JP5716416B2 - Optical fiber connector and manufacturing method thereof - Google Patents

Description

  The present invention relates to an optical fiber connector and a method for manufacturing the same, and more particularly to an optical fiber connector that can easily align an optical fiber and an optical waveguide core without depending on a substrate, and is less likely to be displaced.

In general, an optical cable (also referred to as an optical fiber cable) is widely used for home and industrial information communication because it enables high-speed communication of a large amount of information. For example, automobiles are equipped with various electrical components (for example, a car navigation system), and are also used for optical communication of these electrical components. As an optical cable connector for connecting the ends of optical fibers included in such an optical cable, there is one disclosed in Patent Document 1.
In addition, with the increase in information capacity, development of optical interconnection technology using optical signals not only for communication fields such as trunk lines and access systems but also for information processing in routers and servers is underway. Specifically, since light is used for short-distance signal transmission between boards in a router or server device, the optical transmission path has a higher degree of freedom of wiring and higher density than optical fibers. Possible optical waveguides are used.
An example of a method for joining the optical waveguide and the optical fiber is an optical fiber connector described in Patent Document 2.
However, in such an optical fiber connector, it is necessary to cut the optical fiber mounting groove by dicing, so that the work efficiency is low, and the optical waveguide core is formed by photolithography and process in a process different from the groove cutting process. Since the optical fiber is manufactured by etching, the optical fiber may be misaligned. Furthermore, if the above method is not formed on a hard substrate with good dimensional stability such as a silicon wafer, a larger optical fiber misalignment occurs.
In addition, the waveguide substrate on which the optical waveguide described in Patent Document 3 is formed and the optical connector on which the optical fiber is carrier are mounted on different holders, and the optical fiber and the optical fiber that fix the end faces of each holder are fixed. There is a method for connecting waveguides, but the number of steps until connection is large and complicated.

JP 2010-48925 JP 2001-201646 A JP-A-7-13040

  The present invention has been made in order to solve the above-described problems. An optical fiber connector and an optical fiber connector in which the alignment of the optical fiber and the optical waveguide core is easy and the optical fiber is not easily displaced regardless of the substrate. It aims to provide a method.

In order to solve the above-mentioned problems, the present inventors use an optical fiber guide member having a groove for fixing an optical fiber and an adhesive introduction slit, and an optical fiber connector in which the optical fiber guide member and the optical waveguide are arranged in parallel. I found out that it could be solved. The present invention has been completed based on such findings.
That is, the present invention
(1) An optical fiber guide member in which a fiber guide core pattern having a groove for fixing an optical fiber is formed on a substrate;
An optical fiber connector in which an optical signal transmission core pattern is formed on a first lower cladding layer, and an optical waveguide in which an upper cladding layer is formed on the optical signal transmission core pattern,
The optical fiber guide member has an adhesive introduction slit, and the optical fiber guide member is joined to a position where an optical signal can be transmitted to the optical signal transmission core pattern of the optical waveguide; An optical fiber connector in which the optical waveguides are juxtaposed,
(2) The optical fiber connector according to (1), wherein the adhesive introduction slit is provided from the substrate side,
(3) The optical fiber connector according to (1), wherein the optical fiber guide member has a cover member that covers the core pattern for fiber guide, and the adhesive introduction slit is provided from the cover member side.
(4) The optical signal transmission core pattern is formed on a first lower clad layer formed on the substrate, and the fiber guide core pattern is formed on the substrate. ) Optical fiber connector according to any one of
(5) The optical fiber connector according to any one of (1) to (4), wherein the substrate has an adhesive layer, and the first lower cladding layer and the fiber guide core pattern are formed on the adhesive layer.
(6) The optical fiber connector according to any one of (1) to (5), wherein the adhesive layer is a second lower cladding layer.
(7) The optical waveguide of the optical fiber connector is an optical waveguide with an optical path conversion mirror, and the lid member has a function as a reinforcing material for the optical path conversion mirror. Fiber optic connector,
(8) The optical fiber connector according to any one of (1) to (7), wherein the substrate is an electrical wiring board.
(9) A first lower clad layer forming film is laminated on a substrate, and the first lower clad layer forming film is etched to form a first lower clad layer at a site where a groove for fixing an optical fiber is formed. The core forming film is laminated on the substrate from which the first lower cladding layer and the first lower cladding layer forming film have been removed in the previous step, and the fiber guide core pattern is formed by etching. A method of manufacturing an optical fiber connector, which includes a step of forming an optical signal transmission core pattern in a lump and a step of providing an adhesive introduction slit from the substrate side of the optical fiber guide member,
(10) A first lower clad layer forming film is laminated on a substrate, and the first lower clad layer forming film is etched to form a first lower clad layer at a portion where a groove for fixing an optical fiber is formed. The core forming film is laminated on the substrate from which the first lower cladding layer and the first lower cladding layer forming film have been removed in the previous step, and the fiber guide core pattern is formed by etching. A method of manufacturing an optical fiber connector, including a step of collectively forming a core pattern for transmitting an optical signal, a step of forming a cover material covering at least the fiber guide core pattern, and a step of providing an adhesive introduction slit from the cover material side;
(11) After the step of collectively forming the fiber guide core pattern and the optical signal transmission core pattern, an upper cladding layer forming film is formed from the fiber guide core pattern and the optical signal transmission core pattern forming surface side. (9) or (10) the manufacturing method of the optical fiber connector according to (9), which includes a step of removing the film for forming the upper clad layer in the groove portion for fixing the optical fiber by laminating and etching; The method for producing an optical fiber connector according to any one of (9) to (11), wherein the adhesive introduction slit is formed by a dicing saw,
Is to provide.

  The optical fiber connector of the present invention is easy to align the optical fiber and the optical waveguide core without depending on the substrate, is difficult to shift the position of the optical fiber, and is bonded to bond the optical fiber and the optical waveguide. Since the agent can be easily introduced, the optical fiber and the optical waveguide can be bonded reliably and easily.

It is a figure which shows the optical fiber connector of this invention, and its manufacture process. (A) is a cross-sectional view of the fiber guide core pattern in the parallel direction, and (b) is a cross-sectional view of the optical signal transmission core pattern and the groove in the parallel direction. It is a figure which shows the optical fiber connector of this invention, and its manufacture process. (C) is a vertical sectional view of the optical signal transmission core pattern and grooves, (d) is a vertical sectional view of the fiber guide core pattern, and (e) is a plan view. 1 is a perspective view of an optical fiber connector of the present invention. It is a figure which shows an example of the optical fiber connector of this invention. (A) is a cross-sectional view of the fiber guide core pattern in the parallel direction, and (b) is a cross-sectional view of the optical signal transmission core pattern and the groove in the parallel direction. It is a figure which shows another example of the optical fiber connector of this invention. (A) is a cross-sectional view of the fiber guide core pattern in the parallel direction, and (b) is a cross-sectional view of the optical signal transmission core pattern and the groove in the parallel direction. It is a figure which shows another example of the optical fiber connector of this invention. (A) is a cross-sectional view of the fiber guide core pattern in the parallel direction, and (b) is a cross-sectional view of the optical signal transmission core pattern and the groove in the parallel direction.

The optical fiber connector of the present invention will be described with reference to FIGS.
The optical fiber connector of the present invention is an optical fiber guide in which a core pattern 5 for fiber guide having a groove 8 for fixing an optical fiber on a substrate 1 (hereinafter sometimes referred to as “fiber groove”) is formed. A structure in which a member 10 and an optical waveguide 20 in which an optical signal transmission core pattern 4 is formed on the first lower cladding layer 3 and an upper cladding layer 6 is formed on the optical signal transmission core pattern are arranged in parallel. (See FIG. 3F).

In the optical fiber guide member 10, the fiber guide core pattern 5 is preferably formed on the second lower cladding layer 201 which is a part of the substrate 1.
In the present invention, the fiber guide core pattern 5 is for fixing the optical fiber 30 and does not function as a core for transmitting optical signals.
Further, although there is no limitation on the optical fiber to be used, when it is expressed as “optical fiber diameter” below, it represents the cladding outer diameter of the optical fiber or the coating outer diameter of the optical fiber.
Furthermore, it is preferable to have an upper cladding layer on the fiber guide core pattern 5 in the optical fiber guide member 10. By having the upper cladding layer, the flatness of the optical fiber connector of the present invention is improved.

In the present invention, the optical fiber 30 is inserted into a space formed by the groove 8 and the lid member 7 and fixed with an adhesive. However, the optical fiber and the optical waveguide can be aligned just by inserting the optical fiber in this way. Is possible.
At this time, alignment in the X direction shown in FIG. 2 is performed by the fiber guide core pattern 5, and alignment in the Z direction shown in FIGS. 1 and 2 is performed when the substrate 1 and the lid material 7 are provided. This can be done by adjusting the relative position of. Further, when the lid member 7 is not used, for example, when the fiber is pushed in with a glass block or the like, the relative position between the substrate 1 and the glass block or the like can be adjusted.

  In the present invention, the diameter of the optical fiber is preferably 200 μm or less from the viewpoint of easy control of the film thickness of the core layer forming resin film, and it is more preferable to use an optical fiber having a diameter of 125 μm or 80 μm. The lateral width of the groove 8 of the fiber guide core pattern 5 may be a width that is equal to or greater than the diameter of the optical fiber, but is 0.1 to 10 μm wider than the diameter of the optical fiber from the viewpoint of mountability and tolerance of the optical fiber. It is preferable that

  A feature of the present invention is that an adhesive introduction slit 13 is provided in the optical fiber guide member. With the adhesive introduction slit, the optical fiber 30 can be easily fixed to the optical fiber guide member 10, the alignment between the optical fiber and the optical waveguide core is facilitated regardless of the substrate, and the optical fiber is displaced. In addition to being difficult to connect, the optical fiber and the optical waveguide can be connected reliably and easily.

  The adhesive introduction slit 13 can be provided in various places as long as the effects of the present invention are achieved. Several aspects will be described below with specific examples. In the embodiment described below, since the optical fiber guide member 10 has the lid member 7 that covers the fiber guide core pattern 5, the optical fiber is inserted in the form of being inserted from the left side of each figure, An adhesive is introduced from the adhesive introduction slit 13 to fix the optical fiber to the optical fiber guide member. However, the present invention is not limited to the one with the lid material, but without the lid material. The fiber is held by the glass block and pushed into the groove 8 to be the center of the optical signal transmission core pattern 4. A mode in which the center of the optical fiber 30 is aligned and fixed by an adhesive is also included.

FIGS. 1 (a) -10 and (b) -10 are a sectional view of a groove portion for fixing an optical fiber and a sectional view of a core portion for an optical fiber guide, respectively. In this mode (hereinafter referred to as “first mode”), the adhesive introduction slit 13 is provided from the substrate 1 side so as to cut the end face of the optical waveguide.
Next, in the embodiment shown in FIG. 4 (hereinafter referred to as “second embodiment”), the adhesive introduction slit 13 is provided from the lid 7 side so as to cut the end face of the optical waveguide.
In the mode shown in FIG. 5 (hereinafter referred to as “third mode”), the adhesive introduction slit 13 is provided from the substrate 1 side at a position away from the end face of the optical waveguide.
Further, in the embodiment shown in FIG. 6 (hereinafter referred to as “fourth embodiment”), the adhesive introduction slit 13 is provided from the lid 7 side at a position away from the end face of the optical waveguide.
In addition, it does not specifically limit as a method to provide a slit, For example, it can form by cutting with a dicing saw.

Among the above four modes, in the first mode and the second mode, the adhesive introduction slit 13 also has a role of a slit groove 9 described in detail later, and introduces the adhesive while smoothing the end face of the optical waveguide. It is preferable in that a road can be secured. Also, the manufacturing process is preferable because it can have two processes.
In the first and fourth aspects, since the adhesive introduction slit 13 is on the electric wiring board 103 side, there is an advantage that the optical fiber can be bonded and the element can be mounted on the same surface side.
In the second and third aspects, since the adhesive introduction slit 13 is on the lid 7 side, the overflowed adhesive does not attack the mounting terminals of the element, so that workability can be improved. This is preferable.

Hereinafter, each layer constituting the optical fiber connector of the present invention will be described.
(Lower cladding layer and upper cladding layer)
Hereinafter, the lower clad layers (first lower clad layer, second lower clad layer) 201 and 3 and the upper clad layer 6 used in the present invention will be described. As the lower cladding layers 201 and 3 and the upper cladding layer 6, a cladding layer forming resin or a cladding layer forming resin film can be used.

  The clad layer forming resin used in the present invention is not particularly limited as long as it is a resin composition that has a lower refractive index than the optical signal transmission core pattern 4 and is cured by light or heat, and a thermosetting resin composition or photosensitive resin. Can be suitably used. The resin composition used for the resin for forming the clad layer may be the same or different in the components contained in the resin composition in the lower clad layers 201 and 3 and the upper clad layer 6. The refractive indexes may be the same or different. Further, the second lower clad layer 201 is not required to have a refractive index or a photocurable property as long as it has a function as the adhesive layer 2, and an adhesive or a core forming resin film described later may be used.

In the present invention, the method for forming the clad layer is not particularly limited, and for example, the clad layer may be formed by applying a clad layer forming resin or laminating a clad layer forming resin film.
In the case of application, the method is not limited, and the clad layer forming resin composition may be applied by a conventional method.
The clad layer-forming resin film used for laminating can be easily produced by, for example, dissolving the clad layer-forming resin composition in a solvent, applying it to a carrier film, and removing the solvent.

The thicknesses of the lower cladding layers 201 and 3 and the upper cladding layer 6 are not particularly limited, but the thickness after drying is preferably in the range of 5 to 500 μm. When the thickness is 5 μm or more, a clad thickness necessary for light confinement can be secured, and when the thickness is 500 μm or less, it is easy to control the film thickness uniformly. From the above viewpoint, it is more preferable that the thicknesses of the lower cladding layers 201 and 3 and the upper cladding layer 6 are further in the range of 10 to 100 μm. The first lower clad layer 3 has a cured film thickness of [(radius of optical fiber) − (first lower clad layer 3) in order to align the center of the optical fiber with the optical signal transmission core pattern. It is more preferable to use a film having a thickness of the optical signal transmission core pattern formed on top) / 2].
As a specific example, a preferable thickness of the lower cladding layer 3 when an optical fiber having an optical fiber diameter of 80 μm and an optical fiber core diameter of 50 μm is used is shown. First, when the optical signal propagates from the optical fiber to the optical signal transmission core pattern, the square circumscribing the core diameter of the optical fiber can propagate without optical loss. In this case, the core of the optical waveguide is 50 μm × 50 μm (core height: 50 μm). Applying the above formula, the optimum thickness of the lower cladding layer 3 is 15 μm. Further, when an optical signal propagates from the optical fiber to the optical signal transmission core pattern using the same optical fiber as described above, a square inscribed in the core diameter of the optical fiber can propagate without optical loss. In this case, the core of the optical waveguide is 40 μm × 40 μm (core height: 40 μm). Applying the above equation, the optimum thickness of the lower cladding layer 3 is 20 μm.
In the optical waveguide 20, the thickness of the upper cladding layer 6 for embedding the optical signal transmission core pattern 4 is preferably equal to or greater than the thickness of the core pattern 4, but from the surface of the substrate 1 to the upper surface of the upper cladding layer. What is necessary is just to adjust suitably so that height may become below the diameter of an optical fiber.

(Core layer forming resin and core layer forming resin film)
In the present invention, the method for forming the core layer laminated on the lower clad layers 201 and 3, the optical signal transmission core pattern 4, and the fiber guide core pattern 5 is not particularly limited. Alternatively, the core layer may be formed by laminating a core layer-forming resin film, and the core pattern may be formed by etching.
In the present invention, the optical waveguide 20 and the optical fiber guide member 10 are each formed with a core layer, and then simultaneously etched to form the optical signal transmission core pattern 4 and the fiber guide core pattern 5 at the same time. An optical fiber connector can be manufactured well.

  The core layer forming resin, in particular, the core layer forming resin used for the optical signal transmission core pattern 4 is designed to have a higher refractive index than the cladding layer 3 and uses a resin composition capable of forming a core pattern with actinic rays. It is preferable. The method of forming the core layer before patterning is not limited, and examples thereof include a method of applying the core layer forming resin composition by a conventional method.

The thickness of the resin film for forming the core layer is not particularly limited, and the thickness of the core layer after drying is usually adjusted to be 10 to 100 μm. When the thickness of the optical signal transmission core pattern 4 after finishing the film is 10 μm or more, there is an advantage that the alignment tolerance can be increased in coupling with the light emitting / receiving element or the optical fiber after the optical waveguide is formed. In the case of the following, there is an advantage that the coupling efficiency is improved in coupling with the light emitting / receiving element or the optical fiber after the optical waveguide is formed. From the above viewpoint, the thickness of the film is preferably in the range of 30 to 90 μm, and the film thickness may be appropriately adjusted in order to obtain the thickness.
In addition, when the thickness of the optical signal transmission core pattern after curing is greater than the core diameter of the optical fiber when transmitting light from the optical fiber to the optical signal transmission core pattern, there is less light loss, and optical signal transmission In the case of transmitting light from the optical core pattern to the optical fiber, it is more preferable to adjust the rectangle formed by the thickness and width of the optical signal transmitting core pattern to be inside the core diameter of the optical fiber.

(substrate)
There is no restriction | limiting in particular as a material of the board | substrate 1, For example, a glass epoxy resin substrate, a ceramic substrate, a glass substrate, a silicon substrate, a plastic substrate, a metal substrate, a substrate with a resin layer, a substrate with a metal layer, a plastic film, with a resin layer Examples thereof include a plastic film, a plastic film with a metal layer, and an electric wiring board.
The substrate 1 may be a flexible optical fiber connector by using a base material having flexibility and toughness, for example, a carrier film of the resin film for forming a clad layer and a resin film for forming a core layer as the substrate.
The electric wiring board is not particularly limited, but may be an electric wiring board in which the metal wiring 103 is formed on FR-4, or a flexible wiring board in which the metal wiring 103 is formed on polyimide or polyamide film. There may be. The metal wiring 103 can be formed from the metal layer 102.

(Cover material)
The optical fiber connector of this invention has the cover material 7 as shown in the said FIGS. 1-6 as the preferable aspect. In such an aspect having the lid member 7, it is important that both the depth and width of the groove 8 are equal to or larger than the diameter of the optical fiber 30 fixed in the groove of the optical fiber guide member. That is, the depth of the groove is larger than the diameter of the optical fiber, and the width of the groove is larger than the diameter of the optical fiber. By satisfying this condition, the optical fiber can be easily inserted into the space formed by the groove and the lid member. The optical fiber guide member 10 and the optical waveguide are joined so that the optical fiber is joined to the optical signal transmitting core pattern 4 of the optical waveguide at a position where the optical signal can be transmitted with the optical fiber inserted in this manner. 20 are juxtaposed.

The material of the lid member 7 in the optical fiber guide member 10 is not particularly limited, but when the upper cladding layer 6 has adhesiveness, a glass epoxy resin substrate, a ceramic substrate, a glass substrate, a silicon substrate, a plastic substrate, a metal substrate. A plastic film, and these substrates may be provided with a resin layer, a metal layer, or the like. An electric wiring board can also be used as the lid member 7.
In particular, as the cover material 7 having flexibility and toughness, for example, polyesters such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyethylene, polypropylene, polyamide, polycarbonate, polyphenylene ether, polyether sulfide, polyarylate, liquid crystal polymer Preferable examples include polysulfone, polyethersulfone, polyetheretherketone, polyetherimide, polyamideimide, and polyimide. Of these, polyamideimide and polyimide are particularly preferable from the viewpoints of heat resistance and dimensional stability.

Further, when the upper clad layer 6 has no adhesiveness, it is preferable to provide an adhesive layer on the above-described lid material 7 to provide the lid material 7 with an adhesive layer.
The thickness of the lid member 7 can be changed as appropriate depending on the warp and dimensional stability of the plate, but is preferably 10 μm to 10.0 mm. Moreover, as a thickness of the contact bonding layer formed in the cover material 7, although 0.1 micrometer-50 micrometers are the suitable ranges normally, 0.1 micrometer-20 micrometers are more preferable. This is because when the thickness of the adhesive layer is 20 μm or less, the flow of the adhesive into the groove 8 is suppressed.
Furthermore, the optical waveguide in the present invention preferably has an optical path conversion mirror 11, and in that case, it is preferable that the lid member 7 also has a reinforcing plate for the optical path conversion mirror 11.

(adhesive)
The adhesive used for the adhesive introduction slit is not particularly limited as long as it can bond an optical fiber and an optical fiber guide member. However, an optical adhesive, an optical path coupling adhesive, and an optical component sealing material. , Transparent adhesive, refractive index matching material / adhesive, clad layer forming resin varnish, core layer forming resin varnish, etc., photocurable adhesive, thermosetting adhesive, photothermosetting adhesive, two-component mixture A curable adhesive can be used, and among these, when the substrate 1 and the lid 7 do not transmit electromagnetic waves for curing, a thermosetting adhesive or a two-component mixed curable adhesive is used. preferable.

(Manufacturing method of optical fiber connector of the present invention)
The manufacturing method of the present invention is characterized by having the following three steps in order. That is,
(1) First lower clad layer forming film is laminated on a substrate, and the first lower clad layer forming film is etched to form a first lower clad layer at a portion where a groove for fixing an optical fiber is formed. Removing the film,
(2) A core forming film is laminated on the first lower clad layer and the substrate from which the first lower clad layer forming film has been removed in the step (1), and the fiber guide core pattern is formed by etching. An optical fiber connector manufacturing method comprising sequentially forming a core pattern for transmitting an optical signal and (3) providing an adhesive introduction slit from the substrate side of the optical fiber guide member.

In the step (1), the first lower cladding layer is formed only in the portion of the optical waveguide in the optical fiber connector, and the first lower cladding layer is removed from the portion of the optical fiber guide member. Thus, in the optical waveguide, a lower clad for optical transmission is formed, and the optical waveguide and the optical fiber are aligned in the Z direction. Therefore, the thickness of the first lower cladding layer is appropriately set according to the diameter of the optical fiber to be used, and the preferred thickness is as described above.
Next, by the step (2), in the optical waveguide, an optical signal transmission core pattern is formed on the first lower cladding layer, and in the optical fiber guide member, a fiber guide for fixing the optical fiber on the substrate. A core pattern is formed.
Finally, an adhesive introduction slit is provided from the substrate side of the optical fiber guide member by the step (3). Although there is no restriction | limiting in particular as a method of providing a slit, The method of cutting with a dicing saw is simple and preferable.

Moreover, the manufacturing method which consists of the following processes is also the method of this invention. That is, following the steps (1) and (2) above,
(4) A method for manufacturing an optical fiber connector, comprising: a step of forming a cover material covering at least the fiber guide core pattern; and (5) a step of providing an adhesive introduction slit from the cover material side.
In the step (4), the method of forming the lid is appropriately determined according to the material of the lid, but it is preferably formed using a roll laminator, a vacuum laminator or the like.
The step (5) is the same as the step (3).

In the manufacturing method of the present invention described above, after the step (2), ie, the step of forming the fiber guide core pattern and the optical signal transmission core pattern at once, the fiber guide core pattern and the optical signal transmission It is preferable to have a step of laminating an upper clad layer forming film from the core pattern forming surface side and removing the upper clad layer forming film in the groove portion for fixing the optical fiber by etching.
By this step, an upper cladding layer is formed in the optical waveguide, and high light transmission efficiency is achieved. On the other hand, in the optical fiber guide member, in order to secure a groove, the cladding layer in that portion is removed by etching. Here, the upper clad layer on the fiber guide core pattern may be removed by etching or may be left, but the upper clad layer on the fiber guide core pattern is left in order to ensure flatness. It is preferable. In the step of etching and removing the upper clad layer forming resin film in the groove 8 portion, the removed portion may be covered on the fiber guide core pattern.

In the manufacturing method of the present invention, when the adhesive introduction slit 13 also serves as the slit groove 9, it is not necessary to provide the slit groove 9 separately, but the adhesive layer introduction slit 13 is provided at a position different from the slit groove 9. When providing, it is preferable to provide the slit groove 9. There is no restriction | limiting in particular as a formation method of the slit groove | channel 9 in this case, Forming a slit groove | channel with a dicing saw is performed suitably. In addition, it is preferable that the depth of the slit groove | channel 9 is below the 1st lower clad layer surface.
By providing the slit groove 9, the end face of the optical waveguide connecting the optical fiber and the optical waveguide is smoothed as will be described later. Moreover, an optical fiber can be mounted favorably by setting the slit depth as described above.

Further, when the optical signal transmission core pattern 4 and the fiber guide core pattern 5 are not particularly adhesive to the substrate 1, the substrate 1 with the adhesive layer 2 may be used, and the adhesive layer is the second lower cladding. The layer 201 may also be used.
Although it does not specifically limit as a kind of contact bonding layer 2, Various adhesives used for a double-sided tape, UV or a thermosetting adhesive, a prepreg, a buildup material, and an electrical wiring board manufacture use are mentioned suitably. When the optical signal passes through the substrate 1, it is sufficient that the optical signal is transparent at the wavelength of the optical signal. In this case, the substrate 1 is bonded using a resin film for forming a clad layer or a resin film for forming a core layer that has an adhesive force. Layer 2 is preferred.

  The method for smoothing the end face of the optical waveguide connecting the optical fiber and the optical waveguide is not particularly limited. For example, the end face of the optical waveguide is cut using a dicing saw to form the slit groove 9 and smooth the surface. That's fine. The cutting depth of the dicing blade at this time is preferably less than the surface of the substrate 1 because the optical fiber 30 can be satisfactorily mounted.

EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited to a following example, unless the summary is exceeded.
Example 1
[Preparation of resin film for forming clad layer]
[(A) Base polymer; production of (meth) acrylic polymer (A-1)]
46 parts by mass of propylene glycol monomethyl ether acetate and 23 parts by mass of methyl lactate were weighed in a flask equipped with a stirrer, a cooling pipe, a gas introduction pipe, a dropping funnel, and a thermometer, and stirred while introducing nitrogen gas. . The liquid temperature was raised to 65 ° C., 47 parts by weight of methyl methacrylate, 33 parts by weight of butyl acrylate, 16 parts by weight of 2-hydroxyethyl methacrylate, 14 parts by weight of methacrylic acid, 2,2′-azobis (2,4-dimethylvaleronitrile ) A mixture of 3 parts by mass, 46 parts by mass of propylene glycol monomethyl ether acetate and 23 parts by mass of methyl lactate was added dropwise over 3 hours, followed by stirring at 65 ° C. for 3 hours, and further stirring at 95 ° C. for 1 hour. A (meth) acrylic polymer (A-1) solution (solid content: 45% by mass) was obtained.
[Measurement of weight average molecular weight]
As a result of measuring the weight average molecular weight (in terms of standard polystyrene) of (A-1) using GPC (“SD-8022”, “DP-8020”, and “RI-8020” manufactured by Tosoh Corporation), 3. It was 9 × 10 ⁴ . The column used was “Gelpack GL-A150-S” and “Gelpack GL-A160-S” manufactured by Hitachi Chemical Co., Ltd.
[Measurement of acid value]
As a result of measuring the acid value of (A-1), it was 79 mgKOH / g. In addition, the acid value was computed from the amount of 0.1 mol / L potassium hydroxide aqueous solution required for neutralizing the (A-1) solution. At this time, the point at which the phenolphthalein added as an indicator changed color from colorless to pink was defined as the neutralization point.
[Preparation of Cladding Layer Forming Resin Varnish A]
(A) As the base polymer, 84 parts by mass (solid content: 45% by mass) of the A-1 solution (solid content: 45% by mass), (B) Urethane (meth) acrylate having a polyester skeleton as the photocuring component (Shin Nakamura) 33 parts by mass of “U-200AX” manufactured by Chemical Industry Co., Ltd., and 15 parts by mass of urethane (meth) acrylate having a polypropylene glycol skeleton (“UA-4200” manufactured by Shin-Nakamura Chemical Co., Ltd.), (C) heat As a curing component, 20 parts by mass of a polyfunctional block isocyanate solution (solid content: 75% by mass) obtained by protecting an isocyanurate type trimer of hexamethylene diisocyanate with methyl ethyl ketone oxime (“Sumijour BL3175” manufactured by Sumika Bayer Urethane Co., Ltd.) (Solid content 15 parts by mass), (D) As a photopolymerization initiator, 1- [4- (2-hydroxy ester) Xyl) phenyl] -2-hydroxy-2-methyl-1-propan-1-one (“Irgacure 2959” manufactured by Ciba Japan Co., Ltd.), 1 part by mass, bis (2,4,6-trimethylbenzoyl) phenylphosphine 1 part by mass of oxide (“Irgacure 819” manufactured by Ciba Japan Co., Ltd.) and 23 parts by mass of propylene glycol monomethyl ether acetate as an organic solvent for dilution were mixed with stirring. After pressure filtration using a polyflon filter having a pore size of 2 μm (“PF020” manufactured by Advantech Toyo Co., Ltd.), degassing was performed under reduced pressure to obtain a resin varnish for forming a cladding layer.
The resin varnish A for forming a clad layer obtained above is coated on a non-treated surface of a PET film (“Cosmo Shine A4100” manufactured by Toyobo Co., Ltd., thickness 50 μm) (multicoater TM-MC, stock) After applying for 20 minutes at 100 ° C., surface release treated PET film (“Purex A31” manufactured by Teijin DuPont Films Co., Ltd., thickness 25 μm) is applied as a protective film to form a cladding layer A resin film was obtained. At this time, the thickness of the resin layer can be arbitrarily adjusted by adjusting the gap of the coating machine. In this embodiment, the thickness of the first lower cladding layer and the second lower cladding layer (adhesive layer) is used. Are described in the Examples. Moreover, the film thickness after hardening of the 1st lower clad layer and the 2nd lower clad layer and the film thickness after coating were the same. The film thickness of the upper clad layer forming resin film used in this example is also described in the examples. The film thickness of the upper clad layer forming resin film described in the examples is the film thickness after coating.

[Preparation of resin film for core layer formation]
(A) As a base polymer, 26 parts by mass of a phenoxy resin (trade name: Phenotote YP-70, manufactured by Toto Kasei Co., Ltd.), and (B) 9,9-bis [4- (2- Acrylyloxyethoxy) phenyl] fluorene (trade name: A-BPEF, Shin-Nakamura Chemical Co., Ltd.) 36 parts by mass, and bisphenol A type epoxy acrylate (trade name: EA-1020, Shin-Nakamura Chemical Co., Ltd.) ) 36 parts by mass, (C) As a photopolymerization initiator, 1 part by mass of bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide (trade name: Irgacure 819, manufactured by Ciba Japan Co., Ltd.), and 1 -[4- (2-hydroxyethoxy) phenyl] -2-hydroxy-2-methyl-1-propan-1-one (trade name: Irgacure 2959, Chi -Made by Japan Co., Ltd.) Core layer formation under the same method and conditions as in the above production example of resin varnish A for forming a cladding layer except that 1 part by mass and 40 parts by mass of propylene glycol monomethyl ether acetate as an organic solvent were used. Resin varnish B was prepared. Then, pressure filtration was carried out under the same method and conditions as in the production example of the resin varnish A for forming a cladding layer, and degassing was further performed.
The resin layer varnish B for core layer formation obtained above is applied to a non-treated surface of a PET film (trade name: Cosmo Shine A1517, manufactured by Toyobo Co., Ltd., thickness: 16 μm) in the same manner as in the above production example. Then, a release PET film (trade name: Purex A31, manufactured by Teijin DuPont Films, Inc., thickness: 25 μm) is applied as a protective film so that the release surface is on the resin side, and the core layer A forming resin film was obtained. At this time, the thickness of the resin layer can be arbitrarily adjusted by adjusting the gap of the coating machine. In this example, the thickness of the resin film for forming the core layer used in this example is described in the following examples. Describe. The film thickness of the core layer forming resin film described in the examples is the film thickness after coating.

[Production of substrate]
(Electric wiring formation by subtractive method)
Polyimide film 101 with a single-sided copper foil as the metal layer 102 ((polyimide; Upilex VT (manufactured by Ube Nitto Kasei Co., Ltd.), thickness: 25 μm), (copper foil; NA-DFF (manufactured by Mitsui Mining & Smelting Co., Ltd.)) , Thickness: 9 μm) (see FIG. 1 (a)-1, FIG. 2 (c)-1) on the copper foil surface, a photosensitive dry film resist (trade name: manufactured by Photech, Hitachi Chemical Co., Ltd., thickness: 25 μm) using a roll laminator (manufactured by Hitachi Chemical Technoplant Co., Ltd., HLM-1500) under a pressure of 0.4 MPa, a temperature of 110 ° C., and a laminating speed of 0.4 m / min, and then an ultraviolet exposure machine (Corporation) Exposed by Oak Manufacturing Co., Ltd., EXM-1172) from the photosensitive dry film resist side through a negative photomask with a width of 50 μm and irradiation with ultraviolet rays (wavelength 365 nm) of 120 mJ / cm ^2. The photosensitive dry film resist in the unexposed area was removed with a dilute solution of 0.1 to 5% by weight sodium carbonate at 35 ° C. Thereafter, using a ferric chloride solution, the exposed copper foil of the photosensitive dry film resist was removed by etching, and exposure was performed using a 1-10 wt% sodium hydroxide aqueous solution at 35 ° C. A portion of the photosensitive dry film resist was removed, and an electric wiring 103 having L (line width) / S (gap width) = 60/65 μm was formed to obtain a flexible wiring board.

(Formation of Ni / Au plating)
Thereafter, the flexible wiring board is degreased, soft etched, acid washed, immersed in an electroless Ni plating sensitizer (trade name: SA-100, manufactured by Hitachi Chemical Co., Ltd.) at 25 ° C. for 5 minutes and then washed with water. , Immersed in an electroless Ni plating solution (Okuno Pharmaceutical Co., Ltd., ICP Nicolon GM-SD solution, pH 4.6) at 83 ° C. for 8 minutes to form a 3 μm Ni film, and then washed with pure water Carried out.
Next, the displacement gold plating solution (100 mL; HGS-500 and 1.5 g; built-in bath with potassium gold cyanide / L) (trade name: HGS-500, manufactured by Hitachi Chemical Co., Ltd.), 8 at 85 ° C. It was immersed for a minute to form a 0.06 μm displacement gold film on the Ni film. Thereby, the flexible wiring board by which the electrical wiring 103 part without a cover-lay film was coat | covered with plating of Ni and Au was obtained (refer Fig.1 (a) -2, FIG.2 (c) -2).
The 10 μm-thick clad layer-forming resin film obtained above as the adhesive layer 2 is cut into a size of 100 × 100 mm, the release PET film (Purex A31) as a protective film is peeled off, and the flexible film formed as described above A vacuum pressurization laminator (manufactured by Meiki Seisakusho Co., Ltd., MVLP-500) is used as a flat plate laminator on the polyimide surface of the wiring board, vacuumed to 500 Pa or less, pressure 0.4 MPa, temperature 100 ° C., pressurization An electric wiring board with the second lower cladding layer 201 was formed by thermocompression bonding under the condition of time 30 seconds. Irradiate 4 J / cm ^{2 of} ultraviolet light (wavelength 365 nm) from the carrier film side with an ultraviolet exposure machine (EXM-1172, manufactured by Oak Manufacturing Co., Ltd.), then peel off the carrier film and heat-treat at 170 ° C. for 1 hour. Thus, the substrate 1 with the second lower cladding layer 201 having a thickness of 10 μm was formed (see FIG. 1A-3 and FIG. 2C-3).

[Fabrication of optical fiber connector]
The 15 μm-thick lower clad layer-forming resin film obtained above is cut into a size of 100 × 100 μm, the protective film is peeled off, and a vacuum laminator is formed on the second lower clad layer 201 surface side under the same conditions as described above. Laminated. Through a negative photomask having 95 μm × 3.0 mm × 4 non-exposed portions, UV light (wavelength 365 nm) is 250 mJ from the carrier film side with an ultraviolet light exposure machine (EXM-1172, manufactured by Oak Manufacturing Co., Ltd.). / Cm ² irradiation. Thereafter, the carrier film was peeled off, and the first lower cladding layer 3 was etched using a developer (1% potassium carbonate aqueous solution). Subsequently, the substrate was washed with water, heated and dried at 170 ° C. for 1 hour, and cured to produce a substrate 1 with a first lower cladding layer 3 in which an opening of 95 μm × 3.0 mm was formed in the optical fiber groove forming part (FIG. 1 (a) -4, FIG. 2 (c) -4, FIG. 2 (d) -4). As a result, the first lower cladding layer 3 is formed in the portion where the optical waveguide 20 is formed, and the first lower cladding layer 3 is not present in the groove 8 portion where the optical fiber is mounted.
Next, a roll laminator (manufactured by Hitachi Chemical Technoplant Co., Ltd., HLM-1500) is used on the surface of the first lower cladding layer 3 at a pressure of 0.4 MPa, a temperature of 50 ° C., and a laminating speed of 0.2 m / min. Then, after laminating the above-mentioned resin film for core layer formation having a thickness of 50 μm from which the protective film has been peeled off, and then vacuuming to 500 Pa or less using the above-described vacuum pressure laminator (manufactured by Meiki Seisakusho Co., Ltd., MVLP-500), Thermocompression bonding was performed under the conditions of a pressure of 0.4 MPa, a temperature of 70 ° C., and a pressing time of 30 seconds. Then, optical signal transmission core pattern width 50 μm (pattern pitch of optical fiber connection portion: 125 μm, pattern pitch of optical path conversion mirror forming portion (5 mm point from optical fiber connection portion); 250 μm, 4), core pattern for fiber guide The optical signal transmission core pattern 4 is formed on the first lower cladding layer 3 on the first lower clad layer 3 through a negative photomask having a width of 40 μm (fiber groove pitch: 125 μm, four, and fiber guide core patterns at both ends only 150 μm). Alignment is performed so that the groove 8 formed by the core pattern 5 is formed on the substrate 1 (second lower clad layer 201), and ultraviolet rays (wavelength 365 nm) are irradiated with 700 mJ / cm ² by the ultraviolet exposure machine. Subsequently, post-exposure heating was performed at 80 ° C. for 5 minutes. Thereafter, the PET film as the carrier film was peeled off, and the core pattern was etched using a developer (propylene glycol monomethyl ether acetate / N, N-dimethylacetamide = 8/2, mass ratio). Subsequently, the substrate was washed with a cleaning solution (isopropanol), dried by heating at 100 ° C. for 10 minutes to form an optical signal transmission core pattern 4 and a fiber guide core pattern 5, and at the same time, a groove 8 having a width of 85 μm was formed. . The size of each pattern in the fiber guide core pattern 5 is such that when the optical fiber is fixed in the groove 8, the optical fiber is bonded to the optical signal transmitting core pattern 4 at a position where an optical signal can be transmitted and received. It is designed (refer FIG. 1 (a) -5, FIG.1 (b) -5, FIG.2 (c) -5, FIG.2 (d) -5, FIG.2 (e)).

Next, the 85 μm thick upper clad layer resin film from which the protective film was peeled was evacuated to 500 Pa or less from the core pattern forming surface side using the above-described vacuum pressure laminator (MVLP-500, manufactured by Meiki Seisakusho Co., Ltd.). Thereafter, the film was laminated by thermocompression bonding under conditions of a pressure of 0.4 MPa, a temperature of 110 ° C., and a pressing time of 30 seconds. Further, after irradiating with 150 mJ / cm ^{2 of} ultraviolet rays (wavelength 365 nm) using the negative photomask used in forming the first lower cladding layer 3, the carrier film was peeled off, and the developer (1% potassium carbonate aqueous solution) Was used to etch the upper clad layer forming resin film in the groove 8 portion. Subsequently, it was washed with water, dried and cured at 170 ° C. for 1 hour.
As described above, an optical fiber connector for 125 μm pitch, fiber diameter of 80 μm, and 4 channels was produced.
In the obtained optical fiber connector, the lateral width of the groove 8 of the fiber guide core pattern 5 is 85 μm, the height of the fiber guide core pattern 5 (height from the surface of the second lower cladding layer 201) is 64 μm, from the substrate surface. The height to the upper surface of the upper cladding layer was 85.5 μm, and the thickness of the optical signal transmission core pattern 4 was 50 μm (FIGS. 1A-6, 1B-6, 2C) — 6, FIG. 2 (d) -6, FIG. 3 (f)).

(Formation of optical path conversion mirror)
A 45 ° optical path conversion mirror 11 was formed from the upper clad layer 6 side of the obtained optical waveguide 20 using a dicing saw (DAC552, manufactured by Disco Corporation) (FIGS. 1A-7 and 1A). b) -7). Next, a metal mask having an opening in the mirror formation portion was placed on an optical fiber connector with a mirror, and Au was vapor-deposited by 0.5 μm as a vapor-deposited metal layer 12 using a vapor deposition apparatus (RE-0025, manufactured by First Giken) (FIG. 1 (a) -8, see FIG. 1 (b) -8).

(Cover material formation)
The polyimide film (Upilex RN (manufactured by Ube Nitto Kasei Co., Ltd.), thickness: 25 μm) is peeled off the protective film of the 10 μm-thick clad layer-forming resin film obtained above as an adhesive layer 701 for the lid, Lamination was performed using a vacuum laminator under the same conditions as above to form the lid member 7 with the adhesive layer 701. Next, the carrier film of the clad layer forming resin film laminated on the lid member 7 is peeled off, and heat-pressed with a vacuum laminator under the same conditions as above from the upper clad layer 6 forming surface side of the optical fiber connector. . Subsequently, it heated and hardened at 180 degreeC for 1 hour, and the optical fiber connector with the cover material 7 was formed.
The height from the surface of the substrate 1 (second lower clad layer 201) of the groove 8 for mounting an optical fiber to the bottom surface of the lid member 7 (the bottom surface of the adhesive layer 701 of the lid member) was 82 μm (FIG. 1A ) -9, (b) -9, (c) -7 and (d) -7).

(Formation of adhesive introduction slit)
In order to smooth the optical fiber connection end face of the obtained optical waveguide 20, an adhesive introduction slit 13 that also serves as a slit groove 9 having a width of 40 μm was formed using a dicing saw (DAC552, manufactured by DISCO Corporation) ( FIG. 1 (a) -10, FIG. 1 (b) -10). In addition, the substrate was cut in parallel to the fiber guide core (3 mm point from the end face of the optical waveguide), and the outer shape was processed so that the fiber groove appeared on the end face of the substrate.
The core layer forming resin varnish is dropped from the adhesive introduction slit 13 of the optical fiber connector obtained as described above, and the space formed by the groove 8 and the lid member 7 has a 125 μm pitch and 4 channels. When the optical fiber 30 (core diameter: 50 μm, clad diameter: 80 μm) was inserted and heated and cured at 180 ° C. for 1 hour, it was bonded to the light transmission surface of the optical signal transmission core pattern 5 of the optical waveguide 20. It was possible to transmit an optical signal, and the optical fiber 30 was not displaced.

Example 2
In Example 1, an optical fiber connector was manufactured in the same manner except that the adhesive introduction slit 13 that also serves as the slit groove 9 was formed from the lid member 7 side (see FIGS. 4A and 4B). .
The core layer forming resin varnish is dropped from the adhesive introduction slit 13 of the optical fiber connector obtained as described above, and the space formed by the groove 8 and the lid member 7 has a 125 μm pitch and 4 channels. When the optical fiber 30 (core diameter: 50 μm, clad diameter: 80 μm) was inserted and heated and cured at 180 ° C. for 1 hour, it was bonded to the light transmission surface of the optical signal transmission core pattern 5 of the optical waveguide 20. It was possible to transmit an optical signal, and the optical fiber 30 was not displaced.

Example 3
In Example 1, after the optical path conversion mirror 11 and the vapor deposition metal layer 12 were formed, a slit groove 9 having a width of 40 μm was formed using a dicing saw (DAC552, manufactured by Disco Corporation) in order to smooth the optical fiber connection end face. Thereafter, the lid material 7 was formed in the same manner as in Example 1, and the adhesive introduction slit 13 was formed in the groove 8 separated by 200 μm from the slit groove 9 from the substrate 1 side using the dicing saw. In addition, the substrate was cut parallel to the fiber guide core (3 mm from the end face of the optical waveguide), and the outer shape was processed so that the fiber groove appeared on the end face of the substrate (FIGS. 5A and 5B). reference).
The core layer forming resin varnish is dropped from the adhesive introduction slit 13 of the optical fiber connector obtained as described above, and the space formed by the groove 8 and the lid member 7 has a 125 μm pitch and 4 channels. When the optical fiber 30 (core diameter: 50 μm, clad diameter: 80 μm) was inserted and heated and cured at 180 ° C. for 1 hour, it was bonded to the light transmission surface of the optical signal transmission core pattern 5 of the optical waveguide 20. It was possible to transmit an optical signal, and the optical fiber 30 was not displaced.

Example 4
An optical fiber connector was manufactured in the same manner except that the adhesive introduction slit 13 was formed from the lid member 7 side in Example 3 (see FIGS. 6A and 6B).
The core layer forming resin varnish is dropped from the adhesive introduction slit 13 of the optical fiber connector obtained as described above, and the space formed by the groove 8 and the lid member 7 has a 125 μm pitch and 4 channels. When the optical fiber 30 (core diameter: 50 μm, clad diameter: 80 μm) was inserted and heated and cured at 180 ° C. for 1 hour, it was bonded to the light transmission surface of the optical signal transmission core pattern 5 of the optical waveguide 20. It was possible to transmit an optical signal, and the optical fiber 30 was not displaced.

As described above in detail, the optical fiber connector of the present invention can easily align the optical fiber and the optical waveguide core regardless of the substrate, and the optical fiber is not easily displaced. In addition, the optical fiber and the optical waveguide can be easily coupled simply by inserting the optical fiber into the space formed by the groove and the lid member.
Therefore, it is useful as a photoelectric conversion substrate for optical fibers.

1. Substrate 101. Polyimide film 102. Metal layer 103. Metal wiring, electrical wiring Adhesive layer 201. Lower cladding layer (second lower cladding layer)
3. Lower cladding layer (first lower cladding layer)
4). 4. Optical signal transmission core pattern 5. Core pattern for fiber guide 6. Upper clad layer Lid material8. Groove (fiber groove)
9. Slit groove 10. 10. Optical fiber guide member Optical path conversion mirror 12. Evaporated metal layer 13. Adhesive introduction slit 20. Optical waveguide 30. Optical fiber

Claims (13)

An optical fiber guide member formed on a substrate by fixing a fiber guide core pattern having a fiber groove for fixing an optical fiber and a cover material covering the fiber guide core pattern;
An optical fiber connector in which an optical signal transmission core pattern is formed on a first lower cladding layer, and an optical waveguide in which an upper cladding layer is formed on the optical signal transmission core pattern,
The optical fiber guide member has an adhesive introduction slit provided from the substrate side or / and the lid material side,
The optical fiber guide member and the optical waveguide are juxtaposed so that the optical fiber is bonded to a position where the optical signal can be transmitted to the optical signal transmitting core pattern of the optical waveguide.
A space for inserting the optical fiber is formed by the fiber groove of the optical fiber guide member and the fixed lid member,
In the state where the optical fiber is inserted into the space portion, the adhesive introduction slit is formed so that the adhesive applied to the outside of the optical fiber guide member passes through the adhesive introduction slit from the outside of the optical fiber guide member. Connecting between the space and the outside of the optical fiber guide member so as to be introduced into the space,
The optical fiber connector, wherein the optical fiber is fixed to the optical fiber guide member by an adhesive introduced into the space.   2. The optical fiber connector according to claim 1, wherein only one of the substrate and the lid member is divided by the adhesive introduction slit at an installation location of the adhesive introduction slit. The adhesive introduction slit is provided from the lid material side,
The optical waveguide of the optical fiber connector is an optical waveguide with an optical path conversion mirror;
The optical fiber connector according to claim 1, wherein the lid member has a function as a reinforcing material for the optical path conversion mirror.   The optical signal transmission core pattern is formed on a first lower clad layer formed on the substrate, and the fiber guide core pattern is formed on the substrate. The optical fiber connector as described.   5. The optical fiber connector according to claim 1, wherein the substrate has an adhesive layer, and the first lower cladding layer and the fiber guide core pattern are formed on the adhesive layer. 6.   The optical fiber connector according to claim 5, wherein the adhesive layer is a second lower cladding layer.   The optical fiber connector according to claim 1, wherein the substrate is an electric wiring board. A first lower clad layer forming film is laminated on a substrate, and the first lower clad layer forming film is etched to form a first lower clad layer forming film at a portion where a fiber groove for fixing an optical fiber is formed. A first step of removing
A core forming film is laminated on the first lower cladding layer and the substrate from which the first lower cladding layer forming film has been removed in the previous step, and a fiber guide core pattern and an optical signal transmission core pattern are formed by etching. A batch forming process for batch forming , and
The manufacturing method of the optical fiber connector which has a 2nd process in which the adhesive introduction slit for fixing the said optical fiber from the said board | substrate side is provided in order. A first lower clad layer forming film is laminated on a substrate, and the first lower clad layer forming film is etched to form a first lower clad layer forming film at a portion where a fiber groove for fixing an optical fiber is formed. A first step of removing
A core forming film is laminated on the first lower cladding layer and the substrate from which the first lower cladding layer forming film has been removed in the previous step, and a fiber guide core pattern and an optical signal transmission core pattern are formed by etching. Batch forming process for batch forming ,
An optical fiber connector comprising: a lid member forming step of forming a lid member that covers and fixes at least the fiber guide core pattern; and a second step of providing an adhesive introduction slit for fixing the optical fiber from the lid member side Manufacturing method. After the batch forming step, an upper clad layer forming film is laminated from the fiber guide core pattern and the optical signal transmitting core pattern forming surface side, and a fiber groove portion for fixing the optical fiber is etched. have a step of removing the upper cladding layer-forming film,
The optical signal transmission core pattern is formed on the first lower cladding layer by the first step, the batch formation step, and the second step, and the upper cladding layer is formed on the optical signal transmission core pattern. The manufacturing method of the optical fiber connector of Claim 9 which obtains the formed optical waveguide . The lid material forming step covers the fiber guide core pattern and simultaneously forms the lid material so that a part of the lid material covers at least a part of the optical waveguide;
The said manufacturing method is a manufacturing method of the optical fiber connector of Claim 10 which has the process of forming the said adhesive agent introduction slit after the said cover material formation process.   The method for manufacturing an optical fiber connector according to claim 9, wherein the adhesive introduction slit is formed by a dicing saw. The optical fiber connector has a plurality of space portions for inserting the optical fiber with the fiber groove and the fixed lid member ,
The method for manufacturing an optical fiber connector according to any one of claims 9 to 12, wherein, when forming the adhesive introduction slit, a groove communicating two adjacent space portions among the plurality of space portions is simultaneously formed. .

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