JP4769962B2 - Method and apparatus for producing metal-based microstructure - Google Patents

Description

  The present invention relates to a microfabrication technique, in particular, a method for producing a metal-based microstructure and an apparatus used therefor. More specifically, the present invention relates to the fabrication of a metal-based microstructure using an electroplating method. The present invention relates to a method and an apparatus thereof. The present invention, for example, in the technical field of micromachines, electronic parts, etc., for example, with respect to microfabrication techniques that have conventionally produced microparts using lithography and electroplating, without using expensive equipment, The present invention provides a novel micromachining technology capable of performing micromachining by a simple operation process with a gentle process.

  In recent years, for example, in many technical fields such as micromachines, communication, and biotechnology, with the progress of integration and miniaturization of devices, the production technology of fine parts has attracted much attention, and research on fine processing technology has become active. It is coming. Among them, research on the LIGA (Lithograph Galvanformung und Abformung) method for forming a fine structure using lithography and electroplating is particularly active.

  For example, in the prior literature, a method for manufacturing a mold insert using electroplating and lithography (Patent Document 1), and a shape corresponding to the probe is formed by pressing a probe mold against a plate-like component. There has been proposed a method (Patent Document 2) for producing a mold having a plating structure and forming a plating structure serving as a probe on the surface of the mold.

  The production target of the fine structure is, in particular, to form a fine structure having a higher aspect ratio and finer, for example, a deep thickness of 1 mm using synchrotron radiation X-ray (Non-Patent Document 1). Attempts have been made to use the above PMMA lithography.

  Here, in order to specifically explain the conventional LIGA method, its basic steps are shown in FIG. In the conventional LIGA process shown in FIG. 1, first, as shown in FIG. 1A, a resist layer (32) is formed on a substrate (33) with a desired thickness, and then heavy metals such as gold are absorbed. The resist layer (32) is exposed with X-rays or the like using a mask (30) whose pattern is the material (31). Next, by developing, a resist pattern (34) is produced as shown in FIG.

  Next, the substrate having the resist pattern (34) is dipped in a plating solution, and a metal structure is deposited by electroplating (FIG. 3C). Subsequently, as shown in FIG. 1D, a metal-based microstructure can be manufactured by removing the resist. This LIGA method can be used, for example, in the production of optical elements, sensors, actuators, etc., and its application range is wide.

  However, in the above-described method, the structure for exposing a resist material becomes more complicated and expensive as the structure having a finer portion having a higher height or the finer structure is manufactured. As for the production method, the main problems are that it is necessary to solve environmental problems related to the developer and the like, and that the number of steps is large and complicated.

  As described above, conventionally, a metal-based fine structure has been produced using a resist material by the LIGA method. However, a structure having a finer portion with a higher height or a finer structure is produced. There are complicated and expensive equipment problems, environmental problems, many processes, complicated manufacturing process problems, etc. In this technical field, new microfabrication technology that can solve these problems The development of was strongly requested.

Japanese National Patent Publication No. 10-510483 JP 2004-101351 A Applied Physics, Vol. 73, No. 4 (2004) 466-469

  Under such circumstances, the present inventor has conducted intensive research with the goal of developing a new microfabrication technology capable of reliably solving the problems of the prior art in view of the above-described conventional technology. As a result, the present inventors have succeeded in establishing a technique for producing a metal microstructure by applying an electroplating method without using a resist material, and completed the present invention.

  The present invention has been made in view of the circumstances as described above, can solve the problems of the prior art, has low equipment costs, is a process that does not use a resist material, and is environmentally friendly and low. It is an object of the present invention to provide a novel metal-based microstructure manufacturing method and apparatus capable of efficiently manufacturing a metal-based microstructure with the number of steps.

The present invention for solving the above-described problems comprises the following technical means.
(1) a metal-based microstructures Te method odor produced by electroplating, on a base plate, a mold plate having a through hole is placed so as to be driven, through the upper SL through hole on a substrate there rows plating, by moving in a direction moving away the upper Symbol mold plate from the substrate, a manufacturing method of forming a metallic structure on a substrate, it Tona Ru metal-based microstructures,
A template having a plurality of through holes having an outline substantially corresponding to the shape of the bottom surface of a desired metal-based microstructure is placed on the substrate in close proximity or in close contact, and the template is separated from the substrate by a driving means. A method for producing a metal-based microstructure, wherein the metal-based microstructure is moved at a speed of 80 to 10000 nm / min in the direction of movement.
( 2 ) The method according to (1), wherein the electrode +, the template, the electrode-, and the substrate are immersed in a plating solution, a current is passed, and the plating treatment is performed on the substrate.
( 3 ) An apparatus used in the method for producing a metal-based microstructure according to (1) or (2),
An electroplating tank, a substrate, a template having a plurality of through holes having a contour corresponding to the shape of the bottom surface of a desired metal-based microstructure installed on the substrate, and the template from the substrate An apparatus for manufacturing a metal-based microstructure, comprising: a driving unit that moves in a direction away from the electrode; and an electrode for plating on the substrate.
( 4 ) The metal-based microstructure manufacturing apparatus according to ( 3 ), wherein an electrode − and a substrate, and an electrode + and a template are installed in a tank.
( 5 ) The electrode and the substrate (17) located in the plating tank (11), the holder (13) connected to the electrode (19) facing the electrode and variable in distance, and the other electrode + (12), the template having a desired metal based composite several through-holes that have a contour that corresponds to the bottom shape of the microstructures located between the electrodes in a bath (20) and (18) A device comprising an electric wire connecting the electrodes and a power source located between the electrodes,
In a state where the template (18) is very close to or in close contact with the electrode and the substrate (17), both the electrodes (12, 17) and the template (18) in the tank are immersed in the plating solution (12), and the current is supplied. The electrode + and the template (18) are moved away from the electrode-and the substrate (17) by the driving unit (19) at a speed of 80 to 10000 nm / min during the flow of the electrode-and the substrate ( 17) The apparatus for producing a metal-based microstructure according to (3) or (4), wherein an operation for forming the metal-based microstructure can be performed on the top.

Next, the present invention will be described in more detail.
The present invention is a method for producing a metal-based microstructure by electroplating, and includes an electroplating bath, a substrate, and a contour substantially corresponding to the bottom shape of the desired metal-based microstructure on the substrate. the mold plate having a double several through holes placed so as to be driven that Yusuke performs plating on a substrate through the through hole, at the same time, in a direction moving away the mold plate from the substrate By moving, a metal-based structure is continuously formed on the substrate.

  In the present invention, the template is installed in close proximity to or in close contact with the substrate, and the template is installed to be movable at a predetermined speed in a direction away from the substrate by the driving means simultaneously with the plating process. The The plating process is performed, for example, by immersing the electrode +, the template, the electrode-, and the substrate in a plating solution, passing an electric current, and performing the plating process on the substrate.

Further, the template is desired metallic microstructures bottom shape to the shape of the double several through-holes that have a contour corresponding, size and number, etc., of the metallic microstructures of interest It can be arbitrarily designed according to the shape, structure and the like.

  Next, the present invention will be described in detail with reference to the schematic diagram of the metal-based microstructure manufacturing apparatus capable of manufacturing the metal-based microstructure of the present invention shown in FIG. In this apparatus, a template (18) having through holes (20) between electrodes is installed in an electroplating apparatus, and the template (18) and the electrode + (12) are formed by an electrode- (substrate) (17). It is installed so that it can move in the direction away from it. When an electric current is passed in the state of being very close to or in close contact with the electrode- (substrate) (17), the electric current flows only in a portion having the through hole (20), and a metal structure having a bottom surface similar to the bottom surface of the through hole Is formed on the electrode- (substrate) (17).

  As shown in FIG. 2 and FIG. 3, when the template (18) and the electrode + (12) are separated from the electrode-(substrate) (17), the speed is about the same as the speed at which the structure is formed on the substrate. By moving the template (18) from the substrate (17) at a speed, only the portion having the through hole is plated, and as a result, the metal-based microstructure (21) is formed on the substrate. .

  In this method, it is possible to stop the formation of the metal-based microstructure (21) by stopping the current, and the height is controlled by recognizing the formation speed of the structure by Try and Error. A structure can be obtained arbitrarily. In addition, by arbitrarily designing the shape of the through hole (20), structures having various bottom shapes can be formed while maintaining the bottom shape. Furthermore, any plating solution can be used as the plating solution to be placed in the bath as long as it can be plated on the electrode- (substrate) (17) by electroplating.

  In the above method, the template (18) and the electrode + (12) are separated from the electrode-(substrate) (17). In the present invention, however, the drive unit (19) is connected to the electrode-( Mount on the (substrate) (17) side and separate the electrode-(substrate) (17) from the template (18) and the electrode + (12), or provide drive units (19) on both sides to drive both sides It is also possible to adopt a method as appropriate.

  Further, in the above method, the electrode- (substrate) (17) is installed in the tank, but the through-hole (20) is provided on the wall of the tank or the bottom of the tank, and the drive unit is the electrode- (substrate). (17) Mounted on the side, the electrode (substrate) (17) is brought into close contact with the through hole (20) from the outside of the tank, the current is passed, and the electrode (substrate) (17) is separated from the template (18). It is also possible to adopt various forms as appropriate.

  Moreover, in this invention, the part which contacts a plating solution (10) needs to be an insulating material except for electrodes (12, 17). Further, since the distance between the electrodes greatly affects the physical properties of the structure, it is possible to provide a mechanism that can freely change the positions of the template (18) and the electrode + (12). In the present invention, it is also possible to provide a mechanism capable of controlling each pole with multiple electrodes in order to make the formation speed of the structure at each location uniform. Furthermore, in the present invention, the electrode and the substrate can be made separate in consideration of the convenience of work. The formation of the structure starts by passing an electric current, but in order to constantly supply fresh liquid to the formation part, an infusion pump that controls the flow of the plating solution is installed so that the fresh liquid flows through the formation part. It is preferable to take appropriate measures.

  In the present invention, examples of the material for the metal microstructure include gold, silver, copper, platinum, chromium, nickel, zinc, cadmium, tin, lead, iron, aluminum, and alloys based on these, and Dispersant-containing metals or alloys are exemplified. In the present invention, the type of the metal is not particularly limited, but preferably, for example, nickel and a nickel alloy are exemplified.

  In the present invention, the metal-based microstructure and the microstructure thereof are not particularly limited, and the microstructure similar to the microstructure that has been conventionally microfabricated using a resist material by the LIGA method. For example, a cylindrical structure, a polygonal column, and a columnar structure whose cross section is configured by straight lines and curves can be targeted. Specifically, for example, a fine member corresponding to an integrated circuit, an electronic device, or the like that is highly integrated and miniaturized is exemplified.

In the present invention, the electroplating bath, the substrate and, on a substrate, the template having a desired substantially the corresponding double several through-holes that have a contour shape of the bottom of the metallic microstructures is driven In this case, the template is movably installed at a speed of 80 to 10000 nm / min in a direction away from the substrate by the driving means. As the drive means, for example, a piezo drive stage, an AC servo drive stage, or a composite drive stage thereof is exemplified, and a piezo stage whose displacement is controlled by a closed loop is preferably used. The specific configuration and driving conditions of these means can be arbitrarily designed and selected according to the type, shape, structure, material, etc. of the target microstructure.

  In the present invention, the method and means of electroplating are not particularly limited, and appropriate methods and means can be used. Specific structures of the structural body material, the substrate, the driving means, and the template include, for example, nickel that is most used as an electroplating metal as a structural body material, wrapping for obtaining flatness as a substrate, CPM (Chemical Copper polished by mechanical polishing and subjected to surface treatment such as alkaline degreasing, pickling, etc., a piezo stage having a capacitive sensor as a driving means, and displacement control by a closed loop, and one or a plurality of templates It has a through-hole with a circular and polygonal cross section, a thickness that is about 5 times the diameter of one side, and is made of an insulator such as nylon, polo carbonate, polyethylene, pet resin, polypropylene, and Teflon. (Registered trademark), acrylic, vinyl chloride, epoxy, urethane, and phenol resin are exemplified.

  As a conventional method, when manufacturing a high-precision probe corresponding to a semiconductor integrated circuit or the like that has been highly integrated and miniaturized, for example, a probe mold is pressed against a plate-shaped member to cope with the probe. Producing a microfabricated probe with high accuracy is performed by producing a mold having a shape and forming a plating structure in the probe mold recess by electroplating.

  However, conventionally, a template having a through hole is installed in the substrate, and a plating structure is deposited on the substrate through the through hole while moving the template away from the substrate. No structure having a fine structure has been produced. The present invention adopts the above-described specific configuration, so that any form of fine structure, in particular, a structure having a finer portion with a higher height, which has been difficult to produce by the conventional technology, and more It is possible to provide a new fine processing technique capable of efficiently producing a fine structure with high accuracy.

The following effects are produced by the manufacturing method and the manufacturing apparatus of the present invention.
(1) It is possible to produce a metal-based fine structure that solves the problems of the prior art, such as high equipment costs, environmental problems, and a large number of processes. It is possible to provide a metal-based microstructure manufacturing method and a metal-based microstructure manufacturing apparatus.
(2) It is possible to provide a new processing technique for metal-based microstructures in place of the conventional LIGA method using a resist material.
(3) Compared with the conventional LIGA method, it is possible to provide a new micromachining technique that can be microfabricated by a simple manufacturing process with a simple structure and low-cost apparatus.
(4) It is possible to provide a microfabrication technology for a metal microstructure having a low environmental load and a low energy consumption with a small number of processes.
(5) When setting the height of the structure, it is only necessary to set the formation time as compared with the conventional methods (Patent Documents 1 and 2, Non-Patent Document 1, etc.) for setting the application conditions of the resist material to the substrate It is possible to provide a fine processing technique capable of obtaining structures having different heights by a simple manufacturing process.
(6) By extending the driving range of the template, it is possible to provide a fine processing technique that enables formation of a structure having a high aspect ratio.
(7) Unlike conventional methods (Patent Documents 1, 2, Non-Patent Document 1, etc.) that require the consumption of a mold produced with one structure, the running cost can be used repeatedly. Can provide a low-precision microfabrication technology.

  EXAMPLES Next, although this invention is demonstrated concretely based on an Example, this invention is not limited at all by the following Examples.

(1) Construction of metal-based microstructure manufacturing apparatus In this example, a thickness of 0.1 having a diameter of 0.1 mm and a pitch of 0.3 mm having 49 through-holes (vertical 7 rows, horizontal 7 rows) 0. A 02 mm acrylic material was used as a template. FIG. 4 shows a plan view of the structure of the template. This template has 49 circles (vertical 7 rows, horizontal 7 columns) having a diameter of 0.1 mm and a pitch of 0.3 mm. Ni was used for the electrode + and the substrate. The template was placed in the electroplating tank in close proximity to the substrate. A strain gauge (not shown) is installed in the vicinity of the through hole of the template (18). First, the template (18) is brought into contact with the substrate (17), and then in a direction away from the substrate (17). The template (18) was driven, and the place where no strain was detected was taken as the starting position (FIGS. 2 and 3).

(2) Formation of metal-based microstructure Next, electroplating is performed under the conditions shown in Table 1, and at the same time, the template is moved away from the substrate by a driving means comprising a piezo stage that can be controlled in displacement by a closed loop. The metal structure is continuously formed on the substrate in 70 minutes, and a cylinder 49 having a diameter of 0.1 mm, a pitch of 0.3 mm, and a height of 0.1 mm is formed. Ni microstructures having 7 pieces (7 rows and 7 columns) were produced.

(3) Evaluation of the structure As a result of observing the above-mentioned Ni microstructure from the side with a scanning electron microscope and evaluating the side length of the microstructure cylinder from the substrate to the tip, the structure was 102 μm in height. there were.

(1) Construction of Metal Microstructure Manufacturing Device In this example, as in Example 1, there are 49 through holes (diameter 7 mm, horizontal 7 columns) with a diameter of 0.1 mm and a pitch of 0.3 mm. An acrylic material having a thickness of 0.02 mm was used as a template. Platinum was used for the electrode +, and Cu was used for the substrate. The template was placed in the electroplating tank in close proximity to the substrate. A strain gauge (not shown) is installed in the vicinity of the through hole of the template (18). First, the template (18) is brought into contact with the substrate (17), and then in a direction away from the substrate (17). The template (18) was driven, and the place where no strain was detected was taken as the starting position (FIGS. 2 and 3).

(2) Formation of metal-based microstructure Next, electroplating is performed under the conditions shown in Table 2, and at the same time, the template is separated from the substrate by a driving means including a piezo stage that can be controlled in displacement by a closed loop. The metal structure is continuously formed on the substrate in 120 minutes, and a cylinder 49 having a diameter of 0.1 mm, a pitch of 0.3 mm, and a height of 0.08 mm is formed. Ni-W microstructures having individual pieces (7 rows and 7 columns) were produced.

(3) Evaluation of structure As a result of observing the above-mentioned Ni-W microstructure from the side with a scanning electron microscope and evaluating the side length of the microstructure cylinder from the substrate to the tip, a structure having a height of 76 μm It was a thing.

  As described above in detail, the present invention relates to a method for manufacturing a metal-based microstructure and an apparatus therefor, and the present invention is a metal system that has low equipment costs, is environmentally friendly, and has a small number of processes. It is possible to provide a manufacturing method of a fine structure and a manufacturing apparatus thereof. The present invention has a high technical significance as providing a processing technology for a fine component corresponding to an integrated circuit, an electronic device, etc., which are highly integrated and miniaturized.

It is a schematic diagram which shows the process of the conventional LIGA method. 1 is a schematic view of a manufacturing apparatus according to the present invention. It is a schematic diagram which shows the mode of structure formation. It is a top view of the structure of a template.

Explanation of symbols

10 Liquid 11 Tank 12 Electrode +
13 Electrode + and template holder 14 Power supply 15 Electric wire 16 Electrode-(substrate) holder 17 Electrode-(substrate)
18 Template 19 Drive unit 20 Through hole 21 Metal-based fine structure 30 Mask 31 Heavy metal absorber 32 Resist layer 33 Substrate 34 Resist pattern 35 Metal-based fine structure

Claims (5)

The metallic microstructures Te method odor produced by electroplating, on a base plate, a mold plate having a through hole is placed so as to be driven, the plating process on the substrate through the upper SL through hole there line, by moving in a direction moving away the upper Symbol mold plate from the substrate, a manufacturing method of forming a metallic structure on a substrate, it Tona Ru metal-based microstructures,
A template having a plurality of through holes having an outline substantially corresponding to the shape of the bottom surface of a desired metal-based microstructure is placed on the substrate in close proximity or in close contact, and the template is separated from the substrate by a driving means. A method for producing a metal-based microstructure, wherein the metal-based microstructure is moved at a speed of 80 to 10000 nm / min in the direction of movement.   The method according to claim 1, wherein the electrode + and the template and the electrode − and the substrate are immersed in a plating solution, a current is passed, and the plating process is performed on the substrate. An apparatus used in the method for producing a metal-based microstructure according to claim 1 or 2,
An electroplating tank, a substrate, a template having a plurality of through holes having a contour corresponding to the shape of the bottom surface of a desired metal-based microstructure installed on the substrate, and the template from the substrate An apparatus for manufacturing a metal-based microstructure, comprising: a driving unit that moves in a direction away from the electrode; and an electrode for plating on the substrate. The apparatus for producing a metal-based microstructure according to claim 3 , wherein an electrode-and a substrate, and an electrode + and a template are installed in the tank. An electrode − and a substrate (17) located in the plating tank (11), a holder (13) connected to the drive unit (19) facing the electrode and variable in distance, and the other electrode + (12 a) template having a desired metal based composite several through-holes that have a contour that corresponds to the bottom shape of the microstructures located between the electrodes in a bath (20) and (18), between the electrodes A device comprising an electric wire connecting the power source and a power source located between the wires,
In a state where the template (18) is very close to or in close contact with the electrode and the substrate (17), both the electrodes (12, 17) and the template (18) in the tank are immersed in the plating solution (12), and the current is supplied. The electrode + and the template (18) are moved away from the electrode-and the substrate (17) by the driving unit (19) at a speed of 80 to 10000 nm / min during the flow of the electrode-and the substrate ( 17) The metal-based microstructure manufacturing apparatus according to claim 3 or 4, wherein an operation for forming the metal-based microstructure can be performed on the metal-based microstructure.