JP4675783B2 - Plate unit with electrode - Google Patents

Plate unit with electrode Download PDF

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JP4675783B2
JP4675783B2 JP2006005509A JP2006005509A JP4675783B2 JP 4675783 B2 JP4675783 B2 JP 4675783B2 JP 2006005509 A JP2006005509 A JP 2006005509A JP 2006005509 A JP2006005509 A JP 2006005509A JP 4675783 B2 JP4675783 B2 JP 4675783B2
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metal foil
plate
conductive film
foil tape
lead wire
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JP2007186377A (en
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利明 伊藤
淳 梶田
妥年 本多
岳 奥野
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Figla Co Ltd
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Figla Co Ltd
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Description

本発明は、板ガラス破損を検知して破損情報をセキュリティシステム等へ発報する、いわゆる防犯用板ガラスなどの電極付板材ユニットに関するものである。   The present invention relates to a plate member unit with electrodes such as a so-called crime prevention plate glass, which detects breakage of a plate glass and issues breakage information to a security system or the like.

透明な導電膜を有する板ガラスに電極モジュールを取り付け、導電膜の抵抗値の変化を検出して破損情報をセキュリティシステム等へ発報する防犯用板ガラスは周知である。   A plate glass for crime prevention that attaches an electrode module to a plate glass having a transparent conductive film, detects a change in the resistance value of the conductive film, and reports damage information to a security system or the like is well known.

また、透明な導電膜を有する板ガラスを単板で使用する場合だけでなく、PVBやEVAの中間膜を介挿した合せガラスや、板ガラス周囲のスペーサによって空気層を設けて周囲をシールした複層ガラスにして使用する場合も公知である。   Moreover, not only when using a plate glass with a transparent conductive film as a single plate, but also a laminated glass with an intermediate film of PVB or EVA, or a multilayer with an air layer sealed by a spacer around the plate glass. It is also well known when used as a glass.

透明な導電膜はスパッタリングによって二次加工でフロートガラス上にITO等の導電膜で形成されたり、ガラス製造時にオンラインでチタン、クロム、錫、インジウムやこれらの酸化物で導電膜が形成される。   The transparent conductive film is formed by sputtering on the float glass as a conductive film such as ITO by secondary processing, or the conductive film is formed on-line with titanium, chromium, tin, indium or their oxides during glass production.

前記導電膜にリード線を接続する電極モジュールの構造としては、下記の特許文献1が知られている。
特開2000−277243号(要約書)
The following Patent Document 1 is known as a structure of an electrode module for connecting a lead wire to the conductive film.
JP 2000-277243 (Abstract)

従来の防犯ガラスにおいては、抵抗値の変化を確実に検知するために、電極モジュールの位置、材質、形状、処理方法が十分検討されていない。そのため、取り付け強度が小さく施工時にリード線が取れたり、経時変化で抵抗値が変動してしまう場合があった。   In the conventional security glass, the position, material, shape, and processing method of the electrode module have not been sufficiently studied in order to reliably detect a change in resistance value. For this reason, there are cases in which the strength of the attachment is small and the lead wire can be removed during construction, or the resistance value fluctuates with time.

また、端子板の取付けの作業が難しく、そのため、作業性が良くなかったり、不良が発生しやすかった。   In addition, it is difficult to attach the terminal board, so that the workability is not good or defects are likely to occur.

本発明はリード線と端子板の取り付け、端子板と接続部の取り付け、接続部の導電膜への取り付けにおいて密着性が良く、容易に外れない電極付板材ユニットを提供することを主目的とする。   The main object of the present invention is to provide an electrode-attached plate material unit that has good adhesion in mounting of lead wires and terminal plates, mounting of terminal plates and connecting portions, and mounting of connecting portions to conductive films and does not easily come off. .

また、本発明の他の目的は、合せガラスや、複層ガラスの製作時の不良を防止し、施工時の作業性を向上させると共に、窓に納まった状態での強度を確保し、見栄えの良い納まりとなり得る電極付板材ユニットを提供することである。   Another object of the present invention is to prevent defects during the production of laminated glass and multi-layer glass, improve workability during construction, and ensure the strength in the state of being housed in a window. It is to provide a plate material unit with electrodes that can be a good fit.

ガラス板からなる板材の表面に導電膜を形成し、当該導電膜の抵抗の変化を検出するために前記導電膜に複数の電極モジュールを介してリード線を接続した防犯用ガラスの電極付板材ユニットであって、前記電極モジュールが板材の四隅に設けられ、かつ、前記各電極モジュールが前記板材の上下となる上辺および下辺に沿って長く形成されており、前記電極モジュールは、導電性の接着剤が片面に塗布された金属箔テープを前記導電膜上に前記接着剤を介して接着した接続部と、前記金属箔テープの1枚の金属箔の部分よりも厚く、かつ、前記金属箔テープ上にろう付けされると共に前記リード線に接続される端子板と、前記金属箔テープの上面の少なくとも一部を覆うと共に金属箔テープの幅方向の両側において前記金属箔テープから前記導電膜上にはみ出して塗布された銀粒子を含む導電性ペーストとを備え、前記端子板は前記板材のエッジから当該板材の外方に向って突出していることで板材の端面から突出した突出部を有し、当該突出部にリード線の端部が接続されており、前記突出部の近傍の前記リード線が前記板材の端面に沿って配設され、前記端面に沿った前記リード線および突出部が樹脂の封止材で封止されており、ここにおいて、前記接続部は、前記導電性ペーストで全体が覆われた細い帯状の第1の金属箔テープを含む通電部と、当該第1の金属箔テープよりも幅が広く、かつ、短い第2の金属箔テープを含む台座部とを備え、前記第1および第2の金属箔テープの概ね全面が前記導電膜上に接着されており、前記第1および第2の金属箔テープの端部同士が互いに重ね合わせた状態で接続されていることを特徴とする。 A plate unit with an electrode for crime prevention glass, in which a conductive film is formed on the surface of a plate made of a glass plate, and lead wires are connected to the conductive film through a plurality of electrode modules in order to detect a change in resistance of the conductive film. The electrode modules are provided at the four corners of the plate material, and each electrode module is formed long along the upper and lower sides of the plate material, and the electrode module is a conductive adhesive. Is thicker than a portion of one metal foil of the metal foil tape, and the metal foil tape coated on one side of the metal foil tape is bonded to the conductive film via the adhesive. before from the metal foil tape and a terminal plate connected to the lead wire with brazed at both sides in the width direction of the metal foil tape covering at least a portion of the upper surface of the metal foil tape A conductive paste containing silver particles coated on and protruding from the conductive film, and the terminal board protrudes from the edge of the plate material toward the outside of the plate material, thereby protruding from the end surface of the plate material An end portion of a lead wire is connected to the projecting portion, the lead wire in the vicinity of the projecting portion is disposed along an end surface of the plate member, and the lead wire and the projecting portion along the end surface The connecting portion is sealed with a resin sealing material, wherein the connection portion includes a first band-shaped first metal foil tape covered with the conductive paste, and the first current-carrying portion. And a pedestal including a second metal foil tape that is wider and shorter than the metal foil tape, and substantially the entire surfaces of the first and second metal foil tapes are bonded onto the conductive film. The ends of the first and second metal foil tapes Characterized in that it is connected to each other in a mutually superposed state.

本発明によれば、導電膜に金属箔テープが接着剤を介して接着されるから、導電膜の構造を損なうことなく大きな接続面積が得られる上、導電膜と接続部との接続抵抗となる接着剤の抵抗値は導電膜の抵抗値よりも一般に十分に小さいので、導電膜の抵抗値の変化の検出に影響を与えない。また、接着剤で広い面積にわたって強固に接着できるから、経時的に接続の抵抗値が変化するおそれもない。
一方、リード線が結線される端子板を前記金属箔テープを介して導電膜に接続するから、端子板を薄い導電膜に直接接続するのと異なり、導電膜よりも厚い金属箔に端子板をハンダで、「ろう付け」することができ、小さな接合面積でも板と箔とを強固に接続することができる。
すなわち、極めて薄い導電膜に、この導電膜よりも厚い金属箔を接着し、更に、この金属箔よりも厚い端子板を金属箔に溶着して、段階的に厚さを厚くしているから、接続に無理が生じなく、各接続部分の抵抗値が十分に小さくなると共に、経時的な抵抗値の変化を防止することができる。
According to the present invention, since the metal foil tape is bonded to the conductive film through the adhesive, a large connection area can be obtained without impairing the structure of the conductive film, and the connection resistance between the conductive film and the connection portion can be obtained. Since the resistance value of the adhesive is generally sufficiently smaller than the resistance value of the conductive film, detection of a change in the resistance value of the conductive film is not affected. Further, since the adhesive can be firmly bonded over a wide area, there is no possibility that the resistance value of the connection changes with time.
On the other hand, since the terminal plate to which the lead wire is connected is connected to the conductive film via the metal foil tape, the terminal plate is attached to the metal foil thicker than the conductive film, unlike the case where the terminal plate is directly connected to the thin conductive film. The solder can be “brazed”, and the board and the foil can be firmly connected even with a small bonding area.
That is, since a metal foil thicker than this conductive film is bonded to an extremely thin conductive film, and a terminal board thicker than this metal foil is welded to the metal foil, the thickness is gradually increased. There is no unreasonable connection, the resistance value of each connection portion becomes sufficiently small, and the change in resistance value over time can be prevented.

以下、本発明の一実施例を図面にしたがって説明する。
図1において、板ガラス1の表面(一方の面)1fには、導電膜10が形成されている。導電膜10としては、周知の金属薄膜や金属酸化薄膜等を使用でき(たとえば、特開2000−277243号)、必ずしも板ガラス1の全面に設ける必要はない。
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In FIG. 1, a conductive film 10 is formed on the surface (one surface) 1 f of the plate glass 1. As the conductive film 10, a known metal thin film, metal oxide thin film, or the like can be used (for example, JP 2000-277243 A), and it is not always necessary to provide the entire surface of the plate glass 1.

前記板ガラス1の端部には、複数の電極モジュールMが設けられている。前記各電極モジュールMは、リード線2を介して導電膜10の抵抗の変化を検出するための周知の抵抗検出器(図示せず:たとえば、特許第3677749号参照)に接続される。   A plurality of electrode modules M are provided at the end of the glass sheet 1. Each of the electrode modules M is connected to a known resistance detector (not shown: see, for example, Japanese Patent No. 3677749) for detecting a change in resistance of the conductive film 10 via the lead wire 2.

各電極モジュールMは、接続部3および端子板4を備えている。   Each electrode module M includes a connection portion 3 and a terminal plate 4.

導電膜10に取り付けられる接続部3としては、導電性接着剤を片面に塗布した細長い第1および第2の銅箔テープ(第1および第2の金属箔テープ)31,32を使用する。これにより、導電膜10に銅箔が前記導電性接着剤により強固に接着され、導電性接着剤内の導電成分により接続部3の導電性が高まり、導電膜10と接続部3との接続抵抗値は導電膜10の抵抗値よりも十分に小さく、導電膜10の抵抗値の変化の検出に影響を与えない。また、経時的に接続の抵抗値が変化するおそれもない。
なお、前記端子板4の厚さ(たとえば、0.1mm〜0.2mm程度)は、前記第1および第2の銅箔テープ31,32の各々の厚さ(たとえば、50μm〜100μm程度)よりも厚い。
As the connection portion 3 attached to the conductive film 10, elongated first and second copper foil tapes (first and second metal foil tapes) 31, 32 having a conductive adhesive applied on one side are used. As a result, the copper foil is firmly bonded to the conductive film 10 by the conductive adhesive, the conductivity of the connection portion 3 is increased by the conductive component in the conductive adhesive, and the connection resistance between the conductive film 10 and the connection portion 3 is increased. The value is sufficiently smaller than the resistance value of the conductive film 10, and does not affect the detection of the change in the resistance value of the conductive film 10. Further, there is no possibility that the connection resistance value changes with time.
In addition, the thickness (for example, about 0.1 mm to 0.2 mm) of the terminal board 4 is larger than the thickness (for example, about 50 μm to 100 μm) of each of the first and second copper foil tapes 31 and 32. Also thick.

図2に示すように、接続部3は、導電膜10に接する細長い帯状の第1の銅箔テープからなる通電部31と、略方形状の第2の銅箔テープからなる台座部32で構成され、台座部32は板ガラス端近傍において導電膜10に先に貼り付けられ、この台座部32の一部に重ねて通電部31を貼り付ける。
前記台座部32の幅W2(たとえば、4mm〜8mm程度)は通電部31の幅W1よりも大きく、かつ、台座部32の長さL2(たとえば、15mm〜25mm程度)は通電部31の長さL1(たとえば、30mm〜1000mm程度)よりも短い。
As shown in FIG. 2, the connection portion 3 includes a current-carrying portion 31 made of an elongated strip-shaped first copper foil tape in contact with the conductive film 10 and a pedestal portion 32 made of a substantially rectangular second copper foil tape. The pedestal portion 32 is first attached to the conductive film 10 in the vicinity of the edge of the plate glass, and the energization portion 31 is attached to a part of the pedestal portion 32.
The width W2 of the pedestal portion 32 (for example, about 4 mm to 8 mm) is larger than the width W1 of the energization portion 31, and the length L2 of the pedestal portion 32 (for example, about 15 mm to 25 mm) is the length of the energization portion 31. It is shorter than L1 (for example, about 30 mm to 1000 mm).

図4の前記端子板4の幅W3(たとえば、4mm〜8mm程度)は、前記台座部32の幅W2(図2)と同等ないし若干大きな幅である。
台座部32が通電部31よりも幅広であるから、細い通電部31に端子板4をハンダ付けする場合に比べ、端子板4のハンダ付けが容易になる上、台座部32は端子板4の一端をハンダ33付けする際のハンダ位置の位置決めの基準となるので、位置決めが容易になる。
なお、前記通電部31にもハンダを乗せることにより接続抵抗の低下と安定が確保される。
The width W3 (for example, about 4 mm to 8 mm) of the terminal plate 4 in FIG. 4 is equal to or slightly larger than the width W2 (FIG. 2) of the pedestal portion 32.
Since the pedestal portion 32 is wider than the energization portion 31, it is easier to solder the terminal plate 4 than when the terminal plate 4 is soldered to the thin energization portion 31, and the pedestal portion 32 is made of the terminal plate 4. Since it becomes a standard of positioning of a solder position when soldering one end with solder 33, positioning becomes easy.
In addition, a drop and stability of connection resistance are ensured by putting solder also in the said electricity supply part 31. FIG.

前記端子板4のハンダ付け(ハンダ33付けの一例)に先立って、図3のように、接続部3の通電部31および台座部32を覆って銀ペースト34はオーバー目にシルク印刷等で塗布される。
銀ペースト34は自然乾燥後、低温で焼き付けられる。銀ペースト34は通電部31の全体と、該通電部31にラップした台座部32の周囲をオーバー目に覆うので銅箔テープ31,32の剥れを防止すると共に、前記通電部31に乗せるハンダ33の付けを容易にする。
Prior to soldering the terminal board 4 (an example of soldering 33), as shown in FIG. 3, the silver paste 34 is coated over the energizing part 31 and the pedestal part 32 of the connecting part 3 by silk printing or the like. Is done.
The silver paste 34 is naturally dried and then baked at a low temperature. The silver paste 34 covers the entire current-carrying part 31 and the periphery of the pedestal part 32 wrapped around the current-carrying part 31 to prevent the copper foil tapes 31 and 32 from being peeled off, and the solder to be placed on the current-carrying part 31. 33 is easily attached.

ここで、銀ペースト34は、細かい銀粒子をバインダ中に分散させてペースト化し、印刷後に焼付けられるが、銀粒子同士の接触によって導電性を発揮する。銀ペースト34は、膜厚が余り厚くできない(たとえば、数μm〜20μm)ので、長い距離では抵抗値も大きくなり抵抗値が安定しない。そこで、本実施例では、導電性接着剤を塗布した銅箔テープを使用することにより、抵抗値を低く安定させ、更に、銀ペースト34を、その上にオーバーラップして重ねることで、銅箔テープの剥れを防止して、密着性を高めている。   Here, the silver paste 34 is formed by dispersing fine silver particles in a binder to form a paste, and is baked after printing. The silver paste 34 exhibits conductivity by contact between the silver particles. Since the silver paste 34 cannot be made too thick (for example, several μm to 20 μm), the resistance value becomes large and the resistance value is not stable at a long distance. Therefore, in this embodiment, by using a copper foil tape coated with a conductive adhesive, the resistance value is stabilized to be low, and further, the silver paste 34 is overlapped on the copper foil so as to overlap the copper foil. It prevents the tape from peeling off and improves adhesion.

図4の端子板4は一部を板ガラス1のエッジ1eから突出した状態で台座部32において接続部3とハンダ33付けされている。図1の前記板ガラス1のエッジ1eから突出した突出部41には小穴42を設け、被覆を剥いだリード線2の一端をハンダ付けすることで、リード線2が突出部41に確実に固定され、引っ張っても抜けることがない。
リード線2は端子板4を接続部3にハンダ付けする前に、予め、端子板4にハンダ付けしておいてもよい。
The terminal plate 4 of FIG. 4 is soldered to the connection portion 3 and the solder 33 in the pedestal portion 32 in a state in which a part protrudes from the edge 1 e of the plate glass 1. A small hole 42 is provided in the protruding portion 41 protruding from the edge 1e of the plate glass 1 in FIG. 1, and the lead wire 2 is securely fixed to the protruding portion 41 by soldering one end of the lead wire 2 with the coating removed. , Never pull out.
The lead wire 2 may be soldered to the terminal plate 4 in advance before the terminal plate 4 is soldered to the connecting portion 3.

図7(a)に示すように、電極モジュールMは板ガラス1のたとえば四隅に4箇所設けるが、板ガラス1の縦横比に拘らず板ガラス1を窓枠に装着した時の上下となる辺に沿って設けると、引き違い窓の場合、サッシのクレセント位置で板ガラス1をこじ破って侵入される場合に、ガラス抵抗値の変化の検出が容易になる。   As shown in FIG. 7A, the electrode module M is provided at, for example, four corners of the plate glass 1, but along the upper and lower sides when the plate glass 1 is attached to the window frame regardless of the aspect ratio of the plate glass 1. When the sliding window is provided, it is easy to detect a change in the glass resistance value when the glass pane 1 is broken and penetrated at the sash crescent position.

単板の場合、接続部3、端子板4およびリード線2を取り付けた後、リード線2の引き出し長さを除いて、リード線2、端子板4および接続部3を図6のシリコーンシール(封止材の一例)S等で覆って保護する。   In the case of a single plate, after the connecting portion 3, the terminal plate 4 and the lead wire 2 are attached, the lead wire 2, the terminal plate 4 and the connecting portion 3 are connected to the silicone seal (FIG. An example of a sealing material: Cover and protect with S or the like.

リード線2の長さは、板ガラス1の幅と高さを合計した長さに50cm程度プラスした寸法とする事により、板ガラス1を現場でサッシに嵌めこむ際に、どちらのサイドでも片側にリード線をまとめてサッシに設けた穴からサッシを通して外部の壁や躯体にリード線2を引き出すことができる。
リード線端付近まで電源線をあらかじめ敷設しておく事により、現場ではガラス破壊検知器(抵抗検知器)と電源線、リード線の結線が容易になる。
The length of the lead wire 2 is set to a dimension obtained by adding about 50 cm to the total width and height of the plate glass 1, so that when the plate glass 1 is fitted on the sash in the field, either side leads to one side. The lead wires 2 can be drawn out from the holes provided in the sash through the sash to the external wall or housing.
By laying the power supply line near the end of the lead wire in advance, it is easy to connect the glass breakage detector (resistance detector), the power supply line, and the lead wire on site.

図7に示す4本のリード線2は上辺同士と下辺同士を結線しガラス破損検知器と電源に結線する事で引き違い窓の場合、サッシのクレセント位置で板ガラス1をこじ破って侵入する場合に、板ガラス1の抵抗値の変化を検出することが容易になる。   When the four lead wires 2 shown in FIG. 7 are connected to the glass breakage detector and the power supply by connecting the upper and lower sides to each other, in the case of a sliding window, when the glass plate 1 is broken and penetrated at the sash crescent position Moreover, it becomes easy to detect a change in the resistance value of the glass sheet 1.

入され易い箇所を重点的に検知できるようにするには、電極モジュールMを板ガラス1の四隅に設けるのが好ましく、この場合、高価な銀ペースト34の使用量を軽減しコストの削減を図ることができる。 Invasion To be able to focus detect the input which is likely locations is preferably provided an electrode module M at the four corners of the glass plate 1, in this case, achieving a reduction in cost by reducing the amount of expensive silver paste 34 be able to.

図6(b)の合せガラスの場合は接続部3、端子板4、リード線2を取り付けた後、PVBやEVA等の中間膜11を必要な厚み分、重ねて相手側の板ガラス1Aを乗せ、オートクレープや真空装置で加熱して合せガラスにする。中間膜11の電極モジュールMの部分は必要に応じて中間膜11の一部を切り取り、当該電極モジュールMに対応する部分が厚くならないように調整してもよい。   In the case of the laminated glass of FIG. 6B, after attaching the connecting portion 3, the terminal plate 4, and the lead wire 2, the intermediate film 11 such as PVB or EVA is stacked by a necessary thickness and the other side glass plate 1A is placed. Then, heat the glass with an autoclave or vacuum device to make a laminated glass. The part of the electrode module M of the intermediate film 11 may be adjusted so that a part of the intermediate film 11 is cut off as necessary and the part corresponding to the electrode module M is not thickened.

リード線2は合せガラス製作後に一部突出した端子板4の突出部41にハンダ付けしてもよい。リード線2の長さは単板の場合と同様である。   The lead wire 2 may be soldered to the protruding portion 41 of the terminal plate 4 that partially protrudes after the laminated glass is manufactured. The length of the lead wire 2 is the same as that of the single plate.

リード線2と一部突出した突出部41と合せガラスの端面はシリコーンシールSで覆って保護する。この場合、接続部3の長さ方向に沿った合せガラス端面とその直角方向に50mm〜100mm程度シリコーンシールで合せガラスの端面を覆う事で突出部41とリード線2の保護ができる。   The lead wire 2, the protruding portion 41 that partially protrudes, and the end surface of the laminated glass are covered with a silicone seal S for protection. In this case, the protruding portion 41 and the lead wire 2 can be protected by covering the end face of the laminated glass with a silicone seal in the direction perpendicular to the laminated glass end face along the length direction of the connecting portion 3 with about 50 mm to 100 mm.

図7(a)に示すように、リード線2はシリコーンシールS端付近で粘着テープ100で合せガラス両面に固定し輸送時や施工時にも引掛けて外れてしまう事を防止するのが好ましい。なお、フリーになっているリード線も丸めて束ね、粘着テープで合せガラス片面に貼り付けておくのが好ましい。   As shown in FIG. 7A, the lead wire 2 is preferably fixed to both surfaces of the laminated glass with the adhesive tape 100 in the vicinity of the end of the silicone seal S to prevent the lead wire 2 from being pulled off during transportation or construction. In addition, it is preferable that the free lead wire is also rolled and bundled and attached to one side of the laminated glass with an adhesive tape.

複層ガラスや図7(c)に示す合せ複層ガラスの場合は乾燥空気を保つため乾燥剤の入ったスペーサーの周囲をシリコーンやポリサルファイドの封着材101でシールする。そのため、端子板とリード線の一部を含めて前記素材で封着する事ができるから、ガラス端面のシリコーンシールは不要になる。   In the case of the multi-layer glass or the laminated multi-layer glass shown in FIG. 7C, the periphery of the spacer containing the desiccant is sealed with a sealing material 101 of silicone or polysulfide in order to keep dry air. Therefore, since it can seal with the said raw material including a terminal board and a part of lead wire, the silicone seal | sticker of a glass end surface becomes unnecessary.

本発明は、防犯用板ガラスユニットについて適用できる。 The present invention can be applied with the security for the plate glass units.

本発明の一実施例にかかる電極付板材ユニットの電極モジュールの部分を拡大して示す概略斜視図である。It is a schematic perspective view which expands and shows the part of the electrode module of the board | plate material unit with an electrode concerning one Example of this invention. 第1および第2銅箔テープの接着状態を示す平面図および側面図である。It is the top view and side view which show the adhesion state of the 1st and 2nd copper foil tape. 第2銅箔テープを導電性ペーストで覆った状態を示す平面図および側面図である。It is the top view and side view which show the state which covered the 2nd copper foil tape with the electrically conductive paste. 電極モジュールの平面図および側面図である。It is the top view and side view of an electrode module. 同電極モジュールにリード線を結線した状態を示す平面図および側面図である。It is the top view and side view which show the state which connected the lead wire to the same electrode module. 合せガラスにおける電極モジュールを示す平面図および断面図である。It is the top view and sectional drawing which show the electrode module in a laminated glass. (a)は電極付板材ユニットにおける板ガラスの一部を省略して示す電極モジュールの平面レイアウト図、(b)は合せガラスを示す側面図、(c)は合せ複層ガラスを示す側面図である。(A) is a plane layout diagram of an electrode module shown with a part of the plate glass omitted in the plate unit with electrode, (b) is a side view showing the laminated glass, and (c) is a side view showing the laminated multilayer glass. .

符号の説明Explanation of symbols

1:板材(ガラス板)
1e:エッジ
10:導電膜
2:リード線
3:接続部
31:通電部
32:台座部
33:導電性ペースト
4:端子板
41:突出部
L1:通電部の長さ
L2:台座部の長さ
M:電極モジュール
S:シリコーンシール
W1:通電部の幅
W2:台座部の幅
W3:端子板の幅
1: Plate material (glass plate)
1e: Edge 10: Conductive film 2: Lead wire 3: Connection part 31: Current-carrying part 32: Base part 33: Conductive paste 4: Terminal board 41: Projection part L1: Length of current-carrying part L2: Length of base part M: Electrode module S: Silicone seal W1: Width of current-carrying part W2: Width of base part W3: Width of terminal board

Claims (2)

ガラス板からなる板材の表面に導電膜を形成し、当該導電膜の抵抗の変化を検出するために前記導電膜に複数の電極モジュールを介してリード線を接続した防犯用ガラスの電極付板材ユニットであって、
前記電極モジュールが板材の四隅に設けられ、かつ、前記各電極モジュールが前記板材の上下となる上辺および下辺に沿って長く形成されており、前記電極モジュールは、
導電性の接着剤が片面に塗布された金属箔テープを前記導電膜上に前記接着剤を介して接着した接続部と、
前記金属箔テープの1枚の金属箔の部分よりも厚く、かつ、前記金属箔テープ上にろう付けされると共に前記リード線に接続される端子板と
前記金属箔テープの上面の少なくとも一部を覆うと共に金属箔テープの幅方向の両側において前記金属箔テープから前記導電膜上にはみ出して塗布された銀粒子を含む導電性ペーストとを備え、
前記端子板は前記板材のエッジから当該板材の外方に向って突出していることで板材の端面から突出した突出部を有し、当該突出部にリード線の端部が接続されており、
前記突出部の近傍の前記リード線が前記板材の端面に沿って配設され、前記端面に沿った前記リード線および突出部が樹脂の封止材で封止されており、
ここにおいて、前記接続部は、前記導電性ペーストで全体が覆われた細い帯状の第1の金属箔テープを含む通電部と、当該第1の金属箔テープよりも幅が広く、かつ、短い第2の金属箔テープを含む台座部とを備え、前記第1および第2の金属箔テープの概ね全面が前記導電膜上に接着されており、前記第1および第2の金属箔テープの端部同士が互いに重ね合わせた状態で接続されている電極付板材ユニット。
A plate unit with an electrode for crime prevention glass, in which a conductive film is formed on the surface of a plate made of a glass plate, and lead wires are connected to the conductive film through a plurality of electrode modules in order to detect a change in resistance of the conductive film. Because
The electrode modules are provided at the four corners of the plate material, and each electrode module is formed long along the upper and lower sides of the plate material, and the electrode module is
A connection part in which a metal foil tape coated with a conductive adhesive on one side is bonded onto the conductive film via the adhesive;
A terminal plate that is thicker than one metal foil portion of the metal foil tape and brazed onto the metal foil tape and connected to the lead wire ;
A conductive paste that covers at least a part of the upper surface of the metal foil tape and includes silver particles applied on both sides in the width direction of the metal foil tape so as to protrude from the metal foil tape onto the conductive film;
The terminal plate has a protruding portion protruding from the end surface of the plate material by protruding from the edge of the plate material toward the outside of the plate material, and the end portion of the lead wire is connected to the protruding portion,
The lead wire in the vicinity of the projecting portion is disposed along the end surface of the plate member, and the lead wire and the projecting portion along the end surface are sealed with a resin sealing material,
Here, the connection portion includes a current-carrying portion including a thin strip-shaped first metal foil tape that is entirely covered with the conductive paste, and a width that is wider and shorter than the first metal foil tape. A pedestal portion including two metal foil tapes, and substantially the entire surfaces of the first and second metal foil tapes are bonded onto the conductive film, and ends of the first and second metal foil tapes. A plate unit unit with electrodes connected in a state where they are overlapped with each other.
請求項1において、前記端子板は前記台座部においてろう付されて接続されている電極付板材ユニット。2. The plate member unit with an electrode according to claim 1, wherein the terminal plate is brazed and connected to the pedestal portion.
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Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2003522391A (en) * 2000-02-01 2003-07-22 サウスウォール テクノロジーズ インコーポレイテッド Vacuum deposition of busbar on transparent conductive film
JP2005049380A (en) * 2003-07-29 2005-02-24 Nippon Sheet Glass Co Ltd Light control body and laminated glass
JP2005132681A (en) * 2003-10-30 2005-05-26 Asahi Glass Co Ltd Laminated glass with electrically conductive film

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003522391A (en) * 2000-02-01 2003-07-22 サウスウォール テクノロジーズ インコーポレイテッド Vacuum deposition of busbar on transparent conductive film
JP2005049380A (en) * 2003-07-29 2005-02-24 Nippon Sheet Glass Co Ltd Light control body and laminated glass
JP2005132681A (en) * 2003-10-30 2005-05-26 Asahi Glass Co Ltd Laminated glass with electrically conductive film

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