JP5919860B2 - Electronic component module and method for manufacturing the electronic component module - Google Patents

Description

  The present invention relates to an electronic component module that can be reduced in height by directly applying a conductive paste to a mounted electronic component, and a method for manufacturing the electronic component module.

  With the recent popularization of mobile devices, there is a significant demand for light and thin mobile devices. In addition, in order to increase the degree of freedom in designing portable devices, there is an increasing demand for lowering the height of electronic component modules used therefor. On the other hand, the influence on peripheral devices due to electric field leakage cannot be ignored, and a structure capable of obtaining a sufficient shielding effect is required.

  Therefore, in Patent Document 1, for example, a shield for an electronic device terminal having a non-conductive (insulating) adhesive layer on the surface of an electronic component mounted on a substrate and a sheet-like metal layer covering the non-conductive adhesive layer A structure is disclosed. The sheet-like metal layer is electrically connected to the ground terminal on the substrate via the conductive adhesive layer, and functions as a shield layer.

  In Patent Document 2, an electronic component is mounted on a circuit board, the mounted electronic component is sealed with a resin to form a sealing body, and a shield layer is formed by covering the surface of the sealing body with a metal film. A method for manufacturing a module component is disclosed. The ground electrode is exposed from the side surface of the circuit board, and the metal film and the ground electrode are brought into conduction on the side surface of the circuit board to form a shield layer.

JP 2009-081400 A JP 2010-080968 A

  However, Patent Document 1 has a problem in that the configuration of the sheet-like metal layer is complicated and it is difficult to suppress the manufacturing cost. Moreover, in patent document 2, there existed a problem that thickness increased by the part of a sealing body and it was difficult to make a module component low-profile.

  The present invention has been made in view of such circumstances, and an object thereof is to provide an electronic component module capable of reducing the height while maintaining a shielding effect and a method for manufacturing the electronic component module.

In order to achieve the above object, an electronic component module according to the present invention is an electronic component module in which one or more electronic components are mounted on one surface of a mounting board, and the top surface of the electronic component is insulated. And the ground electrode of the mounting substrate is exposed on the mounting surface or side surface of the electronic component of the mounting substrate, and is composed of any of conductive paste, anisotropic conductive paste, or anisotropic conductive film a film that is, the electronic component of the top and side, and characterized in that it comprises a metal film that covers the exposed surface of the ground electrode directly.

  In the above configuration, the metal film is formed by electrically connecting the ground electrode exposed on the mounting surface or side surface of the electronic component of the mounting substrate and the metal film directly formed on the top and side surfaces of the electronic component. While being able to function as a shield layer, a resin layer for sealing the electronic component is not required, so that the overall height of the electronic component module can be reduced.

  In the electronic component module according to the present invention, it is preferable that the ground electrode is exposed on a mounting surface of the electronic component of the mounting substrate.

  In the above configuration, since the ground electrode is exposed on the mounting surface of the electronic component on the mounting board, the ground electrode and the metal film can be electrically connected on the mounting surface of the electronic component on the mounting board. Can function as a shield layer.

  In the electronic component module according to the present invention, it is preferable that the ground electrode is exposed on a side surface of the mounting substrate.

  In the above configuration, since the ground electrode is exposed on the side surface of the mounting substrate, the ground electrode and the metal film can be electrically connected on the side surface of the mounting substrate, and the metal film can function as a shield layer. it can.

  In the electronic component module according to the present invention, the mounting board includes an external ground electrode on a surface opposite to the mounting surface of the electronic component, and the ground electrode is electrically connected to the external ground electrode. preferable.

  In the above configuration, the ground electrode is electrically connected to the external ground electrode provided on the surface opposite to the mounting surface of the electronic component via the via or the like, so that the degree of freedom of arrangement of the external ground electrode is increased, and the mother It is possible to reduce the area occupied by the electronic component module when connecting to the substrate.

  In the electronic component module according to the present invention, it is preferable that the mounting board includes one or more electronic components.

  In the above configuration, it is possible to avoid a short circuit during the formation of the metal film by incorporating an electronic component in the mounting substrate that has a loss of insulation when a metal film is provided on the top surface, such as having an electrode on the top surface. It becomes possible.

  In the electronic component module according to the present invention, it is preferable that the electronic component built in the mounting substrate is either a chip capacitor or a chip inductor.

  In the above configuration, since the electronic component built in the mounting substrate is either a chip capacitor or a chip inductor, the entire electronic component module can be reduced in size.

A method of manufacturing an electronic component module according to the present invention in order to achieve the above object, Ri tare implement one or more electronic components on one surface of the mounting board where the ground electrode formed therein, the top surface of the electronic component is a method of manufacturing an electronic component module that is isolated, on the mounting surface of the electronic component of the electronic component mounting surface or aggregate substrate of the mounting board are arranged in the mounting substrate, a step of mounting a plurality of electronic components, the top surface of the mounted electronic components, side and the steps of applying a conductive paste or anisotropic conductive paste so as to cover the ground electrode at least directly applied conductive paste or It includes a step of heat-curing the anisotropic conductive paste and a step of dividing the aggregate substrate into pieces.

  In the above configuration, the metal film is formed by electrically connecting the ground electrode exposed on the mounting surface or side surface of the electronic component of the mounting substrate and the metal film directly formed on the top and side surfaces of the mounting component. While being able to function as a shield layer, a resin layer for sealing the electronic component is not required, so that the overall height of the electronic component module can be reduced.

  Further, in the method for manufacturing an electronic component module according to the present invention, the ground electrode is exposed from the mounting surface or side surface of the electronic component of the mounting substrate and connected to the conductive paste that has been heat-cured. preferable.

In the above configuration, the ground electrode is exposed from the mounting surface or side surface of the electronic component of the mounting substrate and can be reliably connected to the heat-cured conductive paste, so that the shielding effect is not impaired.
Next, in order to achieve the above object, in the method of manufacturing an electronic component module according to the present invention, one or a plurality of electronic components are mounted on one surface of a mounting substrate in which a ground electrode is formed, A method of manufacturing an electronic component module in which a top surface of an electronic component is insulated, wherein a plurality of electronic component mounting surfaces of the mounting substrate or a mounting surface of the electronic component of a collective substrate on which the mounting substrates are arranged A step of mounting the electronic component, a step of forming an anisotropic conductive film so as to directly cover at least the top surface, the side surface and the ground electrode of the mounted electronic component, and a step of dividing the aggregate substrate into pieces It is characterized by including.
In the above configuration, by electrically connecting the ground electrode exposed on the mounting surface or side surface of the electronic component of the mounting substrate and the anisotropic conductive film directly formed on the top and side surfaces of the mounting component, The anisotropic conductive film can function as a shield layer, and a resin layer for sealing the electronic component is not necessary, so that the overall height of the electronic component module can be reduced.

  According to the above configuration, the ground electrode exposed on the mounting surface or side surface of the electronic component of the mounting substrate and the metal film directly formed on the top surface and side surface of the electronic component are electrically connected to each other. The film can function as a shield layer, and a resin layer for sealing the electronic component is not necessary, so that the overall height of the electronic component module can be reduced.

It is a schematic diagram which shows the structure before metal film formation of the electronic component module which concerns on Embodiment 1 of this invention. It is a schematic diagram which shows the structure after metal film formation of the electronic component module which concerns on Embodiment 1 of this invention. It is a schematic diagram for demonstrating the manufacturing method of the electronic component module which concerns on Embodiment 2 of this invention. It is a schematic diagram for demonstrating the manufacturing method of the electronic component module which concerns on Embodiment 2 of this invention. It is a schematic diagram for demonstrating the manufacturing method of the electronic component module which concerns on Embodiment 2 of this invention. It is a schematic diagram for demonstrating the manufacturing method of the electronic component module which concerns on Embodiment 2 of this invention. It is a schematic diagram for demonstrating the manufacturing method of the electronic component module which concerns on Embodiment 3 of this invention. It is a schematic diagram for demonstrating the manufacturing method of the electronic component module which concerns on Embodiment 3 of this invention. It is a schematic diagram for demonstrating the manufacturing method of the electronic component module which concerns on Embodiment 3 of this invention. It is a schematic diagram for demonstrating the manufacturing method of the electronic component module which concerns on Embodiment 3 of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(Embodiment 1)
FIG. 1 is a schematic diagram showing a configuration of the electronic component module according to Embodiment 1 of the present invention before forming a metal film. An electronic component module 1 according to Embodiment 1 of the present invention has a rectangular parallelepiped shape of 10.0 mm × 10.0 mm × 1.2 mm as an example, and is a circuit board (mounting board) made of ceramic, glass, epoxy resin, or the like. ) An electronic component 12 made of a semiconductor element such as an IC is mounted on the upper surface (one surface) of 11.

  The electronic component 12 has a so-called BGA (Ball Grid Array) structure, and has terminal electrodes (hereinafter referred to as solder bumps) 15 formed of hemispherical solder arranged in a lattice pattern on the bottom surface. Further, the top surface of the electronic component 12 to be mounted is insulated. Therefore, even if the conductive paste is applied to the top surface, no short circuit occurs. The number of electronic components 12 is not limited to one, and a plurality of electronic components may be mounted according to the function of the electronic component module.

  The circuit board 11 is, for example, a resin board having a rectangular top surface and a thickness of about 0.5 mm. The circuit board 11 contains electronic components 13 such as a chip inductor, a chip capacitor, and a chip resistor (hereinafter referred to as an LCR chip). A method for manufacturing the circuit board 11 incorporating the electronic component 13 is as follows. For example, a solder paste is placed on a copper foil, an LCR chip or the like is mounted, and then reflow cleaning is performed. Thereafter, the circuit board 11 is formed by sealing with an epoxy resin, curing the sealed epoxy resin, and stacking at least two layers of printed boards in which the copper foil is processed into the mounting lands 23 and the like. The built-in electronic component 13 does not need to be insulated from the top surface, and is a passive component with electrodes exposed on the top surface and side surfaces. Although not particularly limited, since the matching circuit can be configured in one electronic component module, the electronic component 13 is preferably either a chip capacitor or a chip inductor.

  The circuit board 11 includes a ground electrode 16 and a mounting land 23 on the mounting surface, and an external ground electrode 17 and an external connection terminal 18 for connecting to an external mounting substrate on a surface opposite to the mounting surface. It has. Electrical connection between the electronic components 12 and 13 and the external ground electrode 17 or the external connection terminal 18 is performed, for example, via the via electrode 14 inside the circuit board 11. The via electrode 14 is formed by, for example, forming a bottomed via hole by irradiating a laser toward the mounting land 23 from the epoxy resin side cured on the printed circuit board, and filling the via hole with a conductor. Is done.

  FIG. 2 is a schematic diagram showing the configuration of the electronic component module 1 according to Embodiment 1 of the present invention after the metal film is formed. As shown in FIG. 2, the electronic component module 1 according to Embodiment 1 of the present invention directly applies the conductive paste 20 to the top surface of the mounted electronic component 12. That is, the electronic component 12 is directly applied by, for example, brush coating without being sealed with resin or the like. When the conductive paste 20 is applied by brushing, the conductive paste 20 is unlikely to enter the lower part of the electronic component 12 and there is little possibility of short-circuiting with the solder bumps 15.

  A film is also formed on the side surface of the electronic component 12 due to the viscosity of the conductive paste 20. That is, by curing the conductive paste 20, the metal film 22 can be formed in the gap portion 21 between the electronic component 12 and the circuit board 11 so as not to contact the solder bump 15. After applying the conductive paste 20, the conductive paste 20 is cured by heating at 180 ° C. for 1 hour in an oven or the like, thereby forming the metal film 22.

  For example, an Ag paste is used as the conductive paste 20. Of course, the paste is not limited to Ag paste, and Cu paste, carbon paste, or the like may be used.

  As described above, according to the first embodiment, the ground electrode 16 exposed on the mounting surface or side surface of the electronic component 12 of the circuit board 11 and the top surface and side surface of the mounted electronic component 12 are directly formed. By electrically connecting the metal film 22 to the metal film 22, the metal film 22 can function as a shield layer and a resin layer for sealing the electronic component 12 is not required. It becomes possible to turn off.

  Instead of applying the conductive paste 20, the metal film 22 may be formed using ACP (Anisotropic Conductive Paste), ACF (Anisotropic Conductive Film), or the like. good. In this case, since the gap portion 21 does not occur between the electronic component 12 and the circuit board 11, the metal film 22 can be formed more easily.

(Embodiment 2)
The electronic component module according to the second embodiment is different from the first embodiment in that a ground electrode is formed inside the circuit board. 3 to 6 are schematic views for explaining a method for manufacturing an electronic component module according to Embodiment 2 of the present invention. 3 shows a state in which the electronic component 12 is mounted on the upper surface (one surface) of the collective substrate 10, FIG. 4 shows a state in which the cut portion 19 is formed, and FIG. 5 shows a state in which the conductive paste 20 is applied. FIG. 6 shows a state in which the electronic component module 1 is singulated.

  First, as shown in FIG. 3, a plurality of electronic components 12 are mounted on the upper surface of a collective substrate 10 in which circuit boards 11 having ground electrodes 16 formed therein are arranged. The electronic component 12 and the mounting land 23 of the collective substrate 10 are connected by melting the solder bump 15. Although not essential in the second embodiment, an underfill resin may be filled between the collective substrate 10 and the electronic component 12.

  Next, as shown in FIG. 4, from the mounting surface of the electronic component 12 of the collective substrate 10 to the depth at which the ground electrode 16 formed inside the collective substrate 10 is exposed at the boundary portion where the electronic component module 1 is cut out. Then, the groove-shaped cut portion 19 is formed using a dicer or the like. The cut portion 19 has a width of about 0.5 mm and a depth of about 0.3 mm, for example. By forming the cut portion 19 to the depth at which the ground electrode 16 is exposed, the collective substrate 10 is in a half-cut state, and the ground electrode 16 can be reliably exposed from the side surface of the cut portion 19. Can be electrically connected to the conductive paste 20.

  Then, as shown in FIG. 5, the conductive paste 20 is applied so as to cover the top and side surfaces of the electronic component 12, the mounting surface of the electronic component 12 of the collective substrate 10, and the side and bottom surfaces of the cut portion 19. The viscosity of the conductive paste 20 is relatively high at the time of application. By applying the conductive paste 20 so as to cover the opening of the cut portion 19, the conductive paste 20 enters the cut portion 19, and the side and bottom surfaces of the cut portion 19. Is covered.

  When apply | coating the electrically conductive paste 20, it is preferable to apply | coat so that the side surface of the aggregate substrate 10 may be covered. By applying the conductive paste 20 so as to cover up to the side surface of the collective substrate 10, the electronic component module 1 cut out from the peripheral portion of the collective substrate 10 also has the ground electrode 16 exposed from the side surface of the circuit substrate 11. This is because the conductive paste 20 can be electrically connected.

  Thereafter, the collective substrate 10 is heated in an oven or the like at 180 ° C. for 1 hour to cure the conductive paste 20 and form, for example, a metal film 22 having a thickness of 20 to 50 μm as a shield layer. The conductive paste 20 may be applied not only by brush coating but also by a method such as printing, vapor deposition, or sputtering.

  Then, as shown in FIG. 6, the collective substrate 10 is separated into electronic component modules 1 by dividing the collective substrate 10 with a dicer or the like at a boundary portion where the electronic component modules 1 are cut out. The blade used in the case of cutting is made smaller in width than the blade used in forming the cut portion 19 so that the metal film 22 formed on the side surface of the cut portion 19 is not ground. For example, since the thickness of the metal film 22 is 20 to 50 μm, the width of the blade used for dividing the aggregate substrate 10 is preferably 100 μm or more smaller than the width of the blade used for forming the cut portion 19. In addition, not only from the mounting surface of the electronic component 12 of the collective substrate 10 but also from the surface opposite to the mounting surface, a break cut portion having a depth that does not reach the cut portion 19 in the middle of the collective substrate 10 is formed. You can leave it.

  The external connection terminal 18 for connecting to an external mounting board or the like is provided on the surface of the circuit board 11 opposite to the side on which the metal film 22 is formed so as not to contact the metal film 22. is there. The external connection terminal 18 and the electronic components 12 and 13 are connected via the via electrode 14.

  As described above, according to the second embodiment, the ground electrode 16 exposed on the mounting surface or side surface of the electronic component 12 of the circuit board 11 and the top surface and side surface of the mounted electronic component 12 are directly formed. By electrically connecting the metal film 22 to the metal film 22, the metal film 22 can function as a shield layer and a resin layer for sealing the electronic component 12 is not required. It becomes possible to turn off.

(Embodiment 3)
The electronic component module according to the third embodiment is different from the first and second embodiments in that the ground electrode is formed inside the circuit board and the electronic component module is manufactured using a dicer sheet. 7 to 10 are schematic views for explaining a method of manufacturing the electronic component module 1 according to Embodiment 3 of the present invention. 7 shows a state in which the electronic component 12 is mounted on the upper surface (one surface) of the collective substrate 10, FIG. 8 shows a state in which the cut portion 19 is formed, and FIG. 9 shows a state in which the conductive paste 20 is applied. FIG. 10 shows a state where the electronic component module 1 is separated into individual pieces.

  First, as shown in FIG. 7, a plurality of electronic components 12 are mounted on the upper surface of a collective substrate 10 on which circuit boards 11 having ground electrodes 16 formed therein are arranged. The electronic component 12 and the mounting land 23 of the collective substrate 10 are connected by melting the solder bump 15. Although not essential in the third embodiment, an underfill resin may be filled between the collective substrate 10 and the electronic component 12.

  Next, as shown in FIG. 8, the dicer sheet 30 is attached to the lower surface of the collective substrate 10, and the collective substrate 10 is fully exposed from the mounting surface of the electronic component 12 of the collective substrate 10 at the boundary where the electronic component module 1 is cut out. The groove-shaped cut portion 19 is formed using a dicer or the like up to a depth that reaches the inside of the dicer sheet 30. The cut portion 19 has a width of about 0.5 mm and a depth of about 0.3 mm, for example. By forming the cut portion 19 to a depth reaching the inside of the dicer sheet 30, the collective substrate 10 is fully cut, and the ground electrode 16 can be reliably exposed from the side surface of the cut portion 19. In this step, the conductive paste 20 can be electrically connected.

  Then, as shown in FIG. 9, the conductive paste 20 is applied so as to cover the top and side surfaces of the electronic component 12, the mounting surface of the electronic component 12 of the collective substrate 10, and the side surface and bottom surface of the cut portion 19. The viscosity of the conductive paste 20 is relatively high at the time of application. By applying the conductive paste 20 so as to cover the opening of the cut portion 19, the conductive paste 20 enters the cut portion 19, and the side and bottom surfaces of the cut portion 19. Is covered.

  When apply | coating the electrically conductive paste 20, it is preferable to apply | coat so that the side surface of the aggregate substrate 10 may be covered. By applying the conductive paste 20 so as to cover up to the side surface of the collective substrate 10, the electronic component module 1 cut out from the peripheral portion of the collective substrate 10 also has the ground electrode 16 exposed from the side surface of the circuit substrate 11. This is because the conductive paste 20 can be electrically connected.

  Thereafter, the collective substrate 10 is heated in an oven or the like at 180 ° C. for 1 hour to cure the conductive paste 20, and for example, a metal film 22 having a thickness of 20 to 50 μm is formed as a shield layer. The conductive paste 20 may be applied not only by brush coating but also by a method such as printing, vapor deposition, or sputtering.

  Then, as shown in FIG. 10, by separating the dicer sheet 30 from the collective substrate 10, the collective substrate 10 is separated into electronic component modules 1.

  The external connection terminal 18 for connecting to an external mounting board or the like is provided on the surface of the circuit board 11 opposite to the side on which the metal film 22 is formed so as not to contact the metal film 22. is there. The external connection terminal 18 and the electronic components 12 and 13 are connected via the via electrode 14.

  As described above, according to the third embodiment, the ground electrode 16 exposed on the mounting surface or side surface of the electronic component 12 of the circuit board 11 and the top surface and side surface of the mounted electronic component 12 are directly formed. By electrically connecting the metal film 22 to the metal film 22, the metal film 22 can function as a shield layer and a resin layer for sealing the electronic component 12 is not required. It becomes possible to turn off.

  Needless to say, Embodiments 1 to 3 described above can be modified without departing from the spirit of the present invention.

1 Electronic component module 11 Circuit board (mounting board)
DESCRIPTION OF SYMBOLS 12, 13 Electronic components 14 Via electrode 15 Solder bump 16 Ground electrode 17 External ground electrode 18 External connection terminal 19 Cut part 20 Conductive paste 22 Metal film

Claims (9)

An electronic component module having one or more electronic components mounted on one surface of a mounting board,
The top surface of the electronic component is insulated,
The mounting substrate ground electrode is exposed on the mounting surface or side surface of the electronic component of the mounting substrate,
A film made of any one of a conductive paste, an anisotropic conductive paste, and an anisotropic conductive film, and a metal film that directly covers the top and side surfaces of the electronic component and the exposed surface of the ground electrode An electronic component module comprising:   The electronic component module according to claim 1, wherein the ground electrode is exposed on a mounting surface of the electronic component of the mounting substrate.   The electronic component module according to claim 1, wherein the ground electrode is exposed on a side surface of the mounting substrate. The mounting board includes an external ground electrode on a surface opposite to the mounting surface of the electronic component,
The electronic component module according to claim 1, wherein the ground electrode is electrically connected to the external ground electrode.   The electronic component module according to claim 1, wherein the mounting substrate includes one or more electronic components.   The electronic component module according to claim 5, wherein the electronic component built in the mounting substrate is a chip capacitor or a chip inductor. Thea implement one or more electronic components on one surface of the mounting board inside the ground electrode is formed is, the top surface of the electronic component is a method of manufacturing an electronic component module that is isolated,
Mounting a plurality of electronic components on the mounting surface of the electronic component of the mounting substrate or the mounting surface of the electronic component of the collective substrate on which the mounting substrate is arranged;
Applying a conductive paste or an anisotropic conductive paste so as to at least directly cover the top surface, side surface and ground electrode of the mounted electronic component;
Heating and curing the applied conductive paste or anisotropic conductive paste ;
And a step of dividing the aggregate substrate into individual pieces. The ground electrode is exposed from the mounting surface or side surface of the electronic component of the mounting substrate,
The method of manufacturing an electronic component module according to claim 7, wherein the electronic paste module is connected to the heat-cured conductive paste. One or a plurality of electronic components are mounted on one surface of a mounting substrate on which a ground electrode is formed, and the top surface of the electronic component is a method of manufacturing an electronic component module,
Mounting a plurality of electronic components on the mounting surface of the electronic component of the mounting substrate or the mounting surface of the electronic component of the collective substrate on which the mounting substrate is arranged;
Forming an anisotropic conductive film so as to at least directly cover the top surface, side surface and ground electrode of the mounted electronic component;
Dividing the collective substrate into individual pieces;
The manufacturing method of the electronic component module characterized by including.

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