JP4559183B2 - Tape bonding device - Google Patents

Description

  The present invention relates to a tape bonding apparatus and a tape bonding method for bonding a tape member to a workpiece.

  In the semiconductor manufacturing process, a circuit pattern is formed on the surface of a semiconductor wafer (hereinafter referred to as a wafer), and then the back surface of the wafer is polished to reduce the thickness, thereby reducing the size and thickness of the formed semiconductor chip. There are things to do. In addition, a chemical etching process may be performed using a chemical solution to perform a manufacturing process for reducing the thickness of the wafer.

  In this manufacturing process, an adhesive protective tape (hereinafter referred to as a tape member) is attached to the wafer surface. As a result, the wafer surface is prevented from being contaminated, and the wafer surface is scratched to prevent the circuit from being damaged.

  There exists a thing of patent document 1 as a tape bonding apparatus which adhere | attaches a tape member on such a wafer surface. In the tape bonding apparatus described in Patent Document 1, the room on the upper lid side is switched to atmospheric pressure from the state where both the room on the main body side and the room on the upper lid side are evacuated. Thereby, a differential pressure is generated between the chamber on the upper lid side and the room on the main body side, and the rubber sheet swells in the room on the main body side by the differential pressure. The bulge causes the rubber sheet to press the tape member, thereby bonding the tape member to the workpiece.

  Moreover, there exists a thing of patent document 2 as another sticking apparatus. In the thing of this patent document 2, using the differential pressure | voltage between a 1st vacuum chamber and a 2nd vacuum chamber, the center part of a base with high smoothness is bent toward the tape member side. Yes. At the same time, the wafer is lifted by driving the lifting device while pressing a base having a bent central portion against a tape member affixed to the wafer. By doing so, the tape member is bonded to the wafer while air is pushed outward from the center side of the tape member.

Japanese Patent Laid-Open No. 2003-7808 (see paragraph number 0007, FIGS. 2 to 4) Japanese Unexamined Patent Publication No. 2000-349047 (summary, see FIGS. 1 to 5)

  The configuration described in Patent Document 1 described above remains at the idea level, and the configuration is not specific. Therefore, various problems arise when actually trying to implement based on such a configuration. For example, in the configuration described in Patent Document 1, since the rubber sheet is located at the upper part, it is necessary to considerably increase the tension when the rubber sheet is stretched in order to remove the slack due to the weight of the rubber sheet. For this reason, it has the subject that the attachment operation | work of a rubber sheet becomes difficult.

  In particular, in order to efficiently bond the tape member, at the initial position where the operation of bonding the tape member to the wafer is started, there is a gap between the tape member in contact with the rubber sheet and the wafer. Usually small. If the rubber sheet is slack in a state where the gap is small, there may be a problem that the tape member adheres to the wafer and bubbles enter the adhesion surface from the stage before vacuum suction.

  Further, in the configuration described in Patent Document 1, a plurality of push screws are provided, and it is necessary to rotate all of these push screws. When it is necessary to rotate the push screws simultaneously, it is a difficult task. Furthermore, in the configuration described in Patent Document 1, it is necessary to install a tape member and a wafer with the upper lid removed. For this reason, it takes extra man-hours.

  Further, in the configuration described in Patent Document 2, a tape member to which a wafer is attached by bending a base such as a glass plate using a differential pressure between the first vacuum chamber and the second vacuum chamber. The base is bonded to the tape, and the tape member and the base to which the wafer is further attached are lifted from the bonded state. For this reason, it has a two-step bonding process, which takes time and is not preferable in terms of cost.

  Moreover, in the tape bonding apparatus disclosed in Patent Documents 1 and 2 described above, the configuration for heating the tape member is not disclosed. However, when affixing the tape member to the wafer, there is an advantage that the adhesive layer of the tape member can be softened by heating so that the adhesive layer can enter the gaps between the concaves and convexes and the adhesiveness is improved. ,preferable. For this purpose, the tape bonding apparatus includes a heater.

  However, in the configuration employing the rubber sheet as in the tape bonding apparatus disclosed in Patent Documents 1 and 2 described above, the rubber sheet is disposed at the location where the heater is disposed due to the heat resistance of the rubber sheet. It will be limited to the upper side on the opposite side to the side where it is. In that case, since the tape member is heated before the wafer, the tape member in the stretched state is not preferable because it is dripped by heat.

  Furthermore, in order to further improve the adhesion between the tape member and the wafer, it is conceivable to apply pressure. However, the tape bonding apparatus disclosed in Patent Documents 1 and 2 described above does not disclose a configuration for pressurizing both the tape member and the wafer after bonding. In particular, when a rubber sheet is used, means for preventing expansion of the rubber sheet due to pressurization is required, and the apparatus configuration may be further complicated.

  The present invention has been made on the basis of the above-mentioned circumstances. The object of the present invention is to satisfactorily bond the tape member to the work and to perform heating and pressurizing treatment, thereby improving the adhesive strength. It is an object of the present invention to provide a tape bonding apparatus and a tape bonding method that can be used.

In another aspect of the invention, in the tape bonding apparatus for bonding the tape member to the work, the placing means for placing the work, the placing means, and the work placed on the placing means are inherently included. A pressure chamber capable of closing the inside in a sealed state, a moving means for moving the mounting means toward the normal direction of the work, and a pressure chamber provided inside the pressure chamber and spaced apart from the work in the normal direction. A tape holding means for holding the tape member at the site; a suction means for vacuum suctioning the inside of the pressure chamber; a pressure means for introducing air into the pressure chamber in a pressurized state; and a placement means. A heating means for heating the workpiece, a suction means, a pressurizing means, a control means for controlling the operation of the moving means and the heating means, a main body portion having a concave fitting portion, and a main body portion that can be opened and closed. With recess And while anda lid portion having a rotating lid provided rotatably with respect to open has a fixed cover and fixing the cover relative to the body portion abuts against the main body, the control means Operates the suction means to perform vacuum suction of the pressure chamber, and after the vacuum suction, operates the moving means to move the work toward the tape member to adhere the work to the tape member. After the members are bonded, the pressurizing means is operated to introduce air into the pressure chamber in a pressurized state, and when the lid is closed with respect to the main body, the gap between the lid and the main body A seal member that hermetically closes the cover is provided at the boundary between the lid body and the main body, and the sliding portion of the moving means extends through the hole into the pressure chamber and slides. A sealing member that hermetically seals the gap between the hole and the hole is provided. In addition, in the closed state of the lid portion, a pressure chamber is formed which is sealed by the seal member and the sealing member and includes a concave fitting portion and a concave portion, and is rotated between the main body portion and the rotary lid. A cam mechanism that can be engaged and disengaged by rotation of the lid is provided, and the presence of this cam mechanism enables the lid body portion to be locked with respect to the main body portion .

In this case, the work is placed on the placing means, and the tape holding means is held by the tape holding means. When the suction means is operated in this state and the pressure chamber is vacuum-sucked, the pressure inside the pressure chamber is reduced, and a state close to vacuum is obtained. In this state, when the moving means is operated and the placing means is moved toward the work, the work is bonded to the tape member. In this case, the heating means is activated to heat the workpiece via the placement means. Then, a tape member (especially adhesive layer) becomes flexible and it becomes possible to improve the adhesiveness between a workpiece | work and mounting means. Then, if a pressurization means is operated and the pressure of a pressure chamber is raised, crimping | compression-bonding will be performed between a workpiece | work and a tape member. As a result, a minute gap between the workpiece and the tape member to which the bonding is performed can be crushed, and the adhesion can be further improved.
For this reason, for example, even when unevenness is generated on the surface of the workpiece, the tape member is softened by heating with the heating means and then pressed with the pressurizing means, so that the tape member is impressed against the workpiece according to the unevenness. Can be glued. Thereby, adhesiveness can be improved further.
Further, the operation of the suction means is started by the operation control by the control means, and the vacuum suction of the pressure chamber is performed. Then, after the vacuum suction, the moving means is operated by the operation control by the control means, and the work is moved toward the tape member. Thereby, a workpiece | work can be adhere | attached with respect to a tape member. In addition, after the tape member is bonded, the pressurizing means is operated to perform pressure bonding between the workpiece and the tape member, and the adhesiveness of the tape member to the workpiece can be improved.
Moreover, when comprised in this way, a cover body part can be opened and closed with respect to a main-body part. If it does in this way, installation of a workpiece | work and a tape member and taking out of the workpiece | work in the state to which the tape member was adhere | attached can be easily performed by opening and closing of a cover body part. In addition, the presence of the sealing member can airtightly close the space between the lid body portion and the main body portion. In this case, the gap between the sliding portion and the hole portion of the moving means is sealed by the sealing member. For this reason, when the suction means and the pressurizing means are operated, the inside of the pressure chamber can be vacuumed and pressurized. In addition, when the lid portion is closed with respect to the main body portion, a pressure chamber is formed between the lid body portion and the main body portion due to the presence of the recessed fitting portion and the concave portion.
Further, in such a configuration, when the rotating lid is rotated with respect to the fixed lid, the cam mechanism is engaged / disengaged. Accordingly, the lid portion can be easily locked with respect to the main body portion, and the lid portion can resist the pressure during pressurization.

  Further, according to another invention, in addition to the above-described invention, the control means heats the workpiece in advance by operating the heating means prior to vacuum suction of the pressure chamber by the suction means.

  In such a configuration, when the rotary lid is rotated with respect to the fixed lid, the cam mechanism is engaged and disengaged. Accordingly, the lid portion can be easily locked with respect to the main body portion, and the lid portion can resist the pressure during pressurization.

  In another invention, in addition to the above-mentioned invention, the heating means further includes a rubber heater. When comprised in this way, a workpiece | work can be heated in planar shape and it becomes possible to heat a workpiece | work uniformly. Thereby, the workpiece can be uniformly bonded to the tape member.

  According to another aspect of the present invention, there is provided a tape adhering method for adhering a tape member to a work, a heating step of heating the placing means for placing the work by the heating means, The suction chamber in which the mounting means and the workpiece are contained and the inside of the pressure chamber can be closed in a sealed state is vacuumed using the suction means, and the pressure chamber reaches the set vacuum level by the suction process. After detecting that the degree of vacuum set by the vacuum degree detection step and the degree of vacuum set by the vacuum degree detection step has been detected, the moving means for moving the mounting means toward the normal direction of the workpiece is activated. And, after the workpiece is brought close to the tape member and the workpiece is bonded to the tape member, and the bonding in the bonding step is performed for a preset time, the pressure means is operated to perform pressure. Pressurizing the pressure introducing air under pressure into the interior of, those having a.

  In the case of such a configuration, in the heating step, the placing means for placing the workpiece is heated in advance. In the suction step, the pressure chamber is vacuum-sucked by the suction means while the work is placed on the placement means. Further, in the vacuum reach detection step, it is detected whether or not the pressure chamber has reached the set pressure, and after detecting that the set pressure has been reached, in the bonding step, the placement means is moved by the moving means. Is operated, the work is brought close to the tape member, and the work is adhered to the tape member. Subsequently, in the pressurizing step, the pressurizing means is operated to introduce air into the pressure chamber in a pressurized state.

  In this case, since the heating means is activated and the workpiece is heated via the placing means, the tape member (particularly, the adhesive layer) becomes flexible, and the adhesion between the workpiece and the placing means is improved. Is possible. Then, if a pressurizing means is operated and the pressure in the pressure chamber is increased, a minute gap between the work and the tape member to which the adhesion is made can be crushed. For this reason, for example, even when unevenness is generated on the surface of the workpiece, the tape member is softened by heating with the heating means, and then pressurizing with the pressurizing means, whereby pressure bonding is performed between the workpiece and the tape member. . Thereby, the tape member can be adhered to the work following the unevenness, and the adhesion can be further improved.

  According to the present invention, the tape member can be satisfactorily bonded to the workpiece, and heating and pressurizing processes can be performed. It is also possible to improve the adhesive strength.

  Hereinafter, a tape bonding apparatus 10 according to an embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a plan view of the main body 20 in a state where the lid 100 shown in FIG. 2 is seen through. FIG. 2 is a plan view showing a state where the lid 100 is closed and the rotary lid 120 is seen through in the tape bonding apparatus 10. FIG. 3 is a front view showing a state where a part of the internal structure of the tape bonding apparatus 10 is transmitted, and FIG. 4 is a side view of the same. Further, FIG. 5 is a schematic configuration diagram showing the exhaust system and the control system of the tape bonding apparatus 10 of FIG. 1 in a simplified manner.

  As shown in FIG. 1, the planar shape of the main body 20 is a square such as a substantially square. A plurality of (for example, four) support legs 21 (see FIG. 4) are attached to the bottom surface of the main body 20. Further, as shown in FIG. 3 and the like, the tape bonding apparatus 10 includes a main body portion 20 and a lid portion 100 that is provided so as to be rotatable with respect to the main body portion 20.

  As shown in FIGS. 3 to 5, a main body upper surface portion 22 that is close to and opposed to the lid body portion 100 is provided inside the main body portion 20. The main body upper surface portion 22 has a structure having an appropriate strength to receive pressure applied during vacuum suction (particularly, vertical load applied from the lid body 100 side) and pressure applied during pressurization. ing. In addition, the side wall and the bottom wall that support the main body 20 and are a part of the main body 20 have a strength that can sufficiently resist the pressure applied during vacuum suction.

  As shown in FIGS. 1 and 3 to 5, a seal ring 23 as a seal member is attached to the outer peripheral side of the main body upper surface portion 22. The seal ring 23 is an O-ring-shaped member and abuts on a ring abutment portion 113 of the lid body portion 100 described later. Thereby, the inside of the tape bonding apparatus 10 is sealed from the outside (atmosphere), and the inside of the tape bonding apparatus 10 can be vacuumed.

  In the present embodiment, an X ring 24 is further attached to the outer diameter side of the seal ring 23, and a configuration that further improves the sealing performance is adopted.

  Further, a frame installation portion 22a is provided in the main body upper surface portion 22 on the center side of the seal ring 23 (see FIG. 5). The frame installation part 22a is a part for installing a frame support member 27 described later. Note that the frame installation portion 22a has a sufficient thickness in order to prevent the frame installation portion 22a from bending upward even when the upper side (the lid portion 100 side) is sucked and exhausted.

  A concave fitting portion 25 is provided in a substantially central portion in the radial direction of the frame installation portion 22a. The recessed fitting portion 25 is a portion that is recessed downward from the frame installation portion 22a, and its planar shape is substantially circular. The wafer 11 as a workpiece is positioned in the recessed fitting portion 25 via a mounting plate 35, a wafer jig 61, and the like which will be described later. The wafer 11 can be moved up and down by driving a cylinder mechanism 30 as a moving means.

  In addition, a hole 26 is provided in the central portion of the recessed fitting portion 25. The hole portion 26 is provided so as to penetrate the recessed fitting portion 25. Moreover, in this Embodiment, while the hole part 26 is a circular hole, the enlarged diameter part 33 (piston 32) described below is penetrated by this hole part 26. As shown in FIG. Then, the outer peripheral surface (corresponding to the sliding portion) of the enlarged diameter portion 33 moves up and down along the hole portion 26, whereby the wafer 11 can be brought into contact with and separated from the tape member 12. In the following description, a space surrounded by the seal ring 23, the ring contact portion 113, the frame installation portion 22a, the enlarged diameter portion 33, the packing 34, and the like is referred to as a pressure chamber 50.

  Here, the configuration of the cylinder mechanism 30 will be described. The cylinder mechanism 30 has a piston 32 inserted through the cylinder 31 and moves the piston 32 up and down by the action of air pressure, for example, by introducing air into the cylinder 31. In this case, an enlarged diameter portion 33 is provided on the upper end side of the piston 32 to block the hole portion 26 and stabilize the sliding. A packing 34 as a sealing member is attached to the outer peripheral side of the enlarged diameter portion 33. Therefore, the packing 34 is interposed between the outer peripheral surface of the enlarged diameter portion 33 and the inner peripheral surface of the hole portion 26, and the pressure in the pressure chamber 50 can be maintained.

  The enlarged diameter portion 33 can reciprocate through the hole portion 26 in the same manner as the piston 32. For this reason, you may make it include the enlarged diameter part 33 in the piston 32. FIG.

  A support plate 40 is provided inside the main body 20. The support plate 40 is supported by a plurality of (four in this embodiment) support columns 41 that are fixed to the main body upper surface portion 22 with, for example, screws or bolts. The bottom portion of the cylinder 31 is attached to the support plate 40. Further, the cylinder mechanism 30 is not limited to one that is operated by air pressure, and may be one that is operated by other methods such as hydraulic pressure.

  In addition, a disc-shaped mounting plate 35 (corresponding to the mounting means) is attached to the upper end portion of the enlarged diameter portion 33. A recess 36 is provided on the upper surface of the mounting plate 35, and a rubber heater 60 as a heating means is fitted in the recess 36. The rubber heater 60 is a heater that includes a planar member and can be heated in a planar shape. In the present embodiment, the rubber heater 60 is provided in a disk shape that fits into the recess 36, for example.

  Further, a wafer jig 61 as a work fixing jig is attached to the upper surface of the attachment plate 35 so as to cover the upper surface side of the attachment plate 35. The wafer jig 61 is a disk-shaped thin plate member made of, for example, aluminum or an aluminum alloy, and is heated by the rubber heater 60. As shown in FIG. 7, the wafer jig 61 is provided with positioning portions 62 at a plurality of locations (four locations in the present embodiment). The positioning portion 62 is formed by cutting the wafer jig 61 into, for example, a substantially triangular shape. A pin member 61 a is located at the positioning portion 62. Thereby, the circumferential positioning of the wafer jig 61 is performed.

  A pin hole 63 is provided on the upper surface of the wafer jig 61. The pin member 61 b is inserted into the pin hole 63. For example, two pin holes 63 are arranged side by side on one side in the radial direction of the wafer jig 61. Accordingly, when the pin member 61 b is inserted into the pin hole 63, the inserted pin member 61 b comes into contact with the orientation flat 11 a of the wafer 11, and the pin member 61 a positioned at the positioning portion 62 is also on the outer peripheral portion of the wafer 11. Abut. Thereby, the wafer 11 is positioned with respect to the wafer jig 61.

  A rubber sheet 64 is installed on the wafer jig 61. The rubber sheet 64 has substantially the same shape as the wafer 11. Since the rubber sheet 64 is interposed between the wafer jig 61 and the wafer 11, even when the wafer jig 61 has irregularities, the irregularities can be absorbed. Further, a separate plate member or the like may be interposed between the wafer jig 61 and the mounting plate 35. Further, a non-adhesive coating is applied to the outer peripheral portion of the wafer jig 61 so as to reduce the adhesive force to the tape member 12. For this reason, even if the outer peripheral portion of the wafer jig 61 comes into contact with the tape member 12, the tape member 12 and the wafer jig 61 do not adhere to each other, and it is possible to omit extra work such as peeling. .

  Also, as shown in FIGS. 5 and 6, a frame support member 27 is attached to the frame installation portion 22a. The frame support member 27 has, for example, a ring shape. The frame support member 27 is provided with a plurality of insertion holes 27a (see FIG. 6), and pin members 28 are inserted into the insertion holes 27a. Accordingly, the pin member 28 can protrude upward from the frame support member 27.

  In the present embodiment, the tape bonding apparatus 10 can attach the tape member 12 to the wafer 11 having various diameters such as 5 inches, 6 inches, and 8 inches. For this reason, the frame support member 27 has insertion holes 27a corresponding to the size in order to support the tape frame 70 having a size corresponding to the attachment of the tape member 12 to the wafer 11 of various diameters. A plurality are provided.

  As shown in FIG. 7, there are two types of pin members 28, a pin member 28 a for receiving and supporting the tape frame 70, and a pin member 28 b that serves to prevent the tape frame 70 from rotating. To do. Among these, the pin member 28b which plays the role of rotation prevention protrudes longer upward than the pin member 28a. The pin member 28 b is located in the notch 72 of the tape frame 70 and prevents the tape frame 70 from rotating.

  As shown in FIG. 7, the frame support member 27 is provided with a tape frame 70 as tape holding means. The tape frame 70 is capable of tensioning the tape member 12 on its upper surface, and the appearance thereof is provided in a substantially ring shape in order to stretch the tape member 12 on the circular wafer 11. Further, an insertion hole 71 through which a wafer jig 61 and the like can be inserted is provided in the central portion of the tape frame 70. By passing the wafer jig 61 and the wafer 11 through the insertion hole 71, the wafer 11 can come into contact with the tape member 12 stretched on the tape frame 70.

  A plurality of (two in the present embodiment) cutout portions 72 are provided on the outer peripheral portion of the tape frame 70 by cutting out the tape frame 70. A pin member 28 b to be inserted into the insertion hole 27 a of the frame support member 27 is located in the notch 72. Therefore, the tape frame 70 is positioned in the circumferential direction, and the rotation of the tape frame 70 is prevented.

  In the present embodiment, the diameter of the wafer 11 mounted on the upper surface of the wafer jig 61 via the rubber sheet 64 is 6 inches. However, the size of the wafer 11 is not particularly limited, and may be other sizes such as 5 inches, 8 inches, and 12 inches. When the size of the wafer 11 is changed, the sizes of other members such as the wafer jig 61, the rubber sheet 64, and the tape frame 70 are also changed accordingly. However, a tape frame 70 such as an 8-inch wafer may be used for bonding the 6-inch wafer 11. Moreover, in this Embodiment, while the shape of the notch part 72 differs, the diameter of the pin member 28b differs. Thereby, the attachment position in the circumferential direction of the tape frame 70 is uniquely determined.

  Further, as shown in FIG. 5, in order to vacuum suction / pressurize the pressure chamber 50, an end portion side of the air duct 80 is disposed inside the pressure chamber 50. One end portion 80a of the air duct 80 is branched into four (FIG. 5 shows only two because of the cross-sectional view). And the opening part 81 of each branched air pipe 80 exists in the inside of the pressure chamber 50, as shown in FIG. In the present embodiment, the openings 81 are arranged at intervals of approximately 90 degrees in the plan view shown in FIG. The opening 81 is a frame installation portion 22 a on the inner side of the seal ring 23 and exists between the frame support member 27 and the seal ring 23. However, the position of the opening 81 is not limited to this part, and may be provided in the lid 100, for example.

  Further, the air duct 80 passes through the frame installation portion 22a, and merges into one collecting pipe 82 from a branched state below the main body 20 or outside the main body 20 (see FIG. 5). ). Further, one end side of the pump pipe 83 is connected to the collecting pipe 82. The other end of the pump pipe 83 is connected to a vacuum pump 84, and the inside of the pressure chamber 50 can be vacuumed by the operation of the vacuum pump 84. A first valve member 85 is provided in the middle of the pump pipe 83. The first valve member 85 can be switched between open / closed, and can also be switched to the protruding tube portion 85a side (switching to the atmosphere introduction side) in FIG. As the first valve member 85, for example, an electromagnetic valve that can be opened and closed by a solenoid can be used, but a system that uses other drive sources such as a motor may be used.

  Further, one end side of the compressor pipe 86 is also connected to the collecting pipe 82. The other end side of the compressor pipe 86 is connected to the compressor 87, and the inside of the pressure chamber 50 can be pressurized by the operation of the compressor 87. A second valve member 88 similar to the first valve member 85 is provided in the middle of the compressor pipe 86. The second valve member 88 can also be switched between open / closed, and can be switched to the protruding tube portion 88a side (switching to the atmosphere introduction side) in FIG. The second valve member 88 can also be opened and closed by a drive source such as an electromagnetic valve or a motor.

  In the present embodiment, as described above, the vacuum pump 84 and the compressor 87 are provided separately, and these are operated to enable vacuum suction or pressurization of the pressure chamber 50. . However, when vacuum suction and pressurization are possible with only one pump, the single pump may be provided instead of the vacuum pump 84 and the compressor 87. In the present embodiment, the first valve member 85 and the second valve member 88 are three-way valves that can be switched to the atmosphere introduction side. However, the first valve member 85 and the second valve member 88 may be not a three-way valve but a valve member that can be simply switched between open and closed.

  The vacuum pump 84, the air pipe 80, the collecting pipe 82, the pump pipe 83, the first valve member 85, and the like constitute suction means. Further, the compressor 87, the air pipe 80, the collecting pipe 82, the compressor pipe 86 and the second valve member 88 constitute a pressurizing means.

  The cylinder mechanism 30, the vacuum pump 84, the first valve member 85, the compressor 87, the second valve member 88, the pressure gauge 91 and the sensor 92 described later are connected to the control device 90, and the control It operates after receiving a signal corresponding to the control command from the device 90. The control device 90 is connected to an operation button (not shown) for performing an ON operation. For this reason, when the operator presses the operation button in the closed state of the lid portion 100 that permits the ON operation of the sensor 92 described later, the vacuum pump 84 is activated.

  Here, the control device 90 as the control means first switches the first valve member 85 to the open side (the side communicating with the vacuum pump 84) and switches the second valve member 88 to the closed side. maintain. Along with this state, the vacuum pump 84 is operated. Thereby, the inside of the pressure chamber 50 can be vacuumed first.

  Further, the control device 90 operates the cylinder mechanism 30 after the vacuum suction, and when it is determined that the operator's button operation or a specified time has elapsed, the first valve member 85 is now closed. And the second valve member 88 is switched to the open side (the side communicating with the compressor 87). After this switching, the compressor 87 is operated. Thereby, it is possible to pressurize the inside of the pressure chamber 50 this time.

  An example of the above-mentioned predetermined degree of vacuum is about 20 Pa. An example of the pressure in the pressure chamber 50 when pressurizing is about 0.6 MPa. However, the predetermined degree of vacuum and the predetermined pressure during pressurization are not limited to this. In addition, the controller 90 issues a control command to the vacuum pump 84 so as to stop the vacuum pump 84 together with the operation of switching the first valve member 85 to the atmosphere introduction side after the bonding is completed. It may be configured.

  Further, in the present embodiment, a pressure gauge 91 is attached. In the present embodiment, two pressure gauges 91 are provided. One of the pressure gauges 91 is for measuring the pressure inside the pressure chamber 50 (hereinafter referred to as a pressure gauge 91a as necessary). The other one of the pressure gauges 91 is for measuring the internal pressure of the cylinder mechanism 30 that moves up and down (hereinafter referred to as a pressure gauge 91b as necessary). The two pressure gauges 91a and 91b are also connected to the control device 90.

  Further, a sensor 92 is provided in a portion of the main body upper surface portion 22 that is close to the lid body portion 100. The sensor 92 uses, for example, a magnetic sensor, and detects whether or not the lid body portion 100 is closed until it approaches the main body portion 20 by a predetermined distance. The sensor 92 is also connected to the control device 90 and transmits a detection signal indicating whether or not the lid 100 is closed to the control device 90. And the control apparatus 90 transmits the signal corresponding to an action | operation with respect to the vacuum pump 84 etc., only when the detection signal corresponding to the state which the cover body part 100 is closed is received.

  A plurality of (four in this embodiment) cam blocks 93 are attached to a portion of the main body upper surface portion 22 on the outer diameter side of the seal ring 23. The cam block 93 has a structure in which a metal block-shaped member is cut out so as to be concave from one side surface, and the cut-out portion serves as a guide groove 94. The guide groove 94 is provided with the lid 100 side opened. Moreover, the upper end surface 94a of the guide groove 94 has a taper part which inclines gradually downward as it goes to the other end side from the one end side. Therefore, when a guide roller 125 (to be described later) is inserted into the guide groove 94 and a handle 130 (to be described later) is gripped and rotated, the lid 100 can be pressed against the upper surface 22 of the main body. The cam block 93 and the guide roller 125 constitute a cam mechanism.

  Next, the configuration of the lid 100 will be described. As shown in FIGS. 3 to 5, the lid body 100 includes a fixed lid 110, a rotary lid 120, and a handle 130 as main components. Among these, the fixed lid 110 is connected to the main body portion 20 via a hinge 111. That is, the fixed lid 110 is rotatable with the hinge 111 as a fulcrum. As shown in FIG. 2, one end side 112 a of the support member 112 is attached to the fixed lid 110. Further, the other end side 112 b of the support member 112 is attached to the main body upper surface portion 22. The support member 112 can maintain a state in which the fixed lid 110 is open to the main body 20.

  As shown in FIGS. 3 to 5, a portion of the fixed lid 110 that contacts the seal ring 23 of the main body 20 is a ring contact portion 113. The ring contact portion 113 seals the pressure chamber 50 by contact with the seal ring 23. In addition, in order to make this sealing favorable, the ring contact part 113 is comprised from the flat part which makes the same plane in this Embodiment.

  As shown in FIGS. 3 to 5, a recessed portion 114 is formed in a portion of the fixed lid 110 facing the main body portion 20, which is on the inner diameter side of the ring contact portion 113. The concave portion 114 is formed in a state of being recessed upward from the ring contact portion 113. The recess 114 has a size corresponding to the above-described frame installation portion 22a. For this reason, when the fixed lid 110 is closed and the seal ring 23 comes into a sealed state in which the seal ring 23 comes into contact with the ring contact portion 113, it is surrounded by the recess 114, the seal ring 23, the frame installation portion 22a, the piston 32, the packing 34, and the like. Space appears. This space becomes the pressure chamber 50.

  Further, as shown in FIG. 5, a rail body 115 is attached to the upper surface side and the outer peripheral side of the fixed lid 110. The rail body 115 is provided without interruption in the circumferential direction, and is provided with a pointed shape that tapers toward the distal end side on the outer diameter side. The rail body 115 is engaged with a guide wheel 122 described later.

  A rotating lid 120 is attached to the upper surface side of the fixed lid 110. The rotary lid 120 is provided to be rotatable with respect to the fixed lid 110 via a rotation shaft (not shown). Moreover, the contact area with respect to the fixed lid | cover 110 is provided large so that the movement to an up-down direction (especially downward) may be controlled. A plurality (six in this embodiment) of rotating shafts 121 are attached to the rotating lid 120 on the outer diameter side thereof. The rotary shaft 121 is provided so as to penetrate the rotary lid 120, and is provided so as to protrude toward the lower side of the lid rotary lid 120. The rotating shaft 121 is disposed on the outer diameter side of the rail body 115 and close to the rail body 115. Note that the lower end portion of the rotating shaft 121 is not in contact with the fixed lid 110.

  Guide wheels 122 are rotatably attached to the rotating shaft 121. Each guide wheel 122 has a groove 122a engaged (contacted) with the rail body 115 described above. Thereby, the rotation of the rotary lid 120 can be guided. Further, on the upper surface and the outer diameter side of the rotating lid 120, a protruding member 123 that protrudes upward and has the circumferential direction of the rotating lid 120 as a longitudinal direction is attached. A support shaft 124 is attached to the protruding member 123 so as to face the outer diameter side. A total of two support shafts 124 are attached to each end of the protruding member 123 in the longitudinal direction. Further, a guide roller 125 as a cam follower is attached to an end portion on the outer diameter side of the support shaft 124. The guide roller 125 enters the guide groove 94 described above.

  Here, the guide roller 125 contacts the upper end surface 94 a of the guide groove 94. In this case, the guide roller 125 is initially positioned on the inlet side of the tapered portion that is separated from the lower portion of the upper end surface 94a. However, after the vacuum pump 84 is operated and vacuum suction is performed, the lid 120 is drawn toward the main body 20 by the vacuum suction force and slightly sinks. Thereby, the contact state between the guide roller 125 and the upper end surface 94a is released or brought into a slight contact state. Therefore, the operator can easily rotate the rotary lid 120, rotate the guide roller 125 from one end side (entrance side) to the other end side, and move the guide roller 125 to the end side of the tapered portion. It becomes possible to position. Thereby, the lid 100 can be locked.

  A handle 130 is attached to the upper surface side of the rotary lid 120. The handle 130 is fixedly provided with respect to the rotary lid 120. The handle 130 is attached to the rotary lid 120 and has an attachment shaft 131 that extends upward. A grip 132 is provided on the attachment shaft 131 on one side and the other side in the outer diameter direction. Stretched toward. Therefore, if the operator grips the grip portion 132 and rotates the rotary lid 120, the guide roller 125 is inserted from one end side of the guide groove 94, and after the vacuum suction of the vacuum pump 84, the guide roller 125 is moved to the other end. It can be rotated toward the side.

  A plurality (three in this embodiment) of handles 140 are attached to the main body upper surface portion 22. Therefore, the operator can hold the handle 140 and move the tape bonding apparatus 10.

  The operation (operation) of the tape bonding apparatus 10 having the above configuration will be described below. This action (operation) is executed based on the operation flow shown in FIG.

  First, the operator opens the lid 100 and attaches the wafer jig 61 to the attachment plate 35. Along with this attachment, the wafer 11 is placed on the wafer jig 61 (step S10). Subsequently, the operator attaches the tape member 12 to the tape frame 70 and places / fixes the tape frame 70 on the frame support member 27 (step S11). Further, before and after such mounting, the rubber heater 60 is operated so that the wafer 11 can be heated (step S12; corresponding to the heating step). Thereby, after the wafer 11 is placed, the wafer 11 is heated to a predetermined temperature (in this embodiment, within a range of 40 to 60 degrees, preferably about 50 degrees).

  Next, the operator lowers the lid body portion 100 to close the lid body portion 100 (step S13). When the operator presses the operation button of the vacuum pump 84, the control device 90 determines whether or not a detection signal from the sensor 92 is received when the lid 100 is in the closed state (step). S14). In this determination, when it is determined that the detection signal in the closed state is received (in the case of Yes), the first valve member 85 is opened and the second valve member 88 is closed. The state is switched (step S15). Further, when it is determined that the control device 90 has not received the detection signal from the sensor 92 in the closed state (in the case of No), the process returns to step S14 again to determine whether the detection signal has been received. Continue judgment.

  Following this switching, the control device 90 operates the vacuum pump 84 to start vacuum suction inside the pressure chamber 50 (step S16; corresponding to the suction process). In such an operation, the compressor 87 may be operated in order to shorten the initial startup time. In this case, the second valve member 88 is in a closed state with respect to the collecting pipe 82, but the compressor 87 communicates with the protruding pipe portion 88a and enters the atmosphere introduction state. However, when the start of the compressor 87 is fast, the compressor 87 may be stopped.

  Further, after vacuum suction, the operator holds the handle 130 and rotates the rotary lid 120, and causes the guide roller 125 to enter the guide groove 94 along the tapered portion (step S17). In this case, the lid 100 is slightly depressed toward the main body 20 by vacuum suction, so that the guide roller 125 can easily enter the guide groove 94. In the present embodiment, it is difficult to allow the guide roller 125 to enter the guide groove 94 when the pressure chamber 50 is not vacuumed.

  After the vacuum suction, the control device 90 determines whether or not it is detected that the pressure is equal to or lower than the specified pressure by detecting the pressure with the pressure gauge 91a (step S18; corresponding to the degree of vacuum detection process). When it is determined that the pressure is equal to or lower than the specified pressure, the cylinder mechanism 30 is operated to move the wafer 11 toward the tape member 12 (step S19; corresponding to the bonding step). Thus, when the wafer 11 is lifted by a predetermined amount, the wafer 11 comes into contact with the tape member 12 and the wafer 11 and the tape member 12 are bonded. In such bonding, since the wafer 11 is heated, the pressure-sensitive adhesive layer of the tape member 12 becomes flexible, and the adhesiveness is improved.

  When the adhesion between the wafer 11 and the tape member 12 elapses for a predetermined time, the control device 90 subsequently switches the first valve member 85 to the closed state and switches the second valve member 88 to the open state ( Step S20). Following this switching, the control device 90 operates the compressor 87 (step S21; corresponding to the pressurizing step). In this operation, the vacuum pump 84 may also be operated to shorten the initial startup time. In this case, the first valve member 85 is in a closed state with respect to the collecting pipe 82, but the vacuum pump 84 and the protruding pipe portion 85a communicate with each other so as to be in the atmosphere introduction state. However, when the startup time until the vacuum pump 84 reaches a predetermined pressure is short, the vacuum pump 84 may be stopped.

  Then, pressurization inside the pressure chamber 50 is started. After the pressurization, the control device 90 determines whether or not the specified pressure has been reached by detecting the pressure with the pressure gauge 91a (step S22). When it is determined that the prescribed pressure has been reached (in the case of Yes), the control device 90 stops the operation of the compressor 87. And if the 1st valve member 85, the 2nd valve member 88, or the open valve not shown is switched to the atmosphere introduction side, the inside of the pressure chamber 50 will become atmospheric pressure, and the above-mentioned pressurization state will be canceled ( Step S23). Here, when it takes time until the compressor 87 reaches a predetermined pressure, the operation may be continued without stopping the operation of the compressor 87 as described above.

  Thereafter, the operator holds the handle 130, rotates the rotary lid 120 in the direction opposite to that at the time of locking, and removes the guide roller 125 from the guide groove 94 (step S24). Thereby, the locked state of the lid body 100 is released. Next, the operator opens the lid portion 100 and takes out the wafer 11 with the tape member 12 bonded (step S25). As described above, the bonding of the tape member 12 to the upper surface of the wafer 11 is completed.

  In addition, after the adhesion of the tape member 12 to the upper surface of the wafer 11 is completed, the process proceeds to the next step such as a dicing process.

  According to the tape bonding apparatus 10 having such a configuration, the wafer 11 is bonded to the tape member 12 after the pressure chamber 50 is vacuumed. For this reason, air can be prevented from entering between the wafer 11 and the tape member 12, and the adhesive force (adhesion degree) of both can be increased.

  Further, since heating is performed by the rubber heater 60, for example, even when a narrow gap is generated between the electronic components, the adhesive layer of the tape member 12 is deformed and enters the narrow gap. It becomes possible to make it. Here, when a roller or the like is used, the tape member 12 cannot enter the narrow gap. However, as described above, by using the rubber heater 60 to soften the adhesive layer of the tape member 12 and pressurizing the inside of the pressure chamber 50, the tape member 12 can be attached to a narrow gap as described above. It becomes possible to get in well.

  Further, by pressurizing the pressure chamber 50, the tape member 12 is brought into close contact with the wafer 11 to improve the adhesion. For this reason, the surface of the wafer 11 is uneven, for example, an electronic component such as a semiconductor chip is mounted on the wafer 11 as compared with a configuration that improves adhesion by mechanical means such as a roller. Even in this case, there is an advantage that these electronic components can be prevented from being damaged. Further, by applying pressure, it is possible to perform pressure bonding to crush a minute gap between the wafer 11 and the tape member 12 that have already been bonded. Therefore, it is possible to further increase the adhesive strength between the two.

  Further, in the present embodiment, the control device 90 performs vacuum suction by the vacuum pump 84, followed by adhesion of the wafer 11 and the tape member 12 by the operation of the cylinder mechanism 30, and wafer 11 and the tape member by the operation of the compressor 87. The crimping | compression-bonding between 12 is performed sequentially. For this reason, the adhesiveness of the tape member 12 to the wafer 11 can be further enhanced. In the present embodiment, the wafer jig 61 is heated by the rubber heater 60 prior to the vacuum suction of the vacuum pump 84. For this reason, when the wafer 11 contacts the tape member 12, the wafer 11 is already heated. Thereby, the tape member 12 can be made flexible at the time of contact, and the adhesiveness between the wafer 11 and the tape member 12 can be further and reliably increased.

  Further, the presence of the seal ring 23 and the packing 34 enables the pressure chamber 50 to be reliably sealed from the outside, and the vacuum suction and pressurization of the pressure chamber 50 can be performed satisfactorily. Further, in the present embodiment, the lid body portion 100 is provided with a rotary lid 120, and a cam block 93 (guide groove 94) and a guide roller 125 are provided between the rotary lid 120 and the main body portion 20. The cam mechanism comprised from these is provided. For this reason, when the rotary lid 120 is rotated with respect to the fixed lid 110, the guide roller 125 is disengaged from the guide groove 94. Thereby, it becomes possible to easily lock the lid body portion 100 with respect to the main body portion 20, and the lid body portion 100 can be made to withstand pressure during pressurization.

  Here, if the operator holds the handle 130 after vacuum suction of the pressure chamber 50 and rotates the rotary lid 120, the guide roller 125 can easily enter the guide groove 94, and the operability is improved. improves.

  In the present embodiment, a rubber heater 60 is used as the heating means. For this reason, planar heating can be performed on the wafer 11, and the wafer 11 can be uniformly heated. Thereby, the wafer 11 can be uniformly bonded to the tape member 12.

  Further, in the present embodiment, the wafer 11 is placed on the mounting plate 35 via the wafer jig 61. For this reason, it is possible to prevent the positional deviation of the wafer 11. In particular, since the pin member 61 b is positioned on the orientation flat 11 a of the wafer 11, it is possible to prevent displacement of the wafer 11 in the circumferential direction. Further, a non-adhesive coating is applied to the outer peripheral side of the wafer jig 61. For this reason, even if the tape member 12 contacts the wafer jig 61, the tape member 12 can be prevented from adhering to the wafer jig 61, and the tape member 12 is peeled off from the wafer jig 61. Can be saved.

  Although one embodiment of the present invention has been described above, the present invention can be variously modified in addition to this. This will be described below.

  In the above-described embodiment, the wafer 11 is placed on the wafer jig 61 via the rubber sheet 64. However, the wafer 11 may be configured to be mounted / fixed using another method. An example of this is shown in FIGS.

  FIG. 10 is a plan view showing the configuration of the wafer ring 150, with the right half corresponding to a 6-inch wafer and the left half corresponding to an 8-inch wafer. The wafer ring 150 shown in FIG. 10 includes an outer peripheral portion 151 attached to the frame support member 27 and an inner diameter portion 152 located on the inner diameter side of the outer peripheral portion 151. The outer peripheral portion 151 is configured to protrude downward from the inner diameter portion 152. An insertion hole 153 is formed on the inner diameter side of the inner diameter portion 152. The insertion hole 153 has a size corresponding to the insertion of the wafer jig 160. Further, the inner diameter portion 152 is provided with a positioning portion 154 in which the inner diameter portion 152 is cut out from the insertion hole 153 toward the outer diameter side. The positioning portion 154 is a portion into which a positioning projection 163 described later is fitted.

  The outer peripheral portion 151 is provided with a plurality of attachment long holes 155. The long hole 155 is a portion for inserting attachment means such as the pin member 28, and allows the wafer ring 150 to be attached to the frame support member 27 via the pin member 28, for example.

  Further, the wafer jig 160 shown in FIG. 11 is attached to the mounting plate 35 and the like with the insertion hole 161 for inserting a pin member (not shown) for positioning the wafer 11 and the wafer jig 160. For example, a plurality of insertion holes 162 are provided. Of the insertion holes 161, the lower one in FIG. 11 contacts the orientation flat 11 a of the wafer 11. Thereby, the position of the wafer 11 in the circumferential direction is also determined. Further, on the wafer jig 160, a positioning protrusion 163 that fits into the positioning portion 154 described above protrudes outward in the radial direction by a predetermined length.

  In this configuration, the wafer jig 160 is attached to the attachment plate 35 while the wafer jig 160 is inserted through the wafer ring 150. In this case, since the positioning protrusion 163 and the positioning portion 154 are fitted, the position of the wafer jig 160 in the circumferential direction is determined. Thereby, since the position of the wafer jig 160 in the circumferential direction is also determined, the wafer 11 can be positioned reliably.

  In the above-described embodiment, the seal ring 23 is attached to the main body upper surface portion 22. However, the seal ring 23 may be attached to the lid portion 100 side. In such a configuration, a ring contact portion is provided on the upper surface portion 22 of the main body.

  In the above-described embodiment, the configuration using the tape frame 70 as the tape holding means has been described. However, the tape holding means is not limited to the tape frame 70. For example, a suction mechanism for sucking and holding the tape member 12 may be provided, and this may be used as a tape holding means.

  Moreover, as a control means, the control condition may be set beforehand, and the structure which can set a control condition arbitrarily on the operator side may be sufficient. Further, the sealing member and the sealing member may have any shape and configuration as long as the space between the main body 20 and the lid body 100 can be hermetically closed.

  In addition to the wafer 11, a glass substrate such as a liquid crystal, a special glass material, a glass substrate for organic EL, or the like may be employed as the workpiece. In the above-described embodiment, the atmosphere (air) is introduced after evacuation, but a state other than air, such as argon gas, may be introduced and pressurized.

  The tape member 12 is not limited to the above-described embodiment, and various materials may be used as long as they can be bonded to the surface of the workpiece, such as a UV curable tape, a polarizing film, a protective sheet, and a transparent electrode. Can do.

  Alternatively, a mechanism for cutting the tape member 12 after the tape member 12 is bonded to the wafer 11 or the glass substrate may be provided inside the tape bonding apparatus 10.

  The tape bonding apparatus and the tape bonding method of the present invention can be used in the manufacturing process of a semiconductor integrated circuit using a wafer and the manufacturing process of a liquid crystal display device using a liquid crystal. That is, it can be used in the semiconductor manufacturing industry. It can also be used in the display manufacturing industry using a glass substrate.

It is a figure which shows the structure of the tape bonding apparatus which concerns on the 1st Embodiment of this invention, and is a top view which sees through a cover body part in the state which has arrange | positioned the wafer on the rubber sheet. It is a figure which shows the structure of the tape bonding apparatus of FIG. 1, and is a top view which shows the state which closed the cover part. It is a figure which shows the structure of the tape bonding apparatus of FIG. 1, and is a front view which shows the state which looked through a part of internal structure while showing the state which closed the cover part. It is a figure which shows the structure of the tape bonding apparatus of FIG. 1, and is a side view which shows the state which looked through a part of internal structure while showing the state which closed the cover part. It is a schematic block diagram which simplifies and shows the state of the exhaust system and control system of the tape bonding apparatus of FIG. In the tape bonding apparatus of FIG. 1, it is a partial sectional side view which expands and shows the vicinity of the edge part of an attachment board among the structures holding a rubber sheet and a tape member. FIG. 2 is a plan view showing a shape of a wafer jig in the tape bonding apparatus of FIG. 1. FIG. 2 is a plan view showing a shape of a tape frame in the tape bonding apparatus of FIG. 1. It is a figure which shows the operation | movement flow at the time of adhere | attaching a tape member with respect to a wafer using the tape bonding apparatus of FIG. It is a top view which shows the shape of the ring for wafers regarding the example of a change of the attachment mode of a wafer among the tape bonding apparatuses of FIG. It is a top view which shows the shape of the jig | tool for wafers regarding the example of a change of the attachment mode of a wafer among the tape bonding apparatuses of FIG.

Explanation of symbols

10 ... Tape bonding device 11 ... Wafer
DESCRIPTION OF SYMBOLS 12 ... Tape member 20 ... Main-body part 22 ... Main-body upper surface part 22a ... Frame installation part 23 ... Seal ring (corresponding to a seal member)
24 ... X ring 25 ... Recessed fitting part 30 ... Cylinder mechanism 35 ... Mounting plate (corresponding to mounting means)
50 ... Pressure chamber 60 ... Heater (corresponding to heating means)
61 ... Wafer jig 70 ... Tape frame (corresponding to tape holding means)
80 ... Air pipe (part of suction means)
82 ... Collection tube (part of suction means)
84 ... Vacuum pump (part of suction means)
85 ... 1st valve member (a part of suction means)
86 ... Compressor piping (part of pressurizing means)
87 ... Compressor (part of pressurizing means)
88 ... Second valve member (part of pressurizing means)
90 ... Control device (control means)
DESCRIPTION OF SYMBOLS 100 ... Lid body part 110 ... Fixed lid 114 ... Recessed part 115 ... Rail body 120 ... Rotating lid 121 ... Rotating shaft 122 ... Guide wheel 125 ... Guide roller

Claims (3)

In a tape bonding apparatus that bonds a tape member to a workpiece,
Mounting means for mounting the workpiece;
A pressure chamber that allows the above-described placing means and the above-described workpiece placed on the placing means to be contained, and can be closed in a sealed state;
Moving means for moving the above-mentioned placing means toward the normal direction of the workpiece;
A tape holding means that is provided inside the pressure chamber and holds the tape member at a site separated from the workpiece in the normal direction;
Suction means for vacuum suction of the inside of the pressure chamber;
A pressurizing means for introducing air into the pressure chamber in a pressurized state;
Heating means for heating the workpiece placed on the placing means;
Control means for controlling the operation of the suction means, the pressurizing means, the moving means and the heating means;
A body portion having a recessed fitting portion;
The main body is provided so as to be openable and closable, has a recess, has a fixed lid that contacts the main body and can be opened and closed with respect to the main body, and is rotatable with respect to the fixed lid A lid having a rotating lid provided;
And having
The control means includes
Activate the suction means to perform vacuum suction of the pressure chamber,
After the vacuum suction, the moving means is actuated to move the work toward the tape member, and the work is adhered to the tape member.
After the tape member is bonded, the pressure means is operated to introduce air into the pressure chamber in a pressurized state,
When the lid portion is closed with respect to the main body portion, a seal member that hermetically closes between the lid body portion and the main body portion is provided at a boundary portion between the lid body portion and the main body portion. ,
The sliding part of the moving means passes through the hole and extends into the pressure chamber, and between the sliding part and the hole, a sealing member that hermetically seals between them Is provided,
In the closed state of the lid portion, the pressure chamber is formed by being sealed by the sealing member and the sealing member and including the concave fitting portion and the concave portion,
A cam mechanism that can be engaged and disengaged by rotation of the rotary lid is provided between the main body and the rotary lid. The presence of the cam mechanism locks the lid body with respect to the main body. Possible,
A tape bonding apparatus characterized by that. Wherein, prior to the vacuum suction of the pressure chamber by the suction means, the heating means is operated to advance the tape bonding device according to claim 1, wherein heating the workpiece. Said heating means, tape bonding device according to claim 1 or 2, wherein the having a rubber heater.

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