JP5170570B2 - Resin multilayer module and method for manufacturing resin multilayer module - Google Patents

Description

  The present invention relates to a resin multilayer module and a method for manufacturing the resin multilayer module, and more particularly to a resin multilayer module in which an electronic component is mounted on a resin multilayer substrate and a method for manufacturing the same.

  In recent years, resin multilayer modules have been developed in which various circuits are formed on a laminate in which a plurality of thermoplastic resin layers such as LCP (liquid crystal polymer) are stacked. Since this resin multilayer module is made of resin, it is strong against impacts such as dropping, has excellent mechanical strength, and has a low relative dielectric constant, compared to a ceramic multilayer module that uses ceramic as a base. Therefore, a module having excellent high frequency characteristics can be configured.

  Such a resin multilayer module, like the ceramic multilayer module, may include a chip-type electronic component such as a chip-type multilayer capacitor or a chip-type multilayer inductor as an element constituting the circuit.

  In such a case, it is common to connect the in-plane connection electrodes (lands) provided on the surface of the laminate and the terminal electrodes of the chip-type electronic component via solder. For example, in Patent Documents 1 to 3, for example, in Patent Documents 1 to 3, a method of connecting a via electrode (interlayer connection electrode) formed in a stacked body and a terminal electrode of a chip-type electronic component by solid phase diffusion. Is disclosed.

  Specifically, for example, as shown in the cross-sectional view for each process showing the manufacturing process of FIG. 10, the conductive paste 150 in which tin particles and silver particles are mixed in the via holes (through holes) 124 of the single-sided conductor pattern film 121. Fill and form a through-hole 135 having substantially the same dimensions as the electronic component 141 in the single-sided conductor pattern film 131, and pressurize and heat to form the laminate 100 by laminating these single-sided conductor pattern films 121 and 131. In this case, the conductive paste 150 is brought into contact with the tin plating layer on the outermost surface of the terminal electrode 142 of the chip-type electronic component 141, and the conductive composition 151 made of an alloy formed of the conductive paste 150 and the chip-type electronic The terminal electrode 142 of the component 141 is electrically connected through a solid phase diffusion layer formed at the interface (see, for example, Patent Document 1).

JP 2003-86949 A JP 2007-305694 A JP 2007-324550 A

  This technique is a technique in which tin of the terminal electrode 142 of the electronic component 141 and tin and silver of the via electrode (the conductive paste 150 filled in the via hole 124) are diffused and alloyed. Generally, the thickness of the tin plating layer in the terminal electrode of the chip-type electronic component is about 1 to 5 μm, and when the terminal electrode and the via electrode are alloyed, the molten tin of the terminal electrode moves to the via electrode side. , So-called "erosion" occurs, and a gap (void) like a Kirkendall void generated at the solder joint interface due to the difference in the diffusion rate of atoms is formed at the interface between the terminal electrode and the via electrode, Connection reliability of chip-type electronic components may not be obtained.

  In view of such a situation, the present invention intends to provide a resin multilayer module and a resin multilayer module manufacturing method capable of ensuring the connection reliability of chip-type electronic components.

  In order to solve the above-mentioned problems, the present invention provides a resin multilayer module configured as follows.

The resin multilayer module includes: (a) a laminated body in which a plurality of resin layers are laminated; (b) a chip-type electronic component disposed on or inside the laminated body; and (c) a surface of the laminated body or An in-plane connection electrode formed of a metal foil containing copper as a main component, and (d) an interlayer connection electrode that penetrates the resin layer, is made of metal particles, and is in contact with the in-plane connection electrode . In the electronic component, the outermost surface layer has a terminal electrode mainly composed of tin. An opening that penetrates the in-plane connection electrode is formed in the in-plane connection electrode. The outermost surface layer of the terminal electrode of the electronic component covers at least a part of the opening of the in-plane connection electrode and is in contact with the in-plane connection electrode at a portion adjacent to the opening by diffusion bonding. Connected by. The interlayer connection electrode is in contact with the outermost surface layer of the terminal electrode of the electronic component through the opening of the in-plane connection electrode and connected by diffusion bonding.

  According to the above configuration, when heating is performed to bond the resin layers, tin contained in the outermost surface layer of the terminal electrode of the electronic component is melted and becomes a Sn—Cu alloy together with copper contained in the in-plane connection electrode. The terminal electrode of the electronic component and the in-plane connection electrode of the laminate can be diffusion bonded. At this time, since the in-plane connection electrode in contact with the outermost surface layer of the terminal electrode of the electronic component is a metal foil mainly composed of copper, it is hard to melt compared with powdered copper or the like. The tin contained in the outermost surface layer does not move excessively to the in-plane connection electrode side so that a gap is formed at the interface between the terminal electrode of the electronic component and the in-plane connection electrode. Therefore, the connection reliability between the terminal electrode of the electronic component and the in-plane connection electrode can be ensured.

  In this case, when heating to bond the resin layers, the metal particles of the interlayer connection electrode melt and become an alloy together with the copper contained in the in-plane connection electrode in contact with the interlayer connection electrode. The inner connection electrode can be diffusion bonded. Thereby, the in-plane connection electrode, the interlayer connection electrode, and the terminal electrode are integrally connected by diffusion bonding, and connection reliability can be ensured.

  According to the above configuration, the terminal electrode of the electronic component and the interlayer connection electrode can be in contact with each other to be diffusion bonded. Since the terminal electrode and the interlayer connection electrode of the electronic component are in contact with each other through the opening formed in the in-plane connection electrode, the size and shape of the opening of the in-plane connection electrode, the opening of the in-plane connection electrode, and the electronic component The degree of the tin contained in the outermost surface layer of the terminal electrode of the electronic component moving to the interlayer connection electrode side and alloying can be controlled by the positional relationship with the terminal electrode. Therefore, the terminal electrode of the electronic component is bonded to both the in-plane connection electrode and the interlayer connection electrode, and connection reliability and bonding strength can be improved.

  Preferably, the in-plane connection electrode is made of only a metal material having a melting point higher than 260 ° C.

  When the resin multilayer module is mounted by reflow, the temperature inside the resin multilayer module usually does not exceed 260 ° C. during reflow. Since the in-plane connection electrode is made of copper alone having a melting point of more than 260 ° C. or an alloy of copper, silver, bismuth, etc., the terminal electrode of the electronic component is most suitable during reflow for mounting the resin multilayer module on the substrate. Even if the metal material contained in the outer surface layer is melted, the metal material contained in the in-plane connection electrode is not melted, so that no biting occurs. That is, tin contained in the outermost surface layer of the terminal electrode of the electronic component moves excessively to the in-plane connection electrode side, and a gap is generated at the interface between the terminal electrode and the in-plane connection electrode. There is no decline. Therefore, connection reliability can be ensured even after reflow.

  Moreover, in order to solve the said subject, this invention provides the manufacturing method of the resin multilayer module comprised as follows.

The method for producing a resin multilayer module is a method for producing a resin multilayer module in which chip-type electronic components are arranged on the surface or inside of a laminate in which a plurality of resin layers are laminated. The method for producing a resin multilayer module includes: (a) an in-plane connection electrode formed on at least one resin layer with a metal foil mainly containing copper, and a terminal electrode whose outermost surface layer is mainly tin. A laminating step of laminating the resin layers to form a laminate in a state where the outermost surface layer of the terminal electrode of the electronic component is in contact; and (b) heating the laminate to heat the resin layer A heating step of bonding each other, melting tin contained in the outermost surface layer of the terminal electrode of the electronic component, and connecting the terminal electrode of the electronic component and the in-plane connection electrode by diffusion bonding; Is provided. An opening that penetrates the in-plane connection electrode is formed in advance in the in-plane connection electrode. An interlayer connection electrode that penetrates the resin layer, is made of metal particles, and is exposed from the opening of the in-plane connection electrode is formed in advance in the resin layer on which the in-plane connection electrode is formed. In the heating step, an interface where the terminal electrode of the electronic component and the in-plane connection electrode are in contact is connected by diffusion bonding, and the terminal electrode of the electronic component and the interlayer connection electrode are connected to the in-plane connection electrode. These are connected by diffusion bonding through the openings.

  According to the above method, the electronic component can be connected to the in-plane connection electrode simultaneously with the thermocompression bonding of the resin layer.

  According to the present invention, connection reliability of a chip-type electronic component can be ensured.

It is an exploded sectional view of a resin multilayer module. Example 1 It is sectional drawing of a resin multilayer module. Example 1 It is a principal part expanded sectional view of a resin multilayer module. Example 1 It is a principal part top view of a resin multilayer module. (Example 2) It is a principal part expanded sectional view of a resin multilayer module. (Example 2) It is a principal part top view of a resin multilayer module. (Modifications 1 and 2) It is sectional drawing of a resin multilayer module. (Modification 3) It is a principal part expanded sectional view of a resin multilayer module. (Modification 4) It is a principal part expanded sectional view of a resin multilayer module. (Modification 5) It is sectional drawing which shows the manufacturing process of a resin multilayer module. (Conventional example)

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  <Example 1> The resin multilayer module 10 of Example 1 will be described with reference to FIGS. FIG. 1 is an exploded cross-sectional view of the resin multilayer module 10 before joining the resin layers. FIG. 2 is a cross-sectional view of the resin multilayer module 10 after joining the resin layers.

  As shown in FIGS. 1 and 2, the resin multilayer module 10 includes in-plane connection electrodes 14 a, 14 b, 16 and interlayer connection electrodes on the inside and surfaces 12 a, 12 b of the laminate 12 in which the resin layers 21 to 25 are laminated. 18 is formed. A chip-type electronic component 2 such as an IC chip, a chip capacitor, a chip coil, or a chip resistor is built in the laminated body 12, and the terminal electrode 6 and the in-plane connection electrode 16 of the electronic component 2 are in contact with each other by diffusion bonding. It is connected.

  For example, surface-mounted components are mounted on the in-plane connection electrodes 14 a and 14 b formed on the upper surface 12 a of the resin multilayer module 10. The in-plane connection electrodes 14s and 14t on the lower surface 12b side of the resin multilayer module 10 are used as terminals to be connected when the resin multilayer module 10 is mounted on another circuit board or the like.

  Next, a method for manufacturing the resin multilayer module 10 will be described.

  (1) First, as shown in FIG. 1, resin layers 21 to 25 on which in-plane connection electrodes 31 to 35 and interlayer connection electrodes 51 to 55 are formed are prepared.

  The resin layers 21 to 25 are produced using, for example, a resin sheet having a metal foil mainly composed of copper on one side. That is, a photosensitive resist is applied on the metal foil of the resin sheet, exposed and developed, a predetermined mask pattern is formed, the metal foil is etched through the mask pattern, and then the mask pattern is removed. Thus, in-plane connection electrodes 31 to 35 having a predetermined shape are formed. The in-plane connection electrodes 31 to 35 having a predetermined shape may be formed on the resin sheet by inkjet or plating.

  In addition, via holes (through holes) 41 to 45 are formed on the resin sheet by laser processing or drilling, and then, the interlayer connection electrodes 51 to 55 are formed by filling the conductive paste with printing or the like. The conductive paste is made of conductive powder having a composition alloyed with Sn, which is the surface layer of the terminal electrode of the electronic component 2, such as powder containing Sn / Au, Sn / Ag / Cu, Sn / Cu as a main component. A mixed solvent or epoxy resin is used.

  Moreover, about the resin layer 22 arrange | positioned around the electronic component 2, the through-hole 22x of the dimension and shape substantially the same as the electronic component 2 is formed by laser processing or drill processing.

  For the resin sheet, a material that is easy to process and has little deformation after processing is suitable. For example, a thermoplastic resin such as liquid crystal polymer (LCP), polyimide, or fluororesin is used. In particular, a liquid crystal polymer (LCP) is particularly preferable because of its low water absorption and extremely small deformation after etching.

  (2) Next, the electronic component 2 to be built in such as an IC chip or a chip capacitor is mounted at a predetermined position of the predetermined resin layer 23. At this time, the electronic component 2 may be fixed using an adhesive or a viscous liquid.

  (3) Next, the resin layers 21 to 25 are stacked and stacked in a predetermined order, pressed in the stacking direction, and evacuated to a temperature exceeding the glass transition temperature of the resin layers 21 to 25 (for example, 300 ° C.). Until the resin sheet which is the base material of the resin layers 21 to 25 is softened, and the resin layers 21 to 25 are pressure bonded. If necessary, the surface of the resin layers 21 to 25 is activated or laminated with an adhesive before lamination. In this thermocompression bonding process, the resin layers 21 and 22 arranged around the electronic component 2 are deformed so as to be softened and enclose the electronic component 2.

  In the thermocompression bonding step, the terminal electrode 6 of the electronic component 2 and the in-plane connection electrode 33 are simultaneously connected.

  Specifically, as shown in the enlarged cross-sectional view of the main part of FIG. 3, the terminal electrode 6 formed at the end of the body 4 of the electronic component 2 is composed of a plurality of layers 6a, 6b, 6c. In this case, the Cu layer 6c, the Ni layer 6b, and the Sn layer 6a are sequentially formed. Since the melting point of tin in the Sn layer 6a which is the outermost surface layer is as low as 232 ° C., it melts by heating during the thermocompression bonding process and becomes a Sn—Cu alloy together with the copper contained in the in-plane connection electrode 16, and the electronic component 2 The terminal electrode 6 and the in-plane connection electrode 33 are connected by diffusion bonding.

  (4) Next, after heating and pressure bonding, if necessary, the in-plane connection electrodes 31 and 35 exposed on the surfaces 12a and 12b of the laminate 12 are etched and plated to complete the resin multilayer module 10. To do. When a plurality of resin multilayer modules 10 are manufactured together, the resin multilayer modules 10 are divided into individual pieces by dicing or the like.

  Through the above steps, simultaneously with the thermocompression bonding of the resin layers 21 to 25, the terminal electrode 6 of the electronic component 2 and the in-plane connection electrode 33 can be connected by diffusion bonding.

  When the terminal electrode 6 of the electronic component 2 and the in-plane connection electrode 33 are connected by diffusion bonding, the in-plane connection electrode 33 contains copper as a main component and thus does not melt even when heated. Therefore, no biting occurs. That is, tin contained in the outermost surface layer 6a of the terminal electrode 6 of the electronic component 2 moves to the in-plane connection electrode 33 side excessively so that a gap is formed at the interface 33s between the terminal electrode 6 and the in-plane connection electrode 33. There is no end to it. Therefore, connection reliability between the terminal electrode 6 and the in-plane connection electrode 33 can be ensured.

  <Example 2> The resin multilayer module of Example 2 will be described with reference to FIGS.

  The resin multilayer module of Example 2 is configured in substantially the same manner as the resin multilayer module 10 of Example 1, and can be manufactured in substantially the same process. In the following description, the same reference numerals are used for the same components as in the first embodiment, and differences from the first embodiment will be mainly described.

  FIG. 4 is a plan view of an essential part of a resin layer on which the electronic component 2 is mounted. FIG. 5 is an enlarged cross-sectional view of a main part of the resin multilayer module.

  As shown in FIGS. 4 and 5, in the resin multilayer module of Example 2, the opening 33x is formed in the in-plane connection electrode 33a, and the interlayer connection electrode 53 is exposed from the opening 33x of the in-plane connection electrode 33a. It has become. The terminal electrode 6 of the electronic component 2 is in contact with both the vicinity of the opening 33x of the in-plane connection electrode 33a and the interlayer connection electrode 53 exposed from the opening 33x of the in-plane connection electrode 33a. The opening 33x can be formed simultaneously when the through hole 43 is formed in the resin layer 23 by laser processing or drilling. When the in-plane connection electrode 33a is formed in a predetermined shape, the opening 33x may be formed at the same time.

  The resin multilayer module of Example 2 is manufactured by laminating a resin layer and thermocompression bonding like the resin multilayer module 10 of Example 1.

  As a result of heating during thermocompression bonding, the tin contained in the outermost surface layer 6a of the terminal electrode 6 is melted at the interface 33p where the terminal electrode 6 of the electronic component 2 and the in-plane connection electrode 33a are in contact with each other. Are connected by diffusion bonding.

  Further, at the interface 53p between the terminal electrode 6 of the electronic component 2 and the interlayer connection electrode 53, tin contained in the outermost surface layer 6a of the terminal electrode 6 is melted, and a metal material contained in the interlayer connection electrode 53, for example, Sn, Together with Ag, Cu, Bi, Zn, Au, Ni, it becomes an alloy such as Sn-Ag, Sn-Cu, Sn-Bi, Sn-Zn, Sn-Au, Sn-Ni, and the terminal electrode 6 of the electronic component 2 The interlayer connection electrode 53 is connected by diffusion bonding through the opening 33x of the in-plane connection electrode 33a.

  The tin contained in the outermost surface layer 6a of the terminal electrode 6 of the electronic component 2 is easily alloyed with the metal material in the interlayer connection electrode 53, compared to copper, which is the main component of the in-plane connection electrode 33a. The fixing strength between the terminal electrode 6 and the interlayer connection electrode 53 is stronger than the fixing strength between the terminal electrode 6 of the electronic component 2 and the in-plane connection electrode 33a.

  Since tin contained in the outermost surface layer 6a of the terminal electrode 6 of the electronic component 2 moves to the interlayer connection electrode 53 side through the opening 33x formed in the in-plane connection electrode 33a, the in-plane connection electrode 33a Depending on the size and shape of the opening 33x, the positional relationship between the opening 33x of the in-plane connection electrode 33a and the terminal electrode 6 of the electronic component 2, tin contained in the outermost surface layer of the terminal electrode 6 of the electronic component 2 may be reduced. It is possible to adjust the state in which the terminal electrode 6 of the electronic component 2 is connected to the in-plane connection electrode 33a and the interlayer connection electrode 53 by controlling the degree of alloying by moving to the interlayer connection electrode 53 side. Therefore, connection reliability and bonding strength can be improved. Specifically, the larger the contact portion between the terminal electrode 6 and the interlayer connection electrode 53, the more the terminal electrode 6 and the interlayer electrode are alloyed with the interlayer electrode 53.

  <Modification 1> As shown in the plan view of the main part of FIG. 6A, two or more openings 33 y are formed in the portion where the in-plane connection electrode 33 m is in contact with each terminal electrode 6 of the electronic component 2. The interlayer connection electrode 53 may be exposed from each opening 33y.

  <Modification 2> Like the in-plane connection electrode 33n shown in the plan view of the main part in FIG. 6B, an opening 33z is formed through which the interlayer connection electrode 53 is exposed, and is connected to the terminal electrode 6 of the electronic component 2. However, a configuration may be adopted in which a wiring portion extending along the resin layer is not formed.

  <Modification 3> The resin multilayer module 11 of Modification 3 shown in the cross-sectional view of FIG. 7 includes in-plane connection electrodes 15a, 15b, 15s, and the like on the inside and surfaces 13a and 13b of the laminate 13 in which the resin layers are laminated. 15t, 17 and interlayer connection electrodes 19a to 19f are formed. Openings 15x and 15y are formed in the in-plane connection electrodes 15a and 15b on the surface 13a of the multilayer body 13, and the interlayer connection electrodes 19a and 19b are exposed from the openings 15x and 15y.

  The terminal electrode 6 of the chip-type electronic component 2 disposed on the upper surface 13 of the multilayer body 13 includes a portion around the opening 15x of the in-plane connection electrode 15a in which the opening 15x is formed, and the in-plane connection electrode 15a. In contact with the interlayer connection electrode 19a exposed from the opening 15x, as in Example 2, the tin contained in the outermost surface layer of the terminal electrode 6 is melted by heating, and the terminal electrode 6 of the electronic component 2 becomes the in-plane connection electrode 15a and the interlayer connection electrode 19a are both connected by diffusion bonding.

  Further, the bump 7 that is a terminal electrode of the chip-type electronic component 3 disposed on the upper surface 13 of the multilayer body 13 includes a portion around the opening 15y of the in-plane connection electrode 15b in which the opening 15y is formed, It contacts the interlayer connection electrode 19b exposed from the opening 15y of the inner connection electrode 15b. As in Example 2, the tin contained in the outermost surface layer of the bump 7 is melted by heating, and the bump 7 is connected to the in-plane connection electrode 15b and the interlayer connection electrode 19b by diffusion bonding.

  <Modification 4> As shown in the enlarged cross-sectional view of the main part of FIG. 8, the openings formed in the in-plane connection electrodes 33b and 33c connected to the terminal electrode 6 of the electronic component 2 are different from those of the second embodiment. The entire circumference is not surrounded by the in-plane connection electrodes 33b and 33c.

  The outer peripheral edges of the in-plane connection electrodes 33b and 33c cross the opening of the through hole 43 formed in the resin layer 23, and only a part of the opening of the through hole 43 is covered with the in-plane connection electrodes 33b and 33c. In other portions 23x and 23y of the opening of the through hole 43, the interlayer connection electrodes 53b and 53c formed in the through hole 43 are exposed. The terminal electrode 6 of the electronic component 2 is in contact with both of the adjacent in-plane connection electrodes 33b and 33c and the interlayer connection electrode 53, and the terminal electrode 6 of the electronic component 2 is heated by the heat-compression of the resin layer. Both the interfaces 33s and 33t with the internal connection electrodes 33b and 33c and the interfaces 53s and 53t with the conductive pastes 53b and 53c are connected by diffusion bonding.

  The openings of the in-plane connection electrodes 33b and 33c may be formed outside the electronic component 2 as shown in FIG. 8A, or may be formed inside the electronic component 2 as shown in FIG. 8B. .

  <Modification 5> As shown in the enlarged cross-sectional view of the main part in FIG. 9, a conductive paste 53 k is applied to the surface of the resin layer 23. In a state where the terminal electrode 6 of the electronic component 2 is in contact with both the conductive paste 53k and the in-plane connection electrode 33k formed of a metal foil mainly composed of copper, the resin layer is thermocompression bonded. As a result, the terminal electrode 6 of the electronic component 2 is connected by diffusion bonding at the interface 33r with the in-plane connection electrode 33k and the interface 53r with the in-plane connection electrode portion formed by the conductive paste 53k.

  <Summary> As described above, the connection reliability can be ensured by connecting the terminal electrode of the electronic component and the in-plane connection electrode by diffusion bonding.

  The present invention is not limited to the above embodiment, and can be implemented with various modifications.

2,3 Electronic parts 6,7 Terminal electrode 6a Outermost surface layer 10,11 Resin multilayer module 12 Laminated body 12a Upper surface (surface)
12b Bottom surface (surface)
13 Laminated body 13a Upper surface (surface)
13b Bottom surface (surface)
14a, 14b, 14s, 14t In-plane connection electrodes 15a, 15b, 15s, 15t In-plane connection electrodes 15x, 15y Openings 16, 17 In-plane connection electrodes 18, 19a-19f Interlayer connection conductors 21-25 Resin layers 31-35 In-plane connection electrodes 33a, 33b, 33c, 33k, 33m, 33n In-plane connection electrodes 33x, 33y, 33z Openings 41 to 45 Via holes (through holes)
51, 52, 53, 53b, 53c, 54, 55 Interlayer connection electrode

Claims (3)

A laminate in which a plurality of resin layers are laminated;
A chip-type electronic component disposed on the surface or inside of the laminate; and
An in-plane connection electrode formed of a metal foil mainly composed of copper on the surface or inside of the laminate, and
An interlayer connection electrode penetrating the resin layer, made of metal particles, and in contact with the in-plane connection electrode;
With
The electronic component has a terminal electrode whose outermost surface layer is mainly composed of tin,
An opening that penetrates the in-plane connection electrode is formed in the in-plane connection electrode,
The outermost surface layer of the terminal electrode of the electronic component covers at least a part of the opening of the in-plane connection electrode and is in contact with the in-plane connection electrode at a portion adjacent to the opening by diffusion bonding. Connected by
The resin multilayer module, wherein the interlayer connection electrode is in contact with the outermost surface layer of the terminal electrode of the electronic component through the opening of the in-plane connection electrode and connected by diffusion bonding . 2. The resin multilayer module according to claim 1 , wherein the in-plane connection electrode is composed only of a metal material having a melting point higher than 260 ° C. 3. A method for producing a resin multilayer module in which chip-type electronic components are arranged on the surface or inside of a laminate in which a plurality of resin layers are laminated,
The outermost surface layer of the terminal electrode of the electronic component has a terminal electrode whose main component is tin as an in-plane connection electrode formed on at least one of the resin layers by a metal foil whose main component is copper. In a state where the outer surface layer is in contact, a laminating step of laminating the resin layer to form a laminate,
The laminated body is heated to bond the resin layers together, and tin contained in the outermost surface layer of the terminal electrode of the electronic component is melted, whereby the terminal electrode of the electronic component and the in-plane connection electrode And a heating process for connecting them by diffusion bonding,
Equipped with a,
In the in-plane connection electrode, an opening that penetrates the in-plane connection electrode is formed in advance,
In the resin layer on which the in-plane connection electrode is formed, an interlayer connection electrode that penetrates the resin layer and is made of metal particles and is exposed from the opening of the in-plane connection electrode is formed in advance.
In the heating step,
The interface where the terminal electrode and the in-plane connection electrode of the electronic component are in contact is connected by diffusion bonding,
The method of manufacturing a resin multilayer module, wherein the terminal electrode of the electronic component and the interlayer connection electrode are connected by diffusion bonding through the opening of the in-plane connection electrode .

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