JP4517541B2 - Method and apparatus for measuring component height in component mounting apparatus - Google Patents

Method and apparatus for measuring component height in component mounting apparatus Download PDF

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Publication number
JP4517541B2
JP4517541B2 JP2001178048A JP2001178048A JP4517541B2 JP 4517541 B2 JP4517541 B2 JP 4517541B2 JP 2001178048 A JP2001178048 A JP 2001178048A JP 2001178048 A JP2001178048 A JP 2001178048A JP 4517541 B2 JP4517541 B2 JP 4517541B2
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Prior art keywords
component
suction nozzle
height
pressure
component suction
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JP2002368491A (en
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武一 柿沼
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Sony Corp
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Sony Corp
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Description

【０００１】
【発明の属する技術分野】
本発明は、電子部品などの部品を回路基板の所定の位置に装着する部品装着装置における部品高さ測定方法及びその装置に関するものである。
【０００２】
【従来の技術】
部品吸着ノズルを用いて真空圧により部品を吸着し、その部品を基板上の所定の位置に移動した後、正圧により真空破壊して部品吸着ノズルから部品の吸着を解除する部品装着装置において、部品吸着の信頼性を上げるためには、部品供給形態や部品そのもののばらつきにより異なる部品吸着高さを正しく把握する必要があり、従来の部品装着装置においては、レーザ変位計などの測定器を部品装着ヘッドに搭載して部品吸着高さの測定を行っている。
【０００３】
また、実際に部品を吸着する部品吸着ノズルの外部で部品高さを測定するため、部品吸着ノズルそのもののばらつきを含めた長さを考慮するには更に別の測定手段が必要となる。
【０００４】
また、実際に部品を吸着する部品吸着ノズルの外部で部品高さを測定するため、部品吸着ノズルそのもののばらつきを含めた長さを考慮しなければならない。
【０００５】
【発明が解決しようとする課題】
レーザ変位計などの測定器は重いために、これを搭載した部品吸着ノズルは動きが重くなる。
【０００６】
また、部品吸着ノズルそのもののばらつきを含めた長さを考慮するには更に別の測定手段が必要となる。
【０００７】
従って、部品装着装置としては、全体で価格が増大してしまうという課題がある。
【０００８】
従って、本発明は、実際に部品を吸着する部品吸着ノズルを用い、その部品吸着ノズルそのもののばらつきを含めた精度の高い部品高さを測定でき、軽量で安価な部品装着装置における部品高さ測定方法及びその装置を得ることを目的とする。
【０００９】
【課題を解決するための手段】
それ故、前記課題を解決するために、本発明の部品装着装置における部品高さ測定方法は、部品吸着ノズルを用い、基板に装着しようとする部品を該部品吸着ノズル内を負圧にして吸着、保持し、前記基板の所定の位置で前記部品吸着ノズル内にエアーを供給して正圧とし、前記部品の吸着を解除して前記基板に装着する部品装着装置において、基板に装着しようとする部品の高さを測定するに当たり、前記部品吸着ノズルを用い、前記部品吸着ノズルに一定の圧力の元に一定流量のエアーを供給して、前記部品吸着ノズルの先端部分から吐出させながら、前記先端部分を測定対象部品の上面に接近させ、前記測定対象部品に前記先端部分が接触した時の前記部品吸着ノズル内のエアー圧力の最大値或いはエアー流量の最小値を検出して前記測定対象部品の高さを測定することを特徴とする。
【００１０】
また、本発明の部品装着装置における部品高さ測定装置は、部品吸着ノズル内を真空圧にして部品を吸着させ、基板の所定位置に移動後、前記部品吸着ノズル内にエアーを供給して正圧とし、該正圧により真空破壊させて前記部品吸着ノズルの部品吸着を解除し、前記所定位置に前記部品を装着するように構成されている部品装着装置において、真空・正圧供給源と、該真空・正圧供給源と前記部品吸着ノズルとの間に配設された真空・正圧切替電磁弁と、該真空・正圧切替電磁弁と前記部品吸着ノズルとの間に配設されたエアー圧力またはエアー流量検出手段と、該エアー圧力またはエアー流量検出手段による検出結果に基づき前記部品高さを計算する計算手段とを具備していることを特徴とする。そして、前記計算手段は測定対象部品の高さに対するエアー圧力或いはエアー流量のデータが格納されているメモリと、前記エアー圧力検出手段または前記エアー流量検出手段からの圧力変化或いは流量変化に基づいて部品吸着ノズルの位置情報を、前記メモリに格納されている圧力情報或いは流量情報に照らして部品高さを計算し、該計算結果に基づいて前記部品吸着ノズルの駆動手段を制御する制御装置とを備えている。
【００１１】
それ故、本発明の部品装着装置における部品高さ測定方法によれば、部品の装着に用いる部品吸着ノズルを兼用し、その部品吸着ノズル内におけるエアーの圧力変化或いはエアーの流量変化を検出することにより、測定対象部品の高さを測定することができる。また、実際に部品を吸着する部品吸着ノズルで部品高さを測定するため、部品吸着ノズルそのもののばらつきを含めた精度の高い部品吸着位置の検出ができる。
【００１２】
そして、本発明の部品装着装置における部品高さ測定装置によれば、部品装着用の部品吸着ノズルや部品吸着状況の確認として一般的に取り付けられている圧力センサ或いは流量センサを流用でき、それらを用いて部品の高さの測定を行うことができる。また、実際に部品を吸着する部品吸着ノズルで部品高さを測定するため、部品吸着ノズルそのもののばらつきを含めた精度の高い部品吸着位置の検出ができる。
【００１３】
【発明の実施の形態】
以下、図を用いて、本発明の一実施形態の部品装着装置における部品高さ測定装置の構成及びその動作を説明する。
【００１４】
図１は本発明の一実施形態の部品装着装置における部品高さ測定装置の構成図、図２は高さ測定対象部品近傍における部品吸着ノズルとの空路を示す拡大断面図、図３は高さ測定対象部品と部品吸着ノズルとの距離と部品吸着ノズル内のエアー圧力との変化を表すグラフ、図４は高さ測定対象部品と部品吸着ノズルとの距離と部品吸着ノズル内のエアー流量との変化を表すグラフである。
【００１５】
先ず、図１を用いて、本発明の実施形態の部品装着装置における部品高さ測定装置の構成を説明する。
【００１６】
符号１は本実施形態の部品高さ測定装置を指す。この部品高さ測定装置１は、部品吸着ノズル２、中空シャフト３、エアー配管継手４、配管５、正・負圧切り替え電磁弁６、配管７、配管８、真空発生器９、圧力センサ１０、制御装置１１、メモリ１２、駆動回路１３、サーボモータ１４などから構成されている。符号Ｐは部品を、そして符号Ｂは基板を指す。
【００１７】
部品吸着ノズル２は上下、回転可能な部品吸着ノズル保持機構を持つ中空シャフト３の先端部に結合或いは着脱可能に固定され、一方、その中空シャフト３の基端部には回転可能なエアー配管継手４が取り付けられ、配管５を介して正・負圧切り替え電磁弁６の出力側に接続されている。この正・負圧切り替え電磁弁６の一入力側には配管７を介して真空発生器９から負圧が供給され、また、他の入力側には配管８を介してエアー供給源（不図示）に接続されていて、正・負圧切り替え電磁弁６の前記他の入力側にエアー供給源（不図示）からのエアーが所定の圧力に減圧された正圧が供給されるように構成されている。
【００１８】
また、圧力センサ１０は配管５に取り付けられており、その出力側には制御装置１１が接続されている。また、制御装置１１には装吸着データが格納されているメモリ１２が接続されている。そして制御装置１１には駆動回路１３を介してサーボモータ１４が接続されている。サーボモータ１４は制御装置１１の出力信号により制御され、中空シャフト３を駆動する。
【００１９】
次に、前記のように構成された部品高さ測定装置１の動作を説明する。
【００２０】
部品Ｐを部品吸着ノズル２で吸着する時は、制御装置１１からの出力信号により正・負圧切り替え電磁弁６を真空発生器９が接続された負圧側に切り替え、部品吸着ノズル２内を真空にし、部品Ｐを吸引する。この時に配管５に取り付けられた圧力センサ１０により部品Ｐの有無及び部品Ｐが正常に吸着されているかを検出する。
【００２１】
次に、吸着した部品Ｐを基板Ｂ上に装着する時には、制御装置１１からの出力信号により正・負圧切り替え電磁弁６を配管８が接続されているエアー供給源の正圧側に切り替え、部品吸着ノズル２内を大気圧に切り替え、真空破壊を行い、部品吸着ノズル２から部品Ｐを解放する。
【００２２】
部品Ｐの高さを測定する場合には、メモリ１２に格納されている部品位置情報よりサーボモータ１４で中空シャフト３を駆動し、部品吸着ノズル２が測定対象部品の上面に接触しない数ミリ上方の部品高さの測定位置まで移動させ、正・負圧切り替え電磁弁６を正圧側に切り替え、部品吸着ノズル２の先端より所定の流量のエアーを流出させた状態で、制御装置１１により部品吸着ノズル２を所定の間隔でサーボモータ１４により下降させ、その位置情報と圧力センサ１０からの圧力情報をメモリ１２に格納する。
【００２３】
この時、図２に示したように、部品吸着ノズル２が測定対象部品Ｐに近づくと、部品吸着ノズル２の先端から流出してエアーの通路Ｃの断面積が減少することにより、部品吸着ノズル２内の流量は減少し、圧力が増加する。理想的な状態としては部品吸着ノズル２が測定対象部品Ｐに接触した時点で０となり、エアの通路Ｃの断面積は０となり、部品吸着ノズル２内の流量は０となって、圧力は配管８から供給されている所定の圧力となる。
【００２４】
図３は前記の動作でメモリ１２に格納されているデータをグラフ化した図であって、測定対象部品Ｐの上面高さを０とした時、部品吸着ノズル２が測定対象部品Ｐに近づくに従って部品吸着ノズル２内の圧力が上がり、部品吸着ノズル２が測定対象部品Ｐの上面に接触した時点で圧力は最大となり、それ以降はエアの通路Ｃの断面積が変化しないため、圧力も変化しない。このことから、圧力センサ１０からの圧力情報が最大になった時点での制御装置１１からの位置情報により測定対象部品Ｐの高さを確定できる。
【００２５】
配管５に取り付けた圧力センサ１０を流量センサにし、エアーの流量を測定することによっても、部品高さの測定ができる。図４は前記の流量測定による動作でメモリ１２に格納されているデータをグラフ化した図であって、測定対象部品Ｐの上面高さを０とした時、部品吸着ノズル２が測定対象部品Ｐに近づくに従って部品吸着ノズル２内の流量は下がり、部品吸着ノズル２が測定対象部品Ｐの上面に接触した時点で流量は最小となり、それ以降はエアの通路Ｃの断面積が変化しないため、流量も変化しない。このことにより流量センサからの流量情報が最小になった時点での制御装置１１からの位置情報により測定対象部品Ｐの高さを確定できる。
【００２６】
【発明の効果】
以上説明したように、本発明の部品高さ測定方法及びその装置によれば、部品吸着状況の確認として一般的に取り付けられている圧力センサを流用して部品の高さの測定を行うため、部品高さ測定用として新たにレーザ変位計などの測定器を用いる必要はなく、部品高さ測定装置の小型化や低廉化が可能となる。
【００２７】
また、実際に部品を吸着する部品吸着ノズルで部品高さを測定するため、部品吸着ノズルそのもののばらつきを含めた精度の高い部品吸着位置の検出ができ、部品吸着の品質向上を計ることができる。
【図面の簡単な説明】
【図１】 本発明の一実施形態の部品装着装置における部品高さ測定装置の構成図である。
【図２】 高さ測定対象部品近傍における部品吸着ノズルとの空路を示す拡大断面図である。
【図３】 高さ測定対象部品と部品吸着ノズルとの距離と部品吸着ノズル内のエアー圧力との変化を表すグラフである。
【図４】 高さ測定対象部品と部品吸着ノズルとの距離と部品吸着ノズル内のエアー流量との変化を表すグラフである。
【符号の説明】
１…本発明の一実施形態の部品高さ測定装置、２…部品吸着ノズル、３…中空シャフト、４…エアー配管継手、５，７，８…配管、６…正・負圧切り替え電磁弁、９…真空発生器、１０…圧力センサ、１１…制御装置、１２…メモリ、１３…駆動回路、１４…サーボモータ、Ｂ…基板、Ｃ…エアーの通路、Ｐ…部品[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component height measuring method and apparatus for a component mounting apparatus for mounting a component such as an electronic component at a predetermined position on a circuit board.
[0002]
[Prior art]
In a component mounting device that sucks a component by vacuum pressure using a component suction nozzle, moves the component to a predetermined position on the substrate, then breaks the vacuum by positive pressure and releases suction of the component from the component suction nozzle. In order to increase the reliability of component adsorption, it is necessary to correctly grasp the different component adsorption height depending on the component supply form and the variation of the component itself. In conventional component mounting devices, measuring instruments such as a laser displacement meter are used. It is mounted on the mounting head and the component suction height is measured.
[0003]
In addition, since the height of the component is measured outside the component suction nozzle that actually picks up the component, another measuring means is required to consider the length including the variation of the component suction nozzle itself.
[0004]
In addition, in order to measure the height of the component outside the component suction nozzle that actually picks up the component, the length including the variation of the component suction nozzle itself must be taken into consideration.
[0005]
[Problems to be solved by the invention]
Since measuring instruments such as a laser displacement meter are heavy, movement of the component suction nozzle on which the measuring instrument is mounted becomes heavy.
[0006]
Further, in order to consider the length including the variation of the component suction nozzle itself, another measuring means is required.
[0007]
Therefore, the component mounting apparatus has a problem that the price increases as a whole.
[0008]
Therefore, the present invention uses a component suction nozzle that actually picks up the component and can measure the height of the component with high accuracy including variations of the component suction nozzle itself, and can measure the component height in a lightweight and inexpensive component mounting apparatus. The object is to obtain a method and its apparatus.
[0009]
[Means for Solving the Problems]
Therefore, in order to solve the above-mentioned problem, the component height measuring method in the component mounting apparatus of the present invention uses a component suction nozzle, and sucks the component to be mounted on the substrate with the negative pressure inside the component suction nozzle. In a component mounting apparatus for holding and mounting air to the component suction nozzle at a predetermined position on the substrate to provide positive pressure and releasing the component suction, the component is mounted on the substrate. When measuring the height of a component, the tip of the tip is used while supplying a constant flow of air under a constant pressure to the component suction nozzle and discharging it from the tip of the component suction nozzle. The part is brought close to the upper surface of the part to be measured, and the maximum value of the air pressure or the minimum value of the air flow rate in the part suction nozzle when the tip part contacts the part to be measured is detected. And measuring the height of the constant target part.
[0010]
In addition, the component height measuring device in the component mounting apparatus of the present invention uses a vacuum pressure in the component suction nozzle to suck the component, moves it to a predetermined position on the board, and then supplies air to the component suction nozzle to correct it. In the component mounting device configured to release the component suction of the component suction nozzle by vacuum breaking with the positive pressure, and to mount the component at the predetermined position, a vacuum / positive pressure supply source; A vacuum / positive pressure switching solenoid valve disposed between the vacuum / positive pressure supply source and the component suction nozzle, and disposed between the vacuum / positive pressure switching solenoid valve and the component suction nozzle. An air pressure or air flow rate detection means and a calculation means for calculating the component height based on a detection result by the air pressure or air flow rate detection means are provided. The calculation means includes a memory storing data of air pressure or air flow with respect to the height of the part to be measured, and a component based on a pressure change or a flow change from the air pressure detection means or the air flow detection means. A controller that calculates the height of the component in accordance with the position information of the suction nozzle in light of the pressure information or the flow rate information stored in the memory, and controls the drive unit of the component suction nozzle based on the calculation result. ing.
[0011]
Therefore, according to the component height measuring method in the component mounting apparatus of the present invention, the component suction nozzle used for component mounting is also used to detect a change in air pressure or a change in air flow in the component suction nozzle. Thus, the height of the part to be measured can be measured. In addition, since the component height is measured by the component suction nozzle that actually sucks the component, it is possible to detect the component suction position with high accuracy including the variation of the component suction nozzle itself.
[0012]
And, according to the component height measuring device in the component mounting device of the present invention, it is possible to divert the component suction nozzle for component mounting and the pressure sensor or flow rate sensor that are generally installed as confirmation of the component suction status, Can be used to measure the height of the part. In addition, since the component height is measured by the component suction nozzle that actually sucks the component, it is possible to detect the component suction position with high accuracy including the variation of the component suction nozzle itself.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the configuration and operation of a component height measuring apparatus in a component mounting apparatus according to an embodiment of the present invention will be described with reference to the drawings.
[0014]
FIG. 1 is a configuration diagram of a component height measuring device in a component mounting apparatus according to an embodiment of the present invention, FIG. 2 is an enlarged cross-sectional view showing an air passage with a component suction nozzle in the vicinity of a height measurement target component, and FIG. FIG. 4 is a graph showing changes in the distance between the measurement target component and the component suction nozzle and the air pressure in the component suction nozzle. FIG. 4 shows the distance between the height measurement target component and the component suction nozzle and the air flow rate in the component suction nozzle. It is a graph showing a change.
[0015]
First, the configuration of the component height measuring apparatus in the component mounting apparatus according to the embodiment of the present invention will be described with reference to FIG.
[0016]
Reference numeral 1 denotes the component height measuring apparatus of the present embodiment. The component height measuring device 1 includes a component suction nozzle 2, a hollow shaft 3, an air pipe joint 4, a pipe 5, a positive / negative pressure switching electromagnetic valve 6, a pipe 7, a pipe 8, a vacuum generator 9, a pressure sensor 10, It comprises a control device 11, a memory 12, a drive circuit 13, a servo motor 14, and the like. Reference numeral P denotes a component, and reference numeral B denotes a substrate.
[0017]
The component suction nozzle 2 is fixed to a distal end portion of a hollow shaft 3 having a component suction nozzle holding mechanism that can rotate up and down, and is detachably fixed to the base end portion of the hollow shaft 3. 4 is attached and connected to the output side of the positive / negative pressure switching electromagnetic valve 6 via the pipe 5. A negative pressure is supplied from a vacuum generator 9 to one input side of the positive / negative pressure switching electromagnetic valve 6 via a pipe 7, and an air supply source (not shown) is connected to the other input side via a pipe 8. ) And the positive / negative pressure switching solenoid valve 6 is configured to be supplied with positive pressure obtained by reducing the air from an air supply source (not shown) to a predetermined pressure. ing.
[0018]
Moreover, the pressure sensor 10 is attached to the piping 5, and the control apparatus 11 is connected to the output side. The control device 11 is connected to a memory 12 in which attachment data is stored. A servo motor 14 is connected to the control device 11 via a drive circuit 13. The servo motor 14 is controlled by the output signal of the control device 11 and drives the hollow shaft 3.
[0019]
Next, the operation of the component height measuring apparatus 1 configured as described above will be described.
[0020]
When the component P is sucked by the component suction nozzle 2, the positive / negative pressure switching electromagnetic valve 6 is switched to the negative pressure side to which the vacuum generator 9 is connected according to the output signal from the control device 11, and the inside of the component suction nozzle 2 is evacuated. Then, the part P is sucked. At this time, the presence or absence of the component P and whether the component P is normally adsorbed are detected by the pressure sensor 10 attached to the pipe 5.
[0021]
Next, when the sucked component P is mounted on the substrate B, the positive / negative pressure switching electromagnetic valve 6 is switched to the positive pressure side of the air supply source to which the pipe 8 is connected by the output signal from the control device 11. The inside of the suction nozzle 2 is switched to atmospheric pressure, a vacuum break is performed, and the part P is released from the part suction nozzle 2.
[0022]
When measuring the height of the component P, the servo motor 14 drives the hollow shaft 3 from the component position information stored in the memory 12, and the component suction nozzle 2 does not contact the upper surface of the measurement target component several millimeters above Is moved to the measurement position of the component height, the positive / negative pressure switching electromagnetic valve 6 is switched to the positive pressure side, and the controller 11 adsorbs the component with a predetermined flow rate of air flowing out from the tip of the component adsorption nozzle 2. The nozzle 2 is lowered by a servo motor 14 at a predetermined interval, and the position information and pressure information from the pressure sensor 10 are stored in the memory 12.
[0023]
At this time, as shown in FIG. 2, when the component suction nozzle 2 approaches the measurement target component P, the component suction nozzle 2 flows out from the tip of the component suction nozzle 2 and the cross-sectional area of the air passage C decreases. The flow rate in 2 decreases and the pressure increases. The ideal state is 0 when the component suction nozzle 2 contacts the measurement target component P, the cross-sectional area of the air passage C is 0, the flow rate in the component suction nozzle 2 is 0, and the pressure is piping. The predetermined pressure supplied from 8 is obtained.
[0024]
FIG. 3 is a graph of the data stored in the memory 12 by the above operation. When the height of the upper surface of the measurement target component P is 0, the component suction nozzle 2 approaches the measurement target component P. When the pressure in the component suction nozzle 2 increases and the component suction nozzle 2 comes into contact with the upper surface of the measurement target component P, the pressure becomes maximum, and after that, the cross-sectional area of the air passage C does not change, so the pressure does not change. . From this, the height of the measurement target component P can be determined based on the position information from the control device 11 when the pressure information from the pressure sensor 10 becomes maximum.
[0025]
The height of the component can also be measured by using the pressure sensor 10 attached to the pipe 5 as a flow rate sensor and measuring the air flow rate. FIG. 4 is a graph showing the data stored in the memory 12 by the above-described flow rate measurement operation. When the height of the upper surface of the measurement target component P is set to 0, the component suction nozzle 2 moves to the measurement target component P. Since the flow rate in the component suction nozzle 2 decreases as the value approaches, the flow rate becomes minimum when the component suction nozzle 2 comes into contact with the upper surface of the measurement target component P, and thereafter, the cross-sectional area of the air passage C does not change. Will not change. As a result, the height of the measurement target component P can be determined from the position information from the control device 11 when the flow rate information from the flow rate sensor is minimized.
[0026]
【The invention's effect】
As described above, according to the component height measuring method and the apparatus of the present invention, in order to measure the height of the component by diverting a pressure sensor generally attached as confirmation of the component adsorption state, It is not necessary to newly use a measuring device such as a laser displacement meter for measuring the component height, and the component height measuring device can be reduced in size and cost.
[0027]
In addition, because the component height is measured by the component suction nozzle that actually picks up the component, it is possible to detect the component suction position with high accuracy including variations in the component suction nozzle itself, and to improve the quality of component suction. .
[Brief description of the drawings]
FIG. 1 is a configuration diagram of a component height measuring apparatus in a component mounting apparatus according to an embodiment of the present invention.
FIG. 2 is an enlarged cross-sectional view showing an air passage with a component suction nozzle in the vicinity of a height measurement target component.
FIG. 3 is a graph showing a change in a distance between a height measurement target component and a component suction nozzle and an air pressure in the component suction nozzle.
FIG. 4 is a graph showing a change in a distance between a height measurement target component and a component suction nozzle and an air flow rate in the component suction nozzle.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Component height measuring apparatus of one Embodiment of this invention, 2 ... Component adsorption nozzle, 3 ... Hollow shaft, 4 ... Air piping coupling, 5, 7, 8 ... Piping, 6 ... Positive / negative pressure switching solenoid valve, DESCRIPTION OF SYMBOLS 9 ... Vacuum generator, 10 ... Pressure sensor, 11 ... Control device, 12 ... Memory, 13 ... Drive circuit, 14 ... Servo motor, B ... Substrate, C ... Air passage, P ... Parts

Claims (3)

部品吸着ノズルを用い、基板に装着しようとする部品を該部品吸着ノズル内を負圧にして吸着、保持し、前記基板の所定の位置で前記部品吸着ノズル内にエアーを供給して正圧とし、前記部品の吸着を解除して前記基板に装着する部品装着装置において、基板に装着しようとする部品の高さを測定するに当たり、前記部品吸着ノズルを用い、
前記部品吸着ノズルに一定の圧力の元に一定流量のエアーを供給して、前記部品吸着ノズルの先端部分から吐出させながら、前記先端部分を測定対象部品の上面に接近させ、前記測定対象部品に前記先端部分が接触した時の前記部品吸着ノズル内のエアー圧力の最大値或いはエアー流量の最小値を検出して前記測定対象部品の高さを測定する
ことを特徴とする部品装着装置における部品高さ測定方法。Using a component suction nozzle, the component to be mounted on the board is sucked and held with a negative pressure inside the component suction nozzle, and air is supplied to the component suction nozzle at a predetermined position on the board to obtain a positive pressure. In the component mounting apparatus for releasing the suction of the component and mounting it on the substrate, the component suction nozzle is used to measure the height of the component to be mounted on the substrate,
While supplying a constant flow of air to the component suction nozzle with a constant pressure and discharging from the tip portion of the component suction nozzle, the tip portion is brought close to the upper surface of the measurement target component, The component height in the component mounting apparatus, wherein the height of the measurement target component is measured by detecting the maximum value of the air pressure in the component suction nozzle or the minimum value of the air flow rate when the tip portion contacts. Measuring method. 部品吸着ノズル内を真空圧にして部品を吸着させ、基板の所定位置に移動後、前記部品吸着ノズル内にエアーを供給して正圧とし、該正圧により真空破壊させて前記部品吸着ノズルの部品吸着を解除し、前記所定位置に前記部品を装着するように構成されている部品装着装置において、
真空・正圧供給源と、
該真空・正圧供給源と前記部品吸着ノズルとの間に配設された真空・正圧切替電磁弁と、
該真空・正圧切替電磁弁と前記部品吸着ノズルとの間に配設されたエアー圧力またはエアー流量検出手段と、
該エアー圧力検出手段またはエアー流量検出手段による検出結果に基づき前記部品高さを計算する計算手段と
を具備していることを特徴とする部品装着装置における部品高さ測定装置。A vacuum is applied to the inside of the component suction nozzle, the component is sucked, and after moving to a predetermined position on the substrate, air is supplied into the component suction nozzle to make a positive pressure, and the positive pressure causes the vacuum to break and In a component mounting apparatus configured to cancel component suction and mount the component at the predetermined position,
Vacuum and positive pressure supply source,
A vacuum / positive pressure switching solenoid valve disposed between the vacuum / positive pressure supply source and the component suction nozzle;
Air pressure or air flow rate detection means disposed between the vacuum / positive pressure switching solenoid valve and the component suction nozzle;
A component height measuring apparatus in a component mounting apparatus, comprising: a calculating unit that calculates the component height based on a detection result by the air pressure detecting unit or the air flow rate detecting unit. 前記計算手段は測定対象部品の高さに対するエアー圧力或いはエアー流量のデータが格納されているメモリと、
前記エアー圧力検出手段または前記エアー流量検出手段からの圧力変化或いは流量変化に基づいて部品吸着ノズルの位置情報を、前記メモリに格納されている圧力情報或いは流量情報に照らして部品高さを計算し、該計算結果に基づいて前記部品吸着ノズルの駆動手段を制御する制御装置とを備えていることを特徴とする請求項２に記載の部品装着装置における部品高さ測定装置。The calculation means includes a memory storing air pressure or air flow data with respect to the height of the measurement target component,
Based on the pressure change or flow rate change from the air pressure detection means or the air flow rate detection means, the position height of the component suction nozzle is calculated in light of the pressure information or flow rate information stored in the memory. The component height measuring device in the component mounting device according to claim 2, further comprising: a control device that controls a driving unit of the component suction nozzle based on the calculation result.
JP2001178048A 2001-06-13 2001-06-13 Method and apparatus for measuring component height in component mounting apparatus Expired - Fee Related JP4517541B2 (en)

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