JP4968720B2 - Electronic device substrate shape inspection apparatus, electronic device substrate shape inspection method, and mask blank glass substrate manufacturing method - Google Patents

Description

  The present invention relates to a shape inspection apparatus and a shape inspection method for an electronic device substrate such as a mask blank substrate used for manufacturing an electronic device, and a method for manufacturing a mask blank substrate.

  With recent rapid development of IT technology, further miniaturization is required for recent electronic devices, particularly color filters or TFT elements for semiconductor elements and liquid crystal monitors. One of the technologies that support such a fine processing technology is a lithography technology using a photomask called a transfer mask. In this lithography technique, a fine pattern is formed on a silicon wafer by exposing an electromagnetic wave or light wave of an exposure light source to a silicon wafer with a resist film through a photomask. This photomask is usually manufactured by forming a thin film pattern to be a transfer pattern by patterning the thin film using a lithography technique on a mask blank in which a thin film such as a light-shielding film is formed on a translucent substrate.

By the way, with the demand for further miniaturization of the pattern, the demand for the quality of the mask blank, which is the original for manufacturing the photomask, has become more severe.
Conventionally, a mask blank glass substrate is chamfered on a glass substrate cut into a rectangular shape of a predetermined size, and the main surface of the glass substrate is mirror-polished and formed on the periphery of the main surface of the glass substrate. The end surfaces (including the side surface of the substrate and the chamfered surface interposed between the side surface and the main surface) are also manufactured by polishing so as to have a predetermined mirror surface.

  The manufactured mask blank glass substrate performs an inspection (final inspection) on a predetermined evaluation item, and determines whether or not it conforms to a predetermined specification. As a result, the mask blank glass substrate determined to conform to the specifications is shipped as a product as it is, or a mask blank in which a thin film for forming a mask pattern is formed on this glass substrate is manufactured. Is done.

  By the way, inspection items at the time of shipment of the mask blank glass substrate include, for example, external dimensions, squareness, plate thickness dimensions, chamfered face width, side face width, corner radius R, notch mark (used for glass type identification, etc.), etc. It is. Conventionally, these inspection items are generally measured using a contact measuring instrument such as a caliper, a squareness measuring instrument, and a micrometer.

  However, in the method of performing inspection using a conventional caliper, a squareness measuring instrument, a contact measuring instrument such as a micrometer, the inspection efficiency does not increase, and there is a human variation among measurers, or the measuring instrument Defects such as scratches due to direct contact with the glass substrate are generated, and the quality is adversely affected. In addition, there is a problem that a re-polishing operation for removing generated scratches or the like is necessary, and depending on the degree of the defect, the product is originally passed but must be recycled. Furthermore, since the requirements for the quality of the mask blank are becoming stricter, higher measurement accuracy is required than before, and an inspection apparatus (inspection method) that can ensure high measurement accuracy by non-contact is provided. It is requested.

  The present invention has been made to solve the above-described conventional problems, and the object of the present invention is to first evaluate the evaluation items related to the electronic device substrate in one measurement, and to be in contact with the substrate. The second object is to provide an electronic device substrate shape inspection apparatus that can obtain high measurement accuracy. Second, it is possible to inspect evaluation items related to an electronic device substrate in a single measurement, without contact with the substrate, and to achieve high measurement. It is to provide a substrate shape inspection method for an electronic device capable of obtaining accuracy, and thirdly, to provide a method for manufacturing a mask blank substrate including a step of performing a substrate shape inspection by the electronic device substrate shape inspection method. It is.

In order to solve the above-mentioned problems, the present invention has the following configuration.
(Configuration 1) Shape detection means for optically detecting the shape of the substrate for electronic devices, shape information processing means for performing image processing as necessary on the detected shape information, and the detected shape information or the image A shape measuring means for measuring the shape of the substrate based on the processed shape information, the shape detecting means comprising a light receiving unit, reflecting light that has passed through at least a measurement site of the substrate, and receiving the light again An electronic device substrate shape inspection apparatus characterized in that an optical member is interposed in the optical path so as to return to the part.
(Configuration 2) A configuration in which an optical prism capable of adjusting an angle is disposed in an optical path between the light receiving unit and the substrate, and a light reflecting member capable of adjusting an inclination is disposed at a rear position of the substrate. The electronic device substrate shape inspection apparatus according to claim 1.
(Structure 3) The substrate shape for an electronic device according to Structure 1 or 2, wherein the substrate for an electronic device is a mask blank substrate having a main surface and an end face formed on a peripheral edge of the main surface. Inspection equipment.

(Configuration 4) Shape detection means for optically detecting the shape of the substrate for electronic devices, shape information processing means for performing image processing as necessary on the detected shape information, and the detected shape information or the image A shape measuring means for measuring the shape of the substrate based on the processed shape information, the shape detecting means comprising a light receiving unit, reflecting light that has passed through at least a measurement site of the substrate, and receiving the light again An electronic device substrate shape inspection method, wherein an optical member is interposed in an optical path so as to return to the portion, and the shape of the substrate is detected.
(Configuration 5) A configuration in which an optical prism capable of adjusting an angle is disposed in an optical path between the light receiving unit and the substrate, and a light reflecting member capable of adjusting an inclination is disposed at a rear position of the substrate. 4. The electronic device substrate shape inspection method according to 4.

(Structure 6) A mask blank substrate manufacturing method comprising a step of performing a substrate shape inspection by the electronic device substrate shape inspection method described in Structure 4 or 5.

  According to the first aspect of the present invention, there is provided a shape detection unit that optically detects the shape of the electronic device substrate, a shape information processing unit that performs image processing on the detected shape information as necessary, and the detection Shape measurement means for measuring the shape of the substrate based on shape information or shape information obtained by performing the image processing on the shape information, and the shape detection means includes a light receiving unit, and light that has passed through at least a measurement site of the substrate. Is a substrate shape inspection apparatus for electronic devices (hereinafter referred to as “substrate shape inspection apparatus”) in which an optical member is interposed in the optical path so as to reflect the light back to the light receiving section.

  According to the substrate shape inspection apparatus of configuration 1, the evaluation items related to the electronic device substrate can be automatically inspected by a single measurement, non-contact with the substrate, and the detection accuracy of the edge of the substrate is improved, thereby providing high shape measurement accuracy. Is obtained. Therefore, there is no human variability among conventional measurers, and since there is no contact with the substrate, there is no occurrence of defects such as scratches during measurement, and inspection with high measurement accuracy can be performed, and inspection efficiency is remarkably improved. be able to.

Further, according to the present invention, as in Configuration 2, as an optical member in the substrate shape inspection apparatus of Configuration 1, an optical prism capable of adjusting an angle is disposed in an optical path between the light receiving unit and the substrate, and the substrate A light reflecting member capable of adjusting the inclination is arranged at the rear position of the lens.
According to the substrate shape inspection apparatus of Configuration 2, by adjusting the angle of the optical prism and the inclination of the light reflecting member, the contrast is suitably increased to improve the detection accuracy of the edge of the substrate, thereby improving the accuracy of measuring the shape of the substrate. be able to. Here, a reflection mirror etc. are mentioned as a light reflection member. Further, by using, for example, an optical prism having an inclination of 45 degrees as the optical prism, the shape inspection of the end face of the substrate can be performed with high accuracy while the substrate is set horizontally with respect to the apparatus. it can.

  Further, as in Configuration 3, the present invention is suitable when the electronic device substrate is a mask blank substrate having a main surface and an end surface formed on the periphery of the main surface. This is because the requirements for the quality of the photomask blank are becoming stricter from the viewpoint of pattern miniaturization, and the requirements for the shape quality of the mask blank substrate are becoming stricter accordingly.

  In addition, as described in Configuration 4, the present invention provides a shape detection unit that optically detects the shape of the electronic device substrate, a shape information processing unit that performs image processing on the detected shape information as necessary, and A shape measuring means for measuring the shape of the substrate based on the detected shape information or the shape information obtained by performing the image processing on the detected shape information. The shape detecting means includes a light receiving unit and passes through at least a measurement site of the substrate. An electronic device substrate shape inspection method (hereinafter referred to as “substrate shape inspection method”) that detects the shape of the substrate by interposing an optical member in the optical path so as to reflect the reflected light back to the light receiving portion. It is.

  According to the substrate shape inspection method of configuration 4, the evaluation items related to the substrate for electronic devices can be automatically inspected by one measurement, non-contact with the substrate, and the detection accuracy of the edge of the substrate is improved and high shape measurement accuracy is achieved. Can be tested. Therefore, there is no human variability among conventional measurers, and since there is no contact with the substrate, there is no occurrence of defects such as scratches during measurement, and inspection with high measurement accuracy can be performed, and inspection efficiency is remarkably improved. be able to.

Further, according to the present invention, as in the configuration 5, as an optical member in the substrate shape inspection method of the configuration 4, an optical prism capable of adjusting an angle is disposed in an optical path between the light receiving unit and the substrate, and the substrate A light reflecting member capable of adjusting the inclination is arranged at the rear position of the lens.
According to the substrate shape inspection method of Configuration 5, by adjusting the angle of the optical prism and the inclination of the light reflecting member, the contrast is suitably increased to improve the detection accuracy of the edge of the substrate, thereby improving the accuracy of measuring the shape of the substrate. be able to. Here, a reflection mirror etc. are mentioned as a light reflection member. Further, by using, for example, an optical prism having an inclination of 45 degrees as the optical prism, the shape inspection of the end face of the substrate can be performed with high accuracy while the substrate is set horizontally with respect to the apparatus. it can.

  Further, as described in Configuration 6, according to the mask blank substrate manufacturing method including the step of performing substrate shape inspection by the substrate shape inspection method described in Configuration 4 or 5, there is no generation of defects during measurement, and the shape A mask blank substrate with good quality can be obtained.

According to the present invention, the evaluation items related to the substrate for electronic devices can be inspected by one measurement, there is no human variation among conventional measurers, and since there is no contact with the substrate, defects such as scratches at the time of measurement are eliminated. It is possible to provide a substrate shape inspection apparatus that can be inspected with high measurement accuracy without occurrence.
In addition, according to the present invention, evaluation items related to the substrate for electronic devices can be inspected by one measurement, there is no human variation among conventional measurers, and there is no contact with the substrate. It is possible to provide a substrate shape inspection method in which no defect is generated, high measurement accuracy is obtained, and inspection efficiency can be remarkably improved.

  In addition, according to the present invention, a mask blank can be obtained that includes a step of performing substrate shape inspection by the substrate shape inspection method of the present invention, so that a mask blank substrate having good shape quality can be obtained without generation of defects during measurement. The manufacturing method of the board | substrate can be provided.

The best mode for carrying out the present invention will be described below with reference to the drawings.
FIG. 1 is a block diagram of an embodiment of a substrate shape inspection apparatus according to the present invention, FIG. 2 is a block diagram of shape detection means in the substrate shape inspection apparatus of the present invention, and FIG. 3 is a plan view showing the arrangement of optical prisms. .
As shown in FIG. 1, a substrate shape inspection apparatus according to an embodiment of the present invention includes a shape detection means 1, an input means 2, a CPU (Central Processing Unit) 3, a display means 4, and a shape information processing means 5. And a shape measuring means 6.

  The shape detection means 1 optically detects the shape of an electronic device substrate (for example, a mask blank substrate). Specifically, for example, a digital color CCD video camera can be used. It is also preferable to provide a necessary optical system and illumination means for appropriately illuminating the measurement site.

The input means 2 is an input means such as a keyboard or a mouse, and performs input for executing shape inspection by the substrate shape inspection apparatus.
The CPU 3 is constituted by a CPU of a PC (personal computer), for example, and in accordance with a control program or the like in a storage means (hard disk or the like) of the PC (not shown), the shape detection means 1, the input means 2, the display means 4 and the like The data exchange between the shape information processing means 5 and the shape measurement means 6 is executed.
The display means 4 is a display (monitor screen) or an output device (printer) for displaying and outputting the result of shape inspection by the substrate shape inspection device.

The shape information processing means 5 performs image processing as needed on the shape information detected by the shape detection means 1. Image processing in this case includes, for example, correction of detected shape information, movement such as rotation, mutual conversion between a two-dimensional image and a three-dimensional image, and the like.
The shape measuring means 6 measures the shape of the substrate based on the detected shape information or the shape information obtained by performing the image processing on the detected shape information. That is, the shape measuring means 6 performs measurement in accordance with a measurement program that calculates, for example, the outer dimensions, perpendicularity, plate thickness, etc. of the substrate based on the detected shape information. The result is displayed by the display means 4.

Here, the shape measurement in the case of the glass substrate for mask blanks is demonstrated.
4A and 4B are a plan view and a cross-sectional view, respectively, of a mask blank glass substrate to be inspected.
The mask blank glass substrate 10 has double-sided main surfaces 21a and 21b and end surfaces formed on the peripheral edges of the main surfaces 21a and 21b. The end surfaces are also referred to as side surfaces of the substrate 10 (hereinafter also referred to as T surfaces). .) 23 and front and back chamfered surfaces (hereinafter also referred to as C surfaces) 22a and 22b interposed between the side surface 23 and the main surfaces 21a and 21b.

  As inspection items at the time of shipment of such a glass substrate 10 for mask blank, for example, external dimensions, perpendicularity, plate thickness dimensions, chamfered surface (C surface) width (from C surface width and end surface direction viewed from the main surface direction) The width of the C surface), the width of the side surface (T surface), the R radius of the corner, the dimensions (shape, size, number, etc.) of the notch marks 24a and 24b. In addition, regarding the notch mark, it is possible to automatically distribute materials by, for example, material manufacturers by determining the shape and the like by measuring the shape. FIG. 4A shows the case where the notch marks 24a and 24b are formed at two opposing corners on one side of the substrate. However, by determining the number of notch marks, for example, two notches are provided. If so, the glass type of the substrate can be automatically discriminated, such as synthetic quartz glass and soda lime glass.

  Therefore, the shape measuring means 6 is based on the shape information detected by the shape detecting means 1 (for example, the position information of a plurality of measurement points set on the edge of the substrate), the outer dimensions, the squareness, the plate thickness of the substrate. Measurement is performed according to a measurement program that calculates dimensions, chamfered surface (C surface) width, side surface (T surface) width, corner R radius, notch mark size, and the like.

  As described above, in the board shape inspection apparatus shown in FIG. 1, the CPU 3 starts processing according to the control program in response to an input instruction (inspection start instruction) by the input means 2, and the shape detection means 1, shape information processing means 5, Each of the shape measuring means 6 and the display means 4 executes a processing operation in accordance with a command from the CPU 3.

  And in the board | substrate shape test | inspection apparatus of this invention, the said shape detection means 1 is equipped with a light-receiving part, An optical member is reflected in the optical path so that the light which passed the at least measurement site | part of the said board may be reflected and returned to the said light-receiving part again. Intervene. That is, in the present embodiment, as shown in FIG. 2, the optical member is below the light receiving portion 7 of the shape detecting means 1 so that the end face of the mask blank glass substrate 10 set horizontally can be detected. The optical prism 8 capable of adjusting the angle is disposed in the optical path between the substrate 10 and the rear position of the substrate 10, that is, through the horizontally placed substrate 10, opposite to the optical prism 8. On the side, a reflection mirror 9 is disposed which can be adjusted in inclination in the direction of arrow B illustrated by the support member 12. The optical prism 8 is a 45 degree prism having a 45 degree inclined surface 8a, and the angle can be adjusted in the direction of the arrow A shown in the drawing, and the angle can be adjusted so that the 45 degree prism is shifted from 45 degrees. Further, in the present embodiment, two optical prisms 8 are provided as shown in FIG. 3 so that the two adjacent sides of the substrate can be seen simultaneously in the detection from the end face direction of the substrate 10 by the optical prism 8. (Prism 8A, 8B) is arranged. Moreover, the detection from the end face direction of the substrate 10 by the optical prism 8 is not one place, so that the entire side of the substrate can be measured, and all the substrates 10a, 10b, and 10c having different sizes can be supported. Each of the two optical prisms 8A and 8B is configured to be movable within the range of the arrow C or the arrow D shown along the side of the substrate. The reflection mirror 9 may also be configured to be movable corresponding to the optical prism, or may be configured to have a width in the side direction of the substrate, although it is not movable. The substrate (for example, 10c) is set horizontally on a stage (not shown) by two positioning members 13a and 13b and two receiving members 14a and 14b, and the stage is movable in the horizontal direction. However, when measuring the main surface of the substrate 10, the optical prism 8 (8 </ b> A, 8 </ b> B) does not need to be positioned below the light receiving unit 7.

  In the measurement from the end face direction of the substrate 10, the optical prism 8 having an inclination of, for example, 45 degrees is used as in the present embodiment, and the prism light L (see FIG. 2) that has passed through at least the measurement site of the substrate 10 is reflected. By reflecting the light on the mirror 9 and returning it to the light receiving unit 7 again, the influence of the light diffraction phenomenon (for example, the plate thickness value becomes small) can be eliminated, and for both thick plate products and thin plate products. It is possible to measure with good reproducibility without re-adjustment.

By using the optical prism 8, the shape inspection can be performed with high accuracy on the end surface of the substrate 10 while the substrate 10 is set horizontally with respect to the apparatus. Further, in the measurement from the end face direction of the substrate 10 described above, the angle of the optical prism 8 and the inclination of the reflection mirror 9 are appropriately adjusted in advance so that the edge of the substrate can be clearly seen in the field of view by increasing the contrast. Is preferred. Thereby, the detection accuracy of the edge of the substrate 10 can be improved, and the shape measurement accuracy of the substrate can be improved.
In the present embodiment, as shown in FIG. 2, the condensing lens 11 is arranged between the optical prism 8 and the substrate 10. However, when measuring, there is no particular problem with the focusing lens. 11 may be omitted.

  According to the substrate shape inspection apparatus of the present invention, for example, all evaluation items related to a mask blank substrate can be measured at one time, and there is no human measurement variation among conventional measurers, and automatic inspection can be performed with high measurement accuracy. Moreover, the inspection time per substrate can be greatly shortened compared to the conventional case, and the inspection efficiency can be remarkably improved. Further, since it is not in contact with the substrate, there is no occurrence of defects such as scratches at the time of measurement, which is suitable for final inspection at the time of shipment of the mask blank substrate.

  The present invention also provides a shape detection means for optically detecting the shape of the substrate for an electronic device, a shape information processing means for performing image processing as necessary on the detected shape information, and the detected shape information or the same. A shape measuring unit for measuring the shape of the substrate based on the shape information subjected to the image processing, the shape detecting unit includes a light receiving unit, reflects light that has passed through at least a measurement site of the substrate, and again There is also provided a substrate shape inspection method for detecting the shape of the substrate by interposing an optical member in the optical path so as to return to the light receiving portion.

Further, as an optical member in the above-described substrate shape inspection method, an optical prism whose angle can be adjusted is disposed in the optical path between the light receiving unit and the substrate, and a light reflecting member whose tilt can be adjusted at a rear position of the substrate. Arranging is a preferred embodiment.
Note that the shape detection means, shape information processing means, shape measurement means, and the like in the above-described substrate shape inspection method are the same as those in the above-described substrate shape inspection apparatus.

  Further, according to the method for manufacturing a mask blank substrate including the step of performing substrate shape inspection by the substrate shape inspection method of the present invention (or using the substrate shape inspection apparatus of the present invention), the occurrence of defects during measurement is caused. Thus, a mask blank substrate having good shape quality can be obtained.

  The present invention is suitable for shape inspection of a mask blank substrate. The demand for the quality of the photomask blank is becoming stricter from the viewpoint of pattern miniaturization, and the demand for the shape quality of the mask blank substrate is also becoming strict accordingly. In the present embodiment, the case where the shape inspection of the glass substrate for mask blank using the substrate shape inspection apparatus of the present invention is mainly described, but the present invention is not limited to this, for example, for mask blank. The present invention is also preferable for shape inspection of a substrate with a film (mask blank) on which a thin film for forming a mask pattern is formed on a glass substrate or a substrate (photomask) on which a mask pattern is formed by patterning the thin film. Can be applied.

Hereinafter, embodiments of the present invention will be described more specifically with reference to examples.
The shape inspection of the glass substrate for mask blanks was performed using the substrate shape inspection apparatus of the present invention.
The substrate shape inspection apparatus used in this example is equipped with a digital color CCD video camera (number of pixels: 768 × 494) as a shape detection means, and is optically inclined at 45 degrees with respect to the substrate set horizontally. The prism, the condenser lens, and the reflection mirror are arranged as shown in FIGS.

For the mask blank glass substrate, a synthetic quartz glass substrate (about 152 mm × about 152 mm × about 6.5 mm) is chamfered and ground, and a glass substrate that has undergone rough polishing is set in a double-side polishing apparatus. Then, the glass substrate (152 mm × 152 mm × 6.5 mm) finished by performing precision polishing on the main surface of the substrate and further polishing the end surface of the substrate.
Using the substrate shape inspection apparatus, the shape inspection of the mask blank glass substrate finished as described above was performed.

  First, the measurement points 1 to 17 (see FIG. 5) of the substrate were detected by the shape detection means of the substrate shape inspection apparatus. That is, measurement points 1 to 8 related to the external dimensions and perpendicularity of the substrate, plate thickness dimensions of the substrate, chamfered surface (C surface) width, measurement points 9 to 13 related to the side surface (T surface), corner radius R, notch Measurement points 14 to 17 related to mark dimensions (shape, size, number). It is to be noted that illumination is appropriately used for the measurement site, and in particular, for each measurement point on the substrate end surface side, the angle of the optical prism and the reflection mirror are set in advance so that the edge contrast is increased so that the edge can be clearly seen in the field of view. The tilt was adjusted. Thereby, the detection accuracy of the measurement point of the edge of a board | substrate can be improved, and the shape measurement precision of a board | substrate can be improved. Further, when viewed through the optical prism, the shape inspection can be performed with high accuracy on the end face of the substrate while the substrate is set horizontally with respect to the apparatus.

Based on the position information of each measurement point detected as described above, the shape measuring means of the board shape inspection apparatus performs external dimensions, perpendicularity, plate thickness dimensions, chamfered surface width, side width, corner R radius, notch. The mark dimension was measured, and the result was displayed on the monitor screen (display means) of the substrate shape inspection apparatus. The shape measuring means is based on the detected position information of each measurement point according to a program that calculates the external dimensions, squareness, plate thickness dimensions, chamfered face width, side face width, corner radius R, and notch mark dimensions. Perform the measurement.
Next, in order to confirm the reproducibility of each measurement value, the above shape inspection was repeated 50 times with the substrate set, and it was confirmed that the reproducibility of each measurement value was good.

As described above, according to the substrate shape inspection apparatus of the present invention, all evaluation items related to the mask blank substrate can be measured at one time, and there is no human measurement variation among conventional measurers, and high measurement accuracy (outer shape) Automatic inspection can be performed at about ± 1.5 μm for dimensions and about 2 seconds for squareness. Moreover, according to the present embodiment, the inspection time per substrate is about 120 seconds, which can be significantly reduced compared to the conventional inspection time (for example, about 40 seconds per inspection item). The efficiency can be remarkably improved.
Further, 50 mask blank glass substrates were prepared in the same manner as in the present example, and the substrate shape inspection was similarly performed on these. As a result, no substrate defect was observed during the inspection. Therefore, the present invention is preferably used for final inspection at the time of shipment of a mask blank substrate.

  In addition, although the present Example demonstrated the case where the shape inspection of the glass substrate for mask blanks using the substrate shape inspection apparatus of this invention was performed, this invention is not restricted to this, For example, on the glass substrate for mask blanks The present invention can also be applied to shape inspection of a film-coated substrate (mask blank) on which a thin film for forming a mask pattern is formed, a substrate (photomask) on which the thin film is patterned to form a mask pattern, and the like. .

It is a block diagram of the board | substrate shape inspection apparatus of this invention. It is a block diagram of the shape detection means in the board | substrate shape inspection apparatus of this invention. It is a top view which shows arrangement | positioning of an optical prism. It is (a) top view and (b) sectional drawing of the glass substrate for mask blanks to be examined. It is the figure seen from the (a) top view and (b) end surface direction for demonstrating an example of the measurement point of the glass substrate for mask blanks which is a test object.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Shape detection means 2 Input means 3 Central processing unit (CPU)
4 Display means 5 Shape information processing means 6 Shape measuring means 7 Light receiving portion 8 Optical prism 9 Reflecting mirror 10 Mask blank glass substrate 11 Lenses 13a and 13b Positioning members 21a and 21b Main surfaces 22a and 22b Chamfered surfaces (C surface)
23 Side (T surface)
24a, 24b Notch mark

Claims (3)

Shape detection means for optically detecting the shape of the substrate for an electronic device, shape information processing means for performing image processing as necessary on the detected shape information, and the detected shape information or the image processing applied thereto A shape measuring means for measuring the shape of the substrate based on the shape information,
The electronic device substrate is a quadrangular mask blank glass substrate having a main surface and an end surface formed on the periphery of the main surface;
The shape detecting means includes a light receiving unit, can detect an end face of the substrate set horizontally with respect to the apparatus, and reflects light that has passed through at least a measurement site of the substrate to return to the light receiving unit again. As described above, an optical prism having a 45-degree inclined surface capable of adjusting the angle is disposed in the optical path between the light receiving unit and the substrate, and is inclined to the rear position of the substrate. Place an adjustable light reflecting member,
Two optical prisms are arranged so that two adjacent sides of the substrate can be detected simultaneously, and further, the two prisms can be detected so that the entire sides of the substrate can be detected and the substrates can be of different sizes. Are configured to be movable within a predetermined range along the side of the substrate, respectively . Shape detection means for optically detecting the shape of the substrate for an electronic device, shape information processing means for performing image processing as necessary on the detected shape information, and the detected shape information or the image processing applied thereto A shape measuring means for measuring the shape of the substrate based on the shape information,
The electronic device substrate is a quadrangular mask blank glass substrate having a main surface and an end surface formed on the periphery of the main surface;
The shape detecting means includes a light receiving unit, can detect an end face of the substrate set horizontally with respect to the apparatus, and reflects light that has passed through at least a measurement site of the substrate to return to the light receiving unit again. As described above, an optical prism having a 45-degree inclined surface capable of adjusting the angle is disposed in the optical path between the light receiving unit and the substrate, and is inclined to the rear position of the substrate. Place an adjustable light reflecting member,
A substrate shape inspection method for an electronic device , wherein an angle of the optical prism and an inclination of the reflection mirror are adjusted to detect the shape of the substrate. The manufacturing method of the glass substrate for mask blanks including the process of performing a substrate shape test | inspection by the substrate shape test | inspection method for electronic devices of Claim 2 .

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