JP4813270B2 - Constant current circuit board for driving high power light emitting diodes - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a constant current circuit board for driving a high-output light-emitting diode which is so small as to be integrated with a lamp, so that only the lamp such as a halogen lamp can be replaced by a light-emitting diode. <P>SOLUTION: Components of the constant current circuit for lighting and driving a light-emitting diode are each mounted on a circuit board body 3 consisting of a first board 11 and a second board 12. A diode D1, an electrolytic capacitor C2, a choke coil L1, and a driver IC 2 are mounted on the lower surface of the second board 12. A fuse F, a noise filter L4, and a film capacitor C1 are mounted on the upper surface of the first board 11. Further, a diode bridge B1 and a varistor Z1 are mounted on the lower surface of the first board 11. <P>COPYRIGHT: (C)2008,JPO&amp;INPIT

Description

  The present invention relates to a constant current circuit board for driving a high-power light-emitting diode for lighting and driving a high-power light-emitting diode (LED) having a forward current of 100 mA to 1 A.

At present, lighting fixtures for stores and displays use halogen lamps as lamps. For example, FIG. 20 shows an illuminating lamp 60 using a halogen lamp as a light source used in a store or the like, and illuminates the fixture 62 attached to the lower part of a pipe-shaped support 61 with a power cable inside. A base 63 of the lamp 60 is detachably mounted.
FIG. 21 shows a stand-type lighting device used in, for example, a showcase for display of jewelry, etc., and an illumination lamp is attached to the device 62 provided at the tip of a support 66 on the upper portion of the stand main body 65 so as to be rotatable. The structure 60 is detachably mounted.

The illuminating lamp 60 using a halogen lamp has the advantage that the circuit configuration is simple and the structure can be simplified because it is only necessary to apply AC 100 V to the halogen lamp.
However, the halogen lamp has a high heat generation, and the tube wall temperature needs to be 250 degrees or more and less than 900 degrees, and the periphery of the lamp becomes very high. Therefore, the article irradiated with the halogen lamp is also heated.

  In such a case, the displayed product at the store or the like deteriorates due to the heat of the halogen lamp and damages the product value. In the case of fresh food products, the deterioration of the freshness becomes significant due to prolonged irradiation and the product value is lost. There was a problem that.

Therefore, at present, the market demands the use of light-emitting diodes as light sources for lighting fixtures using halogen lamps used in stores and homes.
As is well known, the light emission principle of this light emitting diode is that when a forward voltage is applied to the chip of the light emitting diode, electrons and holes move through the chip and current flows. When electrons and holes collide with each other during the movement of the electrons and the like, the electrons and holes are combined (recombination: they are attracted and combined like the N and S poles). Before the electrons and holes are combined, the energy becomes smaller than originally possessed, and at that time, the excess energy loss is converted into light and emitted.

  There are two types of light-emitting diode power, which can be divided into two types, a low output type and a high output type. Low power light emitting diodes are used for backlights, indicators, etc. that do not require much light intensity, while high power light emitting diodes are used for stores that require very high light intensity. There are interior lighting lights.

Further, although a direct current power source is required to light the light emitting diode, the light emitting diode is not lighted if the rated voltage or rated current of the light emitting diode is greatly reduced. Conversely, if the rated voltage or rated current of the light emitting diode is greatly exceeded, the element will be deteriorated and the life will be shortened.
Therefore, it is necessary to limit the rated current of the light emitting diode by connecting a resistor in series with the light emitting diode so as not to exceed the rated current.

  The low output type light emitting diode can limit the current by the resistance as described above, but the high output type light emitting diode requires a constant current circuit. There are two types of power sources for the constant current circuit, one for DC and the other for AC. The DC one needs to be used through a switching power source or an adapter. In the AC type, an AC power source is directly applied.

Although it is possible to make the board of the constant current circuit for direct current application small, it is necessary to provide a DC power supply device for operating the board. is there.
A substrate for a constant current circuit to which AC is applied requires a circuit for converting alternating current into direct current within the substrate, but the installation space can be much narrower than that for a DC application type substrate.

  As described above, a lighting fixture using a halogen lamp has a problem of heat generation, but a light emitting diode does not generate heat even in a portion (product or the like) irradiated with self-heating. In other words, the light-emitting diode emits light by causing a current to flow through a compound of a semiconductor metal, and therefore emits little light. Therefore, in the illumination with the light emitting diode, there is almost no influence of heat on the product.

  However, a low output type light emitting diode has a problem that brightness is insufficient when compared with a halogen lamp. In order to make up for this brightness, it is necessary to use a large amount of light-emitting diodes, which increases the size and cost of the equipment. Therefore, the current situation is that the adoption of light emitting diodes in the market is delayed.

  In place of the low output type light emitting diodes, there are some high output type light emitting diodes that can pass a current equivalent to 40 W of a fluorescent lamp, which can replace the halogen lamp and ensure the brightness.

The above problem can be solved by the combination of the high output type light emitting diode and the constant current circuit. However, the current state in the market is large even in the substrate of the constant current circuit, so that it cannot be incorporated into the current instrument 62, and is separately installed, requiring a separate installation space. In addition, when a constant current circuit board is to be incorporated in an instrument, the board itself is large, and thus a new instrument for mounting a light-emitting diode must be manufactured.
In such a case, the halogen lamp fixture 62 that has been used up to now cannot be used, and a special fixture for the light emitting diode manufactured separately must be purchased, resulting in high costs. It becomes.

FIG. 22 shows a substrate 70 on which a constant current circuit for driving a conventional high output type light emitting diode is mounted. Various components constituting the constant current circuit are mounted on the upper surface of the substrate 70, although not shown. . Among the components used by the electrolytic capacitor 71, the flatest radiating fins 73 are disposed above the substrate 70 through the spacers 72 having a height that takes the height dimension into consideration.
In addition, a substantially U-shaped notch 74 serving as a relief at the top of the electrolytic capacitor 71 is cut out at a part of the heat radiation fin 73. The radiating fins 73 are fixed to the substrate 70 side by spacers 72 with screws 75.

  A driver IC 76 is mounted on the upper surface of the substrate 70 to drive the light emitting diodes. The heat generated from the IC 76 is transferred to the upper radiation fins 73 via the substantially U-shaped radiation fins 77. Conducting.

The heat generation of the driver IC 76 used in the prior art is large, and the board 70 that requires the radiation fins 73 is large. In order to provide an extra space for isolating the electrolytic capacitor 71 by this heat generation, the board 70 is enlarged. It was. Therefore, it has become a circuit board that hinders the space saving characteristic of the light emitting diode.
For the above reasons, the adoption of light emitting diodes in the market is delayed.

  The illuminating lamp required in the market is an illuminating lamp in which the present halogen lamp apparatus can be used as it is, and only the lamp is changed to a light emitting diode. By realizing this, it is expected that environmentally friendly and power-saving light-emitting diodes will be expanded to the market.

  The present invention has been provided in view of the above-described problems, and is designed to drive a high-power light-emitting diode having a small shape so as to be integrated with the lamp so that only the lamp can be replaced from the halogen lamp to the light-emitting diode. The object is to provide a constant current circuit board.

Therefore, in the constant current circuit board for driving a high-power light-emitting diode according to claim 1 of the present invention, the noise filter L4 whose input side is connected to the AC power source and the output side of this noise filter L4 are connected to rectify the AC. A primary side circuit configured with a diode bridge B1 as a main component;
A high output type light emitting diode supplied with a choke coil L1 connected to the output side of the diode bridge B1, an electrolytic capacitor C2 for smoothing the output of the diode bridge B1, and a DC power source smoothed by the electrolytic capacitor C2. In a constant current circuit composed of a secondary side circuit composed mainly of a driver IC 2 for lighting and driving 1 with a constant current,
A first substrate 11 on which components constituting the primary side circuit are mounted and a second substrate 12 on which components constituting the secondary circuit are mounted are provided, and the sizes of both the substrates 11 and 12 are provided. Are formed in substantially the same size, and the first substrate 11 and the second substrate 12 are stacked in two stages in parallel.

  In the constant current circuit board for driving a high-power light-emitting diode according to claim 2, the noise filter L4 mounted on the first substrate 11 is disposed toward the second substrate 12, and the second substrate 12 is provided with the noise filter L4. The mounted choke coil L1 and the electrolytic capacitor C2 are arranged in the direction of the first substrate 11, and the noise filter L4, the choke coil L1 and the electrolytic capacitor C2 are arranged with their positions relatively shifted on the horizontal plane. It is characterized by having.

  In the constant current circuit board for driving a high-power light emitting diode according to claim 3, a lead wire 23 connecting the primary side circuit and the secondary side circuit is provided between the first substrate 11 and the second substrate 12. The power supply cable 5 connected to the AC power supply side is led out from the first substrate 11, and the light emitting diode connection cable 4 connected to the light emitting diode 1 is connected to the power supply cable from the second substrate 12. 5 is derived in the reverse direction.

  The constant current circuit board for driving a high-power light-emitting diode according to claim 4 is characterized in that the first substrate 11 and the second substrate 12 have a circular shape or a substantially circular shape with a part omitted. Yes.

  In the constant current circuit board for driving a high output light emitting diode according to claim 5, the lead wire 23, the power supply cable 5 and the light emitting diode connecting cable 4 are arranged within the projected areas of both the boards 11 and 12. It is characterized by being.

  The constant current circuit board for driving a high-power light-emitting diode according to claim 6 is characterized in that the spacer 13 for arranging and arranging the two boards 11 and 12 in a two-stage parallel stack is made of synthetic resin.

In the constant current circuit board for driving a high output light emitting diode according to claim 7, a noise filter L4 whose input side is connected to an AC power source, and a diode bridge B1 which is connected to the output side of the noise filter L4 and rectifies AC. The choke coil L1 connected to the output side of the diode bridge B1, the electrolytic capacitor C2 for smoothing the output of the diode bridge B1, and the direct current power source smoothed by the electrolytic capacitor C2 are supplied to emit light of a high output type. In a constant current circuit composed mainly of a driver IC 2 for lighting and driving the diode 1 with a constant current,
A board 40 on which both the above components are mounted is formed in a horizontally long shape, and the noise filter L4, choke coil L1 and electrolytic capacitor C2 are mounted on the same surface of the board 40.

  The constant current circuit board for driving a high-power light emitting diode according to claim 8 is characterized in that the driver IC2 is mounted on a surface opposite to the electrolytic capacitor C2.

  According to the constant current circuit board for driving the high output light emitting diode according to claim 1 of the present invention, the first board 11 on which the components constituting the primary circuit are mounted, and the secondary circuit are constituted. A second substrate 12 on which the components are mounted, and the substrates 11 and 12 are formed to have substantially the same size, and the first substrate 11 and the second substrate 12 are stacked in two stages in parallel. Therefore, the circuit board main body 3 composed of the first substrate 11 and the second substrate 12 can be reduced in size, can be accommodated in the current halogen lamp illumination lamp, and the current illumination lamp size can be changed. An illumination lamp in which the halogen lamp is changed to the light emitting diode 1 can be provided. As a result, even when using illuminating lamps, the part irradiated with the light source is not affected by heat, display products such as stores are not deteriorated, and fresh food products are irradiated for a long time. Even if it is done, the freshness does not decrease.

  According to the constant current circuit board for driving the high-power light emitting diode according to claim 2, the noise filter L4 mounted on the first board 11 is arranged toward the second board 12, and the second board is arranged. The choke coil L1 and the electrolytic capacitor C2 mounted on 12 are arranged in the direction of the first substrate 11, and the noise filter L4, the choke coil L1 and the electrolytic capacitor C2 are relatively displaced on the horizontal plane. Since it is arranged, the dimension between the first substrate 11 and the second substrate 12 can be shortened, the size can be reduced, and it can be easily accommodated in the illumination lamp of the current halogen lamp. .

  According to the constant current circuit board for driving a high output light emitting diode according to claim 3, the lead wire connecting the primary side circuit and the secondary side circuit between the first board 11 and the second board 12. 23, the power supply cable 5 connected to the AC power supply side is led out from the first substrate 11, and the light emitting diode connection cable 4 connected to the light emitting diode 1 is connected from the second substrate 12 to the power supply. Since it is derived | led-out in the reverse direction with respect to the cable 5 for electricity, the influence that the noise which generate | occur | produced from the cable 5 for power supplies is superimposed on the light emitting diode connection cable 4 can be prevented.

According to the constant current circuit board for driving a high-power light emitting diode according to claim 4, the first substrate 11 and the second substrate 12 are made into a circular shape or a substantially circular shape with a part omitted. The shape corresponds to the size of the illuminating lamp of the current halogen lamp, and positioning of the circuit board main body 3 constituted by the first substrate 11 and the second substrate 12 within the illuminating lamp becomes easy.
Further, when a part of the first substrate 11 and the second substrate 12 is missing, the lead wire 23 for connecting the first substrate 11 and the second substrate 12 can be arranged in the missing part, and the lead wire 23 Wiring is also easy.

  According to the constant current circuit board for driving a high output light emitting diode according to claim 5, the lead wire 23, the power supply cable 5 and the light emitting diode connecting cable 4 are arranged within the projected areas of both the boards 11 and 12. Therefore, the circuit board main body 3 composed of the first substrate 11 and the second substrate 12 can be reduced in size.

  According to the constant current circuit board for driving the high-power light emitting diode according to claim 6, since the spacer 13 for arranging and arranging the two boards 11 and 12 in a two-tiered parallel structure is made of a synthetic resin, the area is small. Even if the component and the spacer 13 are in contact with each other, there is no short circuit, and even if the first substrate 11 and the second substrate 12 are coupled by the spacer 13, the pattern electrodes of the substrates 11 and 12 are not affected. But there is no short circuit.

  According to the constant current circuit board for driving the high output light emitting diode according to claim 7, the board 40 for mounting each part on both sides is formed horizontally long, and the noise filter L4, the choke coil L1 and the electrolytic capacitor C2 are arranged on the board. 40 is mounted on the same surface, so that the overall height can be reduced as compared with the case where these tall components are mounted on both surfaces of the substrate 40. It can also be stored in a pipe that suspends the lamp.

  According to the constant current circuit board for driving the high output light emitting diode according to claim 8, since the driver IC2 is mounted on the surface opposite to the electrolytic capacitor C2, the electrolytic capacitor C2 from the driver IC2 is provided. It is possible to extend the life of the electrolytic capacitor C2 by eliminating the influence of heat on the electrolytic capacitor C2.

(First embodiment)
Hereinafter, a first embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 shows a constant current circuit for lighting and driving a high output type light emitting diode 1 having a forward current of 100 mA to 1 A, and an input power supply is an AC power supply of AC100V.

  In FIG. 1, a fuse F, a noise preventing capacitor C1, a surge countermeasure varistor Z1, and a noise filter L4 are provided as an input side power supply unit, and an alternating current is rectified to a direct current by a diode bridge B1. A control circuit is configured by a driver IC 2 that drives one or a plurality of light-emitting diodes 1 at a constant current, a choke coil L1, resistors R1 to R3, an electrolytic capacitor C2, capacitors C3 and C4, a diode D1, and the like. The constant current circuit shown in FIG. 1 has a circuit configuration for supplying a constant direct current to the light emitting diode 1.

Here, the noise filter L4, the diode bridge B1, the varistor Z1, the capacitor C1, and the like constitute a primary side circuit, and the choke coil L1, the electrolytic capacitor C2, the driver IC2, and the like constitute a secondary side circuit.
Among these main components, the noise filter L4, the choke coil L1 and the electrolytic capacitor C2 have a high component height, and the diode bridge B1, the varistor Z1, the capacitor C1 and the driver IC2 have a low component height. is there. Further, the driver IC 2 generates a large amount of heat when the light emitting diode 1 is turned on, and the electrolytic capacitor C2 has a characteristic that it is easily influenced by heat due to an increase in ambient temperature, and the life of the component is greatly affected by the heat. The driver IC 2 used in the present embodiment is different from the conventional driver IC 76.

In the present embodiment, if the circuit shown in FIG. 1 is mounted on a single board as in the prior art, the board becomes large and cannot be disposed in the current lamp for a halogen lamp. The two substrates are rounded to match the circular shape of the base of the illuminating lamp.
In particular, when the number of substrates is two, the projected area can be halved compared to one, and by setting the positional relationship of large components, the space can be used effectively. The height of the two steps can be reduced, and the substantial occupied volume of the substrate can be reduced.

  FIG. 2 is a front view of the circuit board main body 3. A pair of light emitting diode connection cables 4 is led out from one side of the circuit board main body 3, and a pair of power supply cables 5 are connected to the light emitting diodes from the other side of the circuit board main body 3. The connection cable 4 is led out in the opposite direction. 3 is an exploded view of the circuit board body 3, FIG. 4 is a view of the circuit board body 3 when the cables 4 and 5 are removed, and FIG. 5 is a view of the AA direction in FIG. FIG. 6 shows a view of the direction BB in FIG.

  As shown in FIG. 3, the circuit board main body 3 includes the above-described components constituting a constant current circuit, round first and second substrates 11 and 12 on which these components are mounted, It is composed of two synthetic resin spacers 13 interposed between the substrate 11 and the second substrate 12 and a synthetic resin lower spacer 14 disposed on the lower surface side of the second substrate 12.

As shown in FIGS. 2 to 4, holes 16 for inserting screws 15 are formed on both sides of the second substrate 12, and the screws 15 are inserted into the holes 16 and are formed on the upper portion of the spacer 13. The second substrate 12 is fixed to the spacer 13 by being screwed into the screw hole 17.
In addition, holes 21 through which the screw portions 20 formed on the upper portion of the lower spacer 14 are inserted are also formed on both sides of the first substrate 11, and the screw portions 20 of the lower spacer 14 inserted through the holes 21 are located below the spacer 13. The first substrate 11 is fixed to the spacer 13 by being screwed into the screw hole 22 formed in the above. At the same time, the lower spacer 14 is fixed to the lower surface of the first substrate 11.

  Thus, since the spacer 13, the lower spacer 14 and the screw 15 are made of synthetic resin, even if the component and the spacer 13 come into contact with each other within a small area, there is no short circuit. Even if the second substrate 12 is coupled with the spacer 13, there is no short circuit with respect to the pattern electrodes of the substrates 11 and 12.

After mounting each component, the first substrate 11 and the second substrate 12 are fixed by the spacer 13 and the lower spacer 14 as described above, and the following components are mounted on the second substrate 12.
That is, as shown in FIG. 2 to FIG. 6, the secondary circuit component which is the control circuit shown in FIG. 1 is mounted on the lower surface of the second substrate 12. A diode D1, an electrolytic capacitor C2, a choke coil L1, a driver IC 2 and the like are mounted on the lower surface of the substrate. Further, resistors R1 to R3, a capacitor C3, and the like are mounted on the upper surface of the second substrate 12.

The components constituting the primary circuit shown in FIG. 1 are mounted on the first substrate 11, and a fuse F, a noise filter L4, a film capacitor C1, and the like are mounted on the upper surface of the first substrate 11. Yes. A diode bridge B1 and a varistor Z1 are mounted on the lower surface of the first substrate 11.
Here, the lower spacer 14 provided on the lower surface of the first substrate 11 is provided to facilitate the installation of the circuit board body 3 when the illumination lamp is incorporated into the fixture, and is formed shorter than the spacer 13. is doing. By arranging the diode bridge B1 and the varistor Z1 in the space portion of the first substrate 11 by the short lower spacer 14, the space is effectively utilized.

Here, the tall components are the noise filter L4, the choke coil L1, and the electrolytic capacitor C2 as described above, and the choke coil L1 and the electrolytic capacitor C2 are mounted on the lower surface of the second substrate 12 as shown in the figure. A noise filter L4 is mounted on the upper surface of one substrate 11, and the choke coil L1 and the electrolytic capacitor C2 and the noise filter L4 are relatively displaced from each other, and the choke coil L1 and the electrolytic capacitor C2 are The filter L4 is not overlapped.
In addition, other components do not overlap in the vertical direction, so that the vertical dimension between the first substrate 11 and the second substrate 12 is the tallest component, for example, the noise filter L4 or the choke coil L1. It is trying to come close to. In this way, the dimensions between the first substrate 11 and the second substrate 12 can be shortened by alternating the choke coil L1 and the electrolytic capacitor C2 and the noise filter L4 that are used, and the circuit board body 3 Can be reduced as much as possible. That is, the circuit board body 3 can be reduced in size. Thereby, it becomes easy to store in the illumination lamp of the current halogen lamp.

  Furthermore, the area of the first substrate 11 can be reduced by mounting the varistor Z1 and the diode bridge B1 on the lower surface of the first substrate 11 by effectively using the space portion at the height of the lower spacer 14.

In addition, the primary circuit component that is the power supply unit is mounted on the first substrate 11, and the secondary circuit component that is the control circuit is mounted on the second substrate 12, and the primary circuit, the secondary circuit, By separating them from each other, it is possible to reduce the propagation of noise generated in the secondary side circuit to the primary side circuit.
Note that if the substrate is composed of multiple stages of three or more stages, the mechanism for maintaining the wiring and the stage configuration between the boards (spacer fastening mechanism) becomes complicated and the merit of multi-stage is impaired. As in the embodiment, the two-stage substrate configuration is the best.

Further, as shown in FIG. 2, the first substrate 11 and the second substrate 12 are connected by a pair of lead wires 23, and the lead wires 23 protrude outside the both substrates 11 and 12. In order to avoid this, wiring is performed in the inner portions of the substrates 11 and 12.
Thus, since the lead wire 23 is wired inside the boards 11 and 12, the area of the circuit board body 3 in the horizontal direction is not larger than both the boards 11 and 12, and the size can be reduced. .

In addition, when the power cable 5 and the light emitting diode connection cable 4 are attached to the circuit board main body 3 in consideration of noise, the light emitting diode connection cable 4 is connected from the upper surface of the second substrate 12 as shown in FIG. The power cable 5 is led out from the lower surface of the first substrate 11 in the direction opposite to the light emitting diode connecting cable 4.
Thereby, it is possible to prevent the influence of noise generated from the power supply cable 5 being superimposed on the light emitting diode connection cable 4.

  Here, the components of the primary circuit are arranged on the first substrate 11 and the components of the secondary circuit are arranged on the second substrate 12 in consideration of the electrical distance required between the components of the upper and lower substrates 11 and 12. By arranging it, the influence of noise etc. is eliminated as much as possible. 4B shows an example of an electrolytic capacitor C2 and a driver IC 2 in which the components of the upper and lower substrates 11 and 12 are easily affected by the ambient temperature in consideration of both the spatial distances necessary for heat dissipation. So as to be spaced apart from each other. As a result, the electrolytic capacitor C2 is not easily affected by the heat from the driver IC2, and the life of the electrolytic capacitor C2 can be extended.

FIG. 7 is a view showing a use state of the illuminating lamp 30 incorporating the circuit board main body 3 of the present invention, in which the illuminating lamp 30 is mounted on the current instrument 62 provided at the lower portion of the support 61. Although this illuminating lamp 30 corresponds to the present invention, the outer shell shape is the same as that of the conventional illuminating lamp 60 except for an internal halogen lamp and the like.
FIG. 8 shows a case where the circuit board main body 3 is arranged in the main body 31 of the illuminating lamp 30, and a light source unit 34 configured by mounting a plurality of high output type light emitting diodes 1 on the substrate 33 is arranged in the reflector 32. It is. In addition, one power cable 5 of the circuit board body 3 is connected to a base part 35, and the other power cable 5 is connected to a tip contact part 36 at the tip of the base part 35. A pair of light-emitting diode connecting cables 4 of the circuit board body 3 are connected to a substrate 33 of the light source unit 34.

FIG. 9 shows an illuminating lamp 30 in the case of using one light-emitting diode 1 of a higher output type. Other configurations are the same as those in FIG.
FIG. 10 shows an illumination lamp 30 of a type different from the illumination lamp 30 shown in FIGS. 8 and 9, in which the shape of the base part 35 is different. In this case, a plurality of high output type light emitting diodes 1 are used.

The shape of the illuminating lamp 30 shown in FIG. 8 to FIG. 10 is the illuminating lamp 30 for the current halogen lamp, and instead of the halogen lamp, a high-power type light emitting diode 1 and the light emitting diode 1 are driven to be lit. The circuit board main body 3 is used.
That is, the size of the circuit board main body 3 is set to be within the current main body 31 of the illuminating lamp 30, and the circuit board main body 3, the light emitting diode 1 and the like of the present invention are incorporated in place of the halogen lamp, The illumination lamp 30 that does not generate heat can be provided. That is, since the first substrate 11 and the second substrate 12 of the same size are stacked in two stages in parallel, the circuit board body 3 composed of the first substrate 11 and the second substrate 12 can be reduced in size, It is possible to provide an illuminating lamp that can be housed in an illuminating lamp of a current halogen lamp and changed from the halogen lamp to the light emitting diode 1 without changing the size of the existing illuminating lamp. As a result, even when the illumination lamp 30 is used, the portion irradiated with the light source is not affected by heat, and the displayed products such as the store are not deteriorated. Irradiation does not cause a decrease in freshness.

(Second Embodiment)
In the previous embodiment, both the substrates 11 and 12 are circular, but are not limited to circular. For example, as shown in FIG. 11, the first substrate 11 is circular (round), the edge of the second substrate 12 is partially cut out, and the upper and lower substrates 11 are formed in the cutout portion 37 formed by the cutout. , 12 may be provided to connect the lead wires 23.
In addition, as shown in FIG. 12, the lead wires 23 may be disposed in a cutout portion 37 formed by cutting out a part of the edge of both the substrates 11 and 12. By arranging the lead wire 23 in the cutout portion 37 in this way, the lead wire 23 can be positioned within the outer shape of the circuit board main body 3, and the lead wire 23 is also positioned at the outer portion. It becomes easy.

(Third embodiment)
Next, a third embodiment will be described. In the previous embodiment, the substrates 11 and 12 are circular and have a two-stage configuration. However, in this embodiment, the substrate is a single substrate, and the overall length (lateral length) is shortened as much as possible. Is.

That is, as shown in FIG. 13, components having substantially the same height are mounted on the front and back surfaces of the horizontally long substrate 40, and the tall component is mounted on one surface of the back. Low components are mounted on the other side.
That is, a fuse F, a noise filter L4, an electrolytic capacitor C2, and a choke coil L1 are mounted on the upper surface of the substrate 40 from one end to the other end, and on the lower surface of the substrate 40 from one end to the other end. A varistor Z1, a capacitor C1, a diode bridge B1, a driver IC 2 and the like are mounted. Thereby, the height of the circuit board main body 3 can be made low, and size reduction can be achieved.

The power cable 5 and the light emitting diode connection cable 4 are attached to the other end of the board 40 by connecting the power cable 5 to one end of the board 40 in consideration of noise as in the previous embodiment. The LED connection cable 4 is connected to the side. Further, holes 41 for fixing the substrate 40 are formed at both ends of the substrate 40.
The driver IC 2 that generates heat and the electrolytic capacitor C2 that affects the life due to heat are mounted on the opposite surface of the substrate 40, thereby eliminating the influence of heat from the driver IC 2 on the electrolytic capacitor C2. The life of the electrolytic capacitor C2 can be extended.

Thus, since the components are mounted on both surfaces of the substrate 40, the lateral length of the substrate 40 can be shortened and can be disposed inside the current illumination lamp 30.
FIG. 14 shows a state in which the circuit board main body 3 constituted by the horizontally long board 40 is disposed inside the illumination lamp 30 as in the case of FIG. Since it is basically the same as in FIG. 8, detailed description thereof is omitted.

FIG. 15 shows a case where the circuit board main body 3 is disposed inside the pipe-shaped support body 61, and the light-emitting diodes that are driven and driven by the circuit board main body 3 are disposed in the illumination lamp 30.
In the embodiment shown in FIG. 15, since the circuit board body 3 is disposed in the support 61, the illumination lamp 30 side only needs to be a light emitting diode, and therefore the size of the illumination lamp 30 can be reduced. The design can also be improved. In particular, the design freedom on the side of the illuminating lamp 30 is improved, and various design designs are possible.

  As described above, in this embodiment, the substrate 40 on which both parts are mounted on both sides is formed in a horizontally long shape, and the noise filter L4, the choke coil L1, and the electrolytic capacitor C2 are mounted on the same surface of the substrate 40. The overall height can be reduced compared to the case where high-priced parts are mounted on both sides of the substrate 40, and therefore, it can be housed in the current halogen lamp illumination lamp or the pipe in which the illumination lamp is suspended. it can.

(Fourth embodiment)
FIG. 16 shows a constant current circuit according to the fourth embodiment. In this embodiment, the light-emitting diode 1 has a dimming function. The brightness of the light emitting diode 1 can be changed by connecting a dimming volume VR to the connection terminal of the driver IC 2 and turning the volume VR.
FIG. 17 shows a case where the illumination lamp 30 mounted with only the high-output type light emitting diode is not lit as in the case of FIG. 15, and is placed at the position of the volume VR mounted on the circuit board body 3. A hole is made in the corresponding support 61, and the tip of the driver 43 is inserted into this hole. Then, the volume adjustment is set by adjusting the volume VR at the tip of the driver 43.

FIG. 18 shows a case of a stand-type illuminating lamp 30, in which a large number of high-power type light emitting diodes 1 are turned on, and a dimming cable 46 from the circuit board body 3 disposed inside the stand base 45. And the cable 46 is connected to a dimming volume VR disposed on the front surface of the stand 45.
In the case shown in FIG. 18, since the volume VR is provided on the front surface of the stand base 45, any brightness can be set at any time.

FIG. 19 shows still another embodiment in the case of having a dimming function, and shows an example of lighting in a store. A number of illuminating lamps 30 are suspended from a suspending member 50 disposed on the lower surface of the ceiling, and cables 51 are led out from the circuit board body 3 of each illuminating lamp 30 to the control panel 53 installed on the wall surface 52. Wiring.
The control panel 53 is provided with a dimming volume VR corresponding to each illuminating lamp 30, and by adjusting this volume VR, it is possible to dim any illuminating lamp 30. It has become.

It is a figure which shows the constant current circuit for the high output type light emitting diode lighting drive in the 1st Embodiment of this invention. It is a front view of the circuit board main body in the 1st Embodiment of this invention. It is an exploded view of the circuit board main body in the 1st Embodiment of this invention. (A)-(d) is the front view of the circuit board main body in the 1st Embodiment of this invention, a side view, a top view, and a bottom view. It is the figure which looked at the AA direction of Fig.4 (a) in the 1st Embodiment of this invention. It is the figure which looked at the BB direction of Fig.4 (a) in the 1st Embodiment of this invention. It is a figure which shows the use condition of the illuminating lamp in the 1st Embodiment of this invention. It is sectional drawing of an illuminating lamp at the time of providing the multiple high output type light emitting diode in the 1st Embodiment of this invention. It is sectional drawing of an illuminating lamp at the time of providing one high output type light emitting diode in the 1st Embodiment of this invention. It is sectional drawing in the case of the illumination lamp of a different shape in the 1st Embodiment of this invention. It is explanatory drawing in the 2nd Embodiment of this invention. It is explanatory drawing in the 2nd Embodiment of this invention. (A)-(d) is the front view, top view, bottom view, and side view of a circuit board main body at the time of using the horizontally long board | substrate in the 3rd Embodiment of this invention. It is sectional drawing of the illuminating lamp at the time of using the horizontally long board | substrate in the 3rd Embodiment of this invention. It is a figure which shows the usage example at the time of arrange | positioning the horizontally long board | substrate in the 3rd Embodiment of this invention inside a support body. It is a figure which shows the constant current circuit at the time of providing the light control function in the 4th Embodiment of this invention. It is a figure which shows the usage example in the case of performing the light control in the 4th Embodiment of this invention. It is a figure which shows the usage example in the case of performing light control by the stand type in the 4th Embodiment of this invention. It is a figure which shows the usage example in the case of performing light control of many illuminating lamps in the 4th Embodiment of this invention. It is a figure of the illuminating lamp in the case of using the halogen lamp of a prior art example. It is a figure of the illuminating lamp at the time of using the halogen lamp of a prior art example in a stand type. (A)-(c) is the top view of the board | substrate of the constant current circuit of a prior art example, a front view, and a side view.

Explanation of symbols

1 Light-emitting diode 2 Driver IC
DESCRIPTION OF SYMBOLS 3 Circuit board body 4 Light emitting diode connection cable 5 Power supply cable 11 1st board 12 2nd board 23 Lead wire B1 Diode bridge C2 Electrolytic capacitor L1 Choke coil L4 Noise filter

Claims (8)

A primary side circuit composed mainly of a noise filter (L4) whose input side is connected to an AC power source and a diode bridge (B1) connected to the output side of the noise filter (L4) and rectifying AC;
A choke coil (L1) connected to the output side of the diode bridge (B1), an electrolytic capacitor (C2) for smoothing the output of the diode bridge (B1), and a direct current smoothed by the electrolytic capacitor (C2) In a constant current circuit composed of a secondary side circuit composed mainly of a driver IC (2) that is supplied with power and that drives a high output type light emitting diode (1) to be driven at a constant current,
A first board (11) on which components constituting the primary circuit are mounted and a second board (12) on which components constituting the secondary circuit are mounted are provided. ) (12) are formed to have substantially the same size, and the first substrate (11) and the second substrate (12) are stacked in two stages in parallel. Constant current circuit board. The noise filter (L4) mounted on the first substrate (11) is disposed toward the second substrate (12), and the choke coil (L1) mounted on the second substrate (12) and the electrolytic capacitor ( C2) is arranged in the direction of the first substrate (11),
The high-power light-emitting diode according to claim 1, wherein the noise filter (L4), the choke coil (L1), and the electrolytic capacitor (C2) are disposed so as to be relatively shifted on a horizontal plane. Constant current circuit board for driving. A lead wire (23) connecting the primary side circuit and the secondary side circuit is connected between the first substrate (11) and the second substrate (12),
The power supply cable (5) connected to the AC power supply side is led out from the first substrate (11), and the light emitting diode connection cable (4) connected to the light emitting diode (1) is connected to the second substrate ( The constant current circuit board for driving a high-power light-emitting diode according to claim 1 or 2, wherein the constant-current circuit board is led out in a reverse direction with respect to the power cable (5).   The height according to any one of claims 1 to 3, wherein the first substrate (11) and the second substrate (12) have a circular shape or a substantially circular shape with a part removed. Constant current circuit board for driving output light emitting diode.   The lead wire (23), the power cable (5), and the light-emitting diode connection cable (4) are arranged within the projected areas of both substrates (11) and (12). 5. A constant current circuit board for driving a high output light emitting diode according to claim 4.   The high output according to any one of claims 1 to 5, characterized in that the spacer (13) for arranging the two substrates (11) (12) in a parallel two-stage stack is made of synthetic resin. Constant current circuit board for driving light emitting diodes. A noise filter (L4) whose input side is connected to an AC power source, a diode bridge (B1) connected to the output side of this noise filter (L4) and rectifying AC, and connected to the output side of this diode bridge (B1) Choke coil (L1), an electrolytic capacitor (C2) for smoothing the output of the diode bridge (B1), and a DC power source smoothed by the electrolytic capacitor (C2) is supplied to the high output type light emitting diode (1 In a constant current circuit composed mainly of a driver IC (2) that is driven to light at a constant current,
The board (40) on which both the components are mounted on both sides is formed in a horizontally long shape, and the noise filter (L4), choke coil (L1), and electrolytic capacitor (C2) are mounted on the same surface of the board (40). A constant current circuit board for driving a high power light emitting diode. The constant current circuit board for driving a high-power light-emitting diode according to claim 7, wherein the driver IC (2) is mounted on a surface opposite to the electrolytic capacitor (C2).

Images