JP5506153B2 - Board inspection equipment - Google Patents

Description

  The present invention relates to a substrate inspection apparatus, and more particularly to a substrate inspection apparatus that inspects conduction or non-conduction of a pattern provided on a substrate using a probe.

  For example, for a substrate on which a wiring pattern is provided such as a liquid crystal substrate, a flat display substrate, a circuit substrate, a semiconductor substrate, etc., it is inspected whether the pattern is correctly formed. In addition to the appearance, the inspection is performed by using an appropriate probe to electrically inspect the electrical conduction or non-conduction of the pattern on the substrate. An apparatus that performs such an electrical inspection is called a substrate inspection apparatus.

  As a probe used for electrical inspection, a non-contact type probe that supplies an electric signal to a pattern in a non-contact manner or detects an electric signal may be used, but in many cases, a contact type probe is used. ing. In the case of a contact type probe, problems such as wear may occur because it directly contacts the pattern on the substrate with a predetermined contact pressure.

  For example, Patent Document 1 describes a configuration for detecting deterioration of a probe in a substrate inspection machine that applies a voltage between two probes for substrate conduction / insulation and inspects the pattern resistance of the substrate from the flowing current. Yes. Here, a probe short-circuit plate is provided in the substrate inspection machine, and before the inspection of the measurement target substrate, the two probes are lowered to the probe short-circuit plate, the resistance value at that time is compared with the probe pass / fail determination resistance value, It is disclosed that a warning is output when the resistance value is larger than the resistance value.

  Further, Patent Document 2 discloses a contact probe device having a configuration that can be easily replaced when the tip of a contact probe needs to be replaced due to wear or the like. Here, the printed circuit board and the probe unit are positioned by the positioning pins provided in the probe guide mechanism, and the probe unit is attached to the probe guide mechanism with one mounting screw, so that this one mounting screw is loosened. The probe unit can be easily replaced.

JP-A-6-331681 JP 2006-330006 A

  In Patent Document 1, when a contact resistance value increases due to wear or the like on a contact type probe, an alarm is output to notify the necessity of replacement. Patent Document 2 describes a calibration contact probe that can be easily replaced.

  As described above, in the prior art, the replacement timing of the contact-type probe is known by appropriate means, and the operator replaces the probe accordingly. Thus, since the probe replacement in the board inspection apparatus is performed by an operator when necessary, depending on the apparatus, it is necessary to frequently perform the replacement operation. Need to be adjusted, which further increases the work load.

  The objective of this invention is providing the board | substrate inspection apparatus which reduces the load of probe replacement | exchange. Another object is to provide a substrate inspection apparatus that can reduce the frequency of probe replacement. Another object is to provide a substrate inspection apparatus that can extend the life of a probe. The following means contribute to at least one of the above objects.

A substrate inspection apparatus according to the present invention is a substrate inspection apparatus that uses a probe to inspect a conduction or non-conduction of a pattern provided on a substrate, and a probe assembly having a contact probe at the tip, and the probe assembly can be attached and detached. Replacement having a holding probe unit, an actuator for moving and driving the probe unit to an arbitrary three-dimensional position, an unused probe region for placing an unused probe assembly, and a used probe region for placing a used probe assembly A plate for calibrating the tip height of the contact probe of the probe unit, a height reference plate having a conductor portion on the surface, and a control unit. The contact probe is mounted on the substrate. Scanning direction when inspecting by continuously scanning multiple patterns provided A tilt probe having a predetermined tilt angle with respect to the substrate surface, and further, contact between the imaging means for imaging the tip shape of the contact probe of the probe unit and the tip of the contact probe A plate for correcting the position, and a contact position reference plate having a conductor pattern portion arranged extending in a direction perpendicular to the scanning direction of the contact probe, and the control unit is Tray forward movement processing means for moving the probe unit to the used probe area of the replacement tray for replacement; and a removal processing means for removing the probe assembly from the probe unit and placing it in the used probe area of the replacement tray; Replace the probe unit with the probe assembly removed for the actuator Intra-tray movement processing means for moving to an unused probe area of the ray, attachment processing means for attaching and holding an unused probe assembly arranged in the unused probe area of the replacement tray to the probe unit, and an actuator On the other hand, the height calibration movement processing means for moving the tip of the contact probe of the replaced probe unit whose probe assembly has been replaced toward the conductor portion of the height reference plate, and the electric power between the contact probe and the conductor portion. Height calibration means that detects the actual contact and sets the height position of the actuator at that time as the contact reference height of the probe unit, and the probe unit whose height calibration has been completed for the actuator to the original inspection position The contact reference height of the probe unit with respect to the return tray return path processing means and the actuator Height setting processing means for setting the height position to the position of the probe, and the position of the tip shape of the contact type probe of the probe unit imaged by the imaging means in a state where the height setting processing is performed, and a predetermined reference position Based on the comparison, the probe unit is calibrated with the tip position deviation calibration means for calibrating the deviation of the tip position in the direction perpendicular to the scanning direction of the contact type probe of the probe unit, and the probe unit is calibrated with the tip position deviation calibration. The tip calibration movement process that moves the tip of the contact probe in the direction perpendicular to the extending direction of the conductor pattern of the contact position reference plate, and the electrical contact between the contact probe and the conductor pattern are detected. Contact position calibration means for setting a position along the scanning direction of the actuator as a contact reference position of the probe unit .

Further, in the substrate inspection apparatus according to the present invention, the probe unit includes a main body portion, a movable holder unit and the upper surface of the probe assembly asked to support relative to the body portion, pressing the probe assembly relative to the body portion It is preferable to have a holder portion that moves in the direction to fix and hold the probe assembly, and moves in a direction to release the probe assembly from the main body portion so that the probe assembly can be removed.

  Further, in the substrate inspection apparatus according to the present invention, the contact type probe has a predetermined predetermined with respect to the substrate surface along the scanning direction when continuously inspecting and inspecting a plurality of patterns provided on the substrate. An inclined probe having an inclination angle, an imaging means for imaging the tip shape of the contact probe of the probe unit, and a plate for correcting the contact position of the tip of the contact probe, the contact type A contact position reference plate having a conductor pattern portion arranged extending in a direction perpendicular to the scanning direction of the probe, and the controller sets the height position to the contact reference height of the probe unit with respect to the actuator The height setting processing means to be performed, and the position of the tip shape of the contact type probe of the probe unit imaged by the imaging means in the state where the height setting processing has been performed Based on a comparison with a predetermined reference position, the tip position deviation calibration means for calibrating the tip position deviation in the direction perpendicular to the scanning direction of the contact type probe of the probe unit and the tip position deviation calibration for the actuator are performed. In the performed state, the tip calibration moving process for moving the tip of the contact type probe of the probe unit in the direction orthogonal to the extending direction of the conductor pattern of the contact position reference plate, and the electrical connection between the contact type probe and the conductor pattern It is preferable to have contact position calibration means that detects contact and sets the position along the scanning direction of the actuator at that time as the contact reference position of the probe unit.

  Further, in the substrate inspection apparatus according to the present invention, the probe unit is a predetermined predetermined with respect to the substrate surface along the first scanning direction when continuously inspecting and inspecting a plurality of patterns provided on the substrate. A first probe assembly including a contact probe having a tilt angle of 2 mm and a second scan direction, which is a scan direction opposite to the first scan direction, with a predetermined tilt angle with respect to the substrate surface. And a second probe assembly including a contact probe.

  The substrate inspection apparatus according to the present invention further includes a gap sensor that is disposed in proximity to the tip of the contact probe of the probe unit and detects a distance between the tip of the contact probe and the surface of the substrate to be inspected. The control unit preferably has a height follow-up processing unit that causes the actuator to follow the reference height of the height position of the probe unit according to the detection result of the gap sensor.

With the above configuration, the substrate inspection apparatus has a probe unit that detachably holds a probe assembly having a contact probe at the tip. Then, a replacement tray having an unused probe region in which an unused probe assembly is arranged and a used probe region in which a used probe assembly can be arranged is provided. Now move the probe unit to the used probe area of the replacement tray for replacement, remove the probe assembly and place it in the used probe area of the replacement tray, and replace the probe unit with the probe assembly removed move unused probe region of the tray, it is held by attaching an unused probe assembly to the probe unit, return the replaced probe unit probe assembly is replaced with the original inspection position. Since these are performed using an actuator or the like under the control of the control unit, the probe replacement load can be reduced.

Further, in the substrate inspection device, the probe unit includes a main body portion and the body portion to have a holder portion capable of moving the upper surface side asked to support the probe assembly, the holder portion in a direction to press the probe assembly relative to the body portion The probe assembly is fixed and held, and the holder portion is moved in a direction to release the probe assembly from the main body portion so that the probe assembly can be removed. Therefore, the probe unit can detachably hold the probe assembly having the contact probe at the tip.

  The substrate inspection apparatus further includes a height reference plate having a conductor portion on the surface in order to calibrate the tip height of the contact type probe of the probe unit. Then, the tip of the contact type probe of the probe unit is moved toward the conductor part of the height reference plate to detect electrical contact between the contact type probe and the conductor part, and the height position of the actuator at that time is determined. Set as the reference contact height of the probe unit. In this way, the probe height can be set appropriately, wear due to an inappropriate probe height can be suppressed, and the probe life can be extended.

  Further, in the substrate inspection apparatus, when the contact probe is an inclined probe that is inclined along the scanning direction when continuously inspecting and inspecting the substrate, it is for imaging the tip shape of the contact probe. An imaging unit and a contact position reference plate for correcting the contact position of the tip of the contact probe are provided. Then, in a state where the height position of the probe unit is set to the contact reference height, the displacement of the tip position in the direction perpendicular to the scanning direction of the contact type probe is calibrated based on the imaging result of the imaging unit, and the contact type The position of the actuator along the scanning direction of the actuator is detected by detecting the electrical contact between the contact probe and the conductor pattern by moving the tip of the probe in the direction perpendicular to the extending direction of the conductor pattern of the contact position reference plate. Is set as the contact reference position of the probe unit. In this way, the probe position can be made appropriate, wear due to an inappropriate probe position can be suppressed, and the probe life can be extended.

  In the substrate inspection apparatus, the probe unit includes a first probe assembly that is inclined at a predetermined inclination angle along the first scanning direction, and a second scanning direction that is a scanning direction opposite to the first scanning direction. And a second probe assembly inclined at a predetermined inclination angle. Therefore, the substrate inspection scan can be alternately switched between the first scanning direction and the second scanning direction, so-called reciprocating scanning or bidirectional scanning can be performed. The first probe is used for the measurement in the first scanning direction, and the second probe is used for the measurement in the second scanning direction. Thus, since the first probe assembly and the second probe assembly are alternately used in bidirectional scanning, the frequency of use of each probe assembly is halved, thereby reducing the frequency of probe replacement.

  The substrate inspection apparatus also includes a gap sensor that detects the distance between the tip of the contact probe and the surface of the substrate to be inspected, and determines the height position of the probe unit according to the detection result of the gap sensor as a contact reference. Follow the height. For example, it is less affected by the undulation of the substrate and the need for setting the contact pressure higher with a margin is reduced. As a result, it is possible to suppress wear due to an inappropriate contact pressure and to extend the life of the probe.

  Embodiments according to the present invention will be described below in detail with reference to the drawings. In the following, a glass substrate for a liquid crystal display device having a wiring pattern will be described as a substrate to be measured. However, any substrate other than this may be used as long as it is necessary to inspect the conduction and non-conduction of the pattern. For example, it may be a semiconductor wafer, a circuit board, or the like. In addition, as a probe for measuring the conduction and non-conduction of the pattern, it is assumed that a contact type probe is used at one end of the pattern and a non-contact type probe is used at the other end, but at least one contact type probe is used. I just need it. For example, in the above example, a contact type probe may be used at the other end. Even in the case of measuring three or more terminals, it is sufficient that at least one terminal uses a contact probe.

  In the following description, the probe assembly is assumed to have a needle-like probe fixed to the tip. However, this is an example for explanation, and a probe assembly having a contact-type probe is used for other structures. I just need it. For example, the probe may be an elastic spring probe, wire probe, or the like. Further, it may be a cantilever type probe assembly which is a so-called cantilever type probe. Further, a structure in which a plurality of probes are attached to one unit may be used.

  In the following description, regarding the movement of the probe unit, a linear motor will be described as an actuator for movement in the XY directions, and a lead screw motor will be described as an actuator for movement in the Z direction. It is an example. Accordingly, a generally used drive actuator for movement may be used for movement in any direction. In addition to the linear motor and the lead screw type motor, a voice coil motor, a movable wire type motor, and the like may be used. In addition, although a description is given assuming that a guide groove is used as the guide mechanism, it is needless to say that another guide mechanism such as a guide rail may be used.

  FIG. 1 is a plan view showing the configuration of the substrate inspection apparatus 10. The substrate inspection device 10 is a device having a function of inspecting conduction or non-conduction of a pattern provided on a substrate using a probe, a mechanism for scanning the probe relative to the pattern on the substrate, pattern conduction, And a measurement function for evaluating non-conduction. In particular, the probe has a function of automatically replacing a probe that needs to be replaced due to wear or the like. FIG. 1 shows a glass substrate 8 for a liquid crystal display device having a wiring pattern 6 that is not a component of the substrate inspection apparatus 10. Although one substrate 8 is shown mounted, as will be described later, the single substrate 8 may include a plurality of blocks to be inspected, or a plurality of substrates. 8 may be mounted. Further, FIG. 1 shows the X direction and the Y direction, respectively.

  The substrate inspection apparatus 10 includes a main body stage 12 that holds a glass substrate 8 that is an object to be measured, guide grooves 14 and 16 that are provided in the vicinity of the left and right ends of the main body stage 12 in the Y direction, and guide grooves 14 and 16. The gantry 20 that can be moved in the Y direction by being guided by the main body stage 12, the guide grooves 22 and 23 that are provided on the upper surface of the gantry 20 so as to extend in the X direction, and the guide groove 22 that is guided by the guide grooves 22 in the X direction And a sensor stage 25 that is guided by a guide groove 23 and can be moved in the X direction on the gantry 20.

  The substrate inspection apparatus 10 further includes a non-contact type sensor probe 26 provided on one end side of the gantry 20 and a probe unit set 30 mounted on the probe stage 24 for inspecting the wiring pattern 6. .

  The substrate inspection apparatus 10 is configured to include a replacement tray 60 for replacing the probe assembly included in the probe unit set 30. Further, a height reference unit 70, a probe imaging camera 80, and a contact position reference unit 90 are configured to calibrate the height and position of the probe assembly. The replacement tray 60, the height reference unit 70, the probe imaging camera 80, and the contact position reference unit 90 are disposed on the main body stage 12.

  The substrate inspection apparatus 10 includes a plurality of actuators for independently moving the non-contact sensor probe 26 and the probe unit set 30 relative to the substrate 8 in the XYZ directions. An actuator driving unit 110 for driving these actuators is provided. Moreover, the board | substrate evaluation part 112 is provided as a measurement function which evaluates the conduction | electrical_connection and non-conduction of a wiring pattern.

  Furthermore, the board inspection apparatus 10 includes a control unit 120 that controls each of these elements as a whole. The control unit 120 includes a substrate inspection module 122 and, in particular, a maintenance module 124 that calibrates positioning and the like for the probe unit set 30 and performs processing for automatically exchanging probes when necessary.

  The main body stage 12 in the substrate inspection apparatus 10 is a flat base that holds the substrate 8 to be inspected. Although not shown in FIG. 1, an appropriate substrate loading / unloading device is connected to the main body stage 12, the uninspected substrate 8 is loaded into the main body stage 12, and the inspected substrate 8 is carried out of the main body stage 12. It is. For loading / unloading, for example, a method of moving a fork arm that adsorbs and supports both sides of the substrate 8 by vacuum technology, a method of moving a fork arm that mechanically mounts and supports both sides of the substrate 8, and a gas pressure are used. Thus, a method of floating the substrate 8 and moving it on the main body stage 12 can be used. The substrate 8 is positioned and held on the main body stage 12 by a mechanical positioning technique, a vacuum technique, an electrostatic holding technique or the like.

  The guide grooves 14 and 16 have a guiding function when the gantry 20 is moved in the Y direction, and are concave grooves into which guide members provided on the bottom surface of the gantry 20 can enter. The guide grooves 14 and 16 are provided in parallel along the Y direction at locations near the left and right ends on the upper surface of the main body stage 12. The distance between the two guide grooves 14 and 16 that run in parallel is set to be larger than the width of the substrate 8 in the X direction.

  The gantry 20 is a member that is guided by the guide grooves 14 and 16 and can move the upper part of the main body stage 12 in the Y direction. FIG. 2 is a detailed perspective view of the periphery of the gantry 20. Both ends of the gantry 20, that is, portions guided by the guide grooves 14 and 16 are provided with linear motors and are connected to the actuator driving unit 110.

The linear motors at both ends can be configured to include a coil that generates a driving force in the Y direction in cooperation with a permanent magnet provided on the main body stage 12 side. As described above, the guide member that can enter the guide grooves 14 and 16 is provided on the bottom surface of the linear motor, and contacts the guide grooves 14 and 16 with a small frictional force by, for example, a ball bearing or the like. Each linear motor is connected to the control unit 120 via the actuator driving unit 110 and operates under the control of the control unit 120 to move and drive the gantry 20 in the + Y direction or the −Y direction.

  A portion extending in the X direction by connecting the linear motors at both ends is a gantry portion provided at a height not contacting the substrate 8 above the main body stage 12. Guide grooves 22 and 23 are provided on the upper surface of the gantry portion. In FIG. 2, the guide groove 22 disposed on the right side of the gantry has a guiding function when the probe stage 24 is moved in the X direction, and is a concave groove into which a guide member provided on the bottom surface of the probe stage 24 can enter. It is. Further, the guide groove 23 disposed on the left side of the gantry portion in FIG. 2 has a guiding function when the sensor stage 25 is moved in the X direction, and a guide member provided on the bottom surface of the sensor stage 25 can enter. It is a groove.

  The probe stage 24 is a member on which the probe unit set 30 is mounted, and includes a coil that incorporates a linear motor and generates a driving force in the X direction in cooperation with a permanent magnet provided on the gantry 20 side. it can. As described above, a guide member that can enter the guide groove 22 is provided on the bottom surface of the linear motor, and contacts the guide groove 22 with a small frictional force, for example, by a ball bearing or the like. The sensor stage 25 is a member on which the non-contact type sensor probe 26 is mounted, and has the same configuration as the probe stage 24.

  Further, a non-contact type sensor probe 26 and a probe unit set 30 are disposed near both ends of the gantry 20. In the example of FIGS. 1 and 2, a probe unit set in which a non-contact type sensor probe 26 is arranged on the left side in the drawing, that is, on the −X side end portion, and has a contact type probe on the right side + X side end portion. 30 is arranged. The non-contact type sensor probe 26 and the probe unit set 30 are arranged at both end portions of the gantry 20 so that the respective detection portions are positioned at both ends of the wiring pattern 6 arranged extending in the X direction on the substrate 8. Located nearby. In the example of FIGS. 1 and 2, a single wiring pattern 6 is shown. The probe of the probe unit set 30 is in contact with the right end thereof, and the detection unit of the non-contact type sensor probe 26 is arranged at the left end thereof. Is done.

  As described above, the non-contact type sensor probe 26 is arranged so as to come to the other end of the wiring pattern 6 when the probe of the probe unit set 30 contacts one end of the wiring pattern 6 to be inspected. A child. The detection signal of the non-contact type sensor probe 26 is transmitted to the board evaluation unit 112 through an appropriate signal line.

  For example, when a high frequency signal is supplied from the probe of the probe unit set 30 to the wiring pattern 6, it has a function of detecting the presence or absence of the high frequency signal. In this case, when a high-frequency signal is detected, the wiring pattern 6 is determined to be conductive by the board evaluation unit 112. On the other hand, if a high-frequency signal is not detected, the wiring pattern 6 is non-conductive. It is said. As such a non-contact type sensor probe 26, one having a detection coil can be used.

  In addition, a DC signal can be supplied from the probe of the probe unit set 30 to the wiring pattern 6. In this case, the non-contact sensor probe 26 has a function of detecting the presence or absence of an electric field. Things can be used. For example, a capacitance sensor or the like can be used.

  As a probe for detecting conduction or non-conduction of the wiring pattern 6, a contact type or a non-contact type can be used, but both have advantages and disadvantages. The contact type can reliably supply a signal to the wiring pattern 6 or can reliably obtain a signal from the wiring pattern 6. However, on the other hand, since there is wear due to contact, the probe has a life, and in that case, it is necessary to replace it with a new probe. The non-contact type can be used almost permanently without fear of wear or the like. However, on the other hand, since signals are input and output without contact, there is a possibility of erroneous recognition depending on the shape of the wiring pattern 6. For example, when the wiring pattern is branched or locally short-circuited, there is a higher possibility of erroneous recognition than the contact type. Therefore, it is better to use properly depending on the case. In the example of FIGS. 1 and 2, the contact type probe unit set 30 is used on the signal supply side, and the non-contact type sensor probe 26 is used on the signal detection side.

  The probe unit set 30 is a contact type probe. As described above, since the gantry 20 is movable in the + Y direction and the −Y direction along the Y direction, the probe unit suitable for scanning in the + Y direction and the probe suitable for scanning in the −Y direction. Unit. FIG. 3 shows the probe unit set 30 together with a replacement tray 60 described later. In the following, elements similar to those in FIGS. 1 and 2 are denoted by the same reference numerals, and detailed description thereof is omitted. In the following, description will be made using the reference numerals in FIGS.

  As shown in FIG. 3, the probe unit set 30 includes two probe units 32 and 33. The probe unit 32 is used for scanning in the + Y direction, and the probe unit 33 is used for scanning in the −Y direction. The probe unit 32 and the probe unit 33 are arranged in a line along the Y direction and are symmetrical with respect to the XZ plane. A major difference between these two probe units 32 and 33 is that when arranged as a unit set, the directions of the inclination angles of the respective probes with respect to the XY plane are opposite to each other.

  In FIG. 3, only the needle-like probe 53 of the probe unit 33 is shown in the drawing, but the needle-like probe 53 has an acute angle with respect to the −Y direction in the YZ plane. Although the tip of the probe unit 32 does not appear in FIG. 3, the needle-like probe 52 is shown in FIG. As shown here, the needle probe 52 has an acute inclination angle with the + Y direction in the YZ plane. That is, the probe unit 32 used for scanning in the + Y direction has a needle-like probe 52 having an acute angle with respect to the + Y direction in the YZ plane, and the probe unit 33 used for scanning in the −Y direction is In the YZ plane, the needle-like probe 53 having an acute inclination angle with respect to the −Y direction is provided. The acute inclination angle may be, for example, about +45 degrees to +80 degrees, preferably about +60 degrees.

  Except for the difference in the direction of the inclination angle of the needle-like probe, the probe units 32 and 33 have the same configuration, and therefore, each element will be described below as a representative of the probe unit 32.

  The probe unit 32 detachably holds a probe assembly 50 having a needle-like probe 52 not shown in FIG. 3 and moves it in the Z direction so that the needle-like probe 52 is in an appropriate contact state with the wiring pattern 6. It is a device having a function of making contact with.

  The probe unit 32 includes an attachment portion 34 fixedly attached to the probe stage 24 via an attachment plate 27, a main body portion 36 movable in the Z direction with respect to the attachment portion 34, and air attached and fixed to the main body portion 36. A holder driving unit 38 that is a cylinder, a holder unit 40 that is driven to move in the Z direction by the holder driving unit 38, and supports the upper surface side of the probe assembly 50; A supply flow for supplying driving gas pressure to a support plate 42 that supports the lead plate, a lead screw type motor 44 that is an actuator that moves and drives the main body 36 in the Z direction, and a holder driving unit 38 that is not shown but is an air cylinder. And road.

  The lead screw type motor 44 is a Z-direction actuator that drives the main body portion 36 to move in the Z direction with respect to the attachment portion 34. The main body portion 36 is held so as to be movable in the Z direction with respect to the attachment portion 34, and the lead screw type motor 44 has the drive shaft moving in the Z direction, and the drive shaft is connected to the main body portion 36. The lead screw type motor 44 operates under the control of the control unit 120 via the actuator driving unit 110.

  The holder driving unit 38 is an actuator that is attached to the main body 36 and drives the holder unit 40 to move in the Z direction. Unlike the lead screw motor 44, the holder driving unit 38 does not have a function of moving the probe assembly 50 in the Z direction. Since the bottom surface side of the probe assembly 50 is supported by the support plate 42, the probe assembly 50 moves in the Z direction as the support plate 42 that is a part of the main body 36 moves in the Z direction. On the other hand, the holder portion 40 that is driven to move by the holder driving portion 38 supports the upper surface side of the probe assembly 50, so that the probe assembly 50 is pressed against the support plate 42 by the movement of the holder portion 40. It does not move in the Z direction.

  The holder driving unit 38 can be formed of an air cylinder as described above. That is, a suitable biasing means is used by moving the holder 40 in the −Z direction by projecting the drive shaft in the Z direction by pressurized fluid from a supply channel (not shown) and releasing the pressurized fluid. Thus, the holder part 40 can be moved in the + Z direction. Means such as an electromagnetic plunger can be used instead of the air cylinder. The holder driving unit 38 is also connected to the control unit 120 via the actuator driving unit 110 with an appropriate signal line.

  As described above, since the holder portion 40 is movable with respect to the support plate 42, the support plate 42 and the holder portion 40 have a function of holding the probe assembly 50 in a detachable manner. In that sense, this set can also be called a holder of the probe assembly 50. As described above, the support plate 42 is integral with the main body portion 36, and the holder portion 40 is movable in the Z direction with respect to the main body portion 36. The holder unit 40 is driven to move in the Z direction by a holder driving unit 38 that is an air cylinder. Therefore, when the holder unit 40 moves in the direction in which the probe assembly 50 is pressed against the support plate, that is, in the −Z direction, the holder unit 40 holds the probe assembly 50 fixedly, and in the direction in which the probe assembly 50 is released, that is, in the + Z direction. Makes the probe assembly 50 removable.

  Further, as described above, the support plate 42 is integral with the main body portion 36, and the main body portion 36 is movable in the Z direction with respect to the attachment portion 34. When the probe assembly 50 is firmly held and fixed by the holder portion 40 and the support plate 42, the probe assembly 50 moves in the Z direction by the movement drive of the lead screw type motor 44. That is, the probe unit 32 can move the probe assembly 50 in the Z direction and set the height in the Z direction in a state in which the probe assembly 50 is firmly fixed and held together with the function of holding the probe assembly 50 detachably. It has a function that can.

  Accordingly, the probe assemblies 50 and 51 in the probe unit set 30 are moved and driven in the Y direction by the linear motors at both ends of the gantry 20 and are moved and driven in the X direction by the linear motors of the probe stage 24. The lead screw type motors 44 and 45 are driven to move in the Z direction. Then, the holder driving units 38 and 39 of the probe units 32 and 33 are detachably held with respect to the probe units 32 and 33.

  Returning to FIG. 1 again, the replacement tray 60, the height reference portion 70, the probe imaging camera 80, and the contact position reference portion 90 provided on the main body stage 12 will be described with reference to FIGS. In the following, the same elements as those in FIG. 1, FIG. 2, and the probe unit set in FIG. 3 are denoted by the same reference numerals, and detailed description thereof is omitted.

  The replacement tray 60, the height reference unit 70, the probe imaging camera 80, and the contact position reference unit 90 are used for replacement and calibration related to the probe unit set 30 in addition to the substrate inspection function of the substrate inspection apparatus 10. It is. Therefore, these are arranged on the main body stage 12 outside the region for holding the substrate 8, that is, outside the substrate inspection region. The guide grooves 14 and 16 are disposed on the main body stage 12 at a distance longer than that covering the substrate inspection region so that the gantry 20 can move the probe unit set 30 to the region in which they are disposed. Is done.

  The replacement tray 60 is a tray disposed on the main body stage 12 and an unused probe assembly is disposed. The replacement tray is used when the probe assembly is replaced from the probe unit set 30. It is also a work area. The configuration of the replacement tray 60 is shown on the right side of FIG.

  The replacement tray 60 includes a base part 62, a used probe area 61 in which a used probe assembly 55 can be placed as two areas provided on the base part 62, and an unused part in which an unused probe assembly 57 is placed. And a probe region 63. In both the used probe area 61 and the unused probe area 63, a plurality of mounting tables 64 are arranged. The mounting tables 64 form a set of two that are arranged parallel to the X direction, and a maximum of three probe units can be positioned and mounted by this set of mounting tables 64. Three positioning pins 66 are provided on the mounting table 64 for positioning. Corresponding to this positioning pin 66, a positioning hole is provided on the bottom surface of the probe assembly (see FIG. 17 described later).

  If the above-mentioned set of mounting tables is called a mounting table group, in the example of FIG. 3, two mounting table groups are arranged in parallel in the X direction in the used probe region 61 of the replacement tray 60 and are not used. Two mounting tables are also arranged in the probe region 63 in parallel to the X direction. The two mounting table groups in the unused probe region 63 are arranged coaxially with the two mounting table groups in the used probe region 61 along the X direction. That is, on the extension in the longitudinal direction of the four mounting bases 64 constituting the two mounting bases of the used probe region 61, the four mounting bases 64 constituting the two mounting bases of the unused probe region 63 are It arrange | positions so that a longitudinal direction may correspond.

  The arrangement interval measured along the Y direction of the two mounting table assemblies arranged in parallel to the X direction is the arrangement interval measured along the Y direction of the two probe units 32 and 33 constituting the probe unit set 30. Is set the same as Thus, when the probe unit set 30 is moved to the position of the replacement tray 60, the two probe assemblies 50 and 51 constituting the two probe units 32 and 33 It can be made to come on each mounting table.

  Using such an arrangement, the two probe assemblies 50 and 51 constituting the two probe units 32 and 33 can be automatically exchanged. For automatic replacement, the Y direction moving function of the gantry 20, the X direction moving function of the probe stage 24, the Z direction moving function of the probe units 32, 33, and the probe assembly attaching / detaching function of the holder driving units 38, 39 of the probe units 32, 33 Is used.

Automatic exchange is performed in the following procedure. That is, when it is determined that the probe assemblies 50 and 51 need to be replaced due to wear or the like, the probe unit set 30 is moved to the used probe region 61 of the replacement tray 60 by the Y movement drive of the gantry 20. Then, using the function of the holder driving unit 38, the probe unit set 30 is appropriately moved in the X direction and the Z direction, and the probe assemblies 50 and 51 are detached from the probe units 32 and 33. The removed probe assembly is placed as a used probe assembly 55 on the mounting table set in the used probe region 61.

  Then, the probe unit set 30 from which the probe assembly has been removed moves to an unused probe region 63, where the probe unit set 30 is appropriately moved in the X direction and the Z direction by using the function of the holder driving unit 38 described above. The unused probe assemblies 56 and 57 are attached to the probe units 32 and 33. A more detailed replacement procedure will be described in the description of the function of the maintenance module 124 of the control unit 120.

  Next, the height reference unit 70, the probe imaging camera 80, and the contact position reference unit 90 will be described. These are the positions of the probe assemblies 50 and 51, particularly the positions of the needle-like probes 52 and 53 when the probe assemblies 50 and 51 constituting the probe units 32 and 33 are replaced or used for a long period of time. Has a function to calibrate and bring it into an appropriate state. Since the needle-like probe of the probe unit is related, the probe unit 33 in which the needle-like probe 53 is illustrated in FIG. 3 will be described. Of course, the probe unit 32 has the same contents.

  FIG. 4 is a diagram for explaining how the height of the needle-like probe 53 in the probe unit 33 is calibrated in the height reference unit 70. As described above, the height reference unit 70 is provided outside the substrate inspection region of the main body stage 12 and is used for calibrating the tip height of the needle-like probe 53 of the probe unit 33. The height reference portion 70 includes a height reference plate 74 having a conductor portion on the surface thereof on a table 72. Here, the conductor portion is connected to a predetermined potential such as ground.

  To calibrate the height of the needle probe 53, the following procedure is used. That is, the probe unit 33 is moved above the height reference portion 70 by the Y direction moving function of the gantry 20 and the X direction moving function of the probe stage 24. Then, the needle-shaped probe 53 is lowered in a predetermined minute step toward the −Z direction by the Z-direction moving function of the lead screw type motor 45 of the probe unit 33. When the distal end portion of the needle-like probe 53 comes into contact with the conductor portion, the board evaluation unit 112 detects that the needle-like probe 53 is in electrical contact with the conductor portion. The height position in the Z direction when the electrical contact between the needle probe 53 and the conductor portion of the height reference plate 74 is detected, that is, the step position of the lead screw motor 45 is the contact reference of the probe unit 33. Set as height. With this setting, the height of the needle probe 53 is calibrated. For example, if the height position is different by ΔZ compared to before the calibration, the contact height position is changed using ΔZ as a calibration value.

  FIG. 5 is a diagram for explaining how the X-direction position of the needle-like probe 53 in the probe unit 33 is calibrated in the probe imaging camera 80. The probe imaging camera 80 is provided outside the substrate inspection area of the main body stage 12 as described above, and is used to calibrate the tip position of the needle-like probe 53 of the probe unit 33, particularly the X direction position. The probe imaging camera 80 is provided on the main body stage 12 and is arranged so that the imaging direction is upward and the needle-like probe 53 is imaged from below.

FIG. 6 is a diagram illustrating an example of a captured image 82 of the probe imaging camera 80. An image 84 indicated by a broken line at the center of the captured image 82 is an image showing when the needle-like probe 53 is in a standard state. By obtaining the difference between the image 86 actually captured and the image 84 in the standard state, the positional deviation of the needle-like probe 53 can be calibrated. In the example of FIG. 6, it can be seen that the needle-like probe 53 is shifted by ΔX in the X direction and by ΔY in the Y direction as compared with the standard state. Note that before performing the displacement calibration by the probe imaging camera 80, it is necessary to perform the height calibration described with reference to FIG. 4 and perform the displacement calibration at the contact reference height.

  The probe imaging camera 80 can obtain the X-direction positional deviation ΔX and the Y-direction positional deviation ΔY of the needle-like probe 53, but the Y-direction positional deviation is a positional deviation along the inclination direction of the needle-like probe 53. The captured image 82 obtained by imaging the XY plane is not accurate. Therefore, the positional deviation in the Y direction of the needle probe 53, that is, the direction along the scanning direction when the probe unit set 30 performs the substrate inspection is accurately calibrated using the contact position reference unit 90.

  FIG. 7 is a diagram for explaining how the Y-direction position of the needle-like probe 53 in the probe unit 33 is calibrated in the contact position reference unit 90. FIG. 8 is a diagram for explaining the principle. As described above, the contact position reference unit 90 is provided outside the substrate inspection region of the main body stage 12 and is used for calibrating the position of the tip of the needle probe 53 of the probe unit 33, particularly in the Y direction. It is. The contact position reference unit 90 has a contact position reference plate 94 mounted on a table 92. The contact position reference plate 94 is provided with a conductor pattern portion 96 extending in a direction orthogonal to the direction of inclination of the needle probe 53, that is, the Y direction which is also the scanning direction of the probe unit 33. Here, the conductor pattern portion 96 is connected to a predetermined potential such as ground. Note that the surface height of the contact position reference plate 94 has a height difference as a parameter with respect to the surface height of the height reference portion 70 described in FIG. The height relationship is maintained.

  In order to calibrate the Y-direction position of the needle probe 53, the following procedure is used. It is preferable to first perform the height calibration described with reference to FIG. 4 and then perform the X-direction displacement calibration described with reference to FIG. Thereafter, the gantry 20 is driven to move, and the probe unit 33 is moved in the Y direction which is the scanning direction of the substrate inspection. When the tip of the needle-like probe 53 intersects and contacts the conductor pattern portion 96, the board evaluation unit 112 detects that the needle-like probe 53 is in electrical contact with the conductor pattern portion 96. The Y-direction position at that time, that is, the step position of the linear motor of the gantry 20 is set as the contact reference position of the probe unit 33. With this setting, the position of the needle probe 53 in the Y direction is accurately calibrated.

  FIG. 8 is a diagram illustrating a state where the needle-like probe 53 moves in the arrow direction and contacts the conductor pattern portion 96. When attention is paid to the contact portion 98, since the needle-like probe 53 has an inclination angle θ, the tip position in the Y direction when the needle-like probe 53 is viewed from below, and the tip position actually in contact with the conductor pattern portion 96, It can be seen that there is a difference in position in the Y direction. The tip position in the Y direction when the needle-like probe 53 is viewed from below is the tip position in the Y direction described with reference to FIG. Therefore, by using the contact position reference portion 90, the tip position when contacting the wiring pattern 6 when scanning in the Y direction can be accurately detected in the substrate inspection of the needle-like probe 53 having an inclination angle. As described above, the tilt angle θ is an angle formed by the scanning direction in the substrate inspection and the needle probe 53, and is set to an acute angle. Specifically, the tilt angle θ is preferably about +45 degrees to +80 degrees. Is preferably about +60 degrees.

  Thus, by using the height reference part 70, the probe imaging camera 80, and the contact position reference part 90, the Z-direction positions of the needle-like probes 52 and 53 of the probe units 32 and 33 constituting the probe unit set 30, X The direction position and the Y direction position can be detected accurately. Thereby, for example, when the probe units 32 and 33 are replaced or after long-term use, the deviation of the positions of the needle-like probes 52 and 53 from the standard state can be obtained, and calibration with respect to the standard state can be performed. .

  In the substrate inspection, the contact state between the needle-like probe and the substrate may change due to the undulation of the substrate. A gap sensor can be used to cause the tip position of the needle probe to follow the undulation of the substrate. In the following, elements similar to those in FIGS. 1 to 8 are denoted by the same reference numerals, and detailed description thereof is omitted. FIGS. 9 and 10 are diagrams illustrating an example in which the gap sensor unit 100 is disposed in the vicinity of the tip of the needle-like probe 53 of the probe unit 33. The gap sensor unit 100 includes an attachment portion 102 that is integrally fixed to the main body portion 36 of the probe unit 33 and a gap sensor 104.

  The gap sensor 104 is a sensor that detects an interval between the detection unit and the substrate 8. For example, a capacitive distance sensor, an optical distance sensor that uses light reflection, and an ultrasonic wave that uses ultrasonic reflection. A sonic distance sensor or the like can be used. The detection data ΔG of the gap sensor 104 is transmitted to the control unit 120 through an appropriate signal line, and is compared with a predetermined reference interval. Then, a command is issued to the lead screw motor 45 of the probe unit 33 so that ΔG follows the reference interval. As a result, the tip of the needle probe 53 follows the undulation of the substrate 8 while the probe unit 33 is scanning the substrate inspection, and the contact state between the needle probe 53 and the substrate 8 is maintained in an appropriate state. Become.

  Returning to FIG. 1 again, the actuator driving unit 110, the board evaluation unit 112, and the control unit 120 will be described. Below, it demonstrates using the code | symbol until now.

  The actuator drive unit 110 is a device that generates drive signals and the like for the linear motor of the gantry 20, the linear motor of the probe stage 24, the lead screw type motors 44 and 45 of the probe units 32 and 33, and the holder drive units 38 and 39. Specifically, it is configured by a motor drive circuit, an air cylinder control valve drive circuit, and the like. The actuator driver 110 operates under the control of the controller 120.

  The board evaluation unit 112 is a measuring device having a function of evaluating the conduction / non-conduction of the wiring pattern 6 being inspected based on the state data of the non-contact sensor probe 26 and the state data of the probe unit set 30. . For example, in the above example, a high frequency signal is supplied from the probe unit set 30 to one end side of the wiring pattern 6, and the presence or absence of the high frequency signal is detected by the non-contact sensor probe 26 on the other end side of the wiring pattern 6. When the high-frequency signal is detected, the wiring pattern 6 is evaluated as being in a conductive state. When the high-frequency signal is not detected, the wiring pattern 6 is evaluated as having a defect such as a disconnection and being in a non-conductive state. To do.

  Further, in the calibration based on the height described with reference to FIG. 4, the board evaluation unit 112 supplies an appropriate voltage to the needle probe 53 of the probe unit 33, detects the current flowing through the needle probe 53, and Has a function of determining conduction or non-conduction between the probe 53 and the conductor of the height reference portion 70. 7 also supplies an appropriate voltage to the needle-like probe 53 of the probe unit 33, detects the current flowing through the needle-like probe 53, and contacts with the needle-like probe 53. It has a function of determining conduction or non-conduction between the reference portion 90 and the conductor pattern portion 96. The board evaluation unit 112 is connected to the control unit 120 through an appropriate signal line and operates under the control of the control unit 120. For example, the control unit 120 operates in conjunction with a command to the actuator driving unit 110.

  The control unit 120 includes a board inspection module 122 and a maintenance module 124. The board inspection module 122 moves the gantry 20 continuously in the Y direction, and extends to the X direction on the board 8 so as to be arranged at both ends of the wiring patterns 6 and the non-contact sensor unit 26 and the probe unit set 30 respectively. Are arranged and scanned in the Y direction, and based on these detection results and the like, there is a function of inspecting the conduction and non-conduction of each wiring pattern 6. Also, the maintenance module 124 maintains the gap between the gap sensor 104 and the substrate 8 at the reference interval so that the tips of the needle-like probes 52 and 53 follow the undulation of the substrate 8 using the gap sensor unit 100 in the substrate inspection. A function, a function of exchanging the probe assemblies 50 and 51 at a necessary time, a function of calibrating the height and position of the needle-like probes 52 and 53, and the like.

  The control unit 120 can be configured by a computer, and the above functions can be realized by executing software. Specifically, it can be realized by executing a board inspection program and a maintenance program. Some of these functions may be realized by hardware.

  The operation of this configuration, in particular, the function of the control unit 120 will be described in detail with reference to FIGS. Below, it demonstrates using the code | symbol of FIGS. 1-10. FIG. 11 is a flowchart showing a procedure related to substrate inspection, and FIG. 12 is a conceptual diagram for explaining a state of substrate inspection. FIG. 13 is a diagram illustrating an example of bidirectional scanning. FIG. 14 is a flowchart showing a procedure related to maintenance, and FIGS. 15 to 19 are diagrams for explaining a procedure for replacing the probe assembly. First, explanation about substrate inspection will be given, and then explanation concerning maintenance will be given.

  FIG. 11 is a flowchart showing the procedure related to the substrate inspection as described above, and the content of each procedure corresponds to the content of each processing procedure of the substrate inspection program. In order to perform the substrate inspection, first, the substrate 8 to be inspected is carried into a predetermined substrate inspection region of the main body stage 12 of the substrate inspection apparatus 10 (S10). Then, using the gap sensor unit 100, the gap between the gap sensor 104 and the substrate 8 is automatically adjusted (S12), and control is performed so that the tip portions of the needle-like probes 52 and 53 follow the undulation of the substrate 8. Accordingly, it is not necessary to set the contact pressure of the needle-like probes 52 and 53 excessively in consideration of the undulation of the substrate 8, etc., and the wear of the needle-like probes 52 and 53 due to the excessive contact pressure is suppressed, and the life thereof is extended. be able to.

  Next, the gantry 20 is scanned in one direction to perform substrate inspection (S14). The unidirectional scan is distinguished from the reverse scan by scanning in either the + Y direction or the −Y direction. This distinction is because the probe unit set 30 is composed of two probe units 32 and 33 having needle-like probes 52 and 53 having different inclination angles. That is, as described with reference to FIG. 8, the inclination angle θ of the needle-shaped probe with respect to the scanning direction is preferably an acute angle. From this viewpoint, the probe unit 32 is used for scanning in the + Y direction, and the scanning in the −Y direction is performed. The probe unit 33 is preferably used.

  In this way, by preparing the two probe units 32 and 33 having different inclination angles, the probe direction used for one-way scanning is distinguished from the probe unit used for other-direction scanning, with the scanning direction being bidirectional. be able to. For example, in the inspection of the first substrate 8, the probe unit 32 is used as scanning in the + Y direction, and at this time, the probe unit 33 is moved in the + Z direction so as not to contact the substrate 8. In the next inspection of the substrate 8, the probe unit 33 is used for scanning in the −Y direction. At this time, the probe unit 32 is moved in the + Z direction so as not to contact the substrate 8. Therefore, since the probe units 32 and 33 can be used alternately in the inspection of the substrate 8, the wear of the needle-like probe can be reduced, its life can be extended, and the replacement frequency of the probe assembly can be reduced.

  FIG. 12 is a diagram showing how the probe unit 32 is used in + Y direction scanning. Here, the probe unit 32 comes into contact with one end of the wiring pattern 6, a high frequency signal is applied from the board evaluation unit 112, and the presence or absence of the high frequency signal is detected by the non-contact type sensor probe 26 disposed at the other end of the wiring pattern 6. A state in which the result is detected and transmitted to the board evaluation unit 112 is shown.

  Returning to FIG. 11 again, when the one-way scanning inspection is completed, the substrate 8 is unloaded from the substrate inspection apparatus 10 (S16). Then, it is determined whether or not there is a substrate 8 to be inspected (S18). If there is a next substrate 8, substrate loading (S20) and automatic gap adjustment (S22) are performed. These steps are the same as those described in S10 and S12. As described above, the substrate inspection is performed by scanning in the direction opposite to S14, that is, scanning in the other direction (S24). Thereafter, the substrate is carried out with the same contents as in S16 (S26), and it is determined again whether there is a next substrate (S28). When there is a next substrate, the process returns to S10, and through S12, the substrate is inspected by unidirectional scanning with the scanning direction reversed, and the above-described processing is repeated.

  The bidirectional scanning inspection is particularly effective when there are a plurality of inspection target blocks on the substrate 8. FIG. 13 is a diagram for explaining a substrate inspection state when a single substrate 8 has a total of four inspection target blocks of 2 rows and 2 columns. Such an example is a case where a plurality of liquid crystal panels 9 are taken using a substrate 8 called mother glass. In the example of FIG. 13, among the total of four liquid crystal panels in the left and right rows, first, the probe unit set 30 and the non-contact type are inspected on the gantry 20 so as to inspect the wiring pattern 6 of the liquid crystal panel 9 in the right column. The X direction position of the sensor probe 26 is set. Then, the gantry 20 moves in the + Y direction from the lowest position of the substrate to the upper position in FIG. 13, and inspects the conduction / non-conduction of the respective wiring patterns 6 for the two liquid crystal panels 9 in the right column. To do. This inspection corresponds to a one-way scanning inspection.

  When the gantry 20 reaches the uppermost position of the substrate 8 in FIG. 13 and the inspection of all the wiring patterns 6 for the right liquid crystal panel 9 is completed, the probe unit set 30 and the non-contact sensor probe 26 are in the −X direction at that position. Moved to. Then, the wiring pattern 6 of the liquid crystal panel 9 in the left column is set to a position to be inspected. Then, the gantry 20 moves in the −Y direction from the uppermost position of the substrate in FIG. 13 to the lower position, and the conductive patterns of the two liquid crystal panels 9 in the left column are turned on and off. inspect. This inspection corresponds to the inspection in the other direction scanning. Thus, after the bidirectional scanning inspection is performed on one substrate 8, the substrate 8 is unloaded.

  Next, a procedure related to maintenance will be described. FIG. 14 is a flowchart showing a procedure related to maintenance as described above, and the contents of each procedure correspond to the contents of each processing procedure of the maintenance program. Maintenance is performed when the substrate inspection is repeatedly performed on a plurality of substrates and the state of the needle probes 52 and 53 changes. As the standard, the number of inspected substrates, the inspection time, and the like can be used, but in order to relate to the wear of the contact type probe, it is preferable to use the accumulated contact distance, that is, the travel distance.

Therefore, first, the counter is set to n = 1 (S30). This counter is incremented each time the board inspection advances and reaches a predetermined travel distance L ₁ in advance. When the substrate inspection (S32) is made, whether the travel distance has exceeded the reference value n × L ₁ a predetermined or not (S34). The contents of the substrate inspection in S32 are the procedure described in FIG. The reference value n × L ₁ is set mainly in consideration of the temporal change in the positional relationship in the probe unit set 30. Further, it can be set empirically or experimentally in consideration of the material, shape, contact pressure, scanning speed in substrate inspection, etc. of the needle-like probes 52, 53. The determination in S34 can be referred to as the first travel distance determination, in distinction from the determination in S40 described later.

  If the determination is affirmed in S34, the height adjustment and position adjustment of the needle-like probes 52, 53 are performed (S36, S38). The height adjustment has the contents described in FIG. 4, and the position adjustment has the contents described in FIGS. As described above, these processes are automatically performed by the functions of the gantry 20, the probe stage 24, the lead screw type motors 44 and 45, the actuator driving unit 110, and the board evaluation unit 112 under the control of the control unit 120. To be executed.

Thus, it is possible to calibrate that the tip state of the needle-like probes 52 and 53 has changed from the initial standard state when the travel distance exceeds L _1, and to return to a state close to the initial state. Thereby, it is possible to suppress the progress of wear and the like while the needle-like probes 52 and 53 are in an inappropriate state, and the life thereof can be extended.

After S36 and S38 are performed, the counter is incremented by one. That is, the current count number n is replaced with n + 1 (S31). Then, the travel distance is whether exceeds the reference value L ₂ is determined (S40). Reference value L ₂ is a larger value than the reference value L ₁ in S34. The reference value L ₁ is set based on the necessity of maintenance based on the change in height and position because the needle-like probes 52 and 53 are worn and do not need to be replaced. Set to On the other hand, the reference value L ₂ is set based on the necessity of maintenance based on the fact that the wear of the needle-like probes 52 and 53 progresses and cannot be dealt with by the readjustment of the height and position. Set to deal with wear.

Therefore, when n is small, the determination of S40 is normally denied, and the process returns to S32 and the substrate inspection (S32) is repeated. Then, again traveling distance from back to S32 is Taka whether or not more than L _1. For example, when n = 2, it is determined whether or not the cumulative travel distance is 2L ₁ . In general terms, it is determined whether or not the cumulative travel distance has exceeded n × L ₁ (S34). If the determination in S34 is affirmative, height adjustment (S36) and position adjustment (S38) are performed again as described above. As described above, the substrate inspection (S32), the first travel distance determination (S34), the height adjustment (S36), and the position adjustment (S38) are repeated as many times as necessary until the determination is affirmed in S40.

  If the determination is affirmative in S40, the probe assembly is replaced (S42). A detailed procedure for replacing the probe assembly will be described with reference to FIGS. 15 to 19. These drawings are views showing states in each procedure when the probe assembly is replaced in the probe unit 33, and only a portion of the probe assembly is extracted and shown.

  FIG. 15 is a diagram showing a state of the substrate inspection stage. Here, a state is shown in which the needle-like probe 53 comes into contact with the wiring pattern 6 on the substrate 8 at an inclination angle θ and is scanned in the −Y direction that is an arrow direction. In this state, the probe assembly 51 is firmly held by the main body portion 37 of the probe unit 33 by the support plate 43 and the holder portion 41.

FIG. 16 is a diagram illustrating a state in which the probe assembly 51 is lifted upward, that is, in a direction away from the main body stage 12 in order to replace the probe assembly. This process is executed by the main body portion 37 being driven to move in the + Z direction by the function of the lead screw type motor 45 of the probe unit 33.

  Next, the probe unit 33 is moved to the position of the replacement tray 60. Specifically, the probe unit 33 is moved above the used probe region 61 of the replacement tray 60 by moving the gantry 20 in the Y direction and moving the probe stage 24 in the X direction. Since this process temporarily moves the probe unit 33 to the replacement tray 60, it can be referred to as a tray forward path movement process. FIG. 17 is a diagram illustrating a state after the movement. Here, a positioning hole 58 provided on the bottom surface of the probe assembly 51 is shown as corresponding to the positioning pin 66 of the mounting table 64 of the replacement tray 60.

Next, the probe unit 33 is lowered and the probe assembly 51 is placed on the mounting table 64 of the replacement tray 60. At this time, the positioning pin 66 and the positioning hole 58 are just aligned. This is shown in FIG. Wherein the -Z direction arrows, by the function of the lead screw motor 45 of the probe unit 33, the body portion 37 - indicates that the move driven in the Z direction.

  Here, the holder portion 41 is moved upward, that is, in a direction away from the upper surface of the probe assembly 51. This function is executed when the holder drive unit 39 of the probe unit 33 moves and drives the holder unit 41 in the + Z direction. In FIG. 18, this is shown by an arrow in the + Z direction. As a result, the probe assembly 51 is released from the probe unit 33. The process so far includes the removal of the probe assembly 51 and can be referred to as a probe assembly removal process.

  Then, by moving the probe stage 24 in the + X direction and completely separating the support plate 43 from the probe assembly 51, the probe assembly 51 is left in the used probe region 61 of the replacement tray 60, while the probe The unit 33 is in a state where the probe assembly is not mounted. Then, the probe unit 33 is pulled upward in a state where the support plate 43 does not interfere with the probe assembly left in the used probe region. This state is shown in FIG. In this manner, the probe assembly is removed from the probe unit 33 and placed in the used probe area of the replacement tray 60 as a used probe assembly.

  Thus, in order to attach a new unused probe unit to the probe unit 33 from which the probe assembly has been removed, the probe unit 33 is moved to the unused probe region 63 of the replacement tray 60, and the above steps are reversed. Go back.

  That is, first, the probe stage 24 is moved in the −X direction, and the probe unit 33 is moved above the unused probe region 63 of the replacement tray 60. Since this step includes moving the probe unit 33 inside the replacement tray 60, it can be referred to as an in-tray moving step. The state after the movement is the same as the state where the probe assembly 51 is replaced with an unused probe assembly 57 in FIG. At this time, the support plate 43 of the probe unit 33 is set to a position that does not interfere with the unused probe assembly 57 arranged in the unused probe region 63.

  Then, the probe unit 33 is moved downward, that is, in the −Z direction, and further moved in the −Z direction, so that the support plate 43 is disposed on the bottom surface of the unused probe assembly 57. The state is similar to the state in which the probe assembly 51 is replaced with an unused probe assembly 57 in FIG.

  And the holder part 41 is moved to -Z direction in the state which has arrange | positioned the support plate 43 to the bottom face of an unused probe unit. Thereby, an unused probe assembly is firmly held by the probe unit 33. Then, the probe unit 33 is pulled upward, that is, in the + Z direction. The process so far includes attaching an unused probe assembly and can be referred to as a probe assembly attaching process. The state is exactly the same as the state where the probe assembly 51 is replaced with an unused probe assembly 57 in FIG. In this way, the unused probe assembly 57 is attached to the probe unit 33, and the replacement of the probe assembly is completed.

Returning to FIG. 14 again, when the replacement of the probe assembly is completed, the probe unit 33 is moved to a position such as the height reference portion 70, and the height adjustment and position adjustment of the needle-like probes 52 and 53 are performed (S36, S38). ). Since the contents of these steps are the same as those performed when the travel distance exceeds L ₁ , detailed description is omitted. By performing these processes, the height and position of the newly replaced probe assembly are calibrated to the standard state. These processes are also automatically executed under the control of the control unit 120.

  When the height adjustment and the position adjustment are completed, the probe unit 33 is moved above the substrate 8 by the X-direction movement drive of the probe stage 24 and the Y-direction movement drive of the gantry 20. This processing is intended to return the probe unit 33 from the outside of the board inspection area such as the replacement tray 60 and the height reference portion 70 to the board inspection area. This can be called a movement process. Thereafter, the process returns to S30 and the counter is reset to n = 1. That is, here, it has returned to a new inspection state. Then, the substrate inspection (S32) is started again, and the above processing is repeated as necessary. In this way, maintenance is automatically performed under the control of the control unit 120.

It is a top view which shows the structure of the board | substrate inspection apparatus in embodiment which concerns on this invention. It is a detailed perspective view of the periphery of the gantry in the embodiment according to the present invention. In embodiment which concerns on this invention, it is a figure which shows a probe unit set and the tray for replacement | exchange. It is a figure explaining the mode of calibration in the height reference | standard part of embodiment which concerns on this invention. It is a figure explaining the mode of calibration of the X direction position about a needle-like probe in the probe imaging camera of an embodiment concerning the present invention. In embodiment which concerns on this invention, it is a figure which shows the example of the captured image of a probe imaging camera. It is a figure explaining the mode of calibration of a Y direction position about a needle-like probe in a contact position reference part of an embodiment concerning the present invention. It is a principle explanatory view of FIG. In embodiment which concerns on this invention, it is a perspective view which shows the example which arrange | positions a gap sensor unit adjacent to the front-end | tip of the needle-like probe of a probe unit. FIG. 10 is a side view corresponding to FIG. 9. 4 is a flowchart showing a procedure related to substrate inspection in the embodiment of the present invention. In embodiment which concerns on this invention, it is a conceptual diagram explaining the mode of a board | substrate test | inspection. In an embodiment concerning the present invention, it is a figure explaining an example of bidirectional scanning. 5 is a flowchart showing a procedure related to maintenance in the embodiment according to the present invention. In embodiment which concerns on this invention, in order to demonstrate the replacement | exchange procedure of a probe assembly, it is a figure which shows the state at the time of a board | substrate test | inspection. In embodiment which concerns on this invention, in order to demonstrate the replacement | exchange procedure of a probe assembly, it is a figure which shows a mode that a probe unit is pulled up above a board | substrate. In an embodiment concerning the present invention, in order to explain the exchange procedure of a probe assembly, it is a figure showing the state where the probe unit was moved above the exchange tray. In embodiment which concerns on this invention, in order to demonstrate the replacement | exchange procedure of a probe assembly, it is a figure explaining a mode that a probe assembly is removed. In embodiment which concerns on this invention, it is a figure which shows a mode that the probe assembly was removed in order to demonstrate the replacement | exchange procedure of a probe assembly.

Explanation of symbols

  6 Wiring pattern, 8 Substrate, 9 Liquid crystal panel, 10 Substrate inspection device, 12 Main body stage, 14, 16, 22, 23 Guide groove, 20 Gantry, 24 Probe stage, 25 Sensor stage, 27 Mounting plate, 26 Non-contact type sensor Probe, 30 Probe unit set, 32, 33 Probe unit, 34, 102 Mounting part, 36, 37 Body part, 38, 39 Holder drive part, 40, 41 Holder part, 42, 43 Support plate, 44, 45 Lead screw type Motor, 50, 51, 55, 56, 57 Probe assembly, 52, 53 Needle-shaped probe, 58 Positioning hole, 60 Replacement tray, 61 Used probe area, 62 base part, 63 Unused probe area, 64 mounting table, 66 Positioning pin, 70 Height reference part, 72, 92 units, 74 Reference plate, 80 Probe imaging camera, 82 Captured image, 84, 86 image, 90 Contact position reference part, 94 Contact position reference plate, 96 Conductor pattern part, 98 Contact part, 100 Gap sensor unit, 104 Gap sensor, 110 Actuator Drive unit, 112 substrate evaluation unit, 120 control unit, 122 substrate inspection module, 124 maintenance module.

Claims (4)

A substrate inspection apparatus for inspecting conduction or non-conduction of a pattern provided on a substrate using a probe,
A probe assembly having a contact probe at the tip;
A probe unit for detachably holding the probe assembly;
An actuator for moving and driving the probe unit to an arbitrary three-dimensional position;
A replacement tray having an unused probe area for placing an unused probe assembly and a used probe area for placing a used probe assembly;
A plate for calibrating the tip height of the contact probe of the probe unit, the height reference plate having a conductor portion on the surface;
A control unit;
With
The contact-type probe is a tilt probe having a predetermined tilt angle with respect to the substrate surface along a scanning direction when continuously inspecting and inspecting a plurality of patterns provided on the substrate, ,
An imaging means for imaging the tip shape of the contact type probe of the probe unit;
A plate for correcting the contact position of the tip of the contact probe, the contact position reference plate having a conductor pattern portion arranged extending in a direction orthogonal to the scanning direction of the contact probe;
With
The control unit
Tray forward movement processing means for moving the probe unit to the used probe area of the replacement tray for replacement with respect to the actuator,
Removal processing means for removing the probe assembly from the probe unit and placing it in the used probe area of the replacement tray;
Intra-tray movement processing means for moving the probe unit from which the probe assembly has been removed to an unused probe area of the replacement tray for the actuator,
An attachment processing means for attaching and holding an unused probe assembly arranged in an unused probe area of the replacement tray with respect to the probe unit;
Height calibration movement processing means for moving the tip of the contact probe of the replaced probe unit with the probe assembly replaced with respect to the actuator toward the conductor portion of the height reference plate;
Height calibration means for detecting electrical contact between the contact probe and the conductor, and setting the height position of the actuator at that time as the contact reference height of the probe unit;
Tray return path processing means for returning the probe unit whose height has been calibrated to the original inspection position for the actuator,
Height setting processing means for setting the height position to the contact reference height of the probe unit for the actuator,
The scanning direction of the contact type probe of the probe unit based on the comparison between the position of the tip shape of the contact type probe of the probe unit imaged by the imaging unit and the predetermined reference position in the state where the height setting process has been performed Tip position displacement calibration means for calibrating the displacement of the tip position in the direction perpendicular to
Tip calibration movement processing for moving the tip of the contact type probe of the probe unit in a direction orthogonal to the extending direction of the conductor pattern of the contact position reference plate in a state where tip position deviation calibration is performed on the actuator;
Contact position calibration means for detecting electrical contact between the contact probe and the conductor pattern, and setting a position along the scanning direction of the actuator at that time as a contact reference position of the probe unit;
A board inspection apparatus comprising: The board inspection apparatus according to claim 1,
The probe unit
The main body,
A holder part that is movable while supporting the upper surface side of the probe assembly with respect to the main body part, moves in a direction in which the probe assembly is pressed against the main body part, holds the probe assembly fixed, and releases the probe assembly from the main body part. A holder part that moves in the direction to make the probe assembly removable; and
A board inspection apparatus comprising: The board inspection apparatus according to claim 1 ,
The probe unit
A first probe assembly including a contact-type probe having a predetermined inclination angle with respect to the substrate surface along a first scanning direction when inspecting by continuously scanning and inspecting a plurality of patterns provided on the substrate; ,
A second probe assembly including a contact probe having a predetermined tilt angle with respect to the substrate surface along a second scanning direction which is a scanning direction opposite to the first scanning direction;
A board inspection apparatus comprising: The board inspection apparatus according to claim 1,
A gap sensor that is disposed in proximity to the tip of the contact probe of the probe unit and detects a distance between the tip of the contact probe and the surface of the substrate to be inspected;
The control unit
A substrate inspection apparatus, comprising: a height follow-up processing unit that causes the actuator to follow the reference position of the height position of the probe unit according to a detection result of the gap sensor.

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