JP5480645B2 - Support frame - Google Patents

Description

  The present invention relates to a support frame that supports an adherend through an adhesive sheet.

  2. Description of the Related Art Conventionally, in a semiconductor manufacturing process, a mounting apparatus that integrates a wafer (adhered body) and a ring frame (support frame) through an adhesive sheet such as a mounting sheet is known to facilitate handling of a semiconductor wafer. (For example, refer to Patent Document 1). A dicing frame (support frame) used in such a mounting apparatus is disclosed in, for example, Patent Document 2.

JP 2008-66684 A JP 2007-53162 A

  Incidentally, as in Patent Document 1, in an apparatus that mounts a wafer on a ring frame by pressing an adhesive sheet that has been previously attached to the ring frame with an application roller, for example, as shown in FIG. The wafer W with the protective sheet HS attached to the WA is supported on the table T from the protective sheet HS side, the support frame F with the adhesive sheet S attached in advance is placed on the table T, and the wafer W is attached through the opening FO. Then, the adhesive sheet S is pressed against the lower wafer back surface WB using the pressing roller R. Thereby, the adhesive sheet S is affixed to the back surface WB, and the wafer W and the support frame F are integrated via the adhesive sheet S.

  However, as shown in FIG. 5A, when there is a step between the upper surface FA of the support frame F and the wafer rear surface WB while being supported by the table T, the adhesive sheet S is pressed by the elastic pressure roller R. At this time, since the adhesive sheet S is always attached to the wafer back surface WB in a state where tension is applied, the adhesive sheet S is attached to the wafer W in a state where the stress remains. Therefore, as shown in FIG. 5B, when the wafer W is cut from the front surface WA side by the dicing apparatus D and separated into individual chips C, the portion of the adhesive sheet S where the stress remains is released. , The intervals between the separated chips C become non-uniform. For this reason, there is a possibility that the pickup device cannot accurately pick up after dicing. In particular, in recent years, with the thinning of the wafer W and the miniaturization of the chip C, in the situation where the accuracy and speed of the pickup are required, the pick-up failure due to the misalignment of the chip C becomes a problem because the manufacturing efficiency is greatly reduced. The improvement is desired.

  The objective of this invention is providing the support frame which can improve manufacturing efficiency by reducing the residual stress of an adhesive sheet and making a to-be-adhered body be supported by a support frame.

In order to achieve the above object, a support frame of the present invention is a support frame that supports an adherend via an adhesive sheet, and is a frame main body that is spaced from the outer periphery of the adherend and can be disposed surrounding the outer periphery. When the a landing portion in which the adhesive sheet is stuck is provided on the frame body, wherein a support portion for supporting an object to be affixed portion so as to move freely with respect to the frame body, wherein the sticking part, the together are arranged in parallel in the circumferential direction of the frame body, characterized in that it is movable in the radial direction before Symbol frame body by the tension from the adhesive sheet.

In this case, the support frame of the present invention includes a biasing unit that biases the portion to be adhered to the outside in the radial direction of the frame body, and the biasing force of the biasing unit is applied to the tension from the adhesive sheet. It is preferable that the amount of movement of the sticking part is set to be larger than the amount of elongation deformation of the adhesive sheet.
In the support frame of the present invention, the support portion includes a plurality of rail members extending in the radial direction of the frame main body, and slide members that are slidably supported by these rail members, wherein the sticking part is preferably formed by a plurality of plate-like member connected before Symbol slide member.

  According to the present invention as described above, since the adherend portion is movable in the radial direction of the frame body by the tension from the adhesive sheet, the sticking surface to which the adhesive sheet is stuck in the sticking portion, Even when there is a difference in level between the surface of the body and the adhesive sheet, the adherend can move, so that the residual stress of the adhesive sheet can be reduced and the adherend can be supported by the support frame. As a result, even when the adherend is separated after being integrated with the support frame, the portion where the stress remains in the adhesive sheet is released, so that the intervals between the separated chips become uneven. Can be minimized. Therefore, even when the adherend is a semiconductor wafer and chips are picked up in a subsequent process, pick-up failure due to positional deviation of each chip can be prevented and manufacturing efficiency can be improved.

In addition, if the biasing force of the biasing means is set so that the amount of movement of the adherend to the tension from the adhesive sheet is greater than the amount of elongation deformation of the adhesive sheet, the residual stress of the adhesive sheet is more reliably suppressed. can do.
Further, the slide member is slidably supported on the rail member provided on the frame main body, and the portion to be pasted is composed of a plurality of plate-like members and connected to the slide member, so that each plate-like member has a diameter of the frame main body. It can be moved smoothly in the direction. Furthermore, by increasing the number of the plurality of plate-like members and subdividing each plate-like member, the relative displacement amount between the plate-like members accompanying the expansion and contraction in the circumferential direction when moving in the radial direction can be reduced. It is possible to prevent wrinkles on the adhesive sheet.

The perspective view of the state which supported the adherend with the support frame concerning one embodiment of the present invention. FIG. B arrow view of FIG. Operation | movement explanatory drawing of the support frame of FIG. The figure which shows the example of a conventional malfunction.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
The support frame 1 of the present embodiment is a ring frame that supports the wafer W by being integrated with the wafer W as an adherend via an adhesive sheet S such as a mounting sheet. The adhesive sheet S is stuck to the back surface WB of the wafer W by a sheet sticking device M1 or the like indicating the part. The support frame 1 includes a frame main body 2 that can be disposed around the outer periphery of the wafer W, a plurality of plate-like members 3 that are attached to the frame main body 2 and to which an adhesive sheet S is attached, A support portion 4 that supports the member 3 with respect to the frame body 2 movably, and a C-ring 5 as a biasing means that biases the plate-like member 3 outward in the radial direction of the frame body 2 are configured. Yes.

  The frame body 2 is formed of metal, resin, or the like, has an opening 21 inside, and is formed in an annular shape, and has a circular shape in plan view perpendicular to the surface 22 on the surface 22 side located on the upper side in FIG. An overall annular step portion 23 formed of a side surface 23A and a bottom surface 23B continuous from the lower end portion in FIG. 2 of the side surface 23A in FIG. 2 to the opening 21 is formed. A notch 24 is formed for positioning the support frame 1 when it is transported and placed on various devices. Note that a surface facing away from the front surface 22 is a back surface 25.

  The plate-like members 3 are arranged on the step portion 23, and the eight plate-like members 3 adjacent to each other along the circumferential direction of the frame main body 2 are arranged in parallel with a gap K therebetween. The plate-like member 3 includes a pasting surface 31 to which the adhesive sheet S is pasted, and a bottom surface portion 32 facing away from the bottom surface 23B of the stepped portion 23 so as to face the pasting surface 31. The affixing surface 31 is formed so as to be flush with the surface 22 of the frame body 2 (flat). In the case of this embodiment, the thickness T1 of the frame body 2 is 3.5 mm, the height T2 of the side surface 23A is 2.5 mm, the thickness T3 of the plate-like member 3 is 1 mm, and the diameter D1 of the side surface 23A is The inner diameter D2 when the plate-like member 3 is in contact with the side surface 23A is set to 350 mm, but these dimensions take into consideration the thickness and diameter of the supporting frame used, the diameter of the adhesive sheet S, and the like. And can be changed as appropriate.

  The support portion 4 includes eight rail members 41 provided on the bottom surface 23B and extending in the radial direction of the frame body 2, and eight slide members 42 that are slidably supported by the rail members 41. Each slide member 42 is fixed to the bottom surface portion 32 of the plate-like member 3. As shown in FIG. 3, the rail member 41 is formed in a wedge shape having an inclination extending upward in the drawing, and the slide member 42 is engaged with the wedge-shaped rail member 41 on the bottom surface of the slide member 42 in the vertical direction in the drawing. A reverse wedge-shaped guide groove 43 that restricts the movement and allows the frame body 2 to slide in the radial direction is formed.

  The C-ring 5 is formed in a substantially C-shape as a whole, and is provided between the upper surface of the rail member 41 and the bottom surface portion 32 of the plate-like member 3, and comes into contact with each slide member 42 to place the plate-like member 3. The frame body 2 is configured to be urged outward in the radial direction, and the state in which the plate-like member 3 is in contact with the side surface 23A is maintained in a state where no external force is applied. The biasing means is not limited to the C-ring 5, and other appropriate springs and elastic members can be used. For example, a coil spring or a leaf spring that biases each plate-like member 3 individually is employed. May be.

Next, a procedure for mounting the wafer W on the support frame 1 using the sheet sticking apparatus M1 and a procedure for dicing the wafer W using the dicing apparatus M2 will be described with reference to FIG.
First, the adhesive sheet S is pasted over the pasting surface 31 of each plate-like member 3 in the support frame 1 and, as shown in FIG. 4A, the wafer W having the protective sheet HS stuck on the surface WA. Is placed on the table T1 of the sheet sticking apparatus M1 from the protective sheet HS side. Then, the support frame 1 is placed on a predetermined position of the table T1 from the back surface 25 side of the frame body 2 so as to surround the wafer W by the opening 21, and the wafer W and the support frame 1 are sucked and held by a suction means of the table T1 (not shown). . Next, the adhesive sheet S is pushed down by the elastically deformable pressing roller R of the sheet sticking apparatus M1, and the adhesive sheet S is pressed and stuck to the back surface WB of the wafer W. At this time, the plate-like member 3 is pulled against the urging force of the C-ring 5 by the plate-like member 3 being pulled inward in the radial direction by the tension of the adhesive sheet S pushed downward. It is designed to absorb tension. At this time, the urging force of the C ring 5 is sufficiently smaller than the tension of the adhesive sheet S, that is, the urging force of the C ring 5 so that the moving amount of the plate-like member 3 is larger than the amount of elongation deformation of the adhesive sheet S. Is set, the elongation in the radial direction of the adhesive sheet S is suppressed, the residual stress of the adhesive sheet S is reduced, and the wafer W can be supported by the support frame 1.

  When the wafer W is mounted on the support frame 1 via the adhesive sheet S as described above, the support frame 1 is supported by a transport unit (not shown) and is unloaded from the sheet sticking apparatus M1. Then, as shown in FIG. 4B, the wafer W is supported while the restoring force of the plate-like member 3 by the C-ring 5 and the tension of the adhesive sheet S straddling the wafer W and the plate-like member 3 are balanced. It will be supported by the frame 1. Next, the protective sheet HS is peeled from the wafer W surface WA by a peeling means (not shown), and the support frame 1 is inverted so that the adhesive sheet S is positioned downward, and then the support frame 1 and the wafer W are conveyed to the dicing apparatus M2. And adsorbed and held (see FIG. 4C).

  Next, the wafer W is cut into a plurality of chips C by cutting means CT from the surface WA side. At the time of this cutting, almost no stress remains in the adhesive sheet S, so that the movement of each chip C can be suppressed and the distance between the chips C can be made uniform. Thereafter, the support frame 1 and the wafer W (divided chips C) are transferred to a pickup process and a die bonding process, which are subsequent processes, by a transfer means (not shown). It will be bonded to.

According to this embodiment as described above, the following effects are obtained.
That is, when the adhesive sheet S is attached to the back surface WB of the wafer W by the sheet attaching device M1, the residual stress of the adhesive sheet S can be reduced by the plate-like member 3 moving and absorbing the tension of the adhesive sheet S. The movement of the chip C when the wafer W is cut in the dicing process can be minimized. Therefore, when picking up the separated chips C, it is possible to prevent the pick-up failure accompanying the positional deviation of each chip C and improve the manufacturing efficiency.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

  For example, in the above-described embodiment, the case where the adherend is the semiconductor wafer W is shown, but the adherend is not limited to the wafer W, and other plates such as a glass plate, a steel plate, or a resin plate are used. A member other than a plate-like member or the like can also be targeted. Examples of the semiconductor wafer include a silicon wafer and a compound wafer. And the adhesive sheet stuck to such a to-be-adhered body is not restricted to a mounting sheet, and an adhesive sheet having an arbitrary use and shape such as a protective sheet, other arbitrary sheets, films, tapes, and the like can be applied. That is, when various adhesive sheets are applied to the adherend, such as when the adherend such as a plate-like member is extremely thin or brittle, if the residual stress occurs in the adhesive sheet, the adherend The adherend may be deformed or damaged due to the stress applied to the substrate, but the stress on the adherend is suppressed by reducing the residual stress of the adhesive sheet using the support frame of the present invention. be able to.

In the above embodiment, the plurality of plate-like members 3 are movably supported on the step portion 23 formed on the frame body 2, but the frame body is not limited to the one having the step portion 23, and the step portion 23. It may consist of a general support frame that does not have. In that case, it is only necessary that the plate-like member 3 is supported on the surface of the frame body via the support portion.
Moreover, in the said embodiment, although the to-be-attached part was comprised with the eight plate-shaped members 3, the number of the plate-shaped members 3 is not specifically limited, The number can be increased / decreased arbitrarily. Furthermore, as a to-be-pasted part, you may comprise not only what consists of a several plate-shaped member but one cyclic | annular member continued in cyclic | annular form, and in this case, a cyclic | annular member is expanded-contracted in the circumferential direction. It is only necessary to be supported so as to be freely movable in the radial direction of the frame body.
Further, the support portion 4 is not limited to a member constituted by a rail member 41 provided on the frame body 2 and a slide member 42 fixed to the plate-like member 3, and a rail member is provided on the plate-like member 3 side. The guide groove may be formed on the frame body 2 side.

1 Support frame 2 Frame body 3 Plate member (bonded part)
4 Supporting part 5 C ring (biasing means)
41 Rail member 42 Slide member S Adhesive sheet W Wafer (Substrate)

Claims (3)

A support frame for supporting an adherend via an adhesive sheet,
A frame main body that is spaced apart from the outer periphery of the adherend and can be disposed surrounding the outer periphery;
A portion to be pasted to which the adhesive sheet is pasted;
Wherein provided on the frame body, and a support portion for supporting the object to be sticking part movably relative to the frame body,
Wherein the sticking part includes a support frame while being juxtaposed in the circumferential direction of the frame body, characterized in that it is movable in the radial direction before Symbol frame body by the tension from the adhesive sheet . Urging means for urging the adherend portion radially outward of the frame body;
The urging force of the urging means is set such that the amount of movement of the adherend to the tension from the adhesive sheet is larger than the amount of deformation of the adhesive sheet. The support frame as described. The support portion includes a plurality of rail members extending in the radial direction of the frame body, and slide members that are slidably supported by the rail members,
Wherein the sticking part, the support frame according to claim 1 or claim 2, characterized in that it is composed of a plurality of plate-like member connected before Symbol slide member.

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