JP5964785B2 - High frequency transmission line - Google Patents

Description

  The present invention relates to a high-frequency transmission technique, and more particularly to a high-frequency transmission line for propagating an input high-frequency signal from the uppermost layer to the lowermost layer of a multilayer wiring board.

  In a high-frequency transmission line that propagates an input high-frequency signal vertically from the top layer to the bottom layer in a multilayer wiring board in which conductor layers and insulating layers are alternately stacked, the transmission loss and reflection loss of the high-frequency signal should be minimized. There is a need to reduce it.

Conventionally, as such a high-frequency transmission line, a technique has been proposed in which a high-frequency signal via is formed in a stepped manner from the uppermost layer to the lowermost layer of a multilayer wiring board and propagated (see, for example, Non-Patent Document 1).
8A and 8B are explanatory views showing a configuration of a conventional high-frequency transmission line, in which FIG. 8A is a top view, FIG. 8B is a cross-sectional view taken along line bb in FIG. 8A, and FIG. Is a bottom view, and FIG. 8D is a sectional view taken along the line dd of FIG. 8B. FIG. 9 is an explanatory diagram showing the structure of the high-frequency signal via shown in FIG.

  In the high-frequency transmission line 50, a high-frequency signal via 52 as shown in FIG. 9 is formed in a step shape on the multilayer wiring board 51, and the uppermost upper conductor pad 53 A and the lowermost layer are formed via the high-frequency signal via 52. The lower conductor pad 53B is connected.

In the uppermost layer, a linear high-frequency signal line 54A is connected to the upper conductor pad 53A, and the upper anti-pad region 55A is sandwiched between the upper conductor pad 53A and the upper high-frequency signal line 54A. A ground plane 56A is formed.
In the lowermost layer, a linear lower high-frequency signal line 54B is connected to the lower conductor pad 53B, and a lower antipad region 55B is sandwiched between the lower conductor pad 53B and the lower high-frequency signal line 54B. Thus, the lower ground plane 56B is formed.

Y. C. Lee, et al, "A Novel CPW-to-Stripline Vertical Via Transition Using a Stagger Via Structure and Embedded Air Cavities for V-band LTCC SiP Applications", APMC2005.

According to the above-described prior art, since the high-frequency signal via 52 is formed in a staircase pattern from the uppermost layer to the lowermost layer in the multilayer wiring board 51, the high-frequency signal line is bent vertically in a small region. However, it is easy to generate unnecessary radiation at the bent portion of such a high-frequency signal line, and it is possible to suppress a certain amount of radiation by increasing the effective bending radius at the bent portion. There is a problem that the radiation component of the signal cannot be completely removed, and the passage loss and reflection loss increase.
In addition, in order to form the high-frequency signal via 52 in a stepped manner from the uppermost layer to the lowermost layer of the multilayer wiring board 51, precise processing is required and also the volume of the multilayer wiring board is increased. There was a problem of causing it.

  The present invention is to solve such a problem, and provides a high-frequency transmission line capable of propagating a high-frequency signal with a small passage loss and reflection loss at a bent portion from the substrate plane direction to the vertical direction. It is an object.

  In order to achieve such an object, a high-frequency transmission line according to the present invention includes a multilayer wiring board in which conductor layers and insulating layers are alternately stacked, and the inside of the multilayer wiring board vertically from the top layer to the bottom layer. A high-frequency signal via formed in a penetrating manner, formed in a substantially circular shape in plan view in the uppermost layer, and connected to an upper end of the high-frequency signal via, and formed in a linear shape in the uppermost layer An upper anti-pad region in which an upper high-frequency signal line whose tip is connected to the upper conductor pad and a conductor layer formed on the uppermost layer and connected to a ground potential is selectively removed. An upper ground plane formed around the upper conductor pad and the upper high-frequency signal line, and a lower portion formed in a substantially circular shape in plan view on the lowermost layer and connected to the lower end of the high-frequency signal via A body pad, a lower high-frequency signal line formed linearly on the lowermost layer and having a tip connected to the lower conductor pad, and a conductor layer formed on the lowermost layer and connected to the ground potential. A lower ground plane formed around the lower conductor pad and the lower high-frequency signal line across the lower antipad region from which the conductor layer is selectively removed, and formed in the multilayer wiring board, The upper ground plane and the lower ground plane, and ground vias connecting the conductor layers stacked between the ground planes, and a thick insulator having dielectric properties, An upper insulator block disposed on a surface, and the upper insulator block includes the upper conductor pad across the upper antipad region. Compared with the distraction capacitance component generated along the extension direction of the upper high-frequency signal line among the capacitance components generated between the upper ground plane and the capacitance component, the generation occurs along the orthogonal direction perpendicular to the extension direction. In order to increase the orthogonal capacitance component, two side regions located on both sides of the upper antipad region sandwiching the upper conductor pad in the orthogonal direction are covered.

  Also, in one configuration example of the high-frequency transmission line according to the present invention, the upper insulator block includes one upper insulator block that collectively covers the two side regions across the upper conductor pad.

  Further, in one configuration example of the high-frequency transmission line according to the present invention, the upper insulator block includes two upper insulator blocks that individually cover the two side regions.

  Also, in one configuration example of the high-frequency transmission line according to the present invention, the upper insulator block includes a boundary point where the upper high-frequency signal line intersects an outer peripheral edge of the upper antipad region and the upper conductor in the extending direction. Let the front-end | tip part of a pad be the edge in the said distraction direction.

  Also, in one configuration example of the high-frequency transmission line according to the present invention, a lower insulation is formed of a thick insulator having a dielectric property instead of the upper insulator block, and is disposed on the surface of the lower antipad region. A body block, and the lower insulator block has a capacitance component generated between the lower conductor pad and the lower ground plane across the lower antipad region in the extending direction of the lower high-frequency signal line. In order to increase the orthogonal capacitance component generated along the orthogonal direction orthogonal to the extension direction as compared with the extended capacitance component generated along the extension anti-capacitance component, It arrange | positions so that two side part area | regions located on the both sides which pinch | interpose in an orthogonal direction may be covered.

  Also, one configuration example of the high-frequency transmission line according to the present invention includes a lower insulator block made of a thick insulator having dielectric properties and disposed on a surface of the lower antipad region, and the lower insulator. The block is a capacitance component generated along the extension direction of the lower high-frequency signal line among the capacitance components generated between the lower conductor pad and the lower ground plane across the lower antipad region. In comparison, in order to increase the orthogonal capacitance component generated along the orthogonal direction orthogonal to the extension direction, 2 located on both sides of the lower antipad region sandwiching the lower conductor pad in the orthogonal direction. It is arranged so as to cover one side region.

  Further, in one configuration example of the high-frequency transmission line according to the present invention, the ground via includes a plurality of ground vias arranged so as to surround the high-frequency signal via, and the pseudo-coaxial line with respect to the high-frequency signal via Form a structure.

  According to the present invention, the capacitance component generated between the upper conductor pad and the ground potential across the upper antipad region is compared with the extension capacitance component generated along the extension direction of the upper high-frequency signal line. Thus, the orthogonal capacitance component generated along the orthogonal direction orthogonal to the extending direction increases. Therefore, anisotropy occurs in the electric field density in the upper conductor pad, and electric field lines in the orthogonal direction are concentrated as compared with the extending direction, and the electric field density is increased. As a result, unnecessary radiation is suppressed, so that it is possible to efficiently couple the electromagnetic fields of the high-frequency signal propagating in the distraction direction and the high-frequency signal propagating in the vertical direction with the generation of unnecessary radiation suppressed. The high-frequency signal can be propagated from the uppermost layer to the lowermost layer of the multilayer wiring board with a small passage loss and reflection loss at the bent portion.

It is a top view which shows the structure of the high frequency transmission line concerning 1st Embodiment. It is II-II sectional drawing of FIG. FIG. 3 is a sectional view taken along line III-III in FIG. 1. It is the IV-IV plane figure of FIG. 2 and FIG. It is a top view which shows the other structure of the high frequency transmission line concerning 1st Embodiment. It is a top view which shows the other structure of the high frequency transmission line concerning 1st Embodiment. It is a bottom view which shows the structure of the high frequency transmission line concerning 2nd Embodiment. It is explanatory drawing which shows the structure of the conventional high frequency transmission line. It is explanatory drawing which shows the structure of the conventional high frequency transmission line.

Next, embodiments of the present invention will be described with reference to the drawings.
[First Embodiment]
First, with reference to FIGS. 1-4, the high frequency transmission line 10 concerning the 1st Embodiment of this invention is demonstrated. FIG. 1 is a top view showing the configuration of the high-frequency transmission line according to the first embodiment. 2 is a cross-sectional view taken along the line II-II in FIG. 3 is a cross-sectional view taken along the line III-III in FIG. FIG. 4 is a cross-sectional view taken along the line IV-IV in FIGS. 2 and 3.

  The high-frequency transmission line 10 according to this embodiment is configured such that an input high-frequency signal is transmitted from the uppermost layer (the upper surface of the substrate) to the lowermost layer (the substrate) in the multilayer wiring substrate 11 in which the conductor layers 11M and the insulating layers 11P are alternately stacked. This is a high-frequency transmission line for propagating vertically to the bottom surface. The high-frequency transmission line 10 is suitable for an electronic device or an electronic component in which a high-speed electrical signal of 10 GHz to 100 GHz or less propagates through the multilayer wiring board 11, for example.

  As shown in FIGS. 1 to 4, the high-frequency transmission line 10 mainly includes a multilayer wiring board 11, a high-frequency signal via 12, an upper conductor pad 13A, an upper high-frequency signal line 14A, an upper ground plane 16A, a lower conductor pad 13B, It comprises a lower high-frequency signal line 14B, a lower ground plane 16B, a ground via 17, and upper insulator blocks 18A and 18B.

The high-frequency signal via 12 is a via made of a conductor such as a metal and vertically penetrating through the multilayer wiring board 11 from the uppermost layer to the lowermost layer.
The upper conductor pad 13 </ b> A is a conductor pad made of a conductor such as metal, formed in a substantially circular shape in plan view on the uppermost layer, and connected to the upper end of the high-frequency signal via 12.

The upper high-frequency signal line 14A is a high-frequency signal line that is made of a conductor such as metal, is formed in a linear shape on the uppermost layer, and has a tip connected to the upper conductor pad 13A.
The upper ground plane 16A is formed of a conductor layer such as a metal connected to the ground potential and formed on the uppermost layer, and the conductor layer is selectively removed in a substantially annular shape in plan view with the upper conductor pad 13A as a center. The grounding conductor is formed around the upper conductor pad 13A and the upper high-frequency signal line 14A with the antipad region 15A interposed therebetween.

The lower conductor pad 13 </ b> B is a conductor pad made of a conductor such as a metal, formed in a substantially circular shape in plan view in the lowermost layer, and connected to the lower end of the high-frequency signal via 12.
The lower high-frequency signal line 14B is a high-frequency signal line that is made of a conductor such as metal, is formed in a linear shape in the lowermost layer, and has a tip connected to the lower conductor pad 13B.

The lower ground plane 16B is formed of a conductive layer such as a metal connected to the ground potential and formed in the lowermost layer, and the conductive layer is selectively removed in a substantially circular shape in plan view with the lower conductive pad 13B as a center. A grounding conductor formed around the lower conductor pad 13B and the lower high-frequency signal line 14B with the antipad region 15B interposed therebetween.
The ground via 17 is made of a conductor such as metal, and is formed in the multilayer wiring board 11, and includes an upper ground plane 16A and a lower ground plane 16B, and each conductor layer 11M stacked between the ground planes 16A and 16B. Is a via.

  The upper insulator blocks 18A and 18B are made of a thick (substantially rectangular parallelepiped) insulator having dielectric properties, and are arranged on the surface of the upper antipad region 15A. Specific examples of the upper insulator blocks 18A and 18B include a dielectric insulating substrate made of a ceramic substrate such as alumina or aluminum nitride, or a single crystal substrate such as sapphire. As the relative permittivity of the upper insulator blocks 18A and 18B, a certain effect can be obtained if the upper insulator blocks 18A and 18B have a relative permittivity higher than that of the region where the upper insulator blocks 18A and 18B are not arranged.

  The upper insulator blocks 18A and 18B are formed by an extended capacitance component CXA generated along the extension direction X among the capacitance components generated between the upper conductor pad 13A and the ground potential across the upper antipad region 15A. Compared to the above, the orthogonal capacitance component CA (upper insulator block 18A side) and the orthogonal capacitance component CB (upper insulator block 18B side) generated along the orthogonal direction Y orthogonal to the extending direction X are increased. Therefore, the upper antipad region 15A is arranged so as to cover two side regions located on both sides of the upper conductor pad 13A in the orthogonal direction Y.

  As shown in FIG. 2, the upper high-frequency signal line 14A formed in the extending direction X along the substrate plane is connected to the high-frequency signal via 12 formed in the vertical direction Z perpendicular to the substrate plane by the upper conductor pad 13A. In the high frequency transmission line, the propagation direction of the high frequency signal is bent from the extending direction X to the vertical direction Z. Therefore, unnecessary radiation of the high-frequency signal is generated at the bent portion of the high-frequency transmission line, and the passage loss and the reflection loss are increased.

According to the present invention, such unnecessary radiation can be suppressed by the anisotropy of the electric field density in the upper conductor pad 13A, whereby electromagnetic waves between a high frequency signal propagating in the extending direction X and a high frequency signal propagating in the vertical direction Z The focus is on the efficient coupling of the fields.
As a specific method for generating such anisotropy of the electric field density, the upper insulator blocks 18A and 18B are covered so as to cover two side regions located on both sides of the upper conductor pad 13A in the orthogonal direction Y. Are arranged respectively.

  As a result, the density of electric lines of force extending from the upper conductor pad 13A to the upper ground plane 16A increases, and is generated between the upper conductor pad 13A and the upper ground plane 16A at the ground potential across the upper antipad region 15A. Among the capacitance components to be transmitted, the orthogonal capacitance component generated along the orthogonal direction Y orthogonal to the extension direction X as compared with the extension capacitance component CXA generated along the extension direction X of the upper high-frequency signal line 14A CA and CB become large. Therefore, anisotropy occurs in the electric field density in the upper conductor pad 13A, and electric field lines in the orthogonal direction Y are concentrated as compared with the extending direction X, and the electric field density is increased.

In FIG. 2, the electric field strength distribution 20 indicates the electric field strength distribution (simulation result) in the upper conductor pad 13A when the upper insulator blocks 18A and 18B are arranged, and the electric field strength distribution 21 indicates the upper insulator block 18A. , 18B are not shown, the electric field intensity distribution (simulation result) is shown.
Since the unnecessary radiation is suppressed by arranging the upper insulator blocks 18A and 18B in this way, the high-frequency signal propagating in the distraction direction X and the vertical direction Z in a state in which the generation of unnecessary radiation is suppressed. Thus, it is possible to efficiently couple the electromagnetic field with the high-frequency signal propagating to the substrate, and to propagate the high-frequency signal with a small passage loss and reflection loss at the bent portion from the substrate plane direction to the vertical direction.

  Further, in the present embodiment, as the upper insulator blocks 18A and 18B for providing the electric field density anisotropy in the upper conductor pad 13A, a dielectric insulator having a thick dielectric, for example, a substantially rectangular parallelepiped. Since it is realized by the substrate, the upper insulator blocks 18A and 18B can be formed by an extremely simple process of disposing or forming an insulator on the surface of the upper antipad region 15A, thereby reducing the cost of the high-frequency transmission line. Can be realized.

  At this time, by making the upper insulator blocks 18A and 18B thick, among the electric lines of force extending from the upper conductor pad 13A to the upper ground plane 16A, the electric lines of force extending in a parabolic shape above the upper antipad region 15A. The density can also be increased, whereby the orthogonal capacitance components CA and CB are increased, and the anisotropy of the electric field density can be given more effectively. Since the density of the electric field lines extending in a parabolic shape above the upper antipad region 15A decreases according to the height from the upper antipad region 15A, the thickness of the upper insulator blocks 18A and 18B depends on the electric force. The thickness may be an appropriate thickness that can be expected to increase the line density.

  In the present embodiment, a plurality of ground vias 17 may be formed so as to surround the high-frequency signal vias 12, and a pseudo coaxial line structure may be formed for the high-frequency signal vias 12. Thereby, as shown in FIG. 4, the electric field strength distribution in the pseudo coaxial line structure has a circular shape centered on the high-frequency signal via 12 on the substrate plane without causing distortion such as an ellipse. It becomes substantially equal to the electric field distribution intensity of the propagating high-frequency signal. This means that only the fundamental mode of the pseudo coaxial line structure is excited and propagated, that is, it is well coupled with the fundamental mode.

  When the fundamental mode is not well coupled, the electric field strength distribution in the pseudo-coaxial line structure shown in FIG. 4 is not circular, but the center fluctuates back and forth with respect to the extending direction X of the upper high-frequency signal line 14A. The high-frequency signal via 12 propagates so as to meander in the vertical direction Z. At this time, if the electric field overlaps with the ground plane in the inner layer of the multilayer wiring substrate 11, the energy of the high-frequency signal is absorbed by the ground potential according to the amount of the overlap, so that stable propagation cannot be obtained.

  On the other hand, according to the present embodiment, as described above, since it is well coupled with the fundamental mode of the pseudo coaxial line structure, the line length of the pseudo coaxial line structure, that is, the upper conductor pad 13A and the lower conductor pad 13B. Regardless of the line length of the high-frequency signal via 12 connected to the high-frequency signal, the high-frequency signal can be stably propagated with low loss and low reflection.

  In the present embodiment, since the power supply layer and the low-speed signal layer can be simultaneously formed by increasing the number of layers of the multilayer wiring board 11, a multi-functional multilayer wiring board is not dedicated to the high-frequency signal line. It can also be provided.

  1 to 4 described above, an example in which two upper insulator blocks 18A and 18B that individually cover the respective side regions are arranged in two side regions sandwiching the upper conductor pad 13A is described as an example. However, it may be realized by one upper insulator block 18 that collectively covers these two side regions across the upper conductor pad 13A.

FIG. 5 is a top view showing another configuration of the high-frequency transmission line according to the first embodiment. Here, the upper insulator block 18 is formed in which the upper insulator blocks 18A and 18B are connected together on the upper conductor pad 13A. At this time, although the upper conductor pad 13A is covered with the upper insulator block 18, the electric lines of force extending upward from the upper conductor pad 13A are hardly involved in the electric field density anisotropy. The same as in the case of the upper insulator blocks 18A and 18B.
Thereby, compared with the case where two upper insulator blocks 18A and 18B are formed, the process can be further simplified, and further cost reduction of the high-frequency transmission line can be realized.

  Further, in view of giving the anisotropy of the electric field density in the upper conductor pad 13A by increasing the density of electric lines of force extending from the upper conductor pad 13A in the orthogonal direction Y using the upper insulator block 18, Regarding the width in the extending direction X of the upper insulator block 18, as shown in FIG. 5, if the width of the upper conductor pad 13A in the extending direction X, specifically, the diameter of the upper conductor pad 13A, The density of the electric lines of force can be increased efficiently with the narrow upper conductor pads 13A.

On the other hand, the width of the upper insulator block 18 in the extending direction X may be wider than the width of the upper conductor pad 13A. FIG. 6 is a top view showing another configuration of the high-frequency transmission line according to the first embodiment.
Here, in the extending direction X, an upper insulator block 18 having a width covering the upper conductor pad 13A and the upper high-frequency signal line 14A formed in the upper antipad region 15A is formed. That is, the upper insulator block 18 is configured such that the boundary point B1 where the upper high-frequency signal line 14A intersects the outer peripheral edge of the upper antipad region 15A and the end B2 of the upper conductor pad 13A in the extending direction X are The edge.

  Thereby, not only the upper conductor pad 13A but also the density of electric lines of force extending from the upper high-frequency signal line 14A to the upper ground plane 16A can be increased, and the anisotropy of the electric field density in the upper conductor pad 13A can be made more effective. Can get to. At this time, when the upper insulator blocks 18A and 18B are disposed on the upper high-frequency signal line 14A outside the upper antipad region 15A, the characteristic impedance of the upper high-frequency signal line 14A changes and reflection loss occurs. The boundary point B1 is good.

  On the other hand, in the upper insulator block 18, the end opposite to the end on the boundary point B1 side is preferably up to the tip B2 of the upper conductor pad 13A in the extending direction X in FIG. When the upper insulator block 18 protrudes above the upper antipad region 15A beyond the tip B2, the line of electric force extending from the upper conductor pad 13A to the upper ground plane 16A along the extending direction X is projected by the protruding portion. This is because the density increases. Therefore, the anisotropy of the electric field density in the upper conductor pad 13A is more effectively achieved by setting the end portion of the upper insulator block 18 opposite to the end portion on the boundary point B1 side as the tip end portion B2. Can be obtained.

  In the upper insulator block 18, the position of the end opposite to the end on the boundary point B1 side is the density of the electric lines of force along the orthogonal direction Y and the electric force extending along the extending direction X. You may determine by balance with the density of a line | wire. The density of the electric field lines extending along the extending direction X is smaller than the density of the electric field lines along the orthogonal direction Y, and a certain degree of anisotropy can be given to the electric field density in the upper conductor pad 13A. For example, the upper insulator block 18 can protrude beyond the boundary point B2 toward the upper antipad region 15A.

Further, if the width of the upper insulator block 18 in the orthogonal direction is equal to or larger than the diameter of the upper antipad region 15A, the anisotropy of the electric field density in the upper conductor pad 13A can be more effectively given. In the above description, the case where the upper insulator block 18 has a substantially rectangular parallelepiped shape and has a rectangular shape in plan view has been described as an example. However, the present invention is not limited to this. Any other shape may be used as long as the shape can be covered over the upper ground plane 16A.
5 and 6 can be applied not only to the upper insulator block 18 but also to the upper insulator blocks 18A and 18B.

[Second Embodiment]
Next, with reference to FIG. 7, the high frequency transmission line 10 concerning the 2nd Embodiment of this invention is demonstrated. FIG. 7 is a bottom view showing the configuration of the high-frequency transmission line according to the second embodiment.
In the first embodiment, the case where the upper insulator blocks 18A and 18B are arranged on the surface of the upper antipad region 15A has been described as an example. However, as shown in FIG. The lower insulator blocks 18C and 18D may be arranged in the same manner as the insulator blocks 18A and 18B.

  In FIG. 7, lower insulator blocks 18C and 18D are made of a thick (substantially rectangular parallelepiped) insulator having dielectric properties, and are disposed on the surface of the lower antipad region 15B. Specific examples of the lower insulator blocks 18C and 18D include a dielectric insulating substrate made of a ceramic substrate such as alumina or alumina nitride or a single crystal substrate such as sapphire. As the relative permittivity of the lower insulator blocks 18C and 18D, a certain effect can be obtained if the lower insulator blocks 18C and 18D have a relative permittivity higher than that of the region where the lower insulator blocks 18C and 18D are not arranged.

  The lower insulator blocks 18C and 18D are generated along the extending direction X of the lower high-frequency signal line 14B out of the capacitance component generated between the lower conductor pad 13B and the ground potential across the lower antipad region 15B. Compared with the distracting electric capacity component CXB, the orthogonal electric capacity component CC (lower insulator block 18C side) and the orthogonal electric capacity component CD (lower insulating block) generated along the orthogonal direction Y orthogonal to the extending direction X. 18D side) is enlarged on both sides of the lower conductor pad 13B and at one and the other positions in the orthogonal direction Y. Note that the extending directions of the upper high-frequency signal line 14A and the lower high-frequency signal line 14B may be different.

  As a result, the density of electric lines of force extending from the lower conductor pad 13B to the lower ground plane 16B increases, and is generated between the lower conductor pad 13B and the lower ground plane 16B that is the ground potential across the lower antipad region 15B. Among the capacitance components to be transmitted, the orthogonal capacitance component generated along the orthogonal direction Y orthogonal to the extension direction X as compared with the extension capacitance component CXB generated along the extension direction X of the lower high-frequency signal line 14B CC and CD increase. Therefore, anisotropy occurs in the electric field density in the lower conductor pad 13B, and electric field lines in the orthogonal direction Y are concentrated compared to the extending direction X, and the electric field density is increased.

Therefore, since the unnecessary radiation is suppressed by arranging the lower insulator blocks 18C and 18D, the high-frequency signal propagating in the extending direction X and the vertical direction Z are propagated while the generation of unnecessary radiation is suppressed. The electromagnetic field with the high frequency signal can be efficiently coupled, and the high frequency signal can be propagated with a small passage loss and reflection loss at the bent portion from the substrate plane direction to the vertical direction.
As for the lower insulator blocks 18C and 18D, various configurations for the upper insulator blocks 18A and 18B and further the upper insulator block 18 can be applied in the same manner as described above.

[Extended embodiment]
The present invention has been described above with reference to the embodiments, but the present invention is not limited to the above embodiments. Various changes that can be understood by those skilled in the art can be made to the configuration and details of the present invention within the scope of the present invention. In addition, each embodiment can be implemented in any combination within a consistent range.

  DESCRIPTION OF SYMBOLS 10 ... High frequency transmission line, 11 ... Multilayer wiring board, 11M ... Conductor layer, 11P ... Insulating layer, 12 ... High frequency signal via, 13A ... Upper conductor pad, 13B ... Lower conductor pad, 14A ... Upper high frequency signal line, 14B ... Lower High frequency signal line, 15A: upper antipad region, 15B: lower antipad region, 16A ... upper ground plane, 16B ... lower ground plane, 17 ... ground via, 18, 18A, 18B ... upper insulator block, 18C, 18D ... Lower insulator block, CA, CB, CC, CD: orthogonal capacitance component, CXA, CXB: distraction capacitance component.

Claims (7)

A multilayer wiring board in which conductor layers and insulating layers are alternately laminated;
A high-frequency signal via formed vertically through the multilayer wiring board from the uppermost layer to the lowermost layer;
An upper conductor pad formed in the uppermost layer in a substantially circular shape in plan view and connected to an upper end of the high-frequency signal via;
An upper high-frequency signal line formed linearly on the uppermost layer and having a tip connected to the upper conductor pad;
The uppermost layer is formed of a conductor layer connected to the ground potential, and the upper antipad region where the conductor layer is selectively removed is sandwiched between the upper conductor pad and the upper high-frequency signal line. The formed upper ground plane;
A lower conductor pad formed in a substantially circular shape in plan view on the lowermost layer and connected to a lower end of the high-frequency signal via;
A lower high-frequency signal line that is formed in a line shape in the lowermost layer and has a tip connected to the lower conductor pad,
The conductor layer is formed in the lowermost layer and is connected to the ground potential, and the lower conductor pad and the lower high-frequency signal line are surrounded by a lower antipad region where the conductor layer is selectively removed. A lower ground plane formed in
A ground via formed in the multilayer wiring board for connecting the upper ground plane and the lower ground plane and the conductor layers stacked between the ground planes;
An upper insulator block made of a thick insulator having dielectric properties and disposed on the surface of the upper antipad region;
The upper insulator block includes an extension generated along the extension direction of the upper high-frequency signal line among the capacitance components generated between the upper conductor pad and the upper ground plane across the upper antipad region. Both sides of the upper antipad region sandwiching the upper conductor pad in the orthogonal direction in order to increase the orthogonal capacitance component generated along the orthogonal direction orthogonal to the extension direction compared to the electrical capacitance component A high-frequency transmission line, characterized in that it is arranged so as to cover two side regions located in the area. In the high frequency transmission line according to claim 1,
The high-frequency transmission line according to claim 1, wherein the upper insulator block includes one upper insulator block that collectively covers the two side regions across the upper conductor pad. In the high frequency transmission line according to claim 1,
The high-frequency transmission line according to claim 1, wherein the upper insulator block includes two upper insulator blocks that individually cover the two side regions. In the high frequency transmission line according to any one of claims 1 to 3,
The upper insulator block has a boundary point where the upper high-frequency signal line intersects with an outer peripheral edge of the upper antipad region and a front end portion of the upper conductor pad in the extension direction as an edge in the extension direction. High-frequency transmission line characterized by In the high frequency transmission line according to any one of claims 1 to 4,
Instead of the upper insulator block, comprising a thick insulator having dielectric properties, comprising a lower insulator block disposed on the surface of the lower antipad region,
The lower insulator block includes an extension generated along a direction in which the lower high-frequency signal line extends out of a capacitance component generated between the lower conductor pad and the lower ground plane across the lower antipad region. Both sides of the lower antipad region sandwiching the lower conductor pad in the orthogonal direction in order to increase the orthogonal capacitance component generated along the orthogonal direction orthogonal to the extension direction compared to the capacitance component A high-frequency transmission line, characterized in that it is arranged so as to cover two side regions located in the area. In the high frequency transmission line according to any one of claims 1 to 4,
It is made of a thick insulator having dielectric properties, and includes a lower insulator block disposed on the surface of the lower antipad region,
The lower insulator block includes an extension generated along a direction in which the lower high-frequency signal line extends out of a capacitance component generated between the lower conductor pad and the lower ground plane across the lower antipad region. Both sides of the lower antipad region sandwiching the lower conductor pad in the orthogonal direction in order to increase the orthogonal capacitance component generated along the orthogonal direction orthogonal to the extension direction compared to the capacitance component A high-frequency transmission line, characterized in that it is arranged so as to cover two side regions located in the area. In the high frequency transmission line according to any one of claims 1 to 6,
The high-frequency transmission line according to claim 1, wherein the ground via includes a plurality of ground vias arranged side by side so as to surround the high-frequency signal via, and forms a pseudo coaxial line structure with respect to the high-frequency signal via.

Images