JP5373215B1 - System, manufacturing condition determination device and manufacturing management device - Google Patents

Abstract

To provide a system, a manufacturing condition determining device, and a manufacturing management device capable of easily and reliably manufacturing a covering sheet suitable for an optical semiconductor device in an optical semiconductor device manufacturing factory.
A system includes a manufacturing condition determining device and a sheet manufacturing management device, and the manufacturing condition determining device stores first information relating to an optical semiconductor element and an optical semiconductor device. First memory 6, second memory 7 storing second information 16 related to varnish 11, first information 15 stored in first memory 6, and second information stored in second memory 7 The sheet manufacturing management apparatus 3 includes a third memory 23 for storing third information 17 related to the manufacturing conditions determined by the first CPU 8, and a third memory 23. And a second CPU 25 for managing the manufacturing conditions of the sheet manufacturing process S2 based on the third information 7 stored in the table.
[Selection] Figure 1

Description

  The present invention relates to a system, a manufacturing condition determining device, and a manufacturing management device, and more particularly to a system, a manufacturing condition determining device, and a manufacturing management device that determine and manage manufacturing conditions in an optical semiconductor device manufacturing method.

  In recent years, as a method for manufacturing an optical semiconductor device, a varnish containing particles and a curable resin is manufactured, a covering sheet such as a B-stage sealing sheet is manufactured from the varnish, and the optical semiconductor element is covered with the covering sheet. A method is being considered.

  For example, there is proposed a method for manufacturing an LED device by covering a light emitting diode mounted on a substrate with a phosphor layer made of a thermosetting resin of a B stage and then converting the phosphor layer into a C stage. (For example, refer to Patent Document 1 below.)

JP 2009-060031 A

  However, the sealing sheet including the phosphor layer is manufactured at a sealing sheet manufacturing factory, and the sealing sheet manufactured there is shipped to the LED device manufacturing factory. In addition, in the sealing sheet manufacturing factory, the information related to the light emitting diode and the LED device is provided from the LED device manufacturing factory, and based on the information and the information related to the varnish, the sealing sheet suitable for the target LED device Determine manufacturing conditions.

  However, when there is a change in the semiconductor element and / or the optical semiconductor device in the LED device manufacturing factory, the sealing sheet is remanufactured in response to those changes in the sealing sheet manufacturing factory, It is necessary to transport the different types of remanufactured sealing sheets to the LED device manufacturing factory. Therefore, there is a problem that it takes time and effort.

  On the other hand, it is also tentative to provide a sealing sheet manufacturing factory in the LED device manufacturing factory and omit the above-described labor and time.

  However, the LED device manufacturing factory has a problem that information relating to the varnish is not sufficient and the manufacturing conditions of the sealing sheet cannot be determined accurately.

  An object of the present invention is to provide a system, a manufacturing condition determination device, and a manufacturing management device that can easily and surely manufacture a covering sheet suitable for an optical semiconductor device in an optical semiconductor device manufacturing factory.

  In order to achieve the above object, the system of the present invention comprises a varnish production process for producing a varnish containing particles and a curable resin, a sheet production process for producing a B-stage coated sheet from the varnish, and the coated sheet. A system for determining and managing manufacturing conditions of the sheet manufacturing process in an optical semiconductor device manufacturing method including a coating process for coating an optical semiconductor element, the system including a manufacturing condition determining apparatus and a manufacturing management apparatus The manufacturing condition determining apparatus includes a first information storage area for storing first information related to the optical semiconductor element and the optical semiconductor device, and a second information storage area for storing second information related to the varnish. Based on the first information stored in the first information storage area and the second information stored in the second information storage area. Determining means for determining manufacturing conditions, wherein the manufacturing management device stores a third information storage area for storing third information related to the manufacturing conditions determined by the determining means, and a third information storage area. Management means for managing the manufacturing conditions of the sheet manufacturing process based on the stored third information.

  In this system, the manufacturing condition determination apparatus includes a first information storage area, a second information storage area, and a determination unit, while the manufacturing management apparatus includes a third information storage area and a management unit.

  The manufacturing condition determination device stores the first information and the second information in the first information storage area and the second information storage area, respectively, and the determination means determines the manufacturing conditions of the sheet manufacturing process. This can be provided to the manufacturing management device.

  In the manufacturing management apparatus, the third information related to the manufacturing conditions provided from the manufacturing condition determining apparatus is stored in the third information storage area, and the sheet manufacturing process is performed by the management means based on the third information. Manage manufacturing conditions.

  Therefore, the manufacturing conditions of the sheet manufacturing process can be determined by the manufacturing condition determination apparatus separately from the manufacturing management apparatus, and can be managed by the manufacturing management apparatus.

  Moreover, the 3rd information relevant to the manufacturing conditions of the sheet manufacturing process provided from a manufacturing condition determination apparatus is based on 1st information and 2nd information. Therefore, the production management device can accurately manage the production conditions of the sheet production process by the management unit based on the third information provided from the production condition determination device. As a result, the target optical semiconductor device can be manufactured with high accuracy.

  The system of the present invention further determines and manages the manufacturing conditions of the varnish manufacturing process, and the determining means includes the first information stored in the first information storage area and the second information storage area. The manufacturing condition of the varnish manufacturing process is further determined based on the second information stored in the varnish, and the management means determines the varnish based on the third information stored in the third information storage area. It is preferable to further manage the manufacturing conditions of the manufacturing process.

  In this system, the determining means further determines manufacturing conditions of the varnish manufacturing process based on the first information stored in the first information storage area and the second information stored in the second information storage area, The management means further manages the manufacturing conditions of the varnish manufacturing process based on the third information stored in the third information storage area. Therefore, a covering sheet suitable for the target optical semiconductor device can be manufactured with high accuracy, and further, the target optical semiconductor device can be manufactured with high accuracy.

  In the system of the present invention, it is preferable that the first information includes information related to a substrate on which the optical semiconductor element is mounted.

  According to this system, since the first information includes information related to the substrate on which the optical semiconductor element is mounted, the manufacturing condition determining apparatus also includes information related to the substrate on which the optical semiconductor element is mounted. It can be provided with information.

  Therefore, based on the highly accurate third information related to the manufacturing conditions determined based on the first information, the manufacturing management apparatus can manage the manufacturing conditions of the sheet manufacturing process with higher accuracy.

  In the system of the present invention, the manufacturing management device includes at least one lot information of particles, curable resin, varnish, and optical semiconductor element, and / or a manufacturing amount of the optical semiconductor device per unit period. It is preferable that the apparatus includes a fourth information storage area that stores four information, and a correction unit that corrects the manufacturing conditions of the sheet manufacturing process based on the fourth information stored in the fourth information storage area. is there.

  Lot information of particles, curable resin, varnish, and optical semiconductor element varies from lot to lot. In addition, the manufacturing amount of the optical semiconductor device per unit period varies for each unit period. Therefore, the physical properties of the manufactured optical semiconductor device may vary from lot to lot and / or unit period. In such a case, it is complicated for the manufacturing condition determination device to determine the manufacturing conditions based on the fourth information every time.

  However, in this system, in the production management apparatus, at least one lot information of particles, curable resin, varnish and optical semiconductor element stored in the fourth information storage area by the correcting means, and / or the unit period The manufacturing conditions of the sheet manufacturing process can be corrected based on the fourth information including the manufacturing amount of the hit optical semiconductor device. Therefore, the target optical semiconductor device can be accurately manufactured by correcting the manufacturing conditions of the sheet manufacturing process in response to fluctuations in the lot information and / or the manufacturing amount of the optical semiconductor device.

  In the system of the present invention, the manufacturing condition determining device includes a fifth information storage area for storing fifth information related to manufacturing conditions for manufacturing the cover sheet before this time, and the fifth information storage area includes the fifth information storage area. It is preferable to determine manufacturing conditions for manufacturing the covering sheet this time based on the stored fifth information.

  According to this system, the manufacturing condition determination device can accumulate the fifth information related to the manufacturing conditions for manufacturing the covering sheet before this time. Therefore, based on the manufacturing conditions accumulated in the past, a covering sheet suitable for the target optical semiconductor device can be manufactured this time, and further, the target optical semiconductor device can be manufactured accurately this time.

  The production condition determining apparatus of the present invention includes a varnish production process for producing a varnish containing particles and a curable resin, a sheet production process for producing a B-stage covering sheet from the varnish, and an optical semiconductor element covered with the covering sheet. A manufacturing condition determining device for determining manufacturing conditions of the sheet manufacturing process in an optical semiconductor device manufacturing method including a covering process to perform, a first information storage area for storing first information related to the optical semiconductor element A second information storage area for storing second information related to the varnish, the first information stored in the first information storage area, and the second information stored in the second information storage area And determining means for determining the manufacturing conditions based on information.

  The manufacturing condition determining apparatus includes a first information storage area, a second information storage area, and a determination unit.

  Therefore, according to this manufacturing condition determining apparatus, the first information and the second information are stored in the first information storage area and the second information storage area, respectively, and the manufacturing condition of the sheet manufacturing process is determined by the determining means. Can be determined.

  As a result, based on the manufacturing conditions of the sheet manufacturing process, the target optical semiconductor device can be manufactured with high accuracy.

  Further, the manufacturing condition determining apparatus of the present invention further determines manufacturing conditions of the varnish manufacturing process, and the determining means stores the first information stored in the first information storage area and the second information storing. It is preferable that the manufacturing conditions of the varnish manufacturing process are further determined based on the second information stored in the region.

  In the manufacturing condition determining apparatus, the determining means further determines the manufacturing conditions of the varnish manufacturing process based on the first information stored in the first information storage area and the second information stored in the second information storage area. decide. Therefore, a covering sheet suitable for the target optical semiconductor device can be manufactured with high accuracy, and further, the target optical semiconductor device can be manufactured with high accuracy.

  In the manufacturing condition determining apparatus of the present invention, it is preferable that the first information includes information related to a substrate on which the optical semiconductor element is mounted.

  According to this manufacturing condition determining apparatus, since the first information includes information related to the substrate on which the optical semiconductor element is mounted, the manufacturing condition determining apparatus also includes information related to the substrate on which the optical semiconductor element is mounted. It can be provided together with each of the information described above.

  Therefore, the target optical semiconductor device can be manufactured with high accuracy.

  Moreover, the manufacturing condition determination apparatus of the present invention includes a fifth information storage area for storing fifth information related to the manufacturing conditions for manufacturing the covering sheet before this time, and is stored in the fifth information storage area. It is preferable to determine manufacturing conditions for manufacturing the covering sheet this time based on the fifth information.

  According to this manufacturing condition determination device, it is possible to accumulate the fifth information related to the manufacturing conditions for manufacturing the covering sheet before this time. Therefore, based on the manufacturing conditions accumulated in the past, a covering sheet suitable for the target optical semiconductor device can be manufactured this time, and further, the target optical semiconductor device can be manufactured accurately this time.

  The production management device of the present invention is a varnish production process for producing a varnish containing particles and a curable resin, a sheet production process for producing a B-stage covering sheet from the varnish, and an optical semiconductor element covered with the covering sheet. A manufacturing management apparatus for managing manufacturing conditions of the sheet manufacturing process in an optical semiconductor device manufacturing method including a coating process, wherein the third information storage area stores third information related to the manufacturing conditions; Management means for managing the manufacturing conditions of the sheet manufacturing process based on the third information stored in the third information storage area.

  According to this manufacturing management apparatus, the third information related to the manufacturing conditions of the sheet manufacturing process is stored in the third information storage area, and based on the third information, the manufacturing means of the sheet manufacturing process is performed by the management means. Can be managed accurately.

  Therefore, the target optical semiconductor device can be manufactured with high accuracy.

  The production management device of the present invention further manages the production conditions of the varnish production process, and the management means performs the varnish production process based on the third information stored in the third information storage area. It is preferable to further manage the manufacturing conditions.

  According to this manufacturing management apparatus, since the management means further manages the manufacturing conditions of the varnish manufacturing process based on the third information stored in the third information storage area, the covering suitable for the target optical semiconductor device The sheet can be manufactured with high accuracy, and the target optical semiconductor device can be manufactured with high accuracy.

  The production management device of the present invention stores at least one kind of lot information of particles, curable resin, varnish, and optical semiconductor element, and / or fourth information including the production amount of the optical semiconductor device per unit period. Preferably, the information processing apparatus includes a fourth information storage area to be corrected, and a correction unit that corrects the manufacturing conditions of the sheet manufacturing process based on the fourth information stored in the fourth information storage area.

  Lot information of particles, curable resin, varnish, and optical semiconductor element varies from lot to lot. In addition, the manufacturing amount of the optical semiconductor device per unit period varies for each unit period. Therefore, the physical properties of the manufactured optical semiconductor device may vary from lot to lot and / or unit period. In such a case, it is complicated for the manufacturing condition determination device to determine the manufacturing conditions based on the fourth information every time.

  However, in this production management apparatus, the correction means stores at least one lot information of particles, curable resin, varnish and optical semiconductor element and / or light per unit period stored in the fourth information storage area. Based on the fourth information including the manufacturing amount of the semiconductor device, the manufacturing conditions of the sheet manufacturing process can be corrected. Therefore, the target optical semiconductor device can be accurately manufactured by correcting the manufacturing conditions of the sheet manufacturing process in response to fluctuations in the lot information and / or the manufacturing amount of the optical semiconductor device.

  According to the system of the present invention including the manufacturing condition determining device and the manufacturing management device of the present invention, the manufacturing management device can be determined separately from the manufacturing management device and managed by the manufacturing management device. Can do. Moreover, the target optical semiconductor device can be manufactured with high accuracy.

FIG. 1 shows a schematic block diagram of an embodiment of the system of the present invention. 2 is an enlarged cross-sectional view of the sealing sheet shown in FIG. 1, FIG. 2A is a sealing sheet composed only of a phosphor layer, and FIG. 2B is provided with a plurality of phosphor layers having different phosphor concentrations. 2C shows a sealing sheet comprising a resin layer having a recess opened downward and a phosphor layer filled in the recess, and FIG. 2D shows a phosphor layer having a substantially trapezoidal cross section. FIG. 2E shows a sealing sheet provided with a phosphor layer having a substantially rectangular cross section and a resin layer formed therearound. 3 is an enlarged cross-sectional view of the sealing sheet shown in FIG. 1. FIG. 3F is a sealing sheet including a resin layer and a phosphor layer formed on the upper side of the resin layer. FIG. 3G is a resin layer. And a phosphor sheet formed on the upper side of the resin layer and a functional layer formed on the lower side of the resin layer so as to surround a portion where the optical semiconductor element is formed. The schematic block diagram of the system of the modification of FIG. 1 is shown. FIG. 5 is an enlarged cross-sectional view of a modified example of the sealing sheet of FIG. 2A, FIG. 5A is a state in which the covering sheet is disposed opposite to the upper side of the sealing layer that covers the optical semiconductor element, and FIG. The state which laminates | stacks a sheet | seat on the upper surface of a sealing layer is shown.

[System configuration]
A system 1 according to an embodiment of the present invention is a system provided in a control department 5 of a sealing sheet manufacturing factory and an optical semiconductor device manufacturing factory 4 provided separately from the sealing sheet manufacturing factory. The system 1 includes a varnish production process S1 for producing a varnish 11 including particles and a curable resin, a sheet production process S2 for producing a sealing sheet 12 as a B-stage covering sheet from the varnish 11, and a sealing sheet 12. The manufacturing conditions of the varnish manufacturing process S1 and the sheet manufacturing process S2 in the manufacturing method of the optical semiconductor device 20 including the sealing process S3 (an example of the covering process) for sealing the optical semiconductor element 13 are determined and managed. The system 1 includes a manufacturing condition determination device 2 and a sheet manufacturing management device 3 as a manufacturing management device.

  The control department 5 is provided in a sealing sheet manufacturing factory capable of manufacturing the same sealing sheet 12 as the sealing sheet 12 manufactured by the sheet manufacturing apparatus 34 (described later) of the optical semiconductor device manufacturing factory 4, for example. .

  The control department 5 includes a manufacturing condition determination device 2.

  The manufacturing condition determination device 2 includes a first memory 6 as a first information storage area, a second memory 7 as a second information storage area, a first CPU 8 as a determination unit, and a fifth memory as a fifth information storage area. And a memory 10.

  The first memory 6 stores first information 15 related to the optical semiconductor element 13, the substrate 14 on which the optical semiconductor element 13 is mounted, and the optical semiconductor device 20.

  Specifically, as the first information 15, for example, as information related to the optical semiconductor element 13, for example, the shape of the optical semiconductor element 13, the dimensions of the optical semiconductor element 13, the emission peak wavelength of the optical semiconductor element 13, the substrate 14 Examples include the number of optical semiconductor elements 13 mounted per unit area, the number of optical semiconductor elements 13 mounted per substrate 14, and the like.

  As the first information 15, specifically, information related to the substrate 14 includes, for example, the outer shape of the substrate 14, the dimensions of the substrate 14, the surface shape of the substrate 14 (such as the presence or absence of a recess), and the like. .

  Further, as the first information 15, specifically, as information related to the optical semiconductor device 20, for example, the color temperature of the optical semiconductor device 20, the total luminous flux of the optical semiconductor device 20, the light distribution characteristics of the optical semiconductor device 20. Etc. Specifically, the target color temperature is, for example, 4600K or more and, for example, 5500K or less when the target light color is day white. In addition, when the target light color is warm white, the target color temperature is, for example, 3250K or more, and for example, 3800K or less. The target color temperature is selected from the above temperature range.

  The first memory 6 is configured to be input from a first information source 21 included in the optical semiconductor device manufacturing factory 4.

  The second memory 7 stores second information 16 related to the varnish 11.

  Specifically, as the second information 16, for example, as information related to the particle, for example, the average value of the particle type, the mixing ratio of the particle, and the maximum length of the particle (in the case where the particle is spherical, the average value) Particle diameter). In addition, when particle | grains contain the fluorescent substance mentioned later, the absorption peak wavelength of fluorescent substance is also mentioned as information relevant to particle | grains. Further, as the second information 16, specifically, as information related to the curable resin, for example, the type of the curable resin, the viscosity of the curable resin, the blending ratio of the curable resin, the curing rate of the curable resin Etc. Furthermore, as the 2nd information 16, specifically, the viscosity of a varnish is mentioned as information relevant to a varnish, for example. Furthermore, when the positioning mark (not shown) is provided in the release sheet 28 (after-mentioned) as the 2nd information 16, the relative position information etc. of the several varnish 11 after application | coating are mentioned.

  The 2nd information 16 is constituted so that it may be inputted from the 2nd information source 22 which control section 5 of a sealing sheet manufacturing factory has.

  The first CPU 8 is a determination device that determines the manufacturing conditions of the sealing sheet 12 based on the first information 15 stored in the first memory 6 and the second information 16 stored in the second memory 7.

  The first CPU 8 stores predetermined program processing in advance, and the first CPU 8 determines the manufacturing conditions of the sealing sheet 12 according to the program processing.

  As manufacturing conditions of the sealing sheet 12, the kind of layer structure of the sealing sheet 12, the application | coating conditions of the varnish 11, etc. are mentioned, for example. In addition, when the sealing sheet 12 is a B stage which will be described later, the heating condition of the varnish 11 when the A stage varnish 11 is changed to the B stage, the irradiation condition of the active energy ray, and the like are also exemplified. Moreover, the compression elastic modulus of the sealing sheet 12 of a B stage is also mentioned.

  As shown in FIGS. 2 and 3, the sealing sheet 12 is configured as, for example, a phosphor-containing sealing sheet including a phosphor layer 26 containing a phosphor, that is, a phosphor sheet. As a layer structure of the sealing sheet 12, for example, as shown in FIGS. 2A to 2E, a contact structure in which the phosphor layer 26 can be in direct contact with the optical semiconductor element 13 (virtual line), or, for example, FIGS. 3A and 3B As shown in FIG. 4, there is a separated structure in which the phosphor layer 26 can cover the optical semiconductor element 13 while the phosphor layer 26 and the optical semiconductor element 13 (virtual line) are spaced apart.

  In FIG. 2 and FIG. 3, the phantom line indicates the optical semiconductor element 13 embedded in the sealing sheet 12.

  As the sealing sheet 12 having a contact structure, for example, as shown in FIG. 2A, a sealing sheet 12A composed of only the phosphor layer 26, and as shown in FIG. 2B, the phosphor concentrations are different and are laminated in the thickness direction. 2B, a sealing sheet 12B including a plurality of phosphor layers 26A and 26B, a resin layer 27 having a recess opened downward, and a phosphor layer 26 filled in the recess. As shown in the sealing sheet 12C, FIGS. 2D and 2E, the sealing sheet includes a phosphor layer 26 having a substantially circular shape in plan view or a substantially rectangular shape in plan view, and a resin layer 27 formed around the phosphor layer 26. 2D, and as shown in FIG. 2D, the sealing sheet 12D is formed in a substantially trapezoidal shape in cross section as the phosphor layer 26 becomes wider toward the upper side, and as shown in FIG. 2E, the phosphor layer 26 is substantially rectangular in sectional view It is selected such from sealing sheet 12E is formed.

  Moreover, as the sealing sheet 12 having a separation structure, for example, as shown in FIG. 3F, a sealing sheet 12F including a resin layer 27 and a phosphor layer 26 formed on the upper side of the resin layer 27, 3G, the resin layer 27, the phosphor layer 26 formed on the upper side of the resin layer 27, and the portion below the resin layer 27 where the optical semiconductor element 13 is formed in the bottom view. It is selected from a sealing sheet 12F provided with a functional layer 29 formed so as to surround it. In FIG. 3G, the resin is selected from the functional layer 29 by blending a resin with a functional material having a wavelength conversion function such as a phosphor or a light reflection function such as a white pigment (specifically, titania). The

  Specifically, as the sealing sheet 12 having the above-mentioned various structures, known sealing sheets can be mentioned. Specifically, as the sealing sheet 12 having a contact structure, for example, JP 2010-067641 A, Sealing sheets (phosphor sheets) described in JP2009-231750A, JP2009-188207A, JP2009-182149A, JP2009-099784A, JP2009-060031A, and the like. In addition, as the sealing sheet 12 having a separation structure, for example, JP 2011-258634 A, JP 2011-228525 A, JP 2011-159874 A, JP 2011-082340 A. JP, JP 2010-192844, JP 2010-153500, JP 2010-12. Is selected (determined) from the sealing sheet described in, 802 JP (phosphor sheet).

  The dimensions of the phosphor layer 26 having a contact structure, the two phosphor layers 26A and 26B having different phosphor concentrations, and the resin layer 27 (including the recesses) are appropriately selected and described in the above-mentioned publication. Selected from the range.

  Examples of application conditions for the varnish 11 include the shape of the varnish 11 immediately after application, the thickness of the varnish 11 immediately after application, and the like. The above-described shape includes a shape in which the varnishes 11 are spaced apart from each other.

  As shown in FIG. 1, the first CPU 8 is configured to be able to read the first information 15 stored in the first memory 6 and the second information 16 stored in the second memory 7.

  As shown in FIG. 1, the fifth memory 10 is an area for storing the manufacturing conditions of the sealing sheet 12 determined by the first CPU 8.

  The fifth memory 10 is provided with a recording area (not shown) in which the fifth information 19 relating to the manufacturing conditions for manufacturing the sealing sheet 12 before this time can be recorded. Note that the fifth information 19 recorded and accumulated in the recording area is read by the first CPU 8 in this manufacturing, and is configured to determine the manufacturing conditions of the sealing sheet 12 again by the first CPU 8. Yes.

  The optical semiconductor device manufacturing factory 4 includes a sheet manufacturing device 34 and a sealing device 32.

  The sheet manufacturing apparatus 34 includes a varnish manufacturing apparatus 33, a sheet forming apparatus 31, and a sheet manufacturing management apparatus 3.

  The varnish production apparatus 33 includes, for example, a container 52 equipped with a stirrer 51.

  The sheet forming apparatus 31 includes a coating apparatus 53 such as a dispenser, an applicator, or a slit die coater. As the coating device 53, a dispenser is preferably used. Further, the sheet forming apparatus 31 may include an oven 55 having heaters 54 that are spaced apart from each other in the vertical direction.

  The sheet manufacturing management apparatus 3 includes a third memory 23 as a third information storage area, a fourth memory 24 as a fourth information storage area, and a second CPU 25 as correction means as management means.

  The third memory 23 stores third information 17 related to the manufacturing conditions of the sealing sheet 12 determined by the first CPU 8.

  The third information 17 includes the manufacturing conditions of the sealing sheet 12 determined by the first CPU 8.

  The third memory 23 is configured such that the third information 17 determined in the fifth memory 10 is input from the fifth memory 10.

  The fourth memory 24 stores at least one kind of lot information of particles, curable resin, varnish and optical semiconductor element 13 and / or fourth information 18 including the production amount of the optical semiconductor device 20 per unit period. .

  The lot information is information that fluctuates with the change of the lot, and specifically, the average value of the maximum length of particles that differ depending on the lot (the average particle diameter when the particles are spherical), etc. In addition, the viscosity of the curable resin, which varies depending on the lot, may be used. In addition, when particle | grains contain fluorescent substance, the absorption peak wavelength of the fluorescent substance which changes with lots is mentioned as lot information of fluorescent substance. Furthermore, information related to varnishes that vary from lot to lot includes the viscosity of the varnish resulting from different lots of the particles and / or curable resin.

  The production amount of the optical semiconductor device 20 per unit period is, for example, 1000 or more, preferably 5000 or more, and for example, 200,000, as the production amount of the optical semiconductor device 20 per month. It is selected from the following ranges.

  The fourth memory 24 is configured to receive the fourth information 18 from the first information source 21 in the optical semiconductor device manufacturing factory 4 and the second information source 22 in the control department 5.

  Among the fourth information 18, examples of the fourth information 18 </ b> B input from the first information source 21 include lot information of the optical semiconductor element 13 and the production amount of the optical semiconductor device 20 per unit period. Examples of the fourth information 18A input from the second information source 22 include particle lot information, curable resin lot information, and varnish lot information.

  Predetermined program processing is stored in advance in the second CPU 25, and the second CPU 25, based on the third information 17 stored in the third memory 23, and the manufacturing conditions of the varnish manufacturing process S1 and the sheet manufacturing process S2 Manage manufacturing conditions. The second CPU 25 can also correct the manufacturing conditions of the varnish manufacturing process S1 and the manufacturing conditions of the sheet manufacturing process S2 based on the fourth information 18 stored in the fourth memory 24.

  The second CPU 25 is configured to be able to read the third information 17 stored in the third memory 23 and the fourth information 18 stored in the fourth memory 24.

  The second CPU 25 is configured to be able to manage and modify each of the manufacturing conditions of the varnish manufacturing process S1 and the manufacturing conditions of the sheet manufacturing process S2 in each of the varnish manufacturing apparatus 33 and the sheet forming apparatus 31.

  The sealing device 32 includes a press device 35 and a sealing control device 36.

  The press device 35 is, for example, a press machine that has two flat plates 41 that are opposed to each other with an interval in the vertical direction and can press the sealing sheet 12 and the substrate 14 in the vertical direction.

  The sealing control device 36 is configured to control the sealing conditions in the sealing step S3. The sealing control device 36 is provided with a memory (not shown) so that the sealing condition of the sealing step S3 is input from the first information source 21 and the sealing condition of the sealing step S3 is controlled. ,It is configured.

  Next, a method for manufacturing the optical semiconductor device 20 in the optical semiconductor device manufacturing factory 4 using the system 1 will be described.

1. Manufacturing Condition Determination Step In this method, first information 15 is first input from the first information source 21 to the first memory 6. The input of the first information 15 to the first memory 6 is not particularly limited. For example, the first information 15 may be input through a line such as a network connecting the first information source 21 and the first memory 6. Alternatively, for example, the first information 15 can be input to the second memory 7 from the first information source 21 via communication means such as fax, mail, and mail.

  Separately, the second information 16 is input from the second information source 22 to the second memory 7. The method for inputting the second information 16 to the second memory 7 is the same as the method for inputting the first information 15 to the first memory 6.

  Next, the first CPU 8 reads out the first information 15 stored in the first memory 6 and the second information 16 stored in the second memory 7, and then, according to a predetermined program process, these first information Based on 15 and the second information 16, the manufacturing condition of the sealing sheet 12 is determined as the third information 17 (described in detail below).

2. Manufacturing management process Thereafter, the third information 17 determined by the first CPU 8 is recorded in the fifth memory 10, and then the third information 17 recorded in the fifth memory 10 is input to the third memory 23. .

  The method for inputting the third information 17 to the third memory 23 is the same as the method for inputting the first information 15 to the first memory 6.

  Separately, the fourth information 18 is input from the first information source 21 and the second information source 22 to the fourth memory 24. The method for inputting the fourth information 18 to the fourth memory 24 is the same as the method for inputting the first information 15 to the first memory 6.

  Thereafter, the second CPU 25 reads out the third information 17 stored in the third memory 23, and subsequently, according to a predetermined program process, based on the third information 17, the manufacturing conditions of the varnish manufacturing step S1, and the sheet manufacturing The manufacturing conditions in step S2 are managed.

  And in the sheet manufacturing apparatus 34, based on the manufacturing conditions managed by 2nd CPU25, varnish manufacturing process S1 and sheet manufacturing process S2 are implemented sequentially.

3. Varnish manufacturing process S1
In the varnish manufacturing apparatus 33, first, the varnish manufacturing process S1 is performed according to the manufacturing conditions managed by the second CPU 25.

  Specifically, in varnish manufacturing process S1, first, each of particle | grains and curable resin is prepared, these are mixed, and varnish 11 is prepared as a particle | grain containing curable resin composition.

  The particles are selected from, for example, phosphors and fillers.

  The phosphor has a wavelength conversion function, and is selected from, for example, a yellow phosphor capable of converting blue light into yellow light, a red phosphor capable of converting blue light into red light, and the like.

Examples of the yellow phosphor include silicate phosphors such as (Ba, Sr, Ca) ₂ SiO ₄ ; Eu, (Sr, Ba) ₂ SiO ₄ : Eu (barium orthosilicate (BOS)), for example, Y ₃ Al Garnet-type phosphors having a garnet-type crystal structure such as ₅ O ₁₂ : Ce (YAG (yttrium, aluminum, garnet): Ce), Tb ₃ Al ₃ O ₁₂ : Ce (TAG (terbium, aluminum, garnet): Ce) For example, it is selected from oxynitride phosphors such as Ca-α-SiAlON.

The red phosphor is selected from nitride phosphors such as CaAlSiN ₃ : Eu and CaSiN ₂ : Eu, for example.

  The shape of the phosphor is selected from, for example, a spherical shape, a plate shape, and a needle shape.

  The average value of the maximum length of the phosphor (in the case of a sphere, the average particle diameter) is, for example, 0.1 μm or more, preferably 1 μm or more, and for example, 200 μm or less, preferably 100 μm or less. Is selected from the range.

  The absorption peak wavelength of the phosphor is, for example, 300 nm or more, preferably 430 nm or more, and is selected, for example, from a range of 550 nm or less, preferably 470 nm or less.

  The phosphors are selected to be used alone or in combination.

  The blending ratio of the phosphor is, for example, 0.1 parts by mass or more, preferably 0.5 parts by mass or more, for example, 80 parts by mass or less, preferably 50 parts by mass with respect to 100 parts by mass of the curable resin. Selected from the following range.

  Examples of the filler include organic fine particles such as silicone particles (specifically, including silicone rubber particles), inorganic fine particles such as silica (for example, fumed silica), talc, alumina, aluminum nitride, and silicon nitride. Selected from. Further, the average value of the maximum length of the filler (in the case of a spherical shape, the average particle diameter) is, for example, 0.1 μm or more, preferably 1 μm or more, and, for example, 200 μm or less, preferably It is selected from the range of 100 μm or less. The filler is selected to be used alone or in combination. The blending ratio of the filler is, for example, 0.1 parts by mass or more, preferably 0.5 parts by mass or more, for example, 70 parts by mass or less, preferably 100 parts by mass of the curable resin. It is selected from the range of 50 parts by mass or less.

  As the curable resin, for example, it has a two-stage reaction mechanism, and is a two-stage that is B-staged (semi-cured) by the first-stage reaction and C-staged (completely cured) by the second-stage reaction. It is selected from curable resins.

  As the two-stage curable resin, for example, a two-stage curable thermosetting resin that is cured by heating, for example, two-stage curable active energy beam curing that is cured by irradiation with active energy rays (for example, ultraviolet rays, electron beams, etc.). Selected from functional resins. Preferably, a two-stage curable thermosetting resin is selected.

  Specifically, the two-stage curable thermosetting resin is selected from, for example, silicone resin, epoxy resin, polyimide resin, phenol resin, urea resin, melamine resin, unsaturated polyester resin, and the like. Preferably, it is selected from two-stage curable silicone resins from the viewpoints of translucency and durability.

  The two-stage curable silicone resin is selected from, for example, a condensation reaction / addition reaction curable silicone resin having two reaction systems of a condensation reaction and an addition reaction.

  Examples of such a condensation reaction / addition reaction curable silicone resin include a first condensation reaction containing a silanol-terminated polysiloxane, an alkenyl group-containing trialkoxysilane, an organohydrogenpolysiloxane, a condensation catalyst, and a hydrosilylation catalyst.・ Addition reaction curable silicone resins such as silanol group-terminated polysiloxane, ethylenically unsaturated hydrocarbon group-containing silicon compound, ethylenically unsaturated hydrocarbon group-containing silicon compound, organohydrogenpolysiloxane, condensation catalyst and hydrosilylation Second condensation reaction / addition reaction curable silicone resin containing a catalyst, such as silanol type silicone oil at both ends, dialkoxyalkylsilane containing alkenyl group, organohydrogenpolysiloxane, condensation catalyst and hydroxy Third condensation reaction / addition reaction curable silicone resin containing a silylation catalyst, for example, an organopolysiloxane having at least two alkenylsilyl groups in one molecule, and at least two hydrosilyl groups in one molecule Fourth condensation reaction / addition reaction curing type silicone resin containing organopolysiloxane, hydrosilylation catalyst and curing retarder, for example, at least two ethylenically unsaturated hydrocarbon groups and at least two hydrosilyl groups in one molecule A first organopolysiloxane having no ethylenically unsaturated hydrocarbon group and having at least two hydrosilyl groups in one molecule, a hydrosilylation catalyst and a hydrosilylation inhibitor Condensation / addition reaction curable silicone resins such as 1st organopolysiloxane having at least 2 ethylenically unsaturated hydrocarbon groups and at least 2 silanol groups in one molecule, 1 molecule of at least 2 hydrosilyl groups not containing ethylenically unsaturated hydrocarbon groups A sixth condensation reaction / addition reaction curable silicone resin containing a second organopolysiloxane, a hydrosilylation inhibitor, and a hydrosilylation catalyst, for example, a silicon compound, and a boron compound or an aluminum compound A seventh condensation reaction / addition reaction curable silicone resin, for example, an eighth condensation reaction / addition reaction curable silicone resin containing polyaluminosiloxane and a silane coupling agent is selected.

The viscosity of the A-stage two-stage curable resin is, for example, 3000 mPa · s or more, preferably 5000 mPa · s or more, and is selected from a range of, for example, 20000 mPa · s or less, preferably 15000 mPa · s or less. The The viscosity of the A-stage two-stage curable resin is measured at a rotational speed of 99 s ⁻¹ using an E-type cone after adjusting the temperature of the A-stage two-stage curable resin to 25 ° C. The following viscosities are measured by the same method as described above.

  The blending ratio of the curable resin is, for example, 30% by mass or more, preferably 40% by mass or more, more preferably 50% by mass or more, with respect to the particle-containing curable resin composition (varnish). For example, it is selected from the range of 98% by mass or less, preferably 95% by mass or less, more preferably 90% by mass or less.

  Moreover, a solvent can also be contained in the particle-containing curable resin composition as necessary.

  The solvent is selected from, for example, aliphatic hydrocarbons such as hexane, aromatic hydrocarbons such as xylene, siloxanes such as vinylmethyl cyclic siloxane and vinyl polydimethylsiloxane at both ends, and the like. A solvent is mix | blended with a particle | grain containing curable resin composition by the compounding ratio which becomes a viscosity which a particle | grain containing curable resin composition mentions later.

  In order to prepare the particle-containing curable resin composition, specifically, as shown in FIG. 1, in the varnish manufacturing apparatus 33, each component described above in the container 52 is managed by the second CPU 25. Production conditions of step S1, for example, the type of varnish 11 managed by the second CPU 25 and corresponding to the layer structure of the sealing sheet 12, more specifically, the type of particles and the mixing ratio of the particles managed by the second CPU 25 The average value of the maximum length of the particles (average particle diameter when the particles are spherical), the type of the curable resin, the viscosity of the curable resin, the blending ratio of the curable resin, and the particles include a phosphor. In this case, it is blended based on the absorption peak wavelength of the phosphor, the viscosity of the varnish 11 and the like. Subsequently, they are mixed using a stirrer 51.

  In this way, the varnish 11 is prepared.

  When the curable resin is a two-stage curable resin, the varnish 11 is prepared as an A-stage particle-containing curable resin composition.

  The viscosity of the varnish 11 at 25 ° C. and 1 atm is, for example, 1,000 mPa · s or more, preferably 4,000 mPa · s or more, and, for example, 1,000,000 mPa · s or less, preferably Is adjusted to be in the range of 100,000 mPa · s or less.

4). Sheet manufacturing process S2
In the sheet forming apparatus 31, the sheet manufacturing process S <b> 2 is performed after the varnish manufacturing process S <b> 1 according to the manufacturing conditions managed by the second CPU 25.

  That is, the sealing sheet 12 is formed from the varnish 11.

  In order to form the sealing sheet 12, for example, first, the varnish 11 is applied to the surface of the release sheet 28.

  The release sheet 28 is selected from polymer films such as polyethylene film and polyester film (PET), for example, ceramic sheets, such as metal foil. Preferably, it is selected from polymer films. Further, the surface of the release sheet 28 can be subjected to a peeling treatment such as a fluorine treatment. The shape of the release sheet 28 is not particularly limited, and is selected from, for example, a substantially rectangular shape in plan view (including a strip shape and a long shape). Further, as the release sheet 28, the presence / absence of formation of a positioning mark (not shown), and the positional information and dimensions of the positioning mark are selected. The mark is formed so that a region where the varnish 11 is applied is secured.

  In order to apply the varnish 11 to the surface of the release sheet 28, for example, the varnish 11 is selected from a coating device 53 such as a dispenser, an applicator, or a slit die coater. Preferably, it is selected from a dispenser.

  The thickness of the sealing sheet 12 is selected from application conditions of the varnish 11 so that the thickness is, for example, 10 μm or more, preferably 50 μm or more, and, for example, 2000 μm or less, preferably 1000 μm or less.

  That is, the varnish 11 is applied so as to be adjusted to the manufacturing conditions managed by the second CPU 25, specifically, the shape of the varnish 11 immediately after application and the thickness of the varnish 11 immediately after application, which are managed by the second CPU 25. The application condition of the device 53 is selected.

  When a positioning mark (not shown) is formed on the release sheet 28, the positioning mark is checked while confirming the application position with respect to the positioning mark by a sensor (not shown) provided in the coating device 53. The relative position of the varnish 11 with respect to is adjusted.

  Thereafter, when the varnish 11 contains a two-stage curable resin, the varnish 11 is made into a B-stage. Specifically, if the thermosetting type is selected as the two-stage curable resin, the varnish 11 is put into the oven 55 and the varnish 11 is heated.

  As for the heating conditions, the heating temperature is, for example, 40 ° C. or higher, preferably 80 ° C. or higher, more preferably 100 ° C. or higher, and for example, 200 ° C. or lower, preferably 150 ° C. or lower, more preferably, It is selected from the range of 140 ° C. or lower. The heating time is, for example, 1 minute or more, preferably 5 minutes or more, more preferably 10 minutes or more, and for example, 24 hours or less, preferably 1 hour or less, more preferably 0.5 hours. It is selected from the following ranges.

  On the other hand, if the active energy curable resin is selected as the two-stage curable resin, the varnish 11 is irradiated with ultraviolet rays using an ultraviolet lamp (not shown).

  Thereby, the sealing sheet 12 laminated | stacked on the surface of the release sheet 28 is manufactured.

  The compression elastic modulus at 25 ° C. of the sealing sheet 12 is, for example, 0.040 MPa or more, preferably 0.050 MPa or more, more preferably 0.075 MPa or more, and further preferably 0.100 MPa or more. For example, it is adjusted to be in the range of 0.145 MPa or less, preferably 0.140 MPa or less, more preferably 0.135 MPa or less, and further preferably 0.125 MPa or less.

5. Sealing step S3
In the press device 35 of the sealing device 32, the sealing step S <b> 3 is performed after the sheet manufacturing step S <b> 2 according to the conditions controlled by the sealing control device 36.

  Specifically, in the sealing step S3, first, a substrate 14 on which the optical semiconductor element 13 is mounted is prepared.

  The substrate 14 is selected from, for example, an insulating substrate such as a silicon substrate, a ceramic substrate, a polyimide resin substrate, or a laminated substrate in which an insulating layer is laminated on a metal substrate.

  Further, on the surface of the substrate 14, a conductor pattern (including an electrode (not shown) for electrical connection with a terminal (not shown) of the optical semiconductor element 13 described below and a wiring continuous therewith ( (Not shown) is formed. The conductor pattern is selected from conductors such as gold, copper, silver, and nickel.

  Further, the surface of the substrate 14 is formed flat. Or although not shown in figure, the recessed part dented below may be formed in the surface in which the optical semiconductor element 13 in the board | substrate 14 is mounted.

  The external shape of the board | substrate 14 is not specifically limited, For example, it selects from planar view substantially rectangular shape, planar view substantially circular shape, etc. The dimensions of the substrate 5 are appropriately selected. For example, the maximum length is, for example, 2 mm or more, preferably 10 mm or more, and for example, selected from the range of 300 mm or less, preferably 100 mm or less.

  The optical semiconductor element 13 is an LED (light emitting diode element), LD (laser diode), or the like that converts electrical energy into light energy, and has, for example, a cross section whose thickness is shorter than the length in the surface direction (length in the direction perpendicular to the thickness direction). It is selected from a substantially rectangular shape. The optical semiconductor element 13 is preferably selected from blue LEDs that emit blue light. The dimensions of the optical semiconductor element 13 are appropriately selected according to the application and purpose. Specifically, the thickness is, for example, 10 μm or more and 1000 μm or less, and the maximum length is, for example, 0.05 mm or more, preferably , 0.1 mm or more, and for example, 5 mm or less, preferably 2 mm or less.

  The emission peak wavelength of the optical semiconductor element 13 is, for example, 400 nm or more, preferably 430 nm or more, and for example, selected from the range of 500 nm or less, preferably 470 nm or less.

  The optical semiconductor element 13 is flip-chip mounted or connected to the substrate 14 by wire bonding, for example.

  Also, a plurality (three in FIG. 1) of optical semiconductor elements 13 can be mounted on one substrate 14. The number of mounted optical semiconductor elements 13 per substrate 14 is, for example, 1 or more, preferably 4 or more, and is selected from a range of 2000 or less, preferably 400 or less, for example.

  Next, in this method, the substrate 14 on which the optical semiconductor element 13 is mounted is placed in the press device 35.

  In order to place the substrate 14 on which the optical semiconductor element 13 is mounted on the press device 35, specifically, the substrate 14 on which the optical semiconductor element 13 is mounted is placed on the lower flat plate 41.

  Subsequently, the sealing sheet 12 laminated on the upper surface of the release sheet 28 is turned upside down so as to face the upper side of the optical semiconductor element 13. That is, the sealing sheet 12 is disposed so as to face the optical semiconductor element 13.

  Next, the optical semiconductor element 13 is covered with the sealing sheet 12. The optical semiconductor element 13 is embedded by the sealing sheet 12.

  Specifically, the optical semiconductor element 13 is covered with the sealing sheet 12 based on the press conditions controlled by the sealing controller 36.

  Specifically, as shown by the arrow in FIG. 1, the sealing sheet 12 is lowered (pressed down). Specifically, the sealing sheet 12 is pressed against the substrate 14 on which the optical semiconductor element 13 is mounted.

  Thereby, the optical semiconductor element 13 is covered with the sealing sheet 12.

  That is, when the optical semiconductor element 13 is embedded with the sealing sheet 12 and the sealing sheet 12 includes the phosphor layer 26, the optical semiconductor element 13 is covered with the phosphor layer 26.

  Specifically, as shown in FIGS. 2A to 2G, when the layer structure of the phosphor layer 26 of the encapsulating sheet 12 is selected from a contact structure, the phosphor layer 26 is formed of the optical semiconductor element 13 (virtual portion of FIG. 2). The optical semiconductor element 13 is covered with the phosphor layer 26 in direct contact with the surface of the line. That is, the phosphor layer 26 seals the optical semiconductor element 13. In other words, the phosphor layer 26 also serves as a sealing layer.

  On the other hand, as shown in FIGS. 3F and 3G, when the layer structure of the phosphor layer 26 of the encapsulating sheet 12 is selected from the separated structure, the phosphor layer 26 is formed of the optical semiconductor element 13 (virtual line in FIG. 3). ) And the resin layer 27, and the upper side of the optical semiconductor element 13 is covered. On the other hand, the resin layer 27 directly contacts the surface of the optical semiconductor element 13 (imaginary line in FIG. 2) to cover the optical semiconductor element 13. That is, the resin layer 27 seals the optical semiconductor element 13 to become a sealing layer.

  Then, if the sealing sheet 12 is a B stage, the sealing sheet 12 is changed to a C stage.

  For example, the sealing sheet 12 is converted to the C stage based on the heating condition of the sealing sheet 12 and the irradiation condition of the active energy rays, which are controlled by the sealing controller 36.

  Specifically, when the thermosetting type is selected as the two-stage curable resin, the B-stage sealing sheet 12 is heated.

  Specifically, it is put into the oven while maintaining the pressed state of the sealing sheet 12 by the flat plate 41. Thereby, the sealing sheet 12 of the B stage is heated.

  The heating temperature is, for example, 80 ° C. or higher, preferably 100 ° C. or higher, and is selected from the range of, for example, 200 ° C. or lower, preferably 180 ° C. or lower. The heating time is, for example, 10 minutes or more, preferably 30 minutes or more, and is selected from the range of, for example, 10 hours or less, preferably 5 hours or less.

  By heating the sealing sheet 12, the B-stage sealing sheet 12 becomes a C-stage (completely cured).

  On the other hand, when the active energy ray curability is selected as the two-stage curable resin, the encapsulating sheet 12 is irradiated with the active energy ray to make the B-stage encapsulating sheet 12 a C-stage (fully cured). Let Specifically, the B stage sealing sheet 12 is irradiated with ultraviolet rays using an ultraviolet lamp or the like.

  Thereby, the optical semiconductor device 20 including the sealing sheet 12, the optical semiconductor element 13 sealed by the sealing sheet 12, and the substrate 14 on which the optical semiconductor element 13 is mounted is manufactured.

  In FIG. 1, a plurality of (three) optical semiconductor elements 13 are provided in one optical semiconductor device 20.

  Thereafter, the release sheet 28 is peeled off from the sealing sheet 12 as indicated by an arrow.

  After that, if necessary, when a plurality of optical semiconductor elements 13 are mounted on one substrate 14, the sealing sheet 12 may be cut into pieces corresponding to each optical semiconductor element 13. it can.

6). Accumulation of production conditions, lot change and production amount per unit period In the production of the sealing sheet 12 before this time, the production conditions of the varnish production process S1 and the production conditions of the sheet production process S2 are recorded in the fifth memory 10. It is recorded and accumulated in an area (not shown).

  That is, the fifth memory 10 inputs the third information 17 to the third memory 23 and stores the third information 17 as it is in the recording area of the fifth memory 10 as the fifth information 19 that is past information.

  And by manufacture of the sealing sheet 12 this time, 1st CPU8 is the manufacturing conditions of the varnish manufacturing process S1 which manufactured the sealing sheet 12 previously this time, and sheet | seat manufacturing process S2 accumulate | stored in the 5th memory 10. The manufacturing conditions of the present varnish manufacturing process S1 and the manufacturing conditions of the current sheet manufacturing process S2 are determined based on this.

  In addition, the lot information of at least one kind of particles, curable resin, varnish, and optical semiconductor element, and / or the production amount of the optical semiconductor device 20 per unit period varies. Corresponding to the fluctuation, the fourth information 18 is input from the first information source 21 and the second information source 22 to the fourth memory 24, and then the second CPU 25 is stored in the fourth memory 24. The fourth information 18 is read, and the manufacturing conditions of the varnish manufacturing process S1 and / or the manufacturing conditions of the sheet manufacturing process S2 are corrected according to a predetermined program process.

[Function and effect]
In this system 1, the manufacturing condition determination device 2 includes a first memory 6, a second memory 7, and a first CPU 8, while the sheet manufacturing management device 3 includes a third memory 23 and a second CPU 25. Prepare.

  The manufacturing condition determination device 2 stores the first information 15 and the second information 16 in the first memory 6 and the second memory 7, respectively. The manufacturing conditions of the sheet manufacturing process S2 are performed by the first CPU 8. Can be determined and provided to the sheet manufacturing management apparatus 3.

  Then, in the sheet manufacturing management device 3, the third information 17 related to the manufacturing conditions provided from the manufacturing condition determining device 2 is stored in the third memory 23, and the second CPU 25 based on the third information 17. The manufacturing conditions of the sheet manufacturing process S2 are managed.

  Therefore, the manufacturing conditions of the sheet manufacturing process S2 can be determined by the manufacturing condition determination apparatus 2 separately from the sheet manufacturing management apparatus 3, and can be managed by the sheet manufacturing management apparatus 3.

  Further, the third information 17 related to the manufacturing conditions of the sheet manufacturing process S <b> 2 provided from the manufacturing condition determining device 2 is based on the first information 15 and the second information 16. Therefore, the sheet manufacturing management apparatus 3 can accurately manage the manufacturing conditions of the sheet manufacturing process S2 by the second CPU 25 based on the third information 17 provided from the manufacturing condition determination apparatus 2. As a result, the target optical semiconductor device 20 can be manufactured with high accuracy.

  Further, in this system 1, the first CPU 8 determines the manufacturing conditions of the varnish manufacturing process S 1 based on the first information 15 stored in the first memory 6 and the second information 16 stored in the second memory 7. Further, the second CPU 25 further manages the manufacturing conditions of the varnish manufacturing process S <b> 1 based on the third information 17 stored in the third memory 23. Therefore, the sealing sheet 12 suitable for the target optical semiconductor device 20 can be manufactured with high accuracy, and further, the target optical semiconductor device 20 can be manufactured with high accuracy.

  Furthermore, according to this system 1, since the first information 15 includes information related to the substrate 14 on which the optical semiconductor element 13 is mounted, the manufacturing condition determination apparatus 2 uses the substrate 14 on which the optical semiconductor element 13 is mounted. The information related to the optical semiconductor element 13 and the information related to the optical semiconductor device 20 can also be provided.

  Therefore, based on the highly accurate third information 17 related to the manufacturing conditions of the sheet manufacturing process S2 determined based on the first information 15, the sheet manufacturing management device 3 further sets the manufacturing conditions of the sheet manufacturing process S2. It can be managed with high accuracy.

  In this system 1, in the sheet manufacturing management device 3, at least one lot information of particles, curable resin, varnish, and optical semiconductor element 13 stored in the fourth memory 24 by the second CPU 25, and / or Based on the fourth information 18 including the manufacturing amount of the optical semiconductor device 20 per unit period, the manufacturing conditions of the sheet manufacturing process S2 can be corrected. Therefore, the target optical semiconductor can be easily modified by correcting the manufacturing conditions of the varnish manufacturing process S1 and the manufacturing conditions of the sheet manufacturing process S2 in response to the variation of the lot information and / or the manufacturing amount of the optical semiconductor device 20. The device 20 can be manufactured with high accuracy.

  Furthermore, according to this system 1, the 5th memory 10 of the manufacturing condition determination apparatus 2 can accumulate | store the 5th information 19 relevant to the manufacturing conditions which manufactured the sealing sheet 12 before this time. Therefore, based on the manufacturing conditions accumulated in the past, the sealing sheet 12 suitable for the target optical semiconductor device 20 can be manufactured this time, and further, the target optical semiconductor device 20 can be manufactured accurately this time. .

  The manufacturing condition determination device 2 includes a first memory 6, a second memory 7, and a first CPU 8.

  Therefore, according to this manufacturing condition determination device 2, the first information 15 and the second information 16 are stored in the first memory 6 and the second memory 7, respectively, and the first CPU 8 performs the varnish manufacturing process S1. The manufacturing conditions and the manufacturing conditions of the sheet manufacturing process S2 can be determined.

  As a result, based on the manufacturing conditions of the varnish manufacturing process S1 and the manufacturing conditions of the sheet manufacturing process S2, the target optical semiconductor device 20 can be manufactured with high accuracy.

  Further, in the manufacturing condition determining apparatus 2, the second CPU 25 performs the varnish manufacturing step S 1 based on the first information 15 stored in the first memory 6 and the second information 16 stored in the second memory 7. Manufacturing conditions and manufacturing conditions of sheet manufacturing process S2 are further determined. Therefore, the sealing sheet 12 suitable for the target optical semiconductor device 20 can be manufactured with high accuracy, and further, the target optical semiconductor device 20 can be manufactured with high accuracy.

  Further, according to the manufacturing condition determining apparatus 2, since the first information 15 includes information related to the substrate 14 on which the optical semiconductor element 13 is mounted, the manufacturing condition determining apparatus 2 has the optical semiconductor element 13 mounted thereon. The information related to the substrate 14 can also be provided together with the information related to the optical semiconductor element 13 and the information related to the optical semiconductor device 20.

  Therefore, the target optical semiconductor device 20 can be manufactured with high accuracy.

  According to this manufacturing condition determination apparatus 2, the 5th information 19 relevant to the manufacturing conditions which manufactured the sealing sheet 12 before this time can be accumulate | stored. Therefore, based on the manufacturing conditions accumulated in the past, the sealing sheet 12 suitable for the target optical semiconductor device 20 can be manufactured this time, and further, the target optical semiconductor device 20 can be manufactured accurately this time. .

  According to the sheet manufacturing management apparatus 3, the third information 17 including the manufacturing conditions related to the varnish manufacturing process S1 and the manufacturing conditions related to the manufacturing conditions of the sheet manufacturing process S2 is stored in the third memory 23. Based on the third information 17, the second CPU 25 can accurately manage the manufacturing conditions related to the varnish manufacturing process S1 and the manufacturing conditions of the sheet manufacturing process S2.

  Therefore, the target optical semiconductor device 20 can be manufactured with high accuracy.

  Further, according to the sheet manufacturing management device 3, the second CPU 25 manufactures the manufacturing conditions related to the varnish manufacturing process S1 and the manufacturing of the sheet manufacturing process S2 based on the third information 17 stored in the third memory 23. Since the conditions are further managed, the sealing sheet 12 suitable for the target optical semiconductor device 20 can be manufactured with high accuracy, and further, the target optical semiconductor device 20 can be manufactured with high accuracy.

  Further, in the sheet manufacturing management apparatus 3, the second CPU 25 stores at least one kind of lot information of particles, curable resin, varnish and optical semiconductor element stored in the fourth memory 24, and / or per unit period. Based on the fourth information 18 including the manufacturing amount of the optical semiconductor device 20, the manufacturing conditions related to the varnish manufacturing process S1 and the manufacturing conditions of the sheet manufacturing process S2 can be corrected. Therefore, the manufacturing conditions related to the varnish manufacturing process S1 and the manufacturing conditions of the sheet manufacturing process S2 are corrected in response to the lot information and / or the fluctuation of the manufacturing amount of the optical semiconductor device 20, and the object is achieved. The optical semiconductor device 20 can be manufactured with high accuracy.

[Modification]
In the description after FIG. 4, members similar to those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the embodiment of FIG. 1, the manufacturing condition determination device 2 and the sheet manufacturing management device 3 have a one-to-one relationship, that is, one sheet manufacturing management device 3 is provided for one manufacturing condition determination device 2. . However, the correspondence relationship between the manufacturing condition determination device 2 and the sheet manufacturing management device 3 is not limited to this, and, for example, as shown in FIG. 3 can also be provided.

  Specifically, a sheet manufacturing management device 3 is installed in each of a plurality of optical semiconductor device manufacturing factories 4 provided independently of each other. The manufacturing condition determining device 2 and the plurality of sheet manufacturing management devices 3 can input a plurality of first information 15 from the first information source 21 included in each of the plurality of sheet manufacturing management devices 3 to the first memory 6, and The third information 17 determined by the first CPU 8 is configured to be input from the fifth memory 10 to the plurality of third memories 23.

  In the embodiment of FIG. 4, one manufacturing condition determination device 2 provides the third information 17 to one sheet manufacturing management device 3 </ b> A (3), and the first information of the one sheet manufacturing management device 3 </ b> A (3). The first information 15 is acquired from one information source 21 and stored in the first memory 6, the first information 15 is accumulated in the fifth memory 10, and another sheet manufacturing management device 3 </ b> B (or another It can also be provided to a plurality of sheet manufacturing management apparatuses 3B and 3C) (3).

  That is, one manufacturing condition determining device 2 has a plurality of pieces of first information 15 (first information 15 to be stored in the first memory 6, specifically, an optical semiconductor provided from a plurality of sheet manufacturing management devices 3. Information related to the element 13, information related to the substrate 14, and information related to the optical semiconductor device 20) can be unified. In other words, one manufacturing condition determination device 2 can aggregate the first information 15 of a plurality of sheet manufacturing management devices 3 and provide the plurality of sheet manufacturing management devices 3 with corresponding third information 17. It is possible to function as the manufacturing condition determining apparatus 2.

  Therefore, the third information 17 with high accuracy can be provided to each sheet manufacturing management device 3 while being one manufacturing condition determining device 2.

  In the embodiment of FIG. 1, the system 1 determines and manages the manufacturing process of the varnish manufacturing process S1. That is, the manufacturing conditions of the varnish manufacturing process S1 are managed by the sheet manufacturing management device 3. However, the system 1 can also be configured so that the system 1 does not determine and manage the manufacturing process of the varnish manufacturing process S1. Specifically, it is also possible to manage only the manufacturing conditions of the sheet manufacturing process S2 without managing the manufacturing conditions of the varnish manufacturing process S1.

  According to this embodiment, since it is not necessary for the second CPU 25 to manage the manufacturing conditions of the varnish manufacturing step S1, the configuration of the second CPU 25 can be simplified.

  Further, in the embodiment of FIG. 1, as the manufacturing management apparatus of the present invention, the sheet manufacturing management apparatus 3 manages the manufacturing conditions of the sheet manufacturing process S2, and the sealing control apparatus 36 performs the sealing conditions of the sealing process S3. For example, the sheet manufacturing management device 3 also serves as the sealing control device 36 to form one manufacturing management device, and the manufacturing conditions of the sheet manufacturing process S2 and the sealing of the sealing process S3 Both stop conditions can be managed.

  Moreover, in embodiment of FIG. 2 and FIG. 3, although the coating sheet of this invention is demonstrated as the sealing sheet 12 which seals the optical semiconductor element 13, it is not limited to this, For example, it shows in FIG. Thus, it can also select as the coating sheet 60 (refer FIG. 5A arrow and FIG. 5B) laminated | stacked on the resin layer (sealing layer) 27 (refer FIG. 5A) which seals the optical semiconductor element 13 previously.

  5A, the covering sheet 60 is selected from the same material as the sealing sheet 12 of FIG.

  In FIG. 5B, the covering sheet 60 covers the upper side of the optical semiconductor element 13, and specifically, is disposed on the upper side of the optical semiconductor element 13 with a space therebetween via the resin layer 27.

  2 and 3, the sealing sheet 12 is selected as a phosphor sheet (phosphor-containing sealing sheet). For example, although not shown, the sealing sheet 12 does not contain a phosphor and is sealed. It can also be selected as the sealing sheet 12 containing a stop layer (resin layer).

  In the description of FIG. 1, the first information 15 includes information related to the substrate 14 on which the optical semiconductor element 13 is mounted. However, the first information 15 may be configured without including the information.

DESCRIPTION OF SYMBOLS 1 System 2 Manufacturing condition determination apparatus 3 Sheet manufacturing management apparatus 6 1st memory 8 1st CPU
11 Varnish 12 Sealing sheet 13 Optical semiconductor element 14 Substrate 15 First information 16 Second information 17 Third information 20 Optical semiconductor device 23 Third memory 24 Fourth memory 60 Cover sheet S1 Varnish manufacturing process S2 Sheet manufacturing process S3 Sealing Process

Claims (12)

An optical semiconductor device comprising: a varnish producing process for producing a varnish containing particles and a curable resin; a sheet producing process for producing a B-stage covering sheet from the varnish; and a covering process for covering an optical semiconductor element with the covering sheet. A system for determining and managing manufacturing conditions of the sheet manufacturing process in a manufacturing method,
The system includes a manufacturing condition determination device and a manufacturing management device,
The manufacturing condition determining device is:
A first information storage area for storing first information related to the optical semiconductor element and the optical semiconductor device;
A second information storage area for storing second information related to the varnish;
Determining means for determining the manufacturing conditions based on the first information stored in the first information storage area and the second information stored in the second information storage area;
The manufacturing management apparatus is
A third information storage area for storing third information related to the manufacturing conditions determined by the determining means;
And a management unit that manages the manufacturing conditions of the sheet manufacturing process based on the third information stored in the third information storage area. The system further determines and manages the manufacturing conditions of the varnish manufacturing process;
The determination means further determines the manufacturing conditions of the varnish manufacturing process based on the first information stored in the first information storage area and the second information stored in the second information storage area. Decide
The system according to claim 1, wherein the management unit further manages the manufacturing conditions of the varnish manufacturing process based on the third information stored in the third information storage area.   The system according to claim 1, wherein the first information includes information related to a substrate on which the optical semiconductor element is mounted. The manufacturing management apparatus is
A fourth information storage area storing at least one kind of lot information of particles, curable resin, varnish, and optical semiconductor element, and / or fourth information including the production amount of the optical semiconductor device per unit period;
The correction means which corrects the said manufacturing conditions of the said sheet manufacturing process based on the said 4th information stored in the said 4th information storage area, The any one of Claims 1-3 characterized by the above-mentioned. The system described in. The manufacturing condition determining device is:
A fifth information storage area for storing fifth information related to manufacturing conditions for manufacturing the covering sheet before this time;
The manufacturing conditions for manufacturing the said covering sheet this time are determined based on the said 5th information stored in the said 5th information storage area, The any one of Claims 1-4 characterized by the above-mentioned. System. An optical semiconductor device comprising: a varnish producing process for producing a varnish containing particles and a curable resin; a sheet producing process for producing a B-stage covering sheet from the varnish; and a covering process for covering an optical semiconductor element with the covering sheet. A manufacturing condition determining device for determining manufacturing conditions of the sheet manufacturing process in a manufacturing method,
A first information storage area for storing first information related to the optical semiconductor element;
A second information storage area for storing second information related to the varnish;
And determining means for determining the manufacturing conditions based on the first information stored in the first information storage area and the second information stored in the second information storage area. Manufacturing condition determination device. The manufacturing condition determining device further determines manufacturing conditions of the varnish manufacturing process,
The determination means further determines the manufacturing conditions of the varnish manufacturing process based on the first information stored in the first information storage area and the second information stored in the second information storage area. The manufacturing condition determination device according to claim 6, wherein the determination is performed.   8. The manufacturing condition determining apparatus according to claim 6, wherein the first information includes information related to a substrate on which the optical semiconductor element is mounted. A fifth information storage area for storing fifth information related to manufacturing conditions for manufacturing the covering sheet before this time;
9. The manufacturing condition for manufacturing the cover sheet at this time is determined based on the fifth information stored in the fifth information storage area, according to claim 6. Manufacturing condition determination device. An optical semiconductor device comprising: a varnish producing process for producing a varnish containing particles and a curable resin; a sheet producing process for producing a B-stage covering sheet from the varnish; and a covering process for covering an optical semiconductor element with the covering sheet. A production management device for managing production conditions of the sheet production process in a production method,
A third information storage area for storing third information related to the manufacturing conditions;
A production management apparatus comprising: a management unit that manages the production conditions of the sheet production process based on the third information stored in the third information storage area. The production management device manages the production conditions of the varnish production process,
The manufacturing management apparatus according to claim 10, wherein the management unit further manages the manufacturing conditions of the varnish manufacturing process based on the third information stored in the third information storage area. . A fourth information storage area storing at least one kind of lot information of particles, curable resin, varnish, and optical semiconductor element, and / or fourth information including the production amount of the optical semiconductor device per unit period;
The manufacturing management according to claim 10, further comprising a correcting unit that corrects the manufacturing condition of the sheet manufacturing process based on the fourth information stored in the fourth information storage area. apparatus.