JP5243883B2 - Light emitting device and lighting apparatus - Google Patents

Description

The present invention relates to a light-emitting equipment and lighting equipment provided therewith utilizing an LED chip (light-emitting diode chip).

  Conventionally, light emission in which a desired mixed color light (for example, white light) is obtained by combining an LED chip and a phosphor that emits light of a light emission color different from that of the LED chip when excited by light emitted from the LED chip. Research and development of the apparatus is performed in various places (for example, refer to Patent Document 1). In this type of light emitting device, for example, a blue LED chip that emits blue light is used as the LED chip, and a yellow phosphor is used as the phosphor, whereby white light can be obtained.

  Incidentally, as shown in FIG. 11, the above-mentioned Patent Document 1 includes an LED chip 1 ′, a mounting substrate 2 ′ made of a ceramic substrate on which the LED chip 1 ′ is mounted on one surface side, and a translucent sealing. Excited by light emitted from LED chip 1 ′ and hemispherical sealing portion 3 ′ formed of a material (for example, silicone resin) and sealing LED chip 1 ′ on the one surface side of mounting substrate 2 ′ The above-mentioned mounting substrate 2 ′ is formed of a translucent material (for example, silicone resin) containing a phosphor that emits light of a different emission color from the LED chip 1 ′ and surrounds the sealing portion 3 ′. A light emitting device A ′ including a dome-shaped color conversion member 4 ′ disposed on one surface side is described. Here, the inner surface of the color conversion member 4 ′ is formed in a hemispherical shape.

  Further, as an example of a lighting fixture in which the light emitting device A ′ shown in FIG. 11 is incorporated as a light source, a configuration shown in FIG. 12A is considered (not related to known literature).

  Here, the lighting fixture shown in FIG. 12A includes the above-described light emitting device A ′, a bottomed cylindrical fixture main body 9 in which the light emitting device A ′ is accommodated, and the light emitting device accommodated in the fixture main body 9. A hybrid lens 6 for controlling the light distribution of the light emitted from A ′, and a groove portion 9 b formed on the opening edge of the instrument body 9 with an outer flange portion 6 d extending outward from the outer surface of the hybrid lens 6. An annular holding frame 10 is provided between the bottom surface and the bottom surface.

  In the hybrid lens 6 described above, as shown in FIG. 12B, the inner bottom surface 61a and the inner side surface 61b of the recess 61 formed on the light emitting device A ′ side constitute a light incident surface 6a. The function of refracting light incident on the inner bottom surface 61a of the recess 61 from the focal point F on the incident surface 6a side and further refracting it on the light exit surface 6b, and the inner surface 61b of the recess 61 from the focal point F on the light incident surface 6a side. Refracted light after being refracted and then totally reflected by the outer surface 6c and further refracted by the light exit surface 6b, and is emitted from the focal point F as indicated by an arrow in FIG. 12B. Light incident on the incident surface 6a is emitted from the light emitting surface 6b. In the hybrid lens 6, the outer surface 6c is formed in a paraboloid shape and the light emitting surface 6a is formed in a convex curved surface, but the outer surface 6c is an LED chip in the optical axis direction of the LED chip 1 ′. As long as it is away from 1 ′, the outer shape gradually increases in shape, and any shape that can totally reflect the light incident from the inner side surface 61b of the recess 61 toward the light emitting surface 6a side is acceptable, and the light emitting surface 6a is planar. However, it may be a Fresnel lens shape.

In addition, as a lighting fixture incorporating the above-described light emitting device A ′ as a light source, not only the example of FIG. 12A, but also as a light distribution control member for controlling the light distribution of light emitted from the light emitting device A ′, Instead of the hybrid lens 6, a reflecting mirror whose inner surface shape is designed so as to reflect light emitted from the outer surface of the color conversion member 4 ′ and obtain a narrow-angle light distribution (for example, the inner surface is a dome) It is also conceivable to use a reflecting mirror formed in a parabolic shape with the apex of the color conversion member 4 in the form of a focus as the focal point. In the light emitting device A ′ shown in FIG. 11, one LED chip 1 ′ is mounted on the one surface side of the mounting substrate 2 ′. A device in which a plurality of LED chips 1 'are mounted on one surface side is also disclosed.
JP 2007-35951 A

By the way, when the LED chip 1 ′ is an LED chip whose radiation angle dependency of the emitted light intensity can be approximated by a Lambertian distribution (that is, an LED chip having a uniform diffusion light distribution characteristic), the LED chip 1 ′ It has a spherical light distribution characteristic B ′ as shown in FIG. 13, the emitted light intensity in the normal direction of the center point of the light extraction surface of the LED chip 1 ′ is I ₀ , the angle with respect to the normal direction is θ, and the angle If the emitted light intensity in the direction of _θ is I _θ , I _θ = I ₀ cos θ. On the other hand, the incident light intensity per unit area (hereinafter referred to as the incident density) on the inner surface of the dome-shaped color conversion member 4 ′ is substantially proportional to I _θ and between the LED chip 1 ′ and the color conversion member 4 ′. It is inversely proportional to the square of the distance to the inner surface.

  However, in the light emitting device A ′ having the configuration shown in FIG. 11, the inner surface of the color conversion member 4 ′ is formed in a hemispherical shape, and the incident density on the inner surface corresponds to the apex of the color conversion member 4 ′. Since the incident density tends to decrease as it approaches the lower end of the color conversion member 4 ′, the following problem arises.

  Since the luminance distribution on the outer surface of the color conversion member 4 ′ is a luminance distribution in which the luminance is maximum when the angle θ is 0 ° and decreases as the angle θ increases, the narrow angle of the hybrid lens 6 or the reflecting mirror described above is reduced. When incorporated in a lighting fixture having a light distribution control member that controls light distribution, the illuminance unevenness of the irradiation pattern on the irradiation surface becomes large (for example, the peripheral portion compared to the central portion of the circular irradiation pattern) Illuminance is reduced).

  In the above-described light emitting device A ′, not only the LED chip 1 ′ but also the phosphor dispersed in the color conversion member 4 ′ generates heat due to energy loss due to the Stokes shift at the time of lighting. The member 4 ′ is a color conversion member due to the distribution of the incident density on the inner surface of the color conversion member 4 ′ because the phosphor is dispersed using a translucent material having a low thermal conductivity such as silicone resin as a base material. The temperature distribution at 4 'increases. Here, the quantum efficiency (wavelength conversion efficiency) of the phosphor becomes higher as the temperature is lower. However, in the above-described light emitting device A ′, the temperature distribution of the color conversion member 4 ′ is large, so that the color conversion member 4 ′ as a whole is quantum. The efficiency is lowered, and the light extraction efficiency of the light emitting device A ′ as a whole is lowered.

  As a means for reducing the temperature of the color conversion member 4 ′, there is a means for increasing the size of the color conversion member 4 ′. However, the light emitting section constituted by the LED chip 1 ′ and the color conversion member 4 ′ becomes large, and illumination is performed. When incorporated in a fixture, the light distribution controllability of a light distribution control member such as a light distribution lens such as the hybrid lens 6 or a reflecting mirror is degraded.

The present invention has been made in view of the above circumstances, and its object is a light-emitting equipment and lighting equipment provided therewith thereby improving the outer surface equalized Hakare and light extraction efficiency of the luminance of the color conversion member It is to provide.

According to a first aspect of the present invention, there is provided an LED chip whose radiation angle dependency of the emitted light intensity can be approximated by a Lambertian distribution, a mounting substrate on which the LED chip is mounted on one surface side, and light emitted from the LED chip. A dome-shaped color conversion member formed of a translucent material containing a phosphor that emits light of a color different from the light emission color of the LED chip when excited by the surface of the mounting substrate. with the door, wherein the plurality of the LED chips around the light source and the assumptions Mr point consisting of the plurality of the LED chips of a virtual circle that includes all mounted on one surface in a surface of said mounting substrate The inner surface of the upper part of the color conversion member is a part of an ellipsoid whose center is the intersection of the optical axis of the color conversion member and the one surface of the mounting substrate, and whose major axis is the optical axis direction of the color conversion member. Consists of Long radius / short radius of the ellipse surface is characterized by a 1.2 to 1.3.

According to the present invention, before Symbol Hakare uniformity of the incident light intensity (incident density) per unit area of the inner surface of the color conversion member, the quantum efficiency of the phosphor of the uniform temperature distribution of the color converting member Since the improvement can be achieved, the luminance of the outer surface of the color conversion member can be made uniform and the light extraction efficiency can be improved.

Further, according to this invention, when the angle with respect to a direction along the thickness direction of the LED chip and θ at the point light source, or incident density becomes lower as angles θ increases, the angle θ becomes larger As the incident density increases, it can be prevented.

The invention of claim 2 is the invention of claim 1 , wherein the LED chip is a blue LED chip, the phosphor of the color conversion member is a yellow phosphor, and the translucent material is a silicone resin, When the surface area of the inner surface of the color conversion member is S [mm ² ] and the light output of the point light source when a prescribed input power is applied to the point light source is P [mW], the value of S / P is 0. The surface area S of the inner surface of the color conversion member is set so as not to be less than .2.

According to this invention, the temperature of the color conversion member can be set to 100 ° C. or less, the decrease in the quantum efficiency of the phosphor due to the temperature rise of the phosphor can be suppressed, and the light extraction efficiency can be improved.
The invention of claim 3 is characterized in that it comprises a light-emitting device of the mounting according to claim 1 or 2 SL.

  According to the first aspect of the invention, there is an effect that the luminance of the outer surface of the color conversion member can be made uniform and the light extraction efficiency can be improved.

(Embodiment 1)
As shown in FIG. 1A, the light emitting device A of the present embodiment includes an LED chip 1, a mounting substrate 2 on which the LED chip 1 is mounted on one surface side, and light emitted from the LED chip 1. The one surface side of the mounting substrate 2 that is formed of a light-transmitting material (for example, silicone resin) containing a phosphor that emits light of an emission color different from that of the LED chip 1 and that surrounds the LED chip 1. And a dome-shaped color conversion member 4 disposed on the surface.

  In the light emitting device A of the present embodiment, a GaN-based blue LED chip that emits blue light is used as the LED chip 1, and the phosphor of the color conversion member 4 is excited by the blue light emitted from the LED chip 1. And a yellow fluorescent material that emits a broad yellow light. The blue light emitted from the LED chip 1 and transmitted through the color conversion member 4 and the yellow phosphor emitted from the color conversion member 4 are emitted. Yellow light is emitted as a light distribution diffused from the outer surface of the color conversion member 4, and white light can be obtained.

  The mounting substrate 2 has a wiring pattern made of a metal material (for example, Cu) formed on one surface side of an insulating substrate made of a ceramic substrate (for example, an alumina ceramic substrate or an aluminum nitride substrate). The insulating substrate of the mounting substrate 2 is not limited to a ceramic substrate, and a glass epoxy resin substrate, a hollow substrate, or the like may be used, but a substrate formed of a heat conductive material such as a ceramic substrate is preferable. In the present embodiment, the outer peripheral shape of the mounting substrate 2 is circular, but is not limited to a circular shape, and may be a polygonal shape. In the present embodiment, the LED chip 1 is bonded to a die pad portion formed of a part of the wiring pattern of the mounting substrate 2 by using a bonding material having thermal conductivity such as solder or silver paste.

  Moreover, the color conversion member 4 uses the mixed material which disperse | distributed the particulate yellow fluorescent substance which is excited by the blue light radiated | emitted from the LED chip 1 in the translucent material which consists of silicone resin, and radiates | emits yellow light. It is formed in a dome shape. The translucent material used as the material of the color conversion member 4 is not limited to the silicone resin, and may be other transparent resin (transparent organic material) such as acrylic resin or polycarbonate resin, or transparent inorganic material such as glass. Alternatively, an organic / inorganic hybrid material in which an organic component and an inorganic component are mixed and combined at the nm level or molecular level may be employed. Further, the phosphor to be contained in the translucent material used as the material of the color conversion member 4 is not limited to the yellow phosphor, and a plurality of types of phosphors may be used for the purpose of improving color adjustment and color rendering. White light with high color rendering properties can be obtained by using a red phosphor and a green phosphor. Here, when a plurality of types of phosphors are used, the phosphor is not necessarily a combination of phosphors having different emission colors, and for example, a plurality of types of phosphors having an emission color of yellow and different emission spectra may be combined.

  By the way, in the light-emitting device A of this embodiment, the LED chip 1 uses an LED chip whose radiation angle dependency of the emitted light intensity can be approximated by a Lambertian distribution, and the LED chip 1 is as shown in FIG. It has a spherical light distribution characteristic B.

Therefore, similarly to the description of FIG. 13, the emitted light intensity in the normal direction of the center point of the light extraction surface of the LED chip 1 is I ₀ , the angle with respect to the normal direction is θ, and the emitted light intensity in the direction of the angle θ is If I _θ , I _θ = I ₀ cos θ, and the incident light intensity per unit area (hereinafter referred to as incident density) on the inner surface of the dome-shaped color conversion member 4 is approximately proportional to I _θ , and It is inversely proportional to the square of the distance between the LED chip 1 and the inner surface of the color conversion member 4.

On the other hand, in the light emitting device A of the present embodiment, assuming that the center of the virtual circle including the LED chip 1 on the one surface of the mounting substrate 2 is the point light source 10 made of the LED chip 1, FIG. ), The distance between the point light source 10 and the inner surface of the color conversion member 4 in the direction of the angle θ with respect to the direction along the thickness direction of the LED chip 1 is r, and the upper inner surface of the color conversion member 4 is I _θ. LED chip 1 is formed in a shape where r ² = constant, and the optical axis of the color conversion member 4 and the optical axis of the point light source 10 (in this embodiment, the optical axis of the LED chip 1) coincide. The color conversion member 4 is mounted on the one surface of the mounting substrate 2.

Here, when the distance between the point light source 10 and the inner surface of the color conversion member 4 in the direction of the angle θ is normalized as 1, the locus of the inner surface of the virtual color conversion member where I _θ · r ² = constant is shown in FIG. (B) is indicated by an alternate long and short dash line “B”, and the shape of the inner surface of the color conversion member 4 ′ when the color conversion member 4 ′ is hemispherical as in the conventional example shown in FIG. The shape of the inner surface of the color conversion member 4 of the present embodiment is indicated by a solid line “A” in FIG. Here, the inner surface of the color conversion member 4 in the present embodiment is centered on the intersection O1 (see FIG. 1A) between the optical axis of the color conversion member 4 and the one surface of the mounting substrate 2 (that is, the above point). The color conversion member 4 is a part of an elliptical surface with the optical axis direction of the color conversion member 4 as the major axis direction, and the curvature decreases with increasing distance from the center of the color conversion member 4. only the portion the height of the inner surface is 1 to 0.8 is in the _I θ · ^{r 2} = constant at 4.

According to the light emitting device A of the present embodiment described above, the center of the virtual circle that encloses one LED chip 1 mounted on the mounting substrate 2 on the one surface of the mounting substrate 2 is the one LED chip 1. And the point light source 10 in the direction of the angle θ with respect to the direction along the thickness direction of the LED chip 1 is assumed to be θ, and the emitted light intensity in the direction of the angle θ is I _θ . When the distance from the inner surface of the color conversion member 4 is r, the upper portion of the color conversion member 4 is formed in a shape where I _θ · r ² = constant, so that the incident density on the inner surface of the color conversion member 4 is Uniformity can be achieved and the quantum efficiency of the phosphor can be improved by making the temperature distribution of the color conversion member 4 uniform, so that the luminance of the outer surface of the color conversion member 4 can be made uniform and the light extraction efficiency can be improved. Since the emitted light intensity I _θ decreases as the angle θ approaches 90 °, the entire color conversion member 4 may have a shape where I _θ · r ² = constant. In this case, the color conversion member 4 is manufactured. Therefore, it is preferable that only the upper part of the color conversion member 4 has a constant I _θ · r ² = constant shape, and the inner surface of the color conversion member 4 is constituted by a part of the above-described elliptical surface. .

  Further, in the light emitting device A of the present embodiment, the luminance of the outer surface of the color conversion member 4 can be made uniform as described above, so that a light distribution lens such as the hybrid lens 6 (see FIG. 12), a reflecting mirror, and the like can be obtained. When incorporated in a lighting fixture having a light distribution control member that controls narrow-angle light distribution, the illuminance unevenness of the irradiation pattern on the irradiation surface can be reduced. Since the light distribution lens is formed of acrylic resin, polycarbonate resin, glass, or the like, the temperature of the color conversion member 4 when the light emitting device A is turned on is 100 ° C. from the viewpoint of being incorporated in a lighting fixture. The following is desirable.

  By the way, as described above, the inner surface of the color conversion member 4 is centered on the intersection O1 between the optical axis of the color conversion member 4 and the one surface of the mounting substrate 2, and the optical axis direction of the color conversion member 4 is the major axis direction. 3 and 4 show the results of simulating the relationship between the angle θ and the incident density when the major radius / minor radius value of the ellipsoid is changed variously. Shown in 3 and 4, the horizontal axis indicates the angle θ described above, and the vertical axis indicates the incident density on the inner surface of the color conversion member 4 in the direction of the angle θ. Further, regarding the parameters φ1, φ2, H1, H2, a, and b described in FIGS. 3 and 4, φ1 is the outer diameter of the color conversion member 4 in plan view, as shown in FIG. H1 is the height of the outer surface of the color conversion member 4, φ2 is the inner diameter of the color conversion member 4 in plan view, H2 is the height of the inner surface of the color conversion member 4, a is the major radius of the elliptical surface (a = H2), b is the short radius (b = φ2 / 2) of the elliptical surface.

  3 and 4, when the major radius / minor radius = a / b of the ellipsoid is 1.2 to 1.3, the incident density can be made uniform, and when a / b is 1.02. Thus, it can be seen that the incident density decreases as the angle θ increases, or that the incident density increases as the angle θ increases as in the case of a / b of 1.52 or 1.77. . Note that “a” in FIG. 1B indicates the shape of the inner surface of the color conversion member 4 when a / b = 1.27.

(Embodiment 2)
The basic configuration of the light emitting device A of the present embodiment is substantially the same as that of the first embodiment. As shown in FIG. 5, a sealing portion made of a translucent material that seals the LED chip 1 inside the color conversion member 4. 3 is different. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

  Although the sealing part 3 employs a silicone resin as the translucent material, it is not limited to the silicone resin, and may employ an epoxy resin, glass, or the like.

  Therefore, in the light emitting device A of the present embodiment, the LED chip 1 and the light extraction surface of the LED chip 1 are in contact with each other as compared with the case where the medium in the space between the LED chip 1 and the color conversion member 4 is air. Since the refractive index difference with the medium is reduced, the light extraction efficiency from the LED chip 1 is improved, and the refractive index difference between the color conversion member 4 and the medium in contact with the inner surface of the color conversion member 4 is reduced. Incidence efficiency to the color conversion member 4 is improved, and light extraction efficiency of the entire light emitting device A is improved.

(Embodiment 3)
The basic configuration of the light emitting device A of the present embodiment is substantially the same as that of the second embodiment. As shown in FIG. 6, the sealing portion 3 is a semi-elliptical whose major axis direction and minor axis direction are opposite to those of the color conversion member 4. It is formed in a spherical shape, has a function as a convex lens, and is different in that an air layer 5 is formed between the sealing portion 3 and the color conversion member 4. Here, the sealing part 3 is formed so that the optical axis coincides with the LED chip 1. In short, the sealing part 3 has a shape in which the minor axis direction of the sealing part 3 matches the major axis direction of the color conversion member 4 and the major axis direction of the sealing part 3 matches the minor axis direction of the color conversion member 4. It is formed with. Here, the light emitted from the LED chip 1 is refracted at the interface between the sealing portion 3 and the air layer 5, but the angle of refraction is small because the angle of incidence on the interface is small in the shape of the sealing portion 3. The light distribution of the light emitted from the sealing portion 3 is small and substantially the same as the light distribution of the light emitted from the LED chip 1. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 2, and description is abbreviate | omitted.

  The major radius of the sealing portion 3 is set to 1.41 times the radius of a virtual circle (here, circumscribed circle) that encloses the LED chip 1, but this numerical value is an example and is particularly limited. Not what you want. Further, the shape of the sealing portion 3 is not limited to a hemispherical shape, and may be a hemispherical shape, for example.

  In the light emitting device A of the present embodiment described above, since the air layer 5 is formed between the sealing portion 3 and the color conversion member 4, it is emitted from the LED chip 1 by the phosphor in the color conversion member 4. Of the scattered light, the amount of light scattered toward the sealing portion 3 and passing through the sealing portion 3 can be reduced, and the light extraction efficiency as a whole of the light emitting device A can be improved.

(Embodiment 4)
The basic configuration of the light emitting device A of the present embodiment is substantially the same as that of the third embodiment. As shown in FIG. 7, a plurality (15 in the illustrated example) of LED chips 1 are mounted on the one surface side of the mounting substrate 2. A point light source 10 comprising the plurality of LED chips 1 at the center of a virtual circle CV that includes all of the plurality of LED chips 1 mounted on the one surface side on the one surface of the mounting substrate 2. Assuming that the distance between the point light source 10 and the inner surface of the color conversion member 4 in the direction of the angle θ with respect to the direction along the thickness direction of the LED chip 1 is r, the upper inner surface of the color conversion member 4 is I _θ · The difference is that it is formed in a shape where r ² = constant. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 3, and description is abbreviate | omitted.

  In the present embodiment, the plurality of LED chips 1 described above are arranged separately on two concentric virtual circles VC1 and VC2 as shown in FIG. 7B. Specifically, five LED chips 1 are arranged at equal intervals on the inner virtual circle VC1 (on the circumference of the virtual circle VC1) (in short, the center of the LED chip 1 is positioned at each vertex of the regular pentagon). 10 LED chips 1 are arranged at equal intervals on the outer virtual circle VC2 (on the circumference of the virtual circle VC2) (in short, the center of the LED chip 1 at each apex of the regular decagon). Is located). Here, in this embodiment, the diameter of the inner virtual circle VC1 is set to 6 mm, and the diameter of the outer virtual circle VC2 is set to 13.5 mm, and each of φ1, H1, φ2, and H2 described in the first embodiment is set. Are set to φ1 = 40 mm, H1 = 25.5 mm, φ2 (= 2b) = 36 mm, H2 (= a) = 23.5 mm, and a / b = 1.3. In the present embodiment, the thickness of the color conversion member 4 is 2 mm.

In the light emitting device A of the present embodiment, the LED chip 1 is a blue LED chip, the phosphor of the color conversion member 4 is a yellow phosphor, the translucent material is a silicone resin, and the inner surface of the color conversion member 4 surface area of 2461 [mm ^2], (in the present embodiment, the sum of the light output of 15 LED chips 1) the light output of the point light source 10 when given input power defined to the point light source 10 is 9769 [mW ]. Here, when the surface area of the inner surface of the color conversion member 4 is S [mm ² ] and the light output of the point light source 10 when a prescribed input power is applied to the point light source 10 is P [mW], S / P [ FIG. 8 shows the results of examining the relationship between the angle θ and the temperature of the color conversion member 4 in the direction of the angle θ when the value of [mm ² / mW] is variously changed as shown in Table 1 below.

FIG. 8 shows that the temperature is highest at the apex of the color conversion member 4 where the angle θ is 0 ° regardless of the value of S / P. On the other hand, the relationship between the S / P value and the temperature of the apex of the color conversion member 4 is as shown in FIG. 9, and the inner surface of the color conversion member 4 is kept so that the S / P value does not fall below 0.2. If the surface area S is set, it can be seen that the temperature of the color conversion member 4 can be set to 100 ° C. or less, the decrease in the quantum efficiency of the phosphor due to the temperature rise of the phosphor can be suppressed, and the light extraction efficiency can be improved. . In the light emitting device A of the present embodiment, the surface area S of the inner surface of the color conversion member 4 is 2461 [mm ² ], the light output P of the point light source 10 is 9769 [mW], and the value of S / P is 0.25 [ mm ² / mW], and the relationship between the angle θ and the incident density is as shown in FIG. 10A, and the relationship between the angle θ and the temperature of the color conversion member 4 is shown in FIG. The distribution is as shown. Further, in the present embodiment, the point light source 10 is configured by a plurality of LED chips 1, but when the point light source 10 is configured by one LED chip 1 as in the other embodiments 1-3. However, if the surface area S of the inner surface of the color conversion member 4 is set so that the value of S / P does not fall below 0.2, the temperature of the color conversion member 4 can be made 100 ° C. or less, and the temperature of the phosphor A decrease in the quantum efficiency of the phosphor due to the rise can be suppressed, and the light extraction efficiency can be improved.

The light-emitting device of Embodiment 1 is shown, (a) is a schematic sectional drawing, (b) is principal part explanatory drawing. It is a light distribution characteristic view of the LED chip in the light emitting device same as the above. It is characteristic explanatory drawing of a light-emitting device same as the above. It is characteristic explanatory drawing of a light-emitting device same as the above. 6 is a schematic cross-sectional view of a light emitting device according to Embodiment 2. FIG. 6 is a schematic cross-sectional view of a light emitting device according to Embodiment 3. FIG. The light-emitting device of Embodiment 4 is shown, (a) is a schematic sectional drawing, (b) is a principal part schematic plan view. It is characteristic explanatory drawing of a light-emitting device same as the above. It is characteristic explanatory drawing of a light-emitting device same as the above. It is characteristic explanatory drawing of a light-emitting device same as the above. It is a schematic sectional drawing of the light-emitting device of a prior art example. (A) shows the schematic sectional drawing of the lighting fixture using the light-emitting device same as the above, (b) is explanatory drawing of the hybrid lens in (a). It is principal part explanatory drawing of a light-emitting device same as the above.

Explanation of symbols

A Light emitting device VC Virtual circle 1 LED chip 2 Mounting substrate 4 Color conversion member 10 Point light source a Long radius b Short radius

Claims (3)

An LED chip whose radiation angle dependency of the emitted light intensity can be approximated by a Lambertian distribution, a mounting substrate on which the LED chip is mounted on one surface side, and the LED chip excited by light emitted from the LED chip A dome-shaped color conversion member formed of a light-transmitting material containing a phosphor that emits light of a color different from the emission color of the mounting substrate and disposed on the one surface side of the mounting substrate. wherein the center of the virtual circle that includes all the plurality of the LED chip mounted on the one surface side in one surface light source and the assumption point consisting of the plurality of the LED chips, the top of the color converting member The inner surface of the color conversion member is constituted by a part of an ellipsoid whose center is the intersection of the optical axis of the color conversion member and the one surface of the mounting substrate and whose major axis is the optical axis direction of the color conversion member. The long half of / Light emitting device short radius, characterized in that a 1.2 to 1.3. The LED chip is a blue LED chip, the phosphor of the color conversion member is a yellow phosphor, the translucent material is a silicone resin, and the surface area of the inner surface of the color conversion member is S [mm ² ]. When the light output of the point light source when a prescribed input power is applied to the point light source is P [mW], the inner surface of the color conversion member is such that the value of S / P does not fall below 0.2. the light-emitting device according to claim 1, wherein the tare Rukoto set the surface area S of the. Luminaire you further comprising a light-emitting device according to claim 1 or 2, wherein.

Images