JP5491219B2 - Light source device, backlight unit, and liquid crystal display device - Google Patents

Description

  The present invention relates to a light source device using a semiconductor light emitting element as a light source, a backlight unit including the light source device, and a liquid crystal display device including the backlight unit, and in particular, a plurality of semiconductor light emitting elements on a long substrate. The present invention relates to a technique for mounting a light emitting module formed by mounting a plurality of lines on a heat sink.

In recent years, LED modules (light emitting modules) in which semiconductor light emitting elements such as LED (Light Emitting Diode) chips are mounted on a mounting substrate are used as light source devices (light emitting units) used by being mounted on various lighting devices. However, it has come to be used as alternative lighting for direct-type and straight-tube fluorescent lamps.
Further, in a liquid crystal display device such as a liquid crystal television or a liquid crystal display, a light source device using an LED module is also used as a linear light source of a backlight unit that irradiates light on the back surface of the liquid crystal panel.

As a backlight unit of a liquid crystal display device, light is emitted from a linear light source device to the side surface of the light guide plate, and light that has entered the inside through the side surface of the light guide plate is reflected on the front and back surfaces facing each other. An edge light system is known in which a liquid crystal panel is emitted from the surface of a light guide plate while being reflected and propagated.
In recent years, a light emitting module in which a plurality of LEDs are arranged on a long substrate has been used as a light source device of an edge light type backlight unit. The light emitting module is generally used by being attached to a heat sink in order to suppress a temperature rise during light emission, and the attachment is performed by screwing with a screw (Patent Document 1).

JP 2007-109404 A

However, when the light emitting module is screwed to the heat sink, if the temperature of the light emitting module rises due to the heat generated from the light emitting element and the light emitting module expands, the light emitting module is fixed with screws. There is a risk of inviting.
Furthermore, the board of the light emitting module needs a screw hole for screwing, and by providing the screw hole, there is a place where the semiconductor light emitting element cannot be mounted on the board. Occurs. In addition, there is a portion where light generated from the light emitting element of the light emitting module is blocked by a screw thread to cause a shadow, which also causes uneven luminance in the light source device.

  In light of the above-described problems, the present invention provides a light source device that is less likely to be deformed or damaged due to thermal stress and is less likely to cause uneven brightness, a backlight unit including the light source device, and the backlight unit. It aims at providing the liquid crystal display device provided with.

  In order to achieve the above object, a light source device according to one aspect of the present invention has a light emitting module having a configuration in which a plurality of semiconductor light emitting elements are arranged on one main surface of a long substrate, and a long shape. A heat conducting member disposed so as to face the other main surface of the substrate in a state where the longitudinal direction thereof is aligned with the longitudinal direction of the substrate, and from one side to the other side in the short direction of the heat conducting member And an enclosing member that is stretched across the main surface of the substrate in a tension state and presses the substrate of the light emitting module toward the heat conducting member by the tension force.

Moreover, the backlight unit which concerns on another side surface of this invention is provided with the said light source device.
Furthermore, a liquid crystal display device according to another aspect of the present invention includes the backlight unit, a liquid crystal panel irradiated with light from the backlight unit, a video signal applied to the liquid crystal panel, and the application timing. And a controller that turns on the light source while switching the light source.

With the above configuration, the light emitting module can be pressure-bonded onto the heat conducting member while allowing a slight displacement in the longitudinal direction of the light emitting module.
Furthermore, the surrounding member may be a contraction tube contracted in the radial direction due to an external factor.
Thereby, there is an effect that handling of the surrounding member is easy and workability is good.

The external factor may be heat.
Thereby, a light emitting module can be crimped | bonded on a heat conductive member by the easy means of a heating.
Here, the light emitting module has a configuration in which the semiconductor light emitting element is sealed with a sealing member, and the sealing member may include a phosphor.

Thereby, for example, white light can be obtained by converting blue light emitted from the semiconductor light emitting element.
Furthermore, the surrounding member may be spanned across a portion of the main surface of the substrate where the sealing member does not exist.
Thereby, the light emitted from the light emitting module is emitted from the light source device without being blocked by the surrounding member, and the light can be used effectively.

Further, the surrounding member may have translucency.
Thereby, even when the surrounding member covers the light emitting surface of the light emitting module, since the light emitted from the light emitting module is emitted through the surrounding member, the occurrence of uneven brightness can be suppressed.
In addition, the heat conducting member is formed in the short direction on the main surface facing the substrate and communicates with the through hole and the main surface through the through hole communicating from one side to the other side in the short direction. The through hole has a facing surface that faces the main surface and is parallel to the main surface, and is surrounded by the facing surface, the slit, and the main surface of the heat conducting member. The portion and the end portion in the longitudinal direction of the light emitting module may be included in the tube and integrally restricted by the tension applied by the contraction.

As a result, when the heat conducting member and the light emitting module are integrally restrained by the surrounding member, a separate member is not required, which can contribute to cost reduction.
Here, the light emitting module and the heat conducting member may be accommodated inside the outer member substantially in the longitudinal direction.
Thereby, the operation | work which inserts a light emitting module and a heat conductive member integrally in the inside of an enclosure member can be performed easily, and the process of forming a through-hole and a slit in a heat conductive member can be skipped.

Here, a locking claw may be provided on one side and the other side of the heat conducting member, and both ends of the surrounding member may be locked by the locking claw.
Thereby, the operation | work which spans an enclosure member from the one side to the other side of a heat conductive member can be performed easily.
Furthermore, the surrounding member may change a wavelength of light emitted from the semiconductor light emitting element.

Thereby, the light color of the light emitted from the light emitting module by the surrounding member can be changed.
The surrounding member may include a phosphor that emits light of a different wavelength when excited by a part of the light emitted from the semiconductor light emitting element at least in a portion covering the semiconductor light emitting element.

Thereby, the process of providing the sealing member in the light emitting module can be omitted.
Furthermore, the surrounding member may include a light passage opening in a portion covering a portion where the semiconductor light emitting element does not exist on the upper surface of the light emitting module.
Thereby, the luminance unevenness of the light source device can be reduced.
Here, the surrounding member may include a heat radiating opening in a portion covering the heat conducting member.

Thereby, the heat dissipation from a heat conductive member can be improved and the temperature rise of the light emitting module by the heat | fever from a semiconductor light emitting element can be suppressed.
Here, the surrounding member may be a heat-shrinkable coil contracted in the radial direction.
Thereby, the area where the light emitting module and the heat conducting member are covered with the surrounding member can be reduced, heat dissipation can be improved, and the temperature rise of the light emitting module due to the heat from the semiconductor light emitting element can be suppressed.

  Further, the present invention can be a backlight unit or a liquid crystal display device using a light source device having the above-described characteristics. Even in this case, the same effect as described above can be obtained.

The disassembled perspective view which shows schematic structure of the backlight unit provided with the light emission unit which is a light source device which concerns on each embodiment and each modification of this invention. It is a disassembled perspective view which shows the structure of the light emitting unit which concerns on Embodiment 1 of this invention, Comprising: The figure which shows the state before a light emitting module is fixed to a heat sink. It is a figure which shows the structure of the light emitting unit which concerns on Embodiment 1 of this invention, Comprising: (a) is an external appearance perspective view which shows the state by which the light emitting module was fixed to the heat sink, (b) is in (a). The figure seen from the direction of arrow A. It is a disassembled perspective view which shows the structure of the light emitting unit which concerns on Embodiment 2 of this invention, Comprising: The figure which shows the state before a light emitting module is fixed to a heat sink. It is an external appearance perspective view which shows the structure of the light emitting unit which concerns on Embodiment 2 of this invention, Comprising: The figure which shows the state by which the light emitting module was fixed to the heat sink. Sectional drawing by the virtual plane P1 seen from the direction of arrow B in FIG. 5 of the light emission unit which concerns on Embodiment 2 of this invention. It is a figure which shows the structure of the light emitting unit which concerns on the modification 1 of this invention, Comprising: (a) is an external appearance perspective view which shows the state with which the light emitting module was fixed to the heat sink, (b) is a light emitting module fixed to a heat sink. Sectional drawing which looked at the cross section by the virtual plane P2 in (a) in the state before being performed from the direction of arrow B. FIG. It is a figure which shows the structure of the light-emitting unit which concerns on the modification 2 of this invention, Comprising: (a) is an external appearance perspective view which shows the state with which the light emitting module was fixed to the heat sink, (b) was fixed to the heat sink. Sectional drawing which looked at the cross section by the virtual plane P3 in (a) from the direction of arrow B in the state before being performed. It is a figure which shows the structure of the light emission unit which concerns on the modification 3 of this invention, Comprising: (a) is an external appearance perspective view which shows the state with which the light emitting module was fixed to the heat sink, (b) is the arrow A in (a). The figure seen from the direction. The external appearance perspective view which shows the structure of the light emission unit which concerns on the modification 4 of this invention. The figure which looked at the sectional view by imaginary plane P4 in Drawing 10 of the light emitting unit concerning modification 4 of the present invention from the direction of arrow B. The figure which looked at the cross-sectional view which cut | disconnected the light emission unit which concerns on the modification 5 of this invention by the virtual plane P4 in FIG. It is a figure which shows the structure of the light emission unit which concerns on the modification 6 of this invention, Comprising: (a) is a perspective view which shows the external appearance, (b) is the figure seen from the direction of arrow A in (a). The figure which shows typically the mode of the emitted light from a light emitting module. The external appearance perspective view which shows the structure of the light emission unit which concerns on the modification 7 of this invention. The perspective view which shows the structure of the light emission unit which concerns on the modification 8 of this invention. FIG. 5 is a partially cutaway perspective view showing a schematic configuration of a liquid crystal display device using a backlight unit including a light emitting unit according to each embodiment and each modification of the present invention.

Embodiments of a light source device according to the present invention will be described below with reference to the drawings.
<Embodiment 1>
(1-1. Overall Configuration of Backlight Unit and Liquid Crystal Display Device)
FIG. 1 is an exploded perspective view showing a schematic configuration of a backlight unit 100 equipped with a light emitting unit 1 that is a light source device according to Embodiment 1 of the present invention. In FIG. Thickness direction (X-axis (+) direction is the light extraction direction of the backlight unit 100), Y-axis direction is the left-right direction (longitudinal direction) of the backlight unit 100, and Z-axis direction is the vertical direction (short) of the backlight unit 100. Hand direction). It should be noted that the drawings of the present application other than FIG. 1 also indicate the same direction when the directions are described in the X axis, the Y axis, and the Z axis.

  As shown in FIG. 1, the backlight unit 100 according to the present embodiment is an edge light (side light) type backlight unit, and includes a housing 101, a reflection sheet 102, a light guide plate 103, a diffusion sheet 104, It includes a prism sheet 105, a polarizing sheet 106, a lighting circuit 107, a plurality of LED modules (light emitting modules) 110, a flexible printed wiring board 120, a heat sink (heat conducting member) 130, and the like.

  The casing 101 is made of a metal such as a galvanized steel plate, for example, and includes a box-shaped casing main body 101a and a rectangular outer frame including an upper side portion 101b, a right side portion 101c, a lower side portion 101d, and a left side portion 101e. In the state where the outer frame is attached to the casing body 101a and the casing 101 is assembled, the area surrounded by the outer frame is the light outlet. Inside the housing 101, a reflection sheet 102, a light guide plate 103, a diffusion sheet 104, a prism sheet 105, and a polarizing sheet 106 are laminated in that order from the bottom surface side of the housing body 101a. A plurality of LED modules 110, a flexible printed wiring board 120, and a heat sink 130 are disposed below the light guide plate 103 inside the housing 101. The LED module 110, the flexible printed wiring board 120, and the heat sink 130 constitute the light emitting unit 1. Details will be described later.

Light emitted from the plurality of LED modules 110 housed in the housing 101 enters the light guide plate 103 from the light incident surface 103 a that is the lower side surface of the light guide plate 103, and is light that is the front surface of the light guide plate 103. The light is emitted from the extraction surface 103b, passes through the diffusion sheet 104, the prism sheet 105, and the polarizing sheet 106, and is extracted from the light extraction port of the housing 101 to the outside.
The reflection sheet 102 is a substantially rectangular sheet made of, for example, PET (polyethylene terephthalate), and is disposed on the back side of the light guide plate 103. The light emitted from the back surface of the light guide plate 103 is directed toward the light extraction surface 103b. reflect. The reflective sheet 102 may be a metallic foil having metallic luster, an Ag sheet, or the like.

  The light guide plate 103 is made of, for example, PC (polycarbonate) resin, the dimension (thickness) in the X-axis direction is about 4 [mm], the dimension (longitudinal dimension) in the Y-axis direction is about 1040 [mm], and the Z-axis direction. Are approximately 600 [mm] in size, and a dot pattern (not shown) is formed according to the arrangement of the LED modules 110. When the light is transmitted through the light guide plate 103, the light is diffused and averaged and taken out from the light extraction surface 103 b of the light guide plate 103.

The diffusion sheet 104 is a substantially square film made of, for example, PET or PC resin, and is laminated in a state of being in close contact with the light extraction surface 103 b of the light guide plate 103.
The prism sheet 105 is a light-transmitting substantially square optical sheet formed by forming a uniform prism pattern with acrylic resin on one surface of a face material made of polyester resin, for example, and is on the light extraction side of the diffusion sheet 104 Are stacked.

The polarizing sheet 106 is a substantially rectangular film made of, for example, a PC film, a polyester film, and an acrylic resin, or made of PEN (polyethylene naphthalate), and is laminated on the light extraction side of the prism sheet 105. .
The lighting circuit 107 is attached to the back surface of the housing 101 and supplies power to each LED module 110. Further, the current flowing through the LED module 110 is controlled. The lighting circuit 107 may be formed inside the housing 101, for example, on the mounting substrate 111 of the LED module 110. By doing so, the connection lines to the outside are only the power supply line for operating the circuit and the control signal line for adjusting the brightness, and the connection can be simplified.

FIG. 16 is a partially cutaway perspective view showing a schematic configuration of the liquid crystal display device 10 using the backlight unit 100 on which the light emitting unit 1 which is the light source device according to Embodiment 1 is mounted. As shown in the figure, the liquid crystal display device 10 is, for example, a 46-inch liquid crystal television, and includes a liquid crystal screen unit 2 including a liquid crystal panel and the like, and a backlight unit 100 disposed on the back surface of the liquid crystal screen unit 2. . The liquid crystal screen unit 2 is a well-known one and includes a liquid crystal panel (color filter substrate, liquid crystal, TFT substrate, etc.) (not shown), a drive module, etc. (not shown), and color based on an image signal from the outside. Form an image.
(1-2. Configuration of light source device)
FIG. 2 is an exploded perspective view showing a configuration of the light emitting unit 1 which is the light source device in the present embodiment. As shown in the figure, the light emitting unit 1 includes a plurality of LED modules 110, a heat sink 130 in which the LED modules 110 are arranged in a row, and a flexible printed wiring board 120 that supplies power to the LED modules 110. . In the figure, a state before the LED module 110 is fixed to the heat sink 130 is shown.

  Each LED module 110 includes a long mounting substrate (substrate) 111, a plurality of LED elements (semiconductor light emitting devices) 112 mounted in a row on the mounting substrate 111, and a wavelength for sealing the LED elements 112. The light incident surface 103a (FIG. 1) of the light guide plate 103 is provided on a mounting surface (module mounting surface for mounting the LED module 110, hereinafter simply referred to as “mounting surface”) 131. It is arranged so as to oppose (see).

For example, the mounting substrate 111 has a dimension in the X-axis direction (short direction) of about 4 [mm], a dimension in the Y-axis direction (longitudinal direction) of about 51 [mm], and a dimension (thickness) in the Z-axis direction of about 1 [mm] plate-shaped ceramic substrate. In this case, as shown in FIG. 2, the lower surface (rear surface) 111a of the mounting substrate 111 has a dimension in the X-axis direction of about 4 [mm], a dimension in the Y-axis direction of about 51 [mm], and an area of 204 [ mm ² ]. The mounting substrate 111 may be a resin substrate such as an epoxy resin.

On the upper surface of the mounting substrate 111, electrode pairs 116 and 117 are provided, and the electrode pairs 116 and 117 and the lighting circuit 107 are conductively connected via the flexible printed wiring board 120. With this connection, the LED element 112 is connected. Is supplied with power for emitting light.
The upper surface 111b of the mounting substrate 111 is a reflecting surface, and the luminance efficiency is improved by reflecting the light emitted from the LED element 112 to the mounting substrate 111 side.

Each LED element 112 is, for example, a light emitting diode that emits blue light in which a GaN-based compound semiconductor layer is formed on a light-transmitting substrate.
The wavelength converter 113 is made of, for example, a silicone resin in which a phosphor (not shown) is dispersed, and seals the LED element 112. The wavelength converter 113 converts, for example, part of blue light emitted from the LED element 112 by the phosphor into yellow-green light that is a complementary color, and the yellow-green light and the blue light that has not been converted by the phosphor. Creates white light by mixing colors. The phosphor of the present invention emits light of different wavelengths when excited by the light emitted from the LED light emitting element. For example, a mixture of red and green phosphors made of silicon nitride, YAG phosphor, etc. Is mentioned.

  The flexible printed wiring board 120 is obtained by forming a conductive pattern 122 from copper on a polyimide base film 121 and has a thickness of 80 to 150 [μm]. A strip-shaped main wiring 123 arranged along the longitudinal direction of the heat sink 130, and a plurality of strip-shaped sub-wirings 124 extending from the main wiring 123 toward the electrode pairs 116, 117 of each LED module 110, Is provided.

  Since the flexible printed wiring board 120 is thin and excellent in flexibility, the flexible printed wiring board 120 can be drawn relatively freely even inside the housing 101 having a small package space. Therefore, it is advantageous for reducing the size of the backlight unit 100. In particular, the flexible printed wiring board 120 is advantageous in reducing the size of the backlight unit 100 including the plurality of LED modules 110 because the wiring is difficult to get tangled or bulky even if the wiring is branched.

The main wiring 123 has a Y-axis dimension (longitudinal dimension) of about 1100 [mm] and a Z-axis dimension (short dimension) of about 10 [mm]. A connector 140 is attached.
The sub-wiring 124 has a Y-axis dimension (longitudinal dimension) of about 5 [mm] and a Z-axis dimension (short-side dimension) of about 15 [mm]. A pair of lands 122a and 122b constituted by a part of the conductive pattern 122 is provided at the tip end portion 124a of each sub-wiring 124. The lands 122a and 122b and the electrode pairs 116 and 117 of the LED module 110 are electrically conductive. They are electrically connected to each other via a conductive adhesive 150 (see FIG. 6) such as a conductive double-sided tape or solder.

  The heat sink 130 has, for example, a dimension (thickness) in the X-axis direction of about 4 [mm], a dimension in the Y-axis direction (longitudinal dimension) of about 1040 [mm], and a dimension in the Z-axis direction (dimension in the short direction). ) Is about 30 [mm], made of substantially rectangular aluminum, and has a thermal conductivity of about 236 [W / mK]. The heat sink 130 is not limited to aluminum, but may be made of a material having high thermal conductivity that can radiate the heat of the LED module 110 such as copper, carbon, or ceramic to the outside of the module. Good. The heat resistance of the heat sink is preferably smaller than the heat resistance of the flexible printed wiring board 120.

The heat sink 130 has a mounting surface 131 and is disposed so that the mounting surface 131 faces the light incident surface 103 a of the light guide plate 103. On the mounting surface 131, for example, 20 [pieces] are arranged in a straight line with a certain interval in a state where the longitudinal direction of the mounting substrate 111 and the longitudinal direction of the mounting surface 131 coincide with each other. .
On the mounting surface 131 of the heat sink 130, both the longitudinal ends of the mounting substrate 111 of each LED module 110 are aligned with the mounting position of the LED module 110, that is, for example, when the LED modules 110 are linearly arranged. A locking claw 132 is formed by cutting out a part of the mounting claw 132 at a position where it is placed. When viewed from the mounting surface 131 side of the heat sink 130, the notch portion of the heat sink 130 has a belt-like shape that communicates from one side of the heat sink 130 to the other side along the short side direction. The T-shape is turned upside down (see FIG. 3B). The length of the portion corresponding to the inverted T-shaped vertical line of the notch is shorter than the height of the heat sink 130 (the length in the Z-axis direction). A portion between the mounting surface 131 and the portion corresponding to the inverted T-shaped horizontal line left without being cut out is a locking claw 132, and the portion corresponding to the vertical line of the cut-out inverted T shape is interposed therebetween. It protrudes along the longitudinal direction so as to face each other.

A heat-shrinkable tube (enclosure member) 160 made of a resin or the like that has a cylindrical shape and contracts in the radial direction when heated is the axial direction of the heat-shrinkable tube 160 and the longitudinal direction of the heat sink 130 and the mounting substrate 111. Is attached to the engaging claw 132 in such a manner that the engaging claw 132 is inserted into the inside thereof in a direction that substantially coincides with.
With the heat-shrinkable tube 160 mounted on the locking claw 132, one end in the longitudinal direction of the LED module 110 is inserted into the heat-shrinkable tube 160 and the other end is formed at a position where the other end is placed. The LED module 110 is placed on the heat sink 130 in a state where the LED module 110 is inserted into another heat shrinkable tube 160 attached to the locking claw 132. In this state, the heat shrinkable tube 160 or the entire light emitting unit 1 is heated to a temperature at which the heat shrinkable tube 160 contracts (hereinafter referred to as “shrink temperature”). As a result, the heat-shrinkable tube 160 contracts, and the locking claw 132 and the LED module 110 placed thereon are integrally restrained so as to be bundled by the heat-shrinkable tube 160.

Here, the “restraint” means that the LED module 110 is held on the mounting surface 131 of the heat sink 130 so as to be slightly displaceable only in the longitudinal direction. In the present specification, the same meaning is used hereinafter.
In addition, as the heat shrinkable tube 160, a tube having high translucency and hardly changing the light color is used. A colorless and transparent heat-shrinkable tube is preferable.

Further, the heat shrinkable tube 160 has a shrinkable temperature that is not damaged by the heat applied when the LED module 110 contracts the heat shrinkable tube 160. Specifically, for example, the material is made of polyolefin and has a shrinkage temperature of 100 [° C.] or less.
The light emitting unit 1 in a state where the LED module 110 is restrained on the heat sink 130 by the heat-shrinkable heat-shrinkable tube 160 is shown in FIG. FIG. 3B is a view as seen from the direction of the arrow A in FIG. In this way, since the LED module 110 is placed on the locking claw 132 that is a part of the heat sink 130, both are integrally restrained inside the heat shrinkable tube 160, so that the heat from the LED element 112 is When the temperature of the LED module 110 rises, the LED module 110 can thermally expand in the longitudinal direction while sliding on the mounting surface 131. Thereby, deformation and breakage of the LED module 110 due to thermal stress can be avoided.

  Further, since it is not necessary to provide a space for screw holes at both ends in the longitudinal direction of the mounting substrate 111, the LED element 112 can be mounted to the very vicinity of the end in the longitudinal direction of the mounting substrate, and the LED module. Since the heat-shrinkable tube 160 that restrains the longitudinal end of 110 and the locking claw 132 has translucency, the area where the LED elements 112 do not exist between the adjacent LED modules 110 can be very small. The occurrence of uneven brightness can be reduced.

Furthermore, since the mounting substrate 111 does not warp and rise from the mounting surface 131 due to the deformation, it is possible to suppress the occurrence of luminance unevenness and to prevent a reduction in heat radiation efficiency from the LED module 110 to the heat sink.
3 (a) and 3 (b), the plurality of LED modules 110 are arranged in a row on the mounting surface 131 at a slight interval in the longitudinal direction. However, the present invention is not limited to this. The LED modules 110 may be arranged without being spaced from each other. Even in this case, the thermal expansion of the individual LED modules 110 is allowed at both ends of the row composed of the plurality of LED modules arranged on the heat sink 130, and the deformation and breakage of the LED modules 110 can be prevented.

Further, the cylindrical shape includes a so-called band shape or annular shape having a short axial length as shown in FIG.
<Embodiment 2>
In the first embodiment, the respective end portions of the LED module 110 in the longitudinal direction of the mounting substrate 111 are bundled by the band-shaped heat shrinkable tube 160 together with the locking claws 132 formed by partially cutting the heat sink 130. The configuration for integrally restraining has been described. In the second embodiment, a configuration in which the entire light emitting unit 1 is housed in the heat shrinkable tube 160 and integrally restrained without providing the heat sink 130 with the locking claws 132 will be described. In addition, in order to avoid duplication of description, the description is abbreviate | omitted about the same content as Embodiment 1, and shall attach | subject the same code | symbol about the same component.

  FIG. 4 is a perspective view showing a configuration of the light emitting unit 1 of the present embodiment, and shows a state before the LED module 110 and the heat sink 130 are restrained integrally. As shown in the figure, a plurality of LED modules 110 are mounted in a row in the longitudinal direction on a mounting surface 131 of a heat sink 130, and electrode pairs 116 and 117 (see FIG. 2) of the LED module 110 and a flexible printed wiring board. The lands 122a and 122b provided at the tips of the 120 sub-wirings 124 are electrically connected to each other via the conductive adhesive 150 (see FIG. 6). In this state, the LED module 110, the heat sink 130, and the flexible printed wiring board 120 are integrally inserted into the heat shrinkable tube 160.

  The heat-shrinkable tube 160 is heated to the contraction temperature and contracts, and is attached to the peripheral surfaces in the longitudinal direction of the LED module 110, the heat sink 130, and the flexible printed wiring board 120 assembled together. Thereby, the LED module 110, the heat sink 130, and the flexible printed wiring board 120 are integrally restrained inside the heat shrinkable tube 160.

  The light emitting unit 1 in a state where the LED module is restrained on the heat sink by the heat-shrinkable heat-shrinkable tube 160 is shown in FIG. 6 is a view of a cross section of the light emitting unit 1 taken along the virtual plane P1 of FIG. A flexible printed wiring that is electrically connected to the heat sink 130, the LED module 110 mounted thereon, and the electrode pairs 116 and 117 on the mounting substrate 111 and that extends along the side surface of the heat sink 130. The plate 120 is included in the heat shrinkable tube 160 so as to surround these peripheral surfaces. The heat-shrinkable tube 160 has translucency, and the light generated from the LED element 112 and the light whose wavelength is converted by the wavelength converter 113 are transmitted through the heat-shrinkable tube 160 and light guide plate from the light incident surface 103a. It enters the inside of 103. Note that it is desirable that the wavelength of the light is not converted when the light is transmitted through the heat-shrinkable tube, but this is not the case when there is a purpose of changing the light color of the light generated from the LED module 110.

  By adopting the above-described configuration, the LED module 110 is constrained only on the heat sink 130 in the circumferential direction by the heat shrinkable tube 160, and therefore, when the temperature of the LED module 110 rises due to heat from the LED element 112. The mounting substrate 111 can thermally expand in the longitudinal direction while sliding on the mounting surface 131. Therefore, deformation and breakage of the LED module 110 due to thermal stress can be avoided.

Further, since the mounting substrate 111 does not warp and rise from the mounting surface 131 due to deformation, the occurrence of uneven brightness can be suppressed.
In addition, since the LED module 110 is applied with a force in a direction in which the LED module 110 is pressed against the mounting surface 131 of the heat sink 130 by the heat shrinkable tube 160, the adhesion between the mounting substrate 111 and the heat sink 130 is improved, and the heat dissipation efficiency to the heat sink is good. .

  Furthermore, since it is not necessary to secure a space for providing a screw hole or the like for fixing to the heat sink 130 at both longitudinal ends of the mounting substrate 111 of the LED module 110, the LED element 112 can be mounted on the space. I can do it. Thereby, when the LED modules 110 are arranged in a line in the longitudinal direction, the area where the LED elements 112 do not exist between the adjacent LED modules 110 can be made very small, and the occurrence of uneven brightness can be reduced. it can.

4 and 5, the plurality of LED modules 110 are arranged in a row on the mounting surface 131 at a slight interval in the longitudinal direction. However, the present invention is not limited to this, and the LED modules 110 are not limited to this. They may be arranged without being spaced from each other. Even in this case, the thermal expansion of the individual LED modules 110 is allowed at both ends of the row composed of the plurality of LED modules arranged on the heat sink 130, and the deformation and breakage of the LED modules 110 can be prevented.
<Modification>
As described above, the present invention has been described based on the embodiment. However, the present invention is not limited to the above-described embodiment, and the following modifications can be implemented. In addition, in order to avoid duplication of description, the description is abbreviate | omitted about the same content as Embodiment 1, and shall attach | subject the same code | symbol about the same component.
(1) In the first embodiment, the heat sink 130 is cut out so as to communicate with the upper surface and side surfaces of the heat sink 130, and the pair of locking claws 132 are formed to face each other. A pair of locking claws may be formed by cutting out both side surfaces in the longitudinal direction of 130.

FIG. 7A shows an external perspective view of the light emitting unit 1 according to this modification. FIG. 7B shows a cross-sectional view of the light emitting unit 1 according to this modification in a state before being heated and contracted, as viewed from the direction of the arrow B in the cross section taken along the virtual plane P2 in FIG. . As shown in both figures, the locking claw 133 is formed by cutting out the side surface in the longitudinal direction of the heat sink 130.
The heat-shrinkable tube 160 is stretched across the upper surface of the heat sink 130 and the LED module 110 from one locking claw 133 to the other locking claw 133, and as shown in FIG. In FIG. 2, two loops are formed. Then, adjacent longitudinal ends of the adjacent LED modules 110 are inserted into the respective loops, and the heat shrinkable tube 160 contracts by heating, so that the LED module 110 is placed on the heat sink 130 as shown in FIG. Restrained by

In this modification, adjacent end portions of the LED modules 110 placed in a row in the longitudinal direction on the mounting surface 131 of the heat sink 130 are constrained to the heat sink 130 by one heat shrinkable tube. However, both ends of the row composed of the plurality of LED modules 110 are restrained by the heat sink 130 by the same method as in the first embodiment.
(2) In Embodiment 1 and Modification 1, a portion of the heat sink 130 is cut out to form the locking claws 132 and 133. However, the present invention is not limited to this. The locking claw may be formed so as to protrude from the side surface.

  FIG. 8A shows an external perspective view of the light emitting unit 1 according to this modification. Further, FIG. 8B shows a cross-sectional view of the light-emitting unit 1 according to this modification in a state before being heated and contracted, as viewed from the direction of the arrow B in the cross section taken along the virtual plane P3 in FIG. . As shown in both figures, the locking claw 134 is formed so as to protrude from the longitudinal side surface of the heat sink 130 in a direction perpendicular to the side surface, and its end portion further extends to the lower surface side of the heat sink 130, and FIG. The cross section shown in (b) is L-shaped.

  Also in this modified example, similarly to the modified example 1, the heat shrinkable tube 160 is spanned from one locking claw 134 to the other locking claw 134 across the upper surface of the heat sink 130 and the LED module 110. As shown in FIG. 8B, two loops are formed in the state before contraction. Then, the adjacent longitudinal ends of the adjacent LED modules 110 are inserted into the respective loops, and the heat shrinkable tube 160 contracts by heating, so that the LED modules 110 are placed on the heat sink 130 as shown in FIG. Restrained by

Also in this modification, as in Modification 1, adjacent ends of the LED modules 110 placed in a row in the longitudinal direction on the mounting surface 131 of the heat sink 130 are constrained to the heat sink 130 by one heat shrinkable tube. However, both ends of the row composed of the plurality of LED modules 110 are constrained to the heat sink 130 by the same method as in the first embodiment.
(3) In the first embodiment, an LED module in which there is a space where the LED element 112 is not mounted can be used in order to provide screw holes at both ends in the longitudinal direction of the mounting substrate 111 as in the prior art.

  FIG. 9A shows the light emitting unit 1 in a state where the conventional LED module 110 is restrained on the heat sink 130 by the heat shrinkable tube 160. FIG. 9B is a view seen from the direction of the arrow A in FIG. In the case of this modification, the heat-shrinkable tube 160 is not necessarily stretched over the LED element 112 and the wavelength converter 113, and thus does not necessarily have translucency. FIG. 9 (a) and FIG. It may be made of a colored material as shown in FIG.

Furthermore, by using the heat shrinkable tube 160 having a thickness smaller than the height of the screw thread used in the light emitting unit configured to screw the LED module to the heat sink, the light emitted from the LED element 112 of the LED module 110. Shadows caused by light being blocked by the heat-shrinkable tube 160 can be reduced, and the occurrence of uneven brightness in the light source device can be reduced as compared with the case where a conventional screw-type light emitting unit is used. However, even if the thickness of the heat-shrinkable tube 160 is equal to or greater than the height of the thread, the heat-shrinkable tube 160 having translucency can reduce brightness unevenness to some extent. it can.
(4) In the second embodiment, the LED module 110 housed in the heat shrinkable tube 160 and integrally restrained together with the heat sink 130 and the flexible printed wiring board 120 is an LED mounted on the mounting substrate 111. Although the wavelength converter 113 which seals the element 112 is provided and the said wavelength converter 113 consists of resin which disperse | distributed fluorescent substance, it is not restricted to this, It is good also as the following structures. That is, the LED module 110 may not be provided with the wavelength converter 113, and the heat-shrinkable tube 160 may be made of a light-transmitting resin in which phosphors are dispersed.

FIG. 10 is an external perspective view of the light emitting unit 1 according to this modification, and FIG. 11 is a cross-sectional view of the cross section taken along the virtual plane P4 of FIG. As shown in both figures, the LED module 110 does not include the wavelength converter 113, and is covered with a heat shrinkable tube 161 made of a resin in which a phosphor is dispersed from above the LED element 112. Thereby, when a part of the blue light emitted from the LED element 112 is transmitted through the heat-shrinkable tube 161, the wavelength is converted by the phosphor in the heat-shrinkable tube 161 to become yellow-green light. The white light is generated in the same manner as described above. That is, the heat shrinkable tube 161 plays a role of the wavelength converter 113.
(5) In Modification 3 described above, the phosphor is dispersed throughout the heat-shrinkable tube 161. However, the present invention is not limited to this, and the phosphor may be dispersed only in a portion covering the upper surface of the LED element 112.

FIG. 12 shows a cross-sectional view of the light emitting unit 1 according to this modification when the cross section taken along the virtual plane P4 in FIG. A heat-shrinkable tube 161 in which a phosphor is dispersed is used for a portion that covers the upper surface of the LED element 112, and a heat-shrinkable tube 160 that does not contain a phosphor is used for the other portions.
Note that the phosphor of the heat-shrinkable tube 161 may be dispersed only in a portion covering the upper surface of the LED element 112, or may be dispersed continuously in a strip shape in the longitudinal direction in a portion covering the upper surface of the LED element 112. .
(6) In the second embodiment, the configuration in which the LED module 110 in which the LED elements 112 are mounted to substantially the end in the longitudinal direction of the mounting substrate 111 has been described. However, it is also possible to apply the LED module 110 according to the modification 3 and the conventional LED module provided with screw holes to the configuration of the second embodiment.

  However, in this case, since there is a region where the LED element 112 is not mounted at a position where the ends of adjacent LED modules face each other, darkness occurs in that portion. In addition, although the heat shrinkable tube 160 has translucency, it is considered that the light emitted from the LED module 110 does not substantially transmit 100% out of the heat shrinkable tube 160. Therefore, an opening may be provided in a portion of the heat shrinkable tube 160 that covers the region.

FIG. 13A shows an external perspective view of the light emitting unit 1 according to this modification, and FIG. 13B shows a view seen from the direction of arrow A in FIG. As shown in both figures, an opening 162 is provided in a portion of the heat shrinkable tube 160 that covers the portion of the mounting substrate 111 in the vicinity of the end portion in the longitudinal direction where the LED element 112 is not mounted. In FIG. 13B, arrow L1 schematically represents light emitted from the LED module 110 and transmitted through the heat-shrinkable tube 160, and arrow L2 is emitted from the LED module 110. Of the emitted light, the light emitted from the opening 162 without passing through the heat shrinkable tube 160 is schematically represented. The lengths of the arrows L1 and L2 schematically represent the intensity of each light, that is, the amount of light. As shown in the figure, since L2 has a larger light amount than L1, a portion where the LED element 112 is mounted on the mounting substrate 111 (as compared to the case where only the L1 is emitted without providing the opening 162) ( It is possible to reduce the overall light amount difference between the portion where L1 is emitted and the portion not mounted (the portion where L2 is emitted). Thereby, the luminance unevenness of the light source device can be reduced.
(7) In Embodiment 2 and Modifications 4, 5, and 6, since most of the heat sink 130 is covered with the heat shrinkable tube, the heat dissipated from the LED module 110 to the heat sink is the heat sink 130. It may be difficult to release to the outside. Therefore, a heat radiating opening for releasing heat to the outside of the heat sink 130 may be provided in the heat shrinkable tube 160.

FIG. 14 is an external perspective view of the light emitting unit 1 according to this modification. In the same figure, the example which applied this modification to the light emitting unit 1 which concerns on the said modification 5 is shown. An opening 163 is provided in a part of a portion of the heat shrinkable tube 160 that covers the side surface and the lower surface of the heat sink 130. The size, location, and number of the openings 163 are other than the portion that covers the wavelength converter 113 or the LED element 112, and the LED module 110, the heat sink 130, and the flexible printed wiring board 120 of the heat shrinkable tube 160 are integrated. It is not particularly limited as long as it can be held (restrained).
(8) In the second embodiment, the configuration using the heat-shrinkable tube 160 having a cylindrical shape has been described. However, the present invention is not limited to this, and instead of the heat-shrinkable tube 160, it has a coil-like shape, A heat-shrinkable coil made of a resin that shrinks in the radial direction may be used.

FIG. 15 shows an external perspective view of the light emitting unit 1 according to this modification. The LED module 110, the heat sink 130, and the flexible printed wiring board 120 are tightly wound around the outer periphery by a heat-shrinkable coil 164 and are integrally restrained. According to the configuration of the present modification, the area covered with the heat sink 130 is reduced as compared with the case where the heat-shrinkable tube is used, so that a reduction in heat dissipation from the heat sink 130 can be suppressed.
(9) In each of the above embodiments and modifications, a circulation path may be provided inside the heat sink 130 to circulate the refrigerant. This is more effective when substantially the entire heat sink 130 is covered by the heat shrinkable tube.
(10) In each of the above-described embodiments and modifications, the heat shrinkable tube and heat shrinkable coil made of resin that shrinks by heat are used as the surrounding member. However, the present invention is not limited to this, and the following modifications may be considered. It is done. That is, an outer member formed of a material having a property of contracting by ultraviolet rays, a predetermined medicine (liquid, gas), electromagnetic waves, or the like may be used instead of heat. However, in this case, it is required to select a material that does not damage the LED module 110 when contracting the surrounding member, or to perform contraction work by a method that does not damage it.
(11) In Embodiment 1 and Modifications 1, 2, 3, and 8, an envelope member made of a shape memory alloy may be used in place of the resin heat-shrinkable tube and heat-shrinkable coil, respectively. In this case, in the first embodiment and the first, second, and third modifications, a C-ring shape having a part of the ring opened may be used as the surrounding member.

  Note that the contents of the first embodiment and the modifications may be combined.

  The light source device according to the present invention can be used as a linear light source of an image display device such as a liquid crystal television or a liquid crystal display, and a linear or planar light source for general illumination.

DESCRIPTION OF SYMBOLS 1 Light emission unit 2 Liquid crystal screen unit 10 Liquid crystal display device 100 Backlight unit 101 Case 101a Case main body 101b Upper side part 101c Right side part 101d Lower side part 101e Left side part 102 Reflective sheet 103 Light guide plate 103a Light incident surface 103b Light extraction surface 104 Diffusion Sheet 105 Prism sheet 106 Polarizing sheet 107 Lighting circuit 110 LED module 111 Mounting substrate 111a Lower surface 111b Upper surface 112 LED element 113 Wavelength converter 116, 117 Electrode 120 Flexible printed wiring board 121 Base film 122 Conductive pattern 122a, b Land 123 Main wiring 124 Sub-wiring 124a Tip 130 Heat sink 131 Mounting surface 132, 133, 134 Locking claw 140 Connector 150 Conductive adhesive 160, 161 Heat shrinkable tube 16 , 163 opening 164 heat shrinkable coil

Claims (7)

A light emitting module having a configuration in which a plurality of semiconductor light emitting elements are arranged on one main surface of a long substrate;
A heat conducting member that is elongated and arranged to face the other main surface of the substrate in a state in which the longitudinal direction thereof is aligned with the longitudinal direction of the substrate;
The heat conducting member is stretched across the main surface of the substrate from one side to the other side in the short direction, and the substrate of the light emitting module is pressed toward the heat conducting member by the tension. An enclosing member,
The surrounding member is a contraction tube contracted in a radial direction by an external factor,
The heat conducting member is formed in a short direction on a main surface facing the substrate and a through hole communicating from one side to the other side in the short direction, and communicates the through hole and the main surface. A slit,
The through hole has an opposing surface that faces the main surface and is parallel to the main surface,
Of the heat conducting member, a portion surrounded by the facing surface, the slit and the main surface, and an end portion in the longitudinal direction of the light emitting module are contained in the tube, and the tension applied by the contraction is provided. A light source device that is integrally restrained by force . The light source apparatus according to claim 1 , wherein the external factor is heat. The light emitting module has a configuration in which the semiconductor light emitting element is sealed by a sealing member,
The light source device according to claim 1 , wherein the sealing member includes a phosphor. The light source device according to claim 3 , wherein the surrounding member is stretched across a portion of the main surface of the substrate where the sealing member does not exist. The light source device according to any one of claims 1 to 3 , wherein the surrounding member has translucency. A backlight unit comprising the light source device according to any one of claims 1 to 5 . The backlight unit according to claim 6 ;
A liquid crystal panel irradiated with light from the backlight unit;
A liquid crystal display device comprising: a control unit that applies a video signal to the liquid crystal panel and lights the light source while switching in synchronization with the application timing.

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