JP4506255B2 - Wafer position teaching method and robot thereof - Google Patents

Wafer position teaching method and robot thereof Download PDF

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JP4506255B2
JP4506255B2 JP2004122511A JP2004122511A JP4506255B2 JP 4506255 B2 JP4506255 B2 JP 4506255B2 JP 2004122511 A JP2004122511 A JP 2004122511A JP 2004122511 A JP2004122511 A JP 2004122511A JP 4506255 B2 JP4506255 B2 JP 4506255B2
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axis
wafer
teaching jig
robot
sensor
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勝 足立
満徳 川辺
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Yaskawa Electric Corp
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本発明は、半導体ウェハ搬送用ロボットに半導体ウェハの位置を教示する方法に関し、特に外部教示治具に関するものである。   The present invention relates to a method for teaching a position of a semiconductor wafer to a semiconductor wafer transfer robot, and more particularly to an external teaching jig.

従来、半導体ウェハ搬送用ロボットの教示作業は、一般の産業用ロボットと同様に、作業者が、搬送対象のウェハを目視して、その位置を確認してロボットをウェハに誘導していた。しかしながら、処理装置等の内部にあるウェハを外部から目視することは、困難あるいは不可能な場合がある。そこで、実物のウェハと同一寸法の教示治具をウェハの代わりに処理装置等に載置して、その教示治具の位置をロボットのエンドエフェクタに設けたセンサで検出して、ロボットに位置を教示するいわゆるオートティーチングの方法や装置が提案されている。
本願発明者等は、先に２つの透過光式センサを備えたハンドを使って教示治具のセンシングを行う方法を提案している（例えば、特許文献１参照）。従来のウェハ教示方法において、教示治具をロボットのウェハ把持部のセンサでセンシングするためにウェハ把持部を教示治具近傍へ自動で移動させる動作は、事前に装置図面から算出した教示位置（以後、事前教示位置と呼ぶ）に基づいて行っていた。また、本願発明者等はウェハ把持部を教示治具近傍へ移動させる動作を手動で行う方法も提案している（特願２００３−３５３７８３）が、自動化率を上げ教示操作の時間を短縮するためにも、ウェハ把持部の移動は自動が望ましい。
国際公開公報 ＷＯ０３／２２５３４ Conventionally, in the teaching work of a semiconductor wafer transfer robot, an operator visually guides a wafer to be transferred, confirms its position, and guides the robot to the wafer, as in a general industrial robot. However, it may be difficult or impossible to visually observe the wafer inside the processing apparatus or the like from the outside. Therefore, a teaching jig having the same dimensions as the actual wafer is placed on a processing device or the like instead of the wafer, and the position of the teaching jig is detected by a sensor provided on the end effector of the robot, and the position of the teaching jig is determined. A so-called auto-teaching method and apparatus for teaching has been proposed.
The inventors of the present application have previously proposed a method of sensing a teaching jig using a hand equipped with two transmitted light sensors (see, for example, Patent Document 1). In the conventional wafer teaching method, in order to sense the teaching jig with the sensor of the robot's wafer gripping section, the operation of automatically moving the wafer gripping section to the vicinity of the teaching jig is performed in advance from the teaching position calculated from the apparatus drawing (hereinafter referred to as the apparatus position). , Called the pre-taught position). The inventors of the present application have also proposed a method of manually moving the wafer gripping portion to the vicinity of the teaching jig (Japanese Patent Application No. 2003-353783), but in order to increase the automation rate and shorten the teaching operation time. In addition, the movement of the wafer gripping part is preferably automatic.
International Publication WO03 / 22534

ところが、従来の方法では、ロボットに対する処理装置の設置精度がよくないと装置入り口の開口部（以後、間口と呼ぶ）が狭い装置では、ウェハ把持部を教示治具へアプローチさせる際に、ウェハ把持部を装置にぶつけてしまうといった問題があった。
そこで、本発明はこのような問題点に鑑みてなされたものであり、装置前面の外壁に設置した外部教示治具をセンシングし事前に教示位置を修正することにより、ウェハ把持部と装置との干渉させることなく、間口の狭い装置においても半導体ウェハの位置を自動的に精度良く教示できる方法を提供することを目的とする。更には、前記外部教示治具の設置により通常のウェハ搬送時におけるロボットの可動範囲を狭めることのない外部教示治具およびその設置方法を提供することを目的とする。 However, in the conventional method, if the processing apparatus is not accurately installed on the robot and the apparatus has a narrow opening at the entrance (hereinafter referred to as a frontage), the wafer gripping is performed when the wafer gripping part is approached to the teaching jig. There was a problem that the part hits the device.
Therefore, the present invention has been made in view of such problems, and by sensing an external teaching jig installed on the outer wall on the front surface of the apparatus and correcting the teaching position in advance, the wafer holding unit and the apparatus are An object of the present invention is to provide a method capable of automatically and accurately teaching the position of a semiconductor wafer even in an apparatus having a narrow frontage without causing interference. It is another object of the present invention to provide an external teaching jig and its installation method that do not narrow the movable range of the robot during normal wafer transfer by installing the external teaching jig.

上記の課題を解決するために、本発明は、次のようにしたものである。
請求項１に記載の発明は、半導体ウェハを把持するウェハ把持部と、旋回θ軸方向と、前記旋回の中心から半径方向に伸縮するＲ軸方向と、昇降Ｚ軸方向とに前記ウェハ把持部を動作可能に支持する動作部と、を備えたロボットに、前記半導体ウェハを搬送する載置位置を教示するウェハ位置教示方法において、前記ロボットから見て、前記ウェハ把持部を通過させる間口の先に前記載置位置がある場合のウェハ位置教示方法であって、前記Ｒ軸方向に対して直角で水平な光軸を有するセンサを前記ウェハ把持部に設けるステップＡと、前記載置位置を事前教示位置Ｐｏｓ１として教示するステップＢと、前記センサが検出可能な円弧部を有する載置位置用教示治具を前記載置位置に設置するステップＣと、前記センサが検出可能な円弧部を有する外部教示治具を前記載置位置との相対位置が既知である前記間口の前面外壁に設けるステップＤと、前記θ軸と前記Ｒ軸とを動作させながら前記センサによって前記円弧部を検出し、そのとき記憶した前記動作部の前記θ軸と前記Ｒ軸の位置から、前記外部教示治具の位置を求めるステップＥと、前記Ｚ軸を動作させながら前記外部教示治具の水平面を検出し、そのとき記憶した前記動作部の前記Ｚ軸の位置から前記外部教示治具の高さを求めるステップＦと、前記ステップＥと前記ステップＦとの結果から、前記載置位置を推定位置Ｐｏｓ２として求めるステップＧと、前記事前教示位置Ｐｏｓ１の各軸の位置と前記推定位置Ｐｏｓ２の各軸の位置とをそれぞれ比較するステップＨと、を備え、前記ステップＨにおいて比較した各軸の位置の差が予め定めた値以内であれば、前記推定位置Ｐｏｓ２を前記事前教示位置Ｐｏｓ１として記憶し、前記ウェハ把持部が前記間口を通過するように動作させ、前記センサによる前記載置位置用教示治具の検出を行い、前記ステップＨにおいて比較した各軸の位置の差が予め定めた値を超えていれば、前記ウェハ把持部が前記間口を通過する動作を中止すること、を特徴とするウェハ位置教示方法とするものである。
請求項２に記載の発明は、半導体ウェハを把持するウェハ把持部と、旋回θ軸方向と、前記旋回の中心から半径方向に伸縮するＲ軸方向と、昇降Ｚ軸方向とに前記ウェハ把持部を動作可能に支持する動作部と、前記ウェハ把持部に設けられ前記Ｒ軸方向に対して直角で水平な光軸を有するセンサと、を備え、前記半導体ウェハを搬送する載置位置に設置された載置位置用教示治具を前記センサで検出することによって、前記載置位置を記憶するロボットにおいて、前記ロボットから見て、前記ウェハ把持部を通過させる間口の先に前記載置位置がある場合、前記載置位置を事前教示位置Ｐｏｓ１として記憶し、前記間口の前面外壁に設けられ、前記載置位置との相対位置が既知であって、前記センサが検出可能な円弧部を有する外部教示治具を前記センサで検出し、前記動作部の前記θ軸と前記Ｒ軸とを動作させながら前記センサによって前記円弧部を検出し、そのとき記憶した前記θ軸と前記Ｒ軸の位置から、前記外部教示治具の位置を求め、前記動作部の前記Ｚ軸を動作させながら前記外部教示治具の水平面を検出し、そのとき記憶した前記Ｚ軸の位置から前記外部教示治具の高さを求め、前記外部教示治具の位置と高さから前記載置位置を推定位置Ｐｏｓ２として求め、前記事前教示位置Ｐｏｓ１の各軸の位置と前記推定位置Ｐｏｓ２の各軸の位置とをそれぞれ比較し、前記比較した各軸の位置の差が予め定めた値以内であれば、前記推定位置Ｐｏｓ２を前記事前教示位置Ｐｏｓ１として記憶し、前記ウェハ把持部が前記間口を通過するように動作させ、前記センサによる前記載置位置用教示治具の検出を行い、前記比較した各軸の位置の差が予め定めた値を超えていれば、前記ウェハ把持部が前記間口を通過する動作を中止すること、を特徴とするロボットとしたものである。
請求項３に記載の発明は、半導体ウェハを把持するウェハ把持部と、旋回θ軸方向と、前記旋回の中心から半径方向に伸縮するＲ軸方向と、昇降Ｚ軸方向とに前記ウェハ把持部を動作可能に支持する動作部と、前記ウェハ把持部に設けられ前記Ｒ軸方向に対して直角で水平な光軸を有するセンサと、を備え、前記半導体ウェハを搬送する載置位置に設置された載置位置用教示治具を前記センサで検出することによって前記載置位置を記憶するロボットにおいて、前記ロボットから見て、前記ウェハ把持部を通過させる間口の先に前記載置位置がある場合、前記間口の前面外壁に設けられ、前記載置位置との相対位置が既知であって、前記センサが検出可能な円弧部を有する外部教示治具を前記センサによって検出し、該検出の際に記憶した前記動作部の前記Ｒ軸と前記θ軸と前記Ｚ軸の位置から求めた前記外部教示治具の位置と高さによって前記載置位置の推定位置Ｐｏｓ２を求め、前記推定位置Ｐｏｓ２と、事前に教示された前記載置位置の事前教示位置Ｐｏｓ１と、を比較し、該比較の結果に応じて、前記ウェハ把持部が前記間口を通過して前記載置位置用教示治具を検出するか否かを決定すること、を特徴とするロボットとしたものである。
請求項４に記載の発明は、前記外部教示治具が、前記ロボットの前記動作部の最小旋回姿勢での可動範囲外に設置されたこと、を特徴とする請求項２または３記載のロボットとしたものである。
請求項５に記載の発明は、前記外部教示治具が、前記間口の前面外壁から取り外し可能に構成されたこと、を特徴とする請求項２または３記載のロボットとしたものである。
In order to solve the above problems, the present invention is as follows.
The invention according to claim 1 is the wafer gripping part for gripping the semiconductor wafer, the turning θ-axis direction, the R-axis direction extending or contracting in the radial direction from the center of the turning, and the elevating Z-axis direction. In a wafer position teaching method for teaching a mounting position for conveying the semiconductor wafer to a robot provided with an operation unit that operably supports the tip of a front end that passes through the wafer gripping unit when viewed from the robot The wafer position teaching method in the case where there is a mounting position on the wafer, wherein a sensor having a horizontal optical axis perpendicular to the R-axis direction is provided on the wafer gripping portion, and the mounting position is set in advance. Step B that teaches as teaching position Pos1, Step C that installs a mounting position teaching jig having an arc portion that can be detected by the sensor at the mounting position, and an arc portion that can be detected by the sensor. And detecting the arc portion by the sensor while operating the θ axis and the R axis while step D is provided on the front outer wall of the frontage whose relative position to the placement position is known. The step E of obtaining the position of the external teaching jig from the positions of the θ axis and the R axis of the operation unit stored at that time, and detecting the horizontal plane of the external teaching jig while operating the Z axis Then, from the result of Step F, the height of the external teaching jig is obtained from the Z-axis position of the operation unit stored at that time, and the result of Step E and Step F, the above-mentioned placement position is set as the estimated position Pos2. A step G for obtaining, and a step H for comparing the position of each axis of the pre-teach position Pos1 and the position of each axis of the estimated position Pos2, respectively. If the difference in position is within a predetermined value, the estimated position Pos2 is stored as the prior teaching position Pos1, and the wafer gripper is operated so as to pass through the frontage. The teaching jig is detected, and if the difference between the positions of the axes compared in step H exceeds a predetermined value, the operation of the wafer gripping part passing through the frontage is stopped. The wafer position teaching method is as follows.
According to a second aspect of the present invention, there is provided the wafer gripping portion for gripping the semiconductor wafer, the turning θ-axis direction, the R-axis direction extending or contracting in the radial direction from the center of the turning, and the elevating Z-axis direction. And a sensor having a horizontal optical axis perpendicular to the R-axis direction and provided in the wafer gripping unit, and installed at a mounting position for transporting the semiconductor wafer. In the robot which memorizes the mounting position by detecting the mounting position teaching jig with the sensor, the mounting position is located at the tip of the frontage through which the wafer gripping portion is passed as viewed from the robot. In this case, the external teaching position is stored as the pre-teaching position Pos1 and is provided on the front outer wall of the frontage, and has an arc portion that is known relative to the previous positioning position and that can be detected by the sensor. jig Detected by the sensor, the arc portion is detected by the sensor while operating the θ axis and the R axis of the operating portion, and the external teaching is determined from the stored positions of the θ axis and the R axis. Obtaining the position of the jig, detecting the horizontal surface of the external teaching jig while operating the Z axis of the operating unit, obtaining the height of the external teaching jig from the position of the Z axis stored at that time, From the position and height of the external teaching jig, the previous position is obtained as an estimated position Pos2, the position of each axis of the pre-taught position Pos1 is compared with the position of each axis of the estimated position Pos2, If the difference between the positions of the compared axes is within a predetermined value, the estimated position Pos2 is stored as the pre-teached position Pos1, and the wafer gripper is operated so as to pass through the frontage, and the sensor By the above Detecting a placement position teaching jig, and stopping the operation of the wafer gripping portion passing through the frontage if the difference between the positions of the compared axes exceeds a predetermined value. Robot .
According to a third aspect of the present invention, there is provided a wafer gripping portion for gripping a semiconductor wafer, a turning θ-axis direction, an R-axis direction extending or contracting in a radial direction from the center of the turning, and an elevating Z-axis direction. And a sensor having a horizontal optical axis perpendicular to the R-axis direction and provided in the wafer gripping unit, and installed at a mounting position for transporting the semiconductor wafer. In the robot which memorize | stores the said mounting position by detecting the mounting position teaching jig with the said sensor, seeing from the said robot, there exists the said mounting position in front of the frontage which passes the said wafer holding part The external teaching jig provided on the outer front wall of the frontage, whose relative position to the mounting position is known, and having an arc portion that can be detected by the sensor is detected by the sensor, and at the time of the detection Before remembering Based on the position and height of the external teaching jig obtained from the positions of the R axis, the θ axis, and the Z axis of the operation unit, the estimated position Pos2 of the above-described placement position is obtained, and the estimated position Pos2 is taught in advance. Whether or not the wafer gripper detects the preceding position teaching jig by passing through the frontage according to the result of the comparison. It is a robot characterized by determining .
According to a fourth aspect of the present invention, in the robot according to the second or third aspect, the external teaching jig is installed outside a movable range in the minimum turning posture of the operation unit of the robot. It is a thing.
The invention according to claim 5 is the robot according to claim 2 or 3 , wherein the external teaching jig is configured to be removable from the front outer wall of the frontage .

本発明によれば、装置前面外壁に設けた外部教示治具をセンシングすることにより教示治具の位置を推定し、コントローラが保持している装置図面から算出した事前教示位置を前記推定位置で置き換え、ロボットはこの修正された事前教示位置を基にして教示治具へアプローチすることによりウェハ把持部を装置と干渉することなく教示治具へ導くことができる。一旦、ウェハ把持部が教示治具へアプローチすることができれば、特許文献１のウェハ教示方法を実行でき、間口の狭い装置においてもその半導体ウェハの位置を自動的に教示することができるという効果がある。
また、本発明によれば、外部教示治具はロボットの最小旋回姿勢での可動範囲外にあるので、通常の搬送動作において、ロボットの姿勢を最小旋回姿勢に保っている限り、外部教示治具との干渉を意識することなくロボットを自由に移動させることができるという効果がある。
また、本発明によれば、通常の搬送動作時には、外部教示治具を取り外しておくことにより、ロボットは従来の可動範囲を自由に移動させることができるという効果がある。 According to the present invention, the position of the teaching jig is estimated by sensing an external teaching jig provided on the outer front wall of the apparatus, and the pre-taught position calculated from the apparatus drawing held by the controller is replaced with the estimated position. The robot can guide the wafer gripper to the teaching jig without interfering with the apparatus by approaching the teaching jig based on the corrected prior teaching position. Once the wafer gripper can approach the teaching jig, the wafer teaching method of Patent Document 1 can be executed, and the position of the semiconductor wafer can be automatically taught even in a device having a narrow frontage. is there.
Further, according to the present invention, since the external teaching jig is out of the movable range in the minimum turning posture of the robot, as long as the robot posture is kept at the minimum turning posture in the normal transfer operation, the external teaching jig is used. There is an effect that the robot can be moved freely without being conscious of the interference.
Further, according to the present invention, the robot can move freely within the conventional movable range by removing the external teaching jig during a normal transport operation.

以下、本発明の方法の具体的実施例について、図に基づいて説明する。   Hereinafter, specific examples of the method of the present invention will be described with reference to the drawings.

図１は本発明の実施例を示すロボットの平面図、図４はその側面図である。
図において、1は半導体ウェハ搬送用の水平多関節型のロボットであり、Ｗはロボット１の搬送対象の半導体ウェハである。ロボット1は、昇降自在な円柱状の支柱部2のロボット旋回中心軸７回りに水平面内で旋回する第1アーム3と、第１アーム3の先端に水平面内で旋回自在に取り付けられた第2アーム4と、第２アーム4の先端に水平面内で旋回自在に取り付けられたウェハ把持部5を備えている。ウェハ把持部5は半導体ウェハＷを載置しるＹ字形のハンドであって、Ｙ字形の先端に１組の透過式センサ6を備えている。なお、21は走行軸ユニット、22は走行軸ロボット架台である。ロボット１は走行軸ロボット架台22に固定されている。
ロボット1はつぎのように４自由度を有している。すなわち、図２の平面図に示すように、第１アーム3、第２アーム4およびウェハ把持部5の相対的な角度を保ったまま、第１アーム3を支柱部2の中心軸7回りに旋回させるθ軸動作（旋回）と、図３の平面図に示すように、第１アーム3、第２アーム4およびウェハ把持部5を一定の速度比を保って旋回させることにより、ウェハ把持部5を支柱部2の半径方向に伸縮させるR軸動作(伸縮) と、図４のように、支柱部2を昇降させるZ軸動作(昇降)と、図１のように、走行軸ユニット21の直線動作によりロボット1自身が走行運動するＴ軸動作（走行）である。
ここで、θ軸は反時計回りをプラス方向とし（図２参照）、R軸は、ウェハ把持部5を支柱部2から遠ざける方向、つまりアームを伸ばす方向をプラスとし（図３参照）、Z軸は、支柱部2を上昇させる方向をプラス（図４参照）、Ｔ軸は、ロボットを図面上方へ走行させる方向をプラス（図１参照）とする。 FIG. 1 is a plan view of a robot showing an embodiment of the present invention, and FIG. 4 is a side view thereof.
In the figure, 1 is a horizontal articulated robot for transporting a semiconductor wafer, and W is a semiconductor wafer to be transported by the robot 1. The robot 1 includes a first arm 3 that swivels in a horizontal plane around a robot swivel center axis 7 of a column-shaped support column 2 that can be moved up and down, and a second arm that is pivotally attached to the tip of the first arm 3 in a horizontal plane. An arm 4 and a wafer gripper 5 attached to the tip of the second arm 4 so as to be rotatable in a horizontal plane are provided. The wafer gripping part 5 is a Y-shaped hand on which the semiconductor wafer W is placed, and includes a pair of transmission sensors 6 at the Y-shaped tip. Reference numeral 21 denotes a travel axis unit, and 22 denotes a travel axis robot base. The robot 1 is fixed to a traveling axis robot mount 22.
The robot 1 has four degrees of freedom as follows. That is, as shown in the plan view of FIG. 2, the first arm 3 is moved around the central axis 7 of the support column 2 while maintaining the relative angles of the first arm 3, the second arm 4 and the wafer gripping portion 5. As shown in the plan view of FIG. 3, the θ-axis operation (turning) is turned, and the wafer holding unit is rotated by turning the first arm 3, the second arm 4 and the wafer holding unit 5 while maintaining a constant speed ratio. R-axis operation (extension / contraction) for extending / contracting 5 in the radial direction of the column 2, Z-axis operation (elevating / lowering) for raising / lowering the column 2 as shown in FIG. 4, and the traveling axis unit 21 as shown in FIG. This is a T-axis operation (travel) in which the robot 1 itself travels by a linear motion.
Here, the θ-axis is a counterclockwise plus direction (see FIG. 2), and the R-axis is a plus direction in which the wafer gripping part 5 is moved away from the column part 2, that is, the direction in which the arm is extended (see FIG. 3). The axis indicates that the direction in which the column part 2 is raised is positive (see FIG. 4), and the T axis indicates the direction in which the robot travels upward in the drawing (see FIG. 1).

図５はウェハ把持部5の詳細を示す斜視図である。図において、8はＹ字形のウェハ把持部5の一方の端に取り付けられた発光部であり、9は他方の端に発光部8に対向するように取り付けられた受光部である。発光部8と受光部9で透過式センサ6を構成している。10は発光部8から受光部9に向かう光軸であり、透過式センサ6は光軸10を遮る物体を検出することができる。   FIG. 5 is a perspective view showing details of the wafer gripping portion 5. In the figure, 8 is a light emitting part attached to one end of a Y-shaped wafer gripping part 5, and 9 is a light receiving part attached to the other end so as to face the light emitting part 8. The light emitting unit 8 and the light receiving unit 9 constitute a transmissive sensor 6. Reference numeral 10 denotes an optical axis from the light emitting unit 8 toward the light receiving unit 9, and the transmission sensor 6 can detect an object that blocks the optical axis 10.

図６は本発明のウェハ搬送装置の全体配置を示す平面図である。図において、14と15は処理装置、11と12と13は収納容器、16は教示治具、17は外部教示治具、18は最小旋回姿勢によるロボット1の可動範囲である。外部教示治具17は処理装置の前面外壁19に、その円周の中心が処理装置14内部の教示治具16の中心の正面に位置するよう取り付ける。また外部教示治具17はロボット1の最小旋回姿勢による可動範囲18を外して設置する。こうすることによって、外部教示治具17を設置したままでも、ロボット1は最小旋回姿勢で外部教示治具17と干渉することなく従来どおり走行軸による移動を行うことができる。更に外部教示治具17を取り外し可能な構造としておけば、従来どおりのロボット1の可動範囲を確保できることはいうまでもない。また、本実施例では、収納容器の前面外壁には外部教示治具17を設置していない。これは収納容器の間口は十分に広いからである。   FIG. 6 is a plan view showing the overall arrangement of the wafer conveyance device of the present invention. In the figure, 14 and 15 are processing devices, 11 and 12 and 13 are storage containers, 16 is a teaching jig, 17 is an external teaching jig, and 18 is a movable range of the robot 1 with a minimum turning posture. The external teaching jig 17 is attached to the front outer wall 19 of the processing apparatus so that the center of the circumference is located in front of the center of the teaching jig 16 inside the processing apparatus 14. In addition, the external teaching jig 17 is installed outside the movable range 18 according to the minimum turning posture of the robot 1. In this way, even with the external teaching jig 17 installed, the robot 1 can move on the traveling axis as usual without interfering with the external teaching jig 17 in the minimum turning posture. Furthermore, if the external teaching jig 17 is configured to be removable, it goes without saying that the movable range of the robot 1 can be secured as in the conventional case. In this embodiment, the external teaching jig 17 is not installed on the front outer wall of the storage container. This is because the opening of the storage container is sufficiently wide.

図７は処理装置14に外部教示治具17を取り付けた装置の側面図、及び立面図である。図において、16は教示治具、17は外部教示治具、25はウェハ搬送面、19は処理装置の前面外壁、20は処理装置14の間口、Zofstは、ウェハ搬送面25と外部教示治具17の上面との距離を示し、Rofstは、図面上の教示位置の中心から外部教示治具17の中心までの距離を示す。外部教示治具17は、図のように処理装置の間口20の下部に設置する。これは通常のウェハ搬送時にロボット1のウェハ把持部5と外部教示治具17が干渉しないようロボットの経路から外した結果である。ZofstやRofstは外部教示治具17の取り付け位置を設計した時点で既知であるので、事前にコントローラへセットされる値である。こうして外部教示治具17の教示治具16に対する相対位置は決まるので、外部教示治具17の位置が求まれば、教示治具16の位置を推定することも可能である。   FIG. 7 is a side view and an elevation view of the apparatus in which the external teaching jig 17 is attached to the processing apparatus 14. In the figure, 16 is a teaching jig, 17 is an external teaching jig, 25 is a wafer transfer surface, 19 is a front outer wall of the processing apparatus, 20 is a front end of the processing apparatus 14, and Zofst is a wafer transfer surface 25 and an external teaching jig. 17 indicates the distance from the upper surface of 17 and Rofst indicates the distance from the center of the teaching position on the drawing to the center of the external teaching jig 17. The external teaching jig 17 is installed in the lower part of the front opening 20 of the processing apparatus as shown in the figure. This is a result of removing from the robot path so that the wafer gripping portion 5 of the robot 1 and the external teaching jig 17 do not interfere during normal wafer transfer. Since Zofst and Rofst are known when the mounting position of the external teaching jig 17 is designed, they are values set in advance in the controller. Since the relative position of the external teaching jig 17 with respect to the teaching jig 16 is determined in this way, if the position of the external teaching jig 17 is obtained, the position of the teaching jig 16 can be estimated.

図８は外部教示治具の２つの例を示す図で、(a)はタイプＡの場合、(b)はタイプＢの場合を示す。タイプＡの場合、外部教示治具は円柱の形状をしており、その直径は３０ｍｍ程度、高さは６０ｍｍ程度である。壁面には固定用ピンを使って固定し、そのピンを抜くことによって外部教示治具の取り外しが可能である。タイプＢの場合は、アーチの形状をしており、その円弧部の直径は実ウェハ３００ｍｍよりも小さければ任意の値でよい。図８(a)、(b)に示すように外部教示治具は、ロボット1のウェハ把持部5の透過式センサ6でセンシングすることができる円周部を備えているものであれば、特にその大きさや形状を制限するものではない。本実施例の説明は図８(a)に示すタイプＡの外部教示治具を用いた場合について説明している。   8A and 8B are diagrams showing two examples of the external teaching jig. FIG. 8A shows the case of type A, and FIG. 8B shows the case of type B. In the case of Type A, the external teaching jig has a cylindrical shape, and the diameter is about 30 mm and the height is about 60 mm. The external teaching jig can be removed by fixing the wall surface with a fixing pin and removing the pin. In the case of Type B, it has an arch shape, and the arc portion may have any value as long as the diameter of the arc portion is smaller than 300 mm. As shown in FIGS. 8A and 8B, if the external teaching jig has a circumferential portion that can be sensed by the transmission sensor 6 of the wafer gripping portion 5 of the robot 1, The size and shape are not limited. In the description of the present embodiment, a case where a type A external teaching jig shown in FIG.

図９は本発明の外部教示治具のセンシング方法を説明する図で、(a)は透過式センサ6を用いて外部教示治具17の円周部を検出した時の位置関係を示した平面図、(b)はその側面図である。実際のセンシング動作は、ロボット1のウェハ把持部5を引いた状態から、低速でＲ軸を伸ばし透過式センサ6が外部教示治具17を検出した時のＲ軸とｔｈ軸の値を記憶し、ウェハ把持部5を一旦引き、ウェハ把持部5の角度を変えて前記センシングを繰り返す。これにより、特許文献１に記載の教示治具の位置を求める方法と同じ原理で、外部教示治具17の位置を求めることができる。図９(b)は透過式センサ6が外部教示治具17を検出した状態から、ロボット1のＺ軸を低速で上昇させ透過式センサ6が外部教示治具17を検出しなくなった位置を示したものである。これにより外部教示治具17の上端のＺ軸の位置が求まる。   FIG. 9 is a diagram for explaining the sensing method of the external teaching jig according to the present invention. FIG. 9A is a plan view showing the positional relationship when the circumferential portion of the external teaching jig 17 is detected using the transmission sensor 6. FIG. 2B is a side view thereof. The actual sensing operation stores the values of the R axis and th axis when the transmission sensor 6 detects the external teaching jig 17 by extending the R axis at a low speed from the state in which the wafer gripping part 5 of the robot 1 is pulled. Then, the wafer gripper 5 is pulled once, and the sensing is repeated by changing the angle of the wafer gripper 5. Accordingly, the position of the external teaching jig 17 can be obtained on the same principle as the method for obtaining the position of the teaching jig described in Patent Document 1. FIG. 9 (b) shows the position where the Z-axis of the robot 1 is raised at a low speed from the state in which the transmission sensor 6 detects the external teaching jig 17, and the transmission sensor 6 no longer detects the external teaching jig 17. It is a thing. As a result, the Z-axis position at the upper end of the external teaching jig 17 is obtained.

図１０は本発明による外部教示治具17の位置検出方法を示すフローチャートである。以下、この位置検出方法をステップを追って説明する。
（ステップ１）外部教示治具17を処理装置の前面外壁19に設置する。
（ステップ２）装置図面などの情報から外部教示治具17の取り付け位置は既知なので、外部教示治具17のセンシング開始位置へ自動でウェハ把持部5を移動させることができる。
ステップ３をスキップしてステップ４へ遷移する。
（ステップ３）ロボットのＲ軸を透過式センサ6が外部教示治具17を検出しない位置まで後退させる。
（ステップ４）θ軸を動作させて、ウェハ把持部5の向きを変え、次にＲ軸を動作させて、ウェハ把持部5を前進させて、外部教示治具17にゆっくり接近させ、透過式センサ6が外部教示治具17を最初に検出した（つまり光軸10が外部教示治具17の円周に接する）時のθ軸とＲ軸の座標を記録する。
（ステップ５）ステップ３とステップ４をＮ回繰り返したら、ステップ６へ遷移する。そうでなければステップ３へ戻る。Ｎは３以上の任意の値である。
（ステップ６）ステップ３とステップ４をＮ回繰り返して、ウェハ把持部5を異なる方向から外部教示治具17に接近させて、光軸10が外部教示治具17の円周に接する時のθ軸とＲ軸の座標を複数求めた。これらの値から最小２乗法を解くことにより、外部教示治具17の中心の位置（θＳ、Ｒｓ）を求めて記録する。この解法は特許文献１にて詳細に述べている。
（ステップ７）θ軸を動作させ、ウェハ把持部5が処理装置14へ対して直角となるよう移動させる。更にＲ軸を１０ｍｍ程度前進させ、Ｚ軸を動作させても透過式センサ6が外部教示治具17を確実に検出する状態にする。
（ステップ８）Ｚ軸を動作させ、ウェハ把持部5をゆっくり上昇させながら、透過式センサ6が外部教示治具17の上面を検出しなくなる（つまり光軸10が外部教示治具17の上面を超えた）時のＺ軸の値をＺsとして記録する。
（ステップ９）ステップ６とステップ８とで記録した値と事前にコントローラにセットしておいたＲofstやＺofstを使って処理装置14内部のウェハ教示位置を求める。この値の求め方は、次節で詳述する。推定したウェハ教示位置は、コントローラが事前に保持している事前教示位置とは別で記憶する。事前にコントローラへセットしている教示位置をPos1(θ1、Ｒ1、Ｚ1、Ｔ1)、本センシングで求めた推定教示位置24をPos2(θ2、Ｒ2、Ｚ2、Ｔ2)とする。
（ステップ１０）Pos1とPos2を各軸ごとに比較し、各軸ごとに設けたしきい値Thold(θt、Ｒt、Ｚt、Ｔt)を１軸でも超えているものがあれば、自動教示を中止としステップ１１へ遷移する。これは、図面上の処理装置14の設置位置と実際に設置された位置が大きくずれていることを示しており、自動教示を行う以前に装置の設置状態を確認することが必要だからである。
（ステップ１１）ステップ９で求めたPos1をコントローラの事前教示位置として上書きし、従来の自動教示動作を行う（特願２００３−３５３７８３に詳述）。従来の自動教示が正常終了すると、処理装置14の教示位置が正しく求まる。
（ステップ１２）ロボット1のアームを最小旋回姿勢に畳んで、自動教示終了とする。 FIG. 10 is a flowchart showing a method for detecting the position of the external teaching jig 17 according to the present invention. Hereinafter, this position detection method will be described step by step.
(Step 1) The external teaching jig 17 is installed on the front outer wall 19 of the processing apparatus.
(Step 2) Since the attachment position of the external teaching jig 17 is known from information such as the apparatus drawing, the wafer gripping part 5 can be automatically moved to the sensing start position of the external teaching jig 17.
Skip step 3 and go to step 4.
(Step 3) Retract the R axis of the robot to a position where the transmission sensor 6 does not detect the external teaching jig 17.
(Step 4) Operate the θ-axis to change the orientation of the wafer gripping part 5 and then move the R-axis to advance the wafer gripping part 5 so that it approaches the external teaching jig 17 slowly. The coordinates of the θ axis and the R axis when the sensor 6 first detects the external teaching jig 17 (that is, the optical axis 10 contacts the circumference of the external teaching jig 17) are recorded.
(Step 5) When Step 3 and Step 4 are repeated N times, the process proceeds to Step 6. Otherwise, return to Step 3. N is an arbitrary value of 3 or more.
(Step 6) Steps 3 and 4 are repeated N times so that the wafer gripping portion 5 approaches the external teaching jig 17 from different directions, and θ when the optical axis 10 contacts the circumference of the external teaching jig 17 A plurality of coordinates of the axis and the R axis were obtained. By solving the least square method from these values, the center position (θ S , Rs) of the external teaching jig 17 is obtained and recorded. This solution is described in detail in US Pat.
(Step 7) The θ axis is operated to move the wafer gripping part 5 so as to be perpendicular to the processing apparatus 14. Furthermore, even if the R-axis is advanced about 10 mm and the Z-axis is operated, the transmission type sensor 6 is in a state of reliably detecting the external teaching jig 17.
(Step 8) Operate the Z axis and slowly raise the wafer gripping part 5 while the transmission sensor 6 does not detect the upper surface of the external teaching jig 17 (that is, the optical axis 10 moves the upper surface of the external teaching jig 17). Z) is recorded as Zs.
(Step 9) Using the values recorded in Step 6 and Step 8 and Rofst and Zofst set in the controller in advance, the wafer teaching position inside the processing apparatus 14 is obtained. The method for obtaining this value will be described in detail in the next section. The estimated wafer teaching position is stored separately from the previous teaching position held in advance by the controller. The teaching position set in advance in the controller is Pos1 (θ 1 , R 1 , Z 1 , T 1 ), and the estimated teaching position 24 obtained by this sensing is Pos2 (θ 2 , R 2 , Z 2 , T 2 ). And
(Step 10) If Pos1 and Pos2 are compared for each axis, and there is one that exceeds the threshold value Thold (θ t , R t , Z t , T t ) provided for each axis, The automatic teaching is stopped and the process proceeds to step 11. This indicates that the installation position of the processing apparatus 14 on the drawing and the actual installation position are greatly deviated, and it is necessary to check the installation state of the apparatus before performing automatic teaching.
(Step 11) Pos1 obtained in Step 9 is overwritten as the prior teaching position of the controller, and a conventional automatic teaching operation is performed (details are described in Japanese Patent Application No. 2003-353783). When the conventional automatic teaching is normally completed, the teaching position of the processing device 14 is correctly obtained.
(Step 12) The arm of the robot 1 is folded to the minimum turning posture and the automatic teaching is finished.

図１１は本発明のウェハ位置推定方法を説明する図である。本図に従ってステップ９で述べた外部教示治具17の推定位置から処理装置内部の教示治具16の位置を推定する方法を説明する。図において、Ｒｓはステップ６で求めたロボット旋回中心7から外部教示治具17の中心までの距離である。θSはステップ６で求めたロボット旋回中心7から外部教示治具17の中心までのトラック軸に対する角度である。Ｔ1は外部教示治具17をセンシングした際のロボット旋回中心7のトラック軸の値である。これらの値からウェハ位置Pos2(θ2、Ｒ2、Ｚ2、Ｔ2)は、式（１）〜（４）により求めることができる。 FIG. 11 is a diagram for explaining the wafer position estimation method of the present invention. A method for estimating the position of the teaching jig 16 in the processing apparatus from the estimated position of the external teaching jig 17 described in step 9 will be described with reference to FIG. In the figure, Rs is the distance from the robot turning center 7 obtained in step 6 to the center of the external teaching jig 17. θ S is an angle with respect to the track axis from the robot turning center 7 obtained in step 6 to the center of the external teaching jig 17. T 1 is the value of the track axis of the robot turning center 7 when the external teaching jig 17 is sensed. From these values, the wafer position Pos2 (θ 2 , R 2 , Z 2 , T 2 ) can be obtained by the equations (1) to (4).

Figure 0004506255
Figure 0004506255

このように、Pos2で事前教示位置が補正されるので、従来のウェハ教示方法において、ウェハ把持部5が処理装置14内に設置された教示治具16へアプローチする際の経路も補正され、ウェハ把持部5が処理装置の間口20を通過する際にウェハ把持部5を装置に干渉することを回避できる。   As described above, since the prior teaching position is corrected by Pos2, in the conventional wafer teaching method, the path when the wafer gripper 5 approaches the teaching jig 16 installed in the processing apparatus 14 is also corrected, and the wafer is corrected. It is possible to avoid the wafer gripping part 5 from interfering with the apparatus when the gripping part 5 passes through the front opening 20 of the processing apparatus.

本発明は、半導体ウェハ搬送用ロボットに半導体ウェハの位置を教示する方法として有用である。   The present invention is useful as a method for teaching a position of a semiconductor wafer to a semiconductor wafer transfer robot.

本発明のロボットの走行運動を示す平面図The top view which shows the running motion of the robot of this invention 本発明のロボットの旋回動作を示す平面図Plan view showing the turning motion of the robot of the present invention 本発明のロボットの伸縮動作を示す平面図The top view which shows the expansion-contraction operation | movement of the robot of this invention 本発明のロボットの昇降動作を示す側面図The side view which shows the raising / lowering operation | movement of the robot of this invention 図１における透過式センサを示す斜視図The perspective view which shows the transmission type sensor in FIG. 本発明のウェハ搬送装置の全体配置を示す平面図The top view which shows the whole arrangement | positioning of the wafer conveyance apparatus of this invention 本発明の外部教示治具の取付状態を示す説明図Explanatory drawing which shows the attachment state of the external teaching jig of this invention 本発明の外部教示治具の形状を示す斜視図The perspective view which shows the shape of the external teaching jig of this invention 本発明の外部教示治具の位置検出方法を示す平面図The top view which shows the position detection method of the external teaching jig of this invention 本発明の動作を示すフローチャート図The flowchart figure which shows operation | movement of this invention. 本発明の教示位置推定方法を示す説明図Explanatory drawing which shows the teaching position estimation method of this invention

符号の説明Explanation of symbols

１ ロボット
２ 支柱部
３ 第１アーム
４ 第２アーム
５ ウェハ把持部
６ 透過式センサ
７ ロボット旋回中心
８ 発光部
９ 受光部
１０ 光軸
１１、１２、１３ 収納容器
１４、１５ 処理装置
１６ 教示治具
１７、２３ 外部教示治具
１８ 最小旋回姿勢による可動範囲
１９ 処理装置の前面外壁
２０ 処理装置の間口
２１ 走行軸ユニット
２２ 可動架台
２４ 推定教示位置
２５ ウェハ搬送面
２６ 固定ピン DESCRIPTION OF SYMBOLS 1 Robot 2 Support | pillar part 3 1st arm 4 2nd arm 5 Wafer holding part 6 Transmission type sensor 7 Robot rotation center 8 Light emitting part 9 Light receiving part 10 Optical axes 11, 12, 13 Storage containers 14, 15 Processing apparatus 16 Teaching jig 17, 23 External teaching jig 18 Movable range 19 with minimum turning posture Front outer wall 20 of processing apparatus Frontage 21 of processing apparatus Traveling axis unit 22 Movable mount 24 Estimated teaching position 25 Wafer transfer surface 26 Fixed pin

Claims (5)

半導体ウェハを把持するウェハ把持部と、旋回θ軸方向と、前記旋回の中心から半径方向に伸縮するＲ軸方向と、昇降Ｚ軸方向とに前記ウェハ把持部を動作可能に支持する動作部と、を備えたロボットに、前記半導体ウェハを搬送する載置位置を教示するウェハ位置教示方法において、
前記ロボットから見て、前記ウェハ把持部を通過させる間口の先に前記載置位置がある場合のウェハ位置教示方法であって、
前記Ｒ軸方向に対して直角で水平な光軸を有するセンサを前記ウェハ把持部に設けるステップＡと、
前記載置位置を事前教示位置Ｐｏｓ１として教示するステップＢと、
前記センサが検出可能な円弧部を有する載置位置用教示治具を前記載置位置に設置するステップＣと、
前記センサが検出可能な円弧部を有する外部教示治具を前記載置位置との相対位置が既知である前記間口の前面外壁に設けるステップＤと、
前記θ軸と前記Ｒ軸とを動作させながら前記センサによって前記円弧部を検出し、そのとき記憶した前記動作部の前記θ軸と前記Ｒ軸の位置から、前記外部教示治具の位置を求めるステップＥと、
前記Ｚ軸を動作させながら前記外部教示治具の水平面を検出し、そのとき記憶した前記動作部の前記Ｚ軸の位置から前記外部教示治具の高さを求めるステップＦと、
前記ステップＥと前記ステップＦとの結果から、前記載置位置を推定位置Ｐｏｓ２として求めるステップＧと、
前記事前教示位置Ｐｏｓ１の各軸の位置と前記推定位置Ｐｏｓ２の各軸の位置とをそれぞれ比較するステップＨと、を備え、
前記ステップＨにおいて比較した各軸の位置の差が予め定めた値以内であれば、前記推定位置Ｐｏｓ２を前記事前教示位置Ｐｏｓ１として記憶し、前記ウェハ把持部が前記間口を通過するように動作させ、前記センサによる前記載置位置用教示治具の検出を行い、
前記ステップＨにおいて比較した各軸の位置の差が予め定めた値を超えていれば、前記ウェハ把持部が前記間口を通過する動作を中止すること、を特徴とするウェハ位置教示方法。 A wafer gripping part for gripping the semiconductor wafer, a turning θ-axis direction, an R-axis direction extending or contracting in the radial direction from the center of the turning, and an operating part for supporting the wafer gripping part in an up-and-down Z-axis direction. In a wafer position teaching method for teaching a mounting position for conveying the semiconductor wafer to a robot equipped with
A wafer position teaching method when the placement position is at the tip of a frontage that allows the wafer gripping portion to pass through as seen from the robot,
Providing the wafer grip with a sensor having a horizontal optical axis perpendicular to the R-axis direction;
Step B for teaching the above-described placement position as the pre-teaching position Pos1,
Installing a mounting position teaching jig having a circular arc part detectable by the sensor at the mounting position;
A step D of providing an external teaching jig having an arc portion that can be detected by the sensor on the front outer wall of the frontage, whose relative position to the placement position is known;
The circular arc portion is detected by the sensor while operating the θ axis and the R axis, and the position of the external teaching jig is obtained from the position of the θ axis and the R axis of the operating portion stored at that time. Step E,
Detecting the horizontal plane of the external teaching jig while operating the Z-axis, and obtaining the height of the external teaching jig from the Z-axis position of the operating unit stored at that time;
From the results of the step E and the step F, a step G for obtaining the above-mentioned placement position as the estimated position Pos2;
Comparing the position of each axis of the pre-teach position Pos1 with the position of each axis of the estimated position Pos2, respectively.
If the difference between the positions of the axes compared in step H is within a predetermined value, the estimated position Pos2 is stored as the pre-taught position Pos1, and the wafer gripper operates so as to pass through the frontage. And detecting the placement position teaching jig by the sensor,
A wafer position teaching method , wherein if the difference between the positions of the axes compared in step H exceeds a predetermined value, the operation of the wafer gripping part passing through the frontage is stopped . 半導体ウェハを把持するウェハ把持部と、A wafer gripping part for gripping a semiconductor wafer;
旋回θ軸方向と、前記旋回の中心から半径方向に伸縮するＲ軸方向と、昇降Ｚ軸方向とに前記ウェハ把持部を動作可能に支持する動作部と、An operation unit that operably supports the wafer gripping unit in a turning θ-axis direction, an R-axis direction that expands and contracts in a radial direction from the center of the turning, and an elevating Z-axis direction;
前記ウェハ把持部に設けられ前記Ｒ軸方向に対して直角で水平な光軸を有するセンサと、を備え、A sensor provided on the wafer gripping portion and having a horizontal optical axis perpendicular to the R-axis direction,
前記半導体ウェハを搬送する載置位置に設置された載置位置用教示治具を前記センサで検出することによって、前記載置位置を記憶するロボットにおいて、In the robot for storing the mounting position described above by detecting the mounting position teaching jig installed at the mounting position for transporting the semiconductor wafer by the sensor,
前記ロボットから見て、前記ウェハ把持部を通過させる間口の先に前記載置位置がある場合、When viewed from the robot, if there is a placement position described above at the tip of the front through which the wafer gripping portion passes,
前記載置位置を事前教示位置Ｐｏｓ１として記憶し、Store the previously described position as the pre-taught position Pos1,
前記間口の前面外壁に設けられ、前記載置位置との相対位置が既知であって、前記センサが検出可能な円弧部を有する外部教示治具を前記センサで検出し、An external teaching jig provided on the front outer wall of the frontage, whose relative position to the above-described mounting position is known, and having an arc portion that can be detected by the sensor is detected by the sensor,
前記動作部の前記θ軸と前記Ｒ軸とを動作させながら前記センサによって前記円弧部を検出し、そのとき記憶した前記θ軸と前記Ｒ軸の位置から、前記外部教示治具の位置を求め、The circular arc portion is detected by the sensor while operating the θ axis and the R axis of the operating portion, and the position of the external teaching jig is obtained from the stored positions of the θ axis and the R axis. ,
前記動作部の前記Ｚ軸を動作させながら前記外部教示治具の水平面を検出し、そのとき記憶した前記Ｚ軸の位置から前記外部教示治具の高さを求め、Detecting the horizontal surface of the external teaching jig while operating the Z axis of the operating unit, obtaining the height of the external teaching jig from the Z-axis position stored at that time,
前記外部教示治具の位置と高さから前記載置位置を推定位置Ｐｏｓ２として求め、From the position and height of the external teaching jig, the previous position is obtained as an estimated position Pos2,
前記事前教示位置Ｐｏｓ１の各軸の位置と前記推定位置Ｐｏｓ２の各軸の位置とをそれぞれ比較し、The position of each axis of the pre-teach position Pos1 is compared with the position of each axis of the estimated position Pos2, respectively.
前記比較した各軸の位置の差が予め定めた値以内であれば、前記推定位置Ｐｏｓ２を前記事前教示位置Ｐｏｓ１として記憶し、前記ウェハ把持部が前記間口を通過するように動作させ、前記センサによる前記載置位置用教示治具の検出を行い、If the difference between the positions of the compared axes is within a predetermined value, the estimated position Pos2 is stored as the prior teaching position Pos1, and the wafer gripper is operated so as to pass through the frontage, Detect the above-mentioned placement position teaching jig with a sensor,
前記比較した各軸の位置の差が予め定めた値を超えていれば、前記ウェハ把持部が前記間口を通過する動作を中止すること、を特徴とするロボット。The robot according to claim 1, wherein if the difference between the positions of the compared axes exceeds a predetermined value, the operation of the wafer gripping part passing through the frontage is stopped. 半導体ウェハを把持するウェハ把持部と、A wafer gripping part for gripping a semiconductor wafer;
旋回θ軸方向と、前記旋回の中心から半径方向に伸縮するＲ軸方向と、昇降Ｚ軸方向とに前記ウェハ把持部を動作可能に支持する動作部と、An operation unit that operably supports the wafer gripping unit in a turning θ-axis direction, an R-axis direction that expands and contracts in a radial direction from the center of the turning, and an elevating Z-axis direction;
前記ウェハ把持部に設けられ前記Ｒ軸方向に対して直角で水平な光軸を有するセンサと、を備え、A sensor provided on the wafer gripping portion and having a horizontal optical axis perpendicular to the R-axis direction,
前記半導体ウェハを搬送する載置位置に設置された載置位置用教示治具を前記センサで検出することによって前記載置位置を記憶するロボットにおいて、In the robot for storing the mounting position by detecting the mounting position teaching jig installed at the mounting position for transporting the semiconductor wafer by the sensor,
前記ロボットから見て、前記ウェハ把持部を通過させる間口の先に前記載置位置がある場合、When viewed from the robot, if there is a placement position described above at the tip of the front through which the wafer gripping portion passes,
前記間口の前面外壁に設けられ、前記載置位置との相対位置が既知であって、前記センサが検出可能な円弧部を有する外部教示治具を前記センサによって検出し、An external teaching jig provided on the front outer wall of the frontage, whose relative position to the above-mentioned placement position is known, and having an arc portion that can be detected by the sensor is detected by the sensor,
該検出の際に記憶した前記動作部の前記Ｒ軸と前記θ軸と前記Ｚ軸の位置から求めた前記外部教示治具の位置と高さによって前記載置位置の推定位置Ｐｏｓ２を求め、前記推定位置Ｐｏｓ２と、事前に教示された前記載置位置の事前教示位置Ｐｏｓ１と、を比較し、該比較の結果に応じて、前記ウェハ把持部が前記間口を通過して前記載置位置用教示治具を検出するか否かを決定すること、を特徴とするロボット。The estimated position Pos2 of the above-mentioned installation position is obtained from the position and height of the external teaching jig obtained from the positions of the R-axis, the θ-axis, and the Z-axis of the operation unit stored at the time of the detection The estimated position Pos2 is compared with the pre-taught position pre-taught position Pos1 taught in advance, and according to the result of the comparison, the wafer gripper passes through the frontage and teaches the previous position. A robot characterized by determining whether or not to detect a jig. 前記外部教示治具が、前記ロボットの前記動作部の最小旋回姿勢での可動範囲外に設置されたこと、を特徴とする請求項２または３記載のロボット。The robot according to claim 2 or 3, wherein the external teaching jig is installed outside a movable range in a minimum turning posture of the operation unit of the robot. 前記外部教示治具が、前記間口の前面外壁から取り外し可能に構成されたこと、を特徴とする請求項２または３記載のロボット。4. The robot according to claim 2, wherein the external teaching jig is configured to be removable from a front outer wall of the frontage.
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