JP4753336B2 - Novel allyl compound and process for producing the same - Google Patents

Novel allyl compound and process for producing the same Download PDF

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JP4753336B2
JP4753336B2 JP2001266913A JP2001266913A JP4753336B2 JP 4753336 B2 JP4753336 B2 JP 4753336B2 JP 2001266913 A JP2001266913 A JP 2001266913A JP 2001266913 A JP2001266913 A JP 2001266913A JP 4753336 B2 JP4753336 B2 JP 4753336B2
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group
allyl
formula
methallyl
triazine
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JP2003073363A (en
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健一 窪木
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Nippon Kayaku Co Ltd
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Nippon Kayaku Co Ltd
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Description

【0001】
【発明の属する技術分野】
本発明は工業原料や各種樹脂組成物の添加剤や架橋剤、難燃剤などに有用な化合物およびこれらを使用した電気・電子部品絶縁材料用、積層板(プリント配線板、ビルドアップ基板)やCFRP(炭素繊維強化プラスチック)、光学材料を始めとする各種複合材料、接着剤、塗料等に有用な硬化性樹脂組成物に関するものである。
【0002】
【従来の技術】
従来、ポリエステルやポリエーテル、ポリフェニレンエーテル、メタクリル酸樹脂、エポキシ樹脂をはじめとする合成樹脂の耐熱性や耐薬品性、耐衝撃性などの改質のための架橋剤として、トリアリルシアヌレートやトリアリルイソシアヌレート、トリメタアリルイソシアヌレートを初めとする多官能のアリル化合物類が使用されてきた。また、近年ハロゲンを含む化合物が難燃剤として多用されているが、これらを使用した製品はその廃棄後の不適切な処理により、ダイオキシン等の有毒物質の発生に寄与することが指摘されている。このためハロゲン含有成分の使用量の低減が検討されているが、例えば合成樹脂中に窒素を含有させることによりその目的を達成しようとする方法が試みられている。そのような試みの一環として中で、上記のアリル化合物類が使用されることも多くなってきている。
【0003】
【発明が解決しようとする課題】
本発明はこのような実情を踏まえ、更に耐熱性が良好で、窒素含有量が多くてハロゲン低減の方向により適した化合物、特に電子材料用途に好適な品質の化合物及びこの化合物を使用することによって高性能化された樹脂組成物を提供するものである。
【0004】
【課題を解決するための手段】
本発明者らは前記課題を解決するため鋭意研究の結果、特定なアリル樹脂を樹脂組成物に使用することにより、耐熱性や低ハロゲン難燃性を発現させることができること、及び同目的のための他化合物の中間原料に有用であることを見出し、本発明を完成した。即ち、本発明は、(1)式(1)
【0005】
【化3】

Figure 0004753336
【0006】
(式中、Xは−Rまたは−NAを表す。Aはアリル基、メタアリル基またはクロチル基を表す。Rは炭素数1〜20の炭化水素基または窒素原子を含む炭化水素基を示す。)で表されるアリル樹脂、(2)式(2)
【0007】
【化4】
Figure 0004753336
【0008】
(式中、Yは−Rまたは−NBを表す。Bは水素原子、アリル基、メタアリル基またはクロチル基を表す。Rは炭素数1〜20の炭化水素基または窒素原子を含む炭化水素基を示す。)で表される化合物の混合物であって、該混合物中の全てのBのうち50%以上がアリル基、メタアリル基またはクロチル基であるアリル化合物混合物、(3)全てのAがアリル基である上記(1)記載のアリル樹脂、(4)アミノ基とトリアジン環を有する化合物とアリル基、メタアリル基またはクロチル基を有するハロゲン化アリル類を塩基類の存在下、非プロトン性極性溶媒中で反応させる事を特徴とするアリル樹脂の製造法、(5)上記(1)または(3)記載の化合物を含有する硬化性樹脂組成物、(6)上記(2)記載の混合物を含有する硬化性樹脂組成物、(7)リン含有化合物を含有する上記(5)または(6)記載の硬化性樹脂組成物、(8)上記(5)〜(7)の何れか1項に記載の硬化性樹脂組成物の硬化物。に関する。
【0009】
以下、本発明について詳細に説明する。本発明のアリル樹脂は、アミノ基とトリアジン環を有する化合物と前記アミノ基の活性水素原子と置換しうるアリル基、メタアリル基またはクロチル基を有するハロゲン化アリル類を、水または有機溶剤中で、塩基類の存在下反応させることにより得ることができる。尚、トリアジンは窒素原子の結合位置により、1,2,3−、1,2,4−、1,3,5−の3種の異性体が存在するが、本発明においては1,3,5−トリアジンにアミノ基が結合した化合物を使用する。
【0010】
本発明で使用するアミノ基とトリアジン環を有する化合物は、トリアジン環に2個以上のアミノ基が結合した化合物であれば特に限定されない。アミノ基以外の置換基としては、炭素数1〜20、好ましくは1〜12の炭化水素基、具体的にはメチル基、エチル基、プロピル基、ブチル基、ペンチル基等の炭素数1〜5の直鎖状又は分枝状のアルキル基、置換基を有しても良いシクロブチル、シクロペンチル、シクロヘキシル等の炭素数4以上のシクロアルキル基、置換基を有しても良いフェニル基、ナフチル基、ビフェニル基等の芳香族基、アセチル基、ビニル基、プロペニル基等の炭素数2以上のアルケニル基等や窒素原子を含む炭素数1〜20の炭化水素基、具体的には、イミダゾリル骨格を有する化合物の残基等があげられる。使用されうるアミノ基とトリアジン環を有する化合物の具体例としては、メラミン、アセトグアナミン、ベンゾグアナミン、2,4−ジアミノ−6−ビニル−S−トリアジン、2,4−ジアミノ−6−(2−プロペニル)−S−トリアジン2,4−ジアミノ−6−〔2’−メチルイミダゾリル-(1')〕−エチル−S−トリアジン、2,4−ジアミノ−6−〔2’−ウンデシルイミダゾリル-(1')〕−エチル−S−トリアジン、2,4−ジアミノ−6−〔2’−エチル−4’−メチルイミダゾリル-(1')〕−エチル−S−トリアジン、2,4−ジアミノ−6−〔2’−フェニルイミダゾリル-(1')〕−エチル−S−トリアジン等があげられるが、これらに限定されることはない。また、合成時に2種以上を併用しても良い。
【0011】
使用されうるハロゲン化アリル類の具体例としては、アリルクロリド、アリルブロミド、クロチルクロリド、クロチルブロミド、メタアリルクロライド、メタアリルブロミドなどのアリル基、メタアリル基またはクロチル基を有する化合物があげられるが、これらに限定されることはなく、単独で用いても2種以上を併用しても良い。
ハロゲン化アリル類の使用量は、アミノ基とトリアジン環を有する化合物のアミノ基の活性水素1当量に対して通常0.5〜3.0モル、好ましくは0.6〜2.0モルの範囲である。
【0012】
使用されうる塩基類の具体例としては、例えば水酸化ナトリウム、水酸化カリウム、水酸化リチウム、水酸化マグネシウム、水酸化カルシウム、炭酸ナトリウム、炭酸カリウム、炭酸マグネシウム、炭酸カルシウム、酸化カルシウム、酸化マグネシウム、ナトリウムメトキシド、ナトリウムエトキシド、カリウム−tert−ブトキシド等があげられるが、これらに限定されることはなく単独で用いても2種以上を併用しても良い。これらは必要により、水溶液として使用しても良い。
塩基類の使用量は、アミノ基とトリアジン環を有する化合物のアミノ基の活性水素1当量に対して通常0.5〜3.0モル、好ましくは0.6〜2.0モルの範囲である。
【0013】
反応は通常水または有機溶剤等の溶媒中で行うが、有機溶剤中が好ましい。使用されうる有機溶剤の具体例としては、トルエン、キシレン等の芳香族系溶剤、メタノール、エタノール、プロパノール、ブタノール等のアルコール類、ジオキサン、エチレングリコールジメチルエーテル、エチレングリコールモノメチルエーテル、プロピレングリコールモノメチルエーテル等のエーテル類、ジメチルホルムアミド、ジメチルスルホキシド、ジメチルスルホン、ジメチルアセトアミド、ジメチルイミダゾリジノン、アセトニトリル、アセトン、メチルエチルケトン、メチルイソブチルケトン等のケトン類、ピリジン等が挙げられるがこれらに限定されることはなく、単独で用いても2種以上を併用しても良い。
また、特に上記有機溶剤のうちジオキサン、エチレングリコールジメチルエーテル、ジメチルホルムアミド、ジメチルスルホキシド、ジメチルスルホン、ジメチルアセトアミド、ジメチルイミダゾリジノン、アセトニトリル、ピリジン等の非プロトン性極性溶媒を使用することにより副反応によるハロゲン化アリル類由来のハロゲンの残留を低減させることができるため、ハロゲン濃度の低い本発明の化合物が得られ、電子材料用途に適する。
これら溶媒の使用量は、アミノ基とトリアジン環を有する化合物100重量部に対して通常50〜1000重量部、好ましくは100〜500重量部の範囲である。
【0014】
反応は、例えばアミノ基とトリアジン環を有する化合物を溶媒に溶解もしくは分散させて、塩基類を固形もしくは水溶液で添加し、ハロゲン化アリル類を徐々に添加しながら、好ましくは20〜90℃で1〜30時間反応させる。また、原料と有機溶剤とハロゲン化アリル類との混合物(もしくは溶液)に、固形または水溶液の塩基類を徐々に添加する方法でも良い。
【0015】
反応終了後は、必要により過剰の塩基類を中和後、非水溶性の有機溶剤を必要により添加し、次いで水洗を繰り返して副生塩等や水溶性の有機溶剤を除去した後、加熱減圧下において非水溶性の有機溶剤を留去することにより本発明の樹脂が得られる。こうして得られる本発明の化合物は式(1)で表させるが、全てのAがアリル基である化合物が好ましい。
【0016】
また、ハロゲン化アリル類や塩基類を、アミノ基とトリアジン環を有する化合物の活性水素と等当量以下で反応させることにより、例えばグアナミンの場合4つの活性水素が存在するため、モノアリル体、ジアリル体(2種)、トリアリル体、テトラアリル体及びアリル基、メタアリル基またはクロチル基が付加しなかった原料グアナミン、即ち式(2)で表される化合物の混合物(本発明の混合物)が得られる。このようにして得られた混合物は、活性水素が残っているので、エポキシ樹脂の硬化剤として使用したり、ホルマリンやフェノール類と重縮合させる際の原料として使用したりすることが可能である。この用途のためには式(2)中の基−NBにおけるBが、該混合物中でアリル基、メタアリル基またはクロチル基である割合(原料化合物中のアミノ基に結合した活性水素原子に対してアリル基、メタアリル基またはクロチル基が置換した割合)が50%以上である。
【0017】
本発明の樹脂または混合物は現状ではトリアリルシアヌレートやトリアリルイソシアヌレート、トリメタアリルイソシアヌレート等が使われている各種の熱可塑性樹脂や硬化性樹脂組成物にこれらの代替として使用することが可能である。例えば、ラジカル重合性の不飽和基を利用した硬化性樹脂組成物に使用することにより、耐熱性や耐薬品性などを向上させることができる。このような硬化性樹脂組成物としては、例えば、ポリエステルアクリレートやエポキシアクリレート等のビニルエステル、アリル化ポリフェニレンエーテル、マレイミド、ビニルエーテルを含んでなる硬化性樹脂組成物などがあげられ、熱や光、電子線等で硬化するものである。また、本発明の樹脂(または混合物)が硬化物中において高分子構造を構成させることのできる条件下であれば、直接にはこれと反応し得ない硬化性のモノマーやオリゴマーを混合させても良い。例えば、エポキシ樹脂や、シアネートエステル樹脂、レゾール樹脂等がその代表として挙げられる。尚、本発明の混合物には高分子構造を構成しない化合物(式(2)におけるBの全てが水素原子である化合物)が一部存在するが、これらは難燃剤として主に機能する。
【0018】
本発明の硬化性樹脂組成物には、必要に応じて種々の添加剤や熱可塑性樹脂などを配合することが出来る。用いうる添加剤や熱可塑性樹脂の具体例としては、ポリブタジエン及びこの変性物、アクリロニトリル共重合体の変性物、インデン樹脂、ポリフェニレンエーテル、ポリスチレン、ポリエチレン、ポリイミド、フッ素樹脂、シリコーンゲル、シリコーンオイル、並びにシリカ、アルミナ、炭酸カルシウム、石英粉、アルミニウム粉末、グラファイト、タルク、クレー、酸化鉄、酸化チタン、窒化アルミニウム、アスベスト、マイカ、ガラス粉末、ガラス繊維、ガラス不織布またはカーボン繊維等の無機充填材、シランカップリング剤のような充填材の表面処理剤、離型剤、カーボンブラック、フタロシアニンブルー、フタロシアニングリーン等の着色剤、臭素化エポキシ樹脂などの難燃剤が挙げられる。
【0019】
本発明の樹脂(または混合物)は、硬化性樹脂組成物中の有機成分100重量部中、通常2〜60重量部を占める割合で使用する。また、本発明の樹脂または混合物単独で難燃性を達成することが難しい場合、リン系の難燃剤を併用することが好ましい。窒素とリンを併用すると相乗効果により、それぞれ単独で使用するときよりも少ない使用量で難燃性を達成することができるため、難燃剤添加による硬化物物性の変化が少なくて済む(これらの詳細については、例えば、西沢仁著「増補新版 ポリマーの難燃化」大成社を参照)
【0020】
本発明の硬化性樹脂組成物の硬化物は、樹脂組成物が含有する硬化性成分に応じた方法で硬化させ得ることができる。例えば熱硬化性の成分を含有する場合は、100〜200℃程度で、数十分〜3時間程度加熱すればよい。また、ラジカル硬化性の成分を含有する場合は、電子線や紫外線等を照射することにより硬化物を得ることができる。
【0021】
【実施例】
以下本発明を実施例により更に詳細に説明する。尚、本発明はこれら実施例に限定されるものではない。
尚、諸物性は以下の方法により測定した。
・粘度:E型回転粘度計(25℃)
Figure 0004753336
・難燃性:UL−94に準拠
【0022】
実施例1
ベンゾグアナミン47重量部、ジメチルスルホキシド100重量部、フレーク状の水酸化ナトリウム65重量部を反応容器に仕込み、加熱、撹拌し、塩化アリル130重量部を系内を70℃に保ちながら3時間かけて滴下した.。滴下終了後更に同温度で5時間反応を行った後、メチルイソブチルケトンを200重量部加え、水洗液が中性になるまで水洗を繰り返し、油層から加熱減圧下においてメチルイソブチルケトンを留去することにより下記式(3)
【0023】
【化5】
Figure 0004753336
【0024】
で表される本発明のアリル樹脂(A1)86重量部を得た。得られたアリル樹脂(A1)は常温で液状であり、その粘度は0.2Pa・sであった。
【0025】
実施例2
実施例1においてベンゾグアナミンをアセトグアナミン25重量部に、ジメチルスルホキシドを170重量部に、水酸化ナトリウムを56重量部に、塩化アリルを112重量部にした以外は、同様の操作を行ったところ、下記式(4)
【0026】
【化6】
Figure 0004753336
【0027】
で表される本発明のアリル樹脂(A2)50重量部を得た。得られたアリル樹脂(A2)は常温で液状であり、その粘度は0.03Pa・sであった。
【0028】
実施例3
実施例1において、水酸化ナトリウムを24重量部に、塩化アリルを48重量部にした以外は、同様の操作を行い本発明の混合物(A3)(モノアリル体、ジアリル体(2種)、トリアリル体、テトラアリル体、原料のベンゾグアナミンの混合物、前記式(2)においてRがフェニル基である化合物の混合物でBの割合が50%)56重量部を得た。得られたアリル化合物の混合物(A3)は常温で半固形であった。
【0029】
実施例4
実施例1で得られた樹脂(A1)21.9重量部、ビスフェノールFのジグリシジルエーテル(日本化薬(株)製 RE−303S)47.4重量部、フェノールノボラック(明和化成(株)製H−1)、2−エチル−4−メチルイミダゾール0.4重量部、t−ブチルペルオキシペルベンゾエート0.9重量部、10−(2,5−ジヒドロキシフェニル)−10H−9−オキサ−10−ホスファフェナンスレン−10−オキサイド(三光化学(株)製 HCA−HQ)8.8重量部を均一に混合し、型に流し込んで、オーブン中で100℃×30分、150℃×30分、180℃×30分の条件で樹脂成型物を得て型から離した後、更にオーブン中で200℃×2時間で後硬化を行った.。この硬化物のTgは187℃で、難燃性はV−0だった。
【0030】
【発明の効果】
本発明の樹脂(または混合物)は、窒素の含有量が多く、多官能のアリル基を有するため、これを利用することにより耐熱性が良好で、ハロゲン低減の方向により適した熱可塑性樹脂や硬化性樹脂組成物等を得ることができる。また、本発明の製法により得られた化合物は、特に高信頼性が必要とされる電子材料用途の有機材料に極めて好適である。[0001]
BACKGROUND OF THE INVENTION
The present invention is useful for industrial raw materials, additives for various resin compositions, cross-linking agents, flame retardants and the like, and laminates (printed wiring boards, build-up boards) and CFRP for insulating materials for electric and electronic parts using these compounds. The present invention relates to a curable resin composition useful for (carbon fiber reinforced plastic), various composite materials including optical materials, adhesives, paints, and the like.
[0002]
[Prior art]
Conventionally, triallyl cyanurate and triaryl have been used as crosslinking agents for modifying the heat resistance, chemical resistance, impact resistance, etc. of synthetic resins such as polyester, polyether, polyphenylene ether, methacrylic acid resin, and epoxy resin. Polyfunctional allyl compounds such as allyl isocyanurate and trimethallyl isocyanurate have been used. In recent years, halogen-containing compounds are frequently used as flame retardants, and it has been pointed out that products using these compounds contribute to the generation of toxic substances such as dioxins by inappropriate treatment after disposal. For this reason, reduction of the usage-amount of a halogen-containing component is examined, However, For example, the method of trying to achieve the objective by making nitrogen contain in a synthetic resin is tried. As part of such attempts, the allyl compounds described above are increasingly used.
[0003]
[Problems to be solved by the invention]
In light of such circumstances, the present invention further improves the heat resistance, has a high nitrogen content, and is more suitable for halogen reduction, particularly a compound having a quality suitable for use in electronic materials, and the use of this compound. The present invention provides a resin composition with improved performance.
[0004]
[Means for Solving the Problems]
As a result of intensive studies to solve the above problems, the present inventors can exhibit heat resistance and low halogen flame retardancy by using a specific allyl resin in the resin composition, and for the same purpose. The present invention was completed by finding it useful as an intermediate material for other compounds. That is, the present invention provides (1) Formula (1)
[0005]
[Chemical 3]
Figure 0004753336
[0006]
(In the formula, X represents —R or —NA 2. A represents an allyl group, a methallyl group, or a crotyl group. R represents a hydrocarbon group having 1 to 20 carbon atoms or a hydrocarbon group containing a nitrogen atom. ) Allyl resin represented by (2) Formula (2)
[0007]
[Formula 4]
Figure 0004753336
[0008]
(Wherein Y represents —R or —NB 2 ; B represents a hydrogen atom, an allyl group, a methallyl group or a crotyl group. R represents a hydrocarbon group having 1 to 20 carbon atoms or a hydrocarbon group containing a nitrogen atom. And a mixture of allyl compounds in which 50% or more of all B in the mixture is an allyl group, methallyl group or crotyl group, and (3) all A is allyl. An allyl resin as described in (1) above, (4) a compound having an amino group and a triazine ring and an allyl halide having an allyl group, a methallyl group or a crotyl group in the presence of a base, an aprotic polar solvent A process for producing an allyl resin characterized in that it is reacted in, (5) a curable resin composition containing the compound described in (1) or (3) above, and (6) a mixture described in (2) above Hardenability Fat composition, (7) Curable resin composition as described in said (5) or (6) containing phosphorus containing compound, (8) Curability as described in any one of said (5)-(7). Hardened product of resin composition. About.
[0009]
Hereinafter, the present invention will be described in detail. The allyl resin of the present invention comprises a compound having an amino group and a triazine ring and an allyl halide having an allyl group, methallyl group or crotyl group which can be substituted with an active hydrogen atom of the amino group in water or an organic solvent. It can be obtained by reacting in the presence of a base. Triazine has three isomers of 1,2,3-, 1,2,4-, 1,3,5- depending on the bonding position of the nitrogen atom. In the present invention, 1,3,3, A compound in which an amino group is bonded to 5-triazine is used.
[0010]
The compound having an amino group and a triazine ring used in the present invention is not particularly limited as long as it is a compound in which two or more amino groups are bonded to the triazine ring. Examples of the substituent other than the amino group include a hydrocarbon group having 1 to 20 carbon atoms, preferably 1 to 12 carbon atoms, specifically 1 to 5 carbon atoms such as a methyl group, an ethyl group, a propyl group, a butyl group, and a pentyl group. A linear or branched alkyl group, a cyclobutyl group having 4 or more carbon atoms such as cyclobutyl, cyclopentyl and cyclohexyl which may have a substituent, a phenyl group which may have a substituent, a naphthyl group, An aromatic group such as a biphenyl group, an alkenyl group having 2 or more carbon atoms such as an acetyl group, a vinyl group, or a propenyl group, or a hydrocarbon group having 1 to 20 carbon atoms including a nitrogen atom, specifically, an imidazolyl skeleton Examples include residues of compounds. Specific examples of compounds having an amino group and a triazine ring that can be used include melamine, acetoguanamine, benzoguanamine, 2,4-diamino-6-vinyl-S-triazine, 2,4-diamino-6- (2-propenyl). ) -S-triazine 2,4-diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-S-triazine, 2,4-diamino-6- [2'-undecylimidazolyl- (1 ')]-Ethyl-S-triazine, 2,4-diamino-6- [2'-ethyl-4'-methylimidazolyl- (1')]-ethyl-S-triazine, 2,4-diamino-6 [2′-Phenylimidazolyl- (1 ′)]-ethyl-S-triazine and the like are exemplified, but not limited thereto. Two or more kinds may be used in combination at the time of synthesis.
[0011]
Specific examples of allyl halides that can be used include compounds having an allyl group, methallyl group, or crotyl group, such as allyl chloride, allyl bromide, crotyl chloride, crotyl bromide, methallyl chloride, and methallyl bromide. However, it is not limited to these, It may be used independently or may use 2 or more types together.
The amount of allyl halide used is usually in the range of 0.5 to 3.0 mol, preferably 0.6 to 2.0 mol, per 1 equivalent of active hydrogen of the amino group of the compound having an amino group and a triazine ring. It is.
[0012]
Specific examples of bases that can be used include, for example, sodium hydroxide, potassium hydroxide, lithium hydroxide, magnesium hydroxide, calcium hydroxide, sodium carbonate, potassium carbonate, magnesium carbonate, calcium carbonate, calcium oxide, magnesium oxide, Examples thereof include sodium methoxide, sodium ethoxide, potassium tert-butoxide and the like, but are not limited to these, and may be used alone or in combination of two or more. If necessary, these may be used as an aqueous solution.
The amount of the base used is usually in the range of 0.5 to 3.0 mol, preferably 0.6 to 2.0 mol, based on 1 equivalent of active hydrogen of the amino group of the compound having an amino group and a triazine ring. .
[0013]
The reaction is usually carried out in a solvent such as water or an organic solvent, preferably in an organic solvent. Specific examples of organic solvents that can be used include aromatic solvents such as toluene and xylene, alcohols such as methanol, ethanol, propanol, and butanol, dioxane, ethylene glycol dimethyl ether, ethylene glycol monomethyl ether, propylene glycol monomethyl ether, and the like. Examples include ethers, dimethylformamide, dimethylsulfoxide, dimethylsulfone, dimethylacetamide, dimethylimidazolidinone, ketones such as acetonitrile, acetone, methyl ethyl ketone, methyl isobutyl ketone, pyridine, etc., but are not limited to these. Two or more types may be used in combination.
In particular, among the above organic solvents, halogens caused by side reactions by using aprotic polar solvents such as dioxane, ethylene glycol dimethyl ether, dimethylformamide, dimethyl sulfoxide, dimethyl sulfone, dimethylacetamide, dimethylimidazolidinone, acetonitrile, and pyridine. Since the residue of halogen derived from allyl halides can be reduced, the compound of the present invention having a low halogen concentration is obtained, which is suitable for use as an electronic material.
The amount of these solvents used is usually in the range of 50 to 1000 parts by weight, preferably 100 to 500 parts by weight, based on 100 parts by weight of the compound having an amino group and a triazine ring.
[0014]
In the reaction, for example, a compound having an amino group and a triazine ring is dissolved or dispersed in a solvent, a base is added as a solid or an aqueous solution, and an allyl halide is gradually added, preferably at 20 to 90 ° C. React for ~ 30 hours. Alternatively, a solid or aqueous base may be gradually added to a mixture (or solution) of the raw material, the organic solvent, and the allyl halide.
[0015]
After completion of the reaction, neutralize excess base if necessary, add a water-insoluble organic solvent if necessary, then repeat washing with water to remove by-product salts and water-soluble organic solvents, The resin of the present invention is obtained by distilling off the water-insoluble organic solvent below. The compound of the present invention thus obtained is represented by the formula (1), and a compound in which all A are allyl groups is preferable.
[0016]
In addition, for example, in the case of guanamine, there are four active hydrogens by reacting allyl halides or bases with an active hydrogen of a compound having an amino group and a triazine ring. (2 types), a triallyl body, a tetraallyl body and a raw material guanamine to which no allyl group, methallyl group or crotyl group was added, that is, a mixture of the compounds represented by the formula (2) (mixture of the present invention) is obtained. Since the active hydrogen remains in the mixture thus obtained, it can be used as a curing agent for epoxy resins or as a raw material for polycondensation with formalin or phenols. For this application, the proportion of B in the group —NB 2 in the formula (2) is an allyl group, methallyl group or crotyl group in the mixture (relative to the active hydrogen atom bonded to the amino group in the raw material compound). Ratio of allyl group, methallyl group or crotyl group) is 50% or more.
[0017]
The resin or mixture of the present invention can be used as an alternative to various thermoplastic resins and curable resin compositions in which triallyl cyanurate, triallyl isocyanurate, trimethallyl isocyanurate and the like are currently used. Is possible. For example, heat resistance, chemical resistance, etc. can be improved by using it for the curable resin composition using a radically polymerizable unsaturated group. Examples of such curable resin compositions include curable resin compositions containing vinyl esters such as polyester acrylates and epoxy acrylates, allylated polyphenylene ethers, maleimides, and vinyl ethers. It is hardened with a wire or the like. Moreover, as long as the resin (or mixture) of the present invention is a condition that can form a polymer structure in the cured product, a curable monomer or oligomer that cannot directly react with the polymer structure may be mixed. good. For example, an epoxy resin, a cyanate ester resin, a resole resin, etc. are mentioned as the representative. In the mixture of the present invention, there are some compounds that do not constitute a polymer structure (compounds in which all of B in formula (2) are hydrogen atoms), but these mainly function as flame retardants.
[0018]
In the curable resin composition of the present invention, various additives, thermoplastic resins, and the like can be blended as necessary. Specific examples of additives and thermoplastic resins that can be used include polybutadiene and modified products thereof, modified products of acrylonitrile copolymer, indene resin, polyphenylene ether, polystyrene, polyethylene, polyimide, fluororesin, silicone gel, silicone oil, and Silica, alumina, calcium carbonate, quartz powder, aluminum powder, graphite, talc, clay, iron oxide, titanium oxide, aluminum nitride, asbestos, mica, glass powder, glass fiber, glass nonwoven fabric or carbon fiber or other inorganic filler, silane Examples thereof include surface treatment agents for fillers such as coupling agents, mold release agents, colorants such as carbon black, phthalocyanine blue, and phthalocyanine green, and flame retardants such as brominated epoxy resins.
[0019]
The resin (or mixture) of the present invention is used in a proportion of usually 2 to 60 parts by weight in 100 parts by weight of the organic component in the curable resin composition. When it is difficult to achieve flame retardancy with the resin or mixture of the present invention alone, it is preferable to use a phosphorus-based flame retardant together. When nitrogen and phosphorus are used in combination, flame retardant properties can be achieved in a smaller amount than when used alone due to a synergistic effect, so there is little change in the physical properties of the cured product due to the addition of flame retardant (these details) For example, see Hitoshi Nishizawa's “New Reinforcement Polymer Flame Retardant” by Taiseisha)
[0020]
The cured product of the curable resin composition of the present invention can be cured by a method according to the curable component contained in the resin composition. For example, when a thermosetting component is contained, it may be heated at about 100 to 200 ° C. for about several tens of minutes to about 3 hours. Moreover, when it contains a radically curable component, a hardened | cured material can be obtained by irradiating an electron beam, an ultraviolet-ray, etc.
[0021]
【Example】
Hereinafter, the present invention will be described in more detail with reference to examples. The present invention is not limited to these examples.
Various physical properties were measured by the following methods.
・ Viscosity: E-type rotational viscometer (25 ℃)
Figure 0004753336
・ Flame retardance: Conforms to UL-94. [0022]
Example 1
47 parts by weight of benzoguanamine, 100 parts by weight of dimethyl sulfoxide and 65 parts by weight of flaky sodium hydroxide were charged into a reaction vessel, heated and stirred, and 130 parts by weight of allyl chloride was added dropwise over 3 hours while maintaining the system at 70 ° C. did.. After the completion of the dropwise addition, the reaction is further carried out at the same temperature for 5 hours, and then 200 parts by weight of methyl isobutyl ketone is added. The water washing is repeated until the water washing solution becomes neutral, and the methyl isobutyl ketone is distilled off from the oil layer under heating and reduced pressure. According to the following formula (3)
[0023]
[Chemical formula 5]
Figure 0004753336
[0024]
86 parts by weight of the allyl resin (A1) represented by the present invention was obtained. The obtained allyl resin (A1) was liquid at room temperature, and its viscosity was 0.2 Pa · s.
[0025]
Example 2
In Example 1, the same operation was carried out except that benzoguanamine was changed to 25 parts by weight of acetoguanamine, 170 parts by weight of dimethyl sulfoxide, 56 parts by weight of sodium hydroxide, and 112 parts by weight of allyl chloride. Formula (4)
[0026]
[Chemical 6]
Figure 0004753336
[0027]
50 parts by weight of the allyl resin (A2) represented by the present invention was obtained. The obtained allyl resin (A2) was liquid at room temperature, and its viscosity was 0.03 Pa · s.
[0028]
Example 3
In Example 1, the same operation was performed except that sodium hydroxide was added to 24 parts by weight and allyl chloride was added to 48 parts by weight. , A tetraallyl compound, a mixture of raw material benzoguanamine, and a mixture of compounds in which R is a phenyl group in the formula (2), the ratio of B is 50%) to obtain 56 parts by weight. The resulting mixture of allyl compounds (A3) was semisolid at room temperature.
[0029]
Example 4
21.9 parts by weight of the resin (A1) obtained in Example 1, 47.4 parts by weight of diglycidyl ether of bisphenol F (RE-303S manufactured by Nippon Kayaku Co., Ltd.), phenol novolak (manufactured by Meiwa Kasei Co., Ltd.) H-1), 0.4 parts by weight of 2-ethyl-4-methylimidazole, 0.9 parts by weight of t-butylperoxyperbenzoate, 10- (2,5-dihydroxyphenyl) -10H-9-oxa-10- 8.8 parts by weight of phosphaphenanthrene-10-oxide (manufactured by Sanko Chemical Co., Ltd., HCA-HQ) was uniformly mixed, poured into a mold, and 100 ° C. × 30 minutes, 150 ° C. × 30 minutes in an oven. The resin molded product was obtained under the conditions of 180 ° C. × 30 minutes and separated from the mold, and then post-cured in an oven at 200 ° C. × 2 hours. The cured product had a Tg of 187 ° C. and flame retardancy of V-0.
[0030]
【The invention's effect】
Since the resin (or mixture) of the present invention has a high nitrogen content and has a polyfunctional allyl group, the heat resistance is good by using this, and the thermoplastic resin and curing more suitable for reducing halogen. Resin composition and the like can be obtained. In addition, the compound obtained by the production method of the present invention is extremely suitable for an organic material for use in an electronic material that particularly requires high reliability.

Claims (8)

式(
Figure 0004753336
(式中、Xは−Rを表す。Aはアリル基、メタアリル基またはクロチル基を表す。Rは炭素数1〜5の直鎖状又は分枝状のアルキル基、置換基を有しても良い炭素数4以上のシクロアルキル基または置換基を有しても良いフェニル基、ナフチル基、ビフェニル基を示す。)で表されるアリル樹脂
Formula ( 5 )
Figure 0004753336
(In the formula, X represents -R. A represents an allyl group, a methallyl group, or a crotyl group. R may have a linear or branched alkyl group having 1 to 5 carbon atoms or a substituent. An allyl resin represented by a good cycloalkyl group having 4 or more carbon atoms or a phenyl group, a naphthyl group or a biphenyl group which may have a substituent .
式(
Figure 0004753336
(式中、Xは−Rを表す。Aはアリル基、メタアリル基またはクロチル基を表す。Rは置換基を有しても良いフェニル基、ナフチル基、ビフェニル基を示す。)で表されるアリル樹脂
Formula ( 6 )
Figure 0004753336
(In the formula, X represents -R. A represents an allyl group, a methallyl group, or a crotyl group. R represents a phenyl group, a naphthyl group, or a biphenyl group which may have a substituent ). Allyl resin .
式(2)
Figure 0004753336
(式中、Yは−Rを表す。Bは水素原子、アリル基、メタアリル基またはクロチル基を表す。Rは炭素数1〜5の直鎖状又は分枝状のアルキル基、置換基を有しても良い炭素数4以上のシクロアルキル基または置換基を有しても良いフェニル基、ナフチル基、ビフェニル基を示す。)で表される化合物の混合物であって、該混合物中の全てのBのうち50%以上がアリル基、メタアリル基またはクロチル基であるアリル化合物混合物。
Formula (2)
Figure 0004753336
(In the formula, Y represents -R. B represents a hydrogen atom, an allyl group, a methallyl group, or a crotyl group. R represents a linear or branched alkyl group having 1 to 5 carbon atoms or a substituent. A cycloalkyl group having 4 or more carbon atoms or a phenyl group, a naphthyl group, or a biphenyl group which may have a substituent , and a mixture of all the compounds in the mixture An allyl compound mixture in which 50% or more of B is an allyl group, methallyl group or crotyl group.
全てのAがアリル基である請求項1又は請求項2のいずれか一項に記載のアリル樹脂The allyl resin according to claim 1, wherein all A are allyl groups. アミノ基とトリアジン環を有する化合物であるメラミン、アセトグアナミン、ベンゾグアナミン、2,4−ジアミノ−6−ビニル−S−トリアジン、2,4−ジアミノ−6−(2−プロペニル)−S−トリアジン2,4−ジアミノ−6−〔2’−メチルイミダゾリル-(1')〕−エチル−S−トリアジン、2,4−ジアミノ−6−〔2’−ウンデシルイミダゾリル-(1')〕−エチル−S−トリアジン、2,4−ジアミノ−6−〔2’−エチル−4’−メチルイミダゾリル-(1')〕−エチル−S−トリアジン、2,4−ジアミノ−6−〔2’−フェニルイミダゾリル-(1')〕−エチル−S−トリアジンからなる群から選ばれる少なくとも一種の化合物とアリル基、メタアリル基またはクロチル基を有するハロゲン化アリルであるアリルクロリド、アリルブロミド、クロチルクロリド、クロチルブロミド、メタアリルクロライド、メタアリルブロミドからなる群から選ばれる少なくとも一種の化合物を塩基類の存在下、非プロトン性極性溶媒中で反応させる事を特徴とする、式(1)
Figure 0004753336
(式中、Xは−Rまたは−NA を表す。Aはアリル基、メタアリル基またはクロチル基を表す。Rは炭素数1〜20の炭化水素基または窒素原子を含む炭化水素基を示す。)で表されるアリル樹脂の製造法。
Melamine, acetoguanamine, benzoguanamine, 2,4-diamino-6-vinyl-S-triazine, 2,4-diamino-6- (2-propenyl) -S-triazine 2, which are compounds having an amino group and a triazine ring 4-diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-S-triazine, 2,4-diamino-6- [2'-undecylimidazolyl- (1')]-ethyl-S -Triazine, 2,4-diamino-6- [2'-ethyl-4'-methylimidazolyl- (1 ')]-ethyl-S-triazine, 2,4-diamino-6- [2'-phenylimidazolyl- (1 ')]-Ethyl-S-triazine and at least one compound selected from the group consisting of allyl chloride, allyl bromide, allyl bromide, and allyl halide having an allyl group, methallyl group or crotyl group . Formula (1) , wherein at least one compound selected from the group consisting of rotyl chloride, crotyl bromide, methallyl chloride, and methallyl bromide is reacted in an aprotic polar solvent in the presence of a base.
Figure 0004753336
(In the formula, X represents —R or —NA 2. A represents an allyl group, a methallyl group, or a crotyl group. R represents a hydrocarbon group having 1 to 20 carbon atoms or a hydrocarbon group containing a nitrogen atom. The manufacturing method of the allyl resin represented by this .
請求項1、請求項2または請求項4記載の樹脂を含有する硬化性樹脂組成物。A curable resin composition containing the resin according to claim 1 , claim 2 or claim 4 . リン含有化合物を含有する請求項または6記載の硬化性樹脂組成物。The curable resin composition according to claim 4 or 6, comprising a phosphorus-containing compound. 請求項6または請求項7の何れか1項に記載の硬化性樹脂組成物の硬化物。A cured product of the curable resin composition according to any one of claims 6 and 7.
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Publication number Priority date Publication date Assignee Title
WO2015003360A3 (en) * 2013-07-11 2015-03-12 Agios Pharmaceuticals, Inc. Therapeutically active compounds and their methods of use
US9434979B2 (en) 2009-10-21 2016-09-06 Shin-San Michael Su Methods and compositions for cell-proliferation-related disorders
US9474779B2 (en) 2012-01-19 2016-10-25 Agios Pharmaceuticals, Inc. Therapeutically active compositions and their methods of use
US9512107B2 (en) 2012-01-06 2016-12-06 Agios Pharmaceuticals, Inc. Therapeutically active compositions and their methods of use
US9579324B2 (en) 2013-07-11 2017-02-28 Agios Pharmaceuticals, Inc Therapeutically active compounds and their methods of use
US9662327B2 (en) 2011-06-17 2017-05-30 Agios Pharmaceuticals, Inc Phenyl and pyridinyl substituted piperidines and piperazines as inhibitors of IDH1 mutants and their use in treating cancer
US9724350B2 (en) 2013-07-11 2017-08-08 Agios Pharmaceuticals, Inc. N,6-bis(aryl or heteroaryl)-1,3,5-triazine-2,4-diamine compounds as IDH2 mutants inhibitors for the treatment of cancer
US9856279B2 (en) 2011-06-17 2018-01-02 Agios Pharmaceuticals, Inc. Therapeutically active compositions and their methods of use
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US10689414B2 (en) 2013-07-25 2020-06-23 Agios Pharmaceuticals, Inc. Therapeutically active compounds and their methods of use
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US11234976B2 (en) 2015-06-11 2022-02-01 Agios Pharmaceuticals, Inc. Methods of using pyruvate kinase activators
US11419859B2 (en) 2015-10-15 2022-08-23 Servier Pharmaceuticals Llc Combination therapy for treating malignancies

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2537833A4 (en) * 2010-02-17 2013-06-19 Nippon Kasei Chem Triazine derivative, and application thereof
WO2015149221A1 (en) 2014-03-31 2015-10-08 Dow Global Technologies Llc Crosslinkable polymeric compositions with n,n,n',n',n",n"-hexaallyl-1,3,5-triazine-2,4,6-triamine crosslinking coagent, methods for making the same, and articles made therefrom

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3277065A (en) * 1962-10-05 1966-10-04 Formica Corp Method for preparation of prepolymers from allylic monomers
US3382221A (en) * 1961-04-19 1968-05-07 Formica Corp Thermoset resins containing the s-triazine ring
JPS54100388A (en) * 1978-01-26 1979-08-08 Teijin Ltd Production of hexaarylmelamine
JPS5672433A (en) * 1979-11-20 1981-06-16 Fujitsu Ltd Pattern forming method
JPS61210076A (en) * 1985-03-14 1986-09-18 Shikoku Chem Corp Novel adduct of 2-substituted-4,6-diamino-s-triazine and isocyanuric acid, synthesis of said adduct, and curing of polyepoxide resin using said adduct
JPH01197520A (en) * 1988-02-03 1989-08-09 Hitachi Ltd Resin composition
JPH072804A (en) * 1993-05-14 1995-01-06 Cytec Technol Corp Production of 1,3,5-triazinecarbamate from amino-1,3,5-triazine and organic carbonic ester

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3382221A (en) * 1961-04-19 1968-05-07 Formica Corp Thermoset resins containing the s-triazine ring
US3277065A (en) * 1962-10-05 1966-10-04 Formica Corp Method for preparation of prepolymers from allylic monomers
JPS54100388A (en) * 1978-01-26 1979-08-08 Teijin Ltd Production of hexaarylmelamine
JPS5672433A (en) * 1979-11-20 1981-06-16 Fujitsu Ltd Pattern forming method
JPS61210076A (en) * 1985-03-14 1986-09-18 Shikoku Chem Corp Novel adduct of 2-substituted-4,6-diamino-s-triazine and isocyanuric acid, synthesis of said adduct, and curing of polyepoxide resin using said adduct
JPH01197520A (en) * 1988-02-03 1989-08-09 Hitachi Ltd Resin composition
JPH072804A (en) * 1993-05-14 1995-01-06 Cytec Technol Corp Production of 1,3,5-triazinecarbamate from amino-1,3,5-triazine and organic carbonic ester

Cited By (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10610125B2 (en) 2009-03-13 2020-04-07 Agios Pharmaceuticals, Inc. Methods and compositions for cell-proliferation-related disorders
USRE49582E1 (en) 2009-06-29 2023-07-18 Agios Pharmaceuticals, Inc. Therapeutic compounds and compositions
US11866411B2 (en) 2009-06-29 2024-01-09 Agios Pharmaceutical, Inc. Therapeutic compounds and compositions
US10029987B2 (en) 2009-06-29 2018-07-24 Agios Pharmaceuticals, Inc. Therapeutic compounds and compositions
US10988448B2 (en) 2009-06-29 2021-04-27 Agios Pharmaceuticals, Inc. Therapeutic compounds and compositions
US9434979B2 (en) 2009-10-21 2016-09-06 Shin-San Michael Su Methods and compositions for cell-proliferation-related disorders
US10711314B2 (en) 2009-10-21 2020-07-14 Agios Pharmaceuticals, Inc. Methods for diagnosing IDH-mutant cell proliferation disorders
US9982309B2 (en) 2009-10-21 2018-05-29 Agios Pharmaceuticals, Inc. Method for treating cell proliferation related disorders
US10632114B2 (en) 2011-05-03 2020-04-28 Agios Pharmaceuticals, Inc. Pyruvate kinase activators for use in therapy
US11793806B2 (en) 2011-05-03 2023-10-24 Agios Pharmaceuticals, Inc. Pyruvate kinase activators for use in therapy
US9980961B2 (en) 2011-05-03 2018-05-29 Agios Pharmaceuticals, Inc. Pyruvate kinase activators for use in therapy
US9662327B2 (en) 2011-06-17 2017-05-30 Agios Pharmaceuticals, Inc Phenyl and pyridinyl substituted piperidines and piperazines as inhibitors of IDH1 mutants and their use in treating cancer
US9856279B2 (en) 2011-06-17 2018-01-02 Agios Pharmaceuticals, Inc. Therapeutically active compositions and their methods of use
US9732062B2 (en) 2012-01-06 2017-08-15 Agios Pharmaceuticals, Inc. Therapeutically active compounds and their methods of use
US9656999B2 (en) 2012-01-06 2017-05-23 Agios Pharmaceuticals, Inc. Therapeutically active compounds and their methods of use
US11505538B1 (en) 2012-01-06 2022-11-22 Servier Pharmaceuticals Llc Therapeutically active compounds and their methods of use
US10294215B2 (en) 2012-01-06 2019-05-21 Agios Pharmaceuticals, Inc. Therapeutically active compounds and their methods of use
US9512107B2 (en) 2012-01-06 2016-12-06 Agios Pharmaceuticals, Inc. Therapeutically active compositions and their methods of use
US9850277B2 (en) 2012-01-19 2017-12-26 Agios Pharmaceuticals, Inc. Therapeutically active compositions and their methods of use
US10717764B2 (en) 2012-01-19 2020-07-21 Agios Pharmaceuticals, Inc. Therapeutically active compounds and their methods of use
US11667673B2 (en) 2012-01-19 2023-06-06 Servier Pharmaceuticals Llc Therapeutically active compounds and their methods of use
US10640534B2 (en) 2012-01-19 2020-05-05 Agios Pharmaceuticals, Inc. Therapeutically active compositions and their methods of use
US9474779B2 (en) 2012-01-19 2016-10-25 Agios Pharmaceuticals, Inc. Therapeutically active compositions and their methods of use
US10202339B2 (en) 2012-10-15 2019-02-12 Agios Pharmaceuticals, Inc. Therapeutic compounds and compositions
US10172864B2 (en) 2013-07-11 2019-01-08 Agios Pharmaceuticals, Inc. Therapeutically active compounds and their methods of use
US10376510B2 (en) 2013-07-11 2019-08-13 Agios Pharmaceuticals, Inc. 2,4- or 4,6-diaminopyrimidine compounds as IDH2 mutants inhibitors for the treatment of cancer
US11844758B2 (en) 2013-07-11 2023-12-19 Servier Pharmaceuticals Llc Therapeutically active compounds and their methods of use
US10111878B2 (en) 2013-07-11 2018-10-30 Agios Pharmaceuticals, Inc. N,6-bis(aryl or heteroaryl)-1,3,5-triazine-2,4-diamine compounds as IDH2 mutants inhibitors for the treatment of cancer
US10028961B2 (en) 2013-07-11 2018-07-24 Agios Pharmaceuticals, Inc. Therapeutically active compounds and their methods of use
US10017495B2 (en) 2013-07-11 2018-07-10 Agios Pharmaceuticals, Inc. Therapeutically active compounds and their methods of use
US10946023B2 (en) 2013-07-11 2021-03-16 Agios Pharmaceuticals, Inc. Therapeutically active compounds and their methods of use
WO2015003360A3 (en) * 2013-07-11 2015-03-12 Agios Pharmaceuticals, Inc. Therapeutically active compounds and their methods of use
US9724350B2 (en) 2013-07-11 2017-08-08 Agios Pharmaceuticals, Inc. N,6-bis(aryl or heteroaryl)-1,3,5-triazine-2,4-diamine compounds as IDH2 mutants inhibitors for the treatment of cancer
US9579324B2 (en) 2013-07-11 2017-02-28 Agios Pharmaceuticals, Inc Therapeutically active compounds and their methods of use
US10689414B2 (en) 2013-07-25 2020-06-23 Agios Pharmaceuticals, Inc. Therapeutically active compounds and their methods of use
US11021515B2 (en) 2013-07-25 2021-06-01 Agios Pharmaceuticals, Inc. Therapeutically active compounds and their methods of use
US9968595B2 (en) 2014-03-14 2018-05-15 Agios Pharmaceuticals, Inc. Pharmaceutical compositions of therapeutically active compounds
US11504361B2 (en) 2014-03-14 2022-11-22 Servier Pharmaceuticals Llc Pharmaceutical compositions of therapeutically active compounds
US10799490B2 (en) 2014-03-14 2020-10-13 Agios Pharmaceuticals, Inc. Pharmaceutical compositions of therapeutically active compounds
US10449184B2 (en) 2014-03-14 2019-10-22 Agios Pharmaceuticals, Inc. Pharmaceutical compositions of therapeutically active compounds
US11234976B2 (en) 2015-06-11 2022-02-01 Agios Pharmaceuticals, Inc. Methods of using pyruvate kinase activators
US11419859B2 (en) 2015-10-15 2022-08-23 Servier Pharmaceuticals Llc Combination therapy for treating malignancies
US10653710B2 (en) 2015-10-15 2020-05-19 Agios Pharmaceuticals, Inc. Combination therapy for treating malignancies
US10980788B2 (en) 2018-06-08 2021-04-20 Agios Pharmaceuticals, Inc. Therapy for treating malignancies

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