JP4640731B2 - Cutting device operation system - Google Patents

Description

The present invention relates to a cutting device operation system in which the cutting device to be remotely operated.

  In various processing apparatuses, it is necessary to set various conditions in advance for processing. For example, when using a cutting machine equipped with a cutting blade, a wafer formed by dividing a plurality of devices by streets is diced by a cutting blade rotating at high speed and divided into individual devices. The street to be cut and the cutting blade are precisely aligned to cut the street, and further, the street to be cut and the cutting are performed in order to cut the street one after another while indexing the cutting blade at intervals of the street. Work to align with the blade and work to find the street interval are required. Since the alignment of the street and the cutting blade is performed by pattern matching of two images acquired by imaging, it is necessary to acquire an image as a reference for matching in advance. The condition of whether or not is to be determined. In determining the reference image, it is necessary to select a part of the circuit formed on the surface of the device as a key pattern to be matched, and it is necessary to determine which part is used as the key pattern. Such a determination also affects the calculation of the street interval (see, for example, Patent Document 1).

  Also, in a processing device, if the parts that make up the device are damaged or worn, the desired processing becomes difficult, so the degree of damage or wear of the component is judged and the part is replaced at an appropriate timing. It is necessary to make adjustments. In the example of the above cutting device, if the cutting blade is chipped or worn, the quality of the device may be degraded. Therefore, the processing region including the cutting groove formed in the street by cutting and the cutting edge of the cutting blade are imaged. Thus, it is necessary to determine whether the cutting blade should be dressed or replaced from the acquired image (see, for example, Patent Document 2). Furthermore, even when it is determined from the image of the cutting groove that dressing or replacement of the cutting blade is not necessary, it may be necessary to adjust processing conditions such as the rotational speed of the cutting blade.

JP-A-7-106405 JP 2004-34192 A

  However, in the setting and adjustment of the processing conditions in the processing apparatus, skilled techniques and judgments may be required, and the delivery destination operator may not be able to do it alone. For example, in the example of the above-mentioned cutting apparatus, the feature points to be the key pattern are accurately selected from the wafer, the necessity of dressing or replacement of the cutting blade is judged from the shape of the cutting groove displayed on the screen, etc. It is necessary to appropriately adjust the processing conditions, and since all of them are skilled work, it is difficult to perform only by the operator on the user side. Under such circumstances, there is a need for an engineer of the processing apparatus manufacturer to go to the user side of the processing apparatus to perform work, and there is a problem that productivity is reduced for both the user and the manufacturer.

  Therefore, the problem to be solved by the present invention is that the manufacturer's engineer is assigned to the user's side even when the operation of the processing apparatus requires skilled techniques and judgments that cannot be performed only by the user's operator. It is to make the work progress with high productivity without dispatching to Japan.

The present invention relates to a holding means for holding a workpiece, a cutting means having a cutting blade for cutting the workpiece held by the holding means, and an imaging means for imaging the workpiece held by the holding means. And a cutting device comprising at least a display means for displaying an image acquired by the image pickup means, a holding means, a cutting means , a control means for controlling the image pickup means and the display means, and the cutting apparatus can be connected via a communication line a terminal device and relates to a cutting device operating system including a cutting device is provided with a memory for storing a unique ID, if a unique ID stored in the ID memory, which is inputted from the terminal device is equal to is connected to the terminal device, the cutting device, controls the hand image acquired by the imaging means and the image information transmitting means for transmitting to the terminal apparatus receives the operation information transmitted from the terminal device The terminal device includes an image information receiving unit that receives image information from the communication line, a reception display unit that displays the image information received by the image information receiving unit, and a communication line. Remote operation means used for inputting operation information for remotely operating the cutting apparatus via the operation means, and operation information transmission means for transmitting operation information input from the remote operation means to the cutting apparatus. According to the operation information received by the information receiving means, one of the holding means, the cutting means , the imaging means or the display means is controlled, and the workpiece image transmitted from the cutting device to the terminal device before cutting the workpiece. Is an image including a key pattern used for alignment, and the image of the workpiece transmitted from the cutting device to the terminal device during or after cutting is formed by cutting. A cutting device operating system is an image that includes a cutting groove.

In the present invention, the image information acquired by the imaging means of the cutting device is displayed on the receiving display unit of the terminal device, control means holding means of the cutting device by the operation information transmitted from the remote control means of the terminal device, cutting means, Since either the imaging unit or the display unit can be controlled, the processing conditions can be set or adjusted while viewing the image of the necessary part of the cutting device on the terminal device side. Accordingly, the technician on the terminal device side can perform an operation that requires skill that cannot be handled only by the operator of the cutting device, so that productivity is improved. Moreover, the cutting device side does not require a skilled expert, and a high-level technology can be provided by the expert on the terminal device side.

The image pickup means of the cutting device picks up the workpiece and displays the image on the reception display means of the terminal device, so that the technician on the terminal device side determines the processing conditions according to the state of the workpiece. Can do.

Since the image of the workpiece is an image including a key pattern to be used for alignment, technology of the terminal apparatus side, it is possible to perform the selection of key patterns for alignment.

Since the image of the workpiece is an image including a cutting groove formed by cutting, the determination of the dressing or replacement cutting blade based on the state of the cut groove can engineer the terminal device side is performed.

  1 includes one or more processing devices 2a, 2b, 2c,..., One or more terminal devices 3a, 3b, 3c,. The communication line 4 connects the device and the terminal device 3.

  As the terminal devices 3a, 3b, 3c,..., For example, a personal computer can be used, and as the communication line 4, for example, the Internet can be used.

  The processing apparatus operation system 1 shown in FIG. 2 shows the function when one processing apparatus 2 and one terminal apparatus 3 are connected via the communication line 4. A holding unit 20 that holds the workpiece, a processing unit 21 that processes the workpiece held by the holding unit 20, an imaging unit 22 that images the workpiece held by the holding unit 20, and an imaging unit 22 Display means 23 for displaying the acquired image, control means 24 for controlling the holding means 20, processing means 21, imaging means 22 and display means 23, and used for inputting instructions and details of operations to the control means 24 In accordance with the contents input by the operator from the operation means 25, imaging, processing, display processing and the like of the workpiece are performed.

  The processing apparatus 2 includes an image information transmission unit 26 that transmits the image information acquired by the imaging unit 22 to the communication line 4. Further, an operation information receiving unit 27 that receives operation information from the communication line 4 is provided, and the received operation information is transferred to the control unit 24, and the holding unit 20, the processing unit 21, the imaging unit 22 or the imaging unit 22 according to the transferred operation information Any of the display means 23 can be controlled.

  The terminal device 3 includes an image information receiving unit 30 that receives image information from the communication line 4, a reception display unit 31 that displays the image information received by the image information receiving unit 30, and a remote control for the processing device 2. Remote operation means 32 used for inputting instructions and details of operation and operation information transmission means 33 for transmitting operation information input from the remote operation means 32 to the communication line 4 are provided. The image information transmitted from the information transmitting unit 26 can be received by the image information receiving unit 30, and the image information can be displayed on the reception display unit 31. Further, the operation information input from the remote operation means 32 and transmitted by the operation information transmission means 33 is received by the operation information receiving means 27 of the processing apparatus 2 and transferred to the control means 24 to be held means 20, processing means 21, This is used for control of the imaging means 22 and the display means 23. That is, in the terminal device 3, the processing device 2 can be controlled by operating the remote operation means 32, and an image captured by the processing device 2 can be displayed on the reception display means 31.

  Below, the cutting apparatus 2 shown in FIG. 3 is demonstrated as an example of the processing apparatus 2. FIG. The cutting apparatus 2 shown in FIG. 3 is an apparatus capable of dicing a wafer and dividing it into individual devices. On the front side of the cutting apparatus 2 is an operating means 25 for an operator to input instructions for the apparatus such as processing conditions. Is provided. In addition, the upper part of the apparatus is provided with a display means 23 for displaying a guidance screen for an operator and an image taken by an imaging means 22 described later.

  As shown in FIG. 4, on the surface of the wafer W to be diced, the first street S1 and the second street S2 are formed orthogonally, and the first street S1 and the second street S2 A plurality of devices D are formed. The wafer W is attached to the dicing tape T. An annular frame F is attached to the outer peripheral edge of the dicing tape T, and the wafer W is supported by being integrated with the frame F via the dicing tape T, and a plurality of wafers W are accommodated in the wafer cassette 28.

  As shown in FIG. 3, on the −Y direction side of the wafer cassette 28, a loading / unloading means 29 for unloading the wafer W before processing from the wafer cassette 28 and loading the processed wafer into the wafer cassette 28 is provided. Has been. Between the wafer cassette 28 and the carry-in / out means 29, a temporary placement region 34, which is a region on which a wafer to be carried in / out, is temporarily placed, is provided. Positioning means 35 for positioning at a fixed position is provided.

  In the vicinity of the temporary placement region 34, a transport unit 36 that sucks and transports the frame F integrated with the wafer W is disposed, and a holding unit 20 is disposed in a movable range of the transport unit 36. Yes. The holding means 20 can move in the X-axis direction and can rotate.

  Above the movement path of the holding means 20 in the X-axis direction, an alignment means 37 for detecting a street to be cut of the wafer W is disposed. The alignment unit 37 includes an imaging unit 22 that images the surface of the wafer W, and can detect a street to be cut by processing such as pattern matching based on an image acquired by imaging. The image acquired by the imaging unit 22 can be displayed on the display unit 23.

  On the + X direction side of the alignment unit 37, a processing unit 21 that performs a cutting process on the wafer W held by the holding unit 20 is disposed. An alignment unit 37 is fixed to the processing unit 21 and the both are interlocked. The processing means 21 is configured by attaching a cutting blade 211 to the tip of a rotatable spindle 210 and is movable in the Y-axis direction and the Z-axis direction. The cutting blade 211 is located on an extension line of the imaging means 22 in the X-axis direction.

  The wafer W accommodated in the wafer cassette 28 is temporarily placed by holding the frame F by the loading / unloading means 29, moving the loading / unloading means 29 in the -Y direction, and releasing the holding in the temporary placement area 34. It is placed in the region 34. Then, the wafer W is positioned at a certain position by the positioning means 35 moving in a direction approaching each other.

  Next, the frame F is adsorbed by the transfer means 36, and the transfer means 36 rotates to transfer the wafer W integrated with the frame F to the holding means 20 and hold it. Then, the holding unit 20 moves in the + X direction, and the wafer W is positioned immediately below the alignment unit 37.

  The image used for pattern matching at the time of alignment in which the alignment unit 37 detects a street to be cut needs to be acquired in advance before cutting. Therefore, when the wafer W is positioned directly below the alignment unit 37, the imaging unit 22 images the surface of the wafer W and causes the display unit 23 to display the acquired image. The operator of the cutting apparatus 2 operates the operation unit 25 to move the image pickup unit 22 slowly and also move the holding unit 20 as necessary to search for a key pattern that is a target for pattern matching.

  In the display means 23, for example, as shown in FIG. 5, a complicated circuit pattern formed in the device is displayed. Since there is only one key pattern for each device from the complicated circuit pattern, it is necessary to select a characteristic shape part suitable for pattern matching. Is difficult. Therefore, in such a case, it is possible to connect to, for example, the manufacturer's terminal device 3 through the communication line 4 shown in FIG. As shown in FIG. 1, when there are a plurality of processing devices, a unique ID is stored in a memory or the like in each processing device, and the terminal device 3 performs remote operation shown in FIG. The ID is input from the means 32. The control means 24 of the cutting device 2 connects the processing device and the terminal device when the ID received via the operation information receiving means 27 is equal to the ID stored in its own memory or the like.

  Referring to FIG. 2, when the cutting device 2 and the terminal device 3 are connected, an image (for example, the image of FIG. 5) captured by the imaging unit 22 of the cutting device 2 and displayed on the display unit 23 is displayed. Also displayed on the reception display means 31 of the terminal device 3. Further, the operation information input from the remote operation means 32 in the terminal device 3 is transferred to the control means 24 of the cutting device 2 via the communication line 4, and the control means 24 operates the imaging means 22 according to the operation information. Can be made. Therefore, the engineer of the processing apparatus manufacturer who is the operator of the terminal device 3 operates the remote control means 32 to operate the image pickup means 22, whereby an image of a desired region on the surface of the wafer W is displayed on the reception display means 31. An appropriate key pattern can be selected based on one's own experience while viewing the content displayed on the reception display means 31. When the engineer of the processing apparatus manufacturer decides, for example, the key pattern P in FIG. 5 as the alignment key pattern, the operation information is transferred to the control means 24 of the cutting apparatus 2 by performing a certain operation in the remote operation means 32. Then, an image including the key pattern P is stored in a memory provided in the alignment means 37 of the cutting device 2. Further, the distance between the key pattern P and the center line of the streets S1 and S2 is obtained by a coordinate value or the like, and the value is also stored in the memory.

  Further, by moving the image pickup means 22 by operating the remote control means 32, an interval between adjacent streets (street interval) is obtained by a coordinate value or the like, and the street interval value is also stored in the memory of the alignment means 37. Let me.

  In this way, the technician of the processing equipment manufacturer in the remote place sets the key pattern, and thereafter, the street of the wafer W can be automatically cut. Specifically, before cutting the street of the wafer W, the alignment unit 37 performs pattern matching between the stored key pattern image and the image actually acquired by the imaging unit 22. When matching is performed, the machining means 21 is moved in the Y-axis direction by the distance between the key pattern and the center line of the street, thereby aligning the street to be cut with the cutting blade 211.

  When the street to be cut and the cutting blade 211 are aligned, the holding means 20 is moved in the X-axis direction, and the processing means 21 is lowered while rotating the cutting blade 211 at a high speed. The street was cut. Further, by performing cutting while indexing the processing means 21 in the Y-axis direction at every street interval stored in the memory, all streets S1 in the same direction are cut. Furthermore, when the same cutting as described above is performed after the holding means 20 is rotated 90 degrees, the streets S2 are all cut and divided into individual devices D.

  During or after cutting, the imaging means 22 images the cutting grooves formed by cutting, estimates the presence or degree of chipping or wear of the cutting blade 211 from the image showing the shape of the cutting grooves, and determines the need for replacement. Although it is necessary to make a determination, it is difficult for the user of the processing apparatus 2 to make such a determination. Therefore, as in the case of the key pattern selection, the processing device 2 and the terminal device 3 are connected, and for example, as shown in FIG. 6, an image including the cutting groove G formed in the first street S1 is transmitted as image information. When the means 26 transmits the data to the terminal device 3 and displays it on the reception display means 31, a skilled engineer of the processing apparatus manufacturer can determine whether the cutting blade 211 needs to be dressed or replaced. The engineer communicates with the operator of the processing apparatus, and the operator can process the wafer under the optimal processing conditions by taking action according to the instruction of the engineer.

It is explanatory drawing which shows an example of a structure of a processing apparatus operation system. It is a functional block diagram of the processing apparatus operation system. It is a perspective view which shows an example of a cutting device. It is a perspective view which shows the wafer integrated with the flame | frame. It is explanatory drawing which shows an example of the image containing a key pattern. It is explanatory drawing which shows an example of the image of a cutting groove.

1: Processing device operation system 2 (2a, 2b, 2c,...): Processing device (cutting device)
20: Holding means 21: Processing means 210: Spindle 211: Cutting blade 22: Imaging means 23: Display means 24: Control means 25: Operating means 26: Image information transmitting means 27: Operation information receiving means 28: Wafer cassette 29: Unloading Input means 34: Temporary placement area 35: Positioning means 36: Transport means 3 (3a, 3b, 3c,...): Terminal device 30: Image information receiving means 31: Reception display means 32: Remote operation means 33: Operation Information transmitting means 34: Temporary placement area 35: Positioning means 36: Transfer means 37: Alignment means 4: Communication line W: Wafer S1: First street S2: Second street D: Device P: Key pattern G: Cutting Groove T: Dicing tape F: Frame

Claims (1)

A holding means for holding the workpiece; a cutting means having a cutting blade for cutting the workpiece held by the holding means; an imaging means for imaging the workpiece held by the holding means; A cutting device comprising at least a display means for displaying an image acquired by the imaging means, the holding means, the cutting means , the imaging means and a control means for controlling the display means; A cutting device operation system comprising a cutting device and a connectable terminal device,
The cutting device includes a memory for storing a unique ID, and when the ID input from the terminal device is equal to the unique ID stored in the memory, the cutting device is connected to the terminal device,
The cutting apparatus includes an image information transmitting unit that transmits an image acquired by the imaging unit to the terminal device, and an operation information receiving unit that receives the operation information transmitted from the terminal device and transfers the operation information to the control unit. With
The terminal device includes: an image information receiving unit that receives image information from the communication line; a reception display unit that displays the image information received by the image information receiving unit; and the cutting device remotely via the communication line. Remote operation means used for inputting operation information for operation, and operation information transmission means for transmitting operation information input from the remote operation means to the cutting apparatus , the control means receiving the operation information the holding means according to the operation information received in means, said cutting means to control either the imaging means or said display means
An image of the workpiece transmitted from the cutting device to the terminal device before cutting the workpiece is an image including a key pattern used for alignment, and the cutting device transmits the image to the terminal device during or after cutting. The cutting apparatus operation system , wherein the transmitted image of the workpiece is an image including a cutting groove formed by cutting .

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