JP5747469B2 - Heat sink device, heat sink mounting device, and heat sink control method - Google Patents

Description

  The present invention relates to a heat sink device, a heat sink mounting device, and a heat sink control method.

  In recent years, processes of arithmetic processing devices such as a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit) have been miniaturized. As the process becomes finer, the processing unit is increased in density and speed and the processing capability is improved. However, the heat generation amount of the processing unit increases and the temperature rises accordingly.

  Therefore, a heat sink with a cooling fan is installed in the arithmetic processing unit in order to cool the arithmetic processing unit whose calorific value has increased. The arithmetic processing unit is cooled by blowing the wind generated by rotating the cooling fan of the heat sink with the cooling fan to the heat sink made of a metal material that easily conducts heat.

  FIG. 15 shows a conventional heat sink with a cooling fan. A broken line in FIG. 15 represents an arithmetic processing unit such as a CPU or a GPU, and the CPU or the GPU is cooled by the heat sink by being installed under the heat sink. As shown in FIG. 15, conventionally, one heat sink has been installed for one cooling point.

JP 2000-193282 A

  There is a variation in the amount of heat generated by the arithmetic processing unit. For example, the CPU generates a heat generation amount that cannot be cooled by the normal rotation of one cooling fan, and the GPU generates a surplus in the amount of cooling heat by the normal rotation of one cooling fan. . In such a case, the cooling fan that cools the CPU needs to be cooled by rotating the cooling fan at a high speed, and the frequency of the high-speed rotation of the cooling fan increases. Will also occur.

  In one aspect, the present invention aims to reduce the power consumption or noise of a cooling fan.

A heat sink device according to an embodiment is directed from a plurality of cooling fans, a plurality of radiating fins, and a first cooling fan of the plurality of cooling fans to a first radiating fin of the plurality of radiating fins. A first heat sink portion having a wind ventilation path; and a second heat sink section having a wind ventilation path from a second cooling fan of the plurality of cooling fans to a second radiation fin of the plurality of radiation fins. And the first heat sink part and the second heat sink part are connected to each other, and either the air flow path of the first heat sink part or the air flow path of the second heat sink part A connecting portion in which a connecting ventilation path of wind from one side to the other is formed, and a state where the connecting ventilation path is closed and a state where the connecting ventilation path is opened; The air passing through the connecting portion is controlled by transitioning from one state to the other state, and the wind from the first cooling fan of the first heat sink portion is closed while the connecting air passage is closed. Air is blown to the first heat dissipating fin of the first heat sink part and air from the second cooling fan of the second heat sink part is blown to the second heat dissipating fin of the second heat sink part. The air from the first cooling fan in the first heat sink portion and the air from the second cooling fan in the second heat sink portion are opened to the first heat sink in a state where the connection ventilation path is opened. and part of the first heat radiation fin or a valve for blowing air into one of the radiation fins of the second heat radiation fins of the second heat sink part, the respectively provided on the first and second heat sink portion And a second temperature sensor, said both controls the rotational speed of the cooling fan according to the first and the detected value of the second temperature sensor, and a control unit for controlling said valve, said first temperature sensor When the detected value exceeds the first reference value and the detected value of the second temperature sensor exceeds the second reference value higher than the first reference value, the rotation speed of the cooling fan is held at a predetermined value. Then, the state is changed from a state in which the connection ventilation path is closed to a state in which the connection ventilation path is opened, and the wind from the first cooling fan of the first heat sink part and the second cooling of the second heat sink part are performed. The valve is controlled so that the wind from the fan is blown to the second heat radiating fin of the second heat sink part, and the detected value of the second temperature sensor exceeds a first reference value, and the second The detected value of temperature sensor 1 is the first reference value If the second reference value is higher than the second reference value, the number of rotations of the cooling fan is maintained at a predetermined value, the state where the connection ventilation path is closed, and the state where the connection ventilation path is opened is changed, and the second heat sink unit The valve so as to blow the wind from the second cooling fan and the wind from the first cooling fan of the first heat sink part to the first heat dissipating fin of the first heat sink part. And when the detection values of both the first and second temperature sensors exceed the second reference value, the rotational speed of the cooling fan is set higher than a predetermined value so as to close the connection ventilation path. Control the valve .

  Reduce the power consumption or noise of the cooling fan.

FIG. 1 is a top view illustrating an example of a heat sink device. FIG. 2 is a side sectional view showing an example of the heat sink device. FIG. 3 is a top view showing an example of the heat sink device when the airflows of two cooling fans are blown to one arithmetic processing unit. FIG. 4 is a top view showing an example of a heat sink device when the air flow of one or more cooling fans is blown to one arithmetic processing device. FIG. 5 is a top view showing an example of the heat sink device when the air flow rate of one or more cooling fans is blown to the other arithmetic processing unit. FIG. 6 is a top view showing an example of the heat sink device when the air flow of two cooling fans is blown to the other arithmetic processing unit. FIG. 7 is a block diagram illustrating an example of a heat sink device. FIG. 8 is a diagram illustrating an example of a heat sink mounting device using a heat sink device. FIG. 9 is a diagram illustrating an example of a hardware configuration of a heat sink device and an information processing apparatus including the heat sink device. FIG. 10 is a diagram illustrating a control table defining an example of the cooling fan and the movable axis control executed by the control unit. FIG. 11 is a diagram illustrating an example of a temperature control process of the arithmetic processing device by the control unit. FIG. 12 is a diagram illustrating an example of a heat sink device applied to three or more arithmetic processing devices. FIG. 13 is a diagram illustrating an example of a heat sink device that cools three or more arithmetic processing devices using a duct. FIG. 14 is a diagram illustrating an example of a heat sink device with one valve of the connecting portion. FIG. 15 shows a conventional heat sink with a cooling fan.

  The heat sink device described below blows wind generated by a plurality of cooling fans to a place where cooling is most necessary through a connecting portion that connects the heat sink portions, so that the power consumption or noise of the cooling fan is reduced. Can be reduced.

  The following [1] explains the configuration of the heat sink device, [2] explains the block diagram of the heat sink device, [3] explains the heat sink mounting device for mounting the heat sink device, [4] Now, temperature control of the arithmetic processing unit by the heat sink device will be described. Furthermore, in [5], a modified example of the heat sink device will be described. Note that the heat sink device described below is described as a device that cools the “arithmetic processing device”, but the object to be cooled by the heat sink device is not limited to the “arithmetic processing device”, for example, a reconfigurable device Such a semiconductor device or a heat generating device that needs to be cooled by generating heat, such as a control circuit.

[1] Configuration of Heat Sink Device FIG. 1 is a top view showing an example of a heat sink device. The heat sink device 300 shown in FIG. 1 includes heat sink portions 100a and 100b, a connecting portion 200 that connects the air passages 120a and 120b of the heat sink portions 100a and 100b, and temperature sensors 140a and 140b. The heat sink units 100a and 100b are respectively disposed above the arithmetic processing devices 510a and 510b that generate heat in a housing 800 such as a personal computer, a server, or an electric appliance, and cool the arithmetic processing devices 510a and 510b. The arithmetic processing unit 510a is, for example, a CPU, and the arithmetic processing unit 510b is a GPU.

  The heat sink parts 100a and 100b have cooling fans 110a and 110b, air passages 120a and 120b, and heat radiation fins 130a and 130b, respectively. The connecting part 200 connects the air passages 120a and 120b of the heat sink part to each other, so that the forced air of the cooling fan 110a or 110b is passed through the radiating fins 130a or 130b of the other heat sink part as indicated by 210.

  When heat is conducted from the arithmetic processing units 510a and 510b to the heat radiating fins 130a and 130b, the heat of the heat radiating fins 130a and 130b is transferred to the forced air generated by the cooling fans 110a and 110b, and from the opening 820 of the housing 800, Heat is released with the cooling air.

  Valves 150a and 150b are attached to the connecting portion 200 via movable shafts 160a and 160b. The movable shafts 160a and 160b move the valves 150a and 150b in a range of −90 ° to 90 °, where 0 ° is a position at which the ventilation at the connecting portion 200 is completely blocked. -90 ° is when the valve is tilted to the left, and 90 ° is when the valve is tilted to the right. When receiving a temperature from the temperature sensors 140a and 140b, the control unit not shown in FIG. 1 (described later with reference to FIG. 7) moves the movable shaft so as to increase the air volume to the arithmetic processing device having a higher temperature than the other arithmetic processing devices. By controlling the movable range of the valve, the inclination of the valve is changed. In addition, the upper wall of the connecting part 200 on the fan side has a V-shaped slope. This is because the wind does not block the wind from the other fan after the wind passes through the connecting part 200. This is to blow air.

  The heat sink device 300 adjusts the angles of the valves 150a and 150b so that when the temperature of one of the arithmetic processing units rises and sudden cooling becomes necessary, the wind from the two cooling fans gathers at the place where cooling is required. .

  The control unit can control the movable shaft based on the information obtained from the temperature sensor, and can control the tilt angle of the valve in a stepless manner between 180 ° from −90 ° to 90 °. Air flow control can be realized by switching the ventilation path according to the change. By adopting this method, the heat sink device 300 sends the wind generated from a plurality of fans to one cooling-required portion, so that it is possible to increase the efficiency by eliminating waste of air and shorten the cooling time. be able to. In addition, since the wind is sent by a plurality of fans, the rotation speed of one fan can be reduced, noise caused by rotation can be prevented, and power consumption can be suppressed at the same time.

  FIG. 2 is a side sectional view showing an example of the heat sink device. In the housing 800, the heat sink device 300 is disposed on the substrate 400 via the joint portion 420 so that the heat radiation fins 130a are disposed on top of the arithmetic processing device 510a disposed on the substrate 400. When heat is conducted from the arithmetic processing unit 510a to the heat radiating fins 130a, the heat of the heat radiating fins 130a is convectively transferred to the forced air generated by the cooling fan 110a, and heat is transmitted to the outside along with the forced air from the opening 820 of the housing 800. Released.

  FIG. 3 is a top view showing an example of a heat sink device that blows the wind of two cooling fans to one arithmetic processing device. The two valves 150a and 150b can be tilted from −90 ° to 90 °, and the air flow to the cooling point is controlled while determining the tilt of the valve according to the temperature of the arithmetic processing unit. By moving the valve in this way, a suitable air passage is secured at the point where cooling is necessary, and the air volume is adjusted.

  The example shown in FIG. 3 is a case where the temperature of the arithmetic processing unit 510a is high and the arithmetic processing unit 510a does not need to be cooled. In this state, both the valves 150a and 150b are tilted by −90 °, and all the wind generated by the cooling fan 110a on the arithmetic processing unit 510a side is passed through the connecting portion 200, whereby the cooling air is sent to the arithmetic processing unit 510b side. The heat sink device 300 concentrates the cooling of the arithmetic processing unit 510b.

  FIG. 4 is a top view illustrating an example of a heat sink device that blows wind of one or more cooling fans to one arithmetic processing device. The example shown in FIG. 4 is a case where the temperature of the arithmetic processing unit 510b is high and the arithmetic processing unit 510a also needs to be cooled. In this state, the heat sink device 300 controls the air flow by tilting the valves 150a and 150b to an appropriate angle between −89 ° and −1 ° according to the temperature of the arithmetic processing devices 510a and 510b, while the heat sink device 300 is controlled by the arithmetic processing device. Cooling of 510a and 510b is performed.

  FIG. 5 is a top view illustrating an example of a heat sink device that blows air from one or more cooling fans to the other arithmetic processing device. The example shown in FIG. 5 is a case where the temperature of the arithmetic processing unit 510a is high and the arithmetic processing unit 510b also needs to be cooled. In this state, the heat sink device 300 is controlled by the arithmetic processing units 510a and 510b while controlling the air volume by tilting the valves 150a and 150b to an appropriate angle between 1 ° and 89 ° according to the temperature of the arithmetic processing units 510a and 510b. 510b is cooled.

  FIG. 6 is a top view showing an example of a heat sink device for blowing the air of two cooling fans to the other arithmetic processing device. The example shown in FIG. 6 is a case where the temperature of the arithmetic processing unit 510a is high and the arithmetic processing unit 510b does not need to be cooled. In this state, both the valves 150a and 150b are tilted by 90 °, and the wind generated by the cooling fan on the arithmetic processing unit 510b side is passed through the connecting portion 200 to blow the air volume to the arithmetic processing unit 510a side. Centrally cools the processing unit 510a.

[2] Block Diagram of Heat Sink Device FIG. 7 is a block diagram showing an example of the heat sink device. The control unit 220 shown in FIG. 7 is connected to the temperature sensors 140a and 140b, and receives the temperatures of the arithmetic processing devices 510a and 510b detected by the temperature sensors 140a and 140b, respectively. The control unit 220 drives the movable shafts 160a and 160b by sending control signals to the movable shaft drive circuits 230a and 230b. In addition, the control unit 220 activates the cooling fans 110a and 110b by outputting control signals to the cooling fan drive circuits 240a and 240b.

  The controller 220 determines the necessity of cooling the arithmetic processing devices 510a and 510b from the detected temperatures detected by the temperature sensors 140a and 140b. When the arithmetic processing unit 510a or 510b has a temperature that requires cooling, the control unit 220 outputs a control signal to the cooling fan drive circuit 240a or 240b to activate the cooling fan 110a or 110b and perform arithmetic processing. The control unit 220 that blows air to the device 510a or 510b further operates the valve 150a or the like by using the movable shaft drive circuits 230a and 230b when one of the arithmetic processing devices requires rapid cooling. An air volume that is equal to or greater than the cooling air volume obtained from one cooling fan is supplied to an arithmetic processing unit that requires rapid cooling.

[3] Heat Sink Mounting Device for Mounting a Heat Sink Device FIG. 8 is an example of a heat sink mounting device for mounting a heat sink device. An example of the heat sink mounting apparatus is the information processing apparatus 500, for example. The information processing apparatus 500 includes a keyboard 575 and a display 580 and is connected to a mouse 578. The heat sink device 300 is disposed in the housing 800.

  FIG. 9 is a diagram illustrating an example of a hardware configuration of a heat sink device and an information processing device using the heat sink device. As shown in FIG. 9, the information processing apparatus 500 includes arithmetic processing devices 510a and 510b, a RAM (Random Access Memory) 520, a secondary storage device 540, a keyboard 575, a mouse 578, and a display 580. Connection is made via a bus 560. The temperature sensors 140 a and 140 b, the control unit 220, the movable shaft drive circuits 230 a and 230 b, and the cooling fan drive circuits 240 a and 240 b that are components of the heat sink device 300 are also connected via the bus 560.

[4] Temperature Control of Arithmetic Processing Device by Heat Sink Device FIG. 10 is a diagram illustrating a control table that defines an example of cooling fan and movable axis control executed by the control unit. The control unit 220 is, for example, a logic circuit, and, according to the control table 700 shown in FIG. It operates in the four cooling modes described.

(1) Cooling mode 1
When the detected temperatures of both the temperature sensors 140a and 140b are “low” (C11), the control unit 220 keeps the valve closed and does not rotate the cooling fan. For example, the “low” detection temperature is 40 ° C. or less.

(2) Cooling mode 2
When one of the detected temperatures of the temperature sensors 140a and 140b is “medium” and no “high” temperature is detected (C12, C21, C22), the valve is closed and the calculation process is performed with the temperature being “medium”. Cool down the device. For example, the “medium” detection temperature is a temperature in the range of 40 ° C. to 50 ° C., and the “high” detection temperature is a temperature of 50 ° C. or higher.

(3) Cooling mode 3
When the detected temperature of any one of the temperature sensors is “high” (C13, C23, C31, C32), the control unit 220 opens the valve and rotates both cooling fans to increase the temperature on the “high” side. Control is performed to blow one or more cooling fans to the arithmetic processing unit in which the sensor is arranged. Because the temperature of one arithmetic processing unit is high, the arithmetic processing unit 510a is intensively cooled by the amount of cooling air from one or more cooling fans. Note that the conventional heat sink cools the “high” temperature arithmetic processing device by rotating the cooling fan at a high speed at the “high” detection temperature, resulting in an increase in power consumption or noise.

(4) Cooling mode 4
When the detected temperatures of the two temperature sensors 140a and 140b are both “high” (C33), the control unit 220 closes the valves and rotates both the cooling fans 110a and 110b at a high speed. This is because, since the temperatures of both the arithmetic processing devices are “high”, an arithmetic processing device that preferentially concentrates cooling cannot be determined.

  FIG. 11 is a diagram illustrating an example of a temperature control processing flow of the arithmetic processing device by the control unit. In FIG. 11, the controller 220 cools the arithmetic processing unit in a plurality of cooling modes according to the control table 700 shown in FIG. In FIG. 11, in the initial state, the valves 150a and 150b are in the “closed” position. In the control processing flow shown in FIG. 11, the arithmetic processing unit 510a is described as “CPU” and the arithmetic processing unit 510b is described as “GPU”.

  When the information processing device 500 is turned on (S1001), electricity is also supplied to the heat sink device 300, and the control processing flow starts. First, the temperature sensors 140a and 140b detect the temperature (S1002). The control unit 220 determines whether or not there is a portion that needs cooling (S1003). In other words, the control unit 220 determines whether there is a CPU or GPU having a detected temperature of “medium” or higher. If there is no part that needs cooling (No in S1003), the control unit 220 returns to Step S1002 and repeats the determination whether there is a part that needs cooling using the temperature detected by the temperature sensor again.

  If there is a portion that needs to be cooled (S1003 Yes), the control unit 220 determines whether the temperature detected by any of the temperature sensors is “low” (S1004). When the detected temperature of any temperature sensor is “low” (S1004 Yes), the control unit 220 does not rotate the cooling fans 110a and 110b (S1005), sets the valve position to 0 ° (S1006), and step S1002 is performed again.

  When the detected temperature of any temperature sensor is not “low” (S1004 Yes), the control unit 220 determines whether there is a temperature sensor whose detected temperature is “high” (S1011). When there is no temperature sensor with a detected temperature of “high”, in other words, when the detected temperature of at least one temperature sensor is “medium”, the control unit 220 performs cooling for the arithmetic processing unit having a temperature of “medium”. The fan is rotated (S1012), and the valve position is set to 0 ° (S1013). In this step, if the detected temperatures of both the CPU and the GPU are “medium”, the controller 220 rotates the cooling fans 110a and 110b, and if any one of the detected temperatures is “medium”, the controller 220 rotates the cooling fan for the “medium” temperature processing unit.

  When there is a temperature sensor whose detection temperature is “high” (S1011), the control unit 220 determines whether the detection temperature of one temperature sensor is “high” and the detection temperature of the other temperature sensor is “low”. Judgment is made (S1021). When the detected temperature of one temperature sensor is “high” and the detected temperature of the other temperature sensor is “low” (S1021 Yes), the control unit 220 rotates both cooling fans 110a and 110b (S1022). ). Next, the control unit 220 determines whether or not the arithmetic processing unit whose detected temperature is “low” is a CPU (S1023). When the arithmetic processing unit whose detected temperature is “low” is a CPU (S1023 Yes), the control unit 220 tilts the valve by −90 ° (S1024, see FIG. 3). When the arithmetic processing unit whose detected temperature is “low” is a GPU (No in S1023), the control unit 220 tilts the valve by 90 ° (see S1024, FIG. 6), and performs temperature detection again (S1002).

  When the detected temperature of one temperature sensor is “high” and the detected temperature of the other temperature sensor is “medium” or “high” (No in S1021), the control unit 220 detects the detected temperature of the other temperature sensor. Is determined to be “medium” (S1031). When the detected temperature of one temperature sensor is “high” and the detected temperature of the other temperature sensor is “medium” (S1031 Yes), the control unit 220 rotates both cooling fans 110a and 110b ( S1032). Further, the control unit 220 determines whether or not the temperature sensor whose detected temperature is “medium” is for the CPU (S1033). When the temperature sensor whose detected temperature is “medium” is for the CPU (S1033 Yes), the control unit 220 tilts the valve in a range of −89 ° to 1 ° (S1034, see FIG. 4). When the temperature sensor whose detected temperature is “medium” is for the GPU (No in S1033), the control unit 220 tilts the valve in the range of 1 to 89 ° (S1035, see FIG. 5) and performs temperature detection again. (S1002).

  When the detected temperature of the other temperature sensor is not “medium” (S1031 No), that is, when the detected temperature of both temperature centers is “high”, the control unit 220 rotates the cooling fans 110a and 110b at a high speed. (S1041), the valve position is set to 0 ° (S1042), and temperature detection is performed again (S1002).

In steps S1034 and S1035, the control unit 220 does not block the connecting unit 200, and the valve is disposed at a position where the blowing of wind to the CPU or GPU is not prevented, -89 ° to -1 °, or The valve is controlled within a range of 1 ° to 89 °. For example, the control unit 220 may determine the movable range of the valve by feedback control such as PID control with respect to a predetermined set value (for example, a temperature set as “low”).

  In the above flowchart, the heat sink of the conventional type as shown in FIG. 15 cools the arithmetic processing unit by rotating the cooling fan at a high speed with respect to the arithmetic processing unit whose temperature is “high”. Therefore, in step S1022, the conventional heat sink rotates one cooling fan at a high speed, and in step S1032, the cooling fan rotates at a high speed and the other cooling fan rotates normally. In steps S1022 and 1032, the heat sink device 300 reduces the power consumption and noise of the cooling fan without rotating the cooling fan at high speed.

[5] Modification of Heat Sink Device FIG. 12 is a diagram illustrating an example of a heat sink device applied to three or more arithmetic processing devices. In the above description, two arithmetic processing devices have been described, but there may be three or more arithmetic processing devices. In the heat sink device 300a shown in FIG. 12, heat radiation fins 130-1, 130-2,..., 130-n are arranged in each of three or more arithmetic processing devices. Since a plurality of air paths are connected by a plurality of connecting portions 200-1,..., 200-n-1, one or more cooling fans controlled by the valve 150 are used when the temperature of one arithmetic processing unit is high. The arithmetic processing unit can be intensively cooled by the cooling air flow of 110-1,.

FIG. 13 is a diagram illustrating an example of a heat sink device that cools three or more arithmetic processing devices using a duct. When three or more arithmetic processing devices are provided, the arrangement of the arithmetic processing devices is separated. May end up. A heat sink device 300b shown in FIG. 13 includes a duct 260 that connects between the heat sink units 100-2 and 100-3. The heat sink device 300b controls the valves 150-3 and 150-4 to supply the cooling air volume from the cooling fan 110-3 at a distant position to the other radiating fins 130-2 via the duct 260. The processor is intensively cooled. As described above, even when the arithmetic processing unit is arranged on the substrate so as to be separated from each other, the cooling of the arithmetic processing unit arranged apart from the fan is performed by blowing air to the duct 260. Can do.

  FIG. 14 is a diagram illustrating an example of a heat sink device with one valve of the connecting portion. The heat sink device 300 shown in FIG. 1 uses two valves 150a and 150b to adjust the amount of air flowing through the connecting portion. However, the heat sink device 300c shown in FIG. 14 includes one valve 150c and one movable shaft 160c. Adjust the air volume. Even with the single valve 150c, it is possible to send the air volume of the cooling fan to the heat dissipating fins of the other heat sinks. Therefore, as with the heat sink device 300 using the two valves 150a and 150b described above, Device 300c is operable.

Regarding the above embodiment, the following additional notes are disclosed.
[Appendix 1]
First and second heat sink portions each having a cooling fan and a heat radiating fin;
A connecting part for connecting the first heat sink part and the second heat sink part to each other so that air generated by the cooling fan of the first heat sink part is blown to the radiation fins of the second heat sink part;
And a valve for switching wind passing through the connecting portion. (1, Figures 3-6)
[Appendix 2]
The first and second heat sink portions each have a temperature sensor,
The valve has a movable shaft;
The apparatus further includes a control unit that controls the movable shaft so that, when the temperature detected by the temperature sensor is received, the air is caused to flow through the heat dissipating fin of the heat sink unit having the detected temperature sensor having a high temperature. 2. A heat sink device according to 1. (2, Figures 3-6)
[Appendix 3]
The heat sink device according to appendix 1 or 2, wherein the position of the valve can be controlled in a range of -90 ° to 90 °, where 0 ° is a position at which air blowing from the second heat sink portion is completely prevented. (3, Fig. 1)
[Appendix 4]
4. The heat sink device according to claim 1, wherein the connecting portion has a V-shaped inclination on an upper wall on a fan side of the first and second heat sink portions. (4, Fig. 1)
[Appendix 5]
The first and second heat sink portions each having a cooling fan and a heat radiating fin, and the plurality of the plurality of heat sinks so as to blow air generated by the cooling fan of the first heat sink portion to the heat radiating fins of the second heat sink portion. A heat sink device comprising: a connecting portion for connecting at least two of the heat sink portions to each other; and a valve for switching wind passing through the connecting portion;
A heat sink mounting device comprising: a plurality of heat generating devices each cooled by the heat radiating fins. (5, Figures 3-6)
[Appendix 6]
The first and second heat sink portions each have a temperature sensor,
The valve has a movable shaft;
The apparatus further includes a control unit that controls the movable shaft so that, when the temperature detected by the temperature sensor is received, the air is caused to flow through the heat dissipating fin of the heat sink unit having the detected temperature sensor having a high temperature. 5. A heat sink device according to 5. (Figs. 3-6)
[Appendix 7]
The heat sink device according to appendix 5 or 6, wherein the position of the valve can be controlled in a range of -90 ° to 90 °, where 0 ° is a position that completely prevents air blowing from the second heat sink portion. (Figure 1)
[Appendix 8]
The heat sink device according to any one of appendices 5 to 7, wherein the connecting portion has a V-shaped inclination on an upper wall on a fan side of the first and second heat sink portions. (Figure 1)
[Appendix 9]
First and second heat sink portions each having a cooling fan and a heat radiating fin, a connecting portion connecting at least two heat sink portions, a valve for switching wind passing through the connecting portion, a temperature sensor attached to each heat sink portion, And a method of controlling the heat sink device having a control unit,
The control unit receives the temperature detected by the temperature sensor,
The said control part controls the said valve | bulb so that the wind which generate | occur | produces with the cooling fan of a said 1st heat sink part may be sent to the radiation fin of a said 2nd heat sink part, The control method characterized by the above-mentioned. (6, Figures 3-6)

DESCRIPTION OF SYMBOLS 100 Heat sink part 110 Cooling fan 120 Air path 130 Radiation fin 140 Temperature sensor 150 Valve 160, 160c Movable axis 160c Movable axis 200 Connection part 220 Control part 230a Movable axis drive circuit 240a Cooling fan drive circuit 260 Duct 300, 300a-f Heat sink device 500 Information processing device 510a, 510b Arithmetic processing device 800 Case 820 Opening

Claims (5)

Multiple cooling fans,
A plurality of heat dissipating fins;
A first heat sink portion having a ventilation path of air from the first cooling fan of the plurality of cooling fans toward the first heat radiation fin of the plurality of heat radiation fins;
A second heat sink portion having a ventilation path of wind from the second cooling fan of the plurality of cooling fans to the second radiation fin of the plurality of radiation fins ;
The respective air passages of the first heat sink portion and the second heat sink portion are connected to each other , and either the air passage of the first heat sink portion or the air passage of the second heat sink portion is directed to the other. A connecting part formed with a wind connecting ventilation path ;
Controlling the wind passing through the connecting part by transitioning from one state of the state of closing the connecting ventilation path and the state of opening the connecting ventilation path to the other state attached to the connecting part , The air from the first cooling fan of the first heat sink part is blown to the first heat radiating fin of the first heat sink part and the first heat sink part of the second heat sink part is closed while the connection ventilation path is closed. The wind from the first cooling fan of the first heat sink part is opened in a state where the wind from the second cooling fan is blown to the second heat radiating fins of the second heat sink part and the connected ventilation path is opened. And the wind from the second cooling fan of the second heat sink part, either the first heat sink fin of the first heat sink part or the second heat sink fin of the second heat sink part A valve for blowing air in a square radiating fins,
First and second temperature sensors respectively provided in the first and second heat sink portions;
A control unit for controlling the number of revolutions of the cooling fan according to detection values of the first and second temperature sensors, and for controlling the valve;
With
When the detection value of the first temperature sensor exceeds a first reference value and the detection value of the second temperature sensor exceeds a second reference value higher than the first reference value, the rotation speed of the cooling fan Is maintained at a predetermined value, and the state where the connection ventilation path is closed is changed to the state where the connection ventilation path is opened, and the wind from the first cooling fan of the first heat sink part and the second heat sink part the valve controls the air from the second cooling fan so as to blow air to the second heat radiation fins of the second heat sink part,
When the detection value of the second temperature sensor exceeds a first reference value and the detection value of the first temperature sensor exceeds a second reference value higher than the first reference value, the number of rotations of the cooling fan Is maintained at a predetermined value, the transition from the state where the connection ventilation path is closed to the state where the connection ventilation path is opened, and the wind from the second cooling fan of the second heat sink part and the first heat sink part the valve controls the air from the first cooling fan so as to blow air to the first heat radiation fins of the first heat sink part,
When the detected values of both the first and second temperature sensors exceed the second reference value, the rotation speed of the cooling fan is made higher than a predetermined value, and the valve is closed so as to close the connection ventilation path. A heat sink device characterized by controlling.   The valve has a movable shaft on the side of the radiating fin of the connecting portion, and the movable shaft has the valve in a range of −90 ° to 90 °, where 0 ° is a position where the valve closes the connecting portion. The heat sink device according to claim 1, wherein the heat sink device closes the ventilation path of the first or second heat sink when the valve is rotated by −90 ° or 90 °.   The heat sink device according to claim 1, wherein the connecting portion has a V-shaped inclination on an upper wall on the cooling fan side. A heat sink device according to claim 1;
A heat sink mounting device comprising: a heat generating device that is cooled by each of the heat dissipating fins provided in each of the first and second heat sink portions. Multiple cooling fans,
A plurality of heat dissipating fins;
First the first heat sink portion having a ventilation passage of air toward the first heat radiation fins of the plurality of heat radiating fins from the cooling fan of the plurality of cooling fans, first of the plurality of cooling fans A second heat sink portion having a ventilation path of air from the two cooling fans toward the second radiating fin of the plurality of radiating fins, and the ventilation paths of the first heat sink portion and the second heat sink portion. A connecting portion in which a connecting air passage for wind is formed from either one of the ventilation path of the first heat sink portion or the ventilation path of the second heat sink portion to the other ;
Wherein mounted on the connecting part to control the air passing through the connecting portion by a transition from the connecting air passage closing state and said state to open the connection air passage have shifted or one state to the other The air from the first cooling fan of the first heat sink portion is blown to the first heat radiating fin of the first heat sink portion and the second heat sink portion of the second heat sink portion is closed in a state where the connection ventilation path is closed. The wind from the second cooling fan is blown to the second heat radiation fin of the second heat sink part, and the first cooling fan of the first heat sink part is opened in the state where the connection ventilation path is opened. And the wind from the second cooling fan of the second heat sink portion between the first radiating fin of the first heat sink portion and the second radiating fin of the second heat sink portion. Any one A valve for blowing the heat radiation fins, and a control method of a heat sink device having a first and second temperature sensors provided respectively to said first and second heat sink part,
When the detection value of the first temperature sensor exceeds a first reference value and the detection value of the second temperature sensor exceeds a second reference value higher than the first reference value, the rotation speed of the cooling fan Is kept at a predetermined value, the transition from the closed state of the connected ventilation path to the opened state of the connected ventilation path, and the wind from the first cooling fan of the first heat sink section and the second heat sink section the valve controls the air from the second cooling fan so as to blow air to the second heat radiation fins of the second heat sink part,
When the detection value of the second temperature sensor exceeds a first reference value and the detection value of the first temperature sensor exceeds a second reference value higher than the first reference value, the number of rotations of the cooling fan Is maintained at a predetermined value, the transition from the state where the connection ventilation path is closed to the state where the connection ventilation path is opened, and the wind from the second cooling fan of the second heat sink part and the first heat sink part said first and wind from the cooling fan to control the valve so as to blow air to the first heat radiation fins of the first heat sink portion, the detection value of the first and second temperature sensor of said When the second reference value is exceeded, the rotational speed of the cooling fan is made higher than a predetermined value, and the valve is controlled to close the connected ventilation path .
A control method characterized by that.

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