JP5183838B2 - Light emitting device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a light emitting device including a pixel portion and a driving circuit for transmitting a signal to the pixel portion on the same insulator. Specifically, this technique is effective for an apparatus (hereinafter referred to as a light emitting device) having an element (hereinafter referred to as a light emitting element) in which a thin film made of a light emitting material is sandwiched between a pair of electrodes. An organic EL display and an organic light emitting diode (OLED) are included in the light emitting device of the present invention.
[0002]
In particular, the present invention relates to an apparatus (hereinafter referred to as EL element) having an element (hereinafter referred to as EL element) having a thin film (hereinafter referred to as EL film) made of a luminescent material capable of obtaining EL (Electro Luminescence) between an anode and a cathode. This technology is effective for light-emitting devices.
[0003]
Note that the luminescent materials that can be used in the present invention include all luminescent materials that emit light (phosphorescence and / or fluorescence) via singlet excitation, triplet excitation, or both excitation.
[0004]
The present invention can also be implemented in an apparatus (hereinafter referred to as a liquid crystal display device) having an element (hereinafter referred to as a liquid crystal element) in which a liquid crystal material is sandwiched between electrodes.
[0005]
[Prior art]
In recent years, active matrix EL light emitting devices have been developed. In the active matrix EL light emitting device, a thin film transistor (hereinafter referred to as TFT) is provided in each pixel provided in the pixel portion, and the amount of current flowing through the EL element is controlled by the TFT to control the light emission luminance of each pixel. Therefore, even if the number of pixels increases, a voltage can be uniformly supplied to each pixel, which is suitable for obtaining a high-definition image.
[0006]
An advantage of the active matrix EL light-emitting device is that a circuit such as a shift register, a latch, or a buffer can be formed using a TFT over the same insulator as a driver circuit that transmits a signal to the pixel portion. This makes it possible to manufacture a very small and lightweight EL light emitting device.
[0007]
However, the active matrix EL light-emitting device has a problem that the manufacturing cost increases when the TFT manufacturing process is complicated. In addition, since a plurality of TFTs are formed at the same time, it is difficult to secure a yield if the manufacturing process becomes complicated. In particular, when there is a malfunction in the drive circuit, there may be a linear defect in which one column of pixels does not operate.
[0008]
Here, FIGS. 18A and 18B illustrate a basic structure of an active matrix EL light-emitting device. In FIG. 18A, a TFT (hereinafter referred to as a current control TFT) 1802 for controlling a current flowing through an EL element is formed over a substrate 1801, and an anode 1803 is connected to the current control TFT 1802. An organic EL film (a thin film made of a light-emitting organic material from which EL can be obtained) 1804 and a cathode 1805 are formed on the anode 1803, and an EL element 1806 made up of the anode 1803, the organic EL film 1804 and the cathode 1805 is formed. ing.
[0009]
At this time, the light generated by the organic EL film 1804 passes through the anode 1803 and is emitted in the direction of the arrow in the figure. Therefore, the current control TFT 1802 becomes a shielding object that blocks light emission when viewed from the observer, and is a factor for narrowing the effective light emission area (area where the observer can observe light emission). In addition, when the effective light emitting area is narrow, it is necessary to increase the light emission luminance in order to obtain a bright image. However, raising the light emission luminance increases the driving voltage of the organic EL film, and there is a concern that the deterioration may be accelerated. It was.
[0010]
Accordingly, an active matrix EL light emitting device having a structure as shown in FIG. 18B has been proposed. In FIG. 18B, a current control TFT 1807 is formed over a substrate 1801, and a cathode 1808 is connected to the current control TFT 1807. An organic EL film 1809 and an anode 1810 are formed on the cathode 1808, and an EL element 1811 including the cathode 1808, the organic EL film 1809 and the anode 1810 is formed. That is, an EL element 1811 having a structure opposite to that of the EL element 1806 shown in FIG.
[0011]
At this time, most of the light generated in the organic EL film 1809 that has traveled toward the cathode 1808 is reflected by the cathode 1808, passes through the anode 1810, and is emitted in the direction of the arrow in the figure. Accordingly, the entire region where the cathode 1808 is provided can be used as an effective light emitting region, and an active matrix EL light emitting device with high light extraction efficiency can be obtained. Further, there is an advantage that even if the driving voltage is low, a high emission luminance can be obtained and a bright image can be obtained.
[0012]
[Problems to be solved by the invention]
An object of the present invention is to suppress the manufacturing cost of a light-emitting device with high light extraction efficiency, and to provide a light-emitting device with high image quality and low cost. It is another object of the present invention to provide an inexpensive electric appliance having a display portion with high image quality using the light-emitting device of the present invention for the display portion.
[0013]
[Means for Solving the Problems]
The present inventors considered that it is desirable to use an n-channel TFT as the current control TFT when manufacturing an EL light-emitting device with high light extraction efficiency as shown in FIG. The reason will be described with reference to FIG.
[0014]
FIG. 19A shows an example in which a p-channel TFT is used as a current control TFT with respect to the structure of FIG. At this time, the source of the current control TFT 1901 is connected to the current supply line 1902 and the drain is connected to the cathode of the EL element 1903. In this structure, the potential of the current supply line 1902 is V _L (The potential of the low level, which is equal to the ground potential here), and the potential of the anode of the EL element 1903 is V _H (High level potential. Here, 5 to 10 V).
[0015]
Further, the potential of the gate of the current control TFT 1901 is set to V _G And the source potential is V _S And the drain potential is V _D And At this time, the gate voltage applied to the current control TFT 1901 is V _G -V _S The voltage applied between the source and drain is V _D -V _S The source voltage is V _S -V _L The drain voltage is V _D -V _L It is represented by Also, V _S Is the potential of the cathode of the EL element 1903. When the gate of the current control TFT 1901 is opened, the potential V of the current supply line 1902 is _L Get closer to. Also, the drain potential V _D Is the potential V of the current supply line 1902 _L be equivalent to.
[0016]
However, in the case of the structure of FIG. 19A, when the current control TFT 1901 is opened, the potential V _S Changes (V _L Gate voltage (V _G -V _S ) And the voltage (V _D -V _S ) Itself will change. As a result, the amount of current flowing through the current control TFT 1901 is V _S This causes a problem that a stable current cannot be supplied to the EL element 1903.
[0017]
On the other hand, FIG. 19B shows an example in which the current control TFT is an n-channel TFT in the structure of FIG. In this case, the potential V of the source of the current control TFT 1904 _S Is always the potential V of the current supply line 1902 _L Is equal to the gate voltage (V _G -V _S ) And the voltage (V _D -V _S ) Will not change. Accordingly, a stable current can be supplied to the EL element 1903.
[0018]
As described above, in the case of a pixel having a structure in which the cathode of the EL element is connected to the drain of the current control TFT, it has been recognized that it is desirable to use an n-channel TFT as the current control TFT.
[0019]
Therefore, the present invention is characterized in that all semiconductor elements (typically thin film transistors) are n-channel semiconductor elements in order to reduce the manufacturing cost of an active matrix light-emitting device. As a result, the manufacturing process of the p-channel type semiconductor element is reduced, so that the manufacturing process of the light emitting device can be simplified and the manufacturing cost can be reduced.
[0020]
Another feature is that a driver circuit is formed using only n-channel semiconductor elements. That is, a general driving circuit is designed based on a CMOS circuit in which an n-channel semiconductor element and a p-channel semiconductor element are complementarily combined. In the present invention, only an n-channel semiconductor element is combined. Another feature is that a drive circuit is formed.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
In an embodiment of the present invention, FIG. 1 shows an active matrix EL light-emitting device in which a pixel portion and a driver circuit for transmitting a signal to the pixel portion are formed over the same insulator.
[0022]
In FIG. 1, an insulating film 12 serving as a base is provided on a substrate 11, on which a TFT 201 serving as a switching element (hereinafter referred to as a switching TFT) and a TFT serving as a current control element (hereinafter referred to as a current control TFT). ) 202, an n-channel TFT 203 and an n-channel TFT 204 are provided. Here, a switching TFT 201 and a current control TFT 202 are shown as examples of TFTs provided in the pixel portion, and an n-channel TFT 203 and an n-channel TFT 204 are shown as examples of inverter circuits provided in the driver circuit.
[0023]
The present invention is a particularly effective technique when a plastic substrate (including a plastic film) is used as the substrate 11. In forming TFTs on plastic substrates, p-channel TFTs have not been able to obtain good electrical characteristics at present. Therefore, the present invention in which all TFTs are formed of n-channel TFTs is a particularly effective technique for manufacturing an active matrix EL light-emitting device using a plastic substrate.
[0024]
First, the pixel portion will be described. The switching TFT 201 is an n-channel TFT, and includes an active layer including a source region 13, a separation region (impurity region existing between channel formation regions) 14, a separation region 15, a drain region 16, and channel formation regions 17 to 19, and gate insulation. A film 20, gate electrodes 21 a to 21 c, an inorganic insulating film 22, an organic insulating film 23, a source wiring 24 and a drain wiring 25 are included. The switching TFT 201 is a switching element for controlling the gate voltage of the current control TFT.
[0025]
The inorganic insulating film 22 is a silicon nitride film or a silicon nitride oxide film (expressed by SiOxNy), and the organic insulating film 23 is a resin film (polyimide film, acrylic resin film, polyamide film, or benzocyclobutene film). . Metal particles or carbon particles may be dispersed in the organic insulating film 23. In that case, the specific resistance is 1 × 10 ⁸ ~ 1x10 ^Ten Generation of static electricity can be suppressed by adjusting the content of metal particles or carbon particles so as to be Ωm.
[0026]
The source wiring 24 and the drain wiring 25 are preferably formed using a metal film containing an element belonging to Group 1 or Group 2 of the periodic table (preferably cesium, magnesium, lithium, calcium, potassium, barium, or beryllium). The metal film is preferably an aluminum film, a copper thin film or a silver thin film. In addition, a bismuth film can also be used.
[0027]
Next, the current control TFT 202 is an n-channel TFT, and includes an active layer including a source region 26, a drain region 27, and a channel formation region 28, a gate insulating film 20, a gate electrode 29, an inorganic insulating film 22, an organic insulating film 23, A source line 30 and a pixel electrode 31 are included. At this time, the drain wiring 25 of the switching TFT 201 is connected to the gate electrode 29 of the current control TFT 202. Further, the pixel electrode 31 connected to the drain region 27 of the current control TFT 202 functions as a cathode of the EL element 40.
[0028]
Note that the pixel electrode 31 is preferably a metal film containing an element belonging to Group 1 or Group 2 of the periodic table (preferably cesium, magnesium, lithium, calcium, potassium, barium, or beryllium). The metal film is preferably an aluminum film, a copper thin film or a silver thin film. In addition, a bismuth film can also be used.
[0029]
Of course, since the source wiring 24 and the drain wiring 25 of the switching TFT 201 and the source wiring 30 of the current control TFT 202 are formed simultaneously with the pixel electrode 31, they are formed of the same material as the pixel electrode 31.
[0030]
Reference numeral 32 denotes a bank made of a resin film (polyimide film, acrylic resin film, polyamide film or benzocyclobutene film) in which metal particles or carbon particles are dispersed, and has a specific resistance of 1 × 10. ⁸ ~ 1x10 ^Ten It contains metal particles or carbon particles so as to have Ωm. Such a specific resistance can suppress electrostatic breakdown of the TFT during film formation. Reference numeral 33 denotes a thin film including an organic EL film, and reference numeral 34 denotes an anode of the EL element 40 (typically an electrode made of an oxide conductive film).
[0031]
Further, a passivation film 36 is provided so as to cover the EL element 40 including the pixel electrode (cathode) 31, the thin film 33 including the organic EL film, and the anode 34. As the passivation film 36, a silicon nitride film, a silicon nitride oxide film, a carbon film (preferably a diamond-like carbon film), an aluminum oxide film, or a tantalum oxide film can be used. These may be laminated.
[0032]
Here, FIG. 2 shows a circuit configuration of one pixel in the pixel portion. In FIG. 2A, 205 is a gate wiring for applying a gate voltage to the gate electrodes 21a to 21c of the switching TFT 201, and 206 is a current supply line for supplying a current flowing through the EL element 40. A capacitor 207 is provided to hold a gate voltage applied to the gate electrode 29 of the current control TFT 202. In this case, the source wiring 30 of the current control TFT 202 is connected to a low level potential (V _L ) And the anode 34 of the EL element has a high level potential (V _H ).
[0033]
FIG. 2B illustrates another circuit configuration of one pixel. In the case of the circuit configuration shown in FIG. 2B, an EL element 208 is formed between the current supply line 206 and the current control TFT 202. In this case, the source wiring 30 of the current control TFT 202 is set to a high level potential (V _H ) And the anode 34 of the EL element has a low level potential (V _L ). At this time, the current supply line 206 functions as the anode 34 of the EL element.
[0034]
Here, an example in which two TFTs (switching TFT and current control TFT) are provided in one pixel is shown, but the number of TFTs is 3, 4, 5, 6, or more. Also good. That is, in addition to the switching TFT that switches the video signal input from the source wiring 24 and the current control TFT that controls the amount of current flowing in the EL element 40, it is possible to provide a TFT that controls other signals.
[0035]
Next, the drive circuit will be described with reference to FIG. The n-channel TFT 203 includes an active layer including a source region 41, a drain region 42, and a channel formation region 43, a gate insulating film 20, a gate electrode 44, an inorganic insulating film 22, an organic insulating film 23, a source wiring 45, and a drain wiring 46. Including.
[0036]
The n-channel TFT 204 includes an active layer including a source region 47, a drain region 48, and a channel formation region 49, a gate insulating film 20, a gate electrode 50, an inorganic insulating film 22, an organic insulating film 23, a source wiring 51, and an n-channel. A drain wiring 46 common to the type TFT 203 is included.
[0037]
Note that the source wiring 45, the drain wiring (wiring common to the n-channel TFT 204) 46 of the n-channel TFT 203, and the source wiring 51 of the n-channel TFT 204 are formed of the same material as the pixel electrode 31.
[0038]
Note that all of the TFTs shown in this embodiment are enhancement type n-channel TFTs (hereinafter referred to as E-type NTFTs), but either the n-channel TFT 203 or the n-channel TFT 204 is a depletion type. You can also In that case, an enhancement type and a depletion type can be obtained by adding an element belonging to Group 15 of the periodic table (preferably phosphorus) or an element belonging to Group 13 of the periodic table (preferably boron) to the semiconductor forming the channel formation region. Can be made separately.
[0039]
In addition, when an n-channel TFT 203 and an n-channel TFT 204 are combined to form an NMOS circuit, an enhancement type TFT is formed (hereinafter referred to as an EEMOS circuit), and an enhancement type and a depletion type are combined. There are cases (hereinafter referred to as EDMOS circuits).
[0040]
Here, an example of an EEMOS circuit is shown in FIG. 3A, and an example of an EDMOS circuit is shown in FIG. In FIG. 3A, 301 and 302 are both E-type NTFTs. In FIG. 3B, reference numeral 303 denotes an E-type NTFT, and 304 denotes a depletion-type n-channel TFT (hereinafter referred to as a D-type NTFT).
[0041]
In FIGS. 3A and 3B, V _DH Is a power supply line to which a positive voltage is applied (positive power supply line), and V _DL Is a power supply line (negative power supply line) to which a negative voltage is applied. The negative power source line may be a ground potential power source line (ground power source line).
[0042]
Further, FIG. 4 shows an example in which a shift register is manufactured using the EEMOS circuit shown in FIG. 3A or the EDMOS circuit shown in FIG. In FIG. 4, reference numerals 400 and 401 denote flip-flop circuits. Reference numerals 402 and 403 denote E-type NTFTs. A clock signal (CL) is input to the gate of the E-type NTFT 402, and a clock signal (CL bar) with an inverted polarity is input to the gate of the E-type NTFT 403. Reference numeral 404 denotes an inverter circuit. As shown in FIG. 4B, the EEMOS circuit shown in FIG. 3A or the EDMOS circuit shown in FIG. 3B is used.
[0043]
In the embodiment of the present invention, since all TFTs are n-channel TFTs, the process of forming p-channel TFTs is reduced, so that the manufacturing process of the EL light-emitting device can be simplified. Accordingly, the yield of the manufacturing process is improved, and the manufacturing cost of the EL light emitting device can be reduced.
[0044]
【Example】
[Example 1]
In this embodiment, a method for manufacturing a pixel portion and a driver circuit provided therearound on the same insulator will be described. However, for the sake of simplicity, an NMOS circuit in which an n-channel TFT is combined is shown in the drawing for the drive circuit.
[0045]
First, as shown in FIG. 5A, an insulator 501 made of plastic is prepared. In this embodiment, as the insulator 501 made of plastic, an insulator in which protective films (carbon films, specifically diamond-like carbon films) 501b and 501c are coated on both surfaces (front and back surfaces) of a plastic substrate 501a is prepared. Of course, it is good also as a structure which provided the protective film in the single side | surface (front surface or back surface).
[0046]
Next, a base film 502 is formed to a thickness of 300 nm on the insulator 501. In this embodiment, a silicon nitride oxide film is stacked as the base film 502 by a sputtering method. At this time, the nitrogen concentration of the layer in contact with the insulator 501 is preferably 10 to 25 wt%, and nitrogen is preferably contained higher than the other layers.
[0047]
Next, an amorphous semiconductor film (not shown) having a thickness of 50 nm is formed on the base film 502 by sputtering. Since the insulator 501 is plastic, the deposition temperature preferably does not exceed 200 ° C. (preferably 150 ° C.).
[0048]
Note that the semiconductor film is not limited to an amorphous semiconductor film, and any semiconductor film including an amorphous structure (including a microcrystalline semiconductor film) may be used. As the amorphous semiconductor film, an amorphous silicon or amorphous silicon germanium film can be used. The film thickness may be 20 to 100 nm.
[0049]
Then, the amorphous silicon film is crystallized using a known laser crystallization method to form a crystalline semiconductor film 503. In this embodiment, a solid laser (specifically, a second harmonic of an Nd: YAG laser) is used, but an excimer laser may be used. As the crystallization method, any means may be used as long as the heat resistance of the insulator 501 made of plastic allows.
[0050]
Next, as illustrated in FIG. 5B, the crystalline semiconductor film 503 is etched by a first photolithography process to form island-shaped semiconductor films 504 to 507. These are semiconductor films that later become active layers of the TFT.
[0051]
In this embodiment, a crystalline semiconductor film is used as an active layer of a TFT, but an amorphous semiconductor film can also be used as an active layer.
[0052]
In this embodiment, a protective film (not shown) made of a silicon oxide film is formed on the semiconductor films 504 to 507 by a sputtering method to a thickness of 130 nm, and an impurity element (hereinafter, referred to as a p-type semiconductor) is used. (referred to as a p-type impurity element) is added to the semiconductor films 504 to 507. As the p-type impurity element, an element belonging to Group 13 of the periodic table (typically boron or gallium) can be used. This protective film is provided in order to prevent the crystalline silicon film from being directly exposed to plasma when impurities are added and to enable fine concentration control.
[0053]
The concentration of the p-type impurity element added at this time is 1 × 10 ¹⁵ ~ 5x10 ¹⁷ atoms / cm ^Three (Typically 1x10 ¹⁶ ~ 1x10 ¹⁷ atoms / cm ^Three ). The p-type impurity element added at this concentration is used to adjust the threshold voltage of the n-channel TFT.
[0054]
Next, the surfaces of the semiconductor films 504 to 507 are cleaned. First, the surface is cleaned using pure water containing ozone. At that time, since a thin oxide film is formed on the surface, the thin oxide film is further removed using a hydrofluoric acid aqueous solution diluted to 1%. By this treatment, contaminants attached to the surfaces of the semiconductor films 504 to 507 can be removed. At this time, the concentration of ozone is preferably 6 mg / L or more. These series of processes are performed without opening to the atmosphere.
[0055]
Then, a gate insulating film 508 is formed by a sputtering method so as to cover the semiconductor films 504 to 507. As the gate insulating film 508, an insulating film containing silicon with a thickness of 10 to 200 nm, preferably 50 to 150 nm may be used. This may be a single layer structure or a laminated structure. In this embodiment, a silicon nitride oxide film having a thickness of 115 nm is used.
[0056]
In this embodiment, the process from the surface cleaning of the semiconductor films 504 to 507 to the formation of the gate insulating film 508 is performed without opening to the atmosphere, and contaminants and interface states at the interface between the semiconductor films 504 to 507 and the gate insulating film 508 are reduced. I am trying. In this case, a multi-chamber (or in-line) apparatus having at least a cleaning chamber and a sputtering chamber may be used.
[0057]
Next, a tantalum nitride film with a thickness of 30 nm is formed as the first conductive film 509, and a tungsten film with a thickness of 370 nm is formed as the second conductive film 510. In addition, a combination using a tungsten film as the first conductive film and an aluminum alloy film as the second conductive film, or a combination using a titanium film as the first conductive film and a tungsten film as the second conductive film may be used. good.
[0058]
These metal films may be formed by sputtering. Further, when an inert gas such as Xe or Ne is added as a sputtering gas, peeling of the film due to stress can be prevented. Further, by setting the purity of the tungsten target to 99.9999%, a low-resistance tungsten film having a resistivity of 20 μΩcm or less can be formed.
[0059]
Further, it is possible to perform the process from the surface cleaning of the semiconductor films 504 to 507 to the formation of the second conductive film 510 without opening to the atmosphere. In this case, a multi-chamber (or in-line) apparatus having at least a cleaning chamber, a sputtering chamber for forming an insulating film, and a sputtering chamber for forming a conductive film may be used.
[0060]
Next, resist masks 511a to 511g are formed, and the first conductive film 509 and the second conductive film 510 are etched. Note that in this specification, the etching process performed here is referred to as a first etching process. (Fig. 5 (C))
[0061]
In this embodiment, an etching method using ICP (Inductively Coupled Plasma) is employed.
[0062]
First, carbon tetrafluoride (CF _Four ) Gas, chlorine (Cl ₂ ) Gas and oxygen (O ₂ ) Using a gas mixture, the pressure is 1 Pa. At this time, the flow rate of each gas is 2.5 × 10 5 for carbon tetrafluoride gas. ^-Five m ^Three / min, chlorine gas is 2.5 × 10 ^-Five m ^Three / min, oxygen gas is 1.0 × 10 ^-Five m ^Three / min.
[0063]
In this state, 500 W RF power (13.56 MHz) is applied to the coil-type electrode to generate plasma. Further, 150 W RF power (13.56 MHz) is applied as a self-bias voltage to the stage on which the substrate is placed, so that a negative self-bias is applied to the substrate. This etching condition is referred to as a first etching condition.
[0064]
As a result, the second conductive film (tungsten film) 510 is selectively etched. This is because the progress of etching of the first conductive film (tantalum nitride film) is extremely slowed by adding oxygen to the etching gas. Further, by using the receding of the resist masks 511a to 511e, a shape having a taper having a taper angle of 15 to 45 ° can be obtained. Under the first etching condition, a taper angle of about 25 ° can be obtained.
[0065]
The taper is a portion where the end surface of the end portion of the electrode is inclined, and the angle with the base is called a taper angle. Further, the shape having a taper is a shape which is inclined with a taper angle with an electrode end, and the trapezoid is included in the shape having a taper.
[0066]
Next, etching is performed using an etching gas as a mixed gas of carbon tetrafluoride gas and chlorine gas. At this time, the pressure is 1 Pa, and the flow rate of each gas is 3.0 × 10 6 for both carbon tetrafluoride gas and chlorine gas. ^-Five m ^Three / min. Further, RF power of 500 W is applied to the coil-type electrode, and RF power of 20 W is applied as a self-bias voltage to the stage on which the substrate is placed. This condition is referred to as a second etching condition.
[0067]
Thus, the gate electrodes 512 to 516 made of a laminated film of the first conductive film and the second conductive film, and the source wiring 517 and the drain wiring 518 of the switching TFT are formed.
[0068]
Next, an n-type impurity element (phosphorus in this embodiment) is added in a self-aligning manner using the gate electrodes 512 to 516, the source wiring 517, and the drain wiring 518 as masks. Impurity regions 519 to 527 thus formed contain 1 × 10 n-type impurity elements. ²⁰ ~ 1x10 ^{twenty one} atoms / cm ^Three (Typically 2 × 10 ²⁰ ~ 5x10 ^{twenty one} atoms / cm ^Three ). These impurity regions 519 to 527 form the source region and drain region of the n-channel TFT.
[0069]
Next, the gate electrode is etched using the resist masks 511a to 511g as they are. This etching condition may be an etching condition in which the self-bias voltage is 20 W in the first etching condition. Under this condition, only the second conductive film (tungsten film) is selectively etched, and gate electrodes (hereinafter referred to as second gate electrodes) 528 to 532 made of the second conductive film, and sources made of the second conductive film. A wiring (hereinafter referred to as a second source wiring) 533 and a drain wiring (hereinafter referred to as a second drain wiring) 534 made of a second conductive film are formed. (Fig. 5 (D))
[0070]
Next, as shown in FIG. 5E, an n-type impurity element (phosphorus in this embodiment) is added using the resist masks 511a to 511g as they are. In this step, the second gate electrodes 528 to 532 function as a mask, and the n-type impurity element is 2 × 10 6. ¹⁶ ~ 5x10 ¹⁹ atoms / cm ^Three (Typically 5 × 10 ¹⁷ ~ 5x10 ¹⁸ atoms / cm ^Three N-type impurity regions 535 to 544 included at a concentration of) are formed. In this specification, an impurity region to which an n-type impurity element is added at this concentration is referred to as an n-type impurity region (b).
[0071]
In addition, the addition condition here is set such that the acceleration voltage is as high as 70 to 120 kV (90 kV in this embodiment) so that phosphorus penetrates the first conductive film and the gate insulating film and reaches the semiconductor film.
[0072]
Next, as illustrated in FIG. 6A, the gate insulating film 508 is etched by a dry etching method to form gate insulating films 545 to 549 that are isolated from each other. In this embodiment, the gate insulating film is etched so that the n-type impurity regions (a) 519 to 527 are exposed. However, the gate insulating film is formed on the surfaces of the n-type impurity regions (a) 519 to 527. May remain.
[0073]
This etching condition is that CHF is used as an etching gas. _Three (Carbon trifluoride) gas 3.5 × 10 ^-Five m ^Three flow at a flow rate of / min and an etching pressure of 7.3 × 10 ^Three Pa. The applied power is 800W.
[0074]
At this time, the first conductive film (tantalum nitride film) is simultaneously etched to form gate electrodes (hereinafter, referred to as first gate electrodes) 550 to 554 made of the first conductive film. Therefore, the EL light emitting device shown in this embodiment includes a gate electrode having a structure in which a first gate electrode and a second gate electrode are stacked.
[0075]
As shown in FIG. 6A, the first gate electrode 550 partially overlaps with the n-type impurity regions (b) 535 and 536 (overlap with the gate insulating film 545). That is, the n-type impurity regions (b) 535 and 536 are regions 535a and 535b that overlap the first gate electrode 550 via the gate insulating film 545, and regions 536a that do not overlap the first gate electrode 550 via the gate insulating film 545, It may be said that 536b is included.
[0076]
Note that although the first gate electrode 550 functions as part of the gate electrode, the regions 535a and 536a overlapping the first gate electrode 550 with the gate insulating film 545 interposed therebetween are effective in reducing the hot carrier effect. Thereby, deterioration resulting from the hot carrier effect can be suppressed. The above features are common to all TFTs.
[0077]
Next, as shown in FIG. 6B, the added n-type impurity element is activated. As an activation means, laser annealing is preferable. Of course, if the heat resistance of the plastic substrate 501a permits, lamp annealing, furnace annealing, or means using both of them and laser annealing may be used. At this time, it is desirable to keep the oxygen concentration in the processing atmosphere as low as possible. This is to prevent oxidation of the gate electrode, and preferably the oxygen concentration is 1 ppm or less.
[0078]
Next, as shown in FIG. 6C, an inorganic insulating film 555 made of a silicon nitride film or a silicon nitride oxide film is formed to a thickness of 50 to 200 nm. This inorganic insulating film 555 may be formed by a sputtering method.
[0079]
Then hydrogen (H ₂ ) Gas or ammonia (NH _Three ) Hydrogenation is performed by plasma treatment using gas. After the hydrogenation treatment is completed, a resin film that transmits visible light is formed as the organic insulating film 556 to a thickness of 1 to 2 μm. As the resin film, a polyimide film, a polyamide film, an acrylic resin film, or a BCB (benzocyclobutene) film may be used. It is also possible to use a photosensitive resin film.
[0080]
Note that in this embodiment, a stacked film of the inorganic insulating film 555 and the organic insulating film 556 is referred to as an interlayer insulating film.
[0081]
Next, as illustrated in FIG. 6D, contact holes are formed in the interlayer insulating film, and wirings 557 to 562 and a pixel electrode 563 are formed. In this embodiment, the wiring is a laminated film having a three-layer structure in which a 50 nm titanium film, an aluminum film containing 200 nm titanium, and an aluminum film containing 200 nm lithium are continuously formed by sputtering. Alternatively, only an aluminum film containing lithium can be formed by an evaporation method. However, even in that case, it is desirable to form continuously without opening to the atmosphere.
[0082]
Here, it is important that the outermost surface of the pixel electrode 563 be a metal surface having a small work function. This is because the pixel electrode 563 functions as a cathode of the EL element as it is. Therefore, at least the outermost surface of the pixel electrode 563 is preferably a metal film or a bismuth (Bi) film containing an element belonging to Group 1 or Group 2 of the periodic table. Since the wirings 557 to 562 are formed at the same time as the pixel electrode 563, they are formed using the same conductive film.
[0083]
At this time, the wirings 557 and 559 function as source wirings of the NMOS circuit and 558 functions as a drain wiring. The wiring 560 functions as a wiring that electrically connects the source wiring 517 and the source region of the switching TFT, and the wiring 561 functions as a wiring that electrically connects the drain wiring 518 and the drain region of the switching TFT. Reference numeral 562 denotes a source wiring (corresponding to a current supply line) of the current control TFT, and 563 denotes a pixel electrode of the current control TFT.
[0084]
Next, as illustrated in FIG. 7, an insulating film (hereinafter referred to as a bank) 564 covering the end portion of the pixel electrode 563 is formed. The bank 564 may be formed by patterning an insulating film or organic resin film containing silicon of 100 to 400 nm. The bank 564 is formed so as to fill a space between the pixels (between the pixel electrode and the pixel electrode). Another purpose is to prevent an organic EL film such as a light emitting layer to be formed next from directly touching an end portion of the pixel electrode 563.
[0085]
Note that since the bank 564 is an insulating film, attention must be paid to electrostatic breakdown of elements during film formation. In this embodiment, carbon particles or metal particles are added to the insulating film that is the material of the bank 564 to lower the resistivity and suppress the generation of static electricity. At this time, the resistivity is 1 × 10 ⁶ ~ 1x10 ¹² Ωm (preferably 1 × 10 ⁸ ~ 1x10 ^Ten The added amount of carbon particles and metal particles may be adjusted so that the resistance becomes Ωm).
[0086]
Next, an EL layer 565 is formed by an evaporation method. In this embodiment, the stacked body of the hole injection layer and the light emitting layer is called an EL layer. That is, a laminate in which a hole injection layer, a hole transport layer, a hole blocking layer, an electron transport layer, an electron injection layer, or an electron blocking layer are combined with the light emitting layer is defined as an EL layer. Note that these may be organic materials or inorganic materials, and may be polymers or low molecules.
[0087]
In this example, a lithium fluoride (LiF) film is first formed to a thickness of 20 nm as an electron injection layer, and an aluminum quinolinato complex (Alq) is further formed as a light emitting layer. _Three ) To a thickness of 80 nm. In addition, a dopant (typically a fluorescent dye) that serves as an emission center may be added to the light emitting layer by co-evaporation. As this dopant, an organic material that emits light through triplet excitation may be used.
[0088]
Next, when the EL layer 565 is formed, an anode 566 made of an oxide conductive film having a high work function and transparent to visible light is formed to a thickness of 300 nm. In this embodiment, an oxide conductive film in which gallium oxide is added to zinc oxide is formed by an evaporation method. As another oxide conductive film, an oxide conductive film made of indium oxide, zinc oxide, tin oxide, or a combination of these can be used. Thus, an EL element 567 including a pixel electrode (cathode) 563, an EL layer 565, and an anode 566 is formed.
[0089]
Note that it is effective to provide the passivation film 568 so as to completely cover the EL element 567 after the anode 566 is formed. As the passivation film 568, an insulating film including a carbon film, a silicon nitride film, or a silicon nitride oxide film is used, and the insulating film is used as a single layer or a combination thereof.
[0090]
At this time, it is preferable to use a film with good coverage as the passivation film, and it is effective to use a carbon film, particularly a DLC (diamond-like carbon) film. Since the DLC film can be formed in a temperature range from room temperature to 100 ° C., it can be easily formed over the EL layer 565 having low heat resistance. Further, the DLC film has a high blocking effect against oxygen and can suppress oxidation of the EL layer 565. Therefore, the problem that the EL layer 565 is oxidized during the subsequent sealing process can be prevented.
[0091]
Further, a sealing material 569 is provided over the passivation film 568 and a cover material 570 is attached thereto. As the sealing material 569, an ultraviolet curable resin may be used, and it is effective to provide a substance having a moisture absorption effect or a substance having an antioxidant effect inside. In this embodiment, the cover material 570 uses carbon films (preferably diamond-like carbon films) 570b and 570c on both surfaces of a plastic substrate (including a plastic film) 570a.
[0092]
Thus, an EL light emitting device having a structure as shown in FIG. 7 is completed. Note that it is effective to continuously process the steps from the formation of the bank 564 to the formation of the passivation film 568 using a multi-chamber type (or in-line type) film formation apparatus without releasing to the atmosphere. . Further, it is possible to continuously process the process up to the step of bonding the cover material 570 without releasing to the atmosphere.
[0093]
Thus, the n-channel TFTs 601 and 602, the switching TFT (n-channel TFT) 603, and the current control TFT (n-channel TFT) 604 are formed on the insulator 501 having the plastic substrate as a base. The photolithography process required in the manufacturing process so far is five times, which is fewer than a general active matrix EL light emitting device.
[0094]
That is, the TFT manufacturing process is greatly simplified, and the yield can be improved and the manufacturing cost can be reduced. Further, since the TFT and the EL element are sandwiched between insulators (including a cover material) having a plastic substrate as a base, a very flexible and lightweight EL light emitting device can be realized.
[0095]
Further, as described with reference to FIG. 6A, an n-channel TFT which is resistant to deterioration due to the hot carrier effect is formed by providing an impurity region overlapping with the first gate electrode through a gate insulating film. Can do. Therefore, a highly reliable EL light emitting device can be realized.
[0096]
FIG. 8 shows a circuit configuration example of the EL light emitting device of this embodiment. In this embodiment, a circuit configuration for performing digital driving is shown. In this embodiment, a source side driver circuit 801, a pixel portion 806, and a gate side driver circuit 807 are provided. Note that in this specification, a driving circuit is a generic term including a source side driving circuit and a gate side driving circuit.
[0097]
The source side driver circuit 801 includes a shift register 802, a latch (A) 803, a latch (B) 804, and a buffer 805. In the case of analog driving, a sampling circuit (also referred to as a transfer gate or an analog switch) may be provided instead of the latches (A) and (B). The gate driver circuit 807 includes a shift register 808 and a buffer 809. Note that the shift registers illustrated in FIG. 4 may be used as the shift registers 802 and 808.
[0098]
In this embodiment, the pixel portion 806 includes a plurality of pixels, and EL elements are provided in the plurality of pixels. At this time, it is preferable that the cathode of the EL element is electrically connected to the drain of the current control TFT.
[0099]
These source side driver circuit 801 and gate side driver circuit 807 are all formed by n-channel TFTs, and all the circuits are formed with the EEMOS circuit shown in FIG. 3A as a basic unit. Although the power consumption is slightly higher than that of the conventional CMOS circuit, the EL light emitting device that originally uses the CMOS circuit as the drive circuit consumes nearly 95% of the power in the pixel portion. Even if the power consumption of the drive circuit is increased, it does not matter so much.
[0100]
Although not illustrated, a gate side driver circuit may be further provided on the opposite side of the gate side driver circuit 807 with the pixel portion 806 interposed therebetween. In this case, both have the same structure and share the gate wiring, and even if one of them breaks, the gate signal is sent from the remaining one so that the pixel portion operates normally.
[0101]
In addition, the said structure is realizable by producing TFT according to the manufacturing process shown in FIGS. Further, in this embodiment, only the configuration of the pixel portion and the drive circuit is shown. However, according to the manufacturing process of this embodiment, other logic circuits such as a signal dividing circuit, a D / A converter, an operational amplifier, and a γ correction circuit are provided. Can be formed on the same insulator, and a memory and a microprocessor can also be formed.
[0102]
Furthermore, the EL light-emitting device of this example after performing the sealing (or sealing) process for protecting the EL element will be described with reference to FIGS. In addition, the code | symbol used in FIGS. 5-8 is quoted as needed.
[0103]
FIG. 9A is a top view showing a state after the EL element is sealed, and FIG. 9B is a cross-sectional view taken along line AA ′ of FIG. 9A. Reference numeral 801 indicated by a dotted line denotes a source side driver circuit, 806 denotes a pixel portion, and 807 denotes a gate side driver circuit. Reference numeral 901 denotes a cover material, reference numeral 902 denotes a first sealing material, reference numeral 903 denotes a second sealing material, and a sealing material 907 is provided on the inner side surrounded by the first sealing material 902.
[0104]
Reference numeral 904 denotes a wiring for transmitting signals input to the source side driver circuit 801 and the gate side driver circuit 807, and receives a video signal and a clock signal from an FPC (flexible printed circuit) 905 serving as an external input terminal. Although only the FPC is shown here, a printed wiring board (PWB) may be attached to the FPC, or a TCP (Tape Carrier Package) may be used. Further, the IC may be mounted on the substrate by COG (Chip On Glass).
[0105]
The EL light emitting device in this specification includes not only the EL light emitting device main body but also a state in which FPC, TCP, or PWB is attached thereto.
[0106]
Next, a cross-sectional structure is described with reference to FIG. A pixel portion 806 and a gate side driver circuit 807 are formed above the insulator 501, and the pixel portion 806 is formed by a plurality of pixels including a current control TFT 604 and a pixel electrode 563 electrically connected to its drain. Is done. The gate side driver circuit 807 is formed using an NMOS circuit (see FIG. 3) in which an n-channel TFT 601 and an n-channel TFT 602 are combined.
[0107]
The pixel electrode 563 functions as a cathode of the EL element. A bank 564 is formed at both ends of the pixel electrode 563, and an EL layer 565 and an anode 566 of an EL element are formed over the pixel electrode 563. The anode 566 also functions as a wiring common to all the pixels, and is electrically connected to the FPC 905 through the connection wiring 904. Further, all the elements included in the pixel portion 806 and the gate side driver circuit 807 are covered with the anode 566 and the passivation film 567.
[0108]
Further, a cover material 901 is bonded to the first seal material 902. Note that a spacer made of a resin film may be provided in order to secure a gap between the cover material 901 and the EL element. A sealing material 907 is filled inside the first sealing material 902. Note that an epoxy-based resin is preferably used as the first sealing material 902 and the sealing material 907. The first sealing material 902 is desirably a material that does not transmit moisture and oxygen as much as possible. Further, a substance having a hygroscopic effect or a substance having an antioxidant effect may be contained in the sealing material 907.
[0109]
The sealing material 907 provided so as to cover the EL element also functions as an adhesive for bonding the cover material 901. In this embodiment, FRP (Fiberglass-Reinforced Plastics), PVF (polyvinyl fluoride), Mylar, polyester, or acrylic can be used as the material of the plastic substrate 901a constituting the cover material 901.
[0110]
Furthermore, in this embodiment, carbon films (specifically, diamond-like carbon films) 901b and 901c are provided as protective films on both surfaces of the plastic substrate 901a to a thickness of 2 to 30 nm. Such a carbon film has a role of preventing oxygen and water from entering and mechanically protecting the surface of the plastic substrate 901a. In addition, a polarizing plate (typically, a circularly polarizing plate) can be attached to the outer carbon film 901b.
[0111]
In addition, after the cover material 901 is bonded using the sealing material 907, the second sealing material 903 is provided so as to cover the side surface (exposed surface) of the sealing material 907. The second sealing material 903 can use the same material as the first sealing material 902.
[0112]
By encapsulating the EL element in the sealing material 907 with the above structure, the EL element can be completely shut off from the outside, and a substance that promotes deterioration due to oxidation of the EL layer such as moisture or oxygen enters from the outside. Can be prevented. Therefore, a highly reliable EL light emitting device can be obtained.
[0113]
[Example 2]
In this example, an example in which an EL element is sealed with a structure different from that of the EL light-emitting device described in Example 1 will be described with reference to FIGS. In addition, the same code | symbol is used about the same part as FIG. FIG. 10B is a cross-sectional view taken along line AA ′ of FIG.
[0114]
First, in this embodiment, as an insulator 1001 for forming TFTs and EL elements, a plastic film 1001a coated with carbon films (specifically diamond-like carbon films) 1001b and 1001c as protective films is used. . Note that the roll-to-roll method may be used when the carbon films 1001b and 1001c are formed on both surfaces of the plastic film 1001a.
[0115]
Further, the cover material 1002 is attached to the substrate manufactured up to the EL element according to Example 1 using the sealing material 907. As the cover material 1002, a plastic film 1002 a having both surfaces coated with carbon films (specifically, diamond-like carbon films) 1002 b and 1002 c as protective films is used. Further, the end surface (end portion) of the cover material 1002 is sealed with a second seal material 1003.
[0116]
Example 3
In this embodiment, the case where the n-channel TFT 601 is a depletion type and the n-channel TFT 602, the switching TFT 603, and the current control TFT 604 are an enhancement type in Embodiment 1 will be described.
[0117]
First, according to the first embodiment, the state of FIG. Next, a silicon oxide film 1101 having a thickness of 100 to 150 nm is formed by a sputtering method, and a resist mask 1102 is formed over the silicon oxide film 1101 in a region to be the n-channel TFT 601. (Fig. 11 (A))
[0118]
Next, an element belonging to Group 13 of the periodic table (boron in this embodiment) is added to the crystalline semiconductor film 503 using the resist mask 1102. Thus 1 × 10 ¹⁵ ~ 5x10 ¹⁷ atoms / cm ^Three (Typically 1x10 ¹⁶ ~ 1x10 ¹⁷ atoms / cm ^Three ) Regions 1103 to which boron is added and regions 1104 to which boron is not added are formed. (Fig. 11 (B))
[0119]
Next, the crystalline semiconductor film is patterned to form island-shaped semiconductor films 1105 to 1108. At this time, the semiconductor film 1105 is formed in a region 1104 to which boron is not added, and the semiconductor films 1106 to 1108 are formed in a region to which boron is added. That is, a TFT having the semiconductor film 1105 as an active layer does not contain boron in the channel formation region, or 5 × 10 5 even if it is contained. ¹⁴ atoms / cm ^Three In the TFT having the semiconductor films 1106 to 1108 as active layers, boron is 1 × 10 6 in the channel formation region. ¹⁵ ~ 5x10 ¹⁷ atoms / cm ^Three (Typically 1x10 ¹⁶ ~ 1x10 ¹⁷ atoms / cm ^Three ) Concentration. (Fig. 11 (C))
[0120]
The subsequent steps may be performed according to the first embodiment. In this embodiment, the n-channel TFT formed using the semiconductor film 1105 is a depletion type TFT (that is, a normally-on n-channel TFT), and the n-channel TFT formed using the semiconductor films 1106 to 1108 is used. The TFT is an enhancement type TFT (that is, a normally-off n-channel type TFT).
[0121]
When this embodiment is implemented, the EDMOS circuit shown in FIG. 3B can be formed by combining the depletion type TFT and the enhancement type TFT formed by the above method.
[0122]
In this embodiment, the threshold voltage is shifted in the positive direction by adding boron to the semiconductor film, and the TFT including the channel formation region to which boron is added is an enhancement type. By adding an element belonging to Group 15 of the table (typically phosphorus or arsenic) to the semiconductor film, the threshold voltage is shifted in the negative direction to form a channel to which an element belonging to Group 15 of the periodic table is added. A TFT including a region can be a depletion type.
[0123]
Note that this embodiment can be implemented in combination with Embodiment 1 or Embodiment 2.
[0124]
Example 4
In this embodiment, the case where the source side driver circuit and the gate side driver circuit are all formed of E-type NTFT will be described with reference to FIGS. In the present invention, a decoder using only an n-channel TFT is used instead of the shift register.
[0125]
FIG. 12 shows an example of a gate side driving circuit. In FIG. 12, 100 is a decoder of the gate side drive circuit, and 101 is a buffer unit of the gate side drive circuit. The buffer unit refers to a part where a plurality of buffers (buffer amplifiers) are integrated. In addition, the buffer refers to a circuit that performs driving without affecting the preceding stage.
[0126]
First, the gate side decoder 100 will be described. First, reference numeral 102 denotes an input signal line (hereinafter referred to as a selection line) of the decoder 100. Here, A1, A1 bar (a signal in which the polarity of A1 is inverted), A2, A2 bar (a signal in which the polarity of A2 is inverted),. An and An bars (signals in which the polarity of An is inverted) are shown. That is, it can be considered that 2n selection lines are arranged.
[0127]
The number of selection lines is determined by the number of gate lines output from the gate side driving circuit. For example, in the case of having a pixel portion for VGA display, there are 480 gate wirings, so a total of 18 selection lines are required for 9 bits (corresponding to n = 9). The selection line 102 transmits a signal shown in the timing chart of FIG. As shown in FIG. 13, when the frequency of A1 is 1, the frequency of A2 is 2 ^-1 Double, A3 frequency is 2 ^-2 Double, An frequency is 2 ^-(n-1) Doubled.
[0128]
Reference numeral 103a denotes a first-stage NAND circuit (also referred to as a NAND cell), 103b denotes a second-stage NAND circuit, and 103c denotes an n-th stage NAND circuit. The NAND circuit requires the number of gate wirings, and n pieces are required here. That is, in the present invention, the decoder 100 includes a plurality of NAND circuits.
[0129]
The NAND circuits 103a to 103c are formed by combining n-channel TFTs 104 to 109 to form a NAND circuit. Actually, 2n TFTs are used in the NAND circuit 103. The gates of the n-channel TFTs 104 to 109 are connected to any one of the selection lines 102 (A1, A1 bar, A2, A2 bar... An, An bar).
[0130]
At this time, in the NAND circuit 103a, the n-channel TFTs 104 to 106 each having a gate connected to any one of A1, A2,..., An (referred to as positive selection lines) are connected in parallel to each other. Negative power supply line (V _DL ) 110 and connected to the output line 71 as a common drain. In addition, n-channel TFTs 107 to 109 having gates connected to any one of A1 bar, A2 bar... An bar (which are referred to as negative selection lines) are connected in series with each other and positioned at the circuit end. The source of the n-channel TFT 109 that performs the positive power supply line (V _DH ) 112 and the drain of the n-channel TFT 107 located at the other circuit end is connected to the output line 111.
[0131]
As described above, in the present invention, the NAND circuit includes n n-channel TFTs connected in series and n n-channel TFTs connected in parallel. However, in the n NAND circuits 103a to 103c, all combinations of n-channel TFTs and selection lines are different. In other words, only one output line 111 is always selected, and a signal for selecting the output line 111 in order from the end is input to the selection line 102.
[0132]
Next, the buffer unit 101 is formed by a plurality of buffers 113a to 113c corresponding to each of the NAND circuits 103a to 103c. However, the buffers 113a to 113c may all have the same structure.
[0133]
The buffers 113a to 113c are formed using n-channel TFTs 114 to 116. An output line 111 from the decoder is input as a gate of an n-channel TFT 114 (first n-channel TFT). The n-channel TFT 114 is a positive power supply line (V _DH ) 117 is a source, and a gate wiring 118 following the pixel portion is a drain. The n-channel TFT 115 (second n-channel TFT) is connected to the positive power supply line (V _DH ) 117 as a gate and a negative power supply line (V _DL ) 119 is a source, and the gate wiring 118 is a drain, and is always on.
[0134]
That is, in the present invention, the buffers 113a to 113c are connected in series to the first n-channel TFT (n-channel TFT 114) and the first n-channel TFT, and the drain of the first n-channel TFT is connected to the first n-channel TFT. A second n-channel TFT (n-channel TFT 115) serving as a gate is included.
[0135]
The n-channel TFT 116 (third n-channel TFT) has a reset signal line (Reset) as a gate and a negative power supply line (V _DL ) 119 is a source, and the gate wiring 118 is a drain. The negative power line (V _DL ) 119 may be a ground power line (GND).
[0136]
At this time, there is a relationship of W1 <W2 between the channel width (W1) of the n-channel TFT 115 and the channel width (W2) of the n-channel TFT 114. Note that the channel width is the length of a channel formation region in a direction perpendicular to the channel length.
[0137]
The operation of the buffer 113a is as follows. First, when a negative voltage is applied to the output line 111, the n-channel TFT 114 is turned off (a state in which no channel is formed). On the other hand, since the n-channel TFT 115 is always in an on state (a channel is formed), the voltage of the negative power supply line 119 is applied to the gate wiring 118.
[0138]
However, when a positive voltage is applied to the output line 111, the n-channel TFT 114 is turned on. At this time, since the channel width of the n-channel TFT 114 is larger than the channel width of the n-channel TFT 115, the potential of the gate wiring 118 is pulled to the output on the n-channel TFT 114 side. As a result, the voltage of the positive power supply line 117 is Added to the gate wiring 118.
[0139]
Therefore, when a positive voltage is applied to the output line 111, the gate wiring 118 outputs a positive voltage (a voltage at which an n-channel TFT used as a pixel switching element is turned on) and a negative voltage to the output line 111. When a voltage is applied, a negative voltage (a voltage at which an n-channel TFT used as a pixel switching element is turned off) is output.
[0140]
Note that the n-channel TFT 116 is used as a reset switch for forcibly pulling down the gate wiring 118 to which a positive voltage is applied to a negative voltage. That is, when the selection period of the gate wiring 118 ends. A reset signal is input and a negative voltage is applied to the gate wiring 118. However, the n-channel TFT 116 can be omitted.
[0141]
The gate lines are sequentially selected by the gate side driving circuit operating as described above. Next, FIG. 14 shows a configuration of the source side driver circuit. The source side driver circuit illustrated in FIG. 14 includes a decoder 121, a latch 122, and a buffer unit 123. Note that the configurations of the decoder 121 and the buffer unit 123 are the same as those of the gate-side driver circuit, and thus description thereof is omitted here.
[0142]
In the case of the source side driver circuit shown in FIG. 14, the latch 122 includes a first-stage latch 124 and a second-stage latch 125. The first-stage latch 124 and the second-stage latch 125 include a plurality of unit units 127a and 127b each formed of m n-channel TFTs 126a to 126c. The output line 128 from the decoder 121 is input to the gates of m n-channel TFTs 126a to 126c forming the unit unit 127a. Note that m is an arbitrary integer.
[0143]
For example, in the case of VGA display, the number of source lines is 640. When m = 1, 640 NAND circuits are required, and 20 selection lines (corresponding to 10 bits) are required. However, if m = 8, the number of necessary NAND circuits is 80, and the number of necessary selection lines is 14 (corresponding to 7 bits). That is, if the number of source wirings is M, the necessary NAND circuits are (M / m).
[0144]
The sources of the n-channel TFTs 126a to 126c are connected to video signal lines (V1, V2,... Vk) 129, respectively. That is, when a positive voltage is applied to the output line 128, the n-channel TFTs 126a to 126c are turned on at the same time, and video signals corresponding to the TFTs are captured. The video signal thus captured is held in capacitors 130a to 130c connected to the n-channel TFTs 126a to 126c.
[0145]
The second-stage latch 125 also includes a plurality of unit units 127b, and the unit unit 127b is formed of m n-channel TFTs 131a to 131c. The gates of the n-channel TFTs 131a to 131c are all connected to the latch signal line 132. When a negative voltage is applied to the latch signal line 132, the n-channel TFTs 131a to 131c are turned on all at once.
[0146]
As a result, the signals held in the capacitors 130a to 130c are output to the buffer 123 simultaneously with being held in the capacitors 133a to 133c connected to the n-channel TFTs 131a to 131c. Then, as described with reference to FIG. 13, the data is output to the source wiring 134 through the buffer. The source lines are selected in order by the source side driving circuit operating as described above.
[0147]
As described above, by forming the gate side driver circuit and the source side driver circuit with only the n-channel TFT, the pixel portion and the driver circuit can all be formed with the n-channel TFT. Note that the present invention can also be implemented when one of the source side driver circuit and the gate side driver circuit is an external IC (typically TCP or COG).
[0148]
Example 5
In this embodiment, a case where a source side driver circuit and a gate side driver circuit are formed by combining an E type NTFT (E type NTFT) and a D type NTFT (D type NTFT) will be described with reference to FIGS.
[0149]
FIG. 15 shows an example of a gate side driving circuit. In FIG. 15, 140 is a shift register, 141 is a NAND circuit section, and 142 is a buffer section.
[0150]
Here, the shift register 140 specifically illustrates the shift register shown in FIG. First, 143 is a clock signal line, 144 is a clock signal line whose polarity is inverted, and 145 is a positive power supply line (V _DH ) 146 is a ground power supply line (GND). In this embodiment, three flip-flop circuits 147a to 147c are shown as basic units forming the shift register 140. In practice, a plurality of flip-flop circuits are connected in series to form the shift register 140.
[0151]
In this embodiment, the flip-flop circuit 147 a corresponds to the flip-flop circuit 400 shown in FIG. 4, and the flip-flop circuit 147 b has a circuit configuration corresponding to the flip-flop circuit 401. The flip-flop circuits 147a to 147c are formed of an E-type NTFT and a D-type NTFT.
[0152]
In the flip-flop circuit 147a, reference numeral 148 denotes an E-type NTFT whose gate is connected to the clock signal line 143. In addition, EDMOS circuits 148a to 148c having the structure shown in FIG. 3B are formed as shown in FIG. Note that 150 is a positive power supply line (VDH), and 151 is a ground power supply line (GND).
[0153]
The flip-flop circuit 147b has the same circuit configuration as the flip-flop circuit 147a except that the gate of the E-type NTFT 152 is connected to the clock signal line 144 whose polarity is inverted.
[0154]
The output line 153 of the flip-flop circuit 147a and the output line 154 of the flip-flop circuit 147b are connected to the NAND circuit 155a. The NAND circuit unit 141 includes three NAND circuits 155a to 155c, but actually includes a plurality of NAND circuits. One NAND circuit is arranged in proportion to two flip-flop circuits. The NAND circuits 155a to 155c are formed of an E-type NTFT and a D-type NTFT.
[0155]
In the NAND circuit 155a, the output line 153 is connected to the gate of the E-type NTFT 156, the ground power supply line 151 is connected to the source, and the E-type NTFT 157 is connected to the drain. The output line 154 is connected to the gate of the E-type NTFT 157, the drain of the E-type NTFT 156 is connected to the source, and the output line 158 is connected to the drain. The source of the D-type NTFT 159 is connected to the positive power supply line 160, and the gate and drain are connected to the output line 158.
[0156]
An output line 158 of the NAND circuit 155a is connected to an EDMOS circuit (which may be called an inverter circuit) 161a. Although three EDMOS circuits 161a to 161c are illustrated in the buffer unit 142, the buffer unit 142 actually includes a plurality of EDMOS circuits.
[0157]
In the EDMOS circuit 161a, the gate of the E-type NTFT 162 is connected to the output line 158, and the source is a negative power supply line (V _DL ) And the drain thereof is connected to an output line (corresponding to a gate wiring of the pixel portion) 164. The gate and drain of the D-type NTFT 165 are connected to the output line 164 and the source is connected to the positive power supply line 160.
[0158]
Next, FIG. 16 shows the configuration of the source side driver circuit. The source side driver circuit shown in FIG. 16 has a configuration in which transfer gates 165a to 165c are added to the gate side driver circuit shown in FIG. 15, and the same circuit is used for the shift register 140, the NAND circuit unit 141, and the buffer unit 142. be able to. This configuration is a configuration in the case of performing analog driving.
[0159]
Further, in this embodiment, two E-type NTFTs are provided in parallel as the transfer gates 165a to 165c. This is a redundant design and a device for increasing current supply capability. Reference numeral 166 denotes a video signal line.
[0160]
When digital driving is performed in this embodiment, the latch 122 and the buffer unit 123 described with reference to FIG. 14 may be provided under the NAND circuit unit 141. On the other hand, in the fourth embodiment, in order to make the source side driving circuit shown in FIG. 14 compatible with analog driving, the latch 122 is omitted, and the transfer gate shown in FIG. .
[0161]
As described above, by forming the gate side driver circuit and the source side driver circuit with only the n-channel TFT, the pixel portion and the driver circuit can all be formed with the n-channel TFT. Note that the present invention can also be implemented when either the source side driver circuit or the gate side driver circuit is an external IC chip.
[0162]
Example 6
In this embodiment, an example of a pixel structure in the EL light emitting device of the present invention is shown in FIG. In FIG. 17A, 1701 is a gate wiring, 1702 is a source wiring, 1703 is a positive power supply line, and 1704 is a negative power supply line (may be a ground power supply line). Reference numerals 1705 to 1708 denote E-type NTFTs, and 1709 and 1710 denote D-type NTFTs. Reference numeral 1711 denotes an EL element which is connected to the E-type NTFT 1708.
[0163]
In the pixel structure of this embodiment, six TFTs are provided in one pixel to form an SRAM (Static Random Access Memory). Specifically, an SRAM is formed by a plurality of E-type NTFTs and a plurality of D-type NTFTs. As described above, there is no limitation on the number of TFTs included in one pixel in carrying out the present invention.
[0164]
In the pixel structure of this embodiment, the E-type NTFT 1705 functions as a switching TFT, and the E-type NTFT 1708 functions as a current control TFT. A memory function is provided by combining an inverter circuit composed of E-type NTFT 1706 and D-type NTFT 1709 and an inverter circuit composed of E-type NTFT 1707 and D-type NTFT 1710.
[0165]
Further, FIG. 17B shows an example in which two adjacent pixels shown in FIG. 17A are arranged symmetrically with a common negative power supply line 1704. Accordingly, the number of wirings provided in the pixel portion can be reduced, and the density of the pixels can be increased.
[0166]
In addition, the structure of a present Example can be implemented in combination with any structure of Example 1- Example 5. FIG.
[0167]
Example 7
The source side driver circuit and the gate side driver circuit described in Embodiment 4 or Embodiment 5 can also be used for a liquid crystal display device. That is, the EEMOS circuit shown in FIG. 3A, the EDMOS circuit shown in FIG. 3B, the shift register shown in FIG. 4, the gate side driving circuit shown in FIG. 13, or the source side driving shown in FIG. Any of the circuits can be used as a driving circuit for a liquid crystal display device.
[0168]
Note that the liquid crystal display device refers to a liquid crystal module in which an FPC (flexible printed circuit) is attached to a liquid crystal panel. The liquid crystal module includes a case where a PWB (printed wiring board) is provided at the tip of the FPC. Further, it may be a TCP (Tape Carrier Package) in which an IC is attached to the FPC. Further, the IC may be mounted on the substrate by COG (Chip On Glass).
[0169]
Example 8
In practicing the present invention, not only a top gate TFT (typically a planar TFT) but also a bottom gate TFT (typically an inverted staggered TFT) may be used as the TFT. It is also possible to use a MOSFET formed on a semiconductor substrate (typically a silicon substrate).
[0170]
The configuration of the present embodiment can be implemented in combination with the configuration included in any of Embodiments 1 to 7.
[0171]
Example 9
A light emitting device or a liquid crystal display device formed by implementing the present invention can be used as a display portion of various electric appliances. As an electric appliance of the present invention, a video camera, a digital camera, a goggle type display (head mounted display), a car navigation system, a car audio system, a notebook type personal computer, a game device, a portable information device (a mobile computer, a cellular phone, a portable type) A game machine or an electronic book), and an image reproducing device provided with a recording medium. Specific examples of these electric appliances are shown in FIGS.
[0172]
FIG. 20A illustrates an EL display including a housing 2001, a support base 2002, and a display portion 2003. The light emitting device or the liquid crystal display device of the present invention can be used for the display portion 2003. In the case where an EL light-emitting device is used for the display portion 2003, since it is a self-luminous type, a backlight can be eliminated and a thin display portion can be obtained.
[0173]
FIG. 20B illustrates a video camera, which includes a main body 2101, a display portion 2102, an audio input portion 2103, operation switches 2104, a battery 2105, and an image receiving portion 2106. The light emitting device or the liquid crystal display device of the present invention can be used for the display portion 2102.
[0174]
FIG. 20C illustrates a digital camera, which includes a main body 2201, a display portion 2202, an eyepiece portion 2203, and operation switches 2204. The light emitting device or the liquid crystal display device of the present invention can be used for the display portion 2202.
[0175]
FIG. 20D shows an image reproducing apparatus (specifically, a DVD reproducing apparatus) provided with a recording medium, which includes a main body 2301, a recording medium (CD, LD, DVD, etc.) 2302, an operation switch 2303, and a display unit (a). 2304 and a display unit (b) 2305. The display unit (a) mainly displays image information, and the display unit (b) mainly displays character information. The light emitting device or the liquid crystal display device of the present invention is used for these display units (a) and (b). Can do. Note that the image reproducing device provided with the recording medium may include a CD reproducing device, a game machine, and the like.
[0176]
FIG. 20E illustrates a portable (mobile) computer, which includes a main body 2401, a display portion 2402, an image receiving portion 2403, operation switches 2404, and a memory slot 2405. The light emitting device or the liquid crystal display device of the present invention can be used for the display portion 2402. This portable computer can record information on a recording medium in which a flash memory or a non-volatile memory is integrated, and can reproduce the information.
[0177]
FIG. 20F illustrates a personal computer, which includes a main body 2501, a housing 2502, a display portion 2503, and a keyboard 2504. The light emitting device or the liquid crystal display device of the present invention can be used for the display portion 2503.
[0178]
In addition, the electric appliances often display information distributed through electronic communication lines such as the Internet or CATV (cable television), and in particular, opportunities to display moving image information are increasing. In the case where an EL light emitting device is used for the display unit, the response speed of the EL light emitting device is very high, so that moving image display without delay is possible.
[0179]
In addition, since the light emitting portion of the EL light emitting device consumes power, it is desirable to display information so that the light emitting portion is minimized. Therefore, when an EL light emitting device is used for a display unit mainly including character information such as a portable information terminal, especially a mobile phone or a car audio, it is driven so that the character information is formed by the light emitting part with the non-light emitting part as the background. It is desirable to do.
[0180]
Here, FIG. 21A shows a cellular phone, which is a part (operation unit) 2601 for performing key operation and a part (information display unit) 2602 for displaying information, and the operation unit 2601 and the information display unit 2602 are connected portions 2603. It is connected with. The operation unit 2601 is provided with a voice input unit 2604 and operation keys 2605, and the information display unit 2602 is provided with a voice output unit 2606 and a display unit 2607.
[0181]
The light emitting device or the liquid crystal display device of the present invention can be used for the display portion 2607. Note that in the case where an EL light-emitting device is used for the display portion 2607, power consumption of the mobile phone can be suppressed by displaying white characters on a black background.
[0182]
In the case of the mobile phone shown in FIG. 21A, the EL light emitting device used in the display portion 2604 incorporates a sensor (NMOS sensor) with an NMOS circuit, and authenticates the user by reading a fingerprint or a palm. It can also be used as a terminal. It is also possible to read the external brightness (illuminance) and emit light so that information can be displayed with a set contrast.
[0183]
Further, power consumption can be reduced by reducing the luminance when the operation switch 2605 is used and increasing the luminance when the operation switch is used. In addition, power consumption can be reduced by increasing the brightness of the display portion 2604 when an incoming call is received and decreasing the brightness during a call. Further, in the case of continuous use, it is possible to reduce power consumption by providing a function that turns off display by time control unless resetting. Note that these may be manual control.
[0184]
FIG. 21B illustrates audio, which includes a housing 2701, a display portion 2702, and operation switches 2703 and 2704. The light emitting device or the liquid crystal display device of the present invention can be used for the display portion 2702. In this embodiment, in-vehicle audio (car audio) is shown, but it may be used for stationary audio (audio component). Note that in the case where an EL light-emitting device is used for the display portion 2704, power consumption can be suppressed by displaying white characters on a black background.
[0185]
Furthermore, the electric appliances described above can be provided with means for detecting the brightness of the usage environment by incorporating a light sensor in the light emitting device or the liquid crystal display device used for the display portion. In the case where an EL light emitting device is used for the display portion, a function of modulating the light emission luminance in accordance with the brightness of the use environment can be provided.
[0186]
Specifically, an image sensor (planar, linear, or dot sensor) formed with an NMOS circuit is provided in the EL light emitting device used for the display unit, or a CCD (Charge Coupled Device) is provided in the main body or the housing. Can be implemented. The user can recognize the image or the character information without any problem if the brightness of 100 to 150 can be secured in the contrast ratio as compared with the brightness of the usage environment. That is, when the usage environment is bright, it is possible to increase the brightness of the image for easy viewing, and when the usage environment is dark, the brightness of the image can be suppressed to reduce power consumption.
[0187]
As described above, the application range of the present invention is extremely wide and can be used for electric appliances in various fields. Moreover, you may use the light-emitting device or liquid crystal display device containing any structure of Examples 1-5 for the electric appliance of a present Example.
[0188]
【Effect of the invention】
By implementing the present invention, a light-emitting device with high yield and low cost and high light extraction efficiency can be manufactured, and a light-emitting device with high image quality and low cost can be provided. In addition, by using a light emitting device with high image quality and low price for the display portion, an inexpensive electric appliance having a display portion with high image quality can be provided.
[Brief description of the drawings]
FIG. 1 illustrates a cross-sectional structure of a light-emitting device.
FIG. 2 is a diagram illustrating a circuit configuration of a pixel portion of a light emitting device.
FIG. 3 is a diagram showing a configuration of an NMOS circuit.
FIG. 4 illustrates a structure of a shift register.
FIG. 5 is a diagram showing a manufacturing process of an EL light emitting device.
FIG. 6 is a diagram showing a manufacturing process of an EL light emitting device.
FIG. 7 is a diagram showing a manufacturing process of the EL light emitting device.
FIG. 8 is a diagram showing a circuit block configuration of an EL light emitting device.
FIG 9 illustrates a cross-sectional structure of an EL light-emitting device.
FIG. 10 illustrates a cross-sectional structure of an EL light-emitting device.
FIG. 11 shows a manufacturing process of an EL light emitting device.
FIG. 12 is a diagram showing a configuration of a gate side driving circuit.
FIG. 13 is a timing chart of decoder input signals.
FIG. 14 is a diagram showing a configuration of a source side driver circuit.
FIG. 15 is a diagram showing a configuration of a gate side driving circuit.
FIG. 16 is a diagram showing a configuration of a source side driver circuit.
FIG. 17 illustrates a structure of a pixel portion.
FIG. 18 shows a cross-sectional structure of a conventional EL light emitting device.
FIG. 19 is a diagram illustrating an arrangement example of TFTs of a pixel.
FIG. 20 is a diagram showing a specific example of an electric appliance.
FIG. 21 is a diagram showing a specific example of an electric appliance.

Claims (3)

In a light emitting device having a pixel portion and a driving circuit on the same insulator,
The pixel portion includes a light emitting element, a switching element, and a current control element .
The driving circuits includes an inverter circuit,
The switching element, the semiconductor film TFT having the current control element and the inverter circuit Ri all n-type Der, and none of the switching element and the current control element is luminous, wherein the enhancement type Der Rukoto apparatus. In a light emitting device having a pixel portion and a driving circuit on the same insulator,
The pixel portion includes the light emitting element, a switching element and a current control element,
The driving circuit includes a shift register having a plurality of flip-flop circuit having an enhancement-type n-channel type TFT and depletion n-channel type TFT of,
The switching element, the semiconductor film TFT having the current control element and the driving circuit is Ri all n-type Der, and none of the switching element and the current control element is luminous, wherein the enhancement type Der Rukoto apparatus. In a light emitting device having a pixel portion and a driving circuit on the same insulator,
The pixel portion includes the light emitting element, a switching element and a current control element,
The driving circuit includes a shift register, as well as enhancement type n-channel type TFT and depletion of n-channel type TFT having a plurality of flip-flop circuit having an enhancement-type n-channel type TFT and depletion n-channel type TFT of the A plurality of NAND circuits having
The switching element, the semiconductor film TFT having the current control element and the driving circuit is Ri all n-type Der, and none of the switching element and the current control element is luminous, wherein the enhancement type Der Rukoto apparatus.

Images