JP5068571B2 - Electronic component mounting equipment - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus capable of mounting an electronic component on a substrate with different crimping loads.

  In a flip chip type mounting apparatus that mounts a semiconductor chip as an electronic component on a substrate, the semiconductor chip picked up by a pick-up tool from the chip supply unit is received by the transfer tool, and the transfer tool is used as a mounting tool of the mounting apparatus. Deliver. The mounting tool that receives the semiconductor chip is positioned in the X and Y directions so as to be positioned above the mounting position of the substrate, and then driven downward in the Z direction to mount the semiconductor chip on the substrate.

  The semiconductor chip is mounted on the substrate via a paste adhesive or a connecting member such as an anisotropic conductive member or a solder bump. For this reason, the crimping load when the semiconductor chip is mounted on the substrate is changed according to the type of the connecting member, the size of the semiconductor chip, and the like.

  Specifically, the bonding of the semiconductor chip is performed with a relatively low load of several tens to hundreds of grams and a high load of several kilograms to several tens of kilograms.

  Therefore, in the mounting apparatus, the mounting load shown in Patent Document 1 can be changed to a low load or a high load depending on the type of connection member used when mounting the semiconductor chip on the substrate. Equipment has been developed.

  The mounting apparatus disclosed in Patent Document 1 has a lifting block that is driven up and down by a first pressing force applying means, and a pressing block is provided on the lifting block so as to be slidable in the vertical direction, and is elastically supported by a spring. Is held in.

  A crimping tool (mounting tool) is provided in the crimping block so as to be slidable in the vertical direction, and the crimping tool can be driven in the downward direction by the second pressing force applying means. The crimping block is provided with a drive unit such as a cylinder, and the cylinder is configured to drive the fixing pin forward and backward with respect to the crimping block. When the fixing pin is driven in the forward direction, the fixing pin engages with an engagement hole formed in the crimping tool.

  As a result, the crimping tool is integrally coupled with the crimping block, so that the semiconductor chip held by the crimping tool is subjected to a first crimping force (high pressure) by the first pressing force applying means for driving the lifting block. It can be mounted on a substrate with a load.

When the fixing pin is driven backward by the driving unit to disengage the crimping tool from the crimping tool, the second pressing force is applied to the second pressing force applying means by the second pressing force applying means. It can be mounted on a substrate with a pressing force (low load).
JP 2002-43336 A

  According to the mounting apparatus having the above-described configuration, it is possible to mount the semiconductor chip on the substrate with different pressure loads depending on the type of the connecting member. However, in order to change the crimping load of the semiconductor chip, it has been necessary to drive the fixing pin forward and backward by the drive unit and to integrally fix the crimping tool to the crimping block. In other words, since the drive portion must be provided at the tip portion where the crimping tool is provided, the number of parts may increase and the configuration may be complicated.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting apparatus that can easily change the crimping load when mounting an electronic component on a substrate with a simple configuration.

The present invention is a mounting apparatus for mounting electronic components on a substrate by changing a crimping load,
First crimping load application means;
A support body driven in the vertical direction by the first pressure-bonding load applying means;
A movable body that is supported by the support body so as to be displaceable in the vertical direction and is provided with a mounting tool that holds the electronic component at the lower end;
Holding means for engaging and holding the movable body at a predetermined position on the support body so as not to be lowered;
A pressure contact portion that is provided on the movable body and presses against the support body to limit the lift of the movable body when the movable body is displaced by a predetermined amount or more in the upward direction relative to the support body;
A second pressure bonding load applying means for selectively driving the movable body in the upward direction and the downward direction;
Comprising
The movable body is urged in the upward direction by the second crimp load applying means, and the support body is lowered by the first crimp load applying means in a state where the press contact portion is in contact with the support body. The electronic component is mounted on the substrate with a first pressure bonding force,
The electronic component is provided by applying a downward biasing force to the movable body by the second pressure-bonding load applying means in a state in which the engagement holding state of the movable body with respect to the support body is released by the holding means. Is mounted on the substrate with a second crimping force that is smaller than the first crimping force.

  The first pressure-bonding load applying means has a drive shaft for driving the support, and the drive shaft and the mounting tool are preferably provided in the vertical direction with their axes aligned.

A shaft member constituting the pressure contact portion is provided at the upper end of the movable body so that the mounting tool and the shaft core coincide with each other,
The holding means is provided on the support body and formed with a through hole through which the shaft member is inserted, and the shaft member is provided symmetrically with respect to the axis around the shaft member and engages with the support piece to It is preferable that the movable body is constituted by an engagement piece that restricts the descending position of the movable body.

  It is preferable that the holding means is a stopper member that is provided on the support body and abuts against a lower end surface of the movable body when the movable body is lowered to a predetermined position to restrict the lowering.

The pressure contact portion is a shaft member provided on the upper surface of the movable body,
The second pressurizing load applying means is provided on the support body and either one of an annular coil or a magnet through which the shaft member is inserted, and either one of an annular coil or a magnet provided on the shaft member It is preferable that it is comprised.

  According to the present invention, when the electronic component is mounted with the first load larger than the second load, the movable body provided with the mounting tool is driven by the second crimping load applying means and integrated with the support body. Therefore, the first crimping force can be reliably applied to the electronic component with a simple configuration.

Embodiments of the present invention will be described below with reference to the drawings.
1 and 2 (a) and 2 (b) show a first embodiment of the present invention, and FIG. 1 shows a schematic configuration of a mounting apparatus. The mounting apparatus includes a frame 1. On the upper surface of the frame 1, a drive source 2 as a first crimp load applying means is provided with an output shaft 3 protruding from the lower surface of the frame 1.

  The output shaft 3 is connected to the upper end of a screw shaft 4 as a drive shaft. The lower end of the screw shaft 4 is rotatably supported by a bearing 6 provided on the upper surface of a horizontal piece of an L-shaped bracket 5 that is suspended from the lower surface of the frame 1.

  Since the screw shaft 4 is formed in the block 8, it is screwed into a screw portion (not shown). The block 8 is connected and fixed to the upper end portion of the connection member 9. One side surface of the lower end of the connecting member 9 is slidably in contact with the front end surface of the horizontal piece of the bracket 5, and the lower end is connected and fixed to the upper surface of the horizontal piece 11 a of the inverted L-shaped support 11.

  A support piece 12 is provided horizontally in the middle of the inner surface of the vertical piece 11b of the support 11, and a through hole 13 is formed in the support piece 12 so that the center thereof coincides with the axis O1 of the screw shaft 4. Yes. A concave step portion 14 is formed around the through hole 13.

  A linear guide 15 is provided along the vertical direction on the inner surface of the vertical piece 11 b of the support 11 below the support piece 12. The linear guide 15 is provided with a movable member 16 slidably engaged with a receiving member 17 provided on a side surface, and an axis O2 of the linear guide 15 is aligned with the axis O1 of the screw shaft 4 in the vertical direction.

  A mounting tool 18 is provided on the lower end surface of the movable body 16, and a shaft member 19 constituting a press contact portion is provided on the upper end surface. The mounting tool 18 and the shaft member 19 are provided so as to coincide with the axis O2 of the movable body 16. The shaft member 19 is inserted into the through hole 13, and a flange 21 as an engagement piece that engages with the stepped portion 14 is provided at a portion protruding to the upper surface side of the support piece 12. That is, the flange 21 is formed symmetrically about the axis of the shaft member 19. And the said flange 21 and the said step part 14 comprise the holding means which hold | maintains the said movable body 16 in a lowered position by these engagement.

  The movable body 16 is driven in the ascending direction and the descending direction by a voice coil motor 22 that constitutes a second pressure bonding load applying means. The voice coil motor 22 is composed of an annular coil 22a provided on the upper surface of the support piece 12 and a similar annular magnet 22b provided on the shaft member 19, and controls the current flowing through the coil 22a. Thus, the movable body 16 is driven in the vertical direction.

  That is, the shaft member 19 provided with the magnet 22b is inserted through the coil 22a. Thereby, the voice coil motor 22 can selectively drive the movable body 16 in the upward or downward direction via the shaft member 19.

  A load cell 23 is provided at a portion corresponding to the upper end surface of the shaft member 19 on the inner surface of the horizontal piece 11 a of the support 11. The support 11 is driven in the downward direction by the drive source 2 through the screw shaft 4. When the support body 11 is driven in the downward direction and the semiconductor chip 25 as an electronic component sucked and held at the lower end of the mounting tool 18 comes into contact with a substrate 27 such as a lead frame placed on the table 26, the movable body. 16 rises relatively.

  The load cell 23 is pressed by the upper end surface of the shaft member 19 provided on the movable body 16 when the movable body 16 rises by a predetermined amount relative to the support body 11 as shown in FIG. The The output value of the load cell 23 varies depending on the strength pressed by the shaft member 19.

  A gap sensor 28 is provided at the tip of the support piece 12 provided on the support 11. The tip of the gap sensor 28 faces the target 29 provided on the movable body 16. The gap sensor 28 measures the distance from the target 29.

  Accordingly, when the support 11 is lowered and the semiconductor chip 25 held by the mounting tool 18 hits the substrate 27, and the movable body 16 is displaced in the upward direction relative to the support 11, the gap sensor 28 and the target 29. And the output from the gap sensor 28 also changes, so that the timing at which the semiconductor chip 25 hits the substrate 27 can be detected.

  At this time, if the value of the current flowing through the voice coil motor 22 is controlled, the urging force for urging the mounting tool 18 in the downward direction changes, so that the pressing force for mounting the semiconductor chip 25 on the substrate 27 can be changed.

  Next, an operation when the semiconductor chip 25 is mounted on the substrate 27 by the mounting apparatus having the above configuration will be described. As shown in FIG. 1, when the semiconductor chip 25 is transferred to the mounting tool 18, the movable body 16 has a flange 21 provided on the shaft member 19 formed in the peripheral portion of the through hole 13 of the support piece 12 of the support body 11. In this state, the stepped portion 14 is engaged. At this time, the movable body 16 is in a lower limit position with respect to the support body 11.

  The flange 21 is symmetrical with respect to the shaft member 19, that is, is provided over the entire outer periphery. Therefore, the movable body 16 is held by the support body 11 without the axis O2 being inclined with respect to the vertical line.

  In order to mount the semiconductor chip 25 delivered to the mounting tool 18 on the substrate 27, first, the drive source 2 is operated to rotate the screw shaft 4, and the support 11 is lowered through the block 8. The movable body 16 is interlocked with the lowering of the support body 11. When the semiconductor chip 25 held by the mounting tool 18 at the lower end of the movable body 16 hits the substrate 27, the movable body 16 rises relative to the support body 11, which is detected by the gap sensor 28. Is done.

  When the semiconductor chip 25 is mounted on the substrate 27 with a high load, first, the current applied to the coil 22a is controlled so that the urging force that drives the shaft member 19 in the upward direction is applied to the voice coil motor 22. Then, the upper end of the shaft member 19 is brought into contact with the load cell 23 as shown in FIG. At this time, the coil 22 a of the voice coil motor 22 is applied with an urging force in the upward direction such that the upper end of the shaft member 19 does not leave the load cell 23.

  Next, the screw shaft 4 is rotationally driven by the drive source 2 to lower the support 11. As a result, the semiconductor chip 25 held by the mounting tool 18 contacts the substrate 27 as shown in FIG. 2A, and the support 11 is further driven in the downward direction from this state.

  When the support body 11 is driven in the descending direction with the upper end of the shaft member 19 being in pressure contact with the load cell 23, the movable body 16 does not rise relative to the support body 11 and falls integrally with the support body 11. Will do. That is, since the movable body 16 is lowered while being fixed to the support 11 so as not to be raised, the semiconductor chip 25 can be mounted on the substrate 27 with a high load by the drive source 2.

  Since the mounting load at this time is detected by the load cell 23, the semiconductor chip 25 is mounted on the substrate 27 by stopping the driving source 2 from moving downward in the downward direction when the load cell 23 detects a predetermined load. It can be mounted with a high load of several kilograms to several tens of kilograms.

  On the other hand, when the semiconductor chip 25 is mounted on the substrate 27 with a low load, if the gap sensor 28 detects the relative rise of the movable body 16 with respect to the support body 11, the support body 11 is moved from the upper end of the shaft member 19 from that point. The distance is lowered by a distance smaller than the gap G (shown in FIG. 1) with the load cell 23.

  As a result, the movable body 16 is in a state of floating with respect to the support piece 12 as shown in FIG. 2B, so that the voice coil motor 22 is energized at that time or before the movable body 16 floats from the support piece 12. Can be mounted with a relatively low pressure load of a few tens of grams to several hundred grams of pressure contact force that presses the semiconductor chip 25 held by the mounting tool 18 against the substrate 27.

  That is, the semiconductor chip 25 can be selectively performed by either a high load of several kilograms to several tens of kilograms or a relatively low pressure load of several tens of grams to several hundreds of grams.

  According to the mounting apparatus having the above configuration, when the semiconductor chip 25 is mounted on the substrate 27 with a high load, the movable body 16 is raised with respect to the support body 11 by the voice coil motor 22, and the upper end surface of the shaft member 19 is the load cell 23. If it contacts, the support body 11 is lowered while maintaining that state.

  Therefore, the pressure contact between the shaft member 19 and the support 11 restricts the ascent of the movable body 16 and lowers it integrally with the support 11, and the semiconductor chip 25 is placed on the substrate 27 with a high load by the driving force of the driving source 2. Can be implemented. That is, since it is not necessary to drive the fixed pin by the drive unit in order to integrally couple the movable body 16 to the support body 11 as in the prior art, the number of parts is reduced correspondingly and the configuration is simplified. Can be achieved.

  In the movable body 16, a flange 21 provided over the entire length of the outer periphery of the shaft member 19 with respect to the support body 11 is engaged with the step portion 14 of the support piece 12. Therefore, since the axis O2 of the movable body 16 does not incline with respect to the vertical line, when the support body 11 is lowered to mount the semiconductor chip 25 on the substrate 27, the movable body 16 is provided at the tip of the mounting tool 18. The semiconductor chip 25 is in contact with the substrate 27 uniformly in a horizontal state. As a result, non-uniform pressing force is not applied to the semiconductor chip 25, so that the semiconductor chip 25 is not damaged, such as a lack of edges.

  In particular, when the semiconductor chip 25 is thin with a thickness of several tens of μm, chipping tends to occur when it strikes the substrate 27 in a tilted state, but it can be applied uniformly in a horizontal state, so chipping is surely generated. Can be prevented.

  Further, the axis O1 of the screw shaft 4 and the axis O2 of the shaft member 19, the movable body 16, and the mounting tool 18 coincide with each other in the vertical direction. For this reason, when the semiconductor chip 25 is pressed and mounted on the substrate 27 while being held by suction at the tip of the mounting tool 18, the moment due to the deviation between the axis O 1 of the screw shaft 4 and the axis O 2 of the movable body 16 is mounted on the semiconductor chip 25. Will not be added.

  As a result, the load of the drive source 2 can be applied perpendicularly to the semiconductor chip 25 held by the mounting tool 18, so that the semiconductor chip 25 is mounted uniformly on the substrate 27 without causing damage such as cracks. Can do.

  The voice coil motor 22 includes an annular coil 22a and a magnet 22b provided on the shaft member 19 inserted through the coil 22a. Therefore, the voice coil motor 22 can selectively drive the movable body 16 in the upward and downward directions via the shaft member 19.

  Accordingly, as described above, if the shaft member 19 is driven in the upward direction to hold the movable body 16 so as not to be lowered relative to the support body 11, the semiconductor chip 25 can be mounted with a high load. In addition, the movable body 16 is driven in the downward direction with the movable body 16 raised from the lower limit with respect to the support body, that is, with the flange 21 provided on the shaft member 19 detached from the stepped portion 14 of the support piece 12. In this case, the semiconductor chip 25 can be mounted with a low load.

  Further, the mounting tool 18 driven by the low load voice coil motor 22 and the screw shaft 4 driven by the high load driving source 2 are arranged on the same axis in the vertical direction, and the mounting tool 18 is interposed. Since a vertical load can be applied to the semiconductor chip 25, the semiconductor chip 25 can be mounted on the substrate 27 without damaging it.

  In the first embodiment, the holding means is composed of the step portion 14 formed on the support piece 12 and the flange 21 that engages the shaft member 19 when the shaft member 19 is at the lower limit. However, instead of the flange 21, a plurality of protrusions may be provided on the outer periphery of the shaft member 19 at predetermined intervals in the circumferential direction around the axis of the shaft member.

  In the above embodiment, the coil 22a is provided on the support piece 12 of the support 11 and the magnet 22b is provided on the shaft member 19. However, the coil 22a is provided on the shaft member 19, and the magnet 22b is provided on the support piece 12. You may make it provide.

  FIG. 3 shows a second embodiment of the present invention. This embodiment is a modification of the means for supporting the movable body 16 with respect to the support body 11 at the lower limit. In this embodiment, the support piece 12 is provided with the step portion 14 and the shaft member 19 with the step portion 14. Without forming the flange 21 to be engaged, a stopper member 31 is provided at the lower end of the vertical piece 11b of the support body 11, and the movable body 16 is supported by the stopper member 31 with respect to the support body 11 at the lower limit. did.

Even with such a configuration, the semiconductor chip 25 can be mounted on the substrate 27 with either a high load or a low load as in the first embodiment described above.
In the second embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

BRIEF DESCRIPTION OF THE DRAWINGS The schematic block diagram of the mounting apparatus which shows 1st Embodiment of this invention. (A) is explanatory drawing when mounting a semiconductor chip on a board | substrate with a high load, (b) is explanatory drawing when similarly mounting with a low load. The schematic block diagram of the mounting apparatus which shows 2nd Embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 2 ... Drive motor (1st crimping load provision means), 4 ... Screw shaft, 11 ... Supporting body, 16 ... Movable body, 18 ... Mounting tool, 19 ... Shaft member, 22 ... Voice coil motor (2nd crimping load) Giving means), 23 ... load cell, 25 ... semiconductor chip, 27 ... substrate.

Claims (5)

A mounting device for mounting electronic components on a substrate by changing the crimping load,
First crimping load application means;
A support body driven in the vertical direction by the first pressure-bonding load applying means;
A movable body that is supported by the support body so as to be displaceable in the vertical direction and is provided with a mounting tool that holds the electronic component at the lower end;
Holding means for engaging and holding the movable body at a predetermined position on the support body so as not to be lowered;
A pressure contact portion that is provided on the movable body and presses against the support body to limit the lift of the movable body when the movable body is displaced by a predetermined amount or more in the upward direction relative to the support body;
A second pressure bonding load applying means for selectively driving the movable body in the upward direction and the downward direction;
Comprising
The movable body is urged in the upward direction by the second crimp load applying means, and the support body is lowered by the first crimp load applying means in a state where the press contact portion is in contact with the support body. The electronic component is mounted on the substrate with a first pressure bonding force,
The electronic component is provided by applying a downward biasing force to the movable body by the second pressure-bonding load applying means in a state in which the engagement holding state of the movable body with respect to the support body is released by the holding means. Is mounted on the substrate with a second crimping force smaller than the first crimping force.   2. The first pressure bonding load applying means has a drive shaft for driving the support, and the drive shaft and the mounting tool are provided in the vertical direction with their axes aligned. Electronic component mounting equipment. A shaft member constituting the pressure contact portion is provided at the upper end of the movable body so that the mounting tool and the shaft core coincide with each other,
The holding means is provided on the support body and formed with a through hole through which the shaft member is inserted, and the shaft member is provided symmetrically with respect to the axis around the shaft member and engages with the support piece to 2. The electronic component mounting apparatus according to claim 1, wherein the electronic component mounting apparatus is configured by an engagement piece that limits a descending position of the movable body.   2. The electronic component according to claim 1, wherein the holding means is a stopper member that is provided on the support body and that abuts against a lower end surface of the movable body when the movable body is lowered to a predetermined position and restricts the lowering. Mounting equipment. The pressure contact portion is a shaft member provided on the upper surface of the movable body,
The second pressurizing load applying means is provided on the support body and either one of an annular coil or a magnet through which the shaft member is inserted, and either one of an annular coil or a magnet provided on the shaft member The electronic component mounting apparatus according to claim 1, comprising:

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