JP5269990B2 - Manufacturing method of humidity detection sensor package - Google Patents

Manufacturing method of humidity detection sensor package Download PDF

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JP5269990B2
JP5269990B2 JP2011518426A JP2011518426A JP5269990B2 JP 5269990 B2 JP5269990 B2 JP 5269990B2 JP 2011518426 A JP2011518426 A JP 2011518426A JP 2011518426 A JP2011518426 A JP 2011518426A JP 5269990 B2 JP5269990 B2 JP 5269990B2
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humidity detection
detection sensor
partition member
substrate
base
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JPWO2010140545A1 (en
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進矢 横山
聡 和賀
澄人 森田
達也 斉藤
志浩 牛来
淳 遁所
崇 佐藤
浩司 佐藤
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Alps Alpine Co Ltd
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Alps Electric Co Ltd
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    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/0004—Gaseous mixtures, e.g. polluted air
    • G01N33/0009—General constructional details of gas analysers, e.g. portable test equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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Description

本発明は、湿度検出センサのパッケージの製造方法に関する。 The present invention relates to a method of manufacturing a package of the humidity detection sensor.

湿度変化測定に用いられる湿度検出センサには、吸収又は放出した水分量に応じて誘電率が変化する高分子感湿膜を誘電体とした静電容量型の湿度検出センサがある。容量型湿度検出センサは、上記高分子感湿膜と該高分子感湿膜で覆われてその静電容量を検出する一対の電極からなるセンサ部を備え、一対の電極端部に設けたパッド部がワイヤボンディングにより外部回路と電気的に接続可能となっている。このような容量型湿度検出センサにおいては、センサ部の高分子感湿膜を雰囲気に曝す必要があり、外部接続部であるワイヤボンディング部を少なくとも封止樹脂で封止することが要求される。   As a humidity detection sensor used for humidity change measurement, there is a capacitance type humidity detection sensor using a polymer moisture-sensitive film whose dielectric constant changes according to the amount of absorbed or released water as a dielectric. A capacitive humidity detection sensor includes a sensor unit including the polymer moisture-sensitive film and a pair of electrodes that are covered with the polymer moisture-sensitive film and detects capacitance thereof, and pads provided at the ends of the pair of electrodes. The part can be electrically connected to an external circuit by wire bonding. In such a capacitive humidity detection sensor, it is necessary to expose the polymer moisture-sensitive film of the sensor part to the atmosphere, and it is required to seal at least the wire bonding part which is an external connection part with a sealing resin.

このように、部分的に封止樹脂で封止してなる電子部品パッケージとしては、特許文献１に開示されたものがある。この構成においては、封止しないセンサ領域をキャップ部材で保護している。このため、封止樹脂がキャップ部材とセンサを搭載する基板とにわたって被覆される。   As described above, an electronic component package partially sealed with a sealing resin is disclosed in Patent Document 1. In this configuration, the sensor region that is not sealed is protected by the cap member. For this reason, sealing resin is coat | covered over the board | substrate which mounts a cap member and a sensor.

国際公開第０１／４０７８４号パンフレットInternational Publication No. 01/40784 Pamphlet

しかしながら、特許文献１に開示された構成においては、キャップ部材を構成する材料と基板を構成する材料との間に熱膨張係数の差があると、使用温度により熱歪みが生じてセンサの温度特性のばらつきが大きくなる。また、特許文献１に開示された構成では、封止樹脂で封止する際に、ポッティングなどの方法でセンサパッケージ毎に個別に封止する必要があり、量産性が悪いという問題もある。   However, in the configuration disclosed in Patent Document 1, if there is a difference in thermal expansion coefficient between the material constituting the cap member and the material constituting the substrate, thermal distortion occurs due to the operating temperature, and the temperature characteristics of the sensor. The variation of the is increased. Further, in the configuration disclosed in Patent Document 1, when sealing with a sealing resin, it is necessary to individually seal each sensor package by a method such as potting, which causes a problem of poor mass productivity.

本発明はかかる点に鑑みてなされたものであり、どの使用温度においても熱歪みが生じず温度特性のばらつきが小さい湿度検出センサパッケージを効率良く得ることができる湿度検出センサパッケージの製造方法を提供することを目的とする。 The present invention has been made in view of the above, the humidity detection sensor package manufacturing method capable any thermal distortion at use temperature is to efficiently obtain a humidity detection sensor package variation in the temperature characteristics is small not occur The purpose is to provide.

本発明の湿度検出センサパッケージの製造方法は、パッケージ基板の一方の主面側に湿度検出センサを実装する工程と、前記湿度検出センサの外部接続部分を少なくとも封止樹脂により封止する工程と、を具備し、前記湿度検出センサは、感湿領域を備えると共に、前記感湿領域が外界に露出するように前記封止樹脂の封止領域と前記感湿領域とを仕切る仕切り部材を有しており、前記湿度検出センサは、前記仕切り部材と同じ材質の基板の一方の主面に、前記感湿領域に対面する凹部を形成する工程と、基台上にセンサ素子を搭載する工程と、前記凹部が前記感湿領域に対面するように、前記基板と前記基台とを接合する工程と、前記基板の他方の主面を研削して前記感湿領域を外界に露出させる開口を形成して前記仕切り部材を設ける工程と、ダイシングラインに沿ってダイシングすることにより個々の湿度検出センサに分割する工程と、により作製されることを特徴とする。 The manufacturing method of the humidity detection sensor package of the present invention includes a step of mounting a humidity detection sensor on one main surface side of the package substrate, a step of sealing an external connection portion of the humidity detection sensor with at least a sealing resin, The humidity detection sensor includes a moisture sensitive region and a partition member that partitions the sealing region of the sealing resin and the moisture sensitive region so that the moisture sensitive region is exposed to the outside. cage, the humidity detection sensor, on one main surface of the substrate of the same material as the partition member, forming a recess facing said moisture sensitive area, a step of mounting the sensor element on the base, A step of bonding the substrate and the base so that the concave portion faces the moisture sensitive region, and an opening that exposes the moisture sensitive region to the outside by grinding the other main surface of the substrate. To install the partition member When, characterized in that it is produced a step of dividing into individual humidity detection sensor by dicing along the dicing line, by.

この方法によれば、多数個取りのウエハ状態で基板と基台とを接合してその後ダイシングしてチップ化するので、量産性が高い状態で湿度検出センサを作製することができる。このため、効率良く湿度検出センサパッケージを製造することができる。   According to this method, since the substrate and the base are joined in a multi-piece wafer state and then diced into chips, a humidity detection sensor can be manufactured with high mass productivity. For this reason, a humidity detection sensor package can be manufactured efficiently.

本発明の湿度検出センサパッケージの製造方法においては、前記基台のみをダイシングラインに沿ってダイシングすることにより個々の湿度検出センサに分割することが好ましい。   In the manufacturing method of the humidity detection sensor package of this invention, it is preferable to divide | segment into each humidity detection sensor by dicing only the said base along a dicing line.

本発明の湿度検出センサパッケージの製造方法においては、前記基台と前記仕切り部材とをダイシングラインに沿ってダイシングすることにより個々の湿度検出センサに分割することが好ましい。   In the manufacturing method of the humidity detection sensor package of this invention, it is preferable to divide | segment into each humidity detection sensor by dicing the said base and the said partition member along a dicing line.

本発明の湿度検出センサパッケージの製造方法においては、前記凹部がフォトリソグラフィ及びエッチングで形成されることが好ましい。   In the manufacturing method of the humidity detection sensor package of this invention, it is preferable that the said recessed part is formed by photolithography and an etching.

本発明の湿度検出センサパッケージの製造方法においては、前記仕切り部材に、フッ素系ガスの被着により薄膜を形成することが好ましい。   In the manufacturing method of the humidity detection sensor package of this invention, it is preferable to form a thin film on the partition member by depositing a fluorine-based gas.

本発明の湿度検出センサパッケージは、パッケージ基板の一方の主面上に実装され、感湿領域を有する湿度検出センサと、前記湿度検出センサの外部接続部を少なくとも封止する封止樹脂と、前記感湿領域が外界に露出するように、前記封止樹脂の封止領域と前記感湿領域とを仕切る仕切り部材と、を具備し、前記湿度検出センサは、基台と、前記基台上に搭載されたセンサ素子と、を有し、前記基台と前記仕切り部材とが同じ材質で構成されているので、どの使用温度においても熱歪みが生じず温度特性のばらつきを小さくすることができる。   The humidity detection sensor package of the present invention is mounted on one main surface of the package substrate, has a humidity detection sensor having a moisture sensitive region, a sealing resin for sealing at least an external connection portion of the humidity detection sensor, A partition member that partitions the sealing region of the sealing resin and the moisture sensitive region so that the moisture sensitive region is exposed to the outside, and the humidity detection sensor is provided on a base and on the base Since the base and the partition member are made of the same material, thermal distortion does not occur at any operating temperature, and variations in temperature characteristics can be reduced.

本発明の実施の形態に係る湿度検出センサパッケージを示す図であり、（ａ）は等角投影図であり、（ｂ）は底面等角投影図であり、（ｃ）は平面図であり、（ｄ）は底面図であり、（ｅ）は側面図であり、（ｆ）は断面図である。It is a figure which shows the humidity detection sensor package which concerns on embodiment of this invention, (a) is an isometric view, (b) is a bottom isometric view, (c) is a top view, (D) is a bottom view, (e) is a side view, and (f) is a sectional view. 本発明の実施の形態に係る湿度検出センサパッケージの封止前の状態を示す図であり、（ａ）は斜視図であり、（ｂ）は平面図である。It is a figure which shows the state before sealing of the humidity detection sensor package which concerns on embodiment of this invention, (a) is a perspective view, (b) is a top view. 本発明の実施の形態に係る湿度検出センサパッケージの封止前の状態を示す図であり、（ａ）は斜視図であり、（ｂ）は平面図である。It is a figure which shows the state before sealing of the humidity detection sensor package which concerns on embodiment of this invention, (a) is a perspective view, (b) is a top view. 本発明の実施の形態に係る湿度検出センサパッケージを示す図であり、（ａ）は等角投影図であり、（ｂ）は平面図であり、（ｃ），（ｄ）は側面図である。It is a figure which shows the humidity detection sensor package which concerns on embodiment of this invention, (a) is an isometric view, (b) is a top view, (c), (d) is a side view. . （ａ）〜（ｃ）は、本発明の実施の形態に係る湿度検出センサパッケージにおける仕切り部材と湿度検出穴の形状を示す図である。(A)-(c) is a figure which shows the shape of the partition member and humidity detection hole in the humidity detection sensor package which concerns on embodiment of this invention. （ａ）〜（ｄ）は、本発明の実施の形態に係る湿度検出センサパッケージの製造方法を説明するための図である。(A)-(d) is a figure for demonstrating the manufacturing method of the humidity detection sensor package which concerns on embodiment of this invention. （ａ）〜（ｈ）は、本発明の実施の形態に係る湿度検出センサパッケージの仕切り部の形状と湿度検出穴の形状を示す図である。(A)-(h) is a figure which shows the shape of the partition part of the humidity detection sensor package which concerns on embodiment of this invention, and the shape of a humidity detection hole. （ａ）〜（ｆ）は、本発明の実施の形態に係る湿度検出センサパッケージの製造方法を説明するための図である。(A)-(f) is a figure for demonstrating the manufacturing method of the humidity detection sensor package which concerns on embodiment of this invention. 本発明の実施の形態に係る湿度検出センサパッケージにおける温度と温度特性の変化率との間の関係を示す図である。It is a figure which shows the relationship between the temperature and the change rate of a temperature characteristic in the humidity detection sensor package which concerns on embodiment of this invention.

以下、本発明の実施の形態について、添付図面を参照して詳細に説明する。
図１は、本発明の実施の形態に係る湿度検出センサパッケージを示す図であり、（ａ）は等角投影図であり、（ｂ）は底面等角投影図であり、（ｃ）は平面図であり、（ｄ）は底面図であり、（ｅ）は側面図であり、（ｆ）は断面図である。Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a view showing a humidity detection sensor package according to an embodiment of the present invention, in which (a) is an isometric view, (b) is a bottom isometric view, and (c) is a plan view. It is a figure, (d) is a bottom view, (e) is a side view, (f) is sectional drawing.

この湿度検出センサパッケージは、図１（ａ），（ｃ），（ｆ）に示すように、パッケージ基板１の一方の主面上に電子部品である湿度検出センサ６が実装され、その湿度検出センサ６が封止樹脂２で封止されてなるものである。湿度検出センサ６は、湿度を検出するために、感湿領域が外界に露出している必要がある。このため、封止樹脂２で湿度検出センサ６を封止する際に、湿度検出センサ６の感湿領域を外界に露出させるために、封止樹脂２の封止領域と感湿領域とを仕切る仕切り部材３を予め設ける。すなわち、湿度検出センサパッケージにおいては、封止樹脂２の封止領域と感湿領域とを仕切る仕切り部材３を予め設けておき、封止樹脂２で湿度検出センサ６を封止することにより、湿度検出センサ６の感湿領域を外界に露出した状態（湿度検出穴４を設けた状態）で湿度検出センサ６を封止することができる。   In this humidity detection sensor package, as shown in FIGS. 1A, 1C, and 1F, a humidity detection sensor 6 as an electronic component is mounted on one main surface of the package substrate 1, and the humidity detection is performed. The sensor 6 is sealed with the sealing resin 2. In order to detect humidity, the humidity detection sensor 6 needs to expose the moisture sensitive area to the outside. For this reason, when the humidity detection sensor 6 is sealed with the sealing resin 2, the sealing region of the sealing resin 2 is separated from the moisture sensitive region in order to expose the humidity sensitive region of the humidity detection sensor 6 to the outside. The partition member 3 is provided in advance. That is, in the humidity detection sensor package, the partition member 3 that partitions the sealing region of the sealing resin 2 from the moisture sensitive region is provided in advance, and the humidity detection sensor 6 is sealed with the sealing resin 2 to thereby reduce the humidity. The humidity detection sensor 6 can be sealed in a state where the humidity sensitive area of the detection sensor 6 is exposed to the outside (a state in which the humidity detection hole 4 is provided).

湿度検出センサパッケージは、図１（ｆ）に示すように、湿度検出センサ６上に仕切り部材３が設けられている。具体的には、湿度検出センサ６上に感光性接着剤（図示せず）などにより仕切り部材３が接合されている。なお、本発明においては、湿度検出センサ６の基台の材質と仕切り部材３の材質とが同じであるので、例えば、基台の材質と仕切り部材３とがシリコンで構成されている場合においては、前記基台と仕切り部材３とが共晶接合で接合されても良い。   In the humidity detection sensor package, as shown in FIG. 1 (f), a partition member 3 is provided on the humidity detection sensor 6. Specifically, the partition member 3 is joined to the humidity detection sensor 6 by a photosensitive adhesive (not shown) or the like. In the present invention, since the material of the base of the humidity detection sensor 6 and the material of the partition member 3 are the same, for example, in the case where the material of the base and the partition member 3 are made of silicon. The base and the partition member 3 may be joined by eutectic bonding.

パッケージ基板１としては、ガラスエポキシ基板などを用いることができる。パッケージ基板１は、図１（ａ），（ｂ），（ｅ），（ｆ）に示すように、コア材１２と、コア材１２の両主面に設けられた絶縁層１１，１３とから構成されている。絶縁層１１，１３を構成する材料としては、絶縁性レジストなどを挙げることができる。絶縁層（センサ実装面と反対側の面の絶縁層）１１には、湿度検出センサパッケージを回路基板（図示せず）に実装するための電極部５を露出するための開口部が設けられている。この電極部５と回路基板の電極部とを電気的に接続することにより、回路基板上に湿度検出センサパッケージを実装することができる。   As the package substrate 1, a glass epoxy substrate or the like can be used. As shown in FIGS. 1A, 1 </ b> B, 1 </ b> E, and 1 </ b> F, the package substrate 1 includes a core material 12 and insulating layers 11 and 13 provided on both main surfaces of the core material 12. It is configured. Examples of the material constituting the insulating layers 11 and 13 include an insulating resist. The insulating layer (insulating layer on the surface opposite to the sensor mounting surface) 11 is provided with an opening for exposing the electrode portion 5 for mounting the humidity detection sensor package on a circuit board (not shown). Yes. By electrically connecting the electrode part 5 and the electrode part of the circuit board, the humidity detection sensor package can be mounted on the circuit board.

封止樹脂２は、湿度検出センサ６の外部接続部を少なくとも封止する。封止樹脂２としては、ＳｉＯ２フィラー含有のエポキシ樹脂などを用いることができる。封止樹脂２による封止は、例えば、トランスファー成型により行う。また、仕切り部材３の材料は、後述する湿度検出センサ６の基台の材料と同じであり、シリコンなどを挙げることができる。The sealing resin 2 seals at least the external connection portion of the humidity detection sensor 6. As the sealing resin 2, an epoxy resin containing SiO 2 filler or the like can be used. Sealing with the sealing resin 2 is performed by transfer molding, for example. Moreover, the material of the partition member 3 is the same as the material of the base of the humidity detection sensor 6 to be described later, and examples thereof include silicon.

ここで、湿度検出センサパッケージについて、図２（ａ），（ｂ）を用いてさらに詳細に説明する。湿度検出センサパッケージの湿度検出センサ６は、吸収又は放出した水分量に応じて誘電率が変化する高分子感湿材料を誘電体とした高分子膜湿度センサである。この湿度検出センサ６は、パッケージ基板１上にダイボンド材９によりダイボンドされている。パッケージ基板１上には、図２（ａ），（ｂ）に示すように、湿度検出センサ６のセンサ素子を制御するＩＣ７がダイボンド材９によりダイボンドされている。   Here, the humidity detection sensor package will be described in more detail with reference to FIGS. The humidity detection sensor 6 of the humidity detection sensor package is a polymer film humidity sensor that uses a polymer moisture-sensitive material whose dielectric constant changes according to the amount of absorbed or released moisture as a dielectric. This humidity detection sensor 6 is die-bonded on the package substrate 1 with a die-bonding material 9. On the package substrate 1, as shown in FIGS. 2A and 2B, an IC 7 that controls the sensor element of the humidity detection sensor 6 is die-bonded by a die-bonding material 9.

パッケージ基板１の絶縁層（センサ実装面の絶縁層）１３には、電極パッド１０を露出するための開口部が設けられている。この電極パッド１０と湿度検出センサ６やＩＣ７の電極パッド１４とを電気的に接続することにより、パッケージ基板１と湿度検出センサ６やＩＣ７とを電気的に接続することができる。パッケージ基板１の電極パッド１０と湿度検出センサ６やＩＣ７の電極パッド１４とは、外部接続部であるワイヤ８により電気的に接続されている（ワイヤボンディング）。また、湿度検出センサ６の電極パッド１４とＩＣ７の電極パッド１４とも、ワイヤ８により電気的に接続されている（ワイヤボンディング）。   The insulating layer (insulating layer on the sensor mounting surface) 13 of the package substrate 1 is provided with an opening for exposing the electrode pad 10. By electrically connecting the electrode pad 10 and the humidity detection sensor 6 or the electrode pad 14 of the IC 7, the package substrate 1 and the humidity detection sensor 6 or the IC 7 can be electrically connected. The electrode pad 10 of the package substrate 1 and the electrode pad 14 of the humidity detection sensor 6 or IC 7 are electrically connected by a wire 8 which is an external connection part (wire bonding). Further, the electrode pad 14 of the humidity detection sensor 6 and the electrode pad 14 of the IC 7 are also electrically connected by a wire 8 (wire bonding).

本実施の形態においては、湿度検出センサ６は容量型湿度センサである。容量型湿度センサは、基台上にセンサ素子が搭載されており、湿度によって静電容量Ｃｓが変化するセンシング部と、湿度によらず一定の静電容量Ｃｒを保持する基準部と、を有する。これらのセンシング部及び基準部は、下部電極膜、高分子感湿膜及び上部電極膜からなる平行平板構造を有している。下部電極膜、高分子感湿膜及び上部電極膜は、基台上に下部電極膜から順に積層形成されていて、ほぼ同一の平面視円形状をなしている。下部電極膜及び上部電極膜は、例えばＡｌなどの電極材料で構成されており、各々の膜厚は均一である。高分子感湿膜は、ポリイミドなどで構成されており、均一の膜厚で形成されている。下部電極膜と上部電極膜との間の間隔ｄは高分子感湿膜の膜厚に等しく、下部電極膜と上部電極膜との間に蓄積される静電容量Ｃは、高分子感湿膜の誘電率ε、下部電極膜と上部電極膜との間の間隔ｄと対向面積Ｓで決定される（Ｃ＝εＳ／ｄ）。   In the present embodiment, the humidity detection sensor 6 is a capacitive humidity sensor. The capacitive humidity sensor includes a sensor element mounted on a base, and includes a sensing unit in which the capacitance Cs changes depending on humidity, and a reference unit that holds a constant capacitance Cr regardless of humidity. . The sensing unit and the reference unit have a parallel plate structure including a lower electrode film, a polymer moisture sensitive film, and an upper electrode film. The lower electrode film, the polymer moisture sensitive film, and the upper electrode film are laminated on the base in order from the lower electrode film, and have substantially the same circular shape in plan view. The lower electrode film and the upper electrode film are made of, for example, an electrode material such as Al, and each film thickness is uniform. The polymer moisture sensitive film is made of polyimide or the like and is formed with a uniform film thickness. The distance d between the lower electrode film and the upper electrode film is equal to the film thickness of the polymer moisture sensitive film, and the capacitance C accumulated between the lower electrode film and the upper electrode film is equal to the polymer moisture sensitive film. Is determined by the dielectric constant ε, the distance d between the lower electrode film and the upper electrode film, and the facing area S (C = εS / d).

基準部では、雰囲気との水分授受を遮断する非透湿保護膜が上部電極膜上に形成されており、この非透過保護膜によって上部電極膜全体が覆われている。非透湿保護膜は、例えば窒化シリコン膜（ＳｉＮｘ膜）やＡｌ２Ｏ３／ＳｉＯ２積層膜で構成されている。高分子感湿膜は、上部電極膜及び非透湿保護膜により覆われて雰囲気に曝されないので、雰囲気中の湿度（水分量）が変化しても該高分子感湿膜中の水分量は変化せず、誘電率εも変化しない。これにより、下部電極膜と上部電極膜の間には一定の静電容量（基準容量）Ｃｒが保持される。In the reference portion, a non-moisture permeable protective film that blocks moisture exchange with the atmosphere is formed on the upper electrode film, and the entire upper electrode film is covered with the non-permeable protective film. The non-moisture permeable protective film is composed of, for example, a silicon nitride film (SiNx film) or an Al 2 O 3 / SiO 2 laminated film. Since the polymer moisture-sensitive film is covered with the upper electrode film and the moisture-impermeable protective film and is not exposed to the atmosphere, even if the humidity (moisture content) in the atmosphere changes, the moisture content in the polymer moisture-sensitive film is It does not change and the dielectric constant ε does not change. Thereby, a certain electrostatic capacitance (reference capacitance) Cr is held between the lower electrode film and the upper electrode film.

一方のセンシング部では、非透湿保護膜が部分的に上部電極膜を覆っている。高分子感湿膜は、非透湿保護膜が覆われていない部分を介して雰囲気に曝されるので、雰囲気中の湿度（水分量）に応じて吸収または放出する水分量が変化し、誘電率εが変化する。この結果、下部電極膜と上部電極膜間の静電容量Ｃｓは変化する。   In one sensing unit, the moisture-impermeable protective film partially covers the upper electrode film. Since the polymer moisture-sensitive film is exposed to the atmosphere through a portion that is not covered with the moisture-impermeable protective film, the amount of moisture absorbed or released changes depending on the humidity (moisture amount) in the atmosphere, and the dielectric The rate ε changes. As a result, the capacitance Cs between the lower electrode film and the upper electrode film changes.

ＩＣ７は、センシング部のセンサ素子と基準部のセンサ素子と電気的に接続されており、センシング部で求められた静電容量Ｃｓと基準部で求められた静電容量Ｃｒとの差分Ｃｓ−Ｃｒを電圧に変換して出力する。   The IC 7 is electrically connected to the sensor element of the sensing unit and the sensor element of the reference unit, and the difference Cs−Cr between the capacitance Cs obtained by the sensing unit and the capacitance Cr obtained by the reference unit. Is converted to voltage and output.

湿度検出センサ６の基台上には、仕切り部材３が設けられている。この仕切り部材３は、湿度検出穴４を有しており、この湿度検出穴４を介してセンシング部のセンサ素子を外界に露出させるようになっている。すなわち、仕切り部材３は、基準部のセンサ素子を覆い、センシング部のセンサ素子（感湿領域）を露出させる。これにより、センシング部のセンサ素子（感湿領域）を露出させることができると共に、それ以外の領域を封止することができる。このため、ワイヤ８の腐食や衝撃による破損を防止することができる。さらに、このような仕切り部材３を設けることにより、上述したように静電容量の差分に相当する電圧を取り出すことができる。   A partition member 3 is provided on the base of the humidity detection sensor 6. The partition member 3 has a humidity detection hole 4, and the sensor element of the sensing unit is exposed to the outside through the humidity detection hole 4. That is, the partition member 3 covers the sensor element of the reference part and exposes the sensor element (humidity sensitive area) of the sensing part. Thereby, while being able to expose the sensor element (humidity sensitive area | region) of a sensing part, other area | regions can be sealed. For this reason, the wire 8 can be prevented from being damaged due to corrosion or impact. Furthermore, by providing such a partition member 3, it is possible to take out a voltage corresponding to the difference in capacitance as described above.

湿度検出センサパッケージにおいては、上述したように、湿度検出センサ６の基台を構成する材料と仕切り部材３を構成する材料とが同じである。このため、どの使用温度においても湿度検出センサ６の基台と仕切り部材３とで同じ熱膨張を生じるので、熱歪みが生じない。その結果、温度特性のばらつきを小さくすることができる。なお、上述したように、湿度検出センサ６の基台と仕切り部材３とは、感光性接着剤による接合や、基台の材質と仕切り部材３とがシリコンで構成されている場合には、Ａｕ層などの封着部材を介した共晶接合やＳｉ−Ｓｉを直接接合する、例えば常温接合で接合される。   In the humidity detection sensor package, as described above, the material constituting the base of the humidity detection sensor 6 and the material constituting the partition member 3 are the same. For this reason, since the same thermal expansion occurs in the base of the humidity detection sensor 6 and the partition member 3 at any operating temperature, no thermal distortion occurs. As a result, variation in temperature characteristics can be reduced. As described above, the base of the humidity detection sensor 6 and the partition member 3 are bonded to each other by a photosensitive adhesive or when the base material and the partition member 3 are made of silicon. For example, eutectic bonding through a sealing member such as a layer or Si—Si is directly bonded, for example, at room temperature bonding.

また、湿度検出センサにおいては、図３（ａ），（ｂ）に示すような湿度検出穴４を有する仕切り部材３を設けても良い。この湿度検出穴４は、平面視において仕切り部材３の中央からずれた位置に設けられており、円形である。なお、図３（ａ），（ｂ）において、図２（ａ），（ｂ）と同じ部分については、図２（ａ），（ｂ）と同じ符号を付して、その詳細な説明は省略する。   Moreover, in a humidity detection sensor, you may provide the partition member 3 which has the humidity detection hole 4 as shown to Fig.3 (a), (b). The humidity detection hole 4 is provided at a position shifted from the center of the partition member 3 in plan view, and has a circular shape. 3 (a) and 3 (b), the same parts as those in FIGS. 2 (a) and 2 (b) are denoted by the same reference numerals as those in FIGS. 2 (a) and 2 (b). Omitted.

図３（ａ），（ｂ）に示す湿度検出センサを封止樹脂２で封止することにより、図４（ａ）〜（ｄ）に示すような湿度検出センサパッケージとなる。図４は、本発明の実施の形態に係る湿度検出センサパッケージを示す図であり、（ａ）は等角投影図であり、（ｂ）は平面図であり、（ｃ），（ｄ）は側面図である。   The humidity detection sensor package shown in FIGS. 4A to 4D is obtained by sealing the humidity detection sensor shown in FIGS. 3A and 3B with the sealing resin 2. FIG. 4 is a diagram showing a humidity detection sensor package according to an embodiment of the present invention, where (a) is an isometric view, (b) is a plan view, and (c) and (d) are It is a side view.

図４に示す湿度検出センサパッケージにおいては、図４（ｃ），（ｄ）に示すように、封止樹脂２の表面から仕切り部材３が突出している。このように仕切り部材３が封止樹脂２の表面よりも突出している場合においては、仕切り部材３の突出部３ａが他の部材と接触する可能性がある。このため、仕切り部材３は、図５（ａ），（ｂ）に示すように、平面視においてＲ部３ｂを有することが好ましい。なお、図５（ｂ）は、図５（ａ）におけるＸ部の拡大図である。ここで、Ｒ部３ｂは、図５（ａ）に示すように、平面視において略矩形状の仕切り部材３の角部に設けられていても良く、図５（ｃ）に示すように、平面視において仕切り部材３外形全体にわたって設けられていても良い。また、平面視において仕切り部材３の外形は、図５（ａ）に示すように、略矩形であっても良く、図５（ｃ）に示すように楕円形であっても良く、円形であっても良い。   In the humidity detection sensor package shown in FIG. 4, the partition member 3 protrudes from the surface of the sealing resin 2 as shown in FIGS. Thus, when the partition member 3 protrudes from the surface of the sealing resin 2, the protruding portion 3a of the partition member 3 may come into contact with another member. For this reason, it is preferable that the partition member 3 has the R part 3b in planar view, as shown to Fig.5 (a), (b). FIG. 5B is an enlarged view of a portion X in FIG. Here, as shown in FIG. 5A, the R portion 3b may be provided at a corner portion of the substantially rectangular partition member 3 in a plan view, and as shown in FIG. It may be provided over the entire outer shape of the partition member 3 in view. Further, the outer shape of the partition member 3 in plan view may be substantially rectangular as shown in FIG. 5A, may be elliptical as shown in FIG. 5C, and is circular. May be.

このように、仕切り部材３の突出部３ａにＲ部３ｂを設けることにより、突出部３ａが他の部材と接触した際のチッピングを防止することができる。このように仕切り部材３の突出部３ａにＲ部３ｂを設ける方法としては、例えば、図６（ａ）〜（ｄ）に示す方法がある。   As described above, by providing the R portion 3b on the protruding portion 3a of the partition member 3, chipping when the protruding portion 3a comes into contact with another member can be prevented. As a method of providing the R portion 3b in the protruding portion 3a of the partition member 3 as described above, for example, there are methods shown in FIGS.

図６（ａ）〜（ｄ）は、本発明の実施の形態に係る湿度検出センサパッケージの製造方法を説明するための図である。この方法においては、基台（基板）のみをダイシングラインに沿ってダイシングすることにより個々の湿度検出センサに分割する。   6A to 6D are views for explaining a method of manufacturing a humidity detection sensor package according to the embodiment of the present invention. In this method, only the base (substrate) is diced along a dicing line to be divided into individual humidity detection sensors.

まず、図６（ａ）に示すように、キャップ側になる基板３１にフォトリソグラフィ及びエッチング（例えば、deep ＲＩＥ）により、仕切り部材に対応する部分３１ａと湿度検出穴に対応する開口部３１ｂを設ける。   First, as shown in FIG. 6A, a portion 31a corresponding to the partition member and an opening 31b corresponding to the humidity detection hole are provided on the substrate 31 on the cap side by photolithography and etching (for example, deep RIE). .

次いで、図６（ｂ）に示すように、この基板３１の開口部３１ｂが露出している側を別の基板３２に接着する。これにより、基板３１は、接着層３３を介して別の基板３２に接着される。次いで、図６（ｃ）に示すように、基板３１を研削して開口部３１ｂを露出させて湿度検出穴４を形成する。次いで、図６（ｄ）に示すように、別の基板３２をフルダイシングしてチップ化する。   Next, as shown in FIG. 6B, the side of the substrate 31 where the opening 31 b is exposed is bonded to another substrate 32. Thereby, the substrate 31 is bonded to another substrate 32 via the adhesive layer 33. Next, as shown in FIG. 6C, the substrate 31 is ground to expose the opening 31b, and the humidity detection hole 4 is formed. Next, as shown in FIG. 6D, another substrate 32 is fully diced into chips.

図６に示す方法によれば、仕切り部材３及び湿度検出穴４をフォトリソグラフィでその形状を決定するので、平面視における仕切り部材３及び湿度検出穴４の形状を任意形状にすることができる。また、仕切り部材３及び湿度検出穴４をダイシングではなく、研削で形成するので、チッピングを低く抑えることができ、チッピングにより発生したパーティクルで感湿膜に影響を及ぼすことを防止できる。さらに、湿度検出穴４を研削で形成しているので、基板同士の接着領域近傍に凹部が形成されず、ダイシング時のスラッジたまりや、封止樹脂のボイドの発生を防ぐことができる。   According to the method shown in FIG. 6, since the shapes of the partition member 3 and the humidity detection hole 4 are determined by photolithography, the shapes of the partition member 3 and the humidity detection hole 4 in a plan view can be made arbitrary shapes. Further, since the partition member 3 and the humidity detection hole 4 are formed by grinding instead of dicing, chipping can be suppressed to a low level, and particles generated by chipping can be prevented from affecting the moisture sensitive film. Further, since the humidity detection hole 4 is formed by grinding, no recess is formed in the vicinity of the bonding region between the substrates, and sludge accumulation during dicing and voids in the sealing resin can be prevented.

図７（ａ）〜（ｈ）は、本発明の実施の形態に係る湿度検出センサパッケージの仕切り部の形状と湿度検出穴の形状を示す図である。基台における仕切り部材３の位置は、図７（ａ）に示すように基台の中央であっても良く、図７（ｂ），（ｃ）に示すように、基台の中央から外れた位置（いずれかの側部に近くなるような位置）であっても良い。また、仕切り部材３の平面視における形状は、図７（ａ）〜（ｃ）に示すように矩形であっても良く、図７（ｄ）に示すように円形であっても良く、楕円形であっても良く、図７（ｅ）に示すように多角形形状（図７（ｅ）では六角形形状）であっても良い。また、湿度検出穴４の平面視における形状は、図７（ａ）〜（ｅ）に示すように円形であっても良く、図７（ｆ）に示すように矩形であっても良く、図７（ｇ）に示すように多角形形状（図７（ｇ）では八角形形状）であっても良く、図７（ｈ）に示すように不定形形状であっても良い。   FIGS. 7A to 7H are views showing the shape of the partition portion and the shape of the humidity detection hole of the humidity detection sensor package according to the embodiment of the present invention. The position of the partition member 3 on the base may be the center of the base as shown in FIG. 7 (a), and deviated from the center of the base as shown in FIGS. 7 (b) and 7 (c). It may be a position (position close to either side). Further, the shape of the partition member 3 in plan view may be rectangular as shown in FIGS. 7A to 7C, may be circular as shown in FIG. 7D, or elliptical. It may be a polygonal shape (hexagonal shape in FIG. 7E) as shown in FIG. Further, the shape of the humidity detection hole 4 in a plan view may be circular as shown in FIGS. 7A to 7E, or may be rectangular as shown in FIG. 7 (g) may be a polygonal shape (an octagonal shape in FIG. 7 (g)), or may be an irregular shape as shown in FIG. 7 (h).

湿度検出センサ６は、仕切り部材３と同じ材質の基板の一方の主面に、感湿領域に対面する凹部を形成し、前記基台上に前記センサ素子を搭載し、前記凹部が前記感湿領域に対面するように、前記基板と前記基台とを接合し、前記基板の他方の主面を研削して前記感湿領域を外界に露出させる開口を形成して前記仕切り部材を設け、ダイシングラインに沿ってダイシングすることにより個々の湿度検出センサに分割することにより作製されることが望ましい。この方法によれば、多数個取りのウエハ状態で基板と基台とを接合してその後ダイシングしてチップ化するので、量産性が高い状態で湿度検出センサ６を作製することができる。このため、効率良く湿度検出センサパッケージを製造することができる。   The humidity detection sensor 6 is formed with a recess facing the moisture sensitive region on one main surface of the substrate made of the same material as that of the partition member 3, and the sensor element is mounted on the base, and the recess is the moisture sensitive sensor. Dicing is performed by joining the substrate and the base so as to face the region, grinding the other main surface of the substrate to form an opening that exposes the moisture sensitive region to the outside, and providing the partition member. It is desirable to produce by dividing into individual humidity detection sensors by dicing along a line. According to this method, since the substrate and the base are joined in a multi-piece wafer state and then diced into chips, the humidity detection sensor 6 can be manufactured with high mass productivity. For this reason, a humidity detection sensor package can be manufactured efficiently.

図８（ａ）〜（ｆ）は、本発明の実施の形態に係る湿度検出センサパッケージの製造方法を説明するための図である。この方法においては、基台（基板）と仕切り部材３とをダイシングラインに沿ってダイシングすることにより個々の湿度検出センサに分割する。   8A to 8F are views for explaining a method for manufacturing a humidity detection sensor package according to the embodiment of the present invention. In this method, the base (substrate) and the partition member 3 are divided into individual humidity detection sensors by dicing along a dicing line.

まず、図８（ａ）に示すように、仕切り部材３となる基板２０の一方の主面にレジスト層２１を形成する。このとき、基板２０を構成する材料は、湿度検出センサ６の基台を構成する材料と同じである。ここでは、基板２０としてシリコン基板を用いる。そして、感湿領域に対面する凹部となる領域に対応する領域に開口部２１ａが形成されるようにレジスト層２１をパターニングする。   First, as shown in FIG. 8A, a resist layer 21 is formed on one main surface of the substrate 20 to be the partition member 3. At this time, the material constituting the substrate 20 is the same as the material constituting the base of the humidity detection sensor 6. Here, a silicon substrate is used as the substrate 20. Then, the resist layer 21 is patterned so that the opening 21a is formed in a region corresponding to a region that becomes a recess facing the moisture sensitive region.

次いで、図８（ｂ）に示すように、パターニング後のレジスト層２１をマスクとして基板２０をエッチング（例えば、deep ＲＩＥ）して、基板２０に感湿領域に対面する凹部２０ａを形成する。その後、図８（ｃ）に示すように、レジスト層２１を除去する。   Next, as shown in FIG. 8B, the substrate 20 is etched (for example, deep RIE) using the patterned resist layer 21 as a mask to form a recess 20 a facing the moisture sensitive region in the substrate 20. Thereafter, as shown in FIG. 8C, the resist layer 21 is removed.

一方、図８（ｄ）に示すように、湿度検出センサ６の基台６０上にセンサ素子６１，６２を形成する。センサ素子６１はセンシング部のセンサ素子であり、センサ素子６２は基準部のセンサ素子である。これらのセンサ素子６１，６２は、下部電極膜、高分子感湿膜及び上部電極膜を順次積層することにより形成する。下部電極膜及び上部電極膜は、例えば、スパッタリングなどの方法で成膜し、その後パターニングすることにより形成し、高分子感湿膜は所定のパターンにポリイミドを塗布し乾燥することにより形成する。次いで、基台６０においてセンサ素子６１，６２以外の領域に部分的に感光性接着剤２２を塗布する。なお、ここでは、基台６０を構成する材料をシリコンとする。   On the other hand, as shown in FIG. 8D, sensor elements 61 and 62 are formed on the base 60 of the humidity detection sensor 6. The sensor element 61 is a sensor element of the sensing unit, and the sensor element 62 is a sensor element of the reference unit. These sensor elements 61 and 62 are formed by sequentially laminating a lower electrode film, a polymer moisture sensitive film, and an upper electrode film. The lower electrode film and the upper electrode film are formed by, for example, sputtering or the like, and then patterned, and the polymer moisture sensitive film is formed by applying polyimide in a predetermined pattern and drying. Next, the photosensitive adhesive 22 is partially applied to a region other than the sensor elements 61 and 62 on the base 60. Here, the material constituting the base 60 is silicon.

次いで、図８（ｅ）に示すように、基板２０の凹部２０ａが感湿領域（センサ素子６１）に対面するように、基板２０と基台６０とをウエハ状態で接合する。このとき、感光性接着剤に光を照射して硬化させることにより、基板２０と基台６０とを接合する。次いで、図８（ｆ）に示すように、基板の他方の主面（凹部が設けられている面と反対側の主面）を研削して感湿領域（センサ素子６１）を外界に露出させる開口（湿度検出穴４）を形成して仕切り部材３を設ける。   Next, as shown in FIG. 8E, the substrate 20 and the base 60 are bonded in a wafer state so that the recess 20a of the substrate 20 faces the moisture sensitive region (sensor element 61). At this time, the substrate 20 and the base 60 are joined by irradiating the photosensitive adhesive with light to cure. Next, as shown in FIG. 8F, the other main surface of the substrate (the main surface opposite to the surface provided with the recesses) is ground to expose the moisture sensitive region (sensor element 61) to the outside. An opening (humidity detection hole 4) is formed and the partition member 3 is provided.

湿度検出センサにおいては、感湿部分を大気中雰囲気に露出することが必須となる。しかしながら、感湿部分が水につかり結露状態にならないようにする必要がある。そこで、仕切り部材３（特に、湿度検出穴４の近傍）にフッ素系の薄膜を形成することが好ましい。これにより、湿度検出穴４にかかる水を撥水させ、感湿領域の結露を防止することができる。ここで、フッ素系の薄膜を形成する場合においては、フッ素系ガス（例えば、ＣＦ４ガス、Ｃ４Ｆ８ガス、ＣＨＦ３ガスなど）を用いる。また、薄膜の厚さは、１０ｎｍ程度であることが好ましい。このような方法によれば、ウエハ処理工程で撥水処理を一括処理することができるので、安価で均質な撥水処理を仕切り部材３に施すことができる。また、仕切り部材３に湿度検出穴４を複数設けて湿度検出穴４を細分化することにより、湿度検出穴４に浸入する水をより効果的に撥水させることができる。In the humidity detection sensor, it is essential to expose the moisture-sensitive part to the atmosphere in the air. However, it is necessary to prevent the moisture-sensitive portion from getting into water and causing condensation. Therefore, it is preferable to form a fluorine-based thin film on the partition member 3 (particularly in the vicinity of the humidity detection hole 4). Thereby, the water applied to the humidity detection hole 4 can be made water repellent, and condensation in the moisture sensitive area can be prevented. Here, in the case of forming a fluorine-based thin film, a fluorine-based gas (for example, CF 4 gas, C 4 F 8 gas, CHF 3 gas, etc.) is used. The thickness of the thin film is preferably about 10 nm. According to such a method, the water repellent treatment can be collectively performed in the wafer processing step, so that the inexpensive and uniform water repellent treatment can be applied to the partition member 3. In addition, by providing a plurality of humidity detection holes 4 in the partition member 3 and subdividing the humidity detection holes 4, the water that enters the humidity detection holes 4 can be made to repel water more effectively.

その後、ダイシングライン（破線）に沿ってダイシングすることにより個々の湿度検出センサ６に分割する。   Then, it divides | segments into each humidity detection sensor 6 by dicing along a dicing line (dashed line).

このようにして作製された湿度検出センサ６（図６又は図８に示す方法で作製された湿度検出センサ６）は、パッケージ基板１上にダイボンド材９でダイボンドされる。また、パッケージ基板１上にはダイボンド材９でＩＣ７もダイボンドされる。その後、パッケージ基板１の電極パッド１０と湿度検出センサ６やＩＣ７の電極パッド１４とをワイヤボンディングして電気的に接続する。そして、トランスファー成型により封止樹脂２で封止して図１に示すような湿度検出センサパッケージを得る。最後に、パッケージ基板１を、ダイシングラインに沿ってダイシングしてチップ状の湿度検出センサパッケージを得る。   The humidity detection sensor 6 manufactured in this way (humidity detection sensor 6 manufactured by the method shown in FIG. 6 or FIG. 8) is die-bonded on the package substrate 1 with a die bond material 9. The IC 7 is also die-bonded on the package substrate 1 with a die-bonding material 9. Thereafter, the electrode pads 10 of the package substrate 1 and the electrode pads 14 of the humidity detection sensor 6 and the IC 7 are electrically connected by wire bonding. And it seals with the sealing resin 2 by transfer molding, and a humidity detection sensor package as shown in FIG. 1 is obtained. Finally, the package substrate 1 is diced along a dicing line to obtain a chip-like humidity detection sensor package.

このようにして得られた湿度検出センサパッケージは、湿度検出センサ６の基台６０と湿度検出センサパッケージの仕切り部材３とが同じ材質で構成されているので、どの使用温度においても熱歪みが生じず温度特性のばらつきを小さくすることができる。   In the humidity detection sensor package thus obtained, the base 60 of the humidity detection sensor 6 and the partition member 3 of the humidity detection sensor package are made of the same material, so that thermal distortion occurs at any operating temperature. Therefore, variation in temperature characteristics can be reduced.

次に、本発明の効果を明確にするために行った実施例について説明する。
基台を構成する材料をシリコンとし、仕切り部材を構成する材料をシリコンとして、上述した方法により図１に示す湿度検出センサパッケージ（実施例１）を作製した。また、比較のために、基台を構成する材料をシリコンとし、仕切り部材を構成する材料をＰＰＳ（ポリフェニルスルフィド）として、上述した方法により図１に示す湿度検出センサパッケージ（比較例１）及び基台を構成する材料をシリコンとし、仕切り部材を構成する材料を金として、上述した方法により図１に示す湿度検出センサパッケージ（比較例２）を作製した。Next, examples performed for clarifying the effects of the present invention will be described.
A humidity detection sensor package (Example 1) shown in FIG. 1 was produced by the above-described method using silicon as the material constituting the base and silicon as the material constituting the partition member. For comparison, the material constituting the base is made of silicon and the material constituting the partition member is made of PPS (polyphenyl sulfide), and the humidity detection sensor package (Comparative Example 1) shown in FIG. The humidity detection sensor package (Comparative Example 2) shown in FIG. 1 was produced by the above-described method using silicon as the material constituting the base and gold as the material constituting the partition member.

このようにして作製された実施例１、比較例１及び比較例２の湿度検出センサパッケージについて、−１０℃から７５℃まで温度を変えたときの同一湿度における湿度検出センサのセンサ出力の温度特性ばらつき（変化率）をシミュレーションにより求めた。その結果を図９に示す。なお、センサ出力のばらつきは、湿度検出センサパッケージの２５℃時の熱歪みを零変化とし、２５℃の出力でそれぞれの温度での出力を規格化することにより以下の式により求めた。
温度特性ばらつき（ｐｐｍ）＝｛Ｖ（ｔ℃）−Ｖ（２５℃）｝／Ｖ（２５℃）×１０６
Ｖ（ｔ℃）：任意の温度での出力、Ｖ（２５℃）：２５℃での出力Regarding the humidity detection sensor packages of Example 1, Comparative Example 1 and Comparative Example 2 manufactured as described above, the temperature characteristics of the sensor output of the humidity detection sensor at the same humidity when the temperature is changed from −10 ° C. to 75 ° C. Variation (rate of change) was determined by simulation. The result is shown in FIG. The variation in the sensor output was obtained by the following equation by setting the thermal strain at 25 ° C. of the humidity detection sensor package to zero and normalizing the output at each temperature with the output of 25 ° C.
Temperature characteristic variation (ppm) = {V (t ° C.) − V (25 ° C.)} / V (25 ° C.) × 10 6
V (t ° C): Output at an arbitrary temperature, V (25 ° C): Output at 25 ° C

図９から分かるように、実施例１の湿度検出センサパッケージでは、センサ出力のばらつきが約１００ｐｐｍに抑えられていたが、比較例１の湿度検出センサパッケージでは、センサ出力のばらつきが約４００ｐｐｍであり、比較例２の湿度検出センサパッケージでは、センサ出力のばらつきが約５００ｐｐｍであった。このように、実施例１の湿度検出センサパッケージのセンサ出力のばらつきが小さかったのは、基台及び仕切り部材を構成する材料が同じで、熱歪みがなかったためであると考えられる。   As can be seen from FIG. 9, in the humidity detection sensor package of Example 1, the variation in sensor output was suppressed to about 100 ppm, but in the humidity detection sensor package of Comparative Example 1, the variation in sensor output was about 400 ppm. In the humidity detection sensor package of Comparative Example 2, the sensor output variation was about 500 ppm. As described above, the reason why the variation in the sensor output of the humidity detection sensor package of Example 1 was small was considered to be that the materials constituting the base and the partition member were the same and there was no thermal distortion.

本発明は上記実施の形態に限定されず、適宜変更して実施することができる。上記実施の形態における材料、各層の配置位置、厚さ、大きさ、製法などは適宜変更して実施することが可能である。その他、本発明は、本発明の範囲を逸脱しないで適宜変更して実施することができる。   The present invention is not limited to the above embodiment, and can be implemented with appropriate modifications. The material, the arrangement position of each layer, the thickness, the size, the manufacturing method, and the like in the above embodiment can be changed as appropriate. In addition, the present invention can be implemented with appropriate modifications without departing from the scope of the present invention.

本出願は、２００９年６月１日出願の特願２００９−１３２０１５に基づく。この内容は全てここに含めておく。   This application is based on Japanese Patent Application No. 2009-13320 filed on June 1, 2009. All this content is included here.

Claims (5)

パッケージ基板の一方の主面側に湿度検出センサを実装する工程と、前記湿度検出センサの外部接続部分を少なくとも封止樹脂により封止する工程と、を具備する湿度検出センサパッケージの製造方法であって、前記湿度検出センサは、感湿領域を備えると共に、前記感湿領域が外界に露出するように前記封止樹脂の封止領域と前記感湿領域とを仕切る仕切り部材を有しており、前記湿度検出センサは、前記仕切り部材と同じ材質の基板の一方の主面に、前記感湿領域に対面する凹部を形成する工程と、基台上にセンサ素子を搭載する工程と、前記凹部が前記感湿領域に対面するように、前記基板と前記基台とを接合する工程と、前記基板の他方の主面を研削して前記感湿領域を外界に露出させる開口を形成して前記仕切り部材を設ける工程と、ダイシングラインに沿ってダイシングすることにより個々の湿度検出センサに分割する工程と、により作製されることを特徴とする湿度検出センサパッケージの製造方法。 A method of manufacturing a humidity detection sensor package comprising: mounting a humidity detection sensor on one main surface side of the package substrate; and sealing an external connection portion of the humidity detection sensor with at least a sealing resin. The humidity detection sensor includes a moisture sensitive region and a partition member that partitions the sealing region of the sealing resin and the moisture sensitive region so that the moisture sensitive region is exposed to the outside. the humidity detection sensor, on one main surface of the substrate of the same material as the partition member, forming a recess facing said moisture sensitive area, a step of mounting the sensor element on the base, said recess Bonding the substrate and the base so that the substrate faces the moisture sensitive region, and forming an opening that exposes the moisture sensitive region to the outside by grinding the other main surface of the substrate. Step of providing a partition member The method of the humidity detection sensor package, characterized in that it is produced a step of dividing into individual humidity detection sensor by dicing along the dicing line, by. 前記基台のみをダイシングラインに沿ってダイシングすることにより個々の湿度検出センサに分割することを特徴とする請求項１記載の湿度検出センサパッケージの製造方法。 Method for producing a humidity detection sensor package according to claim 1, wherein the dividing into individual humidity detection sensor by dicing along only the base dicing lines. 前記基台と前記仕切り部材とをダイシングラインに沿ってダイシングすることにより個々の湿度検出センサに分割することを特徴とする請求項１記載の湿度検出センサパッケージの製造方法。 Method for producing a humidity detection sensor package according to claim 1, wherein the dividing into individual humidity detection sensor by dicing along said partition member and the base to the dicing line. 前記凹部がフォトリソグラフィ及びエッチングで形成されることを特徴とする請求項１から請求項３のいずれかに記載の湿度検出センサパッケージの製造方法。 The method for manufacturing a humidity detection sensor package according to any one of claims 1 to 3, wherein the recess is formed by photolithography and etching. 前記仕切り部材に、フッ素系ガスの被着により薄膜を形成することを特徴とする請求項１から請求項４のいずれかに記載の湿度検出センサパッケージの製造方法。 The method for manufacturing a humidity detection sensor package according to any one of claims 1 to 4, wherein a thin film is formed on the partition member by depositing a fluorine-based gas.
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