JP5697394B2 - Base integrated substrate with fin and base integrated substrate device with fin - Google Patents

Description

  The present invention relates to a fin-integrated base integrated substrate in which a cooling fin is joined to an insulating substrate on which a circuit metal plate is mounted, and a fin-integrated base integrated substrate device to which a water cooling jacket is attached.

  For example, in a conventional power module used to control a large current of an electric vehicle, a train, a machine tool, etc., a fin-integrated base type in which a cooling fin is joined to an insulating substrate on which a circuit metal plate is mounted. A substrate device is used. In this fin-integrated base integrated substrate device, an insulating substrate made of metal-ceramics is directly bonded to one surface of a metal plate or a composite plate called a base plate, and a semiconductor is connected to the metal circuit plate on the insulating substrate. A circuit metal plate such as a chip is fixed by soldering. The base plate is formed with a plurality of heat radiation fins on the surface opposite to the surface to which the insulating substrate is bonded, and a water cooling jacket is attached to surround the heat radiation fins (for example, Patent Documents 1 and 2). reference).

JP 2007-294891 A JP 2008-2188938 A

  In the fin-integrated base integrated substrate device, it is desirable to increase the surface area of the heat radiation fin as much as possible in order to enhance the heat radiation performance of the heat radiation fin. On the other hand, the strength of the base plate is required in order to prevent the base plate from being deformed when cooling water is applied to the radiating fin. In particular, in the fin-integrated base-integrated substrate and the fin-integrated base-integrated substrate device manufactured by the molten metal bonding method described in Patent Documents 1 and 2, it is difficult to achieve both the heat radiation performance and the strength. This is because the fin-equipped base plate of the fin-integrated substrate manufactured by the molten metal bonding method is a so-called cast product in which the molten metal is solidified, so that the tensile strength is less than 100 MPa, for example.

  The present invention has been made in view of such a demand, and an object of the present invention is to achieve both the heat radiation performance and strength of the heat radiation fin in the fin-integrated base integrated substrate device.

In order to achieve the above-mentioned object, according to the present invention, there is provided a fin-integrated base board for cooling with an insulating substrate on which a metal plate for circuit is mounted, which is opposite to the surface on which the insulating substrate is bonded. A plurality of plate-like first radiating fins and plate-like second radiating fins shorter than the first radiating fins are attached in parallel to each other with a gap between them, and the first radiating fins adjacent to each other Between them, the second radiation fins arranged in parallel with the first radiation fins are arranged side by side, there are a plurality of the second radiation fins, and between the first radiation fins adjacent to each other, A plurality of second radiating fin rows formed by arranging a plurality of second radiating fins arranged in parallel with the first radiating fins are arranged in parallel, and the second radiating fins are adjacent to each other in the longitudinal direction of the first radiating fins. Heat radiation fin rows A passage portion that does not have the second heat dissipation fin and extends in a direction intersecting the first heat dissipation fin is formed therebetween, and a hole is provided in the first heat dissipation fin at a position facing the passage portion. A fin-integrated base-integrated substrate is provided.

In the second radiation fin rows adjacent to each other in the longitudinal direction of the first radiation fins, the second radiation fins may be on the same straight line. Alternatively, in the second radiating fin rows adjacent to each other in the longitudinal direction of the first radiating fins, the second radiating fins may not be on the same straight line.

  Further, according to the present invention, there is provided a fin-integrated base-integrated substrate apparatus in which a water-cooling jacket surrounding the first and second radiating fins is attached to the fin-integrated base-integrated substrate.

  ADVANTAGE OF THE INVENTION According to this invention, the base integrated board apparatus with a fin which made heat dissipation performance and intensity | strength compatible can be obtained.

1 is a plan view of a fin-integrated base integrated substrate apparatus according to an embodiment of the present invention. 1 is a front view of a fin-integrated base integrated substrate apparatus according to an embodiment of the present invention. It is a bottom view of the base integrated board apparatus with a fin concerning embodiment of this invention. 1 is a side view of a fin-equipped base integrated substrate apparatus according to an embodiment of the present invention. It is a bottom view of the base integrated board with fin concerning embodiment of this invention. It is a front view of the base integrated board with fin concerning embodiment of this invention. It is a side view of the base integrated board with fin concerning embodiment of this invention. It is a bottom view of the base integrated substrate with fin concerning embodiment of this invention which provided the hole in the 1st radiation fin. FIG. 9 is a front view of the fin-integrated base integrated substrate of FIG. 8. FIG. 6 is a bottom view of a fin-integrated base integrated substrate according to an embodiment of the present invention in which second radiating fins are not on the same straight line. It is a front view of the base-integrated board | substrate with a fin of FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the present specification and drawings, components having substantially the same functional configuration are denoted by the same reference numerals, and redundant description is omitted.

  As shown in FIGS. 1 to 4, the fin-integrated base integrated substrate apparatus 1 has a configuration in which a water cooling jacket 17 is attached to the lower surface of the fin-integrated base integrated substrate 2. The fin-integrated base substrate 2 is formed by bonding a plurality of insulating substrates 11 made of ceramics or the like to the upper surface of the base plate 10 to which the first radiating fins 15 and the second radiating fins 16 are attached. 11, the circuit metal plate 12 is joined to the upper surface. That is, the fin-integrated base board 2 is obtained by joining the insulating substrate 11 and the circuit metal plate 12 to the upper surface of the base plate 10 to which the first and second heat radiating fins 15 and 16 are attached.

  A plurality of first radiating fins 15 and second radiating fins 16 are attached to the lower surface of the base plate 10 in order to increase the radiating efficiency. Further, a water cooling jacket 17 surrounding these first and second radiation fins 15 and 16 is attached to the lower surface of the fin-integrated base integrated substrate 2 (the lower surface of the base plate 10).

  On the upper surface of the water cooling jacket 17, there is provided a space portion 18 formed between the lower surface of the fin-integrated base integrated substrate 2 (the lower surface of the base plate 10). The first radiating fins 15 and the second radiating fins 16 are accommodated in the space 18. On both sides of the water cooling jacket 17, a water inlet 19 and a water outlet 20 are provided for circulating the cooling water to the space 18.

  As shown in FIGS. 5 to 7, for example, the thickness T of the lower surface of the base plate 10 is 5 mm. Further, each of the first and second radiating fins 15 and 16 has a substantially rectangular plate shape with a thickness t = 1.8 mm and a height h = 5 mm, for example. Is attached perpendicularly to the lower surface of the base plate 10 (the surface opposite to the surface where the insulating substrate 11 and the circuit metal plate 12 are joined). The first radiating fins 15 and the second radiating fins 16 have the same longitudinal direction, and both are arranged in parallel to the direction connecting the water inlet 19 and the drain outlet 20 of the water cooling jacket 17. In addition, since the 1st radiation fin 15 and the 2nd radiation fin 16 are produced by the molten metal joining method, in order to release a fin (the 1st radiation fin 15 and the 2nd radiation fin 16) from a casting_mold | template, Tapering from the top of the fin toward the base plate 10. The angle is about 2 ° with respect to the direction perpendicular to the lower surface of the base plate 10. The taper is preferably 2 ° to 10 ° from the viewpoint that the mold releasability and the fin interval can be made dense. At this time, the pitch between the fins is 2.7 mm. (The distance between the fins is about 0.9 mm.)

  Moreover, the 1st radiation fin 15 and the 2nd radiation fin 16 are provided with the mutually equal gap | interval, between the 1st radiation fin 15 and the 2nd radiation fin 16, and between the 2nd radiation fins 16 mutually. In any case, for example, a gap of s = 0.9 mm is formed. Each gap is formed in parallel with the direction connecting the water inlet 19 and the drain 20 of the water cooling jacket 17.

  The first heat radiating fin 15 has a length over almost the entire length of the space 18 formed between the water cooling jacket 17 and the lower surface of the fin-integrated base integrated substrate 2 (the lower surface of the base plate 10). The length L1 of the heat dissipating fin 15 in the longitudinal direction is set to 111 mm. On the other hand, the length L2 of the second radiating fin 16 is considerably shorter than the length L1 of the first radiating fin 15, and is set to, for example, the length L2 of the second radiating fin 16 in the longitudinal direction = 16 mm.

  For example, seven first radiating fins 15 are attached to the lower surface of the base plate 10 in parallel at equal intervals, and a gap 25 having a width l = 9 mm, for example, is formed between the first radiating fins 15 adjacent to each other. Has been. In each gap 25, for example, six rows of second radiating fin rows 26 formed by, for example, arranging three second radiating fins 16 in parallel are arranged.

  Each of the second radiating fin rows 26 has, for example, a configuration in which three second radiating fins 16 are arranged in parallel with each other with a gap of s = 0.9 mm. A gap of s = 0.9 mm is also provided between the second radiating fins 16 and the first radiating fins 15 located at the outermost part.

  For example, six rows of the second radiation fin rows 26 are provided in the longitudinal direction of the first radiation fins 15 between the first radiation fins 15. A passage portion 27 extending in a direction intersecting (orthogonal to) the longitudinal direction of the first radiation fins 15 is formed between the second radiation fin rows 26 adjacent to each other in the longitudinal direction of the first radiation fins 15. Yes. The passage portion 27 is a space formed between the end portions of the second radiation fins 16, and the passage portion 27 is a region where the second radiation fins 16 do not exist. The distance M of the passage portion 27 is set to M = 3 mm, for example.

  Further, the base plate 10, the first radiating fins 15, and the second radiating fins 16 are made of a material having excellent thermal conductivity such as aluminum or an aluminum alloy. On the lower surface of the base plate 10, the first radiating fins 15 and the second radiating fins 16 are formed by a molten metal joining method (casting).

  According to the fin-integrated base integrated substrate apparatus 1 according to the embodiment of the present invention configured as described above, the cooling water is caused to flow into the space 18 in the water cooling jacket 17 through the water inlet 19 and the water outlet 20. The first heat radiating fins 15 and the second heat radiating fins 16 can perform good heat radiation, and can handle the heat generation load of the circuit metal plate 12 mounted on the insulating substrate 11 to avoid malfunction due to heat generation. . In this case, by providing a large number of the second heat radiation fins 16 that are shorter than the first heat radiation fins 15 in particular, the heat radiation area can be increased and a high heat radiation capacity can be obtained.

  On the other hand, a plurality of (seven) first heat dissipating fins 15 in the longitudinal direction are attached to the lower surface of the fin-integrated base integrated substrate 2 (the lower surface of the base plate 10) at appropriate intervals. In the longitudinal direction of the base integrated substrate device 1, that is, the direction in which the cooling water flows (direction in which the water injection port 19 and the drain port 20 are connected), the rib effect of the first heat radiation fin 15 causes the fin integrated base substrate 10. The bending strength can be improved. The first radiating fins 15 are preferably formed over the entire length of the space 18, or when there are a plurality of insulating substrates 11 bonded to the fin-integrated base integrated substrate 2.

  As a result, it is possible to obtain the fin-integrated base integrated substrate apparatus 1 that achieves both heat dissipation performance and strength.

  As shown in FIGS. 8 and 9, the first heat dissipating fin 15 may be provided with a hole 30 having a diameter of about 3 mm, for example. If the holes 30 are provided in the first heat radiating fins 15 in this manner, the heat radiating performance can be improved by increasing the surface area of the first heat radiating fins 15. Moreover, weight reduction can be achieved by opening the hole 30. Further, the cooling water can flow in the direction penetrating the first radiation fins 15 through the holes 30, and the cooling efficiency can be improved by creating a turbulent flow in the space 18.

  The hole 30 can be easily formed by penetrating from the lateral direction of the first radiating fin 15 (perpendicular to the first radiating fin 15) with a drill. In this case, if the hole 30 is arranged at a position facing the passage portion 27 where the second heat dissipating fin 16 does not exist, there is no fear of damaging the second heat dissipating fin 16 when the hole 30 is penetrated by a drill.

  5 to 7 and the fin-integrated base integrated substrate 2 illustrated in FIGS. 8 and 9, the first heat dissipating fins 15 are adjacent to each other in the longitudinal direction. In the two radiating fin rows 27, the second radiating fins 16 are on the same straight line. However, the second radiating fins 16 may not be on the same straight line.

  In the fin-integrated base-integrated substrate 2 shown in FIGS. 10 and 11, the second radiating fins 16 are not on the same straight line in the second radiating fin rows 27 adjacent to each other in the longitudinal direction of the first radiating fins 15. It has become a relationship. The first radiating fin 15 is provided with a bent portion 31 at a position facing the passage portion 27, and the gap between the offset second radiating fin 16 is kept at s = 0.9 mm. Similarly to the fin-integrated base integrated substrate 2 shown in FIGS. 10 and 11, the first heat radiating fin 15 is provided with a hole 30 at a position facing the passage portion 27. The bent portion 31 can be formed by casting, die pressing, forging, or the like.

  Thus, by arranging the second heat radiation fins 16 so as to be offset in the longitudinal direction of the first heat radiation fins 15, it is possible to easily create turbulent flow in the space portion 18 and further improve the cooling efficiency. it can.

  As mentioned above, although an example of embodiment of this invention was demonstrated, this invention is not limited to the form of illustration. It is obvious for those skilled in the art that various modifications or modifications can be conceived within the scope of the idea described in the claims, and these naturally belong to the technical scope of the present invention. It is understood.

  For example, in the above embodiment, the first radiating fin and the second radiating fin having a predetermined thickness, height, and length are used. However, these sizes may be changed.

  The fin-integrated base-integrated substrate of the present invention is produced by, for example, a molten metal bonding method. In this structure, a cavity for accommodating the insulating substrate 11 (ceramic substrate) is formed inside, and a cavity having a shape corresponding to the base plate 10 and a cavity corresponding to the metal circuit board 12 are formed on both sides of the cavity. It can be manufactured by a method in which a molten metal such as aluminum or an aluminum alloy is poured into a mold in which the portion is formed and solidified (so-called molten metal bonding method). As the insulating substrate 11 (ceramic substrate), a commercially available alumina substrate, aluminum nitride substrate, or silicon nitride substrate is used. As the aluminum alloy, for example, a material obtained by adding Si, Mg, B, Ti or the like to aluminum is used.

  In particular, when a ceramic substrate (for example, an AlN substrate or an alumina substrate) and a base plate are bonded to each other by a molten metal bonding method using aluminum or an aluminum alloy, the strength of the base plate is very low, and the tensile strength is 100 MPa or less, further 80 MPa or less, 40 MPa or less. There is only. According to the present invention, even if such a low-strength base plate is used, the first heat dissipating fin is lengthened and the length of the second heat dissipating fin is shortened and intermittently provided. Excellent heat dissipation and sufficient strength can be obtained. Further, by using a base plate having a low material (tensile) strength, the reliability of the fin-integrated base integrated substrate and the fin-integrated base integrated substrate device is ensured with respect to characteristics such as thermal shock resistance.

  The water-cooled jacket is not particularly required to be produced by the molten metal joining method (casting), and may be produced by an appropriate processing method such as pressing or machining. Further, the water-cooling jacket and the fin-integrated base integrated substrate may be attached by brazing or screwing so that the coolant does not leak.

  The present invention is useful for a power module used to control a large current.

DESCRIPTION OF SYMBOLS 1 Base integrated board apparatus with fin 2 Base integrated board 10 with fin 10 Base board 11 Insulating board 12 Metal plate for circuit 15 1st radiation fin 16 2nd radiation fin 17 Water cooling jacket 18 Space part 19 Water inlet 20 Drain outlet 25 Crevice 26 2nd radiation fin row 27 passage part 30 hole 31 bent part

Claims (4)

A base integrated substrate with fins for cooling, in which an insulating substrate on which a metal plate for circuit is mounted is joined,
A plurality of plate-like first radiating fins and a plate-like second radiating fin shorter than the first radiating fin are attached in parallel to each other on a surface opposite to the surface to which the insulating substrate is bonded. ,
Between the first radiating fins adjacent to each other, the second radiating fins arranged in parallel with the first radiating fins are arranged side by side ,
There are a plurality of the second heat radiation fins, and a second heat radiation formed by arranging a plurality of second heat radiation fins arranged in parallel between the first heat radiation fins adjacent to each other. Multiple rows of fins are arranged,
Between the second radiating fin rows adjacent to each other in the longitudinal direction of the first radiating fin, a passage portion is formed that extends in a direction intersecting the first radiating fin and does not have the second radiating fin,
A fin-integrated base-integrated substrate, wherein the first heat dissipating fin is provided with a hole at a position facing the passage portion.   2. The fin-integrated base-integrated substrate according to claim 1, wherein the second radiation fins are collinear in the second radiation fin rows adjacent to each other in the longitudinal direction of the first radiation fins. .   2. The fin-integrated base-integrated substrate according to claim 1, wherein the second radiation fins are not collinear in the second radiation fin rows adjacent to each other in the longitudinal direction of the first radiation fins. .   A base-integrated substrate apparatus with fins, wherein a water-cooling jacket surrounding the first radiating fins and the second radiating fins is attached to the base-integrated substrate with fins according to claim 1.

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