JP5278370B2 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting device and an electronic component mounting method capable of securing a stable holding force of a suction nozzle under a component holding condition, and easily detaching and attaching the nozzle during exchanging the nozzle as well. <P>SOLUTION: The device comprises a clamp mechanism including a plurality of clamp arms 32 to clamp a clamped part 26f provided to a suction nozzle 26 to a nozzle holding part 25 detachably holding the suction nozzle 26, and annular spring members 33 energizing the clamp arms 32 in a clamping direction; and a holding force reinforcing mechanism for driving a piston 29 in an inner direction by a vacuum pressure generated by vacuum sucking a suction opening 25b communicated with the suction nozzle 26, bringing an auxiliary arm 27 into contact with the clamp arms 32 to apply a pressing force, and reinforcing the holding force of the suction nozzle 26 with the clamp mechanism. <P>COPYRIGHT: (C)2012,JPO&amp;INPIT

Description

  The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting electronic components on a substrate.

  In an electronic component mounting apparatus that mounts an electronic component on a substrate, the electronic component stored in the component supply unit is picked up by a mounting head, transferred onto the substrate, and mounted at a predetermined mounting point. As a method for picking up electronic components, a method of vacuum suction using a suction nozzle is widely used. Since the suction nozzle generally has a different type and size depending on the electronic component to be sucked, it is detachably attached to the mounting head according to the electronic component to be sucked. The suction nozzle can be attached to the mounting head in a detachable manner by providing a plurality of clamp arms concentrically arranged in the nozzle holding portion that holds the suction nozzle and fitting into the recess provided in the suction nozzle. A configuration is known in which an annular spring is mounted around the outer surface of the arm (see Patent Document 1).

  In attaching and detaching the suction nozzle, since the fitting protrusion of the clamp arm and the concave portion of the suction nozzle are slid in a state where they are pressed by the elastic force of the spring, wear tends to occur. Wearing by sliding is reduced by providing a groove for storing the lubricant in the fitting protrusion.

Japanese Patent No. 3714080

  In recent years, with the diversification of the types of electronic components mounted on electronic boards, the types of electronic components to be held by the suction nozzle in the electronic component mounting apparatus include large components that are heavier than conventional ones. It is like that. When such a large component is held by suction, the load acting on the suction nozzle increases, so if the holding force of the spring for clamping the suction nozzle is not sufficient, the suction nozzle holds it. May fall out of the nozzle holding part together with the removed parts.

  In order to reduce such a problem of nozzle dropout, it is possible to obtain a large holding force by increasing the spring strength of the spring. Requires a great deal of force when removing from. As a result, the wear of the sliding surface between the fitting protrusion and the recess is promoted, resulting in a problem that the life of the component is reduced. As described above, in the conventional electronic component mounting apparatus, there is a problem that it is difficult to achieve both the securing of the stable holding force of the suction nozzle in the component holding state and the ease of attachment / detachment at the time of nozzle replacement.

  Accordingly, an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method capable of ensuring both stable holding force of the suction nozzle in the component holding state and easy attachment / detachment at the time of nozzle replacement. To do.

  The electronic component mounting apparatus according to the present invention is an electronic component mounting apparatus that sucks and holds an electronic component from a component supply unit by a suction nozzle and mounts the electronic component on a substrate positioned in a substrate positioning unit. A mounting head that is mounted on the head, a head moving mechanism that moves the mounting head between the component supply unit and the substrate positioning unit, and a nozzle holding unit that is provided on the mounting head and detachably holds the suction nozzle And the nozzle holding portion includes a plurality of clamp arms that clamp the clamped portion provided in the suction nozzle and a biasing unit that biases these clamp arms against the clamped portion in a clamping direction. A clamp mechanism and a main body provided with the suction mechanism that is provided with the clamp mechanism and communicates with the suction nozzle. Further, a holding force that reinforces the holding force of the suction nozzle by the clamp mechanism by applying a pressing force in the clamping direction to the plurality of clamp arms by a vacuum pressure generated by vacuum suction of the suction opening. A force reinforcement mechanism was provided.

  The electronic component mounting method of the present invention includes a mounting head to which a suction nozzle is detachably mounted, a head moving mechanism for moving the mounting head between the component supply unit and the substrate positioning unit, and a mounting head. A nozzle holding part that is detachably held by the suction nozzle, and the nozzle holding part clamps the clamped part provided on the suction nozzle and the clamped arm. A clamping mechanism comprising an urging means for urging in a clamping direction to be pressed against the part, and a main body provided with the suction mechanism that is provided with the clamping mechanism and communicates with the suction nozzle. A pressing force in the clamping direction is applied to the plurality of clamp arms by a vacuum pressure generated by vacuum suction. The electronic component mounting apparatus provided with a holding force reinforcing mechanism that reinforces the holding force of the suction nozzle by the clamp mechanism is sucked and held by the suction nozzle from the component supply unit and positioned on the substrate positioning unit. An electronic component mounting method for mounting on a substrate, wherein when holding the electronic component by the suction nozzle, the holding force reinforcing mechanism is operated to reinforce the holding force of the suction nozzle, and the nozzle holding portion When exchanging the suction nozzle, the attachment / detachment of the suction nozzle is performed in a state where the holding force reinforcing mechanism is not operated.

  According to the present invention, the plurality of clamp arms for clamping the clamped portion provided in the suction nozzle to the nozzle holding portion that detachably holds the suction nozzle and the biasing means for biasing these clamp arms in the clamping direction. The holding force of the suction nozzle by the clamp mechanism is exerted by applying a pressing force in the clamping direction to the plurality of clamp arms by the vacuum pressure generated by vacuum suction of the suction opening communicating with the suction nozzle. By providing the holding force reinforcing mechanism that reinforces, it is possible to achieve both the securing of a stable holding force of the suction nozzle in the component holding state and the ease of attachment and detachment when replacing the nozzle.

The perspective view of the electronic component mounting apparatus of one embodiment of this invention Structure explanatory drawing of the mounting head unit used for the electronic component mounting apparatus of one embodiment of this invention Configuration and function explanatory diagram of a nozzle holding unit in an electronic component mounting apparatus according to an embodiment of the present invention Explanatory drawing of operation | movement of the nozzle holding | maintenance part in the electronic component mounting apparatus of one embodiment of this invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, the structure of the electronic component mounting apparatus 1 will be described with reference to FIG. The electronic component mounting apparatus 1 has a function of picking up and holding an electronic component from a component supply unit by a suction nozzle and mounting it on a substrate positioned in the substrate positioning unit. In FIG. 1, a substrate transport mechanism 2 is disposed in the X direction at the center of a base 1a. The board transport mechanism 2 transports the board 3 on which electronic components are mounted in the X direction.

  A substrate positioning unit that positions and holds the substrate at the mounting position is provided in the transport path by the substrate transport mechanism 2, and electronic components are mounted on the substrate 3 positioned by the substrate positioning unit. A component supply unit 4 is disposed on both sides of the substrate transport mechanism 2, and a plurality of tape feeders 5 are arranged in parallel in the component supply unit 4. The tape feeder 5 pitches a carrier tape containing electronic components and supplies the electronic components to a component mounting mechanism described below.

  A Y-axis moving table 6 is disposed in the Y direction at one end of the base 1a in the X direction, and a pair of X-axis moving tables 7 is slidably coupled to the Y-axis moving table 6 in the Y direction. ing. Mounting heads 8 each having a suction nozzle 26 (see FIG. 2) at the lower end are mounted on the two X-axis moving tables 7, and are mounted by driving the Y-axis moving table 6 and the X-axis moving table 7. The head 8 moves horizontally, whereby a component mounting operation is performed in which the electronic component is taken out from the tape feeder 5 of each component supply unit 4 by the mounting head 8 and transferred and mounted on the substrate 3 positioned by the substrate transport mechanism 2. . Therefore, the Y-axis moving table 6 and the X-axis moving table 7 constitute a head moving mechanism that moves the mounting head 8.

  Next, the structure of the mounting head 8 will be described with reference to FIG. In FIG. 2, the mounting head 8 includes a vertical mounting plate 10, and is mounted via a mounting plate 10 on a lifting member 9 a that is lifted and lowered by a Z-axis drive mechanism 9. By driving the Z-axis drive mechanism 9, the entire mounting head 8 moves up and down (arrow a). A motor 11 is disposed vertically on a flat surface portion 10 a provided on the top of the mounting plate 10. The rotating shaft 11 a of the motor 11 is coupled to the upper end shaft 13 a of the rotating block 13 through the coupling 12. A lower portion of the rotary block 13 is coupled to the hollow shaft 14, and a hollow portion 13 b provided at a coupling portion with the hollow shaft 14 is connected to a positive pressure supply source 15 through a pipe line 13 c.

  A housing 18 is fixed to the side surface of the mounting plate 10. The housing 18 rotatably supports the hollow shaft 14 via upper and lower bearings 19. A spline shaft 21 is vertically inserted into the spline housing 20 mounted in the hollow shaft 14 so as to be movable up and down. The upper end portion of the spline shaft 21 abuts on the bellophram 16 mounted in the hollow portion 13 b, and the lower end portion is coupled to the nozzle block 22 that holds the suction nozzle 26. As the spline shaft 21 moves up and down, the suction nozzle 26 moves up and down (arrow b). Therefore, the spline shaft 21 is a nozzle lifting shaft. The nozzle block 22 is biased upward by a tension spring member (not shown) supported at the upper end by the housing 18, thereby restricting the downward movement of the spline shaft and the nozzle block 22.

  When the positive pressure supply source 15 is driven to apply a positive pressure in the hollow portion 13b, the belofram 16 presses the spline shaft 21 downward against the urging force of the tension spring member. That is, the belofram 16 is a pressing unit that presses the electronic component against the substrate 3 through the suction nozzle 26 by applying a downward load due to air pressure to the spline shaft 21. At this time, the pressure load for pressing the electronic component is controlled by controlling the pneumatic pressure supplied from the positive pressure supply source 15 by the control unit 17. It should be noted that other types of air actuators other than belofram may be used as the pressing means.

  The lower part of the nozzle block 22 coupled to the lower end of the spline shaft 21 is a nozzle holding portion 25 to which the suction nozzle 26 is detachably attached. When the suction nozzle 26 is attached, the suction nozzle 26 The suction hole 26 b provided in the shaft portion 26 a is connected to the vacuum suction source 24 through the pipe line 23. By driving the vacuum suction source 24, vacuum suction is performed through the pipe line 23, whereby the electronic component P (see FIG. 4) is vacuum-sucked and held in the suction hole 26b of the suction nozzle 26.

  By driving the motor 11, rotation is transmitted to the nozzle block 22 through the rotary block 13, the hollow shaft 14, the spline housing 20, and the spline shaft 21. As a result, the suction nozzle 26 rotates in the θ direction together with the nozzle block 22 (arrow c), and the rotational position in the θ direction of the electronic component sucked and held by the suction nozzle 26 can be arbitrarily adjusted. . In this rotation operation, the rotation of the nozzle block 22 with respect to the pipe line 23 connected to the vacuum suction source 24 is allowed by the rotary joint portion 22 a incorporated in the nozzle block 22. The rotary joint portion 22a is prevented from turning by a turning stop member 22b.

  When mounting the electronic component held by the suction nozzle 26 on the substrate, it is necessary to press the electronic component with a predetermined mounting load determined by the type of the electronic component. This pressing is performed by applying a positive pressure from the positive pressure supply source 15 to the hollow portion 13 b and pressing the spline shaft 21 downward by the bellophram 16. At this time, by adjusting the pressure supplied from the positive pressure supply source 15, the load pressed by the bellophram 16 can be arbitrarily set. Therefore, it is possible to mount various types of electronic components having different mounting loads using the same mounting head 8.

  Next, the structure of the suction nozzle 26 and the nozzle holding part 25 will be described with reference to FIG. As shown in FIG. 3, the suction nozzle 26 has a suction shaft 26 a that has a suction hole 26 b and extends downward on the lower surface side of the disk-shaped flange portion 26 c, and the suction nozzle 26 is clamped by the nozzle holding portion 25. The mounting projection 26d provided with the clamped portion 26f for holding the projection 26d is projected on the upper surface side of the flange portion 26c.

  The nozzle holding portion 25 has a function of detachably holding the suction nozzle 26 configured as described above, and is provided below the main body portion 25a provided with a suction opening 25b penetrating vertically and communicating with the suction nozzle 26. An inner tapered surface 25c is formed on which the outer tapered surface 26e of the mounting protrusion 26d is fitted. By driving the vacuum suction source 24, the inside of the suction opening 25b is vacuum-sucked through the conduit 23, and further vacuum-sucked from the suction hole 26b.

  Two clamp arms 32 each provided with an upper protrusion 32a and a lower protrusion 32b are mounted on both side surfaces of the main body portion 25a, respectively, and circulate around the outer surface side of these clamp arms 32 to form an annular shape. A spring member 33 is attached. The annular spring member 33 is an endless tension spring member, and has a function as a biasing unit that applies a biasing force inward to the clamp arm 32.

  In a state where the outer tapered surface 26e is fitted to the inner tapered surface 25c and the suction nozzle 26 is held by the nozzle holding portion 25, the clamp arm 32 is urged by the biasing force of the annular spring member 33 as shown in FIG. The upper projection 32a and the lower projection 32b are pressed against the main body 25a and the clamped portion 26f of the nozzle holding portion 25, and the suction nozzle 26 is thereby clamped. Since this clamping force depends on the spring force of the annular spring member 33, when a large clamping force is required, the annular spring member 33 having an appropriate spring strength is set according to the required clamping force. It is necessary to select. However, if the annular spring member 33 having an excessive spring strength is employed, inconveniences such as excessive surface friction acting on the lower protrusion 32b and the clamped portion 26f during the nozzle attaching / detaching operation may cause inconvenience. There is a limit to the spring strength of the annular spring member 33 that can be employed.

  For this reason, in the present embodiment, a holding force reinforcing mechanism described below is provided so that the clamping force can be increased without using the annular spring member 33 having a strong spring strength. In the main body portion 25a shown in FIG. 3A, the cylinder portion 25d communicates with the suction opening portion 25b via the connecting hole 25e at two locations facing each other in the horizontal direction, located above the inner tapered surface 25c. Is formed.

  A piston 29 is slidably fitted to the cylinder portion 25d, and the piston 29 is urged outward (arrow d) by a built-in compression spring member 30. A connection extension 29 a provided to extend outward from the piston 29 is linked to the auxiliary arm 27 via a connection pin 31. By vacuuming the inside of the cylinder portion 25d through the connecting hole 25e, the piston 29 is sucked inward against the urging force of the compression spring member 30, thereby pulling the auxiliary arm 27 inward.

  The auxiliary arm 27 is a pair of arm members that are curved outward, and the support end 27a at the upper end is pivotally supported via a support shaft 28 on a shaft support 25f that projects outward from the main body 25a. ing. A connecting portion 27b in which an intermediate portion of the auxiliary arm 27 projects is provided with a connecting hole 27c having a long hole shape, and a connecting extension portion 29a is linked to the connecting hole 27c via a connecting pin 31. The portion below the connecting portion 27b is a pressing end portion 27d whose tip extends to a position where it can come into contact with the clamp arm 32 from the outside, and when the connecting portion 27b is pulled inward, the pressing end portion 27d is An inner side pressing force corresponding to the vacuum suction force acting on the piston 29 is applied to the clamp arm 32 by coming into contact with the clamp arm 32 from the outside.

  FIG. 4 shows a state in which the vacuum suction source 24 is driven and vacuum suction (arrow e) is performed in order to suck and hold the electronic component P by the suction nozzle 26. By this vacuum suction, the suction hole 26b is vacuum-sucked (arrow f), and the electronic component P is sucked and held at the lower end portion of the shaft portion 26a. At the same time, the cylinder 25d (see FIG. 3) communicating with the suction opening 25b is also vacuumed (arrow g), and the piston 29 is pulled inward against the biasing force of the compression spring member 30 by this vacuum pressure ( Arrow h). Then, the pressing end 27d at the lower end of the auxiliary arm 27 coupled via the connecting pin 31 moves inward (arrow i), contacts the outside of the clamp arm 32, and presses inward. Thereby, the clamping force by which the lower protrusion 32b presses the clamped portion 26f (see FIG. 3) is reinforced.

  That is, in the above configuration, the nozzle holding unit 25 presses the clamped portions 26f provided in the suction nozzle 26 with a plurality of (here, two) clamp arms 32 and these clamp arms 32 against the clamped portions 26f. A main body provided with a clamping mechanism comprising an urging means (annular spring member 33) for urging in the clamping direction (inward direction), and a suction opening 25b provided with this clamping mechanism and communicating with the suction hole 26b of the suction nozzle 26 It has the form which has the part 25a.

  Further, in the present embodiment, the suction pressure in the clamping direction is applied to the plurality of clamp arms 32 by the vacuum pressure generated by vacuum suction of the suction opening 25b, and the suction nozzle 26 is held by the clamp mechanism. The structure is provided with a holding force reinforcing mechanism that reinforces the force. As this holding force reinforcing mechanism, in the present embodiment, a drive unit formed by slidably fitting a piston 29 in a cylinder unit 25d provided in the main body unit 25a in communication with the suction opening 25b; A configuration is adopted in which an auxiliary arm 27 is connected to the piston 29 via a connecting pin 31 and is connected to and separated from the clamp arm 32 from the outside. In the component suction operation, the piston 29 is slid inwardly in the cylinder portion 25d that is vacuum sucked by vacuum suction from the suction opening 25b, and the auxiliary arm 27 connected to the piston 29 is moved with respect to the clamp arm 32. So that they come into contact from the outside.

  This electronic component mounting apparatus is configured as described above, and the component mounting operation will be described below. When the component mounting operation is started, the mounting head 8 moves to the component supply unit 4, the electronic component is sucked and held from the tape feeder 5 by the suction nozzle 26, and mounted on the substrate 3 of the substrate transport mechanism 2. In the process of repeating this component mounting operation, when different types of electronic components are to be sequentially mounted, the suction nozzle 26 is replaced according to the type of the electronic components. At the same time, when it is necessary to change the setting of the mounting load at the time of mounting, the controller 17 controls the positive pressure supply source 15 to supply a pressure corresponding to the mounting load.

  When the electronic component is sucked and held by the suction nozzle 26 in this mounting operation, as shown in FIG. 4, the plurality of clamp arms 32 are clamped by the vacuum pressure generated by vacuum suction of the suction opening 25b. The holding force of the suction nozzle 26 by the clamping mechanism of the nozzle holding portion 25 is reinforced by applying a pressing force in the direction, that is, operating the above-described holding force reinforcing mechanism. Thereby, even when the electronic component P to be held has a large mass, the suction nozzle 26 can be reliably held in the nozzle holding portion 25, and the suction nozzle 26 falls off the nozzle holding portion 25 together with the electronic component P. Problems can be prevented.

  When the suction nozzle 26 is replaced in the nozzle holding portion 25, as shown in FIG. 3, the suction nozzle 26 is attached and detached while the vacuum suction from the suction opening portion 25b is stopped and the holding force reinforcing mechanism is not activated. I do. Thereby, the load required when pulling out the suction nozzle 26 from the nozzle holding part 25 can be reduced. Therefore, it is possible to achieve both the securing of the stable holding force of the suction nozzle 26 in the component holding state and the ease of attachment / detachment when the suction nozzle 26 is replaced.

  The electronic component mounting apparatus and the electronic component mounting method of the present invention have the effect of ensuring both stable holding force of the suction nozzle in the component holding state and ease of attachment / detachment when replacing the nozzle. This is useful in the field where electronic components are held by a nozzle and transferred to a substrate.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 3 Board | substrate 4 Component supply part 5 Tape feeder 6 Y-axis movement table 7 X-axis movement table 8 Mounting head 25 Nozzle holding part 25a Main body part 25b Suction opening part 25d Cylinder part 26 Adsorption nozzle 26b Adsorption hole 26f Clamped 27 Auxiliary arm 29 Piston 32 Clamp arm 33 Annular spring member P Electronic component

Claims (4)

An electronic component mounting apparatus that mounts on a substrate positioned by a substrate positioning unit by sucking and holding an electronic component by suction nozzle from a component supply unit,
A mounting head to which the suction nozzle is detachably mounted, a head moving mechanism for moving the mounting head between the component supply unit and the board positioning unit, and the suction nozzle provided in the mounting head are detachable. A nozzle holding part for holding the
The nozzle holding portion includes a plurality of clamp arms that clamp the clamped portions provided in the suction nozzle, and a clamp mechanism that includes biasing means that biases these clamp arms against the clamped portions in a clamping direction; A main body provided with a suction opening that is provided with the clamp mechanism and communicates with the suction nozzle;
Further, a holding force that reinforces the holding force of the suction nozzle by the clamp mechanism by applying a pressing force in the clamping direction to the plurality of clamp arms by a vacuum pressure generated by vacuum suction of the suction opening. An electronic component mounting apparatus comprising a reinforcing mechanism. The biasing means is an endless tension spring member that is mounted around the outer surface side of the plurality of clamp arms and applies a biasing force in the inner direction to the clamp arms,
The holding force reinforcing mechanism communicates with the suction opening, and includes a drive unit formed by slidably fitting a piston in a cylinder provided in the main body, and a clamp arm connected to the piston. And an auxiliary arm that contacts and separates from the outside, and by vacuum suction from the suction opening, the piston is slid inward and the auxiliary arm is brought into contact with the clamp arm. The electronic component mounting apparatus according to claim 1. A mounting head to which the suction nozzle is detachably mounted, a head moving mechanism for moving the mounting head between the component supply unit and the substrate positioning unit, and the suction nozzle provided in the mounting head to be detachable A nozzle holding portion that holds the plurality of clamp arms that clamp the clamped portion provided in the suction nozzle and urges the clamp arms in a clamping direction to press the clamp arm against the clamped portion. A vacuum mechanism generated by vacuum suction of the suction opening, the clamp mechanism including an urging means, and a main body provided with a suction opening provided with the clamp mechanism and communicating with the suction nozzle. By applying a pressing force in the clamping direction to the plurality of clamp arms, the clamping mechanism An electronic component mounting apparatus having a holding force reinforcing mechanism that reinforces the holding force of the landing nozzle, and picks up and holds the electronic component from the component supply unit by the suction nozzle and mounts it on the substrate positioned in the substrate positioning unit. A component mounting method,
In the case where the electronic component is sucked and held by the suction nozzle, the holding force reinforcing mechanism is operated to reinforce the holding force of the suction nozzle,
When replacing the suction nozzle in the nozzle holding portion, the electronic component mounting method is characterized in that the suction nozzle is attached and detached without the holding force reinforcing mechanism being operated. As the urging means, an endless tension spring member that is mounted around the outer surface side of the plurality of clamp arms and applies an urging force in the inner direction to the clamp arms is used.
As the holding force reinforcing mechanism, a drive part formed by slidably fitting a piston in a cylinder part provided in the main body part in communication with the suction opening, and a clamp arm connected to the piston. On the other hand, using a configuration having an auxiliary arm that contacts and separates from the outside,
The holding force reinforcing mechanism is operated by sliding the piston inward by vacuum suction from the suction opening and bringing the auxiliary arm into contact with the clamp arm. Item 4. The electronic component mounting method according to Item 3.

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