JP4417400B2 - Solder inspection line centralized management system and management device used therefor - Google Patents

Description

  In the present invention, when cream-like solder is printed on a printed circuit board by a solder printing device or the like for surface mounting electronic components or the like, the formation state of the printed solder is measured and inspected by a printed solder inspection device. The present invention relates to a technique for configuring a plurality of inspection lines and centrally managing the operation state or inspection state of the plurality of inspection lines or the printed solder inspection apparatus.

  In particular, the displacement (including height) and brightness (substrate) of the printed solder on the substrate obtained as a result of irradiating the substrate (hereinafter referred to simply as “substrate”) with light. Image (height, area, volume, etc.) that is an element representing the amount of solder printed when solder printing is performed from the measurement data of the amount of light reflected from the light and the amount of light received (including light intensity). In the following, a part or all of these are converted into “images”), and the images are compared with reference data (hereinafter referred to as “standard data”) that serves as a criterion for determination. In the inspection apparatus and method for judging, it is difficult to accurately generate the image from the pattern shape of the printed solder portion of the substrate, the printed solder state, the measurement condition, the noise, the condition for converting the above data, and the combination thereof. It is. For this reason, in order not to generate defective products, reference data for determination is set more strictly in the determination means, so even if it is a non-defective product, an erroneous determination result may be output. The determination result is called “false news”.)

  In general, a plurality of types of substrates are inspected in parallel on different inspection lines. At that time, in order to take countermeasures when a false alarm occurs in each of the plurality of inspection lines, it is inefficient to have people assigned to each inspection line, so there is a method of centrally managing each inspection line at the center It is considered (see Patent Document 1).

  The technique of Patent Document 1 is a technique for centrally managing a plurality of appearance inspection apparatuses for inspecting the appearance of a board on which mounted components are mounted, and receives centralized video signals received from each appearance inspection apparatus. A technology that displays data on the device's monitor, looks at the monitor where the operator determines that it is defective, conducts an appearance inspection, and if it is not defective, determines that it is good, thereby replacing the substrate data determined to be defective It is.

JP-A-10-153556

  The technique as described in Patent Document 1 has the following problems. In other words, since it was a video image by a camera or the like, that is, a two-dimensional image, whether or not it was a false report was not sufficiently accurate in determining whether or not the false report was good.

  In order to solve the above problem, it is desired to display a three-dimensional image. However, a three-dimensional image has a large amount of data and tends to take time for communication or display. For this reason, it is desired to immediately determine whether or not it is a false report. However, there are problems such as it takes a long time to display, is difficult to determine because it is out of real time, and is inefficient.

  An object of the present invention is to display an image of a three-dimensional shape based on a measurement value used by the inspection device for determining the quality of the solder shape on the management device side to determine whether it is a false report of the operator, and to be easily handled by the operator To provide centralized management technology. In addition, a technique is provided in which an operator can quickly determine whether or not the information is false. Furthermore, the present invention provides a technology capable of switching and displaying a list screen capable of grasping the state of occurrence of defects in all inspection lines (an opportunity to determine whether it is a false report) and a countermeasure screen capable of taking countermeasures for false reports immediately.

  Some terms are previously defined here. "Inspection line" is equipment that carries the printed circuit board to the inspection position and inspects at least the solder state of the printed circuit board, and the printed solder inspection apparatus constitutes a part of this equipment. Or most can be configured. “Inspection” is an operation that includes a printed solder inspection apparatus that measures printed circuit boards that are conveyed one after another and determines whether the solder state is good or defective based on the measurement results. Therefore, for example, the inspection is (a) the determination of the printed circuit board is completed, (b) the determination result is output, (c) the inspection target is switched to the next printed circuit board, (d) the next printed circuit board is determined, and (e) ) When the next printed circuit board determination result is output in the process indicated by..., The process is included in the “inspection”. Further, when each process is switched, a time for temporarily stopping the operation may occur. However, this is a known time in advance and is a time that contributes to the inspection process. Does not fall under “Pause inspection line”. The “pause of inspection” or “pause of inspection line” in the present invention refers to an accidental pause caused by the result of determination by the determination means. In other words, the suspension is not scheduled on a normal process. In addition, the “pause of inspection” or “pause of inspection line” may be performed at a process changeover, for example, between (b) and (c) above. However, the present invention is not limited to this. Further, “continue inspection” or “continue inspection” after the suspension of inspection means returning to a normal process of inspection. For example, if the operation is temporarily stopped between (b) and (c), it means that the operation is started from (c).

  In addition, after the determination means determines that it is defective (this is a “temporary decision”), the operator gives an instruction of “good or bad” or “an instruction for false information, an instruction to confirm” (these Is “formal decision” with respect to “provisional decision.”) Means that, from the inspection step, an operation of “continue the inspection as it is, continue until it is instructed by the operator” is instructed. Therefore, expressions such as “good” and “bad” are to be described in an understandable manner, and technically, a code that can be interpreted by each means is sufficient.

In order to achieve the above object, the invention according to claim 1 has an inspection section (50) for measuring the solder state of the printed circuit board and judging whether the solder state is good or bad based on the measurement result. A printed solder inspection apparatus (100) arranged in a plurality of inspection lines, and a management apparatus (200) capable of communicating with the plurality of printed solder inspection apparatuses and managing an operation state including an inspection state of the printed solder inspection apparatus A solder inspection line centralized management system, wherein each of the printed solder inspection apparatuses pauses the inspection at least when the determination result by the inspection unit is defective, and is temporarily stopped And a control means (9) for transmitting state information including a three-dimensional image based on the measurement result representing the shape of the solder spot determined to be defective to the management device, Management device, the an operator instruction accepting means for accepting an instruction to said control means including a quality determination by the operator if there is a temporary test line suspended (22f), display means (24), wherein each printing solder inspection The status information is received from the apparatus, and a list is displayed on the screen of the display means so as to be able to identify whether or not the inspection at each inspection line is paused, and then the inspection line being paused If there is is provided with at least defect and the determined display control means measures the screen for displaying the three-dimensional image of the solder portions to be displayed on the preferentially the list (22), wherein the control means When there is a good instruction from the operator instruction receiving means, the inspection of the printed circuit board in the corresponding inspection line is canceled and the inspection is continued. When there is an instruction for failure from the indication receiving means, the temporary stop state is continued to shift to the next instruction waiting state, and further, the inspection is continued or the next instruction waiting state is The status information is updated and transmitted to the management device, and the display control means of the management device further displays the screen if the inspection of any inspection line is not paused when the status information is updated. The display of the countermeasure screen before the update is stopped and the list is displayed based on the updated state information, and if there is any other inspection line that is temporarily stopped, the other inspection line that is temporarily stopped is displayed. Switch to the countermeasure screen.

According to a second aspect of the present invention, in the first aspect of the invention, the control unit compresses a three-dimensional image based on the measurement result and sends the compressed three-dimensional image to the management device, and the display control unit includes an image storage unit. (22) a configuration in which the compressed three-dimensional image is expanded and expanded and stored in an image storage unit, and when the three-dimensional image is displayed, the image is read from the image storage unit and displayed It was.

The invention of claim 3 is the invention according to claim 2, wherein the display control unit, configured to by thinning out pixels at predetermined intervals of three-dimensional images received from the printing solder inspection apparatus displayed on the display means and did.

According to a fourth aspect of the present invention, in the third aspect of the present invention, the display control means receives the rotation instruction, further thins out the pixels of the three-dimensional image thinned out at the predetermined interval, and performs the rotation. The display unit is configured to rotate the display according to the instruction.

According to a fifth aspect of the present invention, in the invention according to the second, third, or fourth aspect , the display control means is a case where the state information is updated, and cancels the suspension before the update and If there is an inspection line switched to the continuation of the inspection after the update, the three-dimensional image stored in the image storage unit corresponding to the inspection line before the update is deleted.

According to the sixth aspect of the present invention, the solder state of the printed circuit board is measured after the solder is printed, the quality of the printed circuit board is determined based on the measurement result, and the solder state of the printed circuit board is sequentially determined. Inspected, includes a plurality of printed solder inspection apparatuses arranged on a plurality of inspection lines and connected to the network to be communicable, and sent from each of the printed solder inspection apparatuses, including at least a primary stop state due to a defect. Information and a management device that receives and centrally manages status information including a three-dimensional image based on the measurement result, wherein the management device receives the status information from the display means (24) and each of the printed solder inspection devices. When receiving and displaying a list on the screen of the display means so that it can be identified whether or not the inspection at each inspection line is temporarily stopped, And display control means for preferentially displaying a countermeasure screen for displaying the three-dimensional image of the solder points where it is determined that at least defect (22), when there is a test line in stopping at the one, the Paused operator An instruction for correcting the defect determination by the printed solder inspection apparatus arranged on the inspection line to a good determination or an instruction for confirming the determination of the defect is received, and the printed solder inspection apparatus for the inspection line that is temporarily stopped And an operator instruction receiving means (22f) for transmitting an instruction.

According to the first or sixth aspect of the present invention, the printed solder inspection apparatus generates a three-dimensional image based on the measurement value used for determining the quality of the solder shape and displays it on the management apparatus side. Since the determination is based on the image based on the measurement value used for the determination by the printed solder inspection apparatus, it is easy to take the correspondence of the determination. In addition, since the inspection status of the inspection line is displayed as a list, it is possible to grasp the overall countermeasure time and the like. In addition, since the priority is given to the display of the countermeasure screen, the operator can quickly take measures and take measures without leaking.

According to the first aspect of the present invention, since the management device side is configured to respond appropriately and promptly to the status information from the printed solder inspection device side, the operator can immediately move on to the next countermeasure. In particular, a countermeasure screen for a temporarily stopped inspection line is displayed with priority.

According to invention of Claim 2, 3 or 4 , a three-dimensional display can be displayed immediately and quickly.

  Embodiments of the present invention will be described with reference to FIGS. FIG. 1 is a diagram for explaining the entire first embodiment according to the present invention. FIG. 2 is a diagram showing a functional configuration of the printed solder inspection apparatus in FIG. FIG. 3 is a diagram illustrating a functional configuration of the management apparatus in FIG. FIG. 4 is a diagram showing an example in which the inspection status of each inspection line is displayed as a list. FIG. 5 is a diagram illustrating a display example of a countermeasure screen for countermeasures against NG.

  In FIG. 1, a plurality of printed solder inspection apparatuses 100 are arranged on an inspection line for inspecting the solder state of a printed circuit board on which cream solder is printed. The inspection line is a facility that carries the printed circuit board to the inspection position and inspects at least the solder state of the printed circuit board, and the printed solder inspection apparatus constitutes at least a part of this facility.

  The inspection of the board 1 is an operation including a printed solder inspection apparatus that measures a printed board conveyed one after another and determines whether the solder state is good or defective based on the measurement result. Therefore, the inspection referred to here includes, for example, an inspection process. For example, (a) the printed circuit board is determined, (b) the determination result is output, (c) the inspection target is switched to the next printed circuit board, (d) the next (E) Output the determination result of the next printed circuit board.

  The management device 200 and each inspection device 100 are communicably connected via a network NW. The management device 200 collects status information including the inspection status from each inspection device 100 and displays the status to the operator for notification. The inspection status may be collected from the printed solder inspection device 100 side by reporting (transmitting) the inspection status to the management device 200 according to the progress of the inspection, or each printed solder inspection from the management device 200 at a predetermined clock. The form which polls and listens to the apparatus 100 may be sufficient. The inspection status includes the progress of the inspection process. In other words, it includes the operating state.

  The management apparatus 200 includes information indicating an inspection status and an image as state information collected from each inspection apparatus 100. The information indicating the inspection status includes, for example, an inspection line ID (a code for identifying the inspection line), a printed circuit board ID (identification information for specifying a printed board), information “Measuring” indicating that the inspection is ongoing, a determination Since the means is determined to be NG, an instruction from the operator in the standby state of “NG (Wait)” or “NG (Wait)” indicating that it is waiting until the next instruction by the operator or the like (pauses the operation) When the false report is confirmed and “defective” is confirmed, the defective printed board is removed, information “NG (stop)” indicating waiting for an instruction to start the next inspection, and information indicating that the inspection line is stopped due to a malfunction. “Error”, the number of printed circuit boards to be inspected, the number of printed circuit boards that have been inspected, the number of printed circuit boards determined to be NG, and the like. Also, there may be information “Pass” (when the line is passed without inspection) or “OFFLINE” (when the inspection line is not configured) indicating the state of the inspection line. These are information input from the operating means of the user interface 11. As an image, there is a 3D image (three-dimensional image) showing a solder state of a solder spot determined to be NG. At least, this invention requires “NG (Wait)” 3D image at that time. Hereinafter, the printed board is simply referred to as a board.

  In this document, an image or a 3D image is a visual image when displayed on a display means or the like, but when processed internally or treated as information, Means image data.

  Furthermore, in addition to the above information, the management apparatus 200 sets the status information indicating the inspection status as a determination target so that there are a plurality of inspection items and which is determined as NG by the printed solder inspection apparatus. The shape value for each item representing the solder shape is also acquired for each solder location.

  In FIG. 2, the configuration from the measurement unit 3 to the determination unit 6 constitutes an inspection unit 50. The measuring means 3 is, for example, a laser displacement meter, and includes a sensor 3a and a measurement processing unit 3b. The sensor 3a includes a laser light source capable of irradiating a laser in each direction of the X axis and the Y axis by scanning the substrate 1 mounted on the movable table 2, and a light receiving means for receiving reflected light from the substrate 1. In particular, the displacement of the printed solder portion, that is, the height (Z-axis direction) is measured in association with the position. At that time, the received light amount (luminance) corresponding to the position is also obtained from the solder surface. Although detailed explanation of the operation as a laser displacement meter is omitted, there is a principle of JP-A-3-291512 filed by the same applicant as a principle.

  In the measurement processing unit 3b, layout information including a layout diagram of a printed solder spot or a resist spot when the board 1 to be inspected is designed is stored in the board information storage means 10 to be described later. In accordance with the layout information, the moving mechanism 3c is controlled to cause the sensor 3a and the moving base 2 on which the substrate 1 is mounted to be relatively scanned, and the sensor 3a performs measurement, and the sensor 3a corresponds to the position of the printed solder location. Then, the detected displacement amount and / or received light amount are output as measurement data. Similarly, the measurement processing unit 3b controls the camera 2d to take a picture.

  The board information storage means 10 stores at least layout information and reference data as board information to be inspected. The layout information is a layout diagram when the board 1 to be inspected is designed. For example, a printed solder location, a resist location where the printed solder does not appear, and a recognition mark (not shown) that serves as a reference for the location, etc. The arrangement information on the substrate is stored. This layout information itself can be displayed as an image (as a layout screen) on the display means. In addition, reference data used as a reference when the substrate 1 is inspected to determine pass / fail is stored corresponding to the substrate 1 to be inspected. These reference data are prepared for each solder location, for example, the height, area, volume, and solder defect of the printed solder location, and the printed solder at the solder location is quantitatively (image-wise) quality determination. This is the standard data.

  If there are many types of substrates 1 to be inspected, the substrate information is stored in the substrate information storage means 3 with identification information, and a list of identification information and / or a layout screen is displayed on the user interface 11. The information can be selected by being displayed on the display means and designated by a marker or the like on the screen by the operation means.

  The data processing means 4 receives the position of the solder spot of the substrate 1 measured by the measuring means 3, the displacement information (displacement amount) and the luminance information (light reception amount) at the position, and the image parameter values stored in advance. And binarized, and the binarized measurement data is stored in the storage unit.

  The data generation means 5 is a means for processing and generating quantitative image data for determination from measurement data in order to quantitatively determine the state of the solder printed on the substrate 1. The image data is data that represents the amount of solder in the printed solder location, and, similar to the above-described reference data, the height, area, volume, and defect of each solder location (there is no amount of solder to be present) State detection). These data such as height, area, and volume are three-dimensional image information or information that can be elements thereof. Note that not all of the above images are required to determine the substrate 1, but at least one of height, area, and volume is indispensable. In the determination, what is determined as the image data of the substrate 1 to be inspected or which combination of image data is determined may differ depending on the type and content of the substrate 1.

  The determination means 6 receives the image data output from the image processing means 5 and compares it with the reference data from the board information storage means 10 to determine the quality of each solder location. In this example, the determination means 6 determines for each solder location, and outputs “OK” if it is good, or “NG” if it is not (defective). The determination is performed for a plurality of types of shape values for each item, and the result of pass / fail is output for each item, and the pass / fail determination is performed for the shape value for each item. Shape values include “Height” (height), “Areas” (area ratio), “Volume” (volume ratio), X-WIDTH (width in X direction), Y-WIDTH (width in Y direction), “Ht− Scatter "(height unevenness), X-shift (shift X ratio), Y-shift (shift Y ratio), and the like. The determination means 6 outputs the determination result at the stage before the inspection of one target substrate 1 is completed and before the next substrate 1 is started. Of course, the determination may be made for each solder location and the result may be output.

  The 3D image forming unit 7 forms a stereoscopic image at the location determined by the determining unit 6 based on the measurement data. For example, the 3D image forming unit 7 may be the same image as the image indicating the volume generated by the data generating unit 5. The reason why the 3D image forming unit 7 and the data generating unit 5 are provided separately is to increase the degree of freedom in designing each other.

  The 3D image forming unit 7 generates at least a 3D image of a solder spot (hereinafter, also referred to as “NG solder spot”) determined to be NG (defect) by the determination unit 6, that is, NG. To do.

The control unit 9 receives an instruction from the user interface 11 and refers to information for specifying the substrate 1 to be inspected, which is stored in the design information storage unit 10. 4, data generation means 5, design information storage means 10, determination means 6, 3D image forming means, etc.). The control means 9 performs overall control of each main part and manages the result of the control or receiving a response. For example, the control means 9 manages and controls as shown in the following (1) to (5). In particular, the management and control of (2) to (5) is performed from the start of the inspection of one substrate 1 to before the start of the inspection of the next substrate 1, and this is repeated for each substrate 1.
(1) Acquisition of inspection line No. and substrate ID for specifying the substrate 1 to be inspected.
(2) Confirmation that the inspection is ongoing in response to OK as a determination result from the determination means 6. Counting the number of substrates 1 determined to be OK. Then, the inspection line No., substrate ID, “Measuring” information indicating that the inspection is ongoing, the number of substrates 1, and the like are transmitted to the management apparatus 200 via the communication interface 12.

  (3) When NG is received from the determination means 6, a part or all of the main parts such as the inspection unit 50 are temporarily stopped (the inspection process is temporarily stopped), and the solder ID and 3D image of the NG location are displayed. get. Then, the inspection line No., the board ID, the information “NG (Wait)” indicating that the next instruction is awaited because the determination is NG, the solder ID of the NG location, and the 3D image of the solder location are displayed on the communication interface 12. To the management apparatus 200. Since a 3D image has a large capacity, it is compressed and transmitted. Furthermore, the management apparatus 200 also includes the shape value for each item representing the solder shape as the determination target so that it can be understood that there are a plurality of inspection items and which is determined to be NG as the state information. Each time it is acquired and transmitted to the management apparatus 200. That is, “Height”, “Areas”, “Volume”, X-WIDTH, Y-WIDTH ”,“ Ht-Scatter ”,“ X-shift ”,“ Y-shift ”, etc. Is the value of In addition, when it is determined as NG, the control unit 9 may also send image data of the solder spot imaged by the camera 3.

  (4) After (3) above, an instruction “OK”, which is a determination result of “good” by the operator (that is, a recognition result of “false information”) is received from the management device 200 via the communication interface 12. At that time, the main parts that have been on standby after canceling the standby are operated as they are (the operation of the next inspection process is performed when the operation is temporarily stopped), and the state (2) is shifted to. When an instruction of “NG”, which is a determination result of “defective” by the operator (that is, a result of confirmation that it is defective) is received, each main part such as the inspection unit 50 is determined to be defective from the standby state. In order to carry out the work to remove the substrate 1, the state is shifted to the state where the inspection of the corresponding substrate 1 is finished, and the standby state information “NG (Wait)” among the state information is changed to the end state information “NG (Stop)”. To the management apparatus 200, the fact that the process has been completed for the replacement of the board 1 is transmitted. After that, the substrate 1 is actually removed by an operator or the like, and after receiving a start instruction, the operation of each main part is started to shift to the state (2). That is, the inspection is started from a new substrate 1.

  (5) When each main part is controlled and there is no response from each main part, or when the expected output from each main part does not come after a predetermined time, etc., each main part is stopped. Then, “Error” informing the fact is included in the status information together with the inspection line No. and the board ID, and transmitted to the management apparatus 200 via the communication interface 12. Then, the inspection operation is stopped. The state information in (3), (4), and (5) above is transmitted to the management device after the inspection of one substrate 1 is started until the inspection of the next substrate 1 is started. Is done.

  The inspection data management means 8 stores and manages the result determined by the determination means 6 corresponding to the solder location, and can display the solder location and the determination result on the display means of the user interface 11. . In addition, the inspection data management means 8 may be configured such that the control means 9 stores and manages data, information, and the like received from each main part and exchanged with the management apparatus 200.

  The communication interface 12 is means for communicating with the management device 200 via the network NW.

  Next, the configuration and operation of the management apparatus 200 will be described with reference to FIGS. 3, 4, and 5.

  In FIG. 3, a communication unit 21 is a unit that communicates with a plurality of management apparatuses 200 via a network NW.

The display control means 22 is means for receiving the status information representing the inspection status sent from each printed solder inspection apparatus 100 and controlling the display. The status determination means 22a, temporary storage means 22b, list display control. Means 22c, individual NG list display control means 22d, 3D image display control means 22e, and operator instruction receiving means 22f. The status information received from each printed solder inspection apparatus 100 is received at least once after the inspection of one substrate 1 is started until the inspection of the next substrate 1 is started.
In addition, the display control unit 22 controls the user interface together with the display unit 24 and the operation unit 25.

  As shown in FIG. 4, the list display control unit 22 c stores a list format display format corresponding to each printed solder inspection apparatus 100 (or corresponding to an inspection line). Then, among the status information sent from each printed solder inspection apparatus 100, information indicating the inspection status, inspection line ID (indicated as “LineNo” in FIG. 4), printed circuit board ID (in FIG. 4, “BoardName”). ), The information “Measuring”, the information “NG (Wait)”, the information “NG (Stop)”, the information “Error”, the information “Pass” or the information “OFFLINE” and corresponding to the display format. Fill in the fields and send them to the display means 24 for display. At the same time, the list display control means 22c determines from the state information the number of printed circuit boards to be inspected (indicated as “measur: pcs” in FIG. 4) and the number of inspected printed boards (in FIG. 4, “OK: pcs”). ), The number of printed circuit boards determined to be NG (indicated as “NG: pcs” in FIG. 4), and an inspection error (an error such that a recognition mark for positioning cannot be detected from the substrate 1) occurs. The read number (indicated by “Error: pcs” in FIG. 4) is also read and entered and displayed in the appropriate column for each inspection line.

  The list display control means 22c always receives the status information sent from each inspection line and displays it as shown in FIG. Therefore, when updated, the updated information is quickly displayed.

  The state determination means 22a receives the state information from each printed solder inspection apparatus 100, and when there is information of “NG (Wait)” (indicating that it is temporarily stopped), as described later, the individual NG list The display control unit 22d and the 3D image display control unit 22e are instructed to display on the display unit 24 an individual countermeasure screen for countermeasures against NG. At this time, the display means 24 turns the above list display screen behind the individual countermeasure screen. That is, the countermeasure screen is preferentially displayed on the front. According to an instruction from the operation means 25, the list display screen can be brought to the front of the individual countermeasure screen. If there is “NG (Wait)” in the previous state information from each printed solder inspection apparatus 100, and “NG (Wait)” is canceled in the state information updated thereafter, the individual NG list control means 22d and the three-dimensional image display control means 22e are instructed to delete the individual countermeasure screen by the previous “NG (Wait)”. At this time, the display means 24 displays only the list display screen. In addition, the state determination unit 22a deletes the 3D image or the like of the solder location where the NG stored in the temporary storage unit 22b has been eliminated. This is because the measures against NG have been completed, and leaving them left will cause a shortage of capacity.

  The temporary storage unit 22b stores NG-related information among the state information received from each printed solder inspection apparatus 100. Store at least 3D image showing NG solder location determined as NG by printed solder inspection apparatus 100 (“NG (Wait)” as inspection status (suspended)), shape value at that location, and solder status at that location Keep it. The temporary storage means 22b expands the 3D image sent after being compressed, expands it so that it can be read at any time, and stores it corresponding to the solder location. The reason for developing and storing in advance is to quickly read out and display an image when necessary.

  The individual NG list control unit 22 determines the NG solder location for each substrate 1 (inspection line) determined to be NG in accordance with an instruction from the state determination unit 22a that searches for “NG (Wait)” from the received state information. Then, the shape value to be determined is read and displayed as a list as a countermeasure screen. FIG. 5 shows a display example of the list display (in particular, refer to “NG List” of Line No: 04 in FIG. 5). FIG. 5 shows that there are two NG solder locations, and that the NG location in the row that is highlighted in the second row is selected by the operating means 25. Upon receiving the selection instruction, the 3D image display control means 22e reads the 3D image of the corresponding NG solder location from the temporary storage means 22b and displays it in the “Profile” column of the display screen of the display means 24. If there is no selection instruction, the 3D image display control means 22e displays a 3D image corresponding to the NG solder location in the top row of “NG List”. A 3D image of the corresponding NG solder location is read from the temporary storage means 22 b and displayed in the “Profile” column of the display screen of the display means 24. In the example of FIG. 5, the individual NG list control means 22 also displays a plurality of actual shape values in the “Meas result” column of the display screen and can identify the shape values determined to be defective. The display is omitted.

  The reason why the 3D image display control means 22e is configured to display a 3D image is that, based on the measurement result measured by the measurement means 3 by the display means 24, the operator determines the result that the printed solder inspection apparatus 100 determines to be defective. This is because the 3D image generated in this way is examined and investigated, and the quality is judged. That is, the operator examines the 3D image of the solder spot determined to be defective displayed on the display unit 24 and determines whether the determination by the printed solder inspection apparatus 100 is a false report. The three-dimensional image display control means 22e may be configured to read out the image taken by the camera 3d of the corresponding NG solder location from the temporary storage means 22b and display it instead of “Profile” on the display screen of the display means 24. In FIG. 5, either “Profile (3D)” or “camera” can be selected. The reason why the imaging by the camera 3d can be observed is to give the operator a sense of reality compared to the display of only the 3D image.

  The three-dimensional image display control means 22e has a thinning means. Usually, the pixels of the image stored in the primary storage means 22b are reduced by 1/2 to a certain interval so as not to be difficult for the operator to make a decision. Thinned out in the range of about 1/4. When precise examination is necessary, an indication from the operation means 25 can be displayed without thinning out. Further, rotation control means for rotating and displaying the displayed 3D image according to a rotation instruction on the screen of the operator is provided. The rotation control means, when instructed to rotate, further causes the thinning means to perform additional thinning of 1/2 to 1/4, and rotates and displays the additionally thinned image. ing. These thinning-outs are intended to eliminate this because it is difficult for the operator to perform operations and judgments when the response for displaying the 3D image is slow.

  As shown in the column “Judgment” in FIG. 5, the operator instruction accepting means 22 f is a defect in the printed solder inspection apparatus based on the result of the operator examining the 3D image of the NG solder location, the solder state, the shape value, and the like. If it is determined that the determination is false, the “OK” key, which is an instruction to reverse the determination that the printed solder inspection apparatus 100 is defective, or the determination that the printed solder inspection apparatus 100 is defective is confirmed. One of the “NG” keys as an instruction is displayed by the operation means 25 so as to be selectable. When either one is selected by the operator, the corresponding printed solder inspection apparatus in which the selected “OK” (false report) or “NG” (confirmation) instruction is determined to be defective via the communication means 21. 200 is transmitted to the control means 9. The corresponding control means 9 having received it, that is, having received “OK” or “NG” operates as in (4) above. Briefly described, when the control means 9 receives an “OK” instruction from the operator instruction accepting means 22f, the control means 9 cancels the standby (“NG (Wait)”) and sets each main part that has been waiting. The operation is performed as it is, the state is shifted to the state (2), the state information is updated and transmitted to the management apparatus 200 so as to indicate that. Then, the management apparatus 200 changes the display of the corresponding inspection line from “NG (Wait)” to the updated information “Measuring”. When receiving the instruction “NG” from the operator instruction receiving means 22f, the control means 9 shifts each main part from a standby state to a stop state for removing the substrate 1 determined to be defective and performing the work. The status information is updated so as to indicate that, and transmitted to the management apparatus 200. Then, the management apparatus 200 changes the display of the corresponding inspection line from “NG (Wait)” to the updated information “NG (Stop)”. After that, an operation of actually removing the substrate 1 is performed by an operator or the like, and after receiving a start instruction, the operation of each main part is started, and the state (2) is shifted.

  In the configuration of FIG. 3, the state determination unit 22a and the list display control unit 22c directly process the state information without going through the temporary storage unit 22b. However, this may improve the real-time performance. In order to improve usability. Therefore, depending on the reading / writing speed of the temporary storage means 22b or an operator request, all of the status information received from the control means 9 may be temporarily received by the temporary storage means 22b and the above operation may be performed. .

  In the printed solder inspection apparatus 100, the control unit 9, the 3D image forming unit 7, the data generating unit 5, the determining unit 6, the measurement processing unit 3b, the communication procedure of the communication interface, and the like are performed by the CPU and the operation described above. It is executed by the program described. The display control means 22 of the management device 200 is also configured with a memory, a CPU, and a program.

  Next, a series of operations will be described in steps. There may be some overlap with the above description.

  Step 1: The printed solder inspection apparatus 100 is arranged on each inspection line, connected to the management apparatus 200 and the network NW, set to a communicable state, and the solder state of the board 1 to be inspected is sequentially inspected. Let it begin.

  Step 2: Each printed solder inspection apparatus 100 sequentially inspects the solder state of the board by measuring the solder state of the board 1 and determining whether the printed board is good or defective based on the measurement result.

  Step 3: In the inspection stage of Step 2, the control means 9 continues the inspection of the solder state when the determination result of the determination means 6 is good, and pauses the inspection when the determination result is bad, for example The operation of the inspection unit 50 of the measuring unit 3 to the determining unit 6 is temporarily stopped. Further, the control means 9 gives information “Measuring” indicating the continuation of the inspection to the management apparatus 200, or information “NG (Wait)” indicating that the inspection is temporarily stopped, and at least a solder location determined to be defective. State information including a three-dimensional image representing the shape of the image is transmitted to the management apparatus 200.

  Step 4: The display control means 22 of the management apparatus 200 receives the status information from the printed solder inspection apparatus 100, and the inspection in each inspection line is at least the continuation state “Measuring” or the pause “NG” as shown in FIG. (Wait) ”is displayed in a list on the display means 24 so as to be identifiable. Here, for the sake of explanation, as shown in FIG. 4, it is assumed that Line No: 04 and Line No: 11 are “NG (Wait)” almost simultaneously (some of the former is first).

  Step 5: Next, since the inspection line currently suspended is Line No: 04, the display control means 22 shows at least a three-dimensional image of the solder spot determined to be defective as a countermeasure screen as shown in FIG. Is displayed on the display means 24, and the operator enters a state of studying and waiting for treatment. At this time, the control unit 9 of Line No: 04 temporarily stops the operation of the inspection unit 50.

  Step 6: Since there are also two NG locations in Line No: 04 from NG List in FIG. 5, a three-dimensional image of the NG solder locations in the upper part of the list is displayed on the display means 24, and the operator's consideration for that, Then, it waits for the determination of “OK” or “NG”.

  Step 7: The display control means 22 of the management apparatus 200 performs “OK” (defect determination is false alarm) or “NG” (confirmation of defect determination) by the operator's operation for the first NG of Line No: 04. Is sent to the printed solder inspection apparatus 100.

Step 8: When the control means 9 of the printed solder inspection apparatus 100 is instructed to “OK” by the operator's operation, the control section 9 cancels the temporary stop of the inspection section 50 and continues the operation. Since there is a second NG in the NG List, NG is updated from “2” to “1” as status information, and sent to the management apparatus 200. Then, the display control unit 22 causes the display unit 24 to display a three-dimensional image of the second NG solder portion of the NG List in FIG. 5, and waits for the operator to review and determine “OK” or “NG”. . After the operator gives an “OK” instruction to the second NG of the NG List, the corresponding control unit 9 updates the state information and transmits it to the display control unit 22.
Step 9: If the operator's instruction to the first NG of the NG List in FIG. 5 or the second NG is “NG” in Step 8, the control means 9 The measurement of the board 1 is terminated, and the status information updated from “NG (Wait)” to “NG (Stop)” is transmitted to the management apparatus 200, and the operator waits for a restart instruction after replacing the board 1.

  In Steps 7 to 9, when there are a plurality of NG locations on one substrate 1, the operator has instructed “OK” one by one. The configuration may be such that an instruction of “OK” is issued. In this case, which three-dimensional image is to be displayed among a plurality of locations may be selected from the NG list by the operating means 25 and an image of the selected NG location may be displayed.

  Step 10: In Step 8 or Step 9, when the status information is updated from the control means 9, the display control means 22 updates and displays the list display and the countermeasure screen.

  Step 11: When the management apparatus 200 receives the updated status information in Step 9, the management apparatus 200 displays a list when there is no inspection line that is temporarily stopped, and when there is another inspection line that is temporarily stopped, A three-dimensional image of the solder spot determined to be defective on the other inspection line is displayed, and a state waiting for an operator instruction is taken.

  For example, in FIG. 4, even if Line No: 04 is changed from “NG (Wait)”, which is temporarily stopped, to “Measuring”, which is the inspection continuation by the operator instruction, in FIG. Wait state), the state determination unit 22a that has received the updated state information displays the Line No. on the display screen of the display unit 24 with respect to the individual NG list display control unit 22d and the 3D image display control unit 22e. : A countermeasure screen for displaying a 3D image of the solder spot determined to be defective in 11 is displayed. For this NG of Line No: 11, the same operation as in Step 5 to Step 9 is performed.

  In FIG. 4, “NG (Wait)” disappears in all the lines, and the state determination unit 22a that has received the updated state information notifies the individual NG list display control unit 22d and the 3D image display control unit 22e. Thus, the display on the display means 24 is stopped. That is, at this time, the display unit 24 displays a list based on the updated state information.

It is a figure for demonstrating the functional block of this invention. It is a figure which shows the function structure of the printed solder test | inspection apparatus in FIG. It is a figure which shows the function structure of the management apparatus in FIG. It is a figure which shows the example which displayed the inspection condition of each inspection line as a list. It is a figure which shows the example of a display of the countermeasure screen for countermeasures against NG.

Explanation of symbols

1 Printed circuit board (board)
DESCRIPTION OF SYMBOLS 2 Moving stand 3 Measuring means 3a Sensor 3b Measurement processing means 3c Moving mechanism part 4 Data processing means 5 Data generation means 6 Judgment means 7 3D image formation means 8 Inspection data management means 9 Control means 10 Design information storage means 11 User interface 12 Communication Interface 21 Communication means 22 Display control means 22a State determination means 22b Temporary storage means 22c List display control means 22d Individual NG list display control means 22e Three-dimensional image display control means 22f Operator instruction reception means 24 Display means 25 Operation means

Claims (6)

A printed solder inspection apparatus (100) having an inspection section (50) for measuring the solder state of a printed circuit board and determining whether the solder state is good or bad based on the measurement result, and arranged on a plurality of inspection lines A solder inspection line centralized management system comprising a management device (200) capable of communicating with the plurality of printed solder inspection devices and managing an operation status including an inspection status of the printed solder inspection device,
Each of the printed solder inspection apparatuses pauses the inspection at least when the determination result by the inspection unit is defective, informs that it is temporarily stopped, and indicates the shape of the solder spot determined to be defective. The control means (9) for transmitting the state information including the three-dimensional image based on the measurement result to the management device,
The management device includes an operator instruction receiving means (22f) for receiving an instruction to the control means including a pass / fail judgment by an operator when there is an inspection line that is temporarily stopped, a display means (24), and the printed solders. The status information is received from the inspection device, and a list is displayed on the screen of the display means so as to be able to identify whether or not the inspection at each inspection line is paused. If there is a line, the display control means (22) for preferentially displaying a countermeasure screen for displaying the three-dimensional image of the solder spot determined to be defective on the list display,
When there is a good instruction from the operator instruction receiving means, the control means cancels the temporary stop of the inspection of the printed circuit board of the corresponding inspection line and continues the inspection, and the operator instruction receiving means When there is an instruction for failure, the temporary stop state is continued to shift to the next instruction waiting state, and the state information is updated as the inspection continues or the next instruction waiting state is transferred. Update and send to the management device,
Further, the display control means of the management apparatus stops the display of the countermeasure screen before the update if the inspection of any inspection line is not temporarily stopped when the state information is updated. Concentration of solder inspection lines, wherein the list display based on the updated state information is performed, and if there is any other inspection line that is temporarily stopped, switching to the countermeasure screen in the other inspection line that is temporarily stopped Management system.   The control means compresses a three-dimensional image based on the measurement result and sends it to the management device. The display control means has an image storage means (22), and expands the compressed three-dimensional image. 2. The solder inspection line centralized management system according to claim 1, wherein when the three-dimensional image is displayed, it is read out from the image storage means and displayed.   3. The solder inspection line centralized management system according to claim 2, wherein the display control unit thins out pixels at predetermined intervals of a three-dimensional image received from a printed solder inspection apparatus and displays the pixels on the display unit.   The display control means receives a rotation instruction, further thins out pixels of the three-dimensional image thinned out at the predetermined interval, and rotates the display according to the rotation instruction to display on the display means. Item 4. A centralized management system for solder inspection lines according to item 3.   The display control means is the case where the state information is updated, and if there is an inspection line that has been released from the temporary suspension before the update and has been switched to the continuation of the inspection after the update, the display control means 5. The solder inspection line centralized management system according to claim 2, wherein the three-dimensional image stored in the image storage means is erased corresponding to the line. Measure the solder state of the printed circuit board on which the solder is printed, determine whether the printed circuit board is good or defective based on the measurement result, and sequentially inspect the solder state of the printed circuit board. Based on the measurement result and the information including whether or not it is at least a primary stop state due to a defect, which is connected to a plurality of printed solder inspection apparatuses arranged in a network and is communicable and sent from each of the printed solder inspection apparatuses A management device that receives state information including a three-dimensional image and centrally manages the information,
The management device
Display means (24);
The status information is received from each printed solder inspection apparatus, and whether or not the inspection on each inspection line is temporarily stopped is displayed in a list on the screen of the display means so that it can be identified. If there is an inspection line, display control means (22) for displaying preferentially a countermeasure screen for displaying the three-dimensional image of the solder spot determined to be defective at least;
When there is an inspection line that is temporarily stopped, an instruction from the operator to correct the failure determination by the printed solder inspection apparatus arranged on the inspection line that is temporarily stopped to a good determination or an instruction to confirm the determination of the failure And an operator instruction receiving means (22f) for receiving the instruction and transmitting the instruction to the printed solder inspection apparatus of the inspection line that is temporarily stopped.