JP5338250B2 - Work separation method and cutting apparatus - Google Patents

Description

  The present invention relates to a workpiece separation method for cutting the inside of an adhesive layer of a workpiece in which a wafer and a protective member are bonded to each other via an adhesive layer formed on the outer peripheral portion, and separating the center of the cut protective member from the workpiece, and The present invention relates to a cutting apparatus.

  A cutting device for cutting or grooving a workpiece such as a wafer on which a semiconductor device or an electronic component is formed includes a thin disk-shaped blade formed by diamond abrasive grains rotated at high speed by a spindle. A work table for sucking and holding the work and X, Y, Z, and θ movement axes for changing the relative positions of the work table and the blade are provided. When machining a workpiece, a cutting fluid for cooling or lubrication is supplied from a nozzle to a rotating blade or a machining point where the workpiece and the blade are in contact with each other, and the blade and the workpiece are relatively moved by each moving axis. Cutting or grooving is performed on the workpiece by cutting the workpiece with the blade.

  FIG. 1 shows an example of a cutting apparatus. The cutting apparatus 1 includes a high-frequency motor built-in spindles 3 and 3 that are disposed to face each other and have a blade 2 and a wheel cover (not shown) attached to the tip, an imaging unit 4 that images the surface of the workpiece W, and a workpiece W Is provided with a work table 5 having a work table 5 that sucks and holds the blade 2 and a moving shaft (not shown) that relatively moves the blade 2 and the work table 5.

  The cutting device 1 includes a wafer cleaning device 7 that spin-cleans a processed workpiece W in addition to the processing unit 6, a load port 8 that mounts a cassette that stores a large number of workpieces W mounted on the frame F, Conveying means 9 for conveying the workpiece W, display means 10 for displaying an image picked up by the image pickup means 4 and inputting an operation to each part, a controller (not shown) for controlling the operation of each part, and the like. .

  In recent years, wafers processed by such a cutting device have been processed thinner by grinding the backside with a grinding device before cutting, in order to reduce the size and weight of semiconductor devices and electronic components. Yes. Since the wafer thinned in this way is very thin with a thickness of 100μ or less and low rigidity, it is difficult to carry and perform various processing, and a method of processing with a support bonded to the surface of the wafer has been proposed. (For example, refer to Patent Document 1 or Patent Document 2).

  However, if the support is bonded to such a wafer surface, the support must be peeled off after processing, and the adhesive must be degraded by various methods to reduce the adhesive force and peel off. I had to. Further, it is necessary to remove the adhesive remaining on the wafer surface after peeling, and complete removal of the adhesive is a very difficult operation.

In order to deal with such problems, a protective member is attached to the outer peripheral area of the wafer via an adhesive, and the inner side of the adhesive layer of the protective member is cut into a circular shape by a cutting device after the back surface grinding. A wafer processing method for removing the protective member has been proposed (see, for example, Patent Document 3).
Japanese Patent Laid-Open No. 2004-22634 JP 2003-209083 A JP 2005-123568 A

  However, as described in Patent Document 3, when removing the cut center of the protective member that is not required after cutting the protective member, the workpiece is processed at the same height with respect to the work table surface. In some cases, the blade does not completely penetrate the protective member due to a difference in the thickness of the adhesive layer or the like, and a part or all of the blade remains and is not separated. Such a protective member is difficult to remove as it is, and there has been a problem of increasing the processing time, such as cutting the same place again to remove the central portion of the protective member that could not be removed.

  The present invention has been made for such a problem, and the inside of the adhesive layer on the protective member side of the workpiece in which the wafer and the protective member are bonded together via the adhesive layer formed on the outer peripheral portion is cut. It is an object of the present invention to provide a workpiece separating method and a cutting apparatus capable of reliably and easily removing the center of a cut protective member later.

  In order to achieve the above object, the present invention provides a bonding layer in which a wafer having a plurality of devices formed on a surface and a protective member for protecting the surface of the wafer are formed on an outer peripheral portion. The workpiece pasted via the workpiece is placed on a work table, and the work table and a blade rotated by a spindle are moved relative to each other by a moving shaft to cut the inside of the adhesive layer on the protective member side of the workpiece. After the machining, the cut upper surface of the protective member center is sucked and adsorbed by a separating means and lifted to separate the cut protective member center from the workpiece.

  According to the first aspect of the present invention, a workpiece in which a wafer having a plurality of devices formed on the surface and a protective member that protects the surface of the wafer are bonded together via an adhesive layer formed on the outer peripheral portion is a work table. Adsorbed on top. For the work placed on the work table, the work table and the blade rotated by the spindle are moved relative to each other by the moving shaft so that the inner side of the adhesive layer on the protective member side is circular, arc-shaped, polygonal, or arc And cut into a straight line shape.

  The center of the protective member after cutting is separated from the work by suctioning and sucking the upper surface by the separating means and raising it in the vertical direction. As a result, a force is uniformly applied to the center of the cut protective member, and when the blade remains without completely penetrating the protective member, or the unprocessed portion is also sheared by the remaining portion and the protection is reliably and easily cut. The center of the member is removed.

  According to the invention of claim 2, a work in which a wafer having a plurality of devices formed on the surface and a protective member for protecting the surface of the wafer are bonded together via an adhesive layer formed on the outer peripheral portion is placed on the work table. Then, the work table and a blade rotated by a spindle are moved relative to each other by a moving shaft to cut the inner side of the adhesive layer on the protective member side of the work, and then cut the protective member central upper surface. It is characterized in that the center of the protective member that has been cut by being sucked and adsorbed by a separating means and lifted while rotating is separated from the workpiece.

  According to the second aspect of the present invention, the work in which the wafer and the protective member are bonded together via the adhesive layer formed on the outer peripheral portion is placed on the work table by suction. The work placed on the work table by suction is cut inside the adhesive layer on the protective member side by relatively moving the work table and the blade by the moving shaft.

  The center of the protective member after cutting is separated from the work by being lifted in the vertical direction while rotating around the center position of the protective member center while the upper surface is sucked and adsorbed by the separating means. As a result, when the blade remains without completely penetrating the protective member, or even if it is an unprocessed portion, the remaining portion is separated by applying a shearing force, and the protective member that has been cut and processed reliably and easily is removed.

  According to a third aspect of the present invention, a work having a wafer having a plurality of devices formed on the surface and a protective member for protecting the surface of the wafer bonded via an adhesive layer formed on the outer peripheral portion is placed on a work table. Then, the work table and a blade rotated by a spindle are moved relative to each other by a moving shaft to cut the inner side of the adhesive layer on the protective member side of the work, and then cut the protective member central upper surface. Is sucked and adsorbed by the separating means, and one end of the center of the protective member that has been cut is tilted first, and the protective member center that has been cut by being lifted in the tilted state is removed from the workpiece. It is characterized by separation.

  According to invention of Claim 3, the workpiece | work which bonded together the wafer and the protection member through the contact bonding layer formed in the outer peripheral part is adsorbed and mounted on a work table. The work placed on the work table is moved by moving the work table and blade relative to each other with the moving shaft, and the inner side of the adhesive layer on the protective member side is circular, arc, polygonal, or arc and straight To be cut.

  At the center of the protective member after cutting, the upper surface is sucked and adsorbed by the separating means, and one is pulled up first and lifted while being inclined to be separated from the workpiece. As a result, when the blade remains without completely penetrating the protective member, or even if it is an unprocessed portion, a shearing force is applied to the remaining portion and the blade is separated and the center of the protective member that has been cut reliably and easily is removed.

  According to a fourth aspect of the present invention, in the invention of any one of the first, second, or third aspect, when cutting the inside of the adhesive layer on the protective member side of the workpiece, the center of the protective member is arranged. The protective member is cut while being held by the separating means.

  According to invention of Claim 4, it cuts in the state in which the center of the protection member was adsorbed-held by the separating means. As a result, even if the center of the protection member processed when the protection member is cut is separated as it is, the protection member center is not dropped, and the protection immediately cut without damaging the device on the wafer surface. It becomes possible to remove the center of the member.

  As described above, according to the workpiece separating method and the cutting apparatus of the present invention, the center of the protective member processed after cutting the inside of the adhesive layer on the protective member side of the workpiece sucked and placed on the work table is separated. By sucking and adsorbing, the unnecessary center of the protective member can be removed reliably and easily.

  Hereinafter, preferred embodiments of a workpiece separating method and a cutting apparatus according to the present invention will be described in detail with reference to the accompanying drawings. First, the cutting apparatus according to the present invention will be described. FIG. 1 is a perspective view showing an appearance of a cutting apparatus. The cutting apparatus 1 includes a high-frequency motor built-in spindles 3 and 3 that are disposed to face each other and have a blade 2 and a wheel cover (not shown) attached to the tip, an imaging unit 4 that images the surface of the workpiece W, and a workpiece W Is provided with a work table 5 having a work table 5 that sucks and holds the blade 2 and a moving shaft (not shown) that relatively moves the blade 2 and the work table 5.

  The cutting device 1 includes a wafer cleaning device 7 that spin-cleans a processed workpiece W in addition to the processing unit 6, a load port 8 that mounts a cassette that stores a large number of workpieces W mounted on the frame F, Conveying means 9 for conveying the workpiece W, display means 10 for displaying an image picked up by the image pickup means 4 and inputting an operation to each part, a controller (not shown) for controlling the operation of each part, and the like. .

  As shown in FIG. 2, the workpiece W is bonded to a wafer 11 having a plurality of devices D formed on the surface thereof and a plate-like protective member 12 made of glass, silicon or the like via an adhesive layer 13 made of polyimide resin or the like. As shown in FIG. At this time, the adhesive layer 13 is formed in a ring shape on the surplus region 14 on the outer peripheral portion of the wafer 11 where the device D shown in FIG. 2 is not formed. As a result, as shown in FIG. A gap 15 is formed between them.

  The workpiece W thus formed is ground from the back surface side of the wafer 11 by the back surface grinding device, and the wafer 11 is thinned. The workpiece W after back grinding is mounted on the frame F with the wafer 11 side attached to the tape T as shown in FIG. In this state, the work W sucked and placed on the work table 5 of the cutting apparatus 1 is cut by the blade 2 that rotates at high speed by the spindle 3.

  In the cutting process, the center of the protective member 12 is sucked and sucked by the separating means 16 as shown in FIG. 6, and then the blade 2 rotating at high speed by the spindle 3 is formed in a ring shape up to the gap 15 as shown in FIG. The protective member 12 is cut by rotating the work table 5 and the separating means 16 in synchronization with each other. In the present embodiment, the blade 2 is cut to the gap 15 at a position inside the adhesive layer 13, but the present invention is not limited to this, and the blade 2 is cut to the wafer 11 or the tape T. Even if rare, it can be implemented.

  As shown in FIG. 8, the separation means 16 includes a shaft 17, a separation means main body 18 having a central portion connected to the shaft 17, and a suction means 19 for suction adsorption attached to the entire bottom surface of the separation means main body 18. ing.

  One end of the shaft 17 is attached to the conveying means 9, and a flow path 20 connected to a vacuum generating means (not shown) is formed inside the shaft 17. The separation means main body 18 has a flow path 21 connected to the flow path 20 formed therein, and can be rotated or inclined by a driving mechanism (not shown) around the shaft 17 and moved up and down by the transport means 9. It is provided as possible. The suction means 19 is an adsorption member made of resin or rubber material, and is connected to the flow path 21.

  As a result, the separating means 16 can suck and adsorb the center of the protective member 12 and can be lifted, rotated or tilted. As shown in FIG. 9, the center of the protective member 12 after cutting is reliably and easily separated and removed. It becomes possible. Even if the center of the protective member 12 is separated as it is, the center of the protective member 12 does not fall, and the unnecessary protective member 12 center that has been cut immediately can be removed without damaging the device D on the surface of the wafer 11. It becomes possible.

  Next, the work separation method according to the present invention will be described. FIG. 10 is a cross-sectional view showing a state in which the center of the protective member is sucked up and pulled up.

  The workpiece W bonded through the adhesive layer 13 so as to provide a gap 15 between the wafer 11 and the protective member 12 is ground from the back side of the wafer 11 to thin the wafer 11, and the wafer 11 side becomes the tape T. Affixed and mounted on frame F. The work W mounted on the frame F is sucked and placed on the work table 5, and the center of the protection member 12 of the work W is sucked and sucked uniformly by a plurality of suction means 19 spreading radially of the separating means 16.

  In this state, the workpiece W is rotated by θ and the blade 2 cuts the inside of the adhesive layer 13 of the protective member 12 to cut the protective member 12 into a circular shape.

  At this time, as shown in FIG. 10A, the protection member 12 has a full cut portion 22 that completely penetrates the protection member 12 and a half cut portion 23 that remains without penetrating the protection member 12. May occur. In such a case, as shown in FIG. 10B, the separating means 16 is lifted by the conveying means 9 to apply a shearing force to the remaining portion without penetrating, thereby shearing the half-cut portion 23.

  Further, the separating means 16 rotates the center of the protective member 12 by rotating in the direction of arrow A shown in FIG. 10A around the shaft 17 by a drive mechanism (not shown) provided in the separating means main body 18. As a result, a shearing force is generated at the remaining portion without penetrating, and the half-cut portion 23 is sheared.

  When the half cut portion 23 does not occur and the entire portion becomes the full cut portion 22 and the center of the protective member 12 is separated, the center of the protective member 12 is immediately separated and removed by the separating means 16.

  Thus, after cutting the inside of the adhesive layer on the protective member 12 side of the workpiece W in which the wafer 11 and the protective member 12 are bonded together via the adhesive layer 13 formed on the outer peripheral portion, an unnecessary protective member that has been cut is processed. The 12 center is reliably and easily removed.

  The center of the removed unnecessary protection member 12 is conveyed by the separating means 16 or other conveying means and stored in a dedicated cassette for storing unnecessary members provided near the load port 8 shown in FIG. The unnecessary protective member 12 thus removed is easily carried out from the cutting apparatus 1 and discarded.

  Next, a work separating method according to another embodiment of the present invention will be described. FIG. 11 is a cross-sectional view showing a state in which the center of the protective member is tilted and pulled up after suction suction.

  The workpiece W in which the wafer 11 and the protective member 12 are bonded to each other via the adhesive layer 13 is ground, whereby the wafer 11 is thinned, and the wafer 11 side is attached to the tape T and mounted on the frame F. The work W mounted on the frame F is sucked and placed on the work table 5, and the center of the protection member 12 of the work W is sucked and sucked uniformly by the separating means 16. In this state, the work W is rotated by θ and the blade 2 cuts the inside of the adhesive layer 13 of the protective member 12 to cut the protective member 12.

  At this time, as shown in FIG. 11A, the protective member 12 has a full cut portion 22 that completely penetrates the protective member 12 and a half cut portion 23 that remains without penetrating the protective member 12. May occur. In such a case, as shown in FIG. 11 (b), one of the separation means main bodies 18 rises in the direction of arrow B and is inclined by a drive mechanism (not shown) provided in the separation means main body 18. As a result, a shearing force is generated in a portion that remains without penetrating, and the half-cut portion 23 is sheared. After the half-cut portion 23 is sheared, the inclined separating means 16 is raised by the conveying means 9 as shown in FIG.

  When the half cut portion 23 does not occur and the entire portion becomes the full cut portion 22 and the center of the protective member 12 is separated, the center of the protective member 12 is immediately separated and removed by the separating means 16.

  Thus, after cutting the entire inner periphery of the adhesive layer on the protective member 12 side of the workpiece W in which the wafer 11 and the protective member 12 are bonded to each other via the adhesive layer 13 formed on the outer peripheral portion, unnecessary cutting is performed. The center of the protective member 12 can be reliably and easily removed.

  The removed unnecessary protective member 12 center is stored in a dedicated cassette for storing unnecessary members provided in the vicinity of the load port 8 and is carried out of the cutting apparatus 1 and discarded.

  In this embodiment, the protective member 12 is cut into a circular shape on the inner side. However, the present invention is not limited to this, and the entire periphery or unprocessed portion is left in the shape of an arc and a straight line as shown in FIG. You may cut it. Alternatively, the work table 5 may be rotated to perform a plurality of linear cutting processes while changing the angle so as to perform the cutting process while leaving the entire circumference or the unprocessed portion in a polygonal shape as shown in FIG. The protective member 12 cut in this way is separated and removed by suctioning and sucking the center of the unnecessary cut protective member 12 by the separating means 16 and ascending or tilting.

  Further, in the present embodiment, the center of the unnecessary protective member 12 is separated by being lifted, rotated, or inclined as it is after being sucked and sucked by the separating means 16. Alternatively, the separation of the center of the protective member 12 may be assisted by enclosing a fluid such as the gap 15.

  As described above, according to the workpiece separation method and the cutting apparatus according to the present invention, the inside of the adhesive layer on the protective member side of the workpiece in which the wafer and the protective member are bonded together via the adhesive layer formed on the outer peripheral portion. Even when the blade remains without completely penetrating the protective member during cutting, it is possible to remove the protective member that has been cut reliably and easily by shearing the remaining portion.

  In the present embodiment, the cutting process to the protection member 12 by the blade 2 is performed only on the inner side of the adhesive layer 13, but the present invention is not limited to this, and the half-cut portion 23 is bonded as shown in FIG. Cutting may be performed up to the protective member 12 where the layer 13 is formed.

The perspective view which shows the external appearance of a cutting apparatus. The perspective view which showed the structure of the workpiece | work. The perspective view which shows the external appearance of a workpiece | work. Sectional drawing which shows the structure of a workpiece | work. The perspective view which showed the state of the workpiece | work in which cutting is performed. The perspective view which showed the state by which a protection member is cut circularly. Sectional drawing which showed the mode of the cutting process of a protection member. Sectional drawing which showed the structure of the isolation | separation means. The perspective view which showed the state from which the protective member center part cut was separated. Sectional drawing which showed the state which attracts | sucks and raises the center of a protection member. Sectional drawing which showed the state which inclines and raises the center of a protection member after suction adsorption. The perspective view which showed the state by which the protection member was cut by the shape by a circular arc and a straight line. The perspective view which showed the state by which the protection member was cut into polygonal shape. Sectional drawing which showed the mode of the cutting process of the protection member of the part in which the contact bonding layer was formed.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Dicing apparatus, 2 ... Blade, 3 ... Spindle, 4 ... Imaging apparatus, 5 ... Work table, 6 ... Processing part, 7 ... Wafer cleaning apparatus, 8 ... Load port, 9 ... Conveyance means, 10 ... Display means, 11 DESCRIPTION OF SYMBOLS Wafer, 12 ... Protection member, 13 ... Adhesive layer, 14 ... Excess area, 15 ... Gap, 16 ... Separation means, 17 ... Shaft, 18 ... Separation means main body, 19 ... Adsorption means, 20, 21 ... Flow path, 22 ... Full cut part, 23 ... Half cut part, D ... Device, F ... Frame, T ... Tape, Workpiece ... W

Claims (5)

A work having a wafer having a plurality of devices formed on the surface and a protective member for protecting the surface of the wafer bonded through an adhesive layer formed on the outer periphery is placed on the work table, and the work table and the spindle After cutting the inner side of the adhesive layer on the protective member side of the workpiece by relatively moving the rotating blade by the moving shaft,
A workpiece separating method, wherein the cut center of the protection member is separated from the workpiece by sucking and adsorbing the cut upper surface of the center of the protection member by a separating unit. A work having a wafer having a plurality of devices formed on the surface and a protective member for protecting the surface of the wafer bonded through an adhesive layer formed on the outer periphery is placed on the work table, and the work table and the spindle After cutting the inner side of the adhesive layer on the protective member side of the workpiece by relatively moving the rotating blade by the moving shaft,
A workpiece separating method, wherein the cut upper surface of the central protective member is sucked and adsorbed by a separating means, and is lifted while rotating to separate the cut central portion of the protective member from the workpiece. A work having a wafer having a plurality of devices formed on the surface and a protective member for protecting the surface of the wafer bonded through an adhesive layer formed on the outer periphery is placed on the work table, and the work table and the spindle After cutting the inner side of the adhesive layer on the protective member side of the workpiece by relatively moving the rotating blade by the moving shaft,
The upper surface of the central part of the protective member that has been cut is sucked and adsorbed by a separating means, and one end of the central part of the protective member that has been cut is tilted by first raising it, and then it is lifted in an inclined state and cut. Further, the work separating method characterized in that the center of the protective member is separated from the work.   3. When cutting the inside of the adhesive layer on the protective member side of the workpiece, the protective member is cut while holding the center of the protective member by the separating means. 4. The workpiece separation method according to any one of items 3 and 3. A disk-shaped blade,
A spindle for rotating the blade;
A work table for holding a work in which a wafer having a plurality of devices formed on the surface and a protective member for protecting the surface of the wafer are bonded together via an adhesive layer formed on the outer periphery;
A movement axis for relatively moving the work table and the blade;
A cutting apparatus comprising: a separating unit including an adsorbing unit that sucks and adsorbs a central portion of the workpiece on the protective member side that is inside the adhesive layer.

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