JP5896201B2 - Adhesive composition and adhesive tape - Google Patents
Adhesive composition and adhesive tape Download PDFInfo
- Publication number
- JP5896201B2 JP5896201B2 JP2011229671A JP2011229671A JP5896201B2 JP 5896201 B2 JP5896201 B2 JP 5896201B2 JP 2011229671 A JP2011229671 A JP 2011229671A JP 2011229671 A JP2011229671 A JP 2011229671A JP 5896201 B2 JP5896201 B2 JP 5896201B2
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- sensitive adhesive
- mass
- adhesive composition
- acrylic copolymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000203 mixture Substances 0.000 title claims description 62
- 230000001070 adhesive effect Effects 0.000 title claims description 36
- 239000000853 adhesive Substances 0.000 title claims description 31
- 239000002390 adhesive tape Substances 0.000 title claims description 20
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 101
- 239000000178 monomer Substances 0.000 claims description 41
- 229920006243 acrylic copolymer Polymers 0.000 claims description 40
- 239000011256 inorganic filler Substances 0.000 claims description 37
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 37
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 35
- 125000004432 carbon atom Chemical group C* 0.000 claims description 21
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 21
- 229930195734 saturated hydrocarbon Natural products 0.000 claims description 11
- 125000000217 alkyl group Chemical group 0.000 claims description 9
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 9
- 229920002554 vinyl polymer Polymers 0.000 claims description 9
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 239000004973 liquid crystal related substance Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 description 31
- 239000011347 resin Substances 0.000 description 31
- 239000010408 film Substances 0.000 description 24
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 18
- 239000000463 material Substances 0.000 description 18
- 239000003063 flame retardant Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 13
- 239000007787 solid Substances 0.000 description 13
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 11
- 239000003431 cross linking reagent Substances 0.000 description 11
- -1 n-octyl Chemical group 0.000 description 11
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 10
- 239000000945 filler Substances 0.000 description 10
- 150000002430 hydrocarbons Chemical group 0.000 description 10
- 239000010410 layer Substances 0.000 description 10
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 9
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 9
- 238000004132 cross linking Methods 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000001035 drying Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910000000 metal hydroxide Inorganic materials 0.000 description 6
- 150000004692 metal hydroxides Chemical class 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 5
- 229920002799 BoPET Polymers 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 229920000058 polyacrylate Polymers 0.000 description 5
- 150000003505 terpenes Chemical class 0.000 description 5
- 235000007586 terpenes Nutrition 0.000 description 5
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- CYUZOYPRAQASLN-UHFFFAOYSA-N 3-prop-2-enoyloxypropanoic acid Chemical compound OC(=O)CCOC(=O)C=C CYUZOYPRAQASLN-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 4
- 239000011231 conductive filler Substances 0.000 description 4
- 125000001142 dicarboxylic acid group Chemical group 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000002947 alkylene group Chemical group 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000005338 heat storage Methods 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 3
- 239000000347 magnesium hydroxide Substances 0.000 description 3
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 3
- 239000003208 petroleum Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 230000002401 inhibitory effect Effects 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- 125000004400 (C1-C12) alkyl group Chemical group 0.000 description 1
- LGJCFVYMIJLQJO-UHFFFAOYSA-N 1-dodecylperoxydodecane Chemical compound CCCCCCCCCCCCOOCCCCCCCCCCCC LGJCFVYMIJLQJO-UHFFFAOYSA-N 0.000 description 1
- IVORCBKUUYGUOL-UHFFFAOYSA-N 1-ethynyl-2,4-dimethoxybenzene Chemical compound COC1=CC=C(C#C)C(OC)=C1 IVORCBKUUYGUOL-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- 229920000536 2-Acrylamido-2-methylpropane sulfonic acid Polymers 0.000 description 1
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 1
- XHZPRMZZQOIPDS-UHFFFAOYSA-N 2-Methyl-2-[(1-oxo-2-propenyl)amino]-1-propanesulfonic acid Chemical compound OS(=O)(=O)CC(C)(C)NC(=O)C=C XHZPRMZZQOIPDS-UHFFFAOYSA-N 0.000 description 1
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical compound OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 1
- WMRCTEPOPAZMMN-UHFFFAOYSA-N 2-undecylpropanedioic acid Chemical compound CCCCCCCCCCCC(C(O)=O)C(O)=O WMRCTEPOPAZMMN-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- QYEXBYZXHDUPRC-UHFFFAOYSA-N B#[Ti]#B Chemical compound B#[Ti]#B QYEXBYZXHDUPRC-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-M Butyrate Chemical compound CCCC([O-])=O FERIUCNNQQJTOY-UHFFFAOYSA-M 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Natural products CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 229920002284 Cellulose triacetate Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
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- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- FMRLDPWIRHBCCC-UHFFFAOYSA-L Zinc carbonate Chemical compound [Zn+2].[O-]C([O-])=O FMRLDPWIRHBCCC-UHFFFAOYSA-L 0.000 description 1
- SMEGJBVQLJJKKX-HOTMZDKISA-N [(2R,3S,4S,5R,6R)-5-acetyloxy-3,4,6-trihydroxyoxan-2-yl]methyl acetate Chemical compound CC(=O)OC[C@@H]1[C@H]([C@@H]([C@H]([C@@H](O1)O)OC(=O)C)O)O SMEGJBVQLJJKKX-HOTMZDKISA-N 0.000 description 1
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 1
- 229940081735 acetylcellulose Drugs 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
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- 125000002723 alicyclic group Chemical group 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- QBLDFAIABQKINO-UHFFFAOYSA-N barium borate Chemical compound [Ba+2].[O-]B=O.[O-]B=O QBLDFAIABQKINO-UHFFFAOYSA-N 0.000 description 1
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 description 1
- 229910001863 barium hydroxide Inorganic materials 0.000 description 1
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910021538 borax Inorganic materials 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- HHSPVTKDOHQBKF-UHFFFAOYSA-J calcium;magnesium;dicarbonate Chemical compound [Mg+2].[Ca+2].[O-]C([O-])=O.[O-]C([O-])=O HHSPVTKDOHQBKF-UHFFFAOYSA-J 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 229920005994 diacetyl cellulose Polymers 0.000 description 1
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 1
- ZIWYFFIJXBGVMZ-UHFFFAOYSA-N dioxotin hydrate Chemical compound O.O=[Sn]=O ZIWYFFIJXBGVMZ-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 229910000514 dolomite Inorganic materials 0.000 description 1
- 239000010459 dolomite Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 229910001701 hydrotalcite Inorganic materials 0.000 description 1
- 229960001545 hydrotalcite Drugs 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920006284 nylon film Polymers 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000004328 sodium tetraborate Substances 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 239000011667 zinc carbonate Substances 0.000 description 1
- 229910000010 zinc carbonate Inorganic materials 0.000 description 1
- 235000004416 zinc carbonate Nutrition 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- PZRXQXJGIQEYOG-UHFFFAOYSA-N zinc;oxido(oxo)borane Chemical compound [Zn+2].[O-]B=O.[O-]B=O PZRXQXJGIQEYOG-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Adhesive Tapes (AREA)
Description
本発明は、良好な熱伝導性や難燃性を有し、接着性に優れた粘着剤組成物及び粘着テープに関し、電子部品、OA機器部品、家電部品等の各種分野での部材の固定用途、特に発熱性のLEDの固定用途に有用である粘着剤組成物及び粘着テープに関する。 The present invention relates to a pressure-sensitive adhesive composition and a pressure-sensitive adhesive tape having good thermal conductivity and flame retardancy, and excellent adhesion, and for fixing members in various fields such as electronic parts, OA equipment parts, home appliance parts, etc. In particular, the present invention relates to a pressure-sensitive adhesive composition and a pressure-sensitive adhesive tape that are useful for fixing heat-generating LEDs.
近年、エレクトロニクス技術の格段なる進歩により電気、電子、OA機器の高集積化・高性能化が進み、内部の高温化や蓄熱による不具合が生じやすくなっており、内部部品の固定に使用する接着部材にも高温化や蓄熱を防止するための高い熱伝導性が求められている。また、仮に過剰な高温化や蓄熱が生じた際にも発火危険性を防止するため、接着部材には高い難燃性も求められている。近年の電子機器やOA機器は軽薄短小化が進んでおり、限られた放熱空間にて放熱が必要であり、特に、画像表示のバックライトに使用されるLED光源は発熱しやすく、また、画像表示部の輝度を確保するために実装密度を上げるとさらに発熱量が増大することから、高い放熱性や難燃性が求められている。 In recent years, remarkable progress in electronics technology has led to higher integration and higher performance of electrical, electronic, and OA equipment, which has been prone to problems caused by internal high temperatures and heat storage. Adhesive members used for fixing internal components In addition, high thermal conductivity is required to prevent high temperature and heat storage. Moreover, in order to prevent the risk of ignition even when excessive temperature increase or heat storage occurs, the adhesive member is also required to have high flame retardancy. In recent years, electronic devices and OA devices are becoming lighter, thinner, and smaller, and it is necessary to dissipate heat in a limited heat-dissipating space. In particular, LED light sources used for image display backlights tend to generate heat. When the mounting density is increased in order to ensure the luminance of the display portion, the amount of heat generation is further increased. Therefore, high heat dissipation and flame retardancy are required.
熱伝導性や難燃性を有する粘着性の組成物としては、例えば、アクリル系ポリマーに難燃剤及び熱伝導性フィラーを含有する熱伝導性難燃性感圧接着剤(特許文献1参照)や、
(メタ)アクリレート系ポリマーと金属水酸化物とを有し、(メタ)アクリレート系ポリマーのトルエン不溶分の割合とトルエン可溶分の分子量とを特定の範囲とし、(メタ)アクリレート系ポリマー100質量部に対する金属水酸化物の配合割合が80〜160質量部である感圧接着剤組成物が開示されている(特許文献2参照)。
As an adhesive composition having thermal conductivity and flame retardancy, for example, a thermally conductive flame-retardant pressure-sensitive adhesive (see Patent Document 1) containing a flame retardant and a thermally conductive filler in an acrylic polymer,
It has a (meth) acrylate polymer and a metal hydroxide, has a specific range of the toluene-insoluble fraction of the (meth) acrylate polymer and the molecular weight of the toluene-soluble component, and 100 mass of the (meth) acrylate polymer. A pressure-sensitive adhesive composition in which the blending ratio of the metal hydroxide to 80 parts is 80 to 160 parts by mass is disclosed (see Patent Document 2).
これら感圧接着材は、難燃性及び熱伝導性を有するが、軽薄短小化が進んだ電子機器やOA機器等への適用に際し、難燃性や熱伝導性を向上させるため、難燃剤や熱伝導性フィラーの添加量を増加すると接着力が大きく低下し、各種の部品固定用途への適用が困難であった。 These pressure-sensitive adhesives have flame retardancy and thermal conductivity. However, in order to improve flame retardancy and thermal conductivity when applied to electronic devices and OA devices that are becoming lighter and thinner, flame retardants and Increasing the amount of thermally conductive filler added significantly reduced the adhesive strength, making it difficult to apply to various parts fixing applications.
本発明が解決ようとする課題は、良好な熱伝導性や難燃性を実現するために無機フィラーを多く添加しても、部品固定に際して部品の脱落が生じにくい優れた接着性を有する粘着剤組成物を提供することにある。 The problem to be solved by the present invention is to provide a pressure-sensitive adhesive having excellent adhesiveness that does not easily drop off when fixing a component even if a large amount of inorganic filler is added to achieve good thermal conductivity and flame retardancy. It is to provide a composition.
本発明においては、(メタ)アクリレートを主たるモノマー成分とするアクリル系共重合体と、無機フィラーとを含有する粘着剤組成物であって、前記アクリル系共重合体がモノマー成分として炭素数が2以上の飽和炭化水素基を介してカルボキシ基を分子鎖末端に有する(メタ)アクリレートモノマーを含有し、前記無機フィラーの含有量が、アクリル共重合体100質量部に対して200質量部以上である粘着剤組成物により、多量の無機フィラーを添加した場合にも優れた接着性を実現でき、良好な難燃性や熱伝導性と、好適な接着性とを両立できる。 In the present invention, the pressure-sensitive adhesive composition contains an acrylic copolymer containing (meth) acrylate as a main monomer component and an inorganic filler, and the acrylic copolymer has 2 carbon atoms as a monomer component. It contains a (meth) acrylate monomer having a carboxy group at the molecular chain end through the saturated hydrocarbon group as described above, and the content of the inorganic filler is 200 parts by mass or more with respect to 100 parts by mass of the acrylic copolymer. The adhesive composition can realize excellent adhesiveness even when a large amount of inorganic filler is added, and can achieve both good flame retardancy and thermal conductivity and suitable adhesiveness.
本発明の粘着剤組成物は、良好な難燃性や熱伝導性を実現するために無機フィラーを多く添加しても優れた接着性を有することから、部品固定に高い信頼性が求められ、かつ、近年の軽薄短小化が進む各種の電子機器やOA機器等の電子部品の固定に好適に適用できる。なかでも、発熱量が大きく、画像表示部の輝度を確保するために高い実装密度が求められる画像表示のバックライト等に使用されるLED光源の固定に特に好適に使用できる。 Since the pressure-sensitive adhesive composition of the present invention has excellent adhesiveness even if a large amount of inorganic filler is added in order to achieve good flame retardancy and thermal conductivity, high reliability is required for component fixing, In addition, the present invention can be suitably applied to fixing electronic components such as various electronic devices and OA devices that are becoming lighter and thinner in recent years. Among these, the amount of heat generation is large, and it can be particularly suitably used for fixing an LED light source used for an image display backlight or the like that requires a high mounting density in order to ensure the luminance of the image display unit.
[粘着剤組成物]
本発明の粘着剤組成物は、(メタ)アクリレートを主たるモノマー成分とするアクリル系共重合体と、無機フィラーとを含有する粘着剤組成物であって、前記アクリル系共重合体がモノマー成分として炭素数が2以上の飽和炭化水素基を介してカルボキシ基を分子鎖末端に有する(メタ)アクリレートモノマーを含有し、前記無機フィラーの含有量が、アクリル共重合体100質量部に対して200質量部以上の粘着剤組成物である。
[Adhesive composition]
The pressure-sensitive adhesive composition of the present invention is a pressure-sensitive adhesive composition containing an acrylic copolymer containing (meth) acrylate as a main monomer component and an inorganic filler, wherein the acrylic copolymer is used as a monomer component. It contains a (meth) acrylate monomer having a carboxy group at the molecular chain end via a saturated hydrocarbon group having 2 or more carbon atoms, and the content of the inorganic filler is 200 mass with respect to 100 mass parts of the acrylic copolymer. It is a pressure-sensitive adhesive composition of at least part.
(アクリル系共重合体)
本発明の粘着剤組成物を構成するアクリル系共重合体は、(メタ)アクリレートを主たるモノマー成分とし、架橋剤と架橋反応するビニルモノマーとして炭素数が2以上の飽和炭化水素基を介してカルボキシ基を分子鎖末端に有する(メタ)アクリレートモノマーからなることを特徴とする。
(Acrylic copolymer)
The acrylic copolymer constituting the pressure-sensitive adhesive composition of the present invention comprises (meth) acrylate as a main monomer component, and a vinyl monomer that undergoes a cross-linking reaction with a cross-linking agent via a saturated hydrocarbon group having 2 or more carbon atoms. It consists of the (meth) acrylate monomer which has group at the molecular chain terminal.
従来の粘着剤においては、良好な熱伝導性や難燃性を実現するために、無機フィラーを多量に配合させると、粘着剤の流動性は低下し初期接着性が低下する。そこでこれを補うため、アクリル系共重合体の分子量を低くする方法や、架橋点モノマー含有量及び架橋剤添加量を減らし、粘着剤の凝集力を低下させる方法などにより、粘着剤の流動性を向上させることが考えられる。しかし、前述の方法でアクリル系共重合体の流動性を向上させた場合、無機フィラーを多量に含有し、アクリル系共重合体の体積が少ない状態では、バインダーとしての性能が不足し、粘着剤に応力が加わるとアクリル系共重合体と無機フィラーの間で剥離し、粘着物性が低下する。したがって、アクリル系共重合体は凝集性と流動性を両立させる必要がある。本発明の粘着剤組成物においては、炭素数が2以上の飽和炭化水素基を介してカルボキシ基を分子鎖末端に有する(メタ)アクリレートモノマーを使用することでアクリル系共重合体に無機フィラーを多量に含有しても凝集性と流動性とを両立できる。炭素数が2以上の飽和炭化水素基を介してカルボキシ基を分子鎖末端に有する(メタ)アクリレートモノマーは、側鎖が長いため架橋点の流動性に優れる。また、炭素数が2以上の飽和炭化水素基を介してカルボキシ基を分子鎖末端に有する(メタ)アクリレートモノマーは、ガラス転移温度が低いため、粘着剤層の損失正接のピークを示す温度が低くなり、流動性に優れる粘着剤組成物を実現できる。さらに、炭素数が2以上の飽和炭化水素基を介してカルボキシ基を分子鎖末端に有する(メタ)アクリレートモノマーは立体障害が少ないため末端のカルボキシ基と架橋剤が反応しやすく粘着剤組成物の凝集力を得ることができる。このように、当該(メタ)アクリレートモノマーを使用することで、樹脂の凝集力を低下させずに粘着剤の凝集性と流動性を両立できることから、本発明の粘着剤組成物は多量のフィラーを含有しても優れた粘着物性を示す。 In a conventional pressure-sensitive adhesive, when a large amount of an inorganic filler is blended in order to realize good thermal conductivity and flame retardancy, the flowability of the pressure-sensitive adhesive is lowered and initial adhesiveness is lowered. Therefore, in order to compensate for this, the flowability of the pressure-sensitive adhesive can be reduced by reducing the molecular weight of the acrylic copolymer, reducing the content of the crosslinking point monomer and the amount of crosslinking agent added, and reducing the cohesive strength of the pressure-sensitive adhesive. It is possible to improve. However, when the fluidity of the acrylic copolymer is improved by the above-described method, the performance as a binder is insufficient in the state where the inorganic copolymer is contained in a large amount and the volume of the acrylic copolymer is small. When stress is applied to the film, it peels between the acrylic copolymer and the inorganic filler, and the physical properties of the adhesive deteriorate. Therefore, the acrylic copolymer needs to have both cohesion and fluidity. In the pressure-sensitive adhesive composition of the present invention, an inorganic filler is added to the acrylic copolymer by using a (meth) acrylate monomer having a carboxy group at the molecular chain end via a saturated hydrocarbon group having 2 or more carbon atoms. Even if it is contained in a large amount, both cohesion and fluidity can be achieved. A (meth) acrylate monomer having a carboxy group at the end of a molecular chain via a saturated hydrocarbon group having 2 or more carbon atoms is excellent in fluidity at a crosslinking point because of a long side chain. In addition, since the (meth) acrylate monomer having a carboxy group at the molecular chain terminal via a saturated hydrocarbon group having 2 or more carbon atoms has a low glass transition temperature, the temperature at which the loss tangent peak of the pressure-sensitive adhesive layer is low is low. Thus, an adhesive composition having excellent fluidity can be realized. Furthermore, since the (meth) acrylate monomer having a carboxy group at the molecular chain end via a saturated hydrocarbon group having 2 or more carbon atoms has little steric hindrance, the terminal carboxy group and the crosslinking agent can easily react with each other. Cohesive force can be obtained. Thus, since the cohesiveness and fluidity of the pressure-sensitive adhesive can be compatible without reducing the cohesive strength of the resin by using the (meth) acrylate monomer, the pressure-sensitive adhesive composition of the present invention contains a large amount of filler. Even if contained, it exhibits excellent adhesive properties.
炭素数が2以上の飽和炭化水素基を介してカルボキシ基を分子鎖末端に有する(メタ)アクリレートモノマーとしては、例えば、下式(1)にて表わされる(メタ)アクリレートモノマーを例示できる。
(式(1)中、R1は水素又はメチル基であり、R2はアルキル基又は水酸基を側鎖に含んでもよい炭素数2以上のアルキレン基であり、X1はカルボキシ基又はジカルボン酸残基であり、nは1〜2である。)
Examples of the (meth) acrylate monomer having a carboxy group at the molecular chain end through a saturated hydrocarbon group having 2 or more carbon atoms include a (meth) acrylate monomer represented by the following formula (1).
(In Formula (1), R 1 is hydrogen or a methyl group, R 2 is an alkylene group having 2 or more carbon atoms which may contain an alkyl group or a hydroxyl group in the side chain, and X 1 is a carboxy group or a dicarboxylic acid residue. And n is 1 to 2.)
なお、上記ジカルボン酸残基とは、分子鎖末端にジカルボン酸の一方のカルボキシ基が結合した構造におけるジカルボン酸の残基を表し、例えば、HOOC−R−COOHとして表わされるジカルボン酸により形成されるジカルボン酸残基は−OOC−R−COOHである。当該ジカルボン酸残基を構成するジカルボン酸としては、上記Rが直接結合したジカルボン酸や、上記Rとして二価の脂肪族炭化水素基や芳香族炭化水素基を有するジカルボン酸を適宜使用でき、なかでも脂肪族炭化水素基、特に鎖状脂肪族炭化水素基を有するジカルボン酸は立体障害が生じにくいため好ましい。好適なジカルボン酸としては、具体的には、シュウ酸、マロン酸、コハク酸、マレイン酸、フマル酸、グルタル酸、アジピン酸、ピメリン酸、スベリン酸、アゼライン酸、セバシン酸、ドデカンジカルボン酸等を例示できる。 In addition, the said dicarboxylic acid residue represents the residue of the dicarboxylic acid in the structure which one carboxy group of dicarboxylic acid couple | bonded with the molecular chain terminal, For example, it forms with the dicarboxylic acid represented as HOOC-R-COOH. The dicarboxylic acid residue is -OOC-R-COOH. As the dicarboxylic acid constituting the dicarboxylic acid residue, a dicarboxylic acid in which R is directly bonded, or a dicarboxylic acid having a divalent aliphatic hydrocarbon group or an aromatic hydrocarbon group as R can be appropriately used. However, dicarboxylic acids having an aliphatic hydrocarbon group, particularly a chain aliphatic hydrocarbon group, are preferred because steric hindrance is unlikely to occur. Specific examples of suitable dicarboxylic acids include oxalic acid, malonic acid, succinic acid, maleic acid, fumaric acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, and dodecanedicarboxylic acid. It can be illustrated.
上記式(1)で表わされる(メタ)アクリレートのなかでも、R2が炭素数2〜18のアルキレン基であることが好ましく、炭素数が2〜5のアルキレン基であることが特に好ましい。また、X1がカルボキシ基であることが好ましい。具体的には、例えば、β−カルボキシアルキル(メタ)アクリレート、エチレンオキサイド(EO)変性コハク酸(メタ)アクリレート、プロピレンオキサイド(PO)変性コハク酸(メタ)アクリレート等が例示できる。これらのなかでも、β−カルボキシエチルアクリレートを特に好ましく使用できる。 Among the (meth) acrylates represented by the above formula (1), R 2 is preferably an alkylene group having 2 to 18 carbon atoms, and particularly preferably an alkylene group having 2 to 5 carbon atoms. X 1 is preferably a carboxy group. Specifically, for example, β-carboxyalkyl (meth) acrylate, ethylene oxide (EO) modified succinic acid (meth) acrylate, propylene oxide (PO) modified succinic acid (meth) acrylate and the like can be exemplified. Among these, β-carboxyethyl acrylate can be particularly preferably used.
炭素数が2以上の飽和炭化水素基を介してカルボキシ基を分子鎖末端に有する(メタ)アクリレートモノマーの含有量は、アクリル系共重合体を構成するモノマー成分中の0.5〜10質量%であることが好ましく、1〜5質量%であることがより好ましい。炭素数が2以上の飽和炭化水素基を介してカルボキシ基を分子鎖末端に有する(メタ)アクリレートモノマーの含有量を当該範囲とすることで、架橋点を好適に形成しやすくなり、粘着剤の凝集力や初期接着性を向上させやすくなる。 The content of the (meth) acrylate monomer having a carboxy group at the molecular chain end through a saturated hydrocarbon group having 2 or more carbon atoms is 0.5 to 10% by mass in the monomer component constituting the acrylic copolymer. It is preferable that it is 1-5 mass%. By setting the content of the (meth) acrylate monomer having a carboxy group at the end of the molecular chain through a saturated hydrocarbon group having 2 or more carbon atoms within the above range, a crosslinking point can be easily formed, It becomes easy to improve cohesion force and initial adhesiveness.
主たるモノマー成分として使用する(メタ)アクリレートとしては、粘着剤に使用する各種(メタ)アクリレートを使用でき、なかでもアルキル基の炭素数1〜12のアルキル(メタ)アクリレートを好ましく使用できる。炭素数1〜12のアルキル(メタ)アクリレートとしては、例えば、メチル(メタ)アクリレート、エチル(メタ)アクリレート、n−ブチル(メタ)アクリレート、イソブチル(メタ)アクリレート、t−ブチル(メタ)アクリレート、n−オクチル(メタ)アクリレート、イソオクチル(メタ)アクリレート、イソノニル(メタ)アクリレート、シクロヘキシル(メタ)アクリレート、2−エチルヘキシル(メタ)アクリレート等のモノマーがあげられ、これらの1種または2種以上が用いられる。なかでも、アルキル基の炭素数が4〜8のアルキル(メタ)アクリレート、特に2エチルヘキシルアクリレートはフィラーを添加しても粘着性を確保しやすいため好ましい。 As the (meth) acrylate used as the main monomer component, various (meth) acrylates used for the pressure-sensitive adhesive can be used, and among them, alkyl (meth) acrylates having 1 to 12 carbon atoms in the alkyl group can be preferably used. Examples of the alkyl (meth) acrylate having 1 to 12 carbon atoms include methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, Examples include monomers such as n-octyl (meth) acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate, cyclohexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, and one or more of these are used. It is done. Among these, alkyl (meth) acrylates having 4 to 8 carbon atoms in the alkyl group, particularly 2-ethylhexyl acrylate, are preferable because they can easily secure adhesiveness even when a filler is added.
炭素数1〜12のアルキル(メタ)アクリレートの含有量は、アクリル系共重合体を構成するモノマー成分中の60質量%以上であることが好ましく、80質量%以上であることが更に好ましい。なかでも2−エチルヘキシルアクリレートを使用する場合には、全ての炭素数1〜12のアルキル(メタ)アクリレートの80質量%以上が2−エチルヘキシルアクリレートであることが好ましく、90質量%以上であることがより好ましい。 The content of the alkyl (meth) acrylate having 1 to 12 carbon atoms is preferably 60% by mass or more, and more preferably 80% by mass or more in the monomer component constituting the acrylic copolymer. Especially when using 2-ethylhexyl acrylate, it is preferable that 80 mass% or more of all the C1-C12 alkyl (meth) acrylates are 2-ethylhexyl acrylate, and it is 90 mass% or more. More preferred.
アクリル系共重合体を構成するモノマー成分としては、上記以外のモノマー成分として、各種ビニルモノマーを使用できる。このようなビニルモノマーとしては、カルボキシ基含有モノマーを好ましく使用でき、当該カルボキシ基含有ビニルモノマーとしては、例えば、アクリル酸、メタクリル酸、イタコン酸、マレイン酸、無水マレイン酸、フタル酸、無水フタル酸、クロトン酸等の1種又は2種以上を使用できる。なかでもアクリル酸、メタクリル酸は、アクリル系共重合体の凝集性を好適に調整しやすいため好ましく使用できる。 As the monomer component constituting the acrylic copolymer, various vinyl monomers can be used as monomer components other than those described above. As such a vinyl monomer, a carboxy group-containing monomer can be preferably used. Examples of the carboxy group-containing vinyl monomer include acrylic acid, methacrylic acid, itaconic acid, maleic acid, maleic anhydride, phthalic acid, and phthalic anhydride. 1 type, or 2 or more types, such as crotonic acid, can be used. Of these, acrylic acid and methacrylic acid can be preferably used because they easily adjust the cohesiveness of the acrylic copolymer.
当該カルボキシ基含有ビニルモノマーの含有量は、アクリル系共重合体を構成するモノマー成分中の10質量%以下であることが好ましく、0.5〜10質量%であることがさらに好ましく、1〜5質量%であることがより好ましい。当該範囲で含有することにより、粘着剤の凝集力や保持力、接着性を、向上させやすい。 The content of the carboxy group-containing vinyl monomer is preferably 10% by mass or less, more preferably 0.5 to 10% by mass, and more preferably 1 to 5% in the monomer component constituting the acrylic copolymer. More preferably, it is mass%. By containing in the said range, it is easy to improve the cohesive force, holding force, and adhesiveness of an adhesive.
また、その他のビニルモノマーとして、酢酸ビニル、2−アクリルアミド−2−メチルプロパンスルフォン酸等のスルホン酸基含有モノマー、炭素数1〜3の(メタ)アクリレート、炭素数13以上の(メタ)アクリレート、イソボルニル(メタ)アクリレート、スチレン等、公知のビニルモノマーを使用してもよい。 Other vinyl monomers include vinyl acetate, sulfonic acid group-containing monomers such as 2-acrylamido-2-methylpropanesulfonic acid, (meth) acrylates having 1 to 3 carbon atoms, (meth) acrylates having 13 or more carbon atoms, Known vinyl monomers such as isobornyl (meth) acrylate and styrene may be used.
その他のビニルモノマーを使用する場合の含有量は、アクリル系共重合体を構成するモノマー成分中の10質量%以下であることが好ましく、5質量%以下であることがより好ましい。当該範囲で含有することにより、粘着剤の凝集力や保持力、接着性を好適な範囲に調整しやすい。 The content in the case of using other vinyl monomers is preferably 10% by mass or less, more preferably 5% by mass or less, in the monomer component constituting the acrylic copolymer. By containing in the said range, it is easy to adjust the cohesive force, holding force, and adhesiveness of an adhesive to a suitable range.
上記アクリル系共重合は、溶液重合法、塊状重合法などの公知の重合方法により共重合させることにより得ることができる。重合開始方法も過酸化ベンゾイルや過酸化ラウリロイルなどの過酸化物系、アゾビスイソブチルニトリルなどのアゾ系の熱重合開始剤を用いた熱による開始方法や、アセトフェノン系、ベンゾインエーテル系、ベンジルケタール系、アシルフォスフィンオキシド系、ベンゾイン系、ベンゾフェノン系の光重合開始剤を用いた紫外線照射による開始方法や、電子線照射による方法を任意に選択できる。 The acrylic copolymer can be obtained by copolymerization by a known polymerization method such as a solution polymerization method or a bulk polymerization method. Polymerization is initiated by peroxides such as benzoyl peroxide and lauryl peroxide, thermal initiation methods using azo-based thermal polymerization initiators such as azobisisobutylnitrile, acetophenone, benzoin ether, benzyl ketal In addition, an initiation method by ultraviolet irradiation using an acylphosphine oxide-based, benzoin-based or benzophenone-based photopolymerization initiator, or a method by electron beam irradiation can be arbitrarily selected.
上記範囲内で重合したアクリル系共重合体は、ゲルパーミエーションクロマトグラフィのポリスチレン換算による重量平均分子量が30万〜80万、より好ましくは40万〜70万である。重量平均分子量が30万以上とすることで粘着剤の凝集力を確保しやすくなり、高温下での接着性を向上させやすい。また重量平均分子量が80万以下とすることで、熱伝導性フィラーの分散性や、粘着剤の塗工性、初期接着性を向上させやすい。 The acrylic copolymer polymerized within the above range has a weight average molecular weight in terms of polystyrene of gel permeation chromatography of 300,000 to 800,000, more preferably 400,000 to 700,000. When the weight average molecular weight is 300,000 or more, the cohesive force of the pressure-sensitive adhesive is easily secured, and the adhesiveness at high temperature is easily improved. Moreover, it is easy to improve the dispersibility of a heat conductive filler, the applicability | paintability of an adhesive, and initial stage adhesiveness because a weight average molecular weight shall be 800,000 or less.
(無機フィラー)
本発明に使用する無機フィラーは、熱伝導性や難燃性を有する無機フィラーを使用でき、例えば、金属水酸化物、金属酸化物、金属、セラミックス等を使用できる。具体的には、熱伝導性のフィラーとして、例えば、水酸化アルミニウム、水酸化マグネシウム、酸化アルミニウム、酸化ケイ素、酸化マグネシウム、酸化亜鉛、酸化チタン、酸化ジルコニウム、酸化鉄、炭化ケイ素、窒化ホウ素、窒化アルミニウム、窒化チタン、窒化ケイ素、ホウ素化チタン、カーボン、ニッケル、銅、アルミニウム、チタン、金、銀等が挙げられる。また、難燃性のフィラーとしては、例えば、水酸化アルミニウム、水酸化マグネシウム、水酸化ジルコニウム、塩基性炭酸マグネシウム、ドロマイト、ハイドロタルサイト、水酸化カルシウム、水酸化バリウム、酸化スズの水和物、硼砂などの無機金属化合物の水和物、ホウ酸亜鉛、メタホウ酸亜鉛、メタホウ酸バリウム、炭酸亜鉛、炭酸マグネシウム−カルシウム、炭酸カルシウム、炭酸バリウム、酸化マグネシウム、酸化モリブデン、酸化ジルコニウム、酸化スズ、酸化アンチモン、赤リン等が挙げられる。これら無機フィラーは、アクリル系共重合体への分散性向上のため、シランカップリング処理、ステアリン酸処理などの表面処理を施してもよい。
(Inorganic filler)
The inorganic filler used for this invention can use the inorganic filler which has heat conductivity and a flame retardance, for example, can use a metal hydroxide, a metal oxide, a metal, ceramics, etc. Specifically, as the thermally conductive filler, for example, aluminum hydroxide, magnesium hydroxide, aluminum oxide, silicon oxide, magnesium oxide, zinc oxide, titanium oxide, zirconium oxide, iron oxide, silicon carbide, boron nitride, nitriding Examples thereof include aluminum, titanium nitride, silicon nitride, titanium boride, carbon, nickel, copper, aluminum, titanium, gold, and silver. Examples of the flame retardant filler include aluminum hydroxide, magnesium hydroxide, zirconium hydroxide, basic magnesium carbonate, dolomite, hydrotalcite, calcium hydroxide, barium hydroxide, tin oxide hydrate, Hydrate of inorganic metal compounds such as borax, zinc borate, zinc metaborate, barium metaborate, zinc carbonate, magnesium carbonate-calcium carbonate, calcium carbonate, barium carbonate, magnesium oxide, molybdenum oxide, zirconium oxide, tin oxide, oxidation Examples include antimony and red phosphorus. These inorganic fillers may be subjected to surface treatment such as silane coupling treatment or stearic acid treatment in order to improve dispersibility in the acrylic copolymer.
これら無機フィラーは、必要に応じて適宜選択して使用すればよいが、これらのなかでも、熱伝導性及び難燃性が必要な用途においては、熱伝導性及び難燃性を有する熱伝導難燃性フィラーを使用することが好ましい。特に、LED固定用途においては、熱伝導難燃性フィラーとして、水酸化アルミニウム、水酸化マグネシウムなどの金属水酸化物を使用することが特に好ましい。これらの金属水酸化物は熱伝導性と難燃性を付与することができる。特に金属水酸化物の中で水酸化アルミニウムは、250℃程度から熱分解反応が起こり、樹脂が著しく溶融する前に難燃効果を発揮するため好ましい。 These inorganic fillers may be appropriately selected and used as necessary, but among these, in applications that require thermal conductivity and flame retardancy, thermal conductivity and flame retardance are difficult. It is preferable to use a flammable filler. In particular, in LED fixing applications, it is particularly preferable to use a metal hydroxide such as aluminum hydroxide or magnesium hydroxide as the heat conductive flame retardant filler. These metal hydroxides can impart thermal conductivity and flame retardancy. Among the metal hydroxides, aluminum hydroxide is particularly preferable because a thermal decomposition reaction takes place from about 250 ° C. and exhibits a flame retardant effect before the resin is remarkably melted.
無機フィラーの形状は、規則的な形状又は不規則な形状のいずれであってもよく、例えば、多角形状、立方体状、楕円状、球状、針状、平板状、鱗片状又はこれらを組み合わせた形状等が挙げられ、これらが凝集したフィラーであってもよい。無機フィラーの大きさは、最大となる幅や長さの平均、例えば粒子状の場合にはその平均粒径が、0.5〜50μmであることが好ましい。より好ましくは1〜30μmである。なお、フィラーの大きさ、形状は、得られる粘着テープの厚さにより適宜選択される。粘着テープの厚さよりも無機フィラーの最大の幅や長さが小さい方が望ましい。 The shape of the inorganic filler may be either a regular shape or an irregular shape, such as a polygonal shape, a cubic shape, an elliptical shape, a spherical shape, a needle shape, a flat plate shape, a scale shape, or a combination thereof. Etc., and these may be agglomerated fillers. As for the size of the inorganic filler, it is preferable that the average of the maximum width and length, for example, in the case of particles, the average particle size is 0.5 to 50 μm. More preferably, it is 1-30 micrometers. In addition, the magnitude | size and shape of a filler are suitably selected by the thickness of the adhesive tape obtained. It is desirable that the maximum width and length of the inorganic filler be smaller than the thickness of the adhesive tape.
粘着剤組成物への無機フィラーの添加量としては、良好な熱伝導性や難燃性を実現するために、アクリル系共重合体100質量部に対し200質量部以上、好ましくは200質量部〜280質量部、より好ましくは230〜250質量部である。本発明の粘着剤組成物は、当該多量の無機フィラーを含有しても好適な接着性を実現できる。 The amount of the inorganic filler added to the pressure-sensitive adhesive composition is 200 parts by mass or more, preferably 200 parts by mass to 100 parts by mass of the acrylic copolymer in order to realize good thermal conductivity and flame retardancy. It is 280 mass parts, More preferably, it is 230-250 mass parts. Even if the pressure-sensitive adhesive composition of the present invention contains the large amount of the inorganic filler, suitable adhesiveness can be realized.
(粘着付与樹脂)
本発明の熱伝導性粘着剤には粘着物性を向上する目的で粘着付与樹脂を使用してもよい。粘着付与樹脂としては公知の脂肪族系石油樹脂、芳香族系石油樹脂、脂環族系石油樹脂などの石油樹脂、ロジン樹脂、ロジンエステル樹脂、不均化ロジン樹脂、重合ロジン樹脂、重合ロジンエステル樹脂、ロジンフェノールなどのロジン系樹脂、テルペン樹脂、テルペンフェノール樹脂などが使用できる。また粘着付与樹脂は2種類以上の樹脂を併用することができる。
(Tackifying resin)
A tackifier resin may be used in the heat conductive adhesive of the present invention for the purpose of improving adhesive properties. As tackifying resins, known aliphatic petroleum resins, aromatic petroleum resins, alicyclic petroleum resins, etc., rosin resins, rosin ester resins, disproportionated rosin resins, polymerized rosin resins, polymerized rosin esters Resins, rosin resins such as rosin phenol, terpene resins, terpene phenol resins and the like can be used. Further, two or more kinds of tackifying resins can be used in combination.
粘着付与樹脂の添加量としては、アクリル系共重合体100質量部に対し20質量部以下が好ましい。より好ましくは10質量部以下である。当該範囲とすることで、良好な粘着付与効果や初期接着性を得られやすくなる。また、特に高い難燃性、例えばUL94V−0やVTM−0等の高い難燃性を要求される用途については、粘着付与樹脂を使用しないことも好ましい。 As addition amount of tackifying resin, 20 mass parts or less are preferable with respect to 100 mass parts of acrylic copolymers. More preferably, it is 10 parts by mass or less. By setting it as the said range, it will become easy to acquire a favorable tackifying effect and initial stage adhesiveness. Moreover, it is also preferable not to use a tackifying resin for applications that require particularly high flame retardancy, for example, high flame retardancy such as UL94V-0 and VTM-0.
また、粘着付与樹脂は、引火点が高い粘着付与樹脂を使用することが好ましく、引火点が200度以上の樹脂を使用することが特に好ましい。引火点が200度以上の粘着付与樹脂を使用すると、難燃性フィラーが燃焼時に熱分解して生じる難燃効果を特に効率的に発揮しやすくなる。 Moreover, it is preferable to use tackifying resin with a high flash point, and it is especially preferable to use resin with a flash point of 200 degree | times or more as tackifying resin. When a tackifying resin having a flash point of 200 degrees or more is used, it becomes easy to particularly effectively exhibit a flame retardant effect produced by thermal decomposition of the flame retardant filler during combustion.
(架橋剤)
本発明の粘着剤組成物には凝集力向上のため、架橋剤を使用する。架橋剤としては、β−カルボキシエチルアクリレートのカルボキシ基と反応させるため、エポキシ系架橋剤を好ましく使用できる。エポキシ系架橋剤としては、1.3−ビス(N,N―グリシジルアミノメチル)シクロヘキサン(三菱ガス化学社製テトラッドC)、1.3−ビス(N,N−グリシジルアミノメチル)ベンゼン(三菱ガス化学社製テトラッドX)など公知のエポキシ系架橋剤を使用できる。
(Crosslinking agent)
In the pressure-sensitive adhesive composition of the present invention, a crosslinking agent is used for improving cohesive strength. As the cross-linking agent, an epoxy-based cross-linking agent can be preferably used in order to react with the carboxy group of β-carboxyethyl acrylate. Examples of the epoxy crosslinking agent include 1.3-bis (N, N-glycidylaminomethyl) cyclohexane (Tetrad C manufactured by Mitsubishi Gas Chemical Company), 1.3-bis (N, N-glycidylaminomethyl) benzene (Mitsubishi Gas). Known epoxy crosslinking agents such as Tetrad X) manufactured by Kagaku Co., Ltd. can be used.
架橋度合いの指標として、粘着剤層をトルエンに24時間浸漬した後の不溶分を測定するゲル分率の値が用いられる。本発明の粘着剤組成物の架橋後のゲル分率は、25%〜60%が好ましい。またより好ましくは30%〜50%である。尚、ゲル分率の値は、無機フィラーの添加量を差し引いた樹脂の不溶分をさす。当該範囲とすることで、架橋後の粘着剤層に応力が加わった際にも、アクリル系共重合体と無機フィラーとの間の剥離が生じにくく、良好な粘着物性を得やすく、また、好適な初期接着性を得やすくなる。 As an index of the degree of cross-linking, the value of the gel fraction for measuring the insoluble content after the pressure-sensitive adhesive layer is immersed in toluene for 24 hours is used. The gel fraction after crosslinking of the pressure-sensitive adhesive composition of the present invention is preferably 25% to 60%. More preferably, it is 30% to 50%. In addition, the value of a gel fraction refers to the insoluble part of resin which deducted the addition amount of the inorganic filler. By adopting the range, even when stress is applied to the pressure-sensitive adhesive layer after crosslinking, peeling between the acrylic copolymer and the inorganic filler hardly occurs, and it is easy to obtain good pressure-sensitive adhesive properties. Easy initial adhesion.
また、本発明の粘着剤組成物は、熱伝導性、難燃性、粘着物性を大きく阻害しない範囲内で、老化防止剤、着色剤、分散剤などの添加剤を適宜使用してもよい。 Moreover, the pressure-sensitive adhesive composition of the present invention may appropriately use additives such as an anti-aging agent, a colorant, and a dispersant as long as the thermal conductivity, flame retardancy, and pressure-sensitive adhesive properties are not significantly impaired.
本発明の粘着剤組成物からなる粘着剤層は損失正接のピークを示す温度が−40℃以上、−10℃以下であることが好ましい。当該範囲とすることで、無機フィラーを多く配合しても粘着剤の流動性と凝集性を両立しやすくなる。なお、損失正接のピーク温度は、5mm厚にまで重ね合わせた粘着剤層を試験片とし、レオメトリックス社製粘弾性試験機アレス2kSTDに直径7.9mmのパラレルプレートを装着し、試験片を挟み込み周波数1Hz、温度分散法で測定した値である。 The pressure-sensitive adhesive layer comprising the pressure-sensitive adhesive composition of the present invention preferably has a temperature at which the loss tangent peak is -40 ° C or higher and -10 ° C or lower. By setting it as the said range, even if it mix | blends many inorganic fillers, it will become easy to make the fluidity | liquidity and cohesion of an adhesive compatible. The peak temperature of loss tangent is 5 mm thick. The test piece is an adhesive layer, a rheometer viscoelasticity tester Ares 2kSTD is attached to a parallel plate with a diameter of 7.9 mm, and the test piece is sandwiched. This is a value measured by a frequency 1 Hz frequency dispersion method.
(粘着剤製造方法)
本発明の粘着剤組成物の製造方法として、前述の製造方法でアクリル系共重合体を製造した後に、必要に応じて粘着付与樹脂及び粘度調整用に酢酸エチル、ヘキサン、MEKなどの有機溶剤を添加し、粘着付与樹脂を溶解させながら混合し、得られた樹脂組成物を取り出す。次に得られた樹脂組成物と無機フィラー及びその他添加剤とを、プラネタリーミキサーなどの低速攪拌機を用い、樹脂組成物、無機フィラー及びその他添加剤が均一になるまで混合し、粘着剤組成物を得る。
(Adhesive manufacturing method)
As a manufacturing method of the pressure-sensitive adhesive composition of the present invention, after manufacturing an acrylic copolymer by the above-described manufacturing method, an organic solvent such as ethyl acetate, hexane, or MEK is used for adjusting the tackifier resin and viscosity as necessary. Add and mix while dissolving the tackifying resin and take out the resulting resin composition. Next, the obtained resin composition and the inorganic filler and other additives are mixed using a low-speed stirrer such as a planetary mixer until the resin composition, the inorganic filler and other additives are uniform, and an adhesive composition Get.
[粘着テープ]
本発明の粘着テープは、前述の粘着剤組成物からなる粘着剤層を有する粘着テープである。本発明の粘着テープは、基材を有する粘着テープであっても基材を有さない粘着剤層のみからなる粘着テープであってもよい。基材を有する粘着テープは、取り扱い性や加工性が良好であり、また基材を有さない粘着剤層のみからなる粘着テープは、熱伝導性や難燃性の効果を得やすいため、目的とする用途等に応じて適宜選択すればよい。
[Adhesive tape]
The pressure-sensitive adhesive tape of the present invention is a pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer made of the above-mentioned pressure-sensitive adhesive composition. The pressure-sensitive adhesive tape of the present invention may be a pressure-sensitive adhesive tape having a base material or a pressure-sensitive adhesive tape comprising only a pressure-sensitive adhesive layer having no base material. The pressure-sensitive adhesive tape having a base material has good handleability and processability, and the pressure-sensitive adhesive tape consisting only of the pressure-sensitive adhesive layer having no base material is easy to obtain effects of thermal conductivity and flame retardancy. What is necessary is just to select suitably according to the use etc. to make.
基材を有する粘着テープとする場合には、基材として、フィルム、不織布、金属箔などを基材として使用できる。なかでもフィルム基材は取り扱い性等に優れるため好ましく使用でき、フィルム基材としては、例えば、ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリエチレンナフタレート、ポリエチレンフィルム、ポリプロピレンフィルム、セロファン、ジアセチルセルロースフィルム、トリアセチルセルロースフィルム、アセチルセルロースブチレートフィルム、ポリ塩化ビニルフィルム、ポリ塩化ビニリデンフィルム、ポリビニルアルコールフィルム、エチレン−酢酸ビニル共重合体フィルム、ポリスチレンフィルム、ポリカーボネートフィルム、ポリメチルペンテンフィルム、ポリスルホンフィルム、ポリエーテルエーテルケトンフィルム、ポリエーテルスルホンフィルム、ポリエーテルイミドフィルム、ポリイミドフィルム、フッソ樹脂フィルム、ナイロンフィルム、アクリル樹脂フィルム等の樹脂フィルム基材を挙げることができる。 When it is set as the adhesive tape which has a base material, a film, a nonwoven fabric, metal foil, etc. can be used as a base material as a base material. Among them, the film substrate is preferably used because it is excellent in handleability and the like. Examples of the film substrate include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyethylene film, polypropylene film, cellophane, diacetyl cellulose film, and triacetyl cellulose. Film, acetylcellulose butyrate film, polyvinyl chloride film, polyvinylidene chloride film, polyvinyl alcohol film, ethylene-vinyl acetate copolymer film, polystyrene film, polycarbonate film, polymethylpentene film, polysulfone film, polyether ether ketone film , Polyethersulfone film, polyetherimide film, polyimide film, Tsu Seo resin film, nylon film, mention may be made of resin film base material such as an acrylic resin film.
基材の片面に粘着剤組成物を貼合させた場合は片面粘着テープとして、基材の両側に粘着剤を貼合した場合は両面粘着テープとなる。基材は熱伝導性や難燃性を阻害させないことを考慮し、材質や厚さを選択する必要がある。特に両面粘着テープの基材として、PETフィルムは強度、絶縁性、難燃性、平滑性、均一な厚さなどの性能面に加え、生産性、入手性の面から好ましい。PETフィルム表面には粘着剤の投錨性を向上させるためにコロナ処理または易接着処理していることが好ましい。 When the adhesive composition is bonded to one side of the substrate, it becomes a single-sided adhesive tape, and when the adhesive is bonded to both sides of the substrate, it becomes a double-sided adhesive tape. It is necessary to select the material and thickness of the base material in consideration of not inhibiting thermal conductivity and flame retardancy. In particular, as a base material for a double-sided pressure-sensitive adhesive tape, a PET film is preferable from the viewpoints of productivity and availability in addition to performance aspects such as strength, insulation, flame retardancy, smoothness and uniform thickness. The PET film surface is preferably subjected to corona treatment or easy adhesion treatment in order to improve the anchoring property of the pressure-sensitive adhesive.
基材の厚さは、樹脂フィルムの場合、3μm〜50μmであることが好ましく、さらに好ましくは6〜25μmが好ましい。当該範囲とすることで、熱伝導性、難燃性を阻害することなく、且つ良好な取り扱い性や加工性を得ることができる。 In the case of a resin film, the thickness of the substrate is preferably 3 μm to 50 μm, more preferably 6 to 25 μm. By setting it as the said range, favorable handleability and workability can be obtained, without inhibiting heat conductivity and a flame retardance.
粘着剤層の厚さは、1回の乾燥後塗工厚さで10μm〜150μmであることが好ましい。当該範囲とすることで、粘着物性を好適に確保しやすく、また、製造時の粘着剤中の希釈溶剤の乾燥が容易となり生産性を向上させやすくなる。 The thickness of the pressure-sensitive adhesive layer is preferably 10 μm to 150 μm as a coating thickness after drying once. By setting it as the said range, it is easy to ensure adhesive physical property suitably, and it becomes easy to dry the dilution solvent in the adhesive at the time of manufacture, and it becomes easy to improve productivity.
粘着テープの厚さは、特に両面粘着テープの場合、20μm〜300μmであることが好ましい。より好ましくは50μm〜250μmである。粘着テープが150μmを超える場合は、2回の塗工工程を経て粘着剤層を積層する等の方法により厚膜形成が可能である。積層時に各粘着剤層の間に基材を貼合すれば基材を有する両面粘着テープとなる。なお、片面テープの場合、粘着剤層の厚さと基材の厚さを足したものが粘着テープ厚さとなる。 The thickness of the adhesive tape is preferably 20 μm to 300 μm, particularly in the case of a double-sided adhesive tape. More preferably, it is 50 micrometers-250 micrometers. When the pressure-sensitive adhesive tape exceeds 150 μm, a thick film can be formed by a method such as laminating a pressure-sensitive adhesive layer through two coating steps. If a base material is bonded between each adhesive layer at the time of lamination | stacking, it will become a double-sided adhesive tape which has a base material. In the case of a single-sided tape, the thickness of the pressure-sensitive adhesive layer plus the thickness of the base material is the pressure-sensitive adhesive tape thickness.
粘着テープの製造方法は、基材を使用しない場合は剥離ライナーなどの支持体に粘着剤組成物をロールコーターやダイコーターなどで一定の厚さで塗布し、ドライヤーで希釈溶剤を乾燥させ、他の剥離ライナーを貼合させる方法により製造できる。両面に剥離処理を施した剥離ライナーを使用した場合は、前述と同様に粘着剤組成物を剥離ライナーに塗布、乾燥した後にそのままロール状に巻き取り製造することができる。
基材を使用する際は前述と同様に粘着剤組成物を剥離ライナーに塗布、乾燥した後に基材の片側に貼合することで片面粘着テープが製造できる。更に剥離ライナーに熱伝導性粘着剤を塗布、乾燥したものを基材のもう一方の側に貼合することで両面粘着テープが製造できる。
When the base material is not used, the pressure-sensitive adhesive tape is manufactured by applying the pressure-sensitive adhesive composition to a support such as a release liner with a constant thickness using a roll coater or die coater, drying the diluted solvent with a dryer, etc. It can manufacture by the method of bonding the release liner of. When a release liner that has been subjected to a release treatment on both sides is used, the pressure-sensitive adhesive composition can be applied to the release liner and dried in the same manner as described above, and then wound into a roll.
When using a base material, a single-sided adhesive tape can be manufactured by apply | coating an adhesive composition to a release liner like the above, and drying and then bonding to the one side of a base material. Furthermore, a double-sided pressure-sensitive adhesive tape can be produced by applying a thermally conductive pressure-sensitive adhesive to a release liner and bonding the dried liner to the other side of the substrate.
粘着剤組成物中の無機フィラーとして、熱伝導難燃性フィラーを使用した熱伝導難燃性粘着剤組成物を使用した本発明の粘着テープ及び両面粘着テープは、特に液晶画像表示のバックライト等に使用されるLED光源の固定に特に好適に使用できる。LED光源の固定は熱伝導性材料、例えば、アルミニウム等の金属材料へ固定することで、より好適な放熱性を実現できる。 As the inorganic filler in the pressure-sensitive adhesive composition, the pressure-sensitive adhesive tape and double-sided pressure-sensitive adhesive tape of the present invention using the heat-conductive flame-retardant pressure-sensitive adhesive composition using a heat-conductive flame-retardant filler are particularly used for backlights for liquid crystal image display, etc. It can be particularly suitably used for fixing the LED light source used in the above. The LED light source can be fixed to a heat conductive material, for example, a metal material such as aluminum, thereby realizing more suitable heat dissipation.
熱伝導難燃性フィラーを使用した粘着テープをLED光源の固定に使用する場合には、粘着テープの熱伝導率は0.6W/m・k以上であることが好ましい。また、難燃性はUnderwriters Laboratories Inc.社の規格において、UL94V−2またはVTM−2以上の性能であることが好ましく、UL94V−0またはVTM−0以上であることが特に好ましい。更に粘着物性として、接着力は5N/20mm幅以上、保持力は、5mm幅×30mm長の面積で100gの荷重をせん断方向にかけた際に24時間保持する性能であることが好ましい。 When the adhesive tape using the heat conductive flame retardant filler is used for fixing the LED light source, the thermal conductivity of the adhesive tape is preferably 0.6 W / m · k or more. In addition, flame retardancy is reported by Underwriters Laboratories Inc. According to the company standard, the performance is preferably UL94V-2 or VTM-2 or higher, particularly preferably UL94V-0 or VTM-0 or higher. Furthermore, as adhesive properties, it is preferable that the adhesive strength is 5 N / 20 mm width or more, and the holding power is a performance of holding for 24 hours when a load of 100 g is applied in the shear direction in an area of 5 mm width × 30 mm length.
以下に実施例について具体的に説明をするが、本発明はこれに限定されるものではない。 Examples will be specifically described below, but the present invention is not limited thereto.
[実施例1]
(1−1)アクリル系共重合体の調整
攪拌機、還流冷却管、窒素導入管、温度計を備えた反応容器に、2−エチルヘキシルアクリレート96.4質量部、β−カルボキシエチルアクリレート2.4質量部、アクリル酸1.2質量部、酢酸エチル98質量部を仕込み、攪拌下、窒素を吹き込みながら75℃まで昇温した。その後、予め酢酸エチルにて溶解したアゾビスイソブチロニトリル溶液2質量部(固形分5質量%)を添加した。その後、攪拌下75℃にて8時間ホールドした後、内容物を冷却し200メッシュ金網にて濾過した。不揮発分50質量%、粘度8000mPa・s、重量平均分子量50万であるアクリル重合体溶液を得た。
[Example 1]
(1-1) Preparation of acrylic copolymer In a reaction vessel equipped with a stirrer, a reflux condenser, a nitrogen introduction tube, and a thermometer, 96.4 parts by mass of 2-ethylhexyl acrylate, 2.4 parts by mass of β-carboxyethyl acrylate Part, 1.2 parts by mass of acrylic acid and 98 parts by mass of ethyl acetate were added, and the temperature was raised to 75 ° C. while blowing nitrogen under stirring. Thereafter, 2 parts by mass (solid content 5% by mass) of an azobisisobutyronitrile solution previously dissolved in ethyl acetate was added. Then, after holding for 8 hours at 75 ° C. with stirring, the contents were cooled and filtered through a 200 mesh wire mesh. An acrylic polymer solution having a nonvolatile content of 50% by mass, a viscosity of 8000 mPa · s, and a weight average molecular weight of 500,000 was obtained.
(1−2)粘着剤組成物の調整
プラネタリーミキサーの容器に無機フィラーとして熱伝導難燃性の水酸化アルミニウム(昭和電工社製ハイジライトH32、平均粒径8μm)を粘着剤組成物固形分100に対し240質量部を入れ、その後、得られた粘着剤組成物を加える。30分攪拌させ水酸化アルミニウムと粘着剤組成物を均一に混合させた。酢酸エチルを加え固形分70%になるよう調整し、粘度4000mPa・sの熱伝導難燃性粘着剤組成物を得た。
(1-2) Adjustment of pressure-sensitive adhesive composition Heat conductive flame retardant aluminum hydroxide (Hijilite H32, Showa Denko Co., Ltd., average particle size: 8 μm) as an inorganic filler in a container of a planetary mixer 240 parts by mass are added to 100, and then the resulting pressure-sensitive adhesive composition is added. The mixture was stirred for 30 minutes to uniformly mix the aluminum hydroxide and the pressure-sensitive adhesive composition. Ethyl acetate was added to adjust the solid content to 70% to obtain a heat conductive flame retardant pressure-sensitive adhesive composition having a viscosity of 4000 mPa · s.
(1−3)粘着テープの調整
(1−2)で得られた熱伝導難燃性粘着剤組成物にエポキシ系架橋剤(三菱ガス化学社製テトラッドC)2%酢酸エチル溶液を熱伝導難燃性粘着剤組成物中のアクリル共重合体固形分100部に対して、2.1部配合し、ディゾルバー攪拌機で30分間攪拌する。得られた粘着剤組成物を剥離ライナーに乾燥後厚さが60μmになるようにロールコーターで塗布し、80℃ドライヤー中で3分間乾燥させる。得られた粘着シートを表面にコロナ処理を施した厚さ6μmのPETフィルムの両側にラミネートし、厚さ125μmの両面粘着テープを作成した。架橋剤の架橋反応のため40℃乾燥機に48時間養生させ両面粘着テープを得た。
(1-3) Adjustment of pressure-sensitive adhesive tape An epoxy-based crosslinking agent (Tetrad C, manufactured by Mitsubishi Gas Chemical Company) 2% ethyl acetate solution is difficult to heat-conductive to the heat-conductive flame-retardant pressure-sensitive adhesive composition obtained in (1-2). 2.1 parts of 100 parts of the acrylic copolymer solid content in the flammable pressure-sensitive adhesive composition are blended and stirred with a dissolver stirrer for 30 minutes. The obtained pressure-sensitive adhesive composition is applied to a release liner with a roll coater so as to have a thickness of 60 μm after drying, and dried in an 80 ° C. dryer for 3 minutes. The obtained pressure-sensitive adhesive sheet was laminated on both sides of a 6 μm-thick PET film having a corona treatment on the surface to prepare a double-sided pressure-sensitive adhesive tape having a thickness of 125 μm. A double-sided pressure-sensitive adhesive tape was obtained by curing in a 40 ° C. dryer for 48 hours for the crosslinking reaction of the crosslinking agent.
[実施例2]
無機フィラーとして水酸化アルミニウム昭和電工社製ハイジライトH32、平均粒径8μm)を粘着剤組成物固形分100に対し260質量部としたこと以外は実施例1と同様に両面粘着テープを得た。
[Example 2]
A double-sided pressure-sensitive adhesive tape was obtained in the same manner as in Example 1, except that aluminum hydroxide Showa Denko Hygielite H32 (average particle size 8 μm) was 260 parts by mass with respect to the pressure-sensitive adhesive composition solid content 100 as the inorganic filler.
[実施例3]
無機フィラーとして水酸化アルミニウム昭和電工社製ハイジライトH32、平均粒径8μm)を粘着剤組成物固形分100に対し220質量部としたこと以外は実施例1と同様に両面粘着テープを得た。
[Example 3]
A double-sided pressure-sensitive adhesive tape was obtained in the same manner as in Example 1, except that aluminum hydroxide Showa Denko Hygielite H32 (average particle size 8 μm) was 220 parts by mass with respect to the pressure-sensitive adhesive composition solid content 100 as the inorganic filler.
[実施例4]
無機フィラーとして水酸化アルミニウム昭和電工社製ハイジライトH32、平均粒径8μm)を粘着剤組成物固形分100に対し200質量部としたこと以外は実施例1と同様に両面粘着テープを得た。
[Example 4]
A double-sided pressure-sensitive adhesive tape was obtained in the same manner as in Example 1, except that aluminum hydroxide Showa Denko Hygielite H32 (average particle size 8 μm) was used as the inorganic filler in an amount of 200 parts by mass with respect to 100 of the pressure-sensitive adhesive composition solid content.
[実施例5]
粘着付与剤としてテルペン樹脂(ヤスハラケミカル社製PX1250)をアクリル共重合体固形分100に対し15質量部、重合ロジンペンタエリスリトール(ハリマ化成社製ハリタックPCJ)をアクリル共重合体固形分100に対し5質量部を配合させたこと以外は実施例1と同様に両面粘着テープを得た。なお、粘着付与剤の配合は後述の粘着剤組成物の調整方法により行った。
[Example 5]
As a tackifier, terpene resin (PX1250 manufactured by Yasuhara Chemical Co., Ltd.) is 15 parts by mass with respect to the acrylic copolymer solid content 100, and polymerized rosin pentaerythritol (Halitac PCJ manufactured by Harima Chemicals Co., Ltd.) is 5 masses with respect to the acrylic copolymer solid content 100. A double-sided pressure-sensitive adhesive tape was obtained in the same manner as in Example 1 except that the parts were blended. In addition, the compounding of the tackifier was performed by the adjustment method of the below-mentioned adhesive composition.
[粘着剤組成物の調整]
得られたアクリル系共重合体に粘着付与剤としてテルペン樹脂(ヤスハラケミカル社製PX1250)をアクリル共重合体固形分100に対し15質量部、重合ロジンペンタエリスリトール(ハリマ化成社製ハリタックPCJ)をアクリル共重合体固形分100に対し5質量部、希釈溶剤としてヘキサン15質量部、酢酸エチル5質量部を加え、60分間攪拌し粘着付与剤を溶解させ、固形分50%、粘度2000mPa・sの粘着剤組成物を得た。得られた粘着剤を前述の(1−2)粘着剤組成物の調整に記載の方法にて調整を行った。
[Adjustment of adhesive composition]
As a tackifier, 15 parts by mass of terpene resin (PX1250 manufactured by Yasuhara Chemical Co., Ltd.) and 100% polymerized rosin pentaerythritol (Haritama PCJ manufactured by Harima Kasei Co., Ltd.) as a tackifier was added to the obtained acrylic copolymer. Add 5 parts by weight of polymer solids 100, 15 parts by weight of hexane as dilution solvent, 5 parts by weight of ethyl acetate, and stir for 60 minutes to dissolve the tackifier. Adhesive with 50% solids and a viscosity of 2000 mPa · s A composition was obtained. The obtained pressure-sensitive adhesive was adjusted by the method described in the above-mentioned (1-2) Preparation of pressure-sensitive adhesive composition.
[実施例6]
粘着付与剤としてテルペン樹脂(ヤスハラケミカル社製PX1250)をアクリル共重合体固形分100に対し5質量部としたこと以外は実施例5と同様に両面粘着テープを得た。
[Example 6]
A double-sided pressure-sensitive adhesive tape was obtained in the same manner as in Example 5 except that the terpene resin (PX1250 manufactured by Yasuhara Chemical Co., Ltd.) was used as a tackifier at 5 parts by mass with respect to the acrylic copolymer solid content 100.
[実施例7]
粘着剤乾燥後塗工厚さを112μmとし、基材に25μm厚PETフィルムを使用し、テープの厚さが250μmとしたこと以外は実施例1と同様に両面粘着テープを得た。
[Example 7]
A double-sided pressure-sensitive adhesive tape was obtained in the same manner as in Example 1 except that the coating thickness after drying the pressure-sensitive adhesive was 112 μm, a 25 μm-thick PET film was used as the substrate, and the thickness of the tape was 250 μm.
[実施例8]
無機フィラーとして水酸化アルミニウム昭和電工社製ハイジライトH32、平均粒径8μm)を粘着剤組成物固形分100に対し260質量部としたこと以外は実施例7と同様に両面粘着テープを得た。
[Example 8]
A double-sided pressure-sensitive adhesive tape was obtained in the same manner as in Example 7 except that aluminum hydroxide Showa Denko Hygielite H32 (average particle size 8 μm) was 260 parts by mass with respect to the pressure-sensitive adhesive composition solid content 100 as the inorganic filler.
[実施例9]
実施例1と同様に得た粘着剤組成物を使用し、粘着剤乾燥後塗工厚さを125μmになるよう剥離ライナーに塗布し、基材を使用せずに、乾燥後に粘着剤層表面に剥離ライナーを貼合させて両面粘着テープを得た。
[Example 9]
The pressure-sensitive adhesive composition obtained in the same manner as in Example 1 was used, and after drying the pressure-sensitive adhesive, it was applied to a release liner so that the coating thickness was 125 μm. A release liner was bonded to obtain a double-sided pressure-sensitive adhesive tape.
[比較例1]
無機フィラーとして水酸化アルミニウム(昭和電工社製ハイジライトH32、平均粒径8μm)を粘着剤組成物固形分100に対し150質量部としたこと以外は実施例5と同様に両面粘着テープを得た。
[Comparative Example 1]
A double-sided pressure-sensitive adhesive tape was obtained in the same manner as in Example 5 except that aluminum hydroxide (Hijilite H32 manufactured by Showa Denko KK, average particle size: 8 μm) was 150 parts by mass with respect to the solid content of the pressure-sensitive adhesive composition as an inorganic filler. .
[比較例2]
アクリル系共重合体の調整において、β―カルボキシエチルアクリレートを使用せず、2−エチルヘキシルアクリレート97.7質量部、アクリル酸2.3質量部添加させたこと以外は実施例5と同様に両面粘着テープを得た。
[Comparative Example 2]
Double-sided adhesive as in Example 5 except that β-carboxyethyl acrylate was not used in preparation of the acrylic copolymer, and 97.7 parts by mass of 2-ethylhexyl acrylate and 2.3 parts by mass of acrylic acid were added. I got a tape.
実施例、比較例として作成した粘着テープについて、以下に示す方法で、ゲル分率、熱伝導性、難燃性、90°ピール接着力、保持力を評価した。 About the adhesive tape created as an Example and a comparative example, the gel fraction, thermal conductivity, a flame retardance, 90 degree peel adhesive force, and retention strength were evaluated by the method shown below.
[ゲル分率]
上記実施例及び比較例にて得られた粘着テープを40mm×50mmに切断した試料を天秤で重量を測定し、トルエンに浸漬し常温下で24時間静置した。浸漬後に試料をとりだし、乾燥機で105℃で1時間乾燥させ、室温で冷却した後に試料の重量を測定した。トルエン浸漬後の試料重量をトルエン浸漬前の試料重量で除して不溶分の割合を百分立で求めた。
[Gel fraction]
Samples obtained by cutting the adhesive tapes obtained in the above Examples and Comparative Examples into 40 mm × 50 mm were weighed with a balance, immersed in toluene, and allowed to stand at room temperature for 24 hours. After immersion, the sample was taken out, dried at 105 ° C. for 1 hour with a drier, cooled at room temperature, and the weight of the sample was measured. The weight of the sample after immersion in toluene was divided by the weight of the sample before immersion in toluene, and the proportion of insoluble matter was determined as a percentage.
[熱伝導率]
上記実施例及び比較例にて得られた粘着テープを空気を巻き込まないように500μmになるまで貼り重ねせた。最外面は厚さ6μmのPETフィルムを貼合した。得られた試料を5cm×15cmに切断して測定用試料を作製した。得られた測定用試料を京都電子工業性熱伝導率測定機QTM−500と、薄膜法測定用ソフトQTM−5Wを使用し測定を行った。
[Thermal conductivity]
The pressure-sensitive adhesive tapes obtained in the above examples and comparative examples were laminated to 500 μm so as not to entrain air. The outermost surface was bonded with a PET film having a thickness of 6 μm. The obtained sample was cut into 5 cm × 15 cm to prepare a measurement sample. The obtained measurement sample was measured using a Kyoto Electronics Industrial thermal conductivity measuring device QTM-500 and a thin film method measurement software QTM-5W.
[難燃性]
上記実施例及び比較例にて得られた粘着テープをUnderwriters Laboratories Inc.社UL94VTMの規格に準じて試験を行った。なお、基材を有さない粘着テープは、筒状の形成が困難なため同社UL94Vの規格に準じて試験を行った。
難燃性のクラスは下表により判定した。
[Flame retardance]
The adhesive tapes obtained in the above examples and comparative examples were obtained from Underwriters Laboratories Inc. The test was conducted according to the standard of UL94VTM. In addition, since the adhesive tape which does not have a base material cannot form a cylinder shape, it tested according to the specification of the company UL94V.
The flame retardancy class was determined according to the following table.
[90°ピール接着力]
上記実施例及び比較例にて得られた粘着テープの片面に厚さ50μmのアルミ箔を貼合し20mm幅に切断した。23℃50%RH雰囲気下でもう一方の粘着面をアルミ板に2kgローラー1往復の加圧条件で貼付し、1時間静置後に90°方向へ300mm/分の速度で引き剥がした際の接着力を測定した。
[90 ° peel adhesion]
An aluminum foil having a thickness of 50 μm was bonded to one side of the pressure-sensitive adhesive tape obtained in the above examples and comparative examples, and cut into a width of 20 mm. Adhesion when the other adhesive surface is affixed to an aluminum plate under a reciprocating pressure of 2 kg roller in a reciprocating atmosphere at 23 ° C and 50% RH, and left for 1 hour and then peeled off at a rate of 300 mm / min in the 90 ° direction. The force was measured.
[保持力]
上記実施例及び比較例にて得られた粘着テープを5mm幅×30mm長さとした試料を、厚さ500μmのアルミ板の片端に貼付した。23℃50%RH雰囲気下でもう一方の粘着面をアルミ板に貼付し、5kgローラー1往復1往復の加圧条件で貼付し、1時間静置した。静置後に85℃雰囲気下でせん断方向に100gの荷重をかけ、試料が剥がれ落下するまでの時間を測定した。24時間後に試料の落下が無かった場合は試験を終了し24時間以上(>24)と記載した。
[Retention force]
The sample which made the adhesive tape obtained in the said Example and comparative example 5 mm width x 30 mm length was affixed on the one end of the 500-micrometer-thick aluminum plate. The other adhesive surface was affixed to an aluminum plate in an atmosphere of 23 ° C. and 50% RH, affixed under a pressure condition of one reciprocation and one reciprocation of a 5 kg roller, and allowed to stand for 1 hour. After standing, a load of 100 g was applied in the shear direction in an atmosphere at 85 ° C., and the time until the sample peeled off and dropped was measured. When the sample did not fall after 24 hours, the test was terminated and it was described as 24 hours or longer (> 24).
上記表1〜2から明らかなように、実施例1〜9の本願発明の粘着剤組成物は、多量の無機フィラーを添加した場合にも優れた接着性を実現でき、良好な難燃性や熱伝導性と、好適な接着性とを両立できるものであった。一方、比較例1〜2の粘着剤組成物は、無機フィラーの有する特性が充分に発揮されないか、接着性に乏しいものであった。 As is clear from Tables 1 and 2 above, the pressure-sensitive adhesive compositions of the present invention of Examples 1 to 9 can realize excellent adhesion even when a large amount of inorganic filler is added, and have good flame retardancy and It was possible to achieve both thermal conductivity and suitable adhesiveness. On the other hand, the pressure-sensitive adhesive compositions of Comparative Examples 1 and 2 did not sufficiently exhibit the characteristics of the inorganic filler or had poor adhesion.
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JP6264022B2 (en) * | 2013-12-20 | 2018-01-24 | Dic株式会社 | Thermally conductive adhesive sheet, article and image display device |
JP6404590B2 (en) * | 2014-04-18 | 2018-10-10 | 日東電工株式会社 | Double-sided adhesive sheet for portable electronic devices |
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JP6454139B2 (en) * | 2014-11-26 | 2019-01-16 | マクセルホールディングス株式会社 | Adhesive composition precursor, adhesive composition and method for producing the same, adhesive sheet and method for producing the same, and electronic device including the adhesive sheet |
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