JP5219056B1 - Taping unit and electronic component inspection device - Google Patents

Abstract

The present invention reduces taping defects and efficiently removes, discharges, and refills electronic components.
A taping unit includes a transfer unit, an appearance inspection unit, and a holding unit. The transfer unit 10 transfers the electronic component D accommodated in the pocket U at the accommodation position P1 along the transfer path L. The appearance inspection unit 20 is disposed at an inspection position P2 on the downstream side in the transfer direction from the housing position P1, and inspects the electronic component D to be transferred. The holding unit 30 moves linearly between the accommodation position P1 above the transfer path L and the inspection position P2. The holding unit 30 removes the electronic component D from the pocket U located at the inspection position P <b> 2 according to the inspection result of the appearance inspection unit 20. Further, the electronic component D is taken out and held from the pocket U located at the accommodation position P1, and the taken-out electronic component D is accommodated in the pocket U located at the inspection position P2.
[Selection] Figure 2

Description

  The present invention relates to a taping unit that accommodates an electronic component in a carrier tape, performs an appearance inspection to remove defective products, and refills non-defective products, and an electronic component inspection apparatus including the taping unit.

  Electronic components such as semiconductor elements are separated into individual pieces through various assembly processes such as dicing, mounting, bonding, and sealing, and then various processes such as inspection are performed. This process is generally performed by an electronic component inspection apparatus called a test handler. In this method, the main table is rotated, the electronic components of the transport unit are held by a holding unit such as a suction nozzle, and transported to each inspection apparatus for inspection. The electronic component that has been inspected is accommodated in the pocket U of the carrier tape in the taping unit.

  The carrier tape containing the electronic components is taken up by a take-up motor, but before that, an appearance inspection is performed. The appearance inspection is for detecting defects such as an electronic component not stored in the pocket in the correct direction, a scratch on the stored electronic component, or an empty pocket. As an inspection method, the carrier tape is intermittently transferred using a sprocket, and a camera for imaging the electronic component is arranged on the transfer path to image the electronic component. When a defect is detected from the captured image of the camera, the electronic component is removed from the pocket using a removing means such as a suction nozzle. Then, the carrier tape is transported in the direction opposite to the transport direction, and the empty pocket U is returned to the electronic component housing position to accommodate a new electronic component (see, for example, Patent Document 1).

International Publication No. WO2010 / 089275

  The carrier tape is transported by the sprocket protrusion rotating through the sprocket hole provided in the carrier tape. Here, if there is a gap between the hole and the protrusion, the movement in the reverse direction may cause backlash, and the position of the pocket may deviate from the electronic component to be accommodated. Therefore, especially in the case of small electronic components, in order to prevent such rattling, a mechanism for adjusting the hole and the protrusion so that there is no gap, or a mechanism for moving the taping unit itself when transporting in the reverse direction is required. It may become. Further, when the carrier tape is transported in the reverse direction, the carrier tape may be entangled and malfunction of the taping unit may occur.

  Furthermore, when the inspection position is away from the storage position, the transfer distance in the reverse direction becomes long. If this happens, the carrier tape that already contains the electronic components may return to the position of the sprocket and face down, causing the contents of the electronic components to fall off.

  Therefore, by arranging a plurality of prisms in the vicinity of the storage position and directly above the transfer path under the camera, the image of the electronic component is guided to the camera via these prisms, so that the storage position and the appearance inspection position are brought close to each other. Thus, it is conceivable to minimize the transfer distance of the carrier tape in the reverse direction.

  However, this method still requires a reverse transfer of the taping unit. Furthermore, an illumination device that irradiates the electronic component is required for imaging the electronic component. However, since a prism is disposed immediately above the transfer path, a sufficient space cannot be obtained, and the illumination device is also downsized. As a result, a sufficient amount of light cannot be ensured, and there is a problem that precise visual inspection becomes difficult. For example, it may be difficult to inspect the appearance of a shadowed portion, or the crack may not be determined by image processing.

  The present invention has been proposed to solve the above-described problems. In the appearance inspection of the taping unit, removal of defective parts and refilling of non-defective products according to the inspection results are performed in the reverse direction of the carrier tape. An object of the present invention is to provide a highly reliable taping unit and electronic component inspection apparatus that reduce the possibility of occurrence of a taping failure by carrying out without transferring.

A taping unit according to the present invention accommodates an electronic component on a carrier tape in which a plurality of accommodating portions are arranged in the longitudinal direction and transports it on a transport path, and includes the following.
(A) A transfer unit for transferring a carrier tape containing electronic components in a storage unit located at a storage position on the transfer path along the transfer path. (B) A transfer unit disposed at an inspection position downstream in the transfer direction from the storage position. Appearance inspection unit that inspects the electronic components transferred to the inspection position by the unit (c) Moves linearly between the storage position and the inspection position above the transfer path, and according to the inspection result of the appearance inspection unit The electronic component is removed from the housing portion located at the inspection position and discharged, the electronic component is taken out from the housing portion located at the housing position and held, and the electronic component held in the housing portion located at the inspection position is housed. Holding part

In addition , a discharge position is provided between the storage position and the inspection position, and the holding unit from which the electronic component has been removed from the storage part positioned at the inspection position moves to this discharge position, and the electronic component is discharged .

  According to one aspect of the present invention, the appearance inspection unit includes an imaging device that is provided above the inspection position transfer path and images an electronic component that has been transferred to the inspection position, and a transfer path that is spaced apart from the imaging apparatus in the vertical direction. And an illuminating device that irradiates an electronic component that is arranged immediately above and transferred to the inspection position. The illumination device is provided with an opening that communicates the transfer path and the upper portion of the transfer path, and the holding unit descends from between the imaging device and the illumination device toward the transfer path via the opening, and the electron located at the inspection position Remove the part from the housing.

  According to one aspect of the present invention, the lighting device may be one in which a plurality of LEDs are arranged in an annular shape so as to surround the transfer path.

  According to one aspect of the present invention, the holding unit includes a holding mechanism that holds the electronic component and a drive unit that drives the holding mechanism. The holding mechanism may be provided with a biasing member that biases the holding mechanism upward when contacting the electronic component.

  According to one aspect of the present invention, a standby position where the holding unit waits during transfer of the electronic component may be provided between the storage position and the inspection position.

  Furthermore, an electronic component inspection apparatus including the taping unit is also an aspect of the present invention.

  According to the present invention, by using the holding portion that moves linearly above the transfer path, it is possible to efficiently remove, discharge, and refill electronic components, and further transfer the carrier tape in the reverse direction. It is possible to provide a highly reliable taping unit and electronic component inspection apparatus in which taping defects due to the above are reduced.

It is a figure which shows the structure of the taping unit which concerns on the 1st Embodiment of this invention. It is a schematic diagram which shows the structure of the taping unit which concerns on the 1st Embodiment of this invention. The structure of the illuminating device concerning the 1st Embodiment of this invention is shown, (a) is a perspective view, (b) is longitudinal direction sectional drawing. It is a flowchart which shows the effect | action of a taping unit. It is a schematic diagram which shows the effect | action of the taping unit corresponding to step S01 of FIG. (A) shows the state of a main table, (b) shows the state of the taping unit seen from the front. It is a schematic diagram which shows the effect | action of the taping unit corresponding to step S02 to S03 of FIG. (A) shows the state of a main table, (b) shows the state of the taping unit seen from the front. It is a schematic diagram which shows the effect | action of the taping unit corresponding to step S05 of FIG. (A) shows the state of a main table, (b) shows the state of the taping unit seen from the front. It is a schematic diagram which shows the effect | action of the taping unit corresponding to step S06 of FIG. (A) shows the state of a main table, (b) shows the state of the taping unit seen from the front. It is a schematic diagram which shows the effect | action of the taping unit corresponding to step S07 of FIG. (A) shows the state of a main table, (b) shows the state of the taping unit seen from the front. It is a schematic diagram which shows the effect | action of the taping unit corresponding to step S08 of FIG. (A) shows the state of a main table, (b) shows the state of the taping unit seen from the front. It is a schematic diagram which shows the effect | action of the taping unit corresponding to step S09 of FIG. (A) shows the state of a main table, (b) shows the state of the taping unit seen from the front. It is a figure which shows the example of application to the electronic component inspection apparatus of the taping unit which concerns on embodiment of this invention. (A) is a top view of an electronic component inspection apparatus, and (b) is a side view thereof.

  Hereinafter, embodiments of a taping unit and an electronic component inspection apparatus according to embodiments of the present invention will be described in detail with reference to the drawings.

(First embodiment)
(Constitution)
The overall configuration of the taping unit 1 of the present embodiment will be described with reference to FIGS. 1 and 2. In the schematic diagram of FIG. 2, a part of the configuration is simplified and enlarged for easy understanding.

  The taping unit 1 is a unit that performs one of various process processes in the electronic component inspection apparatus. In the taping unit 1, the electronic component D that has undergone various inspection processes is accommodated in the carrier tape T, transferred on the transfer path L, and packed. The electronic component D is conveyed to the taping unit 1 by the suction nozzle 111 of the conveying means provided on the main table of the electronic component inspection apparatus, and is accommodated in the carrier tape T. The electronic component D is a component used for an electrical product, and includes a semiconductor element. Examples of the semiconductor element include a transistor and an integrated circuit. Further, electronic components other than semiconductors include chip capacitors, chip resistors, inductors, filters, and isolators. The carrier tape T is obtained by embossing the tape to provide pockets U, and a plurality of pockets U that serve as receiving portions for the electronic components D are arranged in the longitudinal direction.

  The taping unit 1 roughly includes a transfer unit 10, an appearance inspection unit 20, and a holding unit 30. The transfer unit 10 transfers the electronic component D accommodated in the pocket U at the accommodation position P1 along the transfer path L. The appearance inspection unit 20 is disposed at an inspection position P2 on the downstream side in the transfer direction from the housing position P1, and inspects the electronic component D to be transferred. The holding unit 30 moves linearly between the accommodation position P1 above the transfer path L and the inspection position P2. The holding unit 30 removes the electronic component D from the pocket U located at the inspection position P <b> 2 according to the inspection result of the appearance inspection unit 20. Further, the electronic component D is taken out and held from the pocket U located at the accommodation position P1, and the taken-out electronic component D is accommodated in the pocket U located at the inspection position P2.

Hereinafter, each configuration will be described in detail.
The transfer unit 10 includes a guide rail 11 provided on the main body 1 a of the taping unit 1, a sprocket 12 provided at an end of the main body 1 a, and a motor (not shown) that drives the sprocket 12.

  The guide rail 11 extends on the main body 1a in the apparatus longitudinal direction. The carrier tape T is pulled out from a storage portion (not shown) and guided to the guide rail 11 via the sprocket 12. For example, the sprocket 12 has a rotation shaft of a motor inserted through a central portion thereof, and rotates by driving of the motor. Projections are provided on the circumferential surface of the sprocket 12 at equal intervals. The carrier tape T is provided with a sprocket hole (not shown). When the sprocket 12 is rotated, the protrusion penetrates the sprocket hole of the carrier tape T and moves the carrier tape T along the guide rail 11.

  In the present embodiment, the “transfer path L” means a path formed on the guide rail 11 and transported by the electronic component D realized by the movement of the carrier tape T by the sprocket 12. Further, the “transfer direction” means a direction in which the carrier tape T is unwound by the sprocket 12, that is, a direction in which the electronic component D travels on the guide rail 11 toward a winding motor (not shown).

  The transfer unit 10 transfers the electronic component D accommodated in the pocket U of the carrier tape T along the transfer path L in the transfer direction. An accommodation position P1 for the electronic component D is provided on the upstream side of the transfer path L in the transfer direction. At this storage position P1, the suction nozzle 111 of the electronic component inspection apparatus stops, and the electronic component D sucked at the tip is detached and stored in the pocket U of the carrier tape T positioned at the storage position P1.

  On the other hand, an inspection position P2 that is a position for performing an appearance inspection of the electronic component D is provided on the downstream side in the transfer direction from the accommodation position P1 of the transfer path L. The transfer unit 10 transfers the electronic component D stored in the pocket U at the storage position P1 to the inspection position P2. An appearance inspection unit 20 is disposed at the inspection position P2.

  The appearance inspection unit 20 is provided above the transfer path L of the inspection position P2 and images the electronic component D transferred to the inspection position P2, and immediately above the transfer path L with an interval in the vertical direction from the imaging apparatus 21. And an illuminating device 22 that illuminates the electronic component D transferred to the inspection position P2.

  The imaging device 21 includes a camera body 21a disposed above the transfer path L, and a lens 21b extending downward from the camera body 21a. The lens 21b faces the pocket U located at the inspection position P2. Moreover, in order to further reinforce the illumination by the illumination device 22 at the tip of the lens 21b, a lens tip illumination 21c may be attached. A stand 24 stands on the side of the guide rail 11 from the main body 1 a, and the imaging device 21 is supported by a bracket 23 attached to the tip of the stand 24.

  The illumination device 22 is a ring-type illumination that is placed directly on the guide rail 11. As shown in FIG. 3, in this ring-type illumination, a plurality of bullet-type LEDs 22a are arranged in an annular shape and arranged in multiple stages in the height direction, and surround the electronic component D located at the inspection position P2. Yes. In the center of the illuminating device 22, an opening 22 b that communicates the transfer path L and the upper side of the transfer path L is provided. The image of the electronic component D on the transfer path L reaches the imaging device 21 above the transfer path L through the opening 22b.

  As shown in FIG. 2, the imaging device 21 is connected to the defect detection unit 40. An image captured by the camera is transmitted to the defect detection unit 40. The defect detection unit 40 determines whether or not the electronic component D is defective from the captured image, and transmits a defect detection signal to a control device (not shown) when a defect is detected. The term “defective” is not only when the appearance of the electronic component is flawed, but also when the electronic component is not accommodated in the pocket U1 in the correct direction or position, or when the front and back are not accommodated in the correct orientation. Including.

  The holding unit 30 includes a chuck 31 as a holding mechanism that holds the electronic component D, and a driving unit 32 that supports the chuck 31 and moves it in the transfer direction and the direction opposite to the transfer direction, and further moves in the vertical direction.

  As the chuck 31, for example, a vacuum suction mechanism can be used. The chuck 31 sucks and holds the electronic component D at the tip portion when a vacuum is generated, and separates it by a vacuum break. A spring (not shown) is incorporated in the chuck 31 and acts as a biasing member that biases the entire chuck 31 upward when the tip portion of the chuck 31 contacts the electronic component D. Thereby, the impact given to the electronic component D is relieved. Further, the chuck 31 is provided with a lower limit position adjusting mechanism (not shown), and the lower limit position at which the chuck 31 descends is adjusted in accordance with the difference in thickness of the electronic component D. The lower limit position adjusting mechanism can be configured by, for example, a stopper bolt or a micrometer and a nut.

  The drive unit 32 uses a pneumatic or hydraulic cylinder mechanism connected to the chuck 31. Other drive sources can be used as the drive unit 32. For example, a motor device other than the cylinder device can be used.

  The drive unit 32 is driven according to the inspection result of the appearance inspection unit 20 to move the holding unit 30 linearly between the accommodation position P1 and the inspection position P2 above the transfer path L. The holding unit 30 stops at the accommodation position P1 and the inspection position P2 and further moves in the vertical direction, and the chuck 31 holds and holds the electronic component D by suction.

  A standby position P3 is provided between the storage position P1 and the inspection position P2, but the chuck 31 stops at this standby position P3 and waits when the carrier tape T is transferred.

  The overall size of the holding unit 30 is such that when it moves to the inspection position P2, it enters the space between the imaging device 21 and the illumination device 22 and does not interfere with these devices. Further, the chuck 31 has at least a size that allows the tip portion to enter the opening portion 22b of the lighting device 22, and has a length such that the tip portion contacts the electronic component D in a state where the tip portion enters the opening portion 22b.

  A discharge bin 50 is further provided at the standby position P3. The discharge bin 50 is disposed under the holding unit 30 stopped at the standby position P3, and the electronic component D detached from the holding unit 30 is accommodated in the discharge bin 50. That is, the standby position P3 is also a discharge position of the electronic component D. The discharge bin 50 may discharge the defective electronic component D by dropping its own weight, or may reliably discharge the defective electronic component D by vacuum suction. A sensor (not shown) for detecting whether or not the chuck 31 is holding the electronic component D is further attached to the standby position P3.

  The transfer unit 10, the appearance inspection unit 20, the holding unit 30, the defect detection unit 40, and the sensor are each connected to a control device (not shown). The control device controls the transfer speed and stop / drive timing of the transfer unit 10 and the holding unit 30, and controls the imaging timing of the imaging device 21 of the appearance inspection unit 20. Further, the holding unit 30 is driven based on the defect detection signal transmitted from the defect detection unit 40.

(Function)
The operation of the taping unit 1 of the present embodiment will be described along the flowchart of FIG. The operation of the taping unit 1 in each step will be described with reference to FIGS. 5 to 11 in association with the operation of the main table of the electronic component inspection apparatus.

(Step S01)
As shown in FIG. 5, the main table M of the electronic component inspection apparatus turns, and the electronic component D1 held by the suction nozzle 111 of the conveying means provided on the outer periphery is conveyed to the accommodation position P1 of the taping unit 1. . The electronic component D1 is separated from the suction nozzle 111 by vacuum break and is accommodated in the pocket U1 of the carrier tape T located at the accommodating position P1. At this time, the holding unit 30 is located at the standby position P3 between the accommodation position P1 and the inspection position P2.

(Step S02)
As shown in FIG. 6, the sprocket 12 of the transfer unit 10 rotates and the carrier tape T advances in the transfer direction, and the pocket U1 that stores the electronic component D1 moves to the inspection position P2 downstream in the transfer direction at the storage position P1. .

(Step S03)
The appearance inspection unit 20 performs an appearance inspection on the electronic component D1 transferred to the inspection position P2. Specifically, the illumination of the illumination device 22 is irradiated to the electronic component D1. The image of the electronic component D <b> 1 reaches the imaging device 21 through the opening 22 b of the illumination device 22 and is captured by the imaging device 21. The imaging result is transmitted to the defect detection unit 40. The defect detection unit 40 detects defects such as the electronic component not being accommodated in the pocket U1 in the correct direction or position, the front and back not being accommodated in the correct orientation, or the appearance of the electronic component being scratched.

(Step S04)
In step S03, when the defect detection unit 40 does not detect a defect (step S03: No), the carrier tape T is further advanced in the transfer direction, and the electronic components accommodated in the adjacent pockets are sequentially transferred to the inspection position P2. Then, the appearance inspection unit 20 performs an appearance inspection.

(Step S05)
If any defect is detected in the electronic component D1 in step S03 (step S03: Yes), a defect detection signal is transmitted from the defect detection unit 40 to the control device. The control device stops the transfer of the carrier tape T and stops the rotation of the main table M. As shown in FIG. 7, the electronic component D2 is accommodated in the pocket U2 of the carrier tape T located at the accommodating position P1 at this time. Here, the holding unit 30 located at the standby position P3 moves to the inspection position P2, enters between the imaging device 21 and the illumination device 22, and stops.

(Step S06)
As shown in FIG. 8, the holding unit 30 stopped at the inspection position P <b> 2 descends toward the transfer path L through the opening 22 b of the illumination device 22. When the chuck 31 of the holding unit 30 comes into contact with the electronic component D1 accommodated in the pocket U1 at the inspection position P2, the chuck 31 holds the electronic component D1 by suction. With the electronic component D1 held, the holding unit 30 is raised, and the electronic component D1 is removed from the pocket U1.

(Step S07)
As shown in FIG. 9, the holding unit 30 moves in the direction opposite to the transfer direction while holding the removed electronic component D1, and stops at a standby position P3 provided between the storage position P1 and the inspection position P2. To do. Here, the chuck 31 separates the electronic component D1 by vacuum break. The electronic component D1 detached from the chuck 31 is discharged to a discharge bin 50 disposed under the holding unit 30. The sensor provided at the standby position P3 detects the presence or absence of the electronic component D1 at the tip of the chuck 31, and confirms whether the electronic component D1 has been correctly ejected.

(Step S08)
As shown in FIG. 10, the holding unit 30 that has ejected the electronic component D <b> 1 further moves in the direction opposite to the transfer direction and stops at the accommodation position P <b> 1. At this time, the main table M rotates by 1/2 pitch in the transport direction. Thereby, it is avoided that the conveying unit interferes with the holding unit 30 moved to the accommodation position P1. The holding unit 30 descends toward the transfer path L at the storage position P1. When the chuck 31 of the holding unit 30 comes into contact with the electronic component D2 accommodated in the pocket U2 at the accommodation position P1, the chuck 31 holds the electronic component D2. With the electronic component D2 held, the holding unit 30 is raised, and the electronic component D2 is taken out from the pocket U2.
(Step S09)

  As shown in FIG. 11, the holding unit 30 holding the electronic component D2 moves in the transfer direction and stops at the inspection position P2. Further, the main table M is rotated in the direction opposite to the 1/2 pitch conveyance direction, and the retracted suction nozzle 111 is returned to the original position. The holding unit 30 stopped at the inspection position P <b> 2 descends toward the transfer path L through the opening 22 b of the illumination device 22. When lowered to a predetermined position, the chuck 31 of the holding unit 30 releases the electronic component D2 by vacuum break. The electronic component D2 detached from the chuck 31 is accommodated in an empty pocket U1 located at the inspection position P2. In this way, the electronic component is refilled in the pocket U1 from which the defective electronic component D1 has been removed. After refilling, the holding unit 30 returns to the standby position P3.

  Then, it returns to step S03 again and the external appearance test | inspection of the electronic component D2 accommodated by the external appearance test | inspection part 20 is performed. If no defect is detected, the carrier tape T is advanced and the next part inspection is started. Further, the rotation of the main table M is restarted.

If a defect is detected in the refilled electronic component D2, the holding unit 30 is used again to remove the defective electronic component D2 and refill a new electronic component. At this time, it is necessary to store a new electronic component D in the pocket U2 at the storage position P1, but this may be performed by rotating the main table M by one pitch in the transport direction.
(effect)

  (1) The taping unit 1 of the present embodiment is provided with a holding unit 30 that moves linearly between the accommodation position P1 and the inspection position P2 above the transfer path L, and this holding unit 30 is the appearance inspection unit 20. The electronic component D1 is removed from the pocket U1 of the carrier tape T located at the inspection position P2 in accordance with the inspection result, and the electronic component D2 is taken out and held from the pocket U2 located at the accommodation position P1, and the pocket located at the inspection position P2. The electronic component D2 held in U1 is accommodated.

  As a result, it is not necessary to transfer the carrier tape T in the reverse direction for removing and refilling the electronic component D, and it is possible to reduce malfunctions caused by bounce and entrainment of the carrier tape T and dropping of the electronic component D. A highly reliable taping unit 1 can be provided. Moreover, since the holding | maintenance part 30 moves linearly, without removing the transfer path L, the removal and refilling of the electronic component D can be performed efficiently. As a result, it is possible to secure a large space for disposing the lighting device by separating the appearance inspection unit 20 from the housing position P1, and it is possible to perform an appearance inspection adapted to the types and sizes of various electronic components. A highly convenient taping unit can be provided.

  (2) The holding unit 30 discharges the electronic component removed at the inspection position P2 at a discharge position provided between the storage position P1 and the inspection position P2. Accordingly, there is no need to move the holding unit 30 to a position off the transfer path L for discharging the electronic components, and the removal, discharge, and refill operations are efficiently performed while maintaining the linear movement. be able to.

  (3) As the appearance inspection unit 20, the imaging device 21 is provided above the transfer path L at the inspection position P <b> 2, and the illumination device 22 is disposed directly above the transfer path L with a space from the imaging device 21. Further, the lighting device 22 is provided with an opening 22b that allows the transfer path L and the transfer path L to communicate with each other. And the holding | maintenance part 30 enters between the imaging device 21 and the illuminating device 22, falls toward the transfer path L via the opening part 22b, and removes the electronic component D located in the test | inspection position P2 from the pocket U. FIG.

  As described above, the imaging device 21 and the illumination device 22 are separated, and the illumination device 22 immediately above the transfer path L is provided with the opening 22b, so that the appearance for removing the electronic component D using the holding unit 30 is obtained. It is not necessary to retract the inspection unit 20, and the appearance inspection can be performed more efficiently. Further, since it is not necessary to provide a mechanism for retracting the appearance inspection unit 20, an increase in the size of the apparatus can be avoided. Furthermore, since illumination can be irradiated on the electronic component D directly above the transfer path L, a more accurate appearance inspection can be performed. On the other hand, since the illumination device 22 is provided with the opening 22b, the imaging device 21 provided above the transfer path L can image the electronic component D while being arranged immediately above the transfer path L.

  (4) The illumination device 22 uses a ring-type illumination in which a plurality of LEDs are arranged in an annular shape so as to surround the transfer path L. As a result, the central opening 22b can be secured and the transfer path L can be irradiated evenly to prevent the occurrence of shadows in the pocket U, so that an accurate inspection can be performed with a simple structure.

  (5) A standby position P3 where the holding unit 30 stands by during the transfer of the electronic component D is provided between the storage position P1 and the inspection position P2. Therefore, it is possible to move quickly to the accommodation position P1 and the inspection position P2 only by linear movement during the appearance inspection.

  (6) The chuck 31 that holds the electronic component D of the holding unit 30 is provided with a spring that urges the chuck 31 upward when contacting the electronic component D. Thereby, since the impact applied to the electronic component D when it contacts the electronic component D is alleviated, the quality of the electronic component D to be refilled can be kept good.

  (7) When the holding unit 30 takes out the electronic component D from the pocket U at the storage position P1, the suction nozzle 111 of the main table M located at the stop position where the taping unit 1 is provided is moved forward along the transport path. Or it moves in the reverse direction and retreats. As a result, the suction nozzle 111 does not interfere with the holding unit 30, and the holding unit 30 can be moved to the accommodation position P1 of the transfer path L, so that the electronic component D can be reliably taken out.

(Second Embodiment)
The application example to the electronic component inspection apparatus of the taping unit 1 shown in 1st Embodiment is shown. 12A is a top view of the electronic component inspection apparatus, and FIG. 12B is a side view of the electronic component inspection apparatus.

  The electronic component inspection apparatus 100 includes a transport mechanism and various process processing mechanisms. The transport mechanism includes a main table M. The center of the main table M is supported by the drive shaft of the direct drive motor 101 disposed below. The main table M rotates intermittently at a predetermined angle as the direct drive motor 101 is driven.

  A plurality of conveying means 110 for holding the electronic component D are attached to the outer peripheral end of the main table M at regular intervals along the outer periphery of the main table M. By rotating the main table M, the electronic component D is conveyed in the outer circumferential direction. The arrangement interval of the conveying means 110 is equal to the rotation angle of one pitch of the main table M.

  The transport unit 110 includes a suction nozzle 111 that sucks and detaches the electronic component D. The suction nozzle 111 is supported by a support portion 112 attached to the outer peripheral portion of the main table M so that the lower end protrudes from the lower surface of the main table M.

  A nozzle driving unit 113 is disposed at each stop position S of the conveying unit 110. The nozzle driving unit 113 is specifically a motor, and moves the operation rod 114 up and down. The operation rod 114 comes into contact with the head of the suction nozzle 111 and applies a pressing force to push the suction nozzle 111 downward.

  Such an electronic component inspection apparatus 100 includes a conveyance control unit (not shown), and sends electrical signals to the direct drive motor 101, the nozzle driving unit 113 that raises and lowers the suction nozzle 111, the vacuum generation device, and various process processing units. Thus, these operation timings are controlled. That is, the conveyance control unit includes a ROM, a CPU, and a driver that store a control program, and outputs an operation signal at each timing to each drive mechanism through an interface according to the control program. In addition, this conveyance control part may be the same as the control apparatus of the taping unit 1, or may be a separate control part capable of transmitting and receiving with the control apparatus.

  Various process processing mechanisms surround the main table M and are arranged at equal intervals in the outer circumferential direction. The arrangement interval is the same as or equal to an integral multiple of the rotation angle of one pitch of the main table M. As various process processing mechanisms, for example, the parts feeder 102, the marking unit 103, the appearance inspection unit 104, the test contact unit 105, the sorting / sorting unit 106, the attitude correction unit 107, and the taping unit 1 are sequentially arranged in the rotation direction of the main table M. Is placed.

  In the electronic component inspection apparatus 100 as described above, the accommodation position P1 of the taping unit 1 is at the stop position S of the transport unit 110. At the stop position S, the electronic component D detached from the suction nozzle 111 of the transport means 110 by vacuum breakage is accommodated in the pocket U located at the accommodation position P1. And as demonstrated in the above-mentioned embodiment, after inspecting the presence or absence of a defect in the test | inspection position P2, it is sent to a winding motor.

The main table M basically rotates at a rotation angle of 1 pitch, but the rotation angle can be adjusted as appropriate. For example, as described above, when the holding unit 30 of the taping unit 1 moves to the storage position P1, the main table is rotated in the forward or reverse direction by 1/2 pitch, so that the transport unit 110 is moved from the storage position P1. The interference can be avoided by retracting.
(Other embodiments)

  (1) In the above-described embodiment, the entire holding unit 30 is configured to move up and down. However, the chuck 31 that is a holding mechanism is configured to be extendable and retractable, and the electronic component D is taken out and accommodated by the expansion and contraction of the chuck 31. You may make it perform.

  (2) In the above-described embodiment, the chuck 31 that sucks and holds the electronic component D by the vacuum suction mechanism is used as the holding mechanism of the holding unit 30, but is not limited thereto. For example, a mechanical chuck mechanism, an electrostatic adsorption mechanism, or a Bernoulli chuck mechanism that sandwiches electronic components can be used.

  (3) In the above-described embodiment, the ring-type illumination in which the plurality of bullet-type LEDs 22a are arranged in an annular shape as a whole is used as the illumination device 22. However, the present invention is not limited to this. It is sufficient that the electronic component D on the transfer path L is irradiated with sufficient light and the holding mechanism can take out and accommodate the electronic component D without being interfered with the illumination device 22. For example, a rectangular or other polygonal illumination device, or a dome-type illumination device that rises from the base end and protrudes inward may be used. Alternatively, a plurality of illumination devices may be arranged around the inspection position P2 with a space. In this case, the “opening” may be a space that is formed between the plurality of lighting devices and communicates between the transfer path L and the upper side of the transfer path L.

  (4) In the above-described embodiment, the standby position P3 of the holding unit 30 and the discharge position of the electronic component D provided with the discharge bin 50 are the same position, but this is not limitative. As long as the holding part 30 moves linearly between the accommodation position P1 and the inspection position P2, it may be provided at different positions.

(5) The present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. In addition, various inventions can be formed by appropriately combining a plurality of components disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, constituent elements over different embodiments may be appropriately combined.

DESCRIPTION OF SYMBOLS 1 Taping unit 1a Main body part 10 Transfer part 11 Guide rail 12 Sprocket 20 Appearance inspection part 21 Imaging device 21a Camera main body 21b Lens 21c Lens front end illumination 22 Illumination device 22a Cannonball type LED
22b Opening 23 Bracket 24 Stand 30 Holding part 31 Chuck (holding mechanism)
32 drive unit 40 defect detection unit 50 discharge bin 100 electronic component inspection apparatus 101 direct drive motor 102 parts feeder 103 marking unit 104 appearance inspection unit 105 test contact unit 106 classification sort unit 107 posture correction unit 110 transport means 111 suction nozzle 112 support unit 113 Nozzle driving section 114 Operating rods D, D1, D2 Electronic parts L Transfer path M Main table P1 Storage position P2 Inspection position P3 Standby position / discharge position T Carrier tape S Stop position

Claims (8)

A taping unit that accommodates an electronic component in a carrier tape in which a plurality of accommodating portions are arranged in the longitudinal direction and moves on a transfer path,
A transfer section for transferring the carrier tape, in which electronic components are stored in a storage section located at a storage position on the transfer path, along the transfer path;
An appearance inspection unit that is arranged at an inspection position downstream of the housing position in the transfer direction and inspects an electronic component transferred to the inspection position by the transfer unit;
The upper part of the transfer path is moved linearly between the accommodation position and the inspection position, and electronic components are removed from the accommodation part located at the inspection position according to the inspection result of the appearance inspection part, A holding part for taking out and holding the electronic component from the receiving part located in the receiving position, and holding the electronic part held in the receiving part located in the inspection position ;
The holding unit removes an electronic component from the storage unit located at the inspection position, holds the electronic component, moves to a discharge position provided between the storage position and the inspection position, and features and to ruthenate over keeping unit to discharge the component discharge portion provided in the discharge position. The appearance inspection unit is provided above the transfer path of the inspection position and picks up an image of an electronic component transferred to the inspection position, and is disposed immediately above the transfer path with a space in the vertical direction from the imaging apparatus. An illumination device for irradiating the electronic component transferred to the inspection position,
The lighting device is provided with an opening that communicates the transfer path and the upper transfer path.
The holding unit descends toward the transfer path from between the imaging device and the illumination device through the opening of the illumination device, and removes the electronic component located at the inspection position from the housing unit. claim 1 Symbol placement of the taping unit, characterized. The taping unit according to claim 2 , wherein the lighting device has a plurality of LEDs arranged in an annular shape so as to surround the transfer path. The holding unit includes a holding mechanism that holds the electronic component and a drive unit that drives the holding mechanism, and the holding mechanism biases the holding mechanism upward when contacting the electronic component. The taping unit according to any one of claims 1 to 3 , wherein a member is provided. The taping according to any one of claims 1 to 4 , wherein a standby position where the holding unit waits during transfer of the electronic component is provided between the accommodation position and the inspection position. unit. An electronic component inspection apparatus that performs various process processes while conveying electronic components,
A transport path for various processes of the electronic component;
Transport means for holding the electronic component and intermittently moving along the transport path;
A taping unit that is provided at one of the stop positions of the transport means and that transports the electronic components transported by the transport means on a transport path by housing the electronic components in a carrier tape in which a plurality of housing portions are arranged in the longitudinal direction. And comprising
The conveying means accommodates the electronic component to be held in the accommodating portion located at the accommodating position on the transfer path of the taping unit at the stop position where the taping unit is provided,
The taping unit is
A transfer unit for transferring the electronic component stored in the storage unit by the transfer means along the transfer path;
An appearance inspection unit that is arranged at an inspection position downstream of the housing position in the transfer direction and inspects an electronic component transferred to the inspection position by the transfer unit;
It moves linearly between the accommodation position and the inspection position above the transfer path, and removes and discharges electronic components from the accommodation part located at the inspection position according to the inspection result of the appearance inspection part. And holding and holding the electronic component from the housing portion located at the housing position, and housing the electronic component held in the housing portion located at the inspection position ,
The holding unit removes an electronic component from the storage unit located at the inspection position, holds the electronic component, moves to a discharge position provided between the storage position and the inspection position, and electronic component inspecting apparatus electrostatic you characterized by discharging the component discharge portion provided in the discharge position. The appearance inspection unit is provided above the transfer path of the inspection position and picks up an image of an electronic component transferred to the inspection position, and is disposed immediately above the transfer path with a space in the vertical direction from the imaging apparatus. An illumination device for irradiating the electronic component transferred to the inspection position,
The lighting device is provided with an opening that communicates the transfer path and the upper transfer path.
The holding unit descends toward the transfer path from between the imaging device and the illumination device through the opening of the illumination device, and removes the electronic component located at the inspection position from the housing unit. electronic component testing apparatus according to claim 6 Symbol mounting features. When the holding unit takes out the electronic component from the storage unit positioned at the storage position, the transport unit positioned at the stop position where the taping unit is provided is moved in the forward direction or the reverse direction along the transport path. The electronic component inspection apparatus according to claim 6 , wherein the electronic component inspection apparatus is retracted.

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