JP4808638B2 - IC card manufacturing method - Google Patents

Description

  The present invention relates to a method of manufacturing an IC card such as a non-contact type electronic card that stores personal information or the like that requires safety (security) such as forgery or alteration prevention, or a personal authentication card that is suitable for application to a system. About.

  Conventionally, magnetic cards for recording data by a magnetic recording method have been widely used for identification cards (ID cards) and credit cards. However, since data can be rewritten relatively easily with a magnetic card, it is not enough to prevent data tampering, it is susceptible to external influences due to magnetism, data protection is not enough, and there is little capacity for recording. There were problems such as.

  Some ID cards have, for example, a face layer and description information on the front surface and a writing layer on the back surface that can be filled in with a writing tool or the like. Such ID cards can be made easily and inexpensively due to recent advances in sublimation printing technology, and have been rapidly spread over the past few years, but have not yet been fully spread.

  An IC chip is built in the ID card, and the high cost is cited as the biggest impediment factor that has not yet spread in earnest. Moreover, since it does not spread, it cannot be mass-produced and becomes expensive, and since it is expensive, it has fallen into a vicious circle.

  On the other hand, the quantitative problem is partly due to the fact that the technology for stably and inexpensively producing cards has not yet been established.

  As a conventional IC card manufacturing method, for example, there is a comparatively thick thickness, an IC component and a radio antenna are housed in a cover made of upper and lower resin molds, and the joint surface of the upper and lower covers is melted by heat. A sheet created by bonding or a sheet material is cut into a groove, an IC component and a radio antenna are accommodated in the groove, and this is sealed with resin, and a sheet for holding an image receiving layer thereon Some are created by bonding materials.

  In recent years, there have been increasing cases in which personal information is illegally used and a malicious third party forges a card or uses a card obtained illegally to cause a lot of damage. Various attempts have been made to prevent such problems, but it is still insufficient.

  By the way, the first sheet material and the second sheet material are recorded with a format for recording the face image and description information, for example, by printing or the like, but this surface recording has a recording failure due to dust or dust. May occur. If an IC card is produced by encapsulating an IC unit in a portion where the surface recording is defective, the IC card is discarded as a defective product. The cost of discarding the IC unit increases.

If the IC chip is encapsulated between the two opposite supports, and after a punching process, printing is performed in the form of a card, this surface recording may cause a recording failure due to dust or dust. Even though an expensive IC chip is a good product, it becomes a defective product as an IC card, and as a result, it cannot be stably manufactured at a low cost. For this reason, there has been proposed one in which an IC module made up of an antenna and an IC chip is not placed in a defective printing place (for example, Patent Document 1).
Japanese Patent Laid-Open No. 2000-20668 (pages 1 to 8, FIGS. 1 to 5)

  In particular, in IC cards using very expensive IC chips, the problem is how to manufacture them at low cost. In the manufacturing process, defective products are immediately detected in each process, and not efficiently passed on to subsequent processes. It is necessary to manage the process for manufacturing.

  In order to deal with this problem, conventionally, as process management, defect information and inspection information have been subjected to manufacturing lot management using a book or recently a tag or the like, and the defect has been eliminated. However, with this method, there is a time lag between actual IC card production and book creation, and tags for each production lot are not managed individually for each IC card, making it possible to produce quickly and efficiently. There wasn't. From the viewpoint of security, IC-specific management is required from each process of the IC chip, and it is necessary to prevent outflow of cards from the manufacturing process in real time.

  Conventionally, in order to ensure traceability such as IC card defects and manufacturing lot tracking in the market, those with a serial number visibly engraved on the surface with a laser or the like have been used. Engraving could restrict the design of the card surface or be easily misused by a malicious third party. When IC card unique information such as a stamp is not provided on the ticket surface, it is necessary to record and manage the unique information on the IC chip in order to ensure traceability. However, it is difficult to perform process management that correlates with manufacturing date, material lot, IC inspection information, imposition address information, etc. in the manufacturing process only by randomly recording unique information on the IC chip. there were.

  The present invention has been made in view of such circumstances, and an object thereof is to manufacture an IC card using an expensive IC chip at a low cost and efficiently, ensuring the traceability of the IC card and increasing the security. It is to provide a method of manufacturing an IC card that can be maintained.

  In order to solve the above-described problems and achieve the object, the present invention is configured as follows.

1. In an IC card manufacturing method formed by enclosing and bonding an IC module having an antenna and an IC chip in two opposing supports,
A support printing step of forming a plurality of cards on the support and performing printing for the plurality of cards;
A support recording step for recording a print quality record of the plurality of card prints on a part of the support;
An IC chip recording step for recording individual IC chip specific information on the IC chip;
An IC module placement step of placing an IC module in a good print location based on the print quality record;
A bonding pressure bonding step in which the other support is oppositely bonded to the support on which the IC module is placed, and a card base is formed; and
An IC chip specific information acquisition step of acquiring specific information of each IC chip held by the card substrate;
A punching process in which non-defective products are selected based on print quality records and punched into individual cards from the card base.
An issuance process for performing an IC chip function test and issuing an IC card by associating the IC chip specific information with the issuance content;
A data processing step for creating a management database by associating information in each step;
A method for producing an IC card, comprising:
2. 2. The IC card manufacturing method according to 1, wherein non-defective products are selected in the punching process based on unique information of the individual IC chips.
3. 3. The IC card manufacturing method according to 1 or 2, wherein the unique information of each individual IC chip is selected from at least one of an IC unique number, IC inspection information, and imposition address information.
4). 4. The IC card manufacturing method according to any one of claims 1 to 3, wherein process information is managed by using the unique information of the individual IC modules as common information.
5. 5. The IC card manufacturing method according to claim 1, wherein the management database includes at least printing imposition address information, product type information, manufacturing date, lot information, and inspection information.
6). In the IC card issuing step, the unique information of each IC chip is acquired, the operation test of the IC module is performed at the same time, and the IC failure address and frequency are detected from the inspection result and the print failure information. 6. A method for producing an IC card according to any one of 5 above.
7). 7. The IC card manufacturing method according to any one of claims 1 to 6, wherein in the issuing step, a defect frequency in an intermediate step is detected in comparison with unique information of each IC chip.
8). 8. The IC card manufacturing method according to any one of 1 to 7, wherein the print defect information is a binary image, and information is acquired by an optical reading method.

  With the above configuration, the present invention has the following effects.

  According to the invention described in claim 1, a support recording step, an IC chip recording step, an IC module placement step, a bonding pressure bonding step, an IC specific information acquisition step, a punching step, It has an issuance process and a data processing process. By managing the process based on chip data, defective print data, and chip inspection data, even an IC card using an expensive IC chip can be manufactured inexpensively and efficiently. Card traceability can be secured and security can be kept high.

  According to the invention described in claim 2, it is efficient by selecting non-defective products in the punching process from the IC-specific information of the card base material, passing the non-defective products to the post-process, and not transferring the defective products to the post-process. IC cards can be manufactured.

  According to the invention described in claim 3, the IC unique information is selected from at least one of the IC unique number, the IC inspection information, and the imposition address information, and the non-defective product can be selected easily and reliably. .

  According to the invention described in claim 4, by making the IC unique information of the IC module common information and managing the process, for example, manufacturing history can be aggregated in real time based on the IC unique information. , Delivery time management, cost reduction, traceability management becomes possible.

  According to the invention described in claim 5, the management database includes at least print imposition address information, product type information, production date, lot information, and inspection information, and print imposition address information in the manufacturing process. It is possible to perform process management that correlates with product type information, production date, lot information, inspection information, and the like.

  According to the invention described in claim 6, in the issuing process, the IC specific information of the integrated card base is obtained, and the operation inspection of the IC module is performed at the same time, from the inspection result and the print defect information. IC defect address and frequency can be detected, and traceability management with high security is possible.

  According to the invention described in claim 7, in the issuing process, it is possible to detect the failure frequency in the intermediate process in comparison with the IC specific information, and to manage traceability with high security.

  According to the invention described in claim 8, the print defect information is composed of a binary image, and by acquiring information by an optical reading method, highly secure traceability management is possible.

It is a schematic block diagram of the manufacturing process of an IC card. It is a figure which shows an example of the process including bonding crimping | compression-bonding of an IC card. It is a figure which shows reading of printing inspection information. It is a side view of the principal part of a punching die apparatus. It is a figure which shows schematic structure of an IC card. It is a figure which shows the flow of the manufacturing process of an IC card.

Explanation of symbols

A Support printing process B Support recording process C IC chip recording process D IC module placement process E Bonding crimping process F IC specific information acquisition process G Punching process H Issuing process I Data processing process

  Hereinafter, although the manufacturing method of the IC card of this invention is demonstrated in detail based on drawing, this invention is not limited to this embodiment. The embodiment of the present invention shows the most preferable mode of the present invention, and the present invention is not limited to this.

  FIG. 1 is a schematic configuration diagram of an IC card manufacturing process. In the manufacture of the IC card of this embodiment, the support printing process A, the support recording process B, the IC chip recording process C, the IC module placement process D, the bonding pressure bonding process E, and the IC specific information It has an acquisition process F, a punching process G, an issuing process H, and a data processing process I, and is bonded to enclose an IC module composed of an antenna and an IC chip between two opposing supports. Manufacture IC cards.

[Support printing process A]
In the support body printing process A, it prints on the opposing support body.

  Examples of the opposing support include, for example, polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene terephthalate / isophthalate copolymer, polyolefin resins such as polyethylene, polypropylene, and polymethylpentene, polyvinyl fluoride, polyvinylidene fluoride, poly Polyfluorinated ethylene resins such as ethylene tetrafluoride and ethylene-tetrafluoroethylene copolymer, polyamides such as nylon 6 and nylon 6.6, polyvinyl chloride, vinyl chloride / vinyl acetate copolymer, ethylene / acetic acid Vinyl copolymer, ethylene / vinyl alcohol copolymer, polyvinyl alcohol, vinyl polymer such as vinylon, biodegradable aliphatic polyester, biodegradable polycarbonate, biodegradable polylactic acid, biodegradable polyvinyl alcohol, Degradable cellulose acetate, biodegradable resin such as biodegradable polycaprolactone, cellulose resin such as cellulose triacetate, cellophane, polymethyl methacrylate, polyethyl methacrylate, polyethyl acrylate, polybutyl acrylate, Acrylic resins such as polystyrene, polycarbonate, polyarylate, synthetic resin sheets such as polyimide, or high-quality paper, thin paper, glassine paper, paper such as sulfuric paper, a single layer of metal foil, or a laminate of two or more layers Is mentioned. The thickness of the support is 30 to 300 μm, preferably 50 to 200 μm. In this invention, from the viewpoint of card base material transportability due to heat shrinkage and warping of the support, the sheet member has a thermal shrinkage rate at 150 ° C./30 min of 1.2% or less in the vertical (MD) and horizontal (TD). 0.5% or less is preferable. Further, an easy contact treatment may be performed on the support for post-processing to improve adhesion, and an antistatic treatment may be performed for chip protection. Specifically, U2 series, U4 series, UL series manufactured by Teijin DuPont Films, Ltd., Chrisper G series manufactured by Toyobo Co., Ltd., E00 series, E20 series, E22 series, X20 series, E40 series manufactured by Toray Industries, Inc. The E60 series QE series can be suitably used.

  One of the opposing supports may be provided with a cushion layer in addition to the image receiving layer in order to form a face image of the card user. At least one selected from an authentication identification image such as a face image, an attribute information image, and format printing may be provided on the surface of the personal authentication card substrate, or a white card having no printed portion may be used.

  The image receiving layer can be formed of a binder and various additives. The image receiving layer forms a gradation information-containing image by a sublimation type thermal transfer method and also forms a character information-containing image by a sublimation type thermal transfer method or a melt type thermal transfer method. The adhesion of the hot-melt ink should be good as well as the dyeing property of the ink. In order to impart such special properties to the image-receiving layer, it is necessary to appropriately adjust the types of binders and various additives and their blending amounts as described later.

  An information carrier made up of format printing means that ruled lines, company names, card names, notes, issuer telephone numbers, etc. are formed in advance.

  For the formation of an information carrier consisting of format printing, use the “lithographic printing technology”, “new printing technology overview”, “offset printing technology”, “plate making / printing slightly understandable picture book” published by Japan Printing Technology Association, etc. It can be formed using the general inks described, and is formed of ink such as carbon in photocurable ink, oil-soluble ink, solvent-type ink, and the like.

  In some cases, watermark printing, holograms, fine patterns, etc. may be employed to prevent visual counterfeiting, and the printed material, hologram, barcode, matte pattern, fine pattern, background pattern, uneven pattern may be used as the forgery / alteration prevention layer. Such as visible light absorbing color material, ultraviolet absorber, infrared absorber, fluorescent whitening material, metal deposition layer, glass deposition layer, bead layer, optical change element layer, pearl ink layer, neighbor pigment layer, It is also possible to provide the front sheet by printing or the like from an antistatic layer or the like.

  The other opposing support may have a writing layer, and this writing layer is a layer that allows writing on the back surface of the IC card. As such a writing layer, for example, inorganic fine powders such as calcium carbonate, talc, diatomaceous earth, titanium oxide, and barium sulfate are included in a film of a thermoplastic resin (polyolefins such as polyethylene and various copolymers). Can be formed. It can be formed with a “writing layer” described in JP-A-1-205155. Addition of a material that improves slipperiness, such as wax, to the writing layer is effective in preventing damage and wear when rubbed. As the additive, polyethylene wax is preferably used.

  In the support printing step A, format printing or information recording is performed before at least bonding the opposing supports. As the printing method, the above-mentioned known printing methods can be used, such as offset printing, gravure printing, silk printing, screen printing, intaglio printing, letterpress printing, ink jet method, sublimation transfer method, electrophotographic method, heat melting method, etc. It can be formed by any of these methods.

[Support Recording Step B]
In the support recording process B, a print defect record is recorded on a part of the support. It is preferable that the printing failure is inspected and inspected at least before attaching the opposing support body with the IC module sandwiched therebetween, and the defect and non-defective product information is preferably recorded on a part of the inspected support body.

  As a recording method, a known method can be used without limitation, but a binary image is preferable. As the recording method, binary recording, two-dimensional barcode, and three-dimensional barcode can be used as electronic recording such as an IC tag and optical recording. The recording method may be a printing method, such as offset printing, gravure printing, silk printing, screen printing, intaglio printing, letterpress printing, ink jet method, sublimation transfer method, electrophotographic method, heat melting method, etc. Can be used.

  The print defect information preferably includes at least address information that can identify a defect position and defect information that includes the type of defect.

[IC chip recording process C]
In the IC chip recording step C, IC specific information is recorded on the IC chip.

  IC-specific information to be recorded includes an identification number for identifying an IC card, a production management lot number, inspection information, an encryption key, etc., personal identification information (name, address, employee number, face image, etc.), manufacturer, The information is not particularly limited as long as it is individually identifiable information such as an issuing machine number, but is preferably an IC unique number, IC inspection information, or imposition address information. The IC specific information may be encrypted, and from the viewpoint of security, it is preferable to use a known encryption and verification method, and may include encryption and verification information.

  The IC specific information may be recorded on the chip by direct electrical contact with the IC chip, or selected and recorded appropriately according to the method of the IC module to be manufactured, such as a non-contact electromagnetic induction method or an electromagnetic coupling method. can do. When recording without contact, it is preferable to record information by a reader / writer. The recorded IC specific information is recorded in a data server that manages the information.

  The IC specific information is preferably stored in the manufacturing / issue database in a one-to-one correspondence. The IC specific information can be recorded on the IC chip by the reader / writer connected to the database. Further, the reader / writer can read the IC specific information of the IC chip recorded in advance, and perform additional recording, correction, and new recording in the database. A plurality of data servers may be used as long as the information can correspond to each other on a one-to-one basis, or may be directly connected or indirectly connected, or may be a data server in which manufacturing information and manufacturing information are different.

[IC module placement process D]
In the IC module placement step D, the IC module is placed based on the print defect record information.

  The IC module refers to an information recording member, and specifically includes an IC chip that electrically stores information of a user of the electronic card and a coiled antenna body connected to the IC chip. The IC chip is a memory alone or in addition to a microcomputer. In some cases, a capacitor may be included in the electronic component of the IC module. The present invention is not limited to this, and is not particularly limited as long as it is an electronic component necessary for the information recording member.

  The IC module has an antenna coil, but when it has an antenna pattern, any method such as conductive paste printing, copper foil etching, or winding welding may be used. As the printed board, a thermoplastic film such as polyester is used, and polyimide is advantageous when heat resistance is required. The IC chip and antenna pattern can be joined using conductive adhesives such as silver paste, copper paste, and carbon paste (EN-4000 series from Hitachi Chemical, XAP series from Toshiba Chemical) and anisotropic conductive films (Hitachi Chemical). There are known methods using industrial anisol, etc.) or soldering methods, but any method may be used.

  In order to fill the resin after placing the parts including the IC chip in a predetermined position in advance, the shearing force due to the flow of the resin causes the joint to come off or the surface smoothness due to the flow or cooling of the resin. In order to eliminate the damage and lack of stability, a resin layer is previously formed on the substrate sheet, and the electronic component is sealed with a porous resin film or porous foam to enclose the component in the resin layer. It is preferably used in the form of a conductive resin film, a flexible resin sheet, a porous resin sheet or a non-woven sheet. For example, a method described in Japanese Patent Application No. 11-105476 can be used.

  Further, since the IC chip has a weak point pressure strength, it is also preferable to have a reinforcing plate in the vicinity of the IC chip. The total thickness of the electronic component is preferably 10 to 300 μm, more preferably 30 to 300 μm, still more preferably 30 to 250 μm.

  As a method of placing the IC module on the support, refer to the defective print address information so that the IC module is not placed on the defective print portion printed in advance on the support, and only place the good print on the printed product. Put. For the printing failure information, it is more reliable and preferable to use information recorded in advance on a part of the support to be placed. As a method for reading information recorded in advance, a known method can be used. The reading method includes electronic information such as an IC tag, optical recording includes binary image recording, two-dimensional barcode, three-dimensional barcode, and the like, but it is preferable to read a binary image by an optical reading method.

[Lamination bonding process E]
In the bonding and crimping step E, the opposing support is bonded and bonded so as to sandwich the IC module. As a manufacturing method in order to provide a predetermined IC module between at least a pair of opposing supports, a heat bonding method, an adhesive bonding method, and an injection molding method are known. May be.

  For example, in the heat bonding method, a step of providing an adhesive member which is a solid or a viscous body at normal temperature and softens in a heated state on a support, a step of placing an IC module on the support, A step of disposing a surface support provided with an adhesive member so as to cover the IC module, and a step of bonding the support, the IC module, and the surface support under a predetermined pressure and heating condition And stick together.

  The adhesive member that softens in the heated state of a solid or viscous material can be bonded to the method of forming the adhesive itself in a sheet form and the adhesive itself by heating or melting at room temperature and injection molding.

At the time of bonding, it is preferable to perform heating and pressurization in order to increase the surface smoothness of the support and the adhesion of a predetermined IC module between the first support and the second support. It is preferable to manufacture by a laminate method or the like. Furthermore, in consideration of cracks in the IC components of the IC module, it is preferable to use a flat press die that avoids a roller that is close to line contact and that exerts an unreasonable bending force even with a slight deviation. The heating is preferably 10 to 120 ° C, more preferably 30 to 100 ° C. The pressurization is preferably 0.1 to 300 kgf / cm ² , more preferably 0.1 to 100 kgf / cm ² . If the pressure is higher than this, the IC chip will be damaged. The heating and pressurizing time is preferably 0.1 to 180 sec, more preferably 0.1 to 120 sec.

[IC specific information acquisition process F]
In the IC specific information acquisition step F, the IC specific information of the integrated card base is acquired. After the IC module placed at the non-defective imposition position of the first support is bonded and integrated with the second support based on the print defect information, the IC chip can be specified by the non-contact reader / writer The IC unique number of the IC unique information is read, the IC chip is also inspected, the inspection result, the support lot of the read IC unique number, and the IC module position information (imposition address information) on the support are detected, and the IC The unique information is recorded in the management database in a one-to-one correspondence.

  The address information of the IC module may be obtained from the installation position of the non-contact reader / writer. As the support lot, a record of an optical reading method recorded in advance may be used. The optical read information read as information for mounting the IC module and the information read from the non-contact reader / writer from the IC module are recorded in the management database in a one-to-one correspondence with the IC specific information.

[Punching process G]
In the punching process G, a non-defective product is selected based on the printing defect record and punched into a card shape. The punching method is not particularly limited and can be used. In this invention, in consideration of productivity and maintainability, a bonded sheet base material was punched into a card shape using a punch die method with a blade angle of around 90 degrees.

  In this way, the punching blade uses a mold in which the punch side blade to be punched and the die side blade to be punched are paired up and down, and the card base is cut at a blade angle of about 90 °. . Since the punch die method has a simple blade structure, the punch die method is suitable for production in which a large amount of card base material is punched. Since it is difficult to punch a card base material having a high breaking elongation, it is preferable to use an adhesive having a breaking elongation of 500% or less.

  When punching a plurality of format-printed card bases with a plurality of punches as in this invention, if punching is performed simultaneously, compressive stress and tensile stress are simultaneously applied to the card base material from multiple directions. In addition, the “cut residue” of the base material occurs on the cut surface, which often causes “burrs”. As a countermeasure, in the present invention, as a means for dispersing stress, even if a plurality of punches are operated simultaneously so that the plurality of punches do not punch the card substrate at the same time, the difference in the punch height as in the embodiment is provided. By attaching it, it is devised to avoid simultaneous punching. As a means for making a difference in how to cut a plurality of punches, a means for avoiding punching at the same time by using a plurality of punches by using a plurality of motors and changing each punching speed is also preferable.

  In this punching step, the optical reading information provided on the first support is read, and the defective printing address where no IC module is mounted is detected by the optical reading device. Based on the detected information, defective portions are punched out in the punching process and then discharged. Further, defective IC module products are similarly punched and discharged from the address information and support lot information of defective IC modules detected and recorded after the bonding and crimping process based on the inspection information recorded in the management database. The discharge mechanism is not particularly limited.

[Issuing process H]
In the issuing step H, an IC card is issued through IC function inspection and IC specific information acquisition. The punched IC card flows to the issuing process. In the issuing step, primary and secondary issuance of information writing to an IC chip is performed using a non-contact reader / writer. However, it may or may not issue the design printing of the face, the printing of identification information including personal information, the IC function inspection, and the face inspection, or a plurality of them may be combined. At least in the issuance process, an IC unique number for obtaining IC unique information is read, and the issued contents and results are recorded in the management database in a one-to-one correspondence.

  Only cards that pass a predetermined standard for all issued contents are collected as non-defective products, and those that do not meet the standard are rejected and discharged. In the case of a manufacturing form in which the personal identification information is transferred to the shipping process without printing the identification information on the IC chip or the ticket surface until the first issue as an embodiment, in the issuing process, design printing and a non-contact reader / writer are used. IC identification number is read, IC inspection, primary issuance of information writing to IC chip, card surface inspection, pass / fail judgment is performed, only cards that pass a predetermined standard are accumulated as good products, and those that do not meet the standard are considered defective As well as discharging, the issuance contents and results are recorded in the management database in a one-to-one correspondence.

  In this way, all the information corresponds one-to-one with the IC unique number of the IC chip introduced upstream in the manufacturing process, and traceability management with high security is possible.

  As a recording method of personal identification information (attribute information, name, address, employee number, face image, etc.) on the surface of the IC card, a publicly known method can be used.

  The face image is usually a full-color image having gradation, and is produced by, for example, a sublimation type thermal transfer recording method, a silver halide color photographic method, or the like. The character information image is composed of a binary image, and is produced by, for example, a melt type thermal transfer recording method, a sublimation type thermal transfer recording method, a silver halide color photographic method, an electrophotographic method, an ink jet method or the like. In the present invention, it is preferable to record an authentication identification image such as a face image and an attribute information image by a sublimation type thermal transfer recording method.

  The attribute information includes name, address, date of birth, qualification, etc., and the attribute information is usually recorded as character information, and a melt type thermal transfer recording method is generally used. Format printing or information recording may be performed. By any method such as offset printing, gravure printing, silk printing, screen printing, intaglio printing, letterpress printing, ink jet method, sublimation transfer method, electrophotographic method, heat melting method, etc. Can be formed.

  Further, for the purpose of preventing forgery and alteration, watermark printing, holograms, fine patterns, etc. may be employed. Anti-counterfeiting anti-counterfeiting layer is selected from printed materials, holograms, barcodes, matte patterns, fine patterns, ground patterns, concavo-convex patterns, etc., visible light absorbing colorant, ultraviolet absorbing material, infrared absorbing material, fluorescent whitening material, metal It consists of a vapor deposition layer, a glass vapor deposition layer, a bead layer, an optical change element layer, a pearl ink layer, a neighboring pigment layer, and the like. Finally, it is preferable to provide a protective sheet or a protective layer for protecting the ticket surface information.

  In general, zero-order issuance, primary issuance, and secondary issuance are performed as recording on the IC chip. With the 0th issue, basic information such as basic information, control information, manufacturing information, and manufacturing number for the IC chip is recorded.

  The primary issue mainly writes basic information such as IC card file information. Generation of DF (Dedicated File), EF (Elementary File), etc. and writing of initial common data are performed. If there is a time delay or location movement before the personal information is finally written, forgery and alteration may occur due to theft. It is preferable to record the key information (transportation key) for release on the IC card to perform the closing.

  The secondary issue is completed by recording personal identification information (name, address, qualification, etc.), which is called secondary issue as a personal authentication card, personal information such as electronic money, and monetary information. The delivery of key information is handled confidentially and verified and released by the issuing machine. The IC card that has been subjected to the blocking process is secondarily issued. In the secondary issue, the IC card transport key is set in the secondary issue process manually or automatically by electronic media, printed matter, etc. as a physically managed medium so that it is not easily stolen or leaked. Is done. At this time, the information may or may not be encrypted, but it may be encrypted for security reasons. Further, a known collation method such as a hash function or an encryption key may be incorporated. When the transport key matches with the secondary issue, the IC card is activated. If they do not match, the IC card is not activated. In this case, the IC card may be completely closed after a predetermined number of failures.

  The activated IC card is permitted to perform a writing operation by the secondary issue process, and records personal information such as name, address, and electronic money and money information as a personal authentication card, for example. At this time, it is preferable in terms of security that only the key information recorded in the IC card is unusable or deleted. The primary issue and the secondary issue may be performed continuously, or may be performed separately at different locations and times. This completes the IC card.

[Data processing step I]
In the data processing step I, information including printing defect records, IC specific information, and issue information is made into a management database.

  Next, an outline of an IC card manufacturing apparatus is shown in FIGS. FIG. 2 is a diagram showing an example of a process including IC card bonding and crimping, FIG. 3 is a diagram showing reading of printing inspection information, FIG. 4 is a side view of the main part of the punching die apparatus, and FIG. 5 is an IC card. It is a figure which shows schematic structure of these.

  The IC card laminating and crimping apparatus 9 is provided with a delivery shaft 10 that feeds out the first support 1, and the first support 1 delivered from the delivery shaft 10 spans the guide roller 11 and the drive roller 12. Supplied. An applicator coater 13 is disposed between the delivery shaft 10 and the guide roller 11. The applicator coater 13 applies the adhesive 2a to the first support 1 with a predetermined thickness.

  The IC card laminating and crimping device 9 is provided with a delivery shaft 14 that feeds the second support 4. The second support 4 fed from the delivery shaft 14 is connected to the guide roller 15 and the drive roller 16. Supplied after being delivered. An applicator coater 17 is disposed between the feed shaft 14 and the guide roller 15. The applicator coater 17 applies the adhesive 2b to the second support 4 with a predetermined thickness.

  The first support body 1 coated with the adhesive and the second support body 4 come into contact with each other from a state of being opposed to each other and are transported along the transport path 18. The IC module 3 is inserted into a position where the first support 1 and the second support 4 are spaced apart from each other.

  As shown in FIG. 3, the optical reading device 101 reads the print inspection information from the recording unit 100 of the first support 1, and places the IC module 3 on the defective print address 1 a of the first support 1. First, the IC module 3 is placed only at the non-defective position.

  The IC module 3 is supplied as a single unit or a plurality of sheets or rolls. In the conveyance path 18 of the IC card bonding and crimping device 9, the heating laminate portion 19 and the cutting portion 20 are arranged along the conveyance direction of the second support 4 and the first support 1. The heating laminate 19 is preferably a vacuum heating laminate. Further, a protective film supply unit may be provided in front of the heat laminating unit 19, and it is preferable that the protective film supply unit is disposed facing the upper and lower sides of the transport path 18. The heating laminate unit 19 includes a flat heating laminate upper mold 21 and a heating laminate lower mold 22 that are arranged to face the upper and lower sides of the conveyance path 18. The heating laminate upper mold 21 and the lower mold 22 are provided so as to be movable in a direction in which they are separated from each other. After passing through the heat laminating unit 19, the cutting unit 20 is moved up and down by the vertical driving unit 23 to cut the integrated card base into a predetermined size.

  After the IC module 3 placed at the non-defective imposition position of the first support 1 based on the print defect information in this manner is bonded and integrated with the second support 4, the non-contact reader / writer is integrated. The IC unique number that can identify the IC chip is read from the recording unit 100 of the first support 1 by 102, the IC chip is also inspected, the inspection result, the support lot of the read IC unique number, and the IC module on the support Position information (imposition address information) is detected and recorded in the management database 103 in a one-to-one correspondence with the IC specific information. The address information of the IC module may be obtained from the installation position of the non-contact reader / writer 102 or the like. As the support lot, a record of an optical reading method recorded in advance may be used. The optical reading information read as information for mounting the IC module 3 and the information read from the non-contact reader / writer 102 from the IC module 3 are associated with the IC specific information in a one-to-one correspondence with the management database 103. To record. Thus, from the quantity of the IC modules 3 placed based on the print defect information read by the optical reading method (barcode) and the information obtained by inspecting the IC modules 3 that have undergone the bonding pressure bonding process with the non-contact reader / writer 102, The production history can be calculated in real time based on the yield in the printing process, the yield in the bonding and crimping process, and the IC specific information, thereby enabling delivery date management, cost reduction, and traceability management.

  Next, the card base material cut through the bonding pressure bonding step goes to a step of punching out into a card shape. The punching method is not particularly limited and can be used.

  FIG. 4 is a side view of the main part of the punching die apparatus. The punching die apparatus includes a punching die having an upper blade 110 and a lower blade 120, the upper blade 110 includes a punching punch 111, and the lower blade 120 has a punching die 121. An IC card having the same size as the die hole 122 is punched by lowering the punch 111 for punching into a die hole 122 provided at the center of the punching die 121. For this reason, the size of the punch 111 for punching is slightly smaller than the size of the die hole 122. A blade whose upper cutting blade has an angle close to a right angle is generally called a punch die, and a blade having an acute angle is called a hollow blade. The punch die method is usually a drop-off method, but a hollow blade is often provided with an underlay without being removed. In the present invention, in consideration of productivity and maintainability, a punched die system having a blade angle of around 90 degrees was used to punch a bonded sheet base material into a card shape.

  In this way, the punching blade uses a mold in which the punch side blade to be punched and the die side blade to be punched are paired up and down, and the card base is cut at a blade angle of about 90 °. . Since the punch die method has a simple blade structure, the punch die method is suitable for production in which a large amount of card base material is punched. Since it is difficult to punch a card base material having a high breaking elongation, it is preferable to use an adhesive having a breaking elongation of 500% or less.

  When punching a plurality of format-printed card bases with a plurality of punches as in this invention, if punching is performed simultaneously, compressive stress and tensile stress are simultaneously applied to the card base material from multiple directions. In addition, the “cut residue” of the base material occurs on the cut surface, which often causes “burrs”. As a countermeasure, in the present invention, as a means for dispersing stress, even if a plurality of punches are operated simultaneously so that the plurality of punches do not punch the card substrate at the same time, the difference in the punch height as in the embodiment is provided. By attaching it, it is devised to avoid simultaneous punching. As a means for making a difference in how to cut a plurality of punches, a means for avoiding punching at the same time by using a plurality of punches by using a plurality of motors and changing each punching speed is also preferable.

  In this punching process, the optical reading information is read from the recording unit 100 provided on the first support 1, and the defective printing address where the IC module 3 is not mounted is detected by the optical reading device 104. Based on the detected information, defective portions are punched out in the punching process and then discharged. Further, from the inspection information recorded in the management database 103, the defective IC module is similarly punched and discharged from the address information and the support lot information of the defective IC module 3 detected and recorded after the bonding and crimping process. The discharge mechanism is not particularly limited.

  The IC card of this embodiment includes a first support 1 and a second support 4, and adhesives 2a and 2b interposed between the first support 1 and the second support 4. And the IC module 3. The IC module 3 is sealed in the adhesives 2a and 2b. The surface of the first support 1 may be provided with an image-receiving layer 1b for printing images and written information, and the surface of the second support 4 may have a writable writing layer 4a. There is also. Personal identification information including a name and a face image is provided on the image receiving layer 1b.

  Further, the IC module 3 indicates an information recording member, specifically, an IC chip 3a that electrically stores information of a user of an IC card that is an electronic card, and a coil shape connected to the IC chip 3a. This is an IC module having the antenna 3b. The IC chip 3a and the antenna 3b are provided on the sheet substrate 3c. The IC chip 3a is a memory alone or in addition to a microcomputer. In addition, the IC chip 3a may include a capacitor as an electronic component in some cases.

  The present invention is not limited to this, and is not particularly limited as long as it is an electronic component necessary for the information recording member. The IC module has an antenna coil, but it may have an antenna pattern on the printed circuit board. In this case, any method such as conductive base printing, copper foil etching, or winding welding is used. May be formed.

  As the printed circuit board, a thermoplastic film such as polyester is used, and polyimide is advantageous when heat resistance is required. The IC chip and antenna pattern can be joined using conductive adhesives such as silver paste, copper paste, and carbon paste (EN-4000 series from Hitachi Chemical, XAP series from Toshiba Chemical) and anisotropic conductive films (Hitachi Chemical). There are known methods using industrial anisol, etc.) or soldering methods, but any method may be used.

  In addition, in order to fill the adhesive after a part including the IC chip is placed in a predetermined position in advance, the joint part is detached due to the shearing force due to the flow of the adhesive, or due to the flow or cooling of the adhesive. In order to eliminate the lack of stability, such as impairing the smoothness of the surface, an adhesive layer is formed in advance on the sheet substrate 3c, and components are enclosed in the adhesive layer. For this reason, it is preferable to use the IC chip-containing component after making it into a porous resin film, a porous foamable resin film, a flexible resin sheet, a porous resin sheet, or a nonwoven fabric sheet. . For example, a method described in Japanese Patent Application No. 11-105476 can be used.

  For example, examples of the non-woven sheet member include a mesh woven fabric such as a non-woven fabric, and a plain woven fabric, a twill woven fabric, and a satin woven fabric. In addition, a fabric having pile called moquette, plush velor, seal, velvet, or suede can be used. Materials include polyamides such as nylon 6, nylon 66 and nylon 8, polyesters such as polyethylene terephthalate, polyolefins such as polyethylene, polyvinyl alcohols, polyvinylidene chloride, polyvinyl chloride, polyacrylonitrile, acrylamide, methacryl Acrylics such as amides, synthetic resins such as polycyanide vinylidene, polyfluoroethylene, and polyurethane, natural fibers such as silk, cotton, wool, cellulose, and cellulose ester, recycled fibers (rayon, acetate), aramid fibers The fiber which combined 1 type, or 2 or more types chosen from among these is mentioned.

  Next, FIG. 6 shows a flow in the embodiment of the present invention. In FIG. 6, thin lines indicate information storage, and dotted lines indicate information readout.

  In step S1, either one of both sides or one side of the two opposing supports may be used, but the design is printed on the first support in advance, and a support is created. As a printing method, it can be formed by any method such as offset printing, gravure printing, silk printing, screen printing, intaglio printing, letterpress printing, ink jet method, sublimation transfer method, electrophotographic method, and heat melting method.

  Next, in step S2, the printed surface is inspected to inspect for dirt and unevenness, and the inspection result is recorded on a part of the support. The recording method is not particularly limited, but an optical reading method including a binary image is preferable from the viewpoint of recognition and cost. The result of the inspection is recorded as a support lot, defective card imposition address, and defect type by bar code recording.

  Next, in step S3, the inspection information is read by the optical reading device, and the IC module is not placed at the defective print address of the first support (step S4), and the IC module is placed only at the non-defective product position (step S4). S5).

  Print defect information (step S6) such as a support lot, a defective card imposition address, and a defect type read by the optical reading method is stored in the management database (step S7).

  The IC module to be mounted may be either when the IC module is manufactured (step S8) or when the IC module is mounted (step S5), but the IC unique number is recorded in the memory of the IC chip (step S9). In FIG. 6, the case where it recorded at the time of IC module manufacture is shown. As a recording method, writing may be performed in a non-contact manner using a non-contact reader / writer, or recording may be performed directly on an IC chip.

  Next, in step S10, a heat bonding method, an adhesive bonding method, and an injection molding method are known as a manufacturing method in order to provide a predetermined IC module between the first support and the second support. However, it may be bonded by any method. Although there is no restriction | limiting in particular as an IC card bonding method, At least two opposing support bodies are filled with an adhesive member. After bonding and pressure bonding, the integrated card substrate is cut into a predetermined size.

  In this way, after the IC module placed at the non-defective imposition position of the first support based on the print defect information is bonded and integrated with the second support, the contactless reader / writer The IC unique number that can identify the IC chip is read (step S11), the IC chip is also inspected, and the inspection result, the support lot of the read IC unique number, and the IC module position information (imposition address information) on the support are obtained. It is detected (step S12) and recorded in the management database in a one-to-one correspondence with the IC specific information (step S7). The address information of the IC module may be obtained from the installation position of the non-contact reader / writer. As the support lot, a record of an optical reading method recorded in advance may be used. The optical read information read as information for mounting the IC module and the information read from the non-contact reader / writer from the IC module are recorded in the management database in a one-to-one correspondence with the IC specific information. As a result, from the quantity of IC modules placed based on the print defect information read by the optical reading method (barcode) and the information obtained by inspecting the IC module that has undergone the bonding and crimping process with a non-contact reader / writer, The production history can be calculated in real time based on the yield, the yield in the bonding and crimping process, and the IC specific information, thereby enabling delivery time management, cost reduction, and traceability management.

  The bonded card base material that has undergone the bonding pressure bonding step goes to a step of punching into a card shape. The punching method is not particularly limited and can be used. In the punching process, the optical reading information provided on the first support is read, and the defective printing address where the IC module is not mounted is detected by the optical reading device (step S13). Based on the detected information, the defective portion is punched in the punching process (step S15) and then discharged (step S14).

  Also, from the inspection information recorded in the management database, the defective IC module address information and support lot information detected and recorded after the bonding and crimping process (step S17), the defective IC module is similarly punched and discharged. (Step S16). The discharge mechanism is not particularly limited.

  The punched IC card flows to the issuing process. The issuance process may be any of primary issuance and secondary issuance of information writing to a so-called IC chip using a non-contact reader / writer, and print design of the card surface, identification information printing including personal information, IC function inspection, and card surface inspection. A plurality of combinations may be combined (step S18). At least in the issuing process, the IC unique number is read (step S19), and the above-described issued contents and results are made to correspond one-to-one (step S20) and recorded in the management database (step S7). Only cards that pass a predetermined standard for all issued contents are collected as non-defective products, and those that do not meet the standard are rejected and discharged.

  In the case of a manufacturing form in which the personal identification information is transferred to the shipping process without printing the identification information on the IC chip or the ticket surface until the first issue as an embodiment, in the issuing process, design printing and a non-contact reader / writer are used. IC identification number is read, IC inspection, primary issuance of information writing to IC chip, card surface inspection, pass / fail judgment is performed, only cards that pass a predetermined standard are accumulated as good products, and those that do not meet the standard are considered defective As well as discharging, the issuance contents and results are recorded in the management database in a one-to-one correspondence.

  In this way, all the information corresponds one-to-one with the IC chip unique number that is shipped (step S20) and is input upstream of the manufacturing process, enabling highly secure traceability management.

  This invention has a support recording process, an IC chip recording process, an IC module placement process, a bonding pressure bonding process, an IC specific information acquisition process, a punching process, an issuing process, and a data processing process. By managing the process based on chip data, print defect data, and chip inspection data, IC cards using expensive IC chips can be manufactured inexpensively and efficiently, ensuring IC card traceability and high security. Can keep.

Claims (8)

In an IC card manufacturing method formed by sealing an IC module having an antenna and an IC chip between an opposing first support and a second support and bonding them together,
Based on the print quality recording of the recorded printing the plurality of cards in a part for a plurality of card printing is performed the first support member, the printing excellent locations, IC chip unique information is recorded the An IC module placement step of placing the IC module having an IC chip ;
And bonding bonding step in which the IC module so as to face the second support to said first support mounted to bonding crimping, to form a card substrate,
After the bonding crimping process, the IC chip unique information obtaining step of obtaining respective said IC chip-specific information the card substrate's,
A detection step of detecting at least one of the lot of the first support and the IC module position information on the first support corresponding to the acquired IC chip specific information;
After the detection step, a punching step of punching individual cards from the card base,
At least one of the first support lot corresponding to the IC chip specific information detected in the detection step and the IC module position information on the first support is recorded in a management database. Recording process;
A method for producing an IC card, comprising: IC card manufacturing method according to claim 1, characterized in that from the individual IC chip-specific information, good selection in the punching step. The individual IC chip-specific information, at least IC unique number, IC card manufacturing method according to paragraph 1 or claim 2, characterized in that it is selected from any of the IC testing information. The IC card manufacturing method according to any one of claims 1 to 3, wherein the individual IC chip unique information is set as common information and process management is performed.   5. The management database according to any one of claims 1 to 4, wherein the management database includes at least printing imposition address information, product type information, production date, lot information, and inspection information. IC card manufacturing method. The IC chip functional inspection is further performed, and an IC card is issued by associating the IC chip specific information with the issuance contents,
Prior Symbol issuance process, acquires the individual IC chip-specific information, at the same time performs an operation test of the IC module, and the inspection results, and detects the IC defective address and the frequency of printing failure information An IC card manufacturing method according to any one of claims 1 to 5. The IC chip functional inspection is further performed, and an IC card is issued by associating the IC chip specific information with the issuance contents,
In the issue process, compared with the individual IC chip-specific information, according to any one of claims the first term through the fifth term, characterized in that to detect the failure frequency in the course of step IC card manufacturing method.   8. The method of manufacturing an IC card according to claim 1, wherein the print defect information is a binary image, and information is acquired by an optical reading method.