JP5046675B2 - Electric wire composite printed wiring board, electric wire composite printed wiring board manufacturing method, electric wire component, electric wire component manufacturing method, and electronic device - Google Patents

Description

  The present invention relates to an electric wire composite printed wiring board provided with electric wire components connected to a wiring pattern of the wiring board via a conduction hole conductor, an electric wire composite printed wiring board manufacturing method for manufacturing such an electric wire composite printed wiring board, and the like. The present invention relates to an electric wire component applied to an electric wire composite printed wiring board, an electric wire component manufacturing method for producing such an electric wire component, and an electronic device on which such an electric wire composite printed wiring board is mounted.

  In electronic devices that support high-frequency wireless signals such as mobile phones, wire components that can be electromagnetically shielded and compatible with high frequency by wiring three-dimensionally between printed circuit boards in order to reduce size and weight and achieve high-density mounting. The application of has increased.

  Conventionally, an electric wire component having a connector such as an electric wire with a connector, a coaxial electric wire with a connector, or a flexible substrate with a connector has been applied to the connection between the printed board and the printed board. In addition, as a device to which a connector is not applied, a flexible rigid multilayer printed wiring board in which a flexible substrate and a rigid substrate are combined is used.

  22A and 22B are explanatory diagrams of a flexible rigid multilayer printed wiring board according to Conventional Example 1, wherein FIG. 22A is a plan view, and FIG. 22B is an end view showing an end face of a cross section taken along arrows BB in FIG. It is. It should be noted that hatching in the cross section is omitted in view of easy viewing of the drawing.

  The flexible rigid multilayer printed wiring board 101 according to Conventional Example 1 manufactured as a four-layer structure is manufactured generally by the following process.

  First, a double-sided flexible substrate (first insulating base 110 and first conductor layer 115) as an inner layer substrate is prepared, and an inner layer pattern (first conductor layer pattern 115p) is formed. That is, the first conductor layer pattern 115p is formed on the first insulating base 110. The first conductor layer pattern 115p is configured as a flexible lead pattern 115pf in the flexible region Af.

  Next, a film coverlay is pressure-bonded to the surface of the first conductor layer pattern 115p. That is, the protective insulating film (film cover lay) 130 (the protective film 131 and the protective adhesive 132) is formed.

  Further, a copper foil with resin from which a portion corresponding to the flexible region Af is removed as an outer layer substrate is prepared, and the inner layer substrate and the outer layer substrate are laminated and laminated (adhered). That is, the second insulating base 140 and the second conductor layer 141 are stacked and formed.

  In some cases, a single-sided rigid board from which a portion corresponding to the flexible region Af is removed as an outer layer board instead of the resin-coated copper foil may be prepared. At this time, an adhesive member corresponding to the single-sided rigid substrate is prepared, and the single-sided rigid substrate, the adhesive member, the double-sided flexible substrate, the adhesive member, and the single-sided rigid substrate are superposed in order and stacked and stacked.

  After the second insulating substrate 140 and the second conductor layer 141 are formed, a conduction hole 143 that conducts the second conductor layer 141 and the first conductor layer pattern 115p is opened. Thereafter, the whole is plated with copper to form a conductive hole conductor 144, and the second conductor layer 141 and the first conductor layer pattern 115p are connected.

  Next, the conduction hole conductor 144 and the second conductor layer 141 are patterned to form an outer layer pattern. That is, the second conductor layer pattern 145 is formed. Further, a solder resist 150 is formed and an appropriate surface treatment is performed.

  Thereafter, the outer shape of the flexible region Af and the outer shape of the rigid region Ar are formed.

  Inspection of the flexible rigid multilayer printed wiring board 101 whose outer shape is completed is performed.

  As described above, the flexible rigid multilayer printed wiring board 101 according to Conventional Example 1 uses a flexible substrate as the entire inner substrate.

  Many components are mounted in the rigid region Ar of the flexible rigid multilayer printed wiring board 101. That is, there are many circuit wirings (second conductor layer pattern 145), conduction holes 143, etc., high smoothing accuracy (for example, surface unevenness), high connection performance (for example, roughness of the inner wall of the conduction hole. The smaller the value, the smaller the metal fatigue of the through hole conductor due to temperature shock and the higher the reliability. Further, high electrical performance (for example, conduction resistance, insulation resistance), high heat resistance (for example, solder melting heat resistance), and the like are also required.

  That is, in the rigid region Ar, the conductor is preferably a material having a certain thickness, and the insulator is preferably a material having a certain hardness and a certain insulating property, and is preferably a homogeneous material. Therefore, in general, an epoxy resin containing glass fiber is often used.

  Further, the flexible region Af of the flexible rigid multilayer printed wiring board 101 has many circuit wirings (flexible lead patterns 115pf) functioning as lead wires, and high bending performance (for example, assembly bending, open / close bending) is required.

  That is, in the flexible region Af, it is preferable that the conductor is a material that can be processed to a certain thickness and has a certain flexibility, and the insulator is a material that has a certain flexibility. Therefore, in general, a polyimide resin film excellent in flexibility and insulation is often used.

  However, since the flexible rigid multilayer printed wiring board 101 according to Conventional Example 1 uses a flexible substrate as an inner layer substrate, the insulator is a rigid insulating base (second insulating base 140) in the rigid region Ar. Since it is formed as a composite material of a flexible insulating base material (first insulating base material 110), there is a problem that lamination processing is difficult.

  Further, since the rigid region Ar is formed of a composite material, there is a problem that it is difficult to open the conduction hole 143 and plating for forming the conduction hole conductor is difficult. Since a rigid insulating base (for example, a polyimide resin film) is included in the rigid region Ar, there is a problem that the hygroscopic property is high and the heat resistance performance is inferior.

  Further, it is difficult to adjust the thickness of the conductor (second conductor layer 141) in the rigid region Ar and the conductor (first conductor layer 115) in the flexible region Af, and the material of the conductor in the rigid region Ar and the conductor in the flexible region Af is difficult. There is a problem that it is difficult to optimize.

  In other words, the laminated structure characteristics required for each of the flexible region Af and the rigid region Ar (rigidity in the rigid region, flexibility in the flexible region, processability and reliability of the laminated structure, conductor layer properties, rigid region and There is a problem that it is difficult to satisfy the bonding strength between the flexible regions.

  In addition, the technique which applies a different insulating base material to a rigid area | region and a flexible area | region is proposed (for example, refer patent document 1).

  However, in the technique described in Patent Document 1, since the inner layer pattern (first layer conductor pattern) is formed separately in the rigid region and the flexible region, it is difficult to align the inner layer pattern with high accuracy and miniaturization. There is a problem that it is difficult to increase the density. In addition, since a flexible substrate is used, impedance matching is difficult, and if a shield layer is provided, there is a problem that the substrate becomes hard and bending becomes difficult, and bending performance is lowered.

  Next, the application status of conventional electric wire components will be described with reference to FIGS.

  23A and 23B are explanatory views for explaining a printed circuit board according to Conventional Example 2. FIG. 23A is a plan view, FIG. 23B is a side view taken along arrow B in FIG. It is a side view in the state where electric wire parts were bent according to arrow mark Rot.

  The printed circuit boards 210 are connected to each other by an electric wire component 220 to form a printed circuit board unit (assembled printed circuit board unit).

  24A and 24B are explanatory diagrams for explaining a printed circuit board according to Conventional Example 3. FIG. 24A is a plan view, FIG. 24B is a side view taken along arrow B in FIG. It is a side view in the state where electric wire parts were bent according to arrow mark Rot.

  A printed circuit board unit (assembled printed circuit board unit) is formed by connecting the printed circuit boards 310 to each other with an electric wire component 320. The electric wire component 320 is formed of a flexible substrate with a connector including a connector 325.

  25A and 25B are explanatory diagrams for explaining a printed circuit board according to Conventional Example 4. FIG. 25A is a plan view, FIG. 25B is a side view taken along arrow B in FIG. It is a side view in the state where electric wire parts were bent according to arrow mark Rot.

  A printed circuit board unit (assembled printed circuit board unit) is formed by connecting the printed circuit boards 410 to each other with a wire component 420. The printed circuit board 410 is formed of a rigid printed circuit board (rigid portion). ). That is, the printed circuit board unit is composed of a flexible rigid multilayer printed wiring board.

  When connecting with a connector-attached cable, a connector-equipped coaxial cable (conventional example 2), or a connector-equipped flexible board (conventional example 3), the electrical connection is made by contact of the connector, so the electrical connection becomes unstable. Therefore, there was a problem in reliability. Further, since the connectors are mechanically fitted and connected, there is a problem that the connection strength becomes unstable. Furthermore, since the connector is mounted on the printed circuit board, an occupied area is required on the printed circuit board, so that the surface area of the printed circuit board cannot be fully utilized.

  When connecting with a flexible board with a connector or a flex part of a rigid rigid multilayer printed wiring board (conventional example 4), variations in pattern width and pattern spacing occur due to the etching process that forms the flexible board. There was a problem that became unstable. Further, since the entire periphery of the signal pattern cannot be surrounded by the shielding pattern structurally, unnecessary radiation cannot be blocked, and there is a problem in electromagnetic shielding performance. Moreover, since the inner layer structure of the rigid part and the structure of the flex part are formed of an integral conductor or insulator, there is a problem that the electrical performance and mechanical performance at the flex part cannot be given the highest priority. Further, since the connection is made by a planar flexible member, there is a problem that the arrangement by the parallel movement or the arrangement by the torsion movement cannot be performed.

In addition, although the technique which incorporated the coaxial cable as an electric wire component in a wiring board is proposed (for example, refer patent document 2, patent document 3), it does not connect between wiring boards with an electric wire, but mentioned above. It does not solve the problem.
JP 2006-140213 A Japanese Patent Laid-Open No. 2003-27396 Japanese Patent Laid-Open No. 2004-63725

  The present invention has been made in view of such a situation. The electric wire component and the first wiring board are juxtaposed, and the second of the second wiring substrate stacked on the electric wire connector and the first wiring substrate. By connecting the conductor layer pattern to the conductive hole conductor formed in the conductive hole for the conductive wire penetrating the second wiring board, the conductive wire (electric wire component) and the second conductive layer pattern can be connected easily and firmly. An object of the present invention is to provide an electric wire composite printed wiring board that can be reduced in size, reduced in thickness, and freely arranged in three dimensions, can perform signal transmission reliably, and has high connection reliability between the electric wire component and the second conductor layer pattern. And

  According to the present invention, the electric wire component and the first wiring substrate are juxtaposed, and the conductor for the electric wire component and the second conductor layer pattern of the second wiring substrate stacked on the first wiring substrate are connected to the second wiring substrate. A method for manufacturing an electric wire composite printed wiring board to be connected through a conductive hole conductor formed in a conductive hole for a conductive wire passing therethrough, wherein an opening for fitting an electric wire component for fitting an electric wire component is opened in the first wiring substrate. And a step of forming a wire lamination preventing opening for preventing lamination on an electric wire on a second wiring board obtained by laminating a second insulating base material and a second conductor layer for forming a second conductor layer pattern. And a step of fitting the electric wire component into the electric wire component fitting opening and superimposing the second wiring substrate on the electric wire component and the first wiring substrate; and a step of laminating the second wiring substrate on the first wiring substrate and the electric wire component; , For conducting wires that penetrate through the second wiring board to the conducting wire connector By including a step of forming a through hole, a step of forming a conductive hole conductor in the conductive hole for the conductive wire, and a step of patterning the conductive hole conductor and the second conductive layer to form a second conductive layer pattern. The component (conductive wire) and the second conductor layer pattern can be easily and highly accurately connected, and can be miniaturized, thinned, and freely arranged in three dimensions to ensure signal transmission. Another object of the present invention is to provide a method for manufacturing an electric wire composite printed wiring board capable of manufacturing an electric wire composite printed wiring board with high connection reliability with high productivity.

  The present invention also provides a first wiring board, a second wiring board having a second insulating base material and a second conductor layer pattern and laminated on the first wiring board, and a second conductor juxtaposed on the first wiring board. An electric wire component applied to an electric wire composite printed wiring board including an electric wire component connected to a layer pattern, the electric wire having a conductive wire and a covering portion for insulating the conductive wire, and a conductive wire connector connected to the conductive wire. It is another object of the present invention to provide an electric wire component that can easily and accurately connect a conductive wire to the second wiring board (second conductor layer pattern) of the electric wire composite printed wiring board.

  The present invention also provides a first wiring board, a second wiring board having a second insulating base material and a second conductor layer pattern and laminated on the first wiring board, and a second conductor juxtaposed on the first wiring board. A method of manufacturing an electric wire component applied to an electric wire composite printed wiring board comprising an electric wire component connected to a layer pattern, comprising: preparing a conductor connector for connection to a conductor; and connecting the conductor connector to the conductor By connecting a connector connecting step and a resin sealing portion forming step of forming a resin sealing portion by resin-sealing the conductor and the conductor connector, for a conductor connected to the electric wire composite printed wiring board It is another object of the present invention to provide a method of manufacturing an electric wire component that can easily manufacture an electric wire component capable of positioning a connector with high accuracy and with high productivity.

  Further, the present invention is an electronic device equipped with an electric wire composite printed wiring board to which electric wire components are connected, and the electric wire composite printed wiring board is used as the electric wire composite printed wiring board according to the present invention, thereby forming a housing shape. Another object is to provide an electronic device that can be reduced in size and thickness to have a desired shape and has high connection reliability.

An electric wire composite printed wiring board according to the present invention is fitted into a first wiring board having a first insulating base material and a first conductor layer pattern, and an electric wire component fitting opening formed in the first wiring board. A juxtaposed electric wire component; and a second wiring substrate having a second insulating base material and a second conductor layer pattern and laminated on the first wiring substrate , wherein the second wiring substrate is fitted with the electric wire component fitting. It is laminated on the electric wire component juxtaposed to the first wiring board at the joint opening, and the second conductor layer pattern is an electric wire composite printed wiring board connected to the electric wire component, and the electric wire component is a conductive wire And an electric wire having a covering portion that insulates and covers the conductive wire, and a conductive wire connector connected to the conductive wire, and the conductive wire connector is formed in a conductive wire conduction hole that penetrates the second wiring board. The second conductor is formed through the formed conduction hole conductor. Characterized in that is connected to the layer pattern.

  With this configuration, the conductive wire (electric wire component) and the second conductor layer pattern can be easily and firmly connected to each other, so that the size and thickness can be reduced and free three-dimensional arrangement is possible, signal transmission can be reliably performed, It can be set as the electric wire composite printed wiring board with the high reliability of a connection with 2 conductor layer pattern.

  Moreover, in the electric wire composite printed wiring board according to the present invention, the conductor connector is fastened to the conductor.

  With this configuration, the conductor connector can be reliably and easily connected to the conductor.

  Moreover, in the electric wire composite printed wiring board according to the present invention, the conductor connector has a notch for tightening.

  With this configuration, it is possible to perform easy and reliable tightening simply by pressing.

  Further, in the electric wire composite printed wiring board according to the present invention, the conductor connector is in contact with the conductor.

  With this configuration, the conductor connector can be connected to the conductor with a simple structure, and the conductor connector can be thinned.

  Moreover, in the electric wire composite printed wiring board according to the present invention, the conductor connector has a flat surface connected to the conduction hole conductor.

  With this configuration, it is possible to connect the conduction hole conductor to the conductor connector with high conductivity and high accuracy.

  Moreover, in the electric wire composite printed wiring board according to the present invention, the conductor connector is a rectangular parallelepiped.

  With this configuration, it is possible to fix the position of the conductive wire with high stability and high accuracy, so that accurate and reliable positioning is possible, and the second conductor layer pattern (second conductor layer) to be connected Since a large connection area with respect to can be ensured with high accuracy, a highly reliable connection can be achieved.

  Moreover, in the electric wire composite printed wiring board according to the present invention, the electric wire component includes a covering portion connector coupled to the covering portion.

  With this configuration, it is possible to improve the stability of the conductor connector, and to function as a connection relay unit when the second conductor layer pattern is formed on both sides of the first wiring board and interconnected. .

  In the electric wire composite printed wiring board according to the present invention, the covering portion connector is fastened to the covering portion.

  With this configuration, the covering portion connector can be reliably and easily coupled to the covering portion.

  Moreover, the electric wire composite printed wiring board according to the present invention is characterized in that the covering portion connector is integrated with the conducting wire connector.

  With this configuration, it is possible to substantially increase the shape of the conductor connector to improve stability, and to increase the margin of alignment accuracy for connection with the second conductor layer pattern.

  Moreover, in the electric wire composite printed wiring board according to the present invention, an interval between the covering portion connector and the second conductor layer pattern is an interval between the conductive wire connector and the second conductor layer pattern. It is characterized by being the same.

  With this configuration, the position of the electric wire component can be stabilized and the flatness with respect to the second conductor layer pattern can be ensured, so that the connection between the conductor connector and the second conductor layer pattern can be performed with high accuracy.

  Moreover, in the electric wire composite printed wiring board according to the present invention, the electric wire includes a shielding wire disposed on an outer periphery of the covering portion and an exterior covering portion that covers the shielding wire, and the electric wire component includes the shielding member. A shielding wire joint connected to the wire, the shielding wire joint being connected to the second conductor layer via the conduction hole conductor formed in the shielding wire conduction hole penetrating the second wiring board. It is connected to a pattern.

  With this configuration, since the shielding wire and the second conductor layer pattern can be easily and reliably connected, the reliability of the connection between the electric wire component (shielding wire) and the second conductor layer pattern is improved, and the shielding characteristics are improved. It can be set as the electric wire composite printed wiring board provided with the electric wire component which has the outstanding high frequency characteristic.

  Moreover, in the electric wire composite printed wiring board according to the present invention, the shielding wire connector is fastened to the shielding wire.

  With this configuration, the shield wire connector can be reliably and easily connected to the conducting wire.

  Moreover, in the electric wire composite printed wiring board according to the present invention, the shielding wire connector has a tightening cut.

  With this configuration, it is possible to perform easy and reliable tightening simply by pressing.

  Moreover, in the electric wire composite printed wiring board according to the present invention, the shield wire connector has a flat surface connected to the conduction hole conductor.

  With this configuration, the conduction hole conductor can be connected to the shielding wire connector with high conductivity and high accuracy.

  Moreover, the electric wire composite printed wiring board according to the present invention is characterized in that the shielding wire connector is a rectangular parallelepiped.

  With this configuration, the position of the shielding wire can be fixed stably and with high accuracy, so that reliable positioning is possible, and a large connection area for the second conductor layer pattern (second conductor layer) to be connected is highly accurate. Since it can be ensured, a highly reliable connection can be achieved.

  In the electric wire composite printed wiring board according to the present invention, the interval between the shielding wire connector and the second conductor layer pattern is the interval between the conductor wire connector and the second conductor layer pattern. It is characterized by being the same.

  With this configuration, the position of the electric wire component can be stabilized and the flatness with respect to the second conductor layer pattern can be secured, so that the conductor conductor connector and the shield wire connector and the second conductor layer pattern are connected with high accuracy. It becomes possible.

  Moreover, in the electric wire composite printed wiring board according to the present invention, the first conductor layer pattern is formed on both surfaces of the first insulating base material, and the second wiring substrate is formed on both surfaces of the first wiring substrate. The distance between the conductor connector and one of the second conductor layer patterns is the same as the distance between the conductor connector and the other second conductor layer pattern. .

  With this configuration, the conduction hole conductor can be easily formed with high accuracy, and reliable conduction can be established between the conductor connector and the second wiring pattern laminated on both surfaces.

  In the electric wire composite printed wiring board according to the present invention, an interval between the shielding wire connector and one of the second conductor layer patterns is between the shielding wire connector and the other second conductor layer pattern. It is characterized by being the same as the interval.

  With this configuration, the conduction hole conductor can be easily formed with high accuracy, and reliable conduction can be established between the shielding wire conduction hole and the second conductor layer pattern laminated on both surfaces.

  Moreover, in the electric wire composite printed wiring board according to the present invention, the covering portion connector includes the second conductor layer via the conduction hole conductor formed in the covering portion conduction hole penetrating the second wiring substrate. One of the second conductor layer patterns and the other second conductor layer pattern are connected to each other through the covering portion connector.

  With this configuration, it is possible to easily connect one second conductor layer pattern and the other second conductor layer pattern stacked on both sides of the first wiring board via the covering portion connector, and the connection relay. By making it function as a part, it becomes possible to improve a freedom degree of wiring.

  Moreover, in the electric wire composite printed wiring board according to the present invention, the electric wire component includes a resin sealing portion in which the conductive wire and the conductive wire connector are sealed with resin.

  This configuration protects the conductors and conductors that are connected to each other, and can fix the position of the conductor joints with high accuracy, so that the connection between the conductor connectors and the second conductor layer pattern is highly accurate. Therefore, it is possible to obtain a highly reliable electric wire composite printed wiring board.

  Moreover, in the electric wire composite printed wiring board according to the present invention, the resin sealing portion is characterized in that the covering portion and the covering portion connector are resin-sealed.

  With this configuration, the covering portion and the covering portion connector that are coupled to each other can be protected, and the position of the covering portion connector can be fixed with high accuracy. It becomes possible to make a highly reliable electric wire composite printed wiring board by performing connection with high accuracy.

  Moreover, the electric wire composite printed wiring board according to the present invention is characterized in that the resin sealing portion is resin-sealing the shielding wire and the shielding wire connector.

  With this configuration, it is possible to protect the shielded wire and the shielded wire connector that are coupled to each other and to fix the position of the shielded wire connector with high accuracy. It becomes possible to make a highly reliable electric wire composite printed wiring board by performing connection with high accuracy.

Further, the wire composite printed wiring board manufacturing method according to the present invention includes a first wiring substrate, and the second wiring substrate stacked on the first wiring board having a second insulating substrate and the second conductor layer pattern, An electric wire for manufacturing an electric wire composite printed wiring board, comprising: an electric wire having an electric wire and a covering portion for insulating the electric wire; and an electric wire component connected to the first electric wiring board. A method for manufacturing a composite printed wiring board, comprising: a first electric wire component preparing step for preparing the electric wire component by connecting the conductive wire connector to a conductive wire; and an electric wire component fitting opening for fitting the electric wire component. The wire part fitting opening forming step for opening the wiring board, the second conductor layer for forming the second conductor layer pattern, and the second insulating substrate are laminated on the second wiring board to the electric wire. Electricity to prevent the lamination of Step of forming an opening for preventing electric wire lamination for forming an opening for preventing lamination, fitting the electric wire component to the opening for fitting the electric wire component, and attaching the second wiring board to the electric wire component and the first wiring board An electric wire component assembling step for stacking, a second wiring substrate laminating step for laminating the second wiring substrate on the electric wire component and the first wiring substrate, and penetrating the second wiring substrate to reach the conductor connector. Conducting hole forming step of forming a conducting hole for conducting wire, conducting hole conductor forming step of forming a conducting hole conductor in the conducting hole for conducting wire, and patterning the conducting hole conductor and the second conductor layer to form the second conductor A second conductor layer pattern forming step of forming a layer pattern; and an outer shape forming step of forming an outer shape of the first wiring board and the second wiring board by removing unnecessary regions .

  With this configuration, since the conductor connector connected to the conductor can be easily and highly accurately connected to the second conductor layer pattern, the electric wire component (conductor) and the second conductor layer pattern can be easily and accurately connected, It is possible to manufacture a wire composite printed wiring board with high productivity that can be miniaturized, thinned and freely arranged in three dimensions, can perform signal transmission reliably, and has high reliability in connection between the wire component and the second conductor layer pattern. It becomes possible.

  Further, in the electric wire composite printed wiring board manufacturing method according to the present invention, the electric wire has a shielding wire disposed on an outer periphery of the covering portion and an exterior covering portion that covers the shielding wire, and the electric wire component includes: A shielding wire connector connected to the shielding wire; and connecting the shielding wire connector to the shielding wire in the wire component preparation step; and connecting the second wiring board in the conduction hole forming step. A through hole for shielding wire penetrating to the shielding wire connector is formed, and in the conducting hole conductor forming step, the conducting hole conductor is formed in the shielding wire conducting hole, and in the second conductor layer pattern forming step, The second conductor layer pattern connected to the shielding wire connector is formed.

  With this configuration, since the shielding wire and the second conductor layer pattern can be connected easily and with high accuracy, the reliability of the connection between the electric wire component (shielding wire) and the second conductor layer pattern is improved, and the shielding characteristics are improved. Thus, it is possible to manufacture an electric wire composite printed wiring board having electric wire parts having excellent high frequency characteristics with high productivity.

  Moreover, in the electric wire composite printed wiring board manufacturing method according to the present invention, in the electric wire component preparation step, a covering portion connector is coupled to the covering portion, and in the conductive hole forming step, the second wiring substrate is penetrated. Forming a conductive hole for the covering portion that reaches the connector for the covering portion, forming the conductive hole conductor in the conductive hole for the covering portion in the conductive hole conductor forming step, and in a second conductor layer pattern forming step, A second conductor layer pattern connected to the covering portion connector is formed.

  With this configuration, it is possible to easily connect one second conductor layer pattern and the other second conductor layer pattern stacked on both sides of the first wiring board via the covering portion connector, and the connection relay. By functioning as a unit, it is possible to manufacture a wire composite printed wiring board with improved wiring flexibility with high productivity.

Moreover, in the electric wire composite printed wiring board manufacturing method which concerns on this invention, the said electric wire component preparation process exposes the said conducting wire, prepares the said electric wire, and joining which connects the said connector for conducting wires to the said conducting wire And a resin sealing portion forming step for forming a resin sealing portion for resin sealing the conductor and the conductor connector , the shielding wire is exposed in the wire preparation step, and the bonding is performed. The shielding wire connector is connected to the shielding wire in a child connecting step, and the shielding wire and the shielding wire connector are resin-sealed in the resin sealing portion forming step .

With this configuration, it is possible to easily prepare an electric wire component including a resin sealing portion that protects the conductor connector connected to the second conductor layer pattern, and the electric wire composite printed wiring board manufacturing method has high productivity. be able to. Moreover, it is possible to easily prepare an electric wire component including a resin sealing portion that protects the shielding wire connector connected to the second conductor layer pattern, and to provide a highly productive electric wire composite printed wiring board manufacturing method. Can do.

Moreover, in the electric wire composite printed wiring board manufacturing method which concerns on this invention, the said electric wire component preparation process exposes the said conducting wire, prepares the said electric wire, and joining which connects the said connector for conducting wires to the said conducting wire And a resin sealing portion forming step for forming a resin sealing portion for resin-sealing the conductor and the conductor connector. In the wire preparation step, the covering portion is exposed, and the bonding is performed. In the child connecting step, a covering portion connector is joined to the covering portion, and in the resin sealing portion forming step, the covering portion and the covering portion connector are resin sealed .

With this configuration, it is possible to easily prepare an electric wire component including a resin sealing portion that protects the conductor connector connected to the second conductor layer pattern, and the electric wire composite printed wiring board manufacturing method has high productivity. be able to. In addition, it is possible to easily prepare an electric wire component including a resin sealing portion that protects the covering portion connector connected to the second conductor layer pattern, and the electric wire composite printed wiring board manufacturing method has high productivity. Can do.

  Moreover, in the electric wire composite printed wiring board manufacturing method according to the present invention, in the electric wire preparation step, the covering portion is exposed, and in the connector connecting step, a covering portion connector is bonded to the covering portion, and the resin In the sealing portion forming step, the covering portion and the covering portion connector are resin-sealed.

  With this configuration, it is possible to easily prepare an electric wire component including a resin sealing portion that protects the covering portion connector connected to the second conductor layer pattern, and a highly productive electric wire composite printed wiring board manufacturing method and can do.

Further, the electric wire component according to the present invention, a first wiring board, the first wiring board and the wire part fitting having a second insulating substrate and the second conductive layer pattern having an opening for wire parts fitting is applied to the wire composite printed wiring board and a second wiring board which is laminated to the opening, the wire part is fitted into the fitting opening is juxtaposed with the first wiring board, through the second wiring board a wire part through the through hole conductor formed on the lead wire through hole Ru is connected to the second conductive layer pattern, the wire having a coating unit for coating insulates conductors and conductor lines, said conductor And a conductor connector connected to the wire.

  With this configuration, the conductor and the second conductor layer pattern can be easily and accurately connected via the conductor connector, so that the conductor can be easily connected to the second wiring board (second conductor layer pattern) of the electric wire composite printed wiring board. And it becomes possible to set it as the electric wire component which can be connected with high precision.

  Further, in the electric wire component according to the present invention, the electric wire has a shielding wire disposed on an outer periphery of the covering portion and an exterior covering portion that covers the shielding wire, and the electric wire component is connected to the shielding wire. A shielding wire joint, and the shielding wire joint is connected to the second conductor layer pattern via the conduction hole conductor formed in the shielding wire conduction hole penetrating the second wiring board. It is characterized by being configured to be connected to.

  With this configuration, the shielding wire and the second conductor layer pattern can be easily and highly accurately connected via the shielding wire connector, so that the second wiring substrate (second conductor layer pattern) of the electric wire composite printed wiring board is shielded. It is possible to provide an electric wire component that can connect wires easily and with high accuracy.

  Further, in the electric wire component according to the present invention, the electric wire component includes a covering portion connector coupled to the covering portion, and the covering portion connector is connected to the covering portion through the second wiring board. It is characterized by being configured to be connected to the second conductor layer pattern through the conduction hole conductor formed in the hole.

  With this configuration, it is possible to easily connect one second conductor layer pattern and the other second conductor layer pattern stacked on both sides of the first wiring board via the covering portion connector, and the connection relay. By making it function as a part, it can be set as the electric wire component which can improve the wiring freedom degree of an electric wire composite printed wiring board.

  Moreover, the electric wire component according to the present invention includes a resin sealing portion in which the conductive wire and the conductive wire connector are sealed with a resin.

  With this configuration, the connected conductor and the conductor connector can be protected, and the conductor connector can be reliably and easily connected to the second conductor layer pattern, so the connection strength of the conductor is strong and highly reliable. Thus, it is possible to provide an electric wire component that transmits a signal.

Further, in the wire component according to the present invention, the resin sealing portion, characterized in that the zygote for the shielding wire and the shielding wire are sealed with resin.

  With this configuration, the shielded wire and the shielded wire connector that are connected to each other can be protected, and the shielded wire connector can be reliably and easily connected to the second conductor layer pattern. It is possible to obtain a wire component having a strong and highly reliable noise shielding function.

Further, in the wire component according to the present invention, the resin sealing portion, characterized in that the zygote for the covering part and the cover part are sealed with resin.

  With this configuration, the covering portion and the covering portion joint which are coupled to each other can be protected, and the covering portion joint can be reliably and easily connected to the second conductor layer pattern. It is possible to provide an electric wire component having high connection strength and high wiring flexibility between layers.

Moreover, the electric wire component manufacturing method which concerns on this invention has the 1st wiring board which has an opening part for electric wire components fitting , a 2nd insulating base material, and a 2nd conductor layer pattern, and the said 1st wiring substrate and the said electric wire component is applied to the wire composite printed wiring board and a second wiring board which is laminated into the fitting opening, the wire part is fitted into the fitting opening is juxtaposed with the first wiring board, the second wiring board a wire part manufacturing method for manufacturing a wire part through the through hole conductor formed on the lead wire through hole Ru is connected to the second conductive layer pattern through a covering and insulating conductors and conductor lines An electric wire preparation step for preparing an electric wire having a covering portion and exposing the conductive wire, a connector connecting step for connecting a conductive wire connector to the conductive wire, and a resin sealing for resin sealing the conductive wire and the conductive wire connector Resin forming part Characterized in that it comprises a stop portion forming step.

  With this configuration, it is possible to easily manufacture an electric wire component capable of positioning with high accuracy a conductor connector connected to the electric wire composite printed wiring board with high productivity.

  Moreover, in the electric wire component manufacturing method according to the present invention, the electric wire includes a shielding wire disposed on an outer periphery of the covering portion and an exterior covering portion that covers the shielding wire, and the electric wire component includes the shielding wire. A shield wire joint connected to the second conductor layer pattern via the conduction hole conductor formed in the shield wire conduction hole penetrating the second wiring board. In the wire preparation step, the shielding wire is exposed, and in the connector connection step, a shielding wire connector is connected to the shielding wire, and in the resin sealing portion forming step, The shielding wire and the shielding wire connector are resin-sealed.

  With this configuration, the shielding wire connector connected to the electric wire composite printed wiring board can be positioned with high accuracy, and an electric wire component having an effective shielding function can be easily manufactured with high productivity.

  In the electric wire component manufacturing method according to the present invention, in the electric wire preparation step, the covering portion is exposed, and in the connector connecting step, a covering portion connector is coupled to the covering portion, and the resin sealing portion In the forming step, the covering portion and the covering portion connector are resin-sealed.

  With this configuration, it is possible to position the connector for the covering portion connected to the electric wire composite printed wiring board with high accuracy, and to easily manufacture the electric wire part having the connector for the covering portion that improves the degree of freedom of wiring with high productivity. It becomes possible.

  Further, in the electric wire component manufacturing method according to the present invention, in the resin sealing portion forming step, the resin sealing portion is formed by holding a leading end of the conducting wire outside the resin sealing portion, and the resin sealing The conductive wire protruding from the portion is removed.

  With this configuration, since the resin sealing portion is formed in a state where the conducting wire is accurately positioned, it is possible to form the resin sealing portion in which the conducting wire connector and the shielding wire connector are positioned with higher accuracy. Become.

  Moreover, the electronic device according to the present invention is an electronic device equipped with an electric wire composite printed wiring board to which electric wire components are connected, and the electric wire composite printed wiring board is the electric wire composite printed wiring board according to the present invention. It is characterized by.

  With this configuration, the housing shape can be reduced in size and thickness to a desired shape, and an electronic device with high connection reliability can be obtained.

  According to the electric wire composite printed wiring board according to the present invention, the electric wire component and the first wiring substrate are juxtaposed, and the second conductor layer pattern of the second wiring substrate stacked on the electric wire connector and the first wiring substrate. Are connected via a conductive hole conductor formed in a conductive hole for a conductive wire penetrating through the second wiring board, so that the conductive wire (wire component) and the second conductive layer pattern can be easily and firmly connected to each other. The effect of being able to provide an electric wire composite printed wiring board that can be reduced in thickness, reduced in thickness and freely arranged in three dimensions, can reliably perform signal transmission, and has high reliability in connection between the electric wire component and the second conductor layer pattern. Play.

  In addition, according to the method for manufacturing an electric wire composite printed wiring board according to the present invention, the electric wire component and the first wiring substrate are juxtaposed, and the second wiring substrate laminated on the electric wire connector and the first wiring substrate is arranged. A method of manufacturing an electric wire composite printed wiring board for connecting a two-conductor layer pattern through a conductive hole conductor formed in a conductive hole for a conductive wire penetrating the second wiring board, the electric wire component fitting the electric wire component Prevention of lamination to electric wires on the second wiring board in which the step of opening the fitting opening in the first wiring board and the second insulating base material and the second conductor layer for forming the second conductor layer pattern are laminated. Forming a wire lamination preventing opening, fitting a wire component into the wire component fitting opening, and stacking the second wiring substrate on the wire component and the first wiring substrate, and the first wiring substrate and the wire. Laminating a second wiring board on the component; A step of forming a conductive hole for the conductive wire extending through the wiring board to the conductive wire connector, a step of forming a conductive hole conductor in the conductive hole for the conductive wire, and patterning the conductive hole conductor and the second conductive layer A step of forming a conductor layer pattern, so that the electric wire component (conductor) and the second conductor layer pattern can be easily and highly accurately connected, and can be reduced in size, reduced in thickness, and freely arranged in three dimensions. It is possible to provide an electric wire composite printed wiring board manufacturing method capable of manufacturing an electric wire composite printed wiring board having high reliability in connection between the electric wire component and the second conductor layer pattern with high productivity. There is an effect.

  According to the electric wire component of the present invention, the first wiring board, the second wiring board having the second insulating base material and the second conductor layer pattern and laminated on the first wiring board, and the first wiring board Are connected to the second conductor layer pattern, and are applied to an electric wire composite printed wiring board, wherein the electric wire and the electric wire having a covering portion for insulating the conductive wire are connected to the electric wire. Since the conductor connector is provided, there is an effect that it is possible to provide an electric wire component that can easily and accurately connect the conductor to the second wiring board (second conductor layer pattern) of the electric wire composite printed wiring board.

  According to the electric wire component manufacturing method of the present invention, the first wiring board, the second wiring board having the second insulating base material and the second conductor layer pattern and laminated on the first wiring board, A method of manufacturing an electric wire component applied to an electric wire composite printed wiring board comprising an electric wire component juxtaposed on a wiring board and connected to a second conductor layer pattern, comprising: preparing a conductor connector connected to an electric conductor Since it has a connector connecting step for connecting a conductor for a conductor to a conductor and a resin sealing portion forming step for forming a resin sealing portion by resin sealing the conductor and the conductor connector, an electric wire composite print There is an effect that it is possible to provide a method of manufacturing an electric wire component that can easily manufacture an electric wire component capable of positioning the conductor connector connected to the wiring board with high accuracy with high productivity.

  In addition, since the electronic device according to the present invention is an electronic device equipped with the electric wire composite printed wiring board according to the present invention, the housing shape can be reduced to a desired shape by reducing the size and thickness. There is an effect that an electronic device with high reliability can be provided.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<Embodiment 1>
Based on FIG. 1 thru | or FIG. 5B, the electric wire component which concerns on Embodiment 1 of this invention and the electric wire component manufacturing method which manufactures an electric wire component are demonstrated. The electric wire component according to the present embodiment has the first wiring substrate 10 having the first insulating base material 11 and the first conductor layer pattern 12p, and the second insulating base material 21 and the second conductor layer pattern 22p. An electric wire composite printed wiring board 1 comprising: a second wiring board 20 stacked on the first wiring board 10; and an electric wire component 30 juxtaposed on the first wiring board 10 and connected to the second conductor layer pattern 22p. 3, see FIGS. 16 to 18).

  FIG. 1 is a flowchart showing a schematic process flow of a wire component manufacturing method for manufacturing a wire component according to Embodiment 1 of the present invention.

  2A to 2C are explanatory views schematically showing the structure of the electric wire included in the electric wire component according to Embodiment 1 of the present invention, in which (A) is a front view and (B) is a side view showing the tip side. FIG.

  3A to 3E, 4A, and 4B are explanatory views schematically showing the configuration of the electric wire component according to Embodiment 1 of the present invention, in which (A) is a plan view and (B) is a front view, respectively. (C) is a side view showing the tip side.

  5A and 5B are explanatory views schematically showing the configuration of a modification (resin sealing portion) of the electric wire component according to Embodiment 1 of the present invention, in which (A) is a plan view and (B), respectively. Is a front view, (C) is a side view showing the tip side.

Step S1:
The electric wire 31 (refer FIG. 2A thru | or FIG. 2C) which has the coating | coated part 31h which insulates the conducting wire 31c and the conducting wire 31c is prepared. The electric wire 31 is preferably a coaxial cable (coaxial electric wire) further having a shielding wire 31s disposed on the outer periphery of the covering portion 31h and an outer covering portion 31f covering the shielding wire 31s.

  The outer covering portion 31f, the shielding wire 31s, and the covering portion 31h are sequentially removed at the tip of the electric wire 31, and the end portion of the conducting wire 31c is exposed to prepare the electric wire 31 (electric wire preparation step). In addition, in addition to the wire preparation step, the exterior covering portion 31f is further removed to expose the end portion of the shielding wire 31s. Further, the shielding wire 31s is partially removed to expose the end portion of the covering portion 31h.

  The electric wire 31 shown in FIG. 2A is a coaxial electric wire in which the conducting wire 31c constituting the signal wire is a single wire and the shielding wire 31s that shields the conducting wire 31c is a stranded wire. The electric wire 31 shown in FIG. 2B is a coaxial electric wire in which the conducting wires 31c constituting the signal wires are double wires (three) and the shielding wires 31s that shield the conducting wires 31c are stranded wires.

  The electric wire 31 shown in FIG. 2C is a coaxial electric wire in which the conducting wires 31c constituting the signal wires are double wires (three) and the shielding wires 31s that shield the conducting wires 31c are stranded wires. The shielding lines 31s are separated from each other by a shielding separation portion 31sh made of an insulating resin.

  Since the conducting wire 31c is a signal wire, it is preferable that the conducting resistance is low, that it is flexible, and that it is difficult to deteriorate. For example, a copper or copper alloy that is tin-plated can be used. Note that either a single wire or a stranded wire may be used.

  It is desirable that the covering portion 31h has heat resistance, low hygroscopicity, flexibility, and excellent electrical characteristics (insulating properties). For example, a fluorine resin or the like can be applied.

  It is desirable that the shielding wire 31s has a low conduction resistance, is flexible, and does not easily deteriorate. For example, a copper or copper alloy that is tin-plated can be used. Moreover, as a strand wire which comprises the shielding wire 31s, it is possible to include the braided wire etc. which further improved the softness | flexibility and intensity | strength other than a normal strand wire.

  As the conducting wire 31c and the shielding wire 31s, it is also possible to apply not only a metal wire itself but also a linear body (or a strip-like body) in which a linear conductor is formed by vapor deposition or plating.

Step S2:
A conductor connector 32 to be connected to the conductor 31c is prepared and connected to the conductor 31c (electric wire 31) (connector connection step; see FIGS. 3A to 4B) to constitute the wire component 30. The conductor connector 32 is connected to the second conductor layer 22 (second conductor layer pattern 22p; see FIG. 16) via a conductor hole conductor 41 formed in a conductor hole 40c that penetrates the second wiring board 20. It is configured to be connected. Note that the conductor connector 32 can be integrally formed, for example, with a mold.

  That is, the electric wire component 30 is provided with the electric wire 31 having the conductor 31c and the covering portion 31h that insulates the electric conductor 31c, and the conductor connector 32 connected to the conductor 31c. Further, as described above, the conductor connector 32 is configured to be connected to the second conductor layer pattern 22p via the conduction hole conductor 41 formed in the conduction hole 40c that penetrates the second wiring board 20. .

  With this configuration, since the conductor 31c and the second conductor layer pattern 22p can be easily and highly accurately connected via the conductor connector 32, the second wiring board 20 (second conductor layer pattern) of the wire composite printed wiring board 1 can be used. 22p), the electric wire component 30 can be easily and highly accurately connected to the electric wire 31c.

  In addition, a shield wire connector 33 to be connected to the shield wire 31s is also prepared in the connector connection step, and connected to the shield wire 31s (electric wire 31) (see FIGS. 3A to 4B). 30 is configured. The shield wire connector 33 is connected to the second conductor layer 22 (second conductor layer pattern 22p; see FIG. 16) via the conduction hole conductor 41 formed in the shielding wire conduction hole 40s penetrating the second wiring board 20. ). Note that the entire shield wire connector 33 can be integrally formed of, for example, a mold.

  That is, the electric wire component 30 includes the electric wire 31 having the shielding wire 31s disposed on the outer periphery of the covering portion 31h and the exterior covering portion 31f covering the shielding wire 31s, and the shielding wire connector 33 connected to the shielding wire 31s. With. Further, as described above, the shield wire connector 33 is connected to the second conductor layer pattern 22p via the conduction hole conductor 41 formed in the shielding wire conduction hole 40s that penetrates the second wiring board 20. It is as.

  With this configuration, the shielding wire 31s and the second conductor layer pattern 22p can be easily and highly accurately connected via the shielding wire connector 33, so that the second wiring board 20 (second conductor) of the electric wire composite printed wiring board 1 can be used. It is possible to obtain the electric wire component 30 that can easily and highly accurately connect the shielding wire 31s to the layer pattern 22p).

  The connection between the conducting wire 31c and the conducting wire connector 32, and the connection between the shielding wire 31s and the shielding wire connector 33 are conducted in, for example, through holes provided in the conducting wire connector 32 and the shielding wire connector 33, respectively. It is possible to perform crimping (bonding) by caulking the shielding wire 31s and the shielding wire joint 33 and the shielding wire joint 33 from the periphery through the shielding wire 31s.

  Note that the connection method is not limited to crimping by caulking, and for example, it is possible to connect by interposing a conductive adhesive. It is also possible to use a combination of pressure bonding and a conductive adhesive, appropriate welding and the like.

  The conductor wire connector 32 and the shield wire connector 33 are materials having good connectivity to the conduction hole conductor 41 so that they can be easily connected when connected to the conduction hole conductor 41 (second conductor layer pattern 22p). It is desirable that Moreover, it is desirable not to deteriorate, for example, copper alloys, such as copper and phosphor bronze, silver, gold, etc. can be applied. Further, the surface may be plated. Any material can be used as long as it can secure connection with the conducting wire 31c and the shielding wire 31s, and the material is not limited to copper.

  In the electric wire component 30 shown in FIG. 3A, for example, a plurality (three) of the conducting wires 31c are in a row state. The conductor connector 32 has a flat and thick cylindrical shape (pseudo rectangular parallelepiped), and a surface connected to the conduction hole conductor 41 (second conductor layer pattern 22p) is a flat surface. With this configuration, the conduction hole conductor 41 can be connected to the conductor connector 32 with high conductivity and high accuracy.

  A through-hole for connecting to the conductor 31c is formed in the center of the flat-walled cylindrical conductor (pseudo rectangular parallelepiped) connector 32 corresponding to the conductor 31c in a row, and the thick cylinder is formed from the through-hole. An incision 32d is formed toward the outer peripheral surface. The notch 32d of the conductor connector 32 is crimped (pressed) from an appropriate direction to be clamped to the conductor 31c. That is, the conducting wire 31c and the conducting wire connector 32 can be easily and reliably tightened by simply crimping the fastening cut 32d. The conducting wire connector 32 is connected to the conducting wire 31c by tightening. is there.

  The cut 32d is formed in a state in which the thickness direction between the inner peripheral surface inscribed in the conductive wire 31c and the outer peripheral surface of the conductive wire connector 32 is cut in a direction in which the conductive wire 31c can be tightened. The configuration and operation of the cut 32d are the same in the following, and description thereof will be omitted as appropriate. In addition, it is also possible to adopt a form of simply fitting without depending on the notch.

  The shield wire connector 33 has a thick cylindrical shape, and is clamped to the shield wire 31s by caulking (pressing) a notch 33d of the shield wire connector 33 from an appropriate direction. That is, for example, the shield wire connector 33 having the inner peripheral surface of the through-hole and the thick cylindrical outer peripheral surface (outer shape) through which the shield wire 31s formed as a stranded wire penetrates the tightening cut 33d. Thus, the shielding wire 31s can be easily and reliably tightened, and the shielding wire connector 33 is connected to the shielding wire 31s by tightening.

  The cut 33d is formed in the same manner as the cut 32d, and the thickness direction (radial direction) between the inner peripheral surface inscribed in the shield wire 31s and the outer peripheral surface of the shield wire connector 33 in a direction in which the shield wire 31s can be tightened. Is formed in a state of cutting. Note that the configuration and operation of the cut 33d are the same in the following, and description thereof will be omitted as appropriate.

  As described above, the conductor connector 32 is connected to the second conductor layer pattern 22p through the conductor hole conductor 41 formed in the conductor conductor hole 40c that penetrates the second wiring board 20, and is connected to the shield conductor. 33 is configured to be connected to the second conductor layer pattern 22p through a conduction hole conductor 41 formed in the shielding line conduction hole 40s penetrating the second wiring board 20 (see FIG. 16).

  That is, the conducting wire connector 32 and the shielding wire connector 33 are configured to be connected to the second conductor layer pattern 22p through the conduction hole conductor 41. Therefore, the apex (top surface) of the conductor wire connector 32 and the apex of the shield wire connector 33 may be arranged at different positions in the direction of the arrow B facing the second wiring board 20.

  In addition, since the outer shape of the conductor connector 32 is a rectangular parallelepiped (pseudo rectangular parallelepiped), the conductor B is symmetrically arranged with respect to the conductor 31c (the center of the electric wire 31) in the direction of the arrow B and the direction opposite to the arrow B. It becomes. Therefore, when the 2nd conductor layer pattern 22p is formed in the both sides of the 1st wiring board 10, it can connect symmetrically with respect to the 2nd conductor layer pattern 22p of both sides.

  Further, since the outer shape of the shield wire connector 33 is cylindrical, the shield wire connector 33 is arranged symmetrically with respect to the conducting wire 31c (the center of the electric wire 31) in the direction of the arrow B and the direction opposite to the arrow B. . Therefore, when the 2nd conductor layer pattern 22p is formed in the both sides of the 1st wiring board 10, it can connect symmetrically with respect to the 2nd conductor layer pattern 22p of both sides.

  In the electric wire component 30 shown in FIGS. 3B to 3E, the conducting wire 31c is formed of a single wire, but may be a stranded wire. Since the other points are basically the same as those in FIG. 3A, different points will be mainly described below.

  In the electric wire component 30 shown in FIG. 3B, the conductor connector 32 is a disk, and the surface connected to the conduction hole conductor 41 (second conductor layer pattern 22p) is a plane. With this configuration, the conduction hole conductor 41 can be connected to the conductor connector 32 with high conductivity and high accuracy. The shield wire connector 33 is the same as the shield wire connector 33 shown in FIG. 3A.

  A through hole for connecting to the conductor 31c is formed in the center of the conductor connector 32 as a disk, and a cut 32d is formed from the through hole toward the outer periphery of the disk. The lead wire 31c is fastened to the lead wire 31c by caulking (pressing) a notch 32d of the lead wire connector 32. That is, the conducting wire 31c and the conducting wire connector 32 can be easily and reliably tightened by simply crimping the fastening cut 32d. The conducting wire connector 32 is connected to the conducting wire 31c by tightening. is there.

  In addition, in the direction of the arrow B facing the second wiring board 20, the vertex of the shielding wire connector 33 and the vertex (top surface) of the conductor wire connector 32 are arranged at the same position. That is, the interval between the shield wire connector 33 and the second conductor layer pattern 22p can be made equal to the interval between the conductor wire connector 32 and the second conductor layer pattern 22p.

  With this configuration, the position of the electric wire component 30 can be stabilized and the flatness with respect to the second conductor layer pattern 22p can be secured. Therefore, the conductor connector 32 (and the shield wire connector 33) and the second conductor layer pattern 22p Can be connected with high accuracy.

  In addition, in order to make the vertex position of the shield wire connector 33 equal to the vertex (top surface) position of the conductor wire connector 32, the leading end of the conducting wire 31c is bent in the direction of the second conductor layer pattern 22p to lead the leading end to the leading end. The connector 32 is connected.

  In the electric wire component 30 shown in FIG. 3C, the conductor connector 32 is a rectangular parallelepiped. One surface is brought into contact with the conductor 31c, and the surface opposite to the contacted surface is a conduction hole conductor 41 (second conductor layer). The surface is connected to the pattern 22p). With this configuration, the conductor connector 32 can be connected to the conductor 31c with a simple structure, and the conductor connector 32 can be thinned and simplified.

  In addition, it is desirable to connect the conductive wire connector 32 and the conductive wire 31c together with, for example, soldering or using a conductive adhesive in order to ensure connection strength. The shield wire connector 33 is the same as the shield wire connector 33 shown in FIG. 3A.

  In addition, in the direction of the arrow B facing the second wiring board 20, the vertex of the shielding wire connector 33 and the vertex (top surface) of the conductor wire connector 32 are arranged at the same position. That is, as in FIG. 3B, the interval between the shielding wire connector 33 and the second conductor layer pattern 22p is the same as the interval between the conductor connector 32 and the second conductor layer pattern 22p. It becomes possible.

  With this configuration, the position of the electric wire component 30 can be stabilized and the flatness with respect to the second conductor layer pattern 22p can be secured. Therefore, the conductor connector 32 (and the shield wire connector 33) and the second conductor layer pattern 22p Can be connected with high accuracy.

  In addition, the thickness of the rectangular parallelepiped in the direction of the arrow B is adjusted in order to make the vertex position of the shield wire connector 33 equal to the vertex (top surface) position of the conductor wire connector 32, and the shield wire connector It is possible to easily make the apex of the connector 33 and the apex (top surface) of the conductor connector 32 equal.

  In the electric wire component 30 shown in FIG. 3D, the conductor connector 32 has a wall thickness (outer diameter) similar to that of the shield wire connector 33 (the shield wire connector 33 shown in FIGS. 3A to 3D). As in the case of the shield wire connector 33, the wire 32 is clamped (pressed) in the appropriate direction by caulking (pressing) a notch 32 d included in the conductor wire connector 32.

  That is, the conductor connector 32 having the inner peripheral surface of the through-hole through which the conductive wire 31c penetrates and the thick cylindrical outer peripheral surface (outer shape) can be easily and reliably connected by simply caulking the notch 32d for fastening. The conducting wire connector 32 is connected to the conducting wire 31c by fastening.

  As described above, the conductor connector 32 is connected to the second conductor layer pattern 22p through the conductor hole conductor 41 formed in the conductor conductor hole 40c that penetrates the second wiring board 20, and is connected to the shield conductor. 33 is configured to be connected to the second conductor layer pattern 22p through a conduction hole conductor 41 formed in the shielding line conduction hole 40s penetrating the second wiring board 20 (see FIG. 16).

  In addition, in the direction of the arrow B facing the second wiring board 20, the vertex of the shield wire connector 33 and the vertex of the conductor wire connector 32 are arranged at the same position. That is, the interval between the shield wire connector 33 and the second conductor layer pattern 22p can be made equal to the interval between the conductor wire connector 32 and the second conductor layer pattern 22p.

  With this configuration, the position of the electric wire component 30 can be stabilized and the flatness with respect to the second conductor layer pattern 22p can be ensured, so that the conductor wire connector 32 and the shield wire connector 33 are connected to the second conductor layer pattern 22p. Can be performed with high accuracy.

  In order to make the apex position of the shielding wire connector 33 equal to the apex (top surface) position of the conducting wire connector 32, the conducting wire connector 32 has a larger thickness than the shielding wire connector 33. is there.

  Since the conductor connector 32 has a cylindrical shape, it is arranged symmetrically with respect to the conductor 31c (the center of the electric wire 31) in the direction of the arrow B and in the direction opposite to the arrow B. Therefore, when the 2nd conductor layer pattern 22p is formed in the both sides of the 1st wiring board 10, it can connect symmetrically with respect to the 2nd conductor layer pattern 22p of both sides. In addition, as above-mentioned, the connector 33 for shielding wires is also the same.

  In the electric wire component 30 shown in FIG. 3E, the conductor wire connector 32 has a rectangular parallelepiped shape, and is clamped (pressed) on the conductor wire 31c by caulking (pressing) a notch 32d included in the conductor wire connector 32. is there.

  The shield wire connector 33 has a rectangular parallelepiped shape and is fastened to the shield wire 31s by caulking (pressing) a notch 33d of the shield wire connector 33 from an appropriate direction.

  That is, the conductor connector 32 having the inner peripheral surface of the through-hole through which the conductive wire 31c penetrates and the outer peripheral surface (outer shape) of a rectangular parallelepiped can easily and reliably tighten the electric wire 31c only by caulking the fastening cut 32d. The conductor connector 32 is connected to the conductor 31c by tightening.

  In addition, the shield wire connector 33 having the inner peripheral surface of the through hole that penetrates the shield wire 31s and the outer peripheral surface (outer shape) of a rectangular parallelepiped easily and surely secures the shield wire 31s only by caulking the notch 33d for fastening. The shield wire connector 33 is connected to the shield wire 31s by fastening.

  The cut 32d is formed in a state in which the thickness direction between the inner peripheral surface inscribed in the conductive wire 31c and the outer peripheral surface of the conductive wire connector 32 is cut in a direction in which the conductive wire 31c can be tightened. The notch 32d has an appropriate direction such as an arrangement passing through a corner of a rectangular parallelepiped, for example, in addition to a direction intersecting the arrow B direction facing the second wiring board 20 (a direction intersecting the stacking direction). It is possible.

  In addition, the notch 33d is formed so as to cut the thickness direction between the inner peripheral surface inscribed in the shielding wire 31s and the outer peripheral surface of the shielding wire connector 33 in a direction in which the shielding wire 31s can be tightened. The cut 33d can be set in an appropriate direction such as an arrangement passing through a corner of a rectangular parallelepiped, for example, in addition to the direction intersecting the arrow B direction (direction intersecting the stacking direction).

  The conductor wire connector 32 fits the conductor wire 31c into a through-hole penetrating the center of the opposing surface of the rectangular parallelepiped, and the shield wire connector 33 is similarly shielded into the through-hole penetrating the center of the opposing surface of the rectangular parallelepiped surface. 31s is fitted. In addition, each surface connected to the conduction hole conductor 41 is arranged to be a plane (one surface of a rectangular parallelepiped) that is parallel to the second conductor layer 22 (second conductor layer pattern 22p). Therefore, it is possible to connect the conduction hole conductor 41 with high conductivity and high accuracy.

  In other words, since the positions of the conducting wire 31c and the shielding wire 31s can be fixed with high stability and high accuracy, high-accuracy and reliable positioning can be achieved, and the second conductor layer pattern 22p (the first conductive layer pattern 22p) Since a large connection area for the two conductor layers 22) can be ensured with high accuracy, a highly reliable connection can be achieved.

  Moreover, since the conductor wire connector 32 and the shield wire connector 33 can be arranged with good flatness with respect to the second conductor layer pattern 22p, the productivity and reliability for the connection between the wire component 30 and the second conductor layer pattern 22p. It becomes possible to improve the property.

  In the direction of arrow B, the top surface (one surface of the rectangular parallelepiped) of the shielding wire connector 33 and the top surface of the conductor wire connector 32 (one surface of the rectangular parallelepiped) are arranged at the same position. That is, the interval between the shield wire connector 33 and the second conductor layer pattern 22p can be made equal to the interval between the conductor wire connector 32 and the second conductor layer pattern 22p.

  In order to make the position of the top surface (one surface of the rectangular parallelepiped) of the shield wire connector 33 equal to the position of the top surface (one surface of the rectangular parallelepiped) of the conductor wire connector 32, the conductor wire connector 32 is connected to the shield wire. Compared with the child 33, the thickness between the inner peripheral surface (through hole) and the outer peripheral surface (outer shape) is increased.

  Since both the conductor connector 32 and the shield connector 33 are rectangular parallelepipeds, they are arranged symmetrically with respect to the conductor 31c (center of the electric wire 31) in the direction of the arrow B and in the direction opposite to the arrow B. It becomes a form. Therefore, when the 2nd conductor layer pattern 22p is formed in the both sides of the 1st wiring board 10, it can connect symmetrically with respect to the 2nd conductor layer pattern 22p of both sides, respectively.

  The rectangular parallelepiped includes a cube and can be appropriately chamfered. Since it is a rectangular parallelepiped, the conducting wire connector 32 and the shielding wire connector 33 can be stably disposed. That is, the conducting wire connector 32 and the shielding wire connector 33 do not rotate (twist) from side to side with respect to the original direction.

  Next, the covering portion connector 34 coupled to the covering portion 31h will be described with reference to FIGS. 4A and 4B.

  In the electric wire component 30 shown in FIGS. 4A and 4B, the covering portion connector 34 is coupled to the covering portion 31h. The conductor connector 32 and the shield connector 33 are the same as in FIG. 3E. Other basic configurations are the same as those shown in FIGS. 3A to 3E, and therefore, different points will be mainly described.

  That is, the electric wire component 30 is configured by preparing the covering portion connector 34 to be connected to the covering portion 31h and connecting (fixing) the covering portion 31h (the electric wire 31) to the covering portion 31h. The covering portion connector 34 is configured to be connected to the second conductor layer pattern 22p through a conduction hole conductor 41 formed in the covering portion conduction hole 40h that penetrates the second wiring board 20 (see FIG. 21). ). The covering portion connector 34 can be integrally formed as a whole with, for example, a mold in the same manner as the conducting wire connector 32 and the shielding wire connector 33.

  The covering portion connector 34 has a rectangular parallelepiped shape as in the case of the conducting wire connector 32 and the shielding wire connector 33, and the covering portion connector 34 has a cut 34d included in the covering portion connector 34. 34d is clamped (pressed) from an appropriate direction to be fastened to the covering portion 31h.

  That is, the covering portion connector 34 having the inner peripheral surface of the through hole that penetrates the covering portion 31h and the outer peripheral surface (outer shape) of the rectangular parallelepiped can easily and reliably cover the covering portion 31h only by caulking the cut 34d for fastening. The covering portion connector 34 is connected to the covering portion 31h by tightening. Since the covering portion 31h is an insulator, it may be configured to be mechanically tightened instead of being connected. Therefore, the coupling method is not limited to crimping by caulking, and for example, it is possible to connect by interposing an appropriate adhesive. It is also possible to use pressure bonding and an adhesive in combination.

  Further, the covering portion connector 34 is formed of, for example, copper or a copper alloy, and can be reliably connected to the covering portion 31h. Further, any material that can be coupled to the covering portion 31h may be used, and the material is not limited to copper.

  The cut 34d cuts the thickness direction between the inner peripheral surface inscribed in the covering portion 31h and the outer peripheral surface of the covering portion connector 34 in the direction in which the covering portion 31h can be tightened, similarly to the notches 32d and 33d. Is formed. In addition to the direction (direction intersecting the stacking direction) intersecting the arrow B direction facing the second wiring board 20, the notch 34d has an appropriate direction such as an arrangement passing through a corner of a rectangular parallelepiped. It is possible.

  Since the surface connector connected to the conduction hole conductor 41 is a flat surface (one surface of a rectangular parallelepiped), the covering portion connector 34 is connected to the conduction hole conductor 41 in the same manner as the conductive wire joint 32 and the shielding wire joint 33. It is possible to connect with high conductivity and high accuracy.

  That is, since the position of the covering portion 31h can be fixed with high stability and high accuracy, highly accurate and reliable positioning is possible, and the second conductor layer pattern 22p (second conductor layer) to be connected is also possible. Since a large connection area with respect to 22) can be secured with high accuracy, a highly reliable coupling can be achieved.

  Since the covering portion connector 34 can be arranged with good flatness with respect to the second conductor layer pattern 22p, the stability of the conductor wire connector 32 is improved, and the connection between the wire component 30 and the second conductor layer pattern 22p is improved. Productivity and reliability can be improved. In addition, the covering portion connector 34 and the second conductor layer pattern 22p can be connected easily and with high accuracy.

  Since the covering portion connector 34 is a rectangular parallelepiped, the covering portion connector 34 is arranged symmetrically with respect to the conducting wire 31c (the center of the electric wire 31) in the direction of the arrow B and the direction opposite to the arrow B. In other words, when the second conductor layer pattern 22p is formed on both sides of the first wiring board 10, it can be symmetrically connected to the second conductor layer pattern 22p on both sides. Therefore, when the second conductor layer pattern 22p is formed on both sides of the first wiring board 10 and interconnected, the second conductor layer pattern 22p can function as a connection relay portion, and the wiring flexibility of the electric wire composite printed wiring board 1 can be improved. The electric wire component 30 can be obtained.

  In the arrow B direction, the top surface (one surface of the rectangular parallelepiped) of the covering portion connector 34 and the top surface (one surface of the rectangular parallelepiped) of the conductor wire connector 32 are arranged at the same position. That is, the interval between the covering portion connector 34 and the second conductor layer pattern 22p can be made the same as the interval between the conductor connector 32 and the second conductor layer pattern 22p.

  With this configuration, the position of the electric wire component 30 can be stabilized and the flatness with respect to the second conductor layer pattern 22p can be ensured, so that the conductor connector 32, the covering portion connector 34 and the second conductor layer pattern 22p are connected. Can be performed with high accuracy.

  In addition, in order to make the top surface position of the covering portion connector 34 and the top surface position of the conducting wire connector 32 equal, the conducting wire connector 32 is made thicker than the covering portion connector 34. .

  The covering portion connector 34 can also be integrated with the conductive wire connector 32 (FIG. 4B). By integrating the conductor connector 32 and the covering connector 34, the shape of the conductor connector 32 (connection area with the conduction hole conductor 41) is substantially increased, and stability is improved. It is possible to increase the margin of alignment accuracy for connection with the second conductor layer pattern 22p. Moreover, it becomes possible to improve the joint strength with respect to the conducting wire 31c and the coating | coated part 31h.

  The shape of the covering portion connector 34 is not limited to the form shown in FIGS. 4A and 4B, and various shapes are possible as in the case of the conductor wire connector 32 and the shield wire connector 33 shown in FIGS. 3A to 3D. It can be in the form.

Step S3:
The conducting wire 31c (the tip thereof) and the conducting wire connector 32 are resin-sealed to form a resin sealing portion 35 (resin sealing portion forming step; see FIGS. 5A and 5B). With this configuration, it is possible to easily manufacture the electric wire component 30 that can accurately position the conductor connector 32 connected to the electric wire composite printed wiring board 1 with high productivity. 5A and 5B, the electric wire component 30 shown in FIG. 4A is resin-sealed with the resin sealing portion 35, so that the description thereof is omitted as appropriate.

  That is, the electric wire component 30 includes a resin sealing portion 35 in which the conductive wire 31c and the conductive wire connector 32 are resin-sealed. With this configuration, the conductor 31c and the conductor connector 32 that are connected to each other can be protected, and the conductor connector 32 can be fixed and positioned with high accuracy. Therefore, the conductor connector 32 can be moved to the second conductor layer pattern 22p. Since the connection can be made reliably and easily, it is possible to provide the electric wire component 30 that has a strong connection strength of the conducting wire 31c and performs signal transmission with high reliability.

  The resin sealing portion 35 is preferably a rectangular parallelepiped in consideration of ease of manufacture, shape stability, and arrangement stability. By using a rectangular parallelepiped, the tip of the electric wire component 30 can be stabilized, and the parallelism with respect to the second wiring board 20 can be improved and the lamination can be performed stably.

  With this configuration, it is possible to connect the conductive wire connector 32 and the second conductor layer pattern 22p with high accuracy to configure the highly reliable electric wire composite printed wiring board 1.

  In addition, in the resin sealing portion forming step, the resin sealing portion 35 resin seals the covering portion 31 h and the covering portion connector 34. With this configuration, the covering part connector 34 connected to the wire composite printed wiring board 1 can be positioned with high accuracy, and the wire part 30 having the covering part connector 34 that improves the degree of freedom of wiring can be easily produced with high productivity. It can be manufactured.

  That is, the resin sealing part 35 is resin-sealing the covering part 31 h and the covering part connector 34. With this configuration, the covering portion 31h and the covering portion connector 34 that are coupled to each other can be protected, and the covering portion connector 34 can be fixed and positioned with high accuracy. Since it can be reliably and easily connected to the layer pattern 22p, the electric wire component 30 having a high connection strength of the covering portion connector 34 and a high degree of freedom in wiring between the layers can be obtained. Further, it is possible to configure the highly reliable electric wire composite printed wiring board 1 by connecting the covering portion connector 34 and the second conductor layer pattern 22p with high accuracy.

  In addition, in the resin sealing portion forming step, the resin sealing portion 35 resin seals the shielding wire 31 s and the shielding wire connector 33. With this configuration, it is possible to easily produce the electric wire component 30 having the shield wire connector 33 that can fix the shield wire connector 33 connected to the electric wire composite printed wiring board 1 with high accuracy and improve the shielding function. It becomes possible to manufacture with good performance.

  That is, the resin sealing part 35 is resin-sealing the shielding wire 31 s and the shielding wire connector 33. With this configuration, the shielding wire 31s and the shielding wire connector 33 that are connected to each other can be protected, and the shielding wire connector 33 can be fixed and positioned with high accuracy. Since it can be reliably and easily connected to the conductor layer pattern 22p, it is possible to provide the electric wire component 30 having a strong connection strength of the shielding wire connector 33 and having an effective shielding function. In addition, it is possible to connect the shield wire connector 33 and the second conductor layer pattern 22p with high accuracy to configure the highly reliable electric wire composite printed wiring board 1.

  Note that, as described above, the shape of the resin sealing portion 35 is defined so that the conducting wire connector 32 and the shielding wire connector 33 are connected to the second conductor layer pattern 22p through the conduction hole conductor 41. That is, the surface of the resin sealing portion 35 is configured to abut (adhere) the second insulating substrate 21 (see FIG. 13).

  In the resin sealing portion forming step, it is desirable to form the resin sealing portion 35 by holding the leading end of the conducting wire 31c outside the resin sealing portion 35 (FIG. 5A). FIG. 5A shows a state in which the resin sealing portion 35 is formed by holding the leading end of the conducting wire 31c outside the resin sealing portion 35 in the resin sealing portion forming step. Moreover, holding | maintenance of the front-end | tip of the conducting wire 31c can be performed by the metal mold | die (not shown) which forms the resin sealing part 35, for example.

  With this configuration, since the resin sealing portion 35 is formed in a state where the conducting wire 31c is accurately positioned, the resin sealing portion 35 in which the conducting wire connector 32 and the shielding wire connector 33 are positioned with higher accuracy is formed. It becomes possible to do.

  The sealing resin applied to the resin sealing portion 35 has physical properties (for example, hardness, heat dissipation characteristics, electrical characteristics) so as to have integrity by lamination (adhesion) with the first wiring board 10 and the second wiring board 20. ) Are the same. Moreover, it is desirable that the electric wire 31 (the conducting wire 31c and the shielding wire 31s) does not deteriorate. Therefore, for example, it is desirable to apply an epoxy resin similar to the first wiring board 10 and the second wiring board 20.

Step S4:
After forming the resin sealing portion 35 by holding the tip of the conductive wire 31c outside the resin sealing portion 35 in the resin sealing portion forming step, the conductive wire 31c protruding from the resin sealing portion 35 is removed (unnecessary conductive wire removal) Step, see FIG. With this configuration, since the resin sealing portion 35 is formed in a state where the conducting wire 31c is accurately positioned, the resin sealing portion 35 in which the conducting wire connector 32 and the shielding wire connector 33 are positioned with higher accuracy is formed. It becomes possible to do.

  In FIG. 5B, the state which removed the conducting wire 31c which protruded from the resin sealing part 35 is shown. The conductor 31c can be removed by applying, for example, a press die or a cutter.

  As described above, the electric wire component 30 according to the present embodiment includes the resin sealing portion 35 for resin-sealing the conducting wire 31c and the conducting wire connector 32, and thus the conducting wire 31c and the conducting wire connector that are connected to each other. 32 is protected, and the conductor connector 32 can be reliably and easily connected to the second conductor layer pattern 22p. Therefore, the electrical wire component 30 has a strong connection strength of the conductor 31c and performs signal transmission with high reliability. It becomes possible.

  Further, in the electric wire component 30 according to the present embodiment, the resin sealing portion 35 shields the shielding wire 31s and the shielding wire connector 33 from the resin, so that the shielding wire 31s and the shielding wire 31s connected to each other are shielded. Since the wire connector 33 is protected and the shield wire connector 33 can be easily and reliably connected to the second conductor layer pattern 22p, the connection strength of the shield wire 31s is strong and a highly reliable noise shielding function is provided. It becomes possible to set it as the electric wire component 30 which has.

  In the electric wire component 30 according to the present embodiment, since the resin sealing portion 35 is resin-sealed with the covering portion 31h and the covering portion connector 34, the covering portion 31h and the covering portion that are coupled to each other are covered. Since the coupling connector 34 is protected and the coupling connector 34 can be easily and reliably connected to the second conductor layer pattern 22p, the coupling strength of the coating coupling 34 is high and the wiring between the layers is high. It becomes possible to set it as the electric wire component 30 which has a freedom degree.

  As described above, the wire component manufacturing method for manufacturing the wire component 30 according to the present embodiment prepares the wire 31c and the wire 31 having the covering portion 31h that covers and insulates the wire 31c, and prepares the wire 31c to expose the wire 31c. A process, a connector connecting process of connecting the conductor 32 to the conductor 31c, and a resin sealing part forming process of forming the resin sealing part 35 for resin sealing the conductor 31c and the conductor 32. .

  Therefore, it is possible to easily manufacture the electric wire component 30 capable of positioning the conductor connector 32 connected to the electric wire composite printed wiring board 1 with high accuracy with high productivity.

  Further, in the electric wire component manufacturing method for manufacturing the electric wire component 30 according to the present embodiment, the electric wire 31 has the shielding wire 31s disposed on the outer periphery of the covering portion 31h and the exterior covering portion 31f covering the shielding wire 31s. The electric wire component 30 includes a shield wire connector 33 connected to the shield wire 31 s, and the shield wire connector 33 is electrically connected to the shield wire conduction hole 40 s that penetrates the second wiring board 20. It is configured to be connected to the second conductor layer pattern 22p through the hole conductor 41, and the shielding wire 31s is exposed in the wire preparation step, and the shielding wire connector 33 is connected to the shielding wire 31s in the connector connection step. In the resin sealing portion forming step, the shielding wire 31s and the shielding wire connector 33 are resin-sealed.

  Therefore, the shield wire connector 33 connected to the wire composite printed wiring board 1 can be positioned with high accuracy, and the wire component 30 having an effective shielding function can be easily manufactured with high productivity.

  Moreover, in the electric wire component manufacturing method which manufactures the electric wire component 30 which concerns on this Embodiment, the coating | coated part 31h is exposed at an electric wire preparation process, and the coating | coated part connector 34 is couple | bonded with the coating | coated part 31h at a connector connection process. In the resin sealing portion forming step, the covering portion 31h and the covering portion connector 34 are resin-sealed.

  Therefore, it is possible to easily manufacture the wire component 30 having the covering portion connector 34 that can accurately position the covering portion connector 34 connected to the electric wire composite printed wiring board and improve the degree of freedom of wiring. Is possible.

<Embodiment 2>
Based on FIG. 6 and FIG. 7, the electric wire component (and its manufacturing method) which concerns on Embodiment 2 of this invention is demonstrated. In addition, the basic composition of the electric wire component in the electric wire component (and the manufacturing method thereof) according to the present embodiment is the same as that of the electric wire component 30 according to the first embodiment, and a plurality of electric wires 31 are connected to one resin sealing portion. Since the point corresponding to 35 is different, the reference numerals of the constituent parts are used as they are, and different points will be mainly described.

  FIG. 6 is an explanatory view schematically showing a configuration of the resin sealing portion of the electric wire component according to Embodiment 2 of the present invention, where (A) is a plan view and (B) is an arrow mark of (A). Sectional drawing in BB, (C) is sectional drawing in the arrow CC of (A). In addition, the hatching of the cross section is omitted in consideration of easy viewing of the drawing.

  FIG. 7 is an external view of the electric wire component shown in FIG. 6, (A) is a plan view, and (B) is a side view in the length direction of the electric wire.

  The electric wire component 30 according to the present embodiment is obtained by converging, for example, four electric wire components 30 illustrated in FIG. 5B with one resin sealing portion 35. Since the electric wire component 30 is formed by converging a plurality of electric wires 31, the electric wire component 30 can be provided with as many electric wires 31 as necessary, depending on the number of terminals of the electric wire composite printed wiring board 1. Necessary electric wire components 30 can be easily provided.

<Embodiment 3>
Based on FIG. 8 thru | or 20, the electric wire composite printed wiring board 1 (main part. Refer FIG. 18) and the electric wire composite printed wiring board manufacturing method which manufacture the electric wire composite printed wiring board 1 which concern on Embodiment 3 of this invention. Will be described.

  Since the electric wire composite printed wiring board 1 according to the present embodiment is configured by applying the electric wire component 30 described in the first embodiment and the second embodiment, the description may be omitted as appropriate. Moreover, it has applied as a form which has the characteristic of the electric wire component 30 demonstrated in Embodiment 1 and Embodiment 2 as it is.

  In addition, the part other than the electric wire component 30 of the electric wire composite printed wiring board 1 is configured as a rigid portion, and has a four-layer wiring structure (an inner layer board having a wiring layer on both sides, and outer layers arranged on both outer sides of the inner layer board) An electric wire / rigid printed wiring board having a substrate) will be described as an example.

  FIG. 8 is a flowchart schematically showing a process flow of the method for manufacturing an electric wire composite printed wiring board according to Embodiment 3 of the present invention. Hereinafter, although each process is demonstrated sequentially, FIG. 9 thru | or FIG. 18 corresponding to each process (S10 thru | or S21) is also demonstrated collectively.

  An electric wire composite printed wiring board 1 manufactured by the electric wire composite printed wiring board manufacturing method according to the present embodiment includes a first wiring board 10 having a first insulating base material 11 and a first conductor layer pattern 12p, and a first wiring board. 10, a second wiring substrate 20 having a second insulating base material 21 stacked on the first wiring substrate 10, and a second conductor layer pattern 22 p connected to the electric wire component 30. (See FIG. 16).

  The first wiring substrate 10 corresponds to an inner layer substrate (two layers) in a four-layer structure, and the second wiring substrate 20 corresponds to an outer layer substrate (two layers). A four-layer structure is illustrated but not limited to this.

  As shown in the first and second embodiments, the electric wire component 30 includes the electric wire 31c and the electric wire 31 having the covering portion 31h that covers the electric wire 31c, and the conductor connector 32 connected to the electric wire 31c. Further, the conductor connector 32 is configured to be connected to the second conductor layer pattern 22p via a conduction hole conductor 41 formed in a conduction hole 40c that penetrates the second wiring board 20 (see FIG. 16). ).

  With this configuration, the conductive wire 31c (the electric wire component 30) and the second conductor layer pattern 22p can be easily and firmly connected to each other, so that the size and thickness can be reduced and free three-dimensional arrangement can be performed, signal transmission can be reliably performed, It can be set as the electric wire composite printed wiring board 1 with high reliability of the connection between the component 30 and the second conductor layer pattern 22p.

  Further, the electric wire component 30 includes a covering portion connector 34 coupled to the covering portion 31h. With this configuration, it is possible to improve the stability of the conductor connector 32, and to function as a connection relay portion when the second conductor layer pattern 22p is formed on both sides of the first wiring board 10 for mutual connection. This is possible (see FIG. 21).

  Further, the electric wire component 30 includes an electric wire 31 having a shielding wire 31s disposed on the outer periphery of the covering portion 31h and an exterior covering portion 31f covering the shielding wire 31s, and a shielding wire connector 33 connected to the shielding wire 31s. With. The shield wire connector 33 is configured to be connected to the second conductor layer pattern 22p via the conduction hole conductor 41 formed in the shielding line conduction hole 40s penetrating the second wiring board 20 (FIG. 16).

  With this configuration, the shielding wire 31s (the electric wire component 30) and the second conductor layer pattern 22p can be easily and reliably connected, so that the reliability of the connection between the electric wire component 30 and the second conductor layer pattern 22p is improved and the shielding is performed. It can be set as the electric wire composite printed wiring board 1 provided with the electric wire component 30 which improves a characteristic and has the outstanding high frequency characteristic.

Step S10:
FIG. 9 is an explanatory view showing an electric wire part prepared in the electric wire part preparation step of the electric wire composite printed wiring board manufacturing method according to Embodiment 3 of the present invention, (A) is a plan view, and (B) is (A). It is an end view which shows the end surface of the cross section by arrow BB of). Note that hatching in the cross section is omitted in view of easy viewing of the drawings (the same applies to FIGS. 10 to 18).

  The electric wire component 30 is prepared (electric wire component preparation process). That is, the electric wire component 30 in which the conductor connector 32 is connected to the conductor 31c is prepared. Further, in the electric wire component preparation step, like the conductor connector 32, the shield wire connector 33 is connected to the shield wire 31s, and the covering portion connector 34 is connected to the covering portion 31h. The details of the electric wire component 30 are as described in the first embodiment and the second embodiment. In addition, Embodiment 1 and Embodiment 2 respond | correspond to an electric wire components preparation process.

  In the present embodiment, the electric wire component 30 shown in the second embodiment (FIGS. 6 and 7) is applied. That is, the electric wire component 30 is configured to include four electric wires 31. Moreover, since the resin sealing part 35 is a rectangular parallelepiped, it becomes possible to arrange | position (stack | stack) stably. Further, the resin sealing portions 35 are arranged symmetrically at both ends of the electric wires 31.

  As described above, the electric wire component preparation step includes the electric wire preparation step of preparing the electric wire 31 by exposing the conductive wire 31c, the connector connecting step of connecting the conductive wire connector 32 to the conductive wire 31c, the conductive wire 31c and the conductive wire connector. A resin sealing portion forming step of forming a resin sealing portion 35 for sealing the resin 32.

  Therefore, it is possible to easily prepare the electric wire component 30 including the resin sealing portion 35 that protects the conductive wire connector 32 connected to the second conductor layer pattern 22p, and the electric wire composite printed wiring board manufacturing method with high productivity. It can be.

Step S11:
FIG. 10 is an explanatory view showing a first wiring board prepared in the wire component fitting opening forming step of the electric wire composite printed wiring board manufacturing method according to Embodiment 3 of the present invention, (A) is a plan view; (B) is an end elevation showing an end face of a cross section at arrow BB in (A).

  The first wiring board 10 is prepared. That is, the wire component fitting opening 10w for fitting the wire component 30 is opened in the first wiring board 10 (wire component fitting opening forming step).

  The first wiring board 10 is composed of, for example, a double-sided rigid printed wiring board. A first conductor layer 12 is formed (laminated) on both surfaces of the first insulating substrate 11. Specifically, the first insulating substrate 11 is a glass epoxy resin plate having a thickness of 0.5 mm, for example, the first conductor layer 12 is made of, for example, a copper foil having a thickness of 18 μm, and the first conductor layer 12 is patterned. Thus, the first conductor layer pattern 12p is formed. Patterning can be performed by applying a known technique. Further, appropriate patterning is also performed on other portions not shown (see FIG. 19).

  The opening of the wire component fitting opening 10w can be performed by applying, for example, an NC router (numerical control router). By aligning with respect to the same position reference (pin lamination guide 52; see FIG. 20) as the first conductor layer pattern 12p, the electric wire component 30 can be accurately aligned with the second conductor layer pattern 22p. The part fitting opening 10w can be opened.

Step S12:
FIG. 11 is an explanatory view showing a second wiring board prepared in the wire lamination preventing opening forming step of the electric wire composite printed wiring board manufacturing method according to Embodiment 3 of the present invention, (A) is a plan view, (B) is an end elevation showing an end face of a cross section at arrow BB in (A).

  The second wiring board 20 is prepared. That is, the wire lamination preventing opening 20w for preventing the second wiring substrate 20 in which the second insulating base material 21 and the second conductor layer 22 for forming the second conductor layer pattern 22p are laminated from being laminated on the electric wire 31. (Opening forming step for preventing electric wire lamination).

  For example, the second wiring board 20 is configured by applying an adhesive (epoxy resin adhesive having a thickness of 50 μm) as the second insulating base material 21 to a copper foil having a thickness of 18 μm as the second conductor layer 22. It is.

  The opening of the electric wire lamination preventing opening 20w can be performed by applying, for example, an NC router (numerical control router). The opening 20 w for preventing the lamination of the electric wires has a shape in which the second wiring board 20 is laminated on the first wiring board 10 and the resin sealing portion 35 of the electric wire component 30 and not on the electric wires 31.

Step S13:
FIG. 12 is an explanatory diagram showing a state in which the electric wire component, the first wiring substrate, and the second wiring substrate are aligned in the electric wire component assembly process of the electric wire composite printed wiring board manufacturing method according to Embodiment 3 of the present invention. (A) is a top view, (B) is an end view which shows the end surface of the cross section by the arrow BB of (A).

  The electric wire component 30, the first wiring board 10, and the second wiring board 20 are assembled. That is, the electric wire component 30 is fitted into the electric wire component fitting opening 10w of the first wiring substrate 10, and the second wiring substrate 20 is aligned and overlapped with the juxtaposed first wiring substrate 10 and the electric wire component 30. (Wire component assembly process).

  First, the second wiring board 20 (20a) that is one outer layer board is disposed, and then the first wiring board 10 and the electric wire component 30 are juxtaposed and overlapped on the second wiring board 20a. Further, the second wiring board 20 (20b) serving as the other outer layer board is overlaid on the juxtaposed first wiring board 10 and electric wire component 30. Hereinafter, when it is not necessary to distinguish between the second wiring board 20a and the second wiring board 20b, the second wiring board 20 may be simply used. The mutual alignment can be performed by applying, for example, a pin lamination guide 52 (see FIG. 20).

Step S14:
FIG. 13 is an explanatory view showing a state in which the electric wire component, the first wiring board, and the second wiring board are laminated in the second wiring board lamination step of the electric wire composite printed wiring board manufacturing method according to Embodiment 3 of the present invention. (A) is a top view, (B) is an end view which shows the end surface of the cross section by the arrow BB of (A).

  The second wiring board 20 is laminated corresponding to the first wiring board 10 and the electric wire component 30 (resin sealing portion 35) (second wiring board lamination step). In addition, since the electric wire 31 is arrange | positioned corresponding to the opening part 20w for electric wire lamination | stacking prevention, it is set as the state which is not laminated | stacked.

  Since the conductor connector 32, the shielding wire connector 33, and the covering portion connector 34 are fixed by the resin sealing portion 35, the respective surfaces thereof face the second conductor layer 22 with good parallelism. It becomes a form. That is, the conducting wire connector 32, the shielding wire connector 33, and the covering portion connector 34 are positioned to face the second conductor layer 22 with high accuracy.

  The second wiring board stacking step is performed by heating and pressurizing in a vacuum as in the known multilayer wiring substrate stacking step. The gap between the electric wire component 30 fitted in the electric wire component fitting opening 10w and the first wiring board 10 is filled with the second insulating base material 21 made of an adhesive by heating and pressurization. Therefore, the electric wire component 30 is laminated (adhered) to the first wiring board 10 and the second wiring board 20 reliably and firmly.

  As described in the first embodiment, the interval between the covering portion connector 34 and the second conductor layer 22 (second conductor layer pattern 22p) is equal to the conductor wire connector 32 and the second conductor layer 22 ( It is desirable that the distance between the second conductor layer pattern 22p) is the same.

  With this configuration, the position of the electric wire component 30 can be stabilized and the flatness (parallelism) with respect to the second conductor layer pattern 22p can be ensured. Therefore, the connection between the conductor connector 32 and the second conductor layer pattern 22p is highly accurate. Can be performed.

  Similarly, the gap between the shield wire connector 33 and the second conductor layer 22 (second conductor layer pattern 22p) is equal to the conductor wire connector 32 and the second conductor layer 22 (second conductor layer pattern 22p). It is desirable that the distance between

  With this configuration, it is possible to stabilize the position of the electric wire component 30 and to ensure flatness (parallelism) with respect to the second conductor layer pattern 22p. Therefore, the conductor connector 32, the shield connector 33, and the second conductor layer pattern. It becomes possible to perform connection with 22p with high precision.

  In this Embodiment, the electric wire composite printed wiring board 1 of 4 layer structure is comprised as mentioned above. Therefore, the first conductor layer pattern 12 p is formed on both surfaces of the first insulating base material 11, and the second wiring substrate 20 is laminated on both surfaces of the first wiring substrate 10.

  The distance between the conductor connector 32 and one second conductor layer 22 (second conductor layer pattern 22p) is the same as that between the conductor connector 32 and the other second conductor layer 22 (second conductor layer pattern 22p). The interval is the same. Therefore, the conduction hole conductor 41 can be formed with high accuracy and easily, and reliable conduction can be established between the conductor connector 32 and the second wiring pattern 22p laminated on both surfaces.

  Further, the distance between the shield wire connector 33 and one of the second conductor layers 22 (second conductor layer pattern 22p) is such that the shield wire connector 33 and the other second conductor layer 22 (second conductor layer pattern 22p). ) And the same interval. Therefore, the conduction hole conductor 41 can be formed with high accuracy and ease, and reliable conduction between the shielding wire conduction hole 40s and the second conductor layer 22 (second conductor layer pattern 22p) laminated on both surfaces. It becomes possible to take.

Step S15:
FIGS. 14A and 14B are explanatory views showing a state in which the conductive holes are formed in the conductive hole forming step of the method for manufacturing an electric wire composite printed wiring board according to Embodiment 3 of the present invention. FIG. 14A is a plan view, and FIG. It is an end elevation which shows the end surface of the cross section by arrow BB of (A).

  The conducting wire conduction hole 40c for forming the conducting hole conductor 41 (see FIG. 15) for connecting the conducting wire connector 32 and the second conductor layer 22 (second conductor layer pattern 22p) is positioned at the conducting wire connector 32. (Conducting hole forming step). That is, the conducting wire conduction hole 40 c that penetrates the second wiring substrate 20 and reaches the conducting wire connector 32 is opened.

  In addition, similarly, the shielding wire conduction hole 40 s for forming the conduction hole conductor 41 connecting the shielding wire connector 33 and the second conductor layer 22 (second conductor layer pattern 22 p) is used as the shielding wire connector. It forms corresponding to the position of 33 (conduction hole formation process). That is, the shielding wire conduction hole 40 s penetrating the second wiring substrate 20 is opened.

  Further, a conduction hole 40 for forming a conduction hole conductor 41 connecting the first conductor layer pattern 12p and the second conductor layer 22 is formed corresponding to the position of the first conductor layer pattern 12p (conduction hole forming step). ). That is, the conduction hole 40 penetrating the second wiring board 20 is opened.

  The conducting wire conduction hole 40c, the shielding wire conducting hole 40s, and the conduction hole 40 may be formed only in one of the second wiring boards 20 as necessary. In the present embodiment, a case where the second wiring boards 20 are formed in the same manner is shown.

  In addition, when it is not necessary to distinguish the conducting hole 40c, the shielding wire conducting hole 40s, and the conducting hole 40, the conducting hole 40 may be simply used. Further, the conducting wire conduction hole 40c, the shielding wire conduction hole 40s, and the conduction hole 40 can be appropriately formed at the same time or over time as in a general conduction hole forming method. As a processing method, for example, laser processing can be applied.

  When the resin sealing portion 35 is formed as in the present embodiment, the resin sealing portion 35 is also opened in conjunction with the opening of the conduction hole 40. Therefore, the conducting wire conduction hole 40c exposes the conducting wire connector 32, the shielding wire conducting hole 40s exposes the shielding wire connector 33, and the conducting hole 40 exposes the first conductor layer pattern 12p. .

  The depth of the conducting wire conduction hole 40c with respect to the conducting wire connector 32 and the depth of the shielding wire conduction hole 40s with respect to the shielding wire connector 33 are basically the same depth. Further, the depth of the conduction hole 40 with respect to the first conductor layer pattern 12p is equal to the depth of the conduction hole 40c with respect to the conductor connector 32 (the depth of the shielding wire conduction hole 40s with respect to the shielding wire connector 33). The thickness of the first insulating base material 11 and the first conductor layer 12 (first conductor layer pattern 12p) and the thickness of the conductor connector 32 (shielding wire connector 33) are adjusted as appropriate so as to be approximately the same. It is desirable to keep it.

Step S16:
FIG. 15 is an explanatory view showing a state in which a conduction hole conductor is formed in the conduction hole in the conduction hole conductor forming step of the method for manufacturing an electric wire composite printed wiring board according to Embodiment 3 of the present invention, and (A) is a plan view. , (B) is an end view showing the end face of the cross section at the arrow BB in (A).

  For example, copper plating is performed on the entire surface to form a conduction hole conductor 41 with respect to the conduction hole 40 (conduction hole conduction hole 40c, shielding wire conduction hole 40s) (conduction hole conductor formation step). The conduction hole conductor 41 enables connection between layers as required. Similarly, the conduction hole conductor 41 is laminated and formed on the second conductor layer 22. Since the conduction hole conductor 41 is formed on the entire surface, a highly reliable conductor layer is formed with respect to the conduction hole 40.

Step S17:
FIG. 16 is an explanatory view showing a state in which the second conductor layer pattern is formed in the second conductor layer pattern forming step of the electric wire composite printed wiring board manufacturing method according to Embodiment 3 of the present invention, and FIG. FIG. 4B is an end view showing the end face of the cross section at the arrow BB in FIG.

  The conduction hole conductor 41 and the second conductor layer 22 are patterned to form a second conductor layer pattern 22p (second conductor layer pattern forming step). That is, the conductive hole conductor 41 formed in the conductive hole 40 (conductive wire conductive hole 40c, shielding wire conductive hole 40s) is left as an interlayer connection pattern. Patterning can be performed by applying a known technique. In addition, appropriate patterning is also performed on other portions not shown (see FIG. 19). Component connection terminals 22pt and peripheral wiring patterns are formed.

  Therefore, in the second conductor layer pattern forming step, the conductor connector 32 is connected to the second conductor layer pattern 22p through the conduction hole conductor 41. Similarly, the shield wire connector 33 is connected to the second conductor layer pattern 22p through the conduction hole conductor 41.

  The conducting wire connector 32 and the shielding wire connector 33 are connected to the second conductor layer pattern 22p by the conducting hole conductor 41 formed in the conducting wire conduction hole 40c and the shielding wire conduction hole 40s, respectively. It is possible to achieve a strong and reliable connection. In addition, since the conductor wire connector 32 and the shield wire connector 33 have a flat surface facing the second conductor layer pattern 22p, it is possible to connect with good conductivity.

Step S18:
FIG. 17 is an explanatory view showing a state in which a solder resist is formed on the surface of the second wiring board in the solder resist forming step of the method for manufacturing an electric wire composite printed wiring board according to Embodiment 3 of the present invention. A top view and (B) are the end views which show the end surface of the cross section by arrow BB of (A).

  A solder resist layer (for example, a photo solder resist layer) is applied to the surface of the second wiring substrate 20 and is appropriately patterned to form a solder resist 42 having connection openings 43 (see FIG. 19) (solder resist forming step). ). Further, the solder resist layer is removed in order to facilitate the removal of the unnecessary region 1m to be removed in the outer shape forming step (see step S20).

Step S19:
After forming the solder resist 42, the surface of the second conductor layer 22 (component connection terminal 22pt formed as the second conductor layer pattern 22p) exposed in the connection opening 43 is subjected to rust prevention treatment. The rust prevention treatment can be performed, for example, by applying a water-soluble flux.

Step S20:
FIG. 18 is an explanatory view showing a state in which the electric wire composite printed wiring board is formed in the outer shape forming step of the electric wire composite printed wiring board manufacturing method according to Embodiment 3 of the present invention, (A) is a plan view, ) Is an end view showing the end face of the cross section at arrow BB in (A).

  The outer shapes of the first wiring substrate 10 and the second wiring substrate 20 are formed (outer shape forming step). By this step, the electric wire composite printed wiring board 1 having the final shape is completed. The contour forming process can be performed by applying an NC router, for example.

Step S21:
The completed electric wire composite printed wiring board 1 is inspected (inspection process). Examples of inspection types include electrical inspection and appearance inspection.

  FIG. 19 is a plan view showing an actual layout example of the electric wire composite printed wiring board according to Embodiment 3 of the present invention.

  The electric wire composite printed wiring board 1 according to the present embodiment has component connection terminals 22pt (connection openings 43) for mounting components as the layout of the second conductor layer pattern 22p. Note that the central portion (resin sealing portion 35 and the peripheral region) indicated by the two-dot chain line corresponds to the region described in FIGS. 9 to 18 (the main portion of the electric wire composite printed wiring board 1).

  As described above, the electric wire composite printed wiring board 1 according to the present embodiment includes the first wiring board 10 having the first insulating base material 11 and the first conductor layer pattern 12p, and the electric wires juxtaposed on the first wiring board 10. An electric wire composite printed wiring board provided with a component 30, a second insulating substrate 21 laminated on the first wiring substrate 10, and a second wiring substrate 20 having a second conductor layer pattern 22p connected to the electric wire component 30 1, the wire component 30 includes a wire 31 c and a wire 31 having a covering portion 31 h that insulates and covers the wire 31 c, and a wire connector 32 connected to the wire 31 c. Is connected to the second conductor layer pattern 22p through a conduction hole conductor 41 formed in a conduction hole for conductive line 40c penetrating the second wiring board 20.

  Therefore, since the conducting wire 31c (the electric wire component 30) and the second conductor layer pattern 22p can be easily and firmly connected, the electric wire component 30 can be reduced in size, reduced in thickness, and can be freely arranged in three dimensions. And the second conductor layer pattern 22p, the electric wire composite printed wiring board 1 with high reliability of connection can be obtained.

  Moreover, in the electric wire composite printed wiring board 1 according to the present embodiment, the electric wire 31 includes the shielding wire 31s disposed on the outer periphery of the covering portion 31h and the outer covering portion 31h that covers the shielding wire 31s, and includes an electric wire component. 30 includes a shielding wire connector 33 connected to the shielding wire 31 s, and the shielding wire connector 33 includes a conduction hole conductor 41 formed in the shielding wire conduction hole 40 s penetrating the second wiring substrate 20. To the second conductor layer pattern 22p.

  Accordingly, since the shielding wire 31s and the second conductor layer pattern 22p can be easily and reliably connected, the reliability of the connection between the electric wire component 30 (shielding wire 31s) and the second conductor layer pattern 22p is improved and the shielding characteristic is improved. It can be improved and it can be set as the electric wire composite printed wiring board 1 provided with the electric wire component 30 which has the outstanding high frequency characteristic.

  As described above, the electric wire composite printed wiring board manufacturing method according to the present embodiment includes the first wiring board 10 having the first insulating base material 11 and the first conductor layer pattern 12p, the second insulating base material 21 and the second insulating base material 21. The second wiring board 20 having the conductor layer pattern 22p and laminated on the first wiring board 10, the conductor 31c and the wire 31 having the covering portion 31h for insulating the conductor 31c, and the conductor connector 32 connected to the conductor 31c. And an electric wire composite printed wiring board manufacturing method for manufacturing an electric wire composite printed wiring board 1 comprising an electric wire component 30 juxtaposed on the first wiring board 10, wherein the conductor wire connector 32 is connected to the conductive wire 31 c. The electric wire component preparation step for preparing the electric wire component 30 and the formation of the electric wire component fitting opening for opening the electric wire component fitting opening 10w for fitting the electric wire component 30 in the first wiring board 10 are performed. Then, an opening portion for preventing the lamination of the electric wire 31 that prevents the electric wire 31 from being laminated on the second wiring board 20 in which the second conductive layer 22 and the second insulating base material 21 for forming the second conductive layer pattern 22p are laminated. The wire stacking prevention opening forming step for forming 20w, and the wire component assembly in which the wire component 30 is fitted into the wire component fitting opening 10w and the second wiring substrate 20 is stacked on the wire component 30 and the first wiring substrate 10 Insertion step, a second wiring substrate lamination step of laminating the second wiring substrate 20 on the electric wire component 30 and the first wiring substrate 10, and a conductive wire conduction hole that penetrates the second wiring substrate 20 and reaches the conductive wire connector 32. Conductive hole forming step for forming 40c, conductive hole conductor forming step for forming conductive hole conductor 41 in conductive hole for conductive wire 40c, conductive hole conductor 41 and second conductive layer 22 are patterned to form second conductive layer pattern 22p. Form Comprising a second conductor layer pattern formation step, a contour forming step of forming the outer shape of the first wiring board 10 and second wiring board 20.

  Accordingly, since the conductor connector 32 connected to the conductor 31c can be easily and highly accurately connected to the second conductor layer pattern 22p, the electric wire component 30 (conductor 31c) and the second conductor layer pattern 22p can be easily and highly accurately connected. The wire composite printed wiring board 1 that can be downsized, thinned and freely arranged in three dimensions, can reliably transmit signals, and has high reliability in connection between the wire component 30 and the second conductor layer pattern 22p. It becomes possible to manufacture with high productivity.

  Moreover, in the electric wire composite printed wiring board manufacturing method according to the present embodiment, the electric wire 31 includes the shielding wire 31s disposed on the outer periphery of the covering portion 31h and the outer covering portion 31h that covers the shielding wire 31s. The component 30 includes a shield wire connector 33 connected to the shield wire 31s. In the electric wire component preparation step, the shield wire connector 33 is connected to the shield wire 31s, and in the conduction hole forming step, the second portion is formed. A shielding wire conduction hole 40s that penetrates the wiring board 20 and reaches the shielding wire connector 33 is formed. In the conduction hole conductor forming step, a conduction hole conductor 41 is formed in the shielding wire conduction hole 40s, and the second conductor. In the layer pattern forming step, the second conductor layer pattern 22p connected to the shielding wire connector 33 is formed.

  Therefore, since the shielding wire 31s and the second conductor layer pattern 22p can be connected easily and with high accuracy, the reliability of the connection between the electric wire component 30 (shielding wire 31s) and the second conductor layer pattern 22p is improved and the shielding property is improved. Thus, it is possible to manufacture the electric wire composite printed wiring board 1 including the electric wire component 30 having excellent high frequency characteristics with high productivity.

  FIG. 20 is a plan view showing an example of a workpiece applied when manufacturing the electric wire composite printed wiring board according to Embodiment 3 of the present invention.

  In the actual manufacturing process, a plurality (for example, eight) of the electric wire composite printed wiring board 1 shown as a finished product in FIG. 19 is arranged on the work 50, and at the same time, eight electric wire composite printed wiring boards 1 can be manufactured. Possible configurations.

  The workpiece 50 has an outer shape of, for example, 500 mm × 400 mm, and includes a processing guide 51 and a pin lamination guide 52. The processing guide 51 and the pin lamination guide 52 are disposed at, for example, four corners of the workpiece 50. With the processing guide 51 and the pin lamination guide 52, the alignment work in the steps S10 to S21 can be performed with high accuracy and efficiency.

<Embodiment 4>
Based on FIG. 21, the electric wire composite printed wiring board 1 and the electric wire composite printed wiring board manufacturing method for manufacturing the electric wire composite printed wiring board 1 according to Embodiment 4 of the present invention will be described.

  Since the basic configuration of the electric wire composite printed wiring board 1 according to the present embodiment is the same as that of the third embodiment, the description thereof may be omitted as appropriate. That is, the present embodiment is different from the third embodiment in that the covering portion connector 34 is connected to the second conductor layer pattern 22p. Hereinafter, mainly different points will be described.

  FIG. 21: is explanatory drawing which shows the state in the process in the middle of the electric wire composite printed wiring board manufacturing method which concerns on Embodiment 4 of this invention, (A) is the state which formed the conduction hole at the conduction hole formation process. FIG. 5B is an end view showing a state in which the second conductor layer pattern is formed in the second conductor layer pattern formation step after the formation of the conduction hole conductor in the conduction hole conductor formation step. The position in the end view is the same as that in the third embodiment. Further, hatching in the cross section is omitted in view of easy viewing of the drawing.

  In the electric wire composite printed wiring board manufacturing method according to the present embodiment, the covering portion connector 34 is coupled to the covering portion 31h in the electric wire component preparation step, and the second wiring substrate 20 is penetrated in the conduction hole forming step. After forming the conduction hole 40h for the covering portion that reaches the connector 34 for the covering portion (FIG. 2A), and forming the conduction hole conductor 41 in the conduction hole 40h for the covering portion in the conduction hole conductor forming step, In the conductor layer pattern forming step, the second conductor layer pattern 22p connected to the covering portion connector 34 is formed (FIG. 5B).

  The covering portion connector 34 is connected to the second conductor layer 22 (second conductor layer pattern 22p) through a conduction hole conductor 41 formed in the covering portion conduction hole 40h penetrating the second wiring board 20. Yes, one second conductor layer 22 (second conductor layer pattern 22p) and the other second conductor layer 22 (second conductor layer pattern 22p) are connected to each other via a covering portion connector 34. is there.

  With this configuration, it is possible to easily connect one second conductor layer pattern 22p and the other second conductor layer pattern 22p laminated on both sides of the first wiring board 10 via the covering portion connector 34. Thus, by functioning as a connection relay unit, it is possible to manufacture the wire composite printed wiring board 1 with improved wiring flexibility with high productivity.

  That is, when the second conductor layer pattern 22p is formed on both sides of the first wiring board 10 and interconnected, the electric wire composite printed wiring board 1 having the covering portion connector 34 that can function as a connection relay portion. Can be manufactured. Moreover, it becomes possible to set it as the electric wire composite printed wiring board 1 which improved the freedom degree of wiring by functioning the connector 34 for coating | coated parts as a connection relay part.

<Embodiment 5>
The electronic device (not shown) according to the present embodiment is an electronic device on which the electric wire composite printed wiring board 1 according to the third and fourth embodiments is mounted. That is, the electronic device includes the electric wire composite printed wiring board 1 to which the electric wire component 30 is connected.

  Since the wire composite printed wiring board 1 can be reduced in size and thickness, and can be freely arranged according to the shape of the housing, the housing shape can be reduced in size and thickness to a desired shape. It is possible to provide an electronic device that can be connected with high reliability.

  Note that electronic devices include communication terminals such as mobile phones that are required to have excellent electrical characteristics at high frequencies and to be small and light.

It is a flowchart which shows the general | schematic process flow of the electric wire component manufacturing method which manufactures the electric wire component which concerns on Embodiment 1 of this invention. It is explanatory drawing which shows typically the structure of the electric wire with which the electric wire component which concerns on Embodiment 1 of this invention is equipped, (A) is a front view, (B) is a side view which shows the front end side. It is explanatory drawing which shows typically the structure of the electric wire with which the electric wire component which concerns on Embodiment 1 of this invention is equipped, (A) is a front view, (B) is a side view which shows the front end side. It is explanatory drawing which shows typically the structure of the electric wire with which the electric wire component which concerns on Embodiment 1 of this invention is equipped, (A) is a front view, (B) is a side view which shows the front end side. It is explanatory drawing which shows typically the structure of the electric wire component which concerns on Embodiment 1 of this invention, (A) is a top view, (B) is a front view, (C) is a side view which shows the front end side. It is explanatory drawing which shows typically the structure of the electric wire component which concerns on Embodiment 1 of this invention, (A) is a top view, (B) is a front view, (C) is a side view which shows the front end side. It is explanatory drawing which shows typically the structure of the electric wire component which concerns on Embodiment 1 of this invention, (A) is a top view, (B) is a front view, (C) is a side view which shows the front end side. It is explanatory drawing which shows typically the structure of the electric wire component which concerns on Embodiment 1 of this invention, (A) is a top view, (B) is a front view, (C) is a side view which shows the front end side. It is explanatory drawing which shows typically the structure of the electric wire component which concerns on Embodiment 1 of this invention, (A) is a top view, (B) is a front view, (C) is a side view which shows the front end side. It is explanatory drawing which shows typically the structure of the electric wire component which concerns on Embodiment 1 of this invention, (A) is a top view, (B) is a front view, (C) is a side view which shows the front end side. It is explanatory drawing which shows typically the structure of the electric wire component which concerns on Embodiment 1 of this invention, (A) is a top view, (B) is a front view, (C) is a side view which shows the front end side. It is explanatory drawing which shows typically the structure of the modification (resin sealing part) of the electric wire component which concerns on Embodiment 1 of this invention, (A) is a top view, (B) is a front view, (C) is It is a side view which shows the front end side. It is explanatory drawing which shows typically the structure of the modification (resin sealing part) of the electric wire component which concerns on Embodiment 1 of this invention, (A) is a top view, (B) is a front view, (C) is It is a side view which shows the front end side. It is explanatory drawing which shows typically the structure in the resin sealing part of the electric wire component which concerns on Embodiment 2 of this invention, (A) is a top view, (B) is the arrow BB of (A). (C) is sectional drawing in the arrow CC of (A). It is an external view of the electric wire component shown in FIG. 6, (A) is a top view, (B) is a side view in the length direction of an electric wire. It is a flowchart which shows schematically the process flow of the electric wire composite printed wiring board manufacturing method which concerns on Embodiment 3 of this invention. It is explanatory drawing which shows the electric wire component prepared at the electric wire component preparation process of the electric wire composite printed wiring board manufacturing method which concerns on Embodiment 3 of this invention, (A) is a top view, (B) is an arrow of (A). It is an end elevation which shows the end surface of the cross section in BB. It is explanatory drawing which shows the 1st wiring board prepared at the opening part formation process for electric wire components fitting of the electric wire composite printed wiring board manufacturing method which concerns on Embodiment 3 of this invention, (A) is a top view, (B) is It is an end elevation which shows the end surface of the cross section by arrow BB of (A). It is explanatory drawing which shows the 2nd wiring board prepared at the opening part formation process for electric wire lamination | stacking prevention of the electric wire composite printed wiring board manufacturing method which concerns on Embodiment 3 of this invention, (A) is a top view, (B) is It is an end elevation which shows the end surface of the cross section by arrow BB of (A). It is explanatory drawing which shows the state which aligned the electric wire component, the 1st wiring board, and the 2nd wiring board in the electric wire component assembly | attachment process of the electric wire composite printed wiring board manufacturing method which concerns on Embodiment 3 of this invention, (A) Is a plan view, and (B) is an end view showing an end face of a cross section taken along arrows BB in (A). It is explanatory drawing which shows the state which laminated | stacked the electric wire component, the 1st wiring board, and the 2nd wiring board at the 2nd wiring board lamination process of the electric wire composite printed wiring board manufacturing method which concerns on Embodiment 3 of this invention, (A) Is a plan view, and (B) is an end view showing an end face of a cross section taken along arrows BB in (A). It is explanatory drawing which shows the state which formed the conduction hole by the conduction hole formation process of the electric wire composite printed wiring board manufacturing method which concerns on Embodiment 3 of this invention, (A) is a top view, (B) is (A). It is an end view which shows the end surface of the cross section by arrow BB. It is explanatory drawing which shows the state which formed the conduction-hole conductor in the conduction hole at the conduction-hole conductor formation process of the electric wire composite printed wiring board manufacturing method which concerns on Embodiment 3 of this invention, (A) is a top view, (B) [FIG. 4] An end view showing an end face of a cross section taken along arrows BB in (A). It is explanatory drawing which shows the state which formed the 2nd conductor layer pattern at the 2nd conductor layer pattern formation process of the electric wire composite printed wiring board manufacturing method which concerns on Embodiment 3 of this invention, (A) is a top view, (B ) Is an end view showing the end face of the cross section at arrow BB in (A). It is explanatory drawing which shows the state which formed the soldering resist on the surface of the 2nd wiring board at the soldering resist formation process of the electric wire composite printed wiring board manufacturing method which concerns on Embodiment 3 of this invention, (A) is a top view, ( B) is an end view showing an end face of a cross section taken along arrows BB in (A). It is explanatory drawing which shows the state which formed the electric wire composite printed wiring board by the external shape formation process of the electric wire composite printed wiring board manufacturing method which concerns on Embodiment 3 of this invention, (A) is a top view, (B) is (A) It is an end view which shows the end surface of the cross section by arrow BB of). It is a top view which shows the actual layout example of the electric wire composite printed wiring board which concerns on Embodiment 3 of this invention. It is a top view which shows the example of a workpiece | work applied when manufacturing the electric wire composite printed wiring board which concerns on Embodiment 3 of this invention. It is explanatory drawing which shows the state in the process in the middle of the electric wire composite printed wiring board manufacturing method which concerns on Embodiment 4 of this invention, (A) is an end elevation which shows the state which formed the conduction hole at the conduction hole formation process, (B) is an end view showing a state in which a second conductor layer pattern is further formed in a second conductor layer pattern forming step after a conduction hole conductor is formed in a conduction hole conductor forming step. It is explanatory drawing of the flexible rigid multilayer printed wiring board concerning the prior art example 1, (A) is a top view, (B) is an end elevation which shows the end surface of the cross section by the arrow BB of (A). It is explanatory drawing explaining the printed circuit board which concerns on the prior art example 2, (A) is a top view, (B) is a side view in the arrow B of (A), (C) is according to the arrow Rot of (B). It is a side view in the state where electric wire parts were bent. It is explanatory drawing explaining the printed circuit board which concerns on the prior art example 3, (A) is a top view, (B) is a side view in the arrow B of (A), (C) is according to the arrow Rot of (B). It is a side view in the state where electric wire parts were bent. It is explanatory drawing explaining the printed circuit board which concerns on the prior art example 4, (A) is a top view, (B) is a side view in the arrow B of (A), (C) is according to the arrow Rot of (B). It is a side view in the state where electric wire parts were bent.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electric wire composite printed wiring board 10 1st wiring board 10w Opening part for electric wire components fitting 11 1st insulating base material 12 1st conductor layer 12p 1st conductor layer pattern 20 2nd wiring board 20w Opening part for electric wire lamination | stacking prevention 21 2nd Insulating base material 22 Second conductor layer 22p Second conductor layer pattern 30 Electric wire component 31 Electric wire 31c Conductive wire 31f Exterior covering portion 31h Covering portion 31s Shielding wire 31sh Shielding separation portion 32 Conductor connector 32d Notch 33 Shielding wire connector 33d Notch 34 Covering Portion 34d Notch 35 Resin Sealing Portion 40 Conductive Hole 40c Conducting Wire Conducting Hole 40s Shielding Wire Conducting Hole 40h Covering Portion Conducting Hole 41 Conducting Hole Conductor 42 Solder Resist 43 Connection Opening 50 Work 51 Processing Guide 52 Pin lamination guide

Claims (39)

A first wiring board having a first insulating base material and a first conductor layer pattern; an electric wire component fitted in parallel to an electric wire component fitting opening formed in the first wiring substrate ; and a second insulating substrate And a second wiring board laminated on the first wiring board with a second conductor layer pattern, the second wiring board being juxtaposed to the first wiring board at the opening for fitting the electric wire component And the second conductor layer pattern is an electric wire composite printed wiring board connected to the electric wire component ,
The electric wire component includes an electric wire having an electric wire and a covering portion that insulates and covers the electric wire, and an electric wire connector connected to the electric wire,
The conductor composite printed wiring board, wherein the conductor connector is connected to the second conductor layer pattern through a conduction hole conductor formed in a conduction hole for a conductor penetrating the second wiring board. .   The electric wire composite printed wiring board according to claim 1, wherein the conductor connector is fastened to the conductor.   The electric wire composite printed wiring board according to claim 2, wherein the conductor connector has a notch for tightening.   The electric wire composite printed wiring board according to claim 1, wherein the conductor connector is in contact with the conductor.   5. The electric wire composite printed wiring board according to claim 1, wherein the conductor connector has a flat surface connected to the conduction hole conductor. 6.   The electric wire composite printed wiring board according to claim 5, wherein the conductor connector is a rectangular parallelepiped.   The electric wire composite printed wiring board according to any one of claims 1 to 6, wherein the electric wire component includes a covering portion connector coupled to the covering portion.   The electric wire composite printed wiring board according to claim 7, wherein the covering portion connector is fastened to the covering portion.   The electric wire composite printed wiring board according to claim 7 or 8, wherein the covering portion connector is integrated with the conducting wire connector.   The distance between the covering portion connector and the second conductor layer pattern is the same as the distance between the conductor wire connector and the second conductor layer pattern. The electric wire composite printed wiring board according to claim 9.   The electric wire has a shielding wire disposed on the outer periphery of the covering portion and an exterior covering portion that covers the shielding wire, and the electric wire component includes a shielding wire connector connected to the shielding wire, The shield wire connector is connected to the second conductor layer pattern through the conduction hole conductor formed in the shielding wire conduction hole penetrating the second wiring board. The electric wire composite printed wiring board according to any one of claims 1 to 10.   The electric wire composite printed wiring board according to claim 11, wherein the shield wire connector is fastened to the shield wire.   The electric wire composite printed wiring board according to claim 12, wherein the shielding wire connector has a notch for fastening.   The electric wire composite printed wiring board according to any one of claims 11 to 13, wherein the shield wire connector has a flat surface connected to the conduction hole conductor.   The electric wire composite printed wiring board according to claim 14, wherein the shielding wire connector is a rectangular parallelepiped.   12. The space between the shielding wire connector and the second conductor layer pattern is the same as the space between the conductive wire connector and the second conductor layer pattern. The electric wire composite printed wiring board according to claim 15.   The first conductor layer pattern is formed on both surfaces of the first insulating base material, the second wiring board is laminated on both surfaces of the first wiring board, and the conductor connector and one of The distance between the second conductor layer pattern and the second conductor layer pattern is the same as the distance between the conductor connector and the other second conductor layer pattern. The printed wire composite printed wiring board described.   The distance between the shield wire connector and one of the second conductor layer patterns is the same as the distance between the shield wire connector and the other second conductor layer pattern. The electric wire composite printed wiring board according to 1.   The covering portion connector is connected to the second conductor layer pattern via the conduction hole conductor formed in the covering portion conduction hole penetrating the second wiring substrate, and one of the second conductors The electric wire composite printed wiring board according to claim 17 or 18, wherein the layer pattern and the other second conductor layer pattern are connected to each other through the covering portion connector.   The said electric wire component is equipped with the resin sealing part which resin-sealed the said conducting wire and the said connector for conducting wires, The electric wire composite printed wiring board as described in any one of Claim 1 thru | or 19 characterized by the above-mentioned.   21. The electric wire composite printed wiring board according to claim 20, wherein the resin sealing portion is resin-sealing the covering portion and the covering portion connector.   The electric wire composite printed wiring board according to claim 20 or 21, wherein the resin sealing portion is resin-sealing the shielding wire and the shielding wire connector. A first wiring board, a second wiring board having a second insulating base material and a second conductor layer pattern, laminated on the first wiring board, an electric wire having a conductive wire and a covering portion for insulating the conductive wire, and the conductive wire An electric wire composite printed wiring board manufacturing method for manufacturing an electric wire composite printed wiring board comprising an electric wire component arranged in parallel to the first wiring board with a conductor connector connected to
An electric wire component preparation step of preparing the electric wire component by connecting the conductive wire connector to a conductive wire;
A wire component fitting opening forming step for opening the wire component fitting opening for fitting the wire component in the first wiring board; and
An electric wire that forms an opening for preventing electric wire lamination that prevents the electric wire from being laminated on the electric wire on the second wiring board in which the second electric conductor layer for forming the second electric conductor layer pattern and the second insulating base material are laminated. An opening forming step for preventing lamination;
An electric wire component assembling step of fitting the electric wire component into the electric wire component fitting opening, and overlapping the second wiring substrate on the electric wire component and the first wiring substrate;
A second wiring board lamination step of laminating the second wiring board on the electric wire component and the first wiring board;
A conductive hole forming step of forming a conductive hole for a conductive wire that penetrates through the second wiring substrate to reach the conductive wire connector;
A conduction hole conductor forming step of forming a conduction hole conductor in the conduction hole for the conducting wire;
A second conductor layer pattern forming step of patterning the conductive hole conductor and the second conductor layer to form the second conductor layer pattern;
An outline forming step of forming an outline of the first wiring board and the second wiring board by removing an unnecessary region .   The electric wire includes a shielding wire disposed on an outer periphery of the covering portion and an exterior covering portion that covers the shielding wire, and the electric wire component includes a shielding wire connector connected to the shielding wire. Yes, a shielding wire conducting hole that connects the shielding wire connector to the shielding wire in the electric wire component preparation step and penetrates the second wiring board to the shielding wire connector in the conduction hole forming step. And forming the conduction hole conductor in the shielding wire conduction hole in the conduction hole conductor formation step, and connecting the shielding wire connector in the second conductor layer pattern formation step. 24. The method of manufacturing an electric wire composite printed wiring board according to claim 23, wherein:   In the electric wire component preparation step, the covering portion connector is joined to the covering portion, and in the conductive hole forming step, the covering portion conduction hole that penetrates the second wiring board to reach the covering portion connector. Forming the conduction hole conductor in the conduction hole for the covering portion in the conduction hole conductor formation step, and connecting the conductor for the covering portion in the second conductor layer pattern formation step. 25. The method of manufacturing an electric wire composite printed wiring board according to claim 23 or 24, wherein: The electric wire component preparation step includes: an electric wire preparation step of preparing the electric wire by exposing the conductive wire; a connector connecting step of connecting the conductive wire connector to the conductive wire; and the conductive wire and the conductive wire connector. A resin sealing portion forming step for forming a resin sealing portion to be sealed , exposing the shielding wire in the wire preparation step, and connecting the shielding wire to the shielding wire in the connector connecting step. 25. The method of manufacturing an electric wire composite printed wiring board according to claim 24 , wherein the shielding wire and the shielding wire connector are resin-sealed in the resin sealing portion forming step . In the wire preparation step, the covering portion is exposed, in the connector connecting step, a covering portion connector is coupled to the covering portion, and in the resin sealing portion forming step, the covering portion and the covering portion are used. 27. The method of manufacturing an electric wire composite printed wiring board according to claim 26 , wherein the connector is sealed with a resin. The electric wire component preparation step includes: an electric wire preparation step of preparing the electric wire by exposing the conductive wire; a connector connecting step of connecting the conductive wire connector to the conductive wire; and the conductive wire and the conductive wire connector. A resin sealing portion forming step for forming a resin sealing portion to be sealed,
In the wire preparation step, the covering portion is exposed, in the connector connecting step, a covering portion connector is coupled to the covering portion, and in the resin sealing portion forming step, the covering portion and the covering portion are used. 25. The method of manufacturing an electric wire composite printed wiring board according to claim 24 , wherein the connector is sealed with a resin. A first wiring substrate having a wire part fitting opening, a second wiring board that is laminated to the second said an insulating substrate and a second conductor layer pattern the first wiring board and the wire part fitting opening And a conductive wire formed in a conductive hole for a conductive wire that is fitted in the opening for fitting a wire component, juxtaposed with the first wiring substrate, and penetrates the second wiring substrate. a wire components connected to the second conductive layer pattern through a hole conductor,
An electric wire having a conductive wire and a covering portion for insulating and covering the conductive wire;
An electric wire component comprising: a conductive wire connector connected to the conductive wire.   The electric wire includes a shielding wire disposed on an outer periphery of the covering portion and an exterior covering portion that covers the shielding wire, and the electric wire component includes a shielding wire connector connected to the shielding wire. And the shielding wire connector is configured to be connected to the second conductor layer pattern via the conduction hole conductor formed in the shielding wire conduction hole penetrating the second wiring board. The electric wire component according to claim 29. The electric wire component includes a covering portion connector coupled to the covering portion, and the covering portion connector includes the conduction hole conductor formed in the covering portion conduction hole penetrating the second wiring board. The electric wire component according to claim 30 , wherein the electric wire component is configured to be connected to the second conductor layer pattern via a wiring. 32. The electric wire component according to claim 31 , further comprising a resin sealing portion in which the conductive wire and the conductive wire connector are sealed with resin. The resin sealing portion, the wire component of claim 32, characterized in that the zygote for the shielding wire and the shielding wire are sealed with resin. The resin sealing portion, the wire component according to claim 32 or claim 33, characterized in that the zygote for the covering part and the cover part are sealed with resin. A first wiring substrate having a wire part fitting opening, a second wiring board that is laminated to the second said an insulating substrate and a second conductor layer pattern the first wiring board and the wire part fitting opening And a conductive wire formed in a conductive hole for a conductive wire that is fitted in the opening for fitting a wire component, juxtaposed with the first wiring substrate, and penetrates the second wiring substrate. a cable component fabrication method of fabricating the connected Ru wire component on the second conductive layer pattern through a hole conductor,
Preparing an electric wire having a conductive wire and a covering portion for insulating and covering the conductive wire, and exposing the conductive wire; and
A connector connecting step of connecting a conductor for a conductor to the conductor; and
And a resin sealing part forming step of forming a resin sealing part for resin sealing the conductor and the conductor connector.   The electric wire has a shielding wire disposed on the outer periphery of the covering portion and an exterior covering portion that covers the shielding wire, and the electric wire component includes a shielding wire connector connected to the shielding wire, The shielding wire connector is configured to be connected to the second conductor layer pattern via the conduction hole conductor formed in the shielding wire conduction hole penetrating the second wiring board, and the wire preparation step The shielding wire is exposed, and in the connector connecting step, a shielding wire connector is connected to the shielding wire, and in the resin sealing portion forming step, the shielding wire and the shielding wire connector are made of resin. The electric wire component manufacturing method according to claim 35, wherein sealing is performed. In the wire preparation step, the covering portion is exposed, in the connector connecting step, a covering portion connector is coupled to the covering portion, and in the resin sealing portion forming step, the covering portion and the covering portion are used. The electric wire component manufacturing method according to claim 36 , wherein the connector is sealed with resin.   In the resin sealing portion forming step, the leading end of the conductive wire is held outside the resin sealing portion to form the resin sealing portion, and the conductive wire protruding from the resin sealing portion is removed. An electric wire part manufacturing method according to any one of claims 35 to 37.   It is an electronic device carrying the electric wire composite printed wiring board to which the electric wire component was connected, Comprising: The said electric wire composite printed wiring board is an electric wire composite printed wiring board as described in any one of Claim 1 thru | or 22. An electronic device characterized by that.

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