JP6007008B2 - Sheet pasting device - Google Patents

Description

The present invention also relates to a sheet sticking equipment.

2. Description of the Related Art Conventionally, there has been known a mounting device for attaching an adhesive tape to a ring frame and attaching a semiconductor wafer (hereinafter sometimes referred to as “wafer”) to the ring frame to which the adhesive tape is attached (for example, Patent Document 1). reference).
The mounting device of this Patent Document 1 includes a ring frame supply unit that accommodates and stacks the ring frames with the surface of the ring frame facing in the horizontal plane direction. Each sheet is sucked and held in order and conveyed to a position where an adhesive tape is applied.

JP-A-2005-33119

  However, in the configuration as in Patent Document 1, since the ring frame supply unit is configured to accommodate the ring frame in a flat stack, there is a disadvantage that the operator must support the ring frame with both hands and supply the ring frame to the ring frame supply unit. is there. In particular, in the case of a large ring frame, it is very difficult to flatten the ring frame with one hand against gravity, and in order not to lower the operating rate of the device, more than one ring frame is used at a time. If it is supplied, it cannot be stored in a stack unless it is supported by both hands.

An object of the present invention is to provide a sheet sticking equipment that can easily deliver the frame member.

To achieve the above object, a sheet sticking apparatus of the present invention, a plurality can accommodate frames containing means a frame member which is integral with the adherend via the contact adhesive sheet, wherein the frame member and the adherend Support means for supporting at least the frame member, transfer means for taking out the frame member from the frame housing means and transferring it to the support means, a frame member supported by the support means, or a frame member and a cover. Pasting means for abutting and sticking the adhesive sheet to a body, and the frame housing means is configured so that the frame member can be placed vertically, and the lower part of the frame member is unidirectionally arranged. A configuration is adopted in which posture maintaining means for moving the device is provided.

According to the present invention as described above, since the frame accommodation means is configured to be accommodated by placing the frame member vertically, the operator can easily supply the frame member to the accommodation means. In particular, when the frame member has an opening as in the ring frame, the operator can supply the palm frame by inserting a palm or a finger into the opening and suspending the ring frame, which is a large ring frame. Even in such a case, it is possible to form a vertically stacked body without resisting gravity, and it is possible to supply a plurality of ring frames to the receiving means with one hand at a time.
Note that “vertically placed” as used in the present application refers to a state in which the frame member is placed in a direction along the direction of being pulled by gravity when the frame member is held at a position off the center of gravity.

In this case, by adopting the position maintaining means to the frame accommodating means it can transfer means always to transfer holding a frame member of the same orientation.

The top view of the sheet sticking apparatus which concerns on one Embodiment of this invention. (A) is sectional drawing of a frame accommodating means, (B), (C) is operation | movement explanatory drawing of a transfer means. The BB arrow line view of FIG.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
Note that the X axis, the Y axis, and the Z axis in this embodiment are orthogonal to each other, the X axis and the Y axis are axes in a horizontal plane, and the Z axis is an axis that is orthogonal to the horizontal plane. Further, in the present embodiment, when viewed from the direction of the arrow AR parallel to the Y axis, when indicating the direction, “up” is the arrow direction of the Z axis, “down” is the opposite direction, and “left”. Is the arrow direction of the X axis, “right” is the opposite direction, “front” is the arrow direction of the Y axis, and “rear” is the opposite direction.

In FIG. 1, a sheet sticking apparatus 1 includes a wafer accommodating means 2 that can accommodate a plurality of wafers WF as adherends, and a plurality of ring frames RF as frame members that are integrated with the wafers WF via an adhesive sheet AS. Frame accommodating means 3 that can be accommodated, support means 7 that supports at least the ring frame RF of the ring frame RF and the wafer WF, and a support means that takes out the wafer WF and the ring frame RF from the wafer accommodating means 2 and the frame accommodating means 3 The frame 10 includes a transfer means 8 for transfer to the ring 7 and a ring frame RF supported by the support means 7 or a sticking means 9 for sticking the adhesive sheet AS to the ring frame RF and the wafer WF. It is supported.
Here, on the outer peripheral surface of the ring frame RF, there are four plane portions RF1 at four 90 ° intervals, four curved surface portions RF2 disposed between the adjacent planar portions RF1, and four curved surface portions RF2. V notch RF3 each arrange | positioned at two adjacent curved-surface part RF2 is provided, and opening part RF4 is formed inside.

  The wafer accommodating means 2 includes a wafer cassette 21 that can accommodate a wafer WF having a protective sheet PS (refer to a diagram indicated by reference numeral AA in FIG. It is supported so that it can be separated.

  As shown in FIG. 2 (A), the frame accommodating means 3 is configured to accommodate the ring frame RF in a vertical position. The frame accommodating means 3 accommodates the ring frame RF in the accommodating case 30. A biasing means 40 for biasing the accommodated ring frame RF in one direction (right side) and a posture maintaining means 50 for moving the lower part of the ring frame RF in one direction (right side) are provided.

  The storage case 30 is erected from a rectangular box-shaped bottom surface portion 31 extending in the left-right direction, and both front and rear ends of the bottom surface portion 31, and is larger than the size between the opposed flat surface portions RF <b> 1 of the ring frame RF. A pair of side surface portions 32 as outer support means for supporting the outer edge of the ring frame RF, set to be smaller than the dimension between the curved surface portions RF2, and a left surface portion 33 erected from the left edge of the bottom surface portion 31; One or more gaps of the ring frame RF are provided between the right surface portion 34 and the right surface portion 34 erected from the right edge of the bottom surface portion 31 and formed with a recess 34A in the center, and transferred. A pressing means 38 for preventing a plurality of ring frames RF from being simultaneously taken out (pulled out) by the means 8 is provided. A handle 35 is provided on the side surface portion 32 located in the front, and by operating this handle 35, the transfer position in which the housing case 30 approaches the transfer means 8 indicated by the solid line in FIG. It is provided so that it can be pulled out in the front-rear direction via a rail (not shown) between a supply position separated from the transfer means 8 indicated by the middle two-dot chain line. In addition, it is good also as a structure which can provide the handle | steering-wheel 35 in the left surface part 33, and can be pulled out in the left-right direction via the rail which is not shown in figure between the supply positions shown with a dashed-dotted line in FIG. It is good also as a structure which can be pulled out to both the left-right direction.

The biasing means 40 connects a linear motor 41 as a pair of driving devices provided inside the bottom surface portion 31 and a slider 42 of each linear motor 41 through an opening 36 formed on the top surface of the bottom surface portion 31. And an urging plate 43 provided as described above.
The posture maintaining means 50 is provided inside the bottom surface portion 31, is supported by a pair of frames 55, and is rotated to the same frame 55 and a drive pulley 52 that is rotatably provided by a rotation motor 51 as a drive device. The driven pulley 53 that is supported, and the endless belt that is wound around the drive pulley 52 and the driven pulley 53 and that the upper surface is positioned slightly above the upper surface of the bottom surface portion 31 through the opening 36. 54.

  The support means 7 includes a table 72 having a support surface 71 capable of attracting and holding the wafer WF and the ring frame RF by suction means such as a decompression pump and a vacuum ejector (not shown), and linear as drive equipment for supporting the table 72 with a slider 74. And a motor 73.

The transfer means 8 includes an articulated robot 81 as a drive device and a holding means 82 provided at the tip of the articulated robot 81. The multi-joint robot 81 is a so-called six-axis robot having joints that can rotate at six locations, and the wafer WF and the ring frame RF held by the holding means 82 within the work range of the multi-joint robot 81 are located at any position. It is configured to be movable even at an angle of. The holding means 82 includes a plurality of suction holes 83 and two left and right frame suction portions 84, a plurality of suction holes 85 and a wafer suction portion 86 provided between the frame suction portions 84, There is provided a hooking means 88 having a height equal to or less than the thickness of the ring frame RF and capable of protruding or retracting from the holding surface 87 of the holding means 82. The frame adsorbing unit 84 and the wafer adsorbing unit 86 are connected to the articulated robot 81 so that they are connected to a suction unit such as a decompression pump or a vacuum ejector (not shown) so that the wafer WF or the ring frame RF can be adsorbed and held. It has become.
On the left side of the transfer means 8 are an outer edge position of the wafer WF, an orientation mark such as a V notch and an orientation flat (not shown) formed on the wafer WF, a circuit pattern, a street or an outer edge and an inner edge position of the ring frame RF, a ring Detection means 89 is provided that includes an optical sensor, an imaging device, or the like that can detect the V notch RF3 and the like provided on the outer periphery of the frame RF.

  The sticking means 9 includes a support shaft 91 that supports the original fabric RS in which the adhesive sheet AS is temporarily attached to one surface of the strip-like release sheet RL, as shown in the view from the AR direction indicated by reference numeral AA in FIG. A release plate 92 that folds the release sheet RL and peels the adhesive sheet AS, a pressing roller 93 as a pressing means that is peeled and affixed by bringing the adhesive sheet AS into contact with the wafer WF, and a rotation motor as a drive device A driving roller 95 that is rotationally driven by 94, a pinch roller 96 that sandwiches the release sheet RL with the drive roller 95, and a recovery roller 97 that recovers the release sheet RL.

  In the case of the present embodiment, a peeling means 12 for peeling the protective sheet PS attached to the wafer WF and an unnecessary member storage box (not shown) for collecting the peeled protective sheet PS are provided. Is not an essential requirement of the present invention, and detailed description thereof is omitted. Incidentally, as the peeling means 12, for example, those described in the prior art of peeling devices such as Japanese Patent Application No. 2008-285288 and Japanese Patent Application No. 2011-55508 can be exemplified, and the protective member PS is stored and collected as an unnecessary member storage box. It is not limited at all if possible.

In the sheet sticking apparatus 1 described above, a procedure for sticking the adhesive sheet AS to the wafer WF and the ring frame RF will be described.
First, as shown in the diagram indicated by the symbol AA in FIG. 1, the original fabric RS is set on the sticking means 9, and the wafer cassette 21 is set at the position shown in FIG. Then, when the handle 35 is grasped and the housing case 30 is pulled from the transfer position to the supply position indicated by the two-dot chain line or the one-dot chain line in FIG. 1, the urging means 40 drives the linear motor 41, and FIG. As shown by the middle two-dot chain line, the urging plate 43 is moved to the left end. Next, the operator supplies an arbitrary number of ring frames RF vertically in the housing case 30. At this time, the operator can supply the ring frame RF into the housing case 30 while putting the hand or finger in the opening RF4 of the ring frame RF and suspending the ring frame RF. At the same time, it can be supplied into the housing case 30 with one hand. When the operator presses a supply completion switch (not shown), the posture maintaining means 50 drives the rotation motor 51 to drive the endless belt 54 in the clockwise direction in FIG. 2, and the urging means 40 causes the linear motor 41 to move. Driven to move the urging plate 43 to the right as shown by the solid line in FIG. As a result, the ring frame RF accommodated in the accommodation case 30 is moved rightward as a whole, the ring frame RF located at the right end and the right surface portion 34 are in close contact with each other, and the attitude of the ring frame RF is Maintained. Thereafter, the operator moves the storage case 30 to the transfer position.

Then, after the transfer means 8 drives the articulated robot 81, the holding means 82 is inserted into the wafer cassette 21 and the wafer suction portion 86 is brought into contact with the wafer WF, then the suction means (not shown) is driven, The wafer WF is attracted and held, and the wafer WF is moved to a position where it can be detected by the detection means 89. Next, the detection means 89 detects the outer edge position of the wafer WF and a V notch position (not shown), and these data are output to a control means (not shown). When various data of the wafer WF are input to the control means (not shown), the center position of the wafer WF is calculated, and the transfer means 8 drives the articulated robot 81, and the center position of the wafer WF and the V notch position (not shown) Is placed on the support surface 71 of the table 72 waiting at a position indicated by a two-dot chain line in FIG. When the wafer WF is placed, the support unit 7 drives a suction unit (not shown) to hold the wafer WF by suction.
Further, the transfer means 8 drives the articulated robot 81, and as shown in FIGS. 2B and 3, the holding means 82 is inserted into the recess 34A of the right surface portion 34, and is positioned at the right end of the housing case 30. After the frame suction portion 84 is brought into contact with the right surface of the ring frame RF, the suction means (not shown) is driven to hold the ring frame RF located at the right end by suction. Next, the transfer means 8 drives the articulated robot 81 and pulls the ring frame RF located at the right end upward. At this time, since the ring frame RF located at the right end is pressed against the right surface portion 34 by the biasing means 40 and the posture maintaining means 50, the ring frame RF may not be pulled out only by the suction force of only the frame suction portion 84. Since the hooking means 88 is hooked on the opening RF4 of the ring frame RF, such inconvenience does not occur. Further, when the ring frame RF positioned at the right end is pulled out, the ring frame RF adjacent to the left side of the ring frame RF positioned at the right end may be pulled out and scattered at the same time, but there is a holding means 38. Therefore, such inconvenience does not occur. As shown in FIG. 2C, even if the ring frame RF positioned at the right end may not be in close contact with the right surface portion 34 even by the rotational drive of the endless belt 54, suction by the frame suction portion 84 is possible. It is detected that the pressure due to the pressure does not drop, and the holding means 82 can be rotated clockwise as shown in FIG. When the ring frame RF located at the right end is pulled out of the housing case 30, the ring frame RF adjacent to the left side of the ring frame RF located at the right end is moved to the right surface portion 34 by the urging means 40 and the posture maintaining means 50. Pressed against.
Thereafter, the transfer means 8 drives the articulated robot 81 to move the ring frame RF to a position where it can be detected by the detection means 89, and performs the same operation as when the detection means 89 is the wafer WF described above. The ring frame is set so that the center position of the opening RF4 of the frame RF matches the center position of the wafer WF supported on the table 72, and the V notch RF3 of the ring frame RF faces a predetermined direction. The RF is placed on the support surface 71 of the table 72. When the ring frame RF is placed, the support means 7 drives a suction means (not shown) to hold the ring frame RF by suction.

  Next, the support means 7 drives the linear motor 73 to move the table 72 to the left, and when the detection means (not shown) detects that the wafer WF and the ring frame RF have reached predetermined positions, In synchronization with the movement, the sticking means 9 drives the rotation motor 94 to feed out the original fabric RS. As a result, the adhesive sheet AS is peeled off by the release plate 92, and the peeled adhesive sheet AS is pressed against and adhered to the wafer WF and the ring frame RF by the pressing roller 93. As shown by the solid line in FIG. WK is formed. When the wafer support WK is thus formed, it is detected by a detection means (not shown), and the support means 7 stops the linear motor 73. Then, the transfer means 8 drives the articulated robot 81, lifts the wafer support WK upside down, and transfers it to a delivery means (not shown) having a suction support surface facing the support surface 71. The transfer means supports the wafer. The body WK is lowered and placed on the support surface 71 again. As a result, the wafer support WK is supported on the support surface 71 with the protective sheet PS facing upward. Next, the peeling means 12 affixes a peeling tape (not shown) to the protective sheet PS, and pulls the peeling tape to peel the protective sheet PS from the wafer WF (for details, see the prior art of the peeling device). When the protective sheet PS is peeled off from the wafer WF, the transfer means 8 drives the articulated robot 81, contacts the peeled protective sheet PS with the wafer suction part 86 and drives the suction means (not shown), and the protective sheet The PS is sucked and held and discarded in an unnecessary member storage box (not shown). Then, the protective sheet PS is peeled off, and the wafer support WK is transported to another process by a transport means (not shown), the table 72 returns to the position indicated by the two-dot chain line in FIG. 1, and the same operation is repeated thereafter.

  According to the embodiment as described above, the operator can easily supply the ring frame RF to the housing case 30, and even if the ring frame RF is a large ring frame RF, the operator can maintain the vertical stacking posture without resisting gravity. It is possible to supply a plurality of ring frames to the receiving means with one hand at a time.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

For example, in the above-described embodiment, the ring frame RF is exemplified as the frame member, and the case where the frame member is housed in the housing case 30 in a state where the hand or finger is suspended in the opening RF4 of the ring frame RF has been described. Even if it is a frame member that does not have an opening, when the position of the frame member deviates from the center of gravity, the frame member is oriented along the direction in which the frame member is pulled by gravity (the orientation that does not resist gravity). It is sufficient if the frame member can be supplied to the housing means.
Furthermore, only the ring frame RF may be placed on the table 72, and the adhesive sheet AS may be attached to the ring frame RF.
Further, the biasing plate 43 is configured to be driven by an endless belt similar to the endless belt 54 of the posture maintaining means 50, or to be configured to be pulled by an elastic member such as a spring so as to bias the ring frame RF. It may be.
Further, as shown by a two-dot chain line in FIG. 1, a holding portion 61 having a frame suction portion 60 capable of sucking and holding the ring frame RF located at the right end of the housing case 30, and a ring frame RF held by the holding portion 61. A V-notch detecting means 62 capable of detecting the V-notch RF3 and a rotation motor as a drive device provided with the holding portion 61 movably in the left-right direction and capable of rotating the ring frame RF in the plane of the ring frame RF. The transfer means 6 provided with 63 and the linear motion motor 64 as a drive device which can raise / lower the rotation motor 63 to an up-down direction may be provided. Then, the delivery means 6 drives the rotation motor 63, the ring frame RF positioned at the right end of the housing case 30 is sucked and held by the holding portion 61, the linear motion motor 64 is driven, and the ring frame RF positioned at the right end is driven. Pull out. Thereafter, the delivery means 6 drives the rotation motor 63 to rotate the ring frame RF by a predetermined angle, and after the V notch detection means 62 detects the position of the V notch, the V notch is set at a predetermined position. The rotation motor 63 is stopped and positioned. Then, the transfer means 8 may drive the articulated robot 81 so that the ring frame RF positioned by the delivery means 6 is held by the holding means 82.

  In addition, the type and material of the adherend and the adhesive sheet AS in the present invention are not particularly limited. For example, the adhesive sheet AS has an intermediate layer between the base sheet and the adhesive layer, Three or more layers such as having a cover layer on the upper surface of the material sheet, and further, a so-called double-sided adhesive sheet that can peel the base material sheet from the adhesive layer may be used. The adhesive sheet may have a single layer or a multilayer intermediate layer, or may be a single layer or a multilayer without an intermediate layer. Furthermore, the adherend may be a semiconductor wafer, and the adhesive sheet AS may be a protective sheet, a dicing tape, a die attach film, or the like. At this time, the semiconductor wafer can be exemplified by a silicon semiconductor wafer, a compound semiconductor wafer, etc., and the adhesive sheet AS to be attached to such a semiconductor wafer is not limited to them, and any use such as any sheet, film, tape, An adhesive sheet having a shape can be applied. Further, the adherend may be a substrate of an optical disk, and the adhesive sheet AS may have a resin layer constituting a recording layer. As described above, as the adherend, not only other adherends such as a glass plate, a steel plate, earthenware, a wooden plate, or a resin plate, but also members and articles in any form can be targeted.

  The drive device in the embodiment employs an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition, it is possible to adopt a combination of them directly or indirectly (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 1 Sheet sticking apparatus 3 Frame accommodation means 7 Support means 8 Transfer means 9 Sticking means 38 Pressing means 40 Energizing means 50 Posture maintenance means AS Adhesive sheet RF Ring frame (frame member)

Claims (1)

Frame accommodating means capable of accommodating a plurality of frame members integrated with the adherend via an adhesive sheet;
A support means for supporting at least the frame member of the frame member and the adherend;
Transfer means for taking out the frame member from the frame accommodation means and transferring it to the support means;
A frame member supported by the support means, or a sticking means for sticking the adhesive sheet to the frame member and an adherend,
The frame accommodation unit is configured to be accommodated by placing the frame member vertically, and includes a posture maintaining unit that moves a lower part of the frame member in one direction.

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