JP4821849B2 - Composite substrate and method for manufacturing composite substrate - Google Patents

Composite substrate and method for manufacturing composite substrate Download PDF

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JP4821849B2
JP4821849B2 JP2008509682A JP2008509682A JP4821849B2 JP 4821849 B2 JP4821849 B2 JP 4821849B2 JP 2008509682 A JP2008509682 A JP 2008509682A JP 2008509682 A JP2008509682 A JP 2008509682A JP 4821849 B2 JP4821849 B2 JP 4821849B2
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piece
frame
substrate
composite substrate
hole
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JPWO2007116544A1 (en
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範夫 酒井
充良 西出
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Combinations Of Printed Boards (AREA)

Description

本発明は複合基板及び複合基板の製造方法に関し、詳しくは、平板状の基板本体の一方主面に枠体を接合してなる複合基板及びその製造方法に関する。   The present invention relates to a composite substrate and a method for manufacturing the composite substrate, and more particularly to a composite substrate in which a frame is bonded to one main surface of a flat substrate body and a method for manufacturing the composite substrate.

高密度に電子部品を実装するため、基板本体の両面又は片面にチップ状電子部品を搭載したモジュール部品が提供されている。このようなモジュール部品を他の回路基板に実装したときに、モジュール部品の基板本体を他の回路基板から浮かせるため、モジュール部品の基板本体に枠状部材やパッケージを取り付けることが提案されている。この場合、基板本体と他の回路基板との間の電気的接続のため、枠状部材やパッケージには配線パターンが形成され、配線パターンの一端が基板本体に接合され、配線パターンの他端が他の回路基板に接合される（例えば、特許文献１〜４）。   In order to mount electronic components at high density, module components are provided in which chip-shaped electronic components are mounted on both sides or one side of a substrate body. When such a module component is mounted on another circuit board, it has been proposed to attach a frame-like member or package to the board body of the module component in order to lift the board body of the module component from the other circuit board. In this case, for electrical connection between the board body and another circuit board, a wiring pattern is formed on the frame member or package, one end of the wiring pattern is joined to the board body, and the other end of the wiring pattern is Joined to another circuit board (for example, Patent Documents 1 to 4).

また、特許文献５には、モジュール基板間を接続する基板接続部材について、モジュール基板と接続するためのリード端子を基板接続部材のハウジングから突出させ、この突出部分のばね弾性を利用して、耐衝撃性を改善することが提案されている。   Further, in Patent Document 5, a lead terminal for connecting to a module substrate is projected from a housing of the substrate connecting member for connecting the module substrates, and the spring elasticity of this protruding portion is used to withstand resistance. It has been proposed to improve impact properties.

また、特許文献６には、図１７（Ａ）に示したように、平板形状の樹脂製基板１２０にリードフレーム１３０をインサートモールドし、リードフレーム１３０の中間部分１３１を樹脂製基板１２０の内部に埋設し、リードフレーム１３０の両端を屈折させて、樹脂製基板１２０の表裏面にリード部１３２，１３３を露出させるチップパッケージ１１０が開示されている。   Further, in Patent Document 6, as shown in FIG. 17A, a lead frame 130 is insert-molded on a flat resin substrate 120, and an intermediate portion 131 of the lead frame 130 is placed inside the resin substrate 120. A chip package 110 is disclosed which is embedded and refracted at both ends of a lead frame 130 to expose lead portions 132 and 133 on the front and back surfaces of a resin substrate 120.

このチップパッケージ１１０は、図１７（Ｂ）に示すように、樹脂性基板１１０の上面に、開口１２３を跨ぐようにチップ１４０を実装し、ボンディングワイヤー１５０でチップ１４０とリード部１３２とを接続している。   In this chip package 110, as shown in FIG. 17B, the chip 140 is mounted on the upper surface of the resin substrate 110 so as to straddle the opening 123, and the chip 140 and the lead part 132 are connected by the bonding wire 150. ing.

また、図１７（Ｃ）に示すように、樹脂封止剤１５２をチップパッケージ１１０の上面にチップ１４０も封止するように塗布した後、下面開口のボックス状の蓋１５４を被せて樹脂製基板１２０と固定して半導体装置を形成している。この半導体装置は、プリント基板１７１上に実装している。
特開平６−２１６３１４号公報 特開平７−５０３５７号公報 特開２０００−１０１３４８号公報 特開２００１−３３９１３７号公報 特開２００５−３３３０４６号公報 特開２００５−３２８００９号公報 Further, as shown in FIG. 17C, a resin sealant 152 is applied to the upper surface of the chip package 110 so as to also seal the chip 140, and then covered with a box-shaped lid 154 having an opening on the lower surface. The semiconductor device is formed by being fixed to 120. This semiconductor device is mounted on a printed circuit board 171.
JP-A-6-216314 Japanese Patent Laid-Open No. 7-50357 JP 2000-101348 A JP 2001-339137 A JP 2005-333046 A JP 2005-328209 A

モジュール部品の基板本体とモジュール部品が実装される他の回路基板との熱膨張率又は線膨張係数に差があると、温度変化によって、枠状部材やパッケージに形成した配線パターンと基板本体や他の回路基板との接合部分に熱応力が発生する。また、これらの接合部分には、落下衝撃によって衝撃応力が発生する。特に、厳しい環境下で使用される場合には、熱応力や衝撃応力が大きくなるため、接合信頼性の低下が著しい。   If there is a difference in thermal expansion coefficient or linear expansion coefficient between the board body of the module component and another circuit board on which the module part is mounted, the wiring pattern formed on the frame-like member or package and the board body or other due to temperature changes Thermal stress is generated at the junction with the circuit board. In addition, impact stress is generated in these joint portions by a drop impact. In particular, when used in a harsh environment, the thermal stress and impact stress increase, so the joint reliability is significantly reduced.

特許文献５に開示された基板接続部材は、リード端子の突出した部分が空中に浮いているため、リード端子をモジュール基板に精度よく位置決めして接合することが容易ではない。また、構造も複雑である。   In the board connecting member disclosed in Patent Document 5, the protruding portion of the lead terminal is floating in the air, so that it is not easy to position and join the lead terminal to the module board with high accuracy. The structure is also complicated.

特許文献６に開示されたチップパッケージは、チップを搭載してボンディングワイヤーで接続するものであり、基板本体に接合されるものでない。特許文献６には、熱応力や衝撃応力を緩和するためのリードフレームの形状について、開示も示唆もされていない。   The chip package disclosed in Patent Document 6 is one in which a chip is mounted and connected by a bonding wire, and is not bonded to a substrate body. Patent Document 6 does not disclose or suggest the shape of the lead frame for relieving thermal stress and impact stress.

本発明は、かかる実情に鑑み、簡単な構成で、接合部分の熱応力や衝撃応力を緩和することができる複合基板及びその製造方法を提供しようとするものである。   In view of such circumstances, the present invention is intended to provide a composite substrate and a method for manufacturing the same that can relieve the thermal stress and impact stress of the bonded portion with a simple configuration.

本発明は、上記課題を解決するために、以下のように構成した複合基板を提供する。   In order to solve the above problems, the present invention provides a composite substrate configured as follows.

複合基板は、少なくとも一方主面に端子を有する基板本体と、前記基板本体の前記一方主面に接合される枠体とを備えたタイプのものである。前記枠体は、（１）絶縁材料からなり、中央に貫通穴を有し、前記基板本体の前記一方主面の周縁部に沿って枠状に延在する枠部材と、（２）金属薄板の折り曲げ加工により形成され、中間片の両端にそれぞれ第１片と第２片とが連続する複数の接続部材とを有する。前記複数の接続部材は、（ａ）前記枠部材に、前記枠部材の前記貫通穴を介して対向するように配置され、（ｂ）前記第１片が、前記枠部材の前記基板本体側に露出して、前記基板本体の前記一方主面の前記端子に接合され、（ｃ）前記第２片が、前記枠部材の前記基板本体とは反対側に露出し、（ｄ）前記第１片及び前記第２片が、前記接続部材が前記枠部材の前記貫通穴を介して対向する方向に延在し、（ｅ）前記中間片が、前記枠部材の内部を貫通し、（ｆ）前記中間片の前記両端は、前記第１片と前記第２片の互いに反対側の端部にそれぞれ連続する。前記接続部材は、前記第１片と前記中間片と前記第２片とを通る断面がＺ字状であり、前記中間片は前記第１片と前記第２片との間に斜めに配置されている。 The composite substrate is of a type provided with a substrate body having terminals on at least one main surface, and a frame joined to the one main surface of the substrate body. The frame includes (1) a frame member made of an insulating material, having a through hole in the center, and extending in a frame shape along the peripheral edge of the one main surface of the substrate body; and (2) a metal thin plate And a plurality of connecting members each having a first piece and a second piece continuous with each other at both ends of the intermediate piece. The plurality of connecting members are (a) arranged to face the frame member via the through holes of the frame member, and (b) the first piece is located on the substrate body side of the frame member. Exposed and bonded to the terminal on the one main surface of the substrate body, (c) the second piece is exposed on the opposite side of the frame member from the substrate body, and (d) the first piece. And the second piece extends in a direction in which the connection member faces the through hole of the frame member, (e) the intermediate piece penetrates the inside of the frame member, and (f) the The both ends of the intermediate piece are respectively connected to opposite ends of the first piece and the second piece. The connecting member has a Z-shaped cross section passing through the first piece, the intermediate piece, and the second piece, and the intermediate piece is disposed obliquely between the first piece and the second piece. ing.

上記構成において、複合基板は、接続部材の第２片が外部回路基板に接続される。このとき、第１片と第２片の互いに反対側の端部が中間片の両端に連続する接続部材は、温度変化や衝撃力等により複合基板と外部回路基板との接合部分や基板本体と枠体との接合部分に生じる熱応力や衝撃応力等を、弾性変形することによって緩和することができる。そのため、接合信頼性を向上することができる。   In the above configuration, the composite substrate has the second piece of the connection member connected to the external circuit board. At this time, the connecting member in which the opposite ends of the first piece and the second piece are connected to both ends of the intermediate piece is a joint between the composite board and the external circuit board or the board body due to temperature change, impact force, etc. Thermal stress, impact stress, and the like generated at the joint portion with the frame can be relaxed by elastic deformation. As a result, the bonding reliability can be improved.

さらに、複合基板が接続される外部回路基板が湾曲しても、接続部材の第１片又は第２片の一方は、枠部材から離れるように弾性変形して、接合部分の応力を緩和する。第１片又は第２片の他方については、回動が枠部材によって阻止される。これにより、接合部分に無理な力が作用しないようにして、接合信頼性を高めることができる。   Furthermore, even if the external circuit board to which the composite board is connected is curved, one of the first piece and the second piece of the connecting member is elastically deformed away from the frame member to relieve the stress at the joint portion. As for the other of the first piece and the second piece, the rotation is prevented by the frame member. Thereby, it is possible to increase the bonding reliability by preventing an excessive force from acting on the bonding portion.

好ましくは、前記中間片の前記両端は、前記第２片の前記枠部材の前記貫通穴側の端部と、前記第１片の前記枠部材の前記貫通穴側とは反対側の端部とにそれぞれ連続する。   Preferably, the both ends of the intermediate piece include an end portion of the second piece on the side of the through hole of the frame member, and an end portion of the first piece on the side opposite to the through hole side of the frame member. Each in succession.

上記構成によれば、中間片の両端が、第１片の枠部材の貫通穴側の端部と、第２片の枠部材の貫通穴側とは反対側の端部とにそれぞれ連続する場合と比べると、基板本体と外部回路基板との熱膨張率又は線膨張係数の差により熱応力が発生したとき、接続部材と複合基板や外部回路基板との接合部分に作用するせん断力や曲げモーメントが小さくなり、接合信頼性が高まる。   According to the above configuration, when both ends of the intermediate piece are continuous with the end portion on the through hole side of the frame member of the first piece and the end portion on the side opposite to the through hole side of the frame member of the second piece, respectively. When the thermal stress is generated due to the difference in thermal expansion coefficient or linear expansion coefficient between the board body and the external circuit board, the shearing force and bending moment acting on the joint between the connecting member and the composite board or external circuit board Is reduced, and the bonding reliability is increased.

好ましくは、チップ状電子部品が前記枠状部材の前記貫通穴内に配置され、前記基板本体の前記一方主面に搭載されている。   Preferably, a chip-shaped electronic component is disposed in the through hole of the frame-shaped member and is mounted on the one main surface of the substrate body.

この場合、枠状部材の貫通穴を利用して、複合基板の実装密度を高めることができる。   In this case, the mounting density of the composite substrate can be increased using the through holes of the frame-shaped member.

好ましくは、前記チップ状電子部品が樹脂で封止され、該樹脂が前記枠体の一部に接着又は当接している。   Preferably, the chip-shaped electronic component is sealed with a resin, and the resin adheres to or abuts on a part of the frame.

この場合、枠体で樹脂の流れを阻止し、チップ状電子部品を確実に封止することができる。また、封止に用いた樹脂によって枠体の変形を拘束し、枠体と基板本体との接合を補強することができる。   In this case, the flow of the resin can be prevented by the frame, and the chip-shaped electronic component can be reliably sealed. Further, the deformation of the frame body can be restrained by the resin used for sealing, and the bonding between the frame body and the substrate body can be reinforced.

好ましくは、前記枠体の前記接続部材は、金属薄板の打ち抜き加工及び折り曲げ加工により形成される。前記枠体の前記枠部材は、金型内に前記接続部材となる部分を挿入した状態で成形した樹脂である。   Preferably, the connection member of the frame is formed by punching and bending a thin metal plate. The frame member of the frame body is a resin molded in a state where a portion to be the connection member is inserted into a mold.

この場合、枠体を効率よく製作することができる。   In this case, the frame can be manufactured efficiently.

好ましくは、前記基板本体がセラミック基板である。   Preferably, the substrate body is a ceramic substrate.

セラミック基板は熱膨張が小さいため、外部回路基板に実装したときに接合部分に作用する熱応力が大きくなる。したがって、接合信頼性の向上効果が特に大きい。   Since the ceramic substrate has a small thermal expansion, the thermal stress acting on the joint portion when mounted on the external circuit substrate becomes large. Therefore, the effect of improving the bonding reliability is particularly great.

好ましくは、前記基板本体は、１０５０℃以下で焼結する複数のセラミック層を積層してなるセラミック多層基板である。   Preferably, the substrate body is a ceramic multilayer substrate formed by laminating a plurality of ceramic layers sintered at 1050 ° C. or lower.

この場合、セラミック多層基板により複合基板の実装密度を高めつつ、接合信頼性を向上することができる。また、セラミック多層基板は他の種類の基板に比べて脆いため、熱応力や衝撃応力からセラミック多層基板自体の破壊を防止する効果が大きい。   In this case, it is possible to improve the bonding reliability while increasing the mounting density of the composite substrate by the ceramic multilayer substrate. In addition, since the ceramic multilayer substrate is more fragile than other types of substrates, the effect of preventing the ceramic multilayer substrate itself from being destroyed due to thermal stress or impact stress is great.

好ましくは、前記枠体の前記接続部材の前記金属薄板は可撓性を有する。   Preferably, the metal thin plate of the connection member of the frame body has flexibility.

接続部材を構成する金属薄板が可撓性を有していれば、接続部材の第１片や第２片が屈曲部を支点として可動であるので、枠体と基板本体の接合強度や、枠体と外部回路基板の接合強度が向上する。   If the metal thin plate constituting the connection member is flexible, the first piece and the second piece of the connection member are movable with the bent portion as a fulcrum, so that the bonding strength between the frame body and the substrate body, The bonding strength between the body and the external circuit board is improved.

好ましくは、前記接続部材の厚みは、５０μｍ以上、かつ３００μｍ以下である。   Preferably, the connection member has a thickness of 50 μm or more and 300 μm or less.

上記範囲内であれば、接続部材を高精度の加工することができるため、小型化が容易である。すなわち、接続部材の厚さが５０μｍより小さくなると、折り曲げ加工時のばらつきが大きくなり、接続部材の第１片や第２片の位置や高さの精度が低下する。また、疲労破壊しやすい。接続部材の厚さが３００μｍより大きくなると、折り曲げ加工が難しくなり、曲げ角度のばらつきや高さのばらつきが大きくなる。   If it is in the said range, since a connection member can be processed with high precision, size reduction is easy. That is, when the thickness of the connection member is smaller than 50 μm, the variation during bending increases, and the accuracy of the position and height of the first piece and the second piece of the connection member decreases. Moreover, it is easy to fatigue failure. When the thickness of the connecting member is larger than 300 μm, the bending process becomes difficult, and the variation in the bending angle and the height become large.

好ましくは、前記基板本体の他方主面に、チップ状電子部品が搭載されている。   Preferably, a chip-shaped electronic component is mounted on the other main surface of the substrate body.

この場合、複合基板の実装密度を高めることができる。   In this case, the mounting density of the composite substrate can be increased.

好ましい一態様として、前記枠体の前記接続部材は、前記第２片の先端が、前記枠部材の外周面まで又は該外周面よりも外側まで延在している。   As a preferable aspect, in the connection member of the frame, the tip of the second piece extends to the outer peripheral surface of the frame member or to the outer side of the outer peripheral surface.

この場合、複合基板と外部回路基板との接合部分の面積を大きくして、複合基板と外部回路基板との間の接合強度を向上させることができる。   In this case, the bonding area between the composite substrate and the external circuit board can be improved by increasing the area of the joint portion between the composite board and the external circuit board.

好ましい他の態様として、前記枠体の前記接続部材は、前記第２片の先端側が折り曲げられて、前記枠部材の外周面に沿って延在している。   As another preferred aspect, the connection member of the frame body is bent along the outer peripheral surface of the frame member with the distal end side of the second piece being bent.

この場合、複合基板と外部回路基板との接合状態を、外部から検査することが容易になる。   In this case, it becomes easy to inspect the bonding state between the composite substrate and the external circuit substrate from the outside.

好ましいさらに他の態様として、前記枠体の前記接続部材は、前記第１片の面積が、前記第２片の面積よりも大きい。   As still another preferred aspect, in the connection member of the frame, the area of the first piece is larger than the area of the second piece.

この場合、枠体と基板本体と間の接合部分の面積を大きくして、枠体と基板本体との間の接合強度を向上させることができる。   In this case, the area of the joint portion between the frame body and the substrate body can be increased to improve the joint strength between the frame body and the substrate body.

好ましい別の態様として、前記枠体の前記接続部材の前記第１片の中心の位置が、前記基板本体の前記端子の中心の位置よりも、前記枠体の前記貫通穴側にずれている。   As another preferable aspect, the position of the center of the first piece of the connection member of the frame body is shifted to the through hole side of the frame body from the position of the center of the terminal of the substrate body.

この場合、枠体の貫通穴に封止樹脂を充填・硬化させた際の封止樹脂の硬化収縮応力を、基板本体の端子と接続部材の第１片とを接合している導電性接合材の収縮応力で緩和して、封止樹脂の収縮応力による影響を小さくすることができる。その結果、封止樹脂の硬化収縮に伴う枠体の変形を抑制でき、枠体と基板本体との接続信頼性を向上させることができる。また、基板本体には圧縮応力が働くため、基板本体自身の抗折強度が向上する。   In this case, the conductive bonding material that bonds the curing shrinkage stress of the sealing resin when the through hole of the frame body is filled and cured with the sealing resin to bond the terminal of the substrate body and the first piece of the connecting member. The effect of the shrinkage stress of the sealing resin can be reduced. As a result, deformation of the frame body due to curing shrinkage of the sealing resin can be suppressed, and the connection reliability between the frame body and the substrate body can be improved. Moreover, since compressive stress acts on the substrate body, the bending strength of the substrate body itself is improved.

好ましいさらに別の態様として、前記枠体の前記接続部材の前記第１片の前記枠体の前記貫通穴側の内側縁の位置が、前記基板本体の前記端子の前記基板本体の中心側の内側縁の位置よりも、前記枠体の前記貫通穴側にずれている。   As still another preferred aspect, the position of the inner edge of the frame member on the through hole side of the first piece of the connection member of the frame body is the inner side of the terminal of the substrate body on the center side of the substrate body. It is shifted to the through hole side of the frame body from the position of the edge.

この場合、基板本体の端子と枠体の接続部材の第１片とを接合する導電性接合材は、端子の内側縁と第１片の内側縁との間の領域で幅方向（基板本体と枠体との接合面に対して直角方向）に引き延ばされた形で硬化するので、導電性接合材の硬化収縮応力を大きくすることができる。その結果、枠体の貫通穴に充填・硬化するときの封止樹脂の収縮応力を、導電性接合材の収縮応力でより効果的に緩和することができる。   In this case, the conductive bonding material for bonding the terminal of the board body and the first piece of the connecting member of the frame body is formed in the width direction (with the board body and the area between the inner edge of the terminal and the inner edge of the first piece. Since it hardens | cures in the form extended in the direction orthogonal to the joint surface with a frame, the hardening shrinkage stress of an electroconductive joining material can be enlarged. As a result, the shrinkage stress of the sealing resin when the through hole of the frame body is filled and cured can be more effectively reduced by the shrinkage stress of the conductive bonding material.

好ましいさらに別の態様として、前記枠体の前記接続部材の前記第１片の前記枠体の前記貫通穴とは反対側の外側縁の位置が、前記基板本体の前記端子の前記基板本体の中心とは反対側の外側縁の位置よりも、前記枠体の前記貫通穴側にずれている。   As a further preferred aspect, the position of the outer edge of the connecting member of the frame opposite to the through hole of the frame body of the first piece is the center of the substrate body of the terminal of the substrate body. It is shifted to the through hole side of the frame body from the position of the outer edge on the opposite side.

この場合、基板本体の端子と枠体の接続部材の第１片とを接合する導電性接合材は、端子の外側縁と第１片の外側縁との間の領域で幅方向（基板本体と枠体との接合面に対して直角方向）に引き延ばされた形で硬化するので、導電性接合材の硬化収縮応力を大きくすることができる。その結果、枠体の貫通穴に充填・硬化するときの封止樹脂の収縮応力を、導電性接合材の収縮応力でより効果的に緩和することができる。   In this case, the conductive bonding material for bonding the terminal of the board body and the first piece of the connecting member of the frame body is formed in the width direction (with the board body and the area between the outer edge of the terminal and the outer edge of the first piece. Since it hardens | cures in the form extended in the direction orthogonal to the joint surface with a frame, the hardening shrinkage stress of an electroconductive joining material can be enlarged. As a result, the shrinkage stress of the sealing resin when the through hole of the frame body is filled and cured can be more effectively reduced by the shrinkage stress of the conductive bonding material.

また、本発明は、上記課題を解決するために、以下のように構成した複合基板の製造方法を提供する。   Moreover, in order to solve the said subject, this invention provides the manufacturing method of the composite substrate comprised as follows.

複合基板の製造方法は、（１）少なくとも一方主面に端子が設けられた基板本体と、枠体とを準備する第１の工程と、（２）前記基板本体の前記一方主面に、前記枠体を接合する第２の工程とを備える。前記第１の工程において、前記枠体は、（ｉ）絶縁材料からなり、中央に貫通穴を有し、前記基板本体の前記一方主面の周縁部に沿って枠状に延在する枠部材と、(ii)金属薄板の折り曲げ加工により形成され、中間片の両端にそれぞれ第１片と第２片とが連続する複数の接続部材とを有する。前記複数の接続部材は、（ａ）前記枠部材に、前記枠部材の前記貫通穴を介して対向するように配置され、（ｂ）前記第１片及び第２片が、前記枠部材の前記貫通穴の周囲に延在する前記枠部材の両主面にそれぞれ露出し、（ｃ）前記第１片及び前記第２片が、前記接続部材が前記枠部材の前記貫通穴を介して対向する方向に延在し、（ｄ）前記中間片が、前記枠部材の内部を貫通し、（ｅ）前記中間片の前記両端は、前記第１片と前記第２片の互いに反対側の端部にそれぞれ連続する。前記接続部材は、前記第１片と前記中間片と前記第２片とを通る断面がＺ字状であり、前記中間片は前記第１片と前記第２片との間に斜めに配置されている。前記第２の工程において、（ｆ）前記枠体は、前記基板本体の一方主面の周縁部に沿って枠状に延在するように配置され、（ｇ）前記枠体の前記接続部材の前記第１片が、前記基板本体の前記一方主面に設けられた前記端子に接合される。 The manufacturing method of the composite substrate includes (1) a first step of preparing a substrate body provided with terminals on at least one main surface and a frame, and (2) the one main surface of the substrate main body, And a second step of joining the frames. In the first step, the frame body is (i) a frame member made of an insulating material, having a through hole in the center, and extending in a frame shape along a peripheral edge portion of the one main surface of the substrate body. And (ii) a plurality of connecting members which are formed by bending a thin metal plate, and the first piece and the second piece are respectively continuous at both ends of the intermediate piece. The plurality of connecting members are (a) arranged to face the frame member via the through holes of the frame member, and (b) the first piece and the second piece are the pieces of the frame member. (C) the first piece and the second piece are opposed to each other through the through hole of the frame member. extend in a direction, (d) the intermediate pieces, through the interior of the frame member, (e) the ends of the front Symbol intermediate piece, mutually opposite ends of said second strip and said first strip Each part is continuous. The connecting member has a Z-shaped cross section passing through the first piece, the intermediate piece, and the second piece, and the intermediate piece is disposed obliquely between the first piece and the second piece. ing. In the second step, (f) the frame body is disposed so as to extend in a frame shape along the peripheral edge portion of the one main surface of the substrate body, and (g) the connection member of the frame body. The first piece is joined to the terminal provided on the one main surface of the substrate body.

上記方法により製造された複合基板は、接続部材の第２片が外部回路基板に接続される。このとき、第１片と第２片の互いに反対側の端部が中間片の両端に連続する接続部材は、温度変化や衝撃力等により複合基板と外部回路基板との接合部分や基板本体と枠体との接合部分に生じる熱応力や衝撃応力等を、弾性変形することによって緩和することができる。そのため、接合信頼性を向上することができる。   In the composite substrate manufactured by the above method, the second piece of the connection member is connected to the external circuit substrate. At this time, the connecting member in which the opposite ends of the first piece and the second piece are connected to both ends of the intermediate piece is a joint between the composite board and the external circuit board or the board body due to temperature change, impact force, etc. Thermal stress, impact stress, and the like generated at the joint portion with the frame can be relaxed by elastic deformation. As a result, the bonding reliability can be improved.

さらに、複合基板が接続される外部回路基板が湾曲しても、接続部材の第１片又は第２片の一方は、枠部材から離れるように弾性変形して、接合部分の応力を緩和する。第１片又は第２片の他方については、回動が枠部材によって阻止される。これにより、接合部分に無理な力が作用しないようにして、接合信頼性を高めることができる。   Furthermore, even if the external circuit board to which the composite board is connected is curved, one of the first piece and the second piece of the connecting member is elastically deformed away from the frame member to relieve the stress at the joint portion. As for the other of the first piece and the second piece, the rotation is prevented by the frame member. Thereby, it is possible to increase the bonding reliability by preventing an excessive force from acting on the bonding portion.

本発明によれば、簡単な構成で、接合部分の熱応力や衝撃応力を緩和することができ、接合信頼性を向上することができる。   According to the present invention, with a simple configuration, the thermal stress and impact stress of the joint portion can be relaxed, and the joint reliability can be improved.

複合基板の全体構成を示す（Ａ）断面図、（Ｂ）底面図である。（実施例）It is (A) sectional drawing and (B) bottom view which show the whole structure of a composite substrate. (Example) 複合基板の作製工程を示す断面図である。（実施例）It is sectional drawing which shows the preparation process of a composite substrate. (Example) 複合基板の作製工程を示す断面図である。（実施例）It is sectional drawing which shows the preparation process of a composite substrate. (Example) 複合基板の作製工程を示す断面図である。（実施例）It is sectional drawing which shows the preparation process of a composite substrate. (Example) 複合基板の作製工程を示す断面図である。（実施例）It is sectional drawing which shows the preparation process of a composite substrate. (Example) 複合基板の作製工程を示す断面図である。（実施例）It is sectional drawing which shows the preparation process of a composite substrate. (Example) 複合基板の作製工程を示す断面図である。（実施例）It is sectional drawing which shows the preparation process of a composite substrate. (Example) 複合基板の作製工程を示す（Ａ）断面図、（Ｂ）要部拡大断面図である。（実施例）It is (A) sectional drawing which shows the preparation process of a composite substrate, (B) It is a principal part expanded sectional view. (Example) 枠体の作製工程を示す断面図である。（実施例）It is sectional drawing which shows the preparation process of a frame. (Example) 複合基板の変形の説明図である。（実施例）It is explanatory drawing of a deformation | transformation of a composite substrate. (Example) 複合基板の全体構成を示す断面図である。（変形例１）It is sectional drawing which shows the whole structure of a composite substrate. (Modification 1) 複合基板の全体構成を示す断面図である。（変形例２）It is sectional drawing which shows the whole structure of a composite substrate. (Modification 2) 複合基板の全体構成を示す断面図である。（変形例３）It is sectional drawing which shows the whole structure of a composite substrate. (Modification 3) 複合基板の要部拡大断面図である。（変形例４）It is a principal part expanded sectional view of a composite substrate. (Modification 4) 複合基板の全体構成を示す断面図である。（変形例５）It is sectional drawing which shows the whole structure of a composite substrate. (Modification 5) 複合基板の接合部分を示す要部拡大断面図である。（変形例５）It is a principal part expanded sectional view which shows the junction part of a composite substrate. (Modification 5) チップパッケージの断面図である。（従来例）It is sectional drawing of a chip package. (Conventional example)

符号の説明Explanation of symbols

１０ 複合基板
１２ 基板本体
１２ａ 他方主面
１２ｂ 一方主面
１６，１８ 端子
１６ａ 外側縁
１６ｂ 内側縁
１６ｃ 中心
２０ 枠体
２２ 枠部材
２３ 貫通穴
３０ 接続部材
３２ 第１片
３２ａ 外側縁
３２ｂ 内側縁
３２ｃ 中心
３４ 中間片
３６ 第２片
４０，４２，５０ チップ状電子部品DESCRIPTION OF SYMBOLS 10 Composite board | substrate 12 Board | substrate main body 12a Other main surface 12b One main surface 16, 18 Terminal 16a Outer edge 16b Inner edge 16c Center 20 Frame body 22 Frame member 23 Through-hole 30 Connection member 32 1st piece 32a Outer edge 32b Inner edge 32c Center 34 Intermediate piece 36 Second piece 40, 42, 50 Chip-shaped electronic component

以下、本発明の実施の形態について、図１〜図１６を参照しながら説明する。   Hereinafter, embodiments of the present invention will be described with reference to FIGS.

＜実施例＞ 図１〜図１０を参照しながら、複合基板１０について説明する。   <Example> The composite substrate 10 will be described with reference to FIGS.

図１（Ａ）の断面図及び図１（Ｂ）の底面図に示すように、複合基板１０は、平板状の基板本体１２の一方主面１２ｂに枠体２０が接合されている。   As shown in the cross-sectional view of FIG. 1A and the bottom view of FIG. 1B, the composite substrate 10 has a frame body 20 bonded to one main surface 12b of a flat substrate body 12.

基板本体１２の一方主面１２ｂには、ＩＣチップ等のチップ状電子部品５０が搭載され、チップ状電子部品５０の端子と基板本体１２の一方主面１２ｂに設けられたパッド１７とがボンディングワイヤー５２によって接続されている。なお、基板本体１２の一方主面１２ｂには、ワイヤーボンディング以外で接続するチップ状電子部品を搭載してもよい。例えば、表面実装型部品（ＳＭＤ）を搭載してもよい。   A chip-like electronic component 50 such as an IC chip is mounted on one main surface 12b of the substrate body 12, and the terminals of the chip-like electronic component 50 and the pads 17 provided on the one main surface 12b of the substrate body 12 are bonded wires. 52 is connected. Note that a chip-like electronic component connected by other than wire bonding may be mounted on the one main surface 12 b of the substrate body 12. For example, a surface mount type component (SMD) may be mounted.

基板本体１２の他方主面１２ａには、必要に応じて、チップコンデンサやＩＣチップ等のチップ状電子部品４０，４２が搭載され、はんだリフローやフリップチップボンディングによって、チップ状電子部品４０，４２の端子と基板本体１２の他方主面１２ａに設けられた端子１８とが接続される。   Chip-like electronic components 40 and 42 such as chip capacitors and IC chips are mounted on the other main surface 12a of the substrate body 12 as necessary, and the chip-like electronic components 40 and 42 are mounted by solder reflow or flip-chip bonding. The terminal and the terminal 18 provided on the other main surface 12a of the substrate body 12 are connected.

基板本体１２は、高密度化のために、片面又は両面に電子部品を実装可能な構造であればよい。基板本体１２は、例えば、複数のセラミック層が積層されたセラミック多層基板である。セラミック多層基板は、内部に電気回路を構成することにより実装密度を高めることができるので、複合基板１０の基板本体１２として好ましい。もっとも、基板本体１２はセラミック多層基板に限らず、１層のみのセラミック基板（例えば、アルミナ基板）であっても、セラミック以外の材料を用いた基板（例えば、プリント配線基板、フレキシブルプリント配線基板など）であってもよい。   The substrate body 12 may have any structure as long as electronic components can be mounted on one side or both sides for high density. The substrate body 12 is, for example, a ceramic multilayer substrate in which a plurality of ceramic layers are stacked. The ceramic multilayer substrate is preferable as the substrate body 12 of the composite substrate 10 because the mounting density can be increased by configuring an electric circuit therein. However, the substrate body 12 is not limited to a ceramic multilayer substrate, and even if it is a ceramic substrate having only one layer (for example, an alumina substrate), a substrate using a material other than ceramic (for example, a printed circuit board, a flexible printed circuit board, etc.) ).

枠体２０は、絶縁材料（例えば、樹脂）からなる枠部材２２に、複数の接続部材３０が配置されている。   In the frame 20, a plurality of connection members 30 are arranged on a frame member 22 made of an insulating material (for example, resin).

枠部材２２は、中央に貫通穴２３を有し、矩形の基板本体１２の一方主面１２ｂの周縁部に沿って枠状に延在する。枠部材２２の貫通穴２３によって、凹部（キャビティー）が形成され、この凹部の底面となる基板本体１２の一方主面１２ｂに、前述したチップ状電子部品５０とパッド１７とが配置されている。   The frame member 22 has a through hole 23 in the center, and extends in a frame shape along the peripheral edge portion of the one main surface 12 b of the rectangular substrate body 12. A concave portion (cavity) is formed by the through hole 23 of the frame member 22, and the above-described chip-shaped electronic component 50 and the pad 17 are disposed on the one main surface 12 b of the substrate body 12 which is the bottom surface of the concave portion. .

機械的破壊や熱や水分などの環境から保護するため、必要に応じて、枠部材２２の貫通穴２３に封止剤５４を充填し、チップ状電子部品５０を封止する。基板本体１２の一方主面１２ｂに、チップ状電子部品５０をはんだリフローで実装する場合や、チップ状電子部品５０をＡｕやはんだのバンプでフリップチップボンディングする場合には、封止剤５４はなくてもよい。   In order to protect from mechanical destruction and environments such as heat and moisture, the through hole 23 of the frame member 22 is filled with a sealing agent 54 as necessary, and the chip-shaped electronic component 50 is sealed. When the chip-like electronic component 50 is mounted on one main surface 12b of the substrate body 12 by solder reflow, or when the chip-like electronic component 50 is flip-chip bonded with Au or solder bumps, the sealing agent 54 is not provided. May be.

また、基板本体１２の他方主面１２ａ側のチップ状電子部品４０，４２を封止剤で封止したり、金属ケースを接合したりしてもよい。これは、複合基板１０を外部回路基板６０に実装する際にマウンターで吸着しやくするためである。特に高周波用の複合基板１０には、金属ケースを用いると、電磁シールドの効果もある。電磁シールドが不要な場合には、チップ状電子部品４０，４２の上面を被覆するように、エポキシ樹脂等の熱硬化性樹脂を塗布し、あるいはトランスファー成形し、天面を平らにする。   Further, the chip-shaped electronic components 40 and 42 on the other main surface 12a side of the substrate body 12 may be sealed with a sealant, or a metal case may be joined. This is because when the composite substrate 10 is mounted on the external circuit substrate 60, it is easily adsorbed by the mounter. In particular, when a metal case is used for the high-frequency composite substrate 10, there is an effect of electromagnetic shielding. When the electromagnetic shield is unnecessary, a thermosetting resin such as an epoxy resin is applied or transfer molded so as to cover the upper surfaces of the chip-like electronic components 40 and 42, and the top surface is flattened.

各接続部材３０は、枠部材２２の貫通穴２３を介して互いに対向するように、枠部材２２の４辺に配置されている。各接続部材３０は、帯状の金属薄板を鋭角に折り曲げて２つの屈曲部３３，３５が形成された断面略Ｚ字状の部材であり、中間片３４の両端にそれぞれ第１片３２と第２片３６とが連続している。中間片３４は、枠部材２２の内部を貫通している。第１片３２は、枠部材２２の基板本体１２に対向する面に沿って延在している。第２片３６は、枠部材２２の基板本体１２とは反対側の面に沿って延在し、外部に露出している。第１片３２と第２片３６とは、接続部材３０が枠部材２２の貫通穴２３を介して対向する方向に延在している。第１片３２と第２片３６の互いに反対側の端部、すなわち、第１片３２の枠部材２２の貫通穴２３とは反対側の端部と、第２片３６の枠部材２２の貫通穴２３側の端部とが、それぞれ、中間片３４の両端に連続している。つまり、第１片３２の先端３１が内側を向き、第２片３６の先端３７が外側を向くように配置され、中間片３４は第１片３２と第２片３６との間に斜めに配置されている。   The connection members 30 are arranged on the four sides of the frame member 22 so as to face each other through the through holes 23 of the frame member 22. Each connection member 30 is a member having a substantially Z-shaped cross section in which two bent portions 33 and 35 are formed by bending a strip-shaped metal thin plate at an acute angle, and a first piece 32 and a second piece are respectively formed at both ends of the intermediate piece 34. The piece 36 is continuous. The intermediate piece 34 penetrates the inside of the frame member 22. The first piece 32 extends along a surface of the frame member 22 that faces the substrate body 12. The second piece 36 extends along the surface of the frame member 22 opposite to the substrate body 12 and is exposed to the outside. The first piece 32 and the second piece 36 extend in a direction in which the connection member 30 is opposed to each other through the through hole 23 of the frame member 22. The ends of the first piece 32 and the second piece 36 opposite to each other, that is, the end of the first piece 32 opposite to the through hole 23 of the frame member 22, and the penetration of the frame member 22 of the second piece 36. The end portions on the hole 23 side are respectively continuous with both ends of the intermediate piece 34. In other words, the tip 31 of the first piece 32 is disposed so that the tip 31 faces inward and the tip 37 of the second piece 36 faces outward, and the intermediate piece 34 is disposed obliquely between the first piece 32 and the second piece 36. Has been.

第１片３２と第２片３６とは、長さが異なる。すなわち、第２片３６の先端３７は枠部材２２の外周面２４に達しているが、第１片３２の先端３１は、枠部材２２の貫通穴２３の内周面２３ｂに達していない。もっとも、第１片３２の先端３１が、枠部材２２の貫通穴２３の内周面２３ｂに達するように構成してもよい。   The first piece 32 and the second piece 36 have different lengths. That is, the tip 37 of the second piece 36 reaches the outer peripheral surface 24 of the frame member 22, but the tip 31 of the first piece 32 does not reach the inner peripheral surface 23 b of the through hole 23 of the frame member 22. But you may comprise so that the front-end | tip 31 of the 1st piece 32 may reach the internal peripheral surface 23b of the through-hole 23 of the frame member 22. FIG.

接続部材３０の第１片３２は、基板本体１２の一方主面１２ｂに設けられた端子１６に、はんだ２６で接合される。これによって、枠体２０は基板本体１２の一方主面１２ｂに接合される。   The first piece 32 of the connection member 30 is joined to the terminal 16 provided on the one main surface 12 b of the substrate body 12 with solder 26. As a result, the frame body 20 is joined to the one main surface 12 b of the substrate body 12.

外部に露出している接続部材３０の第２片３６は、外部回路基板６０に接合される。これによって、複合基板１０は外部回路基板６０に実装され、電気的に接続される。基板本体１２に金属ケースを接合する場合には、金属ケースも外部回路基板６０に電気的に接続されるようにする。   The second piece 36 of the connection member 30 exposed to the outside is bonded to the external circuit board 60. As a result, the composite substrate 10 is mounted on the external circuit substrate 60 and electrically connected thereto. When a metal case is joined to the substrate body 12, the metal case is also electrically connected to the external circuit board 60.

接続部材３０に用いる金属薄板の厚みは、５０μｍ〜３００μｍが好ましい。   The thickness of the metal thin plate used for the connecting member 30 is preferably 50 μm to 300 μm.

接続部材３０に用いる金属薄板の厚みが５０μｍ未満では、折り曲げ加工時のばらつきが大きくなり、第１片３２や第２片３６の位置や高さのばらつきが大きくなってしまう。第１片３２や第２片３６の位置や高さのばらつきが大きくなると、枠体２０と基板本体１２との位置合わせ精度が低下する。枠体２０と基板本体１２とを確実に接合するために、第１片３２の位置ずれ分の余裕を見込んで、第１片３２と接合する基板本体１２の端子１６を大きくすると、基板本体１２の小型化、ひいては複合基板１０の小型化を損ねる。   If the thickness of the metal thin plate used for the connection member 30 is less than 50 μm, the variation during bending becomes large, and the variation in the position and height of the first piece 32 and the second piece 36 becomes large. When the variation in the position and height of the first piece 32 and the second piece 36 is increased, the alignment accuracy between the frame body 20 and the substrate body 12 is lowered. In order to securely bond the frame body 20 and the substrate body 12, if the terminal 16 of the substrate body 12 to be bonded to the first piece 32 is made large in consideration of a margin for the positional deviation of the first piece 32, the substrate body 12. Downsizing, and consequently downsizing of the composite substrate 10 is impaired.

第１片３２や第２片３６の高さがばらつくと、例えば、基板本体１２と枠体２０との間や、枠体２０と外部回路基板６０との間のはんだの厚みがばらつき、接合信頼性が損なわれる。高さのばらつき分を見込んで高さマージンを大きくすると、複合基板１０の低背化を阻害する。   If the heights of the first piece 32 and the second piece 36 vary, for example, the solder thickness varies between the board body 12 and the frame body 20 or between the frame body 20 and the external circuit board 60, resulting in bonding reliability. Sexuality is impaired. If the height margin is increased in consideration of the height variation, the height reduction of the composite substrate 10 is hindered.

さらに、熱応力や衝撃応力により、接続部材３０の屈曲部３３，３５付近は繰り返し疲労を受けるが、厚みが小さいと疲労破壊しやすいため、接合信頼性を損ねる。   Further, the vicinity of the bent portions 33 and 35 of the connection member 30 is repeatedly subjected to fatigue due to thermal stress and impact stress. However, if the thickness is small, the fatigue reliability is liable to be deteriorated, so that the joint reliability is impaired.

接続部材３０に用いる金属薄板の厚みが３００μｍを越えると、折り曲げ加工が難しくなり、曲げ角度のばらつき、高さのばらつきが大きくなる。また、打ち抜きや折り曲げの間隔を小さくし、第１片３２、中間片３４、第２片３６の長さ（第１片３２、中間片３４、第２片３６が連続する方向の寸法）や幅（第１片３２、中間片３４、第２片３６が連続する方向に直角方向の寸法）を小さくすることができないため、複合基板１０の小型化、低背化を阻害する。   When the thickness of the metal thin plate used for the connecting member 30 exceeds 300 μm, the bending process becomes difficult, and the variation in bending angle and the variation in height become large. Further, the interval between the punching and bending is reduced, and the length (the dimension in the direction in which the first piece 32, the intermediate piece 34, and the second piece 36 are continuous) and the width of the first piece 32, the intermediate piece 34, and the second piece 36. Since (the dimension in a direction perpendicular to the direction in which the first piece 32, the intermediate piece 34, and the second piece 36 are continuous) cannot be reduced, the size reduction and the height reduction of the composite substrate 10 are hindered.

接続部材３０には、基板本体１２や外部回路基板６０との接合に使用されるはんだや導電性接着剤との濡れ性をよくし、接合強度を高めるため、Ｎｉ／Ｓｎ、Ｎｉ／Ａｕ、Ｎｉ／はんだなどをめっきしてもよい。このようなめっきは、接続部材３０の全面に施しても、第１片３２や第２片３６の接合面のみに施してもよい。   The connecting member 30 is made of Ni / Sn, Ni / Au, Ni in order to improve wettability with solder and conductive adhesive used for bonding to the substrate body 12 and the external circuit board 60 and to increase bonding strength. / Solder or the like may be plated. Such plating may be performed on the entire surface of the connection member 30 or only on the bonding surface of the first piece 32 and the second piece 36.

次に、複合基板１０の作製工程について、図２〜図９を参照しながら説明する。   Next, the manufacturing process of the composite substrate 10 will be described with reference to FIGS.

まず、基板本体１２と枠体２０とを準備する。   First, the substrate body 12 and the frame body 20 are prepared.

基板本体１２は、セラミック多層基板の場合、例えば複数のセラミック層を積層してなり、図２に示すように、内部には、Ａｇ、Ａｇ／Ｐｄ、Ａｇ／Ｐｔ、Ｃｕ、ＣｕＯなどを主成分とする導電性ペーストを用いて面内導体パターン１４やビアホール導体パターン１３が形成されている。このような構成は、低抵抗のＡｇやＣｕを使うので、信号損失が小さく、高周波用の部品あるいはモジュールとして実用化されている。基板本体１２の一方主面１２ｂには、端子１６やパッド１７が形成され、他方主面１２ａには接合電極（接合用ランド）となる端子１８が形成されている。端子１６，１８やパッド１７には、必要に応じて、Ｎｉ／Ｓｎ、Ｎｉ／Ａｕ、Ｎｉ／Ｐｄ／Ａｕ、Ｎｉ／はんだをめっきする。   In the case of a ceramic multilayer substrate, the substrate body 12 is formed by, for example, laminating a plurality of ceramic layers. As shown in FIG. 2, the inside of the substrate body 12 is mainly composed of Ag, Ag / Pd, Ag / Pt, Cu, CuO, or the like. The in-plane conductor pattern 14 and the via hole conductor pattern 13 are formed using the conductive paste. Since such a configuration uses Ag or Cu having low resistance, the signal loss is small and it is put into practical use as a high-frequency component or module. A terminal 16 and a pad 17 are formed on one main surface 12b of the substrate body 12, and a terminal 18 serving as a bonding electrode (bonding land) is formed on the other main surface 12a. The terminals 16 and 18 and the pad 17 are plated with Ni / Sn, Ni / Au, Ni / Pd / Au, or Ni / solder as necessary.

具体的には、面内導体パターン１４やビアホール導体パターン１３等が形成された厚さ１０〜２００μｍ程度の未焼成セラミックグリーンシートと、セラミックグリーンシートの焼成温度よりも高温で焼結する拘束層とを準備する。未焼成セラミックグリーンシートは低温焼結セラミックス材料を含み、焼結温度は１０５０℃以下である。低温焼結セラミック材料としては、具体的には、アルミナやフォルステライト等のセラミック粉末にホウ珪酸系ガラスを混合してなるガラス複合系ＬＴＣＣ（Ｌｏｗ Ｔｅｍｐｅｒａｔｕｒｅ Ｃｏ−ｆｉｒｅｄ Ｃｅｒａｍｉｃ）材料、ＺｎＯ−ＭｇＯ−Ａｌ２Ｏ３−ＳｉＯ２系の結晶化ガラスを用いた結晶化ガラス系ＬＴＣＣ材料、ＢａＯ−Ａｌ２Ｏ３−ＳｉＯ２系セラミック粉末やＡｌ２Ｏ３−ＣａＯ−ＳｉＯ２−ＭｇＯ−Ｂ２Ｏ３系セラミック粉末等を用いた非ガラス系ＬＴＣＣ材料等、が挙げられる。また、拘束層はアルミナを含む材料からなっている。次いで、未焼成セラミックグリーンシートと拘束層とを適宜な順序で積層して、複数枚の未焼成セラミックグリーンシートを積層した積層体の両主面に拘束層が積層された複合積層体を形成する。次いで、この複合積層体を、セラミックグリーンシートの焼結温度で焼成した後、焼結していない拘束層を除去して、未焼成セラミックグリーンシートが焼結して形成された基板本体１２を取り出す。Specifically, an unfired ceramic green sheet having a thickness of about 10 to 200 μm on which the in-plane conductor pattern 14 and the via-hole conductor pattern 13 are formed, and a constraining layer that is sintered at a temperature higher than the firing temperature of the ceramic green sheet; Prepare. The green ceramic green sheet includes a low-temperature sintered ceramic material, and the sintering temperature is 1050 ° C. or lower. Specific examples of the low-temperature sintered ceramic material include a glass composite LTCC (Low Temperature Co-fired Ceramic) material obtained by mixing borosilicate glass with ceramic powder such as alumina and forsterite, ZnO-MgO-Al. Crystallized glass-based LTCC material using 2 O 3 —SiO 2 -based crystallized glass, BaO—Al 2 O 3 —SiO 2 -based ceramic powder and Al 2 O 3 —CaO—SiO 2 —MgO—B 2 O 3 Non-glass type LTCC material using a ceramic ceramic powder or the like. The constraining layer is made of a material containing alumina. Next, the unfired ceramic green sheet and the constraining layer are laminated in an appropriate order to form a composite laminate in which constraining layers are laminated on both main surfaces of a laminate in which a plurality of unfired ceramic green sheets are laminated. . Next, after firing this composite laminate at the sintering temperature of the ceramic green sheet, the unsintered constraining layer is removed, and the substrate body 12 formed by sintering the unfired ceramic green sheet is taken out. .

枠体２０は、図９に示す工程により作製する。   The frame 20 is produced by the process shown in FIG.

すなわち、図９（Ａ）に示すように、青銅、洋白、Ｎｉ合金などの金属薄板を金型で打ち抜いて、先端３１が互いに対向する複数の帯状部３０ｘを形成する。   That is, as shown in FIG. 9A, a metal thin plate such as bronze, white or white, or an Ni alloy is punched out with a mold to form a plurality of strip portions 30x whose tips 31 face each other.

次いで、図９（Ｂ）に示すように、対向する帯状部３０ｘの先端３１側を鋭角に折り曲げて第１の屈曲部３３を形成する。先端３１と第１の屈曲部３３との間が、第１片３２となる。   Next, as shown in FIG. 9B, the first bent portion 33 is formed by bending the leading end 31 side of the opposing band-shaped portion 30x at an acute angle. A first piece 32 is formed between the tip 31 and the first bent portion 33.

次いで、図９（Ｃ）に示すように、第１の屈曲部３３よりも基端３８側を逆方向に鋭角に折り曲げて第２の屈曲部３５を形成する。第１の屈曲部３３と第２の屈曲部３５との間が、中間片３４となる。   Next, as shown in FIG. 9C, the second bent portion 35 is formed by bending the base end 38 side of the first bent portion 33 at an acute angle in the opposite direction. The intermediate piece 34 is between the first bent portion 33 and the second bent portion 35.

次いで、図９（Ｄ）に示すように、帯状部３０ｘに樹脂をモールドし、貫通穴２３を有する枠部材２２を形成する。このとき、先端３１と第１の屈曲部３３との間の第１片３２と、第２の屈曲部３５よりも基端３８側とが金型の内面に沿い、第１の屈曲部３３と第２の屈曲部３５との間の中間片３４が金型の内面から離れるようにして、ＬＣＰ（液晶ポリマー）、ＰＰＳ（ポリフェニレンサルファイド）等の熱可塑性樹脂の射出成形、あるいは、エポキシ系樹脂などの熱硬化性樹脂のトランスファー成形により、樹脂成形する。   Next, as shown in FIG. 9D, resin is molded into the band-shaped portion 30 x to form the frame member 22 having the through hole 23. At this time, the first piece 32 between the distal end 31 and the first bent portion 33 and the base end 38 side of the second bent portion 35 are along the inner surface of the mold, and the first bent portion 33 Injection molding of thermoplastic resin such as LCP (liquid crystal polymer), PPS (polyphenylene sulfide), or epoxy resin so that the intermediate piece 34 between the second bent portion 35 is separated from the inner surface of the mold. The resin is molded by transfer molding of the thermosetting resin.

次いで、図９（Ｅ）に示すように、成形した樹脂（すなわち、枠部材２２）からはみ出した帯状部３０ｘの基端３８側の部分を、枠部材２２の外周面２４に沿って切り離す。これにより、第２片３６の先端３７は、枠部材２２の外周面２４に達している。   Next, as shown in FIG. 9E, the portion on the base end 38 side of the band-shaped portion 30 x that protrudes from the molded resin (that is, the frame member 22) is cut along the outer peripheral surface 24 of the frame member 22. Thereby, the tip 37 of the second piece 36 reaches the outer peripheral surface 24 of the frame member 22.

次いで、図３に示すように、基板本体１２の一方主面１２ｂの端子１６に、はんだペースト２５を印刷する。なお、接合材としては、はんだの他、Ａｇ等の金属粉末を含む導電性樹脂ペースト等の接合材を用いることもできる。   Next, as shown in FIG. 3, the solder paste 25 is printed on the terminals 16 on the one main surface 12 b of the substrate body 12. In addition, as a bonding material, a bonding material such as a conductive resin paste containing metal powder such as Ag can be used in addition to solder.

次いで、基板本体１２の一方主面１２ｂに枠体２０を搭載し、枠体２０の接続部材３０の第１片３２がはんだペースト２５に当接した状態ではんだペースト２５をリフローし、図４に示すように、はんだペースト２５が固化したはんだ２６により、基板本体１２と枠体２０とを接合する。このとき、接続部材３０の中間片３４が枠部材２２の内部に配置されており、貫通穴２３の内面に接続部材３０が露出しないので、基板本体１２と枠体２０との接合を容易に行うことができる。接合後、洗浄を行って、基板本体１２の一方主面１２ｂに設けたパッド１７の汚れを除去する。   Next, the frame body 20 is mounted on the one main surface 12b of the substrate body 12, and the solder paste 25 is reflowed in a state where the first piece 32 of the connection member 30 of the frame body 20 is in contact with the solder paste 25, as shown in FIG. As shown, the substrate body 12 and the frame body 20 are joined by the solder 26 in which the solder paste 25 is solidified. At this time, since the intermediate piece 34 of the connecting member 30 is disposed inside the frame member 22 and the connecting member 30 is not exposed to the inner surface of the through hole 23, the substrate body 12 and the frame body 20 are easily joined. be able to. After bonding, cleaning is performed to remove the dirt on the pad 17 provided on the one main surface 12b of the substrate body 12.

なお、基板本体１２の一方主面１２ｂに、表面実装型部品を搭載する場合、枠体２０の接合と同時に、表面実装型部品の接合を行うことができる。   When a surface mount type component is mounted on the one main surface 12 b of the substrate body 12, the surface mount type component can be joined simultaneously with the joining of the frame body 20.

次いで、図５に示すように、枠体２０の貫通穴２３から、基板本体１２の一方主面１２ｂに、ＩＣ、ＦＥＴなどのチップ状電子部品５０を、エポキシ系樹脂又は導電性樹脂等で搭載し、チップ状電子部品５０の端子と、基板本体１２の一方主面１２ｂに設けたパッド１７との間を、Ａｕ、Ａｌ、Ｃｕなどのボンディングワイヤー５２によって接続する。このとき、接続部材３０の中間片３４が枠部材２２の内部に配置されており、貫通穴２３の内面に接続部材３０が露出しないので、ワイヤーボンディングを容易に行うことができる。   Next, as shown in FIG. 5, a chip-like electronic component 50 such as an IC or FET is mounted on the one main surface 12 b of the substrate body 12 from the through hole 23 of the frame body 20 with an epoxy resin or a conductive resin. The terminals of the chip-like electronic component 50 and the pads 17 provided on the one main surface 12b of the substrate body 12 are connected by bonding wires 52 such as Au, Al, and Cu. At this time, since the intermediate piece 34 of the connecting member 30 is disposed inside the frame member 22 and the connecting member 30 is not exposed to the inner surface of the through hole 23, wire bonding can be easily performed.

次いで、枠体２０の貫通穴２３に、エポキシ系樹脂等の封止剤５４を充填して熱硬化し、図６に示すように、チップ状電子部品５０やボンディングワイヤー５２、パッド１７を封止剤５４で覆い、封止する。   Next, the through hole 23 of the frame 20 is filled with a sealing agent 54 such as an epoxy resin and thermally cured to seal the chip-shaped electronic component 50, the bonding wire 52, and the pad 17 as shown in FIG. Cover with an agent 54 and seal.

このとき、封止剤５４の高さが枠体２０を超えないようにする。複合基板１０を外部回路基板６０に接合するときに、封止剤５４が干渉しないようにするためである。   At this time, the height of the sealant 54 is set so as not to exceed the frame body 20. This is to prevent the sealing agent 54 from interfering when the composite substrate 10 is bonded to the external circuit substrate 60.

また、封止剤５４が、枠部材２２から露出している接続部材３０の第２片３６にまで濡れ広がると、第２片３６にはんだが付かなくなり、外部回路基板６０と接合できなくなる。これを防ぐため、第２片３６やその周辺に、離型剤や撥水剤を塗布してもよい。   Further, when the sealing agent 54 spreads to the second piece 36 of the connection member 30 exposed from the frame member 22, the second piece 36 is not soldered and cannot be joined to the external circuit board 60. In order to prevent this, a mold release agent or a water repellent may be applied to the second piece 36 or its periphery.

封止剤５４が硬化したら、図７に示すように上下を反転し、基板本体１２の他方主面１２ａに、はんだ、Ａｇ等を含むはんだペーストを印刷し、チップコンデンサ等のチップ状電子部品４０を搭載して、リフローもしくは熱硬化して、あるいはＩＣチップ等のチップ状電子部品４２をはんだボール４３を介してフリップチップボンディングして、チップ状電子部品４０，４２の端子と基板本体１２の他方主面１２ａの端子１８とを接合する。必要に応じて、フリップチップボンディングしたチップ状電子部品４２と基板本体１２の他方主面１２ａとの間に、エポキシ系樹脂からなるアンダーフィル樹脂を充填、熱硬化する。金属ケースを用いる場合には、チップ状電子部品４０，４２の接合後に、洋白、りん青銅等からなる金属ケースを、基板本体１２の他方主面１２ａ上又は側面に搭載し、接合する。   When the encapsulant 54 is cured, it is turned upside down as shown in FIG. 7, and a solder paste containing solder, Ag or the like is printed on the other main surface 12a of the substrate body 12, and a chip-like electronic component 40 such as a chip capacitor is printed. Is mounted, and is reflowed or thermally cured, or a chip-shaped electronic component 42 such as an IC chip is flip-chip bonded via a solder ball 43 to connect the terminals of the chip-shaped electronic components 40 and 42 and the other of the substrate body 12. The terminal 18 of the main surface 12a is joined. If necessary, an underfill resin made of an epoxy resin is filled between the chip-shaped electronic component 42 that has been flip-chip bonded and the other main surface 12a of the substrate main body 12 and thermally cured. When a metal case is used, after joining the chip-like electronic components 40 and 42, a metal case made of white or phosphor bronze is mounted on the other main surface 12a or the side surface of the substrate body 12 and joined.

以上の工程で作製された複合基板１０は、例えば図８（Ａ）の断面図、図８（Ｂ）の要部拡大断面図に示すように、外部回路基板６０に実装する場合、枠部材２２の基板本体１２とは反対側の面に露出している接続部材３０の第２片３６を、プリント配線板等の外部回路基板６０の接合用ランド等の表面電極６２に、はんだ６６を介して接合する。これによって、基板本体１２の一方主面１２ｂに設けられた端子１６は、はんだ２６、接続部材３０、はんだ６６を介して、外部回路基板６０の表面電極６２と電気的に接続される。   When the composite substrate 10 manufactured by the above steps is mounted on the external circuit board 60 as shown in, for example, the cross-sectional view of FIG. 8A and the enlarged cross-sectional view of the main part of FIG. The second piece 36 of the connecting member 30 exposed on the surface opposite to the board body 12 is connected to a surface electrode 62 such as a bonding land of an external circuit board 60 such as a printed wiring board via a solder 66. Join. As a result, the terminal 16 provided on the one main surface 12 b of the board body 12 is electrically connected to the surface electrode 62 of the external circuit board 60 via the solder 26, the connection member 30, and the solder 66.

接続部材３０は、中間片３４が枠部材２２の内部に配置されており、貫通穴２３の内面に接続部材３０が露出しないので、基板本体１２の一方主面１２ｂへのチップ状電子部品５０の搭載や、枠体２０の接合を容易に行うことができるため、加工時のマージン（余裕を持たせるための隙間）を小さくし、枠部材２２、ひいては複合基板１０を小型化することができる。   In the connecting member 30, the intermediate piece 34 is disposed inside the frame member 22, and the connecting member 30 is not exposed on the inner surface of the through hole 23, so that the chip-like electronic component 50 on the one main surface 12 b of the substrate body 12 is not exposed. Since mounting and joining of the frame body 20 can be easily performed, a margin at the time of processing (a gap for providing a margin) can be reduced, and the frame member 22 and thus the composite substrate 10 can be reduced in size.

また、接続部材３０は、２箇所の屈曲部３３，３５で折り曲げることにより、第１片３２と第２片３６とが対向する領域の外側に中間片３４がはみ出ないようにすることができるので、小型化することができる。   Further, since the connecting member 30 is bent at the two bent portions 33 and 35, the intermediate piece 34 can be prevented from protruding outside the region where the first piece 32 and the second piece 36 face each other. Can be downsized.

接続部材の屈曲部を円弧状にすると、第１片と第２片の平面部分同士が対向する領域の外側に湾曲部分がはみ出してしまい、枠部材の小型化、ひいては複合基板１０の小型化を阻害することがあるので、接続部材は複数箇所で折り曲げ、かつ、折り曲げ角度が鋭角になることが好ましい。ただし、本発明は、屈曲部にアールがついたものを排除するものではない。   If the bent portion of the connecting member is formed in an arc shape, the curved portion protrudes outside the region where the planar portions of the first piece and the second piece face each other, thereby reducing the size of the frame member, and hence the size of the composite substrate 10. Therefore, it is preferable that the connecting member is bent at a plurality of locations and the bending angle is an acute angle. However, the present invention does not exclude a bent portion having a radius.

一方、接続部材に屈曲部を３箇所設け、中間片を、第１片と第２片とが対向する領域の内側で折り曲げるようにしてもよい。小型化を阻害しないためである。例えば中間片をく字状に折り曲げてもよい。屈曲部を増やことにより、各方向のばね定数の組み合わせを変えることができる。   On the other hand, the connecting member may be provided with three bent portions, and the intermediate piece may be bent inside the region where the first piece and the second piece face each other. This is because it does not hinder downsizing. For example, the intermediate piece may be folded into a square shape. By increasing the number of bent portions, the combination of spring constants in each direction can be changed.

複合基板１０は、以下に説明するように熱応力や衝撃応力を緩和することができるため、接合信頼性を向上することができる。特に、基板本体１２が、アルミナ基板などと比べて曲げ強度が低く、ガラス等を含み脆いセラミック多層基板の場合、熱応力や衝撃応力の緩和により、基板本体の破壊を防止する効果も大きい。   Since the composite substrate 10 can relieve thermal stress and impact stress as will be described below, the bonding reliability can be improved. In particular, when the substrate body 12 is a ceramic multilayer substrate having a lower bending strength than that of an alumina substrate or the like and containing glass or the like, the substrate body 12 has a great effect of preventing the substrate body from being destroyed by relaxing thermal stress and impact stress.

すなわち、接続部材３０は、塑性変形するように折り曲げられた連続する金属端子であるので、ＸＹＺ方向のいずれにも弾性変形する。また、成形された樹脂、すなわち枠部材２２と接続部材３０とは基本的に接合しておらず、樹脂成形された後も、ＸＹＺ方向に自由に弾性変形する。   That is, since the connection member 30 is a continuous metal terminal bent so as to be plastically deformed, it is elastically deformed in any of the XYZ directions. Further, the molded resin, that is, the frame member 22 and the connecting member 30 are not basically joined, and even after being molded, the resin is freely elastically deformed in the XYZ directions.

接続部材３０が弾性変形可能であると、枠体２０を基板本体１２に接合するときや、複合基板１０を外部回路基板６０に接合するときのリフロー、その後のヒートサイクル時の熱により、各部の線膨張係数αの差により熱応力が発生しても、弾性変形で熱応力を吸収することができる。同様に、落下衝撃時などの衝撃応力も、弾性変形で吸収することができる。そのため、接合信頼性が向上する。   If the connecting member 30 is elastically deformable, the reflow when the frame body 20 is bonded to the substrate body 12 or the composite substrate 10 is bonded to the external circuit substrate 60, and the heat during the subsequent heat cycle, Even if thermal stress occurs due to the difference in the linear expansion coefficient α, the thermal stress can be absorbed by elastic deformation. Similarly, an impact stress such as a drop impact can be absorbed by elastic deformation. As a result, the bonding reliability is improved.

図１０を参照しながら、さらに詳しく説明する。   This will be described in more detail with reference to FIG.

一般に、基板本体１２と外部回路基板６０とは熱膨張率又は線膨張係数が異なるため、図１０（Ａ）に示すように、例えば複合基板１０を外部回路基板６０に接合するためのリフロー工程や、使用時の温度上昇によって、貫通穴２３を介して対向して配置されている接続部材３０と基板本体１２や外部回路基板６０との間の接合部分に、せん断力Ｆｓや曲げモーメントＭｓが作用する。このとき、接続部材３０が弾性変形して、接続部材３０の第１片３２と基板本体１２との接合部分や、接続部材３０の第２片３６と外部回路基板６０との接合部分に作用する応力を緩和する。   In general, since the substrate body 12 and the external circuit board 60 have different coefficients of thermal expansion or linear expansion, for example, a reflow process for bonding the composite board 10 to the external circuit board 60 as shown in FIG. The shearing force Fs and the bending moment Ms act on the joint portion between the connecting member 30 and the board body 12 or the external circuit board 60 that are arranged to face each other through the through hole 23 due to a temperature rise during use. To do. At this time, the connection member 30 is elastically deformed and acts on the joint portion between the first piece 32 of the connection member 30 and the substrate body 12 and the joint portion between the second piece 36 of the connection member 30 and the external circuit board 60. Relieve stress.

基板本体１２側の伸びδ１は、対向して配置された接続部材３０の第１屈曲部３３間の距離Ｌ１と基板本体１２の線膨張係数α１との積となる。外部回路基板６０側の伸びδ２は、対向して配置された接続部材３０の第２屈曲部３５間の距離Ｌ２と外部回路基板６０の線膨張係数α２との積となる。せん断力Ｆｓや曲げモーメントＭｓは、δ２−δ１＝α２×Ｌ２−α１×Ｌ１に比例する。一般に、セラミック等の基板本体１２の線膨張係数α１は、樹脂製のプリント配線基板等の外部回路基板６０の線膨張係数α２よりも小さく、α１＜α２であるため、δ２−δ１＝α２×Ｌ２−α１×Ｌ１は、Ｌ１＞Ｌ２の場合の方が、Ｌ１＜Ｌ２の場合よりも小さくなり、せん断力Ｆｓや曲げモーメントＭｓも小さくなる。したがって、対向する接続部材３０は、図示したように、Ｌ１＞Ｌ２となるように配置とすると、接合部分に作用するせん断力Ｆｓや曲げモーメントＭｓが小さくなり、接合信頼性が向上するので、好ましい。The elongation δ 1 on the substrate body 12 side is the product of the distance L1 between the first bent portions 33 of the connecting members 30 arranged opposite to each other and the linear expansion coefficient α 1 of the substrate body 12. The elongation δ 2 on the external circuit board 60 side is the product of the distance L2 between the second bent portions 35 of the connecting members 30 arranged to face each other and the linear expansion coefficient α 2 of the external circuit board 60. The shear force Fs and the bending moment Ms are proportional to δ 2 −δ 1 = α 2 × L 2 −α 1 × L 1 . In general, linear expansion coefficient alpha 1 of the substrate main body 12 of ceramic or the like is smaller than the linear expansion coefficient alpha 2 of the external circuit board 60 such as a resin of a printed wiring board, a α 1 <α 2, δ 2 - δ 1 = α 2 × L2−α 1 × L1 is smaller in the case of L1> L2 than in the case of L1 <L2, and the shearing force Fs and the bending moment Ms are also small. Therefore, it is preferable that the facing connection member 30 is arranged so that L1> L2, as shown in the drawing, since the shearing force Fs and the bending moment Ms acting on the joining portion are reduced, and the joining reliability is improved. .

なお、本発明は、Ｌ１＜Ｌ２の場合、すなわち、対向して配置された接続部材３０を図において左右を入れ替えて配置し、対向して配置された接続部材３０の第１の屈曲部３３同士を内側に向けて配置し、接続部材３０の第２の屈曲部３５同士を外側に向けて配置する場合を排除するものではない。   In the present invention, when L1 <L2, that is, the connecting members 30 arranged to face each other are arranged with the left and right sides interchanged in the drawing, and the first bent portions 33 of the connecting members 30 arranged to face each other are arranged. This is not to exclude the case where the second bent portions 35 of the connecting member 30 are arranged facing outwards.

また、金属と樹脂は接着しにくいため、金属薄板を折り曲げ加工した接続部材３０は、樹脂の枠部材２２に埋設されていても、枠部材２２に接着していなかったり、接着していても接着部分が簡単に剥離したりするので、容易に弾性変形することができる。   Further, since the metal and the resin are difficult to adhere, the connection member 30 obtained by bending the metal thin plate is embedded in the resin frame member 22, is not adhered to the frame member 22, or is adhered even if it is adhered. Since the part easily peels off, it can be easily elastically deformed.

そのため、図１０（Ｂ）に示すように、外部回路基板６０の表面６１が複合基板１０側に接近するように凸状に湾曲した場合、接続部材３０は、第２片３６が大略第２の屈曲部３５を中心に回動し、枠部材２２との間に隙間が形成されるように弾性変形する。これによって、接続部材３０の第２片３６と外部回路基板６０との間の接合部分に無理な力が作用しないようにして、接合信頼性を高めることができる。   Therefore, as shown in FIG. 10B, when the surface 61 of the external circuit board 60 is curved so as to approach the composite board 10 side, the connecting member 30 has the second piece 36 generally second. It rotates around the bent portion 35 and elastically deforms so that a gap is formed between the frame member 22 and the frame member 22. As a result, it is possible to improve the bonding reliability by preventing an excessive force from acting on the bonding portion between the second piece 36 of the connection member 30 and the external circuit board 60.

また、接続部材３０の第１片３２と基板本体１２との接合部分については、接続部材３０の第１片３２以外の部分３４，３６が大略第１の屈曲部３３を中心に、基板本体１２を押圧する方向に回動しようとするが、枠部材２２によって回動が阻止され、接続部材３０の第１片３２と基板本体１２との間の接合部分に無理な力が作用しないようにして、接合信頼性を高めることができる。   In addition, with respect to the joint portion between the first piece 32 of the connection member 30 and the substrate body 12, the portions 34 and 36 other than the first piece 32 of the connection member 30 are substantially centered around the first bent portion 33. However, the frame member 22 prevents the rotation and prevents an excessive force from acting on the joint portion between the first piece 32 of the connection member 30 and the substrate body 12. In addition, the bonding reliability can be improved.

また、図１０（Ｃ）に示すように、外部回路基板６０の表面６１が複合基板１０側から離れるように凹状に湾曲した場合、接続部材３０は、第１片３２以外の部分３４，３６が、枠部材２２とともに、大略第１の屈曲部３５を中心に回動し、第１片３２と枠部材２２との間に隙間が形成されるように弾性変形する。これによって、接続部材３０の第１片３２と基板本体１２との間の接合部分に無理な力が作用しないようにすることができ、接合信頼性を高めることができる。   As shown in FIG. 10C, when the surface 61 of the external circuit board 60 is curved so as to be away from the composite substrate 10 side, the connecting member 30 has portions 34 and 36 other than the first piece 32. Together with the frame member 22, it rotates about the first bent portion 35 and is elastically deformed so that a gap is formed between the first piece 32 and the frame member 22. Thereby, it is possible to prevent an excessive force from acting on the joint portion between the first piece 32 of the connection member 30 and the substrate body 12, and to improve the joint reliability.

このとき、接続部材３０の第１の屈曲部３３付近に応力が集中するが、封止剤５４があれば、封止剤５４により枠部材２２と基板本体１２との接合が補強され、応力集中が緩和され、接合信頼性をより高めることができる。   At this time, stress concentrates in the vicinity of the first bent portion 33 of the connection member 30, but if there is the sealant 54, the joint between the frame member 22 and the substrate body 12 is reinforced by the sealant 54, and the stress is concentrated. Can be relaxed and the bonding reliability can be further improved.

また、接続部材３０の第２片３６と外部回路基板６０との接合部分については、接続部材３０の第２片３６が大略第２の屈曲部３５を中心に、外部回路基板６０を押圧する方向に回動しようとするが、枠部材２２によって回動が阻止され、接続部材３０の第２片３６と外部回路基板６０との間の接合部分に無理な力が作用しないようにすることができ、接合信頼性を高めることができる。   In addition, with respect to the joint portion between the second piece 36 of the connection member 30 and the external circuit board 60, the direction in which the second piece 36 of the connection member 30 presses the external circuit board 60 about the second bent portion 35. However, the frame member 22 prevents the rotation and prevents an excessive force from acting on the joint portion between the second piece 36 of the connection member 30 and the external circuit board 60. In addition, the bonding reliability can be improved.

接続部材３０の配置が図示とは逆の場合、すなわち、接続部材３０の第１の屈曲部３３が内側に配置され、第２の屈曲部３５が外側に配置された場合であっても、同様に、外部回路基板６０の凸状又は凹状に湾曲に対する接合信頼性を高めることができる。すなわち、外部回路基板６０が凸状又は凹状に湾曲しても、接続部材３０は、接続部材３０の第１片３２又は第２片３６の一方が枠部材２２から離れるように弾性変形し、第１片３２又は第２片３６の他方については、回動が枠部材２２によって阻止される。そのため、接合部分に無理な力が作用しないようにして、接合信頼性を高めることができる。   Even when the arrangement of the connecting member 30 is opposite to that shown in the drawing, that is, when the first bent portion 33 of the connecting member 30 is arranged on the inner side and the second bent portion 35 is arranged on the outer side, the same applies. In addition, it is possible to increase the bonding reliability of the external circuit board 60 with respect to the convex shape or concave shape. That is, even if the external circuit board 60 is curved in a convex shape or a concave shape, the connection member 30 is elastically deformed so that one of the first piece 32 or the second piece 36 of the connection member 30 is separated from the frame member 22, and the first The rotation of the other of the first piece 32 and the second piece 36 is prevented by the frame member 22. Therefore, it is possible to improve the bonding reliability by preventing an excessive force from acting on the bonded portion.

また、複合基板１０を外部回路基板６０に実装するときや、落下等の衝撃が加わったとき、図１０（Ｄ）に示すように、複合基板１０を外部回路基板６０の略中心に押圧力Ｗ１が作用すると、この押圧力Ｗ１は、大略、接続部材３０の中間片３４により伝達される反力Ｗ２と釣り合う。押圧力Ｗ１と反力Ｗ２とが作用する位置がずれているため、曲げモーメントＭが発生する。   Further, when the composite substrate 10 is mounted on the external circuit substrate 60 or when an impact such as dropping is applied, the composite substrate 10 is pressed to the approximate center of the external circuit substrate 60 as shown in FIG. When this acts, the pressing force W1 is roughly balanced with the reaction force W2 transmitted by the intermediate piece 34 of the connecting member 30. Since the position where the pressing force W1 and the reaction force W2 act is shifted, a bending moment M is generated.

この曲げモーメントＭにより、接続部材３０が第１の屈曲部３３や第２の屈曲部３５を中心に回動しようとしても、枠部材２２によって回動が阻止される。これにより、接合部分に無理な力が作用しないようにして、接合信頼性を高めることができる。   Due to this bending moment M, the frame member 22 prevents the connecting member 30 from rotating around the first bent portion 33 and the second bent portion 35. Thereby, it is possible to increase the bonding reliability by preventing an excessive force from acting on the bonding portion.

押圧力Ｗ１が図示とは逆向きに作用した場合、接続部材３０は、第１片３２や第２片３６と枠部材２２との間に隙間が形成されるように弾性変形し、接合部分に無理な力が作用しないようにして、接合信頼性を高めることができる。   When the pressing force W1 acts in the direction opposite to that shown in the figure, the connecting member 30 is elastically deformed so that a gap is formed between the first piece 32 or the second piece 36 and the frame member 22. It is possible to improve the bonding reliability by preventing excessive force from acting.

接続部材３０は、金属薄板の折り曲げ加工以外の方法で形成することも考えられる。すなわち枠部材２２に貫通穴をあけ、第１片３２及び第２片３６に相当するもの及びそれらを電気的に接続する金属膜を貫通穴内にめっきで形成する方法がある。   It is also conceivable that the connecting member 30 is formed by a method other than bending a thin metal plate. That is, there is a method of forming a through hole in the frame member 22 and forming a metal film corresponding to the first piece 32 and the second piece 36 and a metal film electrically connecting them in the through hole by plating.

しかし、例えばめっきにより形成する場合、スルーホール内にめっき液が残っていると、枠体２０を基板本体１２に接合する工程や、複合基板１０を外部回路基板６０に接合する工程で、残っていためっき液が加熱され、気化して急激に膨張することによって、スルーホール付近に亀裂が発生したり、はんだにボイドが発生したりすることがある。接続部材３０を金属薄板の折り曲げ加工で形成する場合には、このようなことがないため、接合信頼性を向上することができる。   However, for example, in the case of forming by plating, if the plating solution remains in the through hole, it remains in the step of bonding the frame body 20 to the substrate body 12 or the step of bonding the composite substrate 10 to the external circuit board 60. When the plating solution is heated, vaporized, and rapidly expands, cracks may occur near the through holes or voids may occur in the solder. In the case where the connecting member 30 is formed by bending a thin metal plate, such a situation does not occur, so that the joining reliability can be improved.

また、スルーホールの穴あけを行い、内周面をめっきする場合には、スルーホールの直径は、例えば１００μｍ以下にすると加工が困難になる。金属薄板の折り曲げ加工で接続部材３０を形成する場合には、金属薄板の厚さを５０μｍまで小さくして容易に加工できる。また、穴の周囲に残すことが必要な寸法も、金属薄板の折り曲げ加工で接続部材３０を形成する場合の方が、スルーホールの穴あけを行い、内周面をめっきする場合よりも小さくすることができる。したがって、接続部材３０は、金属薄板の折り曲げ加工で形成することによって、容易に小型化することができる。   Further, when the through hole is drilled and the inner peripheral surface is plated, the through hole has a diameter of, for example, 100 μm or less, which makes it difficult to process. When the connection member 30 is formed by bending a thin metal plate, the thickness of the thin metal plate can be reduced to 50 μm and can be easily processed. Also, the dimensions that need to be left around the hole should be smaller when the connecting member 30 is formed by bending a thin metal plate than when the through hole is drilled and the inner peripheral surface is plated. Can do. Therefore, the connecting member 30 can be easily reduced in size by being formed by bending a thin metal plate.

また、接続部材３０を金属薄板の折り曲げ加工で形成し、それを被覆するように樹脂成形すると、工程が簡単になり、製造コストを低減することができる。   Further, if the connecting member 30 is formed by bending a metal thin plate and resin-molded so as to cover it, the process becomes simple and the manufacturing cost can be reduced.

また、金属薄板の折り曲げ加工で形成された接続部材３０で、基板本体１２と外部回路基板６０との間を接合することにより、金属の弾性変形で応力を吸収し、強度を向上させることができる。   Further, by joining the board body 12 and the external circuit board 60 with the connecting member 30 formed by bending a thin metal plate, the stress can be absorbed by the elastic deformation of the metal and the strength can be improved. .

また、接続部材３０に用いる金属薄板の材質は、めっきにより接続部材３０を形成する場合よりも、選択の自由度が高い。枠部材２２の樹脂と、接続部材３０の金属とは、強固に接合されている必要はない。そのため、枠部材２２に用いる樹脂の材質も、選択の自由度が高い。したがって、安価な材質、折り曲げやすい材質、成形しやすい材質を、高い自由度で選定することができ、工業上、有用である。   The material of the metal thin plate used for the connection member 30 has a higher degree of freedom in selection than when the connection member 30 is formed by plating. The resin of the frame member 22 and the metal of the connection member 30 do not need to be firmly joined. Therefore, the resin material used for the frame member 22 is also highly selectable. Therefore, an inexpensive material, a material that can be easily bent, and a material that can be easily molded can be selected with a high degree of freedom, which is industrially useful.

次に、図１１〜図１４を参照しながら、変形例について説明する。   Next, a modification will be described with reference to FIGS.

＜変形例１＞ 図１１の断面図に示した複合基板１０ａは、外部回路基板６０に接続するための接続部材３０ａの第２片３６ａの先端３７ａ側が、枠部材２２の外周面２４よりも外側に延長されている。これによって、第２片３６ａと外部回路基板６０との接合部分６６ａを大きくして、複合基板１０ａと外部回路基板６０との間の接合力を向上することができる。   <Modification 1> In the composite substrate 10a shown in the cross-sectional view of FIG. 11, the tip 37a side of the second piece 36a of the connection member 30a for connection to the external circuit substrate 60 is outside the outer peripheral surface 24 of the frame member 22. Has been extended. As a result, the joining portion 66a between the second piece 36a and the external circuit board 60 can be enlarged, and the joining force between the composite board 10a and the external circuit board 60 can be improved.

＜変形例２＞ 図１２の断面図に示した複合基板１０ｂは、外部回路基板６０に接続するための接続部材３０ｂの第２片３６ｂの先端３７ｂ側を折り曲げて、枠部材２２の外周面２４に沿うようにしている。外部回路基板６０と接合するためのはんだ６６ｂが、折り曲げられた第２片３６ｂの先端３７ｂ側に沿って盛り上がるため、外部回路基板６０と複合基板１０ｂとを接合するためのはんだ６６ｂを、外部から容易に検査することができる。   <Modification 2> The composite substrate 10b shown in the cross-sectional view of FIG. 12 bends the tip 37b side of the second piece 36b of the connection member 30b for connecting to the external circuit substrate 60, and the outer peripheral surface 24 of the frame member 22 is bent. To be along. Since the solder 66b for joining to the external circuit board 60 rises along the tip 37b side of the bent second piece 36b, the solder 66b for joining the external circuit board 60 and the composite board 10b is externally applied. Can be easily inspected.

＜変形例３＞ 図１３の断面図に示した複合基板１０ｃは、実施例とは逆に、基板本体１２側に接続する接続部材３０ｃの第１片３２ｃが、外部回路基板６０側に接続する接続部材３０ｃの第２片３６ｃよりも長い。この場合、接続部材３０ｃの第１片３２ｃの先端３１ｃ側が、枠部材２２の外周面２４まで延在しても、外周面２４より外側まで延長してもよい。複合基板１０ｃは、接続部材３０ｃの第１片３２ｃと基板本体１２との接合部分２６ｃを大きくして、枠体２０ｃと基板本体１２と間の接合力を向上することができる。   <Modification 3> In the composite substrate 10c shown in the sectional view of FIG. 13, the first piece 32c of the connection member 30c connected to the substrate body 12 side is connected to the external circuit board 60 side, contrary to the embodiment. It is longer than the second piece 36c of the connecting member 30c. In this case, the tip 31c side of the first piece 32c of the connection member 30c may extend to the outer peripheral surface 24 of the frame member 22 or may extend to the outer side from the outer peripheral surface 24. The composite substrate 10c can increase the bonding force between the frame body 20c and the substrate body 12 by increasing the bonding portion 26c between the first piece 32c of the connection member 30c and the substrate body 12.

＜変形例４＞ 図１４の要部拡大断面図に示した複合基板１０ｘでは、接続部材３０ｘの第２片が屈曲部３７ｘ，３７ｙで折り曲げられており、第２片は互いに平行な３つの部分３６ｘ，３６ｙ，３６ｚを含む。第２片の中間片３４側の部分３６ｘは、実施例の第２片３４と同様に、枠部材２２に沿って延在している。第２片の中間の部分３６ｙと先端３７ｘ側の部分３６ｚとは、枠部材２２から離れて延在している。第２片の先端３７ｘ側の部分３６ｚは、プリント配線板等の外部回路基板６０の接合用ランド等の表面電極６２にはんだ６６を介して接合される。第２片の中間の部分３６ｙと先端３７ｘ側の部分３６ｚによって弾性を高め、複合基板１０ｘと外部回路基板６０との間の接合部分や枠体２０ｘと基板本体１２ｘと間の接合部分について応力緩和の効果を大きくすることができる。   <Modification 4> In the composite substrate 10x shown in the enlarged cross-sectional view of the main part of FIG. 14, the second piece of the connecting member 30x is bent at the bent portions 37x and 37y, and the second piece is divided into three parts parallel to each other. 36x, 36y, and 36z are included. The portion 36x on the intermediate piece 34 side of the second piece extends along the frame member 22 similarly to the second piece 34 of the embodiment. The middle portion 36 y of the second piece and the portion 36 z on the tip 37 x side extend away from the frame member 22. A portion 36z on the tip 37x side of the second piece is bonded via a solder 66 to a surface electrode 62 such as a bonding land of an external circuit board 60 such as a printed wiring board. Elasticity is enhanced by the intermediate portion 36y of the second piece and the portion 36z on the tip 37x side, and stress relaxation is performed on the joint portion between the composite substrate 10x and the external circuit substrate 60 and the joint portion between the frame 20x and the substrate body 12x. The effect of can be increased.

＜変形例５＞ 図１５の断面図、図１６の要部拡大断面図に示した複合基板１０ｘは、基板本体１２と枠体２０との接続部分の構成が実施例と異なるが、基板本体１２そのものや枠体２０そのものの構成は実施例と同じである。   <Modification 5> The composite substrate 10x shown in the cross-sectional view of FIG. 15 and the enlarged cross-sectional view of the main part of FIG. 16 differs from the embodiment in the configuration of the connection portion between the substrate main body 12 and the frame 20, but the substrate main body 12 The structure of itself and the frame 20 itself are the same as the embodiment.

すなわち、実施例と異なり、基板本体１２の端子１６と枠体２０の接続部材３０の第１片３２とは、位置がずれている。詳しくは、複合基板１０ｘの中心に対して、基板本体１２の端子１６は相対的に外側に配置され、枠体２０の接続部材３０の第１片３２は相対的に内側に配置されている。そのため、端子１６と第１片３２とを接合する導電性接合材（例えば、はんだ）２６ｘは、幅方向（図１６において左右方向）に引き延ばされた形となっている。   That is, unlike the embodiment, the terminal 16 of the substrate body 12 and the first piece 32 of the connection member 30 of the frame body 20 are misaligned. Specifically, the terminal 16 of the substrate body 12 is disposed relatively outside with respect to the center of the composite substrate 10x, and the first piece 32 of the connecting member 30 of the frame body 20 is disposed relatively inside. Therefore, the conductive bonding material (for example, solder) 26x that bonds the terminal 16 and the first piece 32 has a shape extended in the width direction (left-right direction in FIG. 16).

図１６に示したように、枠体２０側の第１片３２の中心３２ｃは、基板本体１２の端子１６の中心１６ｃよりも内側（枠体２０の貫通穴２３側）に、距離α（α＞０）ずれていることが好ましい。   As shown in FIG. 16, the center 32 c of the first piece 32 on the frame body 20 side is located on the inner side (the through hole 23 side of the frame body 20) than the center 16 c of the terminal 16 of the substrate body 12. > 0) It is preferable that they are shifted.

基板本体１２と枠体２０とで構成されるキャビティ（大部分は枠体２０の貫通穴２３）に封止樹脂５４を充填・硬化させた際、封止樹脂５４の硬化収縮応力Ｆ１は、枠体２０枠部材２２の各辺を内側に引っ張る方向に働く。他方、枠体２０と基板本体１２とを接合している導電性接合材２６ｘを硬化させる際にも硬化収縮応力が働く。接続部材３０の第１片３２の中心３２ｃが基板本体１２の端子１６の中心１６ｃよりも内側にずれて配置されていると、導電性接合材５４の硬化収縮応力Ｆ２は、枠体２０側の接続部材３０の第１片３２を外側へ引っ張る方向に働く。そのため、封止樹脂５４の収縮応力Ｆ１を導電性接合材２６ｘの収縮応力Ｆ２で緩和して、封止樹脂５４の収縮応力による影響を小さくすることができる。その結果、封止樹脂５４の硬化収縮に伴う枠体２０の変形を抑制でき、枠体２０と基板本体１２との接続信頼性を向上させることができる。When the sealing resin 54 is filled and cured in a cavity (mostly the through hole 23 of the frame body 20) formed by the substrate body 12 and the frame body 20, the curing shrinkage stress F 1 of the sealing resin 54 is: The frame 20 acts in the direction of pulling each side of the frame member 22 inward. On the other hand, curing shrinkage stress also works when the conductive bonding material 26x that bonds the frame 20 and the substrate body 12 is cured. When the center 32c of the first piece 32 of the connecting member 30 are shifted to the inside than the center 16c of the terminals 16 of the substrate main body 12, the curing contraction stress F 2 of the conductive bonding material 54, the frame body 20 side This works in the direction of pulling the first piece 32 of the connecting member 30 outward. Therefore, it is possible to mitigate shrinkage stress F 1 of the sealing resin 54 in contraction stress F 2 of the conductive bonding material 26x, to reduce the influence of the contraction stress of the sealing resin 54. As a result, the deformation of the frame body 20 due to the curing shrinkage of the sealing resin 54 can be suppressed, and the connection reliability between the frame body 20 and the substrate body 12 can be improved.

また、このような構造であると、導電性接合材２６ｘが硬化する際、基板本体１２には内側方向（基板本体１２の中心に向かう方向）への圧縮応力が働くため、セラミック等の基板本体１２では、基板本体１２自身の抗折強度が向上する。   Further, with such a structure, when the conductive bonding material 26x is cured, a compressive stress is exerted on the substrate body 12 in the inner direction (the direction toward the center of the substrate body 12). 12, the bending strength of the substrate body 12 itself is improved.

また、枠体２０側の第１片３２の内側縁３２ｂは、基板本体１２の端子１６の内側縁１６ｂよりも内側（枠体２０の貫通穴２３側）に、距離β（β＞０）ずれていることが好ましい。   Further, the inner edge 32b of the first piece 32 on the frame body 20 side is shifted by a distance β (β> 0) to the inner side (the through hole 23 side of the frame body 20) than the inner edge 16b of the terminal 16 of the substrate body 12. It is preferable.

第１片３２の内側縁３２ｂを端子１６の内側縁１６ｂよりも内側にずらした場合には、導電性接合材２６ｘが、それぞれ端子１６の内側縁１６ｂと第１片３２の内側縁３２ｂとの間の領域で幅方向に引き延ばされた形で硬化するので、導電性接合材２６ｘの硬化収縮応力Ｆ２を大きくすることができる。その結果、封止樹脂５４の収縮応力Ｆ１を導電性接合材２６ｘの収縮応力Ｆ２でより効果的に緩和することができる。When the inner edge 32b of the first piece 32 is shifted inward from the inner edge 16b of the terminal 16, the conductive bonding material 26x is formed between the inner edge 16b of the terminal 16 and the inner edge 32b of the first piece 32, respectively. since cured in regions in a form stretched width direction between, it is possible to increase the cure shrinkage stress F 2 of the conductive bonding material 26x. As a result, it is possible to more effectively alleviate the contraction stress F 1 of the sealing resin 54 in contraction stress F 2 of the conductive bonding material 26x.

また、枠体２０側の第１片３２の外側縁３２ａは、基板本体１２の端子１６の外側縁１６ａよりも内側（枠体２０の貫通穴２３側）に、距離γ（γ＞０）ずれていることが好ましい。   Further, the outer edge 32 a of the first piece 32 on the frame body 20 side is shifted by a distance γ (γ> 0) to the inner side (through hole 23 side of the frame body 20) than the outer edge 16 a of the terminal 16 of the substrate body 12. It is preferable.

第１片３２の外側縁３２ａを端子１６の外側縁１６ａよりも内側にずらした場合には、導電性接合材２６ｘが、それぞれ端子１６の外側縁１６ａと第１片３２の外側縁３２ａとの間の領域で幅方向に引き延ばされた形で硬化するので、導電性接合材２６ｘの硬化収縮応力Ｆ２を大きくすることができる。その結果、封止樹脂５４の収縮応力Ｆ１を導電性接合材２６ｘの収縮応力Ｆ２でより効果的に緩和することができる。When the outer edge 32a of the first piece 32 is shifted inward from the outer edge 16a of the terminal 16, the conductive bonding material 26x is formed between the outer edge 16a of the terminal 16 and the outer edge 32a of the first piece 32, respectively. since cured in regions in a form stretched width direction between, it is possible to increase the cure shrinkage stress F 2 of the conductive bonding material 26x. As a result, it is possible to more effectively alleviate the contraction stress F 1 of the sealing resin 54 in contraction stress F 2 of the conductive bonding material 26x.

＜変形例６＞ 変形例６は、接続部材３０が図１５及び図１６の図示とは左右対称に配置された場合、すなわち、接続部材３０の第１の屈曲部３３が内側に配置され、接続部材３０の先端３１が外側に配置され、第２の屈曲部３５が外側に配置された場合である。変形例６においても、変形例５と同様に、枠体２０の第１片３２を、基板本体１２の端子１６よりも内側に配置すること、具体的には、第１片３２と端子１６の中心、内側縁、外側縁が、それぞれ、変形例５と同様に距離α、β、γずれていることが好ましい。   <Modification 6> In Modification 6, the connection member 30 is arranged symmetrically with respect to the illustrations of FIGS. 15 and 16, that is, the first bent portion 33 of the connection member 30 is arranged on the inner side. This is a case where the tip 31 of the member 30 is arranged outside and the second bent portion 35 is arranged outside. Also in the modified example 6, as in the modified example 5, the first piece 32 of the frame body 20 is disposed on the inner side of the terminal 16 of the substrate body 12, specifically, the first piece 32 and the terminal 16 are arranged. It is preferable that the centers, the inner edge, and the outer edge are shifted from each other by the distances α, β, and γ as in the fifth modification.

特に、第１片３２の外側縁（先端縁）と端子１６の外側縁１６ａとについては、仮に、第１片３２の外側縁（先端縁）が端子１６の外側縁１６ａよりも枠体２０の外側（枠体２０の貫通穴２３とは反対側）にずれていると、第１片３２の先端側が枠体２０の内側方向（接続部材３０の屈曲部３３に向かう方向）に引っ張られるので、第１片３２の先端側が枠部材２２から離れてしまい、枠体２０と基板本体１２との接合形状が不安定になったり、枠体２０と基板本体１２との接合強度が低下したりすることがある。これとは逆に、第１片３２の外側縁（先端縁）が端子１６の外側縁１６ａよりも枠体２０の内側にずれていると、第１片３２の先端側は枠体２０の外側方向（接続部材３０の屈曲部３３とは反対方向）に引っ張られるので、第１片３２の先端側と枠部材２２とがしっかりと接合し、枠体２０と基板本体１２との接合形状が安定し、枠体２０と基板本体１２との接合強度が安定する。したがって、枠体２０側の第１片３２の外側縁は、基板本体１２の端子１６の外側縁１６ａよりも内側（枠体２０の貫通穴２３側）に、距離γ（γ＞０）ずれていることが好ましい。   In particular, regarding the outer edge (tip edge) of the first piece 32 and the outer edge 16 a of the terminal 16, the outer edge (tip edge) of the first piece 32 is more of the frame body 20 than the outer edge 16 a of the terminal 16. If it is shifted to the outside (the side opposite to the through hole 23 of the frame body 20), the distal end side of the first piece 32 is pulled inward of the frame body 20 (direction toward the bent portion 33 of the connecting member 30). The distal end side of the first piece 32 is separated from the frame member 22, the bonding shape between the frame body 20 and the substrate body 12 becomes unstable, or the bonding strength between the frame body 20 and the substrate body 12 is reduced. There is. On the contrary, when the outer edge (tip edge) of the first piece 32 is shifted to the inside of the frame body 20 with respect to the outer edge 16 a of the terminal 16, the tip side of the first piece 32 is outside the frame body 20. Since it is pulled in the direction (the direction opposite to the bent portion 33 of the connecting member 30), the distal end side of the first piece 32 and the frame member 22 are firmly bonded, and the bonded shape of the frame 20 and the substrate body 12 is stable. In addition, the bonding strength between the frame body 20 and the substrate body 12 is stabilized. Therefore, the outer edge of the first piece 32 on the frame body 20 side is shifted by the distance γ (γ> 0) to the inner side (through hole 23 side of the frame body 20) than the outer edge 16 a of the terminal 16 of the substrate body 12. Preferably it is.

＜まとめ＞ 以上に説明したように、折り曲げられた接続部材３０が樹脂の枠部材２２に埋設されてなる枠体２０を介して、複合基板１０を外部回路基板６０に接合することにより、簡単な構成で、接合部分の熱応力や衝撃応力を緩和することができる。この場合、枠部材２２の貫通穴２３を介して対向して配置される接続部材３０について、第１片３２と第２片３６の先端３１，３７が外側を向き、中間片３４がともに貫通穴２３側（内側）に配置されるようにすることで、複合基板１０と外部回路基板６０との接合部分や、複合基板１０内における基板本体１２と枠体２０との接合部分に作用するせん断力や曲げモーメントをできるだけ小さくして、接合信頼性をより向上することができる。   <Summary> As described above, it is possible to easily connect the composite substrate 10 to the external circuit board 60 through the frame body 20 in which the bent connection member 30 is embedded in the resin frame member 22. With the configuration, it is possible to relieve thermal stress and impact stress at the joint portion. In this case, with respect to the connection member 30 that is arranged to face the through hole 23 of the frame member 22, the tips 31 and 37 of the first piece 32 and the second piece 36 face outward, and both the intermediate pieces 34 are through holes. By being arranged on the 23rd side (inner side), the shearing force acting on the joint portion between the composite substrate 10 and the external circuit substrate 60 and the joint portion between the substrate body 12 and the frame body 20 in the composite substrate 10 And the bending moment can be made as small as possible to further improve the bonding reliability.

なお、本発明は、上記した実施の形態に限定されるものではなく、種々変更を加えて実施可能である。たとえば、枠体は矩形の他、円形、矩形以外の多角形であってもよい。   The present invention is not limited to the above-described embodiment, and can be implemented with various modifications. For example, the frame may be a rectangle, a circle, or a polygon other than a rectangle.

例えば、「基板本体」は、枠体に接続される複数の端子が同一平面上に設けられた基板であればよく、枠体が接続される平面部以外の部分に、凸部や凹部が設けられていれてもよい。   For example, the “substrate body” may be a substrate in which a plurality of terminals connected to the frame body are provided on the same plane, and a convex portion or a concave portion is provided in a portion other than the flat portion to which the frame body is connected. It may be done.

Claims (17)

少なくとも一方主面に端子を有する基板本体と、
前記基板本体の前記一方主面に接合される枠体とを備えた複合基板であって、
前記枠体は、
絶縁材料からなり、中央に貫通穴を有し、前記基板本体の前記一方主面の周縁部に沿って枠状に延在する枠部材と、
金属薄板の折り曲げ加工により形成され、中間片の両端にそれぞれ第１片と第２片とが連続する複数の接続部材と、
を有し、
前記複数の接続部材は、
前記枠部材に、前記枠部材の前記貫通穴を介して対向するように配置され、
前記第１片が、前記枠部材の前記基板本体側に露出して、前記基板本体の前記一方主面の前記端子に接合され、
前記第２片が、前記枠部材の前記基板本体とは反対側に露出し、
前記第１片及び前記第２片が、前記接続部材が前記枠部材の前記貫通穴を介して対向する方向に延在し、
前記中間片が、前記枠部材の内部を貫通し、
前記中間片の前記両端は、前記第１片と前記第２片の互いに反対側の端部にそれぞれ連続し、
前記接続部材は、前記第１片と前記中間片と前記第２片とを通る断面がＺ字状であり、前記中間片は前記第１片と前記第２片との間に斜めに配置されていることを特徴とする複合基板。A substrate body having terminals on at least one main surface;
A composite substrate comprising a frame joined to the one main surface of the substrate body,
The frame is
A frame member made of an insulating material, having a through hole in the center, and extending in a frame shape along a peripheral edge portion of the one main surface of the substrate body;
A plurality of connecting members formed by bending a thin metal plate, each having a first piece and a second piece continuous at both ends of the intermediate piece,
Have
The plurality of connecting members are:
Arranged to face the frame member through the through hole of the frame member,
The first piece is exposed to the substrate body side of the frame member and joined to the terminal on the one main surface of the substrate body,
The second piece is exposed on a side of the frame member opposite to the substrate body;
The first piece and the second piece extend in a direction in which the connection member faces through the through hole of the frame member;
The intermediate piece penetrates the inside of the frame member;
The both ends of the intermediate piece are respectively connected to opposite ends of the first piece and the second piece ,
The connecting member has a Z-shaped cross section passing through the first piece, the intermediate piece, and the second piece, and the intermediate piece is disposed obliquely between the first piece and the second piece. composite substrate characterized in that is. 前記中間片の前記両端は、前記第２片の前記枠部材の前記貫通穴側の端部と、前記第１片の前記枠部材の前記貫通穴側とは反対側の端部とにそれぞれ連続することを特徴とする、請求項１に記載の複合基板。  The both ends of the intermediate piece are continuous with an end portion of the frame member of the second piece on the through hole side and an end portion of the first piece of the frame member opposite to the through hole side, respectively. The composite substrate according to claim 1, wherein: チップ状電子部品が前記枠状部材の前記貫通穴内に配置され、前記基板本体の前記一方主面に搭載されていることを特徴とする、請求項１又は２に記載の複合基板。  The composite substrate according to claim 1, wherein a chip-shaped electronic component is disposed in the through hole of the frame-shaped member and is mounted on the one main surface of the substrate body. 前記チップ状電子部品が樹脂で封止され、該樹脂が前記枠体の一部に接着又は当接していることを特徴とする、請求項３に記載の複合基板。  4. The composite substrate according to claim 3, wherein the chip-shaped electronic component is sealed with a resin, and the resin is bonded or abutted on a part of the frame. 前記枠体の前記接続部材は、金属薄板の打ち抜き加工及び折り曲げ加工により形成され、
前記枠体の前記枠部材は、金型内に前記接続部材となる部分を挿入した状態で成形した樹脂であることを特徴とする、請求項１〜４のいずれか一項に記載の複合基板。The connection member of the frame is formed by punching and bending a thin metal plate,
5. The composite substrate according to claim 1, wherein the frame member of the frame body is a resin molded in a state where a portion to be the connection member is inserted into a mold. . 前記基板本体がセラミック基板であることを特徴とする、請求項１〜５のいずれか一項に記載の複合基板。  The composite substrate according to claim 1, wherein the substrate body is a ceramic substrate. 前記基板本体は、１０５０℃以下で焼結する複数のセラミック層を積層してなるセラミック多層基板であることを特徴とする、請求項１〜６のいずれか一項に記載の複合基板。  The composite substrate according to any one of claims 1 to 6, wherein the substrate body is a ceramic multilayer substrate formed by laminating a plurality of ceramic layers sintered at 1050 ° C or lower. 前記枠体の前記接続部材の前記金属薄板は可撓性を有することを特徴とする、請求項４に記載の複合基板。  The composite substrate according to claim 4, wherein the metal thin plate of the connection member of the frame body is flexible. 前記接続部材の厚みは、５０μｍ以上、かつ３００μｍ以下であることを特徴とする、請求項１〜８のいずれか一項に記載の複合基板。  The composite substrate according to claim 1, wherein a thickness of the connection member is 50 μm or more and 300 μm or less. 前記基板本体の他方主面に、チップ状電子部品が搭載されていることを特徴とする、請求項１〜９のいずれか一項に記載の複合基板。  The composite substrate according to any one of claims 1 to 9, wherein a chip-shaped electronic component is mounted on the other main surface of the substrate main body. 前記枠体の前記接続部材は、前記第２片の先端が、前記枠部材の外周面まで又は該外周面よりも外側まで延在していることを特徴とする、請求項１〜１０のいずれか一項に記載の複合基板。  The connection member of the frame body, wherein a tip of the second piece extends to an outer peripheral surface of the frame member or to an outer side of the outer peripheral surface. A composite substrate according to claim 1. 前記枠体の前記接続部材は、前記第２片の先端側が折り曲げられて、前記枠部材の外周面に沿って延在していることを特徴とする、請求項２〜１０のいずれか一項に記載の複合基板。  11. The connection member of the frame body according to claim 2, wherein a distal end side of the second piece is bent and extends along an outer peripheral surface of the frame member. The composite substrate described in 1. 前記枠体の前記接続部材は、前記第１片の面積が、前記第２片の面積よりも大きいことを特徴とする、請求項１〜１０のいずれか一項に記載の複合基板。  11. The composite substrate according to claim 1, wherein the connection member of the frame body has an area of the first piece larger than an area of the second piece. 前記枠体の前記接続部材の前記第１片の中心の位置が、前記基板本体の前記端子の中心の位置よりも、前記枠体の前記貫通穴側にずれていることを特徴とする、請求項１〜１０のいずれか一項に記載の複合基板。  The position of the center of the first piece of the connection member of the frame body is shifted to the through hole side of the frame body from the position of the center of the terminal of the substrate body. Item 11. The composite substrate according to any one of Items 1 to 10. 前記枠体の前記接続部材の前記第１片の前記枠体の前記貫通穴側の内側縁の位置が、前記基板本体の前記端子の前記基板本体の中心側の内側縁の位置よりも、前記枠体の前記貫通穴側にずれていることを特徴とする、請求項１〜１０のいずれか一項に記載の複合基板。  The position of the inner edge on the through hole side of the frame body of the first piece of the connection member of the frame body is more than the position of the inner edge of the terminal of the substrate body on the center side of the substrate body. The composite substrate according to claim 1, wherein the composite substrate is shifted toward the through hole side of the frame body. 前記枠体の前記接続部材の前記第１片の前記枠体の前記貫通穴とは反対側の外側縁の位置が、前記基板本体の前記端子の前記基板本体の中心とは反対側の外側縁の位置よりも、前記枠体の前記貫通穴側にずれていることを特徴とする、請求項１〜１０のいずれか一項に記載の複合基板。  The position of the outer edge of the frame member opposite to the through hole of the frame body of the first piece of the connection member is the outer edge of the terminal of the substrate body opposite to the center of the substrate body. The composite substrate according to claim 1, wherein the composite substrate is displaced toward the through hole side of the frame body from the position of the frame. 少なくとも一方主面に端子が設けられた基板本体と、枠体とを準備する第１の工程と、
前記基板本体の前記一方主面に、前記枠体を接合する第２の工程とを備えた、複合基板の製造方法であって、
前記第１の工程において、
前記枠体は、
絶縁材料からなり、中央に貫通穴を有し、前記基板本体の前記一方主面の周縁部に沿って枠状に延在する枠部材と、
金属薄板の折り曲げ加工により形成され、中間片の両端にそれぞれ第１片と第２片とが連続する複数の接続部材と、
を有し、
前記複数の接続部材は、
前記枠部材に、前記枠部材の前記貫通穴を介して対向するように配置され、
前記第１片及び第２片が、前記枠部材の前記貫通穴の周囲に延在する前記枠部材の両主面にそれぞれ露出し、
前記第１片及び前記第２片が、前記接続部材が前記枠部材の前記貫通穴を介して対向する方向に延在し、
前記中間片の前記両端は、前記第１片と前記第２片の互いに反対側の端部にそれぞれ連続し、
前記接続部材は、前記第１片と前記中間片と前記第２片とを通る断面がＺ字状であり、前記中間片は前記第１片と前記第２片との間に斜めに配置されており、
前記第２の工程において、
前記枠体は、前記基板本体の一方主面の周縁部に沿って枠状に延在するように配置され、
前記枠体の前記接続部材の前記第１片が、前記基板本体の前記一方主面に設けられた前記端子に接合されることを特徴とする、複合基板の製造方法。A first step of preparing a substrate body provided with terminals on at least one main surface and a frame;
A method of manufacturing a composite substrate, comprising: a second step of joining the frame body to the one main surface of the substrate body,
In the first step,
The frame is
A frame member made of an insulating material, having a through hole in the center, and extending in a frame shape along a peripheral edge portion of the one main surface of the substrate body;
A plurality of connecting members formed by bending a thin metal plate, each having a first piece and a second piece continuous at both ends of the intermediate piece,
Have
The plurality of connecting members are:
Arranged to face the frame member through the through hole of the frame member,
The first piece and the second piece are respectively exposed on both main surfaces of the frame member extending around the through hole of the frame member;
The first piece and the second piece extend in a direction in which the connection member faces through the through hole of the frame member;
The both ends of the intermediate piece are respectively connected to opposite ends of the first piece and the second piece,
The connecting member has a Z-shaped cross section passing through the first piece, the intermediate piece, and the second piece, and the intermediate piece is disposed obliquely between the first piece and the second piece. And
In the second step,
The frame body is arranged so as to extend in a frame shape along a peripheral edge portion of one main surface of the substrate body,
The method of manufacturing a composite substrate, wherein the first piece of the connection member of the frame body is joined to the terminal provided on the one main surface of the substrate body.
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