JP4842534B2 - Separation method of adhesive - Google Patents

Description

  The present invention relates to an adhesive separating method for separating a pair of adherends from each other, for example, in order to recycle an adhesive composed of a pair of adherends joined (adhered) to each other by an adhesive layer.

  The original function of the adhesive is to “join the substance”. “Adhesion” using an adhesive for bonding has various advantages (for example, stress is uniformly distributed, dissimilar materials can be connected, weight is reduced, etc.). On the other hand, when a pair of adherends are joined (adhered) using an adhesive, there is a disadvantage that it is difficult to disassemble an adhesive layer made of the adhesive and the like and joined to each other. Yes.

  As described above, a bonding method for bonding a pair of adherends to each other using an adhesive is used in many fields such as building materials, automobile parts, office supplies, home appliances, and electronic products. It has been. In recent years, these products are required to recycle the adherend described above from the viewpoints of environmental problems and resource depletion problems.

  As described above, when recycling a pair of adherends joined together by an adhesive, of course, the pair of adherends must be separated from each other. As a method for separating an adhesive bonded with an adhesive, the following methods have heretofore been performed.

  When an adhesive whose main component is a thermoplastic resin is used as the adhesive that constitutes the above-mentioned adhesive layer, first, the adhesive layer is softened by heating to reduce the mechanical strength of the adhesive layer. Let At this time, using a heating press, the adhesive layer for each adherend is pressurized while being heated, and the adhesive layer of the adhesive is softened. Thereafter, after the adherends are separated from each other, a method for recovering these adherends is performed.

  In addition, a method of recovering these adherends after the adherends are separated from each other by pressurizing the adhesive layer for each adherend using a known press machine or the like is used.

  The adhesive mainly composed of the thermoplastic resin described above has limited heat resistance due to its properties, or has a low basic adhesive strength, so the applicable range is limited. Further, in the above-described method, when separating the adherends bonded to each other using an adhesive made of a thermosetting resin, the required time is prolonged and the working efficiency is low. In addition, in the conventional method described above, the work time is prolonged when separating the adherends bonded to each other using an adhesive made of a thermosetting resin. End up. For this reason, damaging the adherend is not desirable from the viewpoint of recycling.

  Accordingly, an object of the present invention is to provide a method for separating an adhesive that can easily and reliably separate a pair of adherends bonded to each other using an adhesive without damaging them.

In order to achieve the above-described object, the method for separating an adhesive body according to the present invention includes a pair of adherends having a pair of adherends bonded to each other by an adhesive layer. In the method of separating from each other, at least one of the pair of pressing members that are ultrasonically vibrated and the direction in which the pair of adherends overlap each other intersect each other, clamping the adhesive body Mutotomoni, contacting the pair of the pair of pressing members on both of the pair of adherends exposed at the end face of the laminate that said adhesive layer and the adherend are laminated to each other, no less In both cases, the pair of adherends are separated from each other by ultrasonically vibrating one pressing member and applying the ultrasonic vibration to the end face.

The method of separating the adhesive body of the present invention described in claim 2 is the method of separating the adhesive of claim 1, wherein the adherend is made of a metal, and is pre-Symbol ultrasonic vibration, the end surface It is characterized by vibrating along the direction intersecting

The method of separating the adhesive body of the present invention described in claim 3 is the method of separating the adhesive of claim 1, wherein the adherend is made of synthetic resin, and the previous SL ultrasonic vibration, the It is characterized by vibrating along a direction parallel to the end face.

  In other words, the inventors of the present invention, as a method for separating an adhesive, that is, a method for peeling an adhesive layer, prevents fatal damage to the adherend, and further provides an adhesive layer that is hidden by the adherend and cannot be seen. The method which can peel in a short time was studied earnestly. The destruction of the adhesive layer made of an adhesive is easy if the adhesive layer can be simply heated. However, when the adhesive body for each adhesive layer is simply heated, the adherend is also broken. Therefore, energy must be transmitted to the adhesive layer so that the adherend is not broken.

  Here, the inventors of the present invention paid attention to “vibration” as being capable of imparting high energy to the interface between the adherend and the adhesive layer (hereinafter referred to as an adhesive interface) or the adhesive layer in a short time. “Vibration” includes macro vibration and micro vibration. The former is like shaking with a hand or using a vibrator, and the latter refers to ultrasonic vibration. The present invention lies in the essence of how to apply ultrasonic energy intensively to the part that needs to be peeled off. Therefore, as a result of intensive studies, the present inventors have found the following matters.

  That is, the present invention provides an adhesive body in a state where a direction in which a pair of adherends bonded by an adhesive layer overlap each other and a direction in which at least one of a pair of pressing members that vibrate ultrasonically cross each other intersect. This is a method for separating an adhesive body that can be easily separated from an adherend and an adhesive layer by sandwiching between a pair of pressing members and applying ultrasonic vibration to the adhesive layer in particular.

  According to the method for separating an adhesive body of the present invention described in claim 1, since ultrasonic vibration acts on the end surface of the laminated portion, the ultrasonic vibration can be efficiently transmitted to the adhesive layer. For this reason, it is possible to suppress the fatal adherend damage and to efficiently separate the adherend adherend in a short time. Moreover, since the thermosetting adhesive can be used as the adhesive used in the present invention, the application range of the present invention is practical and very wide.

A direction in which the pair of adherends bonded by the contact adhesive layers overlap each other, in a state where the opposite directions to each other to intersect each other of the pair of pressing members, so sandwiching the adhesive body between a pair of pressing members, adhesives The ultrasonic vibration can be efficiently transmitted to the layer.

According to the method for separating an adhesive body of the present invention described in claim 2 , the ultrasonic vibration vibrates along the direction intersecting the end face. Thereby, the mechanical strength of the adhesive layer between the pair of adherends can be reliably reduced .

According to the method for separating an adhesive body of the present invention described in claim 3 , the ultrasonic vibration vibrates along a direction parallel to the end face. Thereby, the mechanical strength of the adhesive layer between the pair of adherends can be reliably reduced .

  The ultrasonic vibration referred to in the present invention refers to vibration obtained by converting electrical energy into mechanical vibration. For example, ultrasonic vibration is generated when a voltage is applied to the piezoelectric vibrator and the piezoelectric vibrator vibrates. The ultrasonic vibration is transmitted to at least one pressing member that pressurizes the adhesive in the direction in which the adherends approach each other, and is transmitted to the adhesive layer through at least one pressing member.

  The ultrasonic vibration propagated to the adhesive layer is excited by energy in the adhesive layer and destroys only the adhesive layer. Therefore, energy can be selectively concentrated only on the adhesive layer. For this reason, fatal damage to adherends can be prevented and adherends can be separated from each other. In order to promote the propagation of the ultrasonic vibration according to the present invention, the oscillation frequency, the oscillation time, the oscillation amplitude, the longitudinal vibration and the lateral vibration are important factors. Accordingly, it is greatly affected by the size, thickness, and material of the adherend and the adhesive layer, and therefore it is preferably determined according to the conditions to be implemented. Note that the longitudinal vibration means that at least one pressing member vibrates along the direction in which the pair of pressing members face each other. Further, the lateral vibration indicates that at least one pressing member vibrates along a direction intersecting (orthogonal) with a direction in which the pair of pressing members face each other.

  The application time of the ultrasonic vibration of the present invention is preferably 1 second or less to several seconds. Accordingly, the time required is shorter and the efficiency is higher than when the strength of the adhesive layer is reduced to the same strength by means of simply heating the adhesive layer for each adherend, such as an oven, or a heating press. Further, even if the adhesive is heated for the same time as the time of applying the ultrasonic vibration of the present invention by means of simply heating the adhesive layer for each adherend such as an oven or a heating press, the adhesive layer The mechanical strength cannot be reduced sufficiently. Furthermore, there is no fatal damage (decrease in mechanical strength due to heating) of the adherend due to thermal deterioration or the like which is a concern in the means for simply heating the adhesive layer for each adherend.

  Further, in the method of the present invention, when the ultrasonic vibration of longitudinal vibration is applied to the bonded body, the rate of decrease in the strength of the adhesive layer is larger than when ultrasonic vibration of lateral vibration is applied under the same conditions. . That is, the ultrasonic vibration of the longitudinal vibration can further reduce the mechanical strength of the adhesive layer between the pair of adherends than the ultrasonic vibration of the lateral vibration.

  Although it does not specifically limit as an adhesive agent which comprises the adhesive bond layer said by this invention, If it classify | categorizes roughly according to the property, it can distinguish into a non-reactive type and a reactive type. The non-reactive type means a type that does not cause a bond due to a chemical reaction in the adhesive layer, and the reactive type is a type that causes a chemical bond after reaction regardless of two-dimensional or three-dimensional. Means things.

  Examples of the non-reactive type include vinyl acetate resin type (including emulsion type and solvent type), polyvinyl alcohol type, polyvinyl acetal type (including butyral and formal), vinyl chloride type, acrylic resin type (emulsion type, cyanoacrylate type). ), Polyamide, polyethylene, EVA (ethylene / vinyl acetate copolymer) adhesives, chloroprene rubber (including solvent and latex types), nitrile rubber (solvent, latex, and film types) Styrene butadiene rubber (including solvent type and latex type), SIS rubber, SBS rubber, SEBS rubber, SEPS rubber, and the like.

  In addition, as the reactive adhesive, two-component curing type such as urea resin type, melamine resin type, phenol resin type, resorcinol type, epoxy resin type, polyurethane type, polysulfide type (including epoxy mixed type and sealant type), etc. Adhesives: Thermosetting adhesives such as polyimides and polybenzimidazoles; Moisture curable adhesives such as polyurethanes, silicone rubbers, and modified silicones. Other examples include those that undergo a crosslinking reaction with ultraviolet rays, electron beams, or the like, and conversely cure only under anaerobic conditions.

  Two or more kinds of the adhesives may be used in combination. In addition, the adhesive classified as the non-reactive type may be accompanied by a reaction depending on a special situation, and in such a case, it is treated as a reactive type.

  Among the above adhesives, it is particularly preferable for the method of the present invention to use a reactive adhesive. In the conventional method, only the thermoplastic adhesive can efficiently separate the bonded body. However, thermoplastic adhesives have the disadvantage of poor normal adhesion and heat resistance due to their properties. According to the method of the present invention, the reactive adhesive can be peeled off. Examples of the reactive adhesive include epoxy systems that are cured by chemical reaction of two liquid components, polyurethane systems that require moisture (moisture) in addition to heat, silicone rubber systems, and modified silicone systems. Other examples include those that undergo a crosslinking reaction with ultraviolet rays, electron beams, or the like, or are cured only under anaerobic conditions. In particular, the combined use of the modified silicone type and the epoxy type is preferable in that it is easy to freely change the design of viscoelasticity.

  Among the above adhesives, it is preferable to use a reactive adhesive because of the nature of ultrasonic vibration, when the peeling method of the present invention is used for the reactive adhesive, the heat resistance and strength after curing adhesion It is particularly effective in that it is easy to remove and does not damage the adherend while taking advantage of the property of improving.

  The adherend referred to in the present invention is an article made of a metal such as aluminum, stainless steel, copper, iron, titanium, or silicon, or an article made of an inorganic substance (inorganic compound) such as pottery (ceramics) or slate. In addition, articles made of organic substances (organic compounds) such as polycarbonate, acrylic resin, ABS (Acrylonitrile-butadiene-styrene) resin, silicone resin, polyester, polypropylene, polyethylene, polyvinyl chloride, polyamide, wood, MDF Shows articles made of woody material, such as particle board. The adherend is composed of the above-described various substances, and includes various parts (mainly structural parts) such as building materials, automobile parts, office supplies, home appliances, and electronic products.

  As described above, the present invention described in claim 1 propagates ultrasonic vibrations to the adhesive layer, destroys the adhesive layer or causes a decrease in the strength of the adhesive layer, and peels off due to a decrease in the adhesive force at the adhesive interface. Make it possible. Unlike the destruction of the adhesive layer by normal heating, the adherend can be concentrated and applied to the adhesive layer rather than simultaneously heating the adherend. This makes it possible to use an adhesive that retains excellent adhesion without being affected by environmental temperature, has excellent storage stability, and has a wide selection range of adherends (that is, thermosetting and reactive adhesives). Thus, the pair of adherends joined together can be easily and reliably separated.

  In addition, energy can be applied to the adhesive layer instead of heating the adherends at the same time, so fatal adherend damage can be suppressed, and the adherend adherends can be efficiently attached to each other in a short time. Can be separated. Furthermore, since the thermosetting adhesive can be used as the adhesive constituting the adhesive layer used in the present invention, the scope of application of the present invention is practical and very wide.

  Furthermore, since the adherend is not heated at the same time, the degree of freedom in selecting the material of the adherend is great.

The ultrasonic vibration to the contact adhesive layer can be transmitted efficiently. Therefore, the ultrasonic vibration is propagated to the adhesive layer, the adhesive layer is broken or the strength of the adhesive layer is reduced, and peeling due to a reduction in the adhesive force at the adhesive interface is enabled.

The present invention described in claim 2, it is possible to reliably reduce the mechanical strength of the adhesive layer between the pair of adherends, can reliably separate the adherend one pair of the adhesive body.

The present invention described in claim 3, it is possible to reliably reduce the mechanical strength of the adhesive layer between the pair of adherends, can reliably separate the adherend one pair of the adhesive body.

  Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 1 to 5. The method for separating an adhesive according to an embodiment of the present invention is performed by applying a pair of adherends 2 of the adhesive 1 shown in FIGS. 1 and 2 to the ultrasonic vibration applying device 3 (ultrasonic wave) shown in FIGS. This is a method of separating from each other using a welding apparatus, a ultrasonic welding apparatus, or an ultrasonic welding apparatus.

  The adhesive body 1 includes a pair of adherends 2 and an adhesive layer 4 as shown in FIGS. 1 and 2. The adherend 2 is formed in a flat plate shape in the illustrated example. The adherend 2 includes various parts (mainly structural parts) such as the products described above. The adherend 2 is made of the above-described substance.

  The adhesive layer 4 is provided between the pair of adherends 2 and joins (adheres) the adherends 2 to each other. The adhesive layer 4 is obtained by curing a known liquid, sol, or gel adhesive between the pair of adherends 2. The adhesive joins the pair of adherends 2 to each other. For this reason, the adhesive layer 4 is made of a known adhesive.

  As the adhesive constituting the adhesive layer 4, those described above can be used.

  In the adhesive body 1 described above, an adhesive layer 4 is formed between a pair of adherends 2, and the adherend body 2 and the adhesive layer 4 are overlapped with each other along an arrow X in FIG. 1. (Layered). The arrow X is in a direction in which the pair of adherends 2 described in the present specification overlap each other, and is orthogonal (crossed) to the surface of the adherend 2. Further, the adhesive body 1 is formed with a laminated portion 1a in which a pair of adherends 2 and an adhesive layer 4 are laminated with each other. Moreover, the end surface 1b of the laminated portion 1a in the present specification indicates a surface on which the pair of adherends 2 and the adhesive layer 4 are flush with each other and exposed.

  As shown in FIG. 3, the ultrasonic vibration applying device 3 includes a piezoelectric vibrator 5 as a driving source, a chip 6 as a pressing member, an anvil 7 as a pressing member, a pressure machine (not shown), and a pair of fixed members. A jig 8 is provided. The piezoelectric vibrator 5 is ultrasonically vibrated by being applied by a power source (not shown). At this time, the piezoelectric vibrator 5 vibrates ultrasonically along the arrow Z or the arrows X1 and X2 in FIG.

  The arrow Z forms a direction in which the tip 6 and the anvil 7 face each other with a space therebetween, that is, a direction in which the pair of pressing members face each other, and a direction intersecting the end surface 1b. The arrow X1 is perpendicular to (intersects) the arrow Z. The arrow X2 is perpendicular to (intersects) both the arrow Z and the arrow X1. In the present specification, the vibration of the piezoelectric vibrator 5 along the arrow Z is called longitudinal vibration, and the vibration of the piezoelectric vibrator 5 along the arrow X1 or X2 is called lateral vibration. Arrows X1 and X2 form an arrow Z, that is, a direction intersecting with a direction in which the pair of pressing members face each other, and a direction parallel to the end face 1b.

  The ultrasonic vibration refers to vibration obtained by applying electric voltage to the piezoelectric vibrator 5 to vibrate the piezoelectric vibrator 5 to convert electrical energy into mechanical vibration.

  The chip 6 is attached to the piezoelectric vibrator 5. For this reason, the chip 6 vibrates along the arrow Z or the arrows X1 and X2 by the ultrasonic vibration of the piezoelectric vibrator 5. The anvil 7 is opposed to the tip 6 with a gap. The anvil 7 sandwiches the adhesive body 1 as an object to be peeled between the chip 6. The pressurizer presses the tip 6 and the anvil 7 in a direction approaching each other. The pressurizer can change the weight value (pressure value) for pressurizing the chip 6 and the anvil 7.

  The pair of fixing jigs 8 are arranged at intervals from each other along a direction intersecting (orthogonal) with respect to a direction (arrow Z) in which the tip 6 and the anvil 7 face each other. Further, the pair of fixing jigs 8 positions the adhesive body 1 as an object to be peeled sandwiched between the chip 6 and the anvil 7 between each other. One fixing jig 8 fixes one adherend 2 of the bonded body 1 with the one sandwiched body 2 interposed therebetween. The other fixing jig 8 fixes the other adherend 2 of the adhesive 1 with the other adherend 2 interposed therebetween.

  The ultrasonic vibration applying device 3 sandwiches the adhesive body 1 as an object to be peeled between the chip 6 and the anvil 7. At this time, the direction in which the tip 6 and the anvil 7 face each other (arrow Z) and the direction in which the pair of adherends 2 overlap each other (arrow X) cross each other (orthogonal), and the tip 6 and the anvil 7 The adhesive body 1 is sandwiched between the two. Further, one adherend 2 is fixed to one fixing jig 8, and the other adherend 2 is fixed to the other fixing jig 8. Of course, the chip 6 contacts the end surface 1b of the laminated portion 1a in which the pair of adherends 2 of the adhesive 1 and the adhesive layer 4 disposed between the adherends 2 are laminated together.

  Then, the ultrasonic vibration applying device 3 applies a voltage to the piezoelectric vibrator 5 to ultrasonically vibrate in a state where the tip 6 and the anvil 7 are pressurized in a direction approaching each other by a pressurizer, and this ultrasonic vibration is applied. Is transmitted to the chip 6. Then, the ultrasonic vibration applying device 3 applies ultrasonic vibration to the end surface 1b of the laminated portion 1a of the adhesive body 1 as an object to be peeled sandwiched between the chip 6 and the anvil 7. As described above, the ultrasonic vibration applying device 3 generates ultrasonic vibration by applying the vibration to the piezoelectric vibrator 5 and vibrating the piezoelectric vibrator 5. Then, the ultrasonic vibration applying device 3 is provided on the end surface 1b of the laminated portion 1a in which the pair of adherends 2 and the adhesive layer 4 disposed between the adherends 2 are laminated with each other via the chip 6. Transmits ultrasonic vibrations. In this way, the ultrasonic vibration applying device 3 causes the ultrasonic vibration to act on the end surface 1b of the laminated portion 1a.

  When the pair of adherends 2 of the bonded body 1 are separated from each other using the ultrasonic vibration applying device 3 described above, the chip 6 and the anvil 7 are bonded as shown in FIGS. The body 1 is sandwiched. And after pressurizing with a pressurizer, it applies to the piezoelectric vibrator 5 and an ultrasonic vibration is generated. The generated ultrasonic vibration is transmitted to the pair of adherends 2 and the adhesive layer 4 through the chip 6. At this time, since the tip 6 and the anvil 7 are pressurized in a direction approaching each other by the pressurizer, the tip 6, the pair of adherends 2, and the adhesive layer 4 are integrated by the ultrasonic vibration. Vibrate. Then, the adhesive layer 4 is heated by the ultrasonic vibration, and the adhesive layer 4 is broken or the mechanical strength of the adhesive layer 4 is lowered, and the adhesive force at the adhesive interface is lowered by the ultrasonic vibration.

  In this way, ultrasonic vibration is applied (acted) to the adhesive layer 4 through the chip 6. Then, the vibration of the piezoelectric vibrator 5 of the ultrasonic vibration applying device 3 and the pressurization by the pressurizer are stopped, and the adhesive 1 is removed from between the chip 6 and the anvil 7.

  And even if the adhesive layer 4 reduces the mechanical strength, when the pair of adherends 2 are bonded to each other, the pair of adherends 2 are paired along the arrows K1 and K2 in FIGS. The adherend 2 is moved away from each other. The arrows K1 and K2 are parallel to the surface of the adherend 2. Then, the adhesive layer 4 is broken and the pair of adherends 2 are separated from each other. As described above, the method for separating the adhesive 1 of the present invention allows the adherend 2 and the adhesive layer 4 to be easily peeled off by applying ultrasonic vibration to the adhesive layer 4 between the adherends 2. The pair of adherends 2 can be easily separated.

  According to this embodiment, the chip 6 is brought into contact with the adherend 2 of the adhesive body 1 and the end surface 1b of the adhesive layer 4, and the chip 6 is ultrasonically vibrated. In this manner, since the ultrasonic vibration is directly applied to the end face 1b, the ultrasonic vibration can be efficiently transmitted to the adhesive layer 4 through the chip 6. The ultrasonic vibration is propagated to the adhesive layer 4 to break the adhesive layer 4 or cause the strength of the adhesive layer 4 to be reduced, thereby allowing the adherend 2 to be peeled off.

  For this reason, it is possible to suppress fatal damage to the adherend 2 and to efficiently separate the adherends 2 of the adhesive 1 from each other in a short time. Unlike the destruction of the adhesive layer 4 by normal heating, the adherend 2 is not heated at the same time, but can be concentrated on the adhesive layer 4 to apply energy such as ultrasonic vibrations. The degree of freedom of the material constituting the adherend 2 is great.

  Moreover, since the thermosetting adhesive can be used as the adhesive constituting the adhesive layer 4 used in the present invention, the scope of application of the present invention is practical and very wide.

  Further, ultrasonic vibration is applied via the chip 6. Thereby, ultrasonic vibration can be reliably applied to the adhesive layer 4 between the pair of adherends 2. Thereby, a pair of to-be-adhered body 2 of the adhesive body 1 can be isolate | separated reliably.

  Further, since the chip 6 is ultrasonically vibrated along the arrow Z, the mechanical strength of the adhesive layer 4 between the pair of adherends 2 can be reliably reduced. As a result, the pair of adherends 2 of the bonded body 1 can be reliably separated from each other.

  When the adhesive 1 uses a reactive adhesive as the adhesive constituting the adhesive layer 4, a pair of adhesives 1 using the reactive adhesive, that is, an adhesive made of a thermosetting resin, is used. The body 2 can be separated. Moreover, since the adhesive body 1 uses a reactive adhesive, its strength and heat resistance are higher than that of an adhesive made of a thermoplastic resin, so the applicable range is wide. For this reason, it becomes possible to separate the pair of adherends 2 of the bonded body 1 having a wider application range.

  Thereby, it can apply to the thermosetting adhesive excellent in heat-resistant adhesion and adhesive force, and also can peel an adhesive agent in a short time. In addition, peeling in a short time without generating dust or noise greatly contributes to the development of the recycling business in the future and further to the promotion of recycling.

  In the embodiment described above, the ultrasonic vibration applying device 3 sandwiches the adhesive 1 between the chip 6 and the anvil 7 and applies ultrasonic vibration to the adhesive layer 4 of the adhesive 1. However, in the present invention, as shown in FIG. 6, a pair of chips 6 may be provided in the ultrasonic vibration applying device 3 without providing the anvil 7. The ultrasonic vibration applying device 3 may apply ultrasonic vibration to the adhesive layer 4 of the adhesive 1 by sandwiching the adhesive 1 between the pair of chips 6. Of course, each of the chips 6 of the ultrasonic vibration applying device 3 shown in FIG. 6 is attached to the piezoelectric vibrator 5. The chip 6 vibrates ultrasonically along the arrow Z or the arrows X1 and X2 by ultrasonic vibration generated by applying a voltage to the piezoelectric vibrators 5, respectively.

  When the ultrasonic vibration applying device 3 shown in FIG. 6 is used, the pair of chips 6 in a state in which the direction Z of the chips 6 facing each other and the direction X in which the pair of adherends 2 overlap each other intersect (orthogonal). The adhesive body 1 is sandwiched therebetween. One adherend 2 is fixed to one fixing jig 8, and the other adherend 2 is fixed to the other fixing jig 8.

  Then, a pair of chips 6 are brought into contact with both end surfaces of the pair of adherends 2 and the adhesive layer 4, and the pair of chips 6 are pressed in a direction approaching each other, and a voltage is applied to each piezoelectric vibrator 5. These piezoelectric vibrators 5 are vibrated ultrasonically. Both chips 6 vibrate ultrasonically, and these chips 6 vibrate ultrasonically together with the adherend 2. Then, the adhesive layer 4 is heated by ultrasonic vibration, and the adhesive layer 4 is broken or the strength of the adhesive layer 4 is reduced.

  And even if the adhesive layer 4 reduces the mechanical strength, when the pair of adherends 2 are joined together, the pair of adherends are taken along the arrows K1 and K2 in FIG. 2 is moved along the longitudinal direction of these adherends 2 in a direction away from each other to separate the pair of adherends 2 from each other. Arrows K1 and K2 are along the longitudinal direction and the surface of the adherend 2. As described above, in the present invention, the pair of chips 6 may be brought into contact with the adherend 2 of the adhesive body 1 and the end surface of the adhesive layer 4 to apply ultrasonic vibration to the adhesive layer 4. As described above, the present invention separates the pair of adherends 2 from each other by applying ultrasonic vibration to the adhesive layer 4 via a pair of pressing members, at least one of which is ultrasonically vibrated. In the case shown in FIG. 6, the pair of chips 6 correspond to the pressing members described in the present specification, of course.

  Furthermore, in the present invention, as shown in FIG. 7, the ultrasonic vibration applying device 3 may be provided with only one chip 6 as a pressing member. The ultrasonic vibration applying device 3 may apply ultrasonic vibration to the end surface 1b of the laminated portion 1a of the bonded body 1 with the chip 6 as one pressing member. Of course, the chip 6 as a pressing member of the ultrasonic vibration applying device 3 shown in FIG. 7 is attached to the piezoelectric vibrator 5. The chip 6 as the pressing member vibrates ultrasonically along the arrow Z or the arrow X by ultrasonic vibration generated by applying a voltage to the piezoelectric vibrator 5.

  Next, the inventors of the present invention confirmed the effect of the method for separating an adhesive of the present invention as follows. First, as shown in Table 1 below, the product 1 and the product 2 of the present invention in which ultrasonic vibration is applied to the adhesive layer 4 and the comparative example 1 in which the adherend 2 is separated using other means, and Comparative Example 2 was compared.

The product 1 of the present invention in Table 1 described above uses a modified silicone adhesive (residential Sekisui Bond (trade name) # 72-A (manufactured by Sekisui Chemical Co., Ltd.)) as an adhesive constituting the adhesive layer 4. ing. Polycarbonate (50 × 10 × 2 mm) was used for the adherend 2, the adhesive layer 4 was adhered with a thickness of 1 mm and an adhesion area of 1 cm ² , and cured at 20 ° C. for 1 week. Thereafter, using the ultrasonic vibration applying device 3 shown in FIG. 3, the frequency of 40 kHz, longitudinal vibration (arrow Z), and application time of the piezoelectric vibrator 5 are set to 4 seconds, and the adherend 2 is fixed with the fixing jig 7. Fixed and applied ultrasonic vibration. Thereafter, the adherend 2 of the bonded body 1 was separated from each other along the arrows K1 and K2 in FIGS. The force at this time (shearing force of the adhesive layer 4) was measured.

The product 2 of the present invention in Table 1 described above uses a modified silicone adhesive (residential Sekisui Bond (trade name) # 72-A (manufactured by Sekisui Chemical Co., Ltd.)) as the adhesive constituting the adhesive layer 4. ing. Copper (50 × 10 × 2 mm) was used for the adherend 2, the adhesive layer 4 was adhered with a thickness of 1 mm and an adhesion area of 1 cm ² , and cured at 20 ° C. for 1 week. Thereafter, using the ultrasonic vibration applying device 3 shown in FIG. 3, the frequency of 40 kHz, the longitudinal vibration (arrow Z), and the application time of the piezoelectric vibrator 5 are set to 3 seconds, and the adherend 2 is fixed by the fixing jig 7. Fixed and applied ultrasonic vibration. Thereafter, the adherend 2 of the bonded body 1 was separated from each other along the arrows K1 and K2 in FIGS. The force at this time (shearing force of the adhesive layer 4) was measured.

Comparative Example 1 in Table 1 described above uses a modified silicone adhesive (residential Sekisui Bond (trade name) # 72-A (manufactured by Sekisui Chemical Co., Ltd.)) as an adhesive constituting the adhesive layer 4. Yes. Polycarbonate (50 × 10 × 2 mm) was used for the adherend 2, the adhesive layer 4 was adhered with a thickness of 1 mm and an adhesion area of 1 cm ² , and cured at 20 ° C. for 1 week. Thereafter, the pressure was applied at 100 N for 4 seconds with a press having an area of 8 mm ² . Thereafter, the adherend 2 of the adhesive 1 was separated from each other along arrows K1 and K2 in FIG. The force at this time (shearing force of the adhesive layer 4) was measured.

Comparative Example 2 in Table 1 described above uses a modified silicone adhesive (residential Sekisui Bond (trade name) # 72-A (manufactured by Sekisui Chemical Co., Ltd.)) as an adhesive constituting the adhesive layer 4. Yes. Polycarbonate (50 × 10 × 2 mm) was used for the adherend 2, the adhesive layer 4 was adhered with a thickness of 1 mm and an adhesion area of 1 cm ² , and cured at 20 ° C. for 1 week. Then, the surface of the pressure surface heated to 200 ° C. was pressurized at 100 N for 4 seconds with a hot press machine having an area of 8 mm ² . Thereafter, the adherend 2 of the adhesive 1 was separated from each other along arrows K1 and K2 in FIG. The force at this time (shearing force of the adhesive layer 4) was measured.

  Further, in the products 1 and 2 of the present invention and the comparative examples 1 and 2, the force (adhesive layer 4 of the adhesive layer 4) when the adherend 2 of the adhesive 1 is separated from each other along the arrows K1 and K2 in FIG. Shear force) was measured with the following requirements. The measurement environment temperature was 20 ° C. or lower. The moving (pulling) speed along arrows K1 and K2 was 50 mm / min.

  Furthermore, in the products 1 and 2 of the present invention and the comparative examples 1 and 2 described above, the object to which ultrasonic vibration is not applied and the object to be covered along the arrows K1 and K2 in FIG. The force when the adherends 2 were separated from each other (shearing force of the adhesive layer 4) was measured under the conditions described above.

  According to Table 1 described above, in Comparative Examples 1 and 2, it was clarified that the above-described shearing force can be reduced as compared with the case where ultrasonic vibration is not applied, and the cutting is not performed by heating and pressurization. However, in Comparative Examples 1 and 2, the strength after the treatment is 57.1% or more of the strength before the treatment, and the above-described shearing force, that is, the mechanical strength of the adhesive layer 4 cannot be significantly reduced.

  On the other hand, in the products 1 and 2 of the present invention, it was revealed that the above-described shearing force was remarkably reduced as compared with the products that were not subjected to application of ultrasonic vibration, heating, and pressurization. It becomes clear that the products 1 and 2 of the present invention can reduce the strength after the treatment to 35.7% or less of the strength before the treatment, and can significantly reduce the above-described shear force, that is, the mechanical strength of the adhesive layer 4. It became clear. Thus, since the products 1 and 2 of the present invention can efficiently transmit ultrasonic vibration to the adhesive layer 4 through the adherend 2, it is clear that the mechanical strength of the adhesive layer 4 can be reduced. It became.

  Further, in the products 1 and 2 of the present invention, the adherend 2 is not damaged, whereas in the comparative examples 1 and 2, the adherend 2 partially melts (comparative example 2) or the adherend 2 Scratches (Comparative Example 1) occurred. For this reason, it became clear that Comparative Examples 1 and 2 are not suitable for separating the adherend 2 from the viewpoint of recycling.

  As described above, according to Table 1, the products 1 and 2 of the present invention can prevent the fatal adherend 2 from being damaged and efficiently separate the adherends 2 of the adhesive 1 from each other in a short time. It became clear that we could do it.

  In addition, the inventors of the present invention apply ultrasonic vibration to the adhesive body 1 including the adherend 2 made of various materials, and the ultrasonic vibration and the lateral vibration (longitudinal vibration (arrow Z) described above). The difference in effect from the ultrasonic vibration of the arrows X1, X2) was measured. The results are shown in Table 2 below.

Adhesive A in Table 2 uses a modified silicone adhesive (residential Sekisui Bond (trade name) # 72-A (manufactured by Sekisui Chemical Co., Ltd.)) as an adhesive constituting the adhesive layer 4. Polycarbonate (50 × 10 × 2 mm) is used for the adherend 2, the adhesive layer 4 is bonded to a thickness of 2 mm, and the bonding area is 1 cm ² , and cured at 20 ° C. for 1 week. Then, using the ultrasonic vibration applying device 3 shown in FIG. 3, longitudinal vibration (arrow Z) ultrasonic vibration was applied with a frequency of 40 kHz and an application time of the piezoelectric vibrator 5 of 4 seconds. Thereafter, as in Table 1 described above, the shearing force of the adhesive layer 4 of the adhesive 1 was measured.

Adhesive B in Table 2 uses a modified silicone adhesive (residential Sekisui Bond (trade name) # 72-A (manufactured by Sekisui Chemical Co., Ltd.)) as an adhesive constituting the adhesive layer 4. Polycarbonate (50 × 10 × 2 mm) is used for the adherend 2, the adhesive layer 4 is bonded to a thickness of 2 mm, and the bonding area is 1 cm ² , and cured at 20 ° C. for 1 week. Then, using the ultrasonic vibration applying device 3 shown in FIG. 3, the frequency of 40 kHz, the application time of the piezoelectric vibrator 5 was set to 4 seconds, and the ultrasonic vibration of lateral vibration (arrows X1 and X2) was applied. Thereafter, as in Table 1 described above, the shearing force of the adhesive layer 4 of the adhesive 1 was measured.

Adhesive C in Table 2 is an epoxy adhesive (4.5 parts by weight of toluene, 4.4'-isopropylidenediphenol and 1-chloro-2,3-epoxy) as an adhesive constituting the adhesive layer 4. A compound containing an epoxy resin and an organic solvent consisting of 43 parts by weight of a propane polycondensate, etc., with 1.7 parts by weight of toluene, 1 to 5 parts by weight of methanol, 35 to 45 parts by weight of polyamidoamine, etc. An adhesive using a compound containing a polyamidoamine and an organic solvent as a curing agent is used. Polycarbonate (50 × 10 × 2 mm) is used for the adherend 2, the adhesive layer 4 is bonded to a thickness of 2 mm, and the bonding area is 1 cm ² , and cured at 20 ° C. for 1 week. Then, using the ultrasonic vibration applying device 3 shown in FIG. 3, the frequency of 40 kHz, the application time of the piezoelectric vibrator 5 was set to 2 seconds, and ultrasonic vibration of vertical vibration (arrow Z) was applied. Thereafter, as in Table 1 described above, the shearing force of the adhesive layer 4 of the adhesive 1 was measured.

Adhesive D in Table 2 uses a modified silicone adhesive (residential Sekisui Bond (trade name) # 72-A (manufactured by Sekisui Chemical Co., Ltd.)) as an adhesive constituting adhesive layer 4. Copper (50 × 10 × 2 mm) is used for the adherend 2, the adhesive layer 4 is bonded at a thickness of 2 mm and an adhesive area of 1 cm ² , and cured at 20 ° C. for 1 week. Then, using the ultrasonic vibration applying device 3 shown in FIG. 3, the frequency of 40 kHz, the application time of the piezoelectric vibrator 5 was set to 2 seconds, and ultrasonic vibration of vertical vibration (arrow Z) was applied. Thereafter, as in Table 1 described above, the shearing force of the adhesive layer 4 of the adhesive 1 was measured.

Adhesive E in Table 2 uses a modified silicone adhesive (residential Sekisui Bond (trade name) # 72-A (manufactured by Sekisui Chemical Co., Ltd.)) as the adhesive constituting the adhesive layer 4. Copper (50 × 10 × 2 mm) is used for the adherend 2, the adhesive layer 4 is bonded at a thickness of 2 mm and an adhesive area of 1 cm ² , and cured at 20 ° C. for 1 week. Then, using the ultrasonic vibration applying device 3 shown in FIG. 3, the frequency of 40 kHz, the application time of the piezoelectric vibrator 5 was set to 2 seconds, and the ultrasonic vibration of the lateral vibration (arrows X1 and X2) was applied. Thereafter, as in Table 1 described above, the shearing force of the adhesive layer 4 of the adhesive 1 was measured.

  In the adhesive bodies A to E described above, the force (the shear of the adhesive layer 4) when the adherend 2 is separated from each other along the arrows K1 and K2 in FIG. Force) was measured.

  According to Table 2, the adhesive described above in comparison with the case in which no ultrasonic vibration is applied in the case of applying the ultrasonic vibration of either longitudinal vibration (arrow Z) or lateral vibration (arrows X1, X2). The shear force of layer 4 is reduced. In addition, in the case of applying ultrasonic vibration of either longitudinal vibration (arrow Z) or lateral vibration (arrows X1, X2), the time for applying the ultrasonic vibration is as short as 4 seconds or 2 seconds, and the adherend 2 Is not damaged. For this reason, even if any ultrasonic vibration of either longitudinal vibration (arrow Z) or lateral vibration (arrows X1, X2) is applied, fatal damage to the adherend 2 is suppressed, and the bonded body 1 can be efficiently performed in a short time. The adherends 2 can be separated from each other. As described above, since the adhesive bodies A to E described above, that is, the present invention can efficiently transmit ultrasonic vibrations to the adhesive layer 4 through the adherend 2, the mechanical strength of the adhesive layer 4. It has become clear that can be reliably reduced.

Moreover, according to Table 2, the ratio of the strength after the treatment of the lateral vibration (arrows X1, X2) of the adhesive B to the strength before the treatment is 41.6%, whereas the strength of the adhesive E The ratio of the strength after the treatment of the lateral vibration (arrows X1 and X2) to the strength before the treatment is 11.1%. Furthermore, the ratio of the strength after the longitudinal vibration (arrow Z) treatment of the bonded body D to the strength before the treatment is 67.1%. For this reason, according to Table 2, the ultrasonic vibration of the transverse vibration (arrows X1, X2) particularly reduces the mechanical strength of the adhesive layer 4 in which the adherends 2 made of synthetic resin are joined together. It became clear that it was effective. That is, it has been clarified that the ultrasonic vibration of the lateral vibration (arrows X1 and X2) is effective for separating the adherends 2 made of synthetic resin.

Further, according to Table 2, the ratio of the strength after the longitudinal vibration (arrow Z) treatment of the adhesive D to the strength before the treatment is 67.1%, whereas the adhesive A and the adhesive The ratio of the strength after the treatment of the longitudinal vibration (arrow Z) of C to the strength before the treatment is 14.6% or less. In particular, the above-mentioned ratio of the bonded body A is very small at 5.6%. Furthermore, the ratio of the strength after the treatment of the lateral vibration (arrows X1 and X2) of the adhesive B to the strength before the treatment is 41.6%. Therefore, according to Table 2, the ultrasonic vibration of the longitudinal vibration (arrow Z) is particularly effective for reducing the mechanical strength of the adhesive layer 4 in which the adherends 2 made of metal are joined together. It became clear that there was. That is, it has been clarified that the ultrasonic vibration of the longitudinal vibration (arrow Z) is effective for separating the adherends 2 made of metal.

  The method of the present invention is not limited to the separation of the adherends 2 bonded with an adhesive, but is used for sealing applications, molding applications, potting applications, anti-slip agents, gaskets, and other dissimilar materials that require separation at the time of disposal. Application is also possible in laminated bodies and molded bodies.

  In the embodiments described above, after applying ultrasonic vibration, the adherends 2 are moved away from each other along the arrows K1 and K2 parallel to the surface of the adherend 2 to move the adherends 2 to each other. It is separated. However, in the present invention, for example, after applying ultrasonic vibration, the adherends 2 are moved in directions away from each other along the direction in which the adherends 2 overlap each other (arrows X1 and X2). 2 may be separated from each other. In short, in the present invention, after the ultrasonic vibration is applied, the adherends 2 may be moved away from each other in any direction to separate the adherends 2 from each other.

  Further, in the present invention, after applying ultrasonic vibration, an operator may move the adherends 2 away from each other by hand or the like, and separate the adherends 2 from each other using a tool or a machine. They may be separated by moving in the direction of leaving.

  Furthermore, in the present invention, the arrows X1 and X2 and the arrow Z may not be orthogonal to each other as long as they intersect each other.

  In addition, embodiment mentioned above only showed the typical form of this invention, and this invention is not limited to embodiment. That is, various modifications can be made without departing from the scope of the present invention.

It is a perspective view of the adhesion body provided with the adherend separated from each other by the separation method of the adhesion body of the present invention. It is sectional drawing which follows the II-II line | wire in FIG. It is a perspective view which shows the structure of the ultrasonic vibration provision apparatus etc. which isolate | separate the to-be-adhered body of the adhesive body shown by FIG. It is the side view of the ultrasonic vibration provision apparatus which showed the adhesive body in the cross section along the IV-IV line in FIG. It is explanatory drawing which shows the state which isolate | separates the adherend of the adhesion body shown by FIG. 3 from each other. It is explanatory drawing which shows the modification of the ultrasonic vibration provision apparatus shown by FIG. It is explanatory drawing which shows the other modification of the ultrasonic vibration provision apparatus shown by FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Adhesive body 1a Lamination | stacking part 1b End surface 2 To-be-adhered body 4 Adhesive layer 6 Chip (pressing member)
7 Anvil (Pressing member)
Z direction crossing the end face, direction of the pair of pressing members facing each other X1, X2 direction parallel to the end face, direction crossing the direction of the pair of pressing members facing each other

Claims (3)

In a method of separating a pair of adherends of an adhesive body including a pair of adherends adhered to each other by an adhesive layer,
The mutually opposing direction of the pair of pressing members, at least one of ultrasonic vibration, the pair in a state where the direction of the adherend overlap each other cross each other, clamping Mutotomoni the adhesive member between the pair of pressing members, the pair of contacting said pair of pressing members on both of the pair of adherends exposed at the end face of the laminate that said adhesive layer and the adherend are laminated to each other, one of the pressing member even without least An adhesive separating method, wherein the pair of adherends are separated from each other by applying ultrasonic vibration to the end face by ultrasonic vibration. The adherend is made of a metal, and, before Symbol ultrasonic vibrations, a method for separating the adhesive body of claim 1 Symbol mounting, characterized in that the vibration along a direction crossing the edge. The adherend is made of synthetic resin, and, before Symbol ultrasonic vibrations, a method for separating the adhesive body of claim 1 Symbol mounting, characterized in that vibrates in a direction parallel to the said end face.

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