JP5240912B2 - Piezoelectric device manufacturing method and piezoelectric vibration element mounting apparatus - Google Patents

Description

  The present invention relates to a method for manufacturing a piezoelectric device used in an electronic device or the like and a piezoelectric vibration element mounting apparatus.

Here, the piezoelectric device will be described as a crystal resonator. As shown in FIG. 10, the conventional piezoelectric device uses, for example, quartz as a piezoelectric material. FIG. 10 is a cross-sectional view showing a conventional piezoelectric device.
This crystal resonator 200 is mainly composed of a container body 201, a crystal resonator element 205, and a lid body 206. A pair of crystal resonator elements is mounted on the inner bottom surface of the recess space 202 formed in the container body 201. A pad 203 is provided.
On the crystal resonator element mounting pad 203, a crystal resonator element 205 having a pair of excitation electrodes 207 that are electrically connected via a conductive adhesive 204 on the front and back main surfaces and having a square shape in plan view. Is installed.
The crystal resonator element 205 has an excitation electrode 207, an extraction electrode 208, and a connection electrode 209 on the front and back main surfaces of the crystal base plate 206.
The excitation electrode 207, the extraction electrode 208, and the connection electrode 209 are formed of a base electrode film made of Cr or the like and an Au electrode film provided on the upper surface of the base electrode film.
There is known a crystal resonator 200 in which a concave space 202 is hermetically sealed by covering and bonding a metal lid 206 on a top surface of a side wall of a container body 201 that surrounds the crystal resonator element 205 (for example, Patent Document 1).

Such a conventional method of manufacturing a piezoelectric device includes a base electrode film forming step of forming a base electrode film constituting the excitation electrode 207, the extraction electrode 208, and the connection electrode 209 on the crystal base plate. An Au electrode film forming step for forming an Au electrode film on the base electrode film; and a mask is disposed on the surface of the Au electrode film, and the Au electrode film removal for removing the Au electrode film of the connection electrode by etching. A step of applying a conductive adhesive 204 on a crystal vibration element mounting pad 203 provided on a bottom surface in the concave space 202 of the container body 201 and mounting the crystal vibration element 205 on the conductive adhesive 204. The conductive adhesive 204 is heated and cured, and the crystal vibration element mounting pad 203 and the crystal vibration element 205 are conductively fixed, and the lid body 206 and the container body 201 are joined. Manufacturing method comprising the order of steps is known (e.g., see Patent Document 2).
Since the Au electrode film of the connection electrode 209 of the crystal resonator element 203 has low bondability with the conductive adhesive 204, the connection strength is reduced. Therefore, the Au electrode film of the connection electrode 209 is removed by etching to expose the base metal film and improve the bonding strength with the conductive adhesive 204, thereby improving the connection strength.

JP 2004-7092 A JP 2003-188777 A

However, in the conventional method of manufacturing a piezoelectric device, a mask is disposed on the crystal resonator element 205, and the Au electrode film of the connection electrode is removed by etching. was there.
Further, since the Au electrode film of the connection electrode of the crystal resonator element 205 is removed and stored with the base electrode film exposed, the base electrode film easily oxidizes and is unstable. There was a problem that it fluctuated.

  The present invention has been made in view of the above problems, and when the mask is overlaid on the piezoelectric element plate, the Au electrode film of the connection electrode of the piezoelectric vibration element can be removed without causing displacement of the mask, and the oscillation frequency can be reduced. It is an object of the present invention to provide a method for manufacturing a piezoelectric device that can prevent fluctuations.

  In the method for manufacturing a piezoelectric device of the present invention, a container body having a recessed space and provided with a piezoelectric vibration element mounting pad in the recessed space is extracted from the excitation electrode and the excitation electrode on the piezoelectric element plate. A method of manufacturing a piezoelectric device having a lead electrode and a piezoelectric vibration element on which a connection electrode connected to the lead electrode is formed and hermetically sealing the inside of the concave portion with a lid, the excitation electrode, and the lead electrode The electrode and the connection electrode are composed of a base electrode and an Au electrode, and a laser removal step of removing the Au electrode film of the connection electrode provided on the piezoelectric vibration element on the side facing the piezoelectric vibration element mounting pad with a laser, A piezoelectric vibration element fixing step of mounting a piezoelectric vibration element on a container body with a conductive adhesive, heat-curing the conductive adhesive, and electrically connecting and fixing the piezoelectric vibration element mounting pad and the connection electrode of the piezoelectric vibration element; Body and container body It is characterized in that including a lid bonding process for bonding.

A piezoelectric vibration element mounting apparatus according to the present invention is a piezoelectric vibration element mounting apparatus that mounts a piezoelectric vibration element on a container body having a recessed space, and moves a conveying jig in which the container body is accommodated to a predetermined position. Conductive adhesion is applied to the first conveying means and the piezoelectric vibration element mounting pad provided in the recessed space of the container body accommodated in the conveying jig which is conveyed by the first conveying means and stopped at a predetermined position. Adhesive attaching means for attaching, electrode film forming jig supplying means for holding an electrode film forming jig on which a plurality of piezoelectric vibration elements are mounted, and moving the electrode film forming jig from the electrode film forming jig supplying means And a second transport unit that stops at a predetermined position, and an element mounting unit that moves the plurality of piezoelectric vibration elements mounted on the electrode film forming jig transported by the second transport unit to a predetermined position; The compound moved by the element mounting means When the piezoelectric vibrating element passes, is irradiated with a laser, it is characterized in being configured with a laser means for removing the Au electrodes of the connecting electrodes of the piezoelectric vibrating element.

  According to the method for manufacturing a piezoelectric device of the present invention, since the Au electrode film of the connection electrode of the piezoelectric vibration element is removed with a laser in the laser removing step, the Au electrode film of the connection electrode is etched by conventional etching. It is possible to prevent the portion to be removed from being displaced due to the displacement of the mask that occurs when removing the film.

  In addition, the laser removal process is performed during the piezoelectric vibration element fixing process, so that after removing the Au electrode film of the connection electrode of the piezoelectric vibration element, it is not stored in a state where the base electrode film is exposed. Since the piezoelectric vibration element is immediately mounted on the conductive adhesive on the piezoelectric vibration element mounting pad, the base electrode film of the piezoelectric vibration element is hardly oxidized. Accordingly, it is possible to prevent fluctuations in the oscillation frequency due to oxidation of the base electrode film of the piezoelectric vibration element.

  Further, according to the piezoelectric vibration element mounting apparatus of the present invention, when the plurality of piezoelectric vibration elements moved by the element mounting means pass, a laser is irradiated to remove the Au electrode film of the connection electrode of the piezoelectric vibration element. Since the laser means is provided, the piezoelectric vibration element can be mounted on the conductive adhesive on the piezoelectric vibration element mounting pad immediately after the Au electrode film of the connection electrode of the piezoelectric vibration element is removed. Therefore, it is possible to prevent fluctuations in the oscillation frequency due to oxidation of the base electrode film of the piezoelectric vibration element.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is an exploded perspective view showing a piezoelectric device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line AA of FIG. FIG. 3 is an external perspective view of the piezoelectric vibration element constituting the piezoelectric device according to the embodiment of the present invention. 4 is a cross-sectional view taken along line BB in FIG. A case where crystal is used as the piezoelectric material of the piezoelectric vibration element used in the piezoelectric device will be described.
Hereinafter, a crystal resonator which is an example of a piezoelectric device will be described.

  Next, the piezoelectric device is, for example, the crystal resonator 100 shown in FIGS. 1 and 2, and mainly includes the container body 10, the crystal resonator element 20, and the lid body 30. The crystal resonator 100 has a structure in which a crystal resonator element 20 is mounted in a recessed space 11 formed on one main surface of the container body 10.

The crystal resonator element 20 includes a crystal base plate 21, an excitation electrode 22, an extraction electrode 23, and a connection electrode 24.
As shown in FIGS. 1 to 4, an excitation electrode 22, an extraction electrode 23 drawn from the excitation electrode 22, and a connection electrode 24 connected to the extraction electrode 23 are attached to a quartz base plate 21. Formed.
The excitation electrode 22, the extraction electrode 23, and the connection electrode 24 are composed of base electrode films 22a, 23a, 24a and Au electrode films 22b, 23b, 24b.
The base metal films 22a, 23a, and 24a are formed, for example, by depositing Cr, Ti, or NiCr by sputtering.
The Au electrode films 22b, 23b, and 24b are formed so as to be laminated on the main surfaces of the base metal films 22a, 23a, and 24a.

Such a crystal resonator element 20 is excited in a predetermined vibration mode and frequency when an alternating voltage from the outside is applied to the crystal base plate 21 via the connection electrode 24.
The quartz base plate 21 is a substantially flat plate shape that is cut from an artificial crystalline lens at a predetermined cut angle and is subjected to outer shape processing, and has a planar shape of, for example, a quadrangle.
The excitation electrode 22 is deposited and formed on both the front and back main surfaces of the quartz base plate 21.
The extraction electrode 23 is extracted from the excitation electrode 22 and connected to a connection electrode 24 described later.
The connection electrode 24 is mounted in the recess space 11 by being electrically and mechanically connected to the piezoelectric vibration element mounting pad 13 formed on the inner bottom surface of the recess space 11 via the conductive adhesive 40.
As shown in FIGS. 3 and 4, the connection electrode 24 is provided with a groove 25 formed by removing the Au electrode film 24b. That is, the exposed portion of the groove 25 is the base metal film 24a.
In addition, such a crystal resonator element 20 conducts the connection electrode 24 connected to the lead electrode 23 extending on one side from the excitation electrodes 22 provided on the front and back main surfaces to the piezoelectric resonator element mounting pad 13. The cantilever is fixed with the adhesive 40.

The container body 10 includes a substrate portion 10a and a frame portion 10b provided on one main surface of the substrate portion 10a.
The substrate portion 10a and the frame portion 10b are formed of a ceramic material such as alumina ceramics or glass-ceramic.
As shown in FIGS. 1 and 2, a recessed space 11 is formed by one main surface of the substrate portion 10a and the frame portion 10b.
An annular sealing conductor pattern 12 is formed on the entire circumference of the opening-side top surface of the frame portion 10b surrounding the recessed space 11 of the container body 10.
A piezoelectric vibration element mounting pad 13 is provided on one main surface of the substrate portion 10 a exposed in the recessed space 11 of the container body 10.
External connection electrode terminals 14 are provided at the four corners of the other main surface of the substrate portion 10 a of the container body 10.
The piezoelectric vibration element mounting pad 13 and the external connection electrode terminal 14 are formed inside the substrate portion 10a and a wiring pattern (not shown) formed inside the substrate portion 10a in the recessed space 11 of the container body 10. They are connected by via conductors (not shown).

  The sealing conductor pattern 12 is used when a lid body 30 to be described later is joined to the container body 10, and the sealing member 31 formed on the lid body 30 is joined with good wettability. The airtight reliability and productivity of the recessed space 11 can be improved.

The lid body 30 is disposed and joined on the opening-side top surface of the frame portion 10 b of the container body 10 so as to cover the opening portion of the recessed space 11. The lid 30 is provided with a sealing member 31 at a location corresponding to the sealing conductor pattern 12.
Further, such a sealing member 31 can relieve irregularities on the surface of the sealing conductor pattern 12 and prevent a decrease in airtightness in the concave space 11.

  The lid 30 is manufactured by adopting a conventionally known metal processing method and shaping a metal such as 42 alloy into a predetermined shape. A nickel (Ni) layer is formed on the surface of the lid 30, and at least a portion of the nickel (Ni) layer facing the sealing conductor pattern 12 is gold tin (Au—Sn) as a sealing member 31. ) Layer is formed. The thickness of the gold tin (Au—Sn) layer is 10 μm to 40 μm. For example, the component ratio is 80% gold and 20% tin.

  The conductive adhesive 40 contains conductive powder as a conductive filler in a binder such as a silicone resin. As the conductive powder, aluminum (Al), molybdenum (Mo), tungsten (W ), Platinum (Pt), palladium (Pd), silver (Ag), titanium (Ti), nickel (Ni), nickel iron (NiFe), or a combination thereof is used. .

  When the container body 10 is made of, for example, alumina ceramics, a sealing conductor pattern 12 and a piezoelectric film are formed on the surface of a ceramic green sheet obtained by adding and mixing a suitable organic solvent to a predetermined ceramic material powder. Conventionally, a conductive paste that becomes the vibration element mounting pad 13, the external connection electrode terminal 14 and the like, and a conductive paste that becomes a via conductor in a through-hole that has been punched in advance in the ceramic green sheet are well known. It is manufactured by laminating a plurality of sheets and press-molding them, followed by firing at a high temperature.

  The sealing conductor pattern 12 has, for example, a nickel (Ni) layer and a gold (Au) layer sequentially formed on the surface of a base layer made of tungsten (W), molybdenum (Mo), etc., and the recess space 11 is formed in an annular shape. It is formed to a thickness of 10 μm to 25 μm by being attached to the frame portion 10 b in a surrounding form.

Next, a method for manufacturing a piezoelectric device according to an embodiment of the present invention will be described with reference to FIGS.
FIG. 5A is a cross-sectional view showing the base electrode film forming step of the method for manufacturing a piezoelectric device according to the embodiment of the present invention, and FIG. 5B is the manufacturing of the piezoelectric device according to the embodiment of the present invention. FIG. 5C is a cross-sectional view showing the Au electrode film removing step of the method for manufacturing a piezoelectric device according to the embodiment of the present invention. FIG. 6A is a cross-sectional view illustrating a piezoelectric vibration element fixing step of the piezoelectric device manufacturing method according to the embodiment of the present invention, and FIG. 6B is a manufacturing method of the piezoelectric device according to the embodiment of the present invention. It is sectional drawing which shows the cover body joint process of a method. FIG. 7 is a perspective view conceptually showing an example of an electrode film forming jig used in the method for manufacturing a piezoelectric device of the present invention.

As shown in FIG. 5A, in the base electrode film forming step, the base electrode films 22a, 23a constituting the excitation electrode 22, the extraction electrode 23, and the connection electrode 24 are formed on the piezoelectric element plate 21. This is the step of forming 24a.
The piezoelectric element plate 21 is accommodated in the electrode film forming jig 50, and, for example, Cr, Ti, and NiCr are deposited by sputtering to form the base electrode films 22a, 23a, and 24a.

As shown in FIG. 7, the electrode film forming jig 50 includes an electrode film forming jig main body 51 and an exterior body 53.
The electrode film forming jig main body 51 and the exterior body 53 are made of a single metal plate made of stainless steel such as SUS304.
The electrode film forming jig main body 51 is provided in a state in which a plurality of accommodating portions 52 into which the piezoelectric element plate 21 can be inserted are arranged. The accommodating portion 52 is provided by punching a metal plate or the like.
Two exterior bodies 53 are provided on each of the main surfaces of the electrode film forming jig main body 51 as a pair. The outer package 53 is opposed to the piezoelectric element plate 21 and has openings corresponding to the shapes of the excitation electrode 22, the extraction electrode 23, and the connection electrode 24 provided on the piezoelectric element plate 21.

As shown in FIG. 5B, the Au electrode film forming step is a step of forming Au electrode films 22b, 23b, and 24b on the layers of the base electrode films 22a, 23a, and 24a.
That is, the Au electrode films 22b, 23b, so that the piezoelectric element plate 21 is deposited in the electrode film forming jig 50 while being deposited by sputtering and stacked on the main surfaces of the base electrode films 22a, 23a, 24a. 24b is formed.

(Laser removal process)
As shown in FIG. 5C, the laser removing step is a step of removing the Au electrode film of the connection electrode provided on the piezoelectric vibrating element on the side facing the piezoelectric vibrating element mounting pad 13 with a laser.
The connection electrode 24 deposited on the piezoelectric element plate 21 is intermittently irradiated with a laser to remove the Au electrode film 24 b of the connection electrode 24. For example, the Au electrode film 24b is linearly removed by a laser at a portion of the connection electrode 24 in contact with the conductive adhesive 40.
As the laser, for example, a carbon dioxide laser, a YAG laser, a YVO ₄ laser, a semiconductor laser, an excimer laser, or the like is used.
For example, in the case of a YVO ₄ laser, the third harmonic of the laser having a wavelength of, for example, 300 to 400 nm is used.

(Piezoelectric vibration element fixing process)
As shown in FIG. 6A, in the piezoelectric vibration element fixing step, the piezoelectric vibration element 20 is mounted on the container body 10 with the conductive adhesive 40, and the conductive adhesive 40 is heated and cured, In this step, the piezoelectric vibration element mounting pad 13 and the connection electrode 24 of the piezoelectric vibration element 20 are conductively fixed.
As shown in FIG. 6A, a pair of piezoelectric vibration element mounting pads 13 is provided on the substrate portion 10 a in the recessed space 11 of the container body 10, and conductive bonding is performed on the piezoelectric vibration element mounting pads 13. Piezoelectric vibration in a form in which a connecting electrode 24 extended from an excitation electrode 22 formed on the surface of the piezoelectric vibration element 20 is attached to the conductive adhesive 40 applied to the piezoelectric vibration element mounting pad 13. The element 20 is mounted.

The piezoelectric vibration element 20 is mounted on the container body 10 while being accommodated in the conveyance jig 60.
The conveyance jig 60 is formed of, for example, a metal material such as SUS, and is used when the container body 10 is securely fixed and each process is flowed. Moreover, each process is performed in the state which accommodated the container body 10 in the conveyance jig 60. FIG.
The thickness of the conveying jig 60 is larger than the thickness of the container body 10, and a plurality of accommodating portions for accommodating and fixing the container body 10 are formed. The container body 10 is accommodated in the accommodating portion.

(Cover body joining process)
As shown in FIG. 6B, the lid joining process is a process for joining the lid 30 and the container body 10.
The lid body 30 is mounted so as to cover the recessed space 11 of the container body 10 on which the piezoelectric vibration element 20 is mounted, and the lid member 30 and the container body 10 are joined by heating and melting the sealing member 31. To do.
As the heating means, a xenon lamp, a halogen lamp or the like is used, and the sealing member 31 of the lid body 30 is melted by irradiating the container body 10 on which the lid body 30 is disposed with heat rays from these heat sources. The container body 10 is joined to the sealing conductor pattern 12.

According to the method for manufacturing a piezoelectric device of the present invention, since the Au electrode film 24b of the connection electrode 24 of the piezoelectric vibration element 20 is removed by a laser in the Au electrode film removal step, the connection is performed by conventional etching. It is possible to prevent the portion to be removed from being displaced due to the displacement of the mask position that occurs when the Au electrode film 24b of the electrode 24 is removed.
Further, the laser removal process is performed during the piezoelectric vibration element fixing process, so that the Au electrode film 24b of the connection electrode 24 of the piezoelectric vibration element 20 is removed, and then the base electrode film 24a is kept exposed. Since the piezoelectric vibration element 20 is immediately mounted on the conductive adhesive 40 on the piezoelectric vibration element mounting pad 13, the base electrode film 24a of the piezoelectric vibration element 20 is hardly oxidized. Therefore, it is possible to prevent fluctuations in the oscillation frequency due to oxidation of the base electrode film 24a of the piezoelectric vibration element 20.

Here, a piezoelectric vibration element mounting apparatus that performs the laser removal process to the piezoelectric vibration element fixing process will be described.
FIG. 8 is a perspective view conceptually showing an example of the piezoelectric vibration element mounting device according to the embodiment of the present invention. FIG. 9 is an enlarged view of part C of FIG.
As shown in FIGS. 8 and 9, the piezoelectric vibration element mounting device 190 attaches the conductive adhesive 40 to the piezoelectric vibration element mounting pad 13 provided on the bottom surface in the concave space 11 of the container body 10, and the conductivity thereof. This is a device that is mounted by bringing the piezoelectric vibration element 20 into contact with the adhesive 40.

  As shown in FIGS. 8 and 9, the piezoelectric vibration element mounting device 190 includes a first transport unit 110, an adhesive attaching unit 120, an electrode film forming jig supply unit 130, and a second transport unit 140. The element mounting unit 150 and the laser unit 160 are mainly configured.

In addition, the piezoelectric vibration element mounting device 190 is provided so that the first transport unit 110 and the second transport unit 140 are parallel to each other, and between the first transport unit 110 and the second transport unit 140. Is provided with a laser means 160, and a guide rail R is provided so as to straddle the first conveying means 110 and the second conveying means 140. The adhesive attaching means 120 and the element mounting means 150 are provided on the guide rail R. And are provided. Further, an electrode film forming jig supply unit 130 is provided on one end side of the second transport unit 140.
In the piezoelectric vibration element mounting device 190, the first transport unit 110 and the second transport unit are configured such that the moving direction of the electrode film forming jig 50, that is, the transport direction of the electrode film forming jig 50 is parallel to the Y direction. The direction orthogonal to 140 is the X direction, and the direction orthogonal to both the X direction and the Y direction is the Z direction.

The 1st conveyance means 110 plays the role which moves the conveyance jig 60 to a predetermined position.
A conveying jig 60 is placed on the first conveying means 110, and a predetermined row of the recessed space 11 is located below a position where an adhesive attaching means 120 and an element mounting means 150 described later move. Thus, the conveyance jig 60 is moved. That is, the transport jig 60 can be transported in the Y direction.
Here, the row refers to a set of a plurality of recessed spaces 11 arranged in a direction orthogonal to the moving direction of the first transport unit 110.

The first transport unit 110 moves the transport jig 60 to a predetermined position, and then transports the transport jig for each row interval formed by the recessed spaces 11 formed in the container body 10 of the transport jig 60. It also plays the role of moving 60.
The movement at intervals of this row is performed after the piezoelectric vibration element 20 is mounted on the piezoelectric vibration element mounting pad 13 provided on the bottom surface of the concave space 11 of the container body 10.

  The adhesive adhering means 120 is a piezoelectric vibration element mounting pad provided on the bottom surface in the recessed space 11 of the container body 10 mounted on the transport jig 60 transported by the first transport means 110 and stopped at a predetermined position. The conductive adhesive 40 is attached to 13. In this adhesive attaching means 120, a plurality of dispensers D for taking out the conductive adhesive 40 to the first conveying means 110 side are provided with a piezoelectric vibration element mounting pad on the inner bottom surface of the recessed space 11 of the container bodies 10 in a row. 13 is provided so as to face 13. That is, a plurality of dispensers D are provided in the X direction. These dispensers D are movable back and forth in the Z direction, and the conductive adhesive 40 is applied to the piezoelectric vibration element mounting pad 13 provided on the bottom surface in the recessed space 11 of the container body 10 accommodated in the transport jig 60. Moves in the Z direction when and when it is deposited.

  When the conductive adhesive 40 is attached to the piezoelectric vibration element mounting pad 13 provided on the inner bottom surface of the recessed space 11 of the container body 10 mounted on the conveying jig 60, the conductive adhesive 40 moves in the X direction. .

  The adhesion means that the conductive adhesive 40 is applied to the piezoelectric vibration element mounting pad 13, and includes application of the conductive adhesive 40 to the piezoelectric vibration element mounting pad 13 with a dispenser. Therefore, the case where the transfer head is provided on the first conveying means 110 side of the adhesive attaching means 120 includes the case where the conductive adhesive 40 is transferred to the piezoelectric vibration element mounting pad 13.

The electrode film forming jig supply means 130 plays a role of holding the electrode film forming jig 50 on which the plurality of piezoelectric vibration elements 20 are placed.
The electrode film forming jig supply means 130 holds a plurality of electrode film forming jigs 50 on which a plurality of piezoelectric vibration elements 20 are mounted. The electrode film forming jig supply means 130 may automatically or manually hold a plurality of electrode film forming jigs 50 formed by other processes.

The second transport unit 140 serves to move the electrode film forming jig 50 from the electrode film forming jig supply unit 130 and stop it at a predetermined position.
The second transport unit 140 can move the electrode film forming jig 50 in the same direction as the first transport unit 110, for example. That is, the electrode film forming jig 50 can be transported in the Y direction. The electrode film forming jig 50 is placed on the second conveying means 140, and the electrodes are arranged so that a predetermined row of the piezoelectric vibration elements 20 is located below the position where the element mounting means 150 described later moves. The film forming jig 50 is moved.

Here, the row refers to a set of a plurality of piezoelectric vibration elements 20 arranged in a direction orthogonal to the moving direction of the second transport unit 140.
Further, the second conveying means 140 moves the electrode film forming jig 50 to a predetermined position, and then the interval between the rows constituted by the plurality of piezoelectric vibration elements 20 provided on the electrode film forming jig 50. It also plays a role of moving the electrode film forming jig 50 every time. The movement for each row can be moved when the plurality of piezoelectric vibration elements 20 forming the row placed on the electrode film forming jig 50 are used up.

The element mounting means 150 is configured to place the piezoelectric vibration element 20 placed on the electrode film forming jig 50 conveyed by the second conveying means 140 at a predetermined position, that is, a container accommodated in the conveying jig 60. It plays a role of mounting on the piezoelectric vibration element mounting pad 13 provided on the inner bottom surface of the recessed space 11 of the body 10.
The element mounting means 150 is provided on the guide rail R. Further, the element mounting means 150 is provided with an adsorption portion V1 for adsorbing the piezoelectric vibration element 20 on the second transport means 140 side so as to face the piezoelectric vibration elements 20 in a row. That is, a plurality of suction portions V1 are provided in the X direction. These suction portions V1 can move back and forth in the Z direction, and are placed on the container body 10 mounted on the transport jig 60 when the piezoelectric vibration element 20 is sucked from the electrode film forming jig 50. Sometimes moves in the Z direction. Further, when the piezoelectric vibration element 20 is newly adsorbed, it moves in the X direction.

  Further, it is mounted on the piezoelectric vibration element mounting pad 13 provided on the bottom surface of the recessed space 11 of the container body 10 accommodated in the transport jig 60. A conductive adhesive 40 is attached to the piezoelectric vibration element mounting pad 13 by an adhesive attaching means 120. Therefore, the element mounting means 150 places the piezoelectric vibration element 20 on the conductive adhesive 40 on the piezoelectric vibration element mounting pad 13. Thereby, the piezoelectric vibration element 20 can be mounted on the container body 10 mounted on the conveying jig 60.

As shown in FIGS. 8 and 9, the laser means 160 plays a role of irradiating the connection electrodes 24 of the plurality of piezoelectric vibration elements 20 moved by the element mounting means 150 with a laser to remove the Au electrode film 24 b.
The laser unit 160 is provided with an irradiation port 161, and the laser is irradiated from the irradiation port 161.
At this time, the piezoelectric vibrations formed in the rows of the recessed spaces 11 formed in the container body 10 accommodated in the conveying jig 60, the irradiation port 161 of the laser means 160, and the electrode film forming jig 50 are formed. The column of the elements 20 is located on the same straight line.
Thus, in the process of mounting the piezoelectric vibration element 20 on the container body 10 by the element mounting means 150, the piezoelectric vibration element 20 is temporarily stopped on the irradiation port 161 of the laser means 160, and the connection electrode 24 of the piezoelectric vibration element 20 is The Au electrode film 24b can be removed.

  Further, when the first conveying means 110, the adhesive attaching means 120, and the element mounting means 150 are controlled by the control means, the timing when the conveying jig 60 is moved at every row interval, and the conductive adhesive 40 The time when the piezoelectric vibration element 20 is attached to the piezoelectric vibration element mounting pad 13 and the time when the piezoelectric vibration element 20 is mounted on the container body 10 accommodated in the conveying jig 60 can be shifted from each other.

  Further, the second transporting unit 140 and the element mounting unit 150 are controlled separately or by the same control unit, so that the movement of the electrode film forming jig 50 at every interval of the row and the piezoelectric vibrating element 20 are adsorbed. This can be done at different times.

  According to the piezoelectric vibration element mounting apparatus of the present invention, when a plurality of the piezoelectric vibration elements 20 moved by the element mounting means 150 pass, a laser is irradiated and the Au electrode film of the connection electrode 24 of the piezoelectric vibration element 20 is irradiated. Since the laser means 160 for removing 24b is provided, the piezoelectric vibrating element 20 is immediately connected to the piezoelectric vibrating element mounting pad 13 after the Au electrode film 24b of the connection electrode 24 of the piezoelectric vibrating element 20 is removed. Since it can be mounted on the adhesive 40, it is possible to prevent fluctuations in the oscillation frequency due to oxidation of the base electrode film 24a of the connection electrode 24 of the piezoelectric vibration element 20.

In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.
For example, in the above-described embodiment, the crystal resonator which is one of the piezoelectric devices has been described as an example, but instead of this, the piezoelectric vibration element 20 and the piezoelectric resonator 20 are disposed in the recessed space 11 in the container body 10. A separate recessed space 11 is formed in the container body 10 together with an integrated circuit element having an oscillation circuit electrically connected to the vibrating element 20, and the piezoelectric vibrating element 20 and the integrated circuit are formed in the recessed space 11. The present invention can also be applied to methods for manufacturing other piezoelectric devices, such as a piezoelectric oscillator in which elements are separately mounted, and a piezoelectric filter in which the piezoelectric vibration element 20 mounted inside functions as a filter.

  Furthermore, in the above-described embodiment, the case where the frame portion 10b of the container body 10 is made of alumina ceramics has been described. However, the frame portion 10b is made of a metal such as 42 alloy or Kovar, and has a frame-like seal ring. You may use. In this case, a seam welding method is used as a method for joining the lids.

1 is an exploded perspective view showing a piezoelectric device according to an embodiment of the present invention. It is AA sectional drawing of FIG. 1 is an external perspective view of a piezoelectric vibration element constituting a piezoelectric device according to an embodiment of the present invention. It is a B-B sectional view of FIG. (A) is sectional drawing which shows the base electrode film formation process of the manufacturing method of the piezoelectric device which concerns on embodiment of this invention, (b) is Au electrode of the manufacturing method of the piezoelectric device which concerns on embodiment of this invention It is sectional drawing which shows a film formation process, (c) is a step view which shows the Au electrode film removal process of the manufacturing method of the piezoelectric device which concerns on embodiment of this invention. (A) is sectional drawing which shows the piezoelectric vibration element fixing process of the manufacturing method of the piezoelectric device which concerns on embodiment of this invention, (b) is a cover body of the manufacturing method of the piezoelectric device which concerns on embodiment of this invention. It is sectional drawing which shows a joining process. It is a perspective view which shows notionally an example of the electrode film formation jig | tool used with the manufacturing method of the piezoelectric device of this invention. It is a perspective view which shows notionally an example of the piezoelectric vibration element mounting apparatus which concerns on embodiment of this invention. It is the C partial enlarged view of FIG. It is sectional drawing of the conventional piezoelectric device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Container body 10a ... Board | substrate part 10b ... Frame part 11 ... Recessed space 12 ... Conductive pattern for sealing 13 ... Piezoelectric vibration element mounting pad 14 ... External connection electrode Terminal 20 ... Piezoelectric vibration element 21 ... Piezoelectric base plate 22 ... Excitation electrode 23 ... Extraction electrode 24 ... Connection electrode 22a, 23a, 24a ... Base electrode film 22b, 23b, 24b ... Au electrode film 25 ... groove 30 ... lid body 31 ... sealing member 40 ... conductive adhesive 50 ... electrode film forming jig 60 ... conveying jig 100 ..Piezoelectric device 110... First transport means 120... Adhesive adhesion means 130... Electrode film forming jig supply means 140... Second transport means 150. ..Laser means 190 ... with piezoelectric vibration element Location V1 ··· adsorption unit

Claims (2)

In a container body having a recessed space and provided with a piezoelectric vibration element mounting pad in the recessed space,
A piezoelectric vibration element in which an excitation electrode, an extraction electrode drawn from the excitation electrode, and a connection electrode connected to the extraction electrode are mounted on the piezoelectric base plate, and the inside of the recessed space is aired with a lid. A method for manufacturing a hermetically sealed piezoelectric device comprising:
The excitation electrode, the extraction electrode, and the connection electrode are composed of a base electrode film and an Au electrode film,
A laser removal step of removing the Au electrode film of the connection electrode provided on the piezoelectric vibration element on the side facing the piezoelectric vibration element mounting pad with a laser;
A piezoelectric vibration element in which the piezoelectric vibration element is mounted on the container body with a conductive adhesive, the conductive adhesive is heated and cured, and the piezoelectric vibration element mounting pad and the connection electrode of the piezoelectric vibration element are conductively fixed. Fixing process;
A method for manufacturing a piezoelectric device, comprising: a lid body joining step for joining the lid body and the container body. A piezoelectric vibration element mounting apparatus for mounting a piezoelectric vibration element on a container body having a recessed space,
First transport means for moving a transport jig in which a container body is housed to a predetermined position;
A conductive adhesive is attached to the piezoelectric vibration element mounting pad provided in the concave space of the container body accommodated in the conveyance jig that has been conveyed by the first conveyance means and stopped at a predetermined position. Adhesive adhesive means;
An electrode film forming jig supply means for holding an electrode film forming jig on which a plurality of the piezoelectric vibration elements are mounted;
A second conveying means for moving the electrode film forming jig from the electrode film forming jig supply means and stopping it at a predetermined position;
Element mounting means for moving the plurality of piezoelectric vibration elements mounted on the electrode film forming jig transported by the second transport means to a predetermined position;
Laser means for irradiating a laser when a plurality of the piezoelectric vibration elements moved by the element mounting means pass, and for removing the Au electrode film of the connection electrode of the piezoelectric vibration element. The piezoelectric vibration element mounting apparatus characterized by the above-mentioned.

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