.). Heat transfer from the
The server rack row air conditioner 51 is provided with an inverter 53a in the power supply of the fan 53, and the operation status is determined by a control signal obtained as a result of calculating the measured values from the supply air thermometer 49a and the return air thermometer 49b by the control device 55. Accordingly, the output frequency of the inverter 53a is controlled to increase or decrease the rotational speed of the fan 53 to adjust the air volume.

In the heat exchanger (coil) 52, a chilled water return pipe 52a and a chilled water return pipe 52b from a refrigerator (external heat source) (not shown) communicate with each other, and the chilled water return pipe 52b includes a two-way valve 52c for adjusting the supply amount of the chilled water. Prepare.
The control device 55 compares the measured values from the supply air thermometers 49a and the return air thermometers 49b with a plurality of the same kind of measured values, for example, averages them and replaces them with the representative temperatures on some basis. However, it is regarded as a certain PV value, and on the basis of the PV value, several temperature threshold values set in advance in the control device 55 are compared and set as a set value. The air flow rate of the fan 53 is controlled. Then, after the air flow rate of the fan 53 is reduced to a predetermined inverter frequency, the air flow rate is not reduced any more and the air temperature is raised as in the reset control of the supply air temperature in the variable air flow single duct system. The direction valve 52c is controlled.

  For example, in a normal operation state of the data center room 29, even if the supply air temperature controls the two-way valve 52c based on a design value (for example, 19 ° C.) set in the control device 55, the return air thermometer Since the return air temperature derived from the measured value of 49b is lower than the return air set temperature (for example, a value obtained by subtracting a predetermined difference from 29 ° C.), the return air temperature is higher than the exhaust temperature discharged to the return air chamber 43. When it is determined that the load on the coupled server rack row 36 is small, first, when the first threshold value of several temperature threshold values preset in the control device 55 is exceeded, the inverter 53a of the server rack row air conditioner 51 is used. Is controlled to reduce the air supply from the rated 100% to 80%, and when it falls below the second threshold of several temperature thresholds set in the control device 55, the rated air is reduced from 80% to 60%. Then squeeze. In the state where the operation load of the information processing device 38 in the data center room 29 is reduced, if it is determined that the load is further reduced by falling below the third threshold value of the temperature range value, the server rack row air conditioner 51 The two-way valve 52c is controlled by changing the setting value of the supply air temperature from 19 ° C. to 20 ° C.

Instead of several temperature range values set in the control device 55, one temperature range value is assumed, and the frequency information of the inverter is returned to the control device 55 to determine a combination of the temperature range value and the frequency information. It is also good. The control device 55 can display the measured values, the supply amount and the supply temperature from each of the supply air thermometers 49a and the return air thermometer 49b on the monitor.
FIG. 7 shows an example of the control flow.
The control device 55 receives the supply air temperature T1 from the supply air thermometer 49a as the measured value and the return air thermometer 49b as the measured value (may be after the representative temperature processing), and supplies the supply air temperature. The set values x (= x1) and x2 are set in advance, and the temperature threshold value of the air flow control is set as the set value y of the ambient temperature T2. The number of setting values y is one below, but there may be a plurality of such values as 100%, 80%, 60%, and three for performing the reset control step by step. There may also be a plurality of set values x2. As described above, the set value y is one below, and the frequency information of the inverter of the server rack row air conditioner 51 may be returned to the control device 55, and the combination of the temperature range value and the frequency information may be used as the determination signal.

First, the control device 55 sets the supply air temperature T1 from the server rack row air conditioner 51 to an initial value of 19 ° C.
Next, the control device 55 determines whether or not the supply air temperature T1 from the server rack row air conditioner 51 is a set value x with an initial value of 19 ° C. (step S1).
Next, when determining that the supply air temperature T1 is higher than the set value x, the control device 55 increases the opening of the two-way valve 52c of the server rack row air conditioner 51 to increase the supply amount of cold water, and the process proceeds to step S1. Return (step S2).
Next, when determining that the supply air temperature T1 is lower than the set value x, the control device 55 reduces the amount of cold water supplied by reducing the opening of the two-way valve 52c of the server rack row air conditioner 51, and proceeds to step S1. Return (step S3).

Next, when the control device 55 determines that the supply air temperature T1 from the server rack row air conditioner 51 is the set value x with an initial value of 19 ° C., the control device 55 sets the ambient temperature T2 of the return air chamber 43 to an initial value of 29 ° C. It is determined whether or not the set value y is (step S4).
Next, when the control device 55 determines that the ambient temperature T2 is higher than the set value y, the control device 55 increases the rotation speed of the inverter (INV) 53a of the fan 53 of the server rack row air conditioner 51 to increase the supply amount of cold air ( Step S5).
Next, when the control device 55 determines that the ambient temperature T2 is the set value y, the control device 55 returns to step S4 (step S6).

Next, when the control device 55 determines that the ambient temperature T2 is lower than the set value y, the controller 55 reduces the rotation speed of the inverter (INV) 53a of the fan 53 of the server rack row air conditioner 51 to reduce the supply amount of cold air ( Step S7).
Next, when the control device 55 determines that the ambient temperature T2 remains the set value y, the control device 55 returns to step S4 (step S8).
Then, for example, after a predetermined time elapses by a timer (not shown), the determination in step S4 is performed again. If the ambient temperature T2 still remains at the set value y, the process proceeds again to step S7, and further the fan 53 of the server rack row air conditioner 51 Lower the inverter frequency to reduce the air supply.
If it is determined in step S8 that the ambient temperature T2 does not become lower than the set value y even if the supply air amount is decreased several times stepwise, the process proceeds to step S13.

In step S13, when it is determined from the ambient temperature T2 that the load on the target information processing device storage chamber 30 is a predetermined load that is a sufficient amount of air flow reduced by the server rack row air conditioner 51, the supply air The set value x of the temperature T1 is changed by a predetermined amount of difference, for example, by setting 19 ° C. to 20 ° C. Accordingly, the process proceeds to step S14 in which the control target value of the two-way valve 52c is shifted and controlled based on the new supply air temperature setting value x2.
Next, when determining that the supply air temperature T1 is higher than the set value x2, the control device 55 increases the amount of cold water supplied by increasing the opening of the two-way valve 52c of the server rack row air conditioner 51, and the process proceeds to step S14. Return (step S15).

Next, when determining that the supply air temperature T1 is lower than the set value x2, the control device 55 reduces the amount of cold water supplied by reducing the opening of the two-way valve 52c of the server rack row air conditioner 51, and the process proceeds to step S14. Return (step S16).
If the load on the target information processing equipment storage chamber 30 increases while performing such control, the control proceeds to the following control.
That is, when the control device 55 determines that the ambient temperature T2 has become larger than the set value y in the returned step S4, the control device 55 proceeds to step S6, determines that the ambient temperature T2 is greater than the set value y, and supplies air. The set value x of the temperature T1 is changed by a predetermined amount, for example, with 20 ° C. being 19 ° C. Thereby, based on the new supply air temperature setting value x1 from the setting value x2, the process proceeds to step S10 where the control target value of the two-way valve 52c is shifted and controlled (step S9).

Next, when determining that the supply air temperature T1 is higher than the set value x1, the control device 55 increases the amount of cold water supplied by increasing the opening of the two-way valve 52c of the server rack row air conditioner 51, and the process proceeds to step S10. Return (step S11).
Next, when determining that the supply air temperature T1 is lower than the set value x1, the control device 55 reduces the amount of cold water supplied by lowering the opening of the two-way valve 52c of the server rack row air conditioner 51, and the process proceeds to step S10. Return (step S12).
Then, for example, after a predetermined time elapses by a timer (not shown), the determination in step S4 is performed again. If the ambient temperature T2 is still higher than the set value y, the process proceeds to step S5, and the inverter frequency of the fan 53 of the server rack row air conditioner 51 To increase the air supply.
By repeating such an operation, the air supply amount and the air supply temperature can be controlled in a timely manner according to the load of the target information processing device storage chamber 30, thereby contributing to energy saving.

Next, the operation of the air conditioning system according to this embodiment will be described.
First, for example, 19 ° C. cold air generated by the two server rack row air conditioners 51 in the machine room 50 is connected to the cold air discharge ports 54 of the two server rack row air conditioners 51. The air is supplied to the air supply chamber 31 through the supply port 23 at, for example, a surface speed of the cold air supply port 23 at a speed of 2.5 m / sec.
Next, for example, 19 ° C. cool air introduced into the air supply chamber 31 passes through the tunnel cool air supply port 35 communicating with the air supply tunnel 42 of the high-density connected server rack row 36 into the air supply tunnel 42. The surface speed of the supply port 35 is supplied, for example, at a speed of 6 m / sec, and the inside of the air supply tunnel 42 is made a cold aisle by horizontal side flow cold air.

Next, for example, as shown in FIG. 6, the cool air introduced into the air supply tunnel 42 is, for example, as shown in FIG. The edge of 39 is covered with the shield 41, and each of the two rows of rack rows 37 accommodating the information processing devices 38 is closed by one piece along the end side wall surface 36b2 located farthest in parallel with the side wall 22. Thus, for example, 19 ° C. cool air introduced into the air supply tunnel 42 is blocked from the intake surface side of each information processing device 38 of the high-density connected server rack row 36. It flows into each information processing device 38.
Next, the 19 ° C. cold air that has flowed in from the intake surface side of each information processing device 38 in the high-density connected server rack row 36 takes heat from the inflow information processing devices 38, and is on the back side of each information processing device 38. It is heated and exhausted to the exhaust heat capturing space (duct) 43a.

  Next, the warmed exhaust blown from the cooling fan of each information processing device 38 is discharged into the return air chamber 43 which is the exhaust heat capturing space (duct) 43a on the back side of each information processing device 38. The sucked cold air used for cooling each information processing device 38 is warmed by internal heat generation, but by reliably exhausting it to the return air chamber 43 outside each information processing device 38, the heat generation of each information processing device 38 is performed. Appropriate cold air can be supplied to the inside according to the amount, and the information processing equipment is warmed by the internal heat generation of each information processing equipment 38 and into the exhaust heat capturing space (duct) 43a on the back side of the high-density connected server rack row 36. Exhausts having different temperatures are collected every 38 and mixed to some extent in the return air chamber 43.

Next, the return air (29 ° C.) exhausted to the exhaust heat capturing space (duct) 43a on the back side of the high-density connected server rack row 36 rises in the exhaust heat capturing space (duct) 43a.
Next, the air rising in the exhaust heat capturing space (duct) 43 a flows into the ceiling space 24 from the return air slit 48 provided in the ceiling 26, and ventilates the machine room 50 through the return air port 25. .
Next, the air ventilated in the machine room 50 is supplied again to the supply chamber 31 as cool air of 19 ° C., for example, by the two server rack row air conditioners 51 again.

  As described above, in the air conditioning system according to the present embodiment, the supply air cooled by the server rack row air conditioner 51 of the machine room 50 is supplied to the supply chamber 31 of the information processing device storage room 30 and supplied. The air is supplied from the tunnel cold air supply port 35 of the air chamber 31 to the air supply tunnel 42 and flows into the information processing devices 38 from the air intake surface side of the information processing devices 38 of the high-density connected server rack row 36. Then, the heat of each information processing device 38 is taken away and the exhaust heat is guided from the back side of each information processing device 38 to the ceiling space 24 from the return air chamber 43, and the return air is returned by the server rack row air conditioner 51 of the machine room 50. An air conditioning cycle for supplying the cooled air supply to the air supply tunnel 42 of the information processing device storage chamber 30 again is constructed.

  In the air conditioning system according to the present embodiment, as shown in FIG. 7, the supply air temperature from the server rack row air conditioner 51 is measured by the supply air thermometer 49 a and the supply air temperature control is performed by the heat exchanger 52. The return air temperature in the return air chamber 43 is sequentially measured by the return air thermometer 49b, the amount of heat load in the information processing equipment storage chamber 30 is calculated, and the variable air flow rate of the single duct type is calculated. In this way, the air flow rate of the fan 53 is controlled. Then, after the air flow rate of the fan 53 is reduced to a predetermined inverter frequency, the air flow rate is not reduced any more and the air temperature is raised as in the reset control of the supply air temperature in the variable air flow single duct system. The direction valve 52c is controlled. For example, even if the supply air temperature from the server rack row air conditioner 51 controls the two-way valve 52c based on the design value (for example, 19 ° C.) set in the control device 55, the return air thermometer 49b Since the return air temperature derived from the measured value is lower than the return air set temperature (for example, a value obtained by subtracting a predetermined difference from 29 ° C.), the high-density connected type is determined from the exhaust temperature discharged to the return air chamber 43. When it is determined that the load on the server rack row 36 is small, first, when the temperature falls below the first threshold value (for example, 29 ° C.) of several temperature threshold values preset in the control device 55, the server rack row air conditioner The inverter 53a of 51 is controlled to reduce the air supply amount from the rated 100% to 80%, and further below the second threshold value (for example, 27 ° C.) of several temperature threshold values set in the control device 55. And rated 80% to 60% It decreased squeeze. If the temperature threshold value is lower than the third threshold value (for example, 25 ° C.), the setting value of the supply temperature of the server rack row air conditioner 51 is increased from 19 ° C. to 20 ° C. 52c is controlled. Instead of several temperature range values set in the control device 55, one temperature range value is assumed, and the frequency information of the inverter is returned to the control device 55 to determine a combination of the temperature range value and the frequency information. It is also good.

  As described above, according to the air conditioning system according to the present embodiment, the cool air of, for example, 19 ° C. generated in the server rack row air conditioner 51 is stored in the air supply chamber 31, and the high density coupled server rack row 36. The air is supplied into the air supply tunnel 42 and flows into the information processing devices 38 from the front side of the information processing devices 38 of the high-density connection type server rack row 36. Air heated from the back side of the information processing device 38 is exhausted into the exhaust heat capturing space (duct) 43 a of the return air chamber 43, captured in the return air chamber 43, and passed through the return air slit 48 to the ceiling space 24. The high-temperature exhaust from each information processing device 38 of the high-density connected server rack row 36 is transferred to the other information processing devices 38 because the air can flow into the machine room 50 and return to the machine room 50 through the ceiling space 24. Ri to it without the written becomes effectively possible to operate.

  In the air conditioning system according to the present embodiment, as shown in FIG. 7, the supply air temperature from the server rack row air conditioner 51 is sequentially measured by the supply air thermometer 49a, and the temperature in the return air chamber 43 is returned to the return air. The thermometer 49b sequentially measures and sends these measured values to the control device 55. The control device 55 monitors the load of the return air chamber 43 based on the calculated temperature, and the server rack row air conditioner 51 Since the inverter is controlled, it is possible to operate the increase / decrease of the air supply amount from the server rack row air conditioner 51 in a timely manner in accordance with the operation status of each information processing device 38 of the high-density connection type server rack row 36. Become. When it is determined that the load on the return air chamber 43 is small, first, the air supply amount of the server rack row air conditioner 51 is gradually reduced, for example, 100% → 80% → 60%. The supply air temperature of the row air conditioner 51 can be changed from 19 ° C. to 20 ° C.

In the air conditioning system according to the present embodiment, the information processing devices 38 are distributed in the information processing device storage chamber 30 by centrally managing the information processing devices 38 of the high-density connected server rack row 36. Compared to the case, the total air supply amount can be reduced.
In addition, although this embodiment demonstrated the case where the one information processing equipment storage chamber 30 was provided, this invention is not limited to this, The some information processing equipment storage chamber mentioned above along the side wall 21 of the data center 2 is mentioned. By providing the server rack row air conditioner 51 in the machine room 50, a plurality of information processing equipment storage rooms 30 can be provided side by side.
Further, in the above embodiment, the two cool air inlets 33 are provided with the supply air thermometer 49a for sequentially measuring the exit temperature of the cool air from the server rack row air conditioner 51, and the return air chamber 43 has the inside of the return air chamber 43. Although the return air thermometer 49b for monitoring the representative temperature is provided, the present invention is not limited to this, and the thermometers 49a and 49b may be any flow path from the two cold air inlets 33 to the return air chamber 43. You may install in the place of. The supply air thermometer 49a and the return air thermometer 49b may be either one.

FIG. 8 shows an air conditioning system according to the second embodiment of the present invention.
In the air conditioning system according to the present embodiment, the terminal panel 46 is provided with an opening 61 that connects the air supply tunnel 42 and the data center room 29 outside the information processing device storage room 30, and the pressure regulator 60 is provided in the opening 61. It differs from the air conditioning system according to the first embodiment of the present invention in that it is provided. Since other configurations are the same, description thereof will be omitted.
In the present embodiment, the pressure adjusting body 60 includes, for example, a balancing damper. Alternatively, a flexible resin sheet such as a vinyl sheet may be suspended from the opening 61 to close the opening 61, and the opening 61 may be opened during decompression.

In the present embodiment, when the air volume of the exhaust fan attached to the information processing device 38 exceeds the air supply amount from the server rack row air conditioner 51, the pressure adjusting body 60 is generated when the inside of the air supply tunnel 42 is depressurized. Since the air in the data center room 29 is taken in from the air and flows into the air supply channel 42 until the pressure in the air supply tunnel 42 is stabilized, the flow of the cold air supplied into the air supply tunnel 42 is interrupted. Instead, it is supplied to each information processing device 38 of the high-density connection type server rack row 36.
Also in the present embodiment, it is possible to achieve the same effects as the first embodiment.

FIG. 9 shows an air conditioning system according to the third embodiment of the present invention.
The air conditioning system according to the present embodiment is different from the air conditioning system according to the second embodiment of the present invention in that it has a double floor structure. Since other configurations are the same, description thereof will be omitted.
In the present embodiment, a double floor that supplies cold air from an underfloor space 70 formed in the lower part of the floor 21 through a perforated panel 71 provided on the outer floor 21 surface far from the side wall 22 of the air supply tunnel 42. Is formed. A whole room air conditioner 51A for supplying cold air to the underfloor space 70 is newly provided between the two server rack row air conditioners 51.

In the present embodiment, for example, 19 ° C. cold air from the entire room air conditioner 51 </ b> A passes through the underfloor space 70 and through the hole of the perforated panel 71, the side wall 22 of the terminal side panel 46 of the information processing device storage chamber 30. Supplied from the outside side. Air flows into the ceiling space 24 from a suction port (not shown) provided in the server rack room ceiling 26, and the return air flows into the machine room 50 together with the return air of the server rack row air conditioner 51 in the ceiling space 24. In the vicinity of the floor 21 of the data center room 29 outside the information processing equipment storage room 30, the air temperature is 19 ° C. +-22 ° C., and the room temperature at a height of 1500 mm from the floor 21 is about 25 ° C. Adjust the position and number of.
In the present embodiment, when the pressure in the supply tunnel 42 is reduced, the 19 ° C. cold air supplied from the perforated panel 71 is supplied to the supply channel 42 via the pressure regulator 60 until the pressure in the supply tunnel 42 is stabilized. Therefore, the flow of the cold air supplied into the air supply tunnel 42 is supplied to each information processing device 38 of the high-density connected server rack row 36 without interruption.

In the present embodiment, unlike the conventional double-floor structure air conditioning system, the cold air is not directly supplied from under the floor to the high-density connected server rack row 36, so the cold air is supplied from the entire room air conditioner 51A. It becomes possible to suppress.
Therefore, less fan power is required to supply the conditioned air, and the power of the air conditioning mechanism required to supply the conditioned air to the air-conditioned room can be reduced. Moreover, the installation of the perforated panel 71 is less than that of a conventional air conditioning system having a double floor structure.
Also in the present embodiment, it is possible to achieve the same effects as the first embodiment.

20 Data center 20
21 Floor 22 Side wall 23 Cold air supply port 25 Return air port 26 Data center room ceiling 29 Data center room 30 Information processing equipment storage room 31 Air supply chamber 31f, 31g Maintenance door 34 Vertical wall 35 Tunnel cold air supply port 36 High density connection type Server rack row 36a Passage 36b End side wall surface 37 Rack row 38 Information processing device 39 Upper top plate surface 41 Shielding body 42 Air supply tunnel 43 Return air chamber 43a Waste heat trapping space 44a, 45a Return air chamber outer side wall 44b, 45b Return air Side wall inside chamber 46 End wall of return air chamber (end panel)
47a First start wall 47b Second start wall 48 Return air slit 49a Supply air thermometer 49b Return air thermometer 50 Machine room 51 Server rack row air conditioner (AHU / air handling unit)
51A Whole room air conditioner 52 Heat exchanger (coil)
52a Chilled water return pipe 52b Chilled water return pipe 52c Two-way valve 53 Fan 53a Inverter 54 Cold air outlet 55 Controller 60 Pressure regulator 61 Opening 70 Underfloor space 71 Perforated panel

Claims (9)

A machine room and a data center room are provided on the floor of the data center with a side wall therebetween, and a ceiling space is provided on the upper surface side of the data center room so as to communicate with a return air port provided in the upper part of the side wall.
In the air conditioning system for returning the exhaust from the data center room to the machine room from the return air port to the machine room through the ceiling space by the blower conveying force of the server rack row air conditioner,
The machine room is provided with an air supply part for horizontally blowing the conditioned air temperature-controlled by the server rack row air conditioner to the data center room side on the side wall surface floor part,
The data center room
An air supply chamber provided along the side wall and communicating with the air supply unit;
A rack which is an information processing apparatus which is connected to the air supply chamber through an air supply tunnel formed in its own arrangement and which is composed of two rows of rack rows for accommodating information processing devices and which constitutes two rows of rack rows. A high-density connection type server rack row in which the intake surface side of each information processing device is aligned and mounted, and a plurality of racks are aligned with the intake surface to form a rack row,
An information processing equipment storage room comprising a return air chamber formed in a space on the exhaust surface side of the high-density connected server rack row,
The air supply tunnel seals the ceiling surface with a shield that covers the edge of the upper top plate surface of the front surface of the intake surface opposite to the high-density connection type server rack row, and is farthest in parallel with the side wall. The high-density connection type server rack row end side wall surface located at the end panel is sealed with a termination panel,
The return air chamber has a space on the exhaust surface side of the high-density connected server rack row that stands from the floor to the data center room ceiling in a direction perpendicular to the side wall at a predetermined interval. The return air chamber inner side wall is erected up to the data center room ceiling on the edge of the upper surface of the upper back surface of the high-density connection type server rack row, and each of the two rows of rack rows in the high-density connection type server rack row Parallel to the end side wall surface, the end panel that is continuous with the air supply tunnel portion is erected, the upper part is installed with the ceiling of the data center room provided with a return air slit, and the floor and side walls are sealed off. Formed by
The exhaust air discharged from the return air slit is returned to the machine room from the return air port through the ceiling space. A machine room and a data center room are provided on the floor of the data center with a side wall therebetween, and a ceiling space is provided on the upper surface side of the data center room so as to communicate with a return air port provided in the upper part of the side wall.
In the air conditioning system for returning the exhaust from the data center room to the machine room from the return air port to the machine room through the ceiling space by the blower conveying force of the server rack row air conditioner,
The machine room is provided with an air supply part for horizontally blowing the conditioned air temperature-controlled by the server rack row air conditioner to the data center room side on the side wall surface floor part,
The data center room
An air supply chamber provided along the side wall and communicating with the air supply unit;
A rack which is an information processing apparatus which is connected to the air supply chamber through an air supply tunnel formed in its own arrangement and which is composed of two rows of rack rows for accommodating information processing devices and which constitutes two rows of rack rows. A high-density connection type server rack row in which the intake surface side of each information processing device is aligned and mounted, and a plurality of racks are aligned with the intake surface to form a rack row,
An information processing equipment storage room comprising a return air chamber formed in a space on the exhaust surface side of the high-density connected server rack row,
The air supply tunnel seals the ceiling surface with a shield that covers the edge of the upper top plate surface of the front surface of the intake surface opposite to the high-density connection type server rack row, and is farthest in parallel with the side wall. The high-density connection type server rack row end side wall surface located at is sealed with an end panel having an opening having a pressure adjusting body,
The return air chamber has a space on the exhaust surface side of the high-density connected server rack row that stands from the floor to the data center room ceiling in a direction perpendicular to the side wall at a predetermined interval. The return air chamber inner side wall is erected up to the data center room ceiling on the edge of the upper surface of the upper back surface of the high-density connection type server rack row, and each of the two rows of rack rows in the high-density connection type server rack row Parallel to the end side wall surface, the end panel that is continuous with the air supply tunnel portion is erected, the upper part is installed with the ceiling of the data center room provided with a return air slit, and the floor and side walls are sealed off. Formed by
The exhaust air exhausted from the return air slit is returned from the return air port to the machine room through the ceiling space. A machine room and a data center room are provided on the double floor of the data center with a side wall therebetween, and a ceiling space is provided on the upper surface side of the data center room so as to communicate with a return air port provided in the upper part of the side wall.
An air conditioner that exhausts air from the data center room through the ceiling space by a fan rack conveying force of a server rack row air conditioner and an entire room air conditioner that are arranged in the machine room from the return air port to the machine room. In the system,
The machine room is a first air supply unit located in the upper part of the side wall floor for blowing the conditioned air temperature-controlled by the server rack row air conditioner to the data center room side;
A second air supply unit for blowing out the conditioned air temperature-controlled by the air conditioner for the entire room from the perforated panel provided on the double floor to the data center room side via the space under the double floor. Prepared,
The data center room
An air supply chamber provided along the side wall and communicating with the air supply unit;
A rack which is an information processing apparatus which is connected to the air supply chamber through an air supply tunnel formed in its own arrangement and which is composed of two rows of rack rows for accommodating information processing devices and which constitutes two rows of rack rows. A high-density connection type server rack row in which the intake surface side of each information processing device is aligned and mounted, and a plurality of racks are aligned with the intake surface to form a rack row,
An information processing equipment storage room comprising a return air chamber formed in a space on the exhaust surface side of the high-density connected server rack row,
The air supply tunnel seals the ceiling surface with a shield that covers the edge of the upper top plate surface of the front surface of the intake surface opposite to the high-density connection type server rack row, and is farthest in parallel with the side wall. The high-density connection type server rack row end side wall surface located at is sealed with an end panel having an opening having a pressure adjusting body,
The return air chamber has a space on the exhaust surface side of the high-density connected server rack row that stands from the floor to the data center room ceiling in a direction perpendicular to the side wall at a predetermined interval. The return air chamber inner side wall is erected up to the data center room ceiling on the edge of the upper surface of the upper back surface of the high-density connection type server rack row, and each of the two rows of rack rows in the high-density connection type server rack row Parallel to the end side wall surface, the end panel that is continuous with the air supply tunnel portion is erected, the upper part is installed with the ceiling of the data center room provided with a return air slit, and the floor and side walls are sealed off. Formed by
The second air supply unit is provided on the double floor on the side away from the side wall of the information processing device storage chamber, and the conditioned air from the second air supply unit is disposed inside the supply tunnel. Exhaust gas that flows into the air supply tunnel from the pressure regulator during decompression and is discharged from the return air slit is returned to the machine room from the return port through the ceiling space. Air conditioning system. The air conditioning system according to any one of claims 1 to 3,
An air supply thermometer for measuring an air supply temperature from the server rack row air conditioner;
A return air thermometer for measuring a predetermined return air temperature in the return air chamber;
And a control device that controls based on the measured value of each thermometer,
The control device performs inverter control of the rotation speed of the fan of the server rack air conditioner based on the measurement value of the return air thermometer, and also controls the air conditioning for the server rack row based on the measurement value of the supply air thermometer. An air conditioning system characterized in that the supply air temperature of the machine is controlled by adjusting the amount of cold water to the heat exchanger. In the air conditioning system according to claim 1 or 4,
The air supply chamber is formed in a substantially rectangular parallelepiped space having substantially the same height as the top plate of the high-density connection type server rack row, and a cold air inlet that communicates with the air supply unit, and the air supply tunnel With tunnel cold air supply port to contact,
The high-density connected server rack row accommodates the information processing devices and is disposed through the air supply tunnel, which is a passage, with each intake surface facing each other, and one end side is on the wall surface of the air supply chamber Formed by two rows of rack rows that come into contact with each other, a shield that seals the top plate surfaces of the two rows of rack rows, and the end panel that blocks the other end of the two rows of rack rows,
The return air chamber is spaced a predetermined distance from the back side of the high-density connection type server rack row in order to collect exhaust discharged to the back side of the high-density connection type server rack row and guide it to the ceiling space. The outer wall of the return air chamber is erected from the floor to the ceiling of the data center room in a direction orthogonal to the side wall, and is located above the edge of the upper top plate on the back of the high-density connected server rack row. The inner wall of the return air chamber is erected up to the ceiling of the data center room, and parallel to the end side wall surfaces of the two rack rows of the high-density connection type server rack row, Each return air chamber end wall has a length that extends from the side wall to the farthest vertical end face and has a height from the floor to the data center room ceiling A connecting portion between the vertical wall surface on the long side of the supply chamber and the outer wall surface of the return air chamber, and the vertical wall surface on the long side of the supply chamber and the return air, which are parallel to the side wall. A first start wall is erected from the upper edge of the vertical wall on the long side of the air supply chamber to the ceiling of the data center room between the connecting portion with the inner wall of the chamber, and the long side of the air supply chamber A long side of the air supply chamber between a connecting portion between the vertical wall surface of the return air chamber and the outer side wall of the return air chamber, and a connecting portion between the vertical wall surface of the long side of the air supply chamber and the inner side wall of the return air chamber A second start end wall is erected from the upper edge of the vertical wall on the side to the ceiling of the data center room, and the exhaust heat capturing space inside the return air chamber on the back side of the high-density connected server rack row, Stand up to the ceiling of the data center room Air conditioning system, and forming Te. The air conditioning system according to any one of claims 2 to 4,
The air supply chamber is formed in a substantially rectangular parallelepiped space having substantially the same height as the top plate of the high-density connected server rack row, and introduces cold air that communicates with the air supply unit or the first air supply unit And a tunnel cold air supply port communicating with the air supply tunnel,
The high-density connected server rack row accommodates the information processing devices and is disposed through the air supply tunnel, which is a passage, with each intake surface facing each other, and one end side is on the wall surface of the air supply chamber Formed by two abutting rack rows, a shield that seals the top surface of the two rows of rack rows, and the end panel that seals the other end of the two rows of rack rows,
The air supply tunnel seals the ceiling surface with the shield covering and covering the edge of the upper top plate surface of the front surface of the intake surface opposed to the high-density connection type server rack row, and is parallel to the side wall. Formed by sealing the end side wall surface of the high-density connection type server rack row located far away with an end panel having an opening having a pressure adjusting body,
The return air chamber has a predetermined interval on the back side of the high-density connected server rack row in order to collect exhaust heat discharged to the back side of the high-density connected server rack row and guide it to the ceiling space. The return air chamber outer surface wall is erected from the floor to the data center room ceiling in a direction orthogonal to the side wall, and is above the edge of the upper top plate surface at the back of the high-density connected server rack row. The inner wall of the return air chamber is erected up to the ceiling of the data center room, and the outer wall of the outer wall of the return air chamber is parallel to each of the end side wall surfaces of the two rack rows of the high-density connection type server rack row. Each having a length that extends from the side wall to the vertical end face located farthest from the side wall, and a height of the return air chamber end wall having a height from the floor to the data center room ceiling A connecting portion between the vertical wall surface on the long side of the supply chamber and the outer wall surface of the return air chamber, and the vertical wall surface on the long side of the supply chamber and the return air, which are parallel to the side wall. A first start wall 47a is erected from the upper edge of the vertical wall surface on the long side of the air supply chamber to the ceiling of the data center room between the connecting portion with the inner side wall of the chamber, and the long side of the air supply chamber The length of the air supply chamber is between the connecting portion between the vertical wall surface on the side and the outer surface wall of the return air chamber, and the connecting portion between the vertical wall surface on the long side of the air supply chamber and the inner wall surface of the return air chamber. A second starting wall is erected from the upper edge of the vertical vertical wall on the side to the ceiling of the data center room, and an exhaust heat capturing space that is inside the return air chamber on the back side of the high-density coupled server rack row, To the ceiling of the data center room And forming raised Chi, the end panel of the air supply tunnel, an opening is provided at a site facing the air supply chamber, an air conditioning system characterized by comprising the pressure adjusting body to the opening. The air conditioning system according to any one of claims 2 to 4,
The air conditioning system, wherein the pressure adjusting body is a balancing damper. The air conditioning system according to any one of claims 1 to 7,
The air supply chamber includes a maintenance door on the left and right side walls,
Each said information processing apparatus is withdrawn / inserted from the said right-and-left side wall part in the said information processing apparatus accommodation chamber. The air conditioning system according to any one of claims 1 to 8,
The air supply system is characterized in that the supply tunnel and the return air chamber are maintenance passages for the information processing device, and a person can go in and out with the information processing device.

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