JP5806493B2 - Positive photosensitive resin composition, dry film, cured product, and printed wiring board - Google Patents

Description

  The present invention relates to a positive photosensitive resin composition, a dry film using the same, a cured product thereof, and a printed wiring board using the cured product.

  In recent years, from the viewpoint of high accuracy and high density, solder printed circuit boards for consumer use and industrial printed circuit boards are used to form images by developing after UV irradiation, and finish-curing by heat and / or light irradiation ( A liquid development type solder resist that is fully cured) is used. In addition, there is a demand for improved solder resist workability and higher performance in response to the increase in the density of printed wiring boards accompanying the reduction in size and size of electronic equipment.

  The photosensitive resin composition used for the liquid development type solder resist includes a positive type in which the exposed portion is easily dissolved in addition to the negative type in which the exposed portion is difficult to dissolve in the developer.

  The positive-type photosensitive resin composition has a photosensitive compound containing a quinonediazide group called a photosensitizer as one of the usual structural requirements, and the quinonediazide group in the photosensitive compound is irradiated with light having a wavelength of 300 to 500 nm. As a result of decomposition, a carboxyl group is generated, whereby the photoresist material changes from alkali-insoluble to alkali-soluble and can be developed.

Japanese Patent Application Laid-Open No. 11-052568 Japanese Patent Laid-Open No. 2000-250211 JP 2000-147757 A JP-A-10-153868 JP-A-7-64284

  An object of the present invention is to use a novel positive photosensitive resin composition having a composition different from that of a conventional positive resin composition, a dry film using the same, a cured product thereof, and a cured product thereof. It is to provide a printed wiring board.

  As a result of intensive studies aimed at realizing the above-mentioned object, the present inventors have found that a positive photosensitive resin composition having a specific composition, which has not been considered to be a positive photosensitive resin composition, can be obtained. The present inventors have found that it becomes a composition and have completed the present invention.

  That is, the positive photosensitive resin composition of the present invention contains an epoxy resin having a tertiary amine structure, a phenol resin, and a photocationic polymerization initiator.

  Another positive type photosensitive resin composition of the present invention is characterized by containing an epoxy resin, a phenol resin, a photocationic polymerization initiator, and a heterocyclic compound.

  The heterocyclic compound is preferably a nitrogen-containing heterocyclic compound, and more preferably an imidazole compound.

  The photosensitive dry film of the present invention is obtained by applying and drying any of the positive photosensitive resin compositions described above on a film.

  The cured product of the present invention is obtained by patterning any of the above positive photosensitive resin compositions or photosensitive dry films by irradiation with active energy rays and curing by heating. is there.

  The printed wiring board of the present invention comprises the above cured product.

  According to the present invention, a positive photosensitive resin composition having a composition different from that of a conventional positive photosensitive resin composition, a dry film using the same, a cured product thereof, and a printed wiring board using the same are provided. be able to.

  Hereinafter, embodiments of the present invention will be described in detail.

[Epoxy resin]
The positive photosensitive resin composition of the present invention uses an epoxy resin having a tertiary amine structure as an epoxy resin, or when it contains a heterocyclic compound, the type of the epoxy resin is not particularly limited, Widely known and commonly used epoxy resins can be used.

  As the epoxy resin having a tertiary amine structure, a known epoxy resin having a tertiary amine structure can be used. Specifically, N, N-dimethylaminoethyl glycidyl ether, N, N-dimethylaminotolyl glycidyl ether, N, N-dimethylaminophenyl glycidyl ether, N, N-diglycidyl-4-glycidyloxyaniline, 1,3 , 5-triglycidyl isocyanurate, N, N-diglycidylaniline, 4,4′-methylenebis [N, N-diglycidylaniline, isocyanate-modified epoxy resin, and the like. Commercially available products include N, N-diglycidyl-4-glycidyloxyaniline jER630 (Mitsubishi Chemical), 1,3,5-triglycidyl isocyanurate, Araldide PT810 (BASF) and TEPIC (Nissan Chemical). XAC4151, AER4152 (made by Asahi Kasei E-Materials) etc. are mentioned as an isocyanate modified epoxy resin. Further, the epoxy resin having a tertiary amine structure is preferably a nitrogen-containing heterocyclic epoxy resin, an aniline type epoxy resin, or an isocyanate-modified epoxy resin. The said epoxy resin which has a tertiary amine structure may be used individually by 1 type, and may be used in combination of 2 or more type.

  In the present invention, the amine having the tertiary amine structure of the epoxy resin having the tertiary amine structure more preferably has a linear or branched epoxyalkyl group having 3 to 10 carbon atoms, and particularly 3 to 3 carbon atoms. It is preferable to have 6 linear or branched epoxyalkyl groups.

  Specific examples of preferable compounds of the epoxy resin having the tertiary amine structure include the following compounds, but the present invention is not limited to these compounds.

Ｎ，Ｎ−ジグリシジル−４−グリシジルオキシアニリン

N, N-diglycidyl-4-glycidyloxyaniline

１，３，５−トリグリシジルイソシアヌレート

1,3,5-triglycidyl isocyanurate

  In the positive photosensitive resin composition of the present invention containing the heterocyclic compound, any known epoxy resin can be used, and the epoxy resin having the tertiary amine structure. May be. Examples of the epoxy resin include jER828, jER834, jER1001, and jER1004 manufactured by Mitsubishi Chemical Corporation, Epicron 840, Epicron 850, Epicron 1050, Epicron 2055, Epoto YD-011, YD-013 manufactured by Tohto Kasei Co., Ltd. YD-127, YD-128, D.C. E. R. 317, D.E. E. R. 331, D.D. E. R. 661, D.E. E. R. 664, Sumitomo Epoxy ESA-011, ESA-014, ELA-115, ELA-128, manufactured by Sumitomo Chemical Co., Ltd., A.A. E. R. 330, A.I. E. R. 331, A.I. E. R. 661, A.I. E. R. Bisphenol A type epoxy resin such as 664 (all trade names); jERYL903 manufactured by Mitsubishi Chemical, Epicron 152, Epicron 165 manufactured by DIC, Epototo YDB-400, YDB-500 manufactured by Tohto Kasei Co., Ltd., manufactured by Dow Chemical Of D. E. R. 542, Sumitomo Epoxy ESB-400, ESB-700, manufactured by Sumitomo Chemical Co., Ltd., A. E. R. 711, A.I. E. R. Brominated epoxy resins such as 714 (both trade names); jER152 and jER154 manufactured by Mitsubishi Chemical Corporation, and D.C. E. N. 431, D.D. E. N. 438, Epicron N-730, Epicron N-770, Epicron N-865 manufactured by DIC, Epototo YDCN-701, YDCN-704 manufactured by Tohto Kasei Co., Ltd. EPPN-201, EOCN-1025, EOCN manufactured by Nippon Kayaku Co., Ltd. -1020, EOCN-104S, RE-306, NC-3000, Sumitomo Epoxy ESCN-195X, ESCN-220, manufactured by Sumitomo Chemical Co., Ltd., A.C. E. R. Novolak type epoxy resins such as ECN-235, ECN-299, etc. (both trade names); Epicron 830 manufactured by DIC, jER807 manufactured by Mitsubishi Chemical Co., Ltd. Epototo YDF-170, YDF-175, YDF-2004 manufactured by Tohto Kasei Co., Ltd. (All trade names) bisphenol F-type epoxy resin; hydrogenated bisphenol A-type epoxy resins such as Epototo ST-2004, ST-2007, ST-3000 (trade name) manufactured by Toto Kasei Co., Ltd .; jER604, Etototo YH-434 manufactured by Tohto Kasei Co., Ltd. Sumitomo Chemical Co., Ltd. Sumi-epoxy ELM-120, etc. (all trade names) glycidylamine type epoxy resin; Hydantoin type epoxy resin; 2021 etc. (all trade names) alicyclic epoxy resin; Y manufactured by Mitsubishi Chemical Corporation -933, manufactured by Dow Chemical Company of T. E. N. , EPPN-501, EPPN-502, etc. (all trade names) trihydroxyphenylmethane type epoxy resin; Mitsubishi Chemical Corporation YL-6056, YX-4000, YL-6121 (all trade names) Type or biphenol type epoxy resin or a mixture thereof; Nippon Kayaku EBPS-200, ADEKA EPX-30, DIC EXA-1514 (trade name) and other bisphenol S type epoxy resins; Bisphenol A novolac type epoxy resin such as jER157S (trade name); tetraphenylolethane type epoxy resin such as jERYL-931 (all trade name) made by Mitsubishi Chemical; TEPIC made by Nissan Chemical Industries (all) Product name) heterocyclic epoxy resin; Niguri such as Bremer DGT manufactured by NOF Corporation Zylphthalate resin; Tetraglycidylxylenoylethane resin such as ZX-1063 manufactured by Tohto Kasei; ESN-190, ESN-360 manufactured by Nippon Steel Chemical Co., Ltd., HP-4032, EXA-4750, EXA-4700 manufactured by DIC Naphthalene group-containing epoxy resin; epoxy resin having a dicyclopentadiene skeleton such as HP-7200 and HP-7200H manufactured by DIC; glycidyl methacrylate copolymer epoxy resin such as CP-50S and CP-50M manufactured by NOF Corporation; Furthermore, a polyfunctional epoxy resin such as a copolymerized epoxy resin of cyclohexylmaleimide and glycidyl methacrylate; a CTBN-modified epoxy resin (for example, YR-102, YR-450, etc. manufactured by Tohto Kasei Co., Ltd.) can be mentioned. Absent. Among these, a cresol novolac type epoxy resin and a phenol novolac type epoxy resin are preferable. These epoxy resins may be used alone or in combination of two or more.

[Phenolic resin]
As a phenol resin, a well-known phenol resin can be used. For example, a phenol novolak resin, a cresol novolak resin, a bisphenol A type novolak resin, a bisphenol F type novolak resin, a naphthol novolak resin, and the like can be given. Of these, phenol novolac resins and cresol novolac resins are preferable, and phenol novolac resins are particularly preferable. Such a phenol resin may be used individually by 1 type, and may be used in combination of 2 or more type.

  The blending amount of the phenol resin is preferably 20 to 150 parts by mass, more preferably 35 to 130 parts by mass, and further preferably 50 to 100 parts by mass with respect to 100 parts by mass of the epoxy resin as a solid content. If it is less than 20 parts by mass, development cannot be performed and the desired resolution cannot be obtained. On the other hand, if it exceeds 150 parts by mass, the alkali resistance is lowered and the desired resolution cannot be obtained.

[Photocationic polymerization initiator]
Any known cationic photopolymerization initiator can be used. In the present invention, the photocation polymerization initiator may be any compound that generates a cation upon irradiation with an active energy ray, and is actually a photocation as long as the positive pattern expression that is the effect of the present invention is obtained. It is not limited by whether or not it functions as a polymerization initiator. Examples of the cationic photopolymerization initiator include diphenyliodonium tetrafluoroboroate, triphenylsulfonium hexafluoroantimonate, 2,4,6-triphenylthiopyrylium hexafluorophosphate, and commercially available products such as Optoma manufactured by ADEKA Corporation. -SP-170, SP-152, sulfonium salt photocationic polymerization initiators such as CPI-100P, CPI-101A, CPI-200K, CPI-210S manufactured by San Apro, Irgacure (registered trademark) 261 manufactured by BASF, etc. Is mentioned. Among these, SP-152, CPI-100P, and CPI-200K are preferable, and a sulfonium salt-based photocationic polymerization initiator having hexafluorophosphate as a counter anion is particularly preferable. Such photocationic polymerization initiators may be used alone or in combination of two or more.

  The compounding amount of the photocationic polymerization initiator is preferably 1 to 25 parts by mass, more preferably 5 to 20 parts by mass, and further preferably 10 to 20 parts by mass with respect to 100 parts by mass of the epoxy resin as a solid content. is there. When the amount is less than 1 part by mass, development resistance cannot be obtained in the unexposed part, and a pattern cannot be obtained. On the other hand, when the amount exceeds 25 parts by mass, development resistance is developed in the exposed portion and resolution cannot be obtained.

[Heterocyclic compound]
As the heterocyclic compound, any known compound can be used. For example, nitrogen-containing heterocyclic compounds such as piperidine, piperazine, pyrrolidine, pyrrole, pyridine, pyrazine, pyrimidine, triazole, pyrazole, imidazole, indole, oxazole and thiazole compounds, oxygen-containing compounds such as furan, tetrahydrofuran and tetrahydropyran compounds Examples thereof include sulfur-containing heterocyclic compounds such as heterocyclic compounds, thiophene, and tetrahydrothiophene compounds. Of these, nitrogen-containing heterocyclic compounds are preferable, and imidazole compounds are more preferable. Examples of imidazole compounds include imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 4-phenylimidazole, 1-cyanoethyl-2-phenylimidazole, 1- (2 -Cyanoethyl) -2-ethyl-4-methylimidazole and the like. Such a heterocyclic compound may be used individually by 1 type, and may be used in combination of 2 or more type.

  The compounding amount in the case of compounding the heterocyclic compound is preferably 1 to 10 parts by mass, more preferably 1 to 5 parts by mass with respect to 100 parts by mass of the epoxy resin as a solid content. If it is less than 1 part by mass, the unexposed part has no development resistance and a pattern cannot be obtained. On the other hand, when the amount exceeds 10 parts by mass, development resistance is developed in the exposed portion and resolution cannot be obtained.

[Binder polymer]
Furthermore, a binder polymer can be used in the positive photosensitive resin composition of the present invention for the purpose of improving touch drying properties and handling properties. Examples of the binder polymer that can be used include polyester polymers, polyurethane polymers, polyester urethane polymers, polyamide polymers, polyester amide polymers, acrylic polymers, cellulose polymers, polylactic acid polymers, and phenoxy polymers. Examples thereof include polymers. These binder polymers may be used alone or as a mixture of two or more.

  The blending amount in the case of blending the binder polymer is preferably 5 to 50 parts by mass, more preferably 10 to 40 parts by mass with respect to 100 parts by mass of the epoxy resin as a solid content. When it is less than 5 parts by mass, handling cracks occur. On the other hand, if it exceeds 50 parts by mass, the developability is lowered and satisfactory resolution cannot be obtained.

  The positive photosensitive resin composition of the present invention may further include various additives and components, for example, an antioxidant, a filler (filler), a silane coupling agent, a thermosetting component, if necessary. Photosensitive monomers such as thermosetting catalysts, photocurable components, photoinitiator aids or sensitizers, compounds having isocyanate groups or blocked isocyanate groups, urethanization catalysts, compounds having ethylenically unsaturated groups, elastomers, organic solvents , Colorants, ultraviolet absorbers, chain transfer agents, adhesion promoters, thixotropic agents, thermal polymerization inhibitors, antifoaming agents, leveling agents, rust inhibitors, copper damage inhibitors, and the like can be blended.

  The positive photosensitive resin composition of the present invention is adjusted to a viscosity suitable for the coating method using, for example, the organic solvent, and is applied on the substrate by a dip coating method, a flow coating method, a roll coating method, a bar coater method, screen printing. A tack-free coating film can be formed by applying the organic solvent contained in the composition at a temperature of about 60 to 100 ° C. and performing volatile drying (temporary drying). Thereafter, the exposed portion is selectively exposed to active energy rays through a photomask on which a pattern is formed by a contact method (or non-contact method), or directly exposed to a pattern by a laser direct exposure machine, and the exposed portion is exposed to an alkaline aqueous solution (for example 0.3 A resin insulating layer pattern is formed by development with a ~ 3% sodium carbonate aqueous solution) or an organic solvent. Furthermore, since the positive photosensitive resin composition of the present invention contains an epoxy resin and a phenol resin, for example, it is heated to a temperature of about 100 to 200 ° C. and cured by heat, A cured coating film excellent in various properties such as moisture absorption resistance, adhesion, and electrical characteristics can be formed. In addition, if it contains a photocurable component having an ethylenically unsaturated bond, the radically polymerized ethylenically unsaturated bond of the photocurable component remaining in an unreacted state upon exposure is subjected to heat treatment. In order to improve the coating properties, heat treatment (thermosetting) may be performed depending on the purpose and application.

  As the substrate, in addition to a printed circuit board and a flexible printed circuit board in which circuits are formed in advance, paper-phenol resin, paper-epoxy resin, glass cloth-epoxy resin, glass-polyimide, glass cloth / non-woven cloth-epoxy resin , Glass cloth / paper-epoxy resin, synthetic fiber-epoxy resin, copper-clad laminate of all grades (FR-4 etc.) using polyimide, polyethylene, PPO, cyanate ester, etc., polyimide film, PET A film, a glass substrate, a ceramic substrate, a wafer plate, or the like can be used.

  Volatile drying performed after applying the positive photosensitive resin composition of the present invention can be performed using a hot-air circulating drying furnace, an IR furnace, a hot plate, a convection oven, or the like.

  As the exposure machine used for the exposure by the active energy ray irradiation, a direct drawing apparatus (for example, a laser direct imaging apparatus that directly draws an image with a laser using CAD data from a computer), an exposure machine equipped with a metal halide lamp, (ultra) high pressure An exposure machine equipped with a mercury lamp, an exposure machine equipped with a mercury short arc lamp, or a direct drawing apparatus using an ultraviolet lamp such as a (super) high pressure mercury lamp can be used. When laser light is used as the active energy ray, either a gas laser or a solid laser may be used as long as the maximum wavelength is in the range of 350 to 410 nm. As the direct drawing device, for example, a device that oscillates a laser beam having a maximum wavelength of 350 to 410 nm can be used, such as those manufactured by Nippon Orbotec, Pentax, etc. Any device may be used as long as it is manufactured by Oak Seisakusho or Dainippon Screen.

  The developing method can be a dipping method, a shower method, a spray method, a brush method or the like, and as a developer, potassium hydroxide, sodium hydroxide, sodium carbonate, potassium carbonate, sodium phosphate, sodium silicate, Alkaline aqueous solutions such as ammonia and amines can be used. In developing with an organic solvent, an organic solvent such as acetone, toluene, or methyl ethyl ketone can be used.

As described above, the positive photosensitive resin composition of the present invention was formed by applying and drying the photosensitive resin composition on a film of polyethylene terephthalate or the like in advance, in addition to the method of applying it directly to the substrate in a liquid state. It can also be used in the form of a dry film having a positive photosensitive resin composition layer.
The case where the positive photosensitive resin composition of the present invention is used as a dry film is shown below.

  The dry film has a structure in which a carrier film, a photosensitive resin composition layer, and a peelable cover film used as necessary are laminated in this order. The photosensitive resin composition layer is a layer obtained by applying and drying the photosensitive resin composition on a carrier film or a cover film, and may be two or more layers depending on the purpose. After forming the photosensitive resin composition layer on the carrier film, the cover film is laminated thereon, or the photosensitive resin composition layer is formed on the cover film, and this laminate is laminated on the carrier film. can get.

As the carrier film, a thermoplastic film such as a polyester film having a thickness of 2 to 150 μm is used.
The photosensitive resin composition layer is formed by uniformly applying the positive photosensitive resin composition of the present invention to a carrier film or a cover film with a thickness of 10 to 150 μm using a blade coater, lip coater, comma coater, film coater, and the like. Formed. When there are two or more photosensitive resin composition layers, the positive photosensitive resin composition of the present invention may be applied on another photosensitive resin composition layer.
As the cover film, a polyethylene film, a polypropylene film, and the like can be used, but those having an adhesive force with the photosensitive resin composition layer smaller than that of the carrier film are preferable.

  To create a resin insulation layer on a printed wiring board using a dry film, peel off the cover film, stack the photosensitive resin composition layer and the substrate on which the circuit is formed, and bond them together using a laminator, etc. A photosensitive resin composition layer is formed on the formed substrate. If the formed photosensitive resin composition layer is exposed, developed and heat-cured in the same manner as described above, a cured coating film can be formed. The carrier film may be peeled off either before exposure or after exposure.

  EXAMPLES Hereinafter, although an Example and a comparative example are shown and this invention is demonstrated concretely, this invention is not limited to the following Example. In the following, “parts” and “%” are based on mass unless otherwise specified.

<Preparation of resin composition>
It mix | blends with the ratio (mass part) shown in Table 1 with the various components shown in following Table 1, knead | mixes with a 3 roll mill after premixing with a stirrer, Examples 1-5, Reference Examples 6 and 7 And the resin composition of Comparative Examples 1 and 2 was prepared.

<Production of dry film>
The resin compositions of Examples 1 to 5, Reference Examples 6 and 7, and Comparative Examples 1 and 2 were each diluted with methyl ethyl ketone and coated on a PET film (38 μm). This was dried at 90 ° C. for 15 minutes to form a dry coating film having a thickness of 20 μm, and a cover film was further bonded thereon to produce a dry film.

<Creation of evaluation board>
A solid copper (laminated copper foil) was immersed in Mec Etch Bond CZ-8100B (made by Mec Co., Ltd.) at 30 ° C. to perform a roughening treatment (Ra value: 1 μm). The cover film was peeled off from the dry film produced above and laminated on a pretreated copper foil substrate (70 ° C., vacuuming 60 seconds, slap down 0.10 MPa, 8 seconds). Subsequently, pattern exposure was performed with an optimal exposure amount using an exposure apparatus in which a metal halide lamp was mounted on the substrate (3 J / cm ² on the resist). After exposure, the carrier film was peeled off and heated at 90 ° C. for 15 minutes. Thereafter, development was performed by immersion with stirring in a 5.0 wt% aqueous 2-aminoethanol solution (35 ° C., 3 minutes) to obtain an evaluation substrate on which a pattern was formed.

<Evaluation of positive pattern>
About the obtained evaluation board | substrate, the expression property of the positive type pattern using the resin composition of Examples 1-5, Reference Examples 6 and 7, and Comparative Examples 1 and 2 was evaluated visually. The results are shown in Table 1 below.

＊１ フェノールノボラック樹脂（ＨＦ−１ＣＡ７５（固形分：７５ｗｔ％）、明和化成社製）
＊２ クレゾールノボラック樹脂（ＭＥＲ−７９５９ＣＡ７５（固形分：７５ｗｔ％）、明和化成社製）
＊３ スルホニウム塩系光カチオン重合開始剤（ＣＰＩ−１００Ｐ、サンアプロ社製）
＊４ スルホニウム塩系光カチオン重合開始剤（アデカオプトマーＳＰ−１５２、ＡＤＥＫＡ社製）
＊５ アニリン型エポキシ樹脂（Ｎ，Ｎ−ジグリシジル−４−グリシジルオキシアニリン：ＪＥＲ６３０、ジャパンエポキシレジン社製）
＊６ クレゾールノボラック型エポキシ樹脂（ＥＯＣＮ−１０４ＳＨ７０（固形分：７０ｗｔ％）、日本化薬製）
＊７ 含窒素複素環式エポキシ樹脂（１，３，５−トリグリシジルイソシアヌレート：ＴＥＰＩＣ−ＨＰ、日産化学工業社製）
＊８ ２−エチル−４−メチルイミダゾール（２Ｅ４ＭＺ、四国化成工業社製）
＊９ ２−フェニル−４，５−ジヒドロキシメチルイミダゾール（２ＰＨＺ、四国化成工業社製）
＊１０ フェノキシ樹脂（ＹＸ８０００ＢＨ３０（固形分：３０ｗｔ％）、三菱化学社製）
＊１１ ３元ブロック共重合体：ポリスチレン−ポリブタジエン−ポリメチルメタクリレート（ＳＢＭ−Ｅ４１（固形分：３０ｗｔ％）、アルケマ（株）製）

* 1 Phenol novolac resin (HF-1CA75 (solid content: 75 wt%), manufactured by Meiwa Kasei Co., Ltd.)
* 2 Cresol novolac resin (MER-7959CA75 (solid content: 75 wt%), manufactured by Meiwa Kasei Co., Ltd.)
* 3 Sulfonium salt photocationic polymerization initiator (CPI-100P, manufactured by San Apro)
* 4 Sulfonium salt photocationic polymerization initiator (Adekaoptomer SP-152, manufactured by ADEKA)
* 5 Aniline type epoxy resin (N, N-diglycidyl-4-glycidyloxyaniline: JER630, manufactured by Japan Epoxy Resin Co., Ltd.)
* 6 Cresol novolac epoxy resin (EOCN-104SH70 (solid content: 70 wt%), manufactured by Nippon Kayaku)
* 7 Nitrogen-containing heterocyclic epoxy resin (1,3,5-triglycidyl isocyanurate: TEPIC-HP, manufactured by Nissan Chemical Industries)
* 8 2-Ethyl-4-methylimidazole (2E4MZ, manufactured by Shikoku Chemicals)
* 9 2-Phenyl-4,5-dihydroxymethylimidazole (2PHZ, manufactured by Shikoku Chemicals)
* 10 Phenoxy resin (YX8000BH30 (solid content: 30 wt%), manufactured by Mitsubishi Chemical Corporation)
* 11 Ternary block copolymer: Polystyrene-polybutadiene-polymethyl methacrylate (SBM-E41 (solid content: 30 wt%), manufactured by Arkema Co., Ltd.)

From the results shown in Examples 1 to 5 , it was made clear that the resin composition of the present embodiment expresses a positive pattern. In addition, as shown in Comparative Example 1, when an epoxy resin having no tertiary amine structure is used, a positive pattern cannot be obtained. From the results of Reference Examples 6 and 7, such a tertiary amine is obtained. Even when an epoxy resin having no structure is used, it has been clarified that a positive pattern can be obtained by using a heterocyclic compound. As shown in Comparative Example 2, it was clarified that no positive pattern was developed when no phenol resin was contained.

Claims (4)

At least one selected from an epoxy resin having a tertiary amine structure and 1,3,5-triglycidyl isocyanurate;
Phenol resin (however, a resin compound having a weight average molecular weight of 500 to 40,000 having an acid-decomposable ester group, and a resin having a weight average molecular weight of 500 to 40,000 obtained by adding a monovinyl ether compound to a resin having a phenolic hydroxyl group) Except)
A positive-type photosensitive resin composition comprising a photocationic polymerization initiator.   The photosensitive dry film obtained by apply | coating and drying the positive photosensitive resin composition of Claim 1 on a film.   A cured product obtained by patterning the positive photosensitive resin composition according to claim 1 or the photosensitive dry film according to claim 2 by irradiation with active energy rays and curing by heating. .   A printed wiring board comprising the cured product according to claim 3.