JP5377225B2 - Communication system, RFID tag manufacturing method, and RFID tag - Google Patents

Description

  Communication system, RFID tag manufacturing method and RFID tag, communication system using RFID tag, method of manufacturing RFID tag responding to signal of predetermined frequency band and specific polarization component, and RFID tag manufactured by the method About.

  In recent years, communication systems using RFID (Radio Frequency IDentification) technology have become widespread. In this communication system, a read / write device (hereinafter “reader / writer device”) and an RFID tag communicate wirelessly.

  One component of the RFID tag is a micro IC (Integrated Circuit) chip. The IC chip is equipped with individual identification information, a predetermined arithmetic processing function, and the like, and enables management of each individual to which an RFID tag is attached and various information associated with each individual.

  The IC chip constituting the RFID tag can have a unique function. Depending on the environment in which the RFID tag is used, for example, an IC chip that supports long-distance or short-distance communication can be mounted.

  Further, there are an active type and a passive type as a method of supplying power to the RFID tag. The active RFID tag is driven by a built-in power source. A passive RFID tag is driven by power supply from a reader / writer device. Further, in the passive type, a method in which the coil antenna of the reader / writer device and the coil antenna on the RFID tag side are magnetically coupled and power is supplied by electromagnetic induction, or a method of power supply using the received power of the radio wave from the reader / writer device is used. These power supply methods are selectively used depending on the frequency band used for communication. For example, a method of supplying power by electromagnetic induction is employed in an RFID tag that communicates at a frequency in the HF (High Frequency) band. In addition, a method of supplying power using radio wave reception power is employed in RFID tags that communicate at a frequency in the UHF (Ultra High Frequency) band. The fed RFID tag is subjected to arithmetic processing based on a transmission signal transmitted from the reader / writer device by the IC chip. Then, the RFID tag transmits the processing result to the reader / writer device.

  The reader / writer device internally includes a transceiver that transmits a radio wave (carrier wave) including a transmission signal to the RFID tag and receives a radio wave including a return signal from the RFID tag according to the transmission signal. In this way, the reader / writer device can detect information stored in advance in the RFID tag from the return signal of the RFID tag in a non-contact manner.

  Next, a usage example of the communication system will be described. An RFID tag in which information on an individual to be managed (article name, management number, etc.) is stored in advance is assigned to the individual. Also, a reader / writer device is installed in a warehouse that manages and holds the individual. Each time an individual with an RFID tag is carried into or out of the warehouse, the RFID tag is detected by the reader / writer device, and for example, the number of individuals in the warehouse can be always grasped.

  Communication systems using RFID tags and reader / writer devices operate in various fields, such as railway ticket gate systems and event entrance ticket entrance systems (for example, see Patent Document 1) in addition to managing product inventory and equipment. Has been.

JP 2005-284515 A

  In the communication system as described above, the RFID tag transmits a radio wave including a return signal from the antenna connected to the IC chip to the reader / writer device. This radio wave becomes a signal corresponding to a predetermined frequency band of the IC chip, and there is a problem that the reader / writer device cannot recognize a radio wave other than the designated frequency band.

  In addition, the polarization component of the radio wave may change depending on the material of the antenna and other external factors. The reader / writer device has a problem that it cannot recognize radio waves other than the designated polarization component.

Moreover, since the communication system is operated in various fields as described above, a communication system that can communicate in various usage environments is required.
SUMMARY OF THE INVENTION It is an object of the present invention to provide a communication system, an RFID tag manufacturing method, and an RFID tag that can solve the above problems at the same time and can be applied to various use environments and conditions.

In order to achieve the above object, a communication system using an RFID tag is provided.
In this communication system , a tag antenna for transmitting and receiving signals is associated with a predetermined frequency band, the tag antenna is connected to each other, and the first of the frequency bands is connected via the tag antenna . receiving a signal, and a plurality of semiconductor chips for transmitting a second signal, the RFID tag comprising an antenna unit for transmitting and receiving the first signal and the second signal to the RFID tag, the tag antenna and prior SL is transmitted through a predetermined polarization component of the second signal from, having, a reader-writer device and a filter unit for receiving the antenna unit.

In order to achieve the above object, a method of manufacturing an RFID tag that responds to a signal in a predetermined frequency band is provided.
The RFID tag manufacturing method includes a step of forming a substrate film, and a first semiconductor chip that has a first notch on a part of the outer periphery on the substrate film and responds to a first frequency band. A step of forming a first antenna layer disposed across the first notch, and the substrate so as to cover the first antenna layer and open an opening in a region where the first semiconductor chip is disposed. A step of forming a resist layer on the film; and a second semiconductor chip having a second notch on a part of the outer periphery on the resist layer and responding to a second frequency band. Forming a second antenna layer disposed across the substrate so that the opening is exposed.

In order to achieve the above object, a method of manufacturing an RFID tag that responds to a signal in a predetermined frequency band is provided.
The RFID tag manufacturing method includes a step of forming a substrate film and a first semiconductor chip that has a first notch at a part of the outer periphery on the substrate film and responds to a first frequency band. Forming a first antenna layer in which electrodes to be arranged are respectively disposed in regions sandwiching the first notch, and forming a resist layer so as to cover the first antenna layer on the substrate film; The second semiconductor chip responding to the second frequency band has the second notch so as to overlap the first antenna layer on the resist layer. Forming a second antenna layer disposed across the board.

  Wireless communication is possible in various usage environments and conditions.

It is a figure for demonstrating the hardware constitutions of the communication system in embodiment. It is a figure for demonstrating the hardware constitutions of IC chip which comprises a communication system. It is a figure for demonstrating the hardware constitutions of the filter part which comprises a reader / writer apparatus. It is FIG. (1) for demonstrating the RFID tag which comprises a communication system. It is FIG. (2) for demonstrating the RFID tag which comprises a communication system. It is FIG. (1) for demonstrating the manufacturing method of the RFID tag by which several IC chip is arrange | positioned. It is FIG. (2) for demonstrating the manufacturing method of the RFID tag by which several IC chip is arrange | positioned. It is a figure for demonstrating another RFID tag which comprises a communication system. It is FIG. (1) for demonstrating the manufacturing method of another RFID tag by which several IC chip is arrange | positioned. It is FIG. (2) for demonstrating the manufacturing method of another RFID tag by which several IC chip is arrange | positioned.

Hereinafter, embodiments will be described.
FIG. 1 is a diagram for explaining a hardware configuration of a communication system according to the embodiment, FIG. 2 is a diagram for explaining a hardware configuration of an IC chip constituting the communication system, and FIG. 3 is a reader / writer device. It is a figure for demonstrating the hardware constitutions of a filter part.

The communication system 1 includes an RFID tag 2, a reader / writer device 3 that can communicate with the RFID tag 2, and a communication processing device 4 connected to the reader / writer device 3.
The RFID tag 2 includes antenna units 21a and 21b and two types of IC chips 22a and 22b connected to the antenna units 21a and 21b, respectively.

  The antenna units 21a and 21b are antennas for transmitting and receiving radio waves in a predetermined frequency band. The antenna units 21a and 21b output reception signals included in radio waves received from other communication devices to the IC chips 22a and 22b. The antenna units 21a and 21b transmit radio waves including transmission signals acquired from the IC chips 22a and 22b to other communication devices.

  The IC chips 22a and 22b are passive types, execute arithmetic processing based on information (processing request) included in signals received by the antenna units 21a and 21b, and send the processing results via the antenna units 21a and 21b. respond. Further, the IC chips 22a and 22b correspond to, for example, type B or type C of the international standard ISO / IEC 18000-6 relating to UHF frequency band communication.

  As shown in FIG. 2, the IC chips 22a and 22b include antenna ends 22a1 and 22b1, storage units 22a2 and 22b2, power supply control units 22a3 and 22b3, transmission units 22a4 and 22b4, reception units 22a5 and 22b5, and a control unit. 22a6 and 22b6 are provided.

  The antenna ends 22a1 and 22b1 are connected to the antenna units 21a and 21b, respectively, and output reception signals included in radio waves acquired from the antenna units 21a and 21b to the power supply control units 22a3 and 22b3 and the reception units 22a5 and 22b5, respectively. The antenna ends 22a1 and 22b1 output transmission signals acquired from the transmission units 22a4 and 22b4 to the antenna units 21a and 21b, and radio waves including the output transmission signals are transmitted from the antenna units 21a and 21b to other communication devices. Is done.

The storage units 22a2 and 22b2 are non-volatile memories for storing programs necessary for the processing of the control units 22a6 and 22b6 and information on transmission signals transmitted from other communication devices.
The power supply control units 22a3 and 22b3 generate power for the antenna units 21a and 21b to drive the IC chips 22a and 22b by the received power of radio waves from the reader / writer device 3, and supply the power to the respective units of the IC chips 22a and 22b.

  The transmission units 22a4 and 22b4 modulate and frequency-convert the processing results acquired from the control units 22a6 and 22b6 into transmission signals in a predetermined frequency band and output the result to the antenna ends 22a1 and 22b1.

  The receiving units 22a5 and 22b5 frequency-convert and demodulate received signals in a predetermined frequency band acquired from the antenna ends 22a1 and 22b1, extract processing requests included in the received signals, and output the processing requests to the control units 22a6 and 22b6.

The control units 22a6 and 22b6 execute processing corresponding to the processing request acquired from the receiving units 22a5 and 22b5, and output the result to the transmitting units 22a4 and 22b4.
Further, as shown in FIG. 1, the reader / writer device 3 includes an antenna end 31, a transmission unit 32, a reception unit 33, a storage unit 34, a control unit 35, and a communication interface 36 connected to the antenna unit 31 a. In addition, the filter part 5 is further installed in the antenna part 31a.

  The antenna unit 31a is an antenna for transmitting and receiving radio waves in a predetermined frequency band, similarly to the antenna units 21a and 21b. The antenna unit 31 a outputs a reception signal included in the radio wave received from the RFID tag 2 to the antenna end 31. The antenna unit 31 a transmits a radio wave including a transmission signal acquired from the antenna end 31 to the RFID tag 2.

  The antenna end 31 is connected to the antenna unit 31 a and outputs a reception signal acquired from the antenna unit 31 a to the reception unit 33. The antenna end 31 outputs a transmission signal acquired from the transmission unit 32 to the antenna unit 31a, and the output transmission signal is transmitted from the antenna unit 31a to the RFID tag 2.

The transmission unit 32 modulates and frequency-converts the processing result acquired from the control unit 35 into a transmission signal in a predetermined frequency band and outputs the result to the antenna end 31.
The receiving unit 33 frequency-converts and demodulates a received signal in a predetermined frequency band acquired from the antenna end 31, extracts a processing request included in the received signal, and outputs the processing request to the control unit 35.

  Note that if the receiving unit 33 limits the antenna unit 31a to receive only radio waves having a specific polarization component, a signal with a different polarization component cannot be received, and the information of the RFID tag 2 is correctly demodulated. There are cases where it is not possible. For this reason, the receiving unit 33 is configured to be able to receive the characteristic value of the received radio wave with a width. For example, the receiving unit 33 is configured to receive a frequency in a range of −F1 ≦ f1 ≦ F1 with respect to a radio wave having a frequency f1.

The storage unit 34 is a non-volatile memory for storing a program and the like necessary for the processing of the control unit 35.
The control unit 35 performs arithmetic processing according to a processing request by the receiving unit 33 and the communication processing device 4 described later. Alternatively, the data is output to the transmission unit 32. Note that the control unit 35 accesses the storage unit 34 as necessary, and reads information stored in the storage unit 34.

  The communication interface 36 is connected to the control unit 35 and the communication processing device 4. The communication interface 36 transmits a processing request signal from the communication processing device 4 to the control unit 35, and transmits a signal from the control unit 35 to the communication processing device 4.

  Note that the reader / writer device 3 transmits radio waves including transmission signals respectively corresponding to type B and type C of the international standard ISO / IEC 18000-6 for communication. Alternatively, two reader / writer devices 3 for transmitting radio waves having frequencies corresponding to types B and C of the international standard ISO / IEC 18000-6 for communication may be prepared.

  The communication processing device 4 is connected to the communication interface 36 of the reader / writer device 3. The communication processing device 4 causes the reader / writer device 3 to transmit a radio wave including a transmission signal to the RFID tag 2. In addition, the communication processing device 4 performs a predetermined calculation process using the received signal held by the reader / writer device 3 transmitted from the RFID tag 2. The communication processing device 4 can also cause the reader / writer device 3 to set the switching time interval between the filters 5a and 5b of the filter unit 5 described below.

  The filter unit 5 limits the reception of radio waves from the RFID tag 2 by passing only radio waves of a specific polarization component and not passing other radio waves. Specifically, as shown in FIG. 3, the filter unit 5 includes two types of filters 5a and 5b having different radio wave transmission components, and a filter switching unit 5c that switches these filters 5a and 5b at a predetermined time interval. Have. For example, the frequencies that can be transmitted by the filters 5a and 5b are f1, f2, (0 <f1 <f2 ≦ F1), and the filters 5a and 5b are switched at a predetermined time interval. By using a plurality of filters having different radio wave transmission components, it is possible to separate radio waves to be transmitted.

Next, operation | movement of the communication system 1 provided with such a structure is demonstrated.
In the communication system 1, the communication processing device 4 causes the reader / writer device 3 to transmit the radio wave including the transmission signal in the type B or type C frequency band to the RFID tag 2.

  One of the IC chips 22a and 22b of the RFID tag 2 corresponding to the frequency band of the transmission signal transmitted from the reader / writer device 3 operates. That is, if the frequency band of the transmission signal is type B, the IC chip 22a receives the transmission signal and starts power feeding when the frequency band of the transmission signal is type C. Then, one of the IC chips 22a and 22b that has started supplying power performs a predetermined calculation process, and radio waves including a return signal as a processing result are transmitted from the antenna units 21a and 21b.

At this time, the polarization components of the radio waves transmitted from the antenna units 21a and 21b change depending on the material of the antenna units 21a and 21b and other external factors.
In the reader / writer device 3, the filter unit 5 limits the polarization component of the radio wave so that the reception unit 33 can receive the polarization component. Specifically, the filters 5a and 5b are switched at predetermined time intervals depending on the difference in the polarization component of the radio wave transmitted from the RFID tag 2, and are separated into the polarization components of f1 and f2, and received.

  As described above, the receiving unit 33 can receive different types of polarized waves. The receiving unit 33 demodulates the radio wave having the polarization components f1 and f2 separated by the filter unit 5 and acquires a reply signal. A processing request included in the reply signal is extracted and output to the control unit 35, and predetermined arithmetic processing is performed by the control unit 35.

  As described above, in the communication system 1, the IC tags 22 a and 22 b corresponding to the predetermined frequency bands are arranged on the RFID tag 2. By changing the polarization component of the radio wave transmitted from the RFID tag depending on the reading environment and external factors, and using the filters 5a and 5b, the radio wave polarization component changed by the RFID tag 2 can be separated and received. Thus, the RFID tag 2 and the reader / writer device 3 can be reliably communicated, and communication according to each frequency band is possible.

A specific example of the RFID tag 2 including the two IC chips 22a and 22b will be described below.
Example 1
4 and 5 are diagrams for explaining the RFID tag constituting the communication system. 4A is a plan view of the RFID tag 2, and FIG. 4B is an enlarged view of the IC mounting portion 2e of the RFID tag 2. 4C, 5A, and 5B are cross-sectional views taken along one-dot chain line AA in FIG. 4A and one-dot chain lines BB and CC in FIG. 4A, respectively. . In FIG. 4B, the arrangement positions of the IC chips 22a and 22b are indicated by two-dot chain lines.

  The RFID tag 2 has a laminated structure, and an IC chip 22a is disposed on the antenna layer 2b formed on the film layer 2a so as to straddle the notch 2d1 of the antenna portion 21a of the antenna layer 2b. A resist layer 2c having an opening 2c1 is formed on the film layer 2a and the antenna layer 2b. An antenna layer 2d is formed on the resist layer 2c. An IC chip 22b is disposed on the uppermost antenna layer 2d so as to straddle the notch 2b1 of the antenna portion 21b of the antenna layer 2d.

Hereinafter, description will be continued with reference to a cross-sectional view of the RFID tag 2 and a cross-sectional view of the IC mounting portion 2e of the RFID tag 2.
As shown in the cross-sectional view taken along the alternate long and short dash line AA, the RFID tag 2 includes a film layer 2a, an antenna layer 2b, a resist layer 2c, and an antenna layer 2d, which are sequentially stacked (FIG. 4C).

  The IC chip 22a has bumps so as to straddle the notch 2d1 on the antenna layer 2d further formed on the film layer 2a and the resist layer 2c, which are sequentially laminated, as shown in the cross-sectional view along the alternate long and short dash line BB. The electrodes are joined through the electrode 221a (FIG. 5A).

  As shown in the cross-sectional view by the alternate long and short dash line C-C, the IC chip 22b includes a film layer 2a, an antenna layer 2b, a resist layer 2c, and an antenna layer 2d that are sequentially stacked on the antenna layer 2b in the opening 2c1. It joins via the bump electrode 221b so that the notch part 2b1 may be straddled (FIG. 5 (B)).

Next, a method for manufacturing such an RFID tag 2 will be described.
6 and 7 are diagrams for explaining a method of manufacturing an RFID tag in which a plurality of IC chips are arranged. 6A and 6A are plan views, FIG. 6B is an enlarged plan view of the IC mounting portion 2e of the RFID tag 2, and FIG. 6C is a cross-sectional view taken along the alternate long and short dash line AA in FIG. .

  First, the film layer 2a is prepared by using, for example, a PET film, a PEN film, or a PI film as a base. For example, copper or aluminum foil is sequentially laminated on the film layer 2a via an adhesive. Copper or aluminum foil is etched into a predetermined antenna shape to form an antenna layer 2b having a notch 2b1. The outer peripheral edge of the antenna layer 2b where the notch 2b1 is formed becomes the antenna portion 21b (FIG. 6).

  In addition, the formation method of the antenna layer 2b is not restricted to said method, The following method may be sufficient. For example, a paste-like antenna member in which conductive fine particles such as silver and aluminum are mixed with a resin component is manufactured. The antenna member is printed on the film layer 2a with a squeegee using a printing plate having a predetermined shape formed on the film layer 2a. The antenna layer 2b is formed by heat-treating the printed antenna member and curing it. Alternatively, it is also possible to form a similar antenna layer 2b in which a notch 2b1 is formed by sputtering using a metal particle such as copper or aluminum after forming a mask on the film layer 2a.

  Next, on the antenna layer 2b formed on the film layer 2a and the film layer 2a, a resist layer 2c having an opening 2c1 opening an area of the notch 2b1 of the antenna layer 2b is formed. 7A and 7B, the region of the antenna layer 2b covered with the resist layer 2c is indicated by a two-dot chain line (FIG. 7).

  Next, the antenna layer 2d in which the notch 2d1 is partially formed is formed on the resist layer 2c by any one of the methods for forming the antenna layer 2b described above. However, the antenna layer 2d is formed so that a part thereof overlaps with the portion other than the antenna portion 21b of the antenna layer 2b. Further, the outer peripheral edge of the antenna layer 2d where the notch portion 2d1 is formed becomes the antenna portion 21a.

Next, the IC chips 22a and 22b are respectively joined to the antenna layers 2d and 2b so as to straddle the notch 2d1 and the notch 2b1 in the opening 2c1 (so as to face each other).
As a method of joining the IC chips 22b and 22a, the IC chips 22a and 22b are respectively disposed on the adhesive applied to the notches 2d1 and 2b1, and the applied adhesive is thermally cured to fix the IC chips 22a and 22b. Then, the electrodes (bumps) of the IC chips 22a and 22b and the antenna layers 2d and 2b are electrically joined. As the adhesive at this time, either an anisotropic conductive adhesive or an insulating adhesive is used depending on the antenna material (FIGS. 4 and 5).

  As another arrangement method, an anisotropic conductive film is stuck on the notches 2d1 and 2b1. The IC chips 22a and 22b are placed on the pasted film, and the resin components in the film are thermally cured by heat treatment to fix the IC chips 22a and 22b, respectively. The electrodes (bumps) of the IC chips 22a and 22b and the antenna Layers 2d and 2b are electrically joined.

  In the RFID tag 2 formed in this way, the antenna units 21a and 21b receive transmission signals from the reader / writer device 3, respectively. The received transmission signal is input to the IC chips 22a and 22b via the bump electrodes 221a and 221b, respectively. One of the IC chips 22a and 22b corresponding to the frequency band of the input transmission signal starts its operation. Further, calculation processing is performed in the IC chips 22a and 22b based on the input transmission signal. A reply signal of processing result information is transmitted from the IC chips 22a and 22b to the reader / writer device 3 from the antenna portions 21a and 21b via the bump electrodes 221a and 221b.

  Here, since the antenna layers 2b and 2d are configured by sandwiching an insulating resist, the polarization component of the radio wave transmitted from the antenna layer 2b and the polarization component of the radio wave transmitted from the antenna layer 2d are different. Has different characteristics. The filter unit 5 installed in the antenna unit 31a of the reader / writer device 3 can select and receive a radio wave having a characteristic value in a desired range.

  Therefore, in the communication system 1, an appropriate frequency band can be selected according to the use environment and use conditions, and the RFID tag 2 and the reader / writer device 3 can be reliably communicated using the selected frequency band. Become.

  In addition, in FIG. 4 of Example 1, the case where the notch parts 2b1 and 2d1 of the antenna layers 2b and 2d are close to each other in a plan view has been described. In addition to this case, the antenna layer 2d can be formed on the resist layer 2c as long as the opening 2c1 is not blocked. Further, the cutout portions 2b1 and 2d1 of the antenna layers 2b and 2d can be formed not only at the positions in FIG. 4 but also at the outer peripheral edges of the antenna layers 2b and 2d as long as they do not overlap each other.

Next, another example of the RFID tag will be described.
(Example 2)
FIG. 8 is a diagram for explaining another RFID tag constituting the communication system. 8A is a plan view of the RFID tag 12, FIG. 8B is an enlarged cross-sectional view of the IC mounting portion 12e, and FIG. 8C is a cross-sectional view taken along one-dot chain line DD in FIG. Further, in FIG. 8B, the installation positions of the IC chips 22a and 22b are respectively represented by two-dot chain lines.

  The RFID tag 12 has a laminated structure as in the case of the RFID tag 2 of the first embodiment. Specifically, the film layer 12a, the antenna layer 12b formed on the film layer 12a and partially formed with a notch 12b1, and the resist layer 12c formed on the film layer 12a and the antenna layer 12b. And an antenna layer 12d formed on the resist layer 12c and having a notch 12d1 formed in part (FIG. 8).

  Similarly to the case of the RFID tag 2 of the first embodiment, the IC chip 22a is bonded on the antenna layer 12d so as to straddle the notch 12d1 via the bump electrode 221a. The IC chip 22b is disposed on the antenna layer 12d and is electrically joined to a region sandwiching the notch portion 12b1 of the antenna layer 12b via a bump electrode 222b penetrating the antenna layer 12d and the resist layer 12c. (FIG. 8C).

Next, a method for manufacturing such an RFID tag 12 will be described.
9 and 10 are diagrams for explaining another method of manufacturing an RFID tag in which a plurality of IC chips are arranged. 9 and 10 are plan views, and cross-sectional views taken along one-dot chain line AA in FIGS. 9 and 10 are the same as FIGS. 6C and 7C, respectively.

  First, the film layer 12a is prepared using, for example, a PET film, a PEN film, or a PI film as a base. For example, copper or aluminum foil is sequentially laminated on the film layer 12a via an adhesive. Copper or aluminum foil is etched into a predetermined antenna shape to form an antenna layer 12b having a notch 12b1. The outer peripheral edge of the antenna layer 2b where the notch 2b1 is formed becomes the antenna part 21b (FIG. 9).

  The method for forming the antenna layer 12b may be the following method in addition to the above method, as in the case of the antenna layer 2b of the first embodiment. A paste-like antenna member, which is a conductive fine particle, for example, a mixture of silver, aluminum, and a resin component is produced. The antenna member is printed on the film layer 12a with a squeegee using a printing plate having a predetermined shape formed on the film layer 12a. The printed antenna member is subjected to heat treatment and cured to form the antenna layer 12b in which the notch 12b1 is formed on the outer peripheral edge. Alternatively, it is also possible to form a similar antenna layer 12b in which a notch 12b1 is formed by sputtering using a metal particle such as copper or aluminum after forming a mask on the film layer 12a.

  Next, a resist layer 12c is formed on the antenna layer 12b and the film layer 12a on which the antenna layer 12b is formed (FIG. 10). In FIG. 10, the formation position of the antenna layer 12b is indicated by a two-dot chain line.

  Next, similarly to the method for forming the antenna layer 12b, the antenna layer 12d having a notch 12d1 formed in part is formed on the resist layer 12c so as to overlap the antenna layer 12b (FIG. 8B). .

In order to penetrate the bump electrode 222b, a paste-like antenna member in which conductive fine particles and a resin component are mixed is used.
Next, the IC chips 22b and 22a are joined to the antenna layers 12b and 12d via the bump electrodes 222b and 221a so as to face the notches 12b1 and 12d1, respectively. As a bonding method of the IC chip 22b (bonding method of the bump electrode 222b and the antenna layer 12a), for example, an insulating film (not shown) is formed on the antenna layer 12d, an adhesive is applied to a predetermined region, and ultrasonic mounting is performed. A hole penetrating the antenna layer 12d and the resist layer 12c is formed while the insulating film is wound. The adhesive is thermally cured by heating together with ultrasonic mounting, the IC chip 22b is fixed, and the electrode of the IC chip 22b and the antenna layer 12d are electrically joined. Note that the antenna layer 12d and the resist layer 12c inside the hole are covered with the insulating film by forming the hole while winding the insulating film together with the ultrasonic mounting. Therefore, the insulation between the bump electrode 222b, the antenna layer 12d, and the resist layer 12c is maintained.

  Further, as a method of joining the IC chip 22a, as in the case of the first embodiment, the IC chip 22a is disposed on the adhesive applied to the notch 12d1, and the applied adhesive is heat-cured to form the IC chip 22a. And the electrode of the IC chip 22a and the antenna layer 12d are electrically joined. As the adhesive at this time, either an anisotropic conductive adhesive or an insulating adhesive is selected depending on the antenna material. Alternatively, an anisotropic conductive film is attached to the notch 12d1. The IC chip 22a is arranged on the attached film, the resin component in the film is thermally cured by heat treatment, the IC chip 22a is fixed, and the electrode of the IC chip 22a and the antenna layer 12d are electrically joined.

  In the RFID tag 12 formed in this way, the antenna units 21a and 21b receive transmission signals from the reader / writer device 3, respectively. The received transmission signal is input to the IC chips 22a and 22b via the bump electrodes 221a and 222b, respectively. One of the IC chips 22a and 22b corresponding to the frequency band of the input transmission signal starts its operation. Further, calculation processing is performed in the IC chips 22a and 22b based on the input transmission signal. A reply signal of processing result information is transmitted from the IC chips 22a and 22b to the reader / writer device 3 from the antenna portions 21a and 21b via the bump electrodes 221a and 222b.

  Further, even when the characteristic value of the radio wave including the reply signal from the RFID tag 2 varies by the filter unit 5 installed in the antenna unit 31a of the reader / writer device 3, the radio wave having a characteristic value in a desired range can be received. it can.

Here, since the antenna layers 12b and 12d are configured by sandwiching an insulating resist, the polarization component of the radio wave transmitted from the antenna layer 12b and the polarization component of the radio wave transmitted from the antenna layer 12d are different. Has different characteristics. The filter unit 5 installed in the antenna unit 31a of the reader / writer device 3 can select and receive a radio wave having a specific polarization component.
Therefore, in the communication system 1, an appropriate frequency band can be selected according to the usage environment and usage conditions, and the RFID tag 2 and the reader / writer device 3 can be reliably communicated using the selected frequency band. Become. Further, space saving can be achieved as compared with the first embodiment.

  In FIG. 8 of the second embodiment, the case where the antenna layers 12d and 12b are overlapped with each other and the notches 12d1 and 12b1 are formed on the outer peripheral edge on the same side in the plan view has been described. In addition to this case, the notches 12d1 and 12b1 can be formed on the outer peripheral edges of the antenna layers 12d and 12b as long as they do not overlap each other.

DESCRIPTION OF SYMBOLS 1 Communication system 2,12 RFID tag 2a, 12a Film layer 2b, 2d, 12b, 12d Antenna layer 2b1, 2d1, 12b1, 12d1 Notch 2c, 12c Resist layer 2c1, 12c1 Opening 2e, 12e IC mounting part 3 Reader Writer device 4 Communication processing device 5 Filter unit 5a, 5b Filter 5c Filter switching unit 21a, 21b, 31a Antenna unit 22a, 22b IC chip 22a1, 22b1, 31 Antenna end 22a2, 22b2 34 Storage unit 22a3, 22b3 Power supply control unit 22a4 22b4, 32 Transmitter 22a5, 22b5, 33 Receiver 22a6, 22b6, 35 Controller 36 Communication interface 221a, 221b, 222b Bump electrode

Claims (8)

A tag antenna for transmitting and receiving signals is associated with a predetermined frequency band, the tag antenna is connected to each other, and the first signal in the frequency band is received via the tag antenna . a RFID tag comprising a plurality of semiconductor chips for transmitting a second signal, and
Wherein the antenna portion with respect to the RFID tag for transmitting and receiving the first signal and the second signal, by transmitting a predetermined polarization component before Symbol second signal from the tag antenna, receiving the antenna portion and the reader-writer device and a filter portion which causes,
A communication system comprising:
  The communication system according to claim 1, wherein the filter unit includes a plurality of filters that transmit radio waves according to the polarization component, and switches the filters every predetermined time. In a method of manufacturing an RFID tag that responds to a signal in a predetermined frequency band,
Forming a substrate film;
On the substrate film, a first antenna layer having a first cutout portion at a part of an outer peripheral edge and a first semiconductor chip that responds to a first frequency band is disposed across the first cutout portion. Forming, and
Forming a resist layer on the substrate film so as to cover the first antenna layer and open an opening in a region where the first semiconductor chip is disposed;
A second antenna layer having a second notch on a part of the outer periphery on the resist layer, and a second semiconductor chip that responds to a second frequency band is disposed across the second notch Forming the opening to be exposed;
The manufacturing method of the RFID tag characterized by having. In a method of manufacturing an RFID tag that responds to a signal in a predetermined frequency band,
Forming a substrate film;
An electrode connected to the first semiconductor chip that has a first notch on a part of the outer peripheral edge on the substrate film and responds to the first frequency band is located in a region sandwiching the first notch, respectively. Forming a first antenna layer to be disposed;
Forming a resist layer on the substrate film so as to cover the first antenna layer;
A second notch is formed in a part of the outer periphery so as to overlap the first antenna layer on the resist layer, and a second semiconductor chip responding to the second frequency band straddles the second notch Forming a second antenna layer disposed in
The manufacturing method of the RFID tag characterized by having.   The RFID tag manufacturing method according to claim 4, wherein the second antenna layer is formed so that the second cutout portion does not overlap the first cutout portion.   The method further includes the step of forming, in the second antenna layer and the resist layer, a hole that reaches the region where the electrode sandwiching the first notch portion of the first antenna layer is disposed together with ultrasonic mounting. A method for manufacturing an RFID tag according to claim 5. In an RFID tag that responds to a signal in a predetermined frequency band,
A substrate film;
A first semiconductor chip formed on the substrate film, having a first notch at a part of an outer peripheral edge and responsive to a first frequency band is disposed across the first notch. An antenna layer;
A resist layer formed on the substrate film, covering the first antenna layer and having an opening in an area where the first semiconductor chip is formed;
The second semiconductor chip responding to the second frequency band is formed on the resist layer so as to expose the opening, and the second semiconductor chip responding to the second frequency band has a second notch. A second antenna layer disposed across
An RFID tag comprising: In an RFID tag that responds to a signal in a predetermined frequency band,
A substrate film;
An electrode connected to the first semiconductor chip responding to the first frequency band sandwiches the first notch, having a first notch at a part of the outer periphery formed on the substrate film. A first antenna layer disposed in each region;
A resist layer formed on the substrate film so as to cover the first antenna layer;
A second notch that is formed on the resist layer so as to overlap the first antenna layer and does not overlap the first notch is formed at a part of the outer periphery, and is responsive to the second frequency band. A second antenna layer in which two semiconductor chips are disposed across the second notch,
An RFID tag comprising:

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