JP4589183B2 - Imaging apparatus and imaging system - Google Patents

Description

  The present invention relates to an imaging device and an imaging system including the imaging device.

  An imaging system in which an imaging device is inserted into a body space such as a human esophagus or trachea, or inside a mechanical device such as an engine, and an image captured by the imaging device can be displayed on a monitor. There is.

  Since the imaging apparatus of such an imaging system needs to be inserted into a narrow space, the imaging apparatus is downsized. In this downsizing, the interior parts such as the electrical parts incorporated in the imaging device and the circuit board to which the electrical parts are attached are miniaturized and the efficiency of the placement of the incorporated interior parts is improved. The interior parts are accommodated at a high accommodation density.

  By the way, in an imaging system, an imaging device and a control device that controls the imaging device include a plurality of signal lines for transmitting various electrical signals such as a control signal for controlling the imaging device and an imaging signal from the imaging device. Connected by. These signal lines are bundled in a cladding tube such as a resin tube between the control device and the imaging device as disclosed in, for example, Patent Literature 1, Patent Literature 2, Patent Literature 3, and Patent Literature 4. In the image pickup apparatus, each signal line is divided separately and connected to a predetermined land portion or electrical component of the circuit board by soldering. Further, in such an imaging system, since it is necessary to reduce the thickness of the cladding tube that bundles the signal lines so as not to hinder the insertion of the imaging device into the space, the signal lines are extremely thin. It is used.

  The structure of the signal line is, for example, a structure in which a core wire that is a conductor portion for transmitting a signal is passed through a resin-made cladding tube that insulates the core wire. The outer diameter of the cladding tube is about 0.32 mm, and the outer diameter of the core wire is about 0.09 mm.

Japanese Unexamined Patent Publication No. 2000-92477 (see FIGS. 1, 2, 3 and 46) Japanese Patent Laid-Open No. 2002-112957 (see FIGS. 2 and 10) Japanese Patent Laid-Open No. 2002-75218 (see FIGS. 1 and 2) JP-A-8-271809 (FIGS. 11, 14, and 15)

  As described above, an imaging apparatus that is used by being inserted into a narrow space is particularly required to be downsized. On the other hand, among the interior parts incorporated in the imaging apparatus, the circuit board requires a large accommodation space. For this reason, an imaging apparatus is often required to reduce the size of the circuit board and reduce the accommodation space of the circuit board.

  Therefore, it is gradually difficult to connect the thin signal lines as described above to the circuit boards and electrical components that are miniaturized and arranged with high density without making mistakes in wiring. ing. That is, an extremely high skill is required for the operation of connecting the signal line to the circuit board. In addition, this downsizing causes a reduction in connection work efficiency and an increase in the burden on the operator.

The present invention has been made based on the above-described circumstances, and an object of the present invention is to provide an image pickup apparatus and an image pickup apparatus that can facilitate work when connecting a signal line to a circuit board or an electrical component. Ru der object of the present invention to provide a system.

In order to solve the above-described problems, the present invention transmits an electrical signal between an imaging optical system, an imaging device that converts and outputs an optical image obtained by the imaging optical system, and an external device. An image pickup apparatus having a signal line bundle in which a plurality of signal lines are collected and a circuit board to which these signal lines are connected includes support means for supporting the signal lines with respect to the circuit board, and the support means is a circuit board. The signal line is supported at a position away from the circuit board. In such a configuration, since the signal line is separated from the circuit board and supported by the support means, the connection work of the signal line to the circuit board becomes easy.

  According to another invention, in addition to the above-mentioned invention, the support means supports the signal line in a state of being fixed to the support means. In the case of such a configuration, the signal line can be connected to the circuit board more easily by supporting the signal line while being fixed to the support means.

  According to another invention, in addition to the above-described invention, the support means further includes a support portion for separately supporting a plurality of signal lines. When configured in this way, since a plurality of signal lines are supported separately, a space can be provided between the signal lines, and the signal lines can be easily handled when connecting the signal lines to the circuit board. It is possible to make the lines difficult to get tangled.

  In addition to the above-described invention, another invention is such that the signal line is fixed at the support portion. In such a configuration, since the signal line is fixed at the support portion, it is possible to more easily connect the signal line to the circuit board.

  In addition to the above-mentioned invention, the other invention further arranges the imaging surface of the imaging device and the substrate surface of the circuit board so as to be orthogonal to the optical axis of the imaging optical system, and also images the support portion. They are arranged in a circular shape on a plane orthogonal to the optical axis of the optical system. When configured in this manner, the imaging surface of the imaging device, the substrate surface of the circuit board, and the surface on which the support portion is disposed are each along the optical axis direction, and each surface is orthogonal to the optical axis. Thus, the thickness around the optical axis of the imaging device can be reduced.

  In addition to the above-described invention, in another invention, the connection portion with the signal line of the circuit board and the support portion are arranged at positions facing each other in the optical axis direction. It is. In such a configuration, the signal line connecting portion of the circuit board and the supporting portion of the support member are disposed at positions facing each other, and therefore the signal lines extending from the supporting portion to the connecting portion are crossed. Wiring can be performed without any problems.

  In addition to the above-described invention, another invention is such that a space is provided between the support portion and the circuit board. In the case of such a configuration, since the gap is provided between the support portion and the circuit board, the work for connecting the signal line to the circuit board can be easily performed.

  In addition, another invention is an imaging system including an imaging device according to each of the above-described inventions and a control device that is connected to a signal line of the imaging device and includes a control unit that controls the imaging device. It is. When configured in this manner, the imaging apparatus can be remotely operated via the signal line.

  In addition to the above-described invention, in the imaging system of the present invention, the control device is further provided with a display unit for displaying an image photographed by the imaging device. When configured in this way, an image captured by the imaging device can be displayed on the display unit.

  The present invention also provides an image pickup optical system, an image pickup element that converts an optical image obtained by the image pickup optical system into an electrical signal and outputs the signal, and a signal for transmitting an electric signal between the image pickup element and an external device In an imaging device having a circuit board to which a line is connected, a plurality of circuit boards are provided, and an imaging surface of the imaging element and a substrate surface of the plurality of circuit boards are arranged so as to be orthogonal to the optical axis of the imaging optical system, The plurality of circuit boards are formed with a concave portion toward the center at the peripheral portion, and a land portion for electrical connection is provided in the concave portion, and an insulating member is disposed between the circuit boards, and the peripheral portion of the insulating member is provided. A recess toward the center is provided at a position corresponding to the land portion of the circuit board. In such a configuration, by providing a plurality of circuit boards and arranging the circuit boards in the optical axis direction, the space for accommodating the circuit boards can be reduced, and the imaging apparatus can be downsized. In addition, since the land portion of the connection line connecting each circuit board is formed in the concave portion of the peripheral portion of the circuit board, the concave portion is also formed in the peripheral portion of the insulating member at a position corresponding to the land portion of the circuit board. Can be disposed while suppressing an increase in the outer peripheral diameter of the imaging device.

  Further, in addition to the above-mentioned invention, the other invention is such that the insulating member is constituted by one plate material made of the same material as the circuit board or by laminating a plurality of this plate material. It is. In this case, when connecting the connection line to the circuit board by soldering, since the insulating member is the same member as the circuit board, the heat resistance of the insulating member during soldering is a concern. Work can be done without

  Further, in addition to the above-mentioned invention, the other invention further includes that the insulating member is formed with a gap portion on the surface in contact with the circuit board so as to avoid interference with an electrical component arranged on the circuit board. It is a thing. When configured in this way, it is possible to avoid interference of electrical components attached to the circuit board in the gap.

  According to another invention, in addition to the above-described invention, the insulating member and the circuit board are formed by injecting solder into the concave portions adjacent to the insulating member and the circuit board. When configured in this manner, the insulating member and the circuit board are fixed by soldering, so that they can be firmly fixed.

According to the present invention, since the signal line is supported against the circuit board by the support means, that Do facilitates the work of connecting the circuit board of the signal line.

(First embodiment)
Hereinafter, an imaging apparatus and an imaging system according to a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a diagram illustrating an overall configuration of an imaging system including an imaging apparatus. 2 to 5 are diagrams illustrating an internal configuration of the imaging apparatus.

  As illustrated in FIG. 1, the imaging system 10 includes a control device 20, a flexible cable unit 30, and an imaging device 40. The imaging system 10 can be used as an endoscope apparatus that captures an image of the inside of a human body and can also be used for applications that capture an interior of a machine.

  Among these, the control device 20 has an exterior housing 21. The exterior casing 21 has a rectangular parallelepiped shape whose overall appearance is flat, and is configured to have a size that can be placed on a palm having a length of 15 cm, a width of 10 cm, and a thickness of about 3 cm, for example.

  A monitor unit 22 is provided on the flat surface of the exterior casing 21, and an image taken by the imaging device 40 is displayed. In addition, the flat surface provided with the monitor unit 22 is provided with operation buttons 23 and the like related to the control of the imaging device 40 along with the monitor unit 22.

  The operator operates the operation buttons 23 and the like to start the control operation of the imaging system 10, for example, the power of the imaging system 10 is turned on / off, and various operations such as start of shooting by the imaging device 40 and adjustment of image quality. The operation can be performed. Note that a battery for driving the imaging system 10 is built in the exterior housing 21 so that the imaging system 10 can be carried and used in an appropriate place.

  A flexible cable portion 30 is connected to the side surface on the short side of the control device 20. The flexible cable portion 30 includes a tube-shaped exterior cable 31 and a signal line bundle 32 inserted into the exterior cable 31.

  The signal line bundle 32 includes a plurality of signal lines 32 </ b> A (see FIG. 2) that electrically connects the control device 20 and the imaging device 40. The signal line bundle 32 includes, for example, a signal line that transmits an image captured by the imaging device 40 to the control device 20, a signal line that supplies power for driving the imaging device from the control device 20 to the imaging device 40, and the imaging device 40. A plurality of signal lines 32 </ b> A for exchanging various electrical signals between the control device 20 and the imaging device 40, such as a signal line for controlling the driving of the imaging system 10, and causing the imaging system 10 to function are provided.

The armored cable 31 can change the line shape by a human hand in a state where the signal wire bundle 32 is inserted, and can support the imaging device 40 with respect to the control device 20 while maintaining the changed shape. It has a certain degree of rigidity. Therefore, the imaging device 40 can enter a narrow space such as a body cavity or the inside of a mechanical device, a gap between objects, or the like while being supported by the control device 20 by the flexible cable unit 30. In addition, since the outer cable 31 can change the line shape, even if the space or gap into which the imaging device 40 is inserted has a complicated shape, the line shape of the flexible cable 30 is matched to that shape. The imaging device 40 can be easily inserted into a space or a gap.

  Here, the configuration of the flexible cable 30 will be described with reference to FIG.

  The armored cable 31 includes a so-called spiral tube 31A formed by spirally winding a thin metallic plate material, and a resin coating 31B that covers the outer periphery of the spiral tube 31A. Since the spiral tube 31A has rigidity and flexibility corresponding to the thickness of the plate material forming the spiral tube 31A, the thickness of the plate material is appropriately set according to the weight of the imaging device 40 and the like.

  Further, by covering the outer periphery of the spiral tube 31A with the resin coating 31B, it is possible to prevent water and dirt from entering the spiral tube 31A from the corrosion of the spiral tube 31A and the gap between the wound plate members, and the imaging device 40. The spiral tube 31A does not come into contact with surrounding objects and damage the contacted objects when entering the space or gap where the image is taken.

  As the spiral tube 31A, instead of this, a so-called free tube configured by connecting a plurality of bending pieces, or a tube formed of a resin material having rigidity and flexibility may be used. A signal wire bundle 32 is passed through the exterior cable 31.

  The signal line bundle 32 includes a plurality of signal lines 32A and a resin tube 32B through which the signal lines 32A are bundled. For example, as shown in the drawing, 14 signal lines 32A are passed through the resin tube 32B. The signal line 32A has a core wire 32C, an inner insulating coating 32D, a shield wire 32E, and an outer insulating coating 32F in this order from the center side. The core wire 32C is covered with an inner insulating coating 32D, the inner insulating coating 32D is covered with a shield wire 32E, and the shield wire 32E is further covered with an outer insulating coating 32F. The core wire 32C is formed of a conductive metal such as a copper material, and various electric signals are exchanged between the control device 20 and the imaging device 40 via each core wire 32C.

  The inner insulating coating 32D is formed of an insulating material such as a resin material, has a tubular shape through which the core wire 32C passes, and insulates the core wire 32C from the shield wire 32E. The shield wire 32E is formed in a tube shape by mesh wires woven with conductive metal threads such as a thin copper material, and covers the periphery of the inner insulating coating 32D. The shield wire 32E prevents the signal of the other core wire 32C or the signal from the outside of the imaging system 10 from entering the core wire 32C passed through the inner insulating coating 32D as a noise signal, that is, the other core wire 32C. Noise signals are blocked so that they do not interfere with each other. The outer insulating coating 32F insulates the shield lines 32E of the signal lines 32A.

  For example, the outer peripheral diameter of the outer insulating coating 32F is about 0.32 mm, the outer peripheral diameter of the shield wire 32E positioned inside thereof is about 0.28 mm, and the inner insulating coating positioned further inside thereof. The outer diameter of 32D is around 0.22 mm, and the diameter of the core wire 32C located at the center is around 0.09 mm. Then, in the state where, for example, 14 signal lines 32A are passed through the resin tube 32B, the outer diameter of the signal line bundle 32 including the resin tube 32B is, for example, about 3 mm. The Thus, the signal wire bundle 32 is passed through an outer cable 31 formed with an outer diameter and an inner diameter of about 4.6 mm and about 3.2 mm, respectively.

  Next, the structure of the imaging device 40 and the connection between the imaging device 40 and the flexible cable 30 will be described with reference to FIGS.

  In the following description, the direction in which the subject to be photographed is positioned forward and the side on which the subject image is formed is the rear with respect to the imaging device 40. Further, when looking from the rear to the front, the left hand direction is the left side and the right hand direction is the right side. That is, in each drawing, the left direction is the front and the right direction is the rear. Further, the front side of the paper surface is the left side and the back side is the right side, and the vertical direction of the paper surface corresponds to the vertical direction of the imaging device 40.

  FIG. 2 is a diagram illustrating an internal configuration of the imaging device 40 as viewed from the left side. FIG. 3 is a diagram illustrating an internal configuration of the imaging device 40 viewed from the left diagonal front, and FIG. 4 is a diagram illustrating an internal configuration of the imaging device 40 viewed from the diagonal left rear. FIG. 5 is a diagram illustrating a configuration in which the main part of the imaging device 40 is viewed from the diagonally left rear.

  The imaging device 40 includes an imaging unit 50, an electrical unit 70, and a connection unit 90. The imaging unit 50, the electrical unit 70, and the connection unit 90 are accommodated in an outer casing 41 that has a substantially cylindrical pipe body formed of a stainless material. A shield tube 42 and an insulating tube 43 are disposed inside the outer casing 41 in the radial direction. Details of the outer casing 41 and the shield tube 42 will be described later.

  The imaging unit 50 includes a lens barrel 51 and a CCD (Charge Coupled Device) 52 as an imaging element.

  The lens barrel 51 has a substantially cylindrical shape formed of a stainless material, and an imaging lens system (not shown) serving as an imaging optical system is disposed therein. Behind the lens barrel 51, a CCD 52 is disposed with its imaging surface aligned with the imaging position of the imaging lens system. Accordingly, the subject light incident on the imaging lens system forms an image on the imaging surface of the CCD 52 by the imaging lens system and is converted into an electrical signal by the CCD 52.

  The imaging lens system is composed of, for example, three lenses in three groups, and each subject is imaged on the imaging surface of the CCD 52 at a distance of 1.5 cm to 5.5 cm from the front surface of the front lens. The distance between the lens and the CCD 52 and the imaging lens system is configured.

  The imaging lens system is not limited to the above-described configuration, and the number of lenses and the distance to the field are appropriately set according to the purpose of use of the imaging system 10, and the imaging element is not a CCD. For example, an image sensor such as a C-MOS (metal oxide semiconductor) may be used.

  A low-pass filter 53 is disposed between the lens barrel 51 and the CCD 52, and unnecessary light such as infrared light is cut by the low-pass filter 53 so that a pseudo signal is not output from the CCD 52.

  The lens barrel 51, the CCD 52, and the low-pass filter 53 are held on the inner peripheral surface 54A of the imaging unit holding cylinder 54 formed of a stainless material. On the inner peripheral surface 54A, a convex wall 54B protruding inward is formed. The rear surface 54C of the convex wall 54B functions as a positioning surface that contacts the front surface of the CCD 52 to determine the position of the CCD 52 in the front-rear direction, and the front surface 54D contacts the rear surface of the low-pass filter 53. It functions as a positioning surface that determines the position of the low-pass filter 53 in the front-rear direction.

  54 A of inner peripheral surfaces are formed in the position biased upward with respect to the center of the outer peripheral surface of the imaging part holding | maintenance cylinder 54, and the side wall part 54E surrounding the lens-barrel 51 of the imaging part holding | maintenance part 54 is wall thickness of a lower side. Is formed to be thick. And in the site | part in which the wall thickness of this side wall part 54E was formed thickly, the screw hole 54F which the so-called potato screw 55 screwed is formed penetrating from the outer peripheral surface to the inner peripheral surface 54A side.

  The female screw 55 is used to fix the lens barrel 51 to the imaging unit holding unit 54, and at a position where an image formed by the imaging lens system disposed in the lens barrel 51 is focused on the imaging surface of the CCD 52. The tube screw 55 is tightened, and the lens barrel 51 is sandwiched between the tip of the tube screw 55 and the upper side surface of the inner peripheral surface 54A so that the lens barrel 51 does not move.

  The shape of the inner peripheral surface 54A is such that the lens barrel 51, the CCD 52, and the low-pass filter 53 do not move in a direction perpendicular to the optical axis of the imaging lens system. The filter 53 is formed in a shape that can be supported in a direction orthogonal to the optical axis.

  An illumination device 56 for illuminating the imaging range is provided below the front side of the lens barrel 51. The illumination device 56 includes an LED (Light Emitting Diode) 56A and a circuit board 56B to which the LED 56A is attached. The circuit board 56B has a substantially crescent shape when viewed from the front, and the lens barrel 51 is disposed on the inner peripheral side of the crescent moon, and at both ends of the circuit board 56B (where the crescent moon is narrowed). An LED 56A is attached to each. That is, one LED 56A is provided on each of the left and right lower sides with the lens barrel 51 interposed therebetween. 2 to 4, the LED 56A disposed on the left side is shown.

  A cover frame 57 made of stainless steel is disposed in front of the lens barrel 51 and the illumination device 56. The cover frame 57 is formed with a lens barrel fitting portion 57A into which the tip of the lens barrel 51 is fitted, and a transparent portion 57B through which illumination light from the LED 56A is transmitted.

  The lens barrel fitting portion 57A is formed as a circular hole penetrating in the front-rear direction at a position biased above the cover frame 57, and the tip of the lens barrel 51 is fitted in a direction perpendicular to the optical axis. It is formed in a size and shape that does not rattle.

  As shown in FIG. 3, the portion corresponding to the lower side of the lens barrel fitting portion 57 </ b> A of the cover frame 57 formed at a position where the lens barrel fitting portion 57 </ b> A is biased upward with respect to the center of the cover frame 57. The wall thickness is formed thicker than the upper side. A transparent portion 57B through which light is transmitted in the front-rear direction is formed at a portion where the wall thickness is thick.

  The transparent portion 57B is formed, for example, by forming a hole portion penetrating the cover frame 57 in the front-rear direction and fitting a transparent acrylic resin member into the hole portion. In the present embodiment, the transparent portion 57B has a shape viewed from the front so that the illumination light of the LED 56A disposed on the lower left and right sides through the lens barrel 51 is transmitted, and the shape of the circuit board 56B. It is formed in a nearly crescent shape corresponding to. The illumination light of the LED 56A is transmitted forward through the transparent portion 57B.

  An electrical unit 70 is disposed behind the imaging unit 50 configured as described above. The configuration of the electrical unit 70 will be described with reference to FIG.

  The electrical component section 70 includes a substrate body 70A including three circuit boards 71, 72, and 73 and spacer members 74 and 75 as insulating members.

  The circuit boards 71, 72, 73 each have a disk shape and are formed to have the same outer diameter and plate thickness. Electrical components 71B, 72B, and 73B are attached to the board surfaces 71A, 72A, and 73A of the circuit boards 71, 72, and 73, respectively. The circuit boards 71, 72, and 73 have the board surfaces 71A, 72A, and 73A as optical axes. Are arranged side by side in the front-rear direction at intervals.

  A spacer member 74 is disposed between the circuit board 71 and the circuit board 72, and a spacer member 75 is disposed between the circuit board 72 and the circuit board 73. The spacer members 74 and 75 are made of the same material as the circuit board 71 and the like, for example, an epoxy resin, and are formed by laminating plate materials having the same outer diameter and plate thickness as the circuit board 71 and the like. For example, the spacer member 74 is constituted by laminating two sheets of this plate material, and the spacer member 75 is constituted by laminating three similar plate materials.

  Thus, the board body 70 </ b> A of the electrical component 70 is configured by stacking the circuit board 71, the spacer member 74, the circuit board 72, the spacer member 75, and the circuit board 73 in order from the front. The circuit boards 71, 72, 73 and the spacer members 74, 75 and the plate members constituting the spacer members 74, 75 are fixed to each other by an adhesive.

  A CCD 52 is attached to the front surface of the circuit board 71, and an electrical component 71B such as an IC chip for driving control of the CCD 52 is attached to the rear surface.

  The spacer member 74 disposed behind the circuit board 71 is formed with a hole 74A as a gap penetrating back and forth on the inner side. When the circuit board 71 and the spacer member 74 are laminated, the circuit board 71 The electrical component 71 </ b> B attached to the housing is accommodated in the hole 74 </ b> A so as not to interfere with the spacer member 74, that is, not to contact.

  Also on the rear surface of the circuit board 72, an electrical component 72B such as an IC chip for driving control of the CCD 52 is attached. The spacer member 75 disposed behind the circuit board 72 is also provided with a hole 75A as a gap portion penetrating back and forth on the inner side. When the circuit board 72 and the spacer member 75 are laminated to each other, The electrical component 72B attached to the substrate 72 is accommodated in the hole 75A so as not to interfere with the spacer member 75.

Also, an electrical component 73B such as an IC chip for driving control of the CCD 52 is attached to the front surface of the circuit board 73. When the circuit board 73 and the spacer member 75 are stacked on each other, the electrical component 73A attached to the circuit board 73 is accommodated in the hole 75A and does not interfere with the spacer member 75. The thickness of the spacer members 74 and 75, that is, the thickness of each spacer member 74 and 75 to be laminated and the number of laminated layers are appropriately determined according to the projection amount (height) of the electrical component from the circuit boards 71, 72, and 73. Set.

  In the present embodiment, the holes 74A and 75A are formed as holes that penetrate the spacer members 74 and 75 in the front-rear direction, but may be formed as recesses that do not penetrate the spacer members 74 and 75. . For example, the recess is formed as follows. The recess is formed by cutting the surface of the plate member that forms the spacer member 74 to form a recess, or by forming a through hole in only one or several sheets on the front side of the spacer member 74 to be laminated. Further, for example, the spacer member 75 is a through hole only for the two plate members at both ends in the front-rear direction without forming the hole portion 75A that is a through hole for the middle plate member among the three plate members. The recess may be formed so as to form the hole 75A.

  The circuit boards 71, 72, 73 have a board shape called a so-called end face through-hole type. That is, a plurality of substantially semicircular recesses 71C, 72C, and 73C are formed along the outer periphery of the outer peripheral edge of the circuit boards 71, 72, and 73, and the recesses 71C, 72C, and 73C are formed between the circuit boards or outside the circuit board. It is formed as a land portion for connecting a connection line for connection with the electrical component. The recesses 71C, 72C, and 73C are formed so that the recesses face toward the center of the circuit boards 71, 72, and 73, and the openings of the recesses face toward the outer peripheral side.

  By electrically connecting the recesses 71C, 72C, and 73C to each other so that the circuit boards 71, 72, and 73 are connected in a predetermined manner between the electrical components 71B, 72B, and 73B attached thereto, The circuit boards 71, 72, 73 are electrically connected normally.

  That is, the circuit boards 71, 72, and 73 are arranged by dividing the electrical components that are originally attached to one circuit board into three circuit boards. Then, the recesses 71C, 72C, and 73C, which are land portions, and the electrical components 71B, 72B, and 73B are connected by an electric circuit in each circuit board 71, 72, and 73, and the recesses 71C, 72C, and 73C are electrically connected. Thus, the circuit boards 71, 72, 73 are configured to perform the same function as one circuit board.

  Each circuit configuration of the circuit boards 71, 72, 73 is configured such that the recesses 71C, 72C, 73C arranged in a line in the front-rear direction may be connected. Then, recesses 74B, 75B having the same shape as the recesses 71C, 72C, 73C are formed on the outer peripheral surface portions of the spacer members 74, 75 at positions corresponding to the recesses 71C, 72C, 73C arranged in a line in the front-rear direction.

  Accordingly, the recesses 71C, 72C, 73C are connected via the recesses 74B, 75B, and the recesses 71C, 72C, 73C and the recesses 74B, 75B are provided along the optical axis direction on the outer peripheral surface of the substrate body 70A. A plurality of concave grooves parallel to the optical axis formed by arranging in a line are formed. The recesses 74B and 75B are formed so that the recesses face toward the center of the spacer members 74 and 75 and the opening of the recess faces toward the outer periphery.

  As described above, the circuit configuration of the circuit boards 71, 72, and 73 is configured to connect the recesses 71C, 72C, and 73C arranged in a line in the front and rear, so that the recesses 71C, 72C, and 73C are connected to each other. Can be made along the groove formed by the recesses 71C, 72C, 73C and the recesses 74B, 75B. For example, the recesses 71C, 72C, and 73C can be electrically connected along the core wire 32C of the signal line 32A serving as a conductive line in the groove. In addition, since the heat-resistant epoxy resin plate material is used for the spacer members 74 and 75, it is also possible to connect the recesses 71C, 72C and 73C by pouring solder directly into the communicating groove.

  In addition to fixing the circuit boards 71, 72, 73 and the spacer members 74, 75 and the plate members constituting the spacer members 74, 75 to each other with the adhesive as described above, the recesses 71C, 72C, The connection between the circuit boards 71, 72, 73 and the spacer members 74, 75 and between the plate members constituting the spacer members 74, 75 can be further strengthened by connecting the conductors 73 </ b> C with conductive wires.

  By the way, as described above, the electrical components that are originally attached to one circuit board are divided into three circuit boards 71, 72, 73, and these circuit boards 71, 72, 73 are used as optical axes. Therefore, the circuit boards 71, 72, 73 are extremely small in the radial direction. In other words, if an image pickup apparatus is configured by arranging one circuit board perpendicular to the optical axis, the image pickup apparatus becomes thicker, and one circuit board is arranged along the optical axis direction. Thus, if the imaging apparatus is configured, the length of the imaging apparatus is long. On the other hand, by arranging the circuit boards 71, 72, and 73 divided as described above, the imaging device 41 can be reduced in size, that is, made thinner and shorter.

  In the board body 70A in which the circuit boards 71, 72, 73 and the spacer members 74, 75 are laminated, a hole 76 that penetrates the board body 70A in the front-rear direction is formed inside the outer peripheral surface. Of the signal line 32A, the signal line 32Ae for supplying power to the illumination device 56 is passed through the hole 76 from the circuit board 73 side to the illumination device 56 side. One hole portion 76 is provided on each of the left and right sides so as to pass the two signal lines 32Ae provided corresponding to each of the LEDs 56A provided on the left and right sides.

  In the present embodiment, at least 12 recesses 71C, 72C, 73C and recesses 74B, 75B are formed with respect to the number 14 of signal lines 32A. The remaining 12 signal lines 32A except for the 2 signal lines 32Ae correspond to the 12 grooves formed in the front-rear direction by the recesses 71C, 72C, 73C and the recesses 74B, 75B one by one. Arranged and connected. The number of the recesses 71C, 72C, 73C and the recesses 74B, 75B may be two less than the total number 14 of the signal lines 32A because, as described above, the two signal lines 32Ae pass through the holes 76 and the circuit board. This is because it is connected to 56B.

  A connection portion 90 that connects the flexible cable 30 and the imaging device 40 is disposed behind the electrical component portion 70. The connection unit 90 includes an exterior cable support tube 91 that supports the exterior cable 31 with respect to the outer casing 41, and a support unit 92 that supports the signal line bundle 32 with respect to the electrical component 70, that is, the circuit board 73.

  First, the exterior cable support tube 91 will be described.

  The armored cable support tube 91 is made of a stainless material, has a substantially cylindrical shape, has a thick side wall portion on the front side, and a thin side wall portion on the rear side. Accordingly, a stepped portion with the surface portion 91A facing backward is formed on the inner peripheral portion. Then, on the inner peripheral side of the outer cable support tube 91, the outer cable 31 is fitted until the distal end of the outer cable 31 comes into contact with the surface portion 91A, and is further fitted so as not to come off. The exterior cable 31 is fixed with an adhesive.

  Further, the outer cable support tube 91 has a part slightly longer than the half on the front side fitted into the inner peripheral side of the outer casing 41, and an adhesive between the outer casing 41 and the outer casing 41 so as not to fall off. Fixed.

  As described above, the exterior cable 31 is attached to the outer casing 41 via the exterior cable support tube 91.

When the outer cable support tube 91 is fitted into the outer housing 41, the outer peripheral surface of the outer housing 41 and the outer peripheral surface of the outer cable support tube 91 extending rearward from the outer housing 41 are flush with each other. Thus, the outer peripheral diameter of the portion of the outer cable support tube 91 that is fitted into the outer casing 41 is larger than the outer peripheral diameter of the portion that is not fitted into the outer casing 41 and extends rearward from the rear edge of the outer casing 41. It is formed slightly narrower.

  The boundary between the thick portion and the thin portion of the outer peripheral diameter of the outer cable support tube 91 is a surface portion 91B that faces the front, and the flexible cable so that the rear end surface of the outer casing 41 contacts the surface portion 91B. The support tube 91 is fitted into the outer casing 41.

  By removing the protruding portion with the outer peripheral surface of the outer casing 41 and the outer peripheral surface of the exterior cable support tube 91 extending from the rear edge of the outer casing 41 being flush with each other, When inserted inside, it is possible to prevent the imaging device 40 from being caught by surrounding objects to be inserted, and to prevent the insertion operation of the imaging device 40 from being hindered. Note that the inner peripheral surface of the front end portion 91C of the outer cable support tube 91 is formed as a conical slope 91D whose inner peripheral diameter decreases from the front to the rear, and comes into surface contact with the relay tube 94 described later. ing.

  Next, the support means 92 will be described. The support means 92 includes a support arm portion 93, a relay pipe 94, and a signal line holding pipe 95.

  The support arm 93 is supported by providing an annular plate 93A having a hole at the center and a flat ring around the hole, and a space between the annular plate 93A and the circuit board 73 of the electrical component 70. Support pillar 93B. Both the annular plate 93A and the support pillar 93B are formed of a conductive metal material such as a copper material, for example. In this embodiment, two support pillars 93B are provided.

  A boss 93C is formed at the rear end of the support pillar 93B, and a boss hole 93D into which the boss 93C is fitted is formed in the annular plate 93A. The boss 93C is press-fitted into the boss hole 93D, and the annular plate 93A and the support column 93B are bonded and fixed with an adhesive at the press-fitted portion and the periphery thereof, thereby forming the support arm portion 93.

  The outer peripheral diameter of the annular plate 93A is substantially the same as the outer peripheral diameter of the circuit board 71 and the like, and a plurality of hole portions 93E are formed as support portions for separately supporting the signal lines 32A. At least 14 of these holes 93E are formed as circular through-holes that pass through the annular plate 93A before and after the 14 signal lines 32A. As shown in FIGS. 3 and 4, the holes 93E are arranged side by side in the circumferential direction in the vicinity of the inside of the outer periphery of the annular plate 93A.

The support arm portion 93 is attached by fixing the support pillar 93 </ b> B to the circuit board 73. The mounting structure of the support arm 93 to the circuit board 73 is such that a boss (not shown) is formed on the front end surface of the support column 93B, and a boss (not shown) that fits the boss on the circuit board 73 side. A hole is formed, and the circuit board 73 and the support pillar 93B are fixed and attached with an adhesive in a state where the boss and the boss hole are positioned.

  A large-diameter portion 93F having a slightly larger outer diameter is formed at the front end portion of the support pillar 93B. By increasing the adhesion area with the circuit board 73 by this large-diameter portion 93F, the support arm portion 93 is connected to the circuit. The substrate 73 can be stably supported.

  Each hole 93E is formed at a position corresponding to the arrangement of the recesses 71C, 72C, 73C formed in the circuit boards 71, 72, 73 around the optical axis. That is, the hole 93E is formed in front of each hole 93E in the optical axis direction so that one recess 73C among the plurality of recesses 73C formed on the outer periphery of the circuit board 73 is substantially opposed, and the supporting arm is formed. The part 93 is attached to the circuit board 73. Accordingly, the hole 93E and the recesses 71C, 72C, and 73C are at the same position in the radial position, and are arranged in a line in the optical axis direction.

  As described above, the hole 93E is formed near the inside of the outer periphery of the annular plate 93A, while the recess 73C is formed as a recess in the outer peripheral edge of the circuit board 73. Therefore, the concave portion 73C and the hole portion 93E are disposed at a position where the concave portion 73C is biased in a direction away from the optical axis with respect to the hole portion 93E. That is, the line connecting the circle center of the recess 73C having a substantially semicircular diameter and the circle center of the hole 93E is slightly inclined from the rear to the front and away from the optical axis. For this reason, the holes 93E and the recesses 73C are disposed so as not to completely face each other in the optical axis direction but to substantially face each other.

  A relay tube 94 that supports the signal line holding tube 95 with respect to the support arm portion 93 is attached to the rear of the support arm portion 93. In the relay pipe 94, a cylindrical portion 94A on the rear side and a conical portion 94B provided in front of the cylindrical portion 94 are integrally formed. The relay pipe 94 is formed of a conductive metal material such as a copper material, and the outer peripheral side is covered with a resin material and insulated. The resin material is not coated on the front end surface of the conical portion 94B.

  The inclination angle of each surface of the inclined surface 91D and the inclined surface 94C is set so that the inclined surface 94C on the outer surface of the conical portion 94B and the inclined surface 91D of the front end portion 91C of the exterior cable support portion 91 described above are in contact with each other. . The outer peripheral diameter of the front end portion of the conical portion 94B is formed to be substantially the same as the outer peripheral diameter of the annular plate 93A of the support arm portion 93, and protrudes forward on the left and right sides of the front end portion, and is a wide protruding piece in the circumferential direction. A portion 94D is formed. On the other hand, a concave portion 93G into which the convex piece portion 94D is fitted is formed on the outer peripheral edge of the annular plate 93A of the support arm portion 93.

  The relay pipe 94 is inserted into the concave portion 93G of the annular plate 93A with the convex piece portion 94D of the support arm portion 93, and the front end edge of the conical portion 94B is attached to the rear surface of the annular plate 93A with an adhesive. It is fixed by bonding. A signal line holding tube 95 is fitted into the inner peripheral side of the cylindrical portion 94 </ b> A of the relay pipe 94 from the rear end, and the signal line holding pipe 95 is supported with respect to the relay pipe 94. The signal line holding tube 95 is formed of a conductive metal material such as a copper material.

  The signal line holding tube 95 has a substantially cylindrical shape, and two flange-shaped step portions 95A and 95B continuous in the front-rear direction are formed in a circular shape on the outer peripheral surface. The outer peripheral diameter of the step portion 95A is set larger than the outer peripheral diameter of the step portion 95B. The outer peripheral diameter of the stepped portion 95B is set so as to fit exactly on the inner periphery of the cylindrical portion 94A of the relay pipe 94. Therefore, when the signal line holding tube 95 is fitted into the cylindrical portion 94A until the front surface of the stepped portion 95A contacts the rear end surface of the cylindrical portion 94A, the signal line holding tube 95 is inserted into the cylindrical portion 94A, the stepped portion 95B. That is, it is supported with respect to the relay pipe 94.

  Next, the structure around the electrical component 70 and the support arm 93 will be briefly described.

  On the inner peripheral side of the outer casing 41, there is a shield tube 42 formed of a conductive metal material such as a copper material so as to cover a range from the substrate body 70A of the electrical component 70 to the front portion of the relay tube 94. Arranged. Between the substrate body 70A and the shield tube 42, an insulating tube 43 formed of a resin material is disposed so that the circuit boards 71, 72, 73 constituting the substrate body 70A and the shield tube 42 are not short-circuited. .

  In the imaging device 40 configured as described above, the signal line 32A is connected to the electrical unit 70 as follows. In the drawing, only a few of the signal lines 32A are shown in the drawing in consideration of the visibility of the drawing, and the portions of the signal lines 32A that extend forward from the signal line holding tube 95 are also shown. Some are omitted.

  The signal line 32A is bundled through the signal line holding tube 95 and supported. In the signal line 32A passed through the signal line holding tube 95, the resin tube 32B that bundles the signal lines 32A is peeled off at the rear side of the portion that passes through the signal line holding tube 95, and the outer insulating coating 32F is exposed. Is passed through the signal line holding tube 95.

  Each of the signal lines 32A extending from the front end portion of the signal line holding tube 95 is stripped of the outer insulating coating 32F, and the shield wire 32E is stripped of the inner insulating coating 32D. The peeled shield wire 32E is folded back to the outer peripheral surface side of the signal line holding tube 95 and fixed to the outer peripheral surface by soldering or the like.

  In a state where the signal line holding tube 95 is inserted into the cylindrical portion 94A of the relay pipe 94, the height of the step of the step portion 95B is provided between the inner peripheral surface of the cylindrical portion 94A and the outer peripheral surface of the signal line holding tube 95. Only a gap 95 </ b> C is formed in a cylindrical shape along the outer periphery of the signal line holding tube 95. The tip end side of the shield wire 32E peeled off in the gap 95C is disposed. That is, the signal line 32 </ b> A is supported by the substrate body 70 </ b> A via the signal line holding tube 95, the relay tube 94, and the support arm portion 93.

  In this way, the signal line 32A has the shield line 32E fixed to the signal line holding tube 95 by soldering, and the signal line holding tube 95 to which the signal line 32A is fixed is supported via the relay tube 94. Further, the support arm portion 93 is fixed to the circuit board 73. That is, the signal line 32 </ b> A is supported by the support means 92 with respect to the circuit board 73 at a position away from the circuit board 73. As a result, the signal line 32A is supported by the support means 92 at a position away from the substrate body 70A.

  The signal lines 32A that extend forward from the signal line holding tube 95 and from which the shield lines 32E have been peeled are passed through the holes 93E one by one from the rear side of the annular plate 93A to the front circuit board 73 side. . The signal line 32A passed through the hole 93E has the core wire 32C exposed from the inner insulating coating 32D at the positions of the recesses 71C, 72C, 73C to be connected, and the core wire 32C is exposed to the predetermined recesses 71C, 72C, 73C. Are electrically connected to each other by soldering. Which of the recesses 71C, 72C, and 73C the core wire 32C is connected to is determined by the electrical configuration of the circuit boards 71, 72, and 73.

  The length of the support pillar 93B is such that the signal line 32A through the hole 93E passes between the circuit board 73 and the annular plate 93A from the gap between the circuit board 73 and the annular plate 93A toward the concave portion 73C. It sets so that the space | interval which can perform the operation | work which draws out is formed.

  Further, since the signal line 32Ae in the signal line 32A is a signal line that supplies power to the lighting device 56, the LED 56A is attached through the hole 76 without exposing the core line 32C from the inner insulating coating 32D. It reaches the circuit board 56B and is exposed from the inner insulating coating 32D and connected to the circuit board 56B at the connection portion with the circuit board 56B.

  Subsequently, an assembly procedure of the imaging device 40 will be described focusing on a procedure for connecting the signal line bundle 32 and the signal line 32A to the imaging device 40.

  First, the signal wire bundle 32 is extended from the front end portion of the exterior cable 31 to a length slightly longer than the length L shown in FIG. This length L is a length corresponding to the distance of the substrate 56B to which the LED 56A is attached from the rear end portion of the signal line holding tube 95 in a state where the assembly of the imaging device 40 is completed.

  Then, the resin tube 32B is peeled off from the portion extending from the front end portion of the exterior cable 31 so that the outer insulating coating 32F is exposed. Next, in a state where the signal lines 32A with the outer insulating coating 32F exposed are bundled, they are passed through the inner periphery of the signal line holding tube 95 and the front end of the resin tube 32B where the rear end edge of the signal line holding tube 95 remains. Insert it as close as possible or close to the part. The space between the rear end edge of the signal line holding tube 95 and the front end portion of the resin tube 32B is, for example, such that a tool such as tweezers can be inserted to process the signal line 32A. You may keep it.

  The insulation coating 32F is peeled off from each signal line 32A extending forward from the signal line holding tube 95, and the shield wire 32E is peeled off so that the inner insulation coating 32D is exposed. The peeled shield wire 32E is folded back to the outer peripheral surface side of the signal line holding tube 95, and each shield wire 32E is connected and fixed to the outer peripheral surface of the signal line holding tube 95 by soldering. As a result, all the signal lines 32 </ b> A, that is, the signal line bundle 32 are supported by the signal line holding tube 95.

  Then, the signal line 32A extending forward from the signal line holding tube 95 is passed through the relay tube 94, and then the signal line holding tube 95 is inserted into the cylindrical portion 94A until the step portion 95B of the signal line holding tube 95 is completely fitted. insert. That is, the step portion 95B of the signal line holding tube 95 is fitted into the cylindrical portion 94A until the rear end portion of the cylindrical portion 94A contacts the front surface of the step portion 95A. The tip end side of the shielded wire 32E thus peeled off is disposed in the gap 95C.

  Next, the signal line 32A is passed through a hole 93E formed in the annular plate 93A of the support arm portion 93, and the relay pipe 94 and the annular plate 93A are fixed. As described above, the relay tube 94 and the annular plate 93A are fixed by fitting the convex piece portion 94D of the conical portion 94B of the relay tube 94 into the concave portion 93G of the circular plate 93A and the front end surface of the conical portion 94B. This is performed by bonding the circular plate 93A. The support arm portion 93 is attached to the circuit board 73 in advance.

  Twelve of the signal lines 32A that have passed through the hole 93E are soldered and connected to the recesses 71C, 72C, and 73C that face the front of the hole 93E through which the signal line 32A has passed. Note that the signal wire 32A is soldered to the recesses 71C, 72C, and 73C, the core wire 32C is exposed from the inner insulating coating 32D, and the core wire 32C is soldered to the recesses 71C, 72C, and 73C. In passing the signal line 32A through the hole 93E, the signal line 32A is selected so that the signal line 32A can be connected to the recesses 71C, 72C, and 73C located in front of the hole 93E through which the signal line 32A passes.

  Of the signal lines 32A passed through the hole 93E, the two signal lines 32Ae pass through the hole 76 as they are without peeling off the inner insulating coating 32D.

  Thus, the signal lines 32A extending in a bundled state from the signal line holding tube 95 are arranged in the circumferential direction between the signal lines 32A corresponding to the formation interval of the holes 93E formed in the annular plate 93A. Since the interval is widened, it is possible to prevent the signal lines 32A from being entangled with each other, and the connection work to the recesses 71C, 72C, 73C is facilitated.

  Further, the annular plate 93A is supported on the circuit board 73 by the support pillar 93B, so that a space is provided between the annular plate 93A and the circuit board 73. The connection of the signal line 32A to the recesses 71C, 72C, 73C is also possible. The work is made easy.

  By the way, for example, the peripheral edge of the hole 93E is colored in a different color for each hole 93E, and the same color as the hole 93E through which the signal line 32A should be passed is also colored on the signal line 32A side. As a result, the correspondence between the signal line 32A and the hole 92E through which the signal line 32A is to be passed can be facilitated, and the connection work between the signal line 32A and the recesses 71C, 72C, 73C can be facilitated.

  Note that the signal line 32 </ b> A that passes through the recesses 71 </ b> C, 72 </ b> C, and 73 </ b> C and surpasses the front of the circuit board 71 is cut. Further, the signal line 32Ae connected to the substrate 56B of the lighting device 56 is connected to the circuit substrate 56B through the hole 76 formed in the substrate body 70A as described above.

  As described above, when the connection between the twelve signal lines 32A and the circuit boards 71, 72, 73, and the two signal lines 32Ae and the circuit board 56B is completed, the signal line bundle 32 is pulled backward, and the cone of the relay pipe 94 is obtained. The slope 94C of the portion 94B is brought into contact with the slope 91D of the front end portion 91C of the flexible cable support portion 91. Since the signal line bundle 32, the signal line holding tube 95, the relay tube 94, the support arm portion 93, and the substrate portion 70A are attached and fixed to each other as described above, when the signal line bundle 32 is pulled rearward, it is integrated. And pulled backwards.

  The slope 94C on the side of the relay pipe 94 and the slope 91D on the side of the flexible cable support 91 come into contact with each other, and the relay pipe 94 is surface-supported with respect to the slope 91D, so that it is orthogonal to the optical axis of the flexible cable 30. The backlash in the direction, that is, the up and down or left and right directions is less likely to occur. That is, the relay pipe 94 can be reliably supported by the flexible cable support portion 91 against bending in the vertical and horizontal directions. In addition, since the shielded wire 32E is soldered and fixed to the signal line holding cylinder 95, the signal line 32A pulls the signal line 32A generated when the flexible cable 30 is bent up and down or left and right. The force acting on the signal line 32A is less likely to act on the signal line 32A ahead of the soldered portion. Therefore, it is possible to prevent the signal line 32A and the recesses 71C, 72C, and 73C from being disconnected and disconnected.

  Next, a procedure for incorporating the imaging unit 40, the electrical unit 70, the connection unit 90, and the like into the outer casing 41 will be described.

  The outer casing 41, the imaging unit holding barrel 54, the shield tube 42, and the insulating tube 43 have a structure divided into right and left objects.

  Therefore, first, one half of each of the imaging unit holding barrel 54, the shield tube 42, and the insulating tube 43 is disposed with respect to the outer housing 41 of one half. Next, the lens barrel 51, the low-pass filter 53, and the illumination device 56 that are inserted into the cover frame 57 are incorporated into the half-side imaging unit holding barrel 54 disposed in the outer casing 41.

  Then, the substrate body 70 </ b> A of the electrical component 70 is disposed so as to overlap the half-side insulating tube 43. Prior to performing this arrangement, the electrical unit 70 placed on the insulating tube 43 is attached with the CCD 52 on the front side of the circuit board 71, and the flexible cable 30 is connected to the connection part as described above. 90 is connected.

Therefore, the electrical equipment is arranged such that the front surface of the CCD 52 comes into contact with the rear surface 54C of the convex wall 54B, and the rear end portion of the outer casing 41 comes into contact with the front surface of the step 91B of the flexible cable support 91. The portion 70 is disposed on the outer casing 41.

  As described above, in a state where the imaging unit 40, the electrical unit 70, the connection unit 90, and the like are incorporated in one half of the outer casing 41, the lens barrel 51 is imaged on the imaging surface of the CCD 52 by the lens barrel 51. Move to the position where it is in focus.

  Then, the remaining half on one side of the imaging unit holding cylinder 54 is attached to the other half on the other side and fixed to each other with an adhesive. Then, the lens barrel 55 is tightened to the lens barrel 51 side, and the lens barrel 51 is fixed between the imaging unit holding barrel 54 and the barrel screw 55 so that the lens barrel 51 does not move from the in-focus position with respect to the CCD 52. To.

  Next, the remaining half insulation pipe 43 and shield pipe 42 are attached to the other half half insulation pipe 43 and shield pipe 42 and fixed to each other with an adhesive. Finally, the other half of the outer lens barrel 41 is attached and fixed to the other outer lens barrel 41, and the assembly of the imaging device 40 is completed.

As described above, in the state where the electrical component 70 and the connecting portion 90 are disposed in the outer casing 41, the inner peripheral surface of the shield tube 42 and the outer peripheral edge of the annular plate 93A are in contact with each other. The circular plate 93A and the front end edge of the conical portion 94B of the relay pipe 94 are in contact with each other, and the metal portion of the relay pipe 94 and the shield line 32E of the signal line 32A are electrically connected via the signal line holding pipe 95. Therefore, the electrical component 70 and the signal line 32 </ b> A are shielded from the electrical component 70 to the flexible cable 32.

  The shield tube 42 and the metal portion of the relay tube 94 may be directly electrically connected without using the annular plate 93A. Further, the heat shrinkable tube 100 is covered from the rear side portion of the signal line holding tube 95 to the resin tube 32B. Thus, by covering the heat-shrinkable tube 100 over the signal line holding tube 95 and the resin tube 32B, stress applied to the signal line 32 when the signal line 32 is bent with respect to the signal line holding tube 95. Can be relaxed.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIG. In the embodiment, the description of the same configuration as that described in the first embodiment is omitted, and the same reference numerals as those in the first embodiment are used. Explanation will be made using the same reference numerals.

  In the first embodiment, the signal line 32A is supported on the support arm portion 93 via the signal line holding tube 95 and the relay tube 94, whereas in the second embodiment, the signal line holding tube 95 and The signal line 32 </ b> A is directly supported by the support arm portion 93 without using the relay tube 94.

  That is, the signal line 32A exposed from the resin tube 32B is directly passed through the hole 93E of the support arm 93 with the outer insulating coating 32F removed, and the shield line 32E of the signal line 32A passing through the hole 93E is passed. Then, solder and fix to the annular plate 93A. By this fixing, it is possible to suppress the movement of the signal line 32A in the optical axis direction and prevent the signal line 32A and the recesses 71C, 72C, and 73C from being disconnected and disconnected.

  That is, in the present embodiment, the support arm portion 93 functions as a support means, and the hole portion 93E functions as a support portion as in the first embodiment. The signal line 32A passed from the hole 93E to the front side of the annular plate 93A is connected to the recesses 71C, 72C, and 73C of the circuit boards 71, 72, and 73, as in the first embodiment. Similarly, the signal line 32Ae is connected to the circuit board 56B.

  According to the second embodiment, since the relay pipe 94 and the signal line holding pipe 95 are not used, the number of parts can be reduced, and the part cost of the apparatus can be reduced.

(Third embodiment)
Next, a third embodiment of the present invention will be described with reference to FIG. In the third embodiment, the description of the same configuration as that described in the first embodiment is omitted, and the same configuration as that in the first embodiment is used. The reference numerals will be described using the same reference numerals.

  The third embodiment is different from the first embodiment in the following points. That is, in the first embodiment, the signal line 32A is supported by the support arm portion 93I via the signal line holding tube 95 and the relay tube 94, whereas the third embodiment is configured by the relay tube. The signal line 32 </ b> A is supported on the support arm 93 via the signal line holding tube 95 without using 94.

  Each signal line 32A extending forward from the signal line holding tube 95 is stripped of the outer insulation coating 32F to expose the shield line 32E. The exposed shield wire 32E is folded back to the outer peripheral surface side of the signal line holding tube 95, soldered to the outer peripheral surface side, and sandwiched between the heat shrinkable tube 100 and the signal line holding tube 95. Fixed. The signal line holding tube 95 is inserted into a hole 93I provided at the center of the annular portion 93H of the support arm 93 together with the shield wire 32E folded back to the outer peripheral surface side of the signal line holding tube 95. At the portion where the signal line holding tube 95 is inserted into the hole 93I, the signal line holding tube 95 and the shield wire 32E are bonded and fixed to the support arm portion 93, or the signal line holding tube 95 is a hole together with the shield wire 32E. The signal line holding tube 95 and the shield line 32E are fixed and supported by the support arm portion 93 by being press-fitted into the portion 93I. That is, the signal line 32 </ b> A is supported with respect to the circuit board 73 at a position away from the circuit board 73.

  In the third embodiment, the signal line holding tube 95 and the support arm 93 function as support means. Instead of the annular plate 93A having the hole 93E in the support arm 93 in the first embodiment described above, the support arm 93 has a hole 93E serving as a support for supporting the signal line 32A separately. An annular plate 93H is provided.

  According to the third embodiment, since the signal line 32A is supported with respect to the circuit board 73 at a position away from the circuit board 73, it is possible to easily connect the signal line 32A to the circuit board 73. it can. Further, since the shield wire 32E is supported in a state of being fixed to the support arm portion 93, when the flexible cable 30 is bent up and down or left and right, a force that pulls the signal wire 32A backward acts. Even so, this force is unlikely to act on the signal line 32A ahead of the portion where the signal line holding tube 95 is inserted into the hole 93I. Therefore, it is possible to prevent the signal line 32A and the recesses 71C, 72C, and 73C from being disconnected and disconnected. Further, since the relay pipe 94 is not used, the number of parts can be reduced, and the cost of parts of the apparatus can be reduced. Since the signal line holding tube 95 does not need to be supported by the relay tube 94 as in the first embodiment, the step portions 95A and 95B are not formed.

  Further, by covering the heat shrinkable tube 100 from the rear side portion of the signal line holding tube 95 to the resin tube 32B, when the signal line 32 is bent with respect to the signal line holding tube 95, the signal line 32 is changed. It can relieve stress.

  The front end portion of the signal line holding tube 95 is configured to protrude forward of the hole 93I, and the shield wire 32E is soldered to the outer peripheral surface of the signal line holding tube 95 protruding from the hole 93I. Also good.

(Fourth embodiment)
Next, a fourth embodiment of the present invention will be described with reference to FIG. In the fourth embodiment, the description of the same configuration as that described in the first embodiment is omitted, and the same reference numerals as those in the first embodiment are used. Will be described using the same reference numerals.

  The fourth embodiment is a modification of the second embodiment. In the second embodiment, the signal line 32A from which the outer insulating coating 32F has been stripped is passed through the hole 93E, the shield line 32E is soldered to the support arm 93, and the signal line 32A is supported by the support arm. In the fourth embodiment, the signal line 32A with the inner insulating coating 32D exposed is only passed through the hole 93E of the support arm 93. The shield wire 32E is folded to the outer peripheral surface side of the signal line holding tube 95 and connected to the signal line holding tube 95 through which the signal line 32A passes by soldering, and the heat shrinkable tube 100 and the signal line holding tube 95 are connected to each other. It is sandwiched between and fixed.

  In the configuration of the fourth embodiment, the signal line 32A is not fixed with respect to the support arm portion 93 and can be moved in the front-rear direction. The part 93 has a sufficient support function to facilitate the work of connecting the signal line 32A to the circuit boards 71, 72, 73. The hole 93E also functions as a support that widens the interval between the signal lines 32A.

  In the first to fourth embodiments described above, two support pillars 93B are arranged in the vertical direction. However, the number of support pillars 93B is one, or three or three symmetrically about the center line of the annular plate 93A. You may make it arrange four. By providing three or four, the support of the support means 93 with respect to the circuit board 73 can be stabilized.

  In the first to third embodiments described above, since the support means formed of the conductive material is electrically connected to the shield wire 32E, the ground electrodes of the circuit boards 71, 72, 73 are supported. The means 93 may be used.

  The imaging apparatus and imaging system of the present invention can be applied to all optical devices that image human bodies and objects such as endoscopes and inspection cameras, and can be used in medical, monitoring, and inspection fields. .

1 is a configuration diagram illustrating an overall configuration of an imaging system according to a first embodiment of the present invention. It is the side view which made the cross section partially the internal structure of the imaging device used for the imaging system of FIG. It is the front perspective view made into the partial cross section which shows the internal structure of the imaging device used for the imaging system of FIG. It is the back perspective view made into the cross section partially which shows the internal structure of the imaging device used for the imaging system of FIG. It is the back perspective view made into the cross section partially which shows the structure of the principal part of the imaging device used for the imaging system of FIG. It is sectional drawing of a flexible cable which shows the structure of the flexible cable used for the imaging device which concerns on each embodiment of this invention. It is a disassembled perspective view which shows the structure of the board | substrate body in the imaging device used for the imaging system of FIG. It is the back perspective view made into the section partially showing the composition of the principal part of the imaging device concerning a 2nd embodiment of the present invention. It is the back perspective view made into the section partially showing the composition of the principal part of the imaging device concerning a 3rd embodiment of the present invention. It is the back perspective view made into the section partially showing the composition of the principal part of the imaging device concerning a 4th embodiment of the present invention.

DESCRIPTION OF SYMBOLS 10 ... Imaging system 20 ... Control apparatus 21 ... Monitor (display part)
30 ... Flexible cable 32A ... Signal line 40 ... Imaging device 51 ... Lens barrel (imaging optical system)
52 ... CCD (imaging device)
71, 72, 73 ... Circuit board 71C, 72C, 73C ... Recess 74, 75 ... Spacer member (insulating member)
74A, 75A ... Hole (void)
92 ... support means 93E ... hole (support part)

Claims (9)

An imaging optical system;
An image sensor that converts an optical image by the imaging optical system into an electrical signal and outputs the electrical signal;
A signal line bundle in which a plurality of signal lines for transmitting electrical signals to and from an external device are combined;
A circuit board to which these signal lines are connected;
In an imaging apparatus having
A support means for supporting the signal line with respect to the circuit board;
The support means is fixed to the circuit board and supports the signal line at a position away from the circuit board;
An imaging apparatus characterized by the above.   The imaging apparatus according to claim 1, wherein the support unit supports the signal line in a state of being fixed to the support unit.   The imaging apparatus according to claim 1, wherein the support unit includes a support unit that separately supports a plurality of the signal lines.   The imaging apparatus according to claim 3, wherein the signal line is fixed at the support portion. While disposing the imaging surface of the imaging device and the substrate surface of the circuit board so as to be orthogonal to the optical axis of the imaging optical system,
The imaging apparatus according to claim 3 or 4, wherein the support portions are also arranged in a circular shape on a plane orthogonal to the optical axis of the imaging optical system.   The imaging apparatus according to claim 5, wherein the connection portion of the circuit board with the signal line and the support portion are disposed at positions facing each other in the optical axis direction.   The imaging apparatus according to claim 3, wherein a gap is provided between the support portion and the circuit board. While having the imaging device of any one of Claims 1-7,
An imaging system comprising: a control device connected to the signal line of the imaging device and having a control unit that controls the imaging device.   The imaging system according to claim 8, wherein the control device includes a display unit that displays an image captured by the imaging device.

Images