JP4548096B2 - Fitting structure between semiconductor chip and substrate, semiconductor chip mounting method and electronic device - Google Patents

Description

  The present invention relates to a fitting structure between a semiconductor chip and a substrate. More specifically, the present invention relates to a semiconductor chip capable of controlling the direction in which a semiconductor chip is mounted on a substrate, even in a self-organized mounting. The present invention relates to a fitting structure with a substrate, a semiconductor chip mounting method, and an electronic device using the fitting structure between a semiconductor chip and a substrate according to the present invention.

  2. Description of the Related Art Current electronic devices and the like are widely used in which a large number of components, semiconductor chips, and parts in which they are embedded in an insulator such as plastic are arranged on a substrate. For example, many LED packages such as a light emitting diode display (LED display) are arranged on a substrate to form an image display device.

  As a method for arranging a semiconductor chip or the like on a substrate, a flip chip bonding method is known. The flip chip bonding method is a method in which a semiconductor chip itself without a lead is mounted on a substrate. However, in this method, since the semiconductor chip mounted on the substrate becomes a protrusion on the substrate, a large interval is required at the mounting position of the semiconductor chip, and there is a limit to miniaturization of the circuit. In addition, this method is very complicated since each semiconductor chip is individually mounted on a substrate.

  Many technologies have been proposed in the past to enable circuit miniaturization and to quickly arrange semiconductor chips on a substrate. For example, a recess is formed in a substrate, and components that fit into the recess are mounted on the substrate. A method has been proposed (see, for example, Patent Document 1). In this method, a fluid containing a component is conveyed onto the substrate, and the component is mounted on the substrate in a self-organized manner by a fitting structure provided in the recess and the component. Further, according to this method, the shape of the component is a truncated pyramid-shaped hexahedron with the smaller one of the upper and lower surfaces as a base, and the component is easily lifted off to the recess.

  Another proposal for mounting components on a board in a self-organized manner is to form a magnetic film on the bottom of the element and the mounting position of the element on the board, and use the magnetic force between the magnetic bodies to mount the element on the board. A method of mounting with certainty and accuracy has been proposed (see Patent Document 2). Further, according to this method, the element is mounted in the recess in a self-selective manner by using a cylindrical, rectangular, hexagonal, elliptical, or polygonal column as a fitting structure between the element and the recess formed in the substrate. It is said that it is possible.

  As another proposal related to the fitting structure, there has been proposed a method in which the fitting structure between the component to which the optical element is fixed and the recess formed in the optical waveguide sheet is a cone or a pyramid (Patent Document 3). reference). According to this method, by using a half mirror on the side surface of the component as a reflective and refracting surface, light from any direction can be input to the optical element fixed to the component. It is said.

As described above, when components are mounted on the substrate in a self-organized manner, it is effective to make the opening of the recess formed in the substrate larger than the base of the recess in order to improve the mounting yield. In order to provide self-selection as to which recess the component is to be mounted, it is effective to variously change the fitting structure between the component and the recess.
Japanese Patent Laid-Open No. 9-120943 Japanese Patent Laid-Open No. 2003-216052 JP 2003-57468 A

  In the above-described prior art, in order not to reduce the component mounting yield, the fitting structure between the recess formed on the substrate and the component to be mounted is symmetrical with respect to the top surface of the component, and the side surface of the component. It was symmetrical from the direction. With such a structure, the mounting direction of the component is not fixed in one direction, so it is necessary to devise the internal structure of the component so that the component functions regardless of the mounting direction. It should be noted that the mounting direction of the component can be easily determined in one direction if the fitting structure between the concave portion formed on the substrate and the component to be mounted is asymmetrical when viewed from the top surface direction of the component. However, in such a case, the component mounting yield is significantly reduced.

  Therefore, the present invention reduces the mounting yield of a semiconductor chip when a semiconductor chip having a predetermined shape is mounted on a substrate having recesses complementary to the shape of the semiconductor chip in a self-organized manner. The semiconductor chip-substrate fitting structure capable of controlling the direction in which the semiconductor chip is mounted on the substrate, the semiconductor chip mounting method, and the semiconductor chip-substrate fitting structure according to the present invention are used. It is an object of the present invention to provide an electronic device.

  In order to solve the above-described problems, the semiconductor chip-substrate fitting structure of the present invention includes an inverted conical semiconductor chip having an inclined central axis and a concave portion complementary to the shape of the semiconductor chip. And a substrate. With such a structure, it is possible to control the direction in which the semiconductor chip is mounted on the substrate without reducing the mounting yield of the semiconductor chip.

  The upper surface of the semiconductor chip and a cross section parallel to the upper surface may be a perfect circle. By doing in this way, when attaching a semiconductor chip to a crevice, it becomes possible to rotate a semiconductor chip most smoothly.

  In the above structure, the semiconductor chip may be a light emitting element. By doing so, it is possible to assemble the image display device in consideration of the mounting direction of the light emitting element.

  In order to solve the above problems, the semiconductor chip-substrate fitting structure of the present invention includes an inverted frustum-shaped semiconductor chip having an inclined central axis and a concave portion complementary to the shape of the semiconductor chip. And a formed substrate. With such a structure, it is possible to control the direction in which the semiconductor chip is mounted on the substrate without reducing the mounting yield of the semiconductor chip.

  In order to solve the above problems, a semiconductor chip mounting method according to the present invention includes mounting an inverted conical semiconductor chip having an inclined central axis on a substrate in which a concave portion complementary to the semiconductor chip is formed. A method for mounting a semiconductor chip, comprising: transporting a predetermined liquid in which the semiconductor chip is dispersed to an upper portion of the substrate; and sinking the semiconductor chip into the recess while rotating. It is characterized by that. By adopting such a mounting method, it is possible to control the direction in which the semiconductor chip is mounted on the substrate even when the semiconductor chip is mounted in a self-organized manner.

  The mounting method may include a step of applying a physical external force to the substrate until the semiconductor chip is completely settled. By doing so, it becomes possible to promote the rotation of the semiconductor chip.

  In order to solve the above problems, an electronic device of the present invention includes an inverted conical semiconductor chip whose central axis is inclined, and a substrate in which a concave portion complementary to the shape of the semiconductor chip is formed. It is characterized by that. With such a structure, even in an electronic device in which a semiconductor chip is mounted on a substrate in a self-organizing manner, the direction in which the semiconductor chip is mounted on the substrate can be controlled.

  According to the fitting structure between the semiconductor chip and the substrate of the present invention, the fitting structure between the semiconductor chip mounted on the substrate and the recess formed in the substrate is formed into an inverted conical shape with an inclined central axis. The direction in which the semiconductor chip is mounted on the substrate can be controlled without reducing the mounting yield of the semiconductor chip. Further, if the semiconductor chip is a light emitting element, it is possible to assemble the image display device in consideration of the mounting direction of the light emitting element.

  In addition, according to the fitting structure between the semiconductor chip and the substrate of the present invention, the fitting structure between the semiconductor chip mounted on the substrate and the recess formed in the substrate is an inverted frustum shape whose central axis is inclined. Thus, it is possible to control the direction in which the semiconductor chip is mounted on the substrate without reducing the mounting yield of the semiconductor chip.

  Further, according to the semiconductor chip mounting method of the present invention, the direction in which the semiconductor chip is mounted on the substrate can be controlled even when the semiconductor chip is mounted in a self-organized manner. Further, it is possible to promote the rotation of the semiconductor chip by applying a physical external force to the substrate until the mounting of the semiconductor chip is completed.

  Also, according to the electronic device of the present invention, the semiconductor chip is self-organized by making the fitting structure of the semiconductor chip mounted on the substrate and the recess formed on the substrate into an inverted cone shape with the central axis inclined. Even in an electronic device that is mounted on a substrate, the direction in which the semiconductor chip is mounted on the substrate can be controlled.

  Hereinafter, embodiments to which the present invention is applied will be described in detail with reference to the drawings. In addition, this invention is not limited to the following description, In the range which does not deviate from the summary of this invention, it can change suitably.

  FIG. 1 is a schematic explanatory view showing a fitting structure between a semiconductor chip and a substrate in the embodiment of the present invention. The fitting structure shown in the present embodiment is a fitting structure between an inverted conical semiconductor chip 10 whose central axis is inclined and a substrate 40 in which a concave portion 30 complementary to the semiconductor chip 10 is formed.

  FIG. 2 is a perspective view of the semiconductor chip 10. The semiconductor chip 10 is a semiconductor chip formed in an inverted cone shape having a circuit surface 11, a chip cone side surface 12, and a chip cone vertex 13. As described above, the mounting yield of the semiconductor chip 10 can be made relatively high by making the semiconductor chip 10 into an inverted conical shape.

  FIG. 3 shows a top view of the semiconductor chip 10. The circuit surface 11 is a surface that is in the same plane as the circuit surface of the substrate when mounted on the substrate, and is a perfect circle in the present embodiment. If the circuit surface 11 is a perfect circle, the shape of the cross section parallel to the circuit surface 11 becomes a perfect circle, and the semiconductor chip 10 can be rotated most smoothly when the semiconductor chip 10 is attached to the recess 30. It becomes. The circuit surface 11 may be an ellipse or a polygon depending on the conditions of use.

  FIG. 4 shows a side view of the semiconductor chip 10. The tip cone center line 15 that connects the tip cone vertex 13 that is the vertex of the cone and the circuit surface center point 14 that is the center of the circuit surface 11 has an angle other than 90 degrees with the circuit surface 11. Thus, the mounting direction of the semiconductor chip 10 can be controlled by making the angle between the chip cone center line 15 and the circuit surface 11 other than 90 degrees. The chip conical side surface 12 is a surface in contact with the inner wall of the recess 30 when the semiconductor chip 10 is mounted on the substrate 40.

  The substrate 40 is a substrate in which a concave portion 30 complementary to the shape of the semiconductor chip 10 is formed, and the semiconductor chip 10 is attached to the concave portion 30 to be an electronic device having a predetermined function.

  Hereinafter, a method for mounting the semiconductor chip 10 on the substrate 40 in a self-organizing manner will be described.

  First, a predetermined fluid in which the semiconductor chip 10 is dispersed at a high concentration is conveyed onto the mounting surface of the substrate 40, and the semiconductor chip 10 is settled in the recess 30. The fluid for dispersing the semiconductor chip 10 may be water or an aqueous alcohol solution, but it does not hinder the electrical connection between the semiconductor chip 10 and the substrate 40 and smoothly settles into the recess 30 of the semiconductor chip 10. Others may be used as long as they can be performed.

  Assume that the positional relationship between the tip cone apex position 20 and the recess cone apex position 31 when the semiconductor chip 10 is positioned above the recess 30 is shifted by approximately 180 degrees as shown in FIG. 7, for example. The tip cone vertex position 20 is a projection of the tip cone vertex 13 onto the circuit surface 11, and the recessed cone vertex position 31 is the vertex of the cone formed by the recessed portion 30.

  After the semiconductor chip 10 enters the recess 30, the semiconductor chip 10 settles while rotating due to the contact between the chip conical side surface 12 and the inner wall of the recess 30 as shown in FIG. 5. At this time, if a physical external force such as vibration is applied to the substrate 40, the rotation of the semiconductor chip 10 can be promoted. FIG. 8 shows a state where FIG. 5 is viewed from the upper side of the semiconductor chip 10. The semiconductor chip 10 rotates in a direction in which the tip cone vertex position 20 and the concave cone vertex position 31 coincide.

  When the sedimentation accompanying the rotation of the semiconductor chip 10 proceeds, the semiconductor chip 10 is completely accommodated in the recess 30 as shown in FIG. 6, and the mounting of the semiconductor chip 10 on the substrate 40 is completed. FIG. 9 shows a state in which FIG. 6 is viewed from the upper side of the semiconductor chip 10. It can be seen that the chip cone position 20 and the concave cone apex position 31 coincide, and the semiconductor chip 10 is mounted on the substrate 40 with directivity.

  As described above, the inverted conical semiconductor chip 10 whose central axis is inclined is dispersed in a predetermined fluid and settled while rotating into the recess 30 complementary to the shape of the semiconductor chip 10, so that Even in the systematic mounting, the direction in which the semiconductor chip 10 is mounted on the substrate 40 can be controlled. Therefore, even in an electronic device in which the semiconductor chip 10 is mounted on the substrate 40 in a self-organizing manner, the direction in which the semiconductor chip 10 is mounted on the substrate 40 can be controlled.

  The embodiment of the present invention has been described above. The present invention is not limited to the above-described embodiment, and each component can be appropriately changed without departing from the gist of the present invention.

  For example, the fitting structure between the semiconductor chip 10 and the substrate 40 does not have to be an inverted cone shape having a sharp apex as shown in FIG. 1, and may have a round apex. If the semiconductor chip 10 is a light emitting element, an image display apparatus can be assembled in consideration of the mounting direction of the light emitting element. Further, the fitting structure between the semiconductor chip and the substrate according to the present invention may be a fitting structure using the semiconductor chip and the substrate as shown in FIG.

  In FIG. 10, the schematic explanatory drawing of another fitting structure in this embodiment is shown. The fitting structure shown in the present embodiment is a fitting structure between an inverted frustum-shaped semiconductor chip 50 whose central axis is inclined and a substrate 60 in which a recess 70 complementary to the semiconductor chip 50 is formed.

  FIG. 11 is a perspective view of the semiconductor chip 50. The semiconductor chip 50 is a semiconductor chip formed in an inverted frustum shape including a circuit surface 54, a chip side surface 52, and a chip bottom surface 56. Thus, the mounting yield of the semiconductor chip 50 can be made relatively high by making the semiconductor chip 50 into an inverted frustum shape.

  FIG. 12 shows a top view of the semiconductor chip 50. The circuit surface 51 is a surface that is in the same plane as the circuit surface of the substrate when mounted on the substrate, and is a perfect circle in this embodiment. If the circuit surface 51 is a perfect circle, the shape of the cross section parallel to the circuit surface 51 becomes a perfect circle, and the semiconductor chip 50 can be rotated most smoothly when the semiconductor chip 50 is attached to the recess 70. It becomes. The circuit surface 51 may be an ellipse or a polygon depending on the conditions of use.

  FIG. 13 shows a side view of the semiconductor chip 50. The chip center line 55 connecting the chip bottom surface center point 53 that is the center of the chip bottom surface 56 and the circuit surface center point 54 that is the center of the circuit surface 51 has an angle other than 90 degrees with the circuit surface 51. The chip side surface 52 is a surface in contact with the inner wall of the recess 70 when the semiconductor chip 50 is mounted on the substrate 60. The chip bottom surface 56 is a surface in contact with the bottom surface of the recess 70 when the semiconductor chip 50 is mounted on the substrate 60, and is a perfect circle like the circuit surface 51 in this embodiment.

  The substrate 60 is a circuit board in which a concave portion 61 complementary to the shape of the semiconductor chip 50 is formed. By mounting the semiconductor chip 50 in the concave portion 70, an electronic circuit device having a predetermined function is obtained. It is.

As described above, even when the fitting structure between the semiconductor chip 50 and the substrate 60 is an inverted frustum shape whose central axis is inclined, the mounting yield of the semiconductor chip 50 is reduced as in the case of the above-mentioned inverted cone shape. The direction in which the semiconductor chip 50 is mounted on the substrate 60 can be controlled without any problem.

It is a schematic explanatory drawing which shows embodiment of this invention. 1 is a perspective view of a semiconductor chip in an embodiment of the present invention. It is a top view of the semiconductor chip in the embodiment of the present invention. It is a side view of the semiconductor chip in an embodiment of the invention. It is the schematic explanatory drawing which showed a mode that the semiconductor chip was mounted in a board | substrate. FIG. 6 is a schematic explanatory diagram continuing from FIG. 5 showing a state in which a semiconductor chip is mounted on a substrate. FIG. 7 is a schematic explanatory diagram continuing from FIG. 6 illustrating a state in which a semiconductor chip is mounted on a substrate. FIG. 6 is a top view of FIG. 5. FIG. 7 is a top view of FIG. 6. It is a schematic explanatory drawing which shows another fitting structure of this embodiment. It is a perspective view of an inverted frustum-shaped semiconductor chip. It is a top view of an inverted frustum-shaped semiconductor chip It is a side view of an inverted frustum-shaped semiconductor chip.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Semiconductor chip 11 ... Circuit surface 12 ... Chip cone side surface 13 ... Chip cone vertex 14 ... Rotation surface center point 15 ... Chip cone centerline 20 ... Chip cone vertex position 30 ... Concave 31 ... Conical vertex position of concave part 40 ... Substrate 50 ... Semiconductor chip 51 ... Circuit surface 52 ... Chip side surface 53 ... Chip bottom surface center point 54 ... Circuit surface Center point 55 ... Chip center line 56 ... Chip bottom surface 60 ... Substrate 70 ... Concavity

Claims (7)

An inverted conical semiconductor chip with an inclined central axis;
A fitting structure of a semiconductor chip and a substrate, comprising: a substrate having a recess formed complementary to the shape of the semiconductor chip.   2. The semiconductor chip and substrate fitting structure according to claim 1, wherein the upper surface of the semiconductor chip and a cross section parallel to the upper surface are perfect circles.   2. The fitting structure between a semiconductor chip and a substrate according to claim 1, wherein the semiconductor chip is a light emitting element. An inverted frustum-shaped semiconductor chip with an inclined central axis;
A fitting structure of a semiconductor chip and a substrate, comprising: a substrate having a recess formed complementary to the shape of the semiconductor chip. A semiconductor chip mounting method for mounting an inverted conical semiconductor chip having an inclined central axis on a substrate in which a concave portion complementary to the semiconductor chip is formed,
Transporting a predetermined liquid in which the semiconductor chips are dispersed to the top of the substrate;
And a step of sinking the semiconductor chip into the recess while rotating.   6. The semiconductor chip mounting method according to claim 5, further comprising a step of applying a physical external force to the substrate until the settling of the semiconductor chip is completed. An inverted conical semiconductor chip with an inclined central axis;
An electronic device comprising: a substrate having a concave portion complementary to the shape of the semiconductor chip.