JP5050548B2 - 光モジュール - Google Patents
光モジュール Download PDFInfo
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- JP5050548B2 JP5050548B2 JP2007028588A JP2007028588A JP5050548B2 JP 5050548 B2 JP5050548 B2 JP 5050548B2 JP 2007028588 A JP2007028588 A JP 2007028588A JP 2007028588 A JP2007028588 A JP 2007028588A JP 5050548 B2 JP5050548 B2 JP 5050548B2
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- Prior art keywords
- optical
- optical module
- temperature control
- resonator
- element unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4215—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical elements being wavelength selective optical elements, e.g. variable wavelength optical modules or wavelength lockers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4267—Reduction of thermal stress, e.g. by selecting thermal coefficient of materials
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4271—Cooling with thermo electric cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/08—Construction or shape of optical resonators or components thereof
- H01S3/081—Construction or shape of optical resonators or components thereof comprising three or more reflectors
- H01S3/083—Ring lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02438—Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/0607—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying physical parameters other than the potential of the electrodes, e.g. by an electric or magnetic field, mechanical deformation, pressure, light, temperature
- H01S5/0612—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying physical parameters other than the potential of the electrodes, e.g. by an electric or magnetic field, mechanical deformation, pressure, light, temperature controlled by temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/14—External cavity lasers
- H01S5/141—External cavity lasers using a wavelength selective device, e.g. a grating or etalon
- H01S5/142—External cavity lasers using a wavelength selective device, e.g. a grating or etalon which comprises an additional resonator
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Lasers (AREA)
- Optical Couplings Of Light Guides (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
- Optical Integrated Circuits (AREA)
Description
2 外部共振器
3 SOA(半導体光増幅器)素子
4 レンズ
5 アイソレータ
6 キャリア
7 光素子ユニット
8 ペルチェ素子
41 反射ミラー
42 波長選択素子
43 光路長調整器
44 レンズ
47 光素子ユニット
51 パッケージ
52 ヒートシンク
53 ネジ
Claims (7)
- 温度制御によって共振波長を可変にするとともに応力によって前記共振波長が変動してしまう波長可変型の光共振器とこの光共振器から出力された光を外に取り出すための半導体光増幅器及び光学部品とを導熱性の同一基板の上面にハイブリッド集積してなる光素子ユニットと、前記光素子ユニットの温度を制御するために前記同一基板の底面に設けられた温度制御素子とを有し、
前記同一基板は一端側の第一の領域と他端側の第二の領域とに分けられ、前記第一の領域の上面に前記光共振器が設けられ、前記第二の領域の上面に前記半導体光増幅器及び前記光学部品が設けられ、前記第二の領域の底面にのみ接するように前記温度制御素子が設けられた、
ことを特徴とする光モジュール。 - 前記請求項1に記載の光モジュールにおいて、
前記光共振器が、光導波路で構成されたリング共振器を含むことを特徴とする光モジュール。 - 前記請求項1に記載の光モジュールにおいて、
前記光共振器が、特定の波長の光線を透過する波長選択素子と、光路長を調整する光路長調整器とを有した構成であることを特徴とする光モジュール。 - 前記請求項1乃至3のいずれか一項に記載の光モジュールにおいて、
前記第一の領域の底面と前記温度制御素子との間に空間層を形成したことを特徴とする光モジュール。 - 前記請求項1乃至4のいずれか一項に記載の光モジュールにおいて、
前記温度制御素子が、前記同一基板の底面全体にかけて配置されたことを特徴とする光モジュール。 - 前記請求項1乃至5のいずれか一項に記載の光モジュールにおいて、
前記光素子ユニットを内部に実装したパッケージを更に有することを特徴とする光モジュール。 - 前記請求項1乃至5のいずれか一項に記載の光モジュールにおいて、
前記光素子ユニット及び前記温度制御素子を内部に実装したパッケージを更に有することを特徴とする光モジュール。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007028588A JP5050548B2 (ja) | 2007-02-07 | 2007-02-07 | 光モジュール |
TW097100713A TW200849750A (en) | 2007-02-07 | 2008-01-08 | Optical module |
US12/016,300 US7585117B2 (en) | 2007-02-07 | 2008-01-18 | Optical module |
CN2008100053592A CN101286619B (zh) | 2007-02-07 | 2008-02-01 | 光学模块 |
EP08002058A EP1956402A1 (en) | 2007-02-07 | 2008-02-04 | Optical module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007028588A JP5050548B2 (ja) | 2007-02-07 | 2007-02-07 | 光モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008193003A JP2008193003A (ja) | 2008-08-21 |
JP5050548B2 true JP5050548B2 (ja) | 2012-10-17 |
Family
ID=39339818
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007028588A Active JP5050548B2 (ja) | 2007-02-07 | 2007-02-07 | 光モジュール |
Country Status (5)
Country | Link |
---|---|
US (1) | US7585117B2 (ja) |
EP (1) | EP1956402A1 (ja) |
JP (1) | JP5050548B2 (ja) |
CN (1) | CN101286619B (ja) |
TW (1) | TW200849750A (ja) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7231113B2 (en) * | 2005-08-19 | 2007-06-12 | Infinera Corporation | Coupled optical waveguide resonators with heaters for thermo-optic control of wavelength and compound filter shape |
JP4877009B2 (ja) * | 2007-03-28 | 2012-02-15 | 日本電気株式会社 | Wdm光伝送用光直接増幅器 |
JP2008270583A (ja) * | 2007-04-23 | 2008-11-06 | Nec Corp | 波長可変光源装置とその制御方法,制御用プログラム |
JP5320762B2 (ja) * | 2008-02-12 | 2013-10-23 | 日本電気株式会社 | 振動抑制構造 |
JP5515447B2 (ja) * | 2009-06-19 | 2014-06-11 | 日本電気株式会社 | 導波路型波長ロッカー及び光モジュールの製造方法 |
US8337096B2 (en) * | 2009-11-30 | 2012-12-25 | Futurewei Technologies, Inc. | Efficient thermoelectric cooling of photonic integrated circuits |
JP5693888B2 (ja) * | 2010-07-28 | 2015-04-01 | 住友電工デバイス・イノベーション株式会社 | 光デバイスおよびその製造方法 |
JP6056118B2 (ja) * | 2011-03-23 | 2017-01-11 | セイコーエプソン株式会社 | 光学モジュール及び原子発振器 |
CN102402024A (zh) * | 2011-11-15 | 2012-04-04 | 浙江大学 | 一种能实现无温度效应的集成电光相位调制器 |
JP6265895B2 (ja) * | 2012-06-22 | 2018-01-24 | 古河電気工業株式会社 | 光素子モジュール |
EP3324500B1 (en) * | 2015-07-16 | 2020-04-08 | Furukawa Electric Co., Ltd. | Semiconductor laser module |
JP2017032629A (ja) | 2015-07-29 | 2017-02-09 | 住友電気工業株式会社 | 光モジュール |
CN108028508A (zh) | 2015-09-15 | 2018-05-11 | 日本电气株式会社 | 光源模块及制造光源模块的方法 |
JP6500750B2 (ja) | 2015-11-05 | 2019-04-17 | 住友電気工業株式会社 | 半導体光素子、半導体組立体 |
CN105589161A (zh) * | 2015-12-18 | 2016-05-18 | 中国科学技术大学 | 一种可调恒温滤光片切换装置 |
CN106980159B (zh) * | 2017-03-07 | 2019-01-22 | 中国科学院微电子研究所 | 基于光电混合集成的光电模块封装结构 |
TW201947894A (zh) * | 2018-04-12 | 2019-12-16 | 美商雷神公司 | 整合式光學共振檢測器 |
WO2019199650A1 (en) | 2018-04-12 | 2019-10-17 | Raytheon Company | Phase change detection in optical signals |
JP7211017B2 (ja) | 2018-11-02 | 2023-01-24 | 株式会社デンソー | 光フィルタ、それを用いたレーザ光源および光送受信装置 |
WO2020157853A1 (ja) * | 2019-01-30 | 2020-08-06 | 三菱電機株式会社 | 光送信モジュール |
JPWO2020162446A1 (ja) * | 2019-02-08 | 2021-12-09 | 古河電気工業株式会社 | 光モジュール |
IT201900002013A1 (it) | 2019-02-12 | 2020-08-12 | Laboratorio Europeo Di Spettroscopie Non Lineari Lens | Dispositivo laser a cavita' esterna, sistema e procedimento corrispondenti |
KR20210150225A (ko) * | 2020-06-03 | 2021-12-10 | 삼성전자주식회사 | 파장 가변 레이저 광원 및 이를 포함하는 광 조향 장치 |
WO2023084594A1 (ja) * | 2021-11-09 | 2023-05-19 | 日本電気株式会社 | 制御装置、光源装置、送信モジュール、光トランシーバ、および制御方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6282761U (ja) | 1985-11-13 | 1987-05-27 | ||
US5068865A (en) * | 1988-06-09 | 1991-11-26 | Nec Corporation | Semiconductor laser module |
JP2002131585A (ja) * | 2000-10-20 | 2002-05-09 | Furukawa Electric Co Ltd:The | 半導体レーザモジュールおよびその半導体レーザモジュールを用いたラマンアンプ |
GB2376532A (en) | 2001-06-15 | 2002-12-18 | Kymata Ltd | Thermally controlled optical resonator |
JP3804629B2 (ja) * | 2002-04-25 | 2006-08-02 | ヤマハ株式会社 | 熱電装置用パッケージ |
JP2004288669A (ja) * | 2003-03-19 | 2004-10-14 | Mitsubishi Electric Corp | 光半導体素子モジュール |
JP2006278769A (ja) * | 2005-03-29 | 2006-10-12 | Nec Corp | 波長可変レーザ |
JP4700563B2 (ja) | 2005-06-15 | 2011-06-15 | 株式会社日立国際電気 | データ伝送方法およびデータ伝送システム |
CN1322641C (zh) * | 2005-06-22 | 2007-06-20 | 中国科学院上海光学精密机械研究所 | 分布反馈单纵模光纤激光器 |
WO2007007848A1 (ja) * | 2005-07-13 | 2007-01-18 | Nec Corporation | 外部共振器型波長可変レーザ及びその実装方法 |
JP4505403B2 (ja) * | 2005-11-15 | 2010-07-21 | 富士通株式会社 | 光送信装置 |
-
2007
- 2007-02-07 JP JP2007028588A patent/JP5050548B2/ja active Active
-
2008
- 2008-01-08 TW TW097100713A patent/TW200849750A/zh unknown
- 2008-01-18 US US12/016,300 patent/US7585117B2/en active Active
- 2008-02-01 CN CN2008100053592A patent/CN101286619B/zh active Active
- 2008-02-04 EP EP08002058A patent/EP1956402A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
CN101286619A (zh) | 2008-10-15 |
EP1956402A1 (en) | 2008-08-13 |
JP2008193003A (ja) | 2008-08-21 |
CN101286619B (zh) | 2012-07-18 |
US20080187268A1 (en) | 2008-08-07 |
TW200849750A (en) | 2008-12-16 |
US7585117B2 (en) | 2009-09-08 |
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