JP4982976B2 - Flexible substrate manufacturing method and display element - Google Patents

Description

  The present invention relates to a display substrate that can be suitably used for a flexible flat panel display and the like, and a display element using the same.

Currently, liquid crystal displays (hereinafter abbreviated as LCDs) are widely used in information terminal displays that require portability. However, there is a need for further weight reduction. Application of an electroluminescence (hereinafter abbreviated as organic EL) panel is considered promising. Furthermore, development for practical application of a flexible flat panel display (hereinafter abbreviated as a flexible FPD), which is a next-generation display, is being promoted by making the organic EL full color.

In putting an organic EL display into practical use, preventing the generation of dark spots appearing on the light emitting surface during storage is regarded as the greatest problem. In the organic EL element, both the electrode layer and the light emitting layer constituting the element are deteriorated by oxygen or water vapor in the atmosphere, and a non-light emitting portion called a dark spot is easily generated. Therefore, in order to improve the stability and reliability of the organic EL element, a barrier film that protects from water vapor, oxygen, etc. in the atmosphere and prevents deterioration of the element is necessary. The glass substrate that has been used as a film is unsuitable for a flexible FPD because it is heavy, easily broken, and cannot be bent.

A barrier film that can be used in a flexible FPD is required to be lightweight and highly flexible, and various studies have been made on the use of resin base materials. However, the resin base material has a poor barrier property against water vapor or oxygen. As an improvement of the barrier property, Patent Document 1 discloses a display substrate in which an organic-inorganic hybrid material, particularly a resin film and a glass film are sealed by a heat laminating method or an adhesive, but the barrier property is still It was insufficient.

JP 2002-299041 A

The present invention provides a display substrate that is lightweight, hardly cracked, can be bent, and has a sufficient barrier property against water vapor, oxygen, and the like, and a display element using the substrate.

As a result of intensive studies, the present inventor has an influence on the outer surface of the outer cover of the barrier film by the adhesive used when sealing the glass film with the resin film in the conventional barrier film (organic-inorganic hybrid material). And it discovered that the barrier property was reduced, and it discovered that the said subject could be solved by improving the resin composition of this outer surface, and came to complete this invention.
That is, this invention consists of the following invention.
[1] A substrate for coating a glass substrate with a resin substrate and sealing, wherein the outer surface of the substrate is formed of substantially the same resin .
[2] The display substrate according to [1], wherein the glass substrate has a thickness of 30 μm to 200 μm.
[3] The display substrate according to [1] or [2], wherein the maximum thickness of the substrate is 50 μm to 500 μm.
[4] The resin constituting the resin base material is at least one selected from the group consisting of polycarbonate, polyethylene terephthalate, polyethylene naphthalate, polyarylate, polycycloolefin, polyethersulfone and polyacrylate. The display substrate according to any one of [1] to [3].
[5] The display substrate according to any one of [1] to [3], wherein the resin constituting the resin base material is polycycloolefin.
[6] The display substrate according to any one of [1] to [5], wherein the sealing portion of the resin base material is sealed by solvent adhesion.
[7] The display substrate according to [6], wherein a resin solution obtained by dissolving substantially the same resin as the resin base material in a solvent is used in solvent adhesion.
[8] A display element characterized in that the display substrate according to any one of [1] to [7] is used for at least one of the counter substrates constituting the display element.
[9] A display element characterized in that the display substrate according to any one of [1] to [7] is used for both of the counter substrates constituting the display element.
[10] The display element according to [8] to [9], wherein the display element is a liquid crystal element.
[11] The display element according to the above [8] to [9], wherein the display element is an organic electroluminescence element.

In addition, the substantially same resin in the present invention means that they have the same or almost the same chemical composition and have the same or almost the same chemical and physical characteristics. Here, the same or almost the same chemical composition, when compared with each other repeating unit structure, 80-100 wt% of repeating units are equivalent, and resins containing 0-20 wt% of copolymer components,
Or resin itself is equivalent, The resin composition formed by adding an additive in 0-10 weight% with respect to this resin is shown.
In the present invention, the outer surface of the substrate represents the entire front and back surfaces and end surfaces (including the sealed end surface portion) of the substrate.

ADVANTAGE OF THE INVENTION According to this invention, the board | substrate which has sufficient flexibility as a display substrate of flexible FPD and sufficient water vapor | steam barrier property and oxygen barrier property can be provided, and stability and reliability can be provided by using this substrate. Excellent LCD and organic EL display can be provided.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the drawings as necessary.
Examples of the glass substrate in the present invention include borosilicate glass, alkali-free glass, low alkali glass, soda lime glass, sol-gel glass, or those obtained by subjecting these glasses to surface treatment. Among these, inexpensive soda lime glass coated with an alkali seal, alkali-free glass, and the like are preferable.

The thickness of the glass substrate is preferably 30 μm to 200 μm, and more preferably 50 μm to 150 μm. A thickness of 30 μm or more is preferable because it facilitates production. On the other hand, it is preferable that the thickness of the glass be 200 μm or less because it is difficult to break when stress such as bending is applied. There is no restriction | limiting in particular as a manufacturing method of a glass base material, Well-known methods, such as a redraw method, a fusion method, a microsheet method, a sol gel method, can be used.

The glass substrate in the present invention is preferably subjected to a surface treatment in order to further improve the adhesion of the portion in contact with the resin substrate. Examples of the surface treatment include corona discharge treatment, flame treatment, oxidation treatment, plasma treatment, silane coupling agent coating treatment, primer coating treatment, and the like. Further, the glass substrate and the resin substrate may be bonded by an adhesive treatment, an adhesive treatment, or a heat fusion treatment. Among these, silane coupling agent coating treatment and primer coating treatment are preferable because they are simple in production. When processing with chemicals such as silane coupling agents, primers, and adhesives, after sealing the resin base material, these chemicals leak to the outer surface of the resin base material forming the outer cover of the display substrate. Adjust the processing amount and processing method so that it does not come out.

Examples of the silane coupling agent include those having a vinyl group, an epoxy group, a styryl group, a methacryloxy group, an acryloxy group, an amino group, a ureido group, a chloropropyl group, a mercapto group, a sulfide group, an isocyanate group, and the like. These 1 type (s) or 2 or more types can be used.

As a silane coupling agent, as a specific example that is industrially easily available,
Vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, styryltrimethoxysilane,
2- (3,4 epoxy cyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane,
3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane,
3-acryloxypropylmethyldimethoxysilane, 3-acryloxypropyltrimethoxysilane, 3-acryloxypropylmethyldiethoxysilane, 3-acryloxypropyltriethoxysilane,
N-β- (aminoethyl) γ-aminopropyltrimethoxysilane, N-β- (aminoethyl) γ-aminopropyltriethoxysilane, N-β- (aminoethyl) γ-aminopropyltriisopropoxysilane, N -Β- (aminoethyl) γ-aminopropyltributoxysilane, N-β- (aminoethyl) γ-aminopropylmethyldimethoxysilane, N-β- (aminoethyl) γ-aminopropylmethyldiethoxysilane, N- β- (aminoethyl) γ-aminopropylmethyldiisopropoxysilane, N-β- (aminoethyl) γ-aminopropylmethyldibutoxysilane, N-β- (aminoethyl) γ-aminopropylethyldimethoxysilane, N -Β (aminoethyl) γ-aminopropylethyldiethoxysilane, N-β- (aminoethyl) γ Aminopropylethyldiisopropoxysilane, N-β- (aminoethyl) γ-aminopropylethyldibutoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropyltriisopropoxysilane, γ-aminopropyltributoxysilane, γ-aminopropylmethyldimethoxysilane, γ-aminopropylmethyldiethoxysilane, γ-aminopropylmethyldiisopropoxysilane, γ-aminopropylmethyldibutoxysilane, γ-aminopropylethyldimethoxy Silane, γ-aminopropylethyldiethoxysilane, γ-aminopropylethyldiisopropoxysilane, γ-aminopropylethyldibutoxysilane, γ-aminopropyltriacetoxysilane,
3-ureidopropylmethyldimethoxysilane, 3-ureidopropyltrimethoxysilane, 3-ureidopropylmethyldiethoxysilane, 3-ureidopropyltriethoxysilane, 3-chloropropylmethyldimethoxysilane, 3-chloropropyltrimethoxysilane, 3- Chloropropylmethyldiethoxysilane, 3-chloropropyltriethoxysilane, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropylmethyldiethoxysilane, 3-mercaptopropyltriethoxysilane,
Bis (triethoxysilylpropyl) tetrasulfide, bis (methyldimethoxysilylpropyl) tetrasulfide, bis (methyldiethoxysilylpropyl) tetrasulfide, bis (triethoxysilylpropyl) tetrasulfide,
3-isocyanatopropylmethyldimethoxysilane, 3-isocyanatopropyltrimethoxysilane, 3-isocyanatopropylmethyldiethoxysilane, 3-isocyanatopropyltriethoxysilane,
Etc. These can be used as they are, or can be used even when hydrolyzed and condensed with water contained in the solvent when used by being dissolved in water vapor or a solvent in the atmosphere.

Among these, from the viewpoint of adhesion, a silane coupling agent having an epoxy group, a methacryloxy group, an amino group, a mercapto group, or a sulfide group is preferable, and a silane coupling agent having an epoxy group or an amino group is more preferable.

Among the surface treatments, the primer coat treatment is preferable because it has an effect of improving minute adhesion and defects on the surface of the glass substrate and making it difficult to break, in addition to improving adhesion. As the primer, a commercially available primer such as polyethyleneimine, polyurethane, polyester, and acrylic may be used, or a resin solution in which a resin substantially the same as the resin base material used in the present invention is dissolved in a solvent is used as a primer. May be. In particular, a known primer can be preferably used from the viewpoint of adhesion.

The method of silane coupling agent coating treatment or primer coating treatment is not particularly limited, and a known method such as a dipping method, a spray coating method, a solution spin method, a solution blade method, a meniscus coating method, or a printing method may be used. it can.

The maximum thickness of the display substrate of the present invention is preferably 50 μm to 500 μm, and more preferably 50 μm to 300 μm. When the maximum thickness is 50 μm or more, handling properties are improved, and on the other hand, 500 μm or less is preferable because flexibility is improved.

The resin substrate used in the present invention is not particularly limited, but a substrate made of a transparent resin is preferable. Examples of the transparent resin include polycarbonate, polyethylene terephthalate, polyethylene naphthalate, polyarylate, polycycloolefin, and polyethersulphate. Mention may be made of at least one selected from the group consisting of Hong and polyacrylate. Among these, at least one selected from the group consisting of polycarbonate, polyethylene terephthalate, polyethylene naphthalate, polyarylate, polycycloolefin, and polyacrylate is preferable because of its small hygroscopic dimensional deformation, and in particular, polyethylene terephthalate and polyethylene naphthalate. Polycycloolefin is more preferable.

Among the examples of the resin, a polycycloolefin in which the resin base material itself has a low water absorption is most preferable. The film composed of polycycloolefin has high transparency with a total light transmittance of about 92%, and also has a water vapor transmission rate of about 1/10 of polyethylene terephthalate and about 1/40 of polycarbonate. Since it has the characteristic that performance is extremely high, it can be preferably used in the present invention.
Polycycloolefin is a polymer obtained by hydrogenating a polymer of cycloolefins having an ethylenic double bond in the ring, and Diels-Alder reaction of cyclopentadiene or dicyclopentadiene with the corresponding olefins. Examples thereof include polymers obtained by ring-opening (co) polymerizing and hydrogenating cycloolefins such as norbornene monomers condensed by the like. Examples of the corresponding olefin include ethylene, propylene, 1-butene, 2-butene, methyl acrylate, ethyl acrylate, cyclohexyl acrylate, acrylonitrile, and the like, with ethylene, propylene, methyl acrylate, and ethyl acrylate being preferred. . Examples of polycycloolefins include “Apel” (trade name) manufactured by Mitsui Chemicals, “Zeonor” (trade name) manufactured by Nippon Zeon Co., Ltd., and “Arton” (trade name) manufactured by JSR Corporation. “Topas” (trade name) manufactured by Ticona is readily available as a commercial product, and is particularly preferable.

There is no particular limitation on the method for producing the resin base material, and a known method such as a melt extrusion method, a solution casting method, or an inflation method can be used, and it may be unstretched, or may be stretched uniaxially or biaxially. Good.

The display substrate of the present invention can be produced by coating a glass base material with a resin base material and sealing with a resin substantially the same as the resin base material.
Examples of the sealing method include hot plate welding, vibration welding, ultrasonic welding, laser welding, impulse welding, high frequency induction heating welding, electromagnetic induction ripening welding, welding press bonding such as hot press welding, and solvent bonding.
Among these, laser welding, impulse welding, high frequency induction heating welding, electromagnetic induction ripening welding, hot press welding, and solvent adhesion are preferable because the possibility of breakage of the glass layer is low, and solvent adhesion is more preferable.

Solvent adhesion in the present invention means that the surfaces of the resin substrates to be bonded are dissolved or swollen with an organic solvent, and the resin molecules on the surfaces of both resin substrates are mixed with each other using the organic solvent as a medium. It means that it is adhered by volatilizing. In addition, in the solvent adhesion of the present invention, a resin solution obtained by dissolving substantially the same resin as the resin base material in an organic solvent can be used instead of the organic solvent used as a medium. When the resin bases are made of substantially the same resin, the resin forming the bonding portion is also formed of the substantially identical resin.

Hereinafter, the manufacturing method of the display substrate using the solvent bonding of the present invention will be specifically described.
As a first means of the manufacturing method, the glass base material is composed of the first and second resin base materials which have an area enough to cover the glass base material and are made of substantially the same resin. Coating. At that time, the glass base material is arranged so as to provide an adhesion allowance for both the first and second resin base materials on the entire outer periphery of the glass base material, and the adhesive allowances of both the resin base materials are overlapped to form a solvent adhesion. Seal with. Specifically,
A) After the glass substrate is disposed on the surface of the first resin substrate, the second resin substrate is covered with the glass substrate so as to be sandwiched between the first resin substrate and bonded. A method of solvent-bonding and sealing the bonding margin by infiltrating the organic solvent or the resin solution into all the gaps between the resin base materials formed in the portion of the margin (see FIG. 3),
B) A glass substrate is disposed on the surface of the first resin substrate. Next, the glass substrate is covered with a second resin substrate that is previously coated with the organic solvent or the resin solution on the entire surface in contact with the glass substrate, and the bonding margin of both resin substrates is solvent-bonded. , Sealing method (see FIG. 4),
C) After coating the organic solvent or the resin solution on the entire surface of the first resin substrate in advance, a glass substrate is placed on the coated surface, and then coated with the second resin substrate; A method of solvent-bonding and sealing the bonding allowance of both resin substrates (see FIG. 5),
D) Preliminarily coating the organic solvent or the resin solution on the entire surface of the first and second resin substrates, and then placing the glass substrate between the coated surfaces of both resin substrates, Next, a method in which the bonding allowance of both resin substrates is solvent-bonded and sealed (see FIG. 6)
Is mentioned.

Further, as a second means of the production method, the coating with the second resin base material can be performed by painting a resin solution dissolved in an organic solvent. In particular,
E) After the glass substrate is arranged on the first resin substrate, the resin solution is coated from above the glass substrate, and the glass substrate and the first resin substrate are bonded together. Then, the coated resin solution is dried and formed into a film to form the second resin base material, and at the same time, the bonding margin of the first resin base material is solvent-bonded and sealed (see FIG. 7).
Can be mentioned.

As described above, either an organic solvent or a resin solution can be used for solvent adhesion, but it is preferable to use a resin solution in order to improve defects at the edge of the glass substrate and make it difficult to break. The concentration of the resin solution is not particularly limited, but is preferably 0.01 to 30% by weight, more preferably 0.1 to 10% by weight. If it is 0.01% by weight or more, it is effective for improving defects at the edge of the glass substrate and making it difficult to break. On the other hand, if it is 30% by weight or less, the viscosity of the resin solution is preferably lowered.

The solvent used for the organic solvent or the resin solution is not particularly limited as long as the adhesive surface in the resin substrate dissolves or swells, but it is preferable to use a solvent having a low dissolution rate with respect to the resin substrate manufactured in advance. If the dissolution rate is high, surface roughness or the like may occur on the surface of the resin base material in the process of bonding and sealing, which is not preferable because the operation becomes complicated. For the dissolution rate, a solvent having a high solubility and a solvent having a low solubility are mixed, and a mixed solvent in which the dissolution rate is appropriately adjusted can be used. This can be appropriately performed by conducting a preliminary experiment on the resin substrate to be used. Can be determined.

As a method of heat-treating the organic solvent or the resin solution and volatilizing the organic solvent itself or the solvent contained in the resin solution, not only natural drying but also conductive heat, radiant heat, high frequency induction, heat press, vacuum press, etc. may be used. . Among these, a heat press and a vacuum press are preferable because the smoothness of the display substrate is improved.

In addition, other layers may be added according to various applications, such as a circularly polarizing filter, a light diffusion layer, various lens films, various color filters for improving color purity and color conversion, electrodes, and protective films. Etc.

The display substrate of the present invention is suitably used for a flat panel display substrate such as a liquid crystal display, an organic EL display, a plasma display, a field emission display, and electronic paper. It can also be used as a backlight substrate for liquid crystal displays, signals, neon signs, and the like.

EXAMPLES Hereinafter, although an Example demonstrates this invention, this invention is not limited by an Example.
[Measurement of water vapor permeability]
Measurement was performed under conditions of a temperature of 40 ° C. and a relative humidity of 90% in accordance with JIS Z0208 (cup method). The measurement limit of this evaluation is 0.03 g / m ² / day.
[Flexibility test]
After winding once around a 60 mmφ rod, the glass substrate was visually checked for cracks.

Production Example 1 (surface treatment of glass substrate)
A primer (Jujo Chemical Co., Ltd., Primer L) was applied to a 50 μm-thick alkali-free glass (manufactured by Matsunami Glass Industrial Co., Ltd., AF-45 10 cm square size) with a spin coater, followed by drying at room temperature and surface treatment of the glass substrate. It was. Next, the same surface treatment was performed on the back surface subjected to the surface treatment.

Production Example 2 (Production of resin base material)
A polycycloolefin (ARTON manufactured by JSR) solution adjusted to 30% by weight with toluene was applied to a 100 μm thick polycycloolefin film (ARTON 12 cm square size manufactured by JSR) with a spin coater at 100 ° C. The resin base material was created by drying under reduced pressure for 60 minutes.

Example 1 (Production of film substrate)
The glass substrate obtained in Production Example 1 was coated with the resin substrate obtained in Production Example 2 and the surface of the glass substrate was in contact with the glass substrate, and the resin exceeded the edges of all the glass substrates. The substrate was placed so that there was an excess part. Thereafter, vacuum pressing was performed at 150 ° C. for 2 minutes to produce the film substrate of the present invention. Subsequently, the water vapor permeability and the bending resistance test were evaluated by the above-described methods. The results are shown in Table 1.

Comparative Example 1
A film substrate was produced in the same manner as in Example 1 except that the glass substrate was not used. The results are shown in Table 1.

Comparative Example 2
One separator of a commercially available acrylic adhesive film (12 cm square size) sandwiched between double-sided separators is peeled off, and a roll laminator is applied to a polycycloolefin film (ARTON 12 cm square size manufactured by JSR) with a 100 μm thick exposed adhesive surface. The composite film of an acrylic adhesive film / polycycloolefin film was obtained. Next, the other separator of the composite film was peeled off, and the exposed adhesive surface was attached to the glass layer obtained in Production Example 1 using a roll laminator. Thereafter, a polycycloolefin film / acrylic adhesive film prepared in the same manner as described above was attached to the other glass layer to prepare a film substrate. The results are shown in Table 1.

Comparative Example 3
The glass substrate obtained in Production Example 1 was used as it was.

表１の結果より、ガラス基材を樹脂基材で被覆し、該ガラス基材が完全に外環境から遮断されるように、封止部の全てが樹脂基材と同一種の材料で封止された実施例１では、水蒸気バリア性が高く、優れた耐屈曲性を示した。一方、フィルム基材にガラス基材が存在しない比較例１や、樹脂基材にガラス基材を積層していても、樹脂基材と実質的に同一の材料より接合されていない比較例２では、水蒸気のバリア性は低いものであった。また、ガラス基材のみの比較例３では、水蒸気のバリア性は高いものの、耐屈曲試験において破損した。

From the results in Table 1, the glass substrate is covered with a resin substrate, and all the sealing portions are sealed with the same kind of material as the resin substrate so that the glass substrate is completely shielded from the outside environment. In Example 1, the water vapor barrier property was high and excellent bending resistance was exhibited. On the other hand, in Comparative Example 1 in which there is no glass substrate in the film substrate, or in Comparative Example 2 in which the glass substrate is laminated on the resin substrate, the material is not bonded from the same material as the resin substrate. The barrier property of water vapor was low. Further, in Comparative Example 3 using only the glass substrate, the water vapor barrier property was high, but it was damaged in the bending resistance test.

The perspective view which shows the 1st form in the sealing method of this invention (As an example, a substantially rectangular substrate) The top view of the display board | substrate after sealing by this invention (The glass layer coat | covered with the 2nd resin substrate which is an upper layer is shown with a broken line) The adhesion allowance of the resin base material provided in the periphery of the glass substrate is shown from an upper surface . Sectional drawing which shows the manufacturing method a) of this invention (it shows with the cross section in the A-A 'line main part of FIG. 2 which shows a sealing state) Sectional drawing which shows the manufacturing method a) of this invention (it shows by the cross section in the A-A 'line main part of FIG. 2 which shows a sealing state) FIG. 2 is a cross-sectional view showing the manufacturing method of the present invention (shown in a cross section taken along the line A-A 'in FIG. 2 showing a sealed state). Sectional view showing the manufacturing method d) of the present invention (shown in a section taken along the line A-A 'in FIG. 2 showing the sealed state) Sectional drawing which shows the manufacturing method e) which is the 2nd form in the sealing method of this invention (it shows by the cross section in the A-A 'line principal part of FIG. 2 which shows a sealing state)

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 1st resin base material 1 '1st resin base material 2 which coated the surface with resin solution 2nd resin base material 2' 2nd resin base material 2E which coated the surface with resin solution 2nd resin group Bonding portion 2P of material Resin solution 3 which is precursor of second resin base 3 Glass base 3 'Sealed glass base (perspective view)
4 Organic solvent or resin solution 10 infiltrated into the gap between the first and second resin base substrates 12 (sealed) end surface 12 Resin substrate (display substrate) sealing the first and second resin substrates )

Claims (11)

The glass substrate is arranged so as to provide an adhesion allowance along with the first and second resin base materials made of substantially the same resin on the entire outer periphery of the glass substrate,
The first resin base material and the second resin base material are overlapped with each other so that the glass substrate is sandwiched between the first resin base material and the second resin base material. the glass substrate coated with a resin substrate, by the first resin substrate and the second resin substrate and the same resin, method of manufacturing a flexible substrate for sealing the glass substrates.   The manufacturing method of the flexible substrate of Claim 1 whose said flexible substrate is a board | substrate for flexible FPD.   The manufacturing method of the flexible substrate of Claim 1 or 2 which adhere | attaches both said resin base materials by solvent adhesion.   The manufacturing method of the flexible substrate of Claim 3 which performs the said solvent adhesion | attachment using the resin solution which dissolved substantially the same resin as the said resin base material in the organic solvent.   The thickness of a glass substrate is 30 micrometers-200 micrometers, The manufacturing method of the flexible substrate in any one of Claims 1-4 characterized by the above-mentioned.   The maximum value of the thickness of the said board | substrate is 50 micrometers-500 micrometers, The manufacturing method of the flexible substrate in any one of Claims 1-5 characterized by the above-mentioned.   The resin constituting the resin base material is at least one selected from the group consisting of polycarbonate, polyethylene terephthalate, polyethylene naphthalate, polyarylate, polycycloolefin, polyethersulfone and polyacrylate. A method for producing a flexible substrate according to any one of claims 6 to 10.   The method for producing a flexible substrate according to claim 1, wherein the resin constituting the resin base material is polycycloolefin.   A flexible substrate obtained by the manufacturing method according to claim 1 is used for at least one of the counter substrates constituting the display element. The display element according to claim 9 , wherein the display element is a liquid crystal element. The display element according to claim 9, wherein the display element is an organic electroluminescence element.

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