JP5713688B2 - Laser processing system and laser processing apparatus - Google Patents

Description

  The present invention relates to a laser processing system and a laser processing apparatus. More specifically, the present invention relates to a laser processing system that performs laser processing in consideration of the position or orientation of a workpiece, and an improvement of a laser processing apparatus used in the laser processing system. .

  The laser marker forms a processing pattern on the workpiece by two-dimensionally scanning the irradiation position of the laser light based on predetermined processing setting data. For this reason, if the machining pattern is to be formed at the correct position on the workpiece with the correct orientation, it is necessary to match the position and orientation of the workpiece at the time of machining with a predetermined position and orientation. For this reason, the user had to adjust the position and direction for each workpiece to be processed.

  In particular, when high accuracy is required for the position and orientation of the machining pattern, the same accuracy as the machining accuracy is also required for the position and orientation of the workpiece. For example, when performing laser processing on a small workpiece such as a semiconductor chip of several mm square, it is necessary to control the position and orientation of the workpiece with high accuracy.

  Therefore, a workpiece is photographed using a camera, and an error in the position and orientation (hereinafter referred to as a workpiece error) is measured on an actual workpiece with respect to a predetermined workpiece position and orientation, and machining is performed according to the workpiece error. If the setting data can be corrected, it is considered that convenience can be improved and processing accuracy can be improved.

  FIG. 24 is a diagram illustrating an example of a schematic configuration of a conventional laser processing system including a camera. In this laser processing system, a camera 56 is arranged in the vicinity of the laser marker 20 and the laser marker 20 is controlled based on the captured image. However, the optical axis of the laser marker 20 matches the optical axis of the camera 56. Not. For this reason, it is possible to determine the presence / absence of the workpiece W and the approximate position and orientation, but it is difficult to determine the exact location and orientation of the workpiece W viewed from the laser marker 20.

  FIG. 25 is a diagram showing another example of a schematic configuration of a conventional laser processing system including a camera (for example, Patent Document 1). In this laser processing system, the light receiving axis of the camera 56 is branched from the emission axis of the laser light L on the upstream side of the scanner 47 in the laser marker 20. Therefore, the light receiving axis of the camera 56 is also scanned by the scanner 47 in the same manner as the laser light L. That is, the captured image of the camera 56 is a distorted image of the coordinate system, but only the position on the light receiving axis exactly matches the irradiation position of the laser light L. Therefore, the position and orientation of the workpiece W can be accurately determined based on the captured image.

JP 2009-78280 A

  However, in order to determine the exact position and orientation of the workpiece W using a conventional laser processing system, it is necessary to sequentially match the light receiving axis with two or more feature points of the workpiece W. That is, the captured image is displayed on the display together with a symbol indicating the light receiving axis, and the user must control the scanner 47 so that the light receiving axis matches the feature point of the work W while viewing the captured image. Such an operation must be performed for each workpiece W to be inspected. Therefore, it is possible to realize high-precision laser processing, but there is a problem that the operation is complicated and cannot be automated.

  Furthermore, since the conventional laser marker cannot replace the camera, there is a problem that an optimum camera cannot be used according to the image quality required for the captured image.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a laser processing system capable of controlling the position or orientation of a processing pattern with respect to a workpiece with high accuracy. In particular, an object is to provide a laser processing system capable of forming a processing pattern in a predetermined direction at a predetermined position on the work regardless of the position and orientation of the work.

  Another object is to automate the laser processing system. In particular, an object of the present invention is to provide a laser processing system capable of forming a processing pattern in a predetermined direction at a predetermined position on a workpiece in consideration of a workpiece error of the automatically conveyed workpiece.

  Moreover, it aims at providing the laser processing apparatus which can be used for such a laser processing system. In particular, an object of the present invention is to provide a laser processing apparatus in which a camera can be replaced.

A laser processing system according to a first aspect of the present invention includes a laser generator that generates laser light, a scanner that scans the laser light on a processing surface of a work, and a work that is disposed closer to the work than the scanner. Regardless, a laser processing apparatus comprising a telecentric lens that emits the laser light at a constant emission angle, and a camera having a light receiving axis that is branched from the laser light emission axis on the laser generator side of the scanner. And an image processing device that performs predetermined image processing on a photographed image photographed by the camera, and the laser processing device and the image processing device connected to the laser processing device. and a controller for instructing the processing start, the camera, the illumination possible region of the laser beam Shooting imaging area comprising a region smaller than the processing area that.

The control device consists of the control information for the camera shooting for the scanner, the imaging position data storage means for holding a photographing position data capturing position of the processing area is specified relative to the laser processing apparatus, the photographing An imaging scan request output means for outputting an imaging scan request including position data , and an imaging scan response input for inputting an imaging scan response indicating that the scanner has completed the operation based on the imaging scan request from the laser processing apparatus. And a captured image acquisition request output means for outputting a captured image acquisition request for requesting acquisition of a captured image captured by the camera based on the imaging scan response to the image processing apparatus.

  The image processing device is based on a captured image acquisition unit that acquires a captured image captured by the camera based on the captured image acquisition request from the control device, and a captured image acquired by the captured image acquisition unit. And a workpiece error detecting means for obtaining an error of the actual workpiece position with respect to a predetermined workpiece position as a workpiece error.

In the laser processing apparatus, the position of the imaging area matches the position corresponding to the imaging position data based on the imaging scan request input means for inputting the imaging scan request from the control device and the imaging scan request. As described above, the scanner control means for controlling the scanner, the imaging scan response output means for outputting the imaging scan response to the control device, the work error input means for inputting the work error, and the laser for the scanner Machining setting data storage means for holding machining setting data composed of machining control information, and machining setting correction means for correcting the machining setting data based on the workpiece error.

  When the laser processing apparatus is instructed to start processing the workpiece from the control device, the scanner scans the laser beam based on the processing setting data corrected by the processing setting correction means. Composed.

  With such a configuration, the light receiving axis of the camera is substantially coincident with the laser light emitting axis, and the irradiation position of the laser light scanned by the scanner can be photographed by the camera. For this reason, it is possible to obtain a captured image that exactly matches the irradiation position of the laser beam. Further, by using a telecentric lens, it is possible to obtain a captured image with almost no distortion, and therefore it is possible to determine an accurate position for points other than on the imaging axis in the captured image.

  Further, when the laser beam is not output, the light receiving axis is scanned based on the photographing position data, and the work is photographed, whereby an error of the actual work position with respect to a predetermined work position can be obtained as a work error. it can. If the machining setting data is corrected based on the workpiece error thus obtained, a desired machining position on the workpiece can be irradiated with laser light regardless of the position of the workpiece.

  Further, when the imaging scan request is input, the laser processing apparatus outputs an imaging scan response after the completion of the scanner scanning based on the imaging scan request. For this reason, when the control device sequentially outputs a photographing scan request to the laser processing device and a photographing image acquisition request to the image processing device, and tries to obtain a photographed image of the workpiece, after outputting the photographing scan request, A captured image acquisition request can be quickly output without waiting for the maximum time for the scanner operation. Therefore, it is possible to shorten the time required to acquire the captured image.

In the laser processing system according to the second aspect of the present invention, in addition to the above configuration, the control device receives the workpiece error from the image processing device, and the processing setting is performed on the laser processing device based on the workpiece error. A correction request output means for outputting a data correction request is provided.

In the laser processing system according to the third aspect of the present invention, in addition to the above configuration, the image processing apparatus is built in the laser processing apparatus.

In the laser processing system according to the fourth aspect of the present invention, in addition to the above-described configuration, the workpiece error detection means obtains an error of an actual workpiece position and orientation as a workpiece error with respect to a predetermined workpiece position and orientation. Composed.

  With such a configuration, an error of the actual workpiece position and orientation with respect to a predetermined workpiece position and orientation can be obtained as a workpiece error. If the machining setting data is corrected based on the workpiece error thus obtained, a desired machining position on the workpiece can be irradiated with laser light regardless of the position and orientation of the workpiece.

Pattern fifth laser processing system according to the present invention, in addition to the above configuration, which includes a matching data storage unit for storing the matching data for the pattern matching for the work, the work error detecting means, using the above matching data By performing matching, the position and orientation of the workpiece in the captured image are determined.

A laser processing apparatus according to a sixth aspect of the present invention is a laser processing apparatus in a laser processing system in which a control device is connected to a laser processing apparatus and an image processing apparatus, the laser generator for generating laser light, and the laser light as a workpiece. A scanner that scans the machined surface, a telecentric lens that is disposed closer to the workpiece than the scanner and emits the laser light at a constant emission angle regardless of the incident angle, and the laser generator than the scanner A camera that has a light receiving axis branched from the laser light emitting axis on the side, and that captures a photographing area that is narrower than a processing area that is a region that can be irradiated with the laser light; control information consists, photographing position data capturing position of the working area is designated A photographing scan request input means inputted imaging scan request from the control device comprising, based on the imaging scan request, as the position of the photographing area coincides with the position corresponding to the photographing position data, the scanner Scanner control means for controlling, imaging scan response output means for outputting an imaging scan response indicating that the scanner has completed the operation based on the imaging scan request to the control device, and the scanner responding to the imaging scan request. In a state in which the operation based on the image is completed, a photographed image photographed by the camera is output to the image processing device, and is a work error obtained by the image processing device, which is an actual work position with respect to a predetermined work position. Work error input means for inputting a work error indicating a work position error, and the scanner Machining setting data storage means for holding machining setting data consisting of control information for laser machining, and machining setting correction means for correcting the machining setting data based on the workpiece error. When instructed to start processing, the scanner is configured to scan the laser beam based on the processing setting data corrected by the processing setting correction means.

  With such a configuration, when an imaging scan request is input, an imaging scan response is output after the scanning based on the imaging scan request is completed. For this reason, when acquiring a captured image after inputting an imaging scan request, it is possible to quickly detect the workpiece without waiting for the maximum time from the input of the imaging scan request to the completion of the scanner scan. A captured image can be acquired. Therefore, it is possible to shorten the time required to acquire the captured image.

A laser processing apparatus according to a seventh aspect of the present invention includes, in addition to the above-described configuration, a beam splitter that is disposed between the scanner and the laser generator and splits incident light from the processing surface from the optical axis of the laser light; And a camera mounting portion which is provided on a branch path by the beam splitter and to which the camera is detachably mounted. With such a configuration, the camera can be exchanged as necessary. For example, the camera can be replaced with an appropriate camera according to the required image quality.

In the laser processing apparatus according to the eighth aspect of the present invention, in addition to the above-described configuration, the camera mounting portion includes an adjustment unit that can adjust a two-dimensional offset and a rotation angle with respect to the light receiving surface of the camera. With such a configuration, the light receiving axis of the camera is substantially coincident with the laser light emitting axis, and the irradiation position of the laser light scanned by the scanner can be photographed by the camera.

A laser processing apparatus according to a ninth aspect of the present invention includes, in addition to the above configuration, a metal housing, the camera mounting portion includes a screw mount for screwing the workpiece photographing camera, and the screw mount is And electrically insulated from the casing. With such a configuration, even when the electronic circuit constituting the camera is grounded to the engaging portion with the screw mount, the electronic circuit is electrically connected to the housing and is destroyed by noise. Can be prevented.

  ADVANTAGE OF THE INVENTION According to this invention, the laser processing system which can control the position or direction of the process pattern with respect to a workpiece | work with high precision can be provided. In particular, it is possible to provide a laser processing system capable of forming a processing pattern in a predetermined direction at a predetermined position on the workpiece regardless of the position and orientation of the workpiece.

  In addition, the laser processing system can be automated. In particular, it is possible to provide a laser processing system capable of forming a processing pattern in a predetermined direction at a predetermined position on the workpiece in consideration of a workpiece error of the automatically conveyed workpiece.

  In addition, a laser processing apparatus that can be used in such a laser processing system can be provided. In particular, a laser processing apparatus in which a camera can be replaced can be provided.

1 is a system diagram showing an example of a schematic configuration of a laser marking system 1 including a laser processing apparatus according to Embodiment 1 of the present invention. It is the block diagram which showed the detailed structure of the laser marker 20 of FIG. FIG. 3 is an explanatory diagram showing an example of the operation of the telecentric lens 48 in FIG. 2. It is the figure which showed the spatial arrangement | positioning of the optical units 41-48 and 51-56 of FIG. It is the perspective view which showed the internal structure of the marker head 21 of FIG. FIG. 5 is a plan view showing a configuration example of the illumination module 530 in FIG. 4. It is sectional drawing at the time of cut | disconnecting the illumination module 530 of FIG. 6 by the AA cutting line. FIG. 6 is an external view showing a configuration example of a camera module 560 in FIG. 5. It is the figure which showed the detailed structure of the camera 56 and the camera attachment part 572 of FIG. It is sectional drawing at the time of cut | disconnecting the camera 56 of FIG. 9, and the camera attaching part 572 with a BB cut line. It is the figure which showed an example of the symbol SBL prescribed | regulated by process setting data. It is the figure which showed an example of the laser processing based on the process setting data of FIG. It is the figure which showed an example of the data required for the image process for extracting the workpiece | work W from a picked-up image. It is the figure which showed an example of the calculation process of the workpiece | work error Derr. It is explanatory drawing which showed an example of the correction process of process setting data. It is the figure which showed an example of the laser processing based on the process setting data after correction | amendment. It is the block diagram which showed the detailed structure about the principal part of the laser marking system 1 of FIG. FIG. 2 is a block diagram showing a detailed configuration of main parts of the image processing apparatus 11 and the control apparatus 12 of FIG. It is the sequence diagram which showed an example of operation | movement of the error compensation laser processing by the laser marking system 1 of FIG. It is the timing chart which showed an example of the change of the main signal in error compensation laser processing. It is explanatory drawing about an example of the error compensation laser processing by Embodiment 2 of this invention. It is explanatory drawing about an example of the error compensation laser processing by Embodiment 3 of this invention. It is explanatory drawing about the other example of the error compensation laser processing by Embodiment 3 of this invention. It is the figure which showed an example of schematic structure of the conventional laser processing system provided with the camera. It is the figure which showed the other example of schematic structure of the conventional laser processing apparatus provided with the camera.

Embodiment 1 FIG.
<Laser marking system 1>
FIG. 1 is a system diagram showing an example of a schematic configuration of a laser marking system 1 including a laser processing apparatus according to Embodiment 1 of the present invention. A laser marker 20 is shown as an example of a laser processing apparatus.

  The laser marking system 1 includes a laser marker 20 that processes a workpiece W by irradiating a laser beam L, a workpiece sensor S that detects the workpiece W, a terminal device 10 for editing processing conditions of the laser marker 20, The image processing device 11 performs image processing of a captured image output from the laser marker 20, the laser marker 20, and a control device 12 that controls the image processing device 11. The laser marker 20 includes a marker head 21 that generates and scans the laser light L, and a marker controller 22 that controls the operation of the marker head 21.

  The terminal device 10 is a terminal device for controlling the laser marker 20, and for example, a personal computer in which an application program for a laser marker is installed is used. By using the terminal device 10, the user can create and edit processing setting data that defines the processing conditions of the laser marker 20, and transmit the processing setting data to the laser marker 20. The machining setting data is created on the assumption that the workpiece W is installed with respect to the marker head 21 in a predetermined position and orientation. In this specification, such a position and orientation are referred to as “reference position” and “reference orientation”.

  The image processing apparatus 11 is an apparatus that performs image processing on a captured image of the workpiece W, and may be a dedicated image processing apparatus or a personal computer in which an application program for image processing is installed. In this image processing apparatus 11, the position and orientation of the workpiece W are specified by extracting an image of the workpiece W from the captured image by performing image processing such as pattern matching, and the workpiece error is detected as an error with respect to the reference position and the reference orientation. Ask for.

  The control device 12 is a control device that automatically controls the laser marker 20 and the image processing device 11, and uses, for example, a PLC (programmable logic controller). The control device 12 controls the laser marker 20 and the image processing device 11 based on the detection signal of the workpiece sensor S, and realizes laser processing in consideration of the workpiece error. Here, when a workpiece W is installed in the processing area of the laser marker 20, the laser marker 20 captures the workpiece W, the image processing apparatus 11 obtains a workpiece error from the captured image, and the laser marker 20 responds to the workpiece error. Process. Such a series of processing is automatically controlled by the control device 12.

  The workpiece sensor S is a workpiece detection unit that outputs a workpiece detection signal indicating that the workpiece W has been installed in the processing area of the laser marker 20 to the control device 12. Here, an example in which an optical sensor for monitoring a processing area is used will be described, but an output signal from an automatic transfer device for a workpiece W may be used.

  The marker controller 22 controls the operation of the marker head 21 based on the processing setting data received from the terminal device 10. The machining setting data is corrected based on a correction request from the control device 12, and the work error is reflected. That is, by correcting the machining setting data, laser machining with compensated workpiece errors can be performed.

  The marker head 21 generates laser light L using the excitation light transmitted from the marker controller 22 via the optical fiber 23 and irradiates the workpiece W with it. At this time, by scanning the emission axis of the laser light L based on the control signal from the marker controller 22, symbols such as characters, symbols and figures can be printed on the workpiece W. In addition, an illumination light source and a camera (not shown) are built in the marker head 21, and a photographed image of the work W photographed by the camera is output to the image processing device 11.

<Laser marker 20>
FIG. 2 is a block diagram showing a detailed configuration of the laser marker 20 of FIG. 1, and shows an example of the internal configuration of the marker head 21 and the marker controller 22.

  The laser marker 20 can perform high-precision laser processing by irradiating the laser beam L through the telecentric lens 48. Further, the illumination light source 53 and the camera 56 for photographing the workpiece W are provided, and the optical axis of the illumination light source 53 and the photographing axis of the camera 56 are arranged so as to be coaxial with the emission axis of the laser light L. For this reason, a photographic image without distortion can be obtained through the telecentric lens 48.

  The illumination light source 53 generates illumination light having substantially the same wavelength as the laser light L, and the camera 56 images return light having substantially the same wavelength as the laser light. For this reason, since the workpiece | work W can be image | photographed using the light of the wavelength substantially the same as the laser beam L, a clear picked-up image is obtained. Further, by providing the camera shutter 55 on the photographing axis of the camera 56, the laser light L reflected by the work W is prevented from entering the camera 56 as return light and damaging the camera 56.

<Marker controller 22>
The marker controller 22 includes a power supply 30, an excitation light generation unit 31, and a control unit 32. The power supply 30 supplies electric power to the marker head 21, the excitation light generation unit 31, and the control unit 32 using a commercial power supply. The excitation light generator 31 generates excitation light for laser oscillation. This excitation light is transmitted to the marker head 21 via the optical fiber 23. The control unit 32 controls the excitation light generation unit 31 and the marker head 21 based on the processing setting data transferred from the terminal device 10, and performs output control and scanning control of the laser light L.

<Marker head 21>
The marker head 21 includes a laser oscillator 41, a beam sampler 42, an oscillator shutter 43, a mixing mirror 44, a Z scanner 45, a polarizing beam splitter 46, an XY scanner 47, a telecentric lens 48, a power monitor 51, a guide light source 52, and an illumination light source 53. , A half mirror 54, a camera shutter 55, and a camera 56.

  The laser oscillator 41 is a laser generator that absorbs excitation light and generates laser light L including a laser beam, and includes a laser medium, a resonator, a Q switch, and the like. Here, it is assumed that the laser oscillator 41 is a solid-state laser oscillator that pulsates, for example, an SHG type laser oscillator. The SHG type laser oscillator uses a YAG (yttrium-aluminum-garnet) crystal doped with neodymium ions as a laser medium, and outputs green light having a wavelength of 532 nm using the second harmonic. Laser light having a wavelength of 808 nm is used as excitation light for exciting the laser medium. The laser light L generated by the laser oscillator 41 is applied to the workpiece W via the beam sampler 42, the mixing mirror 44, the Z scanner 45, the polarization beam splitter 46, the XY scanner 47, and the telecentric lens 48 in order.

  The beam sampler 42 is an optical splitter that branches a certain proportion of the laser light L output from the laser oscillator 41 as a sampling beam. For example, by utilizing the surface reflection of the transparent substrate, about 3% of the total amount of the incident laser light L is dispersed and incident on the power monitor 51 as a sampling beam. The power monitor 51 is a light intensity detection means for detecting the output power of the laser oscillator 41 and is composed of a light receiving element such as a photodiode. The detection result is used for output control of the laser oscillator 41.

  The oscillator shutter 43 is a leakage prevention blocking unit that blocks the emission path of the laser light L so as to be openable and closable and prevents the leakage of the laser light L, and is disposed upstream of the polarization beam splitter 46. Here, a shutter 43 for an oscillator is provided between the beam sampler 42 and the mixing mirror 44, and in the processing mode for processing the workpiece W, a shooting mode for shooting the workpiece W by opening the emission path of the laser light L is opened. Sometimes, the emission path of the laser light L is blocked.

  The mixing mirror 44 is an optical mixing optical splitter that substantially matches the emission axis of the guide light with the emission axis of the laser light L, transmits the laser light L from the laser oscillator 41, and reflects the guide light from the guide light source 52. Both are sent to the Z scanner 45. The guide light source 52 is a light source device that generates guide light for displaying a processing position on the workpiece W, and includes a light emitting element such as an LD (laser diode). The symbol pattern to be printed can be visually recognized as an afterimage of the irradiation spot by the lighting control of the guide light and the high-speed scanning of the emission axis of the guide light.

  The Z scanner 45 is a beam diameter control means for adjusting the beam diameter of the laser light L. The Z scanner 45 is composed of two lenses arranged on the optical axis of the laser light L, and changes the relative distance between these lenses. The beam diameter 2 mmφ of the laser beam L can be expanded to a maximum of 8 mmφ. By increasing the spot diameter of the laser light, defocus control that reduces the energy density in the spot can be performed.

  The polarization beam splitter 46 is disposed on the upstream side of the XY scanner 47 on the emission path of the laser light L, and transmits the laser light L from the Z scanner 45, while the light receiving axis of the camera 56 is used as the laser light L. This is an optical splitter for a camera that substantially coincides with the output axis of the camera. Of the light reflected by the work W, the return light that enters the telecentric lens 48 and goes back through the emission path of the laser light L is reflected by the polarization beam splitter 46 and thus separated from the emission axis of the laser light L, and the camera 56. Is incident on. The polarization beam splitter 46 reflects the illumination light incident through the half mirror 54 toward the XY scanner 47 so that the emission axis of the illumination light coincides with the emission axis of the laser light L. For example, when the laser oscillator 41 generates a P-polarized laser beam L, the laser beam L is allowed to pass by using a polarization beam splitter 46 that selectively transmits the P-polarized component and reflects the S-polarized component. On the other hand, the return light and the irradiation light including the S-polarized component can be reflected, respectively.

  The XY scanner 47 is a scanning optical system that scans the emission axis of the laser light L and two-dimensionally scans the irradiation position on the workpiece W in the X direction and the Y direction, and reflects the laser light L. It comprises a mirror, a Y-direction scanning mirror, and a drive unit that rotates these scanning mirrors. The scanning mirror is called a galvanometer mirror, and is arranged on the emission path of the laser light L. The XY scanner 47 rotates the scanning mirror based on a scanning control signal from the marker controller 22.

  The telecentric lens 48 is an emission optical system that emits the laser light L toward the workpiece W, and is arranged downstream of the XY scanner 47 in the emission path of the laser light L, that is, on the workpiece W side. The telecentric lens 48 is an object-side telecentric optical system that includes a plurality of optical lenses and a cover glass, and has an angle of view on the workpiece W side of approximately 0 °. The laser beam L is emitted toward the workpiece W so that the principal ray is substantially parallel to the lens optical axis.

  The illumination light source 53 is a light source device that generates illumination light for illuminating the workpiece W, and includes a light emitting element such as an LED (light emitting diode). The illumination light source 53 generates illumination light including at least the same wavelength as the laser light L and emits the illumination light to the half mirror 54.

  The half mirror 54 is an optical splitter for illumination that is disposed on the light receiving path of the camera 56 and transmits the return light from the polarization beam splitter 46, while making the emission axis of the illumination light substantially coincide with the light receiving axis of the camera 56. That is, the return light from the polarization beam splitter 46 is transmitted toward the camera 56, while the illumination light from the illumination light source 53 is reflected toward the polarization beam splitter 46.

  The camera shutter 55 is a camera protection blocking means for blocking the light receiving path of the camera 56 so that it can be opened and closed, and preventing the return light from entering the camera 56 when the laser beam L is irradiated. It arrange | positions rather than the upstream. Here, a camera shutter 55 is provided between the half mirror 54 and the camera 56, and the light receiving path of the camera 56 is opened in the photographing mode, and the light receiving path of the camera 56 is blocked in the processing mode.

  Here, as the operation mode of the laser marker 20, by switching between the processing mode and the photographing mode, the shutters 43 and 55 are excluded so that neither the oscillator shutter 43 nor the camera shutter 55 is opened. Thus, the camera 56 is prevented from being damaged by the return light of the laser beam L.

  The camera 56 is an imaging unit that captures the workpiece W and generates a captured image. The camera 56 captures an image based on the imaging control signal from the marker controller 22 and outputs the obtained captured image to the image processing apparatus 11. . Here, it is assumed that the camera 56 receives substantially the same wavelength as the laser light and generates a captured image.

<Telecentric lens 48>
FIG. 3 is an explanatory diagram showing an example of the operation of the telecentric lens 48 of FIG. (A) in the figure shows the case where the laser beam L is irradiated to the center of the processing area, (b) shows the case where the laser beam L is irradiated near the left end of the processing area, and (c) shows the processing area. The case where the laser beam L is irradiated near the right end of each is shown.

  The telecentric lens 48 emits the laser light L so that its principal ray is substantially parallel to the optical axis of the telecentric lens 48 regardless of the incident angle of the laser light L. For this reason, even when the scanning angle of the XY scanner 47 becomes deep and the incident angle to the telecentric lens 48 becomes large, the spot diameter of the laser beam L formed on the workpiece W does not change, and high accuracy is achieved. Laser processing can be performed.

  When such a laser marker 20 is used to photograph the workpiece W using a camera 56 having a light receiving axis substantially coincident with the emission axis of the laser light L, a photographed image without distortion can be obtained. That is, even if the scanning angle of the XY scanner 47 becomes deep and the incident angle to the telecentric lens 48 becomes large, the captured image is not distorted. Furthermore, regardless of the scanning angle of the XY scanner 47, surrounding images are not distorted in the captured image. Therefore, by performing image processing for extracting the image of the workpiece W from the captured image of the camera 56, the position and orientation of the workpiece W can be extracted with high accuracy.

<Spatial arrangement of optical unit>
FIG. 4 is a diagram showing a spatial arrangement of the optical units 41 to 48 and 51 to 56 of FIG. The laser oscillator 41, the beam sampler 42, the mixing mirror 44, the Z scanner 45, the polarization beam splitter 46, and the XY scanner 47 are aligned in the horizontal direction, and the laser light L passes through a straight path from the laser oscillator 41 to the XY scanner 47. , Bent downward by the XY scanner 47 and enters the telecentric lens 48. By adopting such a configuration, errors due to variations in the optical units 41 to 47 can be suppressed, and the accuracy of laser processing can be improved.

  The laser oscillator 41 has a T-shape, receives excitation light from the lower right input terminal 41T, and outputs laser light L from an output window 41W formed at the tip of the upper left output tube 41B.

  The beam sampler 42 and the mixing mirror 44 are disposed with an inclination of 45 ° with respect to the emission axis of the laser light L.

  The oscillator shutter 43 includes a light shielding plate 43a, a rotation drive unit 43b, a position detection unit 43c, and a reflected light absorbing device 43d. The light shielding plate 43a is a light shielding means that blocks the optical path of the laser light L, and is made of, for example, a metal plate. The rotation driving unit 43b is a driving unit that rotates the light shielding plate 43a. For example, a rotary solenoid is used. The rotation drive unit 43b rotates the light shielding plate 43a to block the optical path of the laser light L so that it can be opened and closed. The position detection unit 43c is a detection unit that detects the rotational position of the light shielding plate 43a, and for example, a photocoupler is used. The reflected light absorbing device 43d absorbs the laser light L reflected by the light shielding plate 43a and prevents the laser light L from being scattered.

  The polarization beam splitter 46 is disposed so as to be inclined by about 56.6 ° with respect to the emission axis of the laser beam L, and the incident angle of the laser beam L is substantially coincident with the Brewster angle. For this reason, the laser beam L can be transmitted almost 100%. The return light is reflected by the polarization beam splitter 46 and travels upward at an angle of about 66.8 ° with respect to the emission axis of the laser beam L in the horizontal direction.

  The illumination module 530 is a module in which the illumination light source 53 is arranged on the front side of the paper and the half mirror 54 is arranged on the back side of the paper. The illumination light irradiated from the front to the back is reflected by the half mirror 54. , And enters the polarization beam splitter 46 in the lower left direction. The return light incident from the polarization beam splitter 46 passes through the half mirror 54 and enters the camera module 560 in the upper right direction.

  The camera module 560 is a module composed of a camera 56 and a lens barrel 57, and the camera 56 is attached to one end of the lens barrel 57 in a replaceable manner.

<Internal structure of marker head 21>
FIG. 5 is a perspective view showing the internal structure of the marker head 21 of FIG. In the marker head 21, the optical units other than the telecentric lens 48 and the camera 56 among the optical units 41 to 48 and 51 to 56 illustrated in FIG. 2 are accommodated in the housing frame 60.

  The housing frame 60 is an integrally molded die-cast frame made of a metal such as aluminum, and is divided into two accommodating portions 62 and 63 by a partition plate 61 that is integrally molded. The housing frame 60 is integrally formed, and the optical units 41 to 48 and 51 to 56 are fixed to the housing frame 60, thereby improving the placement accuracy of these optical units and improving the laser processing accuracy. it can.

  The right accommodating portion 62 accommodates the laser oscillator 41, the connection portion 23 </ b> C of the optical fiber 23 is attached to the outer wall, and the optical fiber 23 passes through the wall surface. The excitation light is incident on the lower right portion of the laser oscillator 41 via the optical fiber 23, and the laser light L is emitted from the output window 41 </ b> W at the upper left portion of the laser oscillator 41. The output window 41 </ b> W is disposed in the tip of the output cylinder 41 </ b> B of the laser oscillator 41 that penetrates the partition plate 61, that is, in the left receiving portion 63.

  The left accommodation unit 63 accommodates each optical unit except for the laser oscillator 41, the telecentric lens 48, and the camera 56. The housing portion 63 has a dustproof structure, and prevents a reduction in accuracy of laser processing due to the influence of dust.

  Three height adjustment legs 65 for supporting the marker head 21 are attached to the housing frame 60. Each height adjustment leg 65 is a columnar support member, and the length can be individually adjusted. Each height adjustment leg 65 is attached to a common attachment plate 66, and the marker head 21 is installed on a work table or the like via the attachment plate 66.

<Lighting module 530>
FIG. 6 is a plan view showing a configuration example of the illumination module 530 of FIG. Moreover, FIG. 7 is sectional drawing at the time of cut | disconnecting the illumination module 530 of FIG. 6 by the AA cut line. The illumination module 530 includes an illumination light source 53, a heat sink 531, an aperture 532, a condenser lens 533, and a half mirror 54, and an attachment surface 534 is fixed to the housing frame 60.

  The heat sink 531 is a heat radiating plate having a large number of heat radiating fins, and is attached to the back surface of the illumination light source 53. The aperture 532 is an optical stop that transmits only illumination light in the vicinity of the emission axis, and includes a light shielding plate in which a small transmission window is formed on the emission axis of the illumination light. The illumination light that has passed through the aperture 532 passes through the condenser lens 533 and enters the half mirror 54. The half mirror 54 is disposed with an inclination of 45 ° with respect to the light receiving axis of the camera 56.

  If such an aperture 532 is disposed in front of the illumination light source 53, light unnecessary for photographing can be blocked and the amount of irradiation light can be suppressed. For this reason, it can suppress that a lens flare arises in a picked-up image. In particular, when the XY scanner 47 has a shallow scanning angle, it is possible to prevent the illumination light from being reflected by the telecentric lens 48 and causing lens flare in the captured image.

<Camera module 560>
FIG. 8 is an external view showing a configuration example of the camera module 560 of FIG. The camera module 560 includes a camera 56 and a lens barrel 57.

  The camera 56 is a photographing unit including an image sensor 56a, a circuit board 56b, and a mount portion 56c. The imaging element 56a is an imaging unit in which a large number of light receiving elements are arranged in a matrix and outputs a captured image of the workpiece W. For example, a CCD (Charge Coupled Device) can be used. The circuit board 56b is a printed board on which the image sensor 56a and its control circuit are arranged. The mount portion 56c is an engaging means for engaging the camera 56 with the lens barrel 57, and is fixed to the circuit board 56b. Here, it is assumed that the mount portion 56c is made of a cylindrical body having a thread groove formed on the inner surface, and constitutes a general-purpose screw mount (screw mount), for example, a C mount.

  The lens barrel 57 includes a barrel frame 571 and a camera mounting portion 572. The lens barrel frame 571 is a substantially cylindrical casing having one end opposed to the half mirror 54 and the camera mounting portion 572 provided at the other end, and is fixed to the casing frame 60. The imaging lens 57r accommodated in the lens barrel 57 is an optical system for imaging the return light on the imaging device 56a, and includes a wavelength selection filter 57f.

  The wavelength selection filter 57f is a filter that selectively transmits at least substantially the same wavelength as the laser light L. Using the wavelength selection filter 57f, the return light having substantially the same wavelength as that of the laser light L is incident on the camera 56 and a wavelength component unnecessary for photographing is removed to obtain a clear photographed image. .

  FIG. 9 is a diagram illustrating the detailed configuration of the camera 56 and the camera mounting portion 572 of FIG. 8. FIG. 9A is a diagram viewed from the light receiving axis (camera 56 side), and FIG. These are the figures seen from the direction orthogonal to a light-receiving axis. FIG. 10 is a cross-sectional view of the camera 56 and camera mounting portion 572 of FIG. 9 taken along the line BB.

  The camera mounting portion 572 includes a movable mount portion 573 and a mount support portion 574. The movable mount portion 573 is an engagement means that engages with the camera 56 and is supported by the mount support portion 574.

  The movable mount portion 573 includes cylindrical bodies 57 a and 57 c that are arranged with their center axes coincident with each other, and a disc-shaped flange 57 b sandwiched between the cylindrical bodies 57 a and 57 c, and includes a light receiving axis of the camera 56. A hole is formed. The movable mount portion 573 is attached to the mount support portion 574 with the lower cylindrical body 57c inserted from the upper end of the mount support portion 574 and the flange 57b in contact with the upper end surface of the mount support portion 574. Yes. The cylindrical body 57a protruding upward from the flange 57b has a thread groove formed on the outer peripheral surface thereof, and constitutes a screw mount (screw mount), for example, a C mount that engages with the camera 56. That is, the camera 56 is detachably attached to the camera attachment portion 572 by screwing the mount portion 56c with the movable mount portion 573.

  The movable mount portion 573 has six adjustment screws AJ1 and AJ2. The four adjustment screws AJ1 are adjustment means for adjusting the position of the light receiving axis on the image sensor 56a. The two adjusting screws AJ2 are adjusting means for adjusting the orientation of the image sensor 56a around the light receiving axis.

  The four adjustment screws AJ1 are arranged so that each is orthogonal to the optical axis, and adjacent adjustment screws AJ1 form a right angle. Moreover, the mount support part 574 is penetrated from the outside, and is screwed with the cylindrical body 57c. Therefore, by turning these adjustment screws AJ1, the movable mount portion 573 can be moved two-dimensionally, and the position of the light receiving axis on the image sensor 56a can be moved in the XY directions (FIG. 9).

  Further, the two adjustment screws AJ2 are both arranged so as to be parallel to the optical axis, penetrate the arc-shaped elongated hole extending along the outer periphery of the movable mount portion 573 from the outside, and reach the upper end surface of the cylindrical body 57c. Screwed. Therefore, by loosening these adjustment screws AJ2 and rotating the movable mount portion 573, the orientation of the image sensor 56a can be adjusted around the optical axis.

  By providing such adjustment screws AJ1 and AJ2, the light receiving axis can be accurately aligned with the center of the image sensor 56a. In addition, the X direction and the Y direction in the processing area where the workpiece W is installed can be exactly matched with the X direction and the Y direction of the image sensor 56a. Therefore, even if the user detachably attaches the desired camera 56 to the lens barrel 57 via the screw mount, it is possible to obtain a photographed image with the correct position and orientation of the workpiece W.

  Further, the movable mount portion 573 is insulated from the housing frame 60 of the marker head 60. Therefore, the camera 56 is electrically connected to the housing frame 60 via the mount portion 56c of the camera 56 and the movable mount portion 573 of the lens barrel 57, and the camera 56 is prevented from being destroyed by noise. . In general, the camera 56 is configured such that an electronic circuit on the circuit board 56b is grounded via a mount portion 56c. For this reason, by insulating the movable mount portion 573 from the housing frame 60, it is possible to prevent the camera 56 from being destroyed due to noise transmitted through the lens barrel 57. Note that if the cylindrical body 57a that contacts the camera 56 is insulated from the housing frame 60, the entire movable mount portion 573 may not be insulated.

<Error compensation laser processing>
FIGS. 11-16 is explanatory drawing about the error compensation laser processing by Embodiment 1 of this invention. In the laser marking system 1, the work error is compensated by correcting the machining setting data in accordance with the work error. For this reason, regardless of the position and orientation of the workpiece W, desired laser processing can be performed on the workpiece W. In this specification, laser processing that involves compensation of workpiece errors is referred to as “error compensation laser processing”.

  FIG. 11 is a diagram illustrating an example of the symbol SBL defined by the processing setting data. A processing area 200 in the figure is an area where the laser beam L can be irradiated. The assumed workpiece Wo is a workpiece assumed when creating the machining setting data, and the shape, position, and orientation of the workpiece W at the time of laser machining coincide with the shape, position, and orientation of the assumed workpiece Wo. There is a need.

  The processing setting data is information that defines the irradiation condition of the laser beam L, such as the start position where the irradiation of the laser beam L starts, the end position where the irradiation of the laser beam L ends, the scanning speed from the start position to the end position, It is included. That is, the shape of the symbol SBL formed by the laser marker 20 and the position in the processing area 200 where the symbol SBL is formed are defined by the processing setting data.

  FIG. 12 is a diagram showing an example of laser processing based on the processing setting data of FIG. (A) and (b) in the figure show a state in which laser processing is performed on workpieces W and W ′ having different positions and orientations. Note that a shooting area 201 in the figure is an example of a shooting area by the camera 56.

  The symbols SBL in (a) and (b) are both formed by the laser marker 20 performing the same laser processing based on the same processing setting data. For this reason, these symbols SBL are formed at the same position in the processing area 200 in the same direction. However, since the positions and orientations of the workpieces W and W ′ in the machining area 200 are different, the symbols SBL of (a) and (b) are printed in different orientations at different positions on the workpieces W and W ′.

  Here, since the workpiece W of (a) is arranged at the correct position and in the correct orientation, the symbol SBL is correctly printed. That is, since the position and orientation of the workpiece W coincide with the position and orientation of the assumed workpiece Wo, the workpiece W is processed as assumed when the machining setting data is created. On the other hand, the workpiece W ′ in (b) is not arranged at the correct position in the correct orientation, and the symbol SBL is not printed correctly. That is, the position and orientation of the workpiece W ′ do not match the position and orientation of the assumed workpiece Wo, and a workpiece error occurs. For such a workpiece W ′, in order to perform the same machining as in the case of the workpiece W, it is necessary to correct the machining setting data in accordance with the workpiece error. For this reason, in the laser marking system 1 according to the present embodiment, the workpiece error of the workpiece W ′ is obtained by performing image processing for extracting the workpiece W ′ from the captured image of the imaging area 201, and based on the workpiece error, The machining setting data is corrected. That is, the workpiece error is compensated by correcting the machining setting data.

  FIG. 13 is a diagram illustrating an example of data necessary for image processing for extracting the workpiece W from the captured image. (A) in the drawing shows an example of the matching pattern PTN. The matching pattern PTN is data indicating the shape of the workpiece W, and is used for pattern matching processing for extracting the workpiece W from the captured image. For example, an image obtained by photographing the workpiece W in advance or an image of the workpiece W generated by a CAD (Computer Aided Design) tool is used as the matching pattern PTN.

  (B) in the figure shows reference data in the photographing area 201. The reference data includes a reference position STxy and a reference orientation STθ, and indicates the position and orientation of the assumed work Wo in the imaging area 201. Here, the position of the lower left feature point of the assumed work Wo is defined as a reference position STxy, and the direction from the reference position STxy toward the upper left feature point is defined as a reference direction STθ.

  FIG. 14 is a diagram illustrating an example of a workpiece error calculation process. If pattern matching using the matching pattern PTN is performed on the captured image including the workpiece W ′, the workpiece W ′ is extracted from the captured image, and the position W′xy of the lower left feature point and the orientation Wθ of the left side are obtained. It is done. Therefore, by comparing the position Wxy of the workpiece W ′ with the reference position STxy, the error Δx in the X direction and the error Δy in the Y direction are obtained. Further, the angle error Δθ is obtained by comparing the direction Wθ of the workpiece W ′ with the reference direction STθ. That is, the workpiece error is obtained as the offset error ΔX, ΔY and the angle error Δθ.

  FIG. 15 is an explanatory diagram showing an example of the processing for correcting the processing setting data. In FIG. 15A, symbol SBL defined by the processing setting data before correction is shown, and FIG. The symbol SBL ′ defined by the processing setting data before and after correction is shown. (B) in the figure is an enlarged view showing a part of (a) in an enlarged manner.

  The corrected symbol SBL ′ is obtained by correcting the uncorrected symbol SBL based on the work error. That is, the corrected symbol SBL ′ is obtained by offsetting the uncorrected symbol SBL by Δx in the X direction, offset by Δy in the Y direction, and further rotating it by the angle Δθ.

  FIG. 16 is a diagram showing an example of laser processing based on the corrected processing setting data. By correcting the machining setting data based on the workpiece error of the workpiece W ′ and performing laser machining using the corrected machining setting data, the workpiece having no workpiece error is also obtained for the workpiece W ′ having the workpiece error. The same processing as in the case of W can be performed.

  In this way, in the laser marking system 1 according to the present embodiment, the work area W is captured by photographing the photographing area 201 including the work W ′ and extracting the work W ′ from the photographed image in the photographing area 201. The work error of 'is calculated. Then, by correcting the processing setting data based on the workpiece error, laser processing (error compensation laser processing) that compensates the workpiece error can be performed.

<Functional block diagram>
FIG. 17 is a block diagram showing a detailed configuration of the main part of the laser marking system 1 of FIG. FIG. 18 is a block diagram showing a detailed configuration of the main parts of the image processing apparatus 11 and the control apparatus 12 of FIG. In these figures, functional blocks related to error compensation laser processing are shown. In addition, each block 220-226 which comprises the marker controller 22 of FIG. 17 is contained in the control part 32 of FIG.

<Marker controller 22>
The marker controller 22 in FIG. 17 includes a mode control unit 220, a processing setting data storage unit 221, a processing setting correction unit 222, a scanner control unit 223, a shutter control unit 224, an output control unit 225, and an illumination control unit 226.

  The laser marker 20 includes a processing mode and a photographing mode as operation modes, and these modes can be selectively switched. The processing mode is an operation mode for performing laser processing, and is an operation state in which the oscillator shutter 42 is opened, the camera shutter 55 is closed, and the illumination light source 53 is turned off. The laser oscillator 41 can generate the laser light L, and the XY scanner 47 is controlled based on the processing setting data Dstup. On the other hand, the shooting mode is an operation mode for performing camera shooting, and is an operation state in which the oscillator shutter 42 is closed, the camera shutter 55 is opened, and the illumination light source 53 is lit. Further, the laser oscillator 41 is prohibited from generating the laser light L, and the XY scanner 47 is controlled based on the scan request Cscn from the control device 12.

  The mode control unit 220 switches the operation mode of the laser marker 20 based on the mode switching request Cmod from the control device 12 and outputs a mode switching response Rmod to the control device 12 after the mode switching is completed. Therefore, the control device 12 can instruct the switching of the operation mode of the laser marker 20 and can know the timing when the mode switching is completed in the laser marker 20.

  The processing setting data storage unit 221 holds processing setting data Dstup received from the terminal device 10. The machining setting correction unit 222 corrects the machining setting data Dstup based on the correction request Cadj from the control device 12, and generates machining setting data Dstup ′ corresponding to the workpiece error Derr. When the correction of the processing setting data Dstup is completed, a correction response Radj is output to the control device 12 and the corrected processing setting data Dstup ′ is output to the scanner control unit 223 and the output control unit 225. For this reason, the control device 12 can instruct correction of the machining setting data Dstup in the marker controller 22 and can know the timing when the correction of the machining setting data Dstup is completed.

  The scanner control unit 223 controls the scanner 47 in the marker head 21, but this control process differs depending on the operation mode of the laser marker 20. In the processing mode, the irradiation position of the laser beam L is controlled by controlling the scanning angle of the scanner 47 based on the processing setting data Dstup. Here, the scanner 47 is controlled based on the processing setting data Dstup ′ corrected by the processing setting correction unit 222. On the other hand, in the photographing mode, a scan request Cscn from the control device 12 is input, and the scanning angle of the scanner 47 is controlled based on the scan request Cscn. The scan request Cscn is control information for the scanner 47 that specifies the shooting position Dscn of the camera 56, that is, a drive request for the scanner to move the shooting area of the camera 56 to a predetermined area. If the scanner 47 is moved based on the scan request Cscn and the scanning angle of the scanner 47 coincides with the designated photographing position Dscn, a scan response Rscn is output from the scanner control unit 223 to the control device 12. Therefore, the control device 12 can instruct the scanning angle of the scanner 47 in the photographing mode, and can know the timing when the movement of the scanner 47 is completed.

  The shutter control unit 224 controls the open / close state of the oscillator shutter 42 and the camera shutter 55 based on the operation mode of the laser marker 20. In the processing mode, the oscillator shutter 42 is opened and the camera shutter 55 is closed, so that the laser light L can be irradiated and the camera 56 is prevented from being damaged. On the other hand, in the photographing mode, the oscillator shutter 42 is closed and the camera shutter 55 is opened, so that the laser light L is prevented from leaking and the work 56 can be photographed by the camera 56.

  The output control unit 225 controls the laser oscillator 41 based on the operation mode of the laser marker 20. In the processing mode, the laser light L is generated based on the processing setting data Dstup, while in the photographing mode, the laser light L is not generated.

  The illumination control unit 226 controls the illumination light source 53 based on the operation mode of the laser marker 20. In the processing mode, the illumination light source 53 is turned off, while in the shooting mode, the illumination light source 53 is turned on to illuminate the work W.

<Image processing apparatus 11>
The image processing apparatus 11 in FIG. 18 includes an image input unit 110, a work error detection unit 111, a matching pattern storage unit 112, and a reference data storage unit 113. The image input unit 110 captures the captured image IMG from the camera 56 based on the imaging request Csht from the control device 12 and outputs the captured image IMG to the work error detection unit 111. The workpiece error detection unit 111 calculates a workpiece error Derr based on the captured image IMG and outputs the workpiece error Derr to the control device 12. The matching pattern storage unit 112 stores a matching pattern PTN indicating the shape of the workpiece W, and the reference data storage unit 113 stores reference data including a reference position STxy and a reference orientation STθ in the captured image IMG. .

  The workpiece error detection unit 111 extracts the workpiece W from the captured image IMG and obtains the workpiece W position Wxy and orientation Wθ in the captured image IMG, and the workpiece W position Wxy and orientation in the captured image IMG. A work error calculation unit 116 that compares Wθ with reference data Dxy and Dθ to obtain a work error Derr is provided.

  The work extraction unit 115 searches the captured image IMG and detects an image area that matches the matching pattern PTN. The matching pattern storage unit 112 holds an image of the workpiece W as a matching pattern PTN. For this reason, the work W can be extracted from the captured image IMG by searching for a region that matches the matching pattern PTN. If the workpiece W can be extracted in this way, the position Wxy and the orientation Wθ of the workpiece W in the captured image IMG can be obtained. Instead of the matching pattern PTN, it is also possible to hold the workpiece detection edge information and extract the workpiece W by performing edge detection in the captured image IMG.

  The reference data storage unit 113 holds a reference position STxy and a reference orientation STθ. The reference position STxy and the reference orientation STθ indicate the position and orientation of the assumed workpiece Wo assumed by the machining setting data Dstup as the position and orientation of the workpiece in the photographed image IMG, and the machining setting data Dstup and the photographing position Dscn. Is held in correspondence with. If the matching pattern PTN is created so that the reference direction STθ is constant and the shooting position Dscn is determined so that the reference position STxy is constant, regardless of the processing setting data Dstup and the shooting position Dscn, The reference position STxy and the reference direction STθ can be made constant.

  The work error calculation unit 116 obtains a work error Derr as an error with respect to the reference position STxy and the reference direction STθ by collating the position Wxy and the direction Wθ of the work W in the captured image IMG with the reference position STxy and the reference direction STθ. Yes. That is, by comparing the position Wxy of the workpiece W in the captured image IMG with the reference position STxy, the offset errors ΔX and ΔY in the X direction and the Y direction with respect to the reference position STxy can be obtained, respectively. These offset errors ΔX and ΔY are obtained as values obtained by converting the number of pixels in the captured image IMG into actual distances. Further, the orientation Wθ of the extracted work W in the captured image IMG is compared with the reference direction STθ, and an angle error Δθ with respect to the reference direction STθ is obtained. The offset errors ΔX and ΔY and the angle error Δθ obtained in this way are output to the control device 12 as the workpiece error Derr. Note that the workpiece error calculation unit 116 may obtain an error for at least one of the position Wxy or the orientation Wθ of the workpiece W and output the error as the workpiece error Derr.

<Control device 12>
18 includes a main control unit 120, a shooting position control unit 121, a shooting position storage unit 122, and a correction control unit 123. The main control unit 120 controls the operation mode of the laser marker 20. The shooting position control unit 121 performs scanner control for camera shooting. The shooting position storage unit 122 holds a shooting position Dscn. The correction control unit 123 controls correction of the machining setting data Dstup according to the position and orientation of the workpiece W.

  The main control unit 120 controls the operation mode of the laser marker 20. Based on the workpiece detection signal DW from the workpiece sensor S, the main control unit 120 outputs a mode switching request Cmod that instructs to shift to the imaging mode to the marker controller 22. For example, when a new workpiece W is installed in the processing area 200, the laser marker 20 is shifted to the imaging mode. When the mode switching response Rmod indicating that the mode switching is completed is output from the marker controller 22 after the mode switching request Cmod is output, the imaging position control unit 121 is instructed to perform scanner control for camera shooting.

  Further, the main control unit 120, when the correction of the processing setting data Dstup is completed in the marker controller 22 and a correction completion signal is output from the correction control unit 123, a mode switching request Cmod that instructs to shift to the processing mode. Is output to the marker controller 22. The laser marker 20 shifts the operation mode to the machining mode based on the mode switching request Cmod. Thereafter, when the mode switching response Rmod is received from the marker controller 22, a processing start request for instructing the start of laser processing is output to the marker controller 22 to start laser processing.

  The photographing position control unit 121 controls the scanning angle of the scanner 47 in the photographing mode. The imaging position control unit 121 outputs a scan request Cscn to the marker controller 22 when scanner control is instructed from the main control unit 120 after shifting to the imaging mode. The scan request Cscn is a scanner control signal that designates a shooting position Dscn indicating the scanning angle of the scanner 47, and is generated based on the shooting position Dscn in the shooting position storage unit 122. Based on the scan request Cscn, the marker controller 22 controls the scanning angle of the scanner 47 so as to coincide with the photographing position Dscn. When the scan response Rscn indicating the completion of the scanner movement is output from the marker controller 22 after the output of the scan request Cscn, the imaging position control unit 121 outputs the imaging request Csht to the image processing apparatus 11. For this reason, the image processing apparatus 11 can quickly start image processing after the scanner movement is completed.

  The correction control unit 123 controls correction of the processing setting data Dstup in the marker controller 22. That is, based on the workpiece error Derr from the image processing apparatus 11, a correction request Cadj for the machining setting data Dstup is output to the marker controller 22. This correction request Cadj specifies ΔX offset correction for the X direction, ΔY offset correction for the Y direction, and rotation correction for the angle Δθ. Further, the correction control unit 123 outputs a correction completion signal to the main control unit 120 when the correction response Radj is output from the marker controller 22 after the correction request Cadj is output. The main control unit 120 ends the shooting mode based on the correction completion signal.

<Operation example of error compensation laser processing>
FIG. 19 is a sequence diagram showing an example of the operation of error compensation laser processing by the laser marking system 1 of FIG. FIG. 20 is a timing chart showing an example of main signal changes in the error compensation laser processing. In these drawings, the operation mode of the laser marker 20 is switched to the imaging mode, the workpiece W is imaged to obtain the workpiece error Derr, the machining setting data Dstup is corrected, the operation mode is switched to the machining mode, and laser machining is performed. A series of operations for performing is shown.

  First, a mode switching request Cmod that instructs the marker controller 22 to shift to the shooting mode is output from the control device 12. Based on the mode switching request Cmod, the operation mode of the laser marker 20 is switched to the photographing mode, and after the mode switching is completed, the marker controller 22 outputs a mode switching response Rmod.

  The control device 12 that has received the mode switching response Rmod and confirmed the completion of switching to the photographing mode outputs a scan request Cscn. The marker controller 22 controls the scan angle of the scanner 47 based on the scan request Cscn, and outputs a scan response Rscn after the scanner movement is completed.

  Upon receiving the scan response Rscn and confirming the completion of the scanner movement, the control device 12 outputs an imaging request Csht. The image processing apparatus 11 takes in the photographed image IMG output from the camera 56 based on the photographing request Csht, and calculates the work error Derr from the photographed image IMG. After the calculation of the work error Derr is completed, a photographing response is output from the image processing apparatus 11. The control device 12 that has received the imaging response and confirmed the completion of the workpiece error calculation outputs a workpiece error acquisition request. The image processing apparatus 11 outputs a work error Derr based on the work error acquisition request.

  The control device 12 that has received the workpiece error Derr outputs a correction request Cadj to the marker controller 22. The marker controller 22 corrects the machining setting data Dstup based on the correction request Cadj, and outputs a correction response Radj after the correction is completed.

  The control device 12 that receives the correction response Radj and confirms the completion of the correction of the machining setting data Dstup outputs a mode switching request Cmod that instructs to shift to the machining mode. Based on this mode switching request Cmod, the operation mode of the laser marker 20 is switched to the machining mode, and after this mode switching is completed, a mode switching response Rmod is output from the marker controller 22.

  Upon receiving the mode switching response Rmod and confirming the completion of switching to the machining mode, the control device 12 outputs a machining start request. The marker controller 22 starts laser processing based on the corrected processing setting data Dstup ′ based on the processing start request, and outputs a processing completion response after the laser processing is completed.

Embodiment 2. FIG.
In the first embodiment, an example in which one workpiece W is in the machining area 200 has been described. In contrast, in the present embodiment, a case where two or more workpieces W1 to W6 are in the machining area 200 will be described.

  FIG. 21 is an explanatory diagram of an example of error compensation laser processing according to the second embodiment of the present invention, and shows a state in which six workpieces W1 to W6 are arranged in the processing area 200. FIG. In (a) in the figure, the workpieces W1 to W6 are respectively arranged at the correct positions and in the correct orientation. On the other hand, in (b) in the figure, each of the workpieces W1 to W6 has a workpiece error Derr.

  Even when six workpieces W1 to W6 are arranged in the machining area 200, if the machining setting data Dstup is given in advance for each workpiece W1 to W6, laser machining for one workpiece W is performed. By repeating the processing, it is possible to perform laser processing on all the workpieces W1 to W6. In addition, the workpiece error compensation process for obtaining the workpiece error Derr by photographing the workpiece W and correcting the machining setting data Dstup based on the workpiece error Derr is also performed by repeating the error compensation processing for one workpiece W. Error compensation can be performed on the workpieces W1 to W6.

However, when the shooting mode and the processing mode are switched for each of the workpieces W1 to W6, the time required for the mode switching is required by the number of the workpieces W1 to W6. Therefore, without changing the operation mode for each of the workpieces W1 to W6, the workpiece error Derr is obtained for all the workpieces W1 to W6 and the machining setting data Dstup is corrected during the same shooting mode. The correction of the processing setting data Dstup will be described more specifically. Originally, in the machining setting data Dstup, the position of the workpiece W1 and the rotation angle from the predetermined direction are (x ₁ , y ₁ ) and 0 degrees, and the position of the workpiece W2 and the rotation angle from the predetermined direction are (x ₂ , y ₂ ) and 0 degrees, the position of the work W3 and the rotation angle from the predetermined direction are (x ₃ , y ₃ ) and 0 degree, and the position of the work W4 and the rotation angle from the predetermined direction are (x ₄ , y ₄ ). The rotation angle from the position and the predetermined direction of the workpiece W5 is (x ₅ , y ₅ ) and 0 degree, and the rotation angle from the position and the predetermined direction of the workpiece W6 is (x ₆ , y ₆ ) and 0 Each data such as degree is included. Then, the workpiece error compensation process described above overwrites the workpiece W1 in the machining setting data Dstup at (x ₁ ', y ₁ ') and θ ₁ degree, and the workpiece W2 in the machining setting data Dstup (x ₂ ', _{y 2'} are overwritten) and theta ₂ degrees, for the work W3 of the machining setting data _{Dstup (x 3 ', y 3} ') is overwritten and theta ₃ times, the work W4 of the machining setting data DSTUP Is overwritten at (x ₄ ′, y ₄ ′) and θ ₄ degrees, and the workpiece W5 of the machining setting data Dstup is overwritten at (x ₅ ′, y ₅ ′) and θ ₅ degrees, and machining setting data Dstup Among them, the workpiece W6 is overwritten at (x ₆ ′, y ₆ ′) and θ ₆ degrees (you may have a correspondence table in which each of the workpieces W1 to W6 is associated with the position and the rotation angle). . Thereafter, the operation mode is switched, and laser processing is performed on all the workpieces W1 to W6 during the same processing mode. That is, for the workpieces W1 to W6, (x ₁ ′, y ₁ ′) and θ ₁ degree to (x ₆ ′, y ₆ ′) and θ ₆ degrees are read and laser processing is performed. By performing such processing, that is, by performing laser processing based on the latest data (data overwritten last) for each of the workpieces W1 to W6 in the processing setting data Dstup, the workpieces W1 to W6. Even if the number increases, the time required for mode switching does not increase, and the total time required for laser processing can be reduced.

  Therefore, in the present embodiment, as shown in FIG. 19, a series of processing from the output of the scan request Cscn to the reception of the correction response Radj is repeated in order for each work W1 to W6. And after correction | amendment of the process setting data Dstup is complete | finished about all the workpiece | work W, an operation mode is changed to the process mode, and laser processing is performed about all the workpiece | work W1-W6 in order.

  In (a) in the figure, all the workpieces W1 to W6 are arranged so as to coincide with the position and orientation of the assumed workpiece Wo of the corresponding machining setting data Dstup. For this reason, the symbol SBL is correctly printed for each of the workpieces W1 to W6 without compensating for the workpiece error Derr.

  On the other hand, in (b) in the figure, the workpieces W1 to W6 do not match the position and orientation of the assumed workpiece Wo of the corresponding machining setting data Dstup. However, by compensating the work error Derr for each of the works W1 to W6, the symbols SBL can be correctly printed on all the works W1 to W6.

Embodiment 3 FIG.
In the second embodiment, when there are two or more workpieces W1 to W6 in the machining area 200, the workpiece error Derr is obtained for each of the workpieces W1 to W6, and the corresponding machining setting data Dstup is corrected. Explained. On the other hand, in this embodiment, an example in which one work error Derr common to two or more works W1 to W6 is obtained and the machining setting data Dstup corresponding to each work W1 to W6 is corrected will be described. .

  FIG. 22 is an explanatory diagram of an example of error compensation laser machining according to the third embodiment of the present invention. Six workpieces W1 to W6 are arranged in the machining area 200. FIG. These works W1 to W6 are accommodated in a common transport tray 210. The transport tray 210 is a means for holding the workpieces W1 to W6 so that the positions and orientations of the workpieces W1 to W6 do not change relatively.

  When two or more workpieces W1 to W6 are accommodated in the common transport tray 210, the tray error Derr 'of the transport tray 210 is obtained instead of the work error Derr for each of the workpieces W1 to W6, and the tray error Derr' Based on the above, the machining setting data Dstup of each workpiece W1 to W6 may be corrected.

  In this case, pattern matching is performed using an image on the transport tray 210, at least a part of the image, as the matching pattern PTN instead of the images of the workpieces W1 to W6. Further, the reference position STxy and the reference orientation STθ constituting the reference data are given as the positions and orientations of the characteristic points of the transport tray 210 that are assumed when the processing setting data Dstup for each of the workpieces W1 to W6 is created.

  In (a) in the figure, the transport tray 210 is arranged at the correct position and in the correct orientation, as assumed when the processing setting data Dstup is created. For this reason, each workpiece | work W1-W6 also corresponds with the position and direction of the assumption workpiece | work Wo of the process setting data Dstup to which each corresponds. For this reason, the symbol SBL is correctly printed for each of the workpieces W1 to W6 without compensating for the workpiece error Derr.

  On the other hand, in (b) in the figure, since the position and orientation of the transport tray 210 do not match the assumed position and orientation, the works W1 to W6 are also assumed work Wo of the machining setting data Dstup to which they correspond. Does not match the position and orientation of However, an error in the position and orientation of the transport tray 210 with respect to the assumed position and orientation is obtained as a tray error Derr ′, and the processing setting data Dstup for each of the workpieces W1 to W6 is corrected based on the tray error Derr ′. Thus, the symbols SBL can be correctly printed on all the workpieces W1 to W6.

  FIG. 23 is an explanatory diagram of another example of error compensation laser processing according to Embodiment 3 of the present invention. Like FIG. 22, FIG. 23 is arranged in the processing area 200 with two or more workpieces W <b> 1 to W <b> 6 held on a common transport tray 210. However, it differs from the case of FIG. 22 in that the positions and orientations of the workpieces W1 to W6 are relatively changed in the transport tray 210.

  In such a case, after obtaining the tray error Derr 'and correcting the machining setting data Dstup for each of the workpieces W1 to W6, the workpiece error Derr for each of the workpieces W1 to W6 is further obtained to determine the machining settings for each of the workpieces W1 to W6. The data Dstup may be corrected. FIG. 23 shows a state in which laser processing is performed based on the processing setting data Dstup corrected in this way.

  In the above embodiment, the example in which the image processing apparatus 11 detects the workpiece error Derr has been described. However, the laser marking system according to the present invention is not limited to such a configuration. For example, the control device 12 or the marker controller 22 may be configured to calculate the workpiece error Derr based on the result of image processing by the image processing device 11, that is, the extraction result of the workpiece W.

  Moreover, although the said embodiment demonstrated the example in case the laser marker 20 was a SHG type | mold laser marking apparatus, the laser processing apparatus by this invention is not limited to this. For example, the present invention can be applied to a fiber laser type marking apparatus. The fiber laser type marking device is a laser marker using a fiber doped with Yb (ytterbium) as an amplifier.

  In the above embodiment, an example in which the shooting position Dscn is held in the control device 12 has been described. However, the present invention is not limited to such a case. For example, the marker controller 22 may hold the shooting position Dscn, and a scan request Cscn that does not include the shooting position Dscn may be output from the control device 12 to the marker controller 22.

  In the above embodiment, an example in which the workpiece error Derr is transmitted from the image processing apparatus 11 to the control apparatus 12 has been described. However, the present invention is not limited to such a case. For example, the workpiece error Derr is transmitted from the image processing apparatus 11 to the marker controller 22 without passing through the control device 12, and the machining setting correction unit 222 in the marker controller 22 corrects the machining setting data based on the workpiece error Derr. It can also be configured to.

  In the above embodiment, the case where the image processing device 11 and the laser processing device 20 are independent devices and are connected to each other via the control device 12 has been described. However, the present invention is only in such a case. It is not limited to. For example, the image processing apparatus 11 may be built in the laser processing apparatus 20. That is, the marker head 21 or the marker controller 22 can be configured to have the function of the image processing apparatus 11.

DESCRIPTION OF SYMBOLS 1 Laser marking system 10 Terminal apparatus 11 Image processing apparatus 12 Control apparatus 20 Laser marker 21 Marker head 22 Marker controller 41 Laser oscillator 42 Oscillator shutter 47 XY scanner 48 Telecentric lens 53 Illumination light source 55 Camera shutter 56 Camera 60 Housing frame 200 Processing area 110 Image input unit 111 Work error detection unit 112 Matching pattern storage unit 113 Reference data storage unit 115 Work extraction unit 116 Work error calculation unit 120 Main control unit 121 Shooting position control unit 122 Shooting position storage unit 123 Correction control unit 201 Shooting area 210 Transport tray 220 Mode control unit 221 Processing setting data storage unit 222 Processing setting correction unit 223 Scanner control unit 224 Shutter control unit 225 Output control unit 226 Illumination control unit 530 Illumination module 560 Camera module 572 Camera mounting portion AJ1, AJ2 Adjustment screw Cadj Correction request Cmod Mode switching request Cscn Scan request Csht Imaging request Derr Work error Derr 'Tray error Dscn Shooting position Dstup Processing setting data DW Work detection signal IMG Captured image L Laser beam PTN Matching pattern Radj Correction response Rmod Mode switching response Rscn Scan response S Work sensor SBL Symbol STxy Reference position STθ Reference orientation W, W ′, W1 to W6 Work Wo Expected workpiece Wxy Work position Wθ Work orientation

Claims (9)

A laser generator that generates laser light, a scanner that scans the laser beam on the work surface of the workpiece, and the laser beam that is disposed closer to the workpiece than the scanner and has a constant emission angle regardless of the incident angle. A laser processing apparatus comprising: a telecentric lens that emits light; and a camera having a light receiving axis branched from the laser light emitting axis on the laser generator side of the scanner;
An image processing device that performs predetermined image processing on a captured image captured by the camera;
In a laser processing system provided with a control device connected to the laser processing device and the image processing device and instructing the laser processing device to start processing the workpiece with the laser beam,
The camera shoots a shooting area consisting of an area narrower than a processing area consisting of an area where the laser beam can be irradiated,
The control device
Shooting position data storage means comprising control information for camera shooting for the scanner, and holding shooting position data in which the shooting position in the processing area is designated;
An imaging scan request output means for outputting an imaging scan request including the imaging position data to the laser processing device,
An imaging scan response input means for inputting an imaging scan response indicating that the scanner has completed the operation based on the imaging scan request from the laser processing device;
A photographic image acquisition request output means for outputting a photographic image acquisition request for requesting acquisition of a photographic image photographed by the camera based on the photographing scan response to the image processing device,
The image processing apparatus includes:
Based on the captured image acquisition request from the control device, captured image acquisition means for acquiring a captured image captured by the camera;
Work error detection means for obtaining, as a work error, an actual work position error with respect to a predetermined work position based on the photographed image obtained by the photographed image obtaining means,
The laser processing device
A photographing scan request input means for inputting the photographing scan request from the control device;
Based on the shooting scan request, scanner control means for controlling the scanner so that the position of the shooting area matches the position corresponding to the shooting position data;
An imaging scan response output means for outputting the imaging scan response to the control device;
A workpiece error input means for inputting the workpiece error;
Processing setting data storage means for holding processing setting data comprising control information for laser processing for the scanner;
Machining setting correction means for correcting the machining setting data based on the workpiece error,
When the laser processing apparatus is instructed by the control device to start processing a workpiece, the scanner scans the laser beam based on the processing setting data corrected by the processing setting correction means. Laser processing system.   The control device includes correction request output means for receiving the workpiece error from the image processing device and outputting a correction request for the machining setting data to the laser processing device based on the workpiece error. The laser processing system according to claim 1. The image processing apparatus, a laser processing system according to claim 1, characterized in that it is built into the laser processing apparatus.   2. The laser processing system according to claim 1, wherein the workpiece error detecting means obtains an error of an actual workpiece position and orientation with respect to a predetermined workpiece position and orientation as a workpiece error. A matching data storage unit for storing matching data for pattern matching for the workpiece;
The laser processing system according to claim 4 , wherein the workpiece error detection unit determines the position and orientation of the workpiece in a captured image by performing pattern matching using the matching data. In a laser processing apparatus in a laser processing system in which a control device is connected to a laser processing apparatus and an image processing apparatus,
A laser generator for generating laser light;
A scanner that scans the laser beam on the workpiece surface;
A telecentric lens that is disposed on the workpiece side of the scanner and emits the laser light at a constant emission angle regardless of the incident angle;
A camera that has a light receiving axis branched from the laser light emitting axis on the laser generator side than the scanner, and photographs a photographing area that is narrower than a processing area that is composed of a region that can be irradiated with the laser light. When,
An imaging scan request input unit configured to input an imaging scan request including imaging position data in which an imaging position in the processing area is designated, which includes control information for camera imaging with respect to the scanner;
Based on the shooting scan request, scanner control means for controlling the scanner so that the position of the shooting area matches the position corresponding to the shooting position data;
An imaging scan response output means for outputting an imaging scan response indicating that the scanner has completed the operation based on the imaging scan request to the control device;
In a state where the scanner has completed the operation based on the photographing scan request, a photographed image photographed by the camera is output to the image processing device, and is a work error obtained by the image processing device, which is determined in advance. A workpiece error input means for inputting a workpiece error indicating an error of the actual workpiece position with respect to the position of the selected workpiece;
Processing setting data storage means for holding processing setting data comprising control information for laser processing for the scanner;
Machining setting correction means for correcting the machining setting data based on the workpiece error,
The laser processing apparatus according to claim 1, wherein the scanner scans the laser beam based on the processing setting data corrected by the processing setting correction unit when an instruction to start processing the workpiece is given from the control device. A beam splitter disposed between the scanner and the laser generator, for branching incident light from the processing surface from an optical axis of the laser light;
The laser processing apparatus according to claim 6 , further comprising: a camera attachment portion provided on a branch path by the beam splitter, to which the camera is detachably attached. The laser processing apparatus according to claim 7 , wherein the camera mounting portion includes an adjusting unit capable of adjusting a two-dimensional offset and a rotation angle with respect to a light receiving surface of the camera. With a metal housing,
The camera mounting portion has a screw mount for screwing the work photographing camera,
9. The laser processing apparatus according to claim 8 , wherein the screw mount is electrically insulated from the housing.

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