JP5537295B2 - Light emitting element mounting wiring pattern, light emitting element mounting wiring board having light emitting element mounting wiring pattern, light emitting module using light emitting element mounting wiring board, and lighting fixture equipped with light emitting module - Google Patents

Description

  The present invention is equipped with a light emitting element mounting wiring pattern for mounting a plurality of light emitting elements, a light emitting element mounting wiring board having a light emitting element mounting wiring pattern, a light emitting module using the light emitting element mounting wiring board, and a light emitting module. It relates to lighting equipment.

  Conventionally, a light emitting element mounting wiring pattern in which light emitting elements are arranged in an array on a long light emitting element mounting wiring board, a light emitting element mounting wiring board having a light emitting element mounting wiring pattern, and a light emitting element mounting A light emitting module using a wiring board and a lighting fixture equipped with the light emitting module are known (see, for example, Patent Document 1).

JP 2008-288228 A (FIG. 1, claim 1)

The light emitting element mounting wiring pattern described in Patent Document 1, the light emitting element mounting wiring board having the light emitting element mounting wiring pattern, the light emitting module using the light emitting element mounting wiring board, and the lighting fixture equipped with the light emitting module Since the light emitting elements are arranged in a line, a collective light can be obtained.
However, the light emitting element mounting wiring pattern described in Patent Document 1 described above, the light emitting element mounting wiring board having the light emitting element mounting wiring pattern, the light emitting module using the light emitting element mounting wiring board, and the light emitting module are provided. The lighting fixtures are arranged with light emitting elements interspersed, and a series of lights such as fluorescent lamps cannot be obtained due to the coherent nature of the light emitting elements.

  Therefore, the light emitting element mounting wiring pattern described in Patent Document 1 described above, the light emitting element mounting wiring board having the light emitting element mounting wiring pattern, the light emitting module using the light emitting element mounting wiring board, and the light emitting module are provided. However, the luminaires have a problem that it is easy to feel glare strongly. In order to solve this problem, it is conceivable to reduce the density of the light emitting element group.

  However, in recent years, the power consumption has increased with the increase in luminance of the light-emitting element, and the heat generation has increased accordingly, so that the light-emitting element mounting wiring pattern that can further improve the heat dissipation, There is a need for a light emitting element mounting wiring board having a light emitting element mounting wiring pattern, a light emitting module using the light emitting element mounting wiring board, and a lighting fixture equipped with the light emitting module. In particular, if the wiring board for mounting the light emitting element is made of glass epoxy, the thermal conductivity is low, the area of the mounting part of the light emitting element may be small, and the heat dissipation of the light emitting element to the wiring board for mounting the light emitting element is low. Become.

In addition, when a large number of light emitting elements are used as a light source, a plurality of light emitting elements are often connected in series.
However, when the number of light emitting elements used increases, the supply voltage becomes high if all of the light emitting elements are connected in series. Therefore, it is necessary to divide a plurality of power supply circuits to the light emitting elements into a plurality of circuits and connect them in parallel.

  Furthermore, the light emitting element mounting wiring pattern described in Patent Document 1 described above, the light emitting element mounting wiring board having the light emitting element mounting wiring pattern, the light emitting module using the light emitting element mounting wiring board, and the light emitting module are provided. The lighting fixture has room for improvement in the arrangement of the electrode portions in the wiring pattern for mounting the light emitting element.

  The present invention has been made to solve the conventional problems. A wiring pattern for mounting a light-emitting element that can improve heat dissipation and can easily arrange electrodes so that light-emitting elements can be arranged at equal intervals on and between electrodes. An object of the present invention is to provide a light emitting element mounting wiring board having a light emitting element mounting wiring pattern, a light emitting module using the light emitting element mounting wiring board, and a lighting fixture equipped with the light emitting module.

A wiring pattern for mounting a light emitting element according to the present invention includes a first electrode that is electrically connected to a light emitting element mounted on another electrode pattern portion, and a mounting portion that mounts each of the plurality of light emitting elements. in between the first electrode in another electrode pattern part and the electrode pattern portion were passed, it becomes respectively to conduct the plurality of light emitting elements, and a second electrode comprising communicating with said first electrode, A wiring pattern for mounting a light-emitting element including an electrode pattern portion having a structure, wherein the first electrode of each electrode pattern portion is configured to surround the second electrode in another conductive electrode pattern portion. On the other hand, the second electrode of each electrode pattern portion has a larger area than the first electrode, and is arranged close to the first electrode in the other electrode pattern portion that conducts while ensuring an insulation distance. Which is mounted on the second electrode in each of the electrode pattern portion, connected in parallel said plurality of light emitting elements, ing connected in series by the number of respective electrode pattern portions.

Emitting element mounting wiring pattern according to the present invention includes a first electrode group which conducts the light-emitting element mounted on the other of the electrode pattern portion, a mounting portion for mounting a plurality of light emitting elements, said first Each of the plurality of light emitting elements is electrically connected to and communicated with the first electrode group between a first electrode group in an electrode pattern portion different from the electrode pattern portion conducted in the electrode group. A wiring pattern for mounting a light-emitting element including an electrode pattern portion having two electrode groups , wherein the first electrode group of each electrode pattern portion is in a direction in which the respective electrode tips face each other, and The extending direction of the electrodes is arranged at a distance so as not to be on the same straight line, and is configured to surround the second electrode group in the other electrode pattern portion. Above 2 electrode group, the larger in area than the first electrode group of the electrode, with respect to the first electrode group of another electrode pattern part for conducting, is disposed proximate to secure an insulation distance.

  In the light emitting element mounting wiring pattern according to the present invention, the first electrode or the first electrode group is formed in a comb shape, and the comb teeth are alternately arranged.

  The wiring pattern for mounting a light emitting element according to the present invention is electrically connected to an electrode included in the plurality of light emitting elements with respect to each comb tooth of the first electrode of the comb-shaped electrode or the first electrode group.

  The wiring pattern for mounting a light emitting element according to the present invention is formed in a long shape with electrode pattern portions arranged continuously.

  The wiring board for mounting a light emitting element according to the present invention has a wiring pattern for mounting a light emitting element.

  In the light emitting module according to the present invention, a wiring board for mounting light emitting elements was used.

  The lighting fixture according to the present invention uses a light emitting module.

  According to the wiring pattern for mounting a light emitting element according to the present invention, since the second electrode is a mounting part of the light emitting element in the electrode pattern portion, and the area of the second electrode can be increased, the light emitting elements are mounted in an array. When this is done, the light emitting element can dissipate more heat and the output of the light emitting element is improved by lowering the temperature. In addition, according to the wiring pattern for mounting the light emitting element according to the present invention, since the first electrode is around the second electrode, the connection to other electrode pattern portions is facilitated, and the wiring pattern is facilitated. There is an effect.

  According to the wiring pattern for mounting the light emitting element according to the present invention, the lead pattern is extended from the first electrode group, and the width of the second electrode group is further increased by connecting the lead electrode pattern portion and the electrode of the light emitting element. In addition, the heat dissipation of the wiring pattern is improved. Moreover, according to the wiring pattern for mounting a light emitting element according to the present invention, the length of the wire for electrically connecting the light emitting element and the wiring pattern can be shortened. By shortening the wire length, it is possible to reduce costs and improve reliability while ensuring heat dissipation. In addition, according to the wiring pattern for mounting a light emitting element according to the present invention, when the extraction electrode extends to the center of the substrate, it is possible to mount the light emitting elements in an array by face down (bump) mounting.

Light emitting element mounting wiring pattern according to the first embodiment of the present invention, a light emitting element mounting wiring board having a light emitting element mounting wiring pattern, a light emitting module using the light emitting element mounting wiring board, and a lighting fixture equipped with the light emitting module Plan view of lighting equipment in Japan The top view of the modification of the light emitting module of FIG. LIGHT EMITTING DEVICE MOUNTING WIRING PATTERN, LIGHT EMITTING DEVICE MOUNTING WIRING BOARD HAVING LIGHT EMITTING DEVICE MOUNTING WIRING PATTERN, LIGHT EMITTING MODULE USING LIGHT EMITTING ELEMENT MOUNTING WIRING BOARD, AND LIGHTING APPARATUS EQUIPPED WITH LIGHT EMITTING MODULE Plan view of light emitting module FIG. 3 is an enlarged plan view around the light emitting element in the light emitting element mounting wiring board of FIG. Light emitting element mounting wiring pattern according to the third embodiment of the present invention, a light emitting element mounting wiring board having a light emitting element mounting wiring pattern, a light emitting module using the light emitting element mounting wiring board, and a lighting fixture equipped with the light emitting module Plan view of light emitting module Light emitting element mounting wiring pattern according to the fourth embodiment of the present invention, a light emitting element mounting wiring board having a light emitting element mounting wiring pattern, a light emitting module using the light emitting element mounting wiring board, and a lighting fixture equipped with the light emitting module Plan view of light emitting module Light emitting element mounting wiring pattern according to the fifth embodiment of the present invention, a light emitting element mounting wiring board having a light emitting element mounting wiring pattern, a light emitting module using the light emitting element mounting wiring board, and a lighting fixture equipped with the light emitting module Plan view of light emitting module FIG. 7 is a perspective view of the light-emitting element mounting wiring board of FIG. The perspective view with a resist of the wiring board for light emitting element mounting of FIG.

  Hereinafter, a light emitting element mounting wiring pattern of a plurality of embodiments according to the present invention, a light emitting element mounting wiring board having a light emitting element mounting wiring pattern, a light emitting module using the light emitting element mounting wiring board, and a light emitting module are provided. A lighting fixture will be described with reference to the drawings.

(First embodiment)
As shown in FIG. 1, the light emitting element mounting wiring pattern of the first embodiment according to the present invention, the light emitting element mounting wiring board 20 having the light emitting element mounting wiring pattern, and the light emission using the light emitting element mounting wiring board 20. In the lighting fixture 1 equipped with the module 10 and the light emitting module 10, the light emitting module 10 having a long light emitting element mounting wiring substrate 20 is attached to the lighting fixture 1, and the light emitting module 10 includes a plurality of light emitting elements (LEDs). Chip) 11 is equipped.

  In the light emitting element mounting wiring substrate 20 of the light emitting module 10, an electrode pattern portion 24 composed of two electrodes, a first electrode 22 and a second electrode 23, is communicated in the longitudinal direction of the base substrate 21 on the base substrate 21. ing. A plurality of light emitting elements 11 having a pair of positive electrodes 12 and negative electrodes 13 are mounted on the electrode pattern portion 24 in the same length in an array at equal intervals.

The first electrode 22 is a narrow electrode that is electrically connected to the positive electrodes 12 of all the light emitting elements 11 mounted on the other adjacent electrode pattern portions 25 via the bonding wires 14. The second electrode 23 is a wide electrode having the mounting portions 26 of the plurality of light emitting elements 11. The second electrode 23 is electrically connected to the negative electrodes 13 of all the light emitting elements 11 on the electrode via bonding wires 15.
If the connection polarity is unified in the whole light emitting module 10, the positive electrode 12 and the negative electrode 13 may be reversed.

The 1st electrode 22 is comprised so that the circumference | surroundings of the 2nd electrode 23 of the other electrode pattern part 25 to conduct may be enclosed. The width of the first electrode 22 is preferably as narrow as possible, but has a minimum width that does not increase the amount of heat generated by the electrode. For example, when the current flowing through the electrode is 100 mA, the width dimension is set to 1 mm.
The width dimension may be larger than this.

  The second electrode 23 has a larger area than the first electrode 22, and has a sufficiently large area while ensuring an insulation distance with respect to the first electrode 22 in the other electrode pattern portion 25 that is conductive. There is only one other electrode pattern portion 25 through which the electrode pattern portion 24 is conducted. Conducting two or more is synonymous with connecting the light emitting elements 11 twice in parallel, and the second electrode 23 is larger than the two or more conducting elements, and only one of the light emitting elements is conductive. The area of the second electrode 23 having the eleven mounting portions 26 can be increased. Therefore, the number of the other electrode pattern portions 25 through which the electrode pattern portion 24 is conductive is desirable. The shape of the electrode pattern portion 24 is not limited and may be around the second electrode 23 of another electrode pattern portion 25 through which the first electrode 22 is conducted. For example, as in the modification shown in FIG. 2, if the electrode pattern portion 24 is such that the first electrode 27 is formed so as to surround the circular second electrode 28 while ensuring the insulation distance. The light emitting elements 11 can be arrayed in a curved line. The two electrode pattern portions 24 which are the end portions of the conductive electrode pattern portion 24 group are connected to a power supply portion (not shown) with a correct polarity via a lead wire (not shown).

  Returning to FIG. 1, the light emitting element 11 is mounted on the mounting portion 26 in each of the electrode pattern portions 24 and 25 via a die bonding material. The intervals between the light emitting elements 11 are set at equal intervals. As shown in the drawing, the light emitting element 11 is an upper electrode type having a positive electrode 12 and a negative electrode 13 on the upper surface, and an upper and lower electrode type having positive and negative electrodes on the upper surface and the lower surface. In the light emitting element 11 having the positive electrode 12 and the negative electrode 13 on the upper surface, an insulating material (for example, a silicone-based material) or a conductive material (for example, an Ag paste or solder) is used as the die bonding material. In contrast, in a light emitting device having positive and negative electrodes on the upper and lower surfaces, a conductive material is used as a die bonding material. The bonding wires 14 and 15 are made of Au, Cu, Al wire or the like.

  The electrode pattern portions 24 and 25 are formed on the base substrate 21 by a plating method or a vapor deposition method. Further, after the electrode pattern portions 24 and 25 are formed by the lead frame, they may be bonded to the base substrate 21 with an insulating sheet or the like. The base substrate 21 has an insulating property on the surface where the electrode pattern portions 24 and 25 are formed. Examples of the material of the base substrate 21 include glass epoxy, a metal substrate with an insulating layer (Al, Cu, etc.), and ceramic (alumina, aluminum nitride, glass ceramic, etc.). In particular, when a material with low thermal conductivity is used, the improvement in heat dissipation is significant. Electrode materials formed by plating or vapor deposition include Au / Ni, Au / Ti, Au / Pd / Ni, Ag / Ni, Au / Ni / Ag, Al / Ti, Ag, and the thickness is 10 μm. ~ 50 μm. The surface immediately below the light emitting element 11 of the electrode pattern portions 24 and 25 is generally Au. An electrode formed of a lead frame uses Cu, Al, or the like as a base material, and the surface is used by coating the above material by a plating method or a vapor deposition method.

  Other than the mounting portion 26 of the light emitting element 11 on the light emitting element mounting wiring substrate 20, a white resist layer may be covered to protect the pattern and improve the reflectance. The light emitting module 10 is turned on using a power source (not shown) as a current source. Although the light emission color of the light emitting module 10 is the light emission color of the light emitting element 11, a desired light emission color can be obtained by combining the light emitting elements 11 having different light emission colors. For example, by using the light emitting element 11 composed of three colors of RGB, a pseudo white emission color can be obtained. In addition, by using an element whose emission wavelength is blue or purple or in the near ultraviolet region, the light from the light emitting element 11 is partially or entirely converted through a phosphor or a color filter to obtain a desired emission color. May be. For example, the phosphor and the color filter are formed so as to be in contact with the surface and side surfaces of the light emitting element 11 or to surround the light emitting element 11 at a distance. For example, a blue light-emitting element 11 is used, and a YAG phosphor that emits yellow light (Y3Al5Ol2: Ce), a SCASN phosphor that emits red light ((SrCa) AlSiN3: Eu), a deep red CASN phosphor ( There are methods using CaAlSiN3: Eu), green CSO phosphor (CaSc2O4: Ce), and the like. In order to increase the light extraction efficiency of the emitted light, the periphery of the light emitting portion may be sealed with transparent silicone or glass. Or you may put the diffuser which scatters light with a sealing material. Further, a sealing material may be provided outside the light emitting element 11, and a phosphor or a color filter may be further provided outside. Alternatively, a phosphor or a color filter may be provided outside the light emitting element 11, and a sealing material may be provided outside. Good.

  Next, the light emitting element mounting wiring pattern according to the first embodiment of the present invention, the light emitting element mounting wiring board 20 having the light emitting element mounting wiring pattern, the light emitting module 10 using the light emitting element mounting wiring board 20 and the light emission. The operation of the light emitting module 10 in the lighting fixture 1 equipped with the module 10 will be described.

  In the light emitting module 10, when a current flows from the power supply unit with the correct polarity, the light emitting element 11 is turned on through the electrode pattern units 24 and 25 and the bonding wires 14 and 15. The light emitting element 11 generates heat when it is turned on. The heat generated in the light emitting element 11 has a small element size, and thus the amount of heat released to the air by convection and radiation is very small. Most of the heat is transferred to the die bonding material by heat conduction, and the light emitting element 11 is mounted. It is transmitted to the two electrodes 23.

  At this time, since the thermal conductivity of the material of the electrode pattern portion 24 is high, heat spreads within the electrode pattern portion 24. As the thermal conductivity of the base substrate 21 directly below becomes worse, the tendency to spread increases. The heat of the light emitting element 11 is spread by the electrode pattern portion 24, is transmitted through the base substrate 21, is finally transmitted to the lighting fixture 1 to which the light emitting module 10 is attached, and is radiated. Since the area of the 2nd electrode 23 which has the mounting part 26 of the light emitting element 11 is large, the area | region which can spread a heat becomes large. By taking a large heat dissipation area, the light emitting element 11 is effectively dissipated and the element temperature is reduced. The light emitting element 11 can also improve the light emission output by reducing the element temperature.

As explained above, according to the light emitting element mounting wiring pattern of the first embodiment of the present invention, the second electrode 23 is the mounting portion 26 of the light emitting element 11 in the electrode pattern portion 24, and Since the area can be increased, when the light emitting elements 11 are mounted in an array, the light emitting elements 11 can dissipate more heat, and the output of the light emitting elements 11 can be improved by lowering the temperature. Moreover, according to the light emitting element mounting wiring pattern of the first embodiment of the present invention, the first electrode 22 is located around the second electrode 23, so that connection to another electrode pattern portion 25 is facilitated. The wiring pattern becomes easy.
Therefore, according to the light emitting element mounting wiring pattern of the first embodiment of the present invention, the heat dissipation can be improved and the electrode portions can be easily arranged, so that the light emitting elements 11 can be arranged at equal intervals on and between the electrodes.

  Further, according to the light emitting element mounting wiring pattern of the first embodiment of the present invention, the first electrode 22 is configured to surround the second electrode 23 of the other electrode pattern portion 25 that is conductive, The width has a minimum width that does not increase the calorific value of the electrode. Therefore, since the area of the 2nd electrode 23 can be enlarged, suppressing the heat_generation | fever accompanying the electricity supply for making the light emitting element 11 light-emit, heat dissipation can be improved.

  In addition, according to the light emitting element mounting wiring substrate 20 of the first embodiment of the present invention, the heat dissipation can be improved and the electrode portions can be easily arranged so that the light emitting elements 11 can be arranged at equal intervals on and between the electrodes. The light emitting element mounting wiring board 20 can be provided.

  Moreover, according to the light emitting module 10 of 1st Embodiment which concerns on this invention, the light emitting module 10 with a high output can be provided because the light emitting element 11 is efficiently thermally radiated at the time of lighting.

  Moreover, according to the lighting fixture 1 of 1st Embodiment which concerns on this invention, the lighting fixture 1 equipped with the light emitting module 10 with a high output can be provided because the light emitting element 11 is thermally radiated efficiently at the time of lighting.

(Second Embodiment)
Next, a light emitting element mounting wiring pattern according to a second embodiment of the present invention, a light emitting element mounting wiring board having the light emitting element mounting wiring pattern, a light emitting module using the light emitting element mounting wiring board, and a light emitting module are provided. The luminaire will be described. In the following embodiments, components that are the same as those in the first embodiment described above or functionally similar components are simplified or omitted by giving the same reference numerals or equivalent symbols in the drawings. To do.

  As shown in FIG. 3, the light emitting element mounting wiring pattern, the light emitting element mounting wiring board 40 having the light emitting element mounting wiring pattern, and the light emission using the light emitting element mounting wiring board 40 according to the second embodiment of the present invention. In the lighting fixture 2 equipped with the module 30 and the light emitting module 30, the light emitting module 30 includes a plurality of upper extraction electrodes 42 and a wiring board 40 for mounting light emitting elements facing inward from the first electrode 41 of the electrode pattern portion 24. A plurality of lower extraction electrodes 43 extend, and the first electrode 41 constitutes a first electrode group 44 by the upper extraction electrode 42 and the lower extraction electrode 43. The second electrode 45 constitutes a second electrode group 46.

  The upper extraction electrode 42 and the lower extraction electrode 43 are arranged in a staggered combination so that the other extraction portions do not intersect with each other on the extension line of the extraction portions. The upper extraction electrode 42 and the lower extraction electrode 43 are drawn out in the same number as the number of the light emitting elements 11 mounted on the other electrode pattern portion 25 to be conducted. The upper extraction electrode 42 and the lower extraction electrode 43 extend to the upper part or the vicinity of the lower part of the light emitting element 11, but are not particularly limited as long as they extend to a position close to the light emitting element 11. There are no particular restrictions on how the upper extraction electrode 42 and the lower extraction electrode 43 are extracted.

  The pattern widths of the upper extraction electrode 42 and the lower extraction electrode 43 are preferably as narrow as possible in order to increase the area of the second electrode 45. For example, it is formed in the range of 50 μm to 500 μm. The tip portions of the upper lead electrode 42 and the lower lead electrode 43 are joint portions with the bonding wires 14 and 15, and an area necessary for bonding is secured.

As shown in FIG. 4, when the pattern width of the upper extraction electrode 42 and the lower extraction electrode 43 is narrow and a sufficient area cannot be secured as a bonding portion of the bonding wires 14 and 15, the upper extraction electrode 42 and the lower extraction electrode 43 A pad electrode 47 for wire bonding is created at the tip. Usually, the area required for the wire bonding portion of the bonding wires 14 and 15 needs to be □ 100 μm to □ 300 μm with respect to one of the bonding portions. The pattern width of the second electrode 45 can be made sufficiently large because of the upper extraction electrode 42 and the lower extraction electrode 43.
In addition, although the light emitting element 11 is an upper surface electrode type, not only this but an upper and lower surface electrode type may be sufficient. Further, face-down mounting using bumps is also possible. At this time, the upper extraction electrode 42 and the lower extraction electrode 43 are formed at appropriate positions and at appropriate intervals so that the light emitting elements 11 can be arranged in an array.

  Next, the light emitting element mounting wiring pattern according to the second embodiment of the present invention, the light emitting element mounting wiring board 40 having the light emitting element mounting wiring pattern, the light emitting module 30 using the light emitting element mounting wiring board 40, and the light emission. The operation of the light emitting module 30 in the lighting fixture 2 equipped with the module 30 will be described.

  In the light emitting module 30, the heat of the light emitting element 11 generated by being turned on by the power supply unit is such that the area of the second electrode 45 of the electrode pattern part 24 having the mounting part 26 of the light emitting element 11 is the light emitting module in the lighting apparatus 1 described above. Since it is larger than the case of 10, it is expanded more by conduction, the heat radiation area becomes larger, and the temperature of the light emitting element 11 is further reduced. And the light output of the light emitting element 11 improves. The use length of the bonding wires 14 and 15 used for mounting the light emitting element 11 can be shortened by providing the wire electrode pad 47 on the upper extraction electrode 42 and the lower extraction electrode 43.

  According to the wiring pattern for mounting a light emitting element of the second embodiment of the present invention, the upper lead electrode 42 and the lower lead electrode 43, which are extended from the first electrode group 44, are provided. By connecting the extraction electrode 43 and the positive electrode 12 (negative electrode 13) of the light emitting element 11, the width of the second electrode group 46 can be increased, and the heat dissipation of the wiring pattern is further improved. In addition, according to the light emitting element mounting wiring pattern of the second embodiment of the present invention, the lengths of the bonding wires 14 and 15 that electrically connect the light emitting element 11 and the electrode pattern portion 24 can be shortened. By shortening the wire length of the bonding wires 14 and 15, it is possible to reduce costs and improve reliability while ensuring heat dissipation. Further, if a sealing lens for wire protection and output improvement is provided, the lens can be made thinner. Further, according to the light emitting element mounting wiring pattern of the second embodiment of the present invention, the upper lead electrode 42 and the lower lead electrode 43 extend to the center of the substrate, so that the array can be formed even by face down (bump) mounting. A light emitting element can be mounted in a shape.

(Third embodiment)
Next, a light emitting element mounting wiring pattern according to a third embodiment of the present invention, a light emitting element mounting wiring board having the light emitting element mounting wiring pattern, a light emitting module using the light emitting element mounting wiring board, and a light emitting module are provided. The luminaire will be described.

  As shown in FIG. 5, the light emitting element mounting wiring pattern, the light emitting element mounting wiring board 60 having the light emitting element mounting wiring pattern, and the light emission using the light emitting element mounting wiring board 60 according to the third embodiment of the present invention. In the lighting fixture 3 equipped with the module 50 and the light emitting module 50, the light emitting module 50 includes a plurality of upper extraction electrodes (comb teeth) 52 and a plurality of lower extraction electrodes (comb teeth) 53 formed in a comb shape in the first electrode 51. Were arranged alternately. The first electrode 51 constitutes a first electrode group 54 by an upper extraction electrode 52 and a lower extraction electrode 53. The second electrode 55 constitutes a second electrode group 56.

  Next, the light emitting element mounting wiring pattern according to the third embodiment of the present invention, the light emitting element mounting wiring board 60 having the light emitting element mounting wiring pattern, the light emitting module 50 using the light emitting element mounting wiring board 60, and the light emission. The operation of the light emitting module 50 in the lighting fixture 3 equipped with the module 50 will be described.

  In the light emitting module 50, heat of the light emitting element 11 generated at the time of lighting is conducted to the second electrode 55 and spreads in the second electrode 55 of the electrode pattern portion 24 having the mounting portion 26 of the light emitting element 11. In order to spread evenly on the upper side and the lower side, the uneven temperature distribution of the light emitting element mounting wiring board 60 is reduced, and the mounted light emitting element 11 group has a uniform temperature.

  According to the light emitting element mounting wiring pattern of the third embodiment of the present invention, the upper lead electrode 52 and the lower lead electrode 53 formed in a comb shape in the first electrode 51 are alternately arranged, so that the light emitting element is provided. Since heat of 11 spreads in the second electrode 55 of the second electrode group 56 without uneven distribution, heat dissipation can be improved.

(Fourth embodiment)
Next, a light emitting element mounting wiring pattern according to the fourth embodiment of the present invention, a light emitting element mounting wiring board having the light emitting element mounting wiring pattern, a light emitting module using the light emitting element mounting wiring board, and a light emitting module are provided. The luminaire will be described.

  As shown in FIG. 6, the light emitting element mounting wiring pattern, the light emitting element mounting wiring board 80 having the light emitting element mounting wiring pattern, and the light emission using the light emitting element mounting wiring board 80 according to the fourth embodiment of the present invention. In the lighting fixture 4 equipped with the module 70 and the light emitting module 70, the light emitting module 70 alternately arranges the upper extraction electrode 72 and the lower extraction electrode 73 formed in a comb shape in the first electrode 71. The first electrode 71 constitutes a first electrode group 74 by the upper extraction electrode 72 and the lower extraction electrode 73. The second electrode 75 constitutes a second electrode group 76.

  In the light emitting module 70, the plurality of light emitting elements 11 of the other electrode pattern portion 25 that are conductive are electrically connected to one of the upper extraction electrode 72 and the lower extraction electrode 73. The number of light emitting elements 11 to be conducted is such that two light emitting elements 11 are arranged on the left and right with respect to one upper extraction electrode 72 and one lower extraction electrode 73. The arrangement of the light emitting elements 11 is not limited to this, and may be three or more. However, if the number of the light emitting elements 11 is three or more, the lengths of the bonding wires 14 and 15 may be increased and the reliability may be lowered. The upper extraction electrode 72 and the lower extraction electrode 73 extend to the extent that they extend over the mounting area including the group of light emitting elements 11 mounted in an array. As for the positions of the upper extraction electrode 72 and the lower extraction electrode 73, the tips are located at the center between the light emitting elements 11, but they may not be located at the center between the light emitting elements 11. It may be located between. Pad electrodes (see FIG. 4) 47 for wire bonding are provided at the tips of the upper extraction electrode 72 and the lower extraction electrode 73 as many as the number of light emitting elements 11 that are conductive. When the interval between the light emitting elements 11 is increased, the length of the bonding wires 14 and 15 is increased.

  Next, the light emitting element mounting wiring pattern of the fourth embodiment according to the present invention, the light emitting element mounting wiring board 80 having the light emitting element mounting wiring pattern, the light emitting module 70 using the light emitting element mounting wiring board 80, and the light emission. The operation of the light emitting module 70 in the lighting fixture 4 equipped with the module 70 will be described.

  In the light emitting module 70, when the interval between the light emitting elements 11 mounted on the second electrode 75 is small or the number of the light emitting elements 11 is large, the number of the upper extraction electrodes 72 and the lower extraction electrodes 73 is increased. In some cases, the area of the second electrode 75 cannot be increased. Therefore, by providing a plurality of light emitting elements 11 that are conducted from the upper extraction electrode 72 and the lower extraction electrode 73, the number of the upper extraction electrodes 72 and the lower extraction electrodes 73 is reduced. Therefore, by increasing the area of the second electrode 75, the heat dissipation area of the light emitting element 11 can be increased.

  According to the light emitting element mounting wiring pattern of the fourth embodiment of the present invention, the area of the second electrode 75 of the second electrode group 76 that is the mounting portion 26 is divided into the upper lead electrode 72 and the lower portion formed in a comb shape. Since the number of combs of the extraction electrode 73 can be reduced and increased, heat dissipation can be improved.

(Fifth embodiment)
Next, a light emitting element mounting wiring pattern according to the fifth embodiment of the present invention, a light emitting element mounting wiring board having the light emitting element mounting wiring pattern, a light emitting module using the light emitting element mounting wiring board, and a light emitting module are provided. The luminaire will be described.

  As shown in FIGS. 7 and 8, the light emitting element mounting wiring pattern, the light emitting element mounting wiring board 100 having the light emitting element mounting wiring pattern, and the light emitting element mounting wiring board 100 according to the fifth embodiment of the present invention are provided. The light emitting module 90 in the used light emitting module 90 and the lighting fixture 5 equipped with the light emitting module 90 has a long length in which the electrode pattern portion 24 is formed on the base substrate 21 by connecting patterns in which 15 patterns are electrically connected in series. The wiring board 100 for mounting light emitting elements is provided. The light emitting elements 11 are mounted on the light emitting element mounting wiring substrate 100 in a straight line at equal intervals. The first electrode 91 constitutes a first electrode group 94 by the upper extraction electrode 92 and the lower extraction electrode 93. The second electrode 95 constitutes a second electrode group 96.

Although eight light emitting elements 11 are mounted on the electrode pattern part 24, the number of mounted elements is not limited to this number. One of the pattern portions at both ends is only the second electrode 95, and the other is only the first electrode 91. The pad electrodes 97 at both ends in the longitudinal direction (not shown) of the light emitting element mounting wiring substrate 100 form a pair of pad electrodes at both ends. Pad electrodes 97 for joining lead wires are provided in the pattern portions at both ends. The pad electrodes 97 in the pattern portions at both ends are extended not only from both ends of the light emitting element mounting wiring substrate 100 but also from one end so that the pattern is extended from the other end to the other to form positive and negative pad electrodes 97 at one end. doing. The pad electrode 97 is not always necessary. Each electrode pattern portion 24, 25 is also provided with a pad electrode 97 for a lighting test of each electrode pattern portion 24, 25, but it is not always necessary.
As shown in FIG. 9, the wiring board 100 for mounting the light emitting element is covered with a white resist layer 98 for protecting the pattern and improving the reflectance except for the mounting portion 26 of the light emitting element 11.

  Next, the light emitting element mounting wiring pattern according to the fifth embodiment of the present invention, the light emitting element mounting wiring board 100 having the light emitting element mounting wiring pattern, the light emitting module 90 using the light emitting element mounting wiring board 100, and the light emission. The operation of the light emitting module 90 in the lighting fixture 5 equipped with the module 90 will be described.

  In the light emitting module 90, when the light emitting element 11 group mounted in a line at equal intervals is turned on, the heat of the light emitting element 11 is spread evenly on the wiring board 100 for mounting the light emitting element, the element temperature is suppressed, and the light output is reduced. improves. Since the light emitting module 90 has the positive and negative energizing pad electrodes 97 formed at both ends and one end, the degree of freedom of the lead wire wiring method is high. Moreover, when using the several light emitting module 90, the freedom degree of the connection method between each light emitting module 90 is also high.

  According to the wiring pattern for mounting light emitting elements of the fourth embodiment of the present invention, the light emitting elements 11 are mounted in an array in each electrode pattern portion 24, 25, so that a large number of light emitting elements 11 are mounted in an array. It becomes possible to illuminate at a desired supply voltage by combining a parallel circuit and a series circuit.

  The light emitting element mounting wiring pattern of the present invention, the light emitting element mounting wiring board having the light emitting element mounting wiring pattern, the light emitting module using the light emitting element mounting wiring board, and the lighting fixture equipped with the light emitting module are described above. The present invention is not limited to the embodiment, and appropriate modifications and improvements can be made.

1, 2, 3, 4, 5 Lighting fixture 10, 30, 50, 70, 90 Light emitting module 11 Light emitting element 20, 40, 60, 80, 100 Light emitting element mounting wiring board 22, 27, 41, 51, 71, 91 1st electrode 23,28,45,55,75,95 2nd electrode 26 Mounting part 44,54,74,94 1st electrode group 46,56,76,96 2nd electrode group

Claims (8)

A first electrode electrically connected to a light emitting element mounted on another electrode pattern portion;
It has a mounting portion for mounting a plurality of light emitting elements, between the first electrode in the other electrode pattern portion and the electrode pattern portion obtained by conducting the first electrode, each of the plurality of light emitting elements conduction is not made, the second electrode comprising communicating with said first electrode, a light-emitting element mounting wiring pattern provided with the electrode pattern portion having,
The first electrode of each of the electrode pattern portions is configured to surround the second electrode in another conductive electrode pattern portion, while the second electrode of each of the electrode pattern portions includes the first electrode An area larger than one electrode is disposed in close proximity to the first electrode in the other electrode pattern portion that conducts, ensuring an insulation distance ,
Is mounted on the second electrode in each of the electrode pattern portion, connected in parallel said plurality of light emitting elements, each of the electrode pattern portion connected with Na Ru emitting element mounting wiring patterns in series by the number of. A first electrode group electrically connected to a light emitting element mounted on another electrode pattern portion;
It has a mounting portion for mounting a plurality of light emitting elements, between the first electrode group in another electrode pattern portion and the electrode pattern portion were passed in the first electrode group, the plurality of light emitting elements be made conductive, respectively, and a second electrode group including a communication with the first electrode group, a light-emitting element mounting wiring pattern provided with the electrode pattern portion having,
The first electrode group of each electrode pattern portion is arranged at a distance so that the electrode tips are opposed to each other and the extending directions of the electrodes are not on the same straight line. The electrode pattern portion is configured to surround the second electrode group, while the second electrode group of each electrode pattern portion has a larger area than the electrode of the first electrode group and is conductive. A wiring pattern for mounting a light-emitting element, which is disposed close to the first electrode group in the electrode pattern portion while ensuring an insulation distance. In the wiring pattern for light emitting element mounting of any one of Claim 1 or Claim 2 ,
The light emitting element mounting wiring pattern in which the first electrode or the first electrode group is configured in a comb shape, and the comb teeth are alternately arranged. The light emitting element mounting wiring pattern according to any one of claims 1 to 3 ,
A wiring pattern for mounting a light-emitting element that conducts to an electrode included in a plurality of light-emitting elements with respect to each comb tooth of the first electrode or the first electrode group of the comb-shaped electrode. In the light emitting element mounting wiring pattern according to any one of claims 1 to 4 ,
A wiring pattern for mounting a light emitting element, wherein the electrode pattern portion is continuously provided and is formed in a long shape. A wiring board for mounting a light emitting element, comprising the wiring pattern for mounting a light emitting element according to any one of claims 1 to 5 . The light emitting module using the wiring board for light emitting element mounting of Claim 6 . A lighting fixture equipped with the light emitting module according to claim 7 .

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