JP5098684B2 - Component mounting board, manufacturing method thereof, input device, and electronic apparatus - Google Patents

Description

  The present invention relates to a digital camera equipped with an input device having a sliding operation function and a pressing operation function, a video camera, a mobile phone, a mobile terminal device, a personal computer (hereinafter referred to as a PC), a notebook PC, and a home electronic device. The present invention relates to a component mounting board applicable to a device and its remote controller, a manufacturing method thereof, an input device, and an electronic device.

  Specifically, a substrate having a flexible structure capable of bending the second substrate surface onto the first substrate surface is formed such that the opening of the substrate is positioned on the component to be operated on the first substrate surface. The board can be mounted in a state where the board is bent with respect to the housing, and after the board is mounted, the part to be operated on the board first surface is opened from the board second surface side through the opening on the housing operation surface. It can be operated.

  In recent years, a user (operator) has photographed a subject using a digital camera equipped with various types of operation modes, or has taken various contents into a mobile terminal device such as a mobile phone or a PDA (Personal Digital Assistants) It has come to use it. These digital cameras, portable terminal devices, and the like are provided with an input device. In many cases, a keyboard, an input means such as a JOG dial, a touch panel combined with a display unit, or the like is used as the input device.

  FIG. 35 is a cross-sectional view showing a configuration example of an input device 500 according to a conventional example. An input device 500 illustrated in FIG. 35 includes a housing 501, a rotary operation element (hereinafter referred to as a JOG dial 502), a circuit board 503, and a dome switch 504. The input device 500 includes a casing 501 having a predetermined size. An opening 505 is provided on a side of the casing 501, and a key top portion of the JOG dial 502 is exposed from the opening 505. It is mounted on the circuit board 503. The JOG dial 502 has a circular shape and is rotatably attached to the circuit board 503 via a shaft 506 (rotating shaft). The JOG dial 502 is configured so that most of the JOG dial 502 occupies the inside of the casing except the key top portion.

  A magnetic body such as a magnet (not shown) is provided on the back surface of the JOG dial 502, and is located at a position interlinking with the magnetic field generated by the magnetic body. The circuit board 503 has a predetermined angle with the two Hall ICs 507 and 508. Is mounted, and when the magnetic body on the back of the JOG dial crosses the Hall ICs 507 and 508, a two-phase rotation detection signal is output.

  Further, the shaft 506 is biased by a biasing member (not shown) from the circuit board 503 toward the outside of the housing 501. The circuit board 503 facing the axis direction of the shaft 506 is provided with a dome switch 504, and the dome switch 504 can be turned on or off by pushing the JOG dial 502 over the urging force of the urging member. Yes.

  In relation to an input device provided with this type of JOG dial, Patent Document 1 discloses a portable information terminal and a program. According to this portable information terminal, the terminal device main body is provided with a display unit, and a JOG dial substantially at the center of the main body. The JOG dial is provided at a position different from the display unit. The JOG dial is rotated clockwise or counterclockwise, and the image displayed on the display unit is rotated in conjunction with the rotation. In addition, when the JOG dial is pressed in the direction of the main body, the image range is changed. By configuring the information terminal in this way, various operations can be executed more comfortably.

  FIG. 36 is a cross-sectional view showing a configuration example of another input device 600 according to a conventional example. An input device 600 shown in FIG. 36 includes a non-rotating key top 602 having a flat surface. The input device 600 includes a housing 601 having a predetermined size. An opening 605 is provided on a side of the housing 601, and the key top 602 is exposed from the opening 605 with respect to the circuit board. It is mounted movably. The key top 602 is combined with the opening 605 of the housing 601, and the non-operation surface is mounted toward the inside of the housing 601. The key top 602 includes a flange-shaped flange 606, and the flange 606 is hooked inside the opening 605. This prevents the key top 602 from coming out of the opening 605.

  A circuit board 603 is provided inside the key top 602, and a dome switch is provided on the circuit board 603, and is operated to be turned on and / or off by pushing the key top 602. Inside the key top 602, a sensor sheet 613, a pusher 619, a dome switch 604, and a circuit board 603 are arranged in this order. The pusher 619 is disposed so as to be sandwiched between the sensor sheet 613 and the side portion of the circuit board 603. As described above, when the key top 602 having a flat surface is attached to the side portion of the casing, it is possible to adopt a structure in which the key top portion hardly occupies the casing as compared with the JOG dial described above.

  Furthermore, in connection with the key top exposed from the opening, Patent Document 2 discloses an input device. According to this input device, a window hole is provided at a predetermined position of the casing, and an operation button exposed from the window hole is slid to select an item, or another operation knob is pressed to perform page feed or Changed the item selection screen such as scrolling. By configuring the apparatus in this way, the item selection operation can be executed easily and accurately.

Japanese Unexamined Patent Publication No. 2003-256120 (pages 2 to 3 and FIG. 1) Japanese Patent Laying-Open No. 2005-063230 (FIG. 16 on page 9)

  By the way, according to a digital camera with a tactile input function and an electronic apparatus such as an information processing device, a mobile phone, and an information portable terminal device according to the conventional example, there are the following problems.

  i. According to the input device 500 shown in FIG. 35, a portable information terminal in which the display unit and the JOG dial as shown in Patent Document 1 are arranged separately, the JOG dial is mostly composed of the key top portion. The form which occupies the inside of a housing | casing is taken. Accordingly, an area (space) for mounting other components is reduced, and the electronic device to which the input device is applied is prevented from being made compact.

  ii. According to the input device 600 shown in FIG. 36, since a circuit board mounting structure in which two circuit boards 603 and a sensor sheet 613 that are separately prepared are individually mounted on the housing 601 is adopted, detection during a sliding operation is performed. When a circuit for transmitting a signal from the sensor sheet 613 to the circuit board 603 is to be configured (tracing detection function), a flexible printed wiring (FPC) routing process that connects between them, an FPC connector mounting process, etc. It will be forced to add.

  iii. By the way, according to the input device as seen in Patent Document 2, an operation button exposed from a window hole provided in a predetermined position of the casing is slid to select an item, or another operation knob is pressed. The item selection screens such as page turning and scrolling are switched, but the operation mechanism is complicated, and there is a concern that the size and operability of the operation unit may be reduced or malfunction may occur. As described above, there is a problem that the assembly process of the circuit board to the housing is complicated, the wiring routing and connection process between the boards is complicated, and the cost and size of the electronic device mounted with these input devices are increased. is there.

  Therefore, the present invention solves such a conventional problem, and devise a board mounting method to simplify the process of incorporating the board into the housing, and to perform the wiring routing connection process between the boards. It is an object to provide a component mounting board, a manufacturing method thereof, an input device, and an electronic device that can be omitted.

The component mounting board of the present invention has a flexible board having an opening at a predetermined position, one side of the board as the first board, and the other side of the board as the board first. When there are two surfaces, at least a first switch member for pressing operation mounted on the first surface of the substrate and a plurality of second switch members for pressing operation installed on an operation surface different from the first switch member A sheet-like support member that supports the plurality of second switch members; a sheet-like detection member that is mounted on the second surface of the substrate and integrated with the support member; and a substrate and a wiring pattern provided over the substrate second surface from the first surface, bent the substrate second surface to the first surface on the substrate so as to open the mouth portion to the first switch member on the substrate first surface is located and those having a flexible structure.

  With the component mounting board according to the present invention, the board can be mounted in a state in which the board is bent with respect to a predetermined housing. In addition, after mounting the board, it becomes possible to operate the operated component on the first board surface from the second board surface side through the opening on the housing operation surface.

The method for manufacturing a component mounting board according to the present invention includes a step of forming an opening at a predetermined position of a flexible board, one side of the board as a board first side, and the other side of the board as the other side. When the substrate second surface is used, at least a step of mounting a first switch member for pressing operation on the substrate first surface, a step of forming a wiring pattern from the substrate first surface to the substrate second surface, A sheet-like detection member for detecting a sliding operation integrated with a sheet-like support member for supporting a plurality of second switch members for pressing operation installed on an operation surface different from the switch member a step of mounting the second surface, a step of folding the second surface of the substrate to the substrate first surface so as to be positioned to open the mouth portion to the first switch member on which is mounted on the substrate first surface, the folded substrate the is also of a that have a a step of mounting a predetermined housing.

  According to the component mounting board manufacturing method of the present invention, the assembly process is simplified and the wiring routing and connection process is omitted as compared with the case where two individually prepared boards are individually mounted on the housing. be able to.

An input device of the present invention is an input device that inputs information by a sliding operation by an operating body, and is provided in a casing having an operating surface, and a sheet-like detection member that detects a sliding position of the operating body; The component mounting board is provided so as to cover a part or all of the detection member and has an operation unit that is slid along the operation surface of the housing, and the component mounting board is opened at a predetermined position. And a flexible substrate, and when one surface of the substrate is a substrate first surface and the other surface of the substrate is a substrate second surface, at least the substrate first surface The first switch member for pressing operation mounted on the sheet, the plurality of second switch members for pressing operation installed on the operation surface different from the first switch member, and the sheet supporting the plurality of second switch members And a support member that extends from the first surface to the second surface of the substrate. Was a wiring pattern, have a flexible structure folded substrate second surface of the substrate first surface so that the opening of the substrate to the first switch member on the substrate first surface is located, The detection member is mounted on the second surface of the substrate and is integrated with the support member .

  According to the input device of the present invention, since the component mounting board and the manufacturing method thereof according to the present invention are applied, the assembly process is compared with the case where two separately prepared boards are individually mounted on the housing. Can be simplified, and the wiring routing and connection process can be omitted.

An electronic device of the present invention includes a housing having an operation surface and an input device that is provided in the housing and inputs information by a sliding operation using an operation body. The input device includes a housing having an operation surface. A sheet-like detection member that is provided in the body and detects the sliding position of the operation body, and an operation unit that is provided so as to cover part or all of the detection member and is slid along the operation surface of the housing The component mounting substrate has an opening at a predetermined position and has a flexibility, and one surface of the substrate is a substrate first surface. When the other surface of the substrate is the second surface of the substrate, at least a first switch member for pressing operation mounted on the first surface of the substrate and a pressing operation installed on an operation surface different from the first switch member Second switch members and sheet-like shape supporting the second switch members A support member, the substrate and the second surface of the substrate so as a wiring pattern provided over the second surface of the substrate from the substrate first surface, the openings of the substrate to the first switch member on the substrate first surface is located It has a flexible structure that is folded on the first surface, and the detection member, while being mounted on the substrate second surface, in which is integrated with the support member.

  Since the input device according to the present invention is applied to the electronic apparatus according to the present invention, the assembly process can be simplified and wiring can be performed as compared with the case where two individually prepared boards are individually mounted on the housing. The routing connection process can be omitted.

  According to the component mounting board and the manufacturing method thereof according to the present invention, the second board surface can be folded on the first board surface so that the opening of the board is positioned on the operated component on the first board board. It has a flexible structure.

  With this structure, the substrate can be mounted in a state in which the substrate is bent with respect to a predetermined housing. Therefore, the assembling process can be simplified as compared with the case where two individually prepared substrates are individually mounted on the housing, and the wiring routing and connecting process can be omitted. In addition, after mounting the board, it becomes possible to operate the operated component on the first surface of the board through the opening from the second face side of the board on the housing operation face. As a result, it is possible to reduce the size of the electronic device incorporating the component mounting board and significantly reduce the cost.

  According to the input device of the present invention, since the component mounting board and the manufacturing method thereof according to the present invention are applied, the assembly process is compared with the case where two separately prepared boards are individually mounted on the housing. Can be simplified, and the wiring routing and connection process can be omitted. In addition, after mounting, the operated component on the first surface of the substrate can be operated from the second surface side of the substrate through the opening on the housing operation surface. As a result, it is possible to reduce the size of the input device incorporating the component mounting board and significantly reduce its cost.

  Since the input device according to the present invention is applied to the electronic apparatus according to the present invention, the assembly process can be simplified and wiring can be performed as compared with the case where two individually prepared boards are individually mounted on the housing. The routing connection process can be omitted. In addition, after mounting, the operated component on the first surface of the substrate can be operated from the second surface side of the substrate through the opening on the housing operation surface. As a result, it is possible to reduce the size and cost of the electronic device incorporating the input device.

  Subsequently, an embodiment of a component mounting board, a manufacturing method thereof, an input device and an electronic apparatus according to the present invention will be described with reference to the drawings.

  FIG. 1 is a perspective view showing a configuration example of a component mounting board 101 as a first embodiment. A component mounting board 101 shown in FIG. 1 is applicable to a digital camera, a video camera, a mobile phone, a mobile terminal device, a personal computer (hereinafter referred to as a PC), a notebook PC, various electronic devices, and a remote controller thereof. And a flexible substrate 10 having flexibility and having a predetermined width W1 and length L1. Although the width W1 depends on the size of the casing, for example, when applied to the side surface of the mobile phone, W1 = about 10 mm and the length L1 is about 100 mm. As the substrate 10, a substrate having a thickness of several tens μm to several hundreds μm with a rolled copper foil on both sides of the base film is used.

  In this example, when one surface of the substrate 10 is a substrate first surface (hereinafter simply referred to as I surface) and the other surface of the substrate 10 is a substrate second surface (hereinafter simply referred to as II surface), at least the substrate A driver IC device 5 and an LED light source 6 that constitute an example of an operated component are mounted on the I-plane side of 10. In addition to the IC device 5, the LED light source 6, and the like, a switch member for pressing operation is mounted on the operated component on the I surface side of the substrate 10. A dome switch 25 is used as the switch member.

  A detection member for detecting a sliding operation that constitutes an example of another operated component is mounted on the II surface side of the substrate 10. For example, a sheet-like capacitance sensor is used as the detection member, and the sliding operation of the operator's finger is detected. The capacitance sensor is composed of, for example, a plurality of charge storage electrode patterns 7 arranged in a line, a dielectric (not shown), and an opposite electrode pattern. In addition to the capacitance sensor, a sheet-like resistive film sensor is used as the detection member.

  An opening 10a is provided at a predetermined position of the substrate 10, and the operated component on the I surface side, in this example, the dome switch 25 is operated from the II surface side of the substrate 10 through the opening 10a. . The opening 10a has a width of w1 and a length of l1. The component mounting board 101 has a flexible structure. Here, the flexible structure refers to a structure in which the II surface of the substrate 10 is bent on the I surface so that the opening 10a is positioned on the operated part on the I surface side of the substrate 10. When such a component mounting structure is adopted, after assembly, together with the capacitance sensor (operated component) on the II surface of the substrate 10, the dome switch 25 (on the I surface from the II surface side through the opening 10a) The operated parts) can be operated simultaneously or individually.

  A wiring pattern 8 extending from the I surface side to the II surface side is provided on the substrate 10. The wiring pattern 8 is a wiring from a flat electrode (not shown) such as the driver IC device 5 on the I surface side of the substrate 10 to the electrode pattern 7 for accumulating charges on the capacitance sheet on the II surface side of the substrate 10. Is made. In the middle, the wiring surface is replaced with a contact hole penetrating from the I surface side to the II surface side of the substrate 10. By adopting such a wiring pattern structure, it is possible to omit a wiring routing connection process for connecting two separately prepared substrates. Further, since the space for the flexible wiring connector (FPC) can be omitted, the electronic device can be downsized and its cost can be greatly reduced.

  Then, the manufacturing method of the component mounting board | substrate 101 which concerns on this invention is demonstrated. 2 to 7 are process diagrams showing formation examples (No. 1) to (No. 6) of the component mounting board 101. FIG. The case where the component mounting board | substrate 101 for input devices which can be operated on side surfaces of housing | casing, such as a mobile telephone, is mentioned as an example. FIG. 2B is a cross-sectional view of the substrate 10 of FIG.

  First, a long and thin board 10 as shown in FIG. 2A for obtaining the component mounting board 101 is prepared. For example, a flexible substrate material having copper foils 11a and 11b on both sides is cut to obtain a substrate 10 having a longitudinal portion. The width W1 of the substrate 10 is about 10 mm, and the length L1 is about 100 mm. As the substrate material, one obtained by rolling copper foils 11a and 11b having a film thickness of about 18 μm on both sides of a base film 11c having a polyimide composition having a film thickness of about 25 μm is used.

  Next, in the example of forming the electrode pattern 7 and the wiring pattern 8 shown in FIGS. 3A to 3C and FIGS. 4A and B, the electrode pattern 7, the wiring pattern 8, and the cover film are formed on the flexible elongated substrate 10 having double-sided copper foil. 9a-9d etc. are formed. The electrode pattern 7 forms a plate electrode for mounting the IC device 5 for driver, LED light source 6, dome switch 25, etc. on the I surface side of the substrate 10, and the capacitance sheet on the II surface side of the substrate 10 The storage electrode is formed. The storage electrode and the like of the capacitance sheet constitute another operated part. In this example, the storage electrodes are formed so as to be distributed on both sides of the opening 10a. The wiring pattern 8 forms a wiring from the flat plate electrode of the driver IC device 5 or the like on the I surface side of the substrate 10 to the storage electrode or the like of the capacitance sheet on the II surface side of the substrate 10.

  When the electrode pattern 7 and the wiring pattern 8 are formed, first, a predetermined resist material 91 (not shown) is applied to the entire surface of the substrate 10 shown in FIG. 3A. Next, as shown in FIG. 3B, the resist material 91 on the substrate 10 is patterned. For example, the resist material on the substrate 10 is exposed by photolithography using a reticle (dry plate) (not shown) on which the target electrode pattern 7 or wiring pattern 8 is baked, and mask resist films 91a and 91b. , 91c and the like.

  Thereafter, unnecessary portions of the copper foils 11a and 11b are removed by immersing them in an etching solution or the like using the resist films 91a, 91b and 91c on the substrate 10 shown in FIG. 3C as a mask. Accordingly, the driver IC device 5 on the I surface side of the substrate 10, the electrode light source 7 for mounting the LED light source 6, the dome switch 25, etc. A wiring pattern 8 extending from the electrode to the storage electrode of the capacitance sheet on the II surface side of the substrate 10 can be formed. Further, a contact hole (not shown) may be formed in the substrate 10 to connect the wiring pattern 8 on the I surface side and the wiring pattern 8 on the II surface side of the substrate 10 through the contact hole.

  Thereafter, plating is performed on the copper foil forming the wiring pattern 8 shown in FIG. 4A. In this example, first, copper foils 11a and 11b on the front and back sides of the substrate 10 are plated with copper (Cu) for plating growth adjustment having a film thickness of about 15 μm to obtain a Cu layer (not shown). Next, nickel (Ni) for plating base having a film thickness of about 2 to 6 μm is plated on the Cu layer to obtain the Ni layer 12a on the front surface and the Ni layer 12b on the back surface. Further, surface protective gold (Au) having a film thickness of about 0.03 μm or more is plated on the Ni layers on the front and back surfaces to obtain the Au layer 13a on the front surface and the Au layer 13b on the back surface.

  Next, cover films 9a to 9b are formed between the electrode patterns 7 and the wiring pattern 8 shown in FIG. 4B. The cover films 9a to 9b are obtained by applying a polyimide member between portions that insulate the wiring pattern 8 or between the patterns. Note that the cover film 9a and the like are not formed on the electrodes for mounting the driver IC device 5, the LED light source 6, the dome switch 25, and the like. A protective film (tape) is pasted on these electrodes in advance, and a polyimide member is applied using the protective film as a mask. The protective film is peeled off after applying the member. Thereby, the said electrode surface can be protected until the time of component attachment.

  When the flexible substrate 10 with the electrode pattern 7 and the wiring pattern 8 is prepared, an opening 10a having a size w1 × 11 is formed at a predetermined position of the substrate 10 shown in FIG. 5A. Although the opening 10a depends on the part to be operated, the width w1 and the length l1 are about 1 mm to 10 mm on a side when the opening 10a is square. In this example, an opening 10a of about 3 mm × 3 mm that penetrates the substrate 10 is formed. The opening position is a portion of X mm from the right end of the substrate 10 so that the opening 10a is located at the upper center of the dome switch 25 as shown in FIG. 5B. The opening 10a is punched and opened using, for example, a press machine.

  Next, a driver IC device 5, an LED light source 6, a dome switch 25, and the like, which are examples of operated components, are attached to the I surface of the substrate 10 shown in FIG. 6A. The IC device 5, the LED light source 6 and the like are soldered to a flat plate electrode or the like by a solder bonding technique. Soldering may be performed by wire bonding using a predetermined lead frame or a flip chip bonding method using solder bumps. The dome switch 25 includes a switch portion 25a and a cover member 25b as shown in FIG. 6B. As a result, a sensor sheet for detecting the pressing operation can be formed on the I surface side of the substrate 10.

  Here, on the II surface side of the substrate 10, an electrode pattern or the like for a counter electrode (not shown) facing the storage electrode of the capacitance sheet is attached. A dielectric is formed between the storage electrode and the counter electrode. Thereby, a sensor sheet 1b for detecting a sliding (tracing) operation can be formed on the II surface side of the substrate 10.

  When the substrate 10 extending integrally from the sensor sheet for detecting the pressing operation to the sensor sheet 1b for detecting the sliding operation is prepared, the dome switch 25 mounted on the I surface of the substrate 10 shown in FIG. 7A. The II surface is bent on the I surface so that the opening 10a of the substrate 10 is located above. In this example, the bent portion III is set in a direction orthogonal to the longitudinal direction of the longitudinal portion of the substrate 10 shown in FIG. 6A. Then, the II surface of the substrate 10 is bent on the I surface of the substrate 10 at the bending portion III.

  When the bent portion III is set in the longitudinal portion of the substrate 10, a large number of unfolded substrates 10 can be allocated from a single substrate material, members that are cut off unnecessarily can be reduced, and the production yield can be improved. (See FIG. 11). When the bent substrate 10 is mounted on a predetermined housing, the input device 100 having a pressing operation detection function and a sliding operation detection function can be formed (see FIG. 9).

  Thus, according to the component mounting board 101 and the manufacturing method thereof as the first embodiment, the board 10 is arranged such that the opening 10a of the board 10 is positioned on the dome switch 25 on the I surface side of the board 10. It has a flexible structure in which the II surface side is bent on the I surface side.

  Accordingly, the substrate can be mounted in a state in which the substrate 10 is bent with respect to a casing of a cellular phone or the like. For example, the assembly process can be simplified and the wiring routing and connection process can be omitted as compared with the case where two separately prepared boards are individually mounted on the housing. Incidentally, an FPC connector having a size of 7 mm × 4 mm × 0.8 mm and an FPC wiring extension portion are not required as compared with the configuration of the conventional FPC separate part assembly method. When assembling the apparatus, the tact time of about 5 seconds can be reduced (simplified).

  Moreover, since the dome switch 25 on the I surface can be operated from the II surface side of the substrate 10 through the opening 10a on the casing operation surface (identical appearance surface of the product) after mounting the substrate, compared with the conventional method. Cost per unit can be reduced by several hundred yen. As a result, the manufacturing process can be simplified, the electronic device incorporating the component mounting board 101 can be downsized, and the cost can be significantly reduced.

  FIG. 8 is a perspective view showing a configuration example of a mobile phone 200 as a second embodiment on which the component mounting board 101 according to the present invention is mounted. A mobile phone 200 shown in FIG. 8 constitutes an example of an electronic device, and includes the input device 100 according to the present invention, and is configured to input information by an operating body (sliding operation and pressing operation with a user's finger or the like). The mobile phone 200 includes an upper housing 20 and a lower housing 40.

  The upper housing 20 and the lower housing 40 are foldably engaged by the hinge mechanism 11. According to the hinge mechanism 11, the shaft portion provided at one end of the upper housing 20 and the bearing portion provided at one end of the lower housing 40 are rotatably engaged, and the upper housing 20 is in the lower housing. The body 40 is connected to the body 40 in a single-open manner with a degree of freedom of rotation of 120 ° to 180 °.

  The upper housing 20 includes a display unit 29 and an ultra-small speaker 36a. The display unit 29 displays input information such as a plurality of button icons. A speaker 36 a is provided above the upper housing 20 and above the display unit 29, and is used as a telephone receiver (receiver).

  The lower housing 40 has an upper operation surface and a side operation surface. An operation panel 18 including a plurality of push button switches 24 and the like is provided on the upper operation surface of the lower housing 40. The push button switch 24 includes “0” to “9” numeric keys, symbol keys such as “*” and “#”, hook buttons such as “on” and “off”, menu keys, and the like. A key top 42 constituting a side jog is provided on the side operation surface. The key top 42 constitutes an example of the operation unit, and has a convex shape that rises from one of the side operation surfaces of the lower housing 40 along the sliding direction and rises toward the other side operation surface. Have.

  The component mounting board 101 as described in the first embodiment is provided inside the lower housing 40. The component mounting board 101 includes a flexible board 10, and the board 10 is obtained by integrating a pad sheet 1a for an operation panel and a sensor sheet 1b for detecting a sliding operation. The pad sheet 1a includes “0” to “9” numeric keys, symbol keys such as “*” and “#”, hook buttons such as “on” and “off”, and a plurality of push button switches 24 such as menu keys. Configure the base sheet. Part of the pad sheet 1a also serves as a sensor sheet for detecting a pressing operation.

  A sensor sheet 1b having an electrode pattern is provided on one side of the component mounting board 101. When the mobile phone 200 is operated with the right hand, the sliding position of the operator's finger 30a (see FIG. 9) is detected. Operate. The sensor sheet 1b is a capacitance sheet member that detects the displacement of the sliding position by converting the displacement into capacitance. When the sensor sheet 1b made of the electrostatic capacitance sheet member is mounted, the sliding position of the operator's finger is detected and the position detection signal S1 is output. The “cursor moving method” described in Japanese Patent No. 3920833 and the “coordinate input device” described in Japanese Patent No. 3909230 can be applied to the capacitance sheet member.

  In addition to the capacitance sheet member, a pressure detection sheet member using a piezoresistance effect is used for the sensor sheet 1b. The pressure detection sheet member reads a resistance change caused by pushing of the sliding position and converts it into an electric signal. The “force sensor, force detection system, and force detection program” described in JP-A-2005-326293 can be applied to the pressure detection sheet member. When the sensor sheet 1b made of the pressure detection sheet member is mounted, the push of the sliding position of the operator's finger is detected and the push detection signal S2 is output.

  Inside the lower housing 40, a battery 14 and a circuit board 17 for mounting electronic components are provided. In the lower housing 40, a call microphone 43 is attached below the operation panel surface so as to function as a transmitter. A module-type antenna 16 is attached to the lower end of the lower housing 40, and a loudspeaker 36b serving as an actuator is provided on the inner surface of the upper end so as to emit a ringing melody or the like. . A camera 34 is attached to the back surface of the lower housing 40. Of course, an actuator for tactile presentation may be attached to the inside of the lower housing 40.

  FIG. 9 is a cross-sectional view illustrating a configuration example of the input device 100 that can be mounted on the mobile phone 200. The input device 100 on the side of the lower housing 40 shown in FIG. 9 is a device that inputs information by a sliding operation with an operator's finger or the like. For the input device 100, the component mounting board 101 according to the first embodiment is used.

  The input device 100 is provided with a sensor sheet 1b as an example of a sheet-like detection member in the lower housing 40, and detects a sliding position of an operator's finger or the like. The sensor sheet 1b has an electrode pattern 7 (see FIG. 10).

  The component mounting board 101 is fixed in the lower housing 40 on, for example, a metal or resin chassis 17 '. The component mounting board 101 has an opening 10a at a predetermined position and has a flexible board 10, and one surface of the board 10 is an I surface, and the other surface of the substrate 10 is an II surface. A dome switch 25 for pressing operation mounted on the I surface side of the substrate 10, and the opening 10 a of the substrate 10 is positioned on the dome switch 25 on the I surface side of the substrate 10. Thus, it has the flexible structure by which the II surface side was bent on the I surface side on the basis of bending part III.

  In this example, a key top 42 is combined on the substrate 10 so as to cover a part or all of the sensor sheet 1b. The key top 42 is movably engaged in the pressing direction in the opening 40a of the lower housing 40, rises from one of the operation surfaces of the lower housing 40 along the sliding direction, and the other It has a convex shape that rises toward the side operation surface, and is slid along the operation surface of the lower housing 40. The key top 42 is provided with a flange-like flange 42a and a rod-like link portion 42b, and is operated so as to be turned on by depressing the dome switch 25 with the link portion 42b through the opening 10a.

  The dome switch 25 includes a switch portion 25a and a cover member 25b. The switch part 25a is composed of a spring member and an electrode member, and the cover member 25b is composed of an insulating member. The dome switch 25 is turned on, for example, by overcoming the biasing force of the spring member and strongly pushing it with the finger 30a (see FIG. 9) or the like. When the finger 30a is released from the dome switch 25, the key top 42 is brought into contact with the inner peripheral portion of the opening 40a by the biasing force of the spring member.

  In this example, the detection region for detecting the sliding position of the operator's finger 30a by the sensor sheet 1b is set wider than the operation region for sliding operation by the operator's finger 30a by the key top 42. In this way, with respect to the sliding operation by the operator's finger 30a, one operating surface of the lower housing 40 and the other operating surface sandwiching the convex key top 42 are included in the sliding operation range. Can do. The key top 42 having this shape can set a wide range of volume adjustment pitches such as a scroll key search pitch for searching various information and a volume key for adjusting the volume.

  Next, an example of assembling the input device 100 to the lower housing side in the mobile phone 200 will be described. FIG. 10 is a perspective view illustrating an assembly example of the input device 100. First, the lower housing 40, the key top 42, and the component mounting board 101 are prepared. As the lower casing 40, a mold that is shaped like the lower casing 40 of the mobile phone 200 is formed, and a resin is molded and injected into the mold. The mold is processed to open the opening 40 a in the lower housing 40.

  As the encapsulating resin, for example, a PC resin, an ABS resin, or a synthetic resin thereof is used. Thereafter, metal plating may be applied to the outer surface of the lower housing 40. Of course, the lower housing 40 is not limited to a resin mold product, and may be aluminum having a predetermined thickness or light metal such as SUS. The opening 40a may be opened by punching. Thereafter, the outer surface of the lower housing 40 may be plated for rust prevention.

  In this example, the key top 42 may be formed with a non-operation surface that covers part or all of the sensor sheet 1b. For example, since the key top 42 is slid along the operation surface of the lower housing 40, the non-operation surface of the key top 42 has a flat shape, and a flange 42a ( And a central part having a link part 42b. First, a die for a key top that is shaped like a convex key top, a flange, and a link portion is created.

  The key top mold includes a core having a half-moon-shaped recess that rises from the one operation surface of the lower housing 40 along the sliding direction and rises toward the other operation surface, and A cavity covering this is prepared. When such a mold is prepared, resin is sealed in the mold and the lower housing 40 is molded. As the encapsulating resin, for example, a PC resin, an ABS resin, or a synthetic resin thereof is used.

  As a result, a semicircular arc having a predetermined height and width is formed, and a convex key top 42 that can be slid along the arc shape can be formed. When the key top 42 is configured in this manner, in addition to the sliding operation feeling that rises in an arc shape along the sliding direction from one operation surface of the lower housing 40 with respect to the sliding operation by the operator's finger 30a, An arcuate sliding operation feeling that rises toward the other operation surface can be provided.

  The component mounting board 101 is formed by the method described in the first embodiment (see FIGS. 2 to 7). The component mounting board 101 has, for example, a long and thin flexible board 10 as shown in FIG. 2A, and an electrode pattern 7 and a wiring pattern 8 as shown in FIGS. 3A to 3C, 4A and 4B. Use the formed one. The electrode pattern 7 forms a plate electrode for mounting the IC device 5 for driver, LED light source 6, dome switch 25, etc. on the I surface side of the substrate 10, and the capacitance sheet on the II surface side of the substrate 10 The storage electrode is formed. The storage electrodes are formed so as to be distributed on both sides of the opening 10a.

  The wiring pattern 8 is formed so as to form a wiring from a flat plate electrode of the IC device 5 for driver on the I surface side of the substrate 10 to a storage electrode of the capacitance sheet on the II surface side of the substrate 10. For example, an electrode pattern 7 for mounting the driver IC device 5 on the I-side of the substrate 10, the LED light source 6, the dome switch 25, and the like, and a flat plate electrode such as the driver IC device 5 on the I-side of the substrate 10 Then, a wiring pattern 8 is formed from the substrate 10 to the storage electrode of the capacitance sheet on the II surface side. When the flexible substrate 10 with the electrode pattern 7 and the wiring pattern 8 is prepared, an opening 10a is formed at a predetermined position of the substrate 10 shown in FIG. 5A. The opening 10a is punched and opened using a press machine or the like.

  Thereafter, the driver IC device 5, the LED light source 6, the dome switch 25, and the like are attached to the I surface of the substrate 10 shown in FIG. 6A. Thereafter, a sensor sheet (not shown) for detecting the pressing operation is formed on the I surface side of the substrate 10. At this time, as shown in FIG. 6B, the dome switch 25 is constituted by the switch portion 25a and the cover member 25b. A sensor sheet 1b for detecting a sliding (tracing) operation is formed on the II surface side of the substrate 10. The substrate 10 has a shape extending integrally from the sensor sheet for detecting the pressing operation to the sensor sheet 1b for detecting the sliding operation.

  When the lower casing 40, the key top 42, and the component mounting board 101 are prepared, the opening 10a of the board 10 is positioned on the dome switch 25 mounted on the I surface of the board 10 shown in FIG. 7A. Fold the II surface on the I surface. In this example, the bent portion III is set in a direction orthogonal to the longitudinal direction of the longitudinal portion of the substrate 10 shown in FIG. 6A. Then, the II surface of the substrate 10 is bent on the I surface of the substrate 10 at the bending portion III. The component mounting board 101 is folded with the folding part III as a reference, the sliding operation detection sensor sheet 1b is folded on the pressing operation detection sensor sheet, and the link part 42b of the key top 42 is inserted into the opening 10a.

  Next, the key top 42 is lowered to the rectangular opening 40a opened on the upper operation surface of the lower housing 40 so that the key top 42 is exposed from the inside to the outside of the operation surface. The opening 40a of the casing 40 is fitted and combined. At this time, the non-operation surface of the key top 42 is mounted in a state in which the non-operation surface is directed to the inside of the lower housing 40 and the flange 42 a is caught by the opening 40 a on the upper side of the lower housing 40 to be prevented from coming off. Thereby, in the lower housing 40 as shown in FIG. 9, the input device 100 having the pressing operation detection function and the sliding operation detection function is completed.

  As described above, according to the input device 100, it is possible to provide a non-rotating side jog tool or the like that has a structure different from that of the conventional rotating side jog tool and can obtain an operation feeling almost similar to the side jog tool. It becomes like this. When searching for various information, the key top 42 of this shape is, for example, a scroll key for selecting a phone book, selecting a file, or enlarging / reducing, or a determination key thereof, or a volume key for adjusting a volume. It can be applied as an information selection key.

  Here, referring to FIG. 11 and FIG. 12, a method of allocating a large number of unfolded substrates 10 from a single substrate material 1 (member removal) will be compared between member examples of the conventional method and the present invention method. 11A and 11B are top views showing comparative examples of substrate shapes according to the conventional method and the present invention method. 12A and 12B are top views showing a comparative example of the substrate 10 'and the substrate 10 at the time of member removal.

  In this comparative example, a flexible substrate 10 in which a pad sheet 1a of a numeric keypad of a mobile phone 200 and a sensor sheet 1b for detecting a pressing operation and a sliding operation constituting the side jog are integrated into one substrate material. In the case of efficiently removing a member from 1, it was compared which method does not waste a member and a large number of substrates 10 can be removed.

  11A, the sensor sheet 1b 'disposed on the right side of the pad sheet 1a is laid out wider in the horizontal direction than in the vertical direction. The entire width of the substrate 10 'including the pad sheet 1a and the sensor sheet 1b' is w2 '. The substrate 10 'has a bent portion III' set in a direction parallel to the longitudinal direction of the sensor sheet 1b '.

  In other words, a method is employed in which the right side surface of the sensor sheet 1b 'is bent toward the pad sheet side with reference to the bent portion III'. With this method, a lot of part IV to be removed is generated in a lower part of the sensor sheet 1b '. As a result, as shown in FIG. 8A, the number of components that can be taken out of the substrate material 1 from one substrate material 1 is reduced, and the production yield of the component mounting substrate 101 'is reduced.

  On the other hand, in the system of the present invention, the shape of the component mounting board 101 and the folding position thereof are devised. According to the member removal of the substrate 10 according to the method of the present invention shown in FIG. 11B, the sensor sheet 1b having a width in the horizontal direction narrower than the vertical direction is laid out on the right side of the pad sheet 1a. The entire width of the substrate 10 including the pad sheet 1a and the sensor sheet 1b is w2 (w2 <w2 ').

  The substrate 10 has a bent portion III set in a direction orthogonal to the longitudinal direction of the longitudinal portion of the sensor sheet 1b. And the lower surface side of the sensor sheet 1b is bent to the upper surface side of the sensor sheet 1b at the bent portion III. As a result, as shown in FIG. 8B, a large number of unfolded substrates 10 can be removed from one substrate material 1.

  Thus, according to the member example of the method of the present invention, since the bent portion III is set in the longitudinal portion of the sensor sheet 1b, the member shown in FIG. 12A within the substrate material 1 having the same area. Compared to the removal, the member removal shown in FIG. 12B can remove a larger number of integrated flexible substrates 10, and the number of member removals can be improved compared to the conventional method. Thereby, compared with the conventional system, the part cut off from one board | substrate raw material 1 can be reduced, and it has come to be able to improve a production yield.

  Next, a configuration example of a control system of the mobile phone 200 having the input device 100 on which the component mounting board 101 is mounted will be described. FIG. 13 is a block diagram illustrating a configuration example of a control system such as the mobile phone 200 and a touch feedback function example thereof.

  A cellular phone 200 or the like shown in FIG. 13 is configured by mounting each function block on the circuit board 17 or the like of the lower housing 40. In addition, the part corresponding to each part shown in FIGS. 8-12 is shown with the same code | symbol. The mobile phone 200 or the like includes a control unit 15, an operation panel 18, a reception unit 21, a transmission unit 22, an antenna duplexer 23, an input device 100, a display unit 29, a power supply unit 33, a camera 34, a storage unit 35, and a speaker for a receiver. 36a has a loudspeaker 36b with an actuator function.

  An input device 100 shown in FIG. 13 includes a sensor sheet 1b, a dome switch 25, a key top 42, and a component mounting board 101. As for the sensor sheet 1b, FIGS. 1 to 12 describe the case where a capacitance sheet member is used. However, any sensor sheet 1b can be used as long as the functions of sliding operation (cursoring) and pushing (selection determination) can be distinguished. For example, an input device such as a pressure detection sheet member may be used. Preferably, any input device having a configuration in which position detection information and indentation detection information are provided to the control unit 15 may be used.

  The input device 100 is provided in the lower housing 40 constituting the mobile phone 200, and inputs information by a sliding operation and a pressing detection operation by an operator's finger 30a. For example, the input device 100 detects the sliding position of the operator's finger 30a with the sensor sheet 1b, detects the pressing with the dome switch 25, and at least sends the position detection signal S1 and the pressing detection signal S2 to the control unit 15. It is made to output.

  In this example, when the input device 100 according to the first embodiment is used, the input device 100 includes a sensor sheet 1b that is provided in the lower housing 40 and detects the sliding position of the operator's finger. . The key top 42 is provided so as to cover the sensor sheet 1 b and is slid along the operation surface of the lower housing 40. The key top 42 includes a convex shape that rises from the one operation surface of the lower housing 40 along the sliding direction and rises toward the other operation surface (see FIG. 8).

  The control unit 15 constitutes a control system, and includes an image processing unit 26, an A / D driver 31, a CPU 32, and a memory unit 37. The A / D driver 31 is supplied with a position detection signal S1 and a push detection signal S2 from the input device 100. The A / D driver 31 converts an analog signal composed of the position detection signal S1 and the push-in detection signal S2 into digital data in order to distinguish between the functions of cursoring and icon selection.

  In addition to this, the A / D driver 31 performs arithmetic processing on this digital data to detect whether it is a cursoring input or icon selection information, and flag data D3 or position detection information D1 or push-in detection for distinguishing between the cursoring input and the icon selection The information D2 is supplied to the CPU 32. These calculations may be executed in the CPU 32.

  A CPU 32 is connected to the A / D driver 31. The CPU 32 controls the entire telephone set based on the system program. The storage unit 35 stores system program data for controlling the entire telephone. A RAM (not shown) is used as a work memory. When the power is turned on, the CPU 32 reads out the system program data from the storage unit 35 and develops it in the RAM, starts up the system and controls the entire mobile phone.

  For example, the CPU 32 receives position detection information D1, push-in detection information D2 and flag data D3 (hereinafter also simply referred to as input data) from the A / D driver 31, and sends predetermined command data D to the power supply unit 33, the camera 34, Control is performed such that the data is supplied to devices such as the storage unit 35, the memory unit 37, and the video & audio processing unit 44, the reception data from the reception unit 21 is captured, and the transmission data is transferred to the transmission unit 2.

  A display unit 29 is connected to the video & audio processing unit 44. For example, a scroll image corresponding to a sliding operation of the operator's finger 30a detected by the sensor sheet 1b or a pressing operation detected by the dome switch 25 is displayed. Is displayed. In this example, the CPU 32 detects the sliding operation speed of the operator's finger 30a, and adjusts the display pitch of the scroll image on the display unit 29 according to the sliding operation speed of the operator's finger 30a. .

  When display control is performed in this manner, when the sliding speed of the operator's finger 30a is high during information retrieval, the display pitch of the scroll image on the display unit 29 is set to be narrow, and conversely, the operator's finger 30a. When the sliding operation speed is slow, the display pitch of the scroll image on the display unit 29 can be adjusted to be set wide. Therefore, when there are a plurality of information search targets, when the target scroll image is far from the target scroll image, the scroll image is sent roughly, and when approaching the target scroll image, the search can be performed while slowly sending the scroll image. become.

  In this example, a pressure detection sheet member is used for the sensor sheet 1b. In addition to adjusting the display pitch of the scroll image, the CPU 32 detects the indentation detection information D2 obtained from the input device 100 and a preset depression determination threshold value. The memory unit 37 may be read and controlled so that Fth is compared and vibration control is performed on the speaker 36b with an actuator function based on the comparison result.

  For example, if the tactile senses propagated from the operation surface at the pressed position of the input device 100 are #a and #b, the tactile sense #a is the sliding operation of the finger 30a at the sliding position of the operator holding the lower housing 40. It is obtained by changing the operation surface corresponding to the vibration pattern from the low frequency and small amplitude to the high frequency and large amplitude vibration pattern. Further, the tactile sensation #b is to change the operation surface according to the presence or absence of the pushing force of the operator's finger 30a at the sliding position from a high frequency and large amplitude vibration pattern to a low frequency and small amplitude vibration pattern. Therefore, it is obtained.

  The storage unit 35 is connected to the CPU 32 described above, for example, display information D4 for displaying the input item selection display screen three-dimensionally, and the selection position and vibration mode of the icon corresponding to the display information D4. Control information Dc and the like are stored for each display screen. The control information Dc can generate a plurality of different tactile sensations synchronized with the application (three-dimensional display and various display contents) in the display unit 29, and a plurality of specific vibration waveforms that generate the tactile sensations, and An algorithm for setting a specific haptic generation mode for each application is included. For the storage unit 35, an EEPROM, a ROM, a RAM, or the like is used.

  In this example, the CPU 32 performs display control of the display unit 29 and output control of the speaker 36b with an actuator function based on the position detection information D1, the push-in detection information D2, and the flag data D3 output from the A / D driver 31. . For example, the control unit 15 reads the control information Dc from the storage unit 35 based on the position detection signal S1 obtained from the sensor sheet 1b of the input device 100 and the push detection signal S2 obtained from the dome switch 25, and the memory unit 37 Is controlled so as to supply the vibration generation signal Sa to the speaker 36b with an actuator function.

  In this example, when the pressure detection sheet member is used for the sensor, the CPU 32 activates the tactile sense #a when detecting the indentation detection information D2 that is equal to or less than the depressing determination threshold value Fth, and then the input device 100 depresses. When the indentation detection information D2 exceeding the determination threshold Fth is detected, the memory unit 37 is read and controlled so as to activate the tactile sense #b. In this way, it is possible to generate a vibration pattern based on “pressing” of the operator's finger 30a or the like.

  A memory unit 37 is connected to the CPU 32, and vibration generation data Da is read based on the control information Dc from the CPU 32. The vibration generation data Da has an output waveform composed of a sine waveform. A video & audio processing unit 44 is connected to the memory unit 37, and each vibration generation data Da is supplied to the video & audio processing unit 44, and the vibration generation data Da is subjected to audio processing (digital / analog conversion / amplification etc.). The vibration generation signal Sout2 is supplied to the speaker 36a with an actuator function. The speaker 36a vibrates based on the vibration generation signal Sout2.

  In this example, the memory unit 37 stores a pressing determination threshold value Fth corresponding to each application. For example, the pressing determination threshold value Fth is stored in advance in a ROM or the like provided in the storage unit 35 as a trigger parameter. Under the control of the CPU 32, the storage unit 35 inputs the indentation detection information D2, compares the preset depression determination threshold Fth with the depression F obtained from the depression detection information D2, and performs a determination process of Fth ≧ F. , Fth <F and the like are executed.

  For example, when the pressing determination threshold value Fth = 100 [gf] is set in the memory unit 37, the operation surface is vibrated based on the vibration pattern for obtaining the tactile sensation of the classic switch. When the pressing determination threshold Fth = 20 [gf] is set, the operation surface is vibrated based on the vibration pattern for obtaining the tactile sensation of the cyber switch.

  In addition to the memory unit 37, the image processing unit 26 is connected to the CPU 32, and the display information D4 for scroll-displaying the scroll image is subjected to image processing. The display information D4 after the image processing is supplied to the display unit 29. In this example, the CPU 32 controls the display unit 29 to display the scroll image in the display screen in a three-dimensional manner with a perspective in the depth direction.

  The display contents of the display unit 29 are determined by the eyes of the operator's eyes 30b, and the sounds emitted from the speakers 36a and 36b are determined by the sounds of the operator's ears 30c. The operation panel 18 is connected to the CPU 32 described above, and is used, for example, when manually inputting the telephone number of the other party. In addition to the icon selection screen described above, an incoming video may be displayed on the display unit 29 based on the video signal Sv.

  Also, the antenna 16 shown in FIG. 13 is connected to the antenna duplexer 23, and receives a radio wave from the other party from a base station or the like when an incoming call is received. A receiver 21 is connected to the antenna duplexer 23, receives reception data guided from the antenna 16, demodulates video and audio, and outputs the demodulated video and audio data Din to the CPU 32 and the like. The A video & audio processing unit 44 is connected to the receiving unit 21 through the CPU 32, and digital audio data is converted from digital to analog to output an audio signal Sout, or digital video data is converted from digital to analog and converted into a video signal. Sv is output.

  The video & audio processing unit 44 is connected to a speaker 36a constituting a receiver and a speaker 36b constituting a large sound unit with an actuator function. The speaker 36a receives the audio signal Sout1 and expands the other party's speech 30d. The speaker 36b is configured to ring a ringtone, a ringing melody, or the like based on the acoustic signal Sout2 when an incoming call is received. Further, the speaker 36b vibrates based on the vibration generation signal Sout2 'when presenting a tactile sensation.

  In addition to the speakers 36a and 36b, the video & audio processing unit 44 is connected to a microphone 43 constituting a transmitter, and collects an operator's voice 30d and outputs an audio signal Sin. The video & audio processing unit 44 performs analog / digital conversion on the analog audio signal Sin to be sent to the other party at the time of calling and outputs digital audio data, or analog / digital conversion of the analog video signal Sv. Digital video data is output.

  In addition to the receiving unit 21, the transmitting unit 22 is connected to the CPU 32 to modulate the video and audio data Dout and the like to be sent to the other party, and supply the modulated transmission data to the antenna 16 through the antenna duplexer 23. To be made. The antenna 16 radiates a radio wave supplied from the antenna duplexer 23 toward a base station or the like.

  In addition to the transmission unit 22, a camera 34 is connected to the CPU 32 described above, and a subject is photographed. For example, still image information and operation information are transmitted to the other party through the transmission unit 22. The camera 34 may be provided on the back side of the upper housing 20. The power supply unit 33 includes a battery 14, an operation panel 18, a reception unit 21, a transmission unit 22, a display unit 29, a CPU 32, a camera 34, a storage unit 35, a memory unit 37, a video & audio processing unit 44, and an input. DC power is supplied to the device 100. In this example, the case where the memory unit 37 is provided separately from the video & audio processing unit 44 has been described, but a storage device provided in the video & audio processing unit 44 may also be used. The number of parts can be reduced.

  Thus, according to the mobile phone 200 as the second embodiment, the input device 100 according to the present invention is mounted, and the component mounting board 101 according to the first embodiment and the manufacturing method thereof are mounted on the input device 100. Is applied.

  Therefore, the assembly process can be simplified and the wiring routing and connection process can be omitted as compared with the case where two individually prepared substrates are individually mounted on the lower housing 40. Moreover, after mounting, input detection by the sensor sheet 1b on the II side on the side operation surface of the lower housing 40 (identical appearance of the product), and a dome switch on the I surface from the II side through the opening 10a 25 can be input. As a result, it is possible to reduce the size of the input device 100 having the two input detection functions that incorporate the component mounting board 101 and to greatly reduce the cost thereof. Therefore, the size of the mobile phone 200 on which the input device 100 is mounted can be reduced. In addition, the cost can be greatly reduced.

  In this example, the case where the key top 42 is provided on the right side of the lower housing 40 as shown in FIG. 8 has been described. However, the present invention is not limited to this, and the key top 42 and other keys described below are also included. The operation unit such as the top may be provided on the operation surface on the left side of the lower housing 40, the operation surface above or below it, the operation surface on the front or back side, and the like. Furthermore, an operation unit may be provided on the operation surface on the left or right side of the upper housing 20, the operation surface above or below, the operation surface on the front or back side, or the like. Needless to say, the same effect can be obtained when it is provided on the left side of the lower housing 40 or the upper housing 20.

  FIG. 14 is a perspective view showing a configuration example of a digital camera 300 as the third embodiment. In this embodiment, a component mounting board 103 according to the present invention is mounted on a digital camera 300. A digital camera 300 shown in FIG. 14 constitutes an example of an electronic apparatus, and includes an input device 301 according to the present invention, and is configured to input information by an operating body (sliding operation and pressing operation with a user's finger or the like). The digital camera 300 includes a housing 61, an operation panel 62, and a frame 63.

  An optical lens 38 is provided on the front surface of the housing 61, and light from a subject is incident to form an image. An imaging element (not shown) is disposed inside the casing 61 and operates to capture a subject image formed by the optical lens 38. A shutter button 39 is disposed on the upper portion of the casing 61 and is pressed when shooting a subject video. A frame body 63 is attached to the rear surface side of the housing 61, and an operation panel 62 is attached to the inside of the frame body 63. The operation panel 62 and the frame 63 are engaged with the back side of the housing 61 so as to be opened and closed by, for example, a screwing mechanism (not shown).

  A display unit 69 is provided on the operation panel 62 engaged with the rear surface side of the casing 61 with a frame 63 interposed therebetween. A liquid crystal display device of about 1 to 2 inches is used for the display unit 69, and input information such as a plurality of button icons is displayed. A plurality of push button switches 65, a cross key 66, and the like are provided on the right side of the display unit 69. The push button switch 65 includes hook buttons such as “ON” and “OFF”, menu keys, and the like. An opening 62c is provided above the push button switch 65, and a cross key 66 is provided in the opening 62c. The cross key 66 constitutes an example of the operation unit, and a convex shape that rises from one operation surface along the sliding direction in the horizontal direction of the operation panel 62 and rises toward the other operation surface, and the convex shape. Similarly, it has a convex shape that rises from one side along the sliding direction and rises toward the other operation surface in the vertical direction orthogonal to the part shape.

  A component mounting board 103 according to the present invention is mounted inside the operation panel 62. The component mounting board 103 includes a flexible board 60, and the board 60 is obtained by integrating a pad sheet 61a for an operation panel and a sensor sheet 61b for detecting a sliding operation. The pad sheet 61a constitutes a base sheet for a plurality of push button switches 65 such as hook buttons such as “on” and “off” and menu keys. The pad sheet 61a is also used as a sensor sheet for detecting a pressing operation.

  The component mounting board 103 is provided with a sensor sheet 61b having an electrode pattern, and operates to detect the sliding position of the operator's finger 30a when the digital camera 300 is held with the left hand and operated with the right hand. The sensor sheet 61b is a capacitance sheet member that detects the displacement of pushing the sliding position by converting it into a capacitance. When the sensor sheet 61b made of a capacitance sheet member is mounted, the sliding position of the operator's finger is detected and a position detection signal S1 is output. The “cursor moving method” described in Japanese Patent No. 3920833 and the “coordinate input device” described in Japanese Patent No. 3909230 can be applied to the capacitance sheet member.

  In addition to the capacitance sheet member, a pressure detection sheet member using a piezoresistance effect is used for the sensor sheet 61b. The pressure detection sheet member reads a resistance change caused by pushing of the sliding position and converts it into an electric signal. The “force sensor, force detection system, and force detection program” described in JP-A-2005-326293 can be applied to the pressure detection sheet member. When the sensor sheet 61b made of the pressure detection sheet member is mounted, the pressing of the sliding position of the operator's finger is detected and the pressing detection signal S2 is output. Inside the operation panel 62, a battery 64, a circuit board 67 for mounting electronic components, and the like are provided. Also in this example, an actuator for presenting tactile sensation may be attached inside the operation panel 62.

  FIG. 15 is a cross-sectional view illustrating a configuration example of the input device 301 that can be mounted on the digital camera 300. An input device 301 shown in FIG. 15 includes a housing 61, an operation panel 62, a frame body 63, and a cross key 66, and is a device that inputs information by a sliding operation with an operator's finger or the like. The component mounting board 103 is used for the input device 301. The input device 301 is provided with a sensor sheet 61b as an example of a sheet-like detection member on the operation panel 62 so as to detect a sliding position of an operator's finger or the like. The sensor sheet 61b has an electrode pattern 7 '(see FIG. 21). For an example of detection sensitivity of the input device 301, refer to “Input Device and Electronic Device” in Japanese Patent Application (2007-246071).

  The component mounting board 103 is placed on a base of a casing 61 made of, for example, metal or resin in the frame 63. The component mounting board 103 has an opening 60a at a predetermined position and has a flexible board 60, and one side of the board 60 is an I plane, and the other side of the board 60 is II. A dome switch 25 ′ for pressing operation mounted on the I surface side of the substrate 60, and the opening 60 a of the substrate 60 is formed on the dome switch 25 ′ on the I surface side of the substrate 60. It has a flexible structure in which the II surface side is bent on the I surface side with respect to the bent part III so as to be positioned.

  Also in this example, the driver IC device 5 and the LED light source 6 are mounted on the I surface side of the substrate 60 in addition to the dome switch 25 '. A cross key 66 is combined on the substrate 60 with a rubber sheet portion 62a interposed therebetween, and is provided so as to cover part or all of the sensor sheet 61b. The cross key 66 is movably engaged with the pressing direction of the opening 62c of the operation panel 62, rises from one of the operation surfaces of the operation panel 62 along the sliding direction, and the other side operation surface. The convex shape that rises toward the cross has a cross shape, and is slid in a cross shape along the operation surface of the operation panel 62.

  A rubber sheet portion 62 a is provided below the cross key 66, and a rod-like link portion 62 b is provided on the inner surface of the rubber sheet portion 62 a and at the center portion of the cross key 66. The rubber sheet portion 62a and the link portion 62b are integrally formed of the same rubber material, for example. The cross key 66 is operated so that the dome switch 25 'is pressed and turned on at the link portion 62b below the rubber sheet portion 62a through the opening 60a.

  In this example, the detection area for detecting the sliding position of the operator's finger 30a by the sensor sheet 61b is set wider than the operation area for sliding operation by the operator's finger 30a by the cross key 66. In this way, for the sliding operation with the operator's finger 30a, the left and right operation surfaces of the operation panel 62 sandwiching the convex shaped cross key 66 and the upper and lower operation surfaces can be included in the sliding operation range. it can. The cross key 66 having this shape can smoothly set the search pitch of the scroll key when searching for various information and the zoom adjustment pitch when adjusting the zoom amount of the optical lens 38.

  Next, a method for manufacturing the component mounting board 103 according to the present invention will be described. 16 to 21 are process diagrams showing formation examples (No. 1) to (No. 6) of the component mounting board 103. FIG. An example will be described in which a component mounting board 103 for an input device that can be operated by an operation panel 62 such as a digital camera is formed. FIG. 16B is a cross-sectional view of the substrate 60 in FIG.

  First, a long and thin board 60 as shown in FIG. 16A for obtaining the component mounting board 103 is prepared. For example, a flexible substrate material having copper foils 11a and 11b on both sides is cut to obtain a substrate 60 having a longitudinal portion. The width W3 of the substrate 60 is about 30 mm, and the length L3 is about 150 mm. As shown in FIG. 16B, the substrate material is obtained by rolling copper foils 11a and 11b having a film thickness of about 18 μm on both surfaces of a base film 11c having a film thickness of about 25 μm as in the first embodiment. use.

  Next, the electrode pattern 7 ', the wiring pattern 8', the plate electrodes 111 to 113, the cover films 9a to 9d, and the like are formed on the flexible elongated substrate 60 shown in FIG. 17A. Refer to the first embodiment for examples of forming the electrode pattern 7 ', the wiring pattern 8', the cover films 9a to 9d, and the like (FIGS. 3A to 3C and FIGS. 4A and 4B). The electrode pattern 7 ′ forms plate electrodes 111 to 113 for mounting the IC device 5, the LED light source 6, the dome switch 25 ′ and the like for mounting on the I surface side of the substrate 60, and the II surface of the substrate 60. On the side, it forms a storage electrode of a capacitance sheet that becomes the sensor sheet 61b. Note that FIG. 17B is a cross-sectional view of the substrate 60 in FIG.

  The plate electrode 111 is partially cut out to form a circular electrode pattern, and constitutes a dome switch 25 '. The plate electrode 112 forms a pair of rectangular electrode patterns and constitutes a mounting terminal for the LED light source 6. The plate electrode 113 forms a plurality of fine rectangular electrode patterns and constitutes an attachment terminal of the IC device 5. The storage electrodes are formed so as to be distributed on both sides of the opening 60a. The wiring pattern 8 ′ forms a wiring from the flat plate electrodes 111 to 113 on the I surface side of the substrate 60 shown in FIG. 17B to the storage electrode of the capacitance sheet on the II surface side of the substrate 60.

  When a flexible substrate 60 with such electrodes and wiring patterns is prepared, an opening 60a of size w3 × l3 is formed at a predetermined position of the substrate 60 shown in FIG. 18A. The opening 60a opens to a size having a width w3 and a length l3. When the opening 60a is square, one side is about 1 mm to 10 mm. In this example, an opening 60 a of about 3 mm × 3 mm that penetrates the substrate 60 is formed. As shown in FIG. 18B, the opening position is set at a position of X mm from the right end of the substrate 60 so that the opening 60a is located at the upper center of the dome switch 25 'shown in FIG. The opening 60a is punched and opened using, for example, a press machine.

  Next, the driver IC device 5 and the LED light source 6 are mounted on the substrate 60 shown in FIG. 19A. The IC device 5 and the LED light source 6 are soldered to the plate electrodes 112 and 113 on the I surface shown in FIG. 19B by a solder bonding technique. Soldering may be performed by solder bonding using a predetermined lead frame or a flip chip bonding method using solder bumps.

  Thereafter, a dome switch 25 ', which is an example of an operated component, is attached on the substrate 60 shown in FIG. 20A. The dome switch 25 'includes a hemispherical switch portion 25a' and a square cover member 25b 'on the I surface side of the substrate 60 shown in FIG. 20B. Thereby, a sensor sheet (not shown) for detecting the pressing operation can be formed on the I surface side of the substrate 60.

  Here, on the II surface side of the substrate 60, an electrode pattern or the like for a counter electrode (not shown) facing the storage electrode of the capacitance sheet is attached. A dielectric is formed between the storage electrode and the counter electrode. Thereby, a sensor sheet 61b for detecting a sliding (tracing) operation can be formed on the II surface side of the substrate 60.

  When the substrate 60 extending integrally from the sensor sheet for detecting the pressing operation to the sensor sheet 61b for detecting the sliding operation is prepared, the substrate 60 is mounted on the dome switch 25 ′ mounted on the substrate 60 shown in FIG. 21A. The II surface is bent on the I surface of the substrate 60 of FIG. 21B so that the opening 60a of the substrate 60 is located. In this example, the bent portion III is set in a direction orthogonal to the longitudinal direction of the longitudinal portion of the substrate 60 shown in FIG. 20A. Then, the II surface of the substrate 60 is bent on the I surface of the substrate 60 at the bending portion III.

  When the bent portion III is set in the longitudinal portion of the substrate 60, a large number of unfolded substrates 60 can be allocated from a single substrate material, members that are cut off unnecessarily can be reduced, and the production yield can be improved. (See FIG. 25).

  Here, a method of bending the substrate 60 will be described. FIG. 22 is a conceptual diagram showing a configuration example of the bending jig 800. 23 and 24 are process diagrams showing bending examples (Nos. 1 and 2) of the component mounting board 103. FIG.

  In the first embodiment, the folding portion III is narrow, so it can be easily bent by hand. However, in this embodiment, the folding portion III is wider than in the first embodiment, so a dedicated folding jig 800 is used. Thus, the II surface side of the substrate 60 is bent on the I surface side of the substrate 60.

  A bending jig 800 shown in FIG. 22 includes a first movable block 801, a fixed block 802, and a second movable block 803, and bends the component mounting board 103 at about 90 °. The movable block 801 is movable in the vertical direction, and has a member pressing surface 811 and a bending regulating surface 812. The boundary between the member pressing surface 811 and the bending regulating surface 812 is a bending surface 813, and the chamfering process is performed in an R shape. If the angle formed by the member pressing surface 811 and the bending regulating surface 812 is θ, θ is set to about 90 °.

  A fixed block 802 is disposed on the member pressing surface 811 side of the movable block 801. The fixed block 802 has a stage 814 on the member pressing surface 811 side. On the stage 814, the bending fixing side of the component mounting board 103 is placed. On the side surface of the fixed block 802, a movable block 803 movable in the horizontal and vertical directions is disposed. The fixed block 802 has a stage 815 and a member stopper 816 on the upper surface. On the stage 815, the bent side of the component mounting board 103 is placed. The component mounting board 103 on the bent side is free. The tip of the stage 815 of the movable block 803 forms a raised angle surface 817, and the raised angle surface 817 is also chamfered into an R shape.

  When the component mounting board 103 is bent to about 90 ° using such a bending jig 800, first, in FIG. 22A, the fixed block 802 and the movable block 803 are aligned, and a stage 814 on the same plane without any step is provided. , 815 are formed. Next, the component mounting board 103 is placed on the part from the stage 814 of the fixed block 802 to the stage 815 of the movable block 803. The tip of the component mounting board 103 is aligned so as to contact the member stopper 816. The member stopper 816 is adjusted to a position for automatically aligning the bent portion III with the boundary point between the fixed block 802 and the movable block 803.

  Further, the component mounting board 103 is fixed by being sandwiched between the movable block 801 and the fixed block 802. As a result, the component mounting board 103 is sandwiched and fixed between the member pressing surface 811 and the stage 814 shown in FIG. Thereafter, as shown in FIG. 23A, the movable block 803 is raised in the vertical direction. By this raising operation, the component mounting board 103 shown in FIG. 23B is separated from the stage 815 and is generated at about 45 degrees. If the movable block 803 is raised as it is, the component mounting board 103 is cut. Therefore, as shown in FIG. 24A, the movable block 803 is raised, and the movable block 803 is moved in the horizontal direction (left side) to protect the thickness of the bent portion III of the component mounting board 103. . The escape distance is sufficient for the thickness of the component mounting board 103.

  Sequentially, as shown in FIG. 24A, when the movable block 803 is raised and moved so that the movable block 801 is released in the horizontal direction (left side), as shown in FIG. 24B, the thickness of the bent portion III of the component mounting board 103 is increased. Can be bent at about 90 °. In this example, the bending process ends when the movable block 803 finishes moving in the horizontal direction by the thickness of the component mounting board 103 and rises to a predetermined position. When the substrate 60 bent at about 90 ° is mounted on a predetermined housing in this manner, an input device 301 having a pressing operation detection function and a sliding operation detection function can be formed (see FIG. 15).

  Next, an assembly example of the input device 301 to the operation panel 62 in the digital camera 300 will be described. FIG. 25 is a perspective view showing an assembly example of the input device 301. First, the operation panel 62, the cross key 66, and the component mounting board 103 are prepared. As the operation panel 62, a mold is used which is formed by molding a mold that models the inner periphery of the frame body 63 and the opening 62 c of the digital camera 300, and injecting resin into the mold and enclosing it. The opening 62c may be processed into an opening process that penetrates the operation panel 62 and a circular recessed hole shape (bottomed cylindrical shape).

  When the opening 62c has a hole shape penetrating the operation panel 62, the rubber sheet 62a and the cross key 66 arranged on the back surface of the operation panel 62 are bonded, and the cross key 66 is removed by the rubber sheet 62a. Is prevented. When the opening 62c has a bottomed cylindrical shape, a cross key 66 is disposed at the bottom of the opening 62c. Of course, the operation panel 62 and the cross key 66 may be integrally molded with resin.

  As the encapsulating resin, for example, PC (polycarbonate) resin, ABS resin, synthetic resin (PC + ABS resin) or the like is used. Thereafter, metal plating may be applied to the outer surface of the operation panel 62. Of course, the operation panel 62 is not limited to a resin molded product, and may be formed by pressing, deep drawing, or extruding light metal such as aluminum having a predetermined thickness, magnesium plate, SUS304, or the like. Good. The opening 62c may be opened by punching. Thereafter, the outer surface of the operation panel 62 may be plated for rust prevention.

  In this example, the cross key 66 may be formed with a non-operation surface that covers part or all of the sensor sheet 61b. For example, the cross key 66 has a flat shape on the non-operation surface of the cross key 66 in order to perform a sliding operation along the operation surface of the operation panel 62, and has a link portion 62b at the center thereof. Form. First, a die for a key top that is shaped like a cross-shaped key top is created. In this example, since the link part 62b is prepared by another member, the shape of the link part 62b can be deleted from the shape of the key top.

  The core for the key top is a core in which a half-moon-shaped recess that rises from one operation surface of the operation panel 62 along the sliding direction and rises toward the other operation surface is formed into a cross shape. And the cavity which covers this is prepared. When such a mold is prepared, the operation panel 62 is molded by enclosing a resin in the mold. As the encapsulating resin, for example, PC (polycarbonate) resin, ABS resin, synthetic resin (PC + ABS resin) or the like is used. In this example, after the cross key 66 is formed, UV (ultraviolet) coating is applied. For example, a solution that improves wearability is applied to the operation surface of the cross key 66. Thereafter, the coating film surface is cured by irradiating with ultraviolet rays. Thereby, the wear resistance of the operation surface of the cross key 66 can be improved.

  As a result, a cross-shaped cross key 66 that forms a cross-shaped semicircular arc having a predetermined height and width and can be slid along the arc shape can be formed. When the cross key 66 is configured in this way, a sliding operation that rises in an arc shape along the sliding direction from the operation surface on the left side of the operation panel 62 with respect to the sliding operation by the operator's finger 30a (see FIG. 15). In addition to the operation sensation, an arc-shaped sliding operation sensation that rises toward the operation surface on the right side, and a circle along the sliding direction from the operation surface on the upper side of the operation panel 62 in a direction orthogonal thereto. In addition to a sliding operation feeling that rises in an arc shape, an arc-shaped sliding operation feeling that rises toward the lower operation surface can be provided.

  As the component mounting board 103, one produced by the method described with reference to FIGS. As the component mounting board 103, a board having a long and thin flexible board 60 as shown in FIG. 16A and having an electrode pattern 7 'and a wiring pattern 8' formed thereon is used. The electrode pattern 7 ′ forms plate electrodes 111 to 113 for mounting the driver IC device 5, the LED light source 6, the dome switch 25 ′ and the like on the I surface side of the substrate 60, and the II surface side of the substrate 60. Then, the storage electrode of the capacitance sheet is formed. The storage electrodes are formed so as to be distributed on both sides of the opening 60a.

  The wiring pattern 8 ′ is formed so as to be connected from the plate electrodes 111 to 113 of the driver IC device 5 or the like on the I surface side of the substrate 60 to the storage electrode or the like of the capacitance sheet on the II surface side of the substrate 60. To do. For example, the driver IC device 5 on the I surface side of the substrate 60, the LED light source 6, the electrode pattern 7 ′ for attaching the dome switch 25 ′, and the driver IC device 5 on the I surface side of the substrate 60 A wiring pattern 8 ′ is formed from the flat plate electrodes 111 to 113 to the storage electrode of the capacitance sheet on the II surface side of the substrate 60. When a flexible substrate 60 with such electrodes and wiring patterns is prepared, an opening 60a is formed at a predetermined position of the substrate 60 shown in FIG. 18A. The opening 60a is punched and opened using a press machine or the like.

  Then, the driver IC device 5, the LED light source 6, the dome switch 25 ′, and the like are attached on the I surface of the substrate 60 shown in FIG. 19A. Thereafter, a sensor sheet 61b for detecting a pressing operation is formed on the I surface side of the substrate 60. The sensor sheet 61b is attached with an electrode pattern for a counter electrode (not shown) that faces the storage electrode of the capacitance sheet. At this time, a dielectric is formed between the storage electrode and the counter electrode. Thereby, a sensor sheet 61b for detecting a sliding (tracing) operation can be formed on the II surface side of the substrate 60. Further, as shown in FIG. 20B, the dome switch 25 'is constituted by the switch portion 25a' and the cover member 25b '. Thereby, a substrate 60 having a shape extending integrally from the sensor sheet for detecting the pressing operation to the sensor sheet 61b for detecting the sliding operation is obtained.

  When the operation panel 62, the cross key 66, and the component mounting board 103 are prepared, the board 60 is bent so that the opening 60a of the board 60 is positioned on the dome switch 25 ′ mounted on the board 60 shown in FIG. 21A. . At this time, using a bending jig 800 as shown in FIG. 22, the II surface is bent on the I surface. In this example, the bent portion III is set in a direction orthogonal to the longitudinal direction of the longitudinal portion of the substrate 60 shown in FIG. 20A. Then, the II surface of the substrate 60 is bent on the I surface of the substrate 60 at the bending portion III.

  For example, the sensor sheet 61b for sliding operation detection is folded in a horizontal U shape on the sensor sheet for pressing operation detection with the component mounting board 103 as a reference with respect to the bent part III. Further, the component mounting board 103 folded in a horizontal U shape is mounted on the housing 61 shown in FIG. At this time, the center portion of the cross key 66 shown in FIG. 25 is aligned with the link portion 62b, and the link portion 62b is inserted into the opening portion 60a.

  Next, the cross key 66 is fitted and combined with the opening 62 c of the operation panel 62 so that the cross key 66 is exposed from the circular opening 62 c opened in the operation panel 62. At this time, the non-operation surface of the cross key 66 is directed toward the inside of the operation panel 62, and the rubber sheet portion 62a is mounted in a state of keeping airtightness on the lower side of the operation panel 62. As the rubber sheet portion 62a, one having a rod-like link portion 62b formed at a predetermined portion is used. For example, the rubber sheet portion 62a forms the link portion 62b integrally by pouring Si rubber material into a mold. Thereby, in the operation panel 62 as shown in FIG. 15, the input device 301 having a pressing operation detection function and a sliding operation detection function is completed.

  Here, with reference to FIG. 26 and FIG. 27, a method of allocating a large number of unfolded substrates 60 from one substrate material 1 (member removal) will be compared between member methods of the conventional method and the present invention method. 26A and 26B are top views showing comparative examples of substrate shapes according to the conventional method and the present invention method. 27A and 27B are top views showing comparative examples of the substrate 60 ′ and the substrate 60 at the time of member removal.

  In this comparative example, a flexible substrate 60 in which a pad sheet 61a of a push button switch 65 of a digital camera 300 and a sensor sheet 61b for detecting a pressing operation and a sliding operation constituting the cross key 66 are integrated is one. In the case of efficiently removing a member from a single substrate material 1, a comparison was made as to which method does not waste a member and a large number of substrates 60 can be removed.

  According to the member removal of the inverted L-shaped substrate 60 ′ according to the conventional method shown in FIG. 26A, the sensor sheet 61b ′ arranged to protrude to the right side of the pad sheet 61a ′ has the width of the vertical pad sheet 61a ′. It is laid out in the horizontal direction with almost equal width. The total width of the substrate 60 'including the pad sheet 61a' and the sensor sheet 61b 'is w3'. The substrate 60 ′ has a bent portion III ′ set in a direction parallel to the longitudinal direction of the sensor sheet 61 b ′.

  In other words, a method is employed in which the left boundary portion of the sensor sheet 61b 'is bent toward the pad sheet side with respect to the bent portion III'. With this method, a large portion IV 'that is removed wastefully is generated in a lower portion of the sensor sheet 61b'. As a result, as shown in FIG. 27A, the number of components that can be taken out from the single substrate material 1 can be reduced, and the production yield of the component mounting substrate 103 ′ can be reduced.

  On the other hand, in the method of the present invention, the shape of the component mounting board 103 and its folding position are devised. According to the member removal of the substrate 60 according to the method of the present invention shown in FIG. 26B, the sensor sheet 61b having the same width w3 is laid out in the vertical direction continuously to the area of the pad sheet 61a. The entire width of the substrate 60 including the pad sheet 61a and the sensor sheet 61b is w3 (w3 <w3 ').

  The substrate 60 has a bent portion III set in a direction orthogonal to the longitudinal direction of the longitudinal portion of the sensor sheet 61b. And the lower surface side of the sensor sheet 61b is bent to the upper surface side of the sensor sheet 61b at the bent portion III. As a result, as shown in FIG. 27B, a large number of unfolded substrates 60 can be obtained from one substrate material 1.

  According to the above-described member example of the present invention method, since the bent portion III is set in the longitudinal portion of the sensor sheet 61b, the member removal shown in FIG. 27A is performed within the substrate material 1 having the same area. Compared to the member removal shown in FIG. 27B, many integrated flexible substrates 60 can be removed, and the number of member removals can be improved as compared with the conventional method. Thereby, compared with the conventional system, the part cut off from one board | substrate raw material 1 can be reduced, and it has come to be able to improve a production yield.

  Thus, according to the digital camera 300 as the third embodiment, the input device 301 according to the present invention is mounted, and the input device 301 is applied with the component mounting board 103 and its manufacturing method. .

  Therefore, as compared with the case where two individually prepared substrates are individually mounted on the casing 61 of the digital camera 300, the assembly process can be simplified and the wiring routing and connection process can be omitted. In addition, after mounting, an input detection operation by the sensor sheet 61b on the II side on the back side operation surface (identical appearance surface of the product) of the operation panel 62, and the I side through the opening 60a from the II side. The dome switch 25 'can be input. As a result, it is possible to reduce the size and cost of the input device 301 having the two input detection functions that incorporate the component mounting board 103, and thus to reduce the size of the digital camera 300 on which the input device 301 is mounted. In addition, the cost can be greatly reduced.

  In this example, the case where the cross key 66 is provided on the right side of the operation panel 62 as shown in FIG. 14 has been described, but of course, the present invention is not limited to this. It may be provided on the upper or lower operation surface. Needless to say, the same effect can be obtained when the housing 61 is provided.

  FIG. 28 is a cross-sectional view showing a configuration example of an input device 401 as a fourth embodiment that can be mounted on the mobile phone 200, the digital camera 300, and the like. An input device 401 shown in FIG. 28 includes a casing 81, an operation panel 82, a frame 83, and a cross multi-key 86, and is a device that inputs information by a sliding operation with an operator's finger or the like. The component mounting board 104 is used for the input device 401. The input device 401 is provided with a sensor sheet 81b as an example of a sheet-like detection member under the operation panel 82, and detects a sliding position of the operator's finger 30a and the like. The sensor sheet 81b is configured to have an electrode pattern 7 ″ (see FIG. 29). For an example of detection sensitivity of the input device 401, the “input device and electronic device” in the patent application (2007-246071) is currently being applied. Please refer.

  The component mounting board 104 is placed on a base of a casing 81 made of, for example, metal or resin in the frame 83. The component mounting board 104 has five openings 80a, 80b, 80c, 80d, and 80e at predetermined positions, and a flexible board 80, and one side of the board 80 is an I plane. When the other surface of the substrate 80 is the II surface, it includes at least five dome switches 85a, 85b, 85c, 85d, and 85e for pressing operation mounted on the I surface side of the substrate 80. .

  In this example, in the component mounting board 104, the opening 80a of the board 80 is located on the dome switch 85a on the I surface side of the board 80, and the opening 80b is located on the dome switch 85b on the I face side. The bent portion III is used as a reference so that the opening 80c is located on the dome switch 85c, the opening 80d is located on the dome switch 85d, and the opening 80e is located on the dome switch 85e. Thus, it has a flexible structure in which the II surface side is bent on the I surface side.

  Also in this example, in addition to the dome switches 85a, 85b, 85c, 85d, and 85e, the driver IC device 5 and the six LED light sources 6a, 6b, 6c, 6d, and 6e are provided on the I surface side of the substrate 80. Has been implemented. A cross multi-key 86 is combined on the substrate 80 with a rubber sheet portion 82f interposed, and is provided so as to cover part or all of the sensor sheet 81b.

  The cross multi-key 86 has five key parts 86a to 86e. The key part 86a has a cylindrical shape and is disposed at the center of the cross multi-key 86, and is used as, for example, an application determination key. The key parts 86b to 86e have a triangular cross section and are arranged with an arrangement angle of 90 ° in the XY direction (cross direction: vertical direction and horizontal direction) with the key part 86a as the center.

  The key parts 86b are used as, for example, a scroll & determination key when scrolling an image in the left direction of a display screen (not shown). Similarly, the key part 86c is used as a scroll & determination key when scrolling the image in the right direction of the display screen. Similarly, the key part 86d is used as a scroll & determination key when scrolling the image in the upward direction of the display screen.

  Similarly, the key part 86e is used as a scroll & determination key when scrolling the image in the lower direction of the display screen. In the same manner as in the third embodiment, the cross-shaped multi-key 86 is movably engaged with the pressing direction of the opening 82g of the operation panel 82, and extends along the sliding direction from one of the operation surfaces of the operation panel 82. The convex shape that rises up and rises toward the other side operation surface has a cross shape, and is slid along the operation surface of the operation panel 82.

  A rubber sheet portion 82 f is provided below the cross multi-key 86. Further, a portion located at the center of the cross multi-key 86, that is, the non-operation surface side of the key part 86a and each of the four key parts 86b to 86e arranged in a cross shape around the key part 86a. On the operation surface side, rod-shaped link portions 82a to 82e are provided. A link portion 82a is attached to the non-operation surface side of the key part 86a. Similarly, the link part 82b is attached to the non-operation surface side of the key part 86b, the link part 82c is attached to the non-operation surface side of the key part 86c, and the link part is attached to the non-operation surface side of the key part 86d. 82d is attached, and the link part 82e is attached to the non-operation surface side of the key part 86e.

  The cross multi-key 86 is mounted by penetrating the rubber sheet portion 82f at the link portion 82a attached to the key part 86a when assembling the parts. Similarly, the link part 82b attached to the key part 86b penetrates the rubber sheet part 82f, and the link part 82c attached to the key part 86c penetrates the rubber sheet part 82f and is attached to the key part 86d. The link portion 82d penetrates the rubber sheet portion 82f, and the link portion 82e attached to the key part 86e penetrates the rubber sheet portion 82f for mounting. Of course, the present invention is not limited to this, and key parts 86a to 86e with links may be mounted on the component mounting board 104 by providing an opening from the beginning at a predetermined position of the rubber sheet portion 82f.

  In the cross multi-key 86, a key part 86a and a link portion 82a that are integrally formed from the same resin material or the like from the beginning may be used. The same applies to the other key parts 86b to 86e.

  In this example, the key part 86a is operated so as to be turned on by pressing the dome switch 85a through the opening 80a during the input operation. Similarly, the key part 86b is operated so as to be turned on by pressing the dome switch 85b through the opening 80b. The key part 86c is operated so as to be turned on by pressing the dome switch 85c through the opening 80c. The key part 86d is operated so as to be turned on by pressing the dome switch 85d through the opening 80d. The key part 86e is operated so as to be turned on by pressing the dome switch 85e through the opening 80e.

  In this example, the detection area for detecting the sliding position of the operator's finger 30a by the sensor sheet 81b is set wider than the operation area for sliding operation by the operator's finger 30a by the cross multi-key 86. . In this way, for the sliding operation by the operator's finger 30a, the left and right operation surfaces of the operation panel 82 sandwiching the convex cross-shaped multi-key 86 and the upper and lower operation surfaces are included in the sliding operation range. Can do. The cross-shaped multi-key 86 having this shape can smoothly set the scroll key search pitch when searching for various information and the zoom adjustment pitch when adjusting the zoom amount of the optical lens 38.

  Next, a method for manufacturing the component mounting board 104 according to the present invention will be described. 29 to 33 are process diagrams showing formation examples (No. 1) to (No. 5) of the component mounting board 104. FIG. An example will be described in which a component mounting board 104 for an input device that can be mounted on a mobile phone 200, a digital camera 300, or the like is formed. FIG. 29B is a cross-sectional view of the substrate 80 in FIG. 29A taken along the line X3'-X3.

  First, a long and thin board 80 as shown in FIG. 16A for obtaining the component mounting board 104 is prepared. For example, a flexible substrate material having copper foils 11a and 11b on both sides is cut to obtain a substrate 80 having a longitudinal portion. The width W3 of the substrate 80 is about 30 mm, and the length L3 is about 150 mm. As the substrate material, as shown in FIG. 16B, copper foils 11a and 11b having a film thickness of about 18 μm are rolled on both surfaces of a base film 11c having a polyimide composition having a film thickness of about 25 μm.

  Next, the electrode pattern 7 ″, the wiring pattern 8 ″, the plate electrodes 111a to 111e, the plate electrodes 112a to 112e, the plate electrode 113, the cover films 9a to 9d, and the like are formed on the flexible elongated substrate 80 shown in FIG. 29A. . Refer to the first embodiment for examples of forming the electrode pattern 7 ″, the wiring pattern 8 ″, the cover films 9a to 9d, and the like (FIGS. 3A to C and FIGS. 4A and 4B). The electrode pattern 7 ″ includes flat plate electrodes 111a to 111e for mounting the IC device 5, the five LED light sources 6a to 6e, the five dome switches 85a to 85e, etc. The electrode 113 is formed, and on the II surface side of the substrate 80, a storage electrode of a capacitance sheet serving as the sensor sheet 81b is formed.

  The flat plate electrode 111a has a partially cut-out circular electrode pattern and constitutes a dome switch 85a. Similarly, the flat plate electrodes 111b to 111e are partially cut out to form a circular electrode pattern, the flat plate electrode 111b constitutes a dome switch 85b, the flat plate electrode 111c constitutes a dome switch 85c, and the flat plate electrode 111d constitutes a dome. The switch 85d is configured, and the plate electrode 111e configures the dome switch 85e.

  The flat plate electrode 112a forms a pair of rectangular electrode patterns and constitutes a mounting terminal for the LED light source 6a. Similarly, the plate electrodes 112b to 112e also form a pair of rectangular electrode patterns, the plate electrode 112b constitutes an attachment terminal for the LED light source 6b, and the plate electrode 112c constitutes an attachment terminal for the LED light source 6c. The electrode 112d constitutes an attachment terminal for the LED light source 6d, and the plate electrode 112e constitutes an attachment terminal for the LED light source 6e.

  The plate electrode 113 forms a plurality of fine rectangular electrode patterns in the same manner as in the third embodiment, and constitutes an attachment terminal of the IC device 5. The storage electrodes are formed so as to be distributed around the openings 80a to 80e. The wiring pattern 8 ″ forms wiring from the flat electrode 111a to 111e on the I surface side of the substrate 80 and the flat electrode 113 shown in FIG. 29B to the storage electrode of the capacitance sheet on the II surface side of the substrate 80. become.

  If the flexible board | substrate 80 with such an electrode and a wiring pattern is prepared, five opening part 80a-80e will be formed in the predetermined position of the board | substrate 80 shown to FIG. 30A. The opening 80a and the like open to a size having a width w4 and a length l4. When the opening 80a is square, one side is about 1 mm to 10 mm.

  In this example, openings 80 a to 80 e of about 3 mm × 3 mm that penetrate the substrate 80 are formed. 30B, the opening 80a is located at the upper center of the dome switch 85a shown in FIG. 28, the opening 80b is located above the dome switch 85b, and the opening 80c is located on the dome switch 85c. The position is set to be X mm from the right end of the substrate 80 so that the opening 80d is located above the dome switch 85d and the opening 80e is located above the dome switch 85e. The openings 80a and the like are punched and opened using a press machine or the like, as in the third embodiment.

  Next, the driver IC device 5 and the five LED light sources 6a to 6e are mounted on the substrate 80 shown in FIG. 31A. The IC device 5, the LED light sources 6a to 6e, and the like are soldered to the flat plate electrodes 112a to 112e, the flat plate electrode 113, and the like on the I surface shown in FIG. 31B by a solder bonding technique. Soldering may be performed by solder bonding using a predetermined lead frame or a flip chip bonding method using solder bumps.

  Thereafter, five dome switches 85a to 85e, which are examples of the operated components, are attached on the substrate 80 shown in FIG. 32A. The dome switches 85a to 85e are composed of a hemispherical switch portion 25a 'and a square cover member 25b' on the I surface side of the substrate 80 shown in FIG. 32B. Thereby, a sensor sheet (not shown) for detecting the pressing operation can be formed on the I surface side of the substrate 80.

  Here, on the II surface side of the substrate 80, an electrode pattern or the like for a counter electrode (not shown) facing the storage electrode of the capacitance sheet is attached. A dielectric is formed between the storage electrode and the counter electrode. Thereby, a sensor sheet 81b for detecting a sliding (tracing) operation can be formed on the II surface side of the substrate 80.

  When the substrate 80 extending integrally from the sensor sheet for detecting the pressing operation to the sensor sheet 81b for detecting the sliding operation is prepared, the dome switches 85a to 85e mounted on the substrate 80 shown in FIG. The surface II is bent on the surface I of the substrate 80 in FIG. 33B so that the opening 80a of the substrate 80 is positioned at the same position. In this example, the bent part III is set in a direction orthogonal to the longitudinal direction of the longitudinal part of the substrate 80 shown in FIG. 32A. Then, the II surface of the substrate 80 is bent on the I surface of the substrate 80 at the bending portion III.

  When the bent portion III is set in the longitudinal portion of the substrate 80, a large number of unfolded substrates 80 can be allocated from a single substrate material, members that are cut off unnecessarily can be reduced, and the production yield can be improved. (See FIG. 25).

  Next, an assembly example of the input device 401 to the operation panel 82 in the digital camera 300 will be described. FIG. 34 is a perspective view showing an assembly example of the input device 401. First, the operation panel 82, the cross multi key 86, and the component mounting board 104 are prepared. As the operation panel 82, a mold is used which is formed by molding a mold that models the inner periphery of the frame 83 of the digital camera 300 and the opening 82 g, and injecting resin into the mold and enclosing it. The opening 82g may be processed into an opening that penetrates the operation panel 82 and a circular concave hole shape (bottomed cylindrical shape) in the same manner as in the third embodiment.

  In this example, when the opening 82g has a hole shape penetrating the operation panel 82, the rubber sheet portion 82f disposed on the back surface of the operation panel 82 and the cross multi-key 86 are bonded, and the rubber sheet portion 82f crosses the cross. The multi key 86 is prevented from falling off. When the opening portion 82g has a bottomed cylindrical shape, the opening portions of the link portions 82a to 82e are provided at the bottom portion of the opening portion 82g, and the key parts 86a to 86e of the cross multi-key 86 are arranged. Of course, the operation panel 82 and the key parts 86a to 86e of the cross multi-key 86 may be integrally molded with resin so as to be separable.

  As the encapsulating resin, a PC (polycarbonate) resin, an ABS resin, a synthetic resin (PC + ABS resin), or the like is used as in the third embodiment. Thereafter, the outer surface of the operation panel 82 may be subjected to metal plating. Of course, the operation panel 82 is not limited to a resin molded product, and may be formed by pressing, deep drawing, or extruding light metal such as aluminum having a predetermined thickness, magnesium plate, SUS304, or the like. Good. The opening 82g may be opened by punching. Thereafter, the outer surface of the operation panel 82 may be plated for rust prevention.

  In this example, the key parts 86a to 86e constituting the cross multi-key 86 may be formed with a non-operation surface that covers part or all of the sensor sheet 81b. For example, since the cross multi-key 86 is slid along the operation surface of the operation panel 82, each non-operation surface of the key parts 86a to 86e of the cross multi-key 86 has a flat shape. 86a has a link portion 82a at the center of the back surface of the key part 86b, has a link portion 82b at the center of the back surface of the key part 86b, and has a link portion 82c at the center of the back surface of the key part 86c. A link portion 82d is formed at the center of the back surface, and a link portion 82e is formed at the center of the back surface of the key part 86e.

  First, a mold for key parts is created that is shaped like the cross multi-key 86 having a cross-shaped convex shape. In this example, since the link portions 82a to 82e are prepared as separate members, the shape of the link portions 82a to 82e can be deleted from the shape of the cross multi-key 86. The key part mold has a crescent-shaped recess that is raised from one operation surface of the operation panel 82 along the sliding direction and raised toward the other operation surface. And the cavity which covers this is prepared. When such a mold is prepared, the operation panel 82 is molded by enclosing a resin in the mold.

  As the encapsulating resin, for example, PC (polycarbonate) resin, ABS resin, synthetic resin (PC + ABS resin) or the like is used. In this example, after the cross multi-key 86 is formed, UV (ultraviolet) coating is applied. For example, a solution that improves wearability is applied to the operation surface of the cross multi-key 86. Thereafter, the coating film surface is cured by irradiating with ultraviolet rays. Thereby, the wear resistance of the operation surface of the cross multi-key 86 can be improved.

  As a result, a cross-shaped multi-key 86 having a cross-shaped convex shape that forms a cross-shaped semicircular arc having a predetermined height and width and can be slid along the arc shape can be formed. When the cross multi-key 86 is configured in this manner, a sliding operation that rises in an arc shape along the sliding direction from the operation surface on the left side of the operation panel 82 with respect to the sliding operation by the operator's finger 30a (see FIG. 28). In addition to a dynamic operation sensation, an arc-shaped sliding operation sensation that rises toward the operation surface on the right side, and a direction perpendicular thereto, from the operation surface on the upper side of the operation panel 82 along the sliding direction. In addition to a sliding operation feeling that rises in an arc shape, an arc-like sliding operation feeling that rises toward the lower operation surface can be provided.

  As the component mounting board 104, one produced by the method described with reference to FIGS. 29 to 33 is used. As the component mounting board 104, a board having a long and thin flexible board 80 as shown in FIG. 16A and having an electrode pattern 7 ″ and a wiring pattern 8 ″ formed thereon is used. The electrode pattern 7 ″ includes the driver IC device 5 on the I-side of the substrate 80, the LED light sources 6a to 6e, the plate electrodes 111a to 111e for mounting the dome switches 85a to 85e, the plate electrodes 112a to 112e, The plate electrode 113 is formed, and the storage electrode of the capacitance sheet is formed on the II surface side of the substrate 80. The storage electrode is formed so as to be distributed including the openings 80a to 80e.

  The wiring pattern 8 ″ is a capacitance of the plate 80 from the plate electrodes 111a to 111e, the plate electrodes 112a to 112e, and the plurality of plate electrodes 113 of the driver IC device 5 on the I surface side of the substrate 80. It is formed so as to be connected to the storage electrode of the sheet, etc. For example, an electrode pattern 7 ″ for mounting the driver IC device 5 on the I surface side of the substrate 80, LED light sources 6a to 6e, dome switches 85a to 85e From the plate electrodes 111a to 111e, the plate electrodes 112a to 112e, and the plurality of plate electrodes 113 of the IC device 5 for the driver on the I surface side of the substrate 80, the storage electrode of the capacitance sheet on the II surface side of the substrate 80 A wiring pattern 8 ″ is formed so as to form a flexible substrate 80 with such electrodes and wiring patterns, and the substrate 80 shown in FIG. The openings 80a to 80e are formed at the positions of the openings 80a to 80e using a press machine or the like.

  Then, the driver IC device 5, the LED light sources 6a to 6e, the dome switches 85a to 85e, and the like are attached to the I surface of the substrate 80 shown in FIG. 31A. Thereafter, a sensor sheet 81b for detecting a pressing operation is formed on the I surface side of the substrate 80. The sensor sheet 81b is attached with an electrode pattern or the like for a counter electrode (not shown) facing the storage electrode of the capacitance sheet. At this time, a dielectric is formed between the storage electrode and the counter electrode. As a result, a sensor sheet 81b for detecting a sliding (tracing) operation for the cross multi-key can be formed on the II surface side of the substrate 80. Further, as shown in FIG. 32B, the dome switches 85a to 85e are configured by the switch portion 25a 'and the cover member 25b'. As a result, the substrate 80 having a shape extending integrally from the sensor sheet for detecting the pressing operation to the sensor sheet 81b for detecting the sliding operation is obtained.

  Next, in FIG. 34, the key parts 86 a to 86 e of the cross multi-key 86 are opened in the operation panel 82 so that the cross multi-key 86 is exposed from the circular opening 82 g opened in the operation panel 82. Fit into the part 82g and combine. At this time, the non-operation surfaces of the key parts 86 a to 86 e are directed to the inside of the operation panel 82.

  When the operation panel 82, the cross multi-key 86 and the component mounting board 104 are prepared, the opening 80a of the board 80 is positioned on the dome switches 85a to 85e mounted on the board 80 shown in FIG. 33A. Bend it. At this time, using a bending jig 800 as shown in FIG. 22, the II surface is bent on the I surface. In this example, the bent portion III is set in a direction orthogonal to the longitudinal direction of the longitudinal portion of the substrate 80 shown in FIG. 32A. Then, the II surface of the substrate 80 is bent on the I surface of the substrate 80 at the bending portion III. The component mounting board 104 is folded in a horizontal U shape on the sensor sheet 81b for detecting the sliding operation on the sensor sheet for detecting the pressing operation with the folding part III as a reference.

  Further, the component mounting board 104 folded in a horizontal U shape is mounted on the casing 81 shown in FIG. At this time, the link portion 82a is attached to the center of the back surface of the key part 86a of the cross multi-key 86, and the link portion 82a is inserted into the opening 80a through the rubber sheet portion 82f. Similarly, the link portion 82b is attached to the center of the back surface of the key part 86b, the link portion 82b is inserted through the rubber sheet portion 82f and into the opening 80b, and the link portion 82c is attached to the center of the back surface of the key part 86c. The link portion 82c is inserted through the rubber sheet portion 82f into the opening portion 80c, the link portion 82d is attached to the center of the back surface of the key part 86d, and the link portion 82d is inserted through the rubber sheet portion 82f into the opening portion 80d. The link part 82e is attached to the center of the back surface of the key part 86e, and the link part 82e is inserted into the opening part 80e through the rubber sheet part 82f.

  With the rubber sheet portion 82f, the cross multi-key 86 can be mounted in a state where airtightness is maintained on the lower side of the operation panel 82. At this time, it is preferable to use a rubber sheet portion 82f in which openings of the link portions 82a to 82e are formed at predetermined portions. For example, a Si rubber material is used for the rubber sheet portion 82f. Thereby, in the operation panel 82 as shown in FIG. 28, the input device 401 with a pressing operation detection function and a sliding operation detection function is completed.

  Thus, according to the input device 401 as the fourth embodiment that can be mounted on the mobile phone 200, the digital camera 300, etc., the component mounting board 104 and the manufacturing method thereof according to the present invention are used. Therefore, as compared with the case where two individually prepared substrates are individually mounted on the casing 81 of the mobile phone 200, the digital camera 300 or the like, the assembly process can be simplified and the wiring routing and connection process can be omitted. it can.

  In addition, after the mounting, the input detection operation by the sensor sheet 81b on the II surface side on the operation surface of the operation panel 82 (identical appearance of the product), and the I surface side through the openings 80a to 80e from the II surface side The five dome switches 85a to 85e can be individually operated. As a result, it is possible to reduce the size and cost of the input device 401 having the six input detection functions with the built-in component mounting board 104 built therein. It is possible to reduce the size such as 300 and significantly reduce the cost.

  In this example, the case where the cross multi-key 86 shown in FIG. 34 is provided on the operation panel 82 has been described, but of course, the present invention is not limited to this. Alternatively, it may be provided on the lower operation surface. Needless to say, the same effect can be obtained when the housing 81 is provided.

  The present invention relates to a digital camera equipped with an input device having a sliding operation function and a pressing operation function, a video camera, a mobile phone, a mobile terminal device, a personal computer (hereinafter referred to as a PC), a notebook PC, and a home electronic device. It is extremely suitable when applied to a device and its remote controller.

It is a perspective view which shows the structural example of the component mounting board | substrate 101 as a 1st Example. (A) And (B) is process drawing which shows the example of formation of the component mounting board | substrate 101 (the 1). (A) And (B) is process drawing which shows the example of formation of the component mounting board | substrate 101 (the 2). (A) And (B) is process drawing which shows the example of formation of the component mounting board | substrate 101 (the 3). (A) And (B) is process drawing which shows the example of formation of the component mounting board | substrate 101 (the 4). (A) And (B) is process drawing which shows the example of formation of the component mounting board | substrate 101 (the 5). (A) And (B) is process drawing which shows the example of formation of the component mounting board | substrate 101 (the 6). It is a perspective view which shows the structural example of the mobile telephone 200 as a 2nd Example which mounted the component mounting board | substrate 101 which concerns on this invention. 4 is a cross-sectional view showing a configuration example of an input device 100 that can be mounted on a mobile phone 200. 3 is a perspective view showing an assembly example of the input device 100. FIG. (A) And (B) is a top view which shows the comparative example of the board | substrate shape which concerns on a conventional system and this invention system. (A) And (B) is a top view which shows the comparative example of the board | substrate 10 'at the time of member removal, and the board | substrate 10. FIG. It is a block diagram which shows the structural example of control systems, such as a mobile telephone 200, and its tactile feedback function example. It is a perspective view which shows the structural example of the digital camera 300 as a 3rd Example. 2 is a cross-sectional view illustrating a configuration example of an input device 301 that can be mounted on a digital camera 300. (A) And (B) is process drawing which shows the example of formation of the component mounting board | substrate 103 (the 1). (A) And (B) is process drawing which shows the formation example (the 2) of the component mounting board | substrate 103. FIG. (A) And (B) is process drawing which shows the formation example (the 3) of the component mounting board | substrate 103. FIG. (A) And (B) is process drawing which shows the example of formation of the component mounting board | substrate 103 (the 4). (A) And (B) is process drawing which shows the formation example (the 5) of the component mounting board | substrate 103. FIG. (A) And (B) is process drawing which shows the example of formation of the component mounting board | substrate 103 (the 6). FIG. 5 is a conceptual diagram illustrating a configuration example of a bending jig 800. FIG. 10 is a process diagram showing an example (part 1) of bending a component mounting board 103; FIG. 10 is a process diagram illustrating a second example of bending the component mounting board 103; It is a perspective view which shows the assembly example of the input device 301. FIG. (A) And (B) is a top view which shows the comparative example of the board | substrate shape which concerns on a conventional system and this invention system. (A) And (B) is a top view which shows the comparative example of the board | substrate 60 'at the time of member removal, and the board | substrate 60. FIG. It is sectional drawing which shows the structural example of the input device 401 as a 4th Example which can be mounted in the mobile telephone 200, the digital camera 300, etc. FIG. (A) And (B) is process drawing which shows the example of formation of the component mounting board | substrate 104 (the 1). (A) And (B) is process drawing which shows the example of formation of the component mounting board | substrate 104 (the 2). (A) And (B) is process drawing which shows the formation example (the 3) of the component mounting board | substrate 104. FIG. (A) And (B) is process drawing which shows the example of formation of the component mounting board | substrate 104 (the 4). (A) And (B) is process drawing which shows the example of formation of the component mounting board | substrate 104 (the 5). It is a perspective view which shows the assembly example of the input device 401. FIG. It is sectional drawing which shows the structural example of the input device 500 which concerns on a prior art example. It is sectional drawing which shows the structural example of the input device 600 which concerns on a prior art example.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Substrate material, 5 ... IC device, 6, 6a-6e ... LED light source, 7, 7 ', 7 "... Electrode pattern, 8, 8', 8" ... Wiring pattern , 9a to 9d ... cover film, 10, 10'60, 60'80 ... substrate, 10a, 60a, 80a-80e ... opening, 15 ... control unit, 16 ... antenna, 17, 67 ... Circuit board, 18, 62, 82 ... Operation panel, 21 ... Receiver, 22 ... Transmitter, 23 ... Duplexer, 25, 85a to 85e ... Dome Switch, 26 ... Image processing unit, 29, 69 ... Display unit, 31 ... A / D driver, 32 ... CPU, 33 ... Power supply unit, 34 ... Camera, 35 ...・ Storage unit 36a ... Speaker, 36b ... Speaker with actuator function 37: Memory unit, 38: Optical lens, 39: Shutter button, 44 ... Video & audio processing unit, 41 ... Hinge mechanism, 42 ... Key top, 61, 81,. Case, 63, 83 ... Frame, 64 ... Battery, 65 ... Push button switch, 66 ... Cross key (operation unit), 86 ... Cross multi key (operation unit), DESCRIPTION OF SYMBOLS 100, 301, 401 ... Input device, 101-104 ... Component mounting board, 200 ... Mobile phone (electronic device), 300 ... Video camera (electronic device), 800 ... Bending jig

Claims (6)

A substrate having an opening at a predetermined position and having flexibility;
When one surface of the substrate is a substrate first surface and the other surface of the substrate is a substrate second surface, at least a first switch member for pressing operation mounted on the substrate first surface ;
A plurality of second switch members for pressing operation installed on an operation surface different from the first switch member;
A sheet-like support member that supports the plurality of second switch members;
A sheet-like detection member for detecting a sliding operation that is mounted on the second surface of the substrate and integrated with the support member;
A wiring pattern provided from the substrate first surface to the substrate second surface ,
Having a flexible structure that the substrate second surface folded on the first surface substrate such that the opening on the first switch member of the substrate first surface is located
Part goods mounting board. Forming an opening at a predetermined position of the flexible substrate;
When one surface of the substrate is a substrate first surface and the other surface of the substrate is a substrate second surface, at least a step of mounting a first switch member for pressing operation on the substrate first surface;
Forming a wiring pattern from the first substrate surface to the second substrate surface;
A sheet-like detection member for detecting a sliding operation, which is integrated with a sheet-like support member for supporting a plurality of second switch members for pressing operation installed on an operation surface different from the first switch member. Mounting on the second surface of the substrate;
A step of folding the second surface of the substrate on the substrate first surface so that the opening in the substrate first said mounted on side first switch member on is located,
And mounting the bent board on a predetermined housing.
Method of manufacturing a part GOODS mounting board. Forming a longitudinal portion on the substrate;
A bending part is set in a direction orthogonal to the longitudinal direction of the longitudinal part, and the substrate second surface is bent on the substrate first surface at the bending part.
Component mounting board manufacturing method according to 請 Motomeko 2. An input device for inputting information by a sliding operation by an operating body,
A sheet-like detection member that is provided in a casing having an operation surface and detects a sliding position of the operation body;
A component mounting board provided to cover a part or all of the detection member, and having an operation unit that is slid along the operation surface of the housing;
The component mounting board is
A substrate having an opening at a predetermined position and having flexibility;
When one surface of the substrate is a substrate first surface and the other surface of the substrate is a substrate second surface, at least a first switch member for pressing operation mounted on the substrate first surface ;
A plurality of second switch members for pressing operation installed on an operation surface different from the first switch member;
A sheet-like support member that supports the plurality of second switch members;
A wiring pattern provided from the substrate first surface to the substrate second surface ,
Have a flexible structure in which the substrate second surface folded on the first surface substrate such that the opening of the substrate on the first switch member of the substrate first surface is positioned, and the detecting member An input device mounted on the second surface of the substrate and integrated with the support member . The operation unit is
It has a convex shape that rises from the one operation surface of the housing along the sliding direction and rises toward the other operation surface.
The input device according to 請 Motomeko 4. A housing having an operation surface;
An input device that is provided in the housing and inputs information by a sliding operation by an operating body;
The input device is:
A sheet-like detection member that is provided in a casing having an operation surface and detects a sliding position of the operation body;
A component mounting board that is provided so as to cover a part or all of the detection member, and has an operation portion that is slid along the operation surface of the housing;
The component mounting board is
A substrate having an opening at a predetermined position and having flexibility;
When one surface of the substrate is a substrate first surface and the other surface of the substrate is a substrate second surface, at least a first switch member for pressing operation mounted on the substrate first surface ;
A plurality of second switch members for pressing operation installed on an operation surface different from the first switch member;
A sheet-like support member that supports the plurality of second switch members;
A wiring pattern provided from the substrate first surface to the substrate second surface ,
Have a flexible structure in which the substrate second surface folded on the first surface substrate such that the opening of the substrate on the first switch member of the substrate first surface is positioned, and the detecting member An electronic device mounted on the second surface of the substrate and integrated with the support member .

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